TW202306917A - 氧化矽玻璃構件及其製造方法 - Google Patents

氧化矽玻璃構件及其製造方法 Download PDF

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Publication number
TW202306917A
TW202306917A TW111112902A TW111112902A TW202306917A TW 202306917 A TW202306917 A TW 202306917A TW 111112902 A TW111112902 A TW 111112902A TW 111112902 A TW111112902 A TW 111112902A TW 202306917 A TW202306917 A TW 202306917A
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TW
Taiwan
Prior art keywords
glass member
bubbles
silica
silica glass
silicon oxide
Prior art date
Application number
TW111112902A
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English (en)
Chinese (zh)
Inventor
佐佐木寿弥
Original Assignee
日商Agc股份有限公司
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Publication date
Application filed by 日商Agc股份有限公司 filed Critical 日商Agc股份有限公司
Publication of TW202306917A publication Critical patent/TW202306917A/zh

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    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C11/00Multi-cellular glass ; Porous or hollow glass or glass particles
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00Glass compositions
    • C03C3/04Glass compositions containing silica
    • C03C3/06Glass compositions containing silica with more than 90% silica by weight, e.g. quartz
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B19/00Other methods of shaping glass
    • C03B19/10Forming beads
    • C03B19/1005Forming solid beads
    • C03B19/106Forming solid beads by chemical vapour deposition; by liquid phase reaction
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B19/00Other methods of shaping glass
    • C03B19/14Other methods of shaping glass by gas- or vapour- phase reaction processes
    • C03B19/1453Thermal after-treatment of the shaped article, e.g. dehydrating, consolidating, sintering
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B20/00Processes specially adapted for the production of quartz or fused silica articles, not otherwise provided for
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B32/00Thermal after-treatment of glass products not provided for in groups C03B19/00, C03B25/00 - C03B31/00 or C03B37/00, e.g. crystallisation, eliminating gas inclusions or other impurities; Hot-pressing vitrified, non-porous, shaped glass products
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00Etching of wafers, substrates or parts of devices
    • H10P50/20Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/24Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
    • H10P50/242Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B2201/00Type of glass produced
    • C03B2201/02Pure silica glass, e.g. pure fused quartz
    • C03B2201/03Impurity concentration specified
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2201/00Glass compositions
    • C03C2201/02Pure silica glass, e.g. pure fused quartz
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2201/00Glass compositions
    • C03C2201/80Glass compositions containing bubbles or microbubbles, e.g. opaque quartz glass
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2203/00Production processes
    • C03C2203/40Gas-phase processes
    • C03C2203/42Gas-phase processes using silicon halides as starting materials
    • C03C2203/44Gas-phase processes using silicon halides as starting materials chlorine containing
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2203/00Production processes
    • C03C2203/50After-treatment
    • C03C2203/52Heat-treatment

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Geochemistry & Mineralogy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Glass Melting And Manufacturing (AREA)
  • Glass Compositions (AREA)
  • Plasma & Fusion (AREA)
TW111112902A 2021-04-07 2022-04-01 氧化矽玻璃構件及其製造方法 TW202306917A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2021065433 2021-04-07
JP2021-065433 2021-04-07
JP2021-135895 2021-08-23
JP2021135895 2021-08-23

Publications (1)

Publication Number Publication Date
TW202306917A true TW202306917A (zh) 2023-02-16

Family

ID=83546077

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111112902A TW202306917A (zh) 2021-04-07 2022-04-01 氧化矽玻璃構件及其製造方法

Country Status (6)

Country Link
US (1) US20240025795A1 (https=)
JP (1) JPWO2022215663A1 (https=)
KR (1) KR20230167358A (https=)
DE (1) DE112022002001T5 (https=)
TW (1) TW202306917A (https=)
WO (1) WO2022215663A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102825674B1 (ko) 2024-05-31 2025-06-26 신에쯔 세끼에이 가부시키가이샤 성막 처리 가스 노출용 석영 유리 부재 및 이의 제조 방법

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0614480Y2 (ja) * 1988-04-26 1994-04-13 信越石英株式会社 半導体熱処理装置
JP2571181B2 (ja) * 1992-11-24 1997-01-16 日東化学工業株式会社 石英ガラス多孔質成形体およびその製造方法
JP2829227B2 (ja) * 1993-08-24 1998-11-25 信越石英株式会社 不透明石英ガラス
JP3883233B2 (ja) * 1996-07-15 2007-02-21 信越石英株式会社 石英ガラス発泡体の製造方法
JP3827828B2 (ja) * 1997-09-22 2006-09-27 東芝セラミックス株式会社 半導体ウエハ熱処理治具用の多孔質石英ガラス
JP2002362967A (ja) * 2001-06-06 2002-12-18 Koransha Co Ltd シリカガラス焼結体からなる半導体ウエハエッチング用部材とその製造方法
JP5143367B2 (ja) * 2006-03-13 2013-02-13 東ソー・クォーツ株式会社 不透明焼結体
JP2015173154A (ja) * 2014-03-11 2015-10-01 東京エレクトロン株式会社 縦型熱処理装置、縦型熱処理装置の運転方法及び記憶媒体
JP2021065433A (ja) 2019-10-23 2021-04-30 日本製紙クレシア株式会社 吸収性物品
JP2021135895A (ja) 2020-02-28 2021-09-13 三菱重工業株式会社 検知装置、検知方法、およびロボット並びにプログラム

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Publication number Publication date
DE112022002001T5 (de) 2024-01-18
US20240025795A1 (en) 2024-01-25
KR20230167358A (ko) 2023-12-08
WO2022215663A1 (ja) 2022-10-13
JPWO2022215663A1 (https=) 2022-10-13

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