TW202126704A - Resin composition, cured product and siloxane modified (meth) acrylic resin for providing a curable resin composition that can provide a cured product having a relatively low dielectric constant - Google Patents

Resin composition, cured product and siloxane modified (meth) acrylic resin for providing a curable resin composition that can provide a cured product having a relatively low dielectric constant Download PDF

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TW202126704A
TW202126704A TW109140475A TW109140475A TW202126704A TW 202126704 A TW202126704 A TW 202126704A TW 109140475 A TW109140475 A TW 109140475A TW 109140475 A TW109140475 A TW 109140475A TW 202126704 A TW202126704 A TW 202126704A
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resin composition
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引田二郎
宮崎誠太
塩田大
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日商東京應化工業股份有限公司
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/075Silicon-containing compounds
    • G03F7/0757Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • G03F7/0758Macromolecular compounds containing Si-O, Si-C or Si-N bonds with silicon- containing groups in the side chains
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F265/00Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00
    • C08F265/04Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00 on to polymers of esters
    • C08F265/06Polymerisation of acrylate or methacrylate esters on to polymers thereof
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00Processes of polymerisation
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10Esters
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    • C08F220/32Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10Esters
    • C08F220/26Esters containing oxygen in addition to the carboxy oxygen
    • C08F220/32Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals
    • C08F220/325Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals containing glycidyl radical, e.g. glycidyl (meth)acrylate
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F8/00Chemical modification by after-treatment
    • C08F8/42Introducing metal atoms or metal-containing groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04Homopolymers or copolymers of esters
    • C08L33/14Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur, or oxygen atoms in addition to the carboxy oxygen
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor

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  • Epoxy Resins (AREA)

Abstract

The present invention provides a curable resin composition that can provide a cured product having a relatively low dielectric constant, a cured product of the resin composition, a method for producing a patterned cured film using a specific resin composition as the resin composition, and a siloxane modified (meth) acrylic resin suitably used as a component of the resin composition. In the present invention, a siloxane modified (meth) acrylic resin is incorporated into a resin composition as a curable component. The siloxane modified (meth) acrylic resin is a reaction product of a (meth) acrylic resin having an alicyclic epoxy group and an epoxy group-containing cyclic siloxane compound having a specific structure.

Description

樹脂組合物、硬化物、及矽氧烷改質(甲基)丙烯酸樹脂Resin composition, cured product, and silicone modified (meth)acrylic resin

本發明係關於一種含有特定結構之矽氧烷改質(甲基)丙烯酸樹脂(A1)之硬化性樹脂組合物、該樹脂組合物之硬化物、使用上述樹脂組合物之硬化物之製造方法、使用特定感光性組合物作為上述樹脂組合物之經圖案化之硬化膜之製造方法、及適宜地用作上述樹脂組合物之成分的矽氧烷改質(甲基)丙烯酸樹脂。The present invention relates to a curable resin composition containing a silicone-modified (meth)acrylic resin (A1) with a specific structure, a cured product of the resin composition, and a method for producing a cured product using the above-mentioned resin composition, A specific photosensitive composition is used as a method for producing a patterned cured film of the above-mentioned resin composition, and a silicone-modified (meth)acrylic resin suitably used as a component of the above-mentioned resin composition.

作為具有脂環式環氧基之不飽和羧酸酯化合物之具有脂環式環氧基之(甲基)丙烯酸酯係通常用於塗佈劑、墨水、接著劑、密封劑等領域中之化合物。尤其是自含有脂環式結構及環氧基之(甲基)丙烯酸酯獲得之聚合物、硬化物之耐候性優異,具有適合在室外使用之特性。其原因在於該聚合物、硬化物通常藉由脂環式結構中存在之環氧基之開環反應性、(甲基)丙烯酸酯結構中之自由基聚合性雙鍵之反應性等而發揮規定性能。As an unsaturated carboxylic acid ester compound with alicyclic epoxy group, (meth)acrylate with alicyclic epoxy group is a compound commonly used in the fields of coating agents, inks, adhesives, sealants, etc. . In particular, polymers and cured products obtained from (meth)acrylates containing alicyclic structures and epoxy groups have excellent weather resistance and are suitable for outdoor use. The reason is that the polymer and the cured product are usually regulated by the ring-opening reactivity of the epoxy group present in the alicyclic structure, the reactivity of the radical polymerizable double bond in the (meth)acrylate structure, etc. performance.

目前,作為分子中具有環氧基之不飽和羧酸酯,例如已知有甲基丙烯酸縮水甘油酯、甲基丙烯酸1-甲基-1,2-環氧乙酯等含有末端環氧基之(甲基)丙烯酸酯;丙烯酸3,4-環氧環己基甲酯、甲基丙烯酸3,4-環氧環己基甲酯等具有脂環式環氧基之(甲基)丙烯酸酯等。又,於專利文獻1中揭示有分子中具有環氧基之β-羥基丙烯酸酯化合物。At present, as unsaturated carboxylic acid esters having epoxy groups in the molecule, for example, glycidyl methacrylate, 1-methyl-1,2-epoxyethyl methacrylate, etc., containing terminal epoxy groups are known. (Meth)acrylates; (meth)acrylates having alicyclic epoxy groups such as 3,4-epoxycyclohexylmethyl acrylate, 3,4-epoxycyclohexylmethyl methacrylate, etc. In addition, Patent Document 1 discloses a β-hydroxy acrylate compound having an epoxy group in the molecule.

又,專利文獻2中,揭示一種含有3,4-環氧三環[5.2.1.02,6 ]癸烷骨架之不飽和羧酸酯,其係為了提供具有如下性質之樹脂組合物:於用作輻射敏感性樹脂之情形時,可形成溶劑溶解性優異,且具有透明性、耐熱性、耐蝕刻性、平坦性及顯影性之高性能皮膜,並且保存穩定性高。 [先前技術文獻] [專利文獻]In addition, Patent Document 2 discloses an unsaturated carboxylic acid ester containing 3,4-epoxytricyclo[5.2.1.0 2,6 ]decane skeleton, which is to provide a resin composition having the following properties: When used as a radiation-sensitive resin, it can form a high-performance film with excellent solvent solubility, transparency, heat resistance, etching resistance, flatness and developability, and high storage stability. [Prior Technical Documents] [Patent Documents]

[專利文獻1]日本專利特開昭61-263968號公報 [專利文獻2]國際公開第2006-059564號[Patent Document 1] Japanese Patent Laid-Open No. 61-263968 [Patent Document 2] International Publication No. 2006-059564

[發明所欲解決之問題][The problem to be solved by the invention]

對於各種圖像顯示裝置用顯示面板中之絕緣體等膜,希望相對介電常數較低。然而,專利文獻1、專利文獻2中所記載之硬化性組合物之硬化物的相對介電常數高。因此,難以將專利文獻1、專利文獻2中所記載之硬化性組合物應用為用以製造構成顯示面板之膜的材料。For films such as insulators in display panels for various image display devices, it is desirable that the relative dielectric constant be low. However, the cured product of the curable composition described in Patent Document 1 and Patent Document 2 has a high relative dielectric constant. Therefore, it is difficult to apply the curable composition described in Patent Document 1 and Patent Document 2 as a material for manufacturing a film constituting a display panel.

本發明鑒於上述先前技術之問題點,目的在於提供一種提供相對介電常數較低之硬化物之硬化性樹脂組合物、該樹脂組合物之硬化物、使用特定樹脂組合物作為上述樹脂組合物之經圖案化之硬化膜之製造方法、及適宜地用作上述樹脂組合物之成分之矽氧烷改質(甲基)丙烯酸樹脂。 [解決問題之技術手段]In view of the above-mentioned problems of the prior art, the purpose of the present invention is to provide a curable resin composition that provides a cured product with a relatively low dielectric constant, a cured product of the resin composition, and a specific resin composition used as the above-mentioned resin composition. A method for producing a patterned cured film, and a silicone-modified (meth)acrylic resin suitably used as a component of the above-mentioned resin composition. [Technical means to solve the problem]

本發明者等人發現,藉由將具有脂環式環氧基之(甲基)丙烯酸樹脂與特定結構之含有環氧基之環狀矽氧烷化合物之反應物、即矽氧烷改質(甲基)丙烯酸樹脂作為硬化性成分調配於樹脂組合物中,可解決上述課題,從而完成本發明。更具體而言,本發明提供以下者。The inventors discovered that the reaction product of a (meth)acrylic resin with an alicyclic epoxy group and a cyclic siloxane compound containing an epoxy group with a specific structure, that is, silicone is modified ( The meth)acrylic resin is blended into the resin composition as a curable component to solve the above-mentioned problems, and the present invention has been completed. More specifically, the present invention provides the following.

本發明之第1態樣係一種樹脂組合物,其含有矽氧烷改質(甲基)丙烯酸樹脂(A1), 矽氧烷改質(甲基)丙烯酸樹脂(A1)係包含源自具有脂環式環氧基之(甲基)丙烯酸酯之結構單元之(甲基)丙烯酸樹脂(A-I)、與下述式(a-I)所示之含有環氧基之環狀矽氧烷化合物(A-II)之反應物。 [化1]

Figure 02_image001
(式(a-I)中,Ra01 及Ra02 表示含有環氧基之一價基或烷基,x1表示3以上之整數,x1個Ra01 及x1個Ra02 中之至少兩個為含有環氧基之一價基)The first aspect of the present invention is a resin composition containing a silicone-modified (meth)acrylic resin (A1), and the silicone-modified (meth)acrylic resin (A1) contains a resin derived from The (meth)acrylic resin (AI), which is the structural unit of the (meth)acrylate of the cyclic epoxy group, and the epoxy-containing cyclic siloxane compound (A-) represented by the following formula (aI) II) The reactant. [化1]
Figure 02_image001
(In formula (aI), Ra01 and Ra02 represent monovalent groups or alkyl groups containing epoxy groups, x1 represents an integer of 3 or more, and at least two of x1 Ra01 and x1 Ra02 contain epoxy (Basic one valence basis)

本發明之第2態樣係一種硬化物,其係藉由加熱及/或曝光使第1態樣之樹脂組合物硬化而成。The second aspect of the present invention is a cured product formed by curing the resin composition of the first aspect by heating and/or exposure.

本發明之第3態樣係一種硬化物之製造方法,其係對第1態樣之樹脂組合物進行加熱及/或曝光。The third aspect of the present invention is a method for producing a cured product, which heats and/or exposes the resin composition of the first aspect.

本發明之第4態樣係一種經圖案化之硬化膜之製造方法,其包括: 將第1態樣之樹脂組合物且為含有包含具有鹼可溶性基之結構單元之(甲基)丙烯酸樹脂(A1)、光聚合性單體(B)及光聚合起始劑(C)之樹脂組合物塗佈於基板上而形成塗佈膜; 對於塗佈膜,位置選擇性地進行曝光; 利用鹼性顯影液對曝光後之塗佈膜進行顯影而使塗佈膜圖案化;及 對經圖案化之塗佈膜進行加熱。The fourth aspect of the present invention is a method for manufacturing a patterned cured film, which includes: The resin composition of the first aspect is a resin containing a (meth)acrylic resin (A1), a photopolymerizable monomer (B), and a photopolymerization initiator (C) containing a structural unit having an alkali-soluble group The composition is coated on the substrate to form a coating film; For the coated film, the position is selectively exposed; Use an alkaline developer to develop the exposed coating film to pattern the coating film; and The patterned coating film is heated.

本發明之第5態樣係一種矽氧烷改質(甲基)丙烯酸樹脂,其係包含源自具有脂環式環氧基之(甲基)丙烯酸酯之結構單元之(甲基)丙烯酸樹脂(A-I)、與下述式(a-I)所示之含有環氧基之環狀矽氧烷化合物(A-II)之反應物。 [化2]

Figure 02_image003
(式(a-I)中,Ra01 及Ra02 表示含有環氧基之一價基或烷基,x1表示3以上之整數,x1個Ra01 及x1個Ra02 中之至少兩個為含有環氧基之一價基) [發明之效果]The fifth aspect of the present invention is a silicone-modified (meth)acrylic resin, which is a (meth)acrylic resin containing structural units derived from a (meth)acrylate having an alicyclic epoxy group (AI), reactant with epoxy-containing cyclic siloxane compound (A-II) represented by the following formula (aI). [化2]
Figure 02_image003
(In formula (aI), Ra01 and Ra02 represent monovalent groups or alkyl groups containing epoxy groups, x1 represents an integer of 3 or more, and at least two of x1 Ra01 and x1 Ra02 contain epoxy One-valent basis) [Effects of the invention]

根據本發明,可提供一種提供相對介電常數較低之硬化物之硬化性樹脂組合物、該樹脂組合物之硬化物、使用特定樹脂組合物作為上述樹脂組合物之經圖案化之硬化膜之製造方法、及適宜地用作上述樹脂組合物之成分之矽氧烷改質(甲基)丙烯酸樹脂。According to the present invention, it is possible to provide a curable resin composition that provides a cured product with a low relative dielectric constant, a cured product of the resin composition, and a patterned cured film using a specific resin composition as the resin composition. The production method and the silicone-modified (meth)acrylic resin suitably used as a component of the above-mentioned resin composition.

≪樹脂組合物≫ 樹脂組合物含有矽氧烷改質(甲基)丙烯酸樹脂(A1)。矽氧烷改質(甲基)丙烯酸樹脂(A1)係包含源自具有脂環式環氧基之(甲基)丙烯酸酯之結構單元之(甲基)丙烯酸樹脂(A-I)、與下述式(a-I)所示之含有環氧基之環狀矽氧烷化合物(A-II)之反應物。 [化3]

Figure 02_image005
(式(a-I)中,Ra01 及Ra02 表示含有環氧基之一價基或烷基,x1表示3以上之整數,x1個Ra01 及x1個Ra02 中之至少兩個為含有環氧基之一價基)≪Resin composition≫ The resin composition contains silicone modified (meth)acrylic resin (A1). Silicone modified (meth)acrylic resin (A1) is a (meth)acrylic resin (AI) containing structural units derived from (meth)acrylates with alicyclic epoxy groups, and the following formula (aI) The reactant of the epoxy-containing cyclic siloxane compound (A-II). [化3]
Figure 02_image005
(In formula (aI), Ra01 and Ra02 represent monovalent groups or alkyl groups containing epoxy groups, x1 represents an integer of 3 or more, and at least two of x1 Ra01 and x1 Ra02 contain epoxy (Basic one valence basis)

本申請之說明書及申請專利範圍中,「(甲基)丙烯酸」係指丙烯酸及甲基丙烯酸兩者。本申請之說明書及申請專利範圍中,「(甲基)丙烯酸酯」係指丙烯酸酯及甲基丙烯酸酯兩者。本申請之說明書及申請專利範圍中,「(甲基)丙烯醯基」係指丙烯醯基及甲基丙烯醯基兩者。In the specification of this application and the scope of the patent application, "(meth)acrylic acid" refers to both acrylic acid and methacrylic acid. In the specification of this application and the scope of the patent application, "(meth)acrylate" refers to both acrylate and methacrylate. In the specification of this application and the scope of the patent application, "(meth)acryloyl" refers to both acryloyl and methacryloyl.

上述樹脂組合物由於含有作為環氧化合物之上述矽氧烷改質(甲基)丙烯酸樹脂(A1)式(1)所示之化合物,故而可藉由環氧基之相關反應而硬化。 使樹脂組合物硬化之方法並無特別限定。視需要添加有感熱性硬化劑之樹脂組合物可藉由加熱而硬化。又,添加有感光性硬化劑之樹脂組合物可藉由曝光而硬化。Since the above-mentioned resin composition contains the above-mentioned silicone modified (meth)acrylic resin (A1) as an epoxy compound, the compound represented by formula (1), it can be cured by the related reaction of the epoxy group. The method of hardening the resin composition is not particularly limited. The resin composition to which the thermosensitive hardening agent is added can be hardened by heating. In addition, the resin composition to which the photosensitive curing agent is added can be cured by exposure.

樹脂組合物亦可含有光聚合性化合物與光聚合起始劑。含有作為環氧化合物之上述矽氧烷改質(甲基)丙烯酸樹脂(A1)、與光聚合性化合物及光聚合起始劑之樹脂組合物可僅藉由曝光或藉由曝光與加熱之組合而硬化。The resin composition may contain a photopolymerizable compound and a photopolymerization initiator. The resin composition containing the above-mentioned silicone modified (meth)acrylic resin (A1) as an epoxy compound, a photopolymerizable compound and a photopolymerization initiator can be exposed only by exposure or by a combination of exposure and heating And hardened.

以下,對矽氧烷改質(甲基)丙烯酸樹脂(A1)、及樹脂組合物之較佳態樣進行說明。再者,樹脂組合物不受後述組合物任何限定,只要是含有矽氧烷改質(甲基)丙烯酸樹脂(A1)之組合物即可。Hereinafter, preferred aspects of the silicone-modified (meth)acrylic resin (A1) and the resin composition will be described. In addition, the resin composition is not limited to the composition described later, as long as it contains a silicone-modified (meth)acrylic resin (A1).

<矽氧烷改質(甲基)丙烯酸樹脂(A1)> 如上所述,矽氧烷改質(甲基)丙烯酸樹脂(A1)係包含源自具有脂環式環氧基之(甲基)丙烯酸酯之結構單元之(甲基)丙烯酸樹脂(A-I)、與上述含有環氧基之環狀矽氧烷化合物(A-II)之反應物。 藉由使樹脂組合物含有該矽氧烷改質(甲基)丙烯酸樹脂(A1),樹脂組合物可提供相對介電常數較低之硬化物。 以下,對(甲基)丙烯酸樹脂(A-I)、含有環氧基之環狀矽氧烷化合物(A-II)、及矽氧烷改質(甲基)丙烯酸樹脂(A1)之製造方法加以說明。<Siloxane modified (meth)acrylic resin (A1)> As mentioned above, the silicone modified (meth)acrylic resin (A1) is a (meth)acrylic resin (AI) containing structural units derived from (meth)acrylates with alicyclic epoxy groups, Reactant with the above-mentioned epoxy-containing cyclic siloxane compound (A-II). By including the silicone-modified (meth)acrylic resin (A1) in the resin composition, the resin composition can provide a cured product with a relatively low dielectric constant. Hereinafter, the production method of (meth)acrylic resin (AI), epoxy-containing cyclic silicone compound (A-II), and silicone modified (meth)acrylic resin (A1) will be explained .

[(甲基)丙烯酸樹脂(A-I)] (甲基)丙烯酸樹脂(A-I)係包含源自具有脂環式環氧基之(甲基)丙烯酸酯之結構單元之(甲基)丙烯酸樹脂。(甲基)丙烯酸樹脂(A-I)可為具有脂環式環氧基之(甲基)丙烯酸酯之均聚物,亦可為具有脂環式環氧基之(甲基)丙烯酸酯與其他單體之共聚物。[(Meth) acrylic resin (A-I)] The (meth)acrylic resin (A-I) is a (meth)acrylic resin containing a structural unit derived from a (meth)acrylate having an alicyclic epoxy group. The (meth)acrylic resin (AI) can be a homopolymer of (meth)acrylate with alicyclic epoxy group, or it can be a (meth)acrylate with alicyclic epoxy group and other monomers. Body copolymer.

(具有脂環式環氧基之(甲基)丙烯酸酯) 構成具有脂環式環氧基之(甲基)丙烯酸酯之脂環式基可為單環,亦可為多環。就易於獲得介電常數較低之硬化物之方面而言,較佳為脂環式基為多環之脂環式基,具有脂環式環氧基之(甲基)丙烯酸酯具有多環烷烴骨架。 作為單環之脂環式基,可例舉:環戊基、環己基等。又,作為多環之脂環式基,可例舉:降𦯉基、異𦯉基、三環壬基、三環癸基、四環十二烷基等。((Meth)acrylate with alicyclic epoxy group) The alicyclic group constituting the (meth)acrylate having an alicyclic epoxy group may be a monocyclic ring or a polycyclic ring. In terms of the ease of obtaining a cured product with a low dielectric constant, it is preferable that the alicyclic group is a polycyclic alicyclic group, and the (meth)acrylate having an alicyclic epoxy group has a polycyclic alkane skeleton. As a monocyclic alicyclic group, cyclopentyl, cyclohexyl, etc. are mentioned. In addition, as the polycyclic alicyclic group, there can be exemplified nordoxy, isooxy, tricyclononyl, tricyclodecyl, tetracyclododecyl, and the like.

作為具有脂環式環氧基之(甲基)丙烯酸酯之具體例,例如可例舉下述式(a-4-1a)~(a-4-1o)所示之化合物。該等中,為使顯影性處於適度範圍內,較佳為下述式(a-4-1a)~(a-4-1e)所示之化合物,更佳為下述式(a-4-1a)~(a-4-1c)所示之化合物。As a specific example of the (meth)acrylate which has an alicyclic epoxy group, the compound shown by following formula (a-4-1a)-(a-4-1o) is mentioned, for example. Among these, in order to keep the developability in an appropriate range, the compounds represented by the following formulas (a-4-1a) to (a-4-1e) are preferred, and the following formulas (a-4- 1a) ~ (a-4-1c) the compounds shown.

[化4]

Figure 02_image007
[化4]
Figure 02_image007

[化5]

Figure 02_image009
[化5]
Figure 02_image009

[化6]

Figure 02_image011
[化6]
Figure 02_image011

上述式中,Ra20 表示氫原子或甲基,Ra21 表示碳原子數1以上6以下之二價脂肪族飽和烴基,Ra22 表示碳原子數1以上10以下之二價烴基,t表示0以上10以下之整數。作為Ra21 ,較佳為直鏈狀或支鏈狀之伸烷基,例如亞甲基、伸乙基、伸丙基、四亞甲基、乙基伸乙基、五亞甲基、六亞甲基。作為Ra22 ,例如較佳為亞甲基、伸乙基、伸丙基、四亞甲基、乙基伸乙基、五亞甲基、六亞甲基、伸苯基、伸環己基、-CH2 -Ph-CH2 -(Ph表示伸苯基)。In the above formula, R a20 represents a hydrogen atom or a methyl group, R a21 represents a divalent saturated aliphatic hydrocarbon group with 1 to 6 carbon atoms, R a22 represents a divalent hydrocarbon group with 1 to 10 carbon atoms, and t represents 0 or more Integers below 10. R a21 is preferably a linear or branched alkylene group, such as methylene, ethylene, propylene, tetramethylene, ethylethylene, pentamethylene, hexamethylene base. As R a22 , for example, methylene, ethylene, propylene, tetramethylene, ethylethylene, pentamethylene, hexamethylene, phenylene, cyclohexylene, -CH are preferred. 2 -Ph-CH 2- (Ph represents phenylene).

・式(1)所示之化合物 作為具有脂環式環氧基之(甲基)丙烯酸酯,就易於形成相對介電常數較低之硬化物之方面而言,下述式(1)所示之化合物亦較佳。以下,對式(1)所示之化合物加以說明。 [化7]

Figure 02_image013
(式(1)中,環A表示與環B縮合之包含五員或六員脂環之環,環B表示與環A及C縮合且含有於環B內交聯之交聯基之脂環,環C表示與環B縮合之包含五員或六員脂環之環,R1 表示(甲基)丙烯醯基,R2 表示烷基、烷醯基、芳醯基、或三烴基矽烷基,環A、環B及環C可具有取代基,亦可不具有取代基)・The compound represented by formula (1), as a (meth)acrylate having an alicyclic epoxy group, is easy to form a cured product with a low relative permittivity, as shown in the following formula (1) The compound is also preferred. Hereinafter, the compound represented by formula (1) will be described. [化7]
Figure 02_image013
(In formula (1), ring A represents a five-member or six-member alicyclic ring condensed with ring B, and ring B represents an alicyclic ring condensed with rings A and C and containing a crosslinking group crosslinked in ring B , Ring C represents a five-member or six-member alicyclic ring condensed with ring B, R 1 represents a (meth)acryloyl group, R 2 represents an alkyl, alkane, aryl, or trihydrocarbylsilyl group , Ring A, Ring B and Ring C may or may not have substituents)

式(1)中,環A係與環B縮合之包含五員或六員脂環之環。環B係與環A及C縮合且含有於環B內交聯之交聯基之脂環。環C係與環B縮合之包含五員或六員脂環之環。環A、B及C可具有取代基,亦可不具有取代基。In the formula (1), the ring A is a five-member or six-member alicyclic ring condensed with the ring B. Ring B is an alicyclic ring which is condensed with rings A and C and contains a crosslinking group crosslinked in ring B. Ring C is a five-member or six-member alicyclic ring condensed with ring B. Rings A, B, and C may or may not have substituents.

環A可含有與環B同樣之會於環A內交聯之交聯基,亦可不含有該交聯基。就容易合成式(1)所示之化合物之方面而言,作為環A,較佳為六員脂環。 環C可含有與環B同樣之會於環C內交聯之交聯基,亦可不含有該交聯基。就容易合成式(1)所示之化合物之方面而言,作為環C,較佳為五員脂環。就製造時之環氧基開環反應之選擇性之觀點而言,較佳為五員脂環。The ring A may contain the same cross-linking group as the ring B that will cross-link in the ring A, or it may not contain the cross-linking group. In terms of easy synthesis of the compound represented by formula (1), the ring A is preferably a six-membered alicyclic ring. Ring C may contain the same cross-linking group as ring B that will cross-link in ring C, or may not contain the cross-linking group. In terms of easy synthesis of the compound represented by formula (1), the ring C is preferably a five-membered alicyclic ring. From the viewpoint of the selectivity of the epoxy ring-opening reaction during production, a five-membered alicyclic ring is preferred.

環B藉由具有會於環B內交聯之交聯基,可有助於耐熱性。 作為環B,可例舉含有上述交聯基之五員以上八員以下之脂環。作為環B,較佳為含有上述交聯基之六員或七員環之脂環,更佳為含有上述交聯基之六員環之脂環。Ring B can contribute to heat resistance by having a crosslinking group that can crosslink in ring B. As the ring B, an alicyclic ring containing five members or more and eight members or less of the above-mentioned crosslinking group can be exemplified. The ring B is preferably a six-membered or seven-membered alicyclic ring containing the above-mentioned cross-linking group, and more preferably a six-membered ring containing the above-mentioned cross-linking group.

作為會於環B內交聯之上述交聯基,可例舉碳原子數1以上5以下之二價基。交聯基之碳原子數更佳為1以上3以下,進而較佳為1或2。作為上述交聯基,較佳為伸烷基、醚鍵(-O-)、硫醚鍵(-S-)、羰基(-CO-)或該等之至少兩個組合而成之二價基,更佳為伸烷基、醚鍵、硫醚鍵或該等之至少兩個組合而成之二價基,尤佳為伸烷基、醚鍵或硫醚鍵,最佳為伸烷基。Examples of the above-mentioned cross-linking group capable of cross-linking in the ring B include a divalent group having 1 to 5 carbon atoms. The number of carbon atoms of the crosslinking group is more preferably 1 or more and 3 or less, and still more preferably 1 or 2. As the above-mentioned crosslinking group, an alkylene group, an ether bond (-O-), a thioether bond (-S-), a carbonyl group (-CO-) or a divalent group composed of at least two of these are preferred , More preferably an alkylene, ether bond, thioether bond or a divalent group formed by a combination of at least two of these, particularly preferably an alkylene, ether bond or thioether bond, and most preferably an alkylene.

作為上述伸烷基,可例舉可具有取代基之碳原子數1以上5以下之伸烷基。伸烷基之碳原子數更佳為1以上3以下,進而較佳為1或2。作為伸烷基之具體例,可例舉亞甲基、伸乙基、伸丙基、伸丁基、伸戊基等,較佳為亞甲基、伸乙基或伸丙基,更佳為亞甲基或伸乙基。As said alkylene group, the C1-C5 alkylene group which may have a substituent is mentioned. The number of carbon atoms of the alkylene group is more preferably 1 or more and 3 or less, and still more preferably 1 or 2. Specific examples of the alkylene group include methylene, ethylene group, propylene group, butylene group, pentylene group, etc., preferably methylene, ethylene group or propylene group, and more preferably Methylene or ethylene.

作為上述伸烷基可具有之取代基、環A、B及C可具有之取代基,可例舉鹵素原子或烴基。 作為鹵素原子,可例舉:氟原子、氯原子、溴原子或碘原子。 作為烴基,可例舉碳原子數1以上10以下之烴基。作為烴基之較佳例,可例舉烷基等。 作為上述烷基,可例舉碳原子數1以上10以下之烷基。作為烷基之具體例,可例舉:甲基、乙基、正丙基、異丙基、正丁基、異丁基、第二丁基、第三丁基、正戊基、正己基、正庚基、正辛基、正壬基、及正癸基等。該等烷基中,較佳為作為碳原子數1以上4以下之烷基之甲基、乙基、正丙基、異丙基、正丁基、異丁基、第二丁基、及第三丁基。 烷基亦可具有取代基。於烷基具有取代基時,作為該取代基,可例舉鹵素原子等。Examples of the substituents that the above-mentioned alkylene group may have, and the substituents that the rings A, B, and C may have, include a halogen atom or a hydrocarbon group. The halogen atom may, for example, be a fluorine atom, a chlorine atom, a bromine atom or an iodine atom. As the hydrocarbon group, a hydrocarbon group having 1 to 10 carbon atoms may be mentioned. As a preferable example of a hydrocarbon group, an alkyl group etc. can be mentioned. As the above-mentioned alkyl group, an alkyl group having 1 to 10 carbon atoms may be mentioned. Specific examples of the alkyl group include: methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, second butyl, tertiary butyl, n-pentyl, n-hexyl, N-heptyl, n-octyl, n-nonyl, and n-decyl, etc. Among these alkyl groups, methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, sec-butyl, and the first alkyl group having 1 to 4 carbon atoms are preferred. Tributyl. The alkyl group may have a substituent. When the alkyl group has a substituent, the substituent may, for example, be a halogen atom or the like.

作為上述環B,較佳為下述式(2)所示之環。 [化8]

Figure 02_image015
(式(2)中,L表示上述交聯基,上述交聯基為伸烷基、醚鍵、硫醚鍵、酮基或該等之至少兩個組合而成之二價基,R3 及R4 分別獨立表示氫原子、鹵素原子或烴基,*表示與環A之鍵結鍵,**表示與環C之鍵結鍵)The ring B is preferably a ring represented by the following formula (2). [化8]
Figure 02_image015
(In formula (2), L represents the above-mentioned cross-linking group, and the above-mentioned cross-linking group is an alkylene group, an ether bond, a thioether bond, a ketone group, or a divalent group formed by a combination of at least two of these, R 3 and R 4 each independently represents a hydrogen atom, a halogen atom or a hydrocarbon group, * represents a bond with ring A, ** represents a bond with ring C)

作為與L相關之上述交聯基之具體例及較佳例,如上所述。 關於作為R3 及R4 之鹵素原子及烴基之具體例及較佳例,可例舉以上作為「上述伸烷基可具有之取代基、環A、B及C可具有之取代基」所述之鹵素原子或烴基之具體例及較佳例。作為R3 及R4 ,較佳為氫原子、鹵素原子或烷基,更佳為氫原子。Specific examples and preferred examples of the above-mentioned crosslinking group related to L are as described above. Specific examples and preferred examples of halogen atoms and hydrocarbon groups as R 3 and R 4 include those described above as "substituents that may be possessed by the above-mentioned alkylene group, and substituents that may be possessed by rings A, B and C" Specific examples and preferred examples of the halogen atom or hydrocarbon group. As R 3 and R 4 , a hydrogen atom, a halogen atom or an alkyl group is preferable, and a hydrogen atom is more preferable.

式(1)中,R2 為烷基、烷醯基、芳醯基、或三烴基矽烷基。In the formula (1), R 2 is an alkyl group, an alkane group, an aryl group, or a trihydrocarbylsilyl group.

作為R2 之烷基可為直鏈狀,亦可為支鏈狀,較佳為直鏈狀。作為R2 之烷基之碳原子數較佳為1以上10以下,更佳為1以上4以下,進而較佳為1或2。作為烷基之具體例,可例舉:甲基、乙基、正丙基、異丙基、正丁基、異丁基、第二丁基、第三丁基、正戊基、正己基、正庚基、正辛基、正壬基、及正癸基等。該等烷基中,較佳為作為碳原子數1以上4以下之烷基之甲基、乙基、正丙基、異丙基、正丁基、異丁基、第二丁基、及第三丁基,更佳為甲基及乙基,進而較佳為甲基。The alkyl group as R 2 may be linear or branched, and is preferably linear. The number of carbon atoms of the alkyl group as R 2 is preferably 1 or more and 10 or less, more preferably 1 or more and 4 or less, and still more preferably 1 or 2. Specific examples of the alkyl group include: methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, second butyl, tertiary butyl, n-pentyl, n-hexyl, N-heptyl, n-octyl, n-nonyl, and n-decyl, etc. Among these alkyl groups, methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, sec-butyl, and the first alkyl group having 1 to 4 carbon atoms are preferred. The tributyl group is more preferably a methyl group and an ethyl group, and still more preferably a methyl group.

作為R2 之烷醯基可為直鏈狀,亦可為支鏈狀,較佳為直鏈狀。作為R2 之烷醯基之碳原子數較佳為2以上10以下,更佳為2以上4以下,進而較佳為2。作為烷醯基之具體例,可例舉:乙醯基、丙醯基、丁醯基、戊醯基、己醯基、庚醯基、辛醯基、壬醯基、及癸醯基。該等烷醯基中,較佳為乙醯基及丙醯基,更佳為乙醯基。The alkanoyl group as R 2 may be linear or branched, and is preferably linear. The number of carbon atoms of the alkanoyl group as R 2 is preferably 2 or more and 10 or less, more preferably 2 or more and 4 or less, and still more preferably 2. Specific examples of the alkanoyl group include acetyl, propanoyl, butanoyl, pentanyl, hexyl, heptanoyl, octanoyl, nonanoyl, and decanoyl. Among these alkyl groups, acetyl group and propyl group are preferred, and acetyl group is more preferred.

關於作為R2 之芳醯基,可例舉:苯甲醯基、萘甲醯基等。Regarding the aryl group as R 2 , a benzyl group, a naphthyl group and the like can be mentioned.

作為R2 之三烴基矽烷基係於矽原子上鍵結有3個烴基之基。 三烴基矽烷基中之3個烴基可相同,亦可不同。就製造式(1)所示之化合物時,容易合成或獲取用於導入三烴基矽烷基之矽烷化合物之方面而言,較佳為三烴基矽烷基中之3個烴基相同。The trihydrocarbyl silyl group as R 2 is a group in which 3 hydrocarbyl groups are bonded to a silicon atom. The three hydrocarbyl groups in the trihydrocarbylsilyl group may be the same or different. When the compound represented by formula (1) is produced, it is easy to synthesize or obtain a silane compound for introducing a trihydrocarbylsilyl group, it is preferable that the three hydrocarbyl groups in the trihydrocarbylsilyl group are the same.

三烴基矽烷基中,要鍵結於矽原子之烴基可為脂肪族烴基,亦可為芳香族烴基,亦可為脂肪族烴基與芳香族烴基組合而成之基。 三烴基矽烷基中,在要鍵結於矽原子之烴基為脂肪族烴基之情形時,該脂肪族烴基可含有1個以上之不飽和鍵。 三烴基矽烷基中,在要鍵結於矽原子之烴基為脂肪族烴基之情形時,該脂肪族烴基之結構可為直鏈狀,亦可為支鏈狀,亦可為環狀,亦可為該等結構之組合。In the trihydrocarbyl silyl group, the hydrocarbon group to be bonded to the silicon atom may be an aliphatic hydrocarbon group, an aromatic hydrocarbon group, or a combination of an aliphatic hydrocarbon group and an aromatic hydrocarbon group. In the trihydrocarbylsilyl group, when the hydrocarbyl group to be bonded to the silicon atom is an aliphatic hydrocarbyl group, the aliphatic hydrocarbyl group may contain one or more unsaturated bonds. In the trihydrocarbylsilyl group, when the hydrocarbyl group to be bonded to the silicon atom is an aliphatic hydrocarbyl group, the structure of the aliphatic hydrocarbyl group may be linear, branched, cyclic, or It is a combination of these structures.

三烴基矽烷基中,關於要鍵結於矽原子之烴基之碳原子數,就式(1)所示之化合物之分子量及環氧當量不會變得過大之方面而言,較佳為1以上10以下,更佳為1以上6以下,進而較佳為1以上4以下。In the trihydrocarbylsilyl group, the number of carbon atoms of the hydrocarbyl group to be bonded to the silicon atom is preferably 1 or more in terms of the molecular weight and epoxy equivalent of the compound represented by formula (1) not becoming too large 10 or less, more preferably 1 or more and 6 or less, and still more preferably 1 or more and 4 or less.

作為三烴基矽烷基中之烴基,例如較佳為烷基、環烷基、芳基、及芳烷基。As the hydrocarbon group in the trihydrocarbylsilyl group, for example, an alkyl group, a cycloalkyl group, an aryl group, and an aralkyl group are preferable.

作為烷基之具體例,可例舉:甲基、乙基、正丙基、異丙基、正丁基、異丁基、第二丁基、第三丁基、正戊基、正己基、正庚基、正辛基、正壬基、及正癸基等。該等烷基中,較佳為作為碳原子數1以上4以下之烷基之甲基、乙基、正丙基、異丙基、正丁基、異丁基、第二丁基、及第三丁基。Specific examples of the alkyl group include: methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, second butyl, tertiary butyl, n-pentyl, n-hexyl, N-heptyl, n-octyl, n-nonyl, and n-decyl, etc. Among these alkyl groups, methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, sec-butyl, and the first alkyl group having 1 to 4 carbon atoms are preferred. Tributyl.

作為環烷基之具體例,可例舉:環丙基、環丁基、環戊基、環己基、及環庚基等。Specific examples of cycloalkyl groups include cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl, and cycloheptyl.

作為芳基之具體例,可例舉:苯基、萘-1-基、及萘-2-基。As a specific example of an aryl group, a phenyl group, a naphth-1-yl group, and a naphth-2-yl group can be mentioned.

作為芳烷基之具體例,可例舉苄基及苯乙基。As specific examples of the aralkyl group, a benzyl group and a phenethyl group may be mentioned.

作為以上說明之三烴基矽烷基之較佳具體例,可例舉:三甲基矽烷基、三乙基矽烷基、三正丙基矽烷基、三異丙基矽烷基、三正丁基矽烷基、三異丁基矽烷基、三-第二丁基矽烷基、三-第三丁基矽烷基、乙基二甲基矽烷基、正丙基二甲基矽烷基、異丙基二甲基矽烷基、正丁基二甲基矽烷基、異丁基二甲基矽烷基、第二丁基二甲基矽烷基、及第三丁基二甲基矽烷基。As preferred specific examples of the trihydrocarbylsilyl group described above, there may be mentioned: trimethylsilyl group, triethylsilyl group, tri-n-propylsilyl group, triisopropylsilyl group, tri-n-butylsilyl group , Triisobutylsilyl group, tri-second butylsilyl group, tri-tertiary butylsilyl group, ethyl dimethyl silyl group, n-propyl dimethyl silyl group, isopropyl dimethyl silyl group Group, n-butyldimethylsilyl group, isobutyldimethylsilyl group, second butyldimethylsilyl group, and tertiary butyldimethylsilyl group.

上述式(1)所示之化合物較佳為下述式(3)或(4)所示之化合物。 [化9]

Figure 02_image017
(式(3)及式(4)中,環B表示含有會於環B內交聯之上述交聯基之脂環,R1 表示(甲基)丙烯醯基,R2 表示烷基、烷醯基、芳醯基、或三烴基矽烷基,R11 表示單鍵或-CHR15 -所示之二價基,於R11 為單鍵之情形時,R12 及R13 、或R13 及R14 相互鍵結而形成環氧乙烷環(環氧基),於R11 為-CHR15 -所示之二價基之情形時,R12 及R13 、R13 及R14 、或R14 及R15 相互鍵結而形成環氧乙烷環,R12 ~R15 中之未形成環氧乙烷環之基表示氫原子)The compound represented by the above formula (1) is preferably a compound represented by the following formula (3) or (4). [化9]
Figure 02_image017
(In formulas (3) and (4), ring B represents an alicyclic ring containing the above-mentioned crosslinking group that will crosslink within ring B, R 1 represents a (meth)acryloyl group, and R 2 represents an alkyl group or an alkane group. R 11 represents a single bond or a divalent group represented by -CHR 15 -. When R 11 is a single bond, R 12 and R 13 , or R 13 and R 14 is bonded to each other to form an oxirane ring (epoxy group). When R 11 is a divalent group represented by -CHR 15 -, R 12 and R 13 , R 13 and R 14 , or R 14 and R 15 are bonded to each other to form an oxirane ring, and the group in R 12 to R 15 that does not form an oxirane ring represents a hydrogen atom)

式(3)及式(4)中,作為環B之具體例及較佳例,可例舉與式(1)中之環B之具體例及較佳例同樣之脂環。較佳為環B為式(2)所示之環。In formulas (3) and (4), specific examples and preferred examples of ring B include the same alicyclic rings as the specific examples and preferred examples of ring B in formula (1). Preferably, ring B is a ring represented by formula (2).

作為R11 ,較佳為-CHR15 -所示之二價基,更佳為R11 為-CHR15 -所示之二價基,R12 及R13 、R13 及R14 、或R14 及R15 相互鍵結而形成環氧乙烷環,R12 ~R15 中之未形成環氧乙烷環之基表示氫原子。R 11 is preferably a divalent group represented by -CHR 15 -, more preferably R 11 is a divalent group represented by -CHR 15 -, R 12 and R 13 , R 13 and R 14 , or R 14 And R 15 are bonded to each other to form an oxirane ring, and the groups in R 12 to R 15 that do not form an oxirane ring represent a hydrogen atom.

式(1)所示之化合物之製造方法並無特別限定。作為較佳之製造方法,可例舉包括以下步驟之方法: 使下述式(M1)所示之化合物與(甲基)丙烯酸反應,而生成下述式(M2)所示之化合物;及 使下述式(M2)所示之化合物所具有之羥基進行烷基化、烷醯基化、芳醯基化、或三烴基矽烷基化。 [化10]

Figure 02_image019
(式(M1)中,環A表示與環B縮合之包含五員或六員脂環之環,環B表示與環A及C縮合且含有於環B內交聯之交聯基之脂環,環C表示與環B縮合之包含五員或六員脂環之環,環A、環B及環C可具有取代基,亦可不具有取代基) [化11]
Figure 02_image021
(式(M2)中,環A、環B及環C與式(M1)中之該等相同,R1 表示(甲基)丙烯醯基)The method for producing the compound represented by formula (1) is not particularly limited. As a preferable manufacturing method, a method including the following steps can be exemplified: reacting the compound represented by the following formula (M1) with (meth)acrylic acid to produce the compound represented by the following formula (M2); and The hydroxyl group of the compound represented by the formula (M2) is alkylated, alkylated, arylated, or trihydrocarbyl silylated. [化10]
Figure 02_image019
(In formula (M1), ring A represents a five-member or six-member alicyclic ring condensed with ring B, and ring B represents an alicyclic ring condensed with rings A and C and containing a crosslinking group within ring B , Ring C means a five-membered or six-membered alicyclic ring condensed with ring B. Ring A, ring B and ring C may or may not have substituents) [化11]
Figure 02_image021
(In formula (M2), ring A, ring B and ring C are the same as those in formula (M1), and R 1 represents (meth)acryloyl)

式(M1)所示之化合物與(甲基)丙烯酸之反應可於酸性條件下及鹼性條件下之任一條件下進行,較佳為於鹼性條件下進行。於鹼性條件下,可設為於惰性溶劑中且鹼性條件下,亦可設為利用鹼性溶劑(例如,吡啶等)且於鹼性條件下。具體而言,例如可於使用有三乙胺等烷基胺等之鹼性條件下進行反應。 又,亦可於苄基三乙基氯化銨之類的鹵化四級銨等相轉移觸媒之存在下,進行式(M1)所示之化合物與(甲基)丙烯酸之上述反應。The reaction between the compound represented by formula (M1) and (meth)acrylic acid can be carried out under either acidic conditions or alkaline conditions, and is preferably carried out under alkaline conditions. Under alkaline conditions, it can be set in an inert solvent and under alkaline conditions, or it can be set under alkaline conditions using a basic solvent (for example, pyridine, etc.). Specifically, for example, the reaction can be carried out under basic conditions using alkylamines such as triethylamine and the like. In addition, the above-mentioned reaction between the compound represented by formula (M1) and (meth)acrylic acid can also be carried out in the presence of a phase transfer catalyst such as a quaternary ammonium halide such as benzyltriethylammonium chloride.

作為反應溫度,較佳為約為-50℃以上溶劑之沸點以下,進而較佳為室溫以上100℃以下。The reaction temperature is preferably about -50°C or higher and lower than the boiling point of the solvent, and more preferably room temperature or higher and 100°C or lower.

又,作為式(M1)所示之化合物與(甲基)丙烯酸之比率(莫耳比),並無特別限制,較佳為80/20~20/80,更佳為70/30~30/70。 作為反應液中之式(M1)所示之化合物及(甲基)丙烯酸之濃度之合計,通常可為0.001 mol/L以上6 mol/L以下,較佳為0.005 mol/L以上4 mol/L以下,進而較佳為0.01 mol/L以上3 mol/L以下。In addition, the ratio (molar ratio) of the compound represented by the formula (M1) to (meth)acrylic acid is not particularly limited, but is preferably 80/20 to 20/80, more preferably 70/30 to 30/ 70. As the total concentration of the compound represented by formula (M1) and (meth)acrylic acid in the reaction solution, it can usually be 0.001 mol/L or more and 6 mol/L or less, preferably 0.005 mol/L or more and 4 mol/L Hereinafter, it is more preferably 0.01 mol/L or more and 3 mol/L or less.

四級銨鹽之使用量相對於式(M1)所示之化合物,較佳為0.001莫耳倍以上5莫耳倍以下之範圍,更佳為0.005莫耳倍以上1莫耳倍以下之範圍,進而較佳為0.01莫耳倍以上0.1莫耳倍以下之範圍。The usage amount of the quaternary ammonium salt is preferably in the range of 0.001 mol times to 5 mol times, and more preferably in the range of 0.005 mol times to 1 mol times, relative to the compound represented by formula (M1). More preferably, it is the range of 0.01 mol times or more and 0.1 mol times or less.

上述反應中亦可使用溶劑。作為可使用之溶劑,可使用各種,例如可使用選自如下者之一種以上:乙腈等腈系溶劑;苯、甲苯、二甲苯等烴系溶劑;丙二醇單甲醚、丙二醇單乙醚等二醇系溶劑、二乙醚、二異丙醚、二丁醚、四氫呋喃、1,4-二㗁烷等醚系溶劑;丙酮、甲基乙基酮、甲基異丁基酮、甲基戊基酮、環戊酮、環己酮等酮系溶劑;乙醇、異丙醇、丁醇等醇系溶劑。A solvent can also be used in the above reaction. Various solvents can be used. For example, one or more selected from the group consisting of nitrile solvents such as acetonitrile; hydrocarbon solvents such as benzene, toluene, and xylene; glycol-based solvents such as propylene glycol monomethyl ether and propylene glycol monoethyl ether can be used. Solvents, diethyl ether, diisopropyl ether, dibutyl ether, tetrahydrofuran, 1,4-dioxane and other ether-based solvents; acetone, methyl ethyl ketone, methyl isobutyl ketone, methyl amyl ketone, ring Ketone solvents such as pentanone and cyclohexanone; alcohol solvents such as ethanol, isopropanol, and butanol.

使式(M2)所示之化合物所具有之羥基進行烷基化、烷醯基化、芳醯基化、或三烴基矽烷基化之方法並無特別限定。The method of alkylating, alkoxylating, arylating, or trihydrocarbyl silylating the hydroxyl group of the compound represented by the formula (M2) is not particularly limited.

作為烷基化方法,可例舉使鹵化烷烴、硫酸二烷基酯、碳酸二烷基酯等烷化劑於鹼之存在下與式(M2)所示之化合物進行反應之方法等。作為烷化劑,例如可例舉:溴甲烷、碘甲烷、溴乙烷、碘乙烷、溴丙烷、碘丙烷、硫酸二甲酯、碳酸二甲酯、硫酸二乙酯、及碳酸二乙酯等。作為鹼,可例舉:碳酸鈉、碳酸鉀、碳酸鋰、氫氧化鈉、氫氧化鉀、氫氧化鋰、甲醇鈉、甲醇鉀、及甲醇鋰等。 烷基化方法中所使用之溶劑只要為不會與式(M2)所示之化合物及烷化劑反應之溶劑,則並無特別限定,自使用上述烷化劑之羥基之烷基化反應中常用之溶劑中適當選擇。關於反應溫度及反應時間,可自使用上述烷化劑之烷基化反應中通常採用之範圍中適當選擇。As the alkylation method, a method of reacting an alkylating agent such as halogenated alkane, dialkyl sulfate, dialkyl carbonate, and the like with a compound represented by formula (M2) in the presence of a base can be mentioned. Examples of alkylating agents include methyl bromide, methyl iodide, ethyl bromide, ethyl iodide, propane bromide, propane iodide, dimethyl sulfate, dimethyl carbonate, diethyl sulfate, and diethyl carbonate. . Examples of the base include sodium carbonate, potassium carbonate, lithium carbonate, sodium hydroxide, potassium hydroxide, lithium hydroxide, sodium methoxide, potassium methoxide, lithium methoxide, and the like. The solvent used in the alkylation method is not particularly limited as long as it is a solvent that does not react with the compound represented by the formula (M2) and the alkylating agent. From the alkylation reaction using the hydroxyl group of the above-mentioned alkylating agent Appropriate selection among commonly used solvents. The reaction temperature and reaction time can be appropriately selected from the range generally used in the alkylation reaction using the above-mentioned alkylating agent.

作為烷醯基化方法,可例舉使與烷醯基對應之脂肪醯鹵或脂肪酸酐與式(M2)所示之化合物進行反應之方法。作為脂肪醯鹵,例如可例舉:乙醯氯、乙醯溴、丙醯氯、及丙醯溴等。作為脂肪酸酐,例如可例舉:乙酸酐、丙酸酐、及丁酸酐等。 於使用脂肪醯鹵之情形時,較佳為以捕捉由於羥基與脂肪醯鹵之反應而副產之鹵化氫為目的,於吡啶、三乙胺、氫氧化鈉、及氫氧化鉀等鹼之存在下進行烷醯基化。 於使用脂肪酸酐之情形時,較佳為於N,N-二甲基-4-胺基吡啶等觸媒之存在下進行烷醯基化。 烷醯基化方法中所使用之溶劑只要為不會與式(M2)所示之化合物及脂肪醯鹵或脂肪酸酐反應之溶劑,則並無特別限定,可自使用脂肪醯鹵或脂肪酸酐的羥基之烷醯基化反應中所常用之溶劑中適當選擇。關於反應溫度及反應時間,可自使用脂肪醯鹵或脂肪酸酐的烷醯基化反應中所通常採用之範圍中適當選擇。As a method of alkylation, a method of reacting a fatty acid halide or fatty acid anhydride corresponding to an alkano group with a compound represented by the formula (M2) can be exemplified. As a fatty acid halogen, for example, acetyl chloride, acetyl bromide, propyl chloride, propyl bromide, etc. may be mentioned. As fatty acid anhydride, acetic anhydride, propionic anhydride, butyric anhydride, etc. are mentioned, for example. When using fatty halides, it is better to capture the by-product hydrogen halide due to the reaction between hydroxyl and fatty halides in the presence of alkalis such as pyridine, triethylamine, sodium hydroxide, and potassium hydroxide The alkylation is carried out below. In the case of using fatty acid anhydride, it is preferable to carry out alkylation in the presence of a catalyst such as N,N-dimethyl-4-aminopyridine. The solvent used in the alkylation method is not particularly limited as long as it does not react with the compound represented by the formula (M2) and the fatty acid halide or fatty acid anhydride. Appropriate selection of solvents commonly used in the alkylation reaction of hydroxyl group. The reaction temperature and reaction time can be appropriately selected from the range generally used in the alkylation reaction using fatty acid halogen or fatty acid anhydride.

作為芳醯基化方法,可例舉使與芳醯基對應之芳香族羧醯鹵與式(M2)所示之化合物進行反應之方法。作為芳香族羧醯鹵,例如可例舉:苯甲醯氯、苯甲醯溴、α-萘甲醯氯、α-萘甲醯溴、β-萘甲醯氯、及β-萘甲醯溴等。芳香族羧醯鹵與式(M2)所示之化合物之反應可與脂肪醯鹵和式(M2)所示之化合物之反應同樣地進行。 芳醯基化方法中所使用之溶劑只要為不會與式(M2)所示之化合物及芳香族羧醯鹵反應之溶劑,則並無特別限定,可自使用芳香族羧醯鹵的羥基之芳醯基化反應中所常用之溶劑中適當選擇。關於反應溫度及反應時間,可自使用芳香族羧酸之芳醯基化反應中通常採用之範圍中適當選擇。As a method of arylation, a method of reacting an aromatic carboxylic acid halide corresponding to an aryl group with a compound represented by the formula (M2) can be exemplified. As the aromatic carboxylic acid halogen, for example, benzyl chloride, benzyl bromide, α-naphthyl chloride, α-naphthyl bromide, β-naphthyl chloride, and β-naphthyl bromide Wait. The reaction of the aromatic carboxylic acid halide with the compound represented by the formula (M2) can proceed in the same manner as the reaction of the aliphatic carboxylic acid halide with the compound represented by the formula (M2). The solvent used in the arylation method is not particularly limited as long as it does not react with the compound represented by the formula (M2) and the aromatic carboxylic acid halide. It can be selected from among the hydroxyl groups of the aromatic carboxylic acid halide. Appropriate selection of solvents commonly used in the arylation reaction. The reaction temperature and the reaction time can be appropriately selected from the range generally used in the arylation reaction using an aromatic carboxylic acid.

作為三烴基矽烷基化方法,可例舉使式(M2)所示之化合物與對應於三烴基矽烷基種類之矽烷化劑進行反應之方法。作為矽烷化劑,例如可例舉:三烴基單氯矽烷、三烴基單溴矽烷等三烴基單鹵矽烷;三烴基單甲氧基矽烷、三烴基單乙氧基矽烷等三烴基單烷氧基矽烷。As a method of trihydrocarbyl silylation, a method of reacting a compound represented by formula (M2) with a silylation agent corresponding to the type of trihydrocarbyl silyl group can be exemplified. As the silylation agent, for example, trihydrocarbyl monohalosilanes such as trihydrocarbyl monochlorosilane and trihydrocarbyl monobromosilane; trihydrocarbyl monoalkoxy silanes such as trihydrocarbyl monomethoxysilane and trihydrocarbyl monoethoxy silane; Silane.

作為三烴基單鹵矽烷之較佳例,可例舉:三甲基單氯矽烷、三乙基單氯矽烷、三正丙基單氯矽烷、三異丙基單氯矽烷、三正丁基單氯矽烷、三異丁基單氯矽烷、三-第二丁基單氯矽烷、三-第三丁基單氯矽烷、乙基二甲基單氯矽烷、正丙基二甲基單氯矽烷、異丙基二甲基單氯矽烷、正丁基二甲基單氯矽烷、異丁基二甲基單氯矽烷、第二丁基二甲基單氯矽烷、及第三丁基二甲基單氯矽烷等三烷基單氯矽烷; 三甲基單溴矽烷、三乙基單溴矽烷、三正丙基單溴矽烷、三異丙基單溴矽烷、三正丁基單溴矽烷、三異丁基單溴矽烷、三-第二丁基單溴矽烷、三-第三丁基單溴矽烷、乙基二甲基單溴矽烷、正丙基二甲基單溴矽烷、異丙基二甲基單溴矽烷、正丁基二甲基單溴矽烷、異丁基二甲基單溴矽烷、第二丁基二甲基單溴矽烷、及第三丁基二甲基單溴矽烷等三烷基單溴矽烷; 三甲基單甲氧基矽烷、三乙基單甲氧基矽烷、三正丙基單甲氧基矽烷、三異丙基單甲氧基矽烷、三正丁基單甲氧基矽烷、三異丁基單甲氧基矽烷、三-第二丁基單甲氧基矽烷、三-第三丁基單甲氧基矽烷、乙基二甲基單甲氧基矽烷、正丙基二甲基單甲氧基矽烷、異丙基二甲基單甲氧基矽烷、正丁基二甲基單甲氧基矽烷、異丁基二甲基單甲氧基矽烷、第二丁基二甲基單甲氧基矽烷、及第三丁基二甲基單甲氧基矽烷等三烷基單甲氧基矽烷; 三甲基單乙氧基矽烷、三乙基單乙氧基矽烷、三正丙基單乙氧基矽烷、三異丙基單乙氧基矽烷、三正丁基單乙氧基矽烷、三異丁基單乙氧基矽烷、三-第二丁基單乙氧基矽烷、三-第三丁基單乙氧基矽烷、乙基二甲基單乙氧基矽烷、正丙基二甲基單乙氧基矽烷、異丙基二甲基單乙氧基矽烷、正丁基二甲基單乙氧基矽烷、異丁基二甲基單乙氧基矽烷、第二丁基二甲基單乙氧基矽烷、及第三丁基二甲基單乙氧基矽烷等三烷基單乙氧基矽烷。As preferred examples of trihydrocarbyl monohalosilanes, examples include: trimethyl monochlorosilane, triethyl monochlorosilane, tri-n-propyl monochlorosilane, triisopropyl monochlorosilane, tri-n-butyl monochlorosilane Chlorosilane, triisobutyl monochlorosilane, tri-second butyl monochlorosilane, tri-tertiary butyl monochlorosilane, ethyl dimethyl monochlorosilane, n-propyl dimethyl monochlorosilane, Isopropyl dimethyl monochlorosilane, n-butyl dimethyl monochlorosilane, isobutyl dimethyl monochlorosilane, second butyl dimethyl monochlorosilane, and tertiary butyl dimethyl mono Trialkyl monochlorosilanes such as chlorosilanes; Trimethyl monobromosilane, triethyl monobromosilane, tri-n-propyl monobromosilane, triisopropyl monobromosilane, tri-n-butyl monobromosilane, triisobutyl monobromosilane, tri-second Butyl monobromosilane, tri-tertiary butyl monobromosilane, ethyl dimethyl monobromosilane, n-propyl dimethyl monobromosilane, isopropyl dimethyl monobromosilane, n-butyl dimethyl Trialkyl monobromosilanes such as methyl monobromosilane, isobutyldimethylmonobromosilane, sec-butyldimethylmonobromosilane, and tert-butyldimethylmonobromosilane; Trimethylmonomethoxysilane, triethylmonomethoxysilane, tri-n-propylmonomethoxysilane, triisopropylmonomethoxysilane, tri-n-butylmonomethoxysilane, triisopropyl Butyl monomethoxysilane, tri-second butyl monomethoxysilane, tri-tertiary butyl monomethoxysilane, ethyl dimethyl monomethoxy silane, n-propyl dimethyl mono Methoxysilane, isopropyldimethylmonomethoxysilane, n-butyldimethylmonomethoxysilane, isobutyldimethylmonomethoxysilane, sec-butyldimethylmonomethyl Trialkyl monomethoxysilane such as oxysilane, and tert-butyldimethylmonomethoxysilane; Trimethylmonoethoxysilane, triethylmonoethoxysilane, tri-n-propylmonoethoxysilane, triisopropylmonoethoxysilane, tri-n-butylmonoethoxysilane, triiso Butyl monoethoxy silane, tri-second butyl monoethoxy silane, tri-tertiary butyl monoethoxy silane, ethyl dimethyl monoethoxy silane, n-propyl dimethyl mono Ethoxysilane, isopropyldimethylmonoethoxysilane, n-butyldimethylmonoethoxysilane, isobutyldimethylmonoethoxysilane, second-butyldimethylmonoethyl Trialkyl monoethoxysilanes such as oxysilane and tert-butyldimethylmonoethoxysilane.

式(M2)所示之化合物與矽烷化劑之反應中之矽烷化劑之使用量相對於式(M2)所示之化合物之莫耳數,較佳為等莫耳以上,更佳為1.2倍莫耳以上,進而較佳為1.5倍莫耳以上,尤佳為2.0倍莫耳以上。矽烷化劑之使用量之上限並無特別,就成本之方面而言,相對於式(M2)所示之化合物之莫耳數,較佳為5.0倍莫耳以下,更佳為3.0倍莫耳以下。The amount of the silylating agent used in the reaction between the compound represented by formula (M2) and the silylating agent is preferably equal to or more than the molar number of the compound represented by formula (M2), more preferably 1.2 times Molar or more, more preferably 1.5 times mol or more, and particularly preferably 2.0 times mol or more. The upper limit of the amount of silylation agent used is not special. In terms of cost, relative to the number of moles of the compound represented by formula (M2), it is preferably 5.0 times mol or less, and more preferably 3.0 times mol. the following.

式(M2)所示之化合物與矽烷化劑之反應通常於有機溶劑中進行。作為有機溶劑,使用不具有羥基、羧基、胺基等會與矽烷化劑反應之官能基之有機溶劑。 作為有機溶劑之具體例,可例舉:四氯化碳、氯仿、二氯甲烷、溴丙烷、溴丁烷、溴戊烷、溴己烷、碘甲烷、碘乙烷、及碘丙烷等鹵代烷類;丙酮、甲基乙基酮、甲基異丁基酮、及環己酮等酮類;戊烷、己烷、庚烷、辛烷、壬烷、癸烷、十一烷、十二烷、環己烷、石油醚、苯炔、煤油、甲苯、二甲苯、1,3,5-三甲苯、及苯等烴類。The reaction between the compound represented by the formula (M2) and the silylation agent is usually carried out in an organic solvent. As the organic solvent, an organic solvent that does not have a functional group such as a hydroxyl group, a carboxyl group, or an amine group that can react with the silylation agent is used. Specific examples of organic solvents include halogenated alkanes such as carbon tetrachloride, chloroform, dichloromethane, bromopropane, bromobutane, bromopentane, bromohexane, methyl iodide, ethyl iodide, and propane iodide. ; Acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone and other ketones; pentane, hexane, heptane, octane, nonane, decane, undecane, dodecane, Hydrocarbons such as cyclohexane, petroleum ether, benzyne, kerosene, toluene, xylene, 1,3,5-trimethylbenzene, and benzene.

式(M2)所示之化合物與矽烷化劑之反應時之溫度只要使矽烷基化反應良好地進行,則並無特別限定。反應溫度例如較佳為-20℃以上100℃以下,更佳為-10℃以上80℃以下,進而較佳為0℃以上50℃以下。The temperature at the time of the reaction between the compound represented by the formula (M2) and the silylation agent is not particularly limited as long as the silylation reaction proceeds well. The reaction temperature is preferably -20°C or higher and 100°C or lower, more preferably -10°C or higher and 80°C or lower, and still more preferably 0°C or higher and 50°C or lower.

反應時間只要使矽烷基化反應良好地進行,則並無特別限定。反應時間例如為5分鐘以上12小時以下,較佳為10分鐘以上6小時以下。The reaction time is not particularly limited as long as the silylation reaction proceeds well. The reaction time is, for example, 5 minutes or more and 12 hours or less, preferably 10 minutes or more and 6 hours or less.

於矽烷化劑為三烴基單鹵矽烷之情形時,矽烷基化反應時會副產鹵化氫。為捕捉副產之鹵化氫,可於反應液中添加三乙胺、吡啶、及N,N-二甲基-4-胺基吡啶等鹼。When the silylation agent is a trihydrocarbyl monohalosilane, hydrogen halide is by-produced during the silylation reaction. To capture the by-product hydrogen halide, bases such as triethylamine, pyridine, and N,N-dimethyl-4-aminopyridine can be added to the reaction solution.

以如上所述之方式製造之式(1)所示之化合物較佳為依照慣例自反應液回收,並視需要進行精製之後,用作樹脂組合物之成分或下述(甲基)丙烯酸樹脂(A1)之原料。The compound represented by the formula (1) produced in the manner described above is preferably recovered from the reaction solution according to the usual practice, and after purification as necessary, it is used as a component of the resin composition or the following (meth)acrylic resin ( A1) raw materials.

(其他單體) 如上所述,(甲基)丙烯酸樹脂(A1)可為具有脂環式環氧基之(甲基)丙烯酸酯、與具有脂環式環氧基之(甲基)丙烯酸酯以外之其他單體之共聚物。 就樹脂組合物之硬化性之觀點而言,(甲基)丙烯酸樹脂(A1)中之源自具有脂環式環氧基之(甲基)丙烯酸酯之結構單元的含量較佳為50質量%以上,更佳為60質量%以上,進而較佳為70質量%以上。(甲基)丙烯酸樹脂(A1)中之源自具有脂環式環氧基之(甲基)丙烯酸酯之結構單元的含量之上限並無特別限定,可為95質量%以下,可為90質量%以下,可為80質量%以下。(Other monomers) As mentioned above, the (meth)acrylic resin (A1) can be a monomer other than (meth)acrylate with alicyclic epoxy group and (meth)acrylate with alicyclic epoxy group的copolymer. From the viewpoint of the curability of the resin composition, the content of the structural unit derived from the (meth)acrylate having an alicyclic epoxy group in the (meth)acrylic resin (A1) is preferably 50% by mass Above, it is more preferably 60% by mass or more, and still more preferably 70% by mass or more. The upper limit of the content of the structural unit derived from the (meth)acrylate having an alicyclic epoxy group in the (meth)acrylic resin (A1) is not particularly limited, and it can be 95% by mass or less, or 90% by mass. % Or less, may be 80% by mass or less.

作為其他單體,可例舉:不飽和羧酸、不具有環氧基之(甲基)丙烯酸酯、(甲基)丙烯醯胺類、烯丙基化合物、乙烯醚類、乙烯酯類、苯乙烯類、及順丁烯二醯亞胺類等。該等化合物可單獨使用或組合兩種以上而使用。就樹脂組合物之保存穩定性、使用樹脂組合物所形成之硬化物對於鹼性等之耐化學品性之方面而言,(甲基)丙烯酸樹脂(A1)較佳為不含源自不飽和羧酸之單元。 另一方面,於使樹脂組合物成為可利用鹼性顯影液進行顯影之負型感光性組合物之情形時,較佳為(甲基)丙烯酸樹脂(A1)包含具有鹼可溶性基之結構單元。作為鹼可溶性基,並無特別限定,可例舉:羧基、磺酸基、磷酸基、及酚性羥基等。 就樹脂組合物之經時穩定性之方面而言,作為鹼可溶性基,較佳為羧基。即,較佳為(甲基)丙烯酸樹脂(A1)包含源自不飽和羧酸之單元。Examples of other monomers include unsaturated carboxylic acids, (meth)acrylates without epoxy groups, (meth)acrylamides, allyl compounds, vinyl ethers, vinyl esters, benzene Ethylenes, and maleimines, etc. These compounds can be used alone or in combination of two or more kinds. In terms of the storage stability of the resin composition and the chemical resistance of the cured product formed using the resin composition to alkalis and the like, the (meth)acrylic resin (A1) is preferably free of unsaturation origin. The unit of carboxylic acid. On the other hand, when the resin composition is a negative photosensitive composition that can be developed with an alkaline developer, it is preferable that the (meth)acrylic resin (A1) contains a structural unit having an alkali-soluble group. It does not specifically limit as an alkali-soluble group, A carboxyl group, a sulfonic acid group, a phosphoric acid group, a phenolic hydroxyl group, etc. are mentioned. In terms of the stability of the resin composition over time, the alkali-soluble group is preferably a carboxyl group. That is, it is preferable that the (meth)acrylic resin (A1) contains a unit derived from an unsaturated carboxylic acid.

作為不飽和羧酸之例,可例舉:(甲基)丙烯酸;(甲基)丙烯醯胺;丁烯酸;順丁烯二酸、反丁烯二酸、甲基順丁烯二酸、甲基反丁烯二酸、伊康酸、該等二羧酸之酸酐。該等中,較佳為(甲基)丙烯酸。Examples of unsaturated carboxylic acids include: (meth)acrylic acid; (meth)acrylamide; crotonic acid; maleic acid, fumaric acid, methylmaleic acid, Methyl fumaric acid, itaconic acid, anhydrides of these dicarboxylic acids. Among them, (meth)acrylic acid is preferred.

於(甲基)丙烯酸樹脂(A1)包含源自不飽和羧酸之結構單元之情形時,(甲基)丙烯酸樹脂(A1)中之源自不飽和羧酸之結構單元之含量較佳為3質量%以上50質量%以下,更佳為5質量%以上40質量%以下,進而較佳為10質量%以上30質量%以下。When the (meth)acrylic resin (A1) contains a structural unit derived from an unsaturated carboxylic acid, the content of the structural unit derived from an unsaturated carboxylic acid in the (meth)acrylic resin (A1) is preferably 3 Mass% or more and 50 mass% or less, more preferably 5 mass% or more and 40 mass% or less, and still more preferably 10 mass% or more and 30 mass% or less.

作為不具有環氧基之(甲基)丙烯酸酯之例,可例舉:(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丙酯、(甲基)丙烯酸戊酯、(甲基)丙烯酸第三辛酯等直鏈狀或支鏈狀之(甲基)丙烯酸烷基酯;(甲基)丙烯酸氯乙酯、(甲基)丙烯酸2,2-二甲基羥丙酯、(甲基)丙烯酸2-羥乙酯、三羥甲基丙烷單(甲基)丙烯酸酯、(甲基)丙烯酸苄酯、(甲基)丙烯酸糠酯;具有含脂環式骨架之基之(甲基)丙烯酸酯。不具有環氧基之(甲基)丙烯酸酯中,較佳為具有含脂環式骨架之基之(甲基)丙烯酸酯。Examples of (meth)acrylates that do not have an epoxy group include: methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, pentyl (meth)acrylate Straight-chain or branched alkyl (meth)acrylate such as esters, tertiary octyl (meth)acrylate, etc.; chloroethyl (meth)acrylate, 2,2-dimethyl (meth)acrylate Hydroxypropyl ester, 2-hydroxyethyl (meth)acrylate, trimethylolpropane mono(meth)acrylate, benzyl (meth)acrylate, furfuryl (meth)acrylate; with alicyclic skeleton The base of (meth)acrylate. Among the (meth)acrylates that do not have an epoxy group, the (meth)acrylates that have an alicyclic skeleton-containing group are preferred.

具有含脂環式骨架之基之(甲基)丙烯酸酯中,構成脂環式骨架之脂環式基可為單環,亦可為多環。作為單環之脂環式基,可例舉環戊基、環己基等。又,作為多環之脂環式基,可例舉:降𦯉基、異𦯉基、三環壬基、三環癸基、四環十二烷基等。In the (meth)acrylate having a group containing an alicyclic skeleton, the alicyclic group constituting the alicyclic skeleton may be monocyclic or polycyclic. As a monocyclic alicyclic group, a cyclopentyl group, a cyclohexyl group, etc. are mentioned. In addition, as the polycyclic alicyclic group, there may be exemplified nordoxy, isooxy, tricyclononyl, tricyclodecyl, tetracyclododecyl, and the like.

作為具有含脂環式骨架之基之(甲基)丙烯酸酯,例如可例舉下述式(a1-1)~(a1-8)所示之化合物。該等中,較佳為下述式(a1-3)~(a1-8)所示之化合物,更佳為下述式(a1-3)或(a1-4)所示之化合物。As the (meth)acrylate having an alicyclic skeleton-containing group, for example, compounds represented by the following formulas (a1-1) to (a1-8) can be mentioned. Among these, compounds represented by the following formulas (a1-3) to (a1-8) are preferred, and compounds represented by the following formulas (a1-3) or (a1-4) are more preferred.

[化12]

Figure 02_image023
[化12]
Figure 02_image023

[化13]

Figure 02_image025
[化13]
Figure 02_image025

上述式中,RA1 表示氫原子或甲基,RA2 表示單鍵或碳原子數1以上6以下之二價脂肪族飽和烴基,RA3 表示氫原子或碳原子數1以上5以下之烷基。作為RA2 ,較佳為單鍵、直鏈狀或支鏈狀之伸烷基,例如亞甲基、伸乙基、伸丙基、四亞甲基、乙基伸乙基、五亞甲基、六亞甲基。作為RA3 ,較佳為甲基、乙基。In the above formula, R A1 represents a hydrogen atom or a methyl group, R A2 represents a single bond or a divalent saturated aliphatic hydrocarbon group with 1 to 6 carbon atoms, and R A3 represents a hydrogen atom or an alkyl group with 1 to 5 carbon atoms. . R A2 is preferably a single bond, linear or branched alkylene group, such as methylene, ethylene, propylene, tetramethylene, ethylethylene, pentamethylene, Hexamethylene. As R A3 , methyl and ethyl are preferred.

於(甲基)丙烯酸樹脂(A1)包含源自具有含脂環式骨架之基之(甲基)丙烯酸酯之結構單元時,(甲基)丙烯酸樹脂(A1)中之源自具有含脂環式骨架之基之(甲基)丙烯酸酯的結構單元之含量較佳為3質量%以上50質量%以下,更佳為5質量%以上30質量%以下,進而較佳為7質量%以上20質量%以下。When the (meth)acrylic resin (A1) contains a structural unit derived from a (meth)acrylate having an alicyclic skeleton-containing group, the (meth)acrylic resin (A1) is derived from an alicyclic The content of the structural unit of the (meth)acrylate based on the formula skeleton is preferably 3% by mass or more and 50% by mass or less, more preferably 5% by mass or more and 30% by mass or less, and still more preferably 7% by mass or more and 20% by mass %the following.

作為(甲基)丙烯醯胺類之例,可例舉:(甲基)丙烯醯胺、N-烷基(甲基)丙烯醯胺、N-芳基(甲基)丙烯醯胺、N,N-二烷基(甲基)丙烯醯胺、N,N-芳基(甲基)丙烯醯胺、N-甲基-N-苯基(甲基)丙烯醯胺、N-羥乙基-N-甲基(甲基)丙烯醯胺等。Examples of (meth)acrylamides include (meth)acrylamide, N-alkyl(meth)acrylamide, N-aryl(meth)acrylamide, N, N-dialkyl(meth)acrylamide, N,N-aryl(meth)acrylamide, N-methyl-N-phenyl(meth)acrylamide, N-hydroxyethyl- N-methyl(meth)acrylamide and the like.

作為烯丙基化合物之例,可例舉:乙酸烯丙酯、己酸烯丙酯、辛酸烯丙酯、月桂酸烯丙酯、棕櫚酸烯丙酯、硬脂酸烯丙酯、苯甲酸烯丙酯、乙醯乙酸烯丙酯、乳酸烯丙酯等烯丙酯類;烯丙氧基乙醇等。Examples of allyl compounds include: allyl acetate, allyl hexanoate, allyl octoate, allyl laurate, allyl palmitate, allyl stearate, allyl benzoate Allyl esters such as propyl ester, allyl acetate, and allyl lactate; allyloxyethanol, etc.

作為乙烯醚類之例,可例舉:己基乙烯醚、辛基乙烯醚、癸基乙烯醚、乙基己基乙烯醚、甲氧基乙基乙烯醚、乙氧基乙基乙烯醚、氯乙基乙烯醚、1-甲基-2,2-二甲基丙基乙烯醚、2-乙基丁基乙烯醚、羥乙基乙烯醚、二乙二醇乙烯醚、二甲基胺基乙基乙烯醚、二乙基胺基乙基乙烯醚、丁基胺基乙基乙烯醚、苄基乙烯醚、四氫糠基乙烯醚等脂肪族乙烯醚;乙烯基苯基醚、乙烯基甲苯基醚、乙烯基氯苯基醚、乙烯基-2,4-二氯苯基醚、乙烯基萘基醚、乙烯基蒽基醚等乙烯基芳基醚等。Examples of vinyl ethers include: hexyl vinyl ether, octyl vinyl ether, decyl vinyl ether, ethylhexyl vinyl ether, methoxy ethyl vinyl ether, ethoxy ethyl vinyl ether, chloroethyl Vinyl ether, 1-methyl-2,2-dimethyl propyl vinyl ether, 2-ethylbutyl vinyl ether, hydroxyethyl vinyl ether, diethylene glycol vinyl ether, dimethylamino ethyl ethylene Aliphatic vinyl ethers such as ether, diethylamino ethyl vinyl ether, butylamino ethyl vinyl ether, benzyl vinyl ether, tetrahydrofurfuryl vinyl ether; vinyl phenyl ether, vinyl tolyl ether, Vinyl aryl ethers such as vinyl chlorophenyl ether, vinyl-2,4-dichlorophenyl ether, vinyl naphthyl ether, and vinyl anthracenyl ether.

作為乙烯酯類之例,可例舉:丁酸乙烯酯、異丁酸乙烯酯、三甲基乙酸乙烯酯、二乙基乙酸乙烯酯、戊酸乙烯酯、己酸乙烯酯、氯乙酸乙烯酯、二氯乙酸乙烯酯、甲氧基乙酸乙烯酯、丁氧基乙酸乙烯酯、苯基乙酸乙烯酯、乙醯乙酸乙烯酯、乳酸乙烯酯、β-苯基丁酸乙烯酯、苯甲酸乙烯酯、水楊酸乙烯酯、氯苯甲酸乙烯酯、四氯苯甲酸乙烯酯、萘甲酸乙烯酯等。Examples of vinyl esters include: vinyl butyrate, vinyl isobutyrate, trimethyl vinyl acetate, diethyl vinyl acetate, vinyl valerate, vinyl caproate, vinyl chloroacetate , Vinyl dichloroacetate, methoxy vinyl acetate, butoxy vinyl acetate, phenyl vinyl acetate, acetyl vinyl acetate, vinyl lactate, β-phenyl butyrate vinyl ester, vinyl benzoate , Vinyl salicylate, vinyl chlorobenzoate, vinyl tetrachlorobenzoate, vinyl naphthoate, etc.

作為苯乙烯類之例,可例舉:苯乙烯;甲基苯乙烯、二甲基苯乙烯、三甲基苯乙烯、乙基苯乙烯、二乙基苯乙烯、異丙基苯乙烯、丁基苯乙烯、己基苯乙烯、環己基苯乙烯、癸基苯乙烯、苄基苯乙烯、氯甲基苯乙烯、三氟甲基苯乙烯、乙氧基甲基苯乙烯、乙醯氧基甲基苯乙烯等烷基苯乙烯;甲氧基苯乙烯、4-甲氧基-3-甲基苯乙烯、二甲氧基苯乙烯等烷氧基苯乙烯;氯苯乙烯、二氯苯乙烯、三氯苯乙烯、四氯苯乙烯、五氯苯乙烯、溴苯乙烯、二溴苯乙烯、碘苯乙烯、氟苯乙烯、三氟苯乙烯、2-溴-4-三氟甲基苯乙烯、4-氟-3-三氟甲基苯乙烯等鹵苯乙烯等。 就樹脂組合物之硬化物之相對介電常數較低之方面而言,(甲基)丙烯酸樹脂(A1)中之源自苯乙烯類之結構單元之量越少越佳,更佳為(甲基)丙烯酸樹脂(A1)不含源自苯乙烯類之結構單元。Examples of styrenes include: styrene; methyl styrene, dimethyl styrene, trimethyl styrene, ethyl styrene, diethyl styrene, isopropyl styrene, butyl Styrene, hexyl styrene, cyclohexyl styrene, decyl styrene, benzyl styrene, chloromethyl styrene, trifluoromethyl styrene, ethoxy methyl styrene, acetoxy methyl benzene Alkylstyrenes such as ethylene; Alkoxystyrenes such as methoxystyrene, 4-methoxy-3-methylstyrene, and dimethoxystyrene; chlorostyrene, dichlorostyrene, trichlorostyrene, etc. Styrene, tetrachlorostyrene, pentachlorostyrene, bromostyrene, dibromostyrene, iodostyrene, fluorostyrene, trifluorostyrene, 2-bromo-4-trifluoromethylstyrene, 4- Halogenated styrenes such as fluoro-3-trifluoromethylstyrene, etc. As far as the relative dielectric constant of the cured product of the resin composition is low, the smaller the amount of the styrene-derived structural unit in the (meth)acrylic resin (A1), the better, and the more preferred is (A The base) acrylic resin (A1) does not contain structural units derived from styrene.

作為順丁烯二醯亞胺類,可例舉:N-甲基順丁烯二醯亞胺、N-乙基順丁烯二醯亞胺、N-正丙基順丁烯二醯亞胺、N-異丙基順丁烯二醯亞胺、N-正丁基順丁烯二醯亞胺、N-正戊基順丁烯二醯亞胺、N-正己基順丁烯二醯亞胺等經碳原子數1~10之烷基進行N取代之順丁烯二醯亞胺;N-環戊基順丁烯二醯亞胺、N-環己基順丁烯二醯亞胺、N-環庚基順丁烯二醯亞胺等經碳原子數3以上20以下之脂環式基進行N取代之順丁烯二醯亞胺;N-苯基順丁烯二醯亞胺、N-α-萘基順丁烯二醯亞胺、N-β-萘基順丁烯二醯亞胺等經碳原子數6以上20以下之芳基進行N取代之N-芳基順丁烯二醯亞胺;N-苄基順丁烯二醯亞胺、N-苯乙基順丁烯二醯亞胺等經碳原子數7以上20以下之芳烷基進行N取代之N-芳烷基順丁烯二醯亞胺。Examples of maleimines include N-methyl maleimines, N-ethyl maleimines, and N-propyl maleimines , N-isopropyl maleimide, N-butyl maleimide, N-pentyl maleimide, N-hexyl maleimide, etc. N-substituted maleimide by an alkyl group with 1 to 10 carbon atoms; N-cyclopentyl maleimide, N-cyclohexyl maleimide, N-ring Heptyl maleimide and other maleimides N-substituted by alicyclic groups with 3 to 20 carbon atoms; N-phenylmaleimide, N-α -Naphthyl maleimide, N-β-naphthyl maleimide, etc. N-aryl maleimide N-substituted by aryl groups with 6 to 20 carbon atoms Amine; N-benzyl maleimide, N-phenethyl maleimide, etc. N-aralkyl cis-butane substituted with aralkyl groups with 7 to 20 carbon atoms Endiimines.

(甲基)丙烯酸樹脂(A1)之重量平均分子量於不會妨礙本發明之目的之範圍內並無特別限定,作為聚苯乙烯換算之重量平均分子量,較佳為3,000以上30,000以下,更佳為5,000以上15,000以下。The weight average molecular weight of the (meth)acrylic resin (A1) is not particularly limited within a range that does not interfere with the purpose of the present invention. The weight average molecular weight in terms of polystyrene is preferably 3,000 or more and 30,000 or less, and more preferably Above 5,000 and below 15,000.

[含有環氧基之環狀矽氧烷化合物(A-II)] 作為含有環氧基之環狀矽氧烷化合物(A-II),使用下述式(a-I)所示之化合物。 [化14]

Figure 02_image027
[Epoxy group-containing cyclic siloxane compound (A-II)] As the epoxy group-containing cyclic siloxane compound (A-II), a compound represented by the following formula (aI) is used. [化14]
Figure 02_image027

式(a-I)中,Ra01 及Ra02 表示含有環氧基之一價基或烷基。其中,式(a-I)所示之化合物中之x1個Ra01 及x1個Ra02 中之至少兩個為含有環氧基之一價基。又,式(a-I)中之x1表示3以上之整數。再者,式(b1-III)所示之化合物中之Ra01 、Ra02 可相同,亦可不同。又,複數個Ra01 可相同,亦可不同。複數個Ra02 亦為可相同,亦可不同。 作為上述烷基,例如可例舉甲基、乙基、丙基、異丙基等碳原子數為1以上18以下之直鏈狀或支鏈狀之烷基。烷基之碳原子數較佳為1以上6以下,尤佳為1以上3以下。In the formula (aI), R a01 and R a02 represent an epoxy group-containing monovalent group or an alkyl group. Wherein the formula (aI) of the compound represented by the number of x1 x1 and R a01 R a02 in one of at least two divalent groups containing one epoxy group. Moreover, x1 in formula (aI) represents an integer of 3 or more. Furthermore, Ra01 and Ra02 in the compound represented by the formula (b1-III) may be the same or different. In addition, a plurality of Ra01 may be the same or different. A plurality of Ra02 may also be the same or different. Examples of the above-mentioned alkyl group include linear or branched alkyl groups having 1 to 18 carbon atoms such as methyl, ethyl, propyl, and isopropyl. The number of carbon atoms of the alkyl group is preferably 1 or more and 6 or less, particularly preferably 1 or more and 3 or less.

式(a-I)中之x1表示3以上之整數,其中,就與(甲基)丙烯酸樹脂(A-I)之反應性優異,且獲得硬化性優異之矽氧烷改質(甲基)丙烯酸樹脂(A1)之方面而言,較佳為3以上6以下之整數。In formula (aI), x1 represents an integer of 3 or more. Among them, it has excellent reactivity with (meth)acrylic resin (AI) and obtains silicone-modified (meth)acrylic resin (A1) with excellent curability. In terms of ), it is preferably an integer of 3 or more and 6 or less.

式(a-I)所示之化合物於分子內所具有之環氧基之個數為2個以上,就與(甲基)丙烯酸樹脂(A-I)之反應性優異,且獲得硬化性優異之矽氧烷改質(甲基)丙烯酸樹脂(A1)之方面而言,較佳為2個以上6個以下,尤佳為2個以上5個以下。The compound represented by formula (aI) has 2 or more epoxy groups in the molecule, which has excellent reactivity with (meth)acrylic resin (AI) and obtains silicone with excellent curability In terms of the modified (meth)acrylic resin (A1), 2 or more and 6 or less are preferable, and 2 or more and 5 or less are more preferable.

作為上述含有環氧基之一價基,較佳為脂環式環氧基、及-DA -O-Ra03 所示之縮水甘油醚基,更佳為脂環式環氧基,進而較佳為下述式(a-Ia)或下述式(a-Ib)所示之脂環式環氧基。DA 表示伸烷基,Ra03 表示縮水甘油基。 關於作為上述DA 之伸烷基,例如可例舉:亞甲基,甲基亞甲基,二甲基亞甲基,二亞甲基,三亞甲基等碳原子數為1以上18以下之直鏈狀或支鏈狀之伸烷基等。 [化15]

Figure 02_image029
(上述式(a-Ia)及式(a-Ib)中,D1 及D2 分別獨立地表示伸烷基,ms表示0以上2以下之整數)As the above-mentioned epoxy-containing monovalent group, an alicyclic epoxy group and a glycidyl ether group represented by -D A -OR a03 are preferable, an alicyclic epoxy group is more preferable, and an alicyclic epoxy group is more preferable. An alicyclic epoxy group represented by the following formula (a-Ia) or the following formula (a-Ib). D A represents alkylene, R a03 represents a glycidyl group. Regarding the alkylene group as the above D A , for example, methylene, methylmethylene, dimethylmethylene, dimethylmethylene, trimethylene, etc., have carbon atoms of 1 or more and 18 or less. Linear or branched alkylene, etc. [化15]
Figure 02_image029
(In the above formula (a-Ia) and formula (a-Ib), D 1 and D 2 each independently represent an alkylene group, and ms represents an integer of 0 to 2)

作為式(a-I)所示之化合物,更具體而言,可例舉下述式所示之於分子內具有2個以上之縮水甘油基之環狀矽氧烷等。又,作為式(a-I)所示之化合物,例如可使用商品名「X-40-2670」、「X-40-2701」、「X-40-2728」、「X-40-2738」、「X-40-2740」(以上為信越化學工業公司製造)等市售品。As the compound represented by the formula (a-I), more specifically, a cyclic siloxane having two or more glycidyl groups in the molecule represented by the following formula, and the like can be exemplified. In addition, as the compound represented by formula (aI), for example, trade names "X-40-2670", "X-40-2701", "X-40-2728", "X-40-2738", and " "X-40-2740" (the above is made by Shin-Etsu Chemical Co., Ltd.) and other commercially available products.

[化16]

Figure 02_image031
[化16]
Figure 02_image031

[化17]

Figure 02_image033
[化17]
Figure 02_image033

<矽氧烷改質(甲基)丙烯酸樹脂(A1)之製造方法> 矽氧烷改質(甲基)丙烯酸樹脂(A1)係包含源自具有脂環式環氧基之(甲基)丙烯酸酯之結構單元之(甲基)丙烯酸樹脂(A-I)、與上述含有環氧基之環狀矽氧烷化合物(A-II)之反應物。<Manufacturing method of silicone modified (meth)acrylic resin (A1)> Silicone modified (meth)acrylic resin (A1) is a (meth)acrylic resin (AI) containing structural units derived from (meth)acrylates with alicyclic epoxy groups, and the above-mentioned ring-containing The reactant of the cyclic siloxane compound (A-II) of the oxy group.

製造矽氧烷改質(甲基)丙烯酸樹脂(A1)時之要與(甲基)丙烯酸樹脂(A-I)進行反應之含有環氧基之環狀矽氧烷化合物(A-II)之量並無特別限定。 關於要與(甲基)丙烯酸樹脂(A-I)進行反應之含有環氧基之環狀矽氧烷化合物(A-II)之量,例如相對於(甲基)丙烯酸樹脂(A-I)100質量份,較佳為1質量份以上50質量份以下,更佳為1質量份以上30質量份以下,進而較佳為1質量份以上15質量份以下。When manufacturing silicone modified (meth)acrylic resin (A1), the amount of epoxy-containing cyclic silicone compound (A-II) to be reacted with (meth)acrylic resin (AI) and There is no particular limitation. Regarding the amount of the epoxy group-containing cyclic silicone compound (A-II) to be reacted with the (meth)acrylic resin (AI), for example, relative to 100 parts by mass of the (meth)acrylic resin (AI), It is preferably 1 part by mass or more and 50 parts by mass or less, more preferably 1 part by mass or more and 30 parts by mass or less, and still more preferably 1 part by mass or more and 15 parts by mass or less.

反應典型而言係於有機溶劑之存在下進行。作為有機溶劑,例如可自以下作為樹脂組合物之成分所述之有機溶劑中適當選擇。有機溶劑之使用量例如相對於(甲基)丙烯酸樹脂(A-I)之質量與含有環氧基之環狀矽氧烷化合物(A-II)之質量的合計100質量份,較佳為50質量份以上5000質量份以下,更佳為100質量份以上3000質量份以下,進而較佳為150質量份以上2000質量份以下。The reaction is typically carried out in the presence of an organic solvent. As the organic solvent, for example, it can be appropriately selected from the organic solvents described below as components of the resin composition. The amount of the organic solvent used is, for example, 100 parts by mass, preferably 50 parts by mass relative to the total of the mass of the (meth)acrylic resin (AI) and the mass of the epoxy-containing cyclic silicone compound (A-II) Above 5000 parts by mass or less, more preferably 100 parts by mass or more and 3000 parts by mass or less, and still more preferably 150 parts by mass or more and 2000 parts by mass or less.

關於反應溫度及反應時間,反應除要達到所需程度便無特別限定。就使所需反應良好地進行之觀點而言,反應溫度較佳為0℃以上150℃以下,更佳為10℃以上120℃以下,進而較佳為20℃以上100℃以下。反應時間較佳為5分鐘以上12小時以下,更佳為10分鐘以上6小時以下。Regarding the reaction temperature and reaction time, the reaction is not particularly limited unless the reaction reaches a desired level. From the viewpoint of enabling the desired reaction to proceed well, the reaction temperature is preferably 0°C or higher and 150°C or lower, more preferably 10°C or higher and 120°C or lower, and still more preferably 20°C or higher and 100°C or lower. The reaction time is preferably 5 minutes or more and 12 hours or less, more preferably 10 minutes or more and 6 hours or less.

關於(甲基)丙烯酸樹脂(A-I)與含有環氧基之環狀矽氧烷化合物(A-II)之反應,為促進反應,可於觸媒之存在下進行。作為上述觸媒之較佳例,可例舉咪唑化合物、二級胺化合物、三級胺化合物、有機膦化合物、及四苯基硼鹽,更佳為咪唑化合物及三級胺化合物。 作為咪唑化合物之具體例,可例舉:1-甲基咪唑、2-甲基咪唑、2-苯基咪唑、2-苯基-4-甲基咪唑、2-十七烷基咪唑、苯并咪唑等。 作為三級胺化合物之具體例,可例舉:1,8-二氮雜雙環[5.4.0]-7-十一烯、三伸乙基二胺、苄基二甲基胺、三乙醇胺、二甲基乙醇胺、三(二甲基胺基甲基)苯酚等。 作為二級胺化合物之具體例,可例舉:二乙基胺、二丙基胺、二丁基胺等。 作為有機膦化合物之具體例,可例舉:三丁基膦、甲基二苯基膦、三苯基膦、二苯基膦、苯基膦等。 作為四苯基硼鹽之具體例,可例舉:四苯基硼酸四苯基鏻、2-乙基-4-甲基咪唑鎓四苯基硼酸鹽、N-甲基𠰌啉鎓四苯基硼酸鹽等。Regarding the reaction between the (meth)acrylic resin (A-I) and the epoxy-containing cyclic silicone compound (A-II), in order to promote the reaction, it can be carried out in the presence of a catalyst. Preferred examples of the above catalyst include imidazole compounds, secondary amine compounds, tertiary amine compounds, organic phosphine compounds, and tetraphenyl boron salts, more preferably imidazole compounds and tertiary amine compounds. Specific examples of imidazole compounds include 1-methylimidazole, 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 2-heptadecylimidazole, benzo Imidazole and so on. Specific examples of tertiary amine compounds include: 1,8-diazabicyclo[5.4.0]-7-undecene, triethylenediamine, benzyldimethylamine, triethanolamine, Dimethylethanolamine, tris(dimethylaminomethyl)phenol, etc. As a specific example of a secondary amine compound, diethylamine, dipropylamine, dibutylamine, etc. can be mentioned. As a specific example of an organic phosphine compound, tributyl phosphine, methyl diphenyl phosphine, triphenyl phosphine, diphenyl phosphine, phenyl phosphine, etc. can be mentioned. Specific examples of the tetraphenyl boron salt include: tetraphenylphosphonium tetraphenylborate, 2-ethyl-4-methylimidazolium tetraphenylborate, and N-methylpyrolinium tetraphenylborate. Borate, etc.

觸媒之使用量並無特別限定,相對於(甲基)丙烯酸樹脂(A-I)之質量與含有環氧基之環狀矽氧烷化合物(A-II)之質量的合計100質量份,而為0.1質量份以上20質量份以下,更佳為0.2質量份以上10質量份以下,進而較佳為0.5質量份以上5質量份以下。The amount of the catalyst used is not particularly limited, and it is 100 parts by mass of the total of the mass of the (meth)acrylic resin (AI) and the mass of the epoxy-containing cyclic silicone compound (A-II) 0.1 parts by mass or more and 20 parts by mass or less, more preferably 0.2 parts by mass or more and 10 parts by mass or less, and still more preferably 0.5 parts by mass or more and 5 parts by mass or less.

舉一例而言,於(甲基)丙烯酸樹脂(A-I)具有羧基與環氧環己基,含有環氧基之環狀矽氧烷化合物(A-II)具有環氧環己基之情形時,作為(甲基)丙烯酸樹脂(A-I)與含有環氧基之環狀矽氧烷化合物(A-II)之反應,會產生以下之反應。以下之反應中之水分要參與之反應可藉由反應裝置內之微量之水分、有機溶劑等所附帶並帶入至反應系內之微量之水分而產生。 [化18]

Figure 02_image035
For example, when the (meth)acrylic resin (AI) has a carboxyl group and an epoxycyclohexyl group, and the epoxy group-containing cyclic silicone compound (A-II) has an epoxycyclohexyl group, it is ( The reaction between the meth)acrylic resin (AI) and the epoxy-containing cyclic silicone compound (A-II) produces the following reaction. The reaction in which the moisture in the following reactions participates can be produced by the trace moisture in the reaction device, organic solvent, etc., which is added and brought into the reaction system. [化18]
Figure 02_image035

依照以上之方法所製備之矽氧烷改質(甲基)丙烯酸樹脂(A1)係以反應液之形式直接地用於或以依照慣例自反應液單離之狀態用於樹脂組合物之製備。The silicone-modified (meth)acrylic resin (A1) prepared according to the above method is directly used in the form of a reaction liquid or used in the preparation of a resin composition in a state of being isolated from the reaction liquid according to the convention.

[樹脂組合物之較佳態樣] 以下,關於樹脂組合物之較佳態樣,對第1樹脂組合物及第2樹脂組合物進行說明。再者,含有矽氧烷改質(甲基)丙烯酸樹脂(A1)之樹脂組合物並不限定於以下說明之第1樹脂組合物及第2樹脂組合物。[Preferred aspect of resin composition] Hereinafter, with regard to preferable aspects of the resin composition, the first resin composition and the second resin composition will be described. In addition, the resin composition containing the silicone modified (meth)acrylic resin (A1) is not limited to the first resin composition and the second resin composition described below.

(第1樹脂組合物) 第1樹脂組合物係含有矽氧烷改質(甲基)丙烯酸樹脂(A1)與硬化劑之樹脂組合物。(First resin composition) The first resin composition is a resin composition containing a silicone modified (meth)acrylic resin (A1) and a curing agent.

第1樹脂組合物含有矽氧烷改質(甲基)丙烯酸樹脂(A1)作為環氧化合物。第1樹脂組合物含有使作為環氧化合物之矽氧烷改質(甲基)丙烯酸樹脂(A1)硬化之硬化劑。作為硬化劑,可為感光性硬化劑,亦可為感熱性硬化劑,亦可為兩者之組合。The first resin composition contains a silicone modified (meth)acrylic resin (A1) as an epoxy compound. The first resin composition contains a curing agent for curing the silicone-modified (meth)acrylic resin (A1), which is an epoxy compound. The curing agent may be a photosensitive curing agent, a heat-sensitive curing agent, or a combination of the two.

第1樹脂組合物亦可含有不屬於矽氧烷改質(甲基)丙烯酸樹脂(A1)之環氧化合物及/或氧雜環丁烷化合物。 可與矽氧烷改質(甲基)丙烯酸樹脂(A1)一起使用之環氧化合物及/或氧雜環丁烷化合物之種類於不會妨礙本發明之目的之範圍內並無特別限定。The first resin composition may contain epoxy compounds and/or oxetane compounds that are not silicone-modified (meth)acrylic resin (A1). The types of epoxy compounds and/or oxetane compounds that can be used together with the silicone-modified (meth)acrylic resin (A1) are not particularly limited as long as they do not hinder the purpose of the present invention.

就硬化物之相對介電常數較低之方面而言,第1樹脂組合物中之矽氧烷改質(甲基)丙烯酸樹脂(A1)之質量之合計相對於環氧化合物之質量與氧雜環丁烷化合物之質量之合計的比率較佳為50質量%以上,更佳為70質量%以上,進而較佳為80質量%以上,進而更佳為90質量%以上,尤佳為100質量%。As far as the relative dielectric constant of the cured product is low, the total mass of the silicone-modified (meth)acrylic resin (A1) in the first resin composition is relative to the mass of the epoxy compound and the oxygen The ratio of the total mass of the cyclobutane compound is preferably 50% by mass or more, more preferably 70% by mass or more, still more preferably 80% by mass or more, still more preferably 90% by mass or more, and particularly preferably 100% by mass .

硬化劑只要為先前用作環氧化合物或氧雜環丁烷化合物用硬化劑之化合物,則並無特別限定。以下,對較佳硬化劑進行說明。The curing agent is not particularly limited as long as it is a compound previously used as a curing agent for epoxy compounds or oxetane compounds. Hereinafter, the preferred hardener will be described.

・鎓鹽(D1) 鎓鹽(D1)可與環氧化合物或氧雜環丁烷化合物等一起使用,於光或熱之作用下促進環氧化合物或氧雜環丁烷化合物等之硬化。 作為鎓鹽,例如可例舉:重氮鎓鹽、銨鹽、錪鹽、鋶鹽、鏻鹽、氧鎓鹽等。該等中,就獲取之容易性、良好之硬化之方面而言,較佳為鋶鹽及錪鹽。・Onium salt (D1) The onium salt (D1) can be used together with epoxy compounds or oxetane compounds, etc., to promote the hardening of epoxy compounds or oxetane compounds, etc. under the action of light or heat. The onium salt may, for example, be a diazonium salt, an ammonium salt, an iodonium salt, a sulfonium salt, a phosphonium salt, an oxonium salt, and the like. Among them, in terms of ease of obtaining and good hardening, sulphur salt and sulphur salt are preferred.

以下,對鎓鹽(D1)之較佳例進行說明。 作為鎓鹽(D1)之較佳一例,可例舉下述式(D-I)所示之鋶鹽(以下,亦記作「鋶鹽(Q)」)。Hereinafter, preferred examples of the onium salt (D1) will be described. As a preferable example of the onium salt (D1), a sulfonium salt represented by the following formula (D-I) (hereinafter, also referred to as "a sulfonium salt (Q)") can be mentioned.

[化19]

Figure 02_image037
(式(D-I)中,RD1 及RD2 獨立地表示可經鹵素原子取代之烷基或下述式(D-II)所示之基,RD1 及RD2 可相互鍵結而與式中之硫原子一起形成環,RD3 表示下述式(D-III)所示之基或下述式(D-IV)所示之基,AD1 表示S、O、或Se,X- 表示一價之陰離子,其中,RD1 及RD2 不同時為可經鹵素原子取代之烷基)[化19]
Figure 02_image037
(In the formula (DI), R D1 and R D2 independently represent an alkyl group that can be substituted by a halogen atom or a group represented by the following formula (D-II). R D1 and R D2 can be bonded to each other to form The sulfur atoms together form a ring, R D3 represents a group represented by the following formula (D-III) or a group represented by the following formula (D-IV), A D1 represents S, O, or Se, and X - represents one Anion of valence, in which R D1 and R D2 are not at the same time an alkyl group which can be substituted by a halogen atom)

[化20]

Figure 02_image039
(式(D-II)中,環ZD1 表示芳香族烴環,RD4 表示可經鹵素原子取代之烷基、羥基、烷氧基、烷基羰基、烷氧基羰基、醯氧基、烷硫基、噻吩基、噻吩基羰基、呋喃基、呋喃基羰基、硒吩基、硒吩基羰基、雜環式脂肪族烴基、烷基亞磺醯基、烷基磺醯基、羥基(聚)伸烷氧基、可經取代之胺基、氰基、硝基、或鹵素原子,m1表示0以上之整數)[化20]
Figure 02_image039
(In formula (D-II), ring Z D1 represents an aromatic hydrocarbon ring, and R D4 represents an alkyl group, a hydroxyl group, an alkoxy group, an alkylcarbonyl group, an alkoxycarbonyl group, an acyloxy group, an alkane group which can be substituted by a halogen atom. Thio, thienyl, thienyl carbonyl, furyl, furyl carbonyl, selenyl, selenyl carbonyl, heterocyclic aliphatic hydrocarbon group, alkyl sulfinyl, alkyl sulfonyl, hydroxyl (poly) Alkylene group, substituted amine group, cyano group, nitro group, or halogen atom, m1 represents an integer of 0 or more)

[化21]

Figure 02_image041
(式(D-III)中,RD5 表示可經如下基取代之伸烷基或下述式(D-V)所示之基,上述取代基即:羥基、烷氧基、烷基羰基、芳基羰基、烷氧基羰基、芳氧基羰基、芳硫基羰基、醯氧基、芳硫基、烷硫基、芳基、雜環式烴基、芳氧基、烷基亞磺醯基、芳基亞磺醯基、烷基磺醯基、芳基磺醯基、羥基(聚)伸烷氧基、可經取代之胺基、氰基、硝基或鹵素原子,RD6 表示可經如下基取代之烷基或下述式(D-VI)所示之基,上述取代基即:羥基、烷氧基、烷基羰基、芳基羰基、烷氧基羰基、芳氧基羰基、芳硫基羰基、醯氧基、芳硫基、烷硫基、芳基、雜環式烴基、芳氧基、烷基亞磺醯基、芳基亞磺醯基、烷基磺醯基、芳基磺醯基、羥基(聚)伸烷氧基、可經取代之胺基、氰基、硝基、或鹵素原子,AD2 表示單鍵、S、O、亞磺醯基、或羰基,n1表示0或1)[化21]
Figure 02_image041
(In formula (D-III), R D5 represents an alkylene group which may be substituted by the following group or a group represented by the following formula (DV), the above-mentioned substituents are: hydroxy, alkoxy, alkylcarbonyl, aryl Carbonyl, alkoxycarbonyl, aryloxycarbonyl, arylthiocarbonyl, acyloxy, arylthio, alkylthio, aryl, heterocyclic hydrocarbon, aryloxy, alkylsulfinyl, aryl Sulfinyl, alkylsulfonyl, arylsulfonyl, hydroxy (poly) alkoxy, substituted amine, cyano, nitro or halogen atom, R D6 means that it can be substituted by the following groups The alkyl group or the group represented by the following formula (D-VI), the above-mentioned substituents are: hydroxyl, alkoxy, alkylcarbonyl, arylcarbonyl, alkoxycarbonyl, aryloxycarbonyl, arylthiocarbonyl , Acyloxy, arylthio, alkylthio, aryl, heterocyclic hydrocarbon, aryloxy, alkylsulfinyl, arylsulfinyl, alkylsulfinyl, arylsulfinyl , Hydroxy (poly) alkoxy, substituted amine, cyano, nitro, or halogen atom, A D2 represents a single bond, S, O, sulfinyl, or carbonyl, n1 represents 0 or 1 )

[化22]

Figure 02_image043
(式(D-IV)中,RD7 及RD8 獨立地表示可經如下基取代之伸烷基或下述式(D-V)所示之基,上述取代基即:羥基、烷氧基、烷基羰基、芳基羰基、烷氧基羰基、芳氧基羰基、芳硫基羰基、醯氧基、芳硫基、烷硫基、芳基、雜環式烴基、芳氧基、烷基亞磺醯基、芳基亞磺醯基、烷基磺醯基、芳基磺醯基、羥基(聚)伸烷氧基、可經取代之胺基、氰基、硝基、或鹵素原子,RD9 及RD10 獨立地表示可經鹵素原子取代之烷基或上述式(D-II)所示之基,RD9 及RD10 可相互鍵結而與式中之硫原子一起形成環,AD3 表示單鍵、S、O、亞磺醯基、或羰基,X- 如上所述,n2表示0或1,其中,RD9 及RD10 不同時為可經鹵素原子取代之烷基)[化22]
Figure 02_image043
(In formula (D-IV), R D7 and R D8 independently represent an alkylene group which may be substituted by the following group or a group represented by the following formula (DV). The above-mentioned substituents are: hydroxy, alkoxy, alkane Alkylcarbonyl, arylcarbonyl, alkoxycarbonyl, aryloxycarbonyl, arylthiocarbonyl, acyloxy, arylthio, alkylthio, aryl, heterocyclic hydrocarbon, aryloxy, alkylsulfinyl Amino groups, arylsulfinyl groups, alkylsulfinyl groups, arylsulfinyl groups, hydroxy (poly) alkoxy groups, optionally substituted amine groups, cyano groups, nitro groups, or halogen atoms, R D9 And R D10 independently represent an alkyl group that can be substituted by a halogen atom or the group represented by the above formula (D-II), R D9 and R D10 can be bonded to each other to form a ring with the sulfur atom in the formula, and A D3 represents Single bond, S, O, sulfinyl, or carbonyl, X - as described above, n2 represents 0 or 1, wherein R D9 and R D10 are not at the same time an alkyl group that can be substituted by a halogen atom)

[化23]

Figure 02_image045
(式(D-V)中,環ZD2 表示芳香族烴環,RD11 表示可經鹵素原子取代之烷基、羥基、烷氧基、烷基羰基、芳基羰基、烷氧基羰基、芳氧基羰基、芳硫基羰基、醯氧基、芳硫基、烷硫基、芳基、雜環式烴基、芳氧基、烷基亞磺醯基、芳基亞磺醯基、烷基磺醯基、芳基磺醯基、羥基(聚)伸烷氧基、可經取代之胺基、氰基、硝基、或鹵素原子,m2表示0以上之整數) [化24]
Figure 02_image047
(式(D-VI)中,環ZD3 表示芳香族烴環,RD12 表示可經鹵素原子取代之烷基、羥基、烷氧基、烷基羰基、芳基羰基、烷氧基羰基、芳氧基羰基、芳硫基羰基、醯氧基、芳硫基、烷硫基、噻吩基羰基、呋喃基羰基、硒吩基羰基、芳基、雜環式烴基、芳氧基、烷基亞磺醯基、芳基亞磺醯基、烷基磺醯基、芳基磺醯基、羥基(聚)伸烷氧基、可經取代之胺基、氰基、硝基、或鹵素原子,m3表示0以上之整數)[化23]
Figure 02_image045
(In formula (DV), ring Z D2 represents an aromatic hydrocarbon ring, and R D11 represents an alkyl group, a hydroxyl group, an alkoxy group, an alkylcarbonyl group, an arylcarbonyl group, an alkoxycarbonyl group, and an aryloxy group which can be substituted by a halogen atom. Carbonyl, arylthiocarbonyl, acyloxy, arylthio, alkylthio, aryl, heterocyclic hydrocarbon, aryloxy, alkylsulfinyl, arylsulfinyl, alkylsulfonyl , Arylsulfonyl, hydroxy(poly)alkyleneoxy, substituted amine, cyano, nitro, or halogen atom, m2 represents an integer of 0 or more) [化24]
Figure 02_image047
(In formula (D-VI), ring Z D3 represents an aromatic hydrocarbon ring, and R D12 represents an alkyl group, hydroxyl group, alkoxy group, alkylcarbonyl group, arylcarbonyl group, alkoxycarbonyl group, aromatic Oxycarbonyl, arylthiocarbonyl, acyloxy, arylthio, alkylthio, thienylcarbonyl, furylcarbonyl, selenylcarbonyl, aryl, heterocyclic hydrocarbon, aryloxy, alkylsulfinyl Amino groups, arylsulfinyl groups, alkylsulfinyl groups, arylsulfinyl groups, hydroxy (poly) alkoxy groups, optionally substituted amine groups, cyano groups, nitro groups, or halogen atoms, m3 represents Integer above 0)

(鋶鹽(Q)) 以下,對鋶鹽(Q)進行說明。鋶鹽(Q)之特徵在於,在上述式(D-I)中之苯環中,在相對於AD1 所鍵結之碳原子而為鄰位之碳原子上鍵結有甲基。鋶鹽(Q)由於在上述位置具有甲基,故而與先前之鋶鹽相比,對於紫外線等活性能量線之感度較高。(Amber salt (Q)) The following describes amber salt (Q). The sulfonium salt (Q) is characterized in that, in the benzene ring in the above formula (DI), a methyl group is bonded to a carbon atom that is ortho to the carbon atom to which A D1 is bonded. Since the sulfonium salt (Q) has a methyl group at the above-mentioned position, compared with the previous sulfonium salt, the sensitivity to active energy rays such as ultraviolet rays is higher.

上述式(D-I)中,較佳為RD1 及RD2 均為上述式(D-II)所示之基。RD1 及RD2 相互可相同亦可不同。 上述式(D-I)中,於RD1 及RD2 相互鍵結而與式中之硫原子一起形成環之情形時,構成所形成之環之原子數較佳為包含硫原子在內為3以上10以下,更佳為5以上7以下。所形成之環可為多環,較佳為環構成原子數為5以上7以下之單環縮合而成之多環。 上述式(D-I)中,較佳為RD1 及RD2 均為苯基。 上述式(D-I)中,RD3 較佳為上述式(D-III)所示之基。 上述式(D-I)中,AD1 較佳為S或O,更佳為S。In the above formula (DI), it is preferable that both R D1 and R D2 are groups represented by the above formula (D-II). R D1 and R D2 may be the same or different from each other. In the above formula (DI), when R D1 and R D2 are bonded to each other to form a ring together with the sulfur atom in the formula, the number of atoms constituting the formed ring is preferably 3 or more including the sulfur atom. Hereinafter, it is more preferably 5 or more and 7 or less. The formed ring may be a polycyclic ring, and is preferably a polycyclic ring formed by the condensation of a monocyclic ring having 5 or more and 7 or less ring constituent atoms. In the above formula (DI), it is preferable that both R D1 and R D2 are phenyl groups. In the above formula (DI), R D3 is preferably a group represented by the above formula (D-III). In the above formula (DI), A D1 is preferably S or O, more preferably S.

上述式(D-II)中,RD4 較佳為可經鹵素原子取代之烷基、羥基、烷基羰基、噻吩基羰基、呋喃基羰基、硒吩基羰基、可經取代之胺基、或硝基,更佳為可經鹵素原子取代之烷基、烷基羰基、或噻吩基羰基。 上述式(D-II)中,m1可根據環ZD1 之種類而選擇,例如可為0以上4以下之整數,較佳為0以上3以下之整數,更佳為0以上2以下之整數。In the above formula (D-II), R D4 is preferably an alkyl group, a hydroxyl group, an alkylcarbonyl group, a thienylcarbonyl group, a furylcarbonyl group, a selenophenylcarbonyl group, an amine group which may be substituted by a halogen atom, or The nitro group is more preferably an alkyl group, an alkylcarbonyl group, or a thienylcarbonyl group which may be substituted with a halogen atom. In the above formula (D-II), m1 can be selected according to the type of ring Z D1 , for example, it can be an integer of 0 or more and 4 or less, preferably an integer of 0 or more and 3 or less, and more preferably an integer of 0 or more and 2 or less.

上述式(D-III)中,RD5 較佳為伸烷基;可經羥基、可經取代之胺基或硝基取代之伸烷基;或上述式(D-V)所示之基;更佳為上述式(D-V)所示之基。 上述式(D-III)中,RD6 較佳為烷基;可經羥基、可經取代之胺基或硝基取代之烷基;或上述式(D-VI)所示之基;更佳為上述式(D-VI)所示之基。 上述式(D-III)中,AD2 較佳為S或O,更佳為S。 上述式(D-III)中,n1較佳為0。In the above formula (D-III), R D5 is preferably an alkylene group; an alkylene group which may be substituted by a hydroxyl group, an optionally substituted amine group or a nitro group; or a group represented by the above formula (DV); more preferably It is the base shown in the above formula (DV). In the above formula (D-III), R D6 is preferably an alkyl group; an alkyl group which may be substituted by a hydroxyl group, an optionally substituted amine group or a nitro group; or a group represented by the above formula (D-VI); more preferably It is the base represented by the above formula (D-VI). In the above formula (D-III), A D2 is preferably S or O, more preferably S. In the above formula (D-III), n1 is preferably zero.

上述式(D-IV)中,RD7 及RD8 獨立地較佳為伸烷基;可經羥基、可經取代之胺基或硝基取代之伸烷基;或上述式(D-V)所示之基;更佳為上述式(D-V)所示之基。RD7 及RD8 相互可相同亦可不同。 上述式(D-IV)中,較佳為RD9 及RD10 均為上述式(D-II)所示之基。RD9 及RD10 相互可相同亦可不同。 上述式(D-IV)中,於RD9 及RD10 相互鍵結而與式中之硫原子一起形成環之情形時,構成所形成之環之原子數較佳為包含硫原子在內為3以上10以下,更佳為5以上7以下。所形成之環可為多環,較佳為環構成原子數為5以上7以下之單環縮合而成之多環。 上述式(D-IV)中,AD3 較佳為S或O,更佳為S。 上述式(D-IV)中,n2較佳為0。In the above formula (D-IV), R D7 and R D8 are independently preferably an alkylene group; an alkylene group that may be substituted by a hydroxyl group, an optionally substituted amine group or a nitro group; or the above formula (DV) The base; more preferably the base shown in the above formula (DV). R D7 and R D8 may be the same or different from each other. In the above formula (D-IV), it is preferable that both R D9 and R D10 are groups represented by the above formula (D-II). R D9 and R D10 may be the same or different from each other. In the above formula (D-IV), when R D9 and R D10 are bonded to each other to form a ring together with the sulfur atom in the formula, the number of atoms constituting the formed ring is preferably 3 including the sulfur atom Above 10 or less, more preferably 5 or more and 7 or less. The formed ring may be a polycyclic ring, and is preferably a polycyclic ring formed by the condensation of a monocyclic ring having 5 or more and 7 or less ring constituent atoms. In the above formula (D-IV), A D3 is preferably S or O, more preferably S. In the above formula (D-IV), n2 is preferably zero.

上述式(D-V)中,RD11 較佳為可經鹵素原子取代之烷基、羥基、可經取代之胺基、或硝基,更佳為可經鹵素原子取代之烷基。 上述式(D-V)中,m2可根據環ZD2 之種類而選擇,例如可為0以上4以下之整數,較佳為0以上3以下之整數,更佳為0以上2以下之整數。In the above formula (DV), R D11 is preferably an alkyl group which may be substituted by a halogen atom, a hydroxyl group, an amino group which may be substituted, or a nitro group, and more preferably an alkyl group which may be substituted by a halogen atom. In the above formula (DV), m2 can be selected according to the type of ring Z D2 , for example, it can be an integer of 0 or more and 4 or less, preferably an integer of 0 or more and 3 or less, and more preferably an integer of 0 or more and 2 or less.

上述式(D-VI)中,RD12 較佳為可經鹵素原子取代之烷基、羥基、烷基羰基、噻吩基羰基、呋喃基羰基、硒吩基羰基、可經取代之胺基、或硝基,更佳為可經鹵素原子取代之烷基、烷基羰基、或噻吩基羰基。 上述式(D-VI)中,m3可根據環ZD3 之種類而選擇,例如可為0以上4以下之整數,較佳為0以上3以下之整數,更佳為0以上2以下之整數。In the above formula (D-VI), R D12 is preferably an alkyl group, a hydroxyl group, an alkylcarbonyl group, a thienylcarbonyl group, a furylcarbonyl group, a selenylcarbonyl group, an amine group which may be substituted by a halogen atom, or The nitro group is more preferably an alkyl group, an alkylcarbonyl group, or a thienylcarbonyl group which may be substituted with a halogen atom. In the above formula (D-VI), m3 can be selected according to the type of ring Z D3 . For example, it can be an integer of 0 or more and 4 or less, preferably an integer of 0 or more and 3 or less, and more preferably an integer of 0 or more and 2 or less.

上述式(D-I)中,X- 為一價之陰離子。作為X- ,可較佳地例舉一價之多原子陰離子,更佳為MYa - 、(Rf)b PF6-b - 、Rx1 c BY4-c - 、Rx1 c GaY4-c - 、Rx2 SO3 - 、(Rx2 SO2 )3 C- 、或(Rx2 SO2 )2 N- 所示之陰離子。又,X- 可為鹵素陰離子,例如可例舉:氟化物離子、氯化物離子、溴化物離子、碘化物離子等。In the above formula (DI), X - is a monovalent anion. As X -, can be preferably exemplified by a monovalent anion as many atoms, more preferably MY a -, (Rf) b PF 6-b -, R x1 c BY 4-c -, R x1 c GaY 4-c -, R x2 SO 3 -, (R x2 SO 2) 3 C -, or (R x2 SO 2) 2 N - anion of FIG. In addition, X - may be a halogen anion, and examples thereof include fluoride ion, chloride ion, bromide ion, and iodide ion.

M表示磷原子、硼原子、或銻原子。 Y表示鹵素原子(較佳為氟原子)。M represents a phosphorus atom, a boron atom, or an antimony atom. Y represents a halogen atom (preferably a fluorine atom).

Rf表示氫原子之80莫耳%以上被氟原子取代之烷基(較佳為碳原子數1以上8以下之烷基)。作為要經氟取代而成為Rf之烷基,可例舉:直鏈烷基(甲基、乙基、丙基、丁基、戊基及辛基等)、支鏈烷基(異丙基、異丁基、第二丁基及第三丁基等)及環烷基(環丙基、環丁基、環戊基及環己基等)等。Rf中該等烷基之氫原子被取代為氟原子之比率較佳為基於烷基原本所具有之氫原子之莫耳數而為80莫耳%以上,進而較佳為90%以上,尤佳為100%。若氟原子之取代比率處於該等較佳範圍,則鋶鹽(Q)之光感應性變得更良好。作為尤佳之Rf,可例舉:CF3 - 、CF3 CF2 - 、(CF3 )2 CF- 、CF3 CF2 CF2 - 、CF3 CF2 CF2 CF2 - 、(CF3 )2 CFCF2 - 、CF3 CF2 (CF3 )CF- 及(CF3 )3 C- 。b個Rf相互獨立,因此相互可相同亦可不同。Rf represents an alkyl group in which 80 mol% or more of hydrogen atoms are substituted with fluorine atoms (preferably an alkyl group having 1 to 8 carbon atoms). Examples of the alkyl group to be substituted by fluorine to become Rf include straight chain alkyl groups (methyl, ethyl, propyl, butyl, pentyl, octyl, etc.), branched chain alkyl groups (isopropyl, Isobutyl, second butyl, tertiary butyl, etc.) and cycloalkyl (cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl, etc.), etc. The ratio at which hydrogen atoms of the alkyl groups are substituted with fluorine atoms in Rf is preferably 80 mol% or more based on the number of moles of hydrogen atoms originally possessed by the alkyl group, and more preferably 90% or more, and more preferably Is 100%. If the substitution ratio of the fluorine atom is in these preferable ranges, the light sensitivity of the sulfonium salt (Q) becomes better. Plus as the Rf, include: CF 3 -, CF 3 CF 2 -, (CF 3) 2 CF -, CF 3 CF 2 CF 2 -, CF 3 CF 2 CF 2 CF 2 -, (CF 3) 2 CFCF 2 -, CF 3 CF 2 (CF 3) CF - and (CF 3) 3 C -. The b pieces of Rf are independent of each other, and therefore may be the same or different from each other.

P表示磷原子,F表示氟原子。P represents a phosphorus atom, and F represents a fluorine atom.

Rx1 表示氫原子之一部分被至少一個元素或拉電子基取代之苯基。作為此種1個元素之例,包括鹵素原子,可例舉氟原子、氯原子及溴原子等。作為拉電子基,可例舉三氟甲基、硝基及氰基等。該等中,較佳為至少一個氫原子被氟原子或三氟甲基取代之苯基。c個Rx1 相互獨立,因此相互可相同亦可不同。R x1 represents a phenyl group in which a part of a hydrogen atom is substituted by at least one element or an electron withdrawing group. As an example of such one element, a halogen atom is included, and a fluorine atom, a chlorine atom, a bromine atom, etc. are mentioned. As the electron withdrawing group, a trifluoromethyl group, a nitro group, a cyano group, etc. may be mentioned. Among these, a phenyl group in which at least one hydrogen atom is substituted by a fluorine atom or a trifluoromethyl group is preferred. The c pieces of R x1 are independent of each other, and therefore may be the same or different from each other.

B表示硼原子,Ga表示鎵原子。B represents a boron atom, and Ga represents a gallium atom.

Rx2 表示碳原子數1以上20以下之烷基、碳原子數1以上20以下之氟烷基或碳原子數6以上20以下之芳基,烷基及氟烷基可為直鏈狀、支鏈狀或環狀之任一種,烷基、氟烷基或芳基可未經取代,亦可具有取代基。作為上述取代基,例如可例舉羥基、可經取代之胺基、及硝基等。作為可經取代之胺基,例如可例舉與上述式(D-II)~(D-VI)相關之後述說明中所例示之基。 又,Rx2 所示之烷基、氟烷基或芳基中之碳鏈可具有氧原子、氮原子、硫原子等雜原子。尤其是Rx2 所示之烷基或氟烷基中之碳鏈可具有二價官能基(例如醚鍵、羰基鍵、酯鍵、胺基鍵、醯胺鍵、醯亞胺鍵、磺醯基鍵、磺醯基醯胺鍵、磺醯基醯亞胺鍵、胺基甲酸酯鍵等)。 於Rx2 所示之烷基、氟烷基或芳基具有上述取代基、雜原子或官能基之情形時,上述取代基、雜原子或官能基之個數可為1個,亦可為2個以上。R x2 represents an alkyl group with 1 to 20 carbon atoms, a fluoroalkyl group with 1 to 20 carbon atoms, or an aryl group with 6 to 20 carbon atoms. The alkyl group and the fluoroalkyl group may be linear or branched. Either chain or cyclic, the alkyl group, fluoroalkyl group, or aryl group may be unsubstituted or may have a substituent. As said substituent, a hydroxyl group, an amino group which may be substituted, a nitro group, etc. are mentioned, for example. As the amino group which may be substituted, for example, the groups exemplified in the following description related to the above-mentioned formulas (D-II) to (D-VI) can be exemplified. In addition, the carbon chain in the alkyl group, fluoroalkyl group, or aryl group represented by R x2 may have a hetero atom such as an oxygen atom, a nitrogen atom, and a sulfur atom. In particular , the carbon chain in the alkyl group or fluoroalkyl group represented by R x2 may have a divalent functional group (for example, an ether bond, a carbonyl bond, an ester bond, an amino bond, an amide bond, an imine bond, a sulfonyl group Bond, sulfonamide bond, sulfonamide bond, urethane bond, etc.). When the alkyl group, fluoroalkyl group or aryl group represented by R x2 has the above-mentioned substituents, heteroatoms or functional groups, the number of the above-mentioned substituents, heteroatoms or functional groups may be one or two More than one.

S表示硫原子,O表示氧原子,C表示碳原子,N表示氮原子。 a表示4以上6以下之整數。 b較佳為1以上5以下之整數,進而較佳為2以上4以下之整數,尤佳為2或3。 c較佳為1以上4以下之整數,進而較佳為4。S represents a sulfur atom, O represents an oxygen atom, C represents a carbon atom, and N represents a nitrogen atom. a represents an integer of 4 or more and 6 or less. b is preferably an integer of 1 or more and 5 or less, more preferably an integer of 2 or more and 4 or less, and particularly preferably 2 or 3. c is preferably an integer of 1 or more and 4 or less, more preferably 4.

作為MYa - 所示之陰離子,可例舉SbF6 - 、PF6 - 或BF4 - 所示之陰離子等。As MY a - of the anion represented may, for example 6 SbF -, PF 6 - anion shown in the - or BF 4.

作為(Rf)b PF6-b - 所示之陰離子,可例舉:(CF3 CF2 )2 PF4 - 、(CF3 CF2 )3 PF3 - 、((CF3 )2 CF)2 PF4 - 、((CF3 )2 CF)3 PF3 - 、(CF3 CF2 CF2 )2 PF4 - 、(CF3 CF2 CF2 )3 PF3 - 、((CF3 )2 CFCF2 )2 PF4 - 、((CF3 )2 CFCF2 )3 PF3 - 、(CF3 CF2 CF2 CF2 )2 PF4 - 或(CF3 CF2 CF2 CF2 )3 PF3 - 所示之陰離子等。該等中,較佳為(CF3 CF2 )3 PF3 - 、(CF3 CF2 CF2 )3 PF3 - 、((CF3 )2 CF)3 PF3 - 、((CF3 )2 CF)2 PF4 - 、((CF3 )2 CFCF2 )3 PF3 - 或((CF3 )2 CFCF2 )2 PF4 - 所示之陰離子。As (Rf) b PF 6-b - of the anion represented, include: (CF 3 CF 2) 2 PF 4 -, (CF 3 CF 2) 3 PF 3 -, ((CF 3) 2 CF) 2 PF 4 -, ((CF 3 ) 2 CF) 3 PF 3 -, (CF 3 CF 2 CF 2) 2 PF 4 -, (CF 3 CF 2 CF 2) 3 PF 3 -, ((CF 3) 2 CFCF 2) 2 PF 4 -, ( (CF 3) 2 CFCF 2) 3 PF 3 -, (CF 3 CF 2 CF 2 CF 2) 2 PF 4 - or (CF 3 CF 2 CF 2 CF 2) 3 PF 3 - Anions etc. shown. Of these, preferred are (CF 3 CF 2) 3 PF 3 -, (CF 3 CF 2 CF 2) 3 PF 3 -, ((CF 3) 2 CF) 3 PF 3 -, ((CF 3) 2 CF) 4 2 PF -, ( (CF 3) 2 CFCF 2) 3 PF 3 - , or ((CF 3) 2 CFCF 2 ) 2 PF 4 - anion of FIG.

作為Rx1 c BY4-c - 所示之陰離子,較佳為 Rx1 c BY4-c - (式中,Rx1 表示氫原子之至少一部分被鹵素原子或拉電子基取代之苯基,Y表示鹵素原子,c表示1以上4以下之整數) 例如可例舉:(C6 F5 )4 B- 、((CF3 )2 C6 H3 )4 B- 、(CF3 C6 H4 )4 B- 、(C6 F5 )2 BF2 - 、C6 F5 BF3 - 或(C6 H3 F2 )4 B- 所示之陰離子等。該等中,較佳為(C6 F5 )4 B- 或((CF3 )2 C6 H3 )4 B- 所示之陰離子。As R x1 c BY 4-c - the anion represented, preferably R x1 c BY 4-c - ( wherein, R x1 represents at least a portion of the hydrogen atoms substituted by a halogen atom or the electron withdrawing group phenyl, Y represents a halogen atom, c denotes an integer of 1 or more of the following 4), for example, include: (C 6 F 5) 4 B -, ((CF 3) 2 C 6 H 3) 4 B -, (CF 3 C 6 H 4 ) 4 B -, (C 6 F 5) 2 BF 2 -, C 6 F 5 BF 3 - or (2) 4 B C 6 H 3 F - anion of FIG. Among these, the anion represented by (C 6 F 5 ) 4 B - or ((CF 3 ) 2 C 6 H 3 ) 4 B -is preferred.

作為Rx1 c GaY4-c - 所示之陰離子,可例舉:(C6 F5 )4 Ga- 、((CF3 )2 C6 H3 )4 Ga- 、(CF3 C6 H4 )4 Ga- 、(C6 F5 )2 GaF2 - 、C6 F5 GaF3 - 或(C6 H3 F2 )4 Ga- 所示之陰離子等。該等中,較佳為(C6 F5 )4 Ga- 或((CF3 )2 C6 H3 )4 Ga- 所示之陰離子。As R x1 c GaY 4-c - the anion represented, include: (C 6 F 5) 4 Ga -, ((CF 3) 2 C 6 H 3) 4 Ga -, (CF 3 C 6 H 4 ) 4 Ga -, (C 6 F 5) 2 GaF 2 -, C 6 F 5 GaF 3 - or (C 6 H 3 F 2) 4 Ga - anion of FIG. Among them, the anion represented by (C 6 F 5 ) 4 Ga - or ((CF 3 ) 2 C 6 H 3 ) 4 Ga -is preferred.

作為Rx2 SO3 - 所示之陰離子,可例舉:三氟甲磺酸根陰離子、五氟乙磺酸根陰離子、七氟丙磺酸根陰離子、九氟丁磺酸根陰離子、五氟苯磺酸根陰離子、對甲苯磺酸根陰離子、苯磺酸根陰離子、樟腦磺酸根陰離子、甲磺酸根陰離子、乙磺酸根陰離子、丙磺酸根陰離子及丁磺酸根陰離子等。該等中,較佳為三氟甲磺酸根陰離子、九氟丁磺酸根陰離子、甲磺酸根陰離子、丁磺酸根陰離子、樟腦磺酸根陰離子、苯磺酸根陰離子或對甲苯磺酸根陰離子。Examples of the anion represented by R x2 SO 3 - include: trifluoromethanesulfonate anion, pentafluoroethanesulfonate anion, heptafluoropropanesulfonate anion, nonafluorobutanesulfonate anion, pentafluorobenzenesulfonate anion, P-toluenesulfonate anion, benzenesulfonate anion, camphorsulfonate anion, methanesulfonate anion, ethanesulfonate anion, propanesulfonate anion and butanesulfonate anion, etc. Among these, preferred are trifluoromethanesulfonate anion, nonafluorobutanesulfonate anion, methanesulfonate anion, butanesulfonate anion, camphorsulfonate anion, benzenesulfonate anion or p-toluenesulfonate anion.

作為(Rx2 SO2 )3 C- 所示之陰離子,可例舉(CF3 SO2 )3 C- 、(C2 F5 SO2 )3 C- 、(C3 F7 SO2 )3 C- 或(C4 F9 SO2 )3 C- 所示之陰離子等。As the (2 R x2 SO) 3 C - anion represented, the include (CF 3 SO 2) 3 C -, (C 2 F 5 SO 2) 3 C -, (C 3 F 7 SO 2) 3 C -Or (C 4 F 9 SO 2 ) 3 C - as an anion, etc.

作為(Rx2 SO2 )2 N- 所示之陰離子,可例舉(CF3 SO2 )2 N- 、(C2 F5 SO2 )2 N- 、(C3 F7 SO2 )2 N- 或(C4 F9 SO2 )2 N- 所示之陰離子等。As the (2 R x2 SO) 2 N - as shown in the anion, include (CF 3 SO 2) 2 N -, (C 2 F 5 SO 2) 2 N -, (C 3 F 7 SO 2) 2 N -Or (C 4 F 9 SO 2 ) 2 N - as an anion, etc.

作為一價之多原子陰離子,除MYa - 、(Rf)b PF6-b - 、Rx1 c BY4-c - 、Rx1 c GaY4-c - 、Rx2 SO3 - 、(Rx2 SO2 )3 C- 或(Rx2 SO2 )2 N- 所示之陰離子以外,可使用過鹵酸根離子(ClO4 - 、BrO4 - 等)、鹵磺酸根離子(FSO3 - 、ClSO3 - 等)、硫酸根離子(CH3 SO4 - 、CF3 SO4 - 、HSO4 - 等)、碳酸根離子(HCO3 - 、CH3 CO3 - 等)、鋁酸根離子(AlCl4 - 、AlF4 - 等)、六氟鉍酸根離子(BiF6 - )、羧酸根離子(CH3 COO- 、CF3 COO- 、C6 H5 COO- 、CH3 C6 H4 COO- 、C6 F5 COO- 、CF3 C6 H4 COO- 等)、芳基硼酸根離子(B(C6 H5 )4 - 、CH3 CH2 CH2 CH2 B(C6 H5 )3 - 等)、硫氰酸根離子(SCN- )及硝酸根離子(NO3 - )等。As much as a monovalent anion atoms, except MY a -, (Rf) b PF 6-b -, R x1 c BY 4-c -, R x1 c GaY 4-c -, R x2 SO 3 -, (R x2 SO 2) 3 C - or (2) 2 N R x2 SO - anion other than the illustrated, can be performed using halogen acid ion (ClO 4 -, BrO 4 -, etc.), a halogen acid ion (FSO 3 -, ClSO 3 -, etc.), sulfate ion (CH 3 SO 4 -, CF 3 SO 4 -, HSO 4 - , etc.), carbonate ions (HCO 3 -, CH 3 CO 3 - , etc.), aluminum ion (AlCl 4 -, AlF 4 -, etc.), hexafluoro bismuth ions (BiF 6 -), carboxylate ion (CH 3 COO -, CF 3 COO -, C 6 H 5 COO -, CH 3 C 6 H 4 COO -, C 6 F 5 COO -, CF 3 C 6 H 4 COO - , etc.), an aryl borate ion (B (C 6 H 5) 4 -, CH 3 CH 2 CH 2 CH 2 B (C 6 H 5) 3 - , etc.) , thiocyanate ion (SCN -) and nitrate ion (NO 3 -) and the like.

該等X- 中,就陽離子聚合性能之方面而言,較佳為MYa - 、(Rf)b PF6-b - 、Rx1 c BY4-c - 、Rx1 c GaY4-c - 及(Rx2 SO2 )3 C- 所示之陰離子,更佳為SbF6 - 、PF6 - 、(CF3 CF2 )3 PF3 - 、(C6 F5 )4 B- 、((CF3 )2 C6 H3 )4 B- 、(C6 F5 )4 Ga- 、((CF3 )2 C6 H3 )4 Ga- 及(CF3 SO2 )3 C- ,進而較佳為Rx1 c BY4-c -Such X - in terms of performance to the cationic polymerized, preferably MY a -, (Rf) b PF 6-b -, R x1 c BY 4-c -, R x1 c GaY 4-c - and (R x2 SO 2) 3 C - anion represented, the better is SbF 6 -, PF 6 -, (CF 3 CF 2) 3 PF 3 -, (C 6 F 5) 4 B -, ((CF 3 ) 2 C 6 H 3) 4 B -, (C 6 F 5) 4 Ga -, ((CF 3) 2 C 6 H 3) 4 Ga - and (CF 3 SO 2) 3 C -, and further preferably R x1 c BY 4-c - .

上述式(D-II)、(D-V)、及(D-VI)中,作為芳香族烴環,可例舉苯環、縮合多環式芳香族烴環等。作為縮合多環式芳香族烴環,例如較佳為縮合二環式烴環、縮合三環式芳香族烴環等縮合二環至四環式芳香族烴環。作為縮合二環式烴環,例如較佳為萘環等C8 20 縮合二環式烴環,更佳為C10 16 縮合二環式烴環。作為縮合三環式芳香族烴環,例如較佳為蒽環、菲環等。芳香族烴環較佳為苯環或萘環,更佳為苯環。In the above formulas (D-II), (DV), and (D-VI), the aromatic hydrocarbon ring may, for example, be a benzene ring or a condensed polycyclic aromatic hydrocarbon ring. As the condensed polycyclic aromatic hydrocarbon ring, for example, a condensed bicyclic to tetracyclic aromatic hydrocarbon ring such as a condensed bicyclic hydrocarbon ring or a condensed tricyclic aromatic hydrocarbon ring is preferable. As condensed bicyclic hydrocarbon rings, e.g. naphthalene ring is preferably a C 8 ~ 20 condensed bicyclic hydrocarbon rings, more preferably C 10 ~ 16 condensed bicyclic hydrocarbon ring. As the condensed tricyclic aromatic hydrocarbon ring, for example, an anthracene ring, a phenanthrene ring, etc. are preferable. The aromatic hydrocarbon ring is preferably a benzene ring or a naphthalene ring, and more preferably a benzene ring.

上述式(D-I)~(D-VI)中,作為鹵素原子,可例舉:氟原子、氯原子、溴原子、及碘原子等。In the above formulas (D-I) to (D-VI), examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom.

上述式(D-I)~(D-VI)中,作為烷基,可例舉:碳原子數1以上18以下之直鏈烷基、碳原子數3以上18以下之支鏈烷基、及碳原子數3以上18以下之環烷基等。尤其是上述式(D-I)、(D-II)、及(D-IV)~(D-VI)中,所謂可經鹵素原子取代之烷基係指烷基及經鹵素原子取代之烷基。作為經鹵素原子取代之烷基,可例舉上述直鏈烷基、支鏈烷基、或環烷基中之至少一個氫原子被鹵素原子取代之基等。作為直鏈烷基之較佳具體例,可例舉:甲基、乙基、正丙基、正丁基、正戊基、正辛基、正癸基、正十二烷基、正十四烷基、正十六烷基、及正十八烷基等。作為支鏈烷基之較佳具體例,可例舉:異丙基、異丁基、第二丁基、第三丁基、異戊基、新戊基、第三戊基、異己基、及異十八烷基等。作為環烷基之較佳具體例,可例舉:環丙基、環丁基、環戊基、環己基、及4-癸基環己基等。作為經鹵素原子取代之烷基之較佳具體例,可例舉:單氟甲基、二氟甲基、及三氟甲基等。可經鹵素原子取代之烷基中,關於RD1 、RD2 、RD9 、或RD10 ,尤佳為三氟甲基,關於RD4 、RD6 、RD11 、或RD12 ,尤佳為甲基。In the above formulas (DI) to (D-VI), examples of the alkyl group include straight chain alkyl groups having 1 to 18 carbon atoms, branched chain alkyl groups having 3 to 18 carbon atoms, and carbon atoms A cycloalkyl group having a number of 3 or more and 18 or less, etc. Especially in the above formulas (DI), (D-II), and (D-IV) to (D-VI), the so-called alkyl group substituted with a halogen atom refers to an alkyl group and an alkyl group substituted with a halogen atom. The alkyl group substituted with a halogen atom may, for example, be a group in which at least one hydrogen atom of the aforementioned linear alkyl group, branched chain alkyl group, or cycloalkyl group is substituted with a halogen atom. Preferred examples of straight-chain alkyl include: methyl, ethyl, n-propyl, n-butyl, n-pentyl, n-octyl, n-decyl, n-dodecyl, n-tetradecyl Alkyl, n-hexadecyl, and n-octadecyl, etc. Preferred specific examples of branched alkyl groups include isopropyl, isobutyl, second butyl, tertiary butyl, isopentyl, neopentyl, tertiary pentyl, isohexyl, and Isooctadecyl and the like. Preferred specific examples of cycloalkyl include cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl, 4-decylcyclohexyl, and the like. Preferred specific examples of the alkyl group substituted with a halogen atom include monofluoromethyl, difluoromethyl, and trifluoromethyl. Among the alkyl groups that may be substituted by halogen atoms, R D1 , R D2 , R D9 , or R D10 is particularly preferably a trifluoromethyl group, and R D4 , R D6 , R D11 , or R D12 is particularly preferably A base.

上述式(D-II)~(D-VI)中,作為烷氧基,可例舉碳原子數1以上18以下之直鏈或支鏈烷氧基等。作為烷氧基之較佳具體例,可例舉:甲氧基、乙氧基、丙氧基、異丙氧基、丁氧基、異丁氧基、第二丁氧基、第三丁氧基、己氧基、癸氧基、十二烷氧基、及十八烷氧基等。In the above formulas (D-II) to (D-VI), the alkoxy group may, for example, be a linear or branched alkoxy group having 1 to 18 carbon atoms. Examples of preferred alkoxy groups include: methoxy, ethoxy, propoxy, isopropoxy, butoxy, isobutoxy, second butoxy, and tertiary butoxy Group, hexyloxy, decyloxy, dodecyloxy, and octadecyloxy, etc.

上述式(D-II)~(D-VI)中,作為烷基羰基中之烷基,可例舉上述碳原子數1以上18以下之直鏈烷基、碳原子數3以上18以下之支鏈烷基或碳原子數3以上18以下之環烷基。作為烷基羰基,可例舉碳原子數2以上18以下之直鏈狀、支鏈狀或環狀之烷基羰基等。作為烷基羰基之較佳具體例,可例舉:乙醯基、丙醯基、丁醯基、2-甲基丙醯基、庚醯基、2-甲基丁醯基、3-甲基丁醯基、辛醯基、癸醯基、十二碳醯基、十八碳醯基、環戊醯基、及環己醯基等。In the above formulas (D-II) to (D-VI), examples of the alkyl group in the alkylcarbonyl group include the above-mentioned linear alkyl groups having 1 to 18 carbon atoms, and branched groups having 3 to 18 carbon atoms. Alkyl group or cycloalkyl group having 3 to 18 carbon atoms. The alkylcarbonyl group may, for example, be a linear, branched or cyclic alkylcarbonyl group having 2 to 18 carbon atoms. Preferred specific examples of the alkylcarbonyl group include: acetyl, propionyl, butanoyl, 2-methylpropanoyl, heptanoyl, 2-methylbutanoyl, 3-methylbutanoyl, octanoyl, Decanoyl, dodecanoic, octadecanoic, cyclopentanyl, and cyclohexyl and the like.

上述式(D-III)~(D-VI)中,作為芳基羰基,可例舉碳原子數7以上11以下之芳基羰基等。作為芳基羰基之較佳具體例,可例舉苯甲醯基及萘甲醯基等。In the above formulas (D-III) to (D-VI), the arylcarbonyl group may, for example, be an arylcarbonyl group having 7 or more and 11 or less carbon atoms. Preferred specific examples of the arylcarbonyl group include benzyl and naphthyl.

上述式(D-II)~(D-VI)中,作為烷氧基羰基,可例舉碳原子數2以上19以下之直鏈或支鏈烷氧基羰基等。作為烷氧基羰基之較佳具體例,可例舉:甲氧基羰基、乙氧基羰基、丙氧基羰基、異丙氧基羰基、丁氧基羰基、異丁氧基羰基、第二丁氧基羰基、第三丁氧基羰基、辛氧基羰基、十四烷氧基羰基、及十八烷氧基羰基等。In the above formulas (D-II) to (D-VI), the alkoxycarbonyl group may, for example, be a linear or branched alkoxycarbonyl group having 2 to 19 carbon atoms. Preferred specific examples of the alkoxycarbonyl group include: methoxycarbonyl, ethoxycarbonyl, propoxycarbonyl, isopropoxycarbonyl, butoxycarbonyl, isobutoxycarbonyl, butyl Oxycarbonyl, tertiary butoxycarbonyl, octyloxycarbonyl, tetradecyloxycarbonyl, and octadecyloxycarbonyl, etc.

上述式(D-III)~(D-VI)中,作為芳氧基羰基,可例舉碳原子數7以上11以下之芳氧基羰基等。作為芳氧基羰基之較佳具體例,可例舉苯氧基羰基及萘氧基羰基等。In the above formulas (D-III) to (D-VI), the aryloxycarbonyl group may, for example, be an aryloxycarbonyl group having 7 to 11 carbon atoms. Preferable specific examples of the aryloxycarbonyl group include a phenoxycarbonyl group and a naphthoxycarbonyl group.

上述式(D-III)~(D-VI)中,作為芳硫基羰基,可例舉碳原子數7以上11以下之芳硫基羰基等。作為芳硫基羰基之較佳具體例,可例舉苯硫基羰基及萘氧基硫基羰基等。In the above formulas (D-III) to (D-VI), the arylthiocarbonyl group may, for example, be an arylthiocarbonyl group having 7 or more and 11 carbon atoms. Preferable specific examples of the arylthiocarbonyl group include phenylthiocarbonyl, naphthyloxythiocarbonyl, and the like.

上述式(D-II)~(D-VI)中,作為醯氧基,可例舉碳原子數2以上19以下之直鏈或支鏈醯氧基等。作為醯氧基之較佳具體例,可例舉:乙醯氧基、乙基羰氧基、丙基羰氧基、異丙基羰氧基、丁基羰氧基、異丁基羰氧基、第二丁基羰氧基、第三丁基羰氧基、辛基羰氧基、十四烷基羰氧基、及十八烷基羰氧基等。In the above formulas (D-II) to (D-VI), examples of the anooxy group include linear or branched oxyoxy groups having 2 to 19 carbon atoms. Preferred specific examples of the acetoxy group include: acetoxy group, ethylcarbonyloxy group, propylcarbonyloxy group, isopropylcarbonyloxy group, butylcarbonyloxy group, and isobutylcarbonyloxy group. , Second butylcarbonyloxy, tertiary butylcarbonyloxy, octylcarbonyloxy, tetradecylcarbonyloxy, and octadecylcarbonyloxy, etc.

上述式(D-III)~(D-VI)中,作為芳硫基,可例舉碳原子數6以上20以下之芳硫基等。作為芳硫基之較佳具體例,可例舉:苯硫基、2-甲基苯硫基、3-甲基苯硫基、4-甲基苯硫基、2-氯苯硫基、3-氯苯硫基、4-氯苯硫基、2-溴苯硫基、3-溴苯硫基、4-溴苯硫基、2-氟苯硫基、3-氟苯硫基、4-氟苯硫基、2-羥基苯硫基、4-羥基苯硫基、2-甲氧基苯硫基、4-甲氧基苯硫基、1-萘硫基、2-萘硫基、4-[4-(苯硫基)苯甲醯基]苯硫基、4-[4-(苯硫基)苯氧基]苯硫基、4-[4-(苯硫基)苯基]苯硫基、4-(苯硫基)苯硫基、4-苯甲醯基苯硫基、4-苯甲醯基-2-氯苯硫基、4-苯甲醯基-3-氯苯硫基、4-苯甲醯基-3-甲硫基苯硫基、4-苯甲醯基-2-甲硫基苯硫基、4-(4-甲硫基苯甲醯基)苯硫基、4-(2-甲硫基苯甲醯基)苯硫基、4-(對甲基苯甲醯基)苯硫基、4-(對乙基苯甲醯基)苯硫基、4-(對異丙基苯甲醯基)苯硫基、及4-(對第三丁基苯甲醯基)苯硫基等。In the above formulas (D-III) to (D-VI), the arylthio group may, for example, be an arylthio group having 6 or more and 20 or less carbon atoms. Preferred specific examples of the arylthio group include: phenylthio, 2-methylphenylthio, 3-methylphenylthio, 4-methylphenylthio, 2-chlorophenylthio, 3 -Chlorophenylthio, 4-chlorophenylthio, 2-bromophenylthio, 3-bromophenylthio, 4-bromophenylthio, 2-fluorophenylthio, 3-fluorophenylthio, 4- Fluorophenylthio, 2-hydroxyphenylthio, 4-hydroxyphenylthio, 2-methoxyphenylthio, 4-methoxyphenylthio, 1-naphthylthio, 2-naphthylthio, 4 -[4-(phenylthio)benzyl]phenylthio, 4-[4-(phenylthio)phenoxy]phenylthio, 4-[4-(phenylthio)phenyl]benzene Sulfuryl, 4-(phenylthio)phenylthio, 4-benzylphenylthio, 4-benzyl-2-chlorophenylthio, 4-benzyl-3-chlorophenylthio Group, 4-benzyl-3-methylthiophenylthio, 4-benzyl-2-methylthiophenylthio, 4-(4-methylthiobenzyl)phenylthio , 4-(2-Methylthiobenzyl)phenylthio, 4-(p-methylbenzyl)phenylthio, 4-(p-ethylbenzyl)phenylthio, 4- (P-isopropylbenzyl)phenylthio, 4-(p-tert-butylbenzyl)phenylthio, and the like.

上述式(D-II)~(D-VI)中,作為烷硫基,可例舉碳原子數1以上18以下之直鏈或支鏈烷硫基等。作為烷硫基之較佳具體例,可例舉:甲硫基、乙硫基、丙硫基、異丙硫基、丁硫基、異丁硫基、第二丁硫基、第三丁硫基、戊硫基、異戊硫基、新戊硫基、第三戊硫基、辛硫基、癸硫基、十二烷硫基、及異十八烷硫基等。In the above formulas (D-II) to (D-VI), the alkylthio group may, for example, be a linear or branched alkylthio group having 1 to 18 carbon atoms. Preferred specific examples of alkylthio include methylthio, ethylthio, propylthio, isopropylthio, butylthio, isobutylthio, second butylthio, and third butylthio. Thiol, pentylthio, isopentylthio, neopentylthio, tertiary pentylthio, octylthio, decylthio, dodecylthio, and isooctadecylthio, etc.

上述式(D-III)~(D-VI)中,作為芳基,可例舉碳原子數6以上10以下之芳基等。作為芳基之較佳具體例,可例舉:苯基、甲苯基、二甲基苯基、及萘基等。In the above formulas (D-III) to (D-VI), the aryl group may, for example, be an aryl group having 6 or more and 10 or less carbon atoms. Preferable specific examples of the aryl group include phenyl, tolyl, dimethylphenyl, naphthyl, and the like.

上述式(D-II)中,作為雜環式脂肪族基,可例舉碳原子數2以上20以下、較佳為4以上20以下之雜環式脂肪族基等。作為雜環式脂肪族基之較佳具體例,可例舉:吡咯啶基、四氫呋喃基、四氫噻吩基、哌啶基、四氫哌喃基、四氫噻喃基、及𠰌啉基等。In the above formula (D-II), examples of the heterocyclic aliphatic group include a heterocyclic aliphatic group having 2 or more and 20 carbon atoms, preferably 4 or more and 20 or less, and the like. Preferred specific examples of the heterocyclic aliphatic group include: pyrrolidinyl, tetrahydrofuranyl, tetrahydrothienyl, piperidinyl, tetrahydropiperanyl, tetrahydrothiopyranyl, and linolinyl, etc. .

上述式(D-III)~(D-VI)中,作為雜環式芳香族基,可例舉碳原子數4以上20以下之雜環式芳香族基等。作為雜環式芳香族基之較佳具體例,可例舉:噻吩基、呋喃基、硒吩基、哌喃基、吡咯基、㗁唑基、噻唑基、吡啶基、嘧啶基、吡𠯤基、吲哚基、苯并呋喃基、苯并噻吩基、喹啉基、異喹啉基、喹㗁啉基、喹唑啉基、咔唑基、吖啶基、啡噻𠯤基、啡𠯤基、𠮿

Figure 109140475-0000-3
基、噻嗯基、啡㗁𠯤基、啡㗁噻基、𠳭烷基、異𠳭烷基、二苯并噻吩基、𠮿酮基、9-氧硫𠮿
Figure 109140475-0000-3
基、及二苯并呋喃基等。In the above formulas (D-III) to (D-VI), the heterocyclic aromatic group may, for example, be a heterocyclic aromatic group having 4 or more and 20 or less carbon atoms. Preferred specific examples of the heterocyclic aromatic group include: thienyl, furyl, selenophene, piperanyl, pyrrolyl, azolyl, thiazolyl, pyridyl, pyrimidinyl, and pyridyl , Indolyl, benzofuranyl, benzothienyl, quinolinyl, isoquinolinyl, quinolinyl, quinazolinyl, carbazolyl, acridinyl, phenothionyl, phenanthrenyl , 𠮿
Figure 109140475-0000-3
Group, thienyl group, phenanthrene group, phenanthrene group, thioalkyl group, isothioalkyl group, dibenzothienyl group, ketone group, 9-oxythio group
Figure 109140475-0000-3
Group, and dibenzofuranyl, etc.

上述式(D-III)~(D-VI)中,作為芳氧基,可例舉碳原子數6以上10以下之芳氧基等。作為芳氧基之較佳具體例,可例舉苯氧基及萘氧基等。In the above formulas (D-III) to (D-VI), the aryloxy group may, for example, be an aryloxy group having 6 to 10 carbon atoms. Preferable specific examples of the aryloxy group include a phenoxy group and a naphthoxy group.

上述式(D-II)~(D-VI)中,作為烷基亞磺醯基,可例舉碳原子數1以上18以下之直鏈或支鏈亞磺醯基等。作為烷基亞磺醯基之較佳具體例,可例舉:甲基亞磺醯基、乙基亞磺醯基、丙基亞磺醯基、異丙基亞磺醯基、丁基亞磺醯基、異丁基亞磺醯基、第二丁基亞磺醯基、第三丁基亞磺醯基、戊基亞磺醯基、異戊基亞磺醯基、新戊基亞磺醯基、第三戊基亞磺醯基、辛基亞磺醯基、及異十八烷基亞磺醯基等。In the above formulas (D-II) to (D-VI), the alkylsulfinyl group may, for example, be a linear or branched sulfinyl group having 1 to 18 carbon atoms. Preferred specific examples of the alkylsulfinyl group include: methylsulfinyl, ethylsulfinyl, propylsulfinyl, isopropylsulfinyl, and butylsulfinyl Acetyl, isobutylsulfinyl, second butylsulfinyl, tertiary butylsulfinyl, pentylsulfinyl, isopentylsulfinyl, neopentylsulfinyl Group, third pentyl sulfinyl group, octyl sulfinyl group, and isooctadecyl sulfinyl group, etc.

上述式(D-III)~(D-VI)中,作為芳基亞磺醯基,可例舉碳原子數6以上10以下之芳基亞磺醯基等。作為芳基亞磺醯基之較佳具體例,可例舉苯基亞磺醯基、甲苯基亞磺醯基、及萘基亞磺醯基等。In the above formulas (D-III) to (D-VI), the arylsulfinyl group may, for example, be an arylsulfinyl group having 6 to 10 carbon atoms. Preferable specific examples of the arylsulfinyl group include phenylsulfinyl group, tolylsulfinyl group, naphthylsulfinyl group, and the like.

上述式(D-II)~(D-VI)中,作為烷基磺醯基,可例舉碳原子數1以上18以下之直鏈或支鏈烷基磺醯基等。作為烷基磺醯基之較佳具體例,可例舉:甲基磺醯基、乙基磺醯基、丙基磺醯基、異丙基磺醯基、丁基磺醯基、異丁基磺醯基、第二丁基磺醯基、第三丁基磺醯基、戊基磺醯基、異戊基磺醯基、新戊基磺醯基、第三戊基磺醯基、辛基磺醯基、及十八烷基磺醯基等。In the above formulas (D-II) to (D-VI), examples of the alkylsulfonyl group include linear or branched alkylsulfonyl groups having 1 to 18 carbon atoms. Preferred specific examples of alkylsulfonyl groups include: methylsulfonyl, ethylsulfonyl, propylsulfonyl, isopropylsulfonyl, butylsulfonyl, isobutyl Sulfonyl, second butyl sulfonyl, tertiary butyl sulfonyl, pentyl sulfonyl, isoamyl sulfonyl, neopentyl sulfonyl, tertiary pentyl sulfonyl, octyl Sulfonyl, and octadecylsulfonyl, etc.

上述式(D-III)~(D-VI)中,作為芳基磺醯基,可例舉碳原子數6以上10以下之芳基磺醯基等。作為芳基磺醯基之較佳具體例,可例舉:苯基磺醯基、甲苯基磺醯基(tolylsulfonyl)(tosyl)、及萘基磺醯基等。In the above formulas (D-III) to (D-VI), the arylsulfonyl group may, for example, be an arylsulfonyl group having 6 to 10 carbon atoms. Preferred specific examples of the arylsulfonyl group include phenylsulfonyl group, tolylsulfonyl (tosyl), naphthylsulfonyl group, and the like.

上述式(D-II)~(D-VI)中,作為羥基(聚)伸烷氧基,可例舉HO(AO)q -所示之羥基(聚)伸烷氧基等。上述式中,AO獨立地表示伸乙氧基及/或伸丙氧基,q表示1以上5以下之整數。In the above formulas (D-II) to (D-VI), the hydroxyl (poly)alkoxyl group may, for example, be a hydroxyl(poly)alkoxyl group represented by HO(AO) q -. In the above formula, AO independently represents ethoxylate and/or propoxylate, and q represents an integer of 1 or more and 5 or less.

上述式(D-II)~(D-VI)中,作為可經取代之胺基,可例舉胺基(-NH2 )及碳原子數1以上15以下之經取代之胺基等。作為經取代之胺基之較佳具體例,可例舉:甲基胺基、二甲基胺基、乙基胺基、甲基乙基胺基、二乙基胺基、正丙基胺基、甲基正丙基胺基、乙基正丙基胺基、正丙基胺基、異丙基胺基、異丙基甲基胺基、異丙基乙基胺基、二異丙基胺基、苯基胺基、二苯基胺基、甲基苯基胺基、乙基苯基胺基、正丙基苯基胺基、及異丙基苯基胺基等。In the above formulas (D-II) to (D-VI), the substituted amino group may, for example, be an amino group (-NH 2 ) and a substituted amino group having 1 to 15 carbon atoms. Preferred specific examples of the substituted amino group include: methylamino group, dimethylamino group, ethylamino group, methylethylamino group, diethylamino group, n-propylamino group , Methyl n-propyl amino, ethyl n-propyl amino, n-propyl amino, isopropyl amino, isopropyl methyl amino, isopropyl ethyl amino, diisopropyl amine Group, phenylamino group, diphenylamino group, methylphenylamino group, ethylphenylamino group, n-propylphenylamino group, isopropylphenylamino group, etc.

上述式(D-III)及(D-IV)中,作為伸烷基,可例舉碳原子數1以上18以下之直鏈或支鏈伸烷基等。作為伸烷基之較佳具體例,可例舉:亞甲基、1,2-伸乙基、1,1-伸乙基、丙烷-1,3-二基、丙烷-1,2-二基、丙烷-1,1-二基、丙烷-2,2-二基、丁烷-1,4-二基、丁烷-1,3-二基、丁烷-1,2-二基、丁烷-1,1-二基、丁烷-2,2-二基、丁烷-2,3-二基、戊烷-1,5-二基、戊烷-1,4-二基、己烷-1,6-二基、庚烷-1,7-二基、辛烷-1,8-二基、2-乙基己烷-1,6-二基、壬烷-1,9-二基、癸烷-1,10-二基、十一烷-1,11-二基、十二烷-1,12-二基、十三烷-1,13-二基、十四烷-1,14-二基、十五烷-1,15-二基、及十六烷-1,16-二基等。In the above formulas (D-III) and (D-IV), examples of the alkylene group include linear or branched alkylene groups having 1 to 18 carbon atoms. Preferred specific examples of alkylene include: methylene, 1,2-ethylene, 1,1-ethylene, propane-1,3-diyl, propane-1,2-diyl Base, propane-1,1-diyl, propane-2,2-diyl, butane-1,4-diyl, butane-1,3-diyl, butane-1,2-diyl, Butane-1,1-diyl, butane-2,2-diyl, butane-2,3-diyl, pentane-1,5-diyl, pentane-1,4-diyl, Hexane-1,6-diyl, heptane-1,7-diyl, octane-1,8-diyl, 2-ethylhexane-1,6-diyl, nonane-1,9 -Diyl, decane-1,10-diyl, undecane-1,11-diyl, dodecane-1,12-diyl, tridecane-1,13-diyl, tetradecane -1,14-diyl, pentadecane-1,15-diyl, and hexadecane-1,16-diyl, etc.

作為上述式(D-I)所示之鋶鹽(Q)之陽離子部之具體例,可例舉以下之陽離子。作為上述式(D-I)所示之鋶鹽(Q)之陰離子部之具體例,可例舉上述X- 之說明中所例舉之陽離子等先前公知之陽離子。上述式(D-I)所示之鋶鹽(Q)可依照上述方案進行合成,藉由視需要進而進行鹽交換,可將陽離子部與所需陰離子部組合,尤佳為與Rx1 c BY4-c - (式中,Rx1 表示氫原子之至少一部分被鹵素原子或拉電子基取代之苯基,Y表示鹵素原子,c表示1以上4以下之整數)所示之陰離子之組合。The following cations can be mentioned as specific examples of the cation part of the amenium salt (Q) represented by the above formula (DI). As a specific example of the anion part of the sulfonium salt (Q) represented by the above formula (DI), a conventionally known cation such as the cation exemplified in the description of X-above can be exemplified. The sulfonium salt (Q) represented by the above formula (DI) can be synthesized according to the above scheme, and by performing salt exchange as necessary, the cation part can be combined with the desired anion part, especially with R x1 c BY 4- c - (wherein, R x1 represents a hydrogen atom is substituted with at least a portion of the electron-withdrawing group or a halogen atom, a phenyl group, Y represents a halogen atom, c denotes an integer of from 1 to 4) a combination of an anion FIG.

[化25]

Figure 02_image049
[化25]
Figure 02_image049

上述較佳之陽離子部之群中,更佳為下述式所示之陽離子部。 [化26]

Figure 02_image051
Among the above-mentioned preferable group of cation parts, the cation part represented by the following formula is more preferable. [化26]
Figure 02_image051

樹脂組合物中之鎓鹽(D1)之含量只要使樹脂組合物之硬化良好地進行,則並無特別限定。就易於使樹脂組合物良好地硬化之方面而言,樹脂組合物中之鎓鹽(D1)之含量典型而言相對於環氧化合物及/或氧雜環丁烷化合物等要藉由鎓鹽(D1)進行硬化之材料100質量份,而為0.01質量份以上50質量份以上,較佳為0.01質量份以上30質量份以下,更佳為0.01質量份以上20質量份以下,進而較佳為0.05質量份以上15質量份以下,尤佳為1質量份以上10質量份以下。The content of the onium salt (D1) in the resin composition is not particularly limited as long as the curing of the resin composition proceeds well. In terms of easy curing of the resin composition, the content of the onium salt (D1) in the resin composition is typically based on the onium salt (D1) relative to the epoxy compound and/or oxetane compound. D1) 100 parts by mass of the material to be hardened, but 0.01 parts by mass or more and 50 parts by mass or more, preferably 0.01 parts by mass or more and 30 parts by mass or less, more preferably 0.01 parts by mass or more and 20 parts by mass or less, and more preferably 0.05 Part by mass or more and 15 parts by mass or less, more preferably 1 part by mass or more and 10 parts by mass or less.

・環氧化合物或氧雜環丁烷化合物用硬化劑(D2) 環氧化合物或氧雜環丁烷化合物用硬化劑(D2)(以下,亦記作硬化劑(D2))為上述鎓鹽(D1)以外之硬化劑,可自先前公知之硬化劑中適當選擇。硬化劑(D2)藉由與環氧化合物或氧雜環丁烷化合物一起使用,有助於利用加熱之硬化。・Epoxy compound or oxetane compound hardener (D2) The curing agent for epoxy compound or oxetane compound (D2) (hereinafter, also referred to as curing agent (D2)) is a curing agent other than the above-mentioned onium salt (D1), and can be appropriately selected from previously known curing agents . The hardener (D2) is used together with epoxy compounds or oxetane compounds to help harden by heating.

作為硬化劑(D2),例如可例舉:酚系硬化劑、酸酐系硬化劑、多元胺系硬化劑、觸媒型硬化劑。 酚系硬化劑及酸酐系硬化劑之使用量相對於樹脂組合物中之環氧化合物及氧雜環丁烷化合物之合計量100質量份,較佳為1質量份以上200質量份以下,更佳為50質量份以上150質量份以下,尤佳為80質量份以上120質量份以下。酚系硬化劑及酸酐系硬化劑分別可單獨使用,亦可組合兩種以上而使用。 多元胺系硬化劑之使用量相對於樹脂組合物之環氧化合物及氧雜環丁烷化合物之合計量100質量份,較佳為0.1質量份以上50質量份以下,更佳為0.5質量份以上30質量份以下,尤佳為1質量份15質量份。該等多元胺系硬化劑可單獨使用,亦可組合兩種以上而使用。 觸媒型硬化劑之使用量相對於樹脂組合物之環氧化合物及氧雜環丁烷化合物之合計量100質量份,較佳為1質量份以上100質量份以下,更佳為1質量份以上80質量份以下,尤佳為1質量份以上50質量份以下。該等觸媒型硬化劑可單獨使用,亦可組合兩種以上而使用。As the hardening agent (D2), for example, a phenol hardening agent, an acid anhydride hardening agent, a polyamine hardening agent, and a catalyst hardening agent may be mentioned. The usage amount of phenolic hardener and acid anhydride hardener is 100 parts by mass of the total amount of epoxy compound and oxetane compound in the resin composition, preferably 1 part by mass or more and 200 parts by mass or less, more preferably It is 50 parts by mass or more and 150 parts by mass or less, and more preferably 80 parts by mass or more and 120 parts by mass or less. The phenolic curing agent and the acid anhydride curing agent may be used alone, respectively, or two or more of them may be used in combination. The usage amount of the polyamine-based hardener is relative to 100 parts by mass of the total amount of the epoxy compound and the oxetane compound of the resin composition, preferably 0.1 part by mass or more and 50 parts by mass or less, more preferably 0.5 part by mass or more 30 parts by mass or less, particularly preferably 1 part by mass and 15 parts by mass. These polyamine-based hardeners may be used alone or in combination of two or more kinds. The usage amount of the catalyst-type hardener is relative to 100 parts by mass of the total amount of epoxy compound and oxetane compound of the resin composition, preferably 1 part by mass or more and 100 parts by mass or less, more preferably 1 part by mass or more 80 parts by mass or less, particularly preferably 1 part by mass or more and 50 parts by mass or less. These catalyst-type hardeners may be used alone or in combination of two or more kinds.

・藉由熱會產生鹼成分之硬化劑(D3) 作為藉由熱會產生鹼成分之硬化劑(D3),可無特別限定地使用先前用作熱鹼產生劑之化合物。 例如,可使用2-苄基-2-二甲基胺基-1-(4-𠰌啉基苯基)-丁烷-1-酮作為藉由熱會產生鹼成分之硬化劑。再者,2-苄基-2-二甲基胺基-1-(4-𠰌啉基苯基)-丁烷-1-酮於光之作用下亦會產生鹼。・A hardening agent (D3) that generates alkali components by heat As the hardener (D3) that generates an alkali component by heat, a compound previously used as a thermal alkali generator can be used without particular limitation. For example, 2-benzyl-2-dimethylamino-1-(4-𠰌olinylphenyl)-butan-1-one can be used as a hardener that generates an alkali component by heat. Furthermore, 2-benzyl-2-dimethylamino-1-(4-𠰌olinylphenyl)-butan-1-one will also produce a base under the action of light.

又,藉由加熱會產生下式(d1)所示之咪唑化合物之化合物(以下,亦記作熱咪唑產生劑)亦適宜地用作硬化劑。 [化27]

Figure 02_image053
(式(d1)中,Rd1 、Rd2 及Rd3 分別獨立地表示氫原子、鹵素原子、羥基、巰基、硫基、矽烷基、矽烷醇基、硝基、亞硝基、膦基、磺酸根基、氧膦基、膦酸根基、或有機基)In addition, a compound that generates an imidazole compound represented by the following formula (d1) by heating (hereinafter, also referred to as a thermal imidazole generator) is also suitably used as a hardening agent. [化27]
Figure 02_image053
(Formula (d1) of, R d1, R d2 and R d3 each independently represent a hydrogen atom, a halogen atom, a hydroxyl group, a mercapto group, thio, silicon alkyl, silicon alkoxide group, a nitro group, a nitroso group, a phosphino group, a sulfo (Acid radical, phosphinyl, phosphonate, or organic group)

作為Rd1 、Rd2 及Rd3 中之有機基,可例舉:烷基、烯基、環烷基、環烯基、芳基、芳烷基等。該有機基可於該有機基中含有雜原子等烴基以外之鍵或取代基。又,該有機基可為直鏈狀、支鏈狀、環狀之任一種。該有機基通常為一價,但於形成環狀結構之情形時等,可成為二價以上之有機基。As R d1, R d2 and R d3, and the organic group may include: alkyl, alkenyl, cycloalkyl, cycloalkenyl, aryl, aralkyl and the like. The organic group may contain a bond or substituent other than a hydrocarbon group such as a hetero atom in the organic group. In addition, the organic group may be any of linear, branched, and cyclic. This organic group is usually monovalent, but in the case of forming a cyclic structure, etc., it may become an organic group having a valence of two or more.

Rd1 及Rd2 可讓該等鍵結而形成環狀結構,亦可進而包含雜原子之鍵。作為環狀結構,可例舉雜環烷基、雜芳基等,亦可為稠環。R d1 and R d2 may allow these bonds to form a cyclic structure, and may further include heteroatom bonds. As a cyclic structure, a heterocycloalkyl group, a heteroaryl group, etc. are mentioned, and it may be a condensed ring.

Rd1 、Rd2 及Rd3 之有機基中所含之鍵只要無損本發明之效果,則並無特別限定,有機基可包含含有氧原子、氮原子、矽原子等雜原子之鍵。作為含有雜原子之鍵之具體例,可例舉:醚鍵、硫醚鍵、羰基鍵、硫羰基鍵、酯鍵、醯胺鍵、胺基甲酸酯鍵、亞胺基鍵(-N=C(-Rd0 )-、-C(=NRd0 )-:Rd0 表示氫原子或有機基)、碳酸酯鍵、磺醯基鍵、亞磺醯基鍵、偶氮鍵等。R d1, R d2 and the key contained in the organic group of R d3 as long as effects of the present invention is not particularly limited, and may include an organic group containing a hetero atom bond of an oxygen atom, a nitrogen atom, silicon atom. Specific examples of bonds containing heteroatoms include ether bonds, thioether bonds, carbonyl bonds, thiocarbonyl bonds, ester bonds, amide bonds, urethane bonds, imino bonds (-N= C(-R d0 )-, -C(=NR d0 )-: R d0 represents a hydrogen atom or an organic group), a carbonate bond, a sulfonyl bond, a sulfinyl bond, an azo bond, and the like.

作為Rd1 、Rd2 及Rd3 之有機基可具有之含有雜原子之鍵,就咪唑化合物之耐熱性之觀點而言,較佳為醚鍵、硫醚鍵、羰基鍵、硫羰基鍵、酯鍵、醯胺鍵、胺基甲酸酯鍵、亞胺基鍵(-N=C(-Rd0 )-、-C(=NRd0 )-:Rd0 表示氫原子或有機基)、碳酸酯鍵、磺醯基鍵、亞磺醯基鍵。As R d1, R d2 and R d3 may have an organic group of the bond-containing hetero atoms, in view of heat resistance of the imidazole compound, it is preferably an ether bond, a thioether bond, a carbonyl bond, sulfur-carbonyl bond, an ester Bond, amide bond, urethane bond, imino bond (-N=C(-R d0 )-, -C(=NR d0 )-: R d0 represents a hydrogen atom or an organic group), carbonate Bond, sulfonyl bond, sulfinyl bond.

於Rd1 、Rd2 及Rd3 之有機基為烴基以外之取代基之情形時,Rd1 、Rd2 及Rd3 只要無損本發明之效果,則並無特別限定。作為Rd1 、Rd2 及Rd3 之具體例,可例舉:鹵素原子、羥基、巰基、硫基、氰基、異氰基、氰酸基、異氰酸基、氰硫基、異氰硫基、矽烷基、矽烷醇基、烷氧基、烷氧基羰基、胺甲醯基、胺硫甲醯基、硝基、亞硝基、羧酸酯基、醯基、醯氧基、亞磺酸基、磺酸根基、膦基、氧膦基、膦酸根基、烷基醚基、烯基醚基、烷基硫醚基、烯基硫醚基、芳基醚基、芳基硫醚基等。上述取代基中所含之氫原子可被烴基取代。又,上述取代基中所含之烴基可為直鏈狀、支鏈狀、及環狀之任一種。When in the R d1, R d2 and R d3 is an organic group other than the substituent of the hydrocarbon group of the case, R d1, R d2 and R d3 as long as the effects of the present invention, is not particularly limited. Specific examples of R d1, R d2 and R d3 of, include: a halogen atom, a hydroxyl, mercapto, thio, cyano, isocyano, isocyanato groups, isocyanato, thiocyanato, isocyanato sulfur Group, silyl group, silanol group, alkoxy group, alkoxycarbonyl group, carbamethan group, carbothiocarbamate group, nitro group, nitroso group, carboxylate group, acyl group, acyloxy group, sulfinic group Acid group, sulfonate group, phosphine group, phosphinyl group, phosphonate group, alkyl ether group, alkenyl ether group, alkyl sulfide group, alkenyl sulfide group, aryl ether group, aryl sulfide group Wait. The hydrogen atom contained in the above substituent may be substituted by a hydrocarbon group. Moreover, the hydrocarbon group contained in the said substituent may be any of linear, branched, and cyclic.

作為Rd1 、Rd2 及Rd3 ,較佳為氫原子、碳原子數1以上12以下之烷基、碳原子數6以上12以下之芳基、碳原子數1以上12以下之烷氧基、及鹵素原子,更佳為氫原子。R d1 , R d2 and R d3 are preferably hydrogen atoms, alkyl groups having 1 to 12 carbon atoms, aryl groups having 6 to 12 carbon atoms, alkoxy groups having 1 to 12 carbon atoms, And a halogen atom, more preferably a hydrogen atom.

熱咪唑產生劑只要為可藉由加熱而產生上述式(d1)所示之咪唑化合物之化合物,則並無特別限定。關於先前調配於各種組合物中之於熱之作用下會產生胺之化合物(熱鹼產生劑),藉由將源自加熱時產生之胺之骨架置換為源自上述式(d1)所示之咪唑化合物之骨架,而獲得用作熱咪唑產生劑之化合物。The thermal imidazole generator is not particularly limited as long as it is a compound that can generate the imidazole compound represented by the above formula (d1) by heating. Regarding the compound that produces amine under the action of heat (thermal base generator) previously formulated in various compositions, the skeleton derived from the amine produced upon heating is replaced with the one derived from the above-mentioned formula (d1) The skeleton of the imidazole compound is used to obtain a compound used as a thermal imidazole generator.

作為較佳之熱咪唑產生劑,可例舉下述式(d2)所示之化合物。 [化28]

Figure 02_image055
(式(d2)中,Rd1 、Rd2 及Rd3 分別獨立地表示氫原子、鹵素原子、羥基、巰基、硫基、矽烷基、矽烷醇基、硝基、亞硝基、磺酸根基、膦基、氧膦基、膦酸根基、或有機基。Rd4 及Rd5 分別獨立地表示氫原子、鹵素原子、羥基、巰基、硫基、矽烷基、矽烷醇基、硝基、亞硝基、亞磺酸基、磺酸基、磺酸根基、膦基、氧膦基、膦酸基、膦酸根基、或有機基。Rd6 、Rd7 、Rd8 、Rd9 及Rd10 分別獨立地表示氫原子、鹵素原子、羥基、巰基、硫基、矽烷基、矽烷醇基、硝基、亞硝基、亞磺酸基、磺酸基、磺酸根基、膦基、氧膦基、膦酸基、膦酸根基、胺基、銨基、或有機基。Rd6 、Rd7 、Rd8 、Rd9 及Rd10 可讓該等之兩個以上鍵結而形成環狀結構,亦可包含雜原子之鍵)As a preferable thermal imidazole generator, a compound represented by the following formula (d2) can be exemplified. [化28]
Figure 02_image055
(In the formula (d2), R d1, R d2 and R d3 each independently represent a hydrogen atom, a halogen atom, a hydroxyl group, a mercapto group, thio, silicon alkyl, silicon alkanoyl, nitro, nitroso, sulfonate, Phosphine, phosphinyl, phosphonate, or organic group. R d4 and R d5 each independently represent a hydrogen atom, a halogen atom, a hydroxyl group, a mercapto group, a thio group, a silyl group, a silanol group, a nitro group, and a nitroso group , sulfinic acid group, a sulfonic acid group, a sulfonate, a phosphino group, a phosphinyl group, phosphonic acid, phosphonate, or an organic group .R d6, R d7, R d8 , R d9 and R d10 are each independently Represents hydrogen atom, halogen atom, hydroxyl group, mercapto group, thio group, silyl group, silanol group, nitro group, nitroso group, sulfinic acid group, sulfonic acid group, sulfonate group, phosphine group, phosphinyl group, phosphonic acid group, a phosphonate, an amine, an ammonium group, or an organic group .R d6, R d7, R d8 , R d9 and R d10 allows two or more of these bonds to form a cyclic structure may also include hetero Atomic bond)

式(d2)中,Rd1 、Rd2 及Rd3 與關於式(d1)所說明之Rd1 、Rd2 及Rd3 相同。In the illustrated, R d1, R d2 and R d3 of formula (d2) with respect to the formula (d1) R d1, R d2, and the same R d3.

式(d2)中,Rd4 及Rd5 分別獨立地表示氫原子、鹵素原子、羥基、巰基、硫基、矽烷基、矽烷醇基、硝基、亞硝基、亞磺酸基、磺酸基、磺酸根基、膦基、氧膦基、膦酸基、膦酸根基、或有機基。In formula (d2), R d4 and R d5 each independently represent a hydrogen atom, a halogen atom, a hydroxyl group, a mercapto group, a thio group, a silyl group, a silanol group, a nitro group, a nitroso group, a sulfinic acid group, and a sulfonic acid group. , Sulfonate group, phosphine group, phosphinyl group, phosphonate group, phosphonate group, or organic group.

作為Rd4 及Rd5 中之有機基,可例舉關於Rd1 、Rd2 及Rd3 所例示之有機基。該有機基與Rd1 、Rd2 及Rd3 之情形同樣地可於該有機基中含有雜原子。又,該有機基可為直鏈狀、支鏈狀、環狀之任一種。As R d4 and R d5 in the organic group may be an organic group on R d1, R d2 and R d3 of exemplified. The organic group and R d1, R d2 and R d3 case the same manner as in the organic group may contain heteroatoms. In addition, the organic group may be any of linear, branched, and cyclic.

以上中,作為Rd4 及Rd5 ,分別獨立地較佳為氫原子、碳原子數1以上10以下之烷基、碳原子數4以上13以下之環烷基、碳原子數4以上13以下之環烯基、碳原子數7以上16以下之芳氧基烷基、碳原子數7以上20以下之芳烷基、具有氰基之碳原子數2以上11以下之烷基、具有羥基之碳原子數1以上10以下之烷基、碳原子數1以上10以下之烷氧基、碳原子數2以上11以下之醯胺基、碳原子數1以上10以下之烷硫基、碳原子數1以上10以下之醯基、碳原子數2以上11以下之酯基(-COORd 、-OCORd :Rd 表示烴基)、碳原子數6以上20以下之芳基、經供電子性基及/或吸電子性基取代之碳原子數6以上20以下之芳基、經供電子性基及/或吸電子性基取代之苄基、氰基、甲硫基。更佳為Rd4 及Rd5 之兩者為氫原子,或Rd4 為甲基,Rd5 為氫原子。 Among the above, as R d4 and R d5 , each independently preferably is a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 4 to 13 carbon atoms, and a carbon atom of 4 to 13 or less. Cycloalkenyl groups, aryloxyalkyl groups with 7 to 16 carbon atoms, aralkyl groups with 7 to 20 carbon atoms, cyano groups with 2 to 11 carbon atoms, and carbon atoms with hydroxyl groups Alkyl groups with 1 to 10, alkoxy groups with 1 to 10 carbon atoms, amide groups with 2 to 11 carbon atoms, alkylthio groups with 1 to 10 carbon atoms, and 1 or more carbon atoms An acyl group with 10 or less, an ester group with 2 to 11 carbon atoms (-COOR d , -OCOR d : R d represents a hydrocarbon group), an aryl group with 6 to 20 carbon atoms, an electron-donating group, and/or An aryl group with 6 or more and 20 carbon atoms substituted with an electron withdrawing group, benzyl, cyano, and methylthio groups substituted with an electron donating group and/or an electron withdrawing group. More preferably , both of Rd4 and Rd5 are hydrogen atoms, or Rd4 is a methyl group, and Rd5 is a hydrogen atom.

式(d2)中,Rd6 、Rd7 、Rd8 、Rd9 及Rd10 分別獨立地表示氫原子、鹵素原子、羥基、巰基、硫基、矽烷基、矽烷醇基、硝基、亞硝基、亞磺酸基、磺酸基、磺酸根基、膦基、氧膦基、膦酸基、膦酸根基、胺基、銨基、或有機基。In formula (d2), Rd6 , Rd7 , Rd8 , Rd9, and Rd10 each independently represent a hydrogen atom, a halogen atom, a hydroxyl group, a mercapto group, a thio group, a silyl group, a silanol group, a nitro group, and a nitroso group. , Sulfinic acid group, sulfonic acid group, sulfonate group, phosphine group, phosphinyl group, phosphonic acid group, phosphonate group, amine group, ammonium group, or organic group.

作為Rd6 、Rd7 、Rd8 、Rd9 及Rd10 中之有機基,可例舉Rd1 、Rd2 及Rd3 中所例示之有機基。該有機基與Rd1 及Rd2 之情形同樣地可於該有機基中含有雜原子等烴基以外之鍵或取代基。又,該有機基可為直鏈狀、支鏈狀、環狀之任一種。As R d6, R d7, R d8 , R d9 and R d10 in the organic group include R d1, R d2 and R d3, and an organic group shown by the embodiment. The case where the organic radical R and R d1 and D2 in the same manner as the organic group may contain a key other than the hetero atom or a hydrocarbon substituent group. In addition, the organic group may be any of linear, branched, and cyclic.

Rd6 、Rd7 、Rd8 、Rd9 及Rd10 可讓該等之兩個以上鍵結而形成環狀結構,亦可包含雜原子之鍵。作為環狀結構,可例舉雜環烷基、雜芳基等,亦可為稠環。例如,Rd6 、Rd7 、Rd8 、Rd9 及Rd10 可讓該等之兩個以上鍵結,共有Rd6 、Rd7 、Rd8 、Rd9 及Rd10 所鍵結之苯環之原子而形成萘、蒽、菲、茚等稠環。R d6 , Rd7 , Rd8 , Rd9 and Rd10 can allow two or more of these to be bonded to form a cyclic structure, and may also include a heteroatom bond. As a cyclic structure, a heterocycloalkyl group, a heteroaryl group, etc. are mentioned, and it may be a condensed ring. For example, R d6, R d7, R d8 , R d9 and R d10 allows two or more of these bonding, are bonded 5,977 R d6, R d7, R d8 , R d9 atoms of the phenyl ring, and R d10 The formation of naphthalene, anthracene, phenanthrene, indene and other condensed rings.

以上中,作為Rd6 、Rd7 、Rd8 、Rd9 及Rd10 ,分別獨立地較佳為氫原子、碳原子數1以上10以下之烷基、碳原子數4以上13以下之環烷基、碳原子數4以上13以下之環烯基、碳原子數7以上16以下之芳氧基烷基、碳原子數7以上20以下之芳烷基、具有氰基之碳原子數2以上11以下之烷基、具有羥基之碳原子數1以上10以下之烷基、碳原子數1以上10以下之烷氧基、碳原子數2以上11以下之醯胺基、碳原子數1以上10以下之烷硫基、碳原子數1以上10以下之醯基、碳原子數2以上11以下之酯基、碳原子數6以上20以下之芳基、經供電子性基及/或吸電子性基取代之碳原子數6以上20以下之芳基、經供電子性基及/或吸電子性基取代之苄基、氰基、甲硫基、硝基。Among the above, as Rd6 , Rd7 , Rd8 , Rd9 and Rd10 , each independently is preferably a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, and a cycloalkyl group having 4 to 13 carbon atoms , Cycloalkenyl groups with 4 to 13 carbon atoms, aryloxyalkyl groups with 7 to 16 carbon atoms, aralkyl groups with 7 to 20 carbon atoms, and cyano groups with 2 to 11 carbon atoms Alkyl groups with hydroxy groups having 1 to 10 carbon atoms, alkoxy groups with 1 to 10 carbon atoms, amide groups with 2 to 11 carbon atoms, and 1 to 10 carbon atoms Alkylthio groups, acyl groups with 1 to 10 carbon atoms, ester groups with 2 to 11 carbon atoms, aryl groups with 6 to 20 carbon atoms, substituted by electron donating groups and/or electron withdrawing groups Aryl groups with 6 to 20 carbon atoms, benzyl groups, cyano groups, methylthio groups, and nitro groups substituted with electron-donating groups and/or electron-withdrawing groups.

又,作為Rd6 、Rd7 、Rd8 、Rd9 及Rd10 ,亦較佳為如下情形:該等之兩個以上鍵結,共有Rd6 、Rd7 、Rd8 、Rd9 及Rd10 所鍵結之苯環之原子而形成萘、蒽、菲、茚等稠環。In addition, as Rd6 , Rd7 , Rd8 , Rd9, and Rd10 , it is also preferable to have the following situation: these two or more bondings have a total of Rd6 , Rd7, Rd8 , Rd9, and Rd10 . The bonded benzene ring atoms form naphthalene, anthracene, phenanthrene, indene and other condensed rings.

上述式(d2)所示之化合物中,較佳為下述式(d3)所示之化合物。 [化29]

Figure 02_image057
(式(d3)中,Rd1 、Rd2 及Rd3 與式(d1)及(d2)同義。Rd4 ~Rd9 與式(d2)同義。Rd11 表示氫原子或有機基。Rd6 及Rd7 不為羥基。Rd6 、Rd7 、Rd8 及Rd9 可讓該等之兩個以上鍵結而形成環狀結構,亦可包含雜原子之鍵)Among the compounds represented by the above formula (d2), the compound represented by the following formula (d3) is preferred. [化29]
Figure 02_image057
(In the formula (d3), R d1, R d2 and R d3 of formula (d1) and (d2) .R d4 ~ R d9 is synonymous with Formula (d2) synonymous .R d11 represents a hydrogen atom or an organic group and .R d6 R d7 is not a hydroxyl group. R d6 , R d7 , R d8 and R d9 can allow two or more of these to be bonded to form a cyclic structure, and may also include heteroatom bonds)

式(d3)所示之化合物由於具有取代基-O-Rd11 ,故而對於有機溶劑之溶解性優異。Since the compound represented by the formula (d3) has the substituent -OR d11 , it has excellent solubility in organic solvents.

式(d3)中,Rd11 為氫原子或有機基。於Rd11 為有機基之情形時,作為有機基,可例舉Rd1 、Rd2 及Rd3 中所例示之有機基。該有機基可於該有機基中含有雜原子。又,該有機基可為直鏈狀、支鏈狀、環狀之任一種。作為Rd11 ,較佳為氫原子、碳原子數1以上12以下之烷基或烷氧基烷基,更佳為甲基、乙基、正丙基、異丙基、正丁基、異丁基、第三丁基、甲氧基甲基、乙氧基甲基、甲氧基乙基、乙氧基乙基、丙氧基甲基、丁氧基甲基。In formula (d3), R d11 is a hydrogen atom or an organic group. In the case when R d11 is an organic group, the organic group as, include R d1, R d2 and R d3, and an organic group shown by the embodiment. The organic group may contain heteroatoms in the organic group. In addition, the organic group may be any of linear, branched, and cyclic. R d11 is preferably a hydrogen atom, an alkyl group or an alkoxyalkyl group having 1 to 12 carbon atoms, more preferably methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl Group, tertiary butyl, methoxymethyl, ethoxymethyl, methoxyethyl, ethoxyethyl, propoxymethyl, butoxymethyl.

以下示出作為熱咪唑產生劑尤佳之化合物之具體例。 [化30]

Figure 02_image059
Specific examples of compounds that are particularly preferred as thermal imidazole generators are shown below. [化30]
Figure 02_image059

・有機溶劑(S) 樹脂組合物典型而言可出於調整塗佈性之目的等而含有有機溶劑(S)。作為有機溶劑(S),例如可例舉:乙二醇單甲醚、乙二醇單乙醚、乙二醇正丙醚、乙二醇單正丁醚、二乙二醇單甲醚、二乙二醇單乙醚、二乙二醇單正丙醚、二乙二醇單正丁醚、三乙二醇單甲醚、三乙二醇單乙醚、丙二醇單甲醚、丙二醇單乙醚、丙二醇單正丙醚、丙二醇單正丁醚、二丙二醇單甲醚、二丙二醇單乙醚、二丙二醇單正丙醚、二丙二醇單正丁醚、三丙二醇單甲醚、三丙二醇單乙醚等(聚)伸烷基二醇單烷基醚類;乙二醇單甲醚乙酸酯、乙二醇單乙醚乙酸酯、二乙二醇單甲醚乙酸酯、二乙二醇單乙醚乙酸酯、丙二醇單甲醚乙酸酯、丙二醇單乙醚乙酸酯等(聚)伸烷基二醇單烷基醚乙酸酯類;二乙二醇二甲醚、二乙二醇甲基乙基醚、二乙二醇二乙醚、四氫呋喃等其他醚類;甲基乙基酮、環己酮、2-庚酮、3-庚酮等酮類;2-羥基丙酸甲酯、2-羥基丙酸乙酯等乳酸烷基酯類;2-羥基-2-甲基丙酸乙酯、3-甲氧基丙酸甲酯、3-甲氧基丙酸乙酯、3-乙氧基丙酸甲酯、3-乙氧基丙酸乙酯、乙氧基乙酸乙酯、羥基乙酸乙酯、2-羥基-3-甲基丁酸甲酯、乙酸3-甲氧基丁酯、乙酸3-甲基-3-甲氧基丁酯、丙酸3-甲基-3-甲氧基丁酯、乙酸乙酯、乙酸正丙酯、乙酸異丙酯、乙酸正丁酯、乙酸異丁酯、甲酸正戊酯、乙酸異戊酯、丙酸正丁酯、丁酸乙酯、丁酸正丙酯、丁酸異丙酯、丁酸正丁酯、丙酮酸甲酯、丙酮酸乙酯、丙酮酸正丙酯、乙醯乙酸甲酯、乙醯乙酸乙酯、2-側氧丁酸乙酯等其他酯類;甲苯、二甲苯等芳香族烴類;N-甲基吡咯啶酮、N,N-二甲基甲醯胺、N,N-二甲基乙醯胺等醯胺類等。該等溶劑可單獨使用,亦可組合兩種以上而使用。・Organic solvent (S) Typically, the resin composition may contain an organic solvent (S) for the purpose of adjusting coatability. As the organic solvent (S), for example, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol n-propyl ether, ethylene glycol mono-n-butyl ether, diethylene glycol monomethyl ether, diethylene two Alcohol monoethyl ether, diethylene glycol mono-n-propyl ether, diethylene glycol mono-n-butyl ether, triethylene glycol monomethyl ether, triethylene glycol monoethyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol mono-n-propyl Ether, propylene glycol mono-n-butyl ether, dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, dipropylene glycol mono-n-propyl ether, dipropylene glycol mono-n-butyl ether, tripropylene glycol monomethyl ether, tripropylene glycol monoethyl ether, etc. (poly)alkylene Glycol monoalkyl ethers; ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, propylene glycol mono Methyl ether acetate, propylene glycol monoethyl ether acetate and other (poly) alkylene glycol monoalkyl ether acetates; diethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether, diethylene two Alcohol diethyl ether, tetrahydrofuran and other ethers; methyl ethyl ketone, cyclohexanone, 2-heptanone, 3-heptanone and other ketones; 2-hydroxypropionic acid methyl ester, 2-hydroxypropionic acid ethyl ester and other lactic acid Alkyl esters; ethyl 2-hydroxy-2-methylpropionate, methyl 3-methoxypropionate, ethyl 3-methoxypropionate, methyl 3-ethoxypropionate, 3- Ethoxy ethyl propionate, ethyl ethoxy acetate, ethyl hydroxyacetate, methyl 2-hydroxy-3-methylbutyrate, 3-methoxybutyl acetate, 3-methyl-3-acetic acid Methoxybutyl ester, 3-methyl-3-methoxybutyl propionate, ethyl acetate, n-propyl acetate, isopropyl acetate, n-butyl acetate, isobutyl acetate, n-pentyl formate, Isoamyl acetate, n-butyl propionate, ethyl butyrate, n-propyl butyrate, isopropyl butyrate, n-butyl butyrate, methyl pyruvate, ethyl pyruvate, n-propyl pyruvate, Other esters such as methyl acetylacetate, ethyl acetylacetate, ethyl 2-oxobutyrate; aromatic hydrocarbons such as toluene and xylene; N-methylpyrrolidone, N,N-dimethyl Amides such as formamide and N,N-dimethylacetamide. These solvents may be used alone or in combination of two or more kinds.

有機溶劑(S)之使用量可根據樹脂組合物之用途而適當決定。作為有機溶劑(S)之使用量,舉一例而言,可例舉樹脂組合物之固形物成分濃度為1質量%以上50質量%以下之範圍之量。The use amount of the organic solvent (S) can be appropriately determined according to the use of the resin composition. As an example of the usage amount of the organic solvent (S), the solid content concentration of the resin composition may be an amount in the range of 1% by mass to 50% by mass.

・其他成分 樹脂組合物中,可視需要含有上述成分以外之其他各種添加劑。具體而言,可例示:分散助劑、填充劑、填料、密接促進劑、抗氧化劑、紫外線吸收劑、抗凝聚劑、熱聚合抑制劑、消泡劑、界面活性劑等。・Other ingredients The resin composition may optionally contain various additives other than the above-mentioned components. Specifically, examples thereof include dispersion aids, fillers, fillers, adhesion promoters, antioxidants, ultraviolet absorbers, anti-agglomeration agents, thermal polymerization inhibitors, defoamers, surfactants, and the like.

樹脂組合物可包含不與(甲基)丙烯酸樹脂(A-I)反應之含有環氧基之環狀矽氧烷化合物(A-II)。就易於形成相對介電常數較低之硬化物之方面而言,樹脂組合物較佳為不包含含有環氧基之環狀矽氧烷化合物。於樹脂組合物包含含有環氧基之環狀矽氧烷化合物(A-II)之情形時,其含量相對於除有機溶劑(S)之質量以外之樹脂組合物之質量,較佳為40質量%以下,更佳為10質量%以下,進而較佳為1質量%以下。The resin composition may include an epoxy group-containing cyclic silicone compound (A-II) that does not react with the (meth)acrylic resin (A-I). In terms of easy formation of a cured product with a low relative permittivity, the resin composition preferably does not contain an epoxy group-containing cyclic siloxane compound. When the resin composition contains the epoxy-containing cyclic silicone compound (A-II), its content is preferably 40 mass relative to the mass of the resin composition excluding the mass of the organic solvent (S) % Or less, more preferably 10% by mass or less, and still more preferably 1% by mass or less.

(第2樹脂組合物) 第2樹脂組合物含有上述矽氧烷改質(甲基)丙烯酸樹脂(A1)、光聚合性單體(B)、及光聚合起始劑(C)。其中,矽氧烷改質(甲基)丙烯酸樹脂(A1)含有包含具有鹼可溶性基之結構單元之(甲基)丙烯酸樹脂作為鹼溶性樹脂。作為鹼可溶性基,並無特別限定,可例舉:羧基、磺酸基、磷酸基、及酚性羥基等。 第2樹脂組合物藉由含有光聚合性單體(B)與光聚合起始劑(C),利用曝光會硬化。另一方面,未曝光之狀態之第2樹脂組合物由於含有包含具有鹼可溶性基之結構單元之矽氧烷改質(甲基)丙烯酸樹脂(A1),故而對於鹼性顯影液為可溶。因此,於使用第2樹脂組合物之情形時,可使用負型之光罩利用光微影法進行硬化膜之圖案化。 第2樹脂組合物由於含有具有環氧基之矽氧烷改質(甲基)丙烯酸樹脂(A1),故而利用加熱亦可硬化。第2樹脂組合物可不含環氧化合物用硬化劑。其原因在於,在矽氧烷改質(甲基)丙烯酸樹脂所具有之酚性羥基、羧基等鹼可溶性基之作用下會進行環氧基之硬化反應。(Second resin composition) The second resin composition contains the aforementioned silicone-modified (meth)acrylic resin (A1), a photopolymerizable monomer (B), and a photopolymerization initiator (C). Among them, the silicone modified (meth)acrylic resin (A1) contains a (meth)acrylic resin containing a structural unit having an alkali-soluble group as an alkali-soluble resin. It does not specifically limit as an alkali-soluble group, A carboxyl group, a sulfonic acid group, a phosphoric acid group, a phenolic hydroxyl group, etc. are mentioned. By containing the photopolymerizable monomer (B) and the photopolymerization initiator (C), the second resin composition is cured by exposure. On the other hand, the second resin composition in the unexposed state contains a silicone modified (meth)acrylic resin (A1) containing a structural unit having an alkali-soluble group, so it is soluble in an alkaline developer. Therefore, when the second resin composition is used, a negative mask can be used to pattern the cured film by photolithography. Since the second resin composition contains the epoxy-modified (meth)acrylic resin (A1), it can be cured by heating. The second resin composition may not contain the curing agent for epoxy compounds. The reason is that under the action of alkali-soluble groups such as phenolic hydroxyl groups and carboxyl groups of the silicone-modified (meth)acrylic resin, the curing reaction of the epoxy group proceeds.

以下,對第2樹脂組合物可含有之必需或任意之成分進行說明。Hereinafter, the essential or optional components that can be contained in the second resin composition will be described.

・矽氧烷改質(甲基)丙烯酸樹脂(A1) 關於包含具有鹼可溶性基之結構單元之矽氧烷改質(甲基)丙烯酸樹脂(A1)如上所述。・Siloxane modified (meth)acrylic resin (A1) The silicone-modified (meth)acrylic resin (A1) containing the structural unit having an alkali-soluble group is as described above.

・其他樹脂 第2樹脂組合物可含有各種鹼溶性樹脂作為矽氧烷改質(甲基)丙烯酸樹脂(A1)以外之其他樹脂。 就硬化物之相對介電常數較低之方面而言,第2樹脂組合物中,矽氧烷改質(甲基)丙烯酸樹脂(A1)之質量相對於矽氧烷改質(甲基)丙烯酸樹脂(A1)之質量與其他樹脂之質量之合計的比率較佳為50質量%以上,更佳為70質量%以上,進而較佳為80質量%以上,進而更佳為90質量%以上,尤佳為100質量%。・Other resins The second resin composition may contain various alkali-soluble resins as resins other than the silicone-modified (meth)acrylic resin (A1). In terms of the relative dielectric constant of the cured product, the mass of the silicone-modified (meth)acrylic resin (A1) in the second resin composition is relative to that of the silicone-modified (meth)acrylic The ratio of the total mass of the resin (A1) to the mass of other resins is preferably 50% by mass or more, more preferably 70% by mass or more, still more preferably 80% by mass or more, and still more preferably 90% by mass or more, especially Preferably, it is 100% by mass.

以下,對作為其他樹脂較佳之鹼溶性樹脂進行說明。Hereinafter, an alkali-soluble resin, which is preferable as other resins, will be described.

作為較佳之鹼溶性樹脂,可例舉具有Cardo結構之樹脂(a-1)(以下,亦記作「Cardo樹脂(a-1)」)。As a preferable alkali-soluble resin, resin (a-1) having a Cardo structure (hereinafter, also referred to as "Cardo resin (a-1)") can be mentioned.

作為具有Cardo結構之樹脂(a-1),可使用於其結構中具有Cardo結構且具有規定鹼溶性之樹脂。所謂Cardo結構係指於構成第1環狀結構之1個環碳原子上鍵結有第2環狀結構與第3環狀結構之結構。再者,第2環狀結構與第3環狀結構可為相同結構,亦可為不同結構。 作為Cardo結構之代表例,可例舉於茀環之9位碳原子上鍵結有2個芳香環(例如苯環)之結構。As the resin (a-1) having a Cardo structure, it can be used for a resin having a Cardo structure and a predetermined alkali solubility in its structure. The so-called Cardo structure refers to a structure in which a second ring structure and a third ring structure are bonded to one ring carbon atom constituting the first ring structure. Furthermore, the second cyclic structure and the third cyclic structure may be the same structure or different structures. As a representative example of the Cardo structure, a structure in which two aromatic rings (such as a benzene ring) are bonded to the 9-position carbon atom of the chrysanthemum ring can be exemplified.

作為Cardo樹脂(a-1),並無特別限定,可使用先前公知之樹脂。其中,較佳為下述式(a-1)所示之樹脂。It does not specifically limit as Cardo resin (a-1), A conventionally well-known resin can be used. Among them, the resin represented by the following formula (a-1) is preferred.

[化31]

Figure 02_image061
[化31]
Figure 02_image061

式(a-1)中,Xa 表示下述式(a-2)所示之基。t1表示0以上20以下之整數。In the formula (a-1), X a represents a group represented by the following formula (a-2). t1 represents an integer from 0 to 20.

[化32]

Figure 02_image063
[化32]
Figure 02_image063

上述式(a-2)中,Ra1 分別獨立地表示氫原子、碳原子數1以上6以下之烴基、或鹵素原子,Ra2 分別獨立地表示氫原子或甲基,Ra3 分別獨立地表示直鏈或支鏈之伸烷基,t2表示0或1,Wa 表示下述式(a-3)所示之基。In the above formula (a-2), R a1 each independently represents a hydrogen atom, a hydrocarbon group having 1 to 6 carbon atoms, or a halogen atom, R a2 each independently represents a hydrogen atom or a methyl group, and R a3 each independently represents For linear or branched alkylene groups, t2 represents 0 or 1, and Wa represents a group represented by the following formula (a-3).

[化33]

Figure 02_image065
[化33]
Figure 02_image065

式(a-2)中,作為Ra3 ,較佳為碳原子數1以上20以下之伸烷基,更佳為碳原子數1以上10以下之伸烷基,尤佳為碳原子數1以上6以下之伸烷基,最佳為乙烷-1,2-二基、丙烷-1,2-二基、及丙烷-1,3-二基。In the formula (a-2), Ra3 is preferably an alkylene having 1 to 20 carbon atoms, more preferably an alkylene having 1 to 10 carbon atoms, and particularly preferably 1 or more carbon atoms The alkylene groups below 6 are most preferably ethane-1,2-diyl, propane-1,2-diyl, and propane-1,3-diyl.

式(a-3)中之環A1 表示可與芳香族環縮合且可具有取代基之脂肪族環。脂肪族環可為脂肪族烴環,亦可為脂肪族雜環。 作為脂肪族環,可例舉:單環烷烴、二環烷烴、三環烷烴、四環烷烴等。 具體而言,可例舉:環戊烷、環己烷、環庚烷、環辛烷等單環烷烴、金剛烷、降𦯉烷、異𦯉烷、三環癸烷、四環十二烷。 可於脂肪族環上縮合之芳香族環可為芳香族烴環,亦可為芳香族雜環,較佳為芳香族烴環。具體而言,較佳為苯環及萘環。 The ring A 1 in the formula (a-3) represents an aliphatic ring that may be condensed with an aromatic ring and may have a substituent. The aliphatic ring may be an aliphatic hydrocarbon ring or an aliphatic heterocyclic ring. The aliphatic ring may, for example, be a monocycloalkane, a dicycloalkane, a tricycloalkane, or a tetracycloalkane. Specifically, examples thereof include monocyclic alkanes such as cyclopentane, cyclohexane, cycloheptane, and cyclooctane, adamantane, nordecane, isodecane, tricyclodecane, and tetracyclododecane. The aromatic ring that can be condensed on the aliphatic ring may be an aromatic hydrocarbon ring or an aromatic heterocyclic ring, and is preferably an aromatic hydrocarbon ring. Specifically, a benzene ring and a naphthalene ring are preferable.

作為式(a-3)所示之二價基之較佳例,可例舉下述基。 [化34]

Figure 02_image067
As a preferable example of the divalent group represented by formula (a-3), the following groups can be mentioned. [化34]
Figure 02_image067

式(a-1)中之二價基Xa 係藉由使提供殘基Za 之四羧酸二酐與下式(a-2a)所示之二酚化合物反應而導入至Cardo樹脂(a-1)中。 [化35]

Figure 02_image069
Of formula (a-1) in the divalent radical X a system by providing that the Z a residue of tetracarboxylic dianhydride (a-2a) is reacted with a compound of the formula of the diphenols illustrated Cardo introduced into the resin (a -1) In. [化35]
Figure 02_image069

式(a-2a)中,Ra1 、Ra2 、Ra3 、及t2係如關於式(a-2)所說明。關於式(a-2a)中之環A1 如關於式(a-3)所說明。In the formula (a-2a), Ra1 , Ra2 , Ra3 , and t2 are as described with respect to the formula (a-2). Regarding the ring A 1 in the formula (a-2a), it is as described with respect to the formula (a-3).

式(a-2a)所示之二酚化合物例如可藉由以下之方法而製造。 首先,將下述式(a-2b)所示之二酚化合物所具有之酚性羥基中之氫原子視需要依照慣例取代為-Ra3 -OH所示之基後,使用表氯醇等進行縮水甘油基化,而獲得下述式(a-2c)所示之環氧化合物。 其次,藉由使式(a-2c)所示之環氧化合物與丙烯酸或甲基丙烯酸反應,而獲得式(a-2a)所示之二酚化合物。 式(a-2b)及式(a-2c)中,Ra1 、Ra3 、及t2係如關於式(a-2)所說明。關於式(a-2b)及式(a-2c)中之環A1 如關於式(a-3)所說明。 再者,式(a-2a)所示之二酚化合物之製造方法並不限定於上述方法。 [化36]

Figure 02_image071
The diphenol compound represented by the formula (a-2a) can be produced, for example, by the following method. First, the hydrogen atom in the phenolic hydroxyl group of the diphenol compound represented by the following formula (a-2b) is substituted with the group represented by -R a3 -OH according to the convention as necessary, and then it is carried out using epichlorohydrin or the like Glycilylation is performed to obtain an epoxy compound represented by the following formula (a-2c). Next, by reacting the epoxy compound represented by the formula (a-2c) with acrylic acid or methacrylic acid, the diphenol compound represented by the formula (a-2a) is obtained. In formula (a-2b) and formula (a-2c), Ra1 , Ra3 , and t2 are as described with respect to formula (a-2). Regarding the ring A 1 in the formula (a-2b) and the formula (a-2c), as described with respect to the formula (a-3). In addition, the manufacturing method of the diphenol compound represented by formula (a-2a) is not limited to the above-mentioned method. [化36]
Figure 02_image071

作為式(a-2b)所示之二酚化合物之較佳例,可例舉以下之二酚化合物。 [化37]

Figure 02_image073
As a preferable example of the diphenol compound represented by formula (a-2b), the following diphenol compounds can be mentioned. [化37]
Figure 02_image073

上述式(a-1)中,Ra0 為氫原子或-CO-Ya -COOH所示之基。此處,Ya 表示自二羧酸酐去掉酸酐基(-CO-O-CO-)後之殘基。作為二羧酸酐之例,可例舉:順丁烯二酸酐、琥珀酸酐、伊康酸酐、鄰苯二甲酸酐、四氫鄰苯二甲酸酐、六氫鄰苯二甲酸酐、甲基內亞甲基四氫鄰苯二甲酸酐、氯菌酸酐、甲基四氫鄰苯二甲酸酐、戊二酸酐等。In the above formula (a-1), Ra0 is a hydrogen atom or a group represented by -CO-Y a -COOH. Here, Y a represents the residue after removing the acid anhydride group (-CO-O-CO-) from the dicarboxylic anhydride. Examples of dicarboxylic anhydrides include: maleic anhydride, succinic anhydride, itaconic anhydride, phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methylene Methyltetrahydrophthalic anhydride, chlorbacteric acid anhydride, methyltetrahydrophthalic anhydride, glutaric anhydride, etc.

上述式(a-1)中,Za 表示自四羧酸二酐去掉2個酸酐基後之殘基。作為四羧酸二酐之例,可例舉:下述式(a-4)所示之四羧酸二酐、均苯四甲酸二酐、二苯甲酮四羧酸二酐、聯苯四羧酸二酐、二苯醚四羧酸二酐等。其中,較佳為均苯四甲酸二酐或聯苯四羧酸二酐,就顯影製程範圍較廣之方面而言,較佳為均苯四甲酸二酐。 上述式(a-1)中,t1表示0以上20以下之整數。In the formula (a-1), Z a represents a self-tetracarboxylic dianhydride after removal of two acid anhydride residue. Examples of tetracarboxylic dianhydride include: tetracarboxylic dianhydride represented by the following formula (a-4), pyromellitic dianhydride, benzophenone tetracarboxylic dianhydride, and biphenyl tetracarboxylic acid dianhydride Carboxylic dianhydride, diphenyl ether tetracarboxylic dianhydride, etc. Among them, pyromellitic dianhydride or biphenyl tetracarboxylic dianhydride is preferred, and pyromellitic dianhydride is preferred in terms of a wider development process range. In the above formula (a-1), t1 represents an integer of 0 or more and 20 or less.

[化38]

Figure 02_image075
(式(a-4)中,Ra4 、Ra5 及Ra6 分別獨立地表示選自由氫原子、碳原子數1以上10以下之烷基及氟原子所組成之群中之1種,t3表示0以上12以下之整數)[化38]
Figure 02_image075
(In formula (a-4), R a4 , R a5 and R a6 each independently represent one selected from the group consisting of a hydrogen atom, an alkyl group having 1 to 10 carbon atoms and a fluorine atom, and t3 represents Integer from 0 to 12)

作為式(a-4)中之Ra4 可選擇之烷基為碳原子數1以上10以下之烷基。藉由將烷基所具備之碳原子數設定為該範圍,可使所得之羧酸酯之耐熱性進一步提高。於Ra4 為烷基之情形時,關於其碳原子數,就易獲得耐熱性優異之Cardo樹脂之方面而言,較佳為1以上6以下,更佳為1以上5以下,進而較佳為1以上4以下,尤佳為1以上3以下。 於Ra4 為烷基之情形時,該烷基可為直鏈狀,亦可為支鏈狀。 The alkyl group that can be selected as R a4 in the formula (a-4) is an alkyl group having 1 to 10 carbon atoms. By setting the number of carbon atoms of the alkyl group to this range, the heat resistance of the obtained carboxylic acid ester can be further improved. When R a4 is an alkyl group, the number of carbon atoms is preferably 1 or more and 6 or less, more preferably 1 or more and 5 or less, and still more preferably 1 or more and 4 or less, particularly preferably 1 or more and 3 or less. When Ra4 is an alkyl group, the alkyl group may be linear or branched.

作為式(a-4)中之Ra4 ,就易獲得耐熱性優異之Cardo樹脂之方面而言,分別獨立地更佳為氫原子或碳原子數1以上10以下之烷基。式(a-4)中之Ra4 更佳為氫原子、甲基、乙基、正丙基或異丙基,尤佳為氫原子或甲基。 關於式(a-4)中之複數個Ra4 ,就容易製備高純度之四羧酸二酐之方面而言,較佳為同一基。 As R a4 in the formula (a-4), in terms of easily obtaining a Cardo resin having excellent heat resistance, each independently is more preferably a hydrogen atom or an alkyl group having 1 to 10 carbon atoms. R a4 in the formula (a-4) is more preferably a hydrogen atom, a methyl group, an ethyl group, an n-propyl group or an isopropyl group, and particularly preferably a hydrogen atom or a methyl group. Regarding the plural Ra4 in the formula (a-4), the same group is preferred in terms of easy preparation of high-purity tetracarboxylic dianhydride.

式(a-4)中之t3表示0以上12以下之整數。藉由將t3之值設為12以下,可使四羧酸二酐之精製變得容易。 就容易進行四羧酸二酐之精製之方面而言,t3之上限較佳為5,更佳為3。 就四羧酸二酐之化學穩定性之方面而言,t3之下限較佳為1,更佳為2。 式(a-4)中之t3尤佳為2或3。T3 in the formula (a-4) represents an integer of 0 to 12 or less. By setting the value of t3 to 12 or less, the purification of tetracarboxylic dianhydride can be facilitated. In terms of easy purification of tetracarboxylic dianhydride, the upper limit of t3 is preferably 5, more preferably 3. In terms of the chemical stability of tetracarboxylic dianhydride, the lower limit of t3 is preferably 1, and more preferably 2. In formula (a-4), t3 is particularly preferably 2 or 3.

作為式(a-4)中之Ra5 及Ra6 可選擇之碳原子數1以上10以下之烷基與作為Ra4 可選擇之碳原子數1以上10以下之烷基相同。 關於Ra5 及Ra6 ,就容易進行四羧酸二酐之精製之方面而言,較佳為氫原子或碳原子數1以上10以下(較佳為1以上6以下,更佳為1以上5以下,進而較佳為1以上4以下,尤佳為1以上3以下)之烷基,尤佳為氫原子或甲基。The alkyl group with 1 to 10 carbon atoms that can be selected as Ra5 and Ra6 in the formula (a-4) is the same as the alkyl group with 1 to 10 carbon atoms that can be selected as Ra4. Regarding R a5 and R a6 , in terms of easy purification of tetracarboxylic dianhydride, a hydrogen atom or a carbon atom number of 1 or more and 10 or less (preferably 1 or more and 6 or less, more preferably 1 or more and 5 Hereinafter, the alkyl group of 1 or more and 4 or less is more preferable, and 1 or more and 3 or less) are more preferable, and a hydrogen atom or a methyl group is particularly preferable.

作為式(a-4)所示之四羧酸二酐,例如可例舉:降𦯉烷-2-螺-α-環戊酮-α'-螺-2''-降𦯉烷-5,5'',6,6''-四羧酸二酐(別名為「降𦯉烷-2-螺-2'-環戊酮-5'-螺-2''-降𦯉烷-5,5'',6,6''-四羧酸二酐」)、甲基降𦯉烷-2-螺-α-環戊酮-α'-螺-2''-(甲基降𦯉烷)-5,5'',6,6''-四羧酸二酐、降𦯉烷-2-螺-α-環己酮-α'-螺-2''-降𦯉烷-5,5'',6,6''-四羧酸二酐(別名為「降𦯉烷-2-螺-2'-環己酮-6'-螺-2''-降𦯉烷-5,5'',6,6''-四羧酸二酐」)、甲基降𦯉烷-2-螺-α-環己酮-α'-螺-2''-(甲基降𦯉烷)-5,5'',6,6''-四羧酸二酐、降𦯉烷-2-螺-α-環丙酮-α'-螺-2''-降𦯉烷-5,5'',6,6''-四羧酸二酐、降𦯉烷-2-螺-α-環丁酮-α'-螺-2''-降𦯉烷-5,5'',6,6''-四羧酸二酐、降𦯉烷-2-螺-α-環庚酮-α'-螺-2''-降𦯉烷-5,5'',6,6''-四羧酸二酐、降𦯉烷-2-螺-α-環辛酮-α'-螺-2''-降𦯉烷-5,5'',6,6''-四羧酸二酐、降𦯉烷-2-螺-α-環壬酮-α'-螺-2''-降𦯉烷-5,5'',6,6''-四羧酸二酐、降𦯉烷-2-螺-α-環癸酮-α'-螺-2''-降𦯉烷-5,5'',6,6''-四羧酸二酐、降𦯉烷-2-螺-α-環十一酮-α'-螺-2''-降𦯉烷-5,5'',6,6''-四羧酸二酐、降𦯉烷-2-螺-α-環十二酮-α'-螺-2''-降𦯉烷-5,5'',6,6''-四羧酸二酐、降𦯉烷-2-螺-α-環十三酮-α'-螺-2''-降𦯉烷-5,5'',6,6''-四羧酸二酐、降𦯉烷-2-螺-α-環十四酮-α'-螺-2''-降𦯉烷-5,5'',6,6''-四羧酸二酐、降𦯉烷-2-螺-α-環十五酮-α'-螺-2''-降𦯉烷-5,5'',6,6''-四羧酸二酐、降𦯉烷-2-螺-α-(甲基環戊酮)-α'-螺-2''-降𦯉烷-5,5'',6,6''-四羧酸二酐、降𦯉烷-2-螺-α-(甲基環己酮)-α'-螺-2''-降𦯉烷-5,5'',6,6''-四羧酸二酐等。As the tetracarboxylic dianhydride represented by the formula (a-4), for example, norran-2-spiro-α-cyclopentanone-α'-spiro-2''-norman-5, 5``,6,6''-tetracarboxylic dianhydride '',6,6''-tetracarboxylic dianhydride''), methylnorman-2-spiro-α-cyclopentanone-α'-spiro-2''-(methylnormangan)- 5,5``,6,6''-Tetracarboxylic dianhydride, norrsan-2-spiro-α-cyclohexanone-α'-spiro-2''-normanthane-5,5'' ,6,6''-Tetracarboxylic dianhydride (alias is ``norman-2-spiro-2'-cyclohexanone-6'-spiro-2''-normanthane-5,5'', 6,6``-tetracarboxylic dianhydride''), methylnorman-2-spiro-α-cyclohexanone-α'-spiro-2''-(methylnormangan)-5,5 '',6,6''-Tetracarboxylic dianhydride, norman-2-spiro-α-cycloacetone-α'-spiro-2''-norman-5,5'',6,6 ''-Tetracarboxylic dianhydride, norcarboxane-2-spiro-α-cyclobutanone-α'-spiro-2''-norcarboxane-5,5'',6,6''-tetracarboxylic acid Acid dianhydride, norman-2-spiro-α-cycloheptanone-α'-spiro-2''-norman-5,5``,6,6''-tetracarboxylic dianhydride, norman 𦯉alkane-2-spiro-α-cyclooctanone-α'-spiro-2''-nor𦯉alkane-5,5'',6,6''-tetracarboxylic dianhydride, nor𦯉alkane-2- Spiro-α-cyclononanone-α'-spiro-2''-normanthane-5,5``,6,6''-tetracarboxylic dianhydride, normanthane-2-spiro-α-ring Decanone-α'-spiro-2``-norphine-5,5'',6,6''-tetracarboxylic dianhydride, norren-2-spiro-α-cycloundecone-α '-Spiro-2''-Norkane-5,5'',6,6''-Tetracarboxylic dianhydride, Normanne-2-spiro-α-cyclododecanone-α'-Spiro- 2``-Noralkane-5,5'',6,6''-tetracarboxylic dianhydride, noralkane-2-spiro-α-cyclotridecone-α'-spiro-2''- Noralkane-5,5``,6,6''-tetracarboxylic dianhydride, noralkane-2-spiro-α-cyclotetradecone-α'-spiro-2''-noralkane- 5,5``,6,6''-Tetracarboxylic dianhydride, norrsan-2-spiro-α-cyclopentadecone-α'-spiro-2''-normanthane-5,5' ',6,6''-Tetracarboxylic dianhydride, nor𦯉ane-2-spiro-α-(methylcyclopentanone)-α'-spiro-2''-nor𦯉ane-5,5'' ,6,6''-Tetracarboxylic dianhydride, norrethane-2-spiro-α-(methylcyclohexanone)-α'-spiro-2''-norrethane-5,5'', 6,6''-tetracarboxylic dianhydride, etc.

Cardo樹脂(a-1)之重量平均分子量較佳為1000以上40000以下,更佳為1500以上30000以下,進而較佳為2000以上10000以下。藉由設為上述範圍,可獲得良好之顯影性,且獲得關於硬化物之充分之耐熱性與機械強度。The weight average molecular weight of the Cardo resin (a-1) is preferably 1,000 or more and 40,000 or less, more preferably 1,500 or more and 30,000 or less, and still more preferably 2,000 or more and 10,000 or less. By setting it in the above range, good developability can be obtained, and sufficient heat resistance and mechanical strength of the cured product can be obtained.

酚醛清漆樹脂(a-2)亦作為與(甲基)丙烯酸樹脂(A1)一起使用之鹼溶性樹脂而較佳。The novolak resin (a-2) is also preferable as an alkali-soluble resin used together with the (meth)acrylic resin (A1).

作為酚醛清漆樹脂(a-2),可使用先前調配於感光性組合物中之各種酚醛清漆樹脂。作為酚醛清漆樹脂(a-2),較佳為藉由使具有酚性羥基之芳香族化合物(以下,簡稱為「酚類」)與醛類於酸觸媒下加成縮合而獲得之樹脂。As the novolak resin (a-2), various novolak resins previously formulated in the photosensitive composition can be used. The novolak resin (a-2) is preferably a resin obtained by addition condensation of an aromatic compound having a phenolic hydroxyl group (hereinafter, abbreviated as "phenols") and aldehydes under an acid catalyst.

作為製作酚醛清漆樹脂(a-2)時所使用之酚類,例如可例舉:苯酚;鄰甲酚、間甲酚、對甲酚等甲酚類;2,3-二甲苯酚、2,4-二甲苯酚、2,5-二甲苯酚、2,6-二甲苯酚、3,4-二甲苯酚、3,5-二甲苯酚等二甲苯酚類;鄰乙基苯酚、間乙基苯酚、對乙基苯酚等乙基苯酚類;2-異丙基苯酚、3-異丙基苯酚、4-異丙基苯酚、鄰丁基苯酚、間丁基苯酚、對丁基苯酚、及對第三丁基苯酚等烷基酚類;2,3,5-三甲基苯酚、及3,4,5-三甲基苯酚等三烷基酚類;間苯二酚、鄰苯二酚、對苯二酚、對苯二酚單甲醚、鄰苯三酚、及間苯三酚等多元酚類;烷基間苯二酚、烷基鄰苯二酚、及烷基對苯二酚等烷基多元酚類(任一烷基均為碳原子數1以上4以下);α-萘酚;β-萘酚;羥基聯苯;及雙酚A等。該等酚類可單獨使用,亦可組合兩種以上而使用。Examples of phenols used in the production of novolak resin (a-2) include: phenol; cresols such as o-cresol, m-cresol, and p-cresol; 2,3-xylenol, 2, 4-xylenol, 2,5-xylenol, 2,6-xylenol, 3,4-xylenol, 3,5-xylenol and other xylenols; o-ethylphenol, m-ethylphenol Ethyl phenols such as methyl phenol and p-ethyl phenol; 2-isopropyl phenol, 3-isopropyl phenol, 4-isopropyl phenol, o-butyl phenol, m-butyl phenol, p-butyl phenol, and Alkylphenols such as p-tert-butylphenol; trialkylphenols such as 2,3,5-trimethylphenol and 3,4,5-trimethylphenol; resorcinol and catechol , Hydroquinone, hydroquinone monomethyl ether, pyrogallol, and phloroglucinol and other polyphenols; alkyl resorcinol, alkyl catechol, and alkyl hydroquinone Alkyl polyphenols (any alkyl group has 1 to 4 carbon atoms); α-naphthol; β-naphthol; hydroxybiphenyl; and bisphenol A, etc. These phenols may be used alone or in combination of two or more kinds.

該等酚類中,較佳為間甲酚及對甲酚,更佳為併用間甲酚與對甲酚。於此情形時,藉由調整兩者之調配比率,可調節使用樹脂組合物所形成之硬化物之耐熱性等各特性。 間甲酚與對甲酚之調配比率並無特別限定,以間甲酚/對甲酚之莫耳比計較佳為3/7以上8/2以下。藉由以該範圍之比率使用間甲酚及對甲酚,易獲得可形成耐熱性優異之硬化物之樹脂組合物。Among these phenols, m-cresol and p-cresol are preferred, and the combined use of m-cresol and p-cresol is more preferred. In this case, by adjusting the blending ratio of the two, the heat resistance and other characteristics of the cured product formed using the resin composition can be adjusted. The blending ratio of m-cresol and p-cresol is not particularly limited, and the molar ratio of m-cresol/p-cresol is preferably 3/7 or more and 8/2 or less. By using m-cresol and p-cresol in the ratio of this range, it is easy to obtain the resin composition which can form the hardened|cured material excellent in heat resistance.

又,併用間甲酚與2,3,5-三甲基苯酚所製造之酚醛清漆樹脂亦較佳。於使用該酚醛清漆樹脂之情形時,尤其易獲得可形成藉由後烘烤時之加熱而難以過度流動之硬化物之樹脂組合物。 間甲酚與2,3,5-三甲基苯酚之調配比率並無特別限定,以間甲酚/2,3,5-三甲基苯酚之莫耳比計較佳為70/30以上95/5以下。In addition, a novolak resin produced by using m-cresol and 2,3,5-trimethylphenol in combination is also preferable. In the case of using the novolak resin, it is particularly easy to obtain a resin composition that can form a cured product that is difficult to flow excessively by heating during post-baking. The blending ratio of m-cresol and 2,3,5-trimethylphenol is not particularly limited. The molar ratio of m-cresol/2,3,5-trimethylphenol is preferably 70/30 or more 95/ 5 or less.

作為製作酚醛清漆樹脂(a-2)時所使用之醛類,例如可例舉:甲醛、多聚甲醛、糠醛、苯甲醛、硝基苯甲醛、及乙醛等。該等醛類可單獨使用,亦可組合兩種以上而使用。Examples of the aldehydes used when producing the novolak resin (a-2) include formaldehyde, paraformaldehyde, furfural, benzaldehyde, nitrobenzaldehyde, and acetaldehyde. These aldehydes may be used alone or in combination of two or more kinds.

作為製作酚醛清漆樹脂(a-2)時所使用之酸觸媒,例如可例舉:鹽酸、硫酸、硝酸、磷酸、及亞磷酸等無機酸類;甲酸、草酸、乙酸、二乙基硫酸、及對甲苯磺酸等有機酸類;以及乙酸鋅等金屬鹽類等。該等酸觸媒可單獨使用,亦可組合兩種以上而使用。As the acid catalyst used in the production of novolac resin (a-2), for example, inorganic acids such as hydrochloric acid, sulfuric acid, nitric acid, phosphoric acid, and phosphorous acid; formic acid, oxalic acid, acetic acid, diethylsulfuric acid, and Organic acids such as p-toluenesulfonic acid; and metal salts such as zinc acetate. These acid catalysts may be used alone or in combination of two or more kinds.

關於酚醛清漆樹脂(a-2)之聚苯乙烯換算之重量平均分子量(Mw;以下,亦簡稱為「重量平均分子量」),就使用感光性組合物所形成之硬化物對於藉由加熱所產生之流動之耐受性的觀點而言,作為下限值,較佳為2000,更佳為5000,尤佳為10000,進而較佳為15000,最佳為20000,作為上限值,較佳為50000,更佳為45000,進而較佳為40000,最佳為35000。Regarding the weight average molecular weight (Mw; hereafter, also referred to as "weight average molecular weight") in terms of polystyrene of the novolak resin (a-2), the cured product formed by using the photosensitive composition is relatively From the viewpoint of the resistance to flow, as the lower limit, it is preferably 2,000, more preferably 5,000, particularly preferably 10,000, further preferably 15,000, most preferably 20,000, and as the upper limit, preferably 50,000, more preferably 45,000, still more preferably 40,000, most preferably 35,000.

作為酚醛清漆樹脂(a-2),可組合至少兩種聚苯乙烯換算之重量平均分子量不同之樹脂而使用。藉由組合重量平均分子量不同之樹脂而使用,可取得感光性組合物之顯影性與使用感光性組合物所形成之硬化物之耐熱性的平衡。As the novolak resin (a-2), at least two types of resins having different weight average molecular weights in terms of polystyrene can be used in combination. By combining resins with different weight average molecular weights, the developability of the photosensitive composition can be balanced with the heat resistance of the cured product formed using the photosensitive composition.

改質環氧樹脂(a-3)亦作為與矽氧烷改質(甲基)丙烯酸樹脂(A1)一起使用之鹼溶性樹脂而較佳。The modified epoxy resin (a-3) is also preferable as an alkali-soluble resin used together with the silicone modified (meth)acrylic resin (A1).

就易形成藉由加熱而難以變形且具有較高耐水性之硬化物之方面而言,可含有於環氧化合物(a-3a)與含有不飽和基之羧酸(a-3b)之反應物上加成有多元酸酐(a-3c)之加成物。關於該加成物,亦記作「改質環氧樹脂(a-3)」。 再者,將於本申請之說明書及申請專利範圍中符合上述定義之化合物且為不屬於上述具有Cardo結構之樹脂(a-1)之化合物設為改質環氧樹脂(a-3)。In terms of easy formation of hardened products that are difficult to deform by heating and have high water resistance, it can be contained in the reactant of epoxy compound (a-3a) and unsaturated group-containing carboxylic acid (a-3b) Additions of polybasic acid anhydrides (a-3c) are added. The adduct is also referred to as "modified epoxy resin (a-3)". Furthermore, in the specification and patent application scope of this application, the compound that meets the above definition and does not belong to the above-mentioned resin (a-1) with the Cardo structure is referred to as modified epoxy resin (a-3).

以下,對環氧化合物(a-3a)、含有不飽和基之羧酸(a-3b)、及多元酸酐(a-3c)進行說明。Hereinafter, the epoxy compound (a-3a), the unsaturated group-containing carboxylic acid (a-3b), and the polybasic acid anhydride (a-3c) will be described.

環氧化合物(a-3a)只要為具有環氧基之化合物,則並無特別限定,可為具有芳香族基之芳香族環氧化合物,亦可為不含芳香族基之脂肪族環氧化合物,較佳為具有芳香族基之芳香族環氧化合物。 環氧化合物(a-3a)可為單官能環氧化合物,亦可為2官能以上之多官能環氧化合物,較佳為多官能環氧化合物。The epoxy compound (a-3a) is not particularly limited as long as it is a compound having an epoxy group. It may be an aromatic epoxy compound having an aromatic group or an aliphatic epoxy compound not containing an aromatic group. , Preferably an aromatic epoxy compound having an aromatic group. The epoxy compound (a-3a) may be a monofunctional epoxy compound or a multifunctional epoxy compound having two or more functions, and a multifunctional epoxy compound is preferred.

作為環氧化合物(a-3a)之具體例,可例舉:雙酚A型環氧樹脂、雙酚F型環氧樹脂、雙酚S型環氧樹脂、雙酚AD型環氧樹脂、萘型環氧樹脂、及聯苯型環氧樹脂等2官能環氧樹脂;二聚酸縮水甘油酯、及三縮水甘油酯等縮水甘油酯型環氧樹脂;四縮水甘油基胺基二苯基甲烷、三縮水甘油基對胺基苯酚、四縮水甘油基間苯二甲胺、及四縮水甘油基雙胺基甲基環己烷等縮水甘油基胺型環氧樹脂;異氰尿酸三縮水甘油酯等雜環式環氧樹脂;間苯三酚三縮水甘油醚、三羥基聯苯基三縮水甘油醚、三羥基苯基甲烷三縮水甘油醚、甘油三縮水甘油醚、2-[4-(2,3-環氧丙氧基)苯基]-2-[4-[1,1-雙[4-(2,3-環氧丙氧基)苯基]乙基]苯基]丙烷、及1,3-雙[4-[1-[4-(2,3-環氧丙氧基)苯基]-1-[4-[1-[4-(2,3-環氧丙氧基)苯基]-1-甲基乙基]苯基]乙基]苯氧基]-2-丙醇等3官能型環氧樹脂;四羥基苯基乙烷四縮水甘油醚、四縮水甘油基二苯甲酮、雙間苯二酚四縮水甘油醚、及四縮水甘油氧基聯苯等4官能型環氧樹脂。Specific examples of the epoxy compound (a-3a) include: bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol S epoxy resin, bisphenol AD epoxy resin, naphthalene 2-functional epoxy resin such as type epoxy resin and biphenyl type epoxy resin; glycidyl ester type epoxy resin such as dimer acid glycidyl ester and triglycidyl ester; tetraglycidylamino diphenylmethane , Triglycidyl p-aminophenol, tetraglycidyl metaxylylenediamine, and tetraglycidyl diaminomethyl cyclohexane and other glycidyl amine epoxy resins; triglycidyl isocyanurate Heterocyclic epoxy resins; phloroglucinol triglycidyl ether, trihydroxybiphenyl triglycidyl ether, trihydroxyphenylmethane triglycidyl ether, glycerol triglycidyl ether, 2-[4-(2 ,3-epoxypropoxy)phenyl]-2-[4-[1,1-bis[4-(2,3-epoxypropoxy)phenyl]ethyl]phenyl]propane, and 1,3-Bis[4-[1-[4-(2,3-epoxypropoxy)phenyl]-1-[4-[1-[4-(2,3-epoxypropoxy) )Phenyl]-1-methylethyl]phenyl]ethyl]phenoxy]-2-propanol and other trifunctional epoxy resins; tetrahydroxyphenylethane tetraglycidyl ether, tetraglycidyl Four-functional epoxy resins such as benzophenone, bisresorcinol tetraglycidyl ether, and tetraglycidyloxy biphenyl.

又,作為環氧化合物(a-3a),較佳為具有聯苯骨架之環氧化合物。 具有聯苯骨架之環氧化合物較佳為於主鏈具有至少一個以上之下述式(a-3a-1)所示之聯苯骨架。 具有聯苯骨架之環氧化合物較佳為具有兩個以上之環氧基之多官能環氧化合物。 藉由使用具有聯苯骨架之環氧化合物,易獲得感度與顯影性之平衡優異,且可形成對基板之密接性優異之硬化物之樹脂組合物。Moreover, as an epoxy compound (a-3a), the epoxy compound which has a biphenyl skeleton is preferable. The epoxy compound having a biphenyl skeleton preferably has at least one biphenyl skeleton represented by the following formula (a-3a-1) in the main chain. The epoxy compound having a biphenyl skeleton is preferably a polyfunctional epoxy compound having two or more epoxy groups. By using an epoxy compound having a biphenyl skeleton, it is easy to obtain a resin composition that has an excellent balance between sensitivity and developability, and can form a cured product with excellent adhesion to the substrate.

[化39]

Figure 02_image077
(式(a-3a-1)中,Ra7 分別獨立為氫原子、碳原子數1以上12以下之烷基、鹵素原子、或可具有取代基之苯基,j為1以上4以下之整數)[化39]
Figure 02_image077
(In formula (a-3a-1), R a7 is each independently a hydrogen atom, an alkyl group with 1 to 12 carbon atoms, a halogen atom, or a phenyl group which may have a substituent, and j is an integer of 1 to 4 )

於Ra7 為碳原子數1以上12以下之烷基之情形時,作為烷基之具體例,可例舉:甲基、乙基、正丙基、異丙基、正丁基、異丁基、第二丁基、第三丁基、正戊基、異戊基、第二戊基、第三戊基、正己基、正庚基、正辛基、異辛基、第二辛基、第三辛基、正壬基、異壬基、正癸基、異癸基、正十一烷基、及正十二烷基。When Ra7 is an alkyl group with 1 to 12 carbon atoms, specific examples of the alkyl group include methyl, ethyl, n-propyl, isopropyl, n-butyl, and isobutyl. , Second butyl, third butyl, n-pentyl, isopentyl, second pentyl, third pentyl, n-hexyl, n-heptyl, n-octyl, isooctyl, second octyl, the first Trioctyl, n-nonyl, isononyl, n-decyl, isodecyl, n-undecyl, and n-dodecyl.

於Ra7 為鹵素原子之情形時,作為鹵素原子之具體例,可例舉:氟原子、氯原子、溴原子、及碘原子。When Ra7 is a halogen atom, specific examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom.

於Ra7 為可具有取代基之苯基之情形時,苯基上之取代基數並無特別限定。苯基上之取代基數為0以上5以下,較佳為0或1。 作為取代基之例,可例舉:碳原子數1以上4以下之烷基、碳原子數1以上4以下之烷氧基、碳原子數2以上4以下之脂肪族醯基、鹵素原子、氰基、及硝基。When Ra7 is a phenyl group which may have a substituent, the number of substituents on the phenyl group is not particularly limited. The number of substituents on the phenyl group is 0 or more and 5 or less, preferably 0 or 1. Examples of substituents include: alkyl groups with 1 to 4 carbon atoms, alkoxy groups with 1 to 4 carbon atoms, aliphatic acyl groups with 2 to 4 carbon atoms, halogen atoms, and cyano groups. Base, and nitro.

作為具有上述式(a-3a-1)所示之聯苯骨架之環氧化合物(a-3a),並無特別限定,例如可例舉下述式(a-3a-2)所示之環氧化合物。 [化40]

Figure 02_image079
(式(a-3a-2)中,Ra7 及j與式(a-3a-1)相同,k為括號內之結構單元之平均重複數且為0以上10以下)The epoxy compound (a-3a) having a biphenyl skeleton represented by the above formula (a-3a-1) is not particularly limited. For example, a ring represented by the following formula (a-3a-2) may be mentioned Oxygen compounds. [化40]
Figure 02_image079
(In formula (a-3a-2), Ra7 and j are the same as formula (a-3a-1), k is the average repeating number of the structural unit in the brackets and is 0 or more and 10 or less)

式(a-3a-2)所示之環氧化合物中,就尤其易獲得感度與顯影性之平衡優異之樹脂組合物之方面而言,較佳為下述式(a-3a-3)所示之化合物。 [化41]

Figure 02_image081
(式(a-3a-3)中,k與式(a-3a-2)相同)Among the epoxy compounds represented by the formula (a-3a-2), the resin composition having an excellent balance between sensitivity and developability is particularly preferred in terms of easy to obtain a resin composition represented by the following formula (a-3a-3) Show the compound. [化41]
Figure 02_image081
(In formula (a-3a-3), k is the same as formula (a-3a-2))

於製備為改質環氧化合物(a-3)時,要使環氧化合物(a-3a)與含有不飽和基之羧酸(a-3b)反應。 作為含有不飽和基之羧酸(a-3b),較佳為分子中含有丙烯酸基或甲基丙烯酸基等反應性之不飽和雙鍵之單羧酸。作為此種含有不飽和基之羧酸,例如可例舉:丙烯酸、甲基丙烯酸、β-苯乙烯基丙烯酸、β-糠基丙烯酸、α-氰基桂皮酸、桂皮酸等。又,含有不飽和基之羧酸(a-3b)可單獨使用或組合2種以上而使用。When preparing the modified epoxy compound (a-3), the epoxy compound (a-3a) is reacted with the unsaturated group-containing carboxylic acid (a-3b). The unsaturated group-containing carboxylic acid (a-3b) is preferably a monocarboxylic acid having a reactive unsaturated double bond such as an acrylic group or a methacrylic group in the molecule. Examples of such unsaturated group-containing carboxylic acids include acrylic acid, methacrylic acid, β-styryl acrylic acid, β-furfuryl acrylic acid, α-cyanocinnamic acid, cinnamic acid, and the like. Moreover, unsaturated group-containing carboxylic acid (a-3b) can be used individually or in combination of 2 or more types.

環氧化合物(a-3a)與含有不飽和基之羧酸(a-3b)可藉由公知之方法而反應。作為較佳之反應方法,例如可例舉如下方法:將三乙胺、苄基乙基胺等三級胺,十二烷基三甲基氯化銨、四甲基氯化銨、四乙基氯化銨、苄基三乙基氯化銨等四級銨鹽,吡啶或三苯基膦等作為觸媒,於有機溶劑中且在50℃以上150℃以下之反應溫度下,使環氧化合物(a-3a)與含有不飽和基之羧酸(a-3b)反應數小時至數十小時。The epoxy compound (a-3a) and the unsaturated group-containing carboxylic acid (a-3b) can be reacted by a known method. As a preferable reaction method, for example, the following method can be exemplified: tertiary amines such as triethylamine and benzylethylamine, dodecyltrimethylammonium chloride, tetramethylammonium chloride, tetraethyl chloride Quaternary ammonium salts such as ammonium chloride, benzyltriethylammonium chloride, pyridine or triphenylphosphine, etc. are used as catalysts to make epoxy compounds ( a-3a) React with unsaturated group-containing carboxylic acid (a-3b) for several hours to several tens of hours.

關於環氧化合物(a-3a)與含有不飽和基之羧酸(a-3b)之反應中之兩者的使用量之比率,以環氧化合物(a-3a)之環氧當量與含有不飽和基之羧酸(a-3b)之羧酸當量之比計,通常較佳為1:0.5~1:2,更佳為1:0.8~1:1.25,尤佳為1:0.9~1:1.1。 若環氧化合物(a-3a)之使用量與含有不飽和基之羧酸(a-3b)之使用量之比率以上述當量比計為1:0.5~1:2,則有交聯效率提高之傾向而較佳。Regarding the ratio of the two amounts used in the reaction of the epoxy compound (a-3a) and the unsaturated group-containing carboxylic acid (a-3b), the epoxy equivalent of the epoxy compound (a-3a) and the The ratio of the carboxylic acid equivalent of the saturated carboxylic acid (a-3b) is usually 1:0.5-1:2, more preferably 1:0.8-1:1.25, and particularly preferably 1:0.9-1: 1.1. If the ratio of the use amount of epoxy compound (a-3a) to the use amount of unsaturated group-containing carboxylic acid (a-3b) is 1:0.5 to 1:2 based on the above equivalent ratio, the crosslinking efficiency will be improved The tendency is better.

多元酸酐(a-3c)係具有2個以上之羧基之羧酸之酸酐。 作為多元酸酐(a-3c),並無特別限定,例如可例舉:順丁烯二酸酐、琥珀酸酐、伊康酸酐、鄰苯二甲酸酐、四氫鄰苯二甲酸酐、六氫鄰苯二甲酸酐、甲基六氫鄰苯二甲酸酐、甲基四氫鄰苯二甲酸酐、偏苯三甲酸酐、均苯四甲酸酐、二苯甲酮四羧酸二酐、3-甲基六氫鄰苯二甲酸酐、4-甲基六氫鄰苯二甲酸酐、3-乙基六氫鄰苯二甲酸酐、4-乙基六氫鄰苯二甲酸酐、四氫鄰苯二甲酸酐、3-甲基四氫鄰苯二甲酸酐、4-甲基四氫鄰苯二甲酸酐、3-乙基四氫鄰苯二甲酸酐、4-乙基四氫鄰苯二甲酸酐、下述式(a-3c-1)所示之化合物、及下述式(a-3c-2)所示之化合物。又,多元酸酐(a-3c)可單獨使用或組合2種以上而使用。The polybasic acid anhydride (a-3c) is an anhydride of a carboxylic acid having two or more carboxyl groups. The polybasic acid anhydride (a-3c) is not particularly limited, and examples include maleic anhydride, succinic anhydride, itaconic anhydride, phthalic anhydride, tetrahydrophthalic anhydride, and hexahydrophthalic anhydride. Dicarboxylic anhydride, methylhexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, trimellitic anhydride, pyromellitic anhydride, benzophenonetetracarboxylic dianhydride, 3-methylhexa Hydrophthalic anhydride, 4-methylhexahydrophthalic anhydride, 3-ethylhexahydrophthalic anhydride, 4-ethylhexahydrophthalic anhydride, tetrahydrophthalic anhydride , 3-methyltetrahydrophthalic anhydride, 4-methyltetrahydrophthalic anhydride, 3-ethyltetrahydrophthalic anhydride, 4-ethyltetrahydrophthalic anhydride, The compound represented by the formula (a-3c-1) and the compound represented by the following formula (a-3c-2) are described. Moreover, polybasic acid anhydride (a-3c) can be used individually or in combination of 2 or more types.

[化42]

Figure 02_image083
(式(a-3c-2)中,Ra8 表示碳原子數1以上10以下之可具有取代基之伸烷基)[化42]
Figure 02_image083
(In the formula (a-3c-2), R a8 represents an alkylene group having 1 to 10 carbon atoms that may have a substituent)

作為多元酸酐(a-3c),就易獲得感度與顯影性之平衡優異之樹脂組合物之方面而言,較佳為具有2個以上之苯環之化合物。又,多元酸酐(a-3c)更佳為包含上述式(a-3c-1)所示之化合物及上述式(a-3c-2)所示之化合物之至少一者。The polybasic acid anhydride (a-3c) is preferably a compound having two or more benzene rings in terms of easily obtaining a resin composition having an excellent balance between sensitivity and developability. In addition, the polybasic acid anhydride (a-3c) more preferably contains at least one of the compound represented by the above formula (a-3c-1) and the compound represented by the above formula (a-3c-2).

使環氧化合物(a-3a)與含有不飽和基之羧酸(a-3b)反應之後,與多元酸酐(a-3c)進行反應之方法可自公知之方法中進行適當選擇。 又,關於使用量比,以環氧化合物(a-3a)與含有不飽和基之羧酸(a-3b)反應後之成分中之OH基的莫耳數與多元酸酐(a-3c)之酸酐基之當量比計,通常為1:1~1:0.1,較佳為1:0.8~1:0.2。藉由設為上述範圍,易獲得顯影性良好之樹脂組合物。The method of reacting the epoxy compound (a-3a) with the unsaturated group-containing carboxylic acid (a-3b) and then reacting with the polybasic acid anhydride (a-3c) can be appropriately selected from known methods. In addition, the ratio of the amount used is based on the ratio of the molar number of the OH group in the component after the epoxy compound (a-3a) and the unsaturated group-containing carboxylic acid (a-3b) are reacted with the polybasic acid anhydride (a-3c) The equivalent ratio of acid anhydride groups is usually 1:1 to 1:0.1, preferably 1:0.8 to 1:0.2. By setting it as the said range, it becomes easy to obtain the resin composition with good developability.

改質環氧樹脂(a-3)之酸值以樹脂固形物成分計,較佳為10 mgKOH/g以上150 mgKOH/g以下,更佳為70 mgKOH/g以上110 mgKOH/g以下。藉由將樹脂之酸值設為10 mgKOH/g以上,而獲得對於顯影液之充分之溶解性,又,藉由將酸值設為150 mgKOH/g以下,可獲得充分之硬化性,且可使硬化物之表面性變得良好。The acid value of the modified epoxy resin (a-3), based on the solid content of the resin, is preferably 10 mgKOH/g or more and 150 mgKOH/g or less, more preferably 70 mgKOH/g or more and 110 mgKOH/g or less. By setting the acid value of the resin to 10 mgKOH/g or more, sufficient solubility for the developer can be obtained. In addition, by setting the acid value to 150 mgKOH/g or less, sufficient curability can be obtained, and Make the surface of the hardened material become better.

改質環氧樹脂(a-3)之重量平均分子量較佳為1000以上40000以下,更佳為2000以上30000以下。藉由使重量平均分子量為1000以上,易形成耐熱性及強度優異之硬化物。又,藉由使重量平均分子量為40000以下,易獲得顯示對於顯影液之充分之溶解性之樹脂組合物。The weight average molecular weight of the modified epoxy resin (a-3) is preferably 1,000 or more and 40,000 or less, more preferably 2,000 or more and 30,000 or less. By making the weight average molecular weight 1000 or more, it is easy to form a cured product with excellent heat resistance and strength. In addition, by making the weight average molecular weight 40,000 or less, it is easy to obtain a resin composition showing sufficient solubility for the developer.

又,作為(甲基)丙烯酸樹脂(A1)以外之樹脂之(甲基)丙烯酸樹脂(a-4)亦可作為構成鹼溶性樹脂之成分而使用。 於未利用含有環氧基之環狀矽氧烷化合物(A-II)進行改質之(甲基)丙烯酸樹脂(A-I)具有鹼可溶性基之情形時,亦可將該(甲基)丙烯酸樹脂(A-I)作為(甲基)丙烯酸樹脂(a-4)而使用。 作為(甲基)丙烯酸樹脂(a-4),可使用包含源自(甲基)丙烯酸之結構單元及/或源自(甲基)丙烯酸酯等其他單體之結構單元之樹脂。(甲基)丙烯酸為丙烯酸或甲基丙烯酸。(甲基)丙烯酸酯為下述式(a-4-1)所示之化合物,且只要不會妨礙本發明之目的,則並無特別限定。Moreover, (meth)acrylic resin (a-4) which is a resin other than (meth)acrylic resin (A1) can also be used as a component which comprises an alkali-soluble resin. When the (meth)acrylic resin (AI) that has not been modified with the epoxy-containing cyclic silicone compound (A-II) has alkali-soluble groups, the (meth)acrylic resin can also be used (AI) is used as (meth)acrylic resin (a-4). As the (meth)acrylic resin (a-4), a resin containing a structural unit derived from (meth)acrylic acid and/or a structural unit derived from other monomers such as (meth)acrylate can be used. (Meth)acrylic acid is acrylic acid or methacrylic acid. The (meth)acrylate is a compound represented by the following formula (a-4-1), and is not particularly limited as long as it does not interfere with the purpose of the present invention.

[化43]

Figure 02_image085
[化43]
Figure 02_image085

上述式(a-4-1)中,Ra9 為氫原子或甲基,Ra10 為一價有機基。該有機基可於該有機基中包含雜原子等烴基以外之鍵或取代基。又,該有機基可為直鏈狀、支鏈狀、環狀之任一種。In the above formula (a-4-1), Ra9 is a hydrogen atom or a methyl group, and Ra10 is a monovalent organic group. The organic group may include a bond or substituent other than a hydrocarbon group such as a hetero atom in the organic group. In addition, the organic group may be any of linear, branched, and cyclic.

作為Ra10 之有機基中之烴基以外之取代基,只要無損本發明之效果,則並無特別限定,可例舉:鹵素原子、羥基、巰基、硫基、氰基、異氰基、氰酸基、異氰酸基、氰硫基、異氰硫基、矽烷基、矽烷醇基、烷氧基、烷氧基羰基、胺甲醯基、胺硫甲醯基、硝基、亞硝基、羧基、羧酸酯基、醯基、醯氧基、亞磺酸基、磺酸基、磺酸根基、膦基、氧膦基、膦酸基、膦酸根基、羥基亞胺基、烷基醚基、烷基硫醚基、芳基醚基、芳基硫醚基、胺基(-NH2 、-NHR、-NRR':R及R'分別獨立地表示烴基)等。上述取代基中所含之氫原子可被烴基取代。又,上述取代基中所含之烴基可為直鏈狀、支鏈狀、及環狀之任一種。 Substituents other than the hydrocarbon group in the organic group of Ra10 are not particularly limited as long as they do not impair the effects of the present invention. Examples include halogen atoms, hydroxyl groups, mercapto groups, thio groups, cyano groups, isocyano groups, and cyanic acid groups. Groups, isocyanato groups, thiocyanato groups, thioisocyanato groups, silyl groups, silanol groups, alkoxy groups, alkoxycarbonyl groups, carboxamides, carboxamides, nitro groups, nitroso groups, Carboxyl group, carboxylate group, acyl group, acyloxy group, sulfinic acid group, sulfonic acid group, sulfonate group, phosphine group, phosphinyl group, phosphonic acid group, phosphonate group, hydroxyimine group, alkyl ether Group, alkyl sulfide group, aryl ether group, aryl sulfide group, amine group (-NH 2 , -NHR, -NRR': R and R'each independently represent a hydrocarbon group), etc. The hydrogen atom contained in the above substituent may be substituted by a hydrocarbon group. Moreover, the hydrocarbon group contained in the said substituent may be any of linear, branched, and cyclic.

又,作為Ra10 之有機基可具有丙烯醯氧基、甲基丙烯醯氧基、環氧基、氧雜環丁基等反應性之官能基。 丙烯醯氧基或甲基丙烯醯氧基等具有不飽和雙鍵之醯基例如可藉由如下方式製造:使包含具有環氧基之結構單元之(甲基)丙烯酸樹脂(a-4)中之環氧基的至少一部分與丙烯酸或甲基丙烯酸等不飽和羧酸進行反應。 可於使環氧基之至少一部分與不飽和羧酸反應之後,讓藉由反應而生成之基與多元酸酐進行反應。In addition, the organic group as R a10 may have Bingxi Xi group, Bing Xixi methyl group, an epoxy group, an oxetanyl group of the reactive functional groups. Acrylic groups having unsaturated double bonds, such as acryloxy groups or methacryloxy groups, can be produced by, for example, making a (meth)acrylic resin (a-4) containing a structural unit having an epoxy group At least part of the epoxy group reacts with unsaturated carboxylic acid such as acrylic acid or methacrylic acid. After reacting at least a part of the epoxy group with the unsaturated carboxylic acid, the group generated by the reaction may be reacted with the polybasic acid anhydride.

作為多元酸酐之具體例,可例舉:順丁烯二酸酐、琥珀酸酐、伊康酸酐、鄰苯二甲酸酐、四氫鄰苯二甲酸酐、六氫鄰苯二甲酸酐、甲基六氫鄰苯二甲酸酐、甲基四氫鄰苯二甲酸酐、偏苯三甲酸酐、均苯四甲酸酐、二苯甲酮四羧酸二酐、3-甲基六氫鄰苯二甲酸酐、4-甲基六氫鄰苯二甲酸酐、3-乙基六氫鄰苯二甲酸酐、4-乙基六氫鄰苯二甲酸酐、四氫鄰苯二甲酸酐、3-甲基四氫鄰苯二甲酸酐、4-甲基四氫鄰苯二甲酸酐、3-乙基四氫鄰苯二甲酸酐、及4-乙基四氫鄰苯二甲酸酐等。Specific examples of polybasic acid anhydrides include: maleic anhydride, succinic anhydride, itaconic anhydride, phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methylhexahydro Phthalic anhydride, methyltetrahydrophthalic anhydride, trimellitic anhydride, pyromellitic anhydride, benzophenonetetracarboxylic dianhydride, 3-methylhexahydrophthalic anhydride, 4 -Methylhexahydrophthalic anhydride, 3-ethylhexahydrophthalic anhydride, 4-ethylhexahydrophthalic anhydride, tetrahydrophthalic anhydride, 3-methyltetrahydrophthalic anhydride Phthalic anhydride, 4-methyltetrahydrophthalic anhydride, 3-ethyltetrahydrophthalic anhydride, 4-ethyltetrahydrophthalic anhydride, etc.

作為具體例,若使源自甲基丙烯酸縮水甘油酯之結構單元與丙烯酸進行反應,會生成下述反應式中所示之具有羥基之結構單元。藉由使該具有羥基之結構單元與四氫鄰苯二甲酸等多元酸之酸酐進行反應,而生成具有羧基與不飽和雙鍵之對樹脂賦予鹼溶性之結構單元。 [化44]

Figure 02_image087
As a specific example, if a structural unit derived from glycidyl methacrylate is reacted with acrylic acid, a structural unit having a hydroxyl group shown in the following reaction formula is generated. By reacting the structural unit having a hydroxyl group with an anhydride of a polybasic acid such as tetrahydrophthalic acid, a structural unit having a carboxyl group and an unsaturated double bond that imparts alkali solubility to the resin is generated. [化44]
Figure 02_image087

作為Ra10 ,較佳為烷基、芳基、芳烷基、或雜環基,該等基可經鹵素原子、羥基、烷基、或雜環基取代。又,於該等基包含伸烷基部分之情形時,伸烷基部分可經醚鍵、硫醚鍵、酯鍵中斷。R a10 is preferably an alkyl group, an aryl group, an aralkyl group, or a heterocyclic group, and these groups may be substituted with a halogen atom, a hydroxyl group, an alkyl group, or a heterocyclic group. In addition, when these groups contain alkylene moieties, the alkylene moieties can be interrupted by ether bonds, thioether bonds, and ester bonds.

於烷基為直鏈狀或支鏈狀之情形時,烷基之碳原子數較佳為1以上20以下,更佳為1以上15以下,尤佳為1以上10以下。作為較佳之烷基之例,可例舉:甲基、乙基、正丙基、異丙基、正丁基、異丁基、第二丁基、第三丁基、正戊基、異戊基、第二戊基、第三戊基、正己基、正庚基、正辛基、異辛基、第二辛基、第三辛基、正壬基、異壬基、正癸基、異癸基等。When the alkyl group is linear or branched, the number of carbon atoms of the alkyl group is preferably 1 or more and 20 or less, more preferably 1 or more and 15 or less, and particularly preferably 1 or more and 10 or less. Examples of preferable alkyl groups include: methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, second butyl, tertiary butyl, n-pentyl, isopentyl Base, second pentyl, third pentyl, n-hexyl, n-heptyl, n-octyl, isooctyl, second octyl, third octyl, n-nonyl, isononyl, n-decyl, iso Decyl and others.

於烷基為脂環式基或含有脂環式基之基之情形時,作為烷基中所含之較佳之脂環式基,可例舉:環戊基及環己基等單環之脂環式基;金剛烷基、降𦯉基、異𦯉基、三環壬基、三環癸基、及四環十二烷基等多環之脂環式基。When the alkyl group is an alicyclic group or a group containing an alicyclic group, the preferred alicyclic group contained in the alkyl group includes monocyclic alicyclic groups such as cyclopentyl and cyclohexyl Formula group; adamantyl group, nor 𦯉 group, iso 𦯉 group, tricyclononyl, tricyclodecyl, and tetracyclododecyl and other polycyclic alicyclic groups.

作為式(a-4-1)所示之化合物包含具有環氧基之鏈狀之基作為Ra10 時的式(a-4-1)所示之化合物之具體例,可例舉:(甲基)丙烯酸縮水甘油酯、(甲基)丙烯酸2-甲基縮水甘油酯、(甲基)丙烯酸3,4-環氧丁酯、(甲基)丙烯酸6,7-環氧庚酯等(甲基)丙烯酸環氧烷基酯類。As a specific example of the compound represented by the formula (a-4-1) when the compound represented by the formula (a-4-1) contains a chain-like group having an epoxy group as R a10, there may be mentioned: (formula (a-4-1) Base) glycidyl acrylate, 2-methylglycidyl (meth)acrylate, 3,4-epoxybutyl (meth)acrylate, 6,7-epoxyheptyl (meth)acrylate, etc. Base) epoxy alkyl acrylates.

又,式(a-4-1)所示之化合物亦可為含有脂環式環氧基之(甲基)丙烯酸酯。構成脂環式環氧基之脂環式基可為單環,亦可為多環。作為單環之脂環式基,可例舉:環戊基、環己基等。又,作為多環之脂環式基,可例舉:降𦯉基、異𦯉基、三環壬基、三環癸基、四環十二烷基等。In addition, the compound represented by the formula (a-4-1) may also be a (meth)acrylate containing an alicyclic epoxy group. The alicyclic group constituting the alicyclic epoxy group may be monocyclic or polycyclic. As a monocyclic alicyclic group, cyclopentyl, cyclohexyl, etc. are mentioned. In addition, as the polycyclic alicyclic group, there can be exemplified nordoxy, isooxy, tricyclononyl, tricyclodecyl, tetracyclododecyl, and the like.

作為式(a-4-1)所示之化合物為含有脂環式環氧基之(甲基)丙烯酸酯時之具體例,例如可例舉下述式(a-4-1a)~(a-4-1o)所示之化合物。該等中,為使顯影性成為適度範圍內,較佳為下述式(a-4-1a)~(a-4-1e)所示之化合物,更佳為下述式(a-4-1a)~(a-4-1c)所示之化合物。As a specific example when the compound represented by the formula (a-4-1) is a (meth)acrylate containing an alicyclic epoxy group, for example, the following formulas (a-4-1a) to (a) -4-1o) The compound shown in. Among these, in order to bring the developability into an appropriate range, the compounds represented by the following formulas (a-4-1a) to (a-4-1e) are preferred, and the following formulas (a-4- 1a) ~ (a-4-1c) the compounds shown.

[化45]

Figure 02_image089
[化45]
Figure 02_image089

[化46]

Figure 02_image091
[化46]
Figure 02_image091

[化47]

Figure 02_image093
[化47]
Figure 02_image093

上述式中,Ra20 表示氫原子或甲基,Ra21 表示碳原子數1以上6以下之二價脂肪族飽和烴基,Ra22 表示碳原子數1以上10以下之二價烴基,t表示0以上10以下之整數。作為Ra21 ,較佳為直鏈狀或支鏈狀之伸烷基,例如亞甲基、伸乙基、伸丙基、四亞甲基、乙基伸乙基、五亞甲基、六亞甲基。作為Ra22 ,例如較佳為亞甲基、伸乙基、伸丙基、四亞甲基、乙基伸乙基、五亞甲基、六亞甲基、伸苯基、伸環己基、-CH2 -Ph-CH2 -(Ph表示伸苯基)。In the above formula, R a20 represents a hydrogen atom or a methyl group, R a21 represents a divalent saturated aliphatic hydrocarbon group with 1 to 6 carbon atoms, R a22 represents a divalent hydrocarbon group with 1 to 10 carbon atoms, and t represents 0 or more Integers below 10. R a21 is preferably a linear or branched alkylene group, such as methylene, ethylene, propylene, tetramethylene, ethylethylene, pentamethylene, hexamethylene base. As R a22 , for example, methylene, ethylene, propylene, tetramethylene, ethylethylene, pentamethylene, hexamethylene, phenylene, cyclohexylene, -CH are preferred. 2 -Ph-CH 2- (Ph represents phenylene).

又,(甲基)丙烯酸樹脂(a-4)可為進而使(甲基)丙烯酸酯以外之單體進行聚合而成之共聚物。作為(甲基)丙烯酸酯以外之單體,可例舉:(甲基)丙烯醯胺類、不飽和羧酸類、烯丙基化合物、乙烯醚類、乙烯酯類、苯乙烯類等。該等單體可單獨使用或組合兩種以上而使用。關於該等單體之較佳例係如關於(甲基)丙烯酸樹脂(A1)所說明。In addition, the (meth)acrylic resin (a-4) may be a copolymer obtained by further polymerizing monomers other than (meth)acrylate. Examples of monomers other than (meth)acrylates include (meth)acrylamides, unsaturated carboxylic acids, allyl compounds, vinyl ethers, vinyl esters, and styrenes. These monomers can be used individually or in combination of 2 or more types. Preferable examples of these monomers are as described for (meth)acrylic resin (A1).

(甲基)丙烯酸樹脂(a-4)中之源自(甲基)丙烯酸之結構單元之量與源自其他單體之結構單元之量於不會妨礙本發明之目的之範圍內並無特別限定。(甲基)丙烯酸樹脂(a-4)中之源自(甲基)丙烯酸之結構單元之量相對於(甲基)丙烯酸樹脂(a-4)之質量,較佳為5質量%以上50質量%以下,更佳為10質量%以上30質量%以下。The amount of structural units derived from (meth)acrylic acid and the amount of structural units derived from other monomers in the (meth)acrylic resin (a-4) are not particularly limited within a range that does not interfere with the purpose of the present invention limited. The amount of the (meth)acrylic acid-derived structural unit in the (meth)acrylic resin (a-4) relative to the mass of the (meth)acrylic resin (a-4) is preferably 5% by mass or more and 50% by mass % Or less, more preferably 10% by mass or more and 30% by mass or less.

於(甲基)丙烯酸樹脂(a-4)包含具有不飽和雙鍵之結構單元之情形時,(甲基)丙烯酸樹脂(a-4)中之具有不飽和雙鍵之結構單元之量較佳為1質量%以上50質量%以下,更佳為1質量%以上30質量%以下,尤佳為1質量%以上20質量%以下。 藉由(甲基)丙烯酸樹脂(a-4)包含上述範圍內之量之具有不飽和雙鍵之結構單元,可將丙烯酸系樹脂引入抗蝕膜內之交聯反應而使之均勻化,因此對硬化膜之耐熱性、機械特性之提高有效。When the (meth)acrylic resin (a-4) contains structural units with unsaturated double bonds, the amount of structural units with unsaturated double bonds in the (meth)acrylic resin (a-4) is preferred It is 1% by mass or more and 50% by mass or less, more preferably 1% by mass or more and 30% by mass or less, and particularly preferably 1% by mass or more and 20% by mass or less. Since the (meth)acrylic resin (a-4) contains the structural unit having unsaturated double bonds in an amount within the above range, the acrylic resin can be introduced into the cross-linking reaction in the resist film to make it uniform. Effective for improving the heat resistance and mechanical properties of the cured film.

(甲基)丙烯酸樹脂(a-4)之重量平均分子量較佳為2000以上50000以下,更佳為3000以上30000以下。藉由設為上述範圍,而有易取得樹脂組合物之膜形成能力、曝光後之顯影性之平衡的傾向。The weight average molecular weight of the (meth)acrylic resin (a-4) is preferably 2,000 or more and 50,000 or less, more preferably 3,000 or more and 30,000 or less. By setting it as the said range, there exists a tendency for the film-forming ability of a resin composition and the developability after exposure to balance easily to be obtained.

第2樹脂組合物中之(甲基)丙烯酸樹脂(A1)之質量與其他樹脂之質量的合計相對於除後述有機溶劑(S)之質量以外之樹脂組合物之質量(固形物成分整體),較佳為20質量%以上85質量%以下,更佳為25質量%以上75質量%以下。藉由設為上述範圍,而易獲得顯影性優異之樹脂組合物。The total of the mass of the (meth)acrylic resin (A1) and the mass of other resins in the second resin composition is relative to the mass of the resin composition (the total solid content) excluding the mass of the organic solvent (S) described below, It is preferably 20% by mass or more and 85% by mass or less, and more preferably 25% by mass or more and 75% by mass or less. By setting it as the said range, the resin composition excellent in developability can be obtained easily.

・光聚合性單體(B) 第2樹脂組合物含有光聚合性單體(B)。作為光聚合性單體(B),可無特別限制地使用先前調配於感光性組合物中之化合物。・Photopolymerizable monomer (B) The second resin composition contains a photopolymerizable monomer (B). As the photopolymerizable monomer (B), the compound previously formulated in the photosensitive composition can be used without particular limitation.

作為單官能光聚合性單體,例如可例舉:(甲基)丙烯醯胺、羥甲基(甲基)丙烯醯胺、甲氧基甲基(甲基)丙烯醯胺、乙氧基甲基(甲基)丙烯醯胺、丙氧基甲基(甲基)丙烯醯胺、丁氧基甲氧基甲基(甲基)丙烯醯胺、N-羥甲基(甲基)丙烯醯胺(N-methylolmethacrylamide)、N-羥基甲基(甲基)丙烯醯胺(N-(hydroxymethyl)methacrylamide)、(甲基)丙烯酸、反丁烯二酸、順丁烯二酸、順丁烯二酸酐、伊康酸、伊康酸酐、甲基順丁烯二酸、甲基順丁烯二酸酐、丁烯酸、2-丙烯醯胺基-2-甲基丙磺酸、第三丁基丙烯醯胺基磺酸、(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丁酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸2-羥乙酯、(甲基)丙烯酸2-羥丙酯、(甲基)丙烯酸2-羥丁酯、(甲基)丙烯酸2-苯氧基-2-羥丙酯、鄰苯二甲酸2-(甲基)丙烯醯氧基-2-羥丙酯、甘油單(甲基)丙烯酸酯、(甲基)丙烯酸四氫糠酯、二甲基胺基(甲基)丙烯酸酯、(甲基)丙烯酸縮水甘油酯、(甲基)丙烯酸2,2,2-三氟乙酯、(甲基)丙烯酸2,2,3,3-四氟丙酯、鄰苯二甲酸衍生物之(甲基)丙烯酸半酯等。該等單官能光聚合性單體可單獨使用或組合兩種以上而使用。As a monofunctional photopolymerizable monomer, for example, (meth)acrylamide, methylol (meth)acrylamide, methoxymethyl (meth)acrylamide, ethoxymethyl (Meth)acrylamide, propoxymethyl(meth)acrylamide, butoxymethoxymethyl(meth)acrylamide, N-methylol(meth)acrylamide (N-methylolmethacrylamide), N-(hydroxymethyl)methacrylamide, (meth)acrylic acid, fumaric acid, maleic acid, maleic anhydride , Iconic acid, Iconic anhydride, Methylmaleic acid, Methylmaleic anhydride, Crotonic acid, 2-acrylamido-2-methylpropanesulfonic acid, tertiary butylacrylic acid Aminosulfonic acid, methyl (meth)acrylate, ethyl (meth)acrylate, butyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, cyclohexyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 2-phenoxy-2-hydroxypropyl (meth)acrylate, 2-(meth)acryloyloxy-2-hydroxypropyl phthalate, glycerol mono(meth)acrylate, tetrahydrofurfuryl (meth)acrylate, dimethylamino(meth)acrylic acid Ester, glycidyl (meth)acrylate, 2,2,2-trifluoroethyl (meth)acrylate, 2,2,3,3-tetrafluoropropyl (meth)acrylate, phthalic acid derivatives (Meth) acrylic acid half ester, etc. These monofunctional photopolymerizable monomers can be used alone or in combination of two or more kinds.

作為多官能光聚合性單體,可例舉:乙二醇二(甲基)丙烯酸酯、二乙二醇二(甲基)丙烯酸酯、四乙二醇二(甲基)丙烯酸酯、丙二醇二(甲基)丙烯酸酯、聚丙二醇二(甲基)丙烯酸酯、丁二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、1,6-己二醇二(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、甘油二(甲基)丙烯酸酯、季戊四醇三丙烯酸酯、季戊四醇四丙烯酸酯、二季戊四醇五丙烯酸酯、二季戊四醇六丙烯酸酯、季戊四醇二(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、季戊四醇四(甲基)丙烯酸酯、二季戊四醇五(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、2,2-雙(4-(甲基)丙烯醯氧基二乙氧基苯基)丙烷、2,2-雙(4-(甲基)丙烯醯氧基聚乙氧基苯基)丙烷、(甲基)丙烯酸2-羥基-3-(甲基)丙烯醯氧基丙酯、乙二醇二縮水甘油醚二(甲基)丙烯酸酯、二乙二醇二縮水甘油醚二(甲基)丙烯酸酯、鄰苯二甲酸二縮水甘油酯二(甲基)丙烯酸酯、甘油三丙烯酸酯、甘油聚縮水甘油醚聚(甲基)丙烯酸酯、胺基甲酸酯(甲基)丙烯酸酯(即,甲苯二異氰酸酯)、三甲基六亞甲基二異氰酸酯與六亞甲基二異氰酸酯及(甲基)丙烯酸2-羥乙酯之反應物、亞甲基雙(甲基)丙烯醯胺、(甲基)丙烯醯胺基亞甲基醚、多元醇與N-羥甲基(甲基)丙烯醯胺之縮合物等多官能單體;三丙烯醯基縮甲醛等。該等多官能光聚合性單體可單獨使用或組合兩種以上而使用。Examples of the multifunctional photopolymerizable monomer include ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, tetraethylene glycol di(meth)acrylate, and propylene glycol di(meth)acrylate. (Meth)acrylate, polypropylene glycol di(meth)acrylate, butanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate Base) acrylate, trimethylolpropane tri(meth)acrylate, glycerol di(meth)acrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, pentaerythritol Di(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, 2,2- Bis(4-(meth)acryloyloxydiethoxyphenyl)propane, 2,2-bis(4-(meth)acryloyloxypolyethoxyphenyl)propane, (methyl) Acrylic acid 2-hydroxy-3-(meth)acryloxypropyl ester, ethylene glycol diglycidyl ether di(meth)acrylate, diethylene glycol diglycidyl ether di(meth)acrylate, ortho Diglycidyl phthalate di(meth)acrylate, glycerol triacrylate, glycerol polyglycidyl ether poly(meth)acrylate, urethane (meth)acrylate (ie, toluene diisocyanate) ), the reactant of trimethylhexamethylene diisocyanate, hexamethylene diisocyanate and 2-hydroxyethyl (meth)acrylate, methylene bis(meth)acrylamide, (meth)propylene Multifunctional monomers such as the condensate of amide methylene ether, polyol and N-methylol (meth)acrylamide; tripropylene formal, etc. These polyfunctional photopolymerizable monomers can be used alone or in combination of two or more kinds.

該等光聚合性單體(B)中,就存在提高樹脂組合物對基板之密接性、樹脂組合物之硬化後之強度之傾向的方面而言,較佳為3官能以上之多官能光聚合性單體,更佳為4官能以上之多官能單體,進而較佳為5官能以上之多官能光聚合性單體。Among these photopolymerizable monomers (B), in terms of the tendency to improve the adhesion of the resin composition to the substrate and the strength after curing of the resin composition, a polyfunctional photopolymerization of trifunctional or higher is preferred The polyfunctional monomer is more preferably a polyfunctional monomer with tetrafunctional or higher, and more preferably a polyfunctional photopolymerizable monomer with pentafunctional or higher.

光聚合性單體(B)之樹脂組合物中之含量相對於除後述有機溶劑(S)之質量以外之樹脂組合物之質量(固形物成分整體),較佳為1質量%以上50質量%以下,更佳為5質量%以上40質量%以下。藉由設為上述範圍,而有易取得感度、顯影性、解像性之平衡之傾向。The content of the photopolymerizable monomer (B) in the resin composition is preferably 1% by mass or more and 50% by mass relative to the mass of the resin composition (total solid content) other than the mass of the organic solvent (S) described below Below, it is more preferable that it is 5 mass% or more and 40 mass% or less. By setting it in the above range, there is a tendency to easily obtain a balance of sensitivity, developability, and resolution.

・光聚合起始劑(C) 作為光聚合起始劑,可無特別限定地使用先前已知之感光性組合物中出於使具有不飽和鍵之光聚合性單體硬化之目的而使用之化合物。・Photopolymerization initiator (C) As the photopolymerization initiator, compounds used for the purpose of curing the photopolymerizable monomer having an unsaturated bond among the previously known photosensitive compositions can be used without particular limitation.

作為光聚合起始劑(C),具體而言,可例舉:1-羥基環己基苯基酮、2-羥基-2-甲基-1-苯基丙烷-1-酮、1-[4-(2-羥基乙氧基)苯基]-2-羥基-2-甲基-1-丙烷-1-酮、1-(4-異丙基苯基)-2-羥基-2-甲基丙烷-1-酮、1-(4-十二烷基苯基)-2-羥基-2-甲基丙烷-1-酮、2,2-二甲氧基-1,2-二苯基乙烷-1-酮、雙(4-二甲基胺基苯基)酮、2-甲基-1-[4-(甲硫基)苯基]-2-𠰌啉基丙烷-1-酮、2-苄基-2-二甲基胺基-1-(4-𠰌啉基苯基)-丁烷-1-酮、4-苯甲醯基-4'-甲基二甲基硫醚、4-二甲基胺基苯甲酸、4-二甲基胺基苯甲酸甲酯、4-二甲基胺基苯甲酸乙酯、4-二甲基胺基苯甲酸丁酯、4-二甲基胺基苯甲酸2-乙基己酯、4-二甲基胺基苯甲酸2-異戊酯、苄基-β-甲氧基乙基縮醛、苯偶醯二甲基縮酮、1-苯基-1,2-丙二酮-2-(O-乙氧基羰基)肟、鄰苯甲醯基苯甲酸甲酯、2,4-二乙基9-氧硫𠮿

Figure 109140475-0000-3
、2-氯9-氧硫𠮿
Figure 109140475-0000-3
、2,4-二甲基9-氧硫𠮿
Figure 109140475-0000-3
、1-氯-4-丙氧基9-氧硫𠮿
Figure 109140475-0000-3
、硫𠮿
Figure 109140475-0000-3
、2-氯硫𠮿
Figure 109140475-0000-3
、2,4-二乙基硫𠮿
Figure 109140475-0000-3
、2-甲基硫𠮿
Figure 109140475-0000-3
、2-異丙基硫𠮿
Figure 109140475-0000-3
、2-乙基蒽醌、八甲基蒽醌、1,2-苯并蒽醌、2,3-二苯基蒽醌、偶氮雙異丁腈、過氧化苯甲醯、氫過氧化異丙苯、2-巰基苯并咪唑、2-巰基苯并㗁唑、2-巰基苯并噻唑、2-(鄰氯苯基)-4,5-二(間甲氧基苯基)咪唑二聚物、二苯甲酮、2-氯二苯甲酮、p,p'-雙二甲基胺基二苯甲酮、4,4'-雙二乙基胺基二苯甲酮、4,4'-二氯二苯甲酮、3,3-二甲基-4-甲氧基二苯甲酮、二苯基乙二酮、安息香、安息香甲醚、安息香乙醚、安息香異丙醚、安息香正丁醚、安息香異丁醚、安息香丁醚、苯乙酮、2,2-二乙氧基苯乙酮、對二甲基苯乙酮、對二甲基胺基苯丙酮、二氯苯乙酮、三氯苯乙酮、對第三丁基苯乙酮、對二甲基胺基苯乙酮、對第三丁基三氯苯乙酮、對第三丁基二氯苯乙酮、α,α-二氯-4-苯氧基苯乙酮、9-氧硫𠮿
Figure 109140475-0000-3
、2-甲基9-氧硫𠮿
Figure 109140475-0000-3
、2-異丙基9-氧硫𠮿
Figure 109140475-0000-3
、二苯并環庚酮、4-二甲基胺基苯甲酸戊酯、9-苯基吖啶、1,7-雙-(9-吖啶基)庚烷、1,5-雙-(9-吖啶基)戊烷、1,3-雙-(9-吖啶基)丙烷、對甲氧基三𠯤、2,4,6-三(三氯甲基)對稱三𠯤、2-甲基-4,6-雙(三氯甲基)對稱三𠯤、2-[2-(5-甲基呋喃-2-基)乙烯基]-4,6-雙(三氯甲基)對稱三𠯤、2-[2-(呋喃-2-基)乙烯基]-4,6-雙(三氯甲基)對稱三𠯤、2-[2-(4-二乙基胺基-2-甲基苯基)乙烯基]-4,6-雙(三氯甲基)對稱三𠯤、2-[2-(3,4-二甲氧基苯基)乙烯基]-4,6-雙(三氯甲基)對稱三𠯤、2-(4-甲氧基苯基)-4,6-雙(三氯甲基)對稱三𠯤、2-(4-乙氧基苯乙烯基)-4,6-雙(三氯甲基)對稱三𠯤、2-(4-正丁氧基苯基)-4,6-雙(三氯甲基)對稱三𠯤、2,4-雙-三氯甲基-6-(3-溴-4-甲氧基)苯基對稱三𠯤、2,4-雙-三氯甲基-6-(2-溴-4-甲氧基)苯基對稱三𠯤、2,4-雙-三氯甲基-6-(3-溴-4-甲氧基)苯乙烯基苯基對稱三𠯤、2,4-雙-三氯甲基-6-(2-溴-4-甲氧基)苯乙烯基苯基對稱三𠯤等。As the photopolymerization initiator (C), specifically, 1-hydroxycyclohexyl phenyl ketone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1-[4 -(2-Hydroxyethoxy)phenyl)-2-hydroxy-2-methyl-1-propane-1-one, 1-(4-isopropylphenyl)-2-hydroxy-2-methyl Propan-1-one, 1-(4-dodecylphenyl)-2-hydroxy-2-methylpropane-1-one, 2,2-dimethoxy-1,2-diphenylethane Alkane-1-one, bis(4-dimethylaminophenyl) ketone, 2-methyl-1-[4-(methylthio)phenyl]-2-𠰌line propan-1-one, 2-benzyl-2-dimethylamino-1-(4-𠰌linephenyl)-butan-1-one, 4-benzyl-4'-methyl dimethyl sulfide, 4-dimethylaminobenzoic acid, methyl 4-dimethylaminobenzoate, ethyl 4-dimethylaminobenzoate, butyl 4-dimethylaminobenzoate, 4-dimethylaminobenzoate 2-ethylhexyl aminobenzoate, 2-isopentyl 4-dimethylaminobenzoate, benzyl-β-methoxyethyl acetal, benzyl dimethyl ketal, 1 -Phenyl-1,2-propanedione-2-(O-ethoxycarbonyl)oxime, methyl o-benzyl benzoate, 2,4-diethyl 9-oxythio𠮿
Figure 109140475-0000-3
, 2-chloro-9-oxysulfur 𠮿
Figure 109140475-0000-3
, 2,4-Dimethyl 9-oxysulfur 𠮿
Figure 109140475-0000-3
, 1-chloro-4-propoxy 9-oxysulfur 𠮿
Figure 109140475-0000-3
Sulphur
Figure 109140475-0000-3
, 2-Chlorosulfur𠮿
Figure 109140475-0000-3
, 2,4-Diethylsulfide 𠮿
Figure 109140475-0000-3
, 2-Methylsulfide
Figure 109140475-0000-3
, 2-isopropyl sulfide 𠮿
Figure 109140475-0000-3
, 2-ethylanthraquinone, octamethylanthraquinone, 1,2-benzoanthraquinone, 2,3-diphenylanthraquinone, azobisisobutyronitrile, benzyl peroxide, isohydroperoxide Propylbenzene, 2-mercaptobenzimidazole, 2-mercaptobenzoxazole, 2-mercaptobenzothiazole, 2-(o-chlorophenyl)-4,5-bis(m-methoxyphenyl)imidazole dimerization Compounds, benzophenone, 2-chlorobenzophenone, p,p'-bisdimethylaminobenzophenone, 4,4'-bisdiethylaminobenzophenone, 4,4 '-Dichlorobenzophenone, 3,3-dimethyl-4-methoxybenzophenone, diphenylethylenedione, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin positive Butyl ether, benzoin isobutyl ether, benzoin butyl ether, acetophenone, 2,2-diethoxyacetophenone, p-dimethylacetophenone, p-dimethylaminopropiophenone, dichloroacetophenone , Trichloroacetophenone, p-tertiary butyl acetophenone, p-dimethylamino acetophenone, p-tertiary butyl trichloroacetophenone, p-tertiary butyl dichloroacetophenone, α, α-Dichloro-4-phenoxyacetophenone, 9-oxysulfur 𠮿
Figure 109140475-0000-3
, 2-Methyl 9-oxysulfur 𠮿
Figure 109140475-0000-3
, 2-isopropyl 9-oxysulfur 𠮿
Figure 109140475-0000-3
, Dibenzocycloheptanone, pentyl 4-dimethylaminobenzoate, 9-phenylacridine, 1,7-bis-(9-acridinyl)heptane, 1,5-bis-( 9-acridinyl)pentane, 1,3-bis-(9-acridinyl)propane, p-methoxytris, 2,4,6-tris(trichloromethyl) symmetrical tris, 2- Methyl-4,6-bis(trichloromethyl) symmetric tris, 2-[2-(5-methylfuran-2-yl)vinyl]-4,6-bis(trichloromethyl) symmetric Tris, 2-[2-(furan-2-yl)vinyl]-4,6-bis(trichloromethyl) symmetric tris, 2-[2-(4-diethylamino-2- Methylphenyl)vinyl]-4,6-bis(trichloromethyl) symmetric tris, 2-[2-(3,4-dimethoxyphenyl)vinyl]-4,6-bis (Trichloromethyl) symmetric tris, 2-(4-methoxyphenyl)-4,6-bis(trichloromethyl) symmetric tris, 2-(4-ethoxystyryl)- 4,6-bis(trichloromethyl) symmetrical tris, 2-(4-n-butoxyphenyl)-4,6-bis(trichloromethyl) symmetrical tris, 2,4-bis-tris Chloromethyl-6-(3-bromo-4-methoxy)phenyl symmetric tris, 2,4-bis-trichloromethyl-6-(2-bromo-4-methoxy)phenyl symmetric Tris, 2,4-bis-trichloromethyl-6-(3-bromo-4-methoxy)styrylphenyl symmetric tris, 2,4-bis-trichloromethyl-6-( 2-Bromo-4-methoxy)styryl phenyl symmetric tri 𠯤 and so on.

該等光聚合起始劑(C)可單獨使用或組合兩種以上而使用。These photopolymerization initiators (C) can be used alone or in combination of two or more kinds.

又,就樹脂組合物之感度之方面而言,作為光聚合起始劑(C),較佳為肟酯化合物。 作為肟酯化合物,例如較佳為下述式(c1)所示之肟酯化合物。 [化48]

Figure 02_image095
Moreover, in terms of the sensitivity of the resin composition, the photopolymerization initiator (C) is preferably an oxime ester compound. As the oxime ester compound, for example, an oxime ester compound represented by the following formula (c1) is preferred. [化48]
Figure 02_image095

上述式(c1)中,Rc11 表示可具有取代基之碳原子數1以上10以下之烷基、可具有取代基之苯基、或可具有取代基之咔唑基。a為0或1。Rc12 表示可具有取代基之碳原子數1以上10以下之烷基、可具有取代基之苯基、或可具有取代基之咔唑基。Rc13 表示氫原子、碳原子數1以上6以下之烷基、或可具有取代基之苯基。In the above formula (c1), R c11 represents an optionally substituted alkyl group having 1 to 10 carbon atoms, an optionally substituted phenyl group, or an optionally substituted carbazolyl group. a is 0 or 1. R c12 represents an optionally substituted alkyl group having 1 to 10 carbon atoms, an optionally substituted phenyl group, or an optionally substituted carbazolyl group. R c13 represents a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or a phenyl group which may have a substituent.

於Rc11 為可具有取代基之碳原子數1以上10以下之烷基之情形時,烷基所具有之取代基之種類於不會妨礙本發明之目的之範圍內並無特別限定。When R c11 is an alkyl group having 1 or more and 10 carbon atoms which may have a substituent, the type of the substituent that the alkyl group has is not particularly limited within a range that does not interfere with the purpose of the present invention.

作為碳原子數1以上10以下之烷基可具有之較佳取代基之例,可例舉:碳原子數1以上20以下之烷氧基、碳原子數3以上10以下之環烷基、碳原子數3以上10以下之環烷氧基、碳原子數2以上20以下之飽和脂肪族醯基、碳原子數2以上20以下之烷氧基羰基、碳原子數2以上20以下之飽和脂肪族醯氧基、可具有取代基之苯基、可具有取代基之苯氧基、可具有取代基之苯硫基、可具有取代基之苯甲醯基、可具有取代基之苯氧基羰基、可具有取代基之苯甲醯氧基、可具有取代基之碳原子數7以上20以下之苯基烷基、可具有取代基之萘基、可具有取代基之萘氧基、可具有取代基之萘甲醯基、可具有取代基之萘氧基羰基、可具有取代基之萘甲醯氧基、可具有取代基之碳原子數11以上20以下之萘基烷基、可具有取代基之雜環基、可具有取代基之雜環基羰基、胺基、經1個或2個有機基取代之胺基、𠰌啉-1-基、及哌𠯤-1-基、鹵素、硝基、以及氰基等。Examples of preferable substituents that an alkyl group having 1 to 10 carbon atoms may have include: alkoxy having 1 to 20 carbon atoms, cycloalkyl having 3 to 10 carbon atoms, and carbon Cycloalkoxy groups with 3 to 10 atoms, saturated aliphatic acyl groups with 2 to 20 carbon atoms, alkoxycarbonyl groups with 2 to 20 carbon atoms, saturated aliphatic groups with 2 to 20 carbon atoms An oxy group, a phenyl group which may have a substituent, a phenoxy group which may have a substituent group, a thiophenyl group which may have a substituent group, a benzyl group which may have a substituent group, a phenoxycarbonyl group which may have a substituent group, Benzyloxy group which may have substituents, phenylalkyl group which may have substituents and carbon atoms of 7 or more and 20 or less, naphthyl which may have substituents, naphthyloxy which may have substituents, and which may have substituents The naphthyl group, the naphthyloxycarbonyl group which may have a substituent, the naphthyloxycarbonyl group which may have a substituent, the naphthylalkyl group with 11 to 20 carbon atoms which may have a substituent, and which may have a substituent Heterocyclic groups, heterocyclic carbonyl groups that may have substituents, amine groups, amino groups substituted with 1 or 2 organic groups, linolin-1-yl, and piperidine-1-yl, halogen, nitro, And cyano, etc.

碳原子數1以上10以下之烷基可為直鏈,亦可為支鏈。於此情形時,烷基之碳原子數較佳為1以上8以下,更佳為1以上5以下。The alkyl group having 1 to 10 carbon atoms may be linear or branched. In this case, the number of carbon atoms of the alkyl group is preferably 1 or more and 8 or less, more preferably 1 or more and 5 or less.

於Rc11 為可具有取代基之苯基之情形時,取代基之種類於不會妨礙本發明之目的之範圍內並無特別限定。作為苯基可具有之取代基之較佳例,可例舉:烷基、烷氧基、環烷基、環烷氧基、飽和脂肪族醯基、烷氧基羰基、飽和脂肪族醯氧基、可具有取代基之苯基、可具有取代基之苯氧基、可具有取代基之苯甲醯基、可具有取代基之苯氧基羰基、可具有取代基之苯甲醯氧基、可具有取代基之苯基烷基、可具有取代基之萘基、可具有取代基之萘氧基、可具有取代基之萘甲醯基、可具有取代基之萘氧基羰基、可具有取代基之萘甲醯氧基、可具有取代基之萘基烷基、可具有取代基之雜環基、胺基、經1個或2個有機基取代之胺基、𠰌啉-1-基、及哌𠯤-1-基、鹵素、硝基、以及氰基等。於Rc11 為可具有取代基之苯基,苯基具有複數個取代基之情形時,複數個取代基可相同,亦可不同。When R c11 is a phenyl group which may have a substituent, the type of the substituent is not particularly limited within a range that does not hinder the purpose of the present invention. Preferable examples of the substituents that the phenyl group may have include alkyl groups, alkoxy groups, cycloalkyl groups, cycloalkoxy groups, saturated aliphatic acyl groups, alkoxycarbonyl groups, and saturated aliphatic acyloxy groups. , Phenyl which may have substituents, phenoxy which may have substituents, benzyloxy which may have substituents, phenoxycarbonyl which may have substituents, benzyloxy which may have substituents, A substituted phenylalkyl group, a substituted naphthyl group, a substituted naphthyloxy group, a substituted naphthyloxy group, a substituted naphthyloxycarbonyl group, a substituted naphthyl group The naphthyloxy group, the naphthylalkyl group which may have substituents, the heterocyclic group which may have substituents, the amino group, the amino group substituted by one or two organic groups, the linolin-1-yl group, and Piper-1-yl, halogen, nitro, and cyano, etc. When R c11 is a phenyl group which may have a substituent, and the phenyl group has a plurality of substituents, the plurality of substituents may be the same or different.

於苯基所具有之取代基為烷基之情形時,其碳原子數較佳為1以上20以下,更佳為1以上10以下,進而較佳為1以上6以下,尤佳為1以上3以下,最佳為1。又,烷基可為直鏈,亦可為支鏈。作為苯基所具有之取代基為烷基時之具體例,可例舉:甲基、乙基、正丙基、異丙基、正丁基、異丁基、第二丁基、第三丁基、正戊基、異戊基、第二戊基、第三戊基、正己基、正庚基、正辛基、異辛基、第二辛基、第三辛基、正壬基、異壬基、正癸基、及異癸基等。又,烷基可於碳鏈中包含醚鍵(-O-)。於此情形時,作為苯基所具有之取代基,例如可例舉:烷氧基烷基、烷氧基烷氧基烷基。於苯基所具有之取代基為烷氧基烷基之情形時,較佳為-Rc14 -O-Rc15 所示之基。Rc14 為碳原子數1以上10以下之可為直鏈亦可為支鏈之伸烷基。Rc15 為碳原子數1以上10以下之可為直鏈亦可為支鏈之烷基。Rc14 之碳原子數較佳為1以上8以下,更佳為1以上5以下,尤佳為1以上3以下。Rc15 之碳原子數較佳為1以上8以下,更佳為1以上5以下,尤佳為1以上3以下,最佳為1。作為碳鏈中具有醚鍵之烷基之例,可例舉:甲氧基乙基、乙氧基乙基、甲氧基乙氧基乙基、乙氧基乙氧基乙基、丙氧基乙氧基乙基、及甲氧基丙基等。When the substituent of the phenyl group is an alkyl group, the number of carbon atoms is preferably 1 or more and 20 or less, more preferably 1 or more and 10 or less, still more preferably 1 or more and 6 or less, and particularly preferably 1 or more and 3 Below, the best value is 1. In addition, the alkyl group may be linear or branched. Specific examples when the substituent of the phenyl group is an alkyl group include: methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, sec-butyl, and tert-butyl. Base, n-pentyl, isopentyl, second pentyl, third pentyl, n-hexyl, n-heptyl, n-octyl, isooctyl, second octyl, third octyl, n-nonyl, iso Nonyl, n-decyl, and isodecyl, etc. In addition, the alkyl group may include an ether bond (-O-) in the carbon chain. In this case, as the substituent of the phenyl group, for example, an alkoxyalkyl group and an alkoxyalkoxyalkyl group may be mentioned. When the substituent of the phenyl group is an alkoxyalkyl group, it is preferably a group represented by -R c14 -OR c15. R c14 is an alkylene group having 1 to 10 carbon atoms, which may be linear or branched. R c15 is a linear or branched alkyl group having 1 to 10 carbon atoms. The number of carbon atoms of R c14 is preferably 1 or more and 8 or less, more preferably 1 or more and 5 or less, and particularly preferably 1 or more and 3 or less. The number of carbon atoms of R c15 is preferably 1 or more and 8 or less, more preferably 1 or more and 5 or less, particularly preferably 1 or more and 3 or less, and most preferably 1. Examples of alkyl groups with ether bonds in the carbon chain include: methoxyethyl, ethoxyethyl, methoxyethoxyethyl, ethoxyethoxyethyl, and propoxy Ethoxyethyl, and methoxypropyl, etc.

於苯基所具有之取代基為烷氧基之情形時,其碳原子數較佳為1以上20以下,更佳為1以上6以下。又,烷氧基可為直鏈,亦可為支鏈。作為苯基所具有之取代基為烷氧基時之具體例,可例舉:甲氧基、乙氧基、正丙氧基、異丙氧基、正丁氧基、異丁氧基、第二丁氧基、第三丁氧基、正戊氧基、異戊氧基、第二戊氧基、第三戊氧基、正己氧基、正庚氧基、正辛氧基、異辛氧基、第二辛氧基、第三辛氧基、正壬氧基、異壬氧基、正癸氧基、及異癸氧基等。又,烷氧基可於碳鏈中包含醚鍵(-O-)。作為碳鏈中具有醚鍵之烷氧基之例,可例舉:甲氧基乙氧基、乙氧基乙氧基、2-甲氧基-1-甲基乙氧基、甲氧基乙氧基乙氧基、乙氧基乙氧基乙氧基、丙氧基乙氧基乙氧基、及甲氧基丙氧基等。When the substituent of the phenyl group is an alkoxy group, the number of carbon atoms is preferably 1 or more and 20 or less, more preferably 1 or more and 6 or less. In addition, the alkoxy group may be linear or branched. Specific examples when the substituent of the phenyl group is an alkoxy group include: methoxy, ethoxy, n-propoxy, isopropoxy, n-butoxy, isobutoxy, and Dibutoxy, tertiary butoxy, n-pentyloxy, isopentyloxy, second pentyloxy, tertiary pentyloxy, n-hexyloxy, n-heptyloxy, n-octyloxy, isooctoxy Group, second octyloxy group, third octyloxy group, n-nononyloxy group, isononyloxy group, n-decyloxy group, isodecyloxy group, etc. In addition, the alkoxy group may include an ether bond (-O-) in the carbon chain. Examples of alkoxy groups having ether bonds in the carbon chain include: methoxyethoxy, ethoxyethoxy, 2-methoxy-1-methylethoxy, and methoxyethoxy. Oxyethoxy, ethoxyethoxyethoxy, propoxyethoxyethoxy, and methoxypropoxy, etc.

於苯基所具有之取代基為環烷基或環烷氧基之情形時,其碳原子數較佳為3以上10以下,更佳為3以上6以下。作為苯基所具有之取代基為環烷基時之具體例,可例舉:環丙基、環丁基、環戊基、環己基、環庚基、及環辛基等。作為苯基所具有之取代基為環烷氧基時之具體例,可例舉:環丙氧基、環丁氧基、環戊氧基、環己氧基、環庚氧基、及環辛氧基等。When the substituent of the phenyl group is a cycloalkyl group or a cycloalkoxy group, the number of carbon atoms is preferably 3 or more and 10 or less, more preferably 3 or more and 6 or less. Specific examples when the substituent of the phenyl group is a cycloalkyl group include cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl, cycloheptyl, cyclooctyl, and the like. Specific examples when the substituent of the phenyl group is a cycloalkoxy group include cyclopropoxy, cyclobutoxy, cyclopentyloxy, cyclohexyloxy, cycloheptyloxy, and cyclooctyloxy. Oxy etc.

於苯基所具有之取代基為飽和脂肪族醯基或飽和脂肪族醯氧基之情形時,其碳原子數較佳為2以上20以下,更佳為2以上7以下。作為苯基所具有之取代基為飽和脂肪族醯基時之具體例,可例舉:乙醯基、丙醯基、正丁醯基、2-甲基丙醯基、正戊醯基、2,2-二甲基丙醯基、正己醯基、正庚醯基、正辛醯基、正壬醯基、正癸醯基、正十一碳醯基、正十二碳醯基、正十三碳醯基、正十四碳醯基、正十五碳醯基、及正十六碳醯基等。作為苯基所具有之取代基為飽和脂肪族醯氧基時之具體例,可例舉:乙醯氧基、丙醯氧基、正丁醯氧基、2-甲基丙醯氧基、正戊醯氧基、2,2-二甲基丙醯氧基、正己醯氧基、正庚醯氧基、正辛醯氧基、正壬醯氧基、正癸醯氧基、正十一碳醯氧基、正十二碳醯氧基、正十三碳醯氧基、正十四碳醯氧基、正十五碳醯氧基、及正十六碳醯氧基等。When the substituent of the phenyl group is a saturated aliphatic acyl group or a saturated aliphatic acyloxy group, the number of carbon atoms is preferably 2 or more and 20 or less, more preferably 2 or more and 7 or less. As specific examples when the substituent of the phenyl group is a saturated aliphatic acyl group, acetyl group, propyl group, n-butanyl group, 2-methylpropanyl group, n-pentanyl group, 2,2 -Dimethyl propanyl, n-hexyl, n-heptanyl, n-octyl, n-nonanyl, n-decanoyl, n-undecanoyl, n-dodecanoyl, n-tridecanoyl , N-fourteen-carbon acyl group, n-five-carbon acyl group, and n-hexadecyl acyl group and so on. Specific examples when the substituent of the phenyl group is a saturated aliphatic oxy group include: acetoxy group, propoxy group, n-butoxy group, 2-methylpropoxy group, n- Pentanoyloxy, 2,2-dimethylpropanoyloxy, n-hexyloxy, n-heptanoyloxy, n-octanoyloxy, n-nonanoyloxy, n-decanoyloxy, n-undecyloxy Oxooxy, n-dodecanoyloxy, n-tridecanooxy, n-tetradecanoyloxy, n-pentadecanoyloxy, and n-hexadecanoxyoxy, etc.

於苯基所具有之取代基為烷氧基羰基之情形時,其碳原子數較佳為2以上20以下,更佳為2以上7以下。作為苯基所具有之取代基為烷氧基羰基時之具體例,可例舉:甲氧基羰基、乙氧基羰基、正丙氧基羰基、異丙氧基羰基、正丁氧基羰基、異丁氧基羰基、第二丁氧基羰基、第三丁氧基羰基、正戊氧基羰基、異戊氧基羰基、第二戊氧基羰基、第三戊氧基羰基、正己氧基羰基、正庚氧基羰基、正辛氧基羰基、異辛氧基羰基、第二辛氧基羰基、第三辛氧基羰基、正壬氧基羰基、異壬氧基羰基、正癸氧基羰基、及異癸氧基羰基等。When the substituent of the phenyl group is an alkoxycarbonyl group, the number of carbon atoms is preferably 2 or more and 20 or less, more preferably 2 or more and 7 or less. As specific examples when the substituent of the phenyl group is an alkoxycarbonyl group, methoxycarbonyl, ethoxycarbonyl, n-propoxycarbonyl, isopropoxycarbonyl, n-butoxycarbonyl, Isobutoxycarbonyl, second butoxycarbonyl, third butoxycarbonyl, n-pentoxycarbonyl, isopentoxycarbonyl, second pentoxycarbonyl, third pentoxycarbonyl, n-hexoxycarbonyl , N-heptyloxycarbonyl, n-octyloxycarbonyl, isooctyloxycarbonyl, second octyloxycarbonyl, third octyloxycarbonyl, n-nonyloxycarbonyl, isononyloxycarbonyl, n-decyloxycarbonyl , And isodecyloxycarbonyl, etc.

於苯基所具有之取代基為苯基烷基之情形時,其碳原子數較佳為7以上20以下,更佳為7以上10以下。又,於苯基所具有之取代基為萘基烷基之情形時,其碳原子數較佳為11以上20以下,更佳為11以上14以下。作為苯基所具有之取代基為苯基烷基時之具體例,可例舉:苄基、2-苯基乙基、3-苯基丙基、及4-苯基丁基。作為苯基所具有之取代基為萘基烷基時之具體例,可例舉:α-萘基甲基、β-萘基甲基、2-(α-萘基)乙基、及2-(β-萘基)乙基。於苯基所具有之取代基為苯基烷基或萘基烷基之情形時,取代基可於苯基或萘基上進而具有取代基。When the substituent of the phenyl group is a phenylalkyl group, the number of carbon atoms is preferably 7 or more and 20 or less, more preferably 7 or more and 10 or less. When the substituent of the phenyl group is a naphthylalkyl group, the number of carbon atoms is preferably 11 or more and 20 or less, and more preferably 11 or more and 14 or less. Specific examples when the substituent of the phenyl group is a phenylalkyl group include benzyl, 2-phenylethyl, 3-phenylpropyl, and 4-phenylbutyl. Specific examples when the substituent of the phenyl group is naphthylalkyl include α-naphthylmethyl, β-naphthylmethyl, 2-(α-naphthyl)ethyl, and 2-naphthylmethyl. (β-Naphthyl) ethyl. When the substituent of the phenyl group is a phenylalkyl group or a naphthylalkyl group, the substituent may further have a substituent on the phenyl group or the naphthyl group.

於苯基所具有之取代基為雜環基之情形時,雜環基為包含1個以上之N、S、O之五員或六員之單環,或為該單環彼此或者該單環與苯環縮合而成之雜環基。於雜環基為稠環之情形時,使構成稠環之單環之數至多為3。作為構成該雜環基之雜環,可例舉:呋喃、噻吩、吡咯、㗁唑、異㗁唑、噻唑、噻二唑、異噻唑、咪唑、吡唑、三唑、吡啶、吡𠯤、嘧啶、嗒𠯤、苯并呋喃、苯并噻吩、吲哚、異吲哚、吲哚嗪、苯并咪唑、苯并三唑、苯并㗁唑、苯并噻唑、咔唑、嘌呤、喹啉、異喹啉、喹唑啉、呔𠯤、㖕啉、及喹㗁啉等。於苯基所具有之取代基為雜環基之情形時,雜環基可進而具有取代基。When the substituent of the phenyl group is a heterocyclic group, the heterocyclic group is a monocyclic ring containing more than one of five or six members of N, S, and O, or the monocyclic rings or the monocyclic ring Heterocyclic group condensed with benzene ring. When the heterocyclic group is a condensed ring, the number of monocyclic rings constituting the condensed ring is 3 at most. Examples of the heterocyclic ring constituting the heterocyclic group include furan, thiophene, pyrrole, azole, isoazole, thiazole, thiadiazole, isothiazole, imidazole, pyrazole, triazole, pyridine, pyrrole, pyrimidine , Da 𠯤, benzofuran, benzothiophene, indole, isoindole, indoleazine, benzimidazole, benzotriazole, benzoxazole, benzothiazole, carbazole, purine, quinoline, isoindole Quinoline, quinazoline, quinoline, quinoline, and quinoline, etc. When the substituent of the phenyl group is a heterocyclic group, the heterocyclic group may further have a substituent.

於苯基所具有之取代基為經1個或2個有機基取代之胺基之情形時,有機基之較佳例可例舉:碳原子數1以上20以下之烷基、碳原子數3以上10以下之環烷基、碳原子數2以上20以下之飽和脂肪族醯基、碳原子數2以上20以下之飽和脂肪族醯氧基、可具有取代基之苯基、可具有取代基之苯甲醯基、可具有取代基之碳原子數7以上20以下之苯基烷基、可具有取代基之萘基、可具有取代基之萘甲醯基、可具有取代基之碳原子數11以上20以下之萘基烷基、及雜環基等。作為該等較佳有機基之具體例,可例舉與以上關於苯基所具有之取代基所述之基同樣之基。作為經1個或2個有機基取代之胺基之具體例,可例舉:甲基胺基、乙基胺基、二乙基胺基、正丙基胺基、二正丙基胺基、異丙基胺基、正丁基胺基、二正丁基胺基、正戊基胺基、正己基胺基、正庚基胺基、正辛基胺基、正壬基胺基、正癸基胺基、苯基胺基、萘基胺基、乙醯基胺基、丙醯基胺基、正丁醯基胺基、正戊醯基胺基、正己醯基胺基、正庚醯基胺基、正辛醯基胺基、正癸醯基胺基、苯甲醯基胺基、α-萘甲醯基胺基、β-萘甲醯基胺基、及N-乙醯基-N-乙醯氧基胺基等。When the substituent of the phenyl group is an amine group substituted with one or two organic groups, preferable examples of the organic group include: an alkyl group having 1 to 20 carbon atoms, and 3 carbon atoms. Cycloalkyl groups of more than 10 or less, saturated aliphatic acyl groups of 2 to 20 carbon atoms, saturated aliphatic oxy groups of 2 to 20 carbon atoms, phenyl groups that may have substituents, and those that may have substituents Benzyl group, optionally substituted phenylalkyl group with 7 or more carbon atoms and less than 20 carbon atoms, optionally substituted naphthyl group, optionally substituted naphthyl group, optionally substituted carbon atom number 11 Above 20 naphthyl alkyl, heterocyclic group, etc. As specific examples of these preferable organic groups, the same groups as those described above regarding the substituents of the phenyl group can be cited. Specific examples of the amino group substituted with one or two organic groups include: methylamino, ethylamino, diethylamino, n-propylamino, di-n-propylamino, Isopropylamino, n-butylamino, di-n-butylamino, n-pentylamino, n-hexylamino, n-heptylamino, n-octylamino, n-nonylamino, n-decyl Amino, phenylamino, naphthylamino, acetylamino, propionylamino, n-butyrylamino, n-pentanylamino, n-hexylamino, n-heptanylamino , N-octanoylamino, n-decanoylamino, benzylamino, α-naphthylamino, β-naphthylamino, and N-acetyl-N-acetoxy Amino groups and so on.

作為苯基所具有之取代基中所包含之苯基、萘基及雜環基進而具有取代基時之取代基,可例舉:碳原子數1以上6以下之烷基、碳原子數1以上6以下之烷氧基、碳原子數2以上7以下之飽和脂肪族醯基、碳原子數2以上7以下之烷氧基羰基、碳原子數2以上7以下之飽和脂肪族醯氧基、具有碳原子數1以上6以下之烷基之單烷基胺基、具有碳原子數1以上6以下之烷基之二烷基胺基、𠰌啉-1-基、哌𠯤-1-基、鹵素、硝基、及氰基等。於苯基所具有之取代基中所包含之苯基、萘基及雜環基進而具有取代基之情形時,該取代基之數於不會妨礙本發明之目的之範圍內並無限定,較佳為1以上4以下。於苯基所具有之取代基中所包含之苯基、萘基及雜環基具有複數個取代基之情形時,複數個取代基可相同,亦可不同。Examples of the substituent when the phenyl, naphthyl, and heterocyclic group included in the substituent of the phenyl group further have a substituent include: an alkyl group having 1 to 6 carbon atoms, and 1 or more carbon atoms Alkoxy groups with 6 or less, saturated aliphatic acyl groups with 2 to 7 carbon atoms, alkoxycarbonyl groups with 2 to 7 carbon atoms, saturated aliphatic oxy groups with 2 to 7 carbon atoms, Monoalkylamino groups of alkyl groups with 1 to 6 carbon atoms, dialkylamino groups with alkyl groups with 1 to 6 carbon atoms, linolin-1-yl, piperidine-1-yl, halogen , Nitro, and cyano, etc. When the phenyl, naphthyl and heterocyclic groups included in the substituents of the phenyl group further have substituents, the number of the substituents is not limited within the range that does not interfere with the purpose of the present invention. Preferably, it is 1 or more and 4 or less. When the phenyl group, the naphthyl group, and the heterocyclic group contained in the substituent of the phenyl group have a plurality of substituents, the plurality of substituents may be the same or different.

以上,對Rc11 為可具有取代基之苯基時之取代基進行了說明,於該等取代基中,較佳為烷基或烷氧基烷基。Above, the substituent when R c11 is a phenyl group which may have a substituent is explained, and among these substituents, an alkyl group or an alkoxyalkyl group is preferable.

於Rc11 為可具有取代基之苯基之情形時,取代基之數與取代基之鍵結位置於不會妨礙本發明之目的之範圍內並無特別限定。於Rc11 為可具有取代基之苯基之情形時,就鹼之產生效率優異之方面而言,可具有取代基之苯基較佳為可具有取代基之鄰甲苯基。When R c11 is a phenyl group which may have a substituent, the number of substituents and the bonding position of the substituents are not particularly limited within a range that does not interfere with the purpose of the present invention. When R c11 is a phenyl group that may have a substituent, the phenyl group that may have a substituent is preferably an o-tolyl group that may have a substituent in terms of excellent base generation efficiency.

於Rc11 為可具有取代基之咔唑基之情形時,取代基之種類於不會妨礙本發明之目的之範圍內並無特別限定。作為咔唑基可於碳原子上具有之較佳取代基之例,可例舉:碳原子數1以上20以下之烷基、碳原子數1以上20以下之烷氧基、碳原子數3以上10以下之環烷基、碳原子數3以上10以下之環烷氧基、碳原子數2以上20以下之飽和脂肪族醯基、碳原子數2以上20以下之烷氧基羰基、碳原子數2以上20以下之飽和脂肪族醯氧基、可具有取代基之苯基、可具有取代基之苯氧基、可具有取代基之苯硫基、可具有取代基之苯基羰基、可具有取代基之苯甲醯基、可具有取代基之苯氧基羰基、可具有取代基之苯甲醯氧基、可具有取代基之碳原子數7以上20以下之苯基烷基、可具有取代基之萘基、可具有取代基之萘氧基、可具有取代基之萘基羰基、可具有取代基之萘甲醯基、可具有取代基之萘氧基羰基、可具有取代基之萘甲醯氧基、可具有取代基之碳原子數11以上20以下之萘基烷基、可具有取代基之雜環基、可具有取代基之雜環基羰基、胺基、經1個或2個有機基取代之胺基、𠰌啉-1-基、及哌𠯤-1-基、鹵素、硝基、以及氰基等。When R c11 is a carbazolyl group which may have a substituent, the type of the substituent is not particularly limited within a range that does not hinder the purpose of the present invention. Examples of preferable substituents that the carbazolyl group may have on carbon atoms include: alkyl groups with 1 to 20 carbon atoms, alkoxy groups with 1 to 20 carbon atoms, and 3 or more carbon atoms. Cycloalkyl groups of 10 or less, cycloalkoxy groups of carbon atoms of 3 to 10, saturated aliphatic aliphatic groups of carbon atoms of 2 to 20, alkoxycarbonyl groups of 2 to 20 carbon atoms, number of carbon atoms 2 Saturated aliphatic acyloxy groups of more than 20 and less than 20, phenyl groups which may have substituents, phenoxy groups which may have substituents, phenylthio groups which may have substituents, phenylcarbonyl groups which may have substituents, and which may be substituted Benzyl group, optionally substituted phenoxycarbonyl group, optionally substituted benzyloxy group, optionally substituted phenylalkyl group with 7 to 20 carbon atoms, optionally substituted The naphthyl group, the naphthyloxy group that may have a substituent, the naphthylcarbonyl group that may have a substituent, the naphthyloxycarbonyl group that may have a substituent, the naphthyloxycarbonyl group that may have a substituent, and the naphthyloxycarbonyl group that may have a substituent Oxy group, optionally substituted naphthylalkyl with 11 or more and 20 carbon atoms, optionally substituted heterocyclic group, optionally substituted heterocyclic carbonyl group, amino group, with 1 or 2 organic Group substituted amine, linolin-1-yl, piperidine-1-yl, halogen, nitro, and cyano, etc.

於Rc11 為可具有取代基之咔唑基之情形時,作為咔唑基可於氮原子上具有之較佳取代基之例,可例舉:碳原子數1以上20以下之烷基、碳原子數3以上10以下之環烷基、碳原子數2以上20以下之飽和脂肪族醯基、碳原子數2以上20以下之烷氧基羰基、可具有取代基之苯基、可具有取代基之苯甲醯基、可具有取代基之苯氧基羰基、可具有取代基之碳原子數7以上20以下之苯基烷基、可具有取代基之萘基、可具有取代基之萘甲醯基、可具有取代基之萘氧基羰基、可具有取代基之碳原子數11以上20以下之萘基烷基、可具有取代基之雜環基、及可具有取代基之雜環基羰基等。該等取代基中,較佳為碳原子數1以上20以下之烷基,更佳為碳原子數1以上6以下之烷基,尤佳為乙基。When R c11 is a carbazolyl group that may have a substituent, examples of preferable substituents that the carbazolyl group may have on the nitrogen atom include: an alkyl group having 1 to 20 carbon atoms, carbon Cycloalkyl groups with 3 to 10 atoms, saturated aliphatic acyl groups with 2 to 20 carbon atoms, alkoxycarbonyl groups with 2 to 20 carbon atoms, optionally substituted phenyl groups, optionally substituted The benzyl group, the phenoxycarbonyl group which may have a substituent, the phenylalkyl group which may have a substituent and the carbon number of 7 or more and 20 or less, the naphthyl which may have a substituent, and the naphthyl which may have a substituent Group, optionally substituted naphthyloxycarbonyl, optionally substituted naphthylalkyl having 11 or more and 20 or less carbon atoms, optionally substituted heterocyclic group, optionally substituted heterocyclic carbonyl group, etc. . Among these substituents, an alkyl group having 1 to 20 carbon atoms is preferred, an alkyl group having 1 to 6 carbon atoms is more preferred, and an ethyl group is particularly preferred.

關於咔唑基可具有之取代基之具體例,就烷基、烷氧基、環烷基、環烷氧基、飽和脂肪族醯基、烷氧基羰基、飽和脂肪族醯氧基、可具有取代基之苯基烷基、可具有取代基之萘基烷基、可具有取代基之雜環基、及經1個或2個有機基取代之胺基而言,與Rc11 為可具有取代基之苯基時之苯基所具有之取代基的例相同。Regarding specific examples of the substituents that the carbazolyl group may have, the alkyl group, alkoxy group, cycloalkyl group, cycloalkoxy group, saturated aliphatic acyl group, alkoxycarbonyl group, saturated aliphatic acyloxy group, may have Substituent phenylalkyl, optionally substituted naphthylalkyl, optionally substituted heterocyclic group, and amine group substituted with one or two organic groups, and R c11 is optionally substituted The examples of the substituents of the phenyl group in the case of the phenyl group are the same.

Rc11 中,作為咔唑基所具有之取代基中所包含之苯基、萘基及雜環基進而具有取代基時之取代基之例,可例舉:碳原子數1以上6以下之烷基;碳原子數1以上6以下之烷氧基;碳原子數2以上7以下之飽和脂肪族醯基;碳原子數2以上7以下之烷氧基羰基;碳原子數2以上7以下之飽和脂肪族醯氧基;苯基;萘基;苯甲醯基;萘甲醯基;經選自由碳原子數1以上6以下之烷基、𠰌啉-1-基、哌𠯤-1-基、及苯基所組成之群中之基取代之苯甲醯基;具有碳原子數1以上6以下之烷基之單烷基胺基;具有碳原子數1以上6以下之烷基之二烷基胺基;𠰌啉-1-基;哌𠯤-1-基;鹵素;硝基;氰基。於咔唑基所具有之取代基中所包含之苯基、萘基及雜環基進而具有取代基之情形時,該取代基之數於不會妨礙本發明之目的之範圍內並無限定,較佳為1以上4以下。於苯基、萘基及雜環基具有複數個取代基之情形時,複數個取代基可相同,亦可不同。In R c11 , examples of the substituent when the phenyl, naphthyl, and heterocyclic group contained in the substituent of the carbazolyl group further have a substituent include: an alkyl having 1 to 6 carbon atoms Group; Alkoxy with 1 to 6 carbon atoms; Saturated aliphatic acyl with 2 to 7 carbon atoms; Alkoxycarbonyl with 2 to 7 carbon atoms; Saturated with 2 to 7 carbon atoms Aliphatic phenyloxy; phenyl; naphthyl; benzyl; naphthyl; Benzoyl substituted with a group consisting of phenyl and phenyl; monoalkylamino group having an alkyl group having 1 to 6 carbon atoms; dialkyl having an alkyl group having 1 to 6 carbon atoms Amino; 𠰌lin-1-yl; piper-1-yl; halogen; nitro; cyano. When the phenyl, naphthyl and heterocyclic groups included in the substituents of the carbazolyl group further have substituents, the number of the substituents is not limited within a range that does not interfere with the purpose of the present invention. Preferably it is 1 or more and 4 or less. When the phenyl group, the naphthyl group, and the heterocyclic group have plural substituents, the plural substituents may be the same or different.

Rc12 為可具有取代基之碳原子數1以上10以下之烷基、或可具有取代基之苯基、或可具有取代基之咔唑基。R c12 is an optionally substituted alkyl group having 1 to 10 carbon atoms, or an optionally substituted phenyl group, or an optionally substituted carbazolyl group.

於Rc12 為可具有取代基之碳原子數1以上10以下之烷基之情形時,烷基可為直鏈,亦可為支鏈。於此情形時,烷基之碳原子數較佳為1以上8以下,更佳為1以上5以下。When R c12 is an optionally substituted alkyl group having 1 to 10 carbon atoms, the alkyl group may be linear or branched. In this case, the number of carbon atoms of the alkyl group is preferably 1 or more and 8 or less, more preferably 1 or more and 5 or less.

Rc12 中,烷基或苯基所具有之取代基於不會妨礙本發明之目的之範圍內並無特別限定。 作為烷基可於碳原子上具有之較佳取代基之例,可例舉:碳原子數1以上20以下之烷氧基、碳原子數3以上10以下之環烷基、碳原子數3以上10以下之環烷氧基、碳原子數2以上20以下之飽和脂肪族醯基、碳原子數2以上20以下之烷氧基羰基、碳原子數2以上20以下之飽和脂肪族醯氧基、可具有取代基之苯基、可具有取代基之苯氧基、可具有取代基之苯硫基、可具有取代基之苯甲醯基、可具有取代基之苯氧基羰基、可具有取代基之苯甲醯氧基、可具有取代基之碳原子數7以上20以下之苯基烷基、可具有取代基之萘基、可具有取代基之萘氧基、可具有取代基之萘甲醯基、可具有取代基之萘氧基羰基、可具有取代基之萘甲醯氧基、可具有取代基之碳原子數11以上20以下之萘基烷基、可具有取代基之雜環基、可具有取代基之雜環基羰基、胺基、經1個或2個有機基取代之胺基、𠰌啉-1-基、及哌𠯤-1-基、鹵素、硝基、以及氰基等。 作為苯基可於碳原子上具有之較佳取代基之例,除上述中作為烷基可於碳原子上具有之較佳取代基所例示之基以外,可例舉碳原子數1以上20以下之烷基。In R c12 , the substitution of the alkyl group or the phenyl group is not particularly limited as long as it does not interfere with the purpose of the present invention. Examples of preferable substituents that the alkyl group may have on carbon atoms include: alkoxy groups having 1 to 20 carbon atoms, cycloalkyl groups having 3 to 10 carbon atoms, and 3 or more carbon atoms Cycloalkoxy groups of 10 or less, saturated aliphatic acyl groups of 2 to 20 carbon atoms, alkoxycarbonyl groups of 2 to 20 carbon atoms, saturated aliphatic oxy groups of 2 to 20 carbon atoms, Phenyl which may have substituents, phenoxy which may have substituents, thiophenyl which may have substituents, benzyl which may have substituents, phenoxycarbonyl which may have substituents, which may have substituents The benzyloxy group, the phenylalkyl group having 7 to 20 carbon atoms which may have a substituent, the naphthyl group which may have a substituent, the naphthoxy group which may have a substituent, the naphthyloxy group which may have a substituent Group, optionally substituted naphthyloxycarbonyl, optionally substituted naphthyloxy, optionally substituted naphthylalkyl with 11 to 20 carbon atoms, optionally substituted heterocyclic group, Heterocyclic carbonyl group, amine group, amine group substituted by 1 or 2 organic groups, pyrolin-1-yl, piperidine-1-yl, halogen, nitro, and cyano group which may have substituents, etc. . As examples of preferable substituents that the phenyl group may have on carbon atoms, in addition to the groups exemplified above as preferable substituents that the alkyl group may have on carbon atoms, the number of carbon atoms may be from 1 to 20.之alkyl.

關於烷基或苯基可具有之取代基之具體例,就烷基、烷氧基、環烷基、環烷氧基、飽和脂肪族醯基、烷氧基羰基、飽和脂肪族醯氧基、可具有取代基之苯基烷基、可具有取代基之萘基烷基、可具有取代基之雜環基、及經1個或2個有機基取代之胺基而言,與Rc11 為可具有取代基之苯基時之苯基所具有之取代基的例相同。Regarding specific examples of substituents that an alkyl group or a phenyl group may have, there are alkyl groups, alkoxy groups, cycloalkyl groups, cycloalkoxy groups, saturated aliphatic acyl groups, alkoxycarbonyl groups, saturated aliphatic acyloxy groups, For phenylalkyl which may have substituents, naphthylalkyl which may have substituents, heterocyclic groups which may have substituents, and amine groups substituted with one or two organic groups, R c11 is optional In the case of a substituted phenyl group, the examples of the substituents of the phenyl group are the same.

Rc12 中,作為烷基或苯基所具有之取代基中所包含之苯基、萘基及雜環基進而具有取代基時之取代基之例,可例舉:碳原子數1以上6以下之烷基;碳原子數1以上6以下之烷氧基;碳原子數2以上7以下之飽和脂肪族醯基;碳原子數2以上7以下之烷氧基羰基;碳原子數2以上7以下之飽和脂肪族醯氧基;苯基;萘基;苯甲醯基;萘甲醯基;經選自由碳原子數1以上6以下之烷基、𠰌啉-1-基、哌𠯤-1-基、及苯基所組成之群中之基取代之苯甲醯基;具有碳原子數1以上6以下之烷基之單烷基胺基;具有碳原子數1以上6以下之烷基之二烷基胺基;𠰌啉-1-基;哌𠯤-1-基;鹵素;硝基;氰基。於烷基或苯基所具有之取代基中所包含之苯基、萘基及雜環基進而具有取代基之情形時,該取代基之數於不會妨礙本發明之目的之範圍內並無限定,較佳為1以上4以下。於苯基、萘基及雜環基具有複數個取代基之情形時,複數個取代基可相同,亦可不同。In R c12 , examples of substituents when the phenyl, naphthyl, and heterocyclic groups contained in the substituents of the alkyl group or the phenyl group further have a substituent include: 1 to 6 carbon atoms Alkyl groups with 1 to 6 carbon atoms; saturated aliphatic aliphatic groups with 2 to 7 carbon atoms; alkoxycarbonyl with 2 to 7 carbon atoms; 2 to 7 carbon atoms The saturated aliphatic aliphatic oxy; phenyl; naphthyl; benzyl; naphthyl; Benzyl group substituted with a group consisting of a phenyl group and a phenyl group; a monoalkylamino group having an alkyl group having 1 to 6 carbon atoms; two of an alkyl group having 1 to 6 carbon atoms Alkylamino; 𠰌lin-1-yl; piper-1-yl; halogen; nitro; cyano. When the phenyl, naphthyl and heterocyclic groups contained in the substituents of the alkyl group or the phenyl group further have substituents, the number of the substituents is not within the range that does not hinder the purpose of the present invention The limit is preferably 1 or more and 4 or less. When the phenyl group, the naphthyl group, and the heterocyclic group have plural substituents, the plural substituents may be the same or different.

於Rc12 為可具有取代基之咔唑基之情形時,咔唑基所具有之取代基之種類於不會妨礙本發明之目的之範圍內並無特別限定。作為咔唑基可具有之取代基之較佳例,與Rc11 為可具有取代基之咔唑基時之取代基之例相同。When R c12 is a carbazolyl group which may have a substituent, the type of the substituent that the carbazolyl group has is not particularly limited within a range that does not interfere with the purpose of the present invention. As a preferable example of the substituent which the carbazolyl group may have, it is the same as the example of the substituent when R c11 is a carbazolyl group which may have a substituent.

] 就式(c1)所示之化合物之反應性之方面而言,作為Rc12 ,較佳為下述式(c2): [化49]

Figure 02_image097
或下述式(c3): [化50]
Figure 02_image099
所示之基。In terms of the reactivity of the compound represented by the formula (c1), R c12 is preferably the following formula (c2): [化49]
Figure 02_image097
Or the following formula (c3): [化50]
Figure 02_image099
The base shown.

式(c2)中,Rc16 及Rc17 分別為一價有機基,b為0或1。式(c3)中,Rc18 為選自由一價有機基、胺基、鹵素、硝基、及氰基所組成之群中之基,Ac1 為S或O,c為0以上4以下之整數。In the formula (c2), R c16 and R c17 are a monovalent organic group, b is 0 or 1. In formula (c3), R c18 is a group selected from the group consisting of monovalent organic groups, amine groups, halogens, nitro groups, and cyano groups, A c1 is S or O, and c is an integer from 0 to 4 .

式(c2)中之Rc16 於不會妨礙本發明之目的之範圍內可自各種有機基中選擇。作為Rc16 之較佳例,可例舉:氫原子、碳原子數1以上20以下之烷基、碳原子數3以上10以下之環烷基、碳原子數2以上20以下之飽和脂肪族醯基、碳原子數2以上20以下之烷氧基羰基、可具有取代基之苯基、可具有取代基之苯甲醯基、可具有取代基之苯氧基羰基、可具有取代基之碳原子數7以上20以下之苯基烷基、可具有取代基之萘基、可具有取代基之萘甲醯基、可具有取代基之萘氧基羰基、可具有取代基之碳原子數11以上20以下之萘基烷基、可具有取代基之雜環基、及可具有取代基之雜環基羰基等。 R c16 in the formula (c2) can be selected from various organic groups within a range that does not hinder the purpose of the present invention. Preferred examples of R c16 include: hydrogen atoms, alkyl groups with 1 to 20 carbon atoms, cycloalkyls with 3 to 10 carbon atoms, and saturated aliphatic alcohols with 2 to 20 carbon atoms. Groups, alkoxycarbonyl groups with 2 to 20 carbon atoms, phenyl groups which may have substituents, benzyl groups which may have substituents, phenoxycarbonyl groups which may have substituents, and carbon atoms which may have substituents Phenylalkyl with 7 or more and 20 or less, naphthyl which may have substituents, naphthyl which may have substituents, naphthyloxycarbonyl which may have substituents, and carbon atoms which may have substituents of 11 or more and 20 The following naphthylalkyl groups, heterocyclic groups which may have substituents, and heterocyclic carbonyl groups which may have substituents, and the like.

Rc16 中,較佳為碳原子數1以上20以下之烷基,更佳為碳原子數1以上6以下之烷基,尤佳為乙基。 Among R c16, an alkyl group having 1 to 20 carbon atoms is preferable, an alkyl group having 1 to 6 carbon atoms is more preferable, and an ethyl group is particularly preferable.

式(c2)中之Rc17 於不會妨礙本發明之目的之範圍內並無特別限定,可自各種有機基中選擇。關於作為Rc17 較佳之基之具體例,可例舉:氫原子、碳原子數1以上20以下之烷基、可具有取代基之苯基、可具有取代基之萘基、及可具有取代基之雜環基。作為Rc17 ,該等基中,更佳為可具有取代基之苯基及可具有取代基之萘基,尤佳為2-甲基苯基及萘基。 R c17 in the formula (c2) is not particularly limited within a range that does not interfere with the purpose of the present invention, and it can be selected from various organic groups. Specific examples of preferred groups for R c17 include hydrogen atoms, alkyl groups having 1 to 20 carbon atoms, phenyl groups which may have substituents, naphthyl groups which may have substituents, and groups which may have substituents.的heterocyclic group. As R c17 , among these groups, the optionally substituted phenyl group and the optionally substituted naphthyl group are more preferred, and the 2-methylphenyl group and the naphthyl group are particularly preferred.

作為Rc16 或Rc17 中所包含之苯基、萘基、及雜環基進而具有取代基時之取代基,可例舉:碳原子數1以上6以下之烷基、碳原子數1以上6以下之烷氧基、碳原子數2以上7以下之飽和脂肪族醯基、碳原子數2以上7以下之烷氧基羰基、碳原子數2以上7以下之飽和脂肪族醯氧基、具有碳原子數1以上6以下之烷基之單烷基胺基、具有碳原子數1以上6以下之烷基之二烷基胺基、𠰌啉-1-基、哌𠯤-1-基、鹵素、硝基、及氰基等。於Rc16 或Rc17 中所包含之苯基、萘基、及雜環基進而具有取代基之情形時,該取代基之數於不會妨礙本發明之目的之範圍內並無限定,較佳為1以上4以下。於Rc16 或Rc17 中所包含之苯基、萘基、及雜環基具有複數個取代基之情形時,複數個取代基可相同,亦可不同。As the phenyl group R c16 or R c17 included in the group, a naphthyl group, a heterocyclic group, and further having a substituent of substituent group, include: 1 or more carbon atoms of an alkyl group having 6 or less carbon atoms, one or more 6 The following alkoxy groups, saturated aliphatic acyl groups with 2 to 7 carbon atoms, alkoxycarbonyl groups with 2 to 7 carbon atoms, saturated aliphatic oxy groups with 2 to 7 carbon atoms, and carbon atoms The monoalkylamino group of an alkyl group with 1 to 6 atoms, a dialkylamino group with an alkyl group with 1 to 6 carbon atoms, lin-1-yl, piper-1-yl, halogen, Nitro, and cyano, etc. Phenyl in R c16 or R c17 included in the group, a naphthyl group, a heterocyclic group, and the case further has a substituent group, the number of the substituent group within the scope of the object of the present invention does not interfere defined, preferably It is 1 or more and 4 or less. Phenyl in R c16 or R c17 included, the naphthyl group, and a heterocyclic group having a plurality of groups of substituents case, a plurality of substituents may be identical or different.

於式(c3)中之Rc18 為有機基之情形時,Rc18 於不會妨礙本發明之目的之範圍內可自各種有機基中選擇。式(c3)中,作為Rc18 為有機基時之較佳例,可例舉:碳原子數1以上6以下之烷基;碳原子數1以上6以下之烷氧基;碳原子數2以上7以下之飽和脂肪族醯基;碳原子數2以上7以下之烷氧基羰基;碳原子數2以上7以下之飽和脂肪族醯氧基;苯基;萘基;苯甲醯基;萘甲醯基;經選自由碳原子數1以上6以下之烷基、𠰌啉-1-基、哌𠯤-1-基、及苯基所組成之群中之基取代之苯甲醯基;具有碳原子數1以上6以下之烷基之單烷基胺基;具有碳原子數1以上6以下之烷基之二烷基胺基;𠰌啉-1-基;哌𠯤-1-基;鹵素;硝基;氰基;2-甲基苯基羰基;4-(哌𠯤-1-基)苯基羰基;4-(苯基)苯基羰基。 When R c18 in the formula (c3) is an organic group, R c18 can be selected from various organic groups within a range that does not hinder the purpose of the present invention. In the formula (c3), a preferable example when R c18 is an organic group includes: an alkyl group having 1 to 6 carbon atoms; an alkoxy group having 1 to 6 carbon atoms; and a carbon number of 2 or more. Saturated aliphatic acyl group with 7 or less; alkoxycarbonyl group with 2 to 7 carbon atoms; saturated aliphatic acyloxy with 2 to 7 carbon atoms; phenyl; naphthyl; benzyl; naphthyl Benzyl group; benzyl group substituted with a group selected from the group consisting of alkyl having 1 to 6 carbon atoms, linolin-1-yl, piperid-1-yl, and phenyl; having carbon A monoalkylamino group of an alkyl group with 1 to 6 atoms; a dialkylamino group with an alkyl group with 1 to 6 carbon atoms; Nitro; cyano; 2-methylphenylcarbonyl; 4-(piperid-1-yl)phenylcarbonyl; 4-(phenyl)phenylcarbonyl.

Rc18 中,較佳為苯甲醯基;萘甲醯基;經選自由碳原子數1以上6以下之烷基、𠰌啉-1-基、哌𠯤-1-基、及苯基所組成之群中之基取代之苯甲醯基;硝基;更佳為苯甲醯基;萘甲醯基;2-甲基苯基羰基;4-(哌𠯤-1-基)苯基羰基;4-(苯基)苯基羰基。In R c18 , preferably benzyl; naphthyl; selected from the group consisting of alkyl having 1 to 6 carbon atoms, linolin-1-yl, piperid-1-yl, and phenyl Benzyl; nitro; more preferably benzyl; naphthyl; 2-methylphenylcarbonyl; 4-(piperid-1-yl)phenylcarbonyl; 4-(phenyl)phenylcarbonyl.

又,式(c3)中,c較佳為0以上3以下之整數,更佳為0以上2以下之整數,尤佳為0或1。於c為1之情形時,Rc18 所鍵結之位置較佳為相對於Rc18 所鍵結之苯基與硫原子鍵結之鍵結鍵而為對位。Moreover, in formula (c3), c is preferably an integer of 0 or more and 3 or less, more preferably an integer of 0 or more and 2 or less, and particularly preferably 0 or 1. When c is 1, the position where R c18 is bonded is preferably a para position relative to the bonding bond between the phenyl group to which R c18 is bonded and the sulfur atom is bonded.

Rc13 為氫原子、碳原子數1以上6以下之烷基、或可具有取代基之苯基。於為可具有取代基之苯基之情形時,苯基可具有之取代基與Rc11 為可具有取代基之苯基之情形相同。作為Rc13 ,較佳為甲基、乙基、或苯基,更佳為甲基或苯基。R c13 is a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or a phenyl group which may have a substituent. In the case of a phenyl group which may have a substituent, the substituent which the phenyl group may have is the same as the case where R c11 is a phenyl group which may have a substituent. As R c13 , a methyl group, an ethyl group, or a phenyl group is preferable, and a methyl group or a phenyl group is more preferable.

作為上述式(c1)所示之化合物中亦較佳之化合物,可例舉下述式(c4)所示之化合物。 [化51]

Figure 02_image101
As a compound which is also preferable among the compounds represented by the above formula (c1), a compound represented by the following formula (c4) can be exemplified. [化51]
Figure 02_image101

上述式(c4)中,a、Rc12 及Rc13 如上所述。Rc19 為選自由一價有機基、胺基、鹵素、硝基、及氰基所組成之群中之基,d為0以上4以下之整數。In the above formula (c4), a, R c12 and R c13 are as described above. R c19 is a group selected from the group consisting of a monovalent organic group, an amino group, a halogen, a nitro group, and a cyano group, and d is an integer of 0 or more and 4 or less.

上述式(c4)中,Rc19 於不會妨礙本發明之目的之範圍內並無特別限定,於為有機基之情形時自各種有機基中適當選擇。作為Rc19 之較佳例,可例舉:烷基、烷氧基、環烷基、環烷氧基、飽和脂肪族醯基、烷氧基羰基、飽和脂肪族醯氧基、可具有取代基之苯基、可具有取代基之苯氧基、可具有取代基之苯甲醯基、可具有取代基之苯氧基羰基、可具有取代基之苯甲醯氧基、可具有取代基之苯基烷基、可具有取代基之萘基、可具有取代基之萘氧基、可具有取代基之萘甲醯基、可具有取代基之萘氧基羰基、可具有取代基之萘甲醯氧基、可具有取代基之萘基烷基、可具有取代基之雜環基、胺基、經1個或2個有機基取代之胺基、𠰌啉-1-基、哌𠯤-1-基、鹵素、硝基、及氰基等。於s為2以上4以下之整數之情形時,Rc19 可相同,亦可不同。又,取代基之碳原子數中,不包括取代基進而具有之取代基之碳原子數。In the above formula (c4), R c19 is not particularly limited as long as it does not interfere with the purpose of the present invention, and when it is an organic group, it is appropriately selected from various organic groups. Preferred examples of R c19 include: alkyl groups, alkoxy groups, cycloalkyl groups, cycloalkoxy groups, saturated aliphatic acyl groups, alkoxycarbonyl groups, saturated aliphatic acyloxy groups, which may have substituents The phenyl group, the phenoxy group which may have a substituent, the benzyl group which may have a substituent, the phenoxycarbonyl group which may have a substituent, the benzyloxy group which may have a substituent, and the benzene which may have a substituent Alkyl, naphthyl which may have substituents, naphthyloxy which may have substituents, naphthyloxycarbonyl which may have substituents, naphthoxycarbonyl which may have substituents, naphthyloxycarbonyl which may have substituents Group, naphthylalkyl which may have substituents, heterocyclic group which may have substituents, amino group, amino group substituted by 1 or 2 organic groups, lin-1-yl, piper-1-yl , Halogen, nitro, and cyano, etc. When s is an integer of 2 or more and 4 or less, R c19 may be the same or different. In addition, the number of carbon atoms of a substituent does not include the number of carbon atoms of a substituent that the substituent has.

於Rc19 為烷基之情形時,較佳為碳原子數1以上20以下,更佳為碳原子數1以上6以下。又,於Rc19 為烷基之情形時,可為直鏈,亦可為支鏈。作為Rc19 為烷基時之具體例,可例舉:甲基、乙基、正丙基、異丙基、正丁基、異丁基、第二丁基、第三丁基、正戊基、異戊基、第二戊基、第三戊基、正己基、正庚基、正辛基、異辛基、第二辛基、第三辛基、正壬基、異壬基、正癸基、及異癸基等。又,於Rc19 為烷基之情形時,烷基可於碳鏈中包含醚鍵(-O-)。作為碳鏈中具有醚鍵之烷基之例,可例舉:甲氧基乙基、乙氧基乙基、甲氧基乙氧基乙基、乙氧基乙氧基乙基、丙氧基乙氧基乙基、及甲氧基丙基等。When R c19 is an alkyl group, it is preferably 1 or more and 20 or less carbon atoms, more preferably 1 or more and 6 or less carbon atoms. In addition, when R c19 is an alkyl group, it may be a straight chain or a branched chain. Specific examples when R c19 is an alkyl group include: methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, second butyl, tertiary butyl, n-pentyl , Isopentyl, second pentyl, third pentyl, n-hexyl, n-heptyl, n-octyl, isooctyl, second octyl, third octyl, n-nonyl, isononyl, n-decyl Base, and isodecyl, etc. In addition, when R c19 is an alkyl group, the alkyl group may include an ether bond (-O-) in the carbon chain. Examples of alkyl groups with ether bonds in the carbon chain include: methoxyethyl, ethoxyethyl, methoxyethoxyethyl, ethoxyethoxyethyl, and propoxy Ethoxyethyl, and methoxypropyl, etc.

於Rc19 為烷氧基之情形時,較佳為碳原子數1以上20以下,更佳為碳原子數1以上6以下。又,於Rc19 為烷氧基之情形時,可為直鏈,亦可為支鏈。作為Rc19 為烷氧基時之具體例,可例舉:甲氧基、乙氧基、正丙氧基、異丙氧基、正丁氧基、異丁氧基、第二丁氧基、第三丁氧基、正戊氧基、異戊氧基、第二戊氧基、第三戊氧基、正己氧基、正庚氧基、正辛氧基、異辛氧基、第二辛氧基、第三辛氧基、正壬氧基、異壬氧基、正癸氧基、及異癸氧基等。又,於Rc19 為烷氧基之情形時,烷氧基可於碳鏈中包含醚鍵(-O-)。作為碳鏈中具有醚鍵之烷氧基之例,可例舉:甲氧基乙氧基、乙氧基乙氧基、甲氧基乙氧基乙氧基、乙氧基乙氧基乙氧基、丙氧基乙氧基乙氧基、及甲氧基丙氧基等。When R c19 is an alkoxy group, it is preferably 1 or more and 20 or less carbon atoms, more preferably 1 or more and 6 or less carbon atoms. In addition, when R c19 is an alkoxy group, it may be linear or branched. Specific examples when R c19 is an alkoxy group include: methoxy, ethoxy, n-propoxy, isopropoxy, n-butoxy, isobutoxy, second butoxy, Tertiary butoxy, n-pentyloxy, isopentyloxy, second pentyloxy, tertiary pentyloxy, n-hexyloxy, n-heptyloxy, n-octyloxy, isooctyloxy, second octyloxy Oxy, tertiary octyloxy, n-nonyloxy, isononyloxy, n-decyloxy, and isodecyloxy, etc. In addition, when R c19 is an alkoxy group, the alkoxy group may include an ether bond (-O-) in the carbon chain. Examples of alkoxy groups having ether bonds in the carbon chain include: methoxyethoxy, ethoxyethoxy, methoxyethoxyethoxy, ethoxyethoxyethoxy Group, propoxyethoxyethoxy, and methoxypropoxy, etc.

於Rc19 為環烷基或環烷氧基之情形時,較佳為碳原子數3以上10以下,更佳為碳原子數3以上6以下。作為Rc19 為環烷基時之具體例,可例舉:環丙基、環丁基、環戊基、環己基、環庚基、及環辛基等。作為Rc19 為環烷氧基時之具體例,可例舉:環丙氧基、環丁氧基、環戊氧基、環己氧基、環庚氧基、及環辛氧基等。When R c19 is a cycloalkyl group or a cycloalkoxy group, it is preferably 3 or more and 10 or less carbon atoms, more preferably 3 or more and 6 or less carbon atoms. Specific examples when R c19 is a cycloalkyl group include cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl, cycloheptyl, and cyclooctyl. As a specific example when R c19 is a cycloalkoxy group, a cyclopropoxy group, a cyclobutoxy group, a cyclopentyloxy group, a cyclohexyloxy group, a cycloheptyloxy group, a cyclooctyloxy group, etc. are mentioned.

於Rc19 為飽和脂肪族醯基或飽和脂肪族醯氧基之情形時,較佳為碳原子數2以上20以下,更佳為碳原子數2以上7以下。作為Rc19 為飽和脂肪族醯基時之具體例,可例舉:乙醯基、丙醯基、正丁醯基、2-甲基丙醯基、正戊醯基、2,2-二甲基丙醯基、正己醯基、正庚醯基、正辛醯基、正壬醯基、正癸醯基、正十一碳醯基、正十二碳醯基、正十三碳醯基、正十四碳醯基、正十五碳醯基、及正十六碳醯基等。作為Rc19 為飽和脂肪族醯氧基時之具體例,可例舉:乙醯氧基、丙醯氧基、正丁醯氧基、2-甲基丙醯氧基、正戊醯氧基、2,2-二甲基丙醯氧基、正己醯氧基、正庚醯氧基、正辛醯氧基、正壬醯氧基、正癸醯氧基、正十一碳醯氧基、正十二碳醯氧基、正十三碳醯氧基、正十四碳醯氧基、正十五碳醯氧基、及正十六碳醯氧基等。When R c19 is a saturated aliphatic acyl group or a saturated aliphatic acyloxy group, the number of carbon atoms is preferably 2 or more and 20 or less, and more preferably 2 or more and 7 or less. Specific examples when R c19 is a saturated aliphatic acyl group include: acetyl group, propionyl group, n-butyryl group, 2-methylpropionyl group, n-pentyl group, and 2,2-dimethylpropane group. Nyl, n-hexyl, n-heptanyl, n-octyl, n-nonyl, n-decyl, n-undecyl, n-dodecyl, n-thirteen, n-fourteen醯基, pentadecyl, and hexadecyl, etc. Specific examples when R c19 is a saturated aliphatic oxy group include: acetoxy group, propoxy group, n-butoxy group, 2-methylpropoxy group, n-pentoxy group, 2,2-Dimethylpropionyloxy, n-hexyloxy, n-heptanoyloxy, n-octanoyloxy, n-nonanoyloxy, n-decanoyloxy, n-undecanoyloxy, n- Dodecanoyloxy, n-tridecanoyloxy, n-tetradecanoyloxy, n-pentadecanoyloxy, and n-hexadecanoyloxy, etc.

於Rc19 為烷氧基羰基之情形時,較佳為碳原子數2以上20以下,更佳為碳原子數2以上7以下。作為Rc19 為烷氧基羰基時之具體例,可例舉:甲氧基羰基、乙氧基羰基、正丙氧基羰基、異丙氧基羰基、正丁氧基羰基、異丁氧基羰基、第二丁氧基羰基、第三丁氧基羰基、正戊氧基羰基、異戊氧基羰基、第二戊氧基羰基、第三戊氧基羰基、正己氧基羰基、正庚氧基羰基、正辛氧基羰基、異辛氧基羰基、第二辛氧基羰基、第三辛氧基羰基、正壬氧基羰基、異壬氧基羰基、正癸氧基羰基、及異癸氧基羰基等。When R c19 is an alkoxycarbonyl group, it is preferably 2 or more and 20 or less carbon atoms, more preferably 2 or more and 7 or less carbon atoms. Specific examples when R c19 is an alkoxycarbonyl group include: methoxycarbonyl, ethoxycarbonyl, n-propoxycarbonyl, isopropoxycarbonyl, n-butoxycarbonyl, isobutoxycarbonyl , Second butoxycarbonyl, third butoxycarbonyl, n-pentoxycarbonyl, isopentoxycarbonyl, second pentoxycarbonyl, third pentoxycarbonyl, n-hexoxycarbonyl, n-heptyloxy Carbonyl, n-octyloxycarbonyl, isooctyloxycarbonyl, second octyloxycarbonyl, third octyloxycarbonyl, n-nonyloxycarbonyl, isononyloxycarbonyl, n-decyloxycarbonyl, and isodecyloxy Group carbonyl and so on.

於Rc19 為苯基烷基之情形時,較佳為碳原子數7以上20以下,更佳為碳原子數7以上10以下。又,於Rc19 為萘基烷基之情形時,較佳為碳原子數11以上20以下,更佳為碳原子數11以上14以下。作為Rc19 為苯基烷基時之具體例,可例舉:苄基、2-苯基乙基、3-苯基丙基、及4-苯基丁基。作為Rc19 為萘基烷基時之具體例,可例舉:α-萘基甲基、β-萘基甲基、2-(α-萘基)乙基、及2-(β-萘基)乙基。於Rc19 為苯基烷基或萘基烷基之情形時,Rc19 可於苯基或萘基上進而具有取代基。When R c19 is a phenylalkyl group, it is preferably 7 or more and 20 or less carbon atoms, more preferably 7 or more and 10 or less carbon atoms. Moreover, when R c19 is a naphthylalkyl group, it is preferably from 11 to 20 carbon atoms, and more preferably from 11 to 14 carbon atoms. Specific examples when R c19 is a phenylalkyl group include benzyl, 2-phenylethyl, 3-phenylpropyl, and 4-phenylbutyl. Specific examples when R c19 is naphthylalkyl include α-naphthylmethyl, β-naphthylmethyl, 2-(α-naphthyl)ethyl, and 2-(β-naphthyl) ) Ethyl. When R c19 is a phenylalkyl group or a naphthylalkyl group, R c19 may further have a substituent on the phenyl group or the naphthyl group.

於Rc19 為雜環基之情形時,雜環基為包含1個以上之N、S、O之五員或六員之單環,或為該單環彼此或者該單環與苯環縮合而成之雜環基。於雜環基為稠環之情形時,使構成稠環之單環之數至多為3。作為構成該雜環基之雜環,可例舉:呋喃、噻吩、吡咯、㗁唑、異㗁唑、噻唑、噻二唑、異噻唑、咪唑、吡唑、三唑、吡啶、吡𠯤、嘧啶、嗒𠯤、苯并呋喃、苯并噻吩、吲哚、異吲哚、吲哚嗪、苯并咪唑、苯并三唑、苯并㗁唑、苯并噻唑、咔唑、嘌呤、喹啉、異喹啉、喹唑啉、呔𠯤、㖕啉、及喹㗁啉等。於Rc19 為雜環基之情形時,雜環基可進而具有取代基。When R c19 is a heterocyclic group, the heterocyclic group is a monocyclic ring containing more than one of five or six members of N, S, and O, or the monocyclic ring is condensed with each other or the monocyclic ring and a benzene ring. Into the heterocyclic group. When the heterocyclic group is a condensed ring, the number of monocyclic rings constituting the condensed ring is 3 at most. Examples of the heterocyclic ring constituting the heterocyclic group include furan, thiophene, pyrrole, azole, isoazole, thiazole, thiadiazole, isothiazole, imidazole, pyrazole, triazole, pyridine, pyrrole, pyrimidine , Da 𠯤, benzofuran, benzothiophene, indole, isoindole, indoleazine, benzimidazole, benzotriazole, benzoxazole, benzothiazole, carbazole, purine, quinoline, isoindole Quinoline, quinazoline, quinoline, quinoline, and quinoline, etc. When R c19 is a heterocyclic group, the heterocyclic group may further have a substituent.

於Rc19 為經1個或2個有機基取代之胺基之情形時,有機基之較佳例可例舉:碳原子數1以上20以下之烷基、碳原子數3以上10以下之環烷基、碳原子數2以上20以下之飽和脂肪族醯基、可具有取代基之苯基、可具有取代基之苯甲醯基、可具有取代基之碳原子數7以上20以下之苯基烷基、可具有取代基之萘基、可具有取代基之萘甲醯基、可具有取代基之碳原子數11以上20以下之萘基烷基、及雜環基等。該等較佳有機基之具體例與Rc19 相同。作為經1個或2個有機基取代之胺基之具體例,可例舉:甲基胺基、乙基胺基、二乙基胺基、正丙基胺基、二正丙基胺基、異丙基胺基、正丁基胺基、二正丁基胺基、正戊基胺基、正己基胺基、正庚基胺基、正辛基胺基、正壬基胺基、正癸基胺基、苯基胺基、萘基胺基、乙醯基胺基、丙醯基胺基、正丁醯基胺基、正戊醯基胺基、正己醯基胺基、正庚醯基胺基、正辛醯基胺基、正癸醯基胺基、苯甲醯基胺基、α-萘甲醯基胺基、及β-萘甲醯基胺基等。When R c19 is an amino group substituted with one or two organic groups, preferable examples of the organic group include: alkyl groups with 1 to 20 carbon atoms, and rings with 3 to 10 carbon atoms Alkyl group, saturated aliphatic acyl group having 2 to 20 carbon atoms, optionally substituted phenyl group, optionally substituted benzyl group, optionally substituted phenyl group having 7 to 20 carbon atoms An alkyl group, an optionally substituted naphthyl group, an optionally substituted naphthylmethyl group, an optionally substituted naphthylalkyl group having 11 to 20 carbon atoms, a heterocyclic group, and the like. The specific examples of these preferred organic groups are the same as R c19. As specific examples of the amino group substituted with one or two organic groups, there may be mentioned: methylamino group, ethylamino group, diethylamino group, n-propylamino group, di-n-propylamino group, Isopropylamino, n-butylamino, di-n-butylamino, n-pentylamino, n-hexylamino, n-heptylamino, n-octylamino, n-nonylamino, n-decyl Amino, phenylamino, naphthylamino, acetylamino, propionylamino, n-butyrylamino, n-pentanylamino, n-hexylamino, n-heptanylamino , N-octylamino, n-decanoylamino, benzylamino, α-naphthylamino, β-naphthylamino, etc.

作為Rc19 中所含之苯基、萘基、及雜環基進而具有取代基時之取代基,可例舉:碳原子數1以上6以下之烷基、碳原子數1以上6以下之烷氧基、碳原子數2以上7以下之飽和脂肪族醯基、碳原子數2以上7以下之烷氧基羰基、碳原子數2以上7以下之飽和脂肪族醯氧基、具有碳原子數1以上6以下之烷基之單烷基胺基、具有碳原子數1以上6以下之烷基之二烷基胺基、𠰌啉-1-基、哌𠯤-1-基、鹵素、硝基、及氰基等。於Rc19 中所含之苯基、萘基、及雜環基進而具有取代基之情形時,該取代基之數於不妨礙本發明之目的之範圍內並無限定,較佳為1以上4以下。於Rc19 中所含之苯基、萘基、及雜環基具有複數個取代基之情形時,複數個取代基可相同,亦可不同。Examples of the substituent when the phenyl, naphthyl, and heterocyclic group contained in R c19 further have a substituent include an alkyl group having 1 to 6 carbon atoms, and an alkyl group having 1 to 6 carbon atoms. Oxy group, saturated aliphatic acyl group with 2 to 7 carbon atoms, alkoxycarbonyl group with 2 to 7 carbon atoms, saturated aliphatic oxy group with 2 to 7 carbon atoms, and 1 carbon atom The monoalkylamino group of the above 6 alkyl group, the dialkylamino group of the alkyl group having 1 to 6 carbon atoms, linolin-1-yl, piperid-1-yl, halogen, nitro, And cyano, etc. When the phenyl, naphthyl, and heterocyclic groups contained in R c19 further have substituents, the number of the substituents is not limited within a range that does not interfere with the purpose of the present invention, and it is preferably 1 or more. the following. When the phenyl group, naphthyl group, and heterocyclic group contained in R c19 have plural substituents, the plural substituents may be the same or different.

Rc19 中,就化學穩定之方面、立體阻礙較少而容易進行肟酯化合物之合成之方面等而言,較佳為選自由碳原子數1以上6以下之烷基、碳原子數1以上6以下之烷氧基、及碳原子數2以上7以下之飽和脂肪族醯基所組成之群中之基,更佳為碳原子數1以上6以下之烷基,尤佳為甲基。 Among R c19, in terms of chemical stability, less steric hindrance and easier synthesis of oxime ester compounds, etc., it is preferably selected from alkyl groups having 1 to 6 carbon atoms, and 1 to 6 carbon atoms. The group of the following alkoxy groups and saturated aliphatic acyl groups having 2 to 7 carbon atoms is more preferably an alkyl group having 1 to 6 carbon atoms, and particularly preferably a methyl group.

關於Rc19 鍵結於苯基之位置,於針對Rc19 所鍵結之苯基,將苯基與肟酯化合物之主骨架之鍵結鍵之位置設為1位,將甲基之位置設為2位之情形時,較佳為4位或5位,更佳為5位。又,d較佳為0以上3以下之整數,更佳為0以上2以下之整數,尤佳為0或1。Bonded to R c19 on the position of the phenyl group, are bonded to the phenyl group for R c19 junction, the position of the main skeleton with a phenyl oxime ester compound of bonding one set of keys, the position is set as methyl In the case of 2 digits, it is preferably 4 or 5 digits, and more preferably 5 digits. In addition, d is preferably an integer of 0 or more and 3 or less, more preferably an integer of 0 or more and 2 or less, and particularly preferably 0 or 1.

上述式(c4)中之Rc13 為氫原子、碳原子數1以上6以下之烷基、或可具有取代基之苯基。至於Rc13 之具體例,如以上關於式(c1)所述。作為式(c4)中之Rc13 ,較佳為甲基、乙基及苯基,更佳為甲基及苯基。 R c13 in the above formula (c4) is a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or a phenyl group which may have a substituent. The specific examples of R c13 are as described above with respect to formula (c1). As R c13 in the formula (c4), methyl, ethyl, and phenyl are preferred, and methyl and phenyl are more preferred.

於肟酯化合物中,作為包含於式(c1)中但不包含於式(c4)中之化合物之較佳例,可例舉以下之化合物。 [化52]

Figure 02_image103
Among the oxime ester compounds, preferred examples of the compounds included in the formula (c1) but not included in the formula (c4) include the following compounds. [化52]
Figure 02_image103

又,關於作為肟酯化合物尤佳之於式(c4)所示之肟酯化合物中亦尤佳之化合物,可例舉下述式之化合物。 [化53]

Figure 02_image105
Moreover, as an oxime ester compound, the compound of the following formula is especially preferable among the oxime ester compound represented by the formula (c4). [化53]
Figure 02_image105

[化54]

Figure 02_image107
[化54]
Figure 02_image107

[化55]

Figure 02_image109
[化55]
Figure 02_image109

[化56]

Figure 02_image111
[化56]
Figure 02_image111

[化57]

Figure 02_image113
[化57]
Figure 02_image113

[化58]

Figure 02_image115
[化58]
Figure 02_image115

[化59]

Figure 02_image117
[化59]
Figure 02_image117

又,就樹脂組合物之感度及硬化物之透明性之方面而言,作為肟酯化合物,尤佳為下述式(1)所示之肟酯化合物。In addition, in terms of the sensitivity of the resin composition and the transparency of the cured product, the oxime ester compound is particularly preferably an oxime ester compound represented by the following formula (1).

[化60]

Figure 02_image119
(式(1)中,Rc1 為氫原子、硝基或一價有機基,Rc2 及Rc3 分別為可具有取代基之鏈狀烷基、可具有取代基之環狀有機基、或氫原子,Rc2 與Rc3 可相互鍵結而形成環,Rc4 為一價有機基,Rc5 為氫原子、可具有取代基之碳原子數1以上11以下之烷基、或可具有取代基之芳基,n1為0以上4以下之整數,n2為0或1)[化60]
Figure 02_image119
(In formula (1), R c1 is a hydrogen atom, a nitro group or a monovalent organic group, and R c2 and R c3 are respectively a chain alkyl group which may have a substituent, a cyclic organic group which may have a substituent, or hydrogen Atoms, R c2 and R c3 can be bonded to each other to form a ring, R c4 is a monovalent organic group, R c5 is a hydrogen atom, optionally substituted alkyl with 1 to 11 carbon atoms, or optionally substituted The aryl group, n1 is an integer from 0 to 4, n2 is 0 or 1)

式(1)中,Rc1 為氫原子、硝基或一價有機基。Rc1 於式(1)中之茀環上,鍵結於與-(CO)n2 -所示之基上鍵結之六員芳香環不同之六員芳香環。式(1)中,Rc1 對於茀環之鍵結位置並無特別限定。於式(1)所示之化合物具有1個以上之Rc1 之情形時,就容易進行式(1)所示之化合物之合成之方面等而言,較佳為1個以上之Rc1 中之1個鍵結於茀環中之2位。於Rc1 為複數個之情形時,複數個Rc1 可相同,亦可不同。In the formula (1), R c1 is a hydrogen atom, a nitro group, or a monovalent organic group. R c1 is on the tea ring in formula (1), and is bonded to a six-membered aromatic ring different from the six-membered aromatic ring bonded to the group shown by -(CO) n2 -. In the formula (1), R c1 is not particularly limited to the bonding position of the chrysanthemum ring. In the case where the compound represented by formula (1) has one or more R c1 , in terms of easy synthesis of the compound represented by formula (1), etc., it is preferably one or more of R c1 One bond is in the second position of the tea ring. When R c1 is plural, the plural R c1 may be the same or different.

於Rc1 為有機基之情形時,Rc1 於不會妨礙本發明之目的之範圍內並無特別限定,自各種有機基中適當選擇。作為Rc1 為有機基時之較佳例,可例舉:烷基、烷氧基、環烷基、環烷氧基、飽和脂肪族醯基、飽和脂肪族醯氧基、烷氧基羰基、可具有取代基之苯基、可具有取代基之苯氧基、可具有取代基之苯甲醯基、可具有取代基之苯氧基羰基、可具有取代基之苯甲醯氧基、可具有取代基之苯基烷基、可具有取代基之萘基、可具有取代基之萘氧基、可具有取代基之萘甲醯基、可具有取代基之萘氧基羰基、可具有取代基之萘甲醯氧基、可具有取代基之萘基烷基、可具有取代基之雜環基、可具有取代基之雜環基羰基、經1個或2個有機基取代之胺基、𠰌啉-1-基、及哌𠯤-1-基等。When R c1 is an organic group, R c1 is not particularly limited within a range that does not interfere with the purpose of the present invention, and is appropriately selected from various organic groups. Preferable examples when R c1 is an organic group include: alkyl, alkoxy, cycloalkyl, cycloalkoxy, saturated aliphatic acyl group, saturated aliphatic acyloxy group, alkoxycarbonyl group, A phenyl group that may have a substituent, a phenoxy group that may have a substituent, a benzyl group that may have a substituent, a phenoxycarbonyl group that may have a substituent, a benzyloxy group that may have a substituent, and the Substituent phenylalkyl, optionally substituted naphthyl, optionally substituted naphthyloxy, optionally substituted naphthyloxy, optionally substituted naphthyloxycarbonyl, optionally substituted Naphthyloxy, naphthylalkyl which may have substituents, heterocyclic groups which may have substituents, heterocyclic carbonyl groups which may have substituents, amino groups substituted with one or two organic groups, 𠰌line -1-yl, piper-1-yl and so on.

於Rc1 為烷基之情形時,烷基之碳原子數較佳為1以上20以下,更佳為1以上6以下。又,於Rc1 為烷基之情形時,可為直鏈,亦可為支鏈。作為Rc1 為烷基時之具體例,可例舉:甲基、乙基、正丙基、異丙基、正丁基、異丁基、第二丁基、第三丁基、正戊基、異戊基、第二戊基、第三戊基、正己基、正庚基、正辛基、異辛基、第二辛基、第三辛基、正壬基、異壬基、正癸基、及異癸基等。又,於Rc1 為烷基之情形時,烷基可於碳鏈中包含醚鍵(-O-)。作為碳鏈中具有醚鍵之烷基之例,可例舉:甲氧基乙基、乙氧基乙基、甲氧基乙氧基乙基、乙氧基乙氧基乙基、丙氧基乙氧基乙基、及甲氧基丙基等。When R c1 is an alkyl group, the number of carbon atoms of the alkyl group is preferably 1 or more and 20 or less, more preferably 1 or more and 6 or less. In addition, when R c1 is an alkyl group, it may be a straight chain or a branched chain. Specific examples when R c1 is an alkyl group include: methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, second butyl, tertiary butyl, n-pentyl , Isopentyl, second pentyl, third pentyl, n-hexyl, n-heptyl, n-octyl, isooctyl, second octyl, third octyl, n-nonyl, isononyl, n-decyl Base, and isodecyl, etc. In addition, when R c1 is an alkyl group, the alkyl group may include an ether bond (-O-) in the carbon chain. Examples of alkyl groups with ether bonds in the carbon chain include: methoxyethyl, ethoxyethyl, methoxyethoxyethyl, ethoxyethoxyethyl, and propoxy Ethoxyethyl, and methoxypropyl, etc.

於Rc1 為烷氧基之情形時,烷氧基之碳原子數較佳為1以上20以下,更佳為1以上6以下。又,於Rc1 為烷氧基之情形時,可為直鏈,亦可為支鏈。作為Rc1 為烷氧基時之具體例,可例舉:甲氧基、乙氧基、正丙氧基、異丙氧基、正丁氧基、異丁氧基、第二丁氧基、第三丁氧基、正戊氧基、異戊氧基、第二戊氧基、第三戊氧基、正己氧基、正庚氧基、正辛氧基、異辛氧基、第二辛氧基、第三辛氧基、正壬氧基、異壬氧基、正癸氧基、及異癸氧基等。又,於Rc1 為烷氧基之情形時,烷氧基可於碳鏈中包含醚鍵(-O-)。作為碳鏈中具有醚鍵之烷氧基之例,可例舉:甲氧基乙氧基、乙氧基乙氧基、甲氧基乙氧基乙氧基、乙氧基乙氧基乙氧基、丙氧基乙氧基乙氧基、及甲氧基丙氧基等。When R c1 is an alkoxy group, the number of carbon atoms of the alkoxy group is preferably 1 or more and 20 or less, more preferably 1 or more and 6 or less. In addition, when R c1 is an alkoxy group, it may be a straight chain or a branched chain. Specific examples when R c1 is an alkoxy group include: methoxy, ethoxy, n-propoxy, isopropoxy, n-butoxy, isobutoxy, second butoxy, Tertiary butoxy, n-pentyloxy, isopentyloxy, second pentyloxy, tertiary pentyloxy, n-hexyloxy, n-heptyloxy, n-octyloxy, isooctyloxy, second octyloxy Oxy, tertiary octyloxy, n-nonyloxy, isononyloxy, n-decyloxy, and isodecyloxy, etc. In addition, when R c1 is an alkoxy group, the alkoxy group may include an ether bond (-O-) in the carbon chain. Examples of alkoxy groups having ether bonds in the carbon chain include: methoxyethoxy, ethoxyethoxy, methoxyethoxyethoxy, ethoxyethoxyethoxy Group, propoxyethoxyethoxy, and methoxypropoxy, etc.

於Rc1 為環烷基或環烷氧基之情形時,環烷基或環烷氧基之碳原子數較佳為3以上10以下,更佳為3以上6以下。作為Rc1 為環烷基時之具體例,可例舉:環丙基、環丁基、環戊基、環己基、環庚基、及環辛基等。作為Rc1 為環烷氧基時之具體例,可例舉:環丙氧基、環丁氧基、環戊氧基、環己氧基、環庚氧基、及環辛氧基等。When R c1 is a cycloalkyl group or a cycloalkoxy group, the number of carbon atoms of the cycloalkyl group or a cycloalkoxy group is preferably 3 or more and 10 or less, more preferably 3 or more and 6 or less. Specific examples when R c1 is a cycloalkyl group include cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl, cycloheptyl, and cyclooctyl. As a specific example when R c1 is a cycloalkoxy group, a cyclopropoxy group, a cyclobutoxy group, a cyclopentyloxy group, a cyclohexyloxy group, a cycloheptyloxy group, a cyclooctyloxy group, etc. are mentioned.

於Rc1 為飽和脂肪族醯基或飽和脂肪族醯氧基之情形時,飽和脂肪族醯基或飽和脂肪族醯氧基之碳原子數較佳為2以上21以下,更佳為2以上7以下。作為Rc1 為飽和脂肪族醯基時之具體例,可例舉:乙醯基、丙醯基、正丁醯基、2-甲基丙醯基、正戊醯基、2,2-二甲基丙醯基、正己醯基、正庚醯基、正辛醯基、正壬醯基、正癸醯基、正十一碳醯基、正十二碳醯基、正十三碳醯基、正十四碳醯基、正十五碳醯基、及正十六碳醯基等。作為Rc1 為飽和脂肪族醯氧基時之具體例,可例舉:乙醯氧基、丙醯氧基、正丁醯氧基、2-甲基丙醯氧基、正戊醯氧基、2,2-二甲基丙醯氧基、正己醯氧基、正庚醯氧基、正辛醯氧基、正壬醯氧基、正癸醯氧基、正十一碳醯氧基、正十二碳醯氧基、正十三碳醯氧基、正十四碳醯氧基、正十五碳醯氧基、及正十六碳醯氧基等。When R c1 is a saturated aliphatic oxy group or a saturated aliphatic oxy group, the number of carbon atoms of the saturated aliphatic oxy group or saturated aliphatic oxy group is preferably 2 or more and 21 or less, more preferably 2 or more and 7 the following. As specific examples when R c1 is a saturated aliphatic aliphatic group, there may be mentioned: acetyl group, propionyl group, n-butyryl group, 2-methylpropionyl group, n-pentanyl group, 2,2-dimethylpropane group Nyl, n-hexyl, n-heptanyl, n-octyl, n-nonyl, n-decyl, n-undecyl, n-dodecyl, n-thirteen, n-fourteen醯基, pentadecyl, and hexadecyl, etc. Specific examples when R c1 is a saturated aliphatic oxy group include: acetoxy, propoxy, n-butoxy, 2-methylpropoxy, n-pentoxy, 2,2-Dimethylpropionyloxy, n-hexyloxy, n-heptanoyloxy, n-octanoyloxy, n-nonanoyloxy, n-decanoyloxy, n-undecanoyloxy, n- Dodecanoyloxy, n-tridecanoyloxy, n-tetradecanoyloxy, n-pentadecanoyloxy, and n-hexadecanoyloxy, etc.

於Rc1 為烷氧基羰基之情形時,烷氧基羰基之碳原子數較佳為2以上20以下,更佳為2以上7以下。作為Rc1 為烷氧基羰基時之具體例,可例舉:甲氧基羰基、乙氧基羰基、正丙氧基羰基、異丙氧基羰基、正丁氧基羰基、異丁氧基羰基、第二丁氧基羰基、第三丁氧基羰基、正戊氧基羰基、異戊氧基羰基、第二戊氧基羰基、第三戊氧基羰基、正己氧基羰基、正庚氧基羰基、正辛氧基羰基、異辛氧基羰基、第二辛氧基羰基、第三辛氧基羰基、正壬氧基羰基、異壬氧基羰基、正癸氧基羰基、及異癸氧基羰基等。When R c1 is an alkoxycarbonyl group, the number of carbon atoms of the alkoxycarbonyl group is preferably 2 or more and 20 or less, more preferably 2 or more and 7 or less. Specific examples when R c1 is an alkoxycarbonyl group include: methoxycarbonyl, ethoxycarbonyl, n-propoxycarbonyl, isopropoxycarbonyl, n-butoxycarbonyl, and isobutoxycarbonyl. , Second butoxycarbonyl, third butoxycarbonyl, n-pentoxycarbonyl, isopentoxycarbonyl, second pentoxycarbonyl, third pentoxycarbonyl, n-hexoxycarbonyl, n-heptyloxy Carbonyl, n-octyloxycarbonyl, isooctyloxycarbonyl, second octyloxycarbonyl, third octyloxycarbonyl, n-nonyloxycarbonyl, isononyloxycarbonyl, n-decyloxycarbonyl, and isodecyloxy Group carbonyl and so on.

於Rc1 為苯基烷基之情形時,苯基烷基之碳原子數較佳為7以上20以下,更佳為7以上10以下。又,於Rc1 為萘基烷基之情形時,萘基烷基之碳原子數較佳為11以上20以下,更佳為11以上14以下。作為Rc1 為苯基烷基時之具體例,可例舉:苄基、2-苯基乙基、3-苯基丙基、及4-苯基丁基。作為Rc1 為萘基烷基時之具體例,可例舉:α-萘基甲基、β-萘基甲基、2-(α-萘基)乙基、及2-(β-萘基)乙基。於Rc1 為苯基烷基或萘基烷基之情形時,Rc1 可於苯基或萘基上進而具有取代基。When R c1 is a phenylalkyl group, the number of carbon atoms of the phenylalkyl group is preferably 7 or more and 20 or less, more preferably 7 or more and 10 or less. When R c1 is a naphthylalkyl group, the number of carbon atoms of the naphthylalkyl group is preferably 11 or more and 20 or less, more preferably 11 or more and 14 or less. Specific examples when R c1 is a phenylalkyl group include benzyl, 2-phenylethyl, 3-phenylpropyl, and 4-phenylbutyl. Specific examples when R c1 is naphthylalkyl include α-naphthylmethyl, β-naphthylmethyl, 2-(α-naphthyl)ethyl, and 2-(β-naphthyl) ) Ethyl. When R c1 is a phenylalkyl group or a naphthylalkyl group, R c1 may further have a substituent on the phenyl group or the naphthyl group.

於Rc1 為雜環基之情形時,雜環基為包含1個以上之N、S、O之五員或六員之單環,或為該單環彼此或者該單環與苯環縮合而成之雜環基。於雜環基為稠環之情形時,使構成稠環之單環之環數為3以下。雜環基可為芳香族基(雜芳基),亦可為非芳香族基。作為構成該雜環基之雜環,可例舉:呋喃、噻吩、吡咯、㗁唑、異㗁唑、噻唑、噻二唑、異噻唑、咪唑、吡唑、三唑、吡啶、吡𠯤、嘧啶、嗒𠯤、苯并呋喃、苯并噻吩、吲哚、異吲哚、吲哚嗪、苯并咪唑、苯并三唑、苯并㗁唑、苯并噻唑、咔唑、嘌呤、喹啉、異喹啉、喹唑啉、呔𠯤、㖕啉、喹㗁啉、哌啶、哌𠯤、𠰌啉、哌啶、四氫哌喃、及四氫呋喃等。於Rc1 為雜環基之情形時,雜環基可進而具有取代基。When R c1 is a heterocyclic group, the heterocyclic group is a monocyclic ring containing more than one of five or six members of N, S, and O, or the monocyclic ring is condensed with each other or the monocyclic ring and the benzene ring. Into the heterocyclic group. When the heterocyclic group is a condensed ring, the number of monocyclic rings constituting the condensed ring is 3 or less. The heterocyclic group may be an aromatic group (heteroaryl) or a non-aromatic group. Examples of the heterocyclic ring constituting the heterocyclic group include furan, thiophene, pyrrole, azole, isoazole, thiazole, thiadiazole, isothiazole, imidazole, pyrazole, triazole, pyridine, pyrrole, pyrimidine , Da 𠯤, benzofuran, benzothiophene, indole, isoindole, indoleazine, benzimidazole, benzotriazole, benzoxazole, benzothiazole, carbazole, purine, quinoline, isoindole Quinoline, quinazoline, quinoline, quinazoline, quinoline, piperidine, piperidine, quinoline, piperidine, tetrahydropiperan, and tetrahydrofuran, etc. When R c1 is a heterocyclic group, the heterocyclic group may further have a substituent.

於Rc1 為雜環基羰基之情形時,雜環基羰基中所含之雜環基與Rc1 為雜環基之情形相同。When R c1 is a heterocyclic carbonyl group, the heterocyclic group contained in the heterocyclic carbonyl group is the same as the case where R c1 is a heterocyclic group.

於Rc1 為經1個或2個有機基取代之胺基之情形時,有機基之較佳例可例舉:碳原子數1以上20以下之烷基、碳原子數3以上10以下之環烷基、碳原子數2以上21以下之飽和脂肪族醯基、可具有取代基之苯基、可具有取代基之苯甲醯基、可具有取代基之碳原子數7以上20以下之苯基烷基、可具有取代基之萘基、可具有取代基之萘甲醯基、可具有取代基之碳原子數11以上20以下之萘基烷基、及雜環基等。該等較佳有機基之具體例與Rc1 相同。作為經1個或2個有機基取代之胺基之具體例,可例舉:甲基胺基、乙基胺基、二乙基胺基、正丙基胺基、二正丙基胺基、異丙基胺基、正丁基胺基、二正丁基胺基、正戊基胺基、正己基胺基、正庚基胺基、正辛基胺基、正壬基胺基、正癸基胺基、苯基胺基、萘基胺基、乙醯基胺基、丙醯基胺基、正丁醯基胺基、正戊醯基胺基、正己醯基胺基、正庚醯基胺基、正辛醯基胺基、正癸醯基胺基、苯甲醯基胺基、α-萘甲醯基胺基、及β-萘甲醯基胺基等。When R c1 is an amino group substituted with one or two organic groups, preferable examples of the organic group include: alkyl groups with 1 to 20 carbon atoms, and rings with 3 to 10 carbon atoms. Alkyl group, saturated aliphatic acyl group with 2 to 21 carbon atoms, optionally substituted phenyl group, optionally substituted benzyl group, optionally substituted phenyl group with 7 to 20 carbon atoms An alkyl group, an optionally substituted naphthyl group, an optionally substituted naphthylmethyl group, an optionally substituted naphthylalkyl group having 11 to 20 carbon atoms, a heterocyclic group, and the like. The specific examples of these preferred organic groups are the same as R c1. Specific examples of amino groups substituted with one or two organic groups include: methylamino, ethylamino, diethylamino, n-propylamino, di-n-propylamino, Isopropylamino, n-butylamino, di-n-butylamino, n-pentylamino, n-hexylamino, n-heptylamino, n-octylamino, n-nonylamino, n-decyl Amino, phenylamino, naphthylamino, acetylamino, propionylamino, n-butyrylamino, n-pentanylamino, n-hexylamino, n-heptanylamino , N-octylamino, n-decanoylamino, benzylamino, α-naphthylamino, β-naphthylamino, etc.

作為Rc1 中所包含之苯基、萘基、及雜環基進而具有取代基時之取代基,可例舉:碳原子數1以上6以下之烷基、碳原子數1以上6以下之烷氧基、碳原子數2以上7以下之飽和脂肪族醯基、碳原子數2以上7以下之烷氧基羰基、碳原子數2以上7以下之飽和脂肪族醯氧基、具有碳原子數1以上6以下之烷基之單烷基胺基、具有碳原子數1以上6以下之烷基之二烷基胺基、𠰌啉-1-基、哌𠯤-1-基、鹵素、硝基、及氰基等。於Rc1 中所包含之苯基、萘基、及雜環基進而具有取代基之情形時,該取代基之數於不會妨礙本發明之目的之範圍內並無限定,較佳為1以上4以下。於Rc1 中所包含之苯基、萘基、及雜環基具有複數個取代基之情形時,複數個取代基可相同,亦可不同。Examples of the substituent when the phenyl, naphthyl, and heterocyclic group contained in R c1 further have a substituent include: an alkyl group having 1 to 6 carbon atoms, and an alkyl group having 1 to 6 carbon atoms Oxy group, saturated aliphatic acyl group with 2 to 7 carbon atoms, alkoxycarbonyl group with 2 to 7 carbon atoms, saturated aliphatic oxy group with 2 to 7 carbon atoms, and 1 carbon atom The monoalkylamino group of the above 6 alkyl group, the dialkylamino group of the alkyl group having 1 to 6 carbon atoms, linolin-1-yl, piperid-1-yl, halogen, nitro, And cyano, etc. When the phenyl, naphthyl, and heterocyclic groups contained in R c1 further have substituents, the number of the substituents is not limited within the range that does not interfere with the purpose of the present invention, and it is preferably 1 or more 4 or less. When the phenyl group, the naphthyl group, and the heterocyclic group contained in R c1 have plural substituents, the plural substituents may be the same or different.

以上說明之基中,作為Rc1 ,若為硝基或Rc10 -CO-所示之基,則存在感度提高之傾向而較佳。Rc10 於不會妨礙本發明之目的之範圍內並無特別限定,可自各種有機基中選擇。關於作為Rc10 較佳之基之例,可例舉:碳原子數1以上20以下之烷基、可具有取代基之苯基、可具有取代基之萘基、及可具有取代基之雜環基。作為Rc10 ,該等基中,尤佳為2-甲基苯基、噻吩-2-基、及α-萘基。 又,若Rc1 為氫原子,則存在透明性變得良好之傾向而較佳。再者,若Rc1 為氫原子且Rc4 為後述式(1a)或(1b)所示之基,則存在透明性變得更良好之傾向。Among the groups explained above, as R c1 , if it is a nitro group or a group represented by R c10 -CO-, the sensitivity tends to increase, which is preferable. R c10 is not particularly limited within a range that does not interfere with the purpose of the present invention, and it can be selected from various organic groups. Examples of preferable groups for R c10 include: alkyl groups having 1 to 20 carbon atoms, phenyl groups which may have substituents, naphthyl groups which may have substituents, and heterocyclic groups which may have substituents . As R c10 , among these groups, 2-methylphenyl, thien-2-yl, and α-naphthyl are particularly preferred. In addition, if R c1 is a hydrogen atom, transparency tends to become better, which is preferable. Furthermore, if R c1 is a hydrogen atom and R c4 is a group represented by the formula (1a) or (1b) described later, there is a tendency that transparency becomes better.

式(1)中,Rc2 及Rc3 分別為可具有取代基之鏈狀烷基、可具有取代基之環狀有機基、或氫原子。Rc2 與Rc3 可相互鍵結而形成環。該等基中,作為Rc2 及Rc3 ,較佳為可具有取代基之鏈狀烷基。於Rc2 及Rc3 為可具有取代基之鏈狀烷基之情形時,鏈狀烷基可為直鏈烷基,亦可為支鏈烷基。In the formula (1), R c2 and R c3 are each a linear alkyl group which may have a substituent, a cyclic organic group which may have a substituent, or a hydrogen atom. R c2 and R c3 may be bonded to each other to form a ring. Among these groups, R c2 and R c3 are preferably a chain alkyl group which may have a substituent. When R c2 and R c3 are a chain alkyl group which may have a substituent, the chain alkyl group may be a straight chain alkyl group or a branched chain alkyl group.

於Rc2 及Rc3 為不具有取代基之鏈狀烷基之情形時,鏈狀烷基之碳原子數較佳為1以上20以下,更佳為1以上10以下,尤佳為1以上6以下。作為Rc2 及Rc3 為鏈狀烷基時之具體例,可例舉:甲基、乙基、正丙基、異丙基、正丁基、異丁基、第二丁基、第三丁基、正戊基、異戊基、第二戊基、第三戊基、正己基、正庚基、正辛基、異辛基、第二辛基、第三辛基、正壬基、異壬基、正癸基、及異癸基等。又,於Rc2 及Rc3 為烷基之情形時,烷基可於碳鏈中包含醚鍵(-O-)。作為碳鏈中具有醚鍵之烷基之例,可例舉:甲氧基乙基、乙氧基乙基、甲氧基乙氧基乙基、乙氧基乙氧基乙基、丙氧基乙氧基乙基、及甲氧基丙基等。When R c2 and R c3 are chain alkyl groups without substituents, the number of carbon atoms of the chain alkyl group is preferably 1 or more and 20 or less, more preferably 1 or more and 10 or less, and particularly preferably 1 or more and 6 the following. Specific examples when R c2 and R c3 are chain alkyl groups include methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, sec-butyl, and tert-butyl. Base, n-pentyl, isopentyl, second pentyl, third pentyl, n-hexyl, n-heptyl, n-octyl, isooctyl, second octyl, third octyl, n-nonyl, iso Nonyl, n-decyl, and isodecyl, etc. In addition, when R c2 and R c3 are alkyl groups, the alkyl group may include an ether bond (-O-) in the carbon chain. Examples of alkyl groups with ether bonds in the carbon chain include: methoxyethyl, ethoxyethyl, methoxyethoxyethyl, ethoxyethoxyethyl, and propoxy Ethoxyethyl, and methoxypropyl, etc.

於Rc2 及Rc3 為具有取代基之鏈狀烷基之情形時,鏈狀烷基之碳原子數較佳為1以上20以下,更佳為1以上10以下,尤佳為1以上6以下。於此情形時,取代基之碳原子數不包括於鏈狀烷基之碳原子數中。具有取代基之鏈狀烷基較佳為直鏈狀。 烷基可具有之取代基於不會妨礙本發明之目的之範圍內並無特別限定。作為取代基之較佳例,可例舉:氰基、鹵素原子、環狀有機基、及烷氧基羰基。作為鹵素原子,可例舉:氟原子、氯原子、溴原子、碘原子。該等中,較佳為氟原子、氯原子、溴原子。作為環狀有機基,可例舉:環烷基、芳香族烴基、雜環基。作為環烷基之具體例,與Rc1 為環烷基時之較佳例相同。作為芳香族烴基之具體例,可例舉:苯基、萘基、聯苯基、蒽基、及菲基等。作為雜環基之具體例,與Rc1 為雜環基時之較佳例相同。於Rc1 為烷氧基羰基之情形時,烷氧基羰基中所含之烷氧基可為直鏈狀,亦可為支鏈狀,較佳為直鏈狀。烷氧基羰基中所含之烷氧基之碳原子數較佳為1以上10以下,更佳為1以上6以下。When R c2 and R c3 are chain alkyl groups with substituents, the number of carbon atoms of the chain alkyl group is preferably 1 or more and 20 or less, more preferably 1 or more and 10 or less, and particularly preferably 1 or more and 6 or less . In this case, the number of carbon atoms of the substituent is not included in the number of carbon atoms of the chain alkyl group. The chain alkyl group having a substituent is preferably linear. The substitution that the alkyl group may have is not particularly limited as long as it does not interfere with the purpose of the present invention. Preferred examples of the substituent include a cyano group, a halogen atom, a cyclic organic group, and an alkoxycarbonyl group. The halogen atom may, for example, be a fluorine atom, a chlorine atom, a bromine atom, or an iodine atom. Among these, a fluorine atom, a chlorine atom, and a bromine atom are preferable. The cyclic organic group may, for example, be a cycloalkyl group, an aromatic hydrocarbon group, or a heterocyclic group. Specific examples of the cycloalkyl group are the same as the preferred examples when R c1 is a cycloalkyl group. Specific examples of aromatic hydrocarbon groups include phenyl, naphthyl, biphenyl, anthracenyl, and phenanthryl. Specific examples of the heterocyclic group are the same as the preferable examples when R c1 is a heterocyclic group. When R c1 is an alkoxycarbonyl group, the alkoxy group contained in the alkoxycarbonyl group may be linear or branched, and is preferably linear. The number of carbon atoms of the alkoxy group contained in the alkoxycarbonyl group is preferably 1 or more and 10 or less, more preferably 1 or more and 6 or less.

於鏈狀烷基具有取代基之情形時,取代基之數並無特別限定。較佳之取代基數根據鏈狀烷基之碳原子數而改變。取代基之數典型而言為1以上20以下,較佳為1以上10以下,更佳為1以上6以下。When the chain alkyl group has a substituent, the number of substituents is not particularly limited. The preferred number of substituents varies according to the number of carbon atoms of the chain alkyl group. The number of substituents is typically 1 or more and 20 or less, preferably 1 or more and 10 or less, and more preferably 1 or more and 6 or less.

於Rc2 及Rc3 為環狀有機基之情形時,環狀有機基可為脂環式基,亦可為芳香族基。作為環狀有機基,可例舉:脂肪族環狀烴基、芳香族烴基、雜環基。於Rc2 及Rc3 為環狀有機基之情形時,環狀有機基可具有之取代基與Rc2 及Rc3 為鏈狀烷基之情形相同。When R c2 and R c3 are a cyclic organic group, the cyclic organic group may be an alicyclic group or an aromatic group. The cyclic organic group may, for example, be an aliphatic cyclic hydrocarbon group, an aromatic hydrocarbon group, and a heterocyclic group. When R c2 and R c3 are cyclic organic groups, the substituents that the cyclic organic group may have are the same as when R c2 and R c3 are chain alkyl groups.

於Rc2 及Rc3 為芳香族烴基之情形時,芳香族烴基較佳為苯基,或為複數個苯環經由碳-碳鍵進行鍵結而形成之基,或為複數個苯環縮合而形成之基。於芳香族烴基為苯基,或為複數個苯環鍵結或縮合而形成之基之情形時,芳香族烴基中所含之苯環之環數並無特別限定,較佳為3以下,更佳為2以下,尤佳為1。作為芳香族烴基之較佳具體例,可例舉:苯基、萘基、聯苯基、蒽基、及菲基等。When R c2 and R c3 are aromatic hydrocarbon groups, the aromatic hydrocarbon group is preferably a phenyl group, or a group formed by bonding a plurality of benzene rings via carbon-carbon bonds, or a condensation of a plurality of benzene rings. The basis of formation. When the aromatic hydrocarbon group is a phenyl group or a group formed by bonding or condensation of plural benzene rings, the number of benzene rings contained in the aromatic hydrocarbon group is not particularly limited, but is preferably 3 or less, more Preferably it is 2 or less, particularly preferably 1. Preferable specific examples of the aromatic hydrocarbon group include phenyl, naphthyl, biphenyl, anthracenyl, and phenanthryl.

於Rc2 及Rc3 為脂肪族環狀烴基之情形時,脂肪族環狀烴基可為單環式,亦可為多環式。脂肪族環狀烴基之碳原子數並無特別限定,較佳為3以上20以下,更佳為3以上10以下。作為單環式之環狀烴基之例,可例舉:環丙基、環丁基、環戊基、環己基、環庚基、環辛基、降𦯉基、異𦯉基、三環壬基、三環癸基、四環十二烷基、及金剛烷基等。When R c2 and R c3 are aliphatic cyclic hydrocarbon groups, the aliphatic cyclic hydrocarbon groups may be monocyclic or polycyclic. The number of carbon atoms of the aliphatic cyclic hydrocarbon group is not particularly limited, but is preferably 3 or more and 20 or less, and more preferably 3 or more and 10 or less. Examples of monocyclic cyclic hydrocarbon groups include: cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl, cycloheptyl, cyclooctyl, nordoxyl, isooxyl, tricyclononyl , Tricyclodecyl, tetracyclododecyl, and adamantyl, etc.

於Rc2 及Rc3 為雜環基之情形時,雜環基為包含1個以上之N、S、O之五員或六員之單環,或為該單環彼此或者該單環與苯環縮合而成之雜環基。於雜環基為稠環之情形時,使構成稠環之單環之環數為3以下。雜環基可為芳香族基(雜芳基),亦可為非芳香族基。作為構成該雜環基之雜環,可例舉:呋喃、噻吩、吡咯、㗁唑、異㗁唑、噻唑、噻二唑、異噻唑、咪唑、吡唑、三唑、吡啶、吡𠯤、嘧啶、嗒𠯤、苯并呋喃、苯并噻吩、吲哚、異吲哚、吲哚嗪、苯并咪唑、苯并三唑、苯并㗁唑、苯并噻唑、咔唑、嘌呤、喹啉、異喹啉、喹唑啉、呔𠯤、㖕啉、喹㗁啉、哌啶、哌𠯤、𠰌啉、哌啶、四氫哌喃、及四氫呋喃等。When R c2 and R c3 are heterocyclic groups, the heterocyclic group is a monocyclic ring containing more than one of five or six members of N, S, O, or the monocyclic rings or the monocyclic ring and benzene A heterocyclic group formed by ring condensation. When the heterocyclic group is a condensed ring, the number of monocyclic rings constituting the condensed ring is 3 or less. The heterocyclic group may be an aromatic group (heteroaryl) or a non-aromatic group. Examples of the heterocyclic ring constituting the heterocyclic group include furan, thiophene, pyrrole, azole, isoazole, thiazole, thiadiazole, isothiazole, imidazole, pyrazole, triazole, pyridine, pyrrole, pyrimidine , Da 𠯤, benzofuran, benzothiophene, indole, isoindole, indoleazine, benzimidazole, benzotriazole, benzoxazole, benzothiazole, carbazole, purine, quinoline, isoindole Quinoline, quinazoline, quinoline, quinazoline, quinoline, piperidine, piperidine, quinoline, piperidine, tetrahydropiperan, and tetrahydrofuran, etc.

Rc2 與Rc3 可相互鍵結而形成環。包含Rc2 與Rc3 形成之環之基較佳為亞環烷基。於Rc2 與Rc3 鍵結而形成亞環烷基之情形時,構成亞環烷基之環較佳為五員環或六員環,更佳為五員環。R c2 and R c3 may be bonded to each other to form a ring. The group including the ring formed by R c2 and R c3 is preferably a cycloalkylene group. When R c2 and R c3 are bonded to form a cycloalkylene group, the ring constituting the cycloalkylene group is preferably a five-membered ring or a six-membered ring, and more preferably a five-membered ring.

於Rc2 與Rc3 鍵結而形成之基為亞環烷基之情形時,亞環烷基可與1個以上之其他環縮合。作為可與亞環烷基縮合之環之例,可例舉:苯環、萘環、環丁烷環、環戊烷環、環己烷環、環庚烷環、環辛烷環、呋喃環、噻吩環、吡咯環、吡啶環、吡𠯤環、及嘧啶環等。When the group formed by the bonding of R c2 and R c3 is a cycloalkylene group, the cycloalkylene group may be condensed with one or more other rings. Examples of the ring that can be condensed with the cycloalkylene ring include a benzene ring, a naphthalene ring, a cyclobutane ring, a cyclopentane ring, a cyclohexane ring, a cycloheptane ring, a cyclooctane ring, and a furan ring. , Thiophene ring, pyrrole ring, pyridine ring, pyridine ring, and pyrimidine ring.

作為以上說明之Rc2 及Rc3 中亦較佳之基之例,可例舉式-A01 -A02 所示之基。式中,可例舉A01 為直鏈伸烷基,A02 為烷氧基、氰基、鹵素原子、鹵代烷、環狀有機基、或烷氧基羰基。As an example of a preferable group among R c2 and R c3 described above, the group represented by the formula -A 01 -A 02 can be exemplified. In the formula, A 01 is a linear alkylene group, and A 02 is an alkoxy group, a cyano group, a halogen atom, a halogenated alkyl group, a cyclic organic group, or an alkoxycarbonyl group.

A01 之直鏈伸烷基之碳原子數較佳為1以上10以下,更佳為1以上6以下。於A02 為烷氧基之情形時,烷氧基可為直鏈狀,亦可為支鏈狀,較佳為直鏈狀。烷氧基之碳原子數較佳為1以上10以下,更佳為1以上6以下。於A02 為鹵素原子之情形時,較佳為氟原子、氯原子、溴原子、碘原子,更佳為氟原子、氯原子、溴原子。於A02 為鹵代烷之情形時,鹵代烷中所含之鹵素原子較佳為氟原子、氯原子、溴原子、碘原子,更佳為氟原子、氯原子、溴原子。鹵代烷可為直鏈狀,亦可為支鏈狀,較佳為直鏈狀。於A02 為環狀有機基之情形時,環狀有機基之例與Rc2 及Rc3 作為取代基具有之環狀有機基相同。於A02 為烷氧基羰基之情形時,烷氧基羰基之例與Rc2 及Rc3 作為取代基具有之烷氧基羰基相同。The number of carbon atoms of the linear alkylene group of A 01 is preferably 1 or more and 10 or less, more preferably 1 or more and 6 or less. When A 02 is an alkoxy group, the alkoxy group may be linear or branched, preferably linear. The number of carbon atoms of the alkoxy group is preferably 1 or more and 10 or less, more preferably 1 or more and 6 or less. When A 02 is a halogen atom, it is preferably a fluorine atom, a chlorine atom, a bromine atom, or an iodine atom, and more preferably a fluorine atom, a chlorine atom, or a bromine atom. When A 02 is a halogenated alkane, the halogen atom contained in the halogenated alkane is preferably a fluorine atom, a chlorine atom, a bromine atom, or an iodine atom, and more preferably a fluorine atom, a chlorine atom, or a bromine atom. The alkyl halide may be linear or branched, preferably linear. When A 02 is a cyclic organic group, examples of the cyclic organic group are the same as the cyclic organic group that R c2 and R c3 have as substituents. When A 02 is an alkoxycarbonyl group, examples of the alkoxycarbonyl group are the same as the alkoxycarbonyl group that R c2 and R c3 have as substituents.

作為Rc2 及Rc3 之較佳具體例,可例舉:乙基、正丙基、正丁基、正己基、正庚基、及正辛基等烷基;2-甲氧基乙基、3-甲氧基正丙基、4-甲氧基正丁基、5-甲氧基正戊基、6-甲氧基正己基、7-甲氧基正庚基、8-甲氧基正辛基、2-乙氧基乙基、3-乙氧基正丙基、4-乙氧基正丁基、5-乙氧基正戊基、6-乙氧基正己基、7-乙氧基正庚基、及8-乙氧基正辛基等烷氧基烷基;2-氰基乙基、3-氰基正丙基、4-氰基正丁基、5-氰基正戊基、6-氰基正己基、7-氰基正庚基、及8-氰基正辛基等氰基烷基;2-苯基乙基、3-苯基正丙基、4-苯基正丁基、5-苯基正戊基、6-苯基正己基、7-苯基正庚基、及8-苯基正辛基等苯基烷基;2-環己基乙基、3-環己基正丙基、4-環己基正丁基、5-環己基正戊基、6-環己基正己基、7-環己基正庚基、8-環己基正辛基、2-環戊基乙基、3-環戊基正丙基、4-環戊基正丁基、5-環戊基正戊基、6-環戊基正己基、7-環戊基正庚基、及8-環戊基正辛基等環烷基烷基;2-甲氧基羰基乙基、3-甲氧基羰基正丙基、4-甲氧基羰基正丁基、5-甲氧基羰基正戊基、6-甲氧基羰基正己基、7-甲氧基羰基正庚基、8-甲氧基羰基正辛基、2-乙氧基羰基乙基、3-乙氧基羰基正丙基、4-乙氧基羰基正丁基、5-乙氧基羰基正戊基、6-乙氧基羰基正己基、7-乙氧基羰基正庚基、及8-乙氧基羰基正辛基等烷氧基羰基烷基;2-氯乙基、3-氯正丙基、4-氯正丁基、5-氯正戊基、6-氯正己基、7-氯正庚基、8-氯正辛基、2-溴乙基、3-溴正丙基、4-溴正丁基、5-溴正戊基、6-溴正己基、7-溴正庚基、8-溴正辛基、3,3,3-三氟丙基、及3,3,4,4,5,5,5-七氟正戊基等鹵代烷。Preferred specific examples of R c2 and R c3 include alkyl groups such as ethyl, n-propyl, n-butyl, n-hexyl, n-heptyl, and n-octyl; 2-methoxyethyl, 3-methoxy n-propyl, 4-methoxy n-butyl, 5-methoxy n-pentyl, 6-methoxy n-hexyl, 7-methoxy n-heptyl, 8-methoxy n Octyl, 2-ethoxyethyl, 3-ethoxy n-propyl, 4-ethoxy n-butyl, 5-ethoxy n-pentyl, 6-ethoxy n-hexyl, 7-ethoxy Alkoxyalkyl groups such as n-heptyl and 8-ethoxy n-octyl; 2-cyanoethyl, 3-cyano n-propyl, 4-cyano n-butyl, 5-cyano n-pentyl Cyanoalkyl groups such as 6-cyano n-hexyl, 7-cyano n-heptyl, and 8-cyano n-octyl; 2-phenylethyl, 3-phenyl n-propyl, 4-phenyl Phenyl alkyl groups such as n-butyl, 5-phenyl n-pentyl, 6-phenyl n-hexyl, 7-phenyl n-heptyl, and 8-phenyl n-octyl; 2-cyclohexyl ethyl, 3- Cyclohexyl n-propyl, 4-cyclohexyl n-butyl, 5-cyclohexyl n-pentyl, 6-cyclohexyl n-hexyl, 7-cyclohexyl n-heptyl, 8-cyclohexyl n-octyl, 2-cyclopentyl Ethyl, 3-cyclopentyl n-propyl, 4-cyclopentyl n-butyl, 5-cyclopentyl n-pentyl, 6-cyclopentyl n-hexyl, 7-cyclopentyl n-heptyl, and 8- Cycloalkyl alkyl such as cyclopentyl n-octyl; 2-methoxycarbonyl ethyl, 3-methoxycarbonyl n-propyl, 4-methoxycarbonyl n-butyl, 5-methoxycarbonyl n-pentyl Group, 6-methoxycarbonyl n-hexyl, 7-methoxycarbonyl n-heptyl, 8-methoxycarbonyl n-octyl, 2-ethoxycarbonyl ethyl, 3-ethoxycarbonyl n-propyl, 4-ethoxycarbonyl n-butyl, 5-ethoxycarbonyl n-pentyl, 6-ethoxycarbonyl n-hexyl, 7-ethoxycarbonyl n-heptyl, 8-ethoxycarbonyl n-octyl, etc. Alkoxycarbonylalkyl; 2-chloroethyl, 3-chloro-n-propyl, 4-chloro-n-butyl, 5-chloro-n-pentyl, 6-chloro-n-hexyl, 7-chloro-n-heptyl, 8-chloro N-octyl, 2-bromoethyl, 3-bromo n-propyl, 4-bromo n-butyl, 5-bromo n-pentyl, 6-bromo n-hexyl, 7-bromo n-heptyl, 8-bromo n-octyl , 3,3,3-trifluoropropyl, and 3,3,4,4,5,5,5-heptafluoro-n-pentyl and other halogenated alkanes.

作為Rc2 及Rc3 ,上述中亦較佳之基為乙基、正丙基、正丁基、正戊基、2-甲氧基乙基、2-氰基乙基、2-苯基乙基、2-環己基乙基、2-甲氧基羰基乙基、2-氯乙基、2-溴乙基、3,3,3-三氟丙基、及3,3,4,4,5,5,5-七氟正戊基。As R c2 and R c3 , among the above-mentioned preferred groups are ethyl, n-propyl, n-butyl, n-pentyl, 2-methoxyethyl, 2-cyanoethyl, 2-phenylethyl , 2-cyclohexylethyl, 2-methoxycarbonylethyl, 2-chloroethyl, 2-bromoethyl, 3,3,3-trifluoropropyl, and 3,3,4,4,5 ,5,5-Heptafluoro-n-pentyl.

作為Rc4 之較佳有機基之例,與Rc1 同樣地可例舉:烷基、烷氧基、環烷基、環烷氧基、飽和脂肪族醯基、烷氧基羰基、飽和脂肪族醯氧基、可具有取代基之苯基、可具有取代基之苯氧基、可具有取代基之苯甲醯基、可具有取代基之苯氧基羰基、可具有取代基之苯甲醯氧基、可具有取代基之苯基烷基、可具有取代基之萘基、可具有取代基之萘氧基、可具有取代基之萘甲醯基、可具有取代基之萘氧基羰基、可具有取代基之萘甲醯氧基、可具有取代基之萘基烷基、可具有取代基之雜環基、可具有取代基之雜環基羰基、經1個或2個有機基取代之胺基、𠰌啉-1-基、及哌𠯤-1-基等。該等基之具體例與關於Rc1 所說明之該等基之具體例相同。又,作為Rc4 ,亦較佳為環烷基烷基、可於芳香環上具有取代基之苯氧基烷基、可於芳香環上具有取代基之苯硫基烷基。苯氧基烷基及苯硫基烷基可具有之取代基與Rc1 中所含之苯基可具有之取代基相同。Examples of preferable organic groups for R c4 include alkyl groups, alkoxy groups, cycloalkyl groups, cycloalkoxy groups, saturated aliphatic acyl groups, alkoxycarbonyl groups, and saturated aliphatic groups in the same way as R c1. A oxy group, a phenyl group which may have a substituent, a phenoxy group which may have a substituent group, a benzyl group which may have a substituent group, a phenoxycarbonyl group which may have a substituent group, a benzyloxy group which may have a substituent group Group, optionally substituted phenylalkyl group, optionally substituted naphthyl group, optionally substituted naphthyloxy group, optionally substituted naphthyloxy group, optionally substituted naphthoxycarbonyl group, Substituent naphthyloxy, optionally substituted naphthylalkyl, optionally substituted heterocyclic group, optionally substituted heterocyclic carbonyl group, amine substituted with 1 or 2 organic groups Group, linolin-1-yl, and piperidine-1-yl, etc. The specific examples of the bases are the same as the specific examples of the bases described with respect to R c1. Moreover, as R c4 , a cycloalkylalkyl group, a phenoxyalkyl group which may have a substituent on the aromatic ring, and a phenylthioalkyl group which may have a substituent on the aromatic ring are also preferable. The substituents that the phenoxyalkyl group and the phenylthioalkyl group may have are the same as the substituents that the phenyl group contained in R c1 may have.

有機基中,作為Rc4 ,較佳為烷基、環烷基、可具有取代基之苯基、或環烷基烷基、可於芳香環上具有取代基之苯硫基烷基。作為烷基,較佳為碳原子數1以上20以下之烷基,更佳為碳原子數1以上8以下之烷基,尤佳為碳原子數1以上4以下之烷基,最佳為甲基。可具有取代基之苯基中,較佳為甲基苯基,更佳為2-甲基苯基。環烷基烷基中所含之環烷基之碳原子數較佳為5以上10以下,更佳為5以上8以下,尤佳為5或6。環烷基烷基中所含之伸烷基之碳原子數較佳為1以上8以下,更佳為1以上4以下,尤佳為2。環烷基烷基中,較佳為環戊基乙基。可於芳香環上具有取代基之苯硫基烷基中所含之伸烷基之碳原子數較佳為1以上8以下,更佳為1以上4以下,尤佳為2。可於芳香環上具有取代基之苯硫基烷基中,較佳為2-(4-氯苯硫基)乙基。Among the organic groups, R c4 is preferably an alkyl group, a cycloalkyl group, a phenyl group which may have a substituent, or a cycloalkylalkyl group, or a thiophenylalkyl group which may have a substituent on the aromatic ring. As the alkyl group, an alkyl group having 1 to 20 carbon atoms is preferred, an alkyl group having 1 to 8 carbon atoms is more preferred, an alkyl group having 1 to 4 carbon atoms is particularly preferred, and methyl is most preferred. base. Among the phenyl groups which may have a substituent, a methylphenyl group is preferred, and a 2-methylphenyl group is more preferred. The number of carbon atoms of the cycloalkyl group contained in the cycloalkylalkyl group is preferably 5 or more and 10 or less, more preferably 5 or more and 8 or less, and particularly preferably 5 or 6. The number of carbon atoms of the alkylene group contained in the cycloalkylalkyl group is preferably 1 or more and 8 or less, more preferably 1 or more and 4 or less, and particularly preferably 2. Among cycloalkylalkyls, cyclopentylethyl is preferred. The number of carbon atoms of the alkylene group contained in the phenylthioalkyl group which may have a substituent on the aromatic ring is preferably 1 or more and 8 or less, more preferably 1 or more and 4 or less, and particularly preferably 2. Among the phenylthioalkyl groups that may have a substituent on the aromatic ring, 2-(4-chlorophenylthio)ethyl is preferred.

又,作為Rc4 ,亦較佳為-A03 -CO-O-A04 所示之基。A03 為二價有機基,較佳為二價烴基,且較佳為伸烷基。A04 為一價有機基,較佳為一價烴基。Moreover, as R c4 , the group represented by -A 03 -CO-OA 04 is also preferable. A 03 is a divalent organic group, preferably a divalent hydrocarbon group, and preferably an alkylene group. A 04 is a monovalent organic group, preferably a monovalent hydrocarbon group.

於A03 為伸烷基之情形時,伸烷基可為直鏈狀,亦可為支鏈狀,較佳為直鏈狀。於A03 為伸烷基之情形時,伸烷基之碳原子數較佳為1以上10以下,更佳為1以上6以下,尤佳為1以上4以下。When A 03 is an alkylene group, the alkylene group may be linear or branched, preferably linear. When A 03 is an alkylene group, the number of carbon atoms of the alkylene group is preferably 1 or more and 10 or less, more preferably 1 or more and 6 or less, and particularly preferably 1 or more and 4 or less.

作為A04 之較佳例,可例舉:碳原子數1以上10以下之烷基、碳原子數7以上20以下之芳烷基、及碳原子數6以上20以下之芳香族烴基。作為A04 之較佳具體例,可例舉:甲基、乙基、正丙基、異丙基、正丁基、異丁基、第二丁基、第三丁基、正戊基、正己基、苯基、萘基、苄基、苯乙基、α-萘基甲基、及β-萘基甲基等。Preferred examples of A 04 include an alkyl group having 1 to 10 carbon atoms, an aralkyl group having 7 to 20 carbon atoms, and an aromatic hydrocarbon group having 6 to 20 carbon atoms. Preferred specific examples of A 04 include: methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, second butyl, tertiary butyl, n-pentyl, n-hexyl Group, phenyl, naphthyl, benzyl, phenethyl, α-naphthylmethyl, β-naphthylmethyl, etc.

作為-A03 -CO-O-A04 所示之基之較佳具體例,可例舉:2-甲氧基羰基乙基、2-乙氧基羰基乙基、2-正丙氧基羰基乙基、2-正丁氧基羰基乙基、2-正戊氧基羰基乙基、2-正己氧基羰基乙基、2-苄氧基羰基乙基、2-苯氧基羰基乙基、3-甲氧基羰基正丙基、3-乙氧基羰基正丙基、3-正丙氧基羰基正丙基、3-正丁氧基羰基正丙基、3-正戊氧基羰基正丙基、3-正己氧基羰基正丙基、3-苄氧基羰基正丙基、及3-苯氧基羰基正丙基等。Preferred specific examples of the group shown in -A 03 -CO-OA 04 include: 2-methoxycarbonylethyl, 2-ethoxycarbonylethyl, 2-n-propoxycarbonylethyl , 2-n-butoxycarbonylethyl, 2-n-pentoxycarbonylethyl, 2-n-hexoxycarbonylethyl, 2-benzyloxycarbonylethyl, 2-phenoxycarbonylethyl, 3- Methoxycarbonyl n-propyl, 3-ethoxycarbonyl n-propyl, 3-n-propoxycarbonyl n-propyl, 3-n-butoxycarbonyl n-propyl, 3-n-pentoxycarbonyl n-propyl , 3-n-hexyloxycarbonyl n-propyl, 3-benzyloxycarbonyl n-propyl, and 3-phenoxycarbonyl n-propyl, etc.

以上,對Rc4 進行了說明,作為Rc4 ,較佳為下述式(1a)或下述式(1b)所示之基。 [化61]

Figure 02_image121
(式(1a)及式(1b)中,Rc7 及Rc8 分別為有機基,n3為0以上4以下之整數,於Rc7 及Rc8 位於苯環上相鄰之位置之情形時,Rc7 與Rc8 可相互鍵結而形成環,n4為1以上8以下之整數,n5為1以上5以下之整數,n6為0以上(n5+3)以下之整數,Rc9 為有機基)As mentioned above, R c4 has been described, and R c4 is preferably a group represented by the following formula (1a) or the following formula (1b). [化61]
Figure 02_image121
(In formula (1a) and formula (1b), R c7 and R c8 are organic groups, respectively, n3 is an integer from 0 to 4, and when R c7 and R c8 are located at adjacent positions on the benzene ring, R c7 and R c8 can be bonded to each other to form a ring, n4 is an integer of 1 to 8 and n5 is an integer of 1 to 5, n6 is an integer of 0 to (n5+3), and R c9 is an organic group)

關於式(1a)中之Rc7 及Rc8 之有機基之例與Rc1 相同。作為Rc7 ,較佳為烷基或苯基。於Rc7 為烷基之情形時,其碳原子數較佳為1以上10以下,更佳為1以上5以下,尤佳為1以上3以下,最佳為1。即,Rc7 最佳為甲基。於Rc7 與Rc8 鍵結而形成環之情形時,該環可為芳香族環,亦可為脂肪族環。作為式(1a)所示之基且為Rc7 與Rc8 形成環之基之較佳例,可例舉:萘-1-基、1,2,3,4-四氫萘-5-基等。上述式(1a)中,n3為0以上4以下之整數,較佳為0或1,更佳為0。The examples of the organic groups of R c7 and R c8 in formula (1a) are the same as those of R c1. As R c7 , an alkyl group or a phenyl group is preferred. When R c7 is an alkyl group, the number of carbon atoms is preferably 1 or more and 10 or less, more preferably 1 or more and 5 or less, particularly preferably 1 or more and 3 or less, and most preferably 1. That is, R c7 is most preferably a methyl group. When R c7 and R c8 are bonded to form a ring, the ring may be an aromatic ring or an aliphatic ring. Preferred examples of the group represented by the formula (1a) and the group forming a ring between R c7 and R c8 include: naphth-1-yl, 1,2,3,4-tetrahydronaphthalen-5-yl Wait. In the above formula (1a), n3 is an integer of 0 or more and 4 or less, preferably 0 or 1, and more preferably 0.

上述式(1b)中,Rc9 為有機基。作為有機基,可例舉與關於Rc1 所說明之有機基同樣之基。有機基中,較佳為烷基。烷基可為直鏈狀,亦可為支鏈狀。烷基之碳原子數較佳為1以上10以下,更佳為1以上5以下,尤佳為1以上3以下。作為Rc9 ,可較佳地例示甲基、乙基、丙基、異丙基、丁基等,該等中,更佳為甲基。In the above formula (1b), R c9 is an organic group. The organic group may, for example, be the same as the organic group explained for R c1. Among the organic groups, an alkyl group is preferred. The alkyl group may be linear or branched. The number of carbon atoms of the alkyl group is preferably 1 or more and 10 or less, more preferably 1 or more and 5 or less, and particularly preferably 1 or more and 3 or less. As R c9 , a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, etc. are preferably exemplified, and among these, a methyl group is more preferable.

上述式(1b)中,n5為1以上5以下之整數,較佳為1以上3以下之整數,更佳為1或2。上述式(1b)中,n6為0以上(n5+3)以下,較佳為0以上3以下之整數,更佳為0以上2以下之整數,尤佳為0。上述式(1b)中,n4為1以上8以下之整數,較佳為1以上5以下之整數,更佳為1以上3以下之整數,尤佳為1或2。In the above formula (1b), n5 is an integer of 1 or more and 5 or less, preferably an integer of 1 or more and 3 or less, and more preferably 1 or 2. In the above formula (1b), n6 is 0 or more (n5+3) or less, preferably an integer of 0 or more and 3 or less, more preferably an integer of 0 or more and 2 or less, and particularly preferably 0. In the above formula (1b), n4 is an integer of 1 or more and 8 or less, preferably an integer of 1 or more and 5 or less, more preferably an integer of 1 or more and 3 or less, and particularly preferably 1 or 2.

式(1)中,Rc5 為氫原子、可具有取代基之碳原子數1以上11以下之烷基、或可具有取代基之芳基。作為Rc5 為烷基時可具有之取代基,可較佳地例示:苯基、萘基等。又,作為Rc1 為芳基時可具有之取代基,可較佳地例示:碳原子數1以上5以下之烷基、烷氧基、鹵素原子等。In the formula (1), R c5 is a hydrogen atom, an optionally substituted alkyl group having 1 to 11 carbon atoms, or an optionally substituted aryl group. Examples of substituents that may be possessed when R c5 is an alkyl group include phenyl, naphthyl, and the like. In addition, examples of substituents that may be possessed when R c1 is an aryl group include an alkyl group having 1 to 5 carbon atoms, an alkoxy group, a halogen atom, and the like.

式(1)中,作為Rc5 ,可較佳地例示氫原子、甲基、乙基、正丙基、異丙基、正丁基、苯基、苄基、甲基苯基、萘基等,該等中,更佳為甲基或苯基。In formula (1), as R c5 , hydrogen atom, methyl, ethyl, n-propyl, isopropyl, n-butyl, phenyl, benzyl, methylphenyl, naphthyl, etc. can be preferably exemplified Among these, methyl or phenyl is more preferred.

作為式(1)所示之化合物之較佳具體例,可例舉以下之PI-43~PI-83。 [化62]

Figure 02_image123
Preferred specific examples of the compound represented by formula (1) include the following PI-43 to PI-83. [化62]
Figure 02_image123

[化63]

Figure 02_image125
[化63]
Figure 02_image125

光聚合起始劑(C)之含量相對於除後述溶劑(S)之質量以外之樹脂組合物之質量(固形物成分整體),較佳為0.5質量%以上30質量%以下,更佳為1質量%以上20質量%以下。藉由將光聚合起始劑(C)之含量設為上述範圍,可獲得硬化性良好之樹脂組合物。The content of the photopolymerization initiator (C) is preferably 0.5% by mass or more and 30% by mass or less with respect to the mass of the resin composition other than the mass of the solvent (S) described below (total solid content), more preferably 1 The mass% is above 20 mass%. By setting the content of the photopolymerization initiator (C) in the above range, a resin composition with good curability can be obtained.

可對光聚合起始劑(C)組合光起始助劑。作為光起始助劑,可例舉:三乙醇胺、甲基二乙醇胺、三異丙醇胺、4-二甲基胺基苯甲酸甲酯、4-二甲基胺基苯甲酸乙酯、4-二甲基胺基苯甲酸異戊酯、4-二甲基胺基苯甲酸2-乙基己酯、苯甲酸2-二甲基胺基乙酯、N,N-二甲基對甲苯胺、4,4'-雙(二甲基胺基)二苯甲酮、9,10-二甲氧基蒽、2-乙基-9,10-二甲氧基蒽、9,10-二乙氧基蒽、2-乙基-9,10-二乙氧基蒽、2-巰基苯并噻唑、2-巰基苯并㗁唑、2-巰基苯并咪唑、2-巰基-5-甲氧基苯并噻唑、3-巰基丙酸、3-巰基丙酸甲酯、季戊四醇四巰基乙酸酯、3-巰基丙酸酯等硫醇化合物等。該等光起始助劑可單獨使用或組合兩種以上而使用。A photoinitiator auxiliary agent can be combined with the photopolymerization initiator (C). As the photo-initiating auxiliary, there may be mentioned: triethanolamine, methyldiethanolamine, triisopropanolamine, methyl 4-dimethylaminobenzoate, ethyl 4-dimethylaminobenzoate, 4 -Isoamyl dimethylaminobenzoate, 2-ethylhexyl 4-dimethylaminobenzoate, 2-dimethylaminoethyl benzoate, N,N-dimethyl-p-toluidine , 4,4'-bis(dimethylamino)benzophenone, 9,10-dimethoxyanthracene, 2-ethyl-9,10-dimethoxyanthracene, 9,10-diethyl Oxyanthracene, 2-ethyl-9,10-diethoxyanthracene, 2-mercaptobenzothiazole, 2-mercaptobenzoxazole, 2-mercaptobenzimidazole, 2-mercapto-5-methoxy Thiol compounds such as benzothiazole, 3-mercaptopropionic acid, methyl 3-mercaptopropionate, pentaerythritol tetramercaptoacetate, 3-mercaptopropionate, etc. These photoinitiating assistants can be used alone or in combination of two or more kinds.

・有機溶劑(S) 第2樹脂組合物典型而言可出於調整塗佈性之目的等而含有有機溶劑(S)。作為有機溶劑(S),可使用與關於第1樹脂組合物所說明之有機溶劑同樣之有機溶劑。・Organic solvent (S) Typically, the second resin composition may contain an organic solvent (S) for the purpose of adjusting coatability. As the organic solvent (S), the same organic solvent as the organic solvent explained for the first resin composition can be used.

有機溶劑(S)之使用量可根據樹脂組合物之用途而適當決定。作為有機溶劑(S)之使用量,舉一例而言,可例舉樹脂組合物之固形物成分濃度為1質量%以上50質量%以下之範圍之量。The use amount of the organic solvent (S) can be appropriately determined according to the use of the resin composition. As an example of the usage amount of the organic solvent (S), the solid content concentration of the resin composition may be an amount in the range of 1% by mass to 50% by mass.

・其他成分 樹脂組合物中,可視需要含有上述成分以外之其他各種添加劑。具體而言,可例示:分散助劑、填充劑、填料、密接促進劑、抗氧化劑、紫外線吸收劑、抗凝聚劑、熱聚合抑制劑、消泡劑、界面活性劑等。・Other ingredients The resin composition may optionally contain various additives other than the above-mentioned components. Specifically, examples thereof include dispersion aids, fillers, fillers, adhesion promoters, antioxidants, ultraviolet absorbers, anti-agglomeration agents, thermal polymerization inhibitors, defoamers, surfactants, and the like.

又,第2樹脂組合物亦可含有不與(甲基)丙烯酸樹脂(A-I)反應之含有環氧基之環狀矽氧烷化合物(A-II)。就易於形成相對介電常數較低之硬化物之方面而言,樹脂組合物較佳為不包含含有環氧基之環狀矽氧烷化合物。於樹脂組合物包含含有環氧基之環狀矽氧烷化合物(A-II)之情形時,其含量相對於除有機溶劑(S)之質量以外之樹脂組合物之質量而言較佳為40質量%以下,更佳為10質量%以下,進而較佳為1質量%以下。In addition, the second resin composition may contain an epoxy group-containing cyclic silicone compound (A-II) that does not react with the (meth)acrylic resin (A-I). In terms of easy formation of a cured product with a low relative permittivity, the resin composition preferably does not contain an epoxy group-containing cyclic siloxane compound. When the resin composition contains the epoxy-containing cyclic silicone compound (A-II), its content is preferably 40 relative to the mass of the resin composition other than the mass of the organic solvent (S) % By mass or less, more preferably 10% by mass or less, and still more preferably 1% by mass or less.

≪硬化物及硬化物之製造方法≫ 可藉由對上述樹脂組合物進行加熱及/或曝光而製造硬化物。於製造硬化物時,進行加熱、曝光、及加熱與曝光兩者之哪一種係考慮硬化物組合物之組成而適當決定。上述樹脂組合物之硬化物由於顯示較低之相對介電常數,故而適宜地用作各種圖像顯示裝置用顯示面板中之絕緣體等膜之材料。≪The hardened product and the manufacturing method of the hardened product≫ The cured product can be produced by heating and/or exposing the above-mentioned resin composition. When manufacturing a cured product, which of heating, exposure, and heating and exposure is performed is appropriately determined in consideration of the composition of the cured product composition. Since the cured product of the above-mentioned resin composition exhibits a relatively low relative permittivity, it is suitably used as a material for films such as insulators in display panels for various image display devices.

硬化物之相對介電常數以於頻率0.1 MHz下測定之值計,較佳為3.3以下,更佳為3.2以下,進而較佳為3.1以下。 作為相對介電常數之測定方法,較佳地應用水銀探針法。作為可利用水銀探針法進行相對介電常數測定之裝置,舉一例而言,可例舉SSM-495(Semilab Japan公司製造)。 作為相對介電常數之測定方法之較佳一例,可例舉如下方法:利用以下之1)~4)之步驟形成膜狀之硬化物之後,利用水銀探針法對所形成之硬化物進行相對介電常數測定。 1)於矽晶圓上塗佈樹脂組合物而形成塗佈膜。 2)將所形成之塗佈膜於100℃加熱120秒。 3)於樹脂組合物含有光聚合起始劑或感光性硬化劑之情形時,對塗佈膜任意地以1 kJ/cm2 之曝光量進行曝光。 4)視需要將曝光後之塗佈膜於230℃加熱20分鐘。The relative permittivity of the cured product is measured at a frequency of 0.1 MHz, and is preferably 3.3 or less, more preferably 3.2 or less, and still more preferably 3.1 or less. As a method of measuring the relative permittivity, the mercury probe method is preferably used. As an apparatus capable of measuring relative permittivity by the mercury probe method, for example, SSM-495 (manufactured by Semilab Japan) can be cited. As a preferable example of the method of measuring the relative permittivity, the following method can be cited: After forming a film-like cured product using the steps 1) to 4) below, the formed cured product is compared with the mercury probe method. Determination of dielectric constant. 1) Coating the resin composition on the silicon wafer to form a coating film. 2) Heat the formed coating film at 100°C for 120 seconds. 3) When the resin composition contains a photopolymerization initiator or a photosensitive curing agent, the coating film is arbitrarily exposed with an exposure amount of 1 kJ/cm 2. 4) If necessary, heat the exposed coating film at 230°C for 20 minutes.

硬化物之形狀並無特別限定,較佳為膜狀。於硬化物為膜之情形時,其厚度較佳為10 nm以上30000 nm以下,更佳為50 nm以上1500 nm以下,進而較佳為100 nm以上1000 nm以下。The shape of the cured product is not particularly limited, but a film shape is preferred. When the cured product is a film, its thickness is preferably 10 nm or more and 30000 nm or less, more preferably 50 nm or more and 1500 nm or less, and still more preferably 100 nm or more and 1000 nm or less.

於硬化物之形狀為膜狀之情形時,較佳為對塗佈於基板上之樹脂組合物之塗佈膜進行加熱及/或曝光。塗佈方法並無特別限定,例如可例舉使用輥式塗佈機、反向塗佈機、棒式塗佈機等接觸轉印型塗佈裝置,或旋轉器(旋轉式塗佈裝置)、淋幕式流塗機等非接觸型塗佈裝置進行塗佈之方法。When the shape of the cured product is a film, it is preferable to heat and/or expose the coating film of the resin composition coated on the substrate. The coating method is not particularly limited. For example, a roller coater, a reverse coater, a bar coater, etc. contact transfer type coating device, or a spinner (rotary coating device), A method of coating with non-contact coating devices such as curtain flow coaters.

較佳為對上述塗佈後之塗佈膜進行乾燥(預烘烤)。乾燥方法並無特別限定,例如可例舉如下方法:(1)利用加熱板於80℃以上120℃以下、較佳為90℃以上100℃以下之溫度下使其乾燥60秒以上120秒以下之方法;(2)於室溫下放置數小時~數天之方法;(3)放入熱風加熱器或紅外線加熱器中數十分鐘~數小時而去除溶劑之方法等。 再者,可與乾燥同時進行樹脂組合物之硬化。It is preferable to dry (pre-bake) the coated film after the above-mentioned coating. The drying method is not particularly limited. For example, the following methods can be exemplified: (1) Using a hot plate to dry at a temperature of 80°C or more and 120°C or less, preferably 90°C or more and 100°C or less, for 60 seconds or more and 120 seconds or less Methods; (2) Put it at room temperature for several hours to several days; (3) Put it in a hot air heater or infrared heater for several tens of minutes to several hours to remove the solvent, etc. Furthermore, the resin composition can be cured simultaneously with drying.

於將樹脂組合物加熱而形成硬化物之情形時,加熱溫度及加熱時間只要使硬化良好地進行,且硬化物不會產生熱劣化或熱分解,則並無特別限定。加熱溫度例如較佳為80℃以上300℃以下,更佳為100℃以上280℃以下,進而較佳為120℃以上250℃以下。加熱時間例如較佳為10秒以上12小時以下,更佳為1分鐘以上6小時以下,且更佳為2分鐘以上3小時以下。When the resin composition is heated to form a cured product, the heating temperature and heating time are not particularly limited as long as the curing progresses well and the cured product does not undergo thermal degradation or thermal decomposition. The heating temperature is, for example, preferably 80°C or higher and 300°C or lower, more preferably 100°C or higher and 280°C or lower, and still more preferably 120°C or higher and 250°C or lower. The heating time is, for example, preferably 10 seconds or more and 12 hours or less, more preferably 1 minute or more and 6 hours or less, and more preferably 2 minutes or more and 3 hours or less.

於對樹脂組合物進行曝光而形成硬化物之情形時,曝光條件只要使硬化良好地進行,則並無特別限定。曝光例如藉由照射紫外線、準分子雷射光等活性能量線而進行。照射之能量線量並無特別限制,例如可例舉3 mJ/cm2 以上2000 mJ/cm2 以下。When exposing the resin composition to form a cured product, the exposure conditions are not particularly limited as long as the curing progresses well. Exposure is performed by irradiating active energy rays, such as ultraviolet rays and excimer laser light, for example. The amount of energy rays to be irradiated is not particularly limited. For example, 3 mJ/cm 2 or more and 2000 mJ/cm 2 or less can be mentioned.

≪經圖案化之硬化膜之製造方法≫ 於使用含有感光性硬化劑之上述第1樹脂組合物或上述第2樹脂組合物作為樹脂組合物之情形時,可形成藉由應用光微影法而圖案化後之硬化膜。 具體而言,藉由包括以下步驟之方法而製造經圖案化之硬化膜: 將含有感光性硬化劑之上述第1樹脂性組合物或上述第2樹脂組合物塗佈於基板上而形成塗佈膜; 對於塗佈膜,位置選擇性地進行曝光; 利用顯影液對曝光後之塗佈膜進行顯影而使上述塗佈膜圖案化;及 對經圖案化之塗佈膜進行加熱。≪Method of manufacturing patterned hardened film≫ When the first resin composition or the second resin composition containing a photosensitive curing agent is used as the resin composition, a cured film patterned by applying a photolithography method can be formed. Specifically, a patterned hardened film is manufactured by a method including the following steps: Coating the above-mentioned first resin composition or the above-mentioned second resin composition containing a photosensitive curing agent on a substrate to form a coating film; For the coated film, the position is selectively exposed; Use a developer to develop the exposed coating film to pattern the coating film; and The patterned coating film is heated.

關於經圖案化之硬化膜,其膜厚如以上關於硬化膜所述般。 上述經圖案化之硬化膜之製造方法中,塗佈方法如以上關於硬化膜之製造方法所述般。曝光條件如以上關於硬化膜之製造方法所述般。位置選擇性之曝光例如經由負型之光罩而進行。關於曝光後之加熱條件,可應用以上關於硬化膜之製造方法所述之熱硬化之條件。Regarding the patterned cured film, the film thickness is as described above for the cured film. In the manufacturing method of the above-mentioned patterned cured film, the coating method is as described above with respect to the manufacturing method of a cured film. The exposure conditions are as described above with regard to the production method of the cured film. Position-selective exposure is performed, for example, through a negative type photomask. Regarding the heating conditions after exposure, the thermal curing conditions described above for the production method of the cured film can be applied.

顯影方法並無特別限定,例如可使用浸漬法、噴霧法等。作為顯影液之具體例,可例舉:樹脂組合物可含有之有機溶劑(S);單乙醇胺、二乙醇胺、三乙醇胺等有機系之顯影液;例如以濃度0.02質量%以上10質量%以下含有氫氧化鈉、氫氧化鉀、碳酸鈉、氨、四級銨鹽等之鹼性水溶液。 於樹脂組合物為含有感光性硬化劑之第1樹脂組合物之情形時,較佳為樹脂組合物可含有之有機溶劑(S)。 於樹脂組合物為第2樹脂組合物之情形時,作為顯影液,較佳為鹼性顯影液。作為鹼性顯影液,較佳為例如濃度0.05質量%以上10質量%以下、較佳為濃度0.05質量%以上3質量%以下之氫氧化四甲基銨水溶液。 [實施例]The development method is not particularly limited, and for example, a dipping method, a spray method, etc. can be used. Specific examples of the developer include: organic solvent (S) that the resin composition may contain; organic developer such as monoethanolamine, diethanolamine, triethanolamine, etc.; for example, it contains at a concentration of 0.02% by mass to 10% by mass Alkaline aqueous solution of sodium hydroxide, potassium hydroxide, sodium carbonate, ammonia, quaternary ammonium salt, etc. When the resin composition is the first resin composition containing a photosensitive hardener, it is preferably an organic solvent (S) that the resin composition can contain. When the resin composition is the second resin composition, the developer is preferably an alkaline developer. As the alkaline developer, for example, a tetramethylammonium hydroxide aqueous solution having a concentration of 0.05% by mass or more and 10% by mass or less, and preferably a concentration of 0.05% by mass or more and 3% by mass or less is preferable. [Example]

以下,基於實施例對本發明更詳細地進行說明,但本發明並不受該等實施例限定。Hereinafter, the present invention will be described in more detail based on examples, but the present invention is not limited by these examples.

[實施例1] 將容量300 mL之玻璃製三口燒瓶之內部置換成氮氣氛圍之後,使燒瓶之內溫成為80℃。其次,將二乙二醇甲基乙基醚(MEDG)5.18 g加入燒瓶內。 另外,於容量300 mL之玻璃製樣品瓶內,加入包含甲基丙烯酸12質量%、甲基丙烯酸三環[5.2.1.02,6 ]癸酯17質量%以及甲基丙烯酸3,4-環氧環己基甲酯71質量%之單體混合物29 g、作為聚合起始劑之2,2'-偶氮雙(2-甲基丙酸)二甲酯5 g、及MEDG 62 g,製備聚合溶液。 於80℃下,將所得之聚合溶液以2小時滴下至三口燒瓶中之後,於80℃繼續攪拌2小時以繼續進行聚合反應。 其結果,獲得含有下述結構單元比率之(甲基)丙烯酸樹脂(樹脂P1)50 g的(甲基)丙烯酸樹脂之MEDG溶液(濃度30質量%)。括號之右下之數值為各結構單元之比率(質量%)。 關於所得之(甲基)丙烯酸樹脂,利用凝膠滲透層析法測定聚苯乙烯換算之分子量,結果重量平均分子量(Mw)為9000。 [化64]

Figure 02_image127
[Example 1] After replacing the inside of a glass three-necked flask with a capacity of 300 mL with a nitrogen atmosphere, the internal temperature of the flask was set to 80°C. Next, 5.18 g of diethylene glycol methyl ethyl ether (MEDG) was added to the flask. In addition, a glass sample bottle with a capacity of 300 mL was filled with 12% by mass of methacrylic acid , 17% by mass of tricyclo[5.2.1.0 2,6 ]decyl methacrylate, and 3,4-epoxy methacrylate. 29 g of a monomer mixture of 71% by mass of cyclohexyl methyl ester, 5 g of 2,2'-azobis(2-methylpropionic acid) dimethyl as a polymerization initiator, and 62 g of MEDG to prepare a polymerization solution . After dropping the resulting polymerization solution into a three-necked flask at 80°C for 2 hours, stirring was continued for 2 hours at 80°C to continue the polymerization reaction. As a result, a MEDG solution (concentration 30% by mass) of (meth)acrylic resin containing 50 g of (meth)acrylic resin (resin P1) in the following structural unit ratio was obtained. The value at the bottom right of the bracket is the ratio (mass %) of each structural unit. Regarding the obtained (meth)acrylic resin, the molecular weight in terms of polystyrene was measured by gel permeation chromatography. As a result, the weight average molecular weight (Mw) was 9,000. [化64]
Figure 02_image127

繼而,於所得之樹脂P1之溶液中,加入下述結構之含有環氧基之環狀矽氧烷化合物C1 3 g及1-甲基咪唑1 g。其後,於80℃下將燒瓶之內容物攪拌30分鐘,使樹脂P1與含有環氧基之環狀矽氧烷化合物反應而獲得作為矽氧烷改質(甲基)丙烯酸樹脂之樹脂P2。 藉由FT-IR(fourier transform infrared radiation,傅立葉轉換紅外線光譜)測定,確認由於樹脂P1與含有環氧基之環狀矽氧烷化合物之反應而生成了酯鍵與羥基。 關於所得之樹脂P2,利用凝膠滲透層析法測定聚苯乙烯換算之分子量,結果重量平均分子量(Mw)為13000。 [化65]

Figure 02_image129
Then, to the obtained solution of the resin P1, 3 g of the epoxy-containing cyclic siloxane compound C1 3 g and 1-methylimidazole 1 g of the following structure were added. Thereafter, the contents of the flask were stirred at 80°C for 30 minutes to react the resin P1 with the epoxy-containing cyclic silicone compound to obtain the resin P2 as a silicone-modified (meth)acrylic resin. By FT-IR (fourier transform infrared radiation, Fourier transform infrared spectroscopy) measurement, it was confirmed that ester bonds and hydroxyl groups were formed due to the reaction between resin P1 and epoxy-containing cyclic siloxane compounds. Regarding the obtained resin P2, the molecular weight in terms of polystyrene was measured by gel permeation chromatography. As a result, the weight average molecular weight (Mw) was 13,000. [化65]
Figure 02_image129

[實施例2、比較例1及比較例2] 於實施例2、比較例1及比較例2中,使用二季戊四醇六丙烯酸酯作為光聚合性單體。[Example 2, Comparative Example 1, and Comparative Example 2] In Example 2, Comparative Example 1, and Comparative Example 2, dipentaerythritol hexaacrylate was used as the photopolymerizable monomer.

於實施例2、比較例1及比較例2中,使用下述式之化合物作為光聚合起始劑。 [化66]

Figure 02_image131
In Example 2, Comparative Example 1, and Comparative Example 2, the compound of the following formula was used as the photopolymerization initiator. [化66]
Figure 02_image131

於實施例2、比較例1及比較例2中,使用IR1010(BASF Japan公司製造)作為抗氧化劑。使用3-縮水甘油氧基丙基三甲氧基矽烷作為矽烷偶合劑。使用BYK-310(BYK-Chemie公司製造)作為界面活性劑。使用MEDG與丙二醇單甲醚乙酸酯(PGMEA)作為有機溶劑。In Example 2, Comparative Example 1, and Comparative Example 2, IR1010 (manufactured by BASF Japan) was used as the antioxidant. Use 3-glycidoxypropyltrimethoxysilane as the silane coupling agent. As the surfactant, BYK-310 (manufactured by BYK-Chemie) was used. MEDG and propylene glycol monomethyl ether acetate (PGMEA) were used as organic solvents.

將下表1中記載之種類之各成分,以下表1中記載之比率(質量%)加以混合而獲得實施例2、比較例1及比較例2之硬化性樹脂組合物。使用所得之實施例2、比較例1及比較例2之樹脂組合物,依照下述配方進行硬化物之相對介電常數之測定與硬化物之光線透過率之測定(波長380~780 nm)。將該等之評價結果記載於表1。Each component of the type described in Table 1 below was mixed with the ratio (% by mass) described in Table 1 below to obtain curable resin compositions of Example 2, Comparative Example 1, and Comparative Example 2. Using the obtained resin compositions of Example 2, Comparative Example 1, and Comparative Example 2, the relative dielectric constant of the cured product and the light transmittance of the cured product (wavelength 380-780 nm) were measured according to the following formula. The evaluation results are shown in Table 1.

<相對介電常數測定> 利用旋轉器於矽晶圓上塗佈樹脂組合物而形成塗佈膜。於100℃下將所形成之塗佈膜加熱120秒之後,進而於230℃下加熱20分鐘而形成膜厚1 μm之硬化膜。 對於所形成之硬化膜,使用SSM-495(Semilab Japan公司製造)以0.1 MHz之測定頻率測定硬化膜之相對介電常數。<Measurement of relative permittivity> The resin composition is coated on the silicon wafer with a spinner to form a coating film. After heating the formed coating film at 100°C for 120 seconds, it was further heated at 230°C for 20 minutes to form a cured film with a film thickness of 1 μm. For the formed cured film, SSM-495 (manufactured by Semilab Japan) was used to measure the relative permittivity of the cured film at a measuring frequency of 0.1 MHz.

<光線透過率測定> 利用旋轉器於玻璃基板上塗佈樹脂組合物而形成塗佈膜。於100℃下將所形成之塗佈膜加熱120秒。對於加熱後之塗佈膜,使用曝光裝置(TME-150PRO,TOPCON公司製造)以20 mW/cm2 之曝光量進行塗佈膜之曝光。對於曝光後之塗佈膜,於230℃下進行20分鐘之加熱而獲得膜厚3 μm之硬化膜。利用MCPD-3700(大塚電子公司製造)測定所得之硬化膜之光線透過率(波長380~780 nm)。<Measurement of light transmittance> The resin composition was coated on a glass substrate with a spinner to form a coating film. The formed coating film was heated at 100°C for 120 seconds. For the coated film after heating, an exposure device (TME-150PRO, manufactured by TOPCON Corporation) was used to expose the coated film with an exposure amount of 20 mW/cm 2. The coated film after exposure was heated at 230°C for 20 minutes to obtain a cured film with a thickness of 3 μm. The light transmittance (wavelength 380-780 nm) of the obtained cured film was measured with MCPD-3700 (manufactured by Otsuka Electronics Co., Ltd.).

[表1]       實施例2 比較例1 比較例2 矽氧烷改質(甲基)丙烯酸樹脂 種類 樹脂P2 - - 質量% 14.48 - - (甲基)丙烯酸樹脂 種類 - 樹脂P1 樹脂P1 質量% - 14.48 12.9 含有環氧基之環狀矽氧烷化合物 種類 - - 化合物C1 質量% - - 1.58 光聚合性單體 質量% 7.25 7.25 7.25 光聚合起始劑 質量% 0.88 0.88 0.88 抗氧化劑 質量% 0.10 0.10 0.10 矽烷偶合劑 質量% 0.22 0.22 0.22 界面活性劑 質量% 0.04 0.04 0.04 MEDG 質量% 30.80 30.80 30.80 PGMEA 質量% 46.23 46.23 46.23 相對介電常數 3.3 3.6 3.5 光線透過率 99% 99% 99% [Table 1] Example 2 Comparative example 1 Comparative example 2 Silicone modified (meth)acrylic resin type Resin P2 - - quality% 14.48 - - (Meth) acrylic resin type - Resin P1 Resin P1 quality% - 14.48 12.9 Cyclic siloxane compounds containing epoxy groups type - - Compound C1 quality% - - 1.58 Photopolymerizable monomer quality% 7.25 7.25 7.25 Photopolymerization initiator quality% 0.88 0.88 0.88 Antioxidants quality% 0.10 0.10 0.10 Silane coupling agent quality% 0.22 0.22 0.22 Surfactant quality% 0.04 0.04 0.04 MEDG quality% 30.80 30.80 30.80 PGMEA quality% 46.23 46.23 46.23 Relative permittivity 3.3 3.6 3.5 Light transmittance 99% 99% 99%

根據表1可知,含有樹脂P2之實施例2之樹脂組合物可提供相對介電常數較低且透明之硬化物,該樹脂P2係藉由使包含源自具有脂環式環氧基之(甲基)丙烯酸酯之結構單元之(甲基)丙烯酸樹脂、與含有環氧基之矽氧烷化合物反應而獲得之矽氧烷改質(甲基)丙烯酸樹脂。 另一方面,可知含有未經含有環氧基之矽氧烷化合物改質之(甲基)丙烯酸樹脂,或組合含有(甲基)丙烯酸樹脂與含有環氧基之矽氧烷化合物之比較例1及比較例2之樹脂組合物可提供雖為透明但相對介電常數較高之硬化物。According to Table 1, the resin composition of Example 2 containing resin P2 can provide a relatively low dielectric constant and transparent cured product. (Meth)acrylic resin, which is the structural unit of acrylate, and silicone modified (meth)acrylic resin obtained by reacting with epoxy-containing silicone compound. On the other hand, it can be seen that it contains (meth)acrylic resin that has not been modified by epoxy-containing silicone compound, or is a combination of (meth)acrylic resin and epoxy-containing silicone compound in Comparative Example 1 And the resin composition of Comparative Example 2 can provide a cured product that is transparent but has a relatively high dielectric constant.

[實施例3] 將實施例1中使用之單體混合物換成包含甲基丙烯酸14質量%、甲基丙烯酸三環[5.2.1.02,6 ]癸酯17質量%以及丙烯酸3,4-環氧三環[5.2.1.02,6 ]癸烷-1-基酯69質量%之單體混合物,除此以外,以與實施例1同樣之方式獲得含有下述結構單元比率之(甲基)丙烯酸樹脂(樹脂P3)50 g之(甲基)丙烯酸樹脂之MEDG溶液(濃度30質量%)。括號之右下之數值為各結構單元之比率(質量%)。 關於所得之(甲基)丙烯酸樹脂,利用凝膠滲透層析法測定聚苯乙烯換算之分子量,結果重量平均分子量(Mw)為9500。[Example 3] The monomer mixture used in Example 1 was replaced with 14% by mass of methacrylic acid , 17% by mass of tricyclo[5.2.1.0 2,6 ]decyl methacrylate, and 3,4-ring of acrylic acid Except for the monomer mixture of 69% by mass of oxotricyclic [5.2.1.0 2,6 ]decane-1-yl ester, in the same manner as in Example 1, (methyl) containing the following structural unit ratio was obtained Acrylic resin (resin P3) 50 g (meth)acrylic resin MEDG solution (concentration 30% by mass). The value at the bottom right of the bracket is the ratio (mass %) of each structural unit. Regarding the obtained (meth)acrylic resin, the molecular weight in terms of polystyrene was measured by gel permeation chromatography. As a result, the weight average molecular weight (Mw) was 9,500.

[化67]

Figure 02_image133
[化67]
Figure 02_image133

繼而,以與實施例1同樣之方式使樹脂P3與實施例1中使用之含有環氧基之環狀矽氧烷化合物進行反應,而獲得作為矽氧烷改質(甲基)丙烯酸樹脂之樹脂P4。 藉由FT-IR測定,確認由於樹脂P3與含有環氧基之環狀矽氧烷化合物之反應而生成了酯鍵與羥基。 關於所得之樹脂P4,利用凝膠滲透層析法測定聚苯乙烯換算之分子量,結果重量平均分子量(Mw)為125000。Then, in the same manner as in Example 1, the resin P3 was reacted with the epoxy-containing cyclic siloxane compound used in Example 1 to obtain a resin as a siloxane-modified (meth)acrylic resin P4. By FT-IR measurement, it was confirmed that an ester bond and a hydroxyl group were formed due to the reaction between the resin P3 and the epoxy-containing cyclic silicone compound. Regarding the obtained resin P4, the molecular weight in terms of polystyrene was measured by gel permeation chromatography. As a result, the weight average molecular weight (Mw) was 125,000.

[實施例4、比較例3及比較例4] 將樹脂P1換成樹脂P3以及將樹脂P2換成樹脂P4,除此以外,以與實施例2、比較例1及比較例2同樣之方式依照下表2獲得實施例4、比較例3及比較例4之硬化性樹脂組合物。使用所得之實施例4、比較例3及比較例4之樹脂組合物,以與實施例2、比較例1及比較例2同樣之方式進行硬化物之相對介電常數之測定與硬化物之光線透過率之測定(波長380~780 nm)。將該等之評價結果記載於表2。[Example 4, Comparative Example 3, and Comparative Example 4] Except that the resin P1 was replaced with the resin P3 and the resin P2 was replaced with the resin P4, in the same manner as in Example 2, Comparative Example 1, and Comparative Example 2, Example 4, Comparative Example 3, and Comparison were obtained in accordance with Table 2 below. The curable resin composition of Example 4. Using the obtained resin compositions of Example 4, Comparative Example 3, and Comparative Example 4, the relative permittivity of the cured product and the light of the cured product were measured in the same manner as in Example 2, Comparative Example 1 and Comparative Example 2. Measurement of transmittance (wavelength 380 ~ 780 nm). The evaluation results are shown in Table 2.

[表2]       實施例4 比較例3 比較例4 矽氧烷改質(甲基)丙烯酸樹脂 種類 樹脂P4 - - 質量% 14.48 - - (甲基)丙烯酸樹脂 種類 - 樹脂P3 樹脂P3 質量% - 14.48 12.9 含有環氧基之環狀矽氧烷化合物 種類 - - 化合物C1 質量% - - 1.58 光聚合性單體 質量% 7.25 7.25 7.25 光聚合起始劑 質量% 0.88 0.88 0.88 抗氧化劑 質量% 0.10 0.10 0.10 矽烷偶合劑 質量% 0.22 0.22 0.22 界面活性劑 質量% 0.04 0.04 0.04 MEDG 質量% 30.80 30.80 30.80 PGMEA 質量% 46.23 46.23 46.23 相對介電常數 3.0 3.3 3.2 光線透過率 99% 99% 99% [Table 2] Example 4 Comparative example 3 Comparative example 4 Silicone modified (meth)acrylic resin type Resin P4 - - quality% 14.48 - - (Meth) acrylic resin type - Resin P3 Resin P3 quality% - 14.48 12.9 Cyclic siloxane compounds containing epoxy groups type - - Compound C1 quality% - - 1.58 Photopolymerizable monomer quality% 7.25 7.25 7.25 Photopolymerization initiator quality% 0.88 0.88 0.88 Antioxidants quality% 0.10 0.10 0.10 Silane coupling agent quality% 0.22 0.22 0.22 Surfactant quality% 0.04 0.04 0.04 MEDG quality% 30.80 30.80 30.80 PGMEA quality% 46.23 46.23 46.23 Relative permittivity 3.0 3.3 3.2 Light transmittance 99% 99% 99%

根據表2可知,含有樹脂P4之實施例4之樹脂組合物可提供相對介電常數較低且透明之硬化物,該樹脂P4係藉由使包含源自具有脂環式環氧基之(甲基)丙烯酸酯之結構單元之(甲基)丙烯酸樹脂、與含有環氧基之矽氧烷化合物反應而獲得之矽氧烷改質(甲基)丙烯酸樹脂。 另一方面,含有未經含有環氧基之矽氧烷化合物改質之(甲基)丙烯酸樹脂,或組合含有(甲基)丙烯酸樹脂與含有環氧基之矽氧烷化合物之比較例3及比較例4之樹脂組合物可提供雖為透明但相對介電常數較高之硬化物。According to Table 2, the resin composition of Example 4 containing resin P4 can provide a relatively low dielectric constant and a transparent cured product. The resin P4 is made by containing (a (Meth)acrylic resin, which is the structural unit of acrylate, and silicone modified (meth)acrylic resin obtained by reacting with epoxy-containing silicone compound. On the other hand, containing (meth)acrylic resin that has not been modified by epoxy-containing silicone compound, or a combination of (meth)acrylic resin and epoxy-containing silicone compound in Comparative Example 3 and The resin composition of Comparative Example 4 can provide a cured product that is transparent but has a relatively high dielectric constant.

Claims (12)

一種樹脂組合物,其含有矽氧烷改質(甲基)丙烯酸樹脂(A1), 上述矽氧烷改質(甲基)丙烯酸樹脂(A1)係包含源自具有脂環式環氧基之(甲基)丙烯酸酯之結構單元之(甲基)丙烯酸樹脂(A-I)、與下述式(a-I)所示之含有環氧基之環狀矽氧烷化合物(A-II)之反應物, [化1]
Figure 03_image135
(式(a-I)中,Ra01 及Ra02 表示含有環氧基之一價基或烷基,x1表示3以上之整數,x1個Ra01 及x1個Ra02 中之至少兩個為含有環氧基之一價基)。
A resin composition containing a silicone-modified (meth)acrylic resin (A1). The silicone-modified (meth)acrylic resin (A1) contains ( [化1]
Figure 03_image135
(In formula (aI), Ra01 and Ra02 represent monovalent groups or alkyl groups containing epoxy groups, x1 represents an integer of 3 or more, and at least two of x1 Ra01 and x1 Ra02 contain epoxy One valence basis).
如請求項1之樹脂組合物,其中上述(甲基)丙烯酸樹脂(A-I)中之源自具有脂環式環氧基之(甲基)丙烯酸酯之結構單元的量為50質量%以上。The resin composition of claim 1, wherein the amount of the structural unit derived from the (meth)acrylate having an alicyclic epoxy group in the (meth)acrylic resin (A-I) is 50% by mass or more. 如請求項1或2之樹脂組合物,其中上述矽氧烷改質(甲基)丙烯酸樹脂(A1)係使100質量之上述(甲基)丙烯酸樹脂(A-I)與1質量份以上50質量份以下之上述含有環氧基之環狀矽氧烷化合物(A-II)反應而成之反應物。The resin composition of claim 1 or 2, wherein the silicone-modified (meth)acrylic resin (A1) is made of 100 parts by mass of the (meth)acrylic resin (AI) and 1 part by mass or more and 50 parts by mass The following reactants formed by the reaction of the above-mentioned epoxy-containing cyclic siloxane compound (A-II). 如請求項1或2之樹脂組合物,其中上述具有脂環式環氧基之(甲基)丙烯酸酯包含多環烷烴骨架。The resin composition of claim 1 or 2, wherein the (meth)acrylate having an alicyclic epoxy group includes a polycyclic alkane skeleton. 如請求項1或2之樹脂組合物,其含有上述矽氧烷改質(甲基)丙烯酸樹脂(A1)、光聚合性單體(B)、及光聚合起始劑(C),且 上述矽氧烷改質(甲基)丙烯酸樹脂(A1)包含具有鹼可溶性基之結構單元。The resin composition of claim 1 or 2, which contains the above-mentioned silicone modified (meth)acrylic resin (A1), a photopolymerizable monomer (B), and a photopolymerization initiator (C), and The above-mentioned silicone modified (meth)acrylic resin (A1) contains a structural unit having an alkali-soluble group. 一種硬化物,其係藉由加熱及/或曝光使如請求項1至5中任一項之上述樹脂組合物硬化而成。A hardened product obtained by hardening the above-mentioned resin composition according to any one of claims 1 to 5 by heating and/or exposure. 一種硬化物之製造方法,其係對如請求項1至5中任一項之上述樹脂組合物進行加熱及/或曝光。A method for manufacturing a hardened product, which heats and/or exposes the above-mentioned resin composition according to any one of claims 1 to 5. 一種經圖案化之硬化膜之製造方法,其包括以下步驟: 將如請求項5之樹脂組合物塗佈於基板上而形成塗佈膜; 對於上述塗佈膜,位置選擇性地進行曝光; 利用鹼性顯影液對曝光後之上述塗佈膜進行顯影而使上述塗佈膜圖案化;及 對經圖案化之上述塗佈膜進行加熱。A method for manufacturing a patterned hardened film, which includes the following steps: Coating the resin composition of claim 5 on the substrate to form a coating film; For the above-mentioned coated film, position-selective exposure is performed; Use an alkaline developer to develop the exposed coating film to pattern the coating film; and The patterned coating film is heated. 一種矽氧烷改質(甲基)丙烯酸樹脂,其係包含源自具有脂環式環氧基之(甲基)丙烯酸酯之結構單元之(甲基)丙烯酸樹脂(A-I)、與下述式(a-I)所示之含有環氧基之環狀矽氧烷化合物(A-II)之反應物, [化2]
Figure 03_image137
(式(a-I)中,Ra01 及Ra02 表示含有環氧基之一價基或烷基,x1表示3以上之整數,x1個Ra01 及x1個Ra02 中之至少兩個為含有環氧基之一價基)。
A siloxane-modified (meth)acrylic resin, which is a (meth)acrylic resin (AI) containing structural units derived from (meth)acrylates with alicyclic epoxy groups, and the following formula The reactant of the epoxy-containing cyclic siloxane compound (A-II) shown in (aI), [化2]
Figure 03_image137
(In formula (aI), Ra01 and Ra02 represent monovalent groups or alkyl groups containing epoxy groups, x1 represents an integer of 3 or more, and at least two of x1 Ra01 and x1 Ra02 contain epoxy One valence basis).
如請求項9之矽氧烷改質(甲基)丙烯酸樹脂,其中上述(甲基)丙烯酸樹脂(A-I)中之源自具有脂環式環氧基之(甲基)丙烯酸酯之結構單元的量為50質量%以上。Such as the silicone-modified (meth)acrylic resin of claim 9, wherein the above-mentioned (meth)acrylic resin (AI) is derived from a structural unit of (meth)acrylate having an alicyclic epoxy group The amount is 50% by mass or more. 如請求項9或10之矽氧烷改質(甲基)丙烯酸樹脂,其係使100質量之上述(甲基)丙烯酸樹脂(A-I)與1質量份以上50質量份以下之上述含有環氧基之環狀矽氧烷化合物(A-II)反應而成之反應物。For example, the silicone-modified (meth)acrylic resin of claim 9 or 10, which is made of 100 parts by mass of the above-mentioned (meth)acrylic resin (AI) and 1 part by mass or more and 50 parts by mass or less of the above-mentioned epoxy group The cyclic siloxane compound (A-II) is a reactant. 如請求項9或10之矽氧烷改質(甲基)丙烯酸樹脂,其中上述具有脂環式環氧基之(甲基)丙烯酸酯包含多環烷烴骨架。The silicone-modified (meth)acrylic resin according to claim 9 or 10, wherein the (meth)acrylate having an alicyclic epoxy group contains a polycyclic alkane skeleton.
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JP6886782B2 (en) * 2016-06-30 2021-06-16 東京応化工業株式会社 A photosensitive resin composition, a cured film, a bank for partitioning a light emitting layer in an organic EL element, a substrate for an organic EL element, an organic EL element, a method for producing a cured film, a method for producing a bank, and a method for producing an organic EL element.

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