TW202109720A - 基材傳送設備 - Google Patents

基材傳送設備 Download PDF

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TW202109720A
TW202109720A TW109124629A TW109124629A TW202109720A TW 202109720 A TW202109720 A TW 202109720A TW 109124629 A TW109124629 A TW 109124629A TW 109124629 A TW109124629 A TW 109124629A TW 202109720 A TW202109720 A TW 202109720A
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room
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吳丞倍
内山昌彦
李錫準
趙寬英
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南韓商樂華系統股份有限公司
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Abstract

一種能夠減少供清除用之氮氣及其關機時間的基材傳送設備。該基材傳送設備包括一通風驅動室、一FOUP收容室、一驅動設備室、以及一通風管道。該通風驅動室備有用於向下吹空氣的一主風扇。該FOUP收容室設置於該通風驅動室下方且容納用於儲存一基材的一FOUP。該驅動設備室設置於該FOUP收容室下方。該通風管道連接該FOUP收容室與該通風驅動室。

Description

基材傳送設備
本申請案主張來自申請於2019年8月14日之韓國專利申請案第10-2019-0099610號的優先權及利益，藉此併入本文猶如完整闡述於此作為用於所有目的的參考資料。
本發明係有關於一種基材傳送設備，且更特別的是，有關於一種用於在晶圓儲存容器與加工設備之間攜載晶圓的基材傳送設備。
半導體裝置係通過各種製程在為晶圓的矽基材上製成。在製造半導體裝置中，高度集成及電路小型化正在逐步發展，且要求晶圓周圍保持高度乾淨以防粒子或水氣附著至晶圓表面。此外，半導體裝置的製程在氮氣氣氛下或真空中進行以防晶圓的表面特性改變，例如氧化。
為了恰當地維持在晶圓周圍的氣氛，在充滿氮、稱為前開式晶圓傳送盒(Front-Opening Unified Pod，FOUP)的密封圍阻盒(sealed containment pod)內管理晶圓。此外，為了在用於加工晶圓的加工設備與FOUP之間傳送晶圓，使用稱為EFEM(設備前端模組)的基材傳送設備。
圖1為習知基材傳送設備的橫截面圖。
請參考圖1，習知基材傳送設備100包括通風驅動室110、FOUP收容室120、驅動設備室130、及通風管道150。
在通風驅動室110中，設有主風扇140以向下吹氮氣(或空氣)以清潔基材傳送設備100的內部。
氮氣被向下吹而通過FOUP收容室120到驅動設備室130，且流入通過通風管道150，其係連接形成在驅動設備室130下半部的第一開口部(A)與形成在通風驅動室110上半部的第二開口部(B)。
亦即，通風在達到不需要通風之驅動設備室130的大區域中進行，且因此，增加氮氣的需要量且增加設備的關機時間。
因此，本發明解決此問題是要提供一種基材傳送設備，它可減少氮氣的需要量以及設備的關機時間。
根據一示範具體實施例的基材傳送設備包括一通風驅動室、一FOUP收容室、一驅動設備室、及一通風管道。該通風驅動室備有用於向下吹空氣的主風扇。該FOUP收容室設置在該通風驅動室下方且容納用於儲存一基材的一FOUP。該驅動設備室設置在該FOUP收容室下方。該通風管道連接該FOUP收容室與該通風驅動室。
例如，該FOUP收容室可包含形成在彼之下半部的第一開口部，該通風驅動室可包含形成在彼之上半部的第二開口部，以及一通風管道可連接該第一開口部與該第二開口部。
在此情形下，該基材傳送設備可進一步包含設在該第一開口部中的一次要風扇(sub fan)。
另一方面，該FOUP收容室可包含一門扉，其通過下降來打開該FOUP收容室的一第一側且通過上升來關閉該FOUP收容室的該一側，且該基材傳送設備可進一步包含：在該FOUP收容室之該第一側下方鄰近該驅動設備室設置的一門扉收容室，以及在該FOUP收容室之一第二側上鄰近該驅動設備室設置的一排出路徑。
在此情形下，該基材傳送設備可進一步包含：連接該門扉收容室與該排出路徑的一連接路徑。
此外，該基材傳送設備可進一步包含：一副閥體與一主閥體。該副閥體可設在該連接路徑中以打開及關閉該連接路徑。該主閥體排放在該排出路徑中的氣體到外面。
如上述，根據本發明的基材傳送設備，藉由使通風空間不包括為不需要通風之空間的該驅動設備室，可減少氮氣的需要量以及設備的關機時間。
此外，相較於習知基材傳送設備，有可能減少該主風扇的轉速，從而減少耗電量。
此外，當添加一次要風扇至形成於FOUP收容室中的該第一開口部時，藉由減少FOUP收容室中的亂流有可能誘發氮氣的平滑流動。
此外，當形成門扉收容室時，通過連接該門扉收容室與該排出路徑的一連接路徑，可清除門扉收容室的內部，且通過主閥體可排放引進的粒子到外面。
本發明可能有各種變化且可能有各種形式，且數個特定具體實施例將圖示於附圖且詳述於本文中。不過，應瞭解，這非旨在限制本發明為特定的揭露形式，而是要包括包含在本發明之精神及範疇中的所有修改、等效及替代。在描述各圖時，類似的組件使用相同的元件符號。為求清楚圖解說明本發明，在附圖中，可能誇大實際結構的尺寸。
例如第一及第二的用語可用來描述不同的組件，但是該等組件不應受限於該等用語。該等用語只是為了區分一組件與其他組件。例如，第一組件可稱為第二組件而不脫離本發明的範疇，同樣，第二組件也可稱為第一組件。
使用於本申請案的用語只是用來描述特定的具體實施例，且非旨在限制本發明。單數措詞包括複數措詞，除非上下文另有明示。在本申請案中，例如「包括」或「具有」的用語旨在指明描述本專利說明書之特徵、數字、步驟、運作、組件、部件或彼等之組合的存在，且應瞭解，不事先排除存在特徵、數字、步驟、動作、組件、部件或彼等之組合中之一或多個額外可能性。此外，A與B‘連接'及‘連結'不僅意指A與B直接連接，也意指在A與B之間可包括其他組件C以連接或連結A與B。
除非另有界定，所有使用於本文的用語，包括技術或科學用語，都有與熟諳本發明所屬技藝者通常所了解者相同的意思。例如界定於常用字典之中的用語應被解釋為有與在相關技術背景下之意思一致的意思，且不應被解釋為理想或過於正式的意思，除非本申請案另有明確定義。此外，在本發明方法的專利請求項中，除非各步驟被明確地綁定到順序，各步驟的順序可彼此互換。
以下將參考附圖詳述本發明的數個示範具體實施例。
圖2根據本發明之一示範具體實施例圖示一基材傳送設備的橫截面圖。
請參考圖2，根據本發明之一示範具體實施例的基材傳送設備200包括通風驅動室110、FOUP收容室120、驅動設備室130、及通風管道150。基材傳送設備200的殼體被分隔成可形成通風驅動室110、FOUP收容室120、及驅動設備室130。從底部依序配置驅動設備室130、FOUP收容室120及通風驅動室110。
通風驅動室110設有主風扇140。主風扇140使空氣(或氮氣)向下吹。另一方面，通風驅動室110與FOUP收容室120在圖中分開在殼體的分區中，但是這只是為了便於說明。通風驅動室110與FOUP收容室120經形成為空氣可從通風驅動室110流到FOUP收容室120。
FOUP收容室120設置在通風驅動室110下方且容納用於儲存基材的FOUP。儘管未圖示，FOUP收容室120設有門扉。通過此門扉(未圖示)，設置在裝載埠RP之夾具J上面的FOUP可傳送到FOUP收容室120中。
此時，門扉(未圖示)藉由朝向通風驅動室110上升可打開，且藉由返回到FOUP收容室120可關閉。另一方面，如同習知基材傳送設備，在門扉降到較低的驅動設備室130時，可打開圖示於圖3及圖4的基材傳送設備100，且藉由返回到FOUP收容室120可關閉。上述實施例會在說明圖3及圖4時予以詳述。
驅動設備室130設置在FOUP收容室120下方。在驅動設備室130中，可裝設用於驅動基材傳送設備的設施。
通風管道150連接FOUP收容室120與通風驅動室110。例如，FOUP收容室120包括形成在彼之下半部的第一開口部(A)，且通風驅動室110包括形成在彼之上半部的第二開口部(B)，以及通風管道150可連接第一開口部(A)與第二開口部(B)。
另一方面，在圖2中，圖示通風管道150形成在裝載埠RP的反面(例如，背面)上，但不限於此。亦即，通風管道15可形成於旁邊。
基材傳送設備200可進一步包含設在第一開口部(A)中的次要風扇(未圖示)。在說明圖3時會更詳細地描述此次要風扇。
圖3及圖4根據本發明之另一示範具體實施例圖示一基材傳送設備的橫截面圖，圖3的橫截面圖圖示處於門扉關閉的狀態，且圖4的橫截面圖圖示處於門扉打開的狀態。根據本發明另一具體實施例揭露於圖3及圖4的基材傳送設備400如同習知基材傳送設備100有向下降低以打開FOUP收容室120且向上升高以關閉的門扉，使得相較於圖2的基材傳送設備200，基材傳送設備400有複雜的組態。用相同的元件符號標示圖3及圖4中與圖2基材傳送設備200類似的組件，且省略該等組件的描述。
請參考圖3及圖4，根據本發明之另一示範具體實施例的基材傳送設備400包括通風驅動室110、FOUP收容室120、驅動設備室130、及通風管道150。
根據本發明的基材傳送設備400，FOUP收容室120包括門扉122，其通過向下降低及向上升高來打開及關閉FOUP收容室120的一側。基材傳送設備400可進一步包含：門扉收容室121與排出路徑123。
門扉收容室121在FOUP收容室120之該一側下方鄰近驅動設備室130地設置。
排出路徑123在FOUP收容室120之另一側上鄰近驅動設備室130地設置。
在此情形下，基材傳送設備400可進一步包含：連接門扉收容室121與排出路徑123的連接路徑160。通過此連接路徑160，可引導在門扉收容室121內部的空氣至排出路徑123，且可排放通過排出路徑123引進的粒子。
此外，基材傳送設備400可進一步包含：副閥體180與主閥體170。
副閥體180設在連接路徑160中以打開及關閉連接路徑160。主閥體170可排放排出路徑123的氣體到外面。
當設在通風驅動室110內部的主風扇140被驅動時，副閥體180及主閥體170可打開。在此情形下，主閥體170最好稍微打開。
此外，當主風扇140被正常驅動時，關閉且間歇地打開副閥體180及/或主閥體170以排放在基材傳送設備400內部的粒子。此外，當副閥體180及/或主閥體170在主風扇140的正常運作期間被關閉時，只打開門扉收容室121及排出路徑123的一側且關閉門扉收容室121及排出路徑123的另一側，使得空氣沒有向內流動的空間。因此，空氣只在通風驅動室110及FOUP收容室120中循環，如同圖示於圖2的基材傳送設備200。
如上述，根據本發明的基材傳送設備200及400，不需要通風的驅動設備室130不包括在通風空間內使得可減少用於通風的氮氣及關機時間。
此外，相較於先前技術，有可能減少主風扇140的轉速，從而減少耗電量。亦即，為了以一定的強度吹空氣至容納於FOUP收容室120中的FOUP，可相對減少主風扇140的轉速。在習知基材傳送設備100中，由於空氣流通到驅動設備室130，主風扇140的轉速應相對高，但是在本發明的基材傳送設備200及400中，由於空氣只流通達到FOUP收容室120，可相對減少主風扇140的轉速。
熟諳此藝者會明白，本發明可做出各種修改及變體而不脫離本發明的精神或範疇。因此，旨在本發明涵蓋本發明的修改及變體，只要彼等落在隨附專利請求項及其等效陳述的範疇內。
100:習知基材傳送設備 110:通風驅動室 120:FOUP收容室 121:門扉收容室 122:門扉 123:排出路徑 130:驅動設備室 140:主風扇 150:通風管道 160:連接路徑 170:主閥體 180:副閥體 200,400:基材傳送設備 A:第一開口部 B:第二開口部 J:夾具 RP:裝載埠
包括於本文以提供進一步了解本發明且併入本專利說明書而構成彼之一部份的附圖圖示本發明的數個具體實施例，且與說明一起用來解釋本發明的原理。 圖1為習知基材傳送設備的橫截面圖。 圖2根據本發明之一示範具體實施例圖示一基材傳送設備的橫截面圖。 圖3及圖4根據本發明之另一示範具體實施例圖示一基材傳送設備的橫截面圖，圖3的橫截面圖圖示處於門扉關閉的狀態，以及圖4的橫截面圖圖示處於門扉打開的狀態。
110:通風驅動室
120:FOUP收容室
130:驅動設備室
140:主風扇
150:通風管道
200:基材傳送設備
A:第一開口部
B:第二開口部
J:夾具
RP:裝載埠

Claims (6)

  1. 一種基材傳送設備，其包含： 一通風驅動室，其備有用於向下吹送空氣之一主風扇； 一前開式晶圓傳送盒(FOUP)收容室，其設置於該通風驅動室下方且容納用於儲存一基材的一FOUP； 一驅動設備室，其設置於該FOUP收容室下方；以及 一通風管道，其連接該FOUP收容室與該通風驅動室。
  2. 如請求項1之基材傳送設備，其中，該FOUP收容室包含了形成在彼之下半部的一第一開口部， 該通風驅動室包含了形成在彼之上半部的一第二開口部，以及 一通風管道連接該第一開口部與該第二開口部。
  3. 如請求項2之基材傳送設備，其進一步包含： 設在該第一開口部中的一次要風扇。
  4. 如請求項1之基材傳送設備，其中，該FOUP收容室包含一門扉，其通過下降來打開該FOUP收容室的一第一側且通過上升來關閉該FOUP收容室的該一側，且進一步包含： 在該FOUP收容室之該第一側下方鄰近該驅動設備室設置的一門扉收容室；以及 在該FOUP收容室之一第二側上鄰近該驅動設備室設置的一排出路徑。
  5. 如請求項4之基材傳送設備，其進一步包含： 連接該門扉收容室與該排出路徑的一連接路徑。
  6. 如請求項5之基材傳送設備，其進一步包含： 一副閥體，其設在該連接路徑中以打開及關閉該連接路徑；以及 一主閥體，其用於排放在該排出路徑中的氣體到外面。
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