TW202138523A - 半導體用接著劑、以及半導體裝置及其製造方法 - Google Patents
半導體用接著劑、以及半導體裝置及其製造方法 Download PDFInfo
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Adhesives Or Adhesive Processes (AREA)
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JP (1) | JPWO2021200553A1 (ko) |
KR (1) | KR20220157370A (ko) |
CN (1) | CN115298281A (ko) |
TW (1) | TW202138523A (ko) |
WO (1) | WO2021200553A1 (ko) |
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JP5040247B2 (ja) * | 2006-10-06 | 2012-10-03 | 東レ株式会社 | 半導体用接着組成物、それを用いた半導体装置および半導体装置の製造方法 |
JP5217260B2 (ja) | 2007-04-27 | 2013-06-19 | 住友ベークライト株式会社 | 半導体ウエハーの接合方法および半導体装置の製造方法 |
JP5871428B2 (ja) * | 2011-03-16 | 2016-03-01 | 古河電気工業株式会社 | 高熱伝導性フィルム状接着剤用組成物、高熱伝導性フィルム状接着剤、並びに、それを用いた半導体パッケージとその製造方法 |
JP2015183093A (ja) * | 2014-03-24 | 2015-10-22 | 三菱化学株式会社 | 積層型半導体装置用の層間充填材に好適な組成物、積層型半導体装置、および積層型半導体装置の製造方法 |
JP6331575B2 (ja) * | 2013-03-28 | 2018-05-30 | 三菱ケミカル株式会社 | 積層型半導体装置の層間充填材用の組成物、積層型半導体装置、および積層型半導体装置の製造方法 |
JP2016046299A (ja) * | 2014-08-20 | 2016-04-04 | 日立化成株式会社 | 半導体接続部封止用接着剤及びこれを用いた半導体装置、半導体装置の製造方法 |
JP2017171817A (ja) * | 2016-03-25 | 2017-09-28 | 日立化成株式会社 | 半導体用接着剤、半導体装置、及び半導体装置の製造方法 |
JP2018138634A (ja) * | 2017-02-24 | 2018-09-06 | 三菱ケミカル株式会社 | 樹脂組成物および該樹脂組成物を用いた半導体装置 |
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- 2021-03-25 CN CN202180021282.1A patent/CN115298281A/zh active Pending
- 2021-03-25 KR KR1020227027406A patent/KR20220157370A/ko active Search and Examination
- 2021-03-25 WO PCT/JP2021/012571 patent/WO2021200553A1/ja active Application Filing
- 2021-03-25 JP JP2022512070A patent/JPWO2021200553A1/ja active Pending
- 2021-03-26 TW TW110111068A patent/TW202138523A/zh unknown
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KR20220157370A (ko) | 2022-11-29 |
WO2021200553A1 (ja) | 2021-10-07 |
JPWO2021200553A1 (ko) | 2021-10-07 |
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