TW202028354A - 樹脂組合物、硬化膜、附硬化膜之印刷佈線板及其製造方法 - Google Patents
樹脂組合物、硬化膜、附硬化膜之印刷佈線板及其製造方法 Download PDFInfo
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- TW202028354A TW202028354A TW108137463A TW108137463A TW202028354A TW 202028354 A TW202028354 A TW 202028354A TW 108137463 A TW108137463 A TW 108137463A TW 108137463 A TW108137463 A TW 108137463A TW 202028354 A TW202028354 A TW 202028354A
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- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- DIHAURBCYGTGCV-UHFFFAOYSA-N xi-4,5-Dihydro-2,4(5)-dimethyl-1H-imidazole Chemical compound CC1CN=C(C)N1 DIHAURBCYGTGCV-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
- C08F290/067—Polyurethanes; Polyureas
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
- C08K5/5317—Phosphonic compounds, e.g. R—P(:O)(OR')2
- C08K5/5333—Esters of phosphonic acids
- C08K5/5373—Esters of phosphonic acids containing heterocyclic rings not representing cyclic esters of phosphonic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
- C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
- C08L101/025—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing nitrogen atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
- C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
- C08L101/06—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing oxygen atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
- C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
- C08L101/06—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing oxygen atoms
- C08L101/08—Carboxyl groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
- C08L75/04—Polyurethanes
- C08L75/14—Polyurethanes having carbon-to-carbon unsaturated bonds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Materials For Photolithography (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polyurethanes Or Polyureas (AREA)
- Epoxy Resins (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018-197826 | 2018-10-19 | ||
| JP2018197826 | 2018-10-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW202028354A true TW202028354A (zh) | 2020-08-01 |
Family
ID=70282898
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW108137463A TW202028354A (zh) | 2018-10-19 | 2019-10-17 | 樹脂組合物、硬化膜、附硬化膜之印刷佈線板及其製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7418343B2 (ja) |
| KR (1) | KR20210080436A (ja) |
| CN (1) | CN112888748B (ja) |
| TW (1) | TW202028354A (ja) |
| WO (1) | WO2020080352A1 (ja) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2001214024A (ja) * | 2000-02-04 | 2001-08-07 | Teijin Chem Ltd | 難燃性スチレン系樹脂組成物 |
| JP2002003727A (ja) * | 2000-06-22 | 2002-01-09 | Teijin Chem Ltd | 難燃性樹脂組成物 |
| CN1314765C (zh) * | 2001-11-30 | 2007-05-09 | 宝理塑料株式会社 | 阻燃性树脂组合物 |
| JP4065701B2 (ja) * | 2002-03-12 | 2008-03-26 | 帝人化成株式会社 | ペンタエリスリトールジホスホネート化合物およびその製造方法 |
| JP2004035481A (ja) * | 2002-07-04 | 2004-02-05 | Teijin Chem Ltd | スピロ環ジホスホネート化合物の製造方法 |
| JP2004035480A (ja) * | 2002-07-04 | 2004-02-05 | Teijin Chem Ltd | スピロ環ジホスホネート化合物の製造方法 |
| WO2007061080A1 (ja) * | 2005-11-25 | 2007-05-31 | Three Bond Co., Ltd. | 硬化性組成物 |
| JP4616863B2 (ja) * | 2007-06-04 | 2011-01-19 | 太陽ホールディングス株式会社 | 感光性樹脂組成物及びそれを用いて得られるフレキシブル配線板 |
| JP6006385B2 (ja) | 2015-08-05 | 2016-10-12 | 東芝テック株式会社 | サーバ |
| JP2017137405A (ja) * | 2016-02-03 | 2017-08-10 | 帝人株式会社 | 熱可塑性樹脂組成物およびその成形品 |
| CN109071923B (zh) * | 2016-04-25 | 2021-08-24 | 株式会社钟化 | 热固化性树脂组合物、固化膜及其制造方法、以及带固化膜的柔性印刷基板及其制造方法 |
| JP6263307B1 (ja) * | 2017-09-12 | 2018-01-17 | 株式会社レグルス | 熱膨張性樹脂組成物及び熱膨張性樹脂製材料 |
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- 2019-10-15 CN CN201980068811.6A patent/CN112888748B/zh active Active
- 2019-10-15 KR KR1020217014578A patent/KR20210080436A/ko unknown
- 2019-10-15 WO PCT/JP2019/040438 patent/WO2020080352A1/ja active Application Filing
- 2019-10-15 JP JP2020553189A patent/JP7418343B2/ja active Active
- 2019-10-17 TW TW108137463A patent/TW202028354A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2020080352A1 (ja) | 2020-04-23 |
| CN112888748B (zh) | 2023-09-22 |
| KR20210080436A (ko) | 2021-06-30 |
| JPWO2020080352A1 (ja) | 2021-09-30 |
| CN112888748A (zh) | 2021-06-01 |
| JP7418343B2 (ja) | 2024-01-19 |
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