TW202036670A - Cleaning head, center brush, outer periphery brush, substrate cleaning apparatus and substrate cleaning method - Google Patents

Cleaning head, center brush, outer periphery brush, substrate cleaning apparatus and substrate cleaning method Download PDF

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Publication number
TW202036670A
TW202036670A TW108146855A TW108146855A TW202036670A TW 202036670 A TW202036670 A TW 202036670A TW 108146855 A TW108146855 A TW 108146855A TW 108146855 A TW108146855 A TW 108146855A TW 202036670 A TW202036670 A TW 202036670A
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Taiwan
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cleaning
substrate
brush
head
washing
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TW108146855A
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Chinese (zh)
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甲盛諄
西山耕二
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日商斯庫林集團股份有限公司
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Priority to JP2019053365A priority Critical patent/JP2020155617A/en
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Publication of TW202036670A publication Critical patent/TW202036670A/en

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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304Mechanical treatment, e.g. grinding, polishing, cutting

Abstract

This cleaning head comprises a center brush and an outer peripheral brush. The center brush includes a base and a cleaning part attached to the base. The outer peripheral brush includes a base and a cleaning part attached to the base, and is arranged so as to surround the center brush. The center brush and the outer peripheral brush are configured so as to be mutually attachable/detachable.

Description

洗淨頭、中心刷、外周刷、基板洗淨裝置及基板洗淨方法Cleaning head, center brush, outer peripheral brush, substrate cleaning device and substrate cleaning method
本發明係關於一種將基板洗淨之洗淨頭、中心刷、外周刷、基板洗淨裝置及基板洗淨方法。The invention relates to a cleaning head, a center brush, a peripheral brush, a substrate cleaning device and a substrate cleaning method for cleaning a substrate.
在半導體器件等之製造之微影術工序中,藉由對基板上供給抗蝕劑液而形成抗蝕劑膜。藉由在將抗蝕劑膜曝光後顯影,而在抗蝕劑膜形成特定之圖案。對將抗蝕劑膜曝光前之基板,利用基板洗淨裝置進行洗淨處理。In the lithography process in the manufacture of semiconductor devices and the like, a resist film is formed by supplying a resist solution on the substrate. By developing the resist film after exposure, a specific pattern is formed on the resist film. The substrate before exposure of the resist film is cleaned using a substrate cleaning device.
例如,專利文獻1所記載之基板洗淨裝置具有由中央部、圓環部及台座構成之洗淨頭。中央部具有圓柱狀之外觀形狀,安裝於台座之中央。圓環部具有圓環狀之外觀形狀,以包圍中央部之方式安裝於台座。中央部及圓環部分別用於基板之背面及斜面部之洗淨。For example, the substrate cleaning device described in Patent Document 1 has a cleaning head composed of a central part, an annular part, and a base. The central part has a cylindrical appearance and is installed in the center of the pedestal. The ring part has an annular appearance shape, and is installed on the pedestal in a way that surrounds the central part. The central part and the ring part are used to clean the back and inclined parts of the substrate respectively.
[專利文獻1]日本特開2012-23209號公報[Patent Document 1] JP 2012-23209 A
[發明所欲解決之問題] 為了適切地將基板洗淨,而必須利用與該基板之形狀或洗淨之種類對應之適切之洗淨頭。然而,若與該基板之形狀或洗淨之種類對應地準備複數個洗淨頭,則洗淨處理之成本增加。又,洗淨頭係消耗品,在消耗時更換為新品。然而,若頻繁地更換洗淨頭,則洗淨處理之成本增加。[The problem to be solved by the invention] In order to clean the substrate appropriately, it is necessary to use an appropriate cleaning head corresponding to the shape of the substrate or the type of cleaning. However, if a plurality of cleaning heads are prepared corresponding to the shape of the substrate or the type of cleaning, the cost of the cleaning process increases. In addition, the washing head is a consumable item, which is replaced with a new one when consumed. However, if the washing head is frequently replaced, the cost of washing treatment increases.
本發明之目的在於提供一種可抑制成本之增加且進行基板之適切之洗淨之洗淨頭、中心刷、外周刷、基板洗淨裝置及基板洗淨方法。The object of the present invention is to provide a cleaning head, a center brush, a peripheral brush, a substrate cleaning device and a substrate cleaning method that can suppress the increase in cost and perform proper cleaning of the substrate.
[解决问题之技术手段] (1)本發明之一態樣之洗淨頭係用於基板之洗淨者,且具備:中心刷,其包含第1基台、及安裝於第1基台之第1洗淨部;及外周刷,其包含第2基台、及安裝於第2基台之第2洗淨部,且配置為包圍中心刷;並且中心刷與外周刷為可相互拆裝地構成。[Technical means to solve the problem] (1) The cleaning head of one aspect of the present invention is used for cleaning substrates, and is provided with: a center brush, which includes a first base and a first cleaning part installed on the first base; and The outer peripheral brush includes a second base and a second cleaning part installed on the second base, and is arranged to surround the center brush; and the center brush and the outer peripheral brush are configured to be removable from each other.
在該洗淨頭中,外周刷配置為包圍中心刷。由於中心刷之第1基台與外周刷之第2基台為個別構體,故中心刷與外周刷可相互拆裝。因而,在僅中心刷之第1洗淨部及外周刷之第2洗淨部之任一者消耗時,無須更換洗淨頭之整體,可僅更換消耗之刷。In this washing head, the outer peripheral brush is arranged to surround the center brush. Since the first base of the center brush and the second base of the peripheral brush are separate structures, the center brush and the peripheral brush can be detached from each other. Therefore, when only one of the first cleaning part of the center brush and the second cleaning part of the peripheral brush is consumed, there is no need to replace the entire cleaning head, and only the consumed brush can be replaced.
又,藉由與洗淨對象之基板之形狀或洗淨之種類相應地變更中心刷與外周刷之組合而構成洗淨頭,而可利用該洗淨頭適切地將基板洗淨。在此情形下,無須準備中心刷與外周刷之組合經固定之多種類之洗淨頭。其等之結果為,可抑制成本之增加且進行基板之適切之洗淨。In addition, a cleaning head is constructed by changing the combination of the center brush and the peripheral brush according to the shape of the substrate to be cleaned or the type of cleaning, and the substrate can be appropriately cleaned by the cleaning head. In this case, there is no need to prepare various types of cleaning heads in which the combination of the center brush and the peripheral brush is fixed. As a result, the increase in cost can be suppressed and the substrate can be cleaned appropriately.
(2)中心刷與外周刷可構成為可相互獨立地朝一方向移動。在此情形下,藉由與基板之洗淨部分相應地使用適切之刷,而可適切地將基板洗淨。又,藉由使中心刷之洗淨之時序與外周刷之洗淨之時序不同,而防止由一個刷產生之污染物附著於另一刷。藉此,可不易消耗洗淨頭。(2) The center brush and the outer peripheral brush can be configured to move in one direction independently of each other. In this case, by using an appropriate brush corresponding to the cleaning portion of the substrate, the substrate can be cleaned appropriately. In addition, by making the cleaning timing of the center brush different from the cleaning timing of the peripheral brush, the contaminants generated by one brush are prevented from adhering to the other brush. Thereby, the washing head is not easily consumed.
(3)中心刷與外周刷構成為可繞平行於一方向之軸一體地旋轉。在此情形下,可利用單純之構成使中心刷與外周刷旋轉。又,藉由將中心刷與外周刷旋轉,而可高效率地將基板洗淨。(3) The center brush and the outer peripheral brush are configured to be integrally rotatable about an axis parallel to one direction. In this case, a simple structure can be used to rotate the center brush and the outer peripheral brush. In addition, by rotating the center brush and the outer peripheral brush, the substrate can be washed efficiently.
(4)可行的是,第1基台具有與一方向正交之非圓形狀之剖面,第2基台具有收容中心刷之開口部,開口部具有與中心刷之非圓形狀之剖面對應之非圓形狀之剖面。在此情形下,可將中心刷與外周刷構成為可容易地一體地旋轉。(4) It is feasible that the first base has a non-circular cross-section orthogonal to one direction, and the second base has an opening for accommodating the center brush, and the opening has a non-circular cross-section corresponding to the center brush. Section of non-circular shape. In this case, the center brush and the outer peripheral brush can be configured to easily rotate integrally.
(5)中心刷與外周刷可構成為可繞平行於一方向之軸相互獨立地旋轉。在此情形下,可與基板之洗淨部分或洗淨之種類相應地使中心刷與外周刷各者獨立地旋轉。藉此,可更高效率地將基板洗淨。(5) The center brush and the outer peripheral brush can be configured to be able to rotate independently of each other around an axis parallel to one direction. In this case, the central brush and the outer peripheral brush can be independently rotated in accordance with the cleaning portion of the substrate or the type of cleaning. Thereby, the substrate can be cleaned more efficiently.
(6)第1洗淨部可由包含研磨材之材料構成。在此情形下,可利用中心刷研磨基板。藉此,可去除強固地附著於基板之異物。(6) The first cleaning part may be composed of a material containing abrasives. In this case, the center brush can be used to polish the substrate. Thereby, foreign matter strongly attached to the substrate can be removed.
(7)可行的是,中心刷之第1洗淨部具有可與基板接觸之第1洗淨面,在第1洗淨面形成槽部。根據該構成,在朝基板噴出洗淨液而將基板洗淨之情形下,容易通過槽部對第1洗淨面之整體供給洗淨液。藉此,可更充分地將基板洗淨。(7) It is feasible that the first cleaning portion of the center brush has a first cleaning surface that can be in contact with the substrate, and a groove portion is formed on the first cleaning surface. According to this configuration, when the substrate is cleaned by spraying the cleaning liquid onto the substrate, it is easy to supply the cleaning liquid to the entire first cleaning surface through the groove. Thereby, the substrate can be cleaned more sufficiently.
(8)第2洗淨部可利用軟質材料形成。根據該構成,在第2洗淨部與基板接觸之情形下,第2洗淨部變形。因而,基板之斜面部等之不平坦之部分也可利用外周刷適切地洗淨。又,即便在第2洗淨部與基板接觸之情形下,由於第2洗淨部變形,故亦不易阻礙第1洗淨部與基板之接觸。因而,可使第1及第2洗淨部同時且十分地與基板接觸。藉此,可更適切地將基板洗淨。(8) The second cleaning part may be formed of a soft material. According to this configuration, when the second cleaning section is in contact with the substrate, the second cleaning section is deformed. Therefore, uneven parts such as the inclined surface of the substrate can also be cleaned appropriately with the peripheral brush. In addition, even in the case where the second cleaning part is in contact with the substrate, the second cleaning part is deformed, so it is not easy to hinder the contact between the first cleaning part and the substrate. Therefore, the first and second cleaning parts can be brought into contact with the substrate simultaneously and fully. Thereby, the substrate can be cleaned more appropriately.
(9)可行的是,外周刷之第2洗淨部具有可與基板接觸之第2洗淨面,第2洗淨面包含平坦面、及相對於平坦面傾斜之錐形面。根據該構成,在第2洗淨部與基板接觸之情形下,第2洗淨部更容易變形。藉此,可使第1及第2洗淨部同時且更充分地與基板接觸,而更適切地將基板洗淨。又,可利用平坦部更適切地將基板之平坦之部分洗淨。再者,可利用錐形部更適切地將基板之斜面部等之不平坦之部分洗淨。(9) It is possible that the second cleaning portion of the outer peripheral brush has a second cleaning surface that can be in contact with the substrate, and the second cleaning surface includes a flat surface and a tapered surface inclined with respect to the flat surface. According to this configuration, when the second cleaning part is in contact with the substrate, the second cleaning part is more easily deformed. Thereby, the first and second cleaning parts can be brought into contact with the substrate more fully at the same time, and the substrate can be cleaned more appropriately. In addition, the flat part can be used to more appropriately clean the flat part of the substrate. Furthermore, the tapered part can be used to more appropriately clean the uneven part such as the inclined surface of the substrate.
(10)能夠以在第1基台與第2基台之間及第1洗淨部與第2洗淨部之間連通之方式,在中心刷與外周刷之間形成間隙。在此情形下,由於中心刷與外周刷因間隙而不密接,故可容易進行中心刷與外周刷之拆裝。又,可通過間隙對基板進行洗淨水之供給。再者,可通過間隙自基板進行洗淨水或污染物等之吸引。(10) A gap can be formed between the center brush and the outer peripheral brush so that it communicates between the first base and the second base and between the first washing part and the second washing part. In this case, since the center brush and the outer peripheral brush are not in close contact due to the gap, the center brush and the outer peripheral brush can be easily detached and assembled. In addition, washing water can be supplied to the substrate through the gap. Furthermore, it is possible to attract washing water or contaminants from the substrate through the gap.
(11)本發明之另一態樣之中心刷係設置於外周刷且用於基板之洗淨者,且具備:第1基台、及安裝於第1基台之第1洗淨部,以由外周刷包圍之方式可拆裝地配置。(11) The center brush of another aspect of the present invention is one that is provided on the outer peripheral brush and is used for cleaning the substrate, and includes: a first base, and a first cleaning part installed on the first base, and It is detachably arranged in a manner surrounded by outer peripheral brushes.
該中心刷以由外周刷包圍之方式可拆裝地配置。因而,在中心刷之第1洗淨部消耗時,無須更換洗淨頭之整體,可僅更換中心刷。又,藉由與洗淨對象之基板之形狀或洗淨之種類相應地變更與外周刷組合之中心刷而構成洗淨頭,而可利用該洗淨頭適切地將基板洗淨。在此情形下,無須準備中心刷與外周刷之組合經固定之多種類之洗淨頭。其等之結果為,可抑制成本之增加且進行基板之適切之洗淨。The center brush is detachably arranged so as to be surrounded by the outer peripheral brush. Therefore, when the first cleaning part of the center brush is consumed, there is no need to replace the entire cleaning head, and only the center brush can be replaced. In addition, a cleaning head is constructed by changing the center brush combined with the outer peripheral brush according to the shape of the substrate to be cleaned or the type of cleaning, and the substrate can be appropriately cleaned by the cleaning head. In this case, there is no need to prepare various types of cleaning heads in which the combination of the center brush and the peripheral brush is fixed. As a result, the increase in cost can be suppressed and the substrate can be cleaned appropriately.
(12)本發明之又一態樣之外周刷係設置於中心刷且用於基板之洗淨者,且具備第2基台、及安裝於第2基台之第2洗淨部,以包圍中心刷之方式可拆裝地配置。(12) Another aspect of the present invention is that the outer peripheral brush is provided on the center brush and used for cleaning the substrate, and has a second base and a second cleaning part installed on the second base to surround The center brush is detachably configured.
該外周刷以包圍中心刷之方式可拆裝地配置。因而,在外周刷之第2洗淨部消耗時,無須更換洗淨頭之整體,可僅更換外周刷。又,藉由與洗淨對象之基板之形狀或洗淨之種類相應地變更與中心刷組合之外周刷而構成洗淨頭,而可利用該洗淨頭適切地將基板洗淨。在此情形下,無須準備中心刷與外周刷之組合經固定之多種類之洗淨頭。其等之結果為,可抑制成本之增加且進行基板之適切之洗淨。The peripheral brush is detachably arranged to surround the center brush. Therefore, when the second cleaning part of the outer peripheral brush is consumed, there is no need to replace the entire cleaning head, and only the outer peripheral brush can be replaced. In addition, a cleaning head is constructed by combining the outer peripheral brush with the center brush according to the shape of the substrate to be cleaned or the type of cleaning, and the substrate can be appropriately cleaned by the cleaning head. In this case, there is no need to prepare various types of cleaning heads in which the combination of the center brush and the peripheral brush is fixed. As a result, the increase in cost can be suppressed and the substrate can be cleaned appropriately.
(13)本發明之再一態樣之基板洗淨裝置具備:基板保持部,其保持基板;及本發明之一態樣之洗淨頭,其設置為將由基板保持部保持之基板洗淨。(13) A substrate cleaning device according to another aspect of the present invention includes: a substrate holding portion that holds a substrate; and a cleaning head according to an aspect of the present invention, which is provided to clean the substrate held by the substrate holding portion.
在該基板洗淨裝置中,由基板保持部保持之基板係由上述之洗淨頭洗淨。在洗淨頭中,由於中心刷之第1基台與外周刷之第2基台為個別構體,故中心刷與外周刷可相互拆裝。因而,在僅中心刷之第1洗淨部及外周刷之第2洗淨部之任一者消耗時,無須更換洗淨頭之整體,可僅更換消耗之刷。In this substrate cleaning device, the substrate held by the substrate holding portion is cleaned by the above-mentioned cleaning head. In the washing head, since the first base of the center brush and the second base of the outer brush are separate structures, the center brush and the outer brush can be detached from each other. Therefore, when only one of the first cleaning part of the center brush and the second cleaning part of the peripheral brush is consumed, there is no need to replace the entire cleaning head, and only the consumed brush can be replaced.
又,藉由與洗淨對象之基板之形狀或洗淨之種類相應地變更中心刷與外周刷之組合而構成洗淨頭,而可利用該洗淨頭適切地將基板洗淨。在此情形下,無須準備中心刷與外周刷之組合經固定之多種類之洗淨頭。其等之結果為,可抑制成本之增加且進行基板之適切之洗淨。In addition, a cleaning head is constructed by changing the combination of the center brush and the peripheral brush according to the shape of the substrate to be cleaned or the type of cleaning, and the substrate can be appropriately cleaned by the cleaning head. In this case, there is no need to prepare various types of cleaning heads in which the combination of the center brush and the peripheral brush is fixed. As a result, the increase in cost can be suppressed and the substrate can be cleaned appropriately.
(14)基板洗淨裝置可更具備:第1驅動裝置,其設置為可將洗淨頭之中心刷朝向基板移動;及第2驅動裝置,其可將洗淨頭之外周刷朝向基板移動。(14) The substrate cleaning device may be further equipped with: a first driving device configured to move the center brush of the cleaning head toward the substrate; and a second driving device configured to move the outer peripheral brush of the cleaning head toward the substrate.
在此情形下,藉由與基板之洗淨部分相應地使第1或第2驅動裝置動作,而可利用中心刷或外周刷更適切地將基板洗淨。又,藉由使中心刷之洗淨之時序與外周刷之洗淨之時序不同,而防止由一個刷產生之污染物附著於另一刷。藉此,可不易消耗洗淨頭。In this case, by operating the first or second driving device corresponding to the cleaning portion of the substrate, the substrate can be cleaned more appropriately with the center brush or the outer peripheral brush. In addition, by making the cleaning timing of the center brush different from the cleaning timing of the peripheral brush, the contaminants generated by one brush are prevented from adhering to the other brush. Thereby, the washing head is not easily consumed.
(15)本發明之又一態樣之基板洗淨方法包含:藉由基板保持部保持基板之步驟;及藉由本發明之一態樣之洗淨頭將由基板保持部保持之基板洗淨之步驟。根據該方法,在僅中心刷之第1洗淨部及外周刷之第2洗淨部之任一者消耗時,無須更換洗淨頭之整體,可僅更換消耗之刷。(15) A substrate cleaning method of another aspect of the present invention includes: a step of holding a substrate by a substrate holding portion; and a step of cleaning the substrate held by the substrate holding portion by a cleaning head of one aspect of the present invention . According to this method, when only one of the first cleaning part of the center brush and the second cleaning part of the peripheral brush is consumed, it is not necessary to replace the entire cleaning head, and only the consumed brush can be replaced.
又,藉由與洗淨對象之基板之形狀或洗淨之種類相應地變更中心刷與外周刷之組合而構成洗淨頭,而可利用該洗淨頭適切地將基板洗淨。在此情形下,無須準備中心刷與外周刷之組合經固定之多種類之洗淨頭。其等之結果為,可抑制成本之增加且進行基板之適切之洗淨。In addition, a cleaning head is constructed by changing the combination of the center brush and the peripheral brush according to the shape of the substrate to be cleaned or the type of cleaning, and the substrate can be appropriately cleaned by the cleaning head. In this case, there is no need to prepare various types of cleaning heads in which the combination of the center brush and the peripheral brush is fixed. As a result, the increase in cost can be suppressed and the substrate can be cleaned appropriately.
[發明之效果] 根據本發明,可抑制成本之增加且進行基板之適切之洗淨。[Effects of Invention] According to the present invention, it is possible to suppress the increase in cost and perform proper cleaning of the substrate.
以下,針對本發明之實施形態之洗淨頭、中心刷、外周刷、基板洗淨裝置及基板洗淨方法,利用圖式進行說明。在以下之說明中,基板係指半導體基板、液晶顯示裝置或有機EL(Electro Luminescence,電致發光)顯示裝置等之FPD(Flat Panel Display,平板顯示器)用基板、光碟用基板、磁碟用基板、光磁碟用基板、光罩用基板、陶瓷基板或太陽能電池用基板等。Hereinafter, the cleaning head, the center brush, the outer peripheral brush, the substrate cleaning device, and the substrate cleaning method of the embodiment of the present invention will be described with reference to the drawings. In the following description, the substrate refers to a semiconductor substrate, a liquid crystal display device, or an organic EL (Electro Luminescence, electroluminescence) display device, such as FPD (Flat Panel Display) substrate, optical disk substrate, magnetic disk substrate , Optical magnetic disk substrate, photomask substrate, ceramic substrate or solar cell substrate, etc.
[1]第1實施形態 (1)洗淨頭之構成 圖1係本發明之第1實施形態之洗淨頭之外觀立體圖。如圖1所示,洗淨頭100用於基板之洗淨,由中心刷200及外周刷300構成。外周刷300配置為包圍中心刷200。中心刷200與外周刷300可相互拆裝。[1] The first embodiment (1) The composition of the cleansing head Fig. 1 is a perspective view of the appearance of the washing head according to the first embodiment of the present invention. As shown in FIG. 1, the cleaning head 100 is used for cleaning the substrate, and is composed of a center brush 200 and a peripheral brush 300. The outer peripheral brush 300 is configured to surround the center brush 200. The center brush 200 and the outer peripheral brush 300 can be detached from each other.
中心刷200包含基台210及洗淨部220。基台210由例如PVC(聚氯乙烯)樹脂形成。在本實施形態中,在基台210安裝有用於使洗淨頭100旋轉之軸112。洗淨部220係由分散有例如研磨粒等之研磨材之PVA(聚乙烯醇)海綿形成。洗淨部220安裝於基台210。The center brush 200 includes a base 210 and a cleaning part 220. The base 210 is formed of, for example, PVC (polyvinyl chloride) resin. In this embodiment, a shaft 112 for rotating the washing head 100 is attached to the base 210. The washing part 220 is formed of PVA (polyvinyl alcohol) sponge in which abrasive materials such as abrasive grains are dispersed. The washing unit 220 is installed on the base 210.
外周刷300包含基台310及洗淨部320。基台310係由例如PP(聚丙烯)樹脂形成。洗淨部320係由例如多孔質之氟樹脂形成。在本例中,洗淨部320係由PTFE(聚四氟乙烯)形成,但本發明並不限定於此。洗淨部320可由不包含研磨材之PVA海綿等之其他軟質材料形成。洗淨部320安裝於基台310。The peripheral brush 300 includes a base 310 and a cleaning part 320. The base 310 is formed of, for example, PP (polypropylene) resin. The cleaning part 320 is formed of, for example, porous fluororesin. In this example, the cleaning part 320 is formed of PTFE (polytetrafluoroethylene), but the present invention is not limited to this. The cleaning part 320 may be formed of other soft materials such as PVA sponge that does not contain abrasives. The washing part 320 is installed on the base 310.
在以下之說明中,於洗淨頭100中,將配置洗淨部220、320之方向稱為上方,將其相反方向稱為下方(參照圖1之箭頭)。將垂直於上下方向之平面稱為水平面。在水平面內,將朝向洗淨頭100之旋轉中心(水平面內之軸112之中心)之方向稱為內方,將其相反方向稱為外方。In the following description, in the washing head 100, the direction in which the washing parts 220 and 320 are arranged is referred to as upward, and the opposite direction is referred to as downward (refer to the arrow in FIG. 1). The plane perpendicular to the up and down direction is called the horizontal plane. In the horizontal plane, the direction toward the center of rotation of the washing head 100 (the center of the axis 112 in the horizontal plane) is referred to as inner, and the opposite direction is referred to as outer.
圖2及圖3係用於說明圖1之中心刷200之構成之圖。如圖2所示,中心刷200之基台210具有在上下方向延伸之大致圓柱形狀。在基台210之下表面形成朝上方延伸之孔部211。在本例中,孔部211係在水平面內具有正方形狀之有底孔。孔部211之形狀並不限定於圖2之例。孔部211可在水平面內具有正方形狀以外之形狀。又,孔部211可為在上下方向貫通基台210之貫通孔。2 and 3 are diagrams for explaining the structure of the center brush 200 of FIG. 1. As shown in FIG. 2, the base 210 of the center brush 200 has a substantially cylindrical shape extending in the vertical direction. A hole 211 extending upward is formed on the lower surface of the base 210. In this example, the hole portion 211 has a square bottomed hole in the horizontal plane. The shape of the hole 211 is not limited to the example in FIG. 2. The hole 211 may have a shape other than a square shape in the horizontal plane. In addition, the hole 211 may be a through hole that penetrates the base 210 in the vertical direction.
在基台210之側面形成2處平坦部212、213。藉此,基台210在水平面內具有非圓形狀之剖面。基台210之形狀並不限定於圖2之例。只要剖面具有非圓形狀,則基台210可具有其他之形狀。例如,可以剖面成為D字形狀之方式,僅在基台210之側面之1個部位形成平坦部。或,可以剖面成為橢圓形狀或多角形狀之方式,基台210具有橢圓柱形狀或多角柱形狀。Two flat portions 212 and 213 are formed on the side surface of the base 210. Thereby, the base 210 has a non-circular cross-section in the horizontal plane. The shape of the base 210 is not limited to the example in FIG. 2. As long as the cross-section has a non-circular shape, the base 210 may have other shapes. For example, it is possible to form a D-shape in cross section, and form a flat part at only one part of the side surface of the base 210. Or, the cross-section may be an elliptical shape or a polygonal shape, and the base 210 has an elliptical column shape or a polygonal column shape.
中心刷200之洗淨部220具有圓板形狀。在洗淨部220之上表面形成槽部221。在本例中,槽部221具有十字形狀。如圖2中以箭頭所示般,利用接著劑等將洗淨部220之下表面接合於基台210之上表面。藉此,如圖3所示,中心刷200完成。The cleaning part 220 of the center brush 200 has a circular plate shape. A groove portion 221 is formed on the upper surface of the washing portion 220. In this example, the groove 221 has a cross shape. As shown by the arrow in FIG. 2, the lower surface of the cleaning portion 220 is joined to the upper surface of the base 210 with an adhesive or the like. Thereby, as shown in FIG. 3, the center brush 200 is completed.
圖4及圖5係用於說明圖1之外周刷300之構成之圖。如圖4所示,外周刷300之基台310具有大致圓筒形狀。因而,在基台310之中央部形成在上下方向延伸之開口部311。開口部311在水平面內具有與圖2之中心刷200之基台210之剖面形狀對應之非圓形之剖面形狀。因而,在本例中,在開口部311內之基台310之內面形成與基台210之平坦部212、213(圖2)分別對應之平坦部312、313。4 and 5 are diagrams for explaining the structure of the outer peripheral brush 300 in FIG. 1. As shown in FIG. 4, the base 310 of the outer peripheral brush 300 has a substantially cylindrical shape. Therefore, an opening 311 extending in the vertical direction is formed at the center of the base 310. The opening 311 has a non-circular cross-sectional shape corresponding to the cross-sectional shape of the base 210 of the center brush 200 of FIG. 2 in the horizontal plane. Therefore, in this example, the inner surface of the base 310 in the opening 311 is formed with flat portions 312 and 313 corresponding to the flat portions 212 and 213 (FIG. 2) of the base 210, respectively.
外周刷300之洗淨部320具有圓環形狀。因而,在洗淨部320之中央部形成例如圓形狀之開口部321。又,在洗淨部320形成自外周部連接至開口部321之複數個缺口部322。在本例中,4個缺口部322以90度間隔配置。洗淨部320之上表面具有:從內朝外於斜上方傾斜之錐形面323、及在外周部分成為水平之平坦面324。The washing part 320 of the peripheral brush 300 has a circular ring shape. Therefore, a circular opening 321 is formed, for example, in the central part of the washing part 320. In addition, a plurality of notches 322 connected to the opening 321 from the outer periphery are formed in the washing part 320. In this example, the four notches 322 are arranged at 90-degree intervals. The upper surface of the washing part 320 has a tapered surface 323 inclined obliquely upward from the inside to the outside, and a flat surface 324 which is horizontal at the outer peripheral part.
如圖4中以箭頭所示般,藉由接著劑等將洗淨部320之下表面接合於基台310之上表面。藉此,如圖5所示,外周刷300完成。在外周刷300中,基台310之開口部311與洗淨部320之開口部321在上下方向重合。As shown by the arrow in FIG. 4, the lower surface of the cleaning part 320 is joined to the upper surface of the base 310 with an adhesive or the like. Thereby, as shown in FIG. 5, the peripheral brush 300 is completed. In the outer peripheral brush 300, the opening 311 of the base 310 and the opening 321 of the washing part 320 overlap in the vertical direction.
圖6係洗淨頭100之仰視圖。圖7係洗淨頭100之俯視圖。如圖6及圖7所示,藉由將中心刷200配置於外周刷300之開口部311、321內,而完成洗淨頭100。中心刷200之外周面與外周刷300之內周面之間之至少一部分互不接觸。藉此,在中心刷200之外周面與外周刷300之內周面之間形成間隙101。Fig. 6 is a bottom view of the washing head 100. FIG. 7 is a top view of the washing head 100. FIG. As shown in FIGS. 6 and 7, the cleaning head 100 is completed by arranging the center brush 200 in the openings 311 and 321 of the outer peripheral brush 300. At least a part of the outer peripheral surface of the center brush 200 and the inner peripheral surface of the outer peripheral brush 300 are not in contact with each other. Thereby, a gap 101 is formed between the outer peripheral surface of the center brush 200 and the inner peripheral surface of the outer peripheral brush 300.
如此,由於中心刷200與外周刷300因間隙101而不密接,故可容易進行中心刷200與外周刷300之拆裝。又,可通過間隙101對洗淨對象之基板進行洗淨水之供給。進而,可通過間隙101自基板進行洗淨水或污染物等之吸引。細節於後文敘述。In this way, since the center brush 200 and the outer peripheral brush 300 are not in close contact due to the gap 101, the center brush 200 and the outer peripheral brush 300 can be easily detached. In addition, the cleaning water can be supplied through the gap 101 to the substrate to be cleaned. Furthermore, washing water, contaminants, etc. can be sucked from the substrate through the gap 101. The details are described later.
如上述般,基台310之開口部311具有與基台210之剖面形狀對應之剖面形狀。又,如圖6所示,基台210之平坦部212、213與基台310之平坦部312、313分別相接。藉此,限制中心刷200與外周刷300相互獨立地旋轉。As described above, the opening 311 of the base 310 has a cross-sectional shape corresponding to the cross-sectional shape of the base 210. Moreover, as shown in FIG. 6, the flat portions 212, 213 of the base 210 and the flat portions 312, 313 of the base 310 are in contact with each other. Thereby, the center brush 200 and the outer peripheral brush 300 are restricted from rotating independently of each other.
另一方面,中心刷200與外周刷300未相互固定。因而,中心刷200與外周刷300可相互獨立地在上下方向移動。在本實施形態中,於初始狀態下,外周刷300之洗淨部320之上表面位於較中心刷200之洗淨部220之上表面更上方。On the other hand, the center brush 200 and the outer peripheral brush 300 are not fixed to each other. Therefore, the center brush 200 and the outer peripheral brush 300 can move in the vertical direction independently of each other. In this embodiment, in the initial state, the upper surface of the cleaning portion 320 of the outer peripheral brush 300 is located above the upper surface of the cleaning portion 220 of the center brush 200.
軸112在水平面內具有與基台210之孔部211之形狀對應之剖面形狀(在本例中為正方形狀),插入基台210之孔部211。中心刷200與外周刷300由於相互獨立地旋轉受到限制,故藉由軸112旋轉而同步地旋轉。此外,洗淨頭100可不構成為可旋轉。在此情形下,軸112可在水平面內具有圓形之剖面形狀。同樣地,基台210之孔部211可在水平面內具有圓形之剖面形狀。The shaft 112 has a cross-sectional shape (square shape in this example) corresponding to the shape of the hole 211 of the base 210 in the horizontal plane, and is inserted into the hole 211 of the base 210. Since the center brush 200 and the outer peripheral brush 300 are restricted from rotating independently of each other, they rotate synchronously by the rotation of the shaft 112. In addition, the washing head 100 may not be configured to be rotatable. In this case, the shaft 112 may have a circular cross-sectional shape in the horizontal plane. Similarly, the hole 211 of the base 210 may have a circular cross-sectional shape in the horizontal plane.
在本實施形態中,如圖7所示,以洗淨部320之複數個缺口部322與洗淨部220之槽部221相連之方式構成中心刷200及外周刷300,但本發明並不限定於此。圖8係顯示第1變化例之洗淨頭100之俯視圖。如圖8所示,可以複數個缺口部322與槽部221相連之方式構成中心刷200及外周刷300。In this embodiment, as shown in FIG. 7, the center brush 200 and the outer peripheral brush 300 are formed by connecting a plurality of notches 322 of the washing part 320 to the groove part 221 of the washing part 220, but the present invention is not limited Here. FIG. 8 is a top view showing the washing head 100 of the first modification. As shown in FIG. 8, the center brush 200 and the outer peripheral brush 300 may be formed in a manner that a plurality of notches 322 are connected to the groove 221.
又,在本實施形態中,槽部221具有十字形狀,但本發明並不限定於此。槽部221可具有其他之形狀。圖9係顯示第2變化例之洗淨頭100之立體圖。圖10係圖9之洗淨頭100之俯視圖。如圖9及圖10所示,在第2變化例中,槽部221具有風車形狀。具體而言,槽部221具有一面自洗淨部220之中心朝四方彎曲一面朝外方延伸之形狀。在本例中,各缺口部322形成為一面與槽部221相連且彎曲一面在周向延伸。In addition, in this embodiment, the groove 221 has a cross shape, but the present invention is not limited to this. The groove 221 may have other shapes. Fig. 9 is a perspective view showing the washing head 100 of the second modification. FIG. 10 is a top view of the washing head 100 of FIG. 9. As shown in FIGS. 9 and 10, in the second modification, the groove 221 has a windmill shape. Specifically, the groove portion 221 has a shape in which one surface is curved in four directions from the center of the washing portion 220 and the surface extends outward. In this example, each notch portion 322 is formed such that one surface is connected to the groove portion 221 and the curved surface extends in the circumferential direction.
(2)基板洗淨裝置之概略構成 圖11係顯示包含洗淨頭100之基板洗淨裝置之概略構成之圖。如圖11所示,基板洗淨裝置1具備:洗淨頭100、旋轉部110、升降部120、130、洗淨部140及吸引部150。又,基板洗淨裝置1具備後述之圖21之旋轉卡盤410或圖29之旋轉卡盤460等之基板保持部。(2) Outline structure of substrate cleaning device FIG. 11 is a diagram showing a schematic configuration of a substrate cleaning device including a cleaning head 100. As shown in FIG. 11, the substrate cleaning device 1 includes a cleaning head 100, a rotating part 110, lifting parts 120 and 130, a cleaning part 140, and a suction part 150. In addition, the substrate cleaning device 1 includes a substrate holding portion such as a spin chuck 410 of FIG. 21 or a spin chuck 460 of FIG. 29 described later.
旋轉部110包含旋轉驅動裝置111及軸112。旋轉驅動裝置111為例如電動馬達。軸112插入中心刷200之基台210之孔部211,且連接於旋轉驅動裝置111。藉由旋轉驅動裝置111使軸112旋轉,而中心刷200與外周刷300一體地旋轉。The rotating part 110 includes a rotating drive device 111 and a shaft 112. The rotation driving device 111 is, for example, an electric motor. The shaft 112 is inserted into the hole 211 of the base 210 of the center brush 200 and is connected to the rotation driving device 111. The shaft 112 is rotated by the rotation driving device 111, and the center brush 200 and the outer peripheral brush 300 rotate integrally.
此外,在本例中,構成為藉由旋轉部110之旋轉驅動力對中心刷200賦予,而中心刷200與外周刷300一體地旋轉,但本發明並不限定於此。可構成為藉由旋轉部110之旋轉驅動力對外周刷300賦予,而中心刷200與外周刷300一體地旋轉。In addition, in this example, it is configured that the center brush 200 is provided by the rotational driving force of the rotating part 110, and the center brush 200 and the outer peripheral brush 300 rotate integrally, but the present invention is not limited to this. It may be configured that the rotation driving force of the rotating part 110 is applied to the outer peripheral brush 300 so that the center brush 200 and the outer peripheral brush 300 rotate integrally.
升降部120包含升降驅動裝置121及連結構件122。升降部130包含升降驅動裝置131及連結構件132。升降驅動裝置121、131為例如氣缸。此外,升降驅動裝置121、131可由例如電動馬達及滾珠螺桿構成。升降驅動裝置121藉由連結構件122而連結於旋轉驅動裝置111。升降驅動裝置131藉由連結構件132而連結於外周刷300之基台310。The lifting part 120 includes a lifting driving device 121 and a connecting member 122. The lifting part 130 includes a lifting driving device 131 and a connecting member 132. The lift driving devices 121 and 131 are, for example, air cylinders. In addition, the lifting driving devices 121 and 131 may be constituted by, for example, electric motors and ball screws. The lifting drive device 121 is connected to the rotation drive device 111 by a connecting member 122. The lifting driving device 131 is connected to the base 310 of the outer peripheral brush 300 by the connecting member 132.
藉由升降驅動裝置121使連結構件122升降,而中心刷200與外周刷300獨立地升降。藉由升降驅動裝置131使連結構件132升降,而外周刷300與中心刷200獨立地升降。旋轉驅動裝置111與升降驅動裝置121可由單一之旋轉升降驅動裝置實現。在此情形下,在旋轉驅動裝置111與升降驅動裝置121之間未設置連結構件122。The connecting member 122 is raised and lowered by the raising and lowering drive device 121, and the center brush 200 and the outer peripheral brush 300 are raised and lowered independently. The connecting member 132 is raised and lowered by the raising and lowering driving device 131, and the outer peripheral brush 300 and the center brush 200 are raised and lowered independently. The rotary driving device 111 and the lifting driving device 121 can be realized by a single rotary lifting driving device. In this case, the connecting member 122 is not provided between the rotation driving device 111 and the lifting driving device 121.
洗淨部140包含洗淨液供給裝置141及噴嘴142。洗淨液供給裝置141利用噴嘴142朝洗淨頭100之上方(洗淨頭100與基板之間)噴出洗淨液。洗淨液既可為DIW(純水)、界面活性劑或溶劑,也可為其他之藥液。吸引部150為例如真空裝置,設置為可吸引因基板之洗淨而產生之異物。以下,針對基板洗淨裝置1之動作進行說明。圖12及圖13係用於說明基板洗淨裝置1之第1動作例之圖。The washing unit 140 includes a washing liquid supply device 141 and a nozzle 142. The cleaning liquid supply device 141 uses the nozzle 142 to spray the cleaning liquid above the cleaning head 100 (between the cleaning head 100 and the substrate). The cleaning liquid can be DIW (pure water), surfactant or solvent, or other liquid medicine. The suction unit 150 is, for example, a vacuum device, and is configured to suck foreign matter generated by the cleaning of the substrate. Hereinafter, the operation of the substrate cleaning device 1 will be described. FIG. 12 and FIG. 13 are diagrams for explaining the first operation example of the substrate cleaning device 1.
在圖12之例中,將由基板保持部保持之基板W之被洗淨面(在本例中為背面)洗淨。具體而言,如圖12所示,中心刷200及外周刷300朝向基板W之被洗淨面上升。在此情形下,洗淨部320之平坦面324與基板W之被洗淨面接觸。此處,洗淨部320之上表面由於形成為錐形狀,故容易以壓碎之方式變形。因而,不易阻礙洗淨部220與基板W之接觸。藉此,洗淨部220之上表面上升至與洗淨部320之上表面(平坦面324)大致相同之高度,且與基板W之被洗淨面接觸。In the example of FIG. 12, the cleaned surface (the back surface in this example) of the substrate W held by the substrate holding portion is cleaned. Specifically, as shown in FIG. 12, the center brush 200 and the outer peripheral brush 300 rise toward the surface of the substrate W to be cleaned. In this case, the flat surface 324 of the cleaning portion 320 is in contact with the cleaned surface of the substrate W. Here, since the upper surface of the washing portion 320 is formed in a tapered shape, it is easily deformed by crushing. Therefore, it is not easy to hinder the contact between the cleaning portion 220 and the substrate W. Thereby, the upper surface of the washing portion 220 rises to approximately the same height as the upper surface (flat surface 324) of the washing portion 320, and is in contact with the surface of the substrate W to be washed.
如此,藉由在洗淨部220之上表面及洗淨部320之上表面同時且充分地與基板W之被洗淨面接觸之狀態下基板W旋轉,而將基板W之被洗淨面洗淨。又,在洗淨頭100旋轉之情形下,更高效率地將基板W之被洗淨面洗淨。基板W之旋轉方向與洗淨頭100之旋轉方向既可相同,也可相反。In this way, by rotating the substrate W in a state where the upper surface of the cleaning portion 220 and the upper surface of the cleaning portion 320 are in contact with the cleaned surface of the substrate W simultaneously and sufficiently, the cleaned surface of the substrate W is washed net. In addition, when the cleaning head 100 rotates, the cleaned surface of the substrate W is cleaned more efficiently. The rotation direction of the substrate W and the rotation direction of the cleaning head 100 may be the same or opposite.
以下,將藉由研磨而將基板W洗淨稱為研磨洗淨,將藉由摩擦而將基板W洗淨稱為擦洗洗淨。在圖12之例中,利用洗淨部220將基板W之被處理面研磨洗淨,利用洗淨部320將基板W之被處理面擦洗洗淨。根據研磨洗淨,可去除強固地附著於基板W之異物。Hereinafter, the cleaning of the substrate W by polishing is referred to as polishing cleaning, and the cleaning of the substrate W by friction is referred to as scrub cleaning. In the example of FIG. 12, the processing surface of the substrate W is polished and cleaned by the cleaning section 220, and the processing surface of the substrate W is scrubbed and cleaned by the cleaning section 320. According to polishing and cleaning, foreign matter strongly attached to the substrate W can be removed.
在基板W之洗淨中,自噴嘴142朝洗淨頭100之上方噴出洗淨液。所噴出之洗淨液通過洗淨部320之缺口部322(圖5)供給至洗淨部320之上表面之整體。又,洗淨液通過洗淨部220之槽部221供給至洗淨部220之上表面之整體。藉此,可更充分地將基板W洗淨。In the cleaning of the substrate W, the cleaning liquid is sprayed from the nozzle 142 toward the upper side of the cleaning head 100. The sprayed cleaning liquid is supplied to the entire upper surface of the cleaning part 320 through the notch 322 (FIG. 5) of the cleaning part 320. In addition, the washing liquid is supplied to the entire upper surface of the washing unit 220 through the groove 221 of the washing unit 220. Thereby, the substrate W can be cleaned more sufficiently.
此外,在如圖9及圖10之洗淨頭100般,洗淨部320之各缺口部322具有彎曲之形狀之情形下,洗淨液更高效率地供給至洗淨部320之上表面之整體。同樣地,在洗淨部220具有風車形狀之情形下,洗淨液更高效率地供給至洗淨部220之上表面之整體。因而,可削減洗淨液之使用量,且充分地將基板W洗淨。In addition, in the case where each notch portion 322 of the washing portion 320 has a curved shape like the washing head 100 in FIGS. 9 and 10, the washing liquid is more efficiently supplied to the upper surface of the washing portion 320 overall. Similarly, when the washing part 220 has a windmill shape, the washing liquid is supplied to the entire upper surface of the washing part 220 more efficiently. Therefore, the usage of the cleaning solution can be reduced, and the substrate W can be sufficiently cleaned.
如圖12中以虛線所示般,在基板W之洗淨中,通過中心刷200與外周刷300之間隙101利用吸引部150吸引洗淨頭100之上方之氣分。在此情形下,將洗淨液高效率地取入洗淨部320之上表面整體及洗淨部220之上表面整體。因而,可進一步削減洗淨液之使用量,且充分地將基板W洗淨。As shown by the dotted line in FIG. 12, in the cleaning of the substrate W, the air above the cleaning head 100 is sucked by the suction part 150 through the gap 101 between the center brush 200 and the outer peripheral brush 300. In this case, the washing liquid is efficiently taken into the entire upper surface of the washing portion 320 and the entire upper surface of the washing portion 220. Therefore, the usage amount of the cleaning solution can be further reduced, and the substrate W can be sufficiently cleaned.
又,由於基板W吸附於洗淨頭100,故可在將洗淨頭100強固地按壓至基板W之狀態下進行洗淨。洗淨頭100朝基板W之按壓之強度可藉由控制吸引部150之吸引之壓力而調整。再者,洗淨後之洗淨液或因基板之洗淨而產生之異物在不再次附著於基板下朝吸引部150排出。其等之結果為,可進一步充分地將基板W洗淨。In addition, since the substrate W is adsorbed to the cleaning head 100, cleaning can be performed in a state where the cleaning head 100 is firmly pressed to the substrate W. The intensity of the pressing of the cleaning head 100 against the substrate W can be adjusted by controlling the suction pressure of the suction part 150. Furthermore, the cleaning solution after cleaning or the foreign matter generated by the cleaning of the substrate is discharged toward the suction part 150 without re-attaching to the substrate. As a result, the substrate W can be cleaned more sufficiently.
在圖13之例中,進一步將基板W之斜面部洗淨。具體而言,在圖12之洗淨後,如圖13所示,以外周刷300之一部分位於較基板W更外方之方式將洗淨頭100移動至基板W之周緣部。在此情形下,洗淨部320之一部分之形狀恢復原本之形狀,錐形面323與基板W之斜面部接觸。藉此,利用洗淨部320主要將基板W之斜面部擦洗洗淨。又,利用洗淨部220將基板W之被處理面研磨洗淨。In the example of FIG. 13, the inclined surface of the substrate W is further washed. Specifically, after the cleaning in FIG. 12, as shown in FIG. 13, the cleaning head 100 is moved to the peripheral edge of the substrate W so that a part of the outer peripheral brush 300 is located outside the substrate W. In this case, the shape of a part of the washing portion 320 returns to its original shape, and the tapered surface 323 contacts the inclined surface of the substrate W. Thereby, the inclined surface of the substrate W is mainly scrubbed and cleaned by the cleaning part 320. In addition, the surface to be processed of the substrate W is polished and cleaned by the cleaning section 220.
在基板洗淨裝置1之第1動作例中,中心刷200與外周刷300一體地在上下方向移動,但本發明並不限定於此。圖14及圖15係用於說明基板洗淨裝置1之第2動作例之圖。如圖14所示,在基板W之被處理面之洗淨時,外周刷300不上升,中心刷200朝向基板W之被洗淨面上升。在此情形下,洗淨部320與基板W不接觸,洗淨部220之上表面與基板W之被洗淨面接觸。藉此,利用洗淨部220將基板W之被處理面研磨洗淨。In the first operation example of the substrate cleaning device 1, the center brush 200 and the outer peripheral brush 300 move in the vertical direction integrally, but the present invention is not limited to this. 14 and 15 are diagrams for explaining the second operation example of the substrate cleaning device 1. As shown in FIG. 14, during the cleaning of the processed surface of the substrate W, the outer peripheral brush 300 does not rise, and the center brush 200 rises toward the cleaned surface of the substrate W. In this case, the cleaning portion 320 does not contact the substrate W, and the upper surface of the cleaning portion 220 contacts the surface to be cleaned of the substrate W. Thereby, the processed surface of the substrate W is polished and cleaned by the cleaning section 220.
在圖14之例中,洗淨部220與洗淨部320不同時與基板W接觸。因而,防止因洗淨部220之研磨洗淨而產生之異物(包含來自基板W之污染物及自洗淨部220脫落之研磨材)附著於洗淨部320。藉此,可不易污染洗淨部320。之後,如圖15所示,以外周刷300之一部分位於較基板W更外方之方式將洗淨頭100朝基板W之周緣部移動,且將外周刷300上升。藉此,利用洗淨部320將基板W之斜面部擦洗洗淨。In the example of FIG. 14, the cleaning part 220 and the cleaning part 320 are not in contact with the substrate W at the same time. Therefore, foreign matter (including contaminants from the substrate W and abrasives dropped from the cleaning part 220) generated by the polishing cleaning of the cleaning part 220 is prevented from adhering to the cleaning part 320. In this way, the washing part 320 is not easily contaminated. After that, as shown in FIG. 15, the cleaning head 100 is moved toward the periphery of the substrate W so that a part of the outer peripheral brush 300 is located outside the substrate W, and the outer peripheral brush 300 is raised. Thereby, the inclined surface of the substrate W is scrubbed and cleaned by the cleaning part 320.
在圖11之基板洗淨裝置1中,洗淨液供給裝置141利用噴嘴142供給洗淨液,但本發明並不限定於此。洗淨液供給裝置141可在不利用噴嘴142下供給洗淨液。圖16係顯示洗淨部140之第1變化例之圖。如圖16所示,在洗淨部140之第1變化例中,洗淨液供給裝置141構成為通過洗淨頭100之間隙101朝基板W之上方供給洗淨液。在該例中,間隙101不用於吸引部150對異物之吸引。In the substrate cleaning apparatus 1 of FIG. 11, the cleaning liquid supply device 141 uses the nozzle 142 to supply the cleaning liquid, but the present invention is not limited to this. The washing liquid supply device 141 can supply washing liquid without using the nozzle 142. FIG. 16 is a diagram showing a first modification example of the washing unit 140. As shown in FIG. 16, in the first modification of the washing unit 140, the washing liquid supply device 141 is configured to supply the washing liquid above the substrate W through the gap 101 of the washing head 100. In this example, the gap 101 is not used for attracting foreign objects by the suction portion 150.
圖17係顯示洗淨部140之第2變化例之圖。如圖17所示,在洗淨部140之第2變化例中,在中心刷200形成在上下方向貫通基台210及洗淨部220之貫通孔201。洗淨液供給裝置141構成為通過中心刷200之貫通孔201朝基板W之上方供給洗淨液。在該例中,可將間隙101用於吸引部150對異物之吸引。FIG. 17 is a diagram showing a second modification example of the washing unit 140. As shown in FIG. 17, in the second modification of the washing part 140, a through hole 201 that penetrates the base 210 and the washing part 220 in the vertical direction is formed in the center brush 200. The cleaning liquid supply device 141 is configured to supply the cleaning liquid above the substrate W through the through hole 201 of the center brush 200. In this example, the gap 101 can be used for the suction portion 150 to attract foreign objects.
圖18係顯示吸引部150之變化例之圖。如圖18所示,在吸引部150之變化例中,與圖17之例同樣地,在中心刷200形成貫通孔201。吸引部150通過中心刷200之貫通孔201吸引洗淨頭100之上方之氣分。在該例中,與圖16之例同樣地,可將洗淨頭100之間隙101用於洗淨液供給裝置141對洗淨液之供給。FIG. 18 is a diagram showing a modification example of the suction unit 150. As shown in FIG. 18, in the modified example of the suction portion 150, as in the example of FIG. 17, a through hole 201 is formed in the center brush 200. The suction part 150 sucks the air above the washing head 100 through the through hole 201 of the center brush 200. In this example, as in the example of FIG. 16, the gap 101 of the washing head 100 can be used for supplying the washing liquid to the washing liquid supply device 141.
在本實施形態中,由研磨洗淨用之中心刷200及擦洗洗淨用之外周刷300構成洗淨頭100,但本發明並不限定於此。例如,可由擦洗洗淨用之中心刷200及擦洗洗淨用之外周刷300構成洗淨頭100。在該構成中,中心刷200之洗淨部220由PTFE或不包含研磨材之PVA海綿等之軟質材料形成。此洗淨頭100可在例如將在被洗淨面形成有抗蝕劑膜等之處理膜之基板W洗淨之情形下使用。In this embodiment, the cleaning head 100 is composed of the center brush 200 for polishing and cleaning and the outer peripheral brush 300 for scrubbing and cleaning, but the present invention is not limited to this. For example, the cleaning head 100 may be composed of a center brush 200 for scrubbing and washing and an outer peripheral brush 300 for scrubbing and washing. In this configuration, the cleaning portion 220 of the center brush 200 is formed of soft materials such as PTFE or PVA sponge that does not contain abrasives. This cleaning head 100 can be used, for example, when cleaning a substrate W on which a treatment film such as a resist film is formed on the surface to be cleaned.
(3)效果 在本實施形態之洗淨頭100中,外周刷300配置為包圍中心刷200。由於中心刷200之基台210與外周刷300之基台310為個別構體,故中心刷200與外周刷300可相互拆裝。因而,在僅中心刷200之洗淨部220及外周刷300之洗淨部320之任一者消耗時,無須更換洗淨頭100之整體,可僅更換消耗之刷。(3) Effect In the washing head 100 of this embodiment, the outer peripheral brush 300 is arranged to surround the center brush 200. Since the base 210 of the center brush 200 and the base 310 of the peripheral brush 300 are separate structures, the center brush 200 and the peripheral brush 300 can be detached from each other. Therefore, when only one of the cleaning portion 220 of the center brush 200 and the cleaning portion 320 of the outer peripheral brush 300 is consumed, the entire cleaning head 100 does not need to be replaced, and only the consumed brush can be replaced.
又,藉由與洗淨對象之基板W之形狀或洗淨之種類相應地變更中心刷200與外周刷300之組合而構成洗淨頭100,而可利用該洗淨頭100適切地將基板W洗淨。在此情形下,無須準備中心刷與外周刷之組合經固定之多種類之洗淨頭。其等之結果為,可抑制成本之增加且進行基板W之適切之洗淨。In addition, the cleaning head 100 is constructed by changing the combination of the center brush 200 and the outer peripheral brush 300 according to the shape of the substrate W to be cleaned or the type of cleaning, and the cleaning head 100 can be used to appropriately remove the substrate W Wash. In this case, there is no need to prepare various types of cleaning heads in which the combination of the center brush and the peripheral brush is fixed. As a result, the increase in cost can be suppressed and the substrate W can be cleaned appropriately.
又,中心刷200與外周刷300可相互獨立地在上下方向移動。因而,藉由與基板W之洗淨部分相應地使用適切之刷,而可將基板W適切地洗淨。再者,藉由使中心刷200之洗淨之時序與外周刷300之洗淨之時序不同,而防止由一個刷產生之污染物附著於另一刷。藉此,可不易消耗洗淨頭100。In addition, the center brush 200 and the outer peripheral brush 300 can move in the vertical direction independently of each other. Therefore, by using an appropriate brush corresponding to the cleaning portion of the substrate W, the substrate W can be appropriately cleaned. Furthermore, by making the cleaning time sequence of the central brush 200 different from the cleaning time sequence of the outer peripheral brush 300, the contaminants generated by one brush are prevented from adhering to the other brush. In this way, the washing head 100 is not easily consumed.
又,在本實施形態中,中心刷200與外周刷300可繞平行於上下方向之軸一體地旋轉。因而,可藉由利用單一之旋轉部110之單純之構成使中心刷200與外周刷300旋轉。又,藉由將中心刷200與外周刷300旋轉,而可將基板W高效率地洗淨。In addition, in the present embodiment, the center brush 200 and the outer peripheral brush 300 can rotate integrally around an axis parallel to the vertical direction. Therefore, the central brush 200 and the outer peripheral brush 300 can be rotated by using the simple structure of the single rotating part 110. Furthermore, by rotating the center brush 200 and the outer peripheral brush 300, the substrate W can be washed efficiently.
在基板W之洗淨中,自噴嘴142朝洗淨頭100之上方噴出洗淨液。所噴出之洗淨液通過洗淨部320之缺口部322供給至洗淨部320之上表面之整體。又,洗淨液通過洗淨部220之槽部221供給至洗淨部220之上表面之整體。藉此,可更充分地將基板W洗淨。In the cleaning of the substrate W, the cleaning liquid is sprayed from the nozzle 142 toward the upper side of the cleaning head 100. The sprayed washing liquid is supplied to the entire upper surface of the washing part 320 through the notch 322 of the washing part 320. In addition, the washing liquid is supplied to the entire upper surface of the washing unit 220 through the groove 221 of the washing unit 220. Thereby, the substrate W can be cleaned more sufficiently.
[2]第2實施形態 (1)洗淨頭之構成 針對第2實施形態之洗淨頭100及基板洗淨裝置1,說明與第1實施形態之洗淨頭100及基板洗淨裝置1不同之方面。圖19係本發明之第2實施形態之洗淨頭100之仰視圖。如圖19所示,在本實施形態中,中心刷200之基台210具有圓柱形狀,在基台210未形成圖2之平坦部212、213。因而,基台210在水平面內具有圓形狀之剖面。[2] The second embodiment (1) The composition of the cleansing head With regard to the cleaning head 100 and the substrate cleaning device 1 of the second embodiment, the differences from the cleaning head 100 and the substrate cleaning device 1 of the first embodiment will be described. Fig. 19 is a bottom view of the washing head 100 according to the second embodiment of the present invention. As shown in FIG. 19, in this embodiment, the base 210 of the center brush 200 has a cylindrical shape, and the flat portions 212 and 213 of FIG. 2 are not formed on the base 210. Therefore, the base 210 has a circular cross-section in the horizontal plane.
外周刷300之基台310具有圓筒形狀。因而,在基台310之中央部形成在水平面內具有圓形狀且在上下方向延伸之開口部311。因而,在本實施形態中,在開口部311內之基台310之內面未形成圖4之平坦部312、313。藉由將中心刷200配置於外周刷300之開口部311、321內,而洗淨頭100完成。The base 310 of the peripheral brush 300 has a cylindrical shape. Therefore, an opening 311 having a circular shape in the horizontal plane and extending in the vertical direction is formed in the center of the base 310. Therefore, in this embodiment, the flat portions 312 and 313 of FIG. 4 are not formed on the inner surface of the base 310 in the opening portion 311. By arranging the center brush 200 in the openings 311 and 321 of the outer peripheral brush 300, the cleaning head 100 is completed.
與第1實施形態同樣地,中心刷200與外周刷300未被相互固定。因而,中心刷200與外周刷300可相互獨立地在上下方向移動。另一方面,由於基台210之外周面及基台310之內周面在水平面內具有圓形狀,故中心刷200與外周刷300相互獨立地旋轉不受限制。亦即,與第1實施形態不同,中心刷200與外周刷300可相互獨立地旋轉。As in the first embodiment, the center brush 200 and the outer peripheral brush 300 are not fixed to each other. Therefore, the center brush 200 and the outer peripheral brush 300 can move in the vertical direction independently of each other. On the other hand, since the outer peripheral surface of the base 210 and the inner peripheral surface of the base 310 have circular shapes in the horizontal plane, the central brush 200 and the outer peripheral brush 300 are not restricted from rotating independently of each other. That is, unlike the first embodiment, the center brush 200 and the outer peripheral brush 300 can rotate independently of each other.
此外,中心刷200之基台210在水平面內具有圓形狀之剖面,外周刷300之基台310之開口部311在水平面內具有圓形狀,但本發明並不限定於此。只要容許中心刷200與外周刷300之獨立之旋轉,則既可基台210在水平面內具有非圓形狀之剖面,也可基台310之開口部311在水平面內具有非圓形狀之剖面。In addition, the base 210 of the center brush 200 has a circular cross section in the horizontal plane, and the opening 311 of the base 310 of the outer peripheral brush 300 has a circular shape in the horizontal plane, but the present invention is not limited to this. As long as the central brush 200 and the outer peripheral brush 300 are allowed to rotate independently, the base 210 may have a non-circular cross-section in the horizontal plane, or the opening 311 of the base 310 may have a non-circular cross-section in the horizontal plane.
具體而言,只要在基台210旋轉時由基台210之外周部描繪之圓形之軌跡之直徑小於基台310之開口部311之最小之直徑(例如在橢圓之情形下為短徑)即可。因而,可在基台210形成與圖2之平坦部212、213同樣之平坦部。又,可在基台310形成橢圓柱狀或四角柱狀等之開口部311。Specifically, as long as the diameter of the circular track drawn by the outer circumference of the base 210 when the base 210 rotates is smaller than the smallest diameter of the opening 311 of the base 310 (for example, the short diameter in the case of an ellipse). can. Therefore, the same flat portions as the flat portions 212 and 213 in FIG. 2 can be formed on the base 210. In addition, an opening 311 having an elliptic column shape or a square column shape may be formed in the base 310.
(2)基板洗淨裝置之概略構成(2) Outline structure of substrate cleaning device
圖20係顯示包含圖19之洗淨頭100之基板洗淨裝置1之概略構成之圖。如圖20所示,本實施形態之基板洗淨裝置1更包含設置為可將外周刷300旋轉之旋轉部160。在本例中,旋轉部160包含:旋轉驅動裝置161、軸162、皮帶輪163及動力傳遞構件164。FIG. 20 is a diagram showing a schematic configuration of a substrate cleaning device 1 including the cleaning head 100 of FIG. 19. As shown in FIG. 20, the substrate cleaning apparatus 1 of this embodiment further includes a rotating part 160 provided to be able to rotate the outer peripheral brush 300. In this example, the rotation part 160 includes a rotation driving device 161, a shaft 162, a pulley 163, and a power transmission member 164.
旋轉驅動裝置161係例如電動馬達,具有旋轉軸。軸162具有圓筒形狀,且連接於外周刷300之基台310之下表面。皮帶輪163安裝於軸162之外周面。動力傳遞構件164係例如皮帶,架設於皮帶輪163及旋轉驅動裝置161之旋轉軸。The rotation driving device 161 is, for example, an electric motor, and has a rotating shaft. The shaft 162 has a cylindrical shape and is connected to the lower surface of the base 310 of the outer peripheral brush 300. The pulley 163 is mounted on the outer peripheral surface of the shaft 162. The power transmission member 164 is, for example, a belt, and is mounted on the pulley 163 and the rotation shaft of the rotation driving device 161.
藉由旋轉驅動裝置161之旋轉軸旋轉,而旋轉驅動力通過動力傳遞構件164及皮帶輪163對軸162賦予。藉此,外周刷300旋轉。根據該構成,可利用旋轉部110、160使中心刷200及外周刷300分別獨立地旋轉。As the rotation shaft of the rotation driving device 161 rotates, the rotation driving force is applied to the shaft 162 through the power transmission member 164 and the pulley 163. Thereby, the outer peripheral brush 300 rotates. According to this configuration, the center brush 200 and the outer peripheral brush 300 can be independently rotated by the rotating parts 110 and 160.
又,升降驅動裝置131藉由連結構件132而連結於旋轉驅動裝置161。升降驅動裝置131藉由使連結構件132升降,而使旋轉驅動裝置161、軸162、皮帶輪163及動力傳遞構件164一體地升降。根據該構成,可利用升降部120、130使中心刷200及外周刷300分別獨立地升降。此外,升降驅動裝置131與旋轉驅動裝置161可由單一之旋轉升降驅動裝置實現。在此情形下,在旋轉驅動裝置161與升降驅動裝置131之間未設置連結構件132。In addition, the lifting drive device 131 is connected to the rotation drive device 161 by the connecting member 132. The elevation drive device 131 raises and lowers the connection member 132 so that the rotation drive device 161, the shaft 162, the pulley 163, and the power transmission member 164 are raised and lowered integrally. According to this structure, the center brush 200 and the outer peripheral brush 300 can be independently raised and lowered by the elevating parts 120 and 130. In addition, the lifting driving device 131 and the rotating driving device 161 can be realized by a single rotating lifting driving device. In this case, the connecting member 132 is not provided between the rotation driving device 161 and the lifting driving device 131.
(3)效果 與第1實施形態同樣地,在中心刷200之洗淨部220及外周刷300之洗淨部320之任一者消耗時,無須更換洗淨頭100之整體,可僅更換消耗之刷。又,由於可任意地變更中心刷200與外周刷300之組合而構成洗淨頭100,故無須準備中心刷與外周刷之組合經固定之多種類之洗淨頭。其等之結果為,可抑制成本之增加且進行基板W之適切之洗淨。(3) Effect As in the first embodiment, when any one of the cleaning part 220 of the center brush 200 and the cleaning part 320 of the outer peripheral brush 300 is consumed, there is no need to replace the entire cleaning head 100, and only the consumed brush can be replaced. In addition, since the combination of the central brush 200 and the outer peripheral brush 300 can be arbitrarily changed to form the washing head 100, there is no need to prepare various washing heads in which the combination of the central brush and the outer peripheral brush is fixed. As a result, the increase in cost can be suppressed and the substrate W can be cleaned appropriately.
再者,在本實施形態中,中心刷200與外周刷300可繞平行於上下方向之軸相互獨立地旋轉。因而,可與基板W之洗淨部分或洗淨之種類相應地利用旋轉部110、160分別使中心刷200及外周刷300獨立地旋轉。藉此,可更高效率地將基板W洗淨。Furthermore, in this embodiment, the center brush 200 and the outer peripheral brush 300 can rotate independently of each other around an axis parallel to the vertical direction. Therefore, the central brush 200 and the outer peripheral brush 300 can be independently rotated by the rotating parts 110 and 160 according to the cleaning portion or the type of cleaning of the substrate W. Thereby, the substrate W can be cleaned more efficiently.
[3]第3實施形態 (1)基板洗淨裝置之構成 作為第3實施形態之基板洗淨裝置1,說明包含第1實施形態之洗淨頭100之基板洗淨裝置1之詳細的構成。本實施形態之基板洗淨裝置1設置於例如基板處理裝置。此外,本實施形態之基板洗淨裝置1可包含第2實施形態之洗淨頭100,而不包含第1實施形態之洗淨頭100。[3] The third embodiment (1) Composition of substrate cleaning device As the substrate cleaning device 1 of the third embodiment, a detailed configuration of the substrate cleaning device 1 including the cleaning head 100 of the first embodiment will be described. The substrate cleaning apparatus 1 of this embodiment is installed in, for example, a substrate processing apparatus. In addition, the substrate cleaning apparatus 1 of this embodiment may include the cleaning head 100 of the second embodiment instead of the cleaning head 100 of the first embodiment.
圖21係顯示第3實施形態之基板洗淨裝置1之構成之圖。如圖21所示,基板洗淨裝置1除洗淨頭100、旋轉部110、升降部120、130、洗淨部140及吸引部150以外,還具備頭驅動部170及旋轉保持裝置400。在圖21中,省略旋轉部110及升降部120、130之圖示。在基板洗淨裝置1包含第2實施形態之洗淨頭100之情形下,更具備旋轉部160。Fig. 21 is a diagram showing the structure of a substrate cleaning device 1 of the third embodiment. As shown in FIG. 21, the substrate cleaning apparatus 1 includes a head driving unit 170 and a rotation holding device 400 in addition to the cleaning head 100, the rotating unit 110, the lifting units 120, 130, the cleaning unit 140, and the suction unit 150. In FIG. 21, illustration of the rotating part 110 and the lifting parts 120 and 130 is omitted. When the substrate cleaning apparatus 1 includes the cleaning head 100 of the second embodiment, it is further provided with a rotating part 160.
旋轉保持裝置400包含:旋轉卡盤410、複數個卡盤銷420、切換部430、防濺罩裝置440及複數個交接裝置450。旋轉卡盤410構成為將基板W保持為水平且使其旋轉,包含:旋轉馬達411、旋轉軸412、旋轉板413及板支持構件414。The rotation holding device 400 includes a rotating chuck 410, a plurality of chuck pins 420, a switching part 430, a splash guard device 440, and a plurality of transfer devices 450. The spin chuck 410 is configured to hold and rotate the substrate W horizontally, and includes a rotation motor 411, a rotation shaft 412, a rotation plate 413, and a plate support member 414.
旋轉馬達411設置於基板洗淨裝置1之上部,由未圖示之支持構件支持。旋轉軸412設置為自旋轉馬達411朝下方延伸。板支持構件414安裝於旋轉軸412之下端部。旋轉板413具有圓板狀,且由板支持構件414支持為水平。旋轉軸412藉由旋轉馬達411旋轉,從而旋轉板413繞鉛直軸旋轉。The rotating motor 411 is installed on the upper part of the substrate cleaning device 1 and supported by a supporting member (not shown). The rotating shaft 412 is provided to extend downward from the rotating motor 411. The plate supporting member 414 is installed at the lower end of the rotating shaft 412. The rotating plate 413 has a circular plate shape and is supported horizontally by the plate supporting member 414. The rotating shaft 412 is rotated by the rotating motor 411, so that the rotating plate 413 rotates around a vertical axis.
複數個卡盤銷420相對於旋轉軸412以等角度間隔設置於旋轉板413之周緣部。在本例中,8個卡盤銷420相對於旋轉軸412以45度間隔設置於旋轉板413之周緣部。各卡盤銷420包含:軸部421、銷支持部422、保持部423及磁性體424。A plurality of chuck pins 420 are provided on the peripheral edge of the rotating plate 413 at equal angular intervals with respect to the rotating shaft 412. In this example, eight chuck pins 420 are provided on the peripheral edge of the rotating plate 413 with respect to the rotating shaft 412 at an interval of 45 degrees. Each chuck pin 420 includes a shaft portion 421, a pin support portion 422, a holding portion 423, and a magnetic body 424.
軸部421設置為在垂直方向貫通旋轉板413。銷支持部422設置為自軸部421之下端部在水平方向延伸。保持部423設置為自銷支持部422之前端部朝下方突出。又,在旋轉板413之上表面側,於軸部421之上端部安裝有磁性體424。The shaft portion 421 is provided to penetrate the rotating plate 413 in the vertical direction. The pin support portion 422 is provided to extend from the lower end of the shaft portion 421 in the horizontal direction. The holding portion 423 is provided to protrude downward from the front end of the pin support portion 422. In addition, a magnetic body 424 is attached to the upper end of the shaft portion 421 on the upper surface side of the rotating plate 413.
各卡盤銷420能以軸部421為中心繞鉛直軸旋轉,且可切換為保持部423抵接於基板W之外周端部之關閉狀態、與保持部423與基板W之外周端部分開之打開狀態。此外,在本例中,當磁性體424之N極位於內側時各卡盤銷420成為關閉狀態,當磁性體424之S極位於內側時各卡盤銷420成為打開狀態。又,在關閉狀態下,保持部423抵接於基板W之斜面部。Each chuck pin 420 can rotate around a vertical axis with the shaft portion 421 as the center, and can be switched to a closed state in which the holding portion 423 abuts against the outer peripheral end of the substrate W, and is separated from the holding portion 423 and the outer peripheral end of the substrate W Open state. In addition, in this example, when the N pole of the magnetic body 424 is on the inside, the chuck pins 420 are in the closed state, and when the S pole of the magnetic body 424 is on the inside, the chuck pins 420 are in the open state. In the closed state, the holding portion 423 abuts on the inclined surface of the substrate W.
切換部430包含磁性體板431、432及磁性體升降裝置433、434。磁性體板431、432沿以旋轉軸412為中心之周向配置於旋轉板413之上方。磁性體板431、432在外側具有S極,在內側具有N極。磁性體升降裝置433、434使磁性體板431、432分別升降。藉此,磁性體板431、432可在較卡盤銷420之磁性體424為高之上方位置和與卡盤銷420之磁性體424大致相等之高度之下方位置之間獨立地移動。The switching unit 430 includes magnetic plates 431 and 432 and magnetic lifting devices 433 and 434. The magnetic plates 431 and 432 are arranged above the rotating plate 413 in the circumferential direction centered on the rotating shaft 412. The magnetic plates 431 and 432 have S poles on the outside and N poles on the inside. The magnetic lifting devices 433 and 434 lift the magnetic plates 431 and 432 respectively. Thereby, the magnetic plates 431 and 432 can independently move between an upper position higher than the magnetic body 424 of the chuck pin 420 and a lower position substantially equal to the height of the magnetic body 424 of the chuck pin 420.
藉由磁性體板431、432之升降,而將各卡盤銷420切換於打開狀態與關閉狀態。針對磁性體板431、432及卡盤銷420之動作之細節於後文敘述。By the lifting of the magnetic plates 431 and 432, each chuck pin 420 is switched between the open state and the closed state. The details of the actions of the magnetic plates 431 and 432 and the chuck pin 420 will be described later.
防濺罩裝置440包含防濺罩441及防濺罩升降裝置442。防濺罩441相對於旋轉卡盤410之旋轉軸412具有旋轉對稱之形狀,設置於旋轉卡盤410之外方。防濺罩升降裝置442使防濺罩441升降。防濺罩441承接自基板W飛散之洗淨液。由防濺罩441承接之洗淨液藉由未圖示之排液裝置或回收裝置而被排液或回收。The splash guard device 440 includes a splash guard 441 and a splash guard lifting device 442. The splash guard 441 has a rotationally symmetrical shape with respect to the rotating shaft 412 of the rotating chuck 410 and is disposed outside the rotating chuck 410. The splash guard lifting device 442 lifts the splash guard 441 up and down. The splash guard 441 receives the washing liquid scattered from the substrate W. The washing liquid received by the splash guard 441 is drained or recovered by a drain device or a recovery device not shown.
複數個(在本例中為3個)交接裝置450以旋轉卡盤410之旋轉軸412為中心以等角度間隔配置於防濺罩441之外方。各交接裝置450包含升降旋轉驅動部451、旋轉軸452、臂453及保持銷454。A plurality of (three in this example) transfer devices 450 are arranged outside the splash guard 441 at equal angular intervals around the rotating shaft 412 of the spin chuck 410. Each transfer device 450 includes an up-and-down rotation drive unit 451, a rotation shaft 452, an arm 453, and a holding pin 454.
旋轉軸452設置為自升降旋轉驅動部451朝上方延伸。臂453設置為自旋轉軸452之上端部在水平方向延伸。保持銷454以可保持基板W之外周端部之方式設置於臂453之前端部。藉由升降旋轉驅動部451,而旋轉軸452進行升降動作及旋轉動作。藉此,保持銷454在水平方向及上下方向移動。The rotating shaft 452 is provided to extend upward from the lifting and rotating drive part 451. The arm 453 is provided to extend from the upper end of the rotating shaft 452 in the horizontal direction. The holding pin 454 is provided at the front end of the arm 453 in such a way that the outer peripheral end of the substrate W can be held. With the up-and-down rotation driving part 451, the rotating shaft 452 performs an up-and-down operation and a rotation operation. Thereby, the holding pin 454 moves in the horizontal direction and the vertical direction.
頭驅動部170包含頭移動裝置171及頭保持構件172,配置於基板洗淨裝置1之下部。洗淨頭100、旋轉部110(圖11)、升降部120、130(圖11)及噴嘴142安裝於頭保持構件172。頭移動裝置171藉由使頭保持構件172移動,而使洗淨頭100沿由旋轉保持裝置400之旋轉卡盤410保持之基板W之背面移動。藉此,將基板W之背面洗淨。The head driving unit 170 includes a head moving device 171 and a head holding member 172 and is arranged at the lower part of the substrate cleaning device 1. The washing head 100, the rotating part 110 (FIG. 11 ), the lifting parts 120 and 130 (FIG. 11 ), and the nozzle 142 are attached to the head holding member 172. The head moving device 171 moves the head holding member 172 to move the washing head 100 along the back surface of the substrate W held by the spin chuck 410 of the rotating holding device 400. Thereby, the back surface of the substrate W is cleaned.
(2)基板洗淨裝置之動作 圖22~圖25係用於說明旋轉卡盤410對基板W之保持動作之圖。首先,如圖22所示,防濺罩441移動至較卡盤銷420為低之位置。而後,複數個交接裝置450(圖21)之保持銷454通過防濺罩441之上方朝旋轉板413之下方移動。朝複數個保持銷454上搬入基板W。(2) Action of substrate cleaning device 22-25 are diagrams for explaining the holding operation of the substrate W by the spin chuck 410. First, as shown in FIG. 22, the splash guard 441 is moved to a position lower than the chuck pin 420. Then, the holding pins 454 of the plurality of transfer devices 450 (FIG. 21) move above the splash guard 441 toward the bottom of the rotating plate 413. The substrate W is loaded onto the plurality of holding pins 454.
此時,磁性體板431、432位於上方位置。在此情形下,磁性體板431、432之磁力線B在卡盤銷420之磁性體424之高度處自內側朝向外側。藉此,各卡盤銷420之磁性體424之S極被吸引至內側。因而,各卡盤銷420成為打開狀態。其次,如圖23所示,複數個保持銷454在保持著基板W之狀態下上升。藉此,基板W移動至複數個卡盤銷420之保持部423間。At this time, the magnetic plates 431 and 432 are located in the upper position. In this case, the lines of magnetic force B of the magnetic plates 431 and 432 are from the inner side to the outer side at the height of the magnetic body 424 of the chuck pin 420. Thereby, the S pole of the magnetic body 424 of each chuck pin 420 is attracted to the inside. Therefore, each chuck pin 420 becomes an open state. Next, as shown in FIG. 23, the plurality of holding pins 454 rise while holding the substrate W. Thereby, the substrate W moves between the holding portions 423 of the plurality of chuck pins 420.
繼而,如圖24所示,磁性體板431、432移動至下方位置。在此情形下,各卡盤銷420之磁性體424之N極被吸引至內側,各卡盤銷420成為關閉狀態。藉此,由各卡盤銷420之保持部423保持基板W之斜面部。之後,複數個保持銷454朝防濺罩441之外方移動。其次,如圖25所示,防濺罩441移動至包圍由卡盤銷420保持之基板W之高度。在此狀態下,進行基板W之背面之洗淨。Then, as shown in FIG. 24, the magnetic plates 431 and 432 move to the downward position. In this case, the N pole of the magnetic body 424 of each chuck pin 420 is attracted to the inside, and each chuck pin 420 is in a closed state. Thereby, the inclined portion of the substrate W is held by the holding portion 423 of each chuck pin 420. After that, the plurality of holding pins 454 move toward the outside of the splash guard 441. Next, as shown in FIG. 25, the splash guard 441 is moved to a height surrounding the substrate W held by the chuck pin 420. In this state, the back surface of the substrate W is cleaned.
圖26~圖28係用於說明洗淨頭100對基板W之洗淨之圖。如圖26所示,將基板W在由旋轉保持裝置400保持之狀態下旋轉。又,如以一點鏈線所示般,頭移動裝置171以洗淨頭100與基板W之大致中心重合之方式使頭保持構件172移動。此處,藉由圖11之旋轉部110、升降部120、130、洗淨部140及吸引部150動作,而洗淨頭100之上表面與基板W之背面之中心附近接觸。藉此,將基板W之背面之中心附近洗淨。FIGS. 26-28 are diagrams for explaining the cleaning of the substrate W by the cleaning head 100. FIG. As shown in FIG. 26, the substrate W is rotated while being held by the rotation holding device 400. In addition, as shown by a dotted chain line, the head moving device 171 moves the head holding member 172 so that the cleaning head 100 and the substrate W substantially coincide with the center. Here, the upper surface of the washing head 100 is in contact with the vicinity of the center of the back surface of the substrate W by the operation of the rotating part 110, the lifting parts 120, 130, the washing part 140, and the suction part 150 in FIG. Thereby, the vicinity of the center of the back surface of the substrate W is cleaned.
之後,在洗淨頭100與基板W之背面接觸之狀態下,如圖26中以粗箭頭所示般,頭移動裝置171以洗淨頭100朝向基板W之周緣部之方式以中心軸173為基準使刷頭保持構件172逐漸旋轉。藉此,將基板W之背面之整體洗淨,且將基板W之斜面部洗淨。After that, in a state where the cleaning head 100 is in contact with the back surface of the substrate W, as shown by the thick arrow in FIG. 26, the head moving device 171 uses the central axis 173 as the cleaning head 100 toward the periphery of the substrate W. The reference causes the head holding member 172 to gradually rotate. Thereby, the entire back surface of the substrate W is cleaned, and the inclined surface of the substrate W is cleaned.
如圖27所示,在基板W之斜面部之洗淨時,磁性體板431配置於下方位置,磁性體板432配置於上方位置。在此情形下,如圖28所示,在磁性體板431之外方區域R1中各卡盤銷420成為關閉狀態,在磁性體板432之外方區域R2中各卡盤銷420成為打開狀態。As shown in FIG. 27, when washing the inclined surface of the substrate W, the magnetic plate 431 is arranged at the lower position, and the magnetic plate 432 is arranged at the upper position. In this case, as shown in FIG. 28, each chuck pin 420 is in a closed state in the outer region R1 of the magnetic plate 431, and each chuck pin 420 is in an open state in the outer region R2 of the magnetic plate 432 .
根據該構成,各卡盤銷420之保持部423在通過磁性體板431之外方區域R1時維持為與基板W之外周端部接觸之狀態,在通過磁性體板432之外方區域R2時與基板W之外周端部分開。藉此,洗淨頭100可在與卡盤銷420不干擾下高效率且充分地將基板W之斜面部洗淨。According to this configuration, the holding portion 423 of each chuck pin 420 is maintained in contact with the outer peripheral end of the substrate W when passing through the outer region R1 of the magnetic plate 431, and when passing through the outer region R2 of the magnetic plate 432 Partly separated from the outer peripheral end of the substrate W. Thereby, the cleaning head 100 can efficiently and fully clean the inclined surface of the substrate W without interfering with the chuck pin 420.
在本例中,8個卡盤銷420中之至少7個卡盤銷420位於磁性體板431之外方區域R1。在此情形下,由至少7個卡盤銷420保持基板W。因而,確保基板W之穩定性。In this example, at least seven of the eight chuck pins 420 are located in the outer region R1 of the magnetic plate 431. In this case, the substrate W is held by at least seven chuck pins 420. Therefore, the stability of the substrate W is ensured.
在基板W之洗淨結束後,頭移動裝置171以洗淨頭100位於基板W之外方之方式使頭保持構件172移動。又,磁性體板431、432配置於下方位置,由所有卡盤銷420保持基板W。在此狀態下,藉由旋轉卡盤410而基板W以高速旋轉。藉此,將附著於基板W之洗淨液甩開,而基板W乾燥。在基板W乾燥後,停止基板W之旋轉。After the cleaning of the substrate W is completed, the head moving device 171 moves the head holding member 172 such that the cleaning head 100 is located outside the substrate W. In addition, the magnetic plates 431 and 432 are arranged at the lower position, and the substrate W is held by all the chuck pins 420. In this state, the substrate W is rotated at a high speed by the spin chuck 410. Thereby, the cleaning solution adhering to the substrate W is thrown away, and the substrate W is dried. After the substrate W is dried, the rotation of the substrate W is stopped.
[4]第4實施形態 (1)基板洗淨裝置之構成 針對第4實施形態之基板洗淨裝置1,說明與第3實施形態之基板洗淨裝置1不同之方面。圖29係顯示第4實施形態之基板洗淨裝置1之構成之圖。如圖29所示,基板洗淨裝置1具備:複數個(在本例中為3個)洗淨頭100、頭驅動部170、180及旋轉保持裝置400。在以下之說明中,於對3個洗淨頭100予以區別之情形下,將3個洗淨頭100分別稱為洗淨頭100A、100B、100C。[4] Fourth Embodiment (1) Composition of substrate cleaning device Regarding the substrate cleaning apparatus 1 of the fourth embodiment, the differences from the substrate cleaning apparatus 1 of the third embodiment will be described. FIG. 29 is a diagram showing the structure of a substrate cleaning device 1 of the fourth embodiment. As shown in FIG. 29, the substrate cleaning device 1 includes a plurality of (three in this example) cleaning heads 100, head driving units 170 and 180, and a rotation holding device 400. In the following description, in the case where three washing heads 100 are distinguished, the three washing heads 100 are referred to as washing heads 100A, 100B, and 100C, respectively.
又,基板洗淨裝置1具備與洗淨頭100A~100C各者對應之旋轉部110、升降部120、130、洗淨部140及吸引部150。在圖29中,省略旋轉部110、升降部120、130、洗淨部140及吸引部150之圖示。在洗淨頭100A~100C之任一者為第2實施形態之洗淨頭100之情形下,基板洗淨裝置1更具備與該洗淨頭100對應之旋轉部160。In addition, the substrate cleaning device 1 includes a rotating part 110, lifting parts 120 and 130, a cleaning part 140, and a suction part 150 corresponding to each of the cleaning heads 100A to 100C. In FIG. 29, illustration of the rotating part 110, the lifting parts 120, 130, the washing part 140, and the suction part 150 are omitted. When any one of the cleaning heads 100A to 100C is the cleaning head 100 of the second embodiment, the substrate cleaning device 1 further includes a rotating part 160 corresponding to the cleaning head 100.
本實施形態之旋轉保持裝置400除以下之方面,具有與第3實施形態之圖21之旋轉保持裝置400同樣之構成。旋轉保持裝置400更包含位於旋轉卡盤410之下方之旋轉卡盤460。又,旋轉保持裝置400包含交接裝置470而取代交接裝置450。再者,本實施形態之旋轉卡盤410不包含圖21之磁性體板432及磁性體升降裝置434。The rotation holding device 400 of this embodiment has the same structure as the rotation holding device 400 of FIG. 21 of the third embodiment except for the following points. The rotation holding device 400 further includes a spin chuck 460 located below the spin chuck 410. In addition, the rotation holding device 400 includes a transfer device 470 instead of the transfer device 450. Furthermore, the spin chuck 410 of this embodiment does not include the magnetic plate 432 and the magnetic lifting device 434 of FIG. 21.
旋轉卡盤460包含旋轉馬達461及吸附保持部463。旋轉馬達461設置於例如基板洗淨裝置1之底部。在旋轉馬達461中,以朝向上方延伸之方式設置旋轉軸462。在旋轉軸462之上端部設置吸附保持部463。吸附保持部463構成為可吸附基板W之背面中央部。藉由吸附保持部463吸附基板W之背面中央部,而保持基板W。又,藉由旋轉馬達461使旋轉軸462旋轉,而由吸附保持部463保持之基板W旋轉。The spin chuck 460 includes a spin motor 461 and a suction holding portion 463. The rotation motor 461 is installed at the bottom of the substrate cleaning device 1, for example. In the rotating motor 461, a rotating shaft 462 is provided so as to extend upward. A suction holding portion 463 is provided at the upper end of the rotating shaft 462. The suction holding portion 463 is configured to be able to suck the center portion of the back surface of the substrate W. The substrate W is held by the suction holding portion 463 by sucking the center portion of the back surface of the substrate W. In addition, by rotating the rotating shaft 462 by the rotating motor 461, the substrate W held by the suction holding portion 463 rotates.
交接裝置470包含升降驅動部471、銷支持構件472及複數個(在本例中為3個)升降銷473,且配置為接近旋轉卡盤460。升降驅動部471對銷支持構件472以可在鉛直方向移動之方式予以支持。複數個升降銷473以等間隔以包圍旋轉卡盤460且在鉛直方向延伸之方式安裝於銷支持構件472。藉由複數個升降銷473之上端部抵接於基板W之背面中央部與背面周緣部之間之區域,而基板W以水平姿勢受支持。The transfer device 470 includes a lift driving part 471, a pin support member 472, and a plurality of (three in this example) lift pins 473, and is arranged close to the spin chuck 460. The lift drive part 471 supports the pin support member 472 so that it can move in a vertical direction. The plurality of lift pins 473 are attached to the pin support member 472 so as to surround the spin chuck 460 at equal intervals and extend in the vertical direction. The upper end portions of the plurality of lift pins 473 abut against the area between the center portion of the back surface and the peripheral edge portion of the back surface of the substrate W, and the substrate W is supported in a horizontal posture.
藉由升降驅動部471驅動,而複數個升降銷473之上端部在第1高度H1、第2高度H2、及第3高度H3之間移動。此處,如圖29中以兩點鏈線所示般,第1高度H1位於較旋轉卡盤460之上端部以一定距離靠下方。第2高度H2位於旋轉卡盤460之上端部與各卡盤銷420之下端部之間。第3高度H3位於較各卡盤銷420之下端部略微靠上方。Driven by the lift drive portion 471, the upper ends of the plurality of lift pins 473 move between the first height H1, the second height H2, and the third height H3. Here, as shown by a two-dot chain line in FIG. 29, the first height H1 is located below the upper end of the spin chuck 460 by a certain distance. The second height H2 is located between the upper end of the spin chuck 460 and the lower end of each chuck pin 420. The third height H3 is located slightly above the lower end of each chuck pin 420.
本實施形態之頭驅動部170具有與第3實施形態之圖21之頭驅動部170同樣之構成,配置於旋轉卡盤460之上方。在頭驅動部170之頭保持構件172,以洗淨頭100A之上表面朝向下方之狀態安裝洗淨頭100A,以便可由旋轉卡盤460保持之基板W之表面洗淨。又,在頭保持構件172安裝與洗淨頭100A對應之旋轉部110(圖11)、升降部120、130(圖11)及噴嘴142(圖11)。The head driving unit 170 of this embodiment has the same structure as the head driving unit 170 of FIG. 21 in the third embodiment, and is arranged above the spin chuck 460. In the head holding member 172 of the head driving unit 170, the cleaning head 100A is mounted with the upper surface of the cleaning head 100A facing downward, so that the surface of the substrate W held by the spin chuck 460 can be cleaned. In addition, the rotating part 110 (FIG. 11 ), the lifting parts 120 and 130 (FIG. 11) and the nozzle 142 (FIG. 11) corresponding to the washing head 100A are attached to the head holding member 172.
頭驅動部180包含頭移動裝置181及頭保持構件182,配置於基板洗淨裝置1之下部。頭驅動部180除頭移動裝置181使頭保持構件182不僅旋轉也可在上下方向移動之方面以外,具有與頭驅動部170同樣之構成。在頭保持構件182以洗淨頭100B之上表面朝向上方之狀態安裝洗淨頭100B,以便可將由旋轉卡盤410保持之基板W之背面洗淨。又,在頭保持構件182安裝有與洗淨頭100B對應之旋轉部110、升降部120、130及噴嘴142。The head driving unit 180 includes a head moving device 181 and a head holding member 182 and is arranged under the substrate cleaning device 1. The head driving unit 180 has the same configuration as the head driving unit 170 except that the head moving device 181 not only rotates the head holding member 182 but also moves in the vertical direction. The cleaning head 100B is mounted on the head holding member 182 with the upper surface of the cleaning head 100B facing upward so that the back surface of the substrate W held by the spin chuck 410 can be cleaned. In addition, the head holding member 182 is equipped with the rotating part 110, the lifting parts 120 and 130, and the nozzle 142 corresponding to the washing head 100B.
又,在基板洗淨裝置1之底部安裝由旋轉卡盤460保持之基板W之外周緣部、及以與外周端部在上下方向重合之方式設置之頭載置部2。在頭載置部2以洗淨頭100C之上表面朝向上方之狀態載置洗淨頭100C,以便可將由旋轉卡盤460保持之基板W之背面側之斜面部洗淨。又,在頭載置部2載置與洗淨頭100C對應之旋轉部110、升降部120、130及噴嘴142。如圖29中以一點鏈線所示般,洗淨頭100C藉由升降部120、130可自頭載置部2朝上方移動。In addition, the outer peripheral edge portion of the substrate W held by the spin chuck 460 and the head mounting portion 2 provided so as to overlap the outer peripheral end portion in the vertical direction are attached to the bottom of the substrate cleaning device 1. The cleaning head 100C is placed on the head placement portion 2 with the top surface of the cleaning head 100C facing upwards so that the slope on the back side of the substrate W held by the spin chuck 460 can be cleaned. In addition, the rotating part 110, the elevating parts 120 and 130, and the nozzle 142 corresponding to the washing head 100C are placed on the head placing part 2. As shown by a dotted chain line in FIG. 29, the washing head 100C can be moved upward from the head placement part 2 by the lifting parts 120 and 130.
(2)基板洗淨裝置之動作 在朝基板洗淨裝置1搬入基板W時,複數個升降銷473移動至上方,複數個升降銷473之上端部保持於第2高度H2。在此狀態下,在複數個升降銷473上載置基板W。其次,複數個升降銷473移動至下方,複數個升降銷473之上端部保持於第1高度H1。藉此,基板W自複數個升降銷473傳遞至吸附保持部463上。此時,基板W之中心以在水平面內與吸附保持部463之旋轉中心一致之方式定位。之後,基板W之背面中央部由旋轉卡盤460保持,且將基板W旋轉。(2) Action of substrate cleaning device When the substrate W is loaded into the substrate cleaning apparatus 1, the plurality of lift pins 473 move upward, and the upper ends of the plurality of lift pins 473 are held at the second height H2. In this state, the substrate W is placed on the plurality of lift pins 473. Next, the plurality of lift pins 473 move downward, and the upper ends of the plurality of lift pins 473 are maintained at the first height H1. Thereby, the substrate W is transferred from the plurality of lift pins 473 to the suction holding portion 463. At this time, the center of the substrate W is positioned to coincide with the rotation center of the adsorption holding portion 463 in the horizontal plane. After that, the center of the back surface of the substrate W is held by the spin chuck 460, and the substrate W is rotated.
其次,頭移動裝置171以洗淨頭100A與基板W之大致中心重合之方式使頭保持構件172移動。此處,藉由與洗淨頭100A對應之旋轉部110、升降部120、130、洗淨部140及吸引部150動作,而洗淨頭100A之上表面與基板W之表面之中心附近接觸。藉此,將基板W之表面之中心附近洗淨。Next, the head moving device 171 moves the head holding member 172 so that the substantially center of the cleaning head 100A and the substrate W coincide. Here, the upper surface of the cleaning head 100A is in contact with the center of the surface of the substrate W by the operation of the rotating part 110, the lifting parts 120, 130, the cleaning part 140, and the suction part 150 corresponding to the cleaning head 100A. Thereby, the vicinity of the center of the surface of the substrate W is cleaned.
之後,在洗淨頭100A與基板W之表面接觸之狀態下,頭移動裝置171以洗淨頭100A朝向基板W之周緣部之方式使刷頭保持構件172逐漸旋轉。藉此,將基板W之表面之整體洗淨,且將基板W之表面側之斜面部洗淨。After that, in a state where the cleaning head 100A is in contact with the surface of the substrate W, the head moving device 171 gradually rotates the brush head holding member 172 such that the cleaning head 100A faces the periphery of the substrate W. Thereby, the entire surface of the substrate W is cleaned, and the inclined surface portion on the surface side of the substrate W is cleaned.
此外,於在上述之基板W之表面之洗淨中,在基板W之表面形成抗蝕劑膜等之處理膜之情形下,洗淨頭100A由擦洗洗淨用之中心刷200及擦洗洗淨用之外周刷300構成。另一方面,於在基板W之表面未形成處理膜之情形下,亦即在基板W為裸基板之情形下,洗淨頭100A可由研磨洗淨用之中心刷200及擦洗洗淨用之外周刷300構成。In addition, in the above-mentioned cleaning of the surface of the substrate W, in the case where a resist film or the like is formed on the surface of the substrate W, the cleaning head 100A is cleaned by the center brush 200 for scrubbing cleaning and scrubbing cleaning. It is composed of an outer peripheral brush 300. On the other hand, in the case where no treatment film is formed on the surface of the substrate W, that is, when the substrate W is a bare substrate, the cleaning head 100A can be used for polishing and cleaning the center brush 200 and scrubbing and cleaning the outer periphery The brush 300 constitutes.
藉由與上述之基板W之表面之洗淨並行地,與洗淨頭100C對應之旋轉部110、升降部120、130、洗淨部140及吸引部150動作,而洗淨頭100C之上表面與基板W之背面側之斜面部接觸。藉此,將基板W之背面側之斜面部洗淨。Parallel to the above-mentioned cleaning of the surface of the substrate W, the rotating part 110, the lifting parts 120, 130, the cleaning part 140 and the suction part 150 corresponding to the cleaning head 100C operate, and the upper surface of the cleaning head 100C It is in contact with the inclined surface of the back side of the substrate W. Thereby, the inclined surface on the back side of the substrate W is washed.
在洗淨頭100A、100C對基板W之洗淨後,頭保持構件172及洗淨頭100C返回初始位置,藉由旋轉卡盤460而基板W以高速旋轉。藉此,將附著於基板W之洗淨液甩開,而基板W乾燥。在基板W乾燥後,停止基板W之旋轉,且停止旋轉卡盤460對基板W之吸附。After the substrate W is cleaned by the cleaning heads 100A and 100C, the head holding member 172 and the cleaning head 100C return to the initial positions, and the substrate W is rotated at a high speed by the spin chuck 460. Thereby, the cleaning solution adhering to the substrate W is thrown away, and the substrate W is dried. After the substrate W is dried, the rotation of the substrate W is stopped, and the suction of the substrate W by the spin chuck 460 is stopped.
其次,在藉由將複數個升降銷473移動至上方,而將基板W自旋轉卡盤460之吸附保持部463傳遞至複數個升降銷473上後,將複數個升降銷473之上端部保持於第3高度H3。此時,基板W位於旋轉卡盤410之複數個卡盤銷420之保持部423之間。Next, after the substrate W is transferred from the suction and holding portion 463 of the spin chuck 460 to the plurality of lift pins 473 by moving the plurality of lift pins 473 upward, the upper ends of the plurality of lift pins 473 are held at The third height H3. At this time, the substrate W is located between the holding portions 423 of the plurality of chuck pins 420 of the spin chuck 410.
繼而,切換部430之磁性體板431移動至下方位置。在此情形下,複數個卡盤銷420之磁性體424之N極被吸引至內側。藉此,各卡盤銷420成為關閉狀態,各保持部423抵接於基板W之外周端部。藉此,由複數個卡盤銷420之保持部423保持基板W之外周端部。之後,藉由複數個升降銷473移動至下方,而將複數個升降銷473之上端部保持於第1高度H1。又,藉由防濺罩441移動至上方,而包圍由旋轉卡盤410保持之基板W。在此狀態下,將基板W旋轉。Then, the magnetic plate 431 of the switching part 430 moves to the lower position. In this case, the N poles of the magnetic bodies 424 of the plurality of chuck pins 420 are attracted to the inside. Thereby, each chuck pin 420 is in a closed state, and each holding portion 423 abuts against the outer peripheral end portion of the substrate W. Thereby, the outer peripheral end portion of the substrate W is held by the holding portions 423 of the plurality of chuck pins 420. After that, by moving the plurality of lifting pins 473 downward, the upper ends of the plurality of lifting pins 473 are held at the first height H1. In addition, by moving the splash guard 441 upward, it surrounds the substrate W held by the spin chuck 410. In this state, the substrate W is rotated.
其次,頭移動裝置181使頭保持構件182上升,且以洗淨頭100B與基板W之大致中心重合之方式使頭保持構件182移動。此處,藉由與洗淨頭100B對應之旋轉部110、升降部120、130、洗淨部140及吸引部150動作,而洗淨頭100B之上表面與基板W之背面之中心附近接觸。之後,在洗淨頭100B與基板W之背面接觸之狀態下,頭移動裝置181以洗淨頭100B朝向基板W之周緣部之附近之方式使刷頭保持構件182逐漸旋轉。藉此,將基板W之背面之整體洗淨。Next, the head moving device 181 raises the head holding member 182, and moves the head holding member 182 so that the substantially center of the washing head 100B and the substrate W coincide. Here, the upper surface of the washing head 100B is in contact with the vicinity of the center of the back surface of the substrate W by the operation of the rotating part 110, the lifting parts 120, 130, the washing part 140, and the suction part 150 corresponding to the washing head 100B. Thereafter, in a state where the cleaning head 100B is in contact with the back surface of the substrate W, the head moving device 181 gradually rotates the brush head holding member 182 so that the cleaning head 100B faces the vicinity of the periphery of the substrate W. Thereby, the entire back surface of the substrate W is cleaned.
在洗淨頭100B對基板W之洗淨後,將頭保持構件182返回初始位置,藉由旋轉卡盤410而基板W以高速旋轉。藉此,將附著於基板W之洗淨液甩開,而基板W乾燥。在基板W乾燥後,將基板W之旋轉停止。After the substrate W is cleaned by the cleaning head 100B, the head holding member 182 is returned to the initial position, and the substrate W is rotated at a high speed by the spin chuck 410. Thereby, the cleaning solution adhering to the substrate W is thrown away, and the substrate W is dried. After the substrate W is dried, the rotation of the substrate W is stopped.
洗淨頭100B不用於基板W之背面側之斜面部之洗淨。因而,洗淨頭100B之外周刷300之上表面可不形成為錐形狀。又,在僅進行研磨洗淨之情形下,洗淨頭100B可由研磨洗淨用之中心刷200及研磨洗淨用之外周刷300構成。或,洗淨頭100B可由擦洗洗淨用之中心刷200及研磨洗淨用之外周刷300構成。The cleaning head 100B is not used for cleaning the inclined surface of the back side of the substrate W. Therefore, the upper surface of the outer peripheral brush 300 of the washing head 100B may not be formed in a tapered shape. In addition, in the case of performing only abrasive cleaning, the cleaning head 100B may be composed of a center brush 200 for abrasive cleaning and an outer peripheral brush 300 for abrasive cleaning. Alternatively, the cleaning head 100B may be composed of a center brush 200 for scrubbing cleaning and an outer peripheral brush 300 for abrasive cleaning.
如上述般,由於旋轉卡盤410不包含磁性體板432及磁性體升降裝置434,故在基板W之洗淨中,全部之卡盤銷420成為關閉狀態。在此情形下亦然,由於洗淨頭100B不用於基板W之背面側之斜面部之洗淨,故洗淨頭100B可在與卡盤銷420不干涉下高效率且充分將基板W之背面整體洗淨。As described above, since the spin chuck 410 does not include the magnetic plate 432 and the magnetic lifting device 434, all the chuck pins 420 are closed during the cleaning of the substrate W. In this case as well, since the cleaning head 100B is not used for cleaning the inclined surface of the back side of the substrate W, the cleaning head 100B can efficiently and fully clean the back surface of the substrate W without interfering with the chuck pin 420 Wash whole.
另一方面,與第3實施形態同樣地,旋轉卡盤410可包含磁性體板432及磁性體升降裝置434。在此情形下,洗淨頭100B可在與卡盤銷420不干涉下進一步進行基板W之背面側之斜面部之洗淨。因而,在基板W由旋轉卡盤460保持時可不進行基板W之背面側之斜面部之洗淨。因而,基板洗淨裝置1可不具備洗淨頭100C以及與其對應之旋轉部110、升降部120、130、洗淨部140及吸引部150。On the other hand, similar to the third embodiment, the spin chuck 410 may include a magnetic plate 432 and a magnetic lifting device 434. In this case, the cleaning head 100B can further clean the inclined surface of the back side of the substrate W without interfering with the chuck pin 420. Therefore, when the substrate W is held by the spin chuck 460, the slant portion on the back side of the substrate W may not be cleaned. Therefore, the substrate cleaning apparatus 1 may not include the cleaning head 100C and the rotating part 110, the lifting parts 120 and 130, the cleaning part 140, and the suction part 150 corresponding thereto.
[5]其他之實施形態 (1)在上述實施形態中,於基板W之洗淨中將基板W旋轉,但本發明並不限定於此。可在基板W之洗淨中不將基板W旋轉。[5] Other implementation forms (1) In the above embodiment, the substrate W is rotated during the cleaning of the substrate W, but the present invention is not limited to this. The substrate W may not be rotated during the cleaning of the substrate W.
(2)在上述實施形態中,藉由升降部120、130而將洗淨頭100相對於基板W在上下方向移動,但本發明並不限定於此。可藉由旋轉卡盤410、460等之基板保持部而將基板W相對於洗淨頭100在上下方向移動。在此情形下,洗淨頭100可不在上下方向移動。(2) In the above-mentioned embodiment, the cleaning head 100 is moved in the vertical direction with respect to the substrate W by the lifters 120 and 130, but the present invention is not limited to this. The substrate W can be moved in the vertical direction with respect to the cleaning head 100 by the substrate holding portion of the spin chuck 410, 460, etc. In this case, the washing head 100 may not move up and down.
(3)在上述實施形態中,在利用洗淨頭100將基板W之被洗淨面之中央附近洗淨後,將基板W之斜面部洗淨,但本發明並不限定於此。例如,既可利用洗淨頭100僅將基板W之被洗淨面之中央附近洗淨,也可僅將基板W之斜面部洗淨。又,在不將基板旋轉之情形下,可在利用洗淨頭100將基板W之斜面部洗淨後,將基板W之被洗淨面之中央附近洗淨。被洗淨面既可為基板W之背面,也可為表面,還可為背面及表面之兩者。(3) In the above embodiment, after the cleaning head 100 cleans the vicinity of the center of the cleaned surface of the substrate W, the inclined surface of the substrate W is cleaned, but the present invention is not limited to this. For example, the cleaning head 100 may be used to clean only the vicinity of the center of the cleaned surface of the substrate W, or only the inclined surface of the substrate W may be cleaned. In addition, without rotating the substrate, after the inclined surface of the substrate W is cleaned by the cleaning head 100, the vicinity of the center of the cleaned surface of the substrate W can be cleaned. The surface to be cleaned may be the back surface of the substrate W, the surface, or both the back surface and the surface.
此外,在第4實施形態中,在進行基板W之表面之洗淨,不進行基板W之背面之洗淨之情形下,基板洗淨裝置1只要具備洗淨頭100A、100C既可,可不具備洗淨頭100B及與其對應之旋轉部110、升降部120、130、洗淨部140及吸引部150。又,旋轉保持裝置400可不包含用於基板W之背面之洗淨之旋轉卡盤410、卡盤銷420及切換部430。In addition, in the fourth embodiment, in the case where the surface of the substrate W is cleaned, but the back surface of the substrate W is not cleaned, the substrate cleaning device 1 may be equipped with cleaning heads 100A and 100C, or not. The washing head 100B and the rotating part 110, the lifting parts 120 and 130, the washing part 140 and the suction part 150 corresponding thereto. In addition, the rotation holding device 400 may not include the spin chuck 410, the chuck pin 420, and the switching part 430 for cleaning the back surface of the substrate W.
[6]申請專利範圍之各構成要素與實施形態之各部之對應關係 在上述實施形態中,基板W為基板之例,洗淨頭100為洗淨頭之例,基台210、310分別為第1及第2基台之例。洗淨部220、320分別為第1及第2洗淨部之例,中心刷200為中心刷之例,外周刷300為外周刷之例,開口部311為開口部之例。[6] Correspondence between each component of the scope of patent application and each part of the implementation form In the above embodiment, the substrate W is an example of a substrate, the cleaning head 100 is an example of a cleaning head, and the bases 210 and 310 are examples of the first and second bases, respectively. The washing parts 220 and 320 are examples of the first and second washing parts, respectively, the center brush 200 is an example of a center brush, the outer peripheral brush 300 is an example of an outer peripheral brush, and the opening 311 is an example of an opening.
槽部221為槽部之例,錐形面323及平坦面324為第2洗淨面之例,平坦面324為平坦面之例,錐形面323為錐形面之例,間隙101為間隙之例。旋轉卡盤410、460為基板保持部之例,升降部120、130分別為第1及第2驅動裝置之例,基板洗淨裝置1為基板洗淨裝置之例。The groove portion 221 is an example of a groove portion, the tapered surface 323 and the flat surface 324 are examples of the second washing surface, the flat surface 324 is an example of a flat surface, the tapered surface 323 is an example of a tapered surface, and the gap 101 is a gap的例。 Examples. The spin chucks 410 and 460 are examples of substrate holding parts, the elevating parts 120 and 130 are examples of first and second driving devices, respectively, and the substrate cleaning device 1 is an example of a substrate cleaning device.
1:基板洗淨裝置 2:頭載置部 100:洗淨頭 100A:洗淨頭 100B:洗淨頭 100C:洗淨頭 101:間隙 110:旋轉部 111:旋轉驅動裝置 112:軸 120:升降部 121:升降驅動裝置 122:連結構件 130:升降部 131:升降驅動裝置 132:連結構件 140:洗淨部 141:洗淨液供給裝置 142:噴嘴 150:吸引部 160:旋轉部 161:旋轉驅動裝置 162:軸 163:皮帶輪 164:動力傳遞構件 170:頭驅動部 171:頭移動裝置 172:頭保持構件 173:中心軸 180:頭驅動部 181:頭移動裝置 182:頭保持構件 200:中心刷 201:貫通孔 210:基台 211:孔部 212:平坦部 213:平坦部 220:洗淨部 221:槽部 300:外周刷 310:基台 311:開口部 312:平坦部 313:平坦部 320:洗淨部 321:開口部 322:缺口部 323:錐形面 324:平坦面 400:旋轉保持裝置 410:旋轉卡盤 411:旋轉馬達 412:旋轉軸 413:旋轉板 414:板支持構件 420:卡盤銷 421:軸部 422:銷支持部 423:保持部 424:磁性體 430:切換部 431:磁性體板 432:磁性體板 433:磁性體升降裝置 434:磁性體升降裝置 440:防濺罩裝置 441:防濺罩 442:防濺罩升降裝置 450:交接裝置 451:升降旋轉驅動部 452:旋轉軸 453:臂 454:保持銷 460:旋轉卡盤 461:旋轉馬達 462:旋轉軸 463:吸附保持部 470:交接裝置 471:升降驅動部 472:銷支持構件 473:升降銷 B:磁力線 H1:第1高度 H2:第2高度 H3:第3高度 N:極 R1:外方區域 R2:外方區域 S:極 W:基板 1: Substrate cleaning device 2: Head placement part 100: Wash your head 100A: Wash head 100B: Wash head 100C: Wash head 101: gap 110: Rotating part 111: Rotary drive device 112: Axis 120: Lifting part 121: Lifting drive 122: connecting member 130: elevator 131: Lifting drive device 132: Connection member 140: Washing Department 141: Detergent supply device 142: Nozzle 150: Attraction Department 160: Rotating part 161: Rotary drive device 162: Shaft 163: Pulley 164: Power Transmission Components 170: head drive 171: Head moving device 172: Head holding member 173: central axis 180: head drive 181: head moving device 182: Head holding member 200: center brush 201: Through hole 210: Abutment 211: Hole 212: flat part 213: flat part 220: Washing Department 221: Groove 300: peripheral brush 310: Abutment 311: Opening 312: flat part 313: flat part 320: Washing Department 321: opening 322: Notch 323: tapered surface 324: flat surface 400: Rotation holding device 410: Spin chuck 411: Rotating Motor 412: Rotation axis 413: Rotating Plate 414: board support member 420: Chuck pin 421: Shaft 422: Sales Support Department 423: holding part 424: Magnetic 430: Switching Department 431: Magnetic Board 432: Magnetic Board 433: Magnetic Lifting Device 434: Magnetic Lifting Device 440: Splash guard device 441: Splash guard 442: Splash guard lifting device 450: Handover device 451: Lifting and rotating drive unit 452: rotation axis 453: arm 454: keep pin 460: Spin chuck 461: Rotating Motor 462: Rotation Axis 463: Adsorption Holder 470: Handover Device 471: Lifting drive 472: pin support member 473: Lift Pin B: Magnetic field lines H1: 1st height H2: 2nd height H3: 3rd height N: pole R1: foreign area R2: foreign area S: extremely W: substrate
圖1係本發明之第1實施形態之洗淨頭之外觀立體圖。 圖2係用於說明圖1之中心刷之構成之圖。 圖3係用於說明圖1之中心刷之構成之圖。 圖4係用於說明圖1之外周刷之構成之圖。 圖5係用於說明圖1之外周刷之構成之圖。 圖6係洗淨頭之仰視圖。 圖7係洗淨頭之俯視圖。 圖8係顯示第1變化例之洗淨頭之俯視圖。 圖9係顯示第2變化例之洗淨頭之立體圖。 圖10係圖9之洗淨頭之俯視圖。 圖11係顯示包含洗淨頭之基板洗淨裝置之概略構成之圖。 圖12係用於說明基板洗淨裝置之第1動作例之圖。 圖13係用於說明基板洗淨裝置之第1動作例之圖。 圖14係用於說明基板洗淨裝置之第2動作例之圖。 圖15係用於說明基板洗淨裝置之第2動作例之圖。 圖16係顯示洗淨部之第1變化例之圖。 圖17係顯示洗淨部之第2變化例之圖。 圖18係顯示吸引部之變化例之圖。 圖19係本發明之第2實施形態之洗淨頭之仰視圖。 圖20係顯示包含圖19之洗淨頭之基板洗淨裝置之概略構成之圖。 圖21係顯示第3實施形態之基板洗淨裝置之構成之圖。 圖22係用於說明旋轉卡盤對基板之保持動作之圖。 圖23係用於說明旋轉卡盤對基板之保持動作之圖。 圖24係用於說明旋轉卡盤對基板之保持動作之圖。 圖25係用於說明旋轉卡盤對基板之保持動作之圖。 圖26係用於說明洗淨頭對基板之洗淨之圖。 圖27係用於說明洗淨頭對基板之洗淨之圖。 圖28係用於說明洗淨頭對基板之洗淨之圖。 圖29係顯示第4實施形態之基板洗淨裝置之構成之圖。Fig. 1 is a perspective view of the appearance of the washing head according to the first embodiment of the present invention. Fig. 2 is a diagram for explaining the structure of the center brush of Fig. 1. Fig. 3 is a diagram for explaining the structure of the center brush of Fig. 1. Fig. 4 is a diagram for explaining the structure of the outer peripheral brush of Fig. 1. Fig. 5 is a diagram for explaining the structure of the outer peripheral brush of Fig. 1. Figure 6 is a bottom view of the washing head. Figure 7 is a top view of the washing head. Fig. 8 is a plan view showing the washing head of the first modification. Fig. 9 is a perspective view showing the washing head of the second modification. Fig. 10 is a top view of the washing head of Fig. 9; Fig. 11 is a diagram showing a schematic configuration of a substrate cleaning device including a cleaning head. Fig. 12 is a diagram for explaining the first operation example of the substrate cleaning device. Fig. 13 is a diagram for explaining the first operation example of the substrate cleaning device. Fig. 14 is a diagram for explaining a second operation example of the substrate cleaning device. Fig. 15 is a diagram for explaining a second operation example of the substrate cleaning device. Fig. 16 is a diagram showing a first modification of the washing part. Fig. 17 is a diagram showing a second modification example of the washing part. Fig. 18 is a diagram showing a modification example of the suction part. Fig. 19 is a bottom view of the washing head of the second embodiment of the present invention. Fig. 20 is a diagram showing a schematic configuration of a substrate cleaning device including the cleaning head of Fig. 19; Fig. 21 is a diagram showing the structure of a substrate cleaning device of the third embodiment. Fig. 22 is a diagram for explaining the holding action of the spin chuck on the substrate. Fig. 23 is a diagram for explaining the holding action of the spin chuck on the substrate. Fig. 24 is a diagram for explaining the holding action of the spin chuck on the substrate. Fig. 25 is a diagram for explaining the holding action of the spin chuck on the substrate. Fig. 26 is a diagram for explaining the cleaning of the substrate by the cleaning head. Fig. 27 is a diagram for explaining the cleaning of the substrate by the cleaning head. Fig. 28 is a diagram for explaining the cleaning of the substrate by the cleaning head. Fig. 29 is a diagram showing the structure of a substrate cleaning device of the fourth embodiment.
100:洗淨頭 100: Wash your head
112:軸 112: Axis
200:中心刷 200: center brush
210:基台 210: Abutment
220:洗淨部 220: Washing Department
300:外周刷 300: peripheral brush
310:基台 310: Abutment
320:洗淨部 320: Washing Department

Claims (15)

  1. 一種洗淨頭,其係用於基板之洗淨者,且具備: 中心刷,其包含第1基台、及安裝於前述第1基台之第1洗淨部;及 外周刷,其包含第2基台、及安裝於前述第2基台之第2洗淨部,且配置為包圍前述中心刷;並且 前述中心刷與前述外周刷可相互拆裝地構成。A cleaning head, which is used for cleaning substrates, and has: The center brush includes a first base and a first cleaning part installed on the first base; and A peripheral brush, which includes a second base and a second cleaning part installed on the second base, and is configured to surround the center brush; and The center brush and the outer peripheral brush are configured to be detachable from each other.
  2. 如請求項1之洗淨頭,其中前述中心刷與前述外周刷構成為可相互獨立地朝一方向移動。The washing head of claim 1, wherein the center brush and the outer peripheral brush are configured to be movable in one direction independently of each other.
  3. 如請求項2之洗淨頭,其中前述中心刷與前述外周刷構成為可繞平行於前述一方向之軸一體地旋轉。The washing head of claim 2, wherein the center brush and the outer peripheral brush are configured to be integrally rotatable about an axis parallel to the one direction.
  4. 如請求項3之洗淨頭,其中前述第1基台具有與前述一方向正交之非圓形狀之剖面;且 前述第2基台具有收容前述中心刷之開口部; 前述開口部具有與前述中心刷之非圓形狀之剖面對應之非圓形狀之剖面。The cleaning head of claim 3, wherein the first base has a non-circular cross section orthogonal to the one direction; and The aforementioned second base has an opening for accommodating the aforementioned center brush; The opening has a non-circular cross section corresponding to the non-circular cross section of the center brush.
  5. 如請求項2之洗淨頭,其中前述中心刷與前述外周刷構成為可繞平行於前述一方向之軸相互獨立地旋轉。The cleaning head of claim 2, wherein the center brush and the outer peripheral brush are configured to be independently rotatable about an axis parallel to the one direction.
  6. 如請求項1至5中任一項之洗淨頭,其中前述第1洗淨部由包含研磨材之材料構成。The cleaning head according to any one of claims 1 to 5, wherein the first cleaning part is composed of a material containing abrasives.
  7. 如請求項1至5中任一項之洗淨頭,其中前述中心刷之前述第1洗淨部具有可與基板接觸之第1洗淨面;且 在前述第1洗淨面形成槽部。The cleaning head of any one of claims 1 to 5, wherein the first cleaning portion of the center brush has a first cleaning surface that can contact the substrate; and A groove is formed on the first washing surface.
  8. 如請求項1至5中任一項之洗淨頭,其中前述第2洗淨部由軟質材料形成。The washing head according to any one of claims 1 to 5, wherein the second washing part is formed of a soft material.
  9. 如請求項8之洗淨頭,其中前述外周刷之前述第2洗淨部具有可與基板接觸之第2洗淨面;且 前述第2洗淨面包含平坦面、及相對於前述平坦面傾斜之錐形面。The cleaning head of claim 8, wherein the second cleaning portion of the peripheral brush has a second cleaning surface that can contact the substrate; and The second washing surface includes a flat surface and a tapered surface inclined with respect to the flat surface.
  10. 如請求項1至5中任一項之洗淨頭,其中以在前述第1基台與前述第2基台之間及前述第1洗淨部與前述第2洗淨部之間連通之方式,在前述中心刷與前述外周刷之間形成間隙。The washing head according to any one of claims 1 to 5, wherein it is connected between the first base and the second base and between the first washing part and the second washing part , A gap is formed between the center brush and the outer peripheral brush.
  11. 一種中心刷,其係設置於外周刷且用於基板之洗淨者,且具備: 第1基台;及 第1洗淨部,其安裝於前述第1基台;並且 以由前述外周刷包圍之方式可拆裝地配置。A center brush, which is set on the outer peripheral brush and used for cleaning the substrate, and has: The first abutment; and The first cleaning part, which is installed on the aforementioned first base; and It is detachably arranged so as to be surrounded by the aforementioned outer peripheral brush.
  12. 一種外周刷,其係設置於中心刷且用於基板之洗淨者,且具備: 第2基台;及 第2洗淨部,其安裝於前述第2基台;並且 以包圍前述中心刷之方式可拆裝地配置。A peripheral brush, which is set on the center brush and used for cleaning the substrate, and has: 2nd abutment; and The second cleaning part, which is installed on the aforementioned second base; and It is detachably arranged to surround the aforementioned center brush.
  13. 一種基板洗淨裝置,其具備: 基板保持部,其保持基板;及 如請求項1至10中任一項之洗淨頭,其設置為將由前述基板保持部保持之基板洗淨。A substrate cleaning device, which includes: A substrate holding portion, which holds the substrate; and The cleaning head according to any one of claims 1 to 10, which is configured to clean the substrate held by the aforementioned substrate holding portion.
  14. 如請求項13之基板洗淨裝置,其更具備: 第1驅動裝置,其設置為可將前述洗淨頭之前述中心刷朝向基板移動;及 第2驅動裝置,其可將前述洗淨頭之前述外周刷朝向基板移動。Such as the substrate cleaning device of claim 13, which is further equipped with: The first driving device is configured to move the center brush of the cleaning head toward the substrate; and The second driving device can move the outer peripheral brush of the cleaning head toward the substrate.
  15. 一種基板洗淨方法,其包含: 藉由基板保持部保持基板之步驟;及 藉由如請求項1至10中任一項之洗淨頭將由前述基板保持部保持之基板洗淨之步驟。A method for cleaning a substrate, which comprises: The step of holding the substrate by the substrate holding portion; and A step of washing the substrate held by the aforementioned substrate holding portion by the cleaning head of any one of claims 1 to 10.
TW108146855A 2019-03-20 2019-12-20 Cleaning head, center brush, outer periphery brush, substrate cleaning apparatus and substrate cleaning method TW202036670A (en)

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Publication number Priority date Publication date Assignee Title
CN113467199A (en) * 2021-09-06 2021-10-01 宁波润华全芯微电子设备有限公司 Device convenient to dismantle and capable of preventing wafer from being polluted by splashing liquid
CN113467199B (en) * 2021-09-06 2021-11-12 宁波润华全芯微电子设备有限公司 Device convenient to dismantle and capable of preventing wafer from being polluted by splashing liquid

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JP2002177898A (en) * 2000-12-15 2002-06-25 Dainippon Screen Mfg Co Ltd Substrate cleaning apparatus, substrate cleaning method, and cleaning brush
JP5583503B2 (en) * 2010-07-14 2014-09-03 東京エレクトロン株式会社 Substrate cleaning apparatus and coating and developing apparatus provided with the same
JP6210935B2 (en) * 2013-11-13 2017-10-11 東京エレクトロン株式会社 Polishing and cleaning mechanism, substrate processing apparatus, and substrate processing method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113467199A (en) * 2021-09-06 2021-10-01 宁波润华全芯微电子设备有限公司 Device convenient to dismantle and capable of preventing wafer from being polluted by splashing liquid
CN113467199B (en) * 2021-09-06 2021-11-12 宁波润华全芯微电子设备有限公司 Device convenient to dismantle and capable of preventing wafer from being polluted by splashing liquid

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