TW202044363A - 被加工物單元 - Google Patents
被加工物單元 Download PDFInfo
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- TW202044363A TW202044363A TW109101142A TW109101142A TW202044363A TW 202044363 A TW202044363 A TW 202044363A TW 109101142 A TW109101142 A TW 109101142A TW 109101142 A TW109101142 A TW 109101142A TW 202044363 A TW202044363 A TW 202044363A
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Abstract
本發明的課題,係提供可從外觀判別是否被施加伴隨外在刺激的加工的被加工物單元。
解決手段是包含被加工物、黏合於被加工物的膠帶、及黏合膠帶的外周緣,於中央具有開口的環狀框,於環狀框的開口,透過膠帶配置晶圓的被加工物單元。於環狀框,黏合有藉由作為外在刺激的紫外線照射而變色之不可逆性的紫外線偵測貼紙。
Description
本發明係關於至少具有被加工物,與黏合於被加工物的膠帶的被加工物單元。
一般公知有包含半導體晶圓等之板狀的被加工物、黏合於被加工物的膠帶、及黏合膠帶的外周緣,於中央具有開口的環狀框的被加工物單元。在此種被加工物單元中,例如使用因為紫外線照射(外在刺激)而黏合力降低的UV膠帶,對於透過該UV膠帶固定於環狀框的被加工物,藉由切削刀施加切割(切削)加工,將被加工物分割成晶片。然後,對被切割加工的被加工物單元照射紫外線之後,將被加工物單元投入至拾取裝置,讓各晶片被拾取(例如參照專利文獻1)。
[先前技術文獻]
[專利文獻]
[專利文獻1] 日本特開2018-074082號公報
[發明所欲解決之課題]
然而,紫外線照射的有無並無法以外觀判斷,故也假設因為作業者的不注意,將紫外線照射前的被加工物單元投入至拾取裝置的事態。在未照射紫外線的狀況中,膠帶的黏著力並未降低,故有晶片不從膠帶剝離導致破損的問題。
因此,本發明的目的係提供可從外觀判別是否被施加伴隨外在刺激的加工的被加工物單元。
[用以解決課題之手段]
依據本發明的一觀點,提供一種被加工物單元,係包含被加工物、黏合於被加工物的膠帶、及黏合該膠帶的外周緣,於中央具有開口的環狀框,於該環狀框的該開口,透過該膠帶配置被加工物的被加工物單元,並且於該膠帶與該環狀框的至少一方,具有因為外在刺激而變色之不可逆性的變色部。
依據該構造,被加工物單元係於膠帶與環狀框的至少一方具有因為外在刺激而變色的變色部,故可容易從外觀判別是否被施加伴隨外在刺激的加工。所以,可防止因為將不是已加工的被加工物投入至下個工程所導致的不妥。
依據本發明的其他觀點,提供一種被加工物單元,包含被加工物,與黏合於被加工物的膠帶;於該膠帶,具有因為外在刺激而變色之不可逆性的變色部。
依據該構造,被加工物單元係於膠帶具有因為外在刺激而變色的變色部,故可容易從外觀判別是否被施加伴隨外在刺激的加工。所以,可防止因為將不是已加工的被加工物投入至下個工程所導致的不妥。
於該構造中,作為該膠帶整體會因為外在刺激而變色的構造亦可。
又,該膠帶係由基材與糊層所成;該糊層係藉由紫外線的照射而硬化;該外在刺激係該紫外線亦可。
或者,該外在刺激係溫度變化亦可。
又,該外在刺激係溫度變化;該變色部係因為第1溫度而變色成第1顏色,因為與該第1溫度不同的第2溫度,變色成與該第1顏色不同的第2顏色亦可。
[發明的效果]
本發明相關的被加工物單元係於膠帶與環狀框的至少一方具有因為外在刺激而變色的變色部,故可容易從外觀判別是否被施加伴隨外在刺激的加工。
以下,針對本發明的實施形態,一邊參照圖面一邊詳細進行說明。並不是根據以下的實施形態所記載之內容而限定本發明者。又,於以下所記載之構成要素,包含該發明所屬技術領域中具有通常知識者可易於思及者、實質上相同者。進而,以下所記載的構造可適當組合。又,在不脫離本發明之要旨的範圍內,可進行構造的各種省略、置換或變更。
[第1實施形態]
圖1係揭示第1實施形態的被加工物單元之構造例的立體圖。圖2係被加工物單元的部分剖面圖。被加工物單元1係如圖1所示,具備作為被加工物的晶圓2、黏合於晶圓2的膠帶6、及黏合膠帶6的外周緣,於中央具有開口7A的環狀框7。晶圓2係以矽作為母材之圓板狀的半導體晶圓、以藍寶石、SiC(碳化矽)等作為母材的光學裝置晶圓。晶圓2係於藉由形成於表面2A之格子狀的預定分割線(預定切削線)3所區劃的複數區域,形成裝置4。在本實施形態中,作為被加工物已例示圓板狀的晶圓,但不僅晶圓,使用形成為矩形板狀的封裝基板、陶瓷基板、玻璃基板等亦可。
膠帶6係如圖2所示,具有以合成樹脂所構成的基材6A,與層積於基材6A的黏著層(糊層)6B之例如切割膠帶。在本實施形態中,黏著層6B係例如使用藉由照射所定波長(300~400nm)的紫外線而硬化,黏著力降低的黏著材料。該膠帶6係將黏著層6B作為上面,黏合於晶圓2的背面2B。
環狀框7係具備比晶圓2還大直徑的開口7A,於該開口7A內晶圓2隔著膠帶6被保持。於晶圓2的外周緣與環狀框7的內周緣,膠帶6的黏著層6B形成露出成環狀的環狀區域8。又,於環狀框7的背面7B的一部分,黏合有紫外線偵測貼紙(變色部)10。該紫外線偵測貼紙10係藉由前述之使膠帶6的黏著層6B硬化的所定波長(300~400nm)的紫外線的照射,不可逆地變色。紫外線偵測貼紙10係例如層積黏著層10A與基材層10B與變色層10C所形成,黏著層10A黏合於環狀框7的背面7B。變色層10C係例如包含藉由紫外線從無色變色成有色之紫外線油墨所形成。又,將紫外線油墨塗布於基材層10B來形成亦可。又,紫外線油墨的變色為不可逆,一旦變色的顏色不會回到原來的樣子。因此,作業員可藉由觀察紫外線偵測貼紙10的變色之有無,從外觀判別被加工物單元1是否被照射紫外線。再者,在本實施形態中,已作為藉由紫外線從無色變色成有色的構造,但是,預先知道變色後的色彩的話,從有色變成不同的顏色亦可。又,並不限於紫外線偵測貼紙10,作為於環狀框7的背面7B的一部分或全部,塗布紫外線油墨的構造亦可。此時,紫外線油墨係可藉由使用溶劑等,容易從環狀框7去除者為佳。
接著,說明紫外線偵測貼紙10黏合於環狀框7之被加工物單元1的加工步驟。圖3係揭示切削被加工物單元的被加工物之工程的立體圖。圖4係揭示對被加工物單元照射紫外線之工程的立體圖,圖5係揭示照射紫外線後的被加工物單元的立體圖。被加工物單元1係如圖3所示,使用切削單元20的切削刀21進行切削(加工)。切削單元20係具備切削刀21、主軸22、殼體23。
切削刀21係具備切削晶圓2之圓環狀的刀刃21A。刀刃21A係例如由鑽石或CBN(Cubic Boron Nitride)等的磨粒,與包含金屬或樹脂等的接合材(結合材)所成,形成為所定厚度。主軸22係利用旋轉切削刀21,來切削晶圓2。主軸22的旋轉軸心22A係延伸於與所定Y方向平行的方向。於主軸22的前端,安裝有固定螺帽24,與輪座凸緣(未圖示)一起挾持切削刀21。殼體23係收容主軸22與旋轉該主軸22的馬達(未圖示)。又,殼體23係連結於將切削單元20分別移動於主軸22的旋轉軸心22A所延伸之方向(Y方向),與和該旋轉軸心22A所延伸之方向正交的垂直方向(Z方向)的移動單元(未圖示)。
被加工物單元1係被吸盤台(未圖示)保持。該吸盤台係構成為可移動於分別與前述之主軸22的旋轉軸心22A及垂直方向正交的加工進送方向(X方向)。又,吸盤台係構成為可繞與垂直方向平行的軸心旋轉。在本實施形態中,作為保持被加工物單元1的吸盤台移動於X方向的構造,但是,只要對於被加工物單元1,切削單元20往X方向相對移動的話,作為切削單元20移動於X方向的構造亦可。
在對被加工物單元1的晶圓2進行切削加工時,藉由在使切削單元20的切削刀21旋轉之狀態下,將吸盤台往X1方向進行加工進送,沿著預定分割線3切削晶圓2,以形成切削溝(所謂全切溝)5。然後,如圖4所示,沿著所有預定分割線3,形成切削溝5,進行對裝置晶片11的分割的話,則結束切削加工。
接著,使膠帶6的黏著層6B硬化,降低該黏著層6B的黏著力。本實施形態中所用的黏著層6B係具有藉由紫外線照射而硬化的特質,故如圖4所示,於被加工物單元1的下方,配置紫外線照射燈25,從該紫外線照射燈25朝向被加工物單元1照射紫外線26。藉此,膠帶6的黏著層6B係硬化,對於裝置晶片11的黏著力降低。
進而,在本實施形態中,環狀框7的背面7B的一部分所黏合之紫外線偵測貼紙10,係如圖5所示,具有藉由紫外線照射(外在刺激)而變色的特質。因此,作業員可藉由觀察紫外線偵測貼紙10的變色之有無,從外觀判別被加工物單元1是否被照射紫外線。所以,紫外線偵測貼紙10變色的話,可判別為紫外線照射(伴隨外在刺激的加工)至被加工物單元1,膠帶6的黏著層6B的黏著力降低,故將被加工物單元1投入至拾取裝置(未圖示),藉由該拾取裝置,可從膠帶6容易卸下由晶圓2分割的裝置晶片11。
另一方面,紫外線偵測貼紙10未變色的話,可判別為紫外線並未充分照射(伴隨外在刺激的加工)至被加工物單元1,膠帶6的黏著層6B的黏著力並未降低。因此,可防止誤將被加工物單元1投入至拾取裝置(未圖示)的狀況,可預防裝置晶片11未從膠帶6剝離導致破損的狀況。
接著,針對第1實施形態的變形例進行說明。在第1實施形態中,作為將作為藉由紫外線的照射(外在刺激)而不可逆地變色之變色部的紫外線偵測貼紙10,黏合於環狀框7的構造,但是,也可將前述變色部設置於膠帶6。具體來說,藉由使藉由紫外線的照射(外在刺激)而不可逆地變色之紫外線油墨(或顏料),混合存在於膠帶6的黏著層6B,將該黏著層6B構成為變色部。又,將包含前述紫外線油墨的變色層(變色部)設置於基材6A與黏著層6B之間亦可。進而,使基材6A包含紫外線油墨(顏料)來構成變色部亦可。依據該變形例,藉由紫外線的照射(外在刺激),膠帶6的主要部分,環狀區域8會變色,故作業員可藉由觀察膠帶6的變色之有無,容易從外觀判別被加工物單元1是否被照射紫外線。
又,在第1實施形態中,被加工物單元1係作為具備晶圓2與膠帶6與環狀框7的構造,但是,如圖6所示,作為不具備環狀框,具備晶圓2與膠帶16的被加工物單元1A亦可。膠帶16係形成為與晶圓2同等的大小,黏合於晶圓2的背面2B。膠帶16係具有前述之基材6A及黏著層6B,與層積配置於基材6A的下面側的變色層(變色部)16C。該變色層16C包含前述紫外線油墨。在該變形例中,膠帶16係形成為與晶圓2同等的大小,故黏著層6B側不會露出。因此,藉由於基材6A的下面側設置變色層16C,藉由紫外線的照射(外在刺激),膠帶16的下面側會變色,故作業員可藉由觀察膠帶6的變色之有無,容易從外觀判別被加工物單元1A是否被照射紫外線。
[第2實施形態]
在第1實施形態中,作為外在刺激已例示紫外線的照射,但是,在此第2實施形態中,說明具備因溫度變化,也就是說被加工物單元1在所定溫度以上的加熱環境下不可逆地變色的變色部的構造。圖7係第2實施形態相關之被加工物單元的部分剖面圖。針對與前述之第1實施形態同等的構造,附加相同符號而省略說明。
第2實施形態相關的被加工物單元101,係具備黏合於晶圓2,將該晶圓2支持於環狀框7的膠帶106,該膠帶106係具有以合成樹脂構成的基材6A、層積配置於基材6A的上面側之透明的黏著層(糊層)6B、配置於基材6A與黏著層(糊層)6B之間的變色層(變色部)106C。變色層106C係例如包含藉由加熱至所定溫度(例如35℃)以上時的溫度變化(外在刺激),從無色變色成有色的示溫油墨所形成。又,示溫油墨的變色為不可逆,一旦變色的顏色不會回到原來的樣子。因此,作業員可藉由觀察膠帶106的變色層106C的變色之有無,在所定溫度以上的環境下,從外觀容易判別是否執行了對於被加工物單元101的加工(例如電漿蝕刻加工)。再者,在本實施形態中,已作為藉由所定溫度以上的溫度變化,從無色變色成有色的構造,但是,預先知道變色後的色彩的話,從有色變成不同的顏色亦可。又,藉由使前述之示溫油墨(或顏料),混合存在於膠帶6的黏著層6B,將該黏著層6B構成為變色部亦可,使基材6A包含該示溫油墨(或顏料)構成變色部亦可。又,變色層106C的位置並不限於黏著層6B與基材6A之間,設置於基材6A的下面側亦可。此時,可從被加工物單元101的下方觀察變色層106C的變色之有無。
接著,說明透過設置變色層106C的膠帶106,晶圓2被環狀框7支持之被加工物單元101的加工步驟。在本實施形態中,藉由電漿蝕刻(也稱為電漿切割)加工將晶圓2分割成裝置晶片。圖8係揭示於被加工物單元的晶圓表面形成樹脂膜之工程的圖。圖9係揭示沿著被加工物單元之晶圓的預定分割線去除樹脂膜之工程的圖。圖10係揭示進行對於被加工物單元的晶圓之電漿蝕刻的工程的圖。圖11係揭示電漿蝕刻加工後之被加工物單元的立體圖。
首先,藉由圖8所示的樹脂膜被覆裝置40,例如於晶圓2的表面2A整面,被覆樹脂膜(遮蔽膜)。樹脂膜被覆裝置40係例如旋轉塗佈機(旋轉式塗布裝置),具備可保持被加工物單元101,可繞垂直(Z方向)的軸心旋轉的吸盤台41、被吸盤台41保持的被加工物單元101之晶圓2的表面2A供給液狀樹脂44的噴嘴42、及配置於吸盤台41的周圍,防止液狀樹脂的飛散的殼體43。吸盤台41係構成為可吸引且保持晶圓2,並且具備挾持環狀框7的箝夾41A。液狀樹脂44係水溶性樹脂,藉由乾燥硬化的話則變成具有電漿耐性的樹脂膜。
於吸盤台41,在以晶圓2的表面2A側成為上面之方式被保持被加工物單元101的狀態下,對晶圓2的表面2A的中心部,從噴嘴42滴下所定量之液狀樹脂44。然後,藉由以所定速度旋轉吸盤台41,所滴下的液狀樹脂會因為離心力,從晶圓2的表面2A的中心側流向外周側,於晶圓2的表面2A整面形成幾乎一樣厚度的樹脂膜45(圖9)。
接下來,藉由圖9所示的雷射加工裝置50,沿著晶圓2的預定分割線3去除樹脂膜45。雷射加工裝置50係具備將雷射光線51A朝向晶圓2照射的照射頭51,與和該照射頭51橫向並排於X方向配置的攝像部52。照射頭51係具備對藉由振盪器(未圖示)振盪之雷射光線進行聚光的聚光器(未圖示),將朝向晶圓2照射之雷射光線51A的聚光位置(對焦位置)調整於Z方向(垂直方向)。在本實施形態中,照射頭51係照射可進行去除樹脂膜45之剝蝕加工的波長的雷射光線51A。攝像部52係將對於照射頭51之晶圓2的配置狀況及晶圓2的加工狀況等進行攝像的相機。
被加工物單元101係被吸盤台(未圖示)保持。該吸盤台係構成為可移動於前述之X方向。又,吸盤台係構成為可繞與垂直方向平行的軸心旋轉。在本實施形態中,作為保持被加工物單元101的吸盤台移動於X方向的構造,但是,只要對於被加工物單元101,雷射加工裝置50往X方向相對移動的話,作為雷射加工裝置50移動於X方向的構造亦可。
雷射加工裝置50係藉由攝像部52對晶圓2的表面2A進行攝像,導出預定分割線3的位置之後,一邊將吸盤台往X1方向加工進送,一邊沿著晶圓2的預定分割線3照射雷射光線51A。藉此,藉由沿著預定分割線3進行剝蝕加工,形成加工溝46,藉由該加工溝46沿著預定分割線3去除樹脂膜45。
接下來,使用圖10所示之電漿蝕刻裝置60,對晶圓2的表面2A施加電漿蝕刻加工,形成沿著預定分割線3之到達晶圓2的完工厚度的蝕刻加工溝。電漿蝕刻裝置60係具備保持被加工物單元101的靜電吸盤(ESC)61、噴出氣體的氣體噴出頭62、及於內部收容靜電吸盤61及氣體噴出頭62的處理室63。
靜電吸盤61係例如以氧化鋁等的陶瓷或氧化鈦等的介電體形成。於靜電吸盤61的內部,配設有以藉由施加電壓而產生電荷的金屬板等所構成的電極61A,該電極61A係連接於整合器64A及偏壓高頻電源65A。利用偏壓高頻電源65A對電極61A施加直流電壓,使靜電吸盤61的保持面與被加工物單元101之間產生電荷的分極所致之靜電吸附力,以保持被加工物單元101。
氣體噴出頭62係透過軸承66可自由升降地配設於處理室63的上部。於氣體噴出頭62的內部,設置有氣體擴散空間62A,於氣體擴散空間62A的上部,連通氣體導入口67,於氣體導入口67,透過氣體配管連接於氣體供給部68。氣體供給部68係例如分別蓄存蝕刻氣體與稀有氣體。又,於氣體擴散空間62A的下部,連通朝向靜電吸盤61開口的複數氣體吐出口62B。於氣體噴出頭62,透過整合器64B連接高頻電源65B。藉由從高頻電源65B透過整合器64B對氣體噴出頭62供給高頻電力,將從氣體吐出口62B吐出的氣體電漿化。
於處理室63的下部,連接排氣管69,於該排氣管69,連接排氣裝置70。藉由使該排氣裝置70動作,可將處理室63的內部減壓至所定真空度為止。又,於處理室63的內部,在靜電吸盤61與氣體噴出頭62之間配置框架加熱防止導件71。該框架加熱防止導件71係配置於被加工物單元101的環狀框7之上方的環狀構件,於中央部形成比晶圓2還大的開口71A。又,電漿蝕刻裝置60係具備未圖示的控制部,控制各氣體的吐出量及時間、高頻電力等的條件。
實施電漿蝕刻時,將晶圓2的表面2A側朝上,被加工物單元101載置於靜電吸盤61上。然後,從高頻電源65B對氣體噴出頭62施加高頻電力,並且對電極61A從偏壓高頻電源65A施加直流電壓,使靜電吸盤61的保持面與被加工物單元101之間產生介電極化現象。藉此,在靜電吸盤61的保持面與被加工物單元101之間產生靜電吸附力,故以被加工物單元101在靜電吸盤61上被吸附保持。
又,藉由驅動排氣裝置70對處理室63內進行排氣,將處理室63內減壓至所定壓力為止之後,將處理室63設為密閉空間。然後,將蓄存於氣體供給部68的蝕刻氣體,透過氣體配管及氣體導入口67,導引至氣體擴散空間62A內,從氣體吐出口62B朝晶圓2噴出。在從高頻電源65B對氣體噴出頭62施加高頻電力的狀態下,將蝕刻氣體導入至處理室63內,藉此使氣體噴出頭62與靜電吸盤61之間產生高頻電場,使蝕刻氣體電漿化。
在本實施形態中,使用藉由作為蝕刻氣體,交互噴出例如SF6
氣體與C4
F8
氣體,對晶圓2進行電漿蝕刻的所謂波希法。在該波希法中,首先對於晶圓2供給電漿化之SF6
氣體。該SF6
氣體係對藉由圖10所示之加工溝46去除了樹脂膜45的預定分割線3上,朝晶圓2的厚度方向進行蝕刻,以形成蝕刻加工溝。此時,被樹脂膜45被覆的區域不會被蝕刻。接著,對於晶圓2供給電漿化之C4
F8
氣體來代替SF6
氣體。該C4
F8
氣體係於蝕刻加工溝的內側面及底部堆積被膜。再次供給電漿化之SF6
氣體的話,SF6
氣體會去除蝕刻加工溝之底部的被膜,使蝕刻加工溝往晶圓2的厚度方向行進。如此,藉由電漿蝕刻,形成沿著預定分割線3之到達晶圓2的完工厚度的蝕刻加工溝。
然而,藉由電漿蝕刻所形成的蝕刻加工溝47(圖11)係形成為溝寬為10~20μm程度的細溝。進而,電漿蝕刻加工結束時,被加工物單元101通常自動被收容於晶匣(未圖示)。因此,有作業者難以藉由目視從外觀判別是否施加了電漿蝕刻加工的情況。
另一方面,判明電漿蝕刻加工時,晶圓2係被加熱至比常溫還高的溫度(例如40℃程度)。因此,在本實施形態中,被加工物單元101的膠帶106係具備包含因為溫度變化(外在刺激)而變色之示溫油墨的變色層106C,該變色層106C係如圖11所示,包含被加熱至電漿蝕刻時的所定溫度(例如35℃)以上時不可逆地變色的示溫油墨所形成。因此,作業員可藉由觀察膠帶106的變色之有無,從外觀容易判別被加工物單元101是否被配置於加熱環境下,亦即是否被施加了電漿蝕刻加工。又,在本實施形態中,膠帶106之主要部分的環狀區域8會變色,故作業員即使在被加工物單元101收容於晶匣(未圖示)的狀況中,也可從外觀容易判別是否被施加了電漿蝕刻加工。又,在本實施形態中,只要至少膠帶106的環狀區域8變色的話,即可判別為已對被加工物單元101施加伴隨溫度變化(外在刺激)的電漿蝕刻加工,故以水沖洗被覆表面2A的樹脂膜45之後,例如可將被加工物單元101轉移至下個工程(背面磨削工程)。
另一方面,膠帶106的環狀區域8未變色的話,可判別為未對被加工物單元101施加電漿蝕刻加工。因此,可防止誤將被加工物單元101轉移至下個工程的狀況。
接著,針對第2實施形態的變形例進行說明。在前述的第2實施形態中,被加工物單元101係作為具備晶圓2與膠帶6與環狀框7的構造,但是,如圖12所示,作為不具備環狀框,具備晶圓2與膠帶116的被加工物單元101A亦可。膠帶116係形成為與晶圓2同等的大小,黏合於晶圓2的背面2B。膠帶116係具有前述之基材6A及黏著層6B,與層積配置於基材6A的下面側的變色層(變色部)116C。該變色層116C包含前述示溫油墨。在該變形例中,膠帶116係形成為與晶圓2同等的大小,故黏著層6B側不會露出。因此,藉由於基材6A的下面側設置變色層116C,藉由溫度變化(外在刺激),膠帶116的下面側會變色,故作業員可藉由觀察膠帶6的變色之有無,容易從外觀判別是否對被加工物單元101A施加了伴隨溫度變化的電漿蝕刻加工。
[第3實施形態]
圖14係第3實施形態相關之被加工物單元的部分剖面圖。針對與前述之第1實施形態同等的構造,附加相同符號而省略說明。第3實施形態相關的被加工物單元201,係如圖14所示,作為具備黏合於晶圓2,將該晶圓2支持於環狀框7的膠帶206,在該膠帶206與晶圓2之間具備晶圓黏結薄膜(以下稱為DAF)9的構造。DAF9係晶粒接合用之薄膜狀的黏著性構件,層積於膠帶206的黏著層6B上。
在本實施形態中,被加工物單元201係藉由將附DAF9的膠帶206黏合於晶圓2及環狀框7的背面所形成。在此,為了強固地黏合DAF9與晶圓2,在將被加工物單元201加熱的狀態下執行附DAF9的膠帶206的黏合。另一方面,被加工物單元201(晶圓2)的加熱不充分時有發生黏合不良之虞。但是,有作業者難以從外觀判別是否正常地黏合附DAF9的膠帶206的情況。因此,本實施形態的被加工物單元201係可從外觀判別附DAF9的膠帶206的黏合狀態者。
被加工物單元201的膠帶206係具有以合成樹脂構成的基材6A、層積配置於基材6A的上面側之透明的黏著層(糊層)6B、配置於基材6A的下面側的變色層(變色部)206C。在本實施形態中,變色層206C係例如包含到達所定第1溫度(例如50℃)的話由無色變色成第1顏色的第1示溫油墨,與到達比該第1溫度還高(不同)之所定第2溫度(例如70℃)的話從無色變色成與第1顏色不同的第2顏色的第2示溫油墨所形成。第1示溫油墨與第2示溫油墨分別分散於變色層206C的整面。第1示溫油墨及第2示溫油墨的變色分別為不可逆,一旦變色的顏色不會回到原來的樣子。依據該構造,作業員可藉由觀察變色層206C是否變色成第1顏色或第2顏色(也包含與第1顏色混合的顏色),從外觀容易判別被加工物單元201的加熱加工之有無,及大概的加熱溫度。再者,在本實施形態中,已作為藉由所定溫度以上的溫度變化,從無色變色成有色的構造,但是,預先知道變色後的色彩的話,從有色變成不同的顏色亦可。
接著,說明將附DAF9的膠帶206黏合於晶圓2及環狀框7的加工步驟。圖14係揭示將膠帶黏合於晶圓及環狀框之工程的圖。圖15係揭示膠帶被正常黏合的被加工物單元的仰視圖。圖16係揭示膠帶未正常黏合的被加工物單元的仰視圖。
藉由圖14所示的膠帶黏合裝置80,進行對於晶圓2及環狀框7之附DAF9的膠帶206的黏合。膠帶黏合裝置80係具備加熱台81與黏合滾筒82所構成。
加熱台81係層積保持部83與加熱部84所形成。保持部83係以金屬等之具有優良熱傳導性的材料形成,具有保持晶圓2的保持面83A。於晶圓2的表面2A黏合保護膠帶12,隔著該保護膠帶12,晶圓2被載置於保持面83A。複數吸引孔85開口於該保持面83A。該等吸引孔85係分別連通於形成於保持部83內的連通路徑86,該連通路徑86係透過吸引路徑87及電磁開閉閥88連接於吸引源89。
加熱部84係於與保持部83的下面83B接觸之上面84A具備凹部90,於該凹部90內,層積配置隔熱材91與加熱器92與鋁板93。鋁板93係將加熱器92的熱傳導至保持部83的熱傳導構件,配置於與上面84A同面,與保持部83的下面83B接觸。加熱器92係例如電熱器,藉由對加熱器92通電,將電能轉換成熱能。在本實施形態中,例如具備檢測出保持部83之溫度感的溫度感測器(未圖示),以該溫度感測器的檢測溫度成為所定溫度之方式,控制供給至加熱器92的電流值。
黏合滾筒82係藉由往所定方向(α方向)轉動於加熱台81上,於被保持於加熱部84上之晶圓2的背面2B及環狀框7的背面7C黏合附DAF9的膠帶206。再者,膠帶黏合裝置80係具備切割機構(未圖示),膠帶206被黏合之後,藉由該切割機構,將該膠帶206切斷成所定大小的圓形。
黏合膠帶206時,於加熱台81上隔著保護膠帶12載置晶圓2,並且於該晶圓2的周圍載置環狀框7。在該狀態下,膠帶黏合裝置80係藉由使吸引源89動作,透過各吸引孔85吸引保持晶圓2。又,膠帶黏合裝置80係藉由對加熱部84的加熱器92通電,隔著鋁板93對保持部83進行加熱。該熱會透過保護膠帶12傳達至晶圓2,故晶圓2也被加熱。
接著,於晶圓2的背面2B側配置附DAF9的膠帶206,黏合滾筒82往所定方向(α方向)轉動於該膠帶206上。藉此,於被加熱台81保持之晶圓2的背面2B及環狀框7的背面7C,黏合附DAF9的膠帶206。
在本實施形態中,被加工物單元201的膠帶206係包含因為溫度變化(外在刺激)到達所定第1溫度的話會變色成第1顏色的第1示溫油墨,與到達比第1溫度還高之所定第2溫度的話會變色成第2顏色的第2示溫油墨所形成。在此,經驗法則上判明晶圓2與附DAF9的膠帶206成為所定黏合溫度(例如60℃)的話則黏密接力會提升,而強固地黏合。因此,第2溫度(例如70℃)係設定為比該黏合溫度還高的溫度,第1溫度(例如50℃)係設定為比黏合溫度還低的溫度。
因此,作業員可藉由觀察膠帶206的變色之有無,及變色之區域的大小,從外觀容易判別附DAF9的膠帶206是否在加熱環境下被黏合,亦即晶圓2與附DAF9的膠帶206是否強固地黏合。具體來說,如圖15所示,變色成第2顏色之區域210的外緣210A及變色成第1顏色之區域211的外緣211A都到達比DAF9更靠外側的話,作業員可判別至少DAF9被加熱至第2溫度以上,晶圓2與附DAF9的膠帶206被強固地黏合。
另一方面,如圖16所示,變色成第1顏色的區域211存在於DAF9的內側時,作業員可判斷因為DAF9整體未被加熱成第2溫度以上,有加熱不充分導致發生黏合不良之虞。因此,加熱不充分時可藉由再次加熱晶圓2,來消除黏合不良。
接著,針對第3實施形態的變形例進行說明。在前述的第3實施形態中,被加工物單元201係作為具備晶圓2與膠帶6與環狀框7的構造,但是,如圖17所示,作為不具備環狀框,具備晶圓2與附DAF9的膠帶216的被加工物單元201A亦可。附DAF9的膠帶216係形成為與晶圓2同等的大小,黏合於晶圓2的背面2B。膠帶216係具有前述之基材6A及黏著層6B,與層積配置於基材6A的下面側的變色層(變色部)216C。該變色層216C包含前述之第1示溫油墨與第2示溫油墨。依據該變形例,作業員可藉由觀察變色層216C是否變色成第1顏色或第2顏色(也包含與第1顏色混合的顏色),從外觀容易判別被加工物單元201A的加工之有無,及大概的加熱溫度。
以上,依據本發明的實施形態,於膠帶6、106、206與環狀框7的至少一方,設置作為因為外在刺激即紫外線照射或溫度變化而變色之不可逆性的變色部的紫外線偵測貼紙10或變色層106C、206C,故可容易從外觀判別是否被施加伴隨外在刺激的加工。
又,依據前述實施形態的變形例,於膠帶16、116、216,設置作為因為外在刺激即紫外線照射或溫度變化而變色之不可逆性的變色部的變色層16C、116C、216C,故可容易從外觀判別是否被施加伴隨外在刺激的加工。
再者,本發明並不是限定於前述實施形態者。亦即,在不脫離本發明的要點的範圍中可進行各種變形來實施。例如,在前述的第1實施形態中,已說明於環狀框7的背面7B黏合因為紫外線照射而變色之不可逆性的紫外線偵測貼紙10的構造,但是,也可於環狀框7的表面或背面7B黏合因為溫度變化而變色之示溫膠帶(未圖示),來判別對被加工物單元之加熱加工的有無。該示溫膠帶設為包含前述之示溫油墨、第1示溫油墨及第2示溫油墨者。又,並不限於示溫膠帶,作為於環狀框7的表面或背面7B的一部分或全部,塗布前述之示溫油墨(包含第1示溫油墨及第2示溫油墨)的構造亦可。
又,在第2實施形態中,作為晶圓加工之一例,已說明電漿蝕刻加工,但是並不是限定於此者,例如沿著晶圓2的預定分割線,照射雷射光線來實施剝蝕加工或改質層形成加工亦可。於該等雷射加工時,膠帶也互溫度變化(加熱),故可容易從外觀判別是否被施加了雷射加工(伴隨外在刺激的加工)。
又,在前述的第1~3實施形態中,已針對作為膠帶使用切割膠帶的構造進行說明,但並不限定於此,使用BG膠帶(黏合於晶圓2的表面,保護裝置的膠帶)亦可。該BG膠帶係剝離時以加熱器台隔著晶圓被加熱至60℃程度,使該BG膠帶軟化後進行剝離。
1,101,201:被加工物單元
2:晶圓(被加工物)
2A:表面
2B:背面
6,16,106,116,206,216:膠帶
6A:基材
6B:黏著層
7:環狀框
7A:開口
7B:背面
8:環狀區域
9:DAF
10:紫外線偵測貼紙(變色部)
20:切削單元
21:切削刀
25:紫外線照射燈
26:紫外線
40:樹脂膜被覆裝置
41:吸盤台
44:液狀樹脂
45:樹脂膜
46:加工溝
47:蝕刻加工溝
50:雷射加工裝置
51:照射頭
51A:雷射光線
60:電漿蝕刻裝置
61:靜電吸盤
62:氣體噴出頭
80:膠帶黏合裝置
81:加熱台
82:黏合滾筒
92:加熱器
106C,116C,206C,216C:變色層(變色部)
[圖1] 圖1係揭示第1實施形態的被加工物單元之構造例的立體圖。
[圖2] 圖2係被加工物單元的部分剖面圖。
[圖3] 圖3係揭示切削被加工物單元的被加工物之工程的立體圖。
[圖4] 圖4係揭示對被加工物單元照射紫外線之工程的立體圖。
[圖5] 圖5係揭示照射紫外線後之被加工物單元的立體圖。
[圖6] 圖6係第1實施形態的變形例相關之被加工物單元的部分剖面圖。
[圖7] 圖7係第2實施形態相關之被加工物單元的部分剖面圖。
[圖8] 圖8係揭示於被加工物單元的晶圓表面形成樹脂膜之工程的剖面圖。
[圖9] 圖9係揭示沿著被加工物單元之晶圓的預定分割線去除樹脂膜之工程的立體圖。
[圖10] 圖10係揭示進行對於被加工物單元的晶圓之電漿蝕刻的工程的剖面圖。
[圖11] 圖11係揭示電漿蝕刻加工後之被加工物單元的立體圖。
[圖12] 圖12係第2實施形態的變形例相關之被加工物單元的部分剖面圖。
[圖13] 圖13係第3實施形態相關之被加工物單元的部分剖面圖。
[圖14] 圖14係揭示將膠帶黏合於晶圓及環狀框之工程的剖面圖。
[圖15] 圖15係揭示膠帶被正常黏合的被加工物單元的仰視圖。
[圖16] 圖16係揭示膠帶未正常黏合的被加工物單元的仰視圖。
[圖17] 圖17係第3實施形態的變形例相關之被加工物單元的部分剖面圖。
1:被加工物單元
2:晶圓(被加工物)
2A:表面
2B:背面
3:預定分割線
4:裝置
6:膠帶
7:環狀框
7A:開口
7B:背面
8:環狀線材
10:紫外線偵測貼紙(變色部)
Claims (6)
- 一種被加工物單元,係包含被加工物、黏合於被加工物的膠帶、及黏合該膠帶的外周緣,於中央具有開口的環狀框,於該環狀框的該開口,透過該膠帶配置被加工物的被加工物單元,其特徵為: 於該膠帶與該環狀框的至少一方,具有因為外在刺激而變色之不可逆性的變色部。
- 一種被加工物單元,其特徵為: 包含被加工物,與黏合於被加工物的膠帶; 於該膠帶,具有因為外在刺激而變色之不可逆性的變色部。
- 如申請專利範圍第1項或第2項所記載之被加工物單元,其中, 該膠帶整體會因為外在刺激而變色。
- 如申請專利範圍第1項至第3項中任一項所記載之被加工物單元,其中, 該膠帶係由基材與糊層所成;該糊層係藉由紫外線的照射而硬化; 該外在刺激,係該紫外線。
- 如申請專利範圍第1項至第3項中任一項所記載之被加工物單元,其中, 該外在刺激,係溫度變化。
- 如申請專利範圍第1項至第3項中任一項所記載之被加工物單元,其中, 該外在刺激,係溫度變化; 該變色部,係因為第1溫度而變色成第1顏色,因為與該第1溫度不同的第2溫度,變色成與該第1顏色不同的第2顏色。
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