TW202215457A - Method for manufacturing transparent electroconductive film - Google Patents

Abstract

Provided is a transparent electroconductive film that includes metal nanowires and that has exceptional uniformity of electrical resistance. This transparent electroconductive film comprises a substrate, and a transparent electroconductive layer that is positioned on at least one surface of the substrate, the transparent-electroconductive-layer-side surface of the substrate being subjected to surface treatment, and the transparent electroconductive layer including metal nanowires. According to one embodiment, the transparent electroconductive layer is directly positioned on the substrate.

Description

Manufacturing method of transparent conductive film

The present invention relates to a method for producing a transparent conductive film.

Previously, in an image display device with a touch sensor, electrodes of the touch sensor were mostly obtained by forming a metal oxide layer such as ITO (indium-tin composite oxide) on a transparent resin film. Transparent conductive film. However, the transparent conductive film provided with the metal oxide layer easily loses conductivity due to bending, and there is a problem that it is difficult to use in applications that require flexibility, such as a flexible display.

As a highly flexible transparent conductive film, the transparent conductive film provided with the transparent conductive layer containing a metal nanowire is known. Metal nanowires are linear conductive substances with a diameter of nanometers. In the transparent conductive layer including the metal nanowires, by making the metal nanowires mesh-like, a small amount of metal nanowires can be used to form a good conductive path, and openings are formed in the gaps of the meshes to achieve High light transmittance.

On the other hand, in the transparent conductive film, the resistance is required to have in-plane uniformity. In the above-mentioned transparent conductive layer including metal nanowires, the variation in resistance caused by uneven distribution of metal nanowires is a problem. prior art literature Patent Literature

Patent Document 1: Japanese Patent Publication No. 2009-505358 Patent Document 1: Japanese Patent No. 6199034

[Problems to be Solved by Invention]

The present invention is made in order to solve the above-mentioned problems, and an object thereof is to provide a transparent conductive film containing metal nanowires and having excellent uniformity of resistance. [Technical means to solve problems]

The transparent conductive film of the present invention includes a substrate and a transparent conductive layer disposed on at least one side of the substrate, the surface of the substrate on the side of the transparent conductive layer is a surface treated, and the transparent conductive layer contains metal nanowires Rice Noodles. In one embodiment, the transparent conductive layer is directly disposed on the base material. In one embodiment, the substrate includes a substrate film. In one embodiment, the base material is a single-layer structure. In one embodiment, the substrate is provided with a hard coat layer disposed on at least one side of the substrate film, and the transparent conductive layer is disposed on the hard coat layer side of the substrate. In one embodiment, the variance of the surface resistance value of the transparent conductive film is 10 [(Ω/□) ² ] or less. In one embodiment, the surface treatment is plasma treatment or corona treatment. In one embodiment, the above-mentioned base film contains polyester-based resin or cycloolefin-based resin. In one embodiment, the metal nanowires are silver nanowires. In one embodiment, the contact angle of the surface-treated surface of the substrate with respect to water is 90° or less. [Effect of invention]

According to the present invention, it is possible to provide a transparent conductive film containing metal nanowires and having excellent uniformity of resistance.

A. Outline of Transparent Conductive Film FIG. 1 is a schematic cross-sectional view of a transparent conductive film according to an embodiment of the present invention. The transparent conductive film 100 of the present embodiment includes a base material 10 and a transparent conductive layer 20 disposed on at least one side of the base material 10 . 2 is a schematic cross-sectional view of a transparent conductive film according to another embodiment. In the transparent conductive film 200 of this embodiment, the base material 10 ′ is composed of two layers, and the base material 10 ′ includes the base film 11 and the hard coat layer 12 disposed on at least one side of the base film 11 . In this embodiment, the transparent conductive layer 20 is disposed on the hard coat layer 12 side of the substrate 10'.

The above-mentioned transparent conductive layer 20 includes metal nanowires.

The surface on the transparent conductive layer 20 side of the substrate 10 is the surface treated. In the present invention, the transparent conductive layer can be formed by coating the dispersion of metal nanowires, but because the substrate 10 is surface-treated, the agglomeration of the metal nanowires in the coating layer of the dispersion is suppressed, and the dispersion is reduced. The coating thickness of the liquid becomes uniform, and a transparent conductive film excellent in in-plane uniformity of resistance value (sheet resistance value) can be obtained.

Preferably, the above-mentioned transparent conductive layer is directly (ie, without intervening other layers) disposed on the substrate. In addition, the above-mentioned transparent conductive film may further include any appropriate other layer on the side opposite to the base material of the transparent conductive layer, but is not shown. For example, any suitable protective layer including organic materials (eg, hardening resin, conductive resin) and inorganic materials (eg, silicon oxide, aluminum oxide, etc.) can be configured.

In one embodiment, the above-mentioned transparent conductive film may be elongated.

The surface resistance value of the transparent conductive film is preferably 0.1 Ω/□～1000 Ω/□, more preferably 0.5 Ω/□～300 Ω/□, particularly preferably 1 Ω/□～200 Ω/□. The surface resistance value can be measured by the eddy current method using a non-contact surface resistance meter (trade name "EC-80") manufactured by Napson Co., Ltd. The above-mentioned surface resistance value may be an average value of 5 randomly selected points.

The variance of the surface resistance value of the transparent conductive film is preferably 10 [(Ω/□) ² ] or less, more preferably 8 [(Ω/□) ² ] or less, and still more preferably 5 [(Ω/□) ² ] below. The variance value is obtained from the measured values of 5 randomly selected points.

The haze value of the above-mentioned transparent conductive film is preferably 20% or less, more preferably 10% or less, and still more preferably 0.1% to 5%.

The total light transmittance of the above-mentioned transparent conductive film is preferably 30% or more, more preferably 35% or more, and even more preferably 40% or more.

B. Substrate As described above, the base material may have a one-layer structure or a two-layer structure. In addition, it may be composed of a plurality of layers of three or more layers. The substrate composed of one layer may be composed of a substrate film. In one embodiment, the substrate composed of a plurality of layers includes a substrate film and a hard coat layer. The thickness of the base material is preferably 20 μm to 220 μm, more preferably 30 μm to 120 μm. The total light transmittance of the base material is preferably 30% or more, more preferably 35% or more, and still more preferably 40% or more.

As described above, at least one side of the substrate (the substrate film surface or the hard coat layer surface) is surface-treated. As the surface treatment, for example, plasma treatment or corona treatment can be mentioned.

As the plasma treatment, specifically, plasma treatment in which oxygen, nitrogen, hydrogen, carbon dioxide, carbon tetrachloride, a fluorine compound, an inert gas, or a mixed gas thereof is used as a reaction gas can be exemplified. Regarding the conditions of the plasma treatment, any appropriate conditions can be set according to the type of the base material and the like. The plasma emission amount can be set to, for example, 1 W to 2000 W, and the processing speed can be set to, for example, 3000 mm/min to 2000 mm/min.

Regarding the conditions of the corona treatment, any appropriate conditions can be set according to the type of the base material and the like. The irradiation energy in the corona treatment is, for example, 6 kW·min/m ² to 150 kW·min/m ² .

The contact angle of the surface-treated surface of the substrate with respect to water is preferably 90° or less, more preferably 50° to 90°, more preferably 60° to 85°. When it exists in such a range, the said effect of this invention becomes remarkable.

As the material constituting the above-mentioned base film, any appropriate material can be used. Specifically, for example, it is preferable to use a polymer film. A representative example of the material constituting the above-mentioned base film is a polymer film mainly composed of a thermoplastic resin. Examples of thermoplastic resins include polyester-based resins; cycloolefin-based resins such as polynorene; acrylic resins; polycarbonate resins; cellulose-based resins. Among them, polyester-based resins, cycloolefin-based resins, or acrylic-based resins are preferred. These resins are excellent in transparency, mechanical strength, thermal stability, water resistance, and the like. The above thermoplastic resins may be used alone or in combination of two or more. Moreover, the optical film used for a polarizing plate, for example, a low retardation film, a high retardation film, a brightness enhancement film, etc. can also be used as a base film.

In one embodiment, the base film may include polyester-based resin or cycloolefin-based resin, and the base film may be an optical film. When such a material is used, a conductive film excellent in transparency can be obtained.

The thickness of the above-mentioned base film is preferably 20 μm to 200 μm, more preferably 30 μm to 150 μm.

The total light transmittance of the above-mentioned base film is preferably 30% or more, more preferably 35% or more, and still more preferably 40% or more.

The above-mentioned hard coat layer preferably has sufficient surface hardness, excellent mechanical strength, and excellent light transmittance. The hard coat layer may be formed of any suitable resin as long as it has such desired properties. Specific examples of resins include thermosetting resins, thermoplastic resins, ultraviolet curable resins, electron beam curable resins, and two-component mixed resins. Preferably it is an ultraviolet curable resin. The reason for this is that the hard coat layer can be formed with a simple operation and high efficiency.

As a specific example of an ultraviolet curable resin, the ultraviolet curable resin of polyester type, acrylic type, urethane type, amide type, silicone type, and epoxy type can be mentioned. UV-curable resins include UV-curable monomers, oligomers, and polymers. As a preferable ultraviolet curable resin, the resin composition containing the acrylic monomer component or oligomer component which has preferably 2 or more, and more preferably 3 to 6 ultraviolet polymerizable functional groups can be mentioned. Typically, a photopolymerization initiator is blended into the UV-curable resin.

The above-mentioned hard coat layer can be formed by any suitable method. For example, a hard coat layer can be formed by applying a resin composition for forming a hard coat layer on a base film, drying it, and irradiating ultraviolet rays to the dried coating film to harden it.

The thickness of the hard coat layer is, for example, 0.1 μm to 20 μm, preferably 0.5 μm to 15 μm, more preferably 0.5 μm to 10 μm, and still more preferably 0.5 μm to 5 μm.

The total light transmittance of the hard coat layer is preferably 30% or more, more preferably 35% or more, and still more preferably 40% or more.

C. Transparent conductive layer As mentioned above, the transparent conductive layer contains metal nanowires. Preferably, the above-mentioned transparent conductive layer further contains a binder resin.

The thickness of the above-mentioned transparent conductive layer is 1000 nm or less, preferably 800 nm or less, more preferably 600 nm or less, further preferably 30 nm to 500 nm, and particularly preferably 30 nm to 300 nm.

The total light transmittance of the transparent conductive layer is preferably 80% or more, more preferably 85% or more, more preferably 90% or more, and still more preferably 95% or more.

C-1. Metal Nanowires Metal nanowires refer to conductive substances whose material is metal, whose shape is needle-like or wire-like, and whose diameter is nanometer size. The metal nanowires can be linear or curved. If a transparent conductive layer including metal nanowires is used, even if a small amount of metal nanowires is used, a good conductive path can be formed by making the metal nanowires in a mesh shape, and transparent conductivity with low resistance can be obtained. membrane. Furthermore, by making the metal nanowire into a mesh shape, openings can be formed in the gaps of the meshes, and a transparent conductive film with high light transmittance can be obtained.

The ratio of the thickness d to the length L (aspect ratio: L/d) of the metal nanowires is preferably 10-100,000, more preferably 50-100,000, particularly preferably 100-10,000. If such metal nanowires with a large aspect ratio are used, the metal nanowires can be crossed well, and a small amount of metal nanowires can exhibit higher electrical conductivity. As a result, a transparent conductive film with high light transmittance can be obtained. Furthermore, in this specification, with regard to the "thickness of the metal nanowire", when the cross-section of the metal nanowire is circular, it means its diameter, and when the cross-section is elliptical, it means the diameter. The short diameter means the longest diagonal when the cross section is polygonal. The thickness and length of the metal nanowires can be confirmed by scanning electron microscopy or transmission electron microscopy.

The thickness of the metal nanowires is preferably less than 500 nm, more preferably less than 200 nm, particularly preferably 10 nm to 100 nm, and most preferably 10 nm to 50 nm. Within such a range, a transparent conductive layer with high light transmittance can be formed.

The length of the metal nanowires is preferably 1 μm˜1000 μm, more preferably 10 μm˜500 μm, particularly preferably 20 μm˜100 μm. Within such a range, a highly conductive transparent conductive film can be obtained.

As the metal constituting the above-mentioned metal nanowire, any suitable metal can be used as long as it is a conductive metal. As a metal which comprises the said metal nanowire, silver, gold, copper, nickel, etc. are mentioned, for example. Moreover, the material which these metals were plated (for example, gold-plated) can also be used. Among them, from the viewpoint of electrical conductivity, silver, copper, or gold is preferable, and silver is more preferable.

As a method for producing the above-mentioned metal nanowire, any appropriate method can be adopted. For example, a method of reducing silver nitrate in a solution; applying a voltage or current to the surface of the precursor from the tip of the probe, pulling out metal nanowires from the tip of the probe, and continuously forming the metal Methods of nanowires, etc. In the method of reducing silver nitrate in solution, silver nanowires can be synthesized by liquid-phase reduction of silver salts such as silver nitrate in the presence of polyols such as ethylene glycol and polyvinylpyrrolidone. For example, silver nanowires with uniform size can be based on Xia, Y.etal., Chem.Mater.(2002), 14, 4736-4745, Xia, Y.etal., Nano letters (2003) 3(7), 955- The method described in 960 is used for mass production.

The content ratio of the metal nanowires in the transparent conductive layer is preferably 30 to 98 parts by weight, more preferably 40 to 85 parts by weight relative to 100 parts by weight of the binder resin constituting the transparent conductive layer. Within such a range, a transparent conductive film excellent in conductivity and light transmittance can be obtained.

C-2. Binder resin As the above-mentioned binder resin, any appropriate resin can be used. Examples of the resin include: acrylic resin; polyester resin such as polyethylene terephthalate; polystyrene, polyvinyltoluene, polyvinylxylene, polyimide, polyamide , aromatic resins such as polyamide imide; polyurethane resin; epoxy resin; polyolefin resin; acrylonitrile-butadiene-styrene copolymer (ABS); cellulose; Silicon resin; polyvinyl chloride; polyacetate; polynorene; synthetic rubber; fluorine resin, etc. The binder resin may be used alone or in combination of two or more.

In one embodiment, a curable resin can be used as the above-mentioned binder resin. As curable resin, a polyfunctional acrylic resin is mentioned, for example. The curable resin can be obtained from a monomer composition containing a multifunctional monomer. As the polyfunctional monomer, for example, tricyclodecane dimethanol diacrylate, pentaerythritol di(meth)acrylate, pentaerythritol tri(meth)acrylate, trimethylolpropane triacrylate, pentaerythritol tetraacrylate, (Meth)acrylate, dimethylolpropane tetraacrylate, dipentaerythritol hexa(meth)acrylate, 1,6-hexanediol (meth)acrylate, 1,9-nonanediol diacrylate , 1,10-decanediol (meth)acrylate, polyethylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, dipropylene glycol diacrylate, isocyanuric acid tris( Meth)acrylate, ethoxylated glycerol triacrylate, ethoxylated pentaerythritol tetraacrylate, etc. The polyfunctional monomer may be used alone or in combination of two or more.

The above-mentioned monomer composition may further comprise a monofunctional monomer. When the above-mentioned monomer composition contains a monofunctional monomer, the content ratio of the monofunctional monomer is preferably 40 parts by weight or less, more preferably 20 parts by weight relative to 100 parts by weight of the monomer in the monomer composition the following.

As said monofunctional monomer, ethoxylated o-phenylphenol (meth)acrylate, methoxy polyethylene glycol (meth)acrylate, phenoxy polyethylene glycol (meth)acrylate, for example Acrylates, 2-ethylhexyl acrylate, lauryl acrylate, isooctyl acrylate, isostearyl acrylate, cyclohexyl acrylate, isophthalate acrylate, benzyl acrylate, 2-hydroxy-3-phenoxy acrylate ester, acrylamide, 2-hydroxyethyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, hydroxyethyl acrylamide, etc. In one embodiment, a monomer having a hydroxyl group is used as the above-mentioned monofunctional monomer.

D. Manufacturing method of transparent conductive film The said transparent conductive film can be formed by apply|coating the composition for transparent conductive layer formation to the surface treatment surface of a base material. In one embodiment, the composition for forming a transparent conductive layer includes a binder resin (or a monomer for forming the binder resin) and metal nanowires.

The composition for forming a transparent conductive layer contains metal nanowires. In one embodiment, the metal nanowires are dispersed in any suitable solvent to prepare the composition for forming a transparent conductive layer. As the solvent, water, an alcohol-based solvent, a ketone-based solvent, an ether-based solvent, a hydrocarbon-based solvent, an aromatic-based solvent, and the like may, for example, be mentioned. In addition, the composition for forming a transparent conductive layer may further contain additives such as resin (binder resin), conductive materials other than metal nanowires (for example, conductive particles), and leveling agent. Moreover, the composition for forming a transparent conductive layer may contain a plasticizer, a heat stabilizer, a light stabilizer, a lubricant, an antioxidant, an ultraviolet absorber, a flame retardant, a colorant, an antistatic agent, a compatibilizer, a crosslinking agent additives, tackifiers, inorganic particles, surfactants and dispersants.

The viscosity of the composition for forming a transparent conductive layer is preferably 5 mP·s/25°C to 300 mP·s/25°C, more preferably 10 mP·s/25°C to 100 mP·s/25°C. Within such a range, the effect obtained by setting the wind direction in the blowing step to a specific direction becomes large. The viscosity of the composition for forming a transparent conductive layer can be measured by a rheometer (eg, MCR302 from Anton Paar).

The dispersion concentration of the metal nanowires in the composition for forming a transparent conductive layer is preferably 0.01% by weight to 5% by weight. Within such a range, the effect of the present invention becomes remarkable.

As a coating method of the said composition for transparent conductive layer formation, any appropriate method can be employ|adopted. Examples of the coating method include spray coating, bar coating, roll coating, die coating, ink jet coating, screen coating, dip coating, letterpress printing, gravure printing, and gravure printing. Wait. As the drying method of the coating layer, any suitable drying method (eg, natural drying, air drying, heating drying) can be adopted. For example, in the case of heating and drying, the typical drying temperature is 100°C to 200°C, and the typical drying time is 1 to 10 minutes.

The weight per unit area of the coating layer is preferably 0.3 g/m ² to 30 g/m ² , more preferably 1.6 g/m ² to 16 g/m ² . [Example]

Hereinafter, the present invention will be specifically described by means of examples, but the present invention is not limited in any way by these examples. The evaluation methods in the examples are as follows. In addition, the thickness is measured by using a scanning electron microscope "S-4800" manufactured by Hitachi High-Technology Co., Ltd. after embedding in epoxy resin, cutting it with an ultramicrotome to form a cross section.

(1) Surface resistance value The surface resistance value of the transparent conductive film (transparent conductive layer side) was measured by the eddy current method using a non-contact surface resistance meter (trade name "EC-80") manufactured by Napson Co., Ltd. The measurement temperature was set to 23°C. Five points were randomly selected and measured, and the average value of the measured values was set as the surface resistance value of the transparent conductive films obtained in Examples and Comparative Examples. Moreover, the variance of the surface resistance value was calculated|required from the measured value.

(2) Contact angle The substrate film for the production of the transparent conductive film was placed on a glass slide with the surface-treated surface (in the comparative example, one of the surfaces) on top, and the surface-treated surface (in the comparative example, one of the surfaces) and the The contact angle of pure water. 2 μl of pure water was dropwise added to the surface-treated surface (one of the surfaces in the comparative example), and the contact angle (N=5) after 5 seconds was measured. The contact angle was measured using a contact angle meter (manufactured by Kyowa Interface Co., Ltd., trade name "CX-A type") in a gas atmosphere of 23°C and 50% RH.

[Production Example 1] Preparation of a composition for forming a transparent conductive layer Silver nanowires were synthesized based on the method described in Chem.Mater.2002, 14, 4736-4745. The silver nanowires obtained above were dispersed in pure water at a concentration of 0.2% by weight, and dodecyl pentaethylene glycol was dispersed in pure water at a concentration of 0.1% by weight, thereby obtaining a composition for forming a transparent conductive layer .

[Example 1] A cycloolefin film (manufactured by Zeon Corporation, trade name "ZEONOR") was prepared as a substrate film, and the film was surface-treated to obtain a substrate A. The surface treatment was carried out using a direct/remote dual-purpose atmospheric pressure plasma surface treatment experimental device (model name: AP-T05-S440) manufactured by Sekisui Chemical Industry Co., Ltd. The discharge electrode length L was set to 2 mm, and the membrane speed V was It was set to 5000 mm/min, the discharge voltage was set to 115 V, and the discharge current was set to 0.1 A or less. While conveying the above-mentioned base material with a conveying roller, a rod coater (manufactured by Daiichi Science Co., Ltd., product name "Bar Coater No. 16") was used to coat the base material prepared in Production Example 1 The composition for forming a transparent conductive layer was used to form a coating layer with a thickness per unit area of 0.015 g/m ² . Then, while conveying the base material on which the coating layer was formed, the coating layer was dried to form a transparent conductive layer, thereby obtaining a transparent conductive film including the base material and the transparent conductive layer. The obtained transparent conductive film was used for the above-mentioned evaluations (1) to (2). The results are shown in Table 1.

[Example 2] A transparent conductive film was obtained in the same manner as in Example 1, except that a polyester-based resin film (manufactured by Mitsubishi Chemical Corporation) was used as the base film. The obtained transparent conductive film was used for the above-mentioned evaluations (1) to (2). The results are shown in Table 1.

[Example 3] A transparent conductive film was obtained in the same manner as in Example 1, except that a cellulose triacetate film (manufactured by KONICA MINOLTA ADVANCED LAYERS, trade name "KC4UY") was used as the base film. The obtained transparent conductive film was used for the above-mentioned evaluations (1) to (2). The results are shown in Table 1.

[Example 4] A cellulose triacetate film (manufactured by KONICA MINOLTA ADVANCED LAYERS, trade name "KC4UY") was prepared as a base film, and a hard coat layer (thickness: 10 μm) was formed on the base film to obtain a base film. material (substrate film/hard coat). The hard coat layer is formed by applying the composition for forming a hard coat layer prepared in the following manner to a base film to form a coating layer, and heating the coating layer at 90° C. for 1 minute, The heated coating layer was irradiated with ultraviolet rays (200 mJ/cm ² ) to harden the coating layer. Furthermore, the surface of the hard-coat layer side of a base material was surface-treated in the same manner as Example 1, and the base material B was obtained. The hard coat layer was coated with Production Example 1 using a bar coater (manufactured by Daiichi Science Co., Ltd., product name "Bar Coater No. 16") while conveying the above-mentioned base material using a conveying roller. The prepared composition for forming a transparent conductive layer formed a coating layer with a thickness per unit area of 0.015 g/m ² . Then, while conveying the base material on which the coating layer was formed, the coating layer was dried to form a transparent conductive layer, thereby obtaining a transparent conductive film including the base material and the transparent conductive layer. The obtained transparent conductive film was used for the above-mentioned evaluations (1) to (2). The results are shown in Table 1. (Preparation of a composition for forming a hard coat layer) 31 parts of 15-functional urethane acrylic oligomer (manufactured by Shin-Nakamura Chemical Co., Ltd., trade name: NK Oligo UA-53H, weight average molecular weight: 2300), 39 parts Pentaerythritol triacrylate (PETA) (manufactured by Osaka Organic Chemical Co., Ltd., trade name: Viscoat #300), 30 parts of ethoxylated glycerol triacrylate (manufactured by Shin-Nakamura Chemical Co., Ltd., trade name: NK Ester A-GLY-9E), 3 parts of a photopolymerization initiator (manufactured by Ciba-Japan Co., Ltd., trade name: Irgacure 907) were mixed, and diluted with methyl isobutyl ketone so that the solid content concentration would be 40% to prepare a hard coat layer. combination.

[Comparative Example 1] A transparent conductive film was obtained in the same manner as in Example 1 except that the surface treatment was not performed by discharge. The obtained transparent conductive film was used for the above-mentioned evaluations (1) to (2). The results are shown in Table 1.

[Comparative Example 2] A transparent conductive film was obtained in the same manner as in Example 2 except that the surface treatment was not performed by discharge. The obtained transparent conductive film was used for the above-mentioned evaluations (1) to (2). The results are shown in Table 1.

[Comparative Example 3] A transparent conductive film was obtained in the same manner as in Example 3, except that the surface treatment was not performed by discharge. The obtained transparent conductive film was used for the above-mentioned evaluations (1) to (2). The results are shown in Table 1.

[Comparative Example 4] A transparent conductive film was obtained in the same manner as in Example 4 except that the surface treatment was not performed by discharge. The obtained transparent conductive film was used for the above-mentioned evaluations (1) to (2). The results are shown in Table 1.

[Table 1] substrate surface treatment Contact angle (°) Resistance value (measured value) (Ω/□) Surface resistance (Ω/□) Variance of surface resistance value (Ω/□) ² Example 1 COP plasma treatment 83.4 46.5 48.0 47.7 48.4 47.7 47.7 0.52 Example 2 PET plasma treatment 68.5 50.4 50.0 49.3 45.2 46.8 48.3 4.95 Example 3 TAC plasma treatment 64.8 41.0 41.4 46.5 46.4 42.7 43.6 7.06 Example 4 TAC/Hard Coating plasma treatment 78.9 48.3 46.7 49.2 47.1 49.4 48.1 1.47 Comparative Example 1 COP none 98.3 53.5 56.4 56.1 46.2 42.6 50.9 39.06 Comparative Example 2 PET none 84.6 45.7 47.8 54.0 50.8 53.6 50.4 12.87 Comparative Example 3 TAC none 76.9 45.0 37.4 42.6 46.3 47.4 43.7 15.77 Comparative Example 4 TAC/Hard Coating none 90.9 48.4 54.9 44.4 46.5 52.1 49.3 17.96

10: Substrate 10': Substrate 11: Substrate film 12: Hard coating 20: Transparent conductive layer 100: Transparent conductive film 200: Transparent conductive film

FIG. 1 is a schematic cross-sectional view of a transparent conductive film according to an embodiment of the present invention. 2 is a schematic cross-sectional view of a transparent conductive film according to another embodiment.

10: Substrate

20: Transparent conductive layer

100: Transparent conductive film

Claims (10)

A transparent conductive film, It has a base material and a transparent conductive layer disposed on at least one side of the base material, The surface on the transparent conductive layer side of the substrate is the surface treated, and The transparent conductive layer includes metal nanowires. The transparent conductive film according to claim 1, wherein the transparent conductive layer is directly disposed on the base material. The transparent conductive film according to claim 1 or 2, wherein the base material comprises a base material film. The transparent conductive film according to any one of claims 1 to 3, wherein the base material is a single-layer structure. The transparent conductive film of claim 3, wherein The above-mentioned substrate further includes a hard coat layer disposed on at least one side of the substrate film, and The said transparent conductive layer is arrange|positioned at the hard-coat layer side of this base material. The transparent conductive film according to any one of claims 1 to 5, wherein the variance of the surface resistance value is 10 [(Ω/□) ² ] or less. The transparent conductive film according to any one of claims 1 to 6, wherein the surface treatment is plasma treatment or corona treatment. The transparent conductive film according to claim 2, wherein the base film comprises a polyester-based resin or a cycloolefin-based resin. The transparent conductive film according to any one of claims 1 to 8, wherein the metal nanowires are silver nanowires. The transparent conductive film according to any one of claims 1 to 9, wherein the contact angle of the surface-treated surface of the substrate with respect to water is 90° or less.

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