TW202145549A - 固態攝像元件及電子機器 - Google Patents
固態攝像元件及電子機器 Download PDFInfo
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- TW202145549A TW202145549A TW110113658A TW110113658A TW202145549A TW 202145549 A TW202145549 A TW 202145549A TW 110113658 A TW110113658 A TW 110113658A TW 110113658 A TW110113658 A TW 110113658A TW 202145549 A TW202145549 A TW 202145549A
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- Prior art keywords
- light
- pixel
- metal layer
- state imaging
- solid
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- 229910052751 metal Inorganic materials 0.000 claims abstract description 245
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- 238000006243 chemical reaction Methods 0.000 claims abstract description 69
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims abstract description 21
- 229910052721 tungsten Inorganic materials 0.000 claims abstract description 21
- 239000010937 tungsten Substances 0.000 claims abstract description 21
- 239000004065 semiconductor Substances 0.000 claims description 76
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- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 1
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- ANRHNWWPFJCPAZ-UHFFFAOYSA-M thionine Chemical compound [Cl-].C1=CC(N)=CC2=[S+]C3=CC(N)=CC=C3N=C21 ANRHNWWPFJCPAZ-UHFFFAOYSA-M 0.000 description 1
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Images
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/807—Pixel isolation structures
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
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- H10F39/191—Photoconductor image sensors
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- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/20—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from infrared radiation only
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
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- H10F39/182—Colour image sensors
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
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- H10F39/184—Infrared image sensors
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
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- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
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- H—ELECTRICITY
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- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
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- H10F39/805—Coatings
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
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- H10F39/8063—Microlenses
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
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- H10F39/8067—Reflectors
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- H—ELECTRICITY
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- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
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- H10F39/811—Interconnections
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- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
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- H10F39/199—Back-illuminated image sensors
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- H—ELECTRICITY
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- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/805—Coatings
- H10F39/8053—Colour filters
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/805—Coatings
- H10F39/8057—Optical shielding
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- Engineering & Computer Science (AREA)
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- Solid State Image Pick-Up Elements (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020074995 | 2020-04-20 | ||
| JP2020-074995 | 2020-04-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW202145549A true TW202145549A (zh) | 2021-12-01 |
Family
ID=78269297
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW110113658A TW202145549A (zh) | 2020-04-20 | 2021-04-15 | 固態攝像元件及電子機器 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20230230986A1 (https=) |
| EP (1) | EP4141938A4 (https=) |
| JP (1) | JPWO2021215337A1 (https=) |
| KR (1) | KR20230007316A (https=) |
| CN (1) | CN115210874A (https=) |
| TW (1) | TW202145549A (https=) |
| WO (1) | WO2021215337A1 (https=) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20230068895A (ko) * | 2021-11-11 | 2023-05-18 | 삼성전자주식회사 | 이미지 센서 |
| TWI799057B (zh) * | 2022-01-04 | 2023-04-11 | 力晶積成電子製造股份有限公司 | 影像感測器積體晶片及其形成方法 |
| JP2024021322A (ja) * | 2022-08-03 | 2024-02-16 | ソニーセミコンダクタソリューションズ株式会社 | 光検出装置及び電子機器 |
| WO2024135127A1 (ja) * | 2022-12-23 | 2024-06-27 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像装置 |
| CN116435383A (zh) * | 2023-04-28 | 2023-07-14 | 深圳市汇顶科技股份有限公司 | 光学传感装置、制备方法和电子设备 |
Family Cites Families (24)
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| JP2006054262A (ja) * | 2004-08-10 | 2006-02-23 | Sony Corp | 固体撮像装置 |
| JP4826111B2 (ja) * | 2005-03-17 | 2011-11-30 | ソニー株式会社 | 固体撮像素子および固体撮像素子の製造方法および画像撮影装置 |
| US20070001100A1 (en) * | 2005-06-30 | 2007-01-04 | Taiwan Semiconductor Manufacturing Company, Ltd. | Light reflection for backside illuminated sensor |
| JP4525671B2 (ja) * | 2006-12-08 | 2010-08-18 | ソニー株式会社 | 固体撮像装置 |
| JP2010056167A (ja) * | 2008-08-26 | 2010-03-11 | Sony Corp | 固体撮像素子及びその製造方法 |
| FR2935839B1 (fr) * | 2008-09-05 | 2011-08-05 | Commissariat Energie Atomique | Capteur d'images cmos a reflexion lumineuse |
| JP5521312B2 (ja) * | 2008-10-31 | 2014-06-11 | ソニー株式会社 | 固体撮像装置及びその製造方法、並びに電子機器 |
| JP2010118412A (ja) * | 2008-11-11 | 2010-05-27 | Panasonic Corp | 固体撮像装置及びその製造方法 |
| KR101545638B1 (ko) * | 2008-12-17 | 2015-08-19 | 삼성전자 주식회사 | 이미지 센서 및 그 제조 방법, 이미지 센서를 포함하는 장치 및 그 제조 방법 |
| US8299554B2 (en) * | 2009-08-31 | 2012-10-30 | International Business Machines Corporation | Image sensor, method and design structure including non-planar reflector |
| JP5131309B2 (ja) * | 2010-04-16 | 2013-01-30 | ソニー株式会社 | 固体撮像装置、その製造方法および撮像装置 |
| JP5263220B2 (ja) * | 2010-04-16 | 2013-08-14 | ソニー株式会社 | 固体撮像装置、その製造方法および撮像装置 |
| JP2012064709A (ja) * | 2010-09-15 | 2012-03-29 | Sony Corp | 固体撮像装置及び電子機器 |
| JP2012084815A (ja) * | 2010-10-14 | 2012-04-26 | Sharp Corp | 固体撮像装置および電子情報機器 |
| US8767108B2 (en) * | 2011-03-14 | 2014-07-01 | Sony Corporation | Solid-state imaging device, method of manufacturing solid-state imaging device, and electronic apparatus |
| KR102109221B1 (ko) * | 2012-05-16 | 2020-05-11 | 소니 세미컨덕터 솔루션즈 가부시키가이샤 | 고체 촬상 장치 및 전자 기기 |
| JP2014086551A (ja) * | 2012-10-23 | 2014-05-12 | Canon Inc | 撮像装置及びカメラ |
| US9349770B2 (en) * | 2014-02-11 | 2016-05-24 | Semiconductor Components Industries, Llc | Imaging systems with infrared pixels having increased quantum efficiency |
| JP2016082133A (ja) * | 2014-10-20 | 2016-05-16 | ソニー株式会社 | 固体撮像素子及び電子機器 |
| JP2016219566A (ja) * | 2015-05-19 | 2016-12-22 | 株式会社東芝 | 固体撮像素子およびその製造方法 |
| JP2017139286A (ja) | 2016-02-02 | 2017-08-10 | ソニー株式会社 | 撮像素子、及び、カメラシステム |
| CN109661727B (zh) * | 2016-09-02 | 2024-01-19 | 索尼半导体解决方案公司 | 固态成像装置及其制造方法和电子设备 |
| JPWO2018079296A1 (ja) * | 2016-10-27 | 2019-09-12 | ソニーセミコンダクタソリューションズ株式会社 | 撮像素子及び電子機器 |
| CN107833900A (zh) * | 2017-11-07 | 2018-03-23 | 德淮半导体有限公司 | 背照式互补金属氧化物半导体图像传感器及其制造方法 |
-
2021
- 2021-04-14 JP JP2022517004A patent/JPWO2021215337A1/ja active Pending
- 2021-04-14 EP EP21793193.0A patent/EP4141938A4/en not_active Withdrawn
- 2021-04-14 US US17/996,043 patent/US20230230986A1/en active Pending
- 2021-04-14 WO PCT/JP2021/015499 patent/WO2021215337A1/ja not_active Ceased
- 2021-04-14 CN CN202180018230.9A patent/CN115210874A/zh active Pending
- 2021-04-14 KR KR1020227033230A patent/KR20230007316A/ko not_active Abandoned
- 2021-04-15 TW TW110113658A patent/TW202145549A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2021215337A1 (https=) | 2021-10-28 |
| EP4141938A1 (en) | 2023-03-01 |
| CN115210874A (zh) | 2022-10-18 |
| KR20230007316A (ko) | 2023-01-12 |
| WO2021215337A1 (ja) | 2021-10-28 |
| US20230230986A1 (en) | 2023-07-20 |
| EP4141938A4 (en) | 2023-08-23 |
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