TW202208905A - 光電混合基板 - Google Patents

光電混合基板 Download PDF

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Publication number
TW202208905A
TW202208905A TW110125791A TW110125791A TW202208905A TW 202208905 A TW202208905 A TW 202208905A TW 110125791 A TW110125791 A TW 110125791A TW 110125791 A TW110125791 A TW 110125791A TW 202208905 A TW202208905 A TW 202208905A
Authority
TW
Taiwan
Prior art keywords
wiring
optical element
hybrid substrate
layer
mentioned
Prior art date
Application number
TW110125791A
Other languages
English (en)
Chinese (zh)
Inventor
大川忠男
小田高司
山路正高
市川和志
Original Assignee
日商日東電工股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日東電工股份有限公司 filed Critical 日商日東電工股份有限公司
Publication of TW202208905A publication Critical patent/TW202208905A/zh

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/12002—Three-dimensional structures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/12004—Combinations of two or more optical elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Integrated Circuits (AREA)
  • Structure Of Printed Boards (AREA)
TW110125791A 2020-07-29 2021-07-14 光電混合基板 TW202208905A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020128012 2020-07-29
JP2020-128012 2020-07-29

Publications (1)

Publication Number Publication Date
TW202208905A true TW202208905A (zh) 2022-03-01

Family

ID=80036299

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110125791A TW202208905A (zh) 2020-07-29 2021-07-14 光電混合基板

Country Status (5)

Country Link
US (1) US12366715B2 (https=)
JP (1) JP7682183B2 (https=)
CN (1) CN115868252A (https=)
TW (1) TW202208905A (https=)
WO (1) WO2022024756A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI892399B (zh) * 2023-09-26 2025-08-01 乾坤科技股份有限公司 具有嵌入式光波導結構的軟性印刷電路板及其製作方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI884282B (zh) * 2020-06-22 2025-05-21 日商日東電工股份有限公司 光通訊模組基板
JP2024093387A (ja) * 2022-12-27 2024-07-09 新光電気工業株式会社 配線基板及びその製造方法

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5771568A (en) 1995-03-02 1998-06-30 Hutchinson Technology Incorporated Method for manufacturing a head suspension having electrical trace interconnects with reduced capacitance
JP4222882B2 (ja) 2003-06-03 2009-02-12 日東電工株式会社 配線回路基板
JP5055193B2 (ja) * 2008-04-24 2012-10-24 日東電工株式会社 光電気混載基板の製造方法
JP4796615B2 (ja) * 2008-11-26 2011-10-19 日東電工株式会社 光電気混載基板およびその製造方法
JP4754613B2 (ja) * 2008-11-27 2011-08-24 日東電工株式会社 光電気混載基板およびその製造方法
JP2010266598A (ja) 2009-05-13 2010-11-25 Hitachi Cable Ltd 光配線部材
JP5604840B2 (ja) 2009-09-29 2014-10-15 大日本印刷株式会社 サスペンション用基板、サスペンション、ヘッド付サスペンションおよびハードディスクドライブ
KR101067793B1 (ko) * 2009-11-13 2011-09-27 삼성전기주식회사 연성 광기판 및 그 제조방법
JP2012194401A (ja) * 2011-03-16 2012-10-11 Nitto Denko Corp 光電気混載基板およびその製法
JP5840988B2 (ja) * 2012-03-16 2016-01-06 日東電工株式会社 光電気混載基板およびその製法
JP5840989B2 (ja) * 2012-03-16 2016-01-06 日東電工株式会社 光電気混載基板およびその製法
JP5877749B2 (ja) * 2012-03-29 2016-03-08 日東電工株式会社 光電気混載基板の製法
JP5877756B2 (ja) * 2012-05-08 2016-03-08 日東電工株式会社 光電気混載基板およびその製法
JP6202662B2 (ja) * 2012-11-27 2017-09-27 日東電工株式会社 光電気混載基板およびその製法
JP6245569B2 (ja) * 2013-06-06 2017-12-13 日東電工株式会社 光電気混載基板
JP6414839B2 (ja) * 2013-09-27 2018-10-31 日東電工株式会社 光電気混載基板およびその製法
JP6202566B2 (ja) * 2013-10-29 2017-09-27 日東電工株式会社 光電気混載基板およびその製法
JP6474060B2 (ja) * 2013-10-31 2019-02-27 日東電工株式会社 光電気混載基板
JP6319762B2 (ja) * 2013-10-31 2018-05-09 日東電工株式会社 光電気混載基板およびその製法
JP6376556B2 (ja) * 2014-06-10 2018-08-22 日東電工株式会社 光電気混載基板
JP6712742B2 (ja) * 2014-09-24 2020-06-24 日東電工株式会社 光電気混載基板およびその製法
JP6460515B2 (ja) * 2014-10-24 2019-01-30 日東電工株式会社 光電気混載基板およびその製法
JP6460516B2 (ja) * 2014-10-28 2019-01-30 日東電工株式会社 光電気混載基板
JP6653857B2 (ja) * 2014-11-25 2020-02-26 日東電工株式会社 光電気混載基板およびその製法
JP6674691B2 (ja) * 2014-12-10 2020-04-01 日東電工株式会社 光電気混載基板
JP6859136B2 (ja) * 2017-03-03 2021-04-14 日東電工株式会社 光導波路コア形成用感光性エポキシ樹脂組成物、光導波路コア形成用感光性フィルム、光導波路、光電気混載基板および光導波路の製造方法
JP7351610B2 (ja) 2018-10-30 2023-09-27 浜松ホトニクス株式会社 光検出装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI892399B (zh) * 2023-09-26 2025-08-01 乾坤科技股份有限公司 具有嵌入式光波導結構的軟性印刷電路板及其製作方法
US12446149B2 (en) 2023-09-26 2025-10-14 Cyntec Co., Ltd. Flexible printed circuit board with embedded optical waveguide structure

Also Published As

Publication number Publication date
JP7682183B2 (ja) 2025-05-23
US20230258893A1 (en) 2023-08-17
JPWO2022024756A1 (https=) 2022-02-03
CN115868252A (zh) 2023-03-28
WO2022024756A1 (ja) 2022-02-03
US12366715B2 (en) 2025-07-22

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