TW202146190A - 具有徑向氣簾及/或內部容積控制的晶圓搬運機器人 - Google Patents

具有徑向氣簾及/或內部容積控制的晶圓搬運機器人 Download PDF

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Publication number
TW202146190A
TW202146190A TW110106997A TW110106997A TW202146190A TW 202146190 A TW202146190 A TW 202146190A TW 110106997 A TW110106997 A TW 110106997A TW 110106997 A TW110106997 A TW 110106997A TW 202146190 A TW202146190 A TW 202146190A
Authority
TW
Taiwan
Prior art keywords
turntable
radial
base
axis
wafer handling
Prior art date
Application number
TW110106997A
Other languages
English (en)
Chinese (zh)
Inventor
查爾斯 Ｎ 狄特摩爾
理查 Ｍ 布蘭克
Original Assignee
美商蘭姆研究公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商蘭姆研究公司 filed Critical 美商蘭姆研究公司
Publication of TW202146190A publication Critical patent/TW202146190A/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J18/00—Arms
    • B25J18/02—Arms extensible
    • B25J18/04—Arms extensible rotatable
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
    • B25J19/0075—Means for protecting the manipulator from its environment or vice versa
    • B25J19/0079—Means for protecting the manipulator from its environment or vice versa using an internal pressure system
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
    • B25J19/0075—Means for protecting the manipulator from its environment or vice versa
    • B25J19/0083—Means for protecting the manipulator from its environment or vice versa using gaiters
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
TW110106997A 2020-02-27 2021-02-26 具有徑向氣簾及/或內部容積控制的晶圓搬運機器人 TW202146190A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US202062982626P 2020-02-27 2020-02-27
US62/982,626 2020-02-27

Publications (1)

Publication Number Publication Date
TW202146190A true TW202146190A (zh) 2021-12-16

Family

ID=77492125

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110106997A TW202146190A (zh) 2020-02-27 2021-02-26 具有徑向氣簾及/或內部容積控制的晶圓搬運機器人

Country Status (6)

Country Link
US (1) US11833662B2 (https=)
JP (2) JP7724227B2 (https=)
KR (1) KR20220146594A (https=)
CN (1) CN115427198A (https=)
TW (1) TW202146190A (https=)
WO (1) WO2021173568A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7561568B2 (ja) * 2020-10-19 2024-10-04 ニデックインスツルメンツ株式会社 産業用ロボット
CN117832049A (zh) * 2022-09-28 2024-04-05 北京北方华创微电子装备有限公司 半导体工艺设备及其传输腔室
US12552619B2 (en) * 2023-02-16 2026-02-17 Samsung Electronics Co., Ltd. Wafer transfer apparatus, wafer transfer system, and method for removing particles in wafer transfer apparatus
TWI854761B (zh) * 2023-08-02 2024-09-01 友達光電股份有限公司 半導體自動裝載系統

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60189219A (ja) * 1984-03-08 1985-09-26 Matsushita Electric Ind Co Ltd 回転サセプタ支持装置
JPH06105082B2 (ja) * 1985-08-20 1994-12-21 株式会社東芝 発塵防止機構
JPH0469186A (ja) * 1990-07-09 1992-03-04 Mitsubishi Electric Corp 産業用特殊雰囲気内作業ロボット
JPH0929682A (ja) * 1995-07-11 1997-02-04 Canon Inc クリーン環境用機器のシール装置及びクリーンロボット
JP3638393B2 (ja) * 1997-03-04 2005-04-13 大日本スクリーン製造株式会社 基板処理装置
JPH1187461A (ja) * 1997-09-11 1999-03-30 Dainippon Screen Mfg Co Ltd 基板搬送装置およびそれを適用した基板処理装置
US6352265B1 (en) * 1999-05-26 2002-03-05 Brooks Automation, Inc. Seal ring using gas curtain
JP2001024045A (ja) * 1999-07-08 2001-01-26 Nikon Corp 搬送装置およびそれを用いた露光装置
JP2001300883A (ja) * 2000-04-20 2001-10-30 Kawasaki Heavy Ind Ltd ロボット
JP3983481B2 (ja) 2001-01-31 2007-09-26 東京エレクトロン株式会社 基板処理装置及び基板処理装置における基板搬送方法
JP2012056034A (ja) * 2010-09-09 2012-03-22 Sinfonia Technology Co Ltd ロボットアーム装置
JP5364769B2 (ja) * 2011-09-26 2013-12-11 株式会社安川電機 搬送ロボットおよび基板処理装置
TWI725303B (zh) * 2012-02-10 2021-04-21 美商布魯克斯自動機械公司 基材處理設備
JP5500206B2 (ja) * 2012-06-01 2014-05-21 株式会社安川電機 搬送ロボットおよび搬送ロボットを備えた局所クリーン装置
JP6120031B2 (ja) * 2016-01-20 2017-04-26 セイコーエプソン株式会社 部品検査装置、及び、ハンドラー
JP7137047B2 (ja) 2018-03-15 2022-09-14 シンフォニアテクノロジー株式会社 Ｅｆｅｍ、及び、ｅｆｅｍにおけるガス置換方法
JP7480635B2 (ja) * 2020-08-21 2024-05-10 東京エレクトロン株式会社 基板を搬送する装置、基板を処理するシステム、及び基板を処理する方法
JP7561568B2 (ja) * 2020-10-19 2024-10-04 ニデックインスツルメンツ株式会社 産業用ロボット

Also Published As

Publication number Publication date
US11833662B2 (en) 2023-12-05
CN115427198A (zh) 2022-12-02
JP2025163166A (ja) 2025-10-28
US20230074285A1 (en) 2023-03-09
KR20220146594A (ko) 2022-11-01
WO2021173568A1 (en) 2021-09-02
JP7724227B2 (ja) 2025-08-15
JP2023516944A (ja) 2023-04-21

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