TW202239615A - 聚合物膜、以及積層體及其製造方法 - Google Patents

聚合物膜、以及積層體及其製造方法 Download PDF

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Publication number
TW202239615A
TW202239615A TW111104027A TW111104027A TW202239615A TW 202239615 A TW202239615 A TW 202239615A TW 111104027 A TW111104027 A TW 111104027A TW 111104027 A TW111104027 A TW 111104027A TW 202239615 A TW202239615 A TW 202239615A
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Taiwan
Prior art keywords
layer
polymer
polymer film
less
loss tangent
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TW111104027A
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English (en)
Chinese (zh)
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佐佐田泰行
師岡直之
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日商富士軟片股份有限公司
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Publication of TW202239615A publication Critical patent/TW202239615A/zh

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    • C08G63/02—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
    • C08G63/60—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from the reaction of a mixture of hydroxy carboxylic acids, polycarboxylic acids and polyhydroxy compounds
    • C08G63/605—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from the reaction of a mixture of hydroxy carboxylic acids, polycarboxylic acids and polyhydroxy compounds the hydroxy and carboxylic groups being bound to aromatic rings
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    • B32B15/09—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
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  • Chemical & Material Sciences (AREA)
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  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Laminated Bodies (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
TW111104027A 2021-01-29 2022-01-28 聚合物膜、以及積層體及其製造方法 TW202239615A (zh)

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US (1) US20230364887A1 (https=)
JP (1) JPWO2022163776A1 (https=)
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JP7775575B2 (ja) * 2021-03-31 2025-11-26 三菱ケミカル株式会社 積層フィルム、基板用積層体、回路基板、及び電子機器
JP7405276B2 (ja) * 2021-03-31 2023-12-26 Tdk株式会社 化合物、樹脂組成物、樹脂シート、樹脂硬化物および積層基板
JPWO2023191012A1 (https=) * 2022-03-31 2023-10-05
KR20250022654A (ko) * 2022-06-09 2025-02-17 자크로스 가부시키가이샤 액정 폴리머 필름의 제조 방법, 액정 폴리머 필름, 고주파 회로 기판 재료의 제조 방법, 및 고주파 회로 기판의 제조 방법
WO2024048348A1 (ja) * 2022-08-31 2024-03-07 富士フイルム株式会社 フィルム、及び、積層体
JPWO2024048727A1 (https=) * 2022-08-31 2024-03-07
WO2024048728A1 (ja) * 2022-08-31 2024-03-07 富士フイルム株式会社 フィルム、及び、積層体
WO2024048729A1 (ja) * 2022-08-31 2024-03-07 富士フイルム株式会社 フィルム及びその製造方法、並びに、積層体
WO2024048000A1 (ja) * 2022-08-31 2024-03-07 富士フイルム株式会社 組成物、及び、フィルム
WO2024070619A1 (ja) * 2022-09-26 2024-04-04 富士フイルム株式会社 積層体、金属張積層体、配線基板
JPWO2024095641A1 (https=) * 2022-10-31 2024-05-10
JPWO2024095642A1 (https=) * 2022-10-31 2024-05-10
WO2024122277A1 (ja) * 2022-12-09 2024-06-13 富士フイルム株式会社 ポリマーフィルム、積層体及び金属付き積層体
JPWO2024127887A1 (https=) * 2022-12-16 2024-06-20
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Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5248530A (en) * 1991-11-27 1993-09-28 Hoechst Celanese Corp. Heat sealable coextruded lcp film
JP5157366B2 (ja) * 2007-10-26 2013-03-06 東洋紡株式会社 Ｒｆｉｄメディアの製造方法
JP5234647B2 (ja) * 2009-03-31 2013-07-10 新日鉄住金化学株式会社 複合接着フィルムおよびそれを用いた多層回路基板並びにその製造方法
JP2015002334A (ja) * 2013-06-18 2015-01-05 出光興産株式会社 電子回路基板用積層体
KR102854410B1 (ko) * 2019-11-19 2025-09-05 디아이씨 가부시끼가이샤 2축 연신 적층 필름, 적층체 및 그들의 제조 방법
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