TW202012319A - System for producing washing water for electronic components, and operating method for system for producing washing water for electronic components - Google Patents

Abstract

The present invention is a system for producing washing water for electronic components 100, comprising: a transfer line L1 that connects a raw material water supply unit and a use point; a return line L2 that branches at a branch point 8 at the downstream side of the transfer line L1, and merges at a merging point 9 at the upstream side; a functional substance adding device 2 that is connected to the transfer line L1 upstream from the merging point 9, and that adds a functional substance to raw material water supplied to the transfer line L1 to produce the washing water; a physical property measuring device 3 that is connected to the transfer line L1 downstream from the merging point 9, and that measures the physical properties of the washing water; a storage tank 4 that is provided in the return line L2, and that can store the washing water; and a control means 7 that controls the distribution channel of the washing water. In the system for producing washing water for electronic components 100, it is possible to shorten the preparation time for the washing water used at the use point (the time until the washing water is stable under set conditions) while also significantly suppressing the waste fluid amount of the produced washing water.

Description

Operation method of washing water manufacturing system for electronic parts and washing water manufacturing system for electronic parts

The present invention relates to an operating method of a washing water manufacturing system for electronic parts and a washing water manufacturing system for electronic parts used in manufacturing steps of electronic parts such as semiconductors, liquid crystals, and organic EL.

In the manufacturing process of electronic components such as semiconductors, liquid crystals, organic ELs, etc., it is extremely important to clean particles or organic substances that are attached to a silicon wafer that is a material of a semiconductor substrate, a glass substrate for flat panel displays, or the like. As a cleaning method for silicon wafers and the like, in the ultrapure water used as the raw material water, a conductivity-imparting substance such as ammonia, a redox potential adjusting substance such as hydrogen peroxide, or dissolved water such as hydrogen gas is dissolved. For example, Patent Document 1 discloses a manufacturing apparatus including a hydrogen dissolving device that dissolves hydrogen in pure water or ultrapure water in a closed system, and uses the hydrogen dissolving water obtained by the device to clean a semiconductor element 、Immersion. In addition, Patent Document 2 discloses a conductive aqueous solution manufacturing apparatus capable of manufacturing a conductive aqueous solution having a stable concentration when manufacturing a conductive aqueous solution in which ultrapure water dissolves a conductivity-imparting substance such as carbon dioxide or ammonia.

The manufactured washing water is transferred from the washing water manufacturing device to multiple use points in a manufacturing plant such as silicon wafers, and is used for wafer processing. However, in the conventional apparatus for manufacturing cleaning water for electronic parts as shown in FIG. 3, generally, even when wafer processing is not performed, the cleaning water is manufactured and continuously transferred to the point of use. Therefore, there is a problem that the added conductivity-imparting substance and the like are consumed in large amounts and a large amount of waste liquid is generated.

In order to solve the above problem, a method of manufacturing cleaning water only when performing wafer processing is considered. However, in the case where the cleaning water is manufactured and transferred to the point of use only during wafer processing, it takes a few minutes to several tens of minutes to stabilize the cleaning water under the set conditions, so during this period, it is transferred to the point of use All the cleaning water is discarded. Even if it is not the case that the cleaning water is continuously transferred to the point of use when the wafer is not processed, a large amount of waste liquid will be generated.

On the other hand, a device for manufacturing cleaning water as shown in FIG. 4 is also proposed, which temporarily stores the cleaning water not used for wafer processing in a tank, and manufactures and replenishes the tank for use in wafer processing. Part of the washing water. However, in such devices, the solution concentration of the washing water returned to the tank is often different from the set solution concentration, and if the newly-made washing water is replenished to the tank storing the returned washing water, there is a deviation in the solution concentration The problem of becoming larger is the problem of poor controllability of the solution concentration. Therefore, for example, it is necessary to provide a mixer for mixing in the tank, and the manufacturing cost of washing water increases. [Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2003-136077 [Patent Document 2] Japanese Patent Laid-Open No. 2016-076590

[Problems to be solved by the invention] The present invention was made based on the above circumstances, and its purpose is to provide a method that can greatly reduce the amount of waste liquid of the produced washing water, and can also shorten the preparation time of the washing water used at the point of use (the washing water is under the set conditions (Time until stability) Operation method of electronic parts cleaning water manufacturing system and electronic parts cleaning water manufacturing system.

[Means to solve the problem] In order to solve the above problems, first, the present invention provides a cleaning water manufacturing system for electronic parts, including: a transfer line that connects the raw water supply unit and the point of use; a return line at a branch point located on the downstream side of the transfer line Branch, merge at the confluence point located on the upstream side; a functional substance addition device, connected to the upstream side of the confluence point in the transfer line, and add a functional substance to the raw material water supplied to the transfer line to manufacture cleaning Water; physical property measuring device, connected to the downstream side of the confluence point in the transfer line, to measure the physical properties of the washing water; a storage tank, provided in the return line, and capable of storing the washing water; and control A component that controls the flow path of the washing water (Invention 1).

According to the above invention (Invention 1), regardless of whether the washing water is used at the point of use, the manufactured washing water is continuously transferred to the point of use, and at the same time, by using a control member, when the water is not used at the point of use, It is controlled to temporarily store the washing water in the storage tank via the return line, and when the washing water is used at the point of use, it is controlled to supply the washing water stored in the storage tank to the transfer line. This can greatly reduce the amount of waste liquid of the produced washing water, and can shorten the preparation time of the washing water used at the point of use (the time until the washing water is stable under the set conditions).

In the invention (Invention 1), it is preferable that the control member controls to store the washing water in the return line through the return line when it is determined that the washing water is not used at the point of use In the storage tank, when it is determined that the washing water is used at the point of use, the control unit controls to supply the washing water stored in the storage tank to the transfer line (Invention 2).

According to the above invention (Invention 2), the amount of waste liquid of the produced washing water can be greatly suppressed, and the washing water supplied from the storage tank to the transferring line and the newly-made washing water on the transferring line can be mixed on the transferring line Quantitatively measure its physical properties, so it is always possible to supply washing water with a certain physical property value to the point of use.

In the above invention (Invention 1 and Invention 2), it is preferable to further include: a first flow meter connected to the upstream side of the confluence point in the transfer line; and a second flow meter connected to the return flow The pipeline is connected to the downstream side of the storage tank, and when the control unit determines that the washing water is used at the point of use, based on the measurement value of the first flowmeter and the measurement of the second flowmeter Value to control the amount of wash water produced on the transfer line (Invention 3).

According to the above invention (Invention 3), the total amount of the washing water supplied from the storage tank to the transfer line and the newly-made washing water on the transfer line is insufficient with respect to the required amount at the point of use by the control means Next, the amount of cleaning water produced on the transfer line can be controlled in such a way as to supplement this deficiency, so that a constant flow of cleaning water can always be supplied to the point of use.

In the above invention (Invention 1 to Invention 3), it is preferable that the combination of the functional substance and the physical property measurement device is selected from the group consisting of a conductivity-imparting substance and a conductivity meter, a redox potential adjusting substance, and a redox potential One or more than two (Oxidation-Reduction Potential, ORP) meters, pH adjusting substances and pH meters, and gas and gas concentration meters (Invention 4).

Second, the present invention provides a method for operating a cleaning water manufacturing system for electronic parts, wherein the cleaning water manufacturing system for electronic parts includes: a transfer line that connects the raw water supply unit and the point of use; a return line is located at the transfer The branch point on the downstream side of the pipeline is branched and merged at the merge point on the upstream side; a functional substance addition device is connected to the upstream side of the merged point in the transfer line, in the raw material water supplied to the transfer line Add functional substances to produce washing water; a physical property measuring device connected to the downstream side of the confluence point in the transfer line to measure the physical properties of the cleaning water; a storage tank provided in the return line and capable of storing The washing water; and a control member that controls the flow path of the washing water, and the method of operating the washing water manufacturing system for electronic parts is characterized in that the washing water is used regardless of whether the washing water is used at the point of use Washing water is transferred to the point of use via the transfer line (Invention 5).

According to the invention (Invention 5), regardless of whether the washing water is used at the point of use, the manufactured washing water is continuously transferred to the point of use, and at the same time, by using a control member, when the water is not used at the point of use, It is controlled to temporarily store the washing water in the storage tank via the return line, and when the washing water is used at the point of use, it is controlled to supply the washing water stored in the storage tank to the transfer line. This can greatly reduce the amount of waste liquid of the produced washing water, and can shorten the preparation time of the washing water used at the point of use (the time until the washing water is stable under the set conditions).

In the above invention (Invention 5), it is preferable that the control member controls the washing water to be stored in the washing water via the return line when it is determined that the washing water is not used at the point of use In the storage tank, when it is determined that the washing water is used at the point of use, the control unit controls to supply the washing water stored in the storage tank to the transfer line (Invention 6).

According to the above invention (Invention 6), the amount of waste liquid of the produced washing water can be greatly suppressed, and the washing water supplied from the storage tank to the transferring line and the newly-made washing water on the transferring line can be mixed on the transferring line Quantitatively measure its physical properties, so it is always possible to supply washing water with a certain physical property value to the point of use.

In the above invention (Invention 5 and Invention 6), it is preferable that the cleaning water manufacturing system for electronic parts further includes: a first flow meter connected to the upstream side of the confluence point in the transfer line; and The second flowmeter is connected to the downstream side of the storage tank in the return line, and the control unit is based on the measured value of the first flowmeter when it is determined that the washing water is used at the point of use And the measured value of the second flow meter to control the amount of washing water produced on the transfer line (Invention 7).

According to the above invention (Invention 6), the total amount of the cleaning water supplied from the storage tank to the transfer line and the newly-made cleaning water on the transfer line is insufficient with respect to the required amount at the point of use by the control means Next, the amount of cleaning water produced on the transfer line can be controlled in such a way as to supplement this deficiency, so that a constant flow of cleaning water can always be supplied to the point of use.

In the above invention (Invention 5-Invention 7), it is preferable that the combination of the functional substance and the physical property measurement device is selected from the group consisting of a conductivity-imparting substance and a conductivity meter, a redox potential adjusting substance and an ORP meter, One or two or more of the group consisting of a pH adjusting substance, a pH meter, and a gas and a gas concentration meter (Invention 8).

[Effect of invention] According to the operation method of the washing water manufacturing system for electronic parts and the washing water manufacturing system for electronic parts of the present invention, regardless of whether the washing water is used at the point of use, the manufactured washing water is continuously transferred to the point of use, and can also be borrowed When the washing water is not used at the point of use, it is controlled by the control unit to temporarily store the washing water in the storage tank via the return line, and when the washing water is used at the point of use, it is controlled to be stored in the storage tank. Wash water is supplied to the transfer line. This can greatly reduce the amount of waste liquid of the produced washing water, and can shorten the preparation time of the washing water used at the point of use (the time until the washing water is stable under the set conditions).

Hereinafter, an embodiment of a washing water manufacturing system for electronic parts of the present invention and an operation method of the system will be described with reference to FIGS. 1 and 2(a) to 2(c). In addition, in FIGS. 2( a) to 2 (c ), in order to simplify the drawing, some symbols are omitted. The embodiments described below are for easy understanding of the present invention and do not limit the present invention in any way.

〔Cleaning water manufacturing system for electronic parts〕 FIG. 1 is a schematic explanatory diagram showing a cleaning water manufacturing system 100 for electronic parts according to an embodiment of the present invention. The cleaning water manufacturing system 100 for electronic parts shown in FIG. 1 includes: a transfer line L1 that connects the raw water supply unit and the point of use; and a return line L2, which is switched via a three-way valve at a branch point 8 located on the downstream side of the transfer line L1 81 branched and merged at the junction 9 located on the upstream side. As shown in FIG. 2( a ), the washing water manufacturing system 100 for electronic parts continuously transfers the washing water to the usage point via the transfer line L1 regardless of whether the washing water is used at the usage point. A first flow meter 1, a functional substance addition device 2, and a physical property measuring device 3 are sequentially provided on the transfer line L1 along the circulation direction, and a storage tank 4 and a second are sequentially provided along the circulation direction on the return line L2. Flowmeter 5, water supply pump 6. In addition, the cleaning water manufacturing system 100 for electronic parts includes a control member 7 (not shown) that controls the flow path of the cleaning water. Furthermore, the supply amount of the raw water from the raw water supply unit to the transfer line L1 can be adjusted by the first on-off valve 10 provided on the upstream side of the first flow meter 1 in the transfer line L1.

(Raw water) The raw material water is preferably a water quality suitable for washing electronic parts such as semiconductors, liquid crystals, and organic EL. For example, ultrapure water or pure water that removes impurities to the limit can be preferably used. In this embodiment, ultrapure water W is used as raw material water.

<Functional substance addition device> The functional substance addition device 2 adds functional substances to the ultrapure water W supplied to the transfer line L1 to produce washing water W1, and is connected to the upstream side of the confluence point 9 via the second on-off valve 11 on the transfer line L1 . Furthermore, the functional substance is preferably one, two or more selected from the group consisting of conductivity-imparting substances, redox potential adjusting substances, pH adjusting substances, and gases.

Examples of the conductivity-imparting substance include ammonia and carbonic acid, but it is preferable to use ammonia with high safety. Examples of the oxidation-reduction potential adjusting substance include liquids such as hydrogen peroxide water and gases such as ozone gas. For easier control of the amount of oxygen, it is preferable to use hydrogen peroxide water. Examples of the pH adjusting substance include ammonia and carbonic acid, but it is preferable to use ammonia that is relatively easy to adjust. Examples of the gas include hydrogen gas, nitrogen gas, and carbonic acid gas. However, it is preferable to use hydrogen gas with high safety.

As the functional substance addition device 2, as long as the functional substance can be added to the ultrapure water W to produce the washing water W1, the method is not particularly limited. For example, when the functional substance is a liquid, a method of using a pump to add to the ultrapure water W flowing in the transfer line can be used, and when the functional substance is a gas, the flow in the transfer line can be used. The method of directly bubbling ultra pure water W etc.

<Physical Properties Measuring Device> The physical property measuring device 3 is a person who quantitatively measures the physical properties of the produced washing water W1, and is connected to the downstream side of the confluence point 9 in the transfer line L1. By connecting the physical property measuring device 3 to the downstream side of the confluence point 9, the cleaning water W1' supplied from the storage tank to the transfer line and the newly-made cleaning water W1'' on the transfer line can be mixed quantitatively on the transfer line L1 The physical properties are measured, so it is always possible to supply washing water with a certain physical property value to the point of use.

The physical property measuring device 3 only needs to be capable of quantitatively measuring the physical properties of the washing water W1 flowing through the transfer line L1, and therefore it may be adopted as long as it matches the functional substance added by the functional substance adding device 2. That is, in the case where the added functional substance is a conductivity-imparting substance, a conductivity meter is used as the physical property measurement device 3, and in the case of a redox potential adjusting substance, an ORP meter is sufficient, and a pH adjusting substance is used. In the case of, a pH meter may be used, and in the case of a gas, a gas concentration meter may be used. As these conductivity meters, ORP meters, pH meters, and gas concentration meters, as long as the purpose can be achieved separately, for example, a commercially available one can be used without particular limitation.

<Storage tank> The storage tank 4 is configured to be able to store the washing water W1 returned through the return line L2. The supply amount of the washing water W1' stored in the storage tank 4 to the transfer line L1 can be adjusted by the third switching valve 12 provided on the downstream side of the storage tank 4 in the return line L2. The storage tank 4 only needs to have a capacity that can temporarily store the washing water W1 ′ that is not used at the point of use and returned, and its configuration is not particularly limited.

<Flowmeter> The first flow meter 1 measures the flow rate of the ultrapure water W flowing through the transfer line L1, that is, the inlet flow rate of the electronic component cleaning water production system 100, and is provided on the upstream side of the confluence point 9. By installing the first flow meter 1 on the upstream side of the confluence point 9, based on the measured value of the first flow meter 1, the flow rate of the washing water W1 (or washing water W1'') manufactured by the transfer line L1 can be grasped, that is The flow rate of the washing water W1 (or washing water W1'') of the washing water W1' supplied from the storage tank 4 to the transfer line L1 is not included. Furthermore, in the present embodiment, the first flow meter 1 is provided on the upstream side of the functional substance addition device 2.

The second flow meter 5 measures the flow rate of the washing water W1' supplied from the storage tank 4 to the transfer line L1. The second flow meter 5 only needs to be capable of measuring the flow rate of the washing water W1' supplied from the storage tank 4 to the transfer line L1. In the present embodiment, a third switch is provided in the return line L2 on the downstream side of the storage tank 4 Between the valve 12 and the water supply pump 6.

As the first flow meter 1 and the second flow meter 5, for example, commercially available ones can be used without particular limitation.

<Control Components> The control member 7 (not shown) controls the flow path of the washing water W1. In this embodiment, the control member 7 controls to switch the washing water W1 by switching the switching three-way valve 81 when it is determined that the washing water is not used at the point of use (the case of FIG. 2(b)). The return line L2 is temporarily stored in the storage tank 4, and when it is determined that the washing water is used at the point of use (in the case of FIG. 2(c)), it is controlled to store the water in the storage tank 4 by driving the water supply pump 6. The washing water W1' is supplied to the transfer line L1. In addition, the supply amount to the transfer line L1 at this time can be adjusted by controlling the opening and closing of the third switching valve 12 by the control unit 7. In this way, the control member 7 can be controlled to return the washing water W1 through the return line L2 when the washing water is not used at the point of use (in the case of FIG. 2(b)), so the manufactured washing water W1 is transferred via The pipeline L1 is continuously transferred to the point of use, and at the same time, a large amount of waste liquid can be prevented.

In addition, in the present embodiment, based on the measured value of the first flow meter 1 and the measured value of the second flow meter 5, the control unit 7 supplies the cleaning water W1 ′ supplied from the storage tank 4 to the transfer line L1 and the transfer line L1. When the total amount of washing water W1'' newly manufactured is insufficient relative to the required amount at the point of use, the amount of washing water W1'' manufactured on the transfer line L1 can be controlled in such a manner as to supplement the shortage. As a result, a constant flow of washing water W1 can always be supplied to the point of use.

The control member 7 is not particularly limited as long as at least the above control can be performed, for example, it may be performed manually, or may be performed using a well-known computer or the like.

[Operation method of washing water manufacturing system for electronic parts] Next, the operation method of the cleaning water manufacturing system 100 for electronic parts according to the present embodiment described above will be described in detail with reference to FIGS. 2(a) to 2(c).

First, for the raw material water W supplied to the transfer line L1, the functional substance addition device 2 adds the functional substance to produce the washing water W1 (functional substance addition step). Next, the physical property measurement device 3 provided on the downstream side of the functional substance addition device 2 in the transfer line L1 quantitatively measures the physical properties of the produced washing water W1 (physical property measurement step). As shown in FIG. 2( a ), the cleaning water W1 whose physical properties have been measured is continuously transferred to the point of use regardless of whether the point of use is used or not.

Then, when it is determined that the washing water is not used at the point of use (in the case of FIG. 2(b)), the control unit 7 controls to switch the manufactured washing water W1 by switching the switching three-way valve 81. The return line L2 is stored in the storage tank 4. At this time, only the washing water W1 that has been transferred to the point of use is discarded, and most of the washing water W1 is returned. Therefore, it is possible to prevent a large amount of waste liquid from being generated. Furthermore, when the washing water is not used for a long time at the point of use, the switching three-way valve 81 is switched as described above, and the first switching valve 10 and the second switching valve 11 are closed, thereby passing through the storage tank 4 The washing water W1 may be circulated. With this, even when the washing water is not used for a long time at the point of use, it is possible to prevent the washing water W1 having a volume or more from flowing into the storage tank 4.

On the other hand, when it is determined that the washing water is not used at the point of use (in the case of FIG. 2(b)), the control unit 7 controls to drive the water supply pump 6 to store the washing water stored in the storage tank 4 W1' is supplied to the transfer line L1. At this time, the control member 7 can adjust the supply amount of the washing water W1' to the transfer line L1 by controlling the opening and closing of the third switching valve 12. In addition, based on the measured value of the first flowmeter 1 and the measured value of the second flowmeter 5, the control unit 7 supplies the washing water W1 ′ supplied from the storage tank 4 to the transfer line L1 and the newly produced wash water on the transfer line L1 When the total amount of W1'' is insufficient relative to the required amount at the point of use, the amount of washing water W1'' produced on the transfer line L1 can be controlled in such a manner as to supplement the shortage.

As described above, by operating the cleaning water manufacturing system 100 for electronic parts, the amount of waste liquid of the manufactured cleaning water can be greatly suppressed, and the preparation time of the cleaning water used at the point of use can be shortened (the cleaning water is set at Time until stable under conditions). Moreover, in the physical property measurement step, the cleaning water W1′ supplied from the storage tank 4 to the transfer line L1 and the newly-made washing water W1″ on the transfer line L1 can be quantitatively measured on the transfer line L1, Therefore, washing water with a certain physical value can always be supplied to the point of use.

The present invention has been described above with reference to the drawings. However, the present invention is not limited to the above-mentioned embodiments, and various changes can be made as long as they do not deviate from the gist. For example, in FIG. 1, the functional substance addition device 2 is shown as one device, but when the functional substance is hydrogen peroxide water as a redox potential adjustment substance, the functional substance addition device 2 may also be a hydrogen supply device It is composed of a hydrogen dissolution device connected to it. [Example]

Hereinafter, the present invention will be further described in detail based on examples, but the present invention is not limited to the following examples.

In the following Examples 1 to 5, the cleaning water manufacturing system 100 for electronic components shown in FIG. 1 is used to manufacture cleaning water for electronic components.

[Example 1] After adding ammonia to the ultrapure water so that the conductivity becomes 30 μS/cm to produce washing water, it is continuously transferred to the point of use at 50 L/min. While the use of the cleaning water at the point of use is interrupted, unused cleaning water is stored in the storage tank via the return line. After the cleaning water at the point of use is restored to use, the cleaning water stored in the storage tank is supplied to the transfer line. Wafers were cleaned at 2 L/min for 1 minute using the cleaning water. The overall time required to process a wafer is 3 minutes. This cleaning process is continued for 10 wafers.

As a result, the preparation time (time until the cleaning water stabilizes) for cleaning the wafer is zero, and the amount of waste liquid per hour is 20 L. The conductivity of the cleaning water is 30 μS/cm, and the deviation is within ±10%.

[Example 2] After adding hydrogen peroxide water to the ultrapure water so that the oxidation-reduction potential becomes 600 mV to produce washing water, it is continuously transferred to the point of use at 50 L/min. While the use of the cleaning water at the point of use is interrupted, unused cleaning water is stored in the storage tank via the return line. After the cleaning water at the point of use is restored to use, the cleaning water stored in the storage tank is supplied to the transfer line. Wafers were cleaned at 2 L/min for 1 minute using the cleaning water. The overall time required to process a wafer is 3 minutes. This cleaning process is continued for 10 wafers.

As a result, the preparation time (time until the cleaning water stabilizes) for cleaning the wafer is zero, and the amount of waste liquid per hour is 20 L. The redox potential of the cleaning water is 600 mV, and the deviation is within ±10%.

[Example 3] After adding hydrogen to ultrapure water so that the hydrogen concentration becomes 10 ppm to produce washing water, it is continuously transferred to the point of use at 50 L/min. While the use of the cleaning water at the point of use is interrupted, unused cleaning water is stored in the storage tank via the return line. After the cleaning water at the point of use is restored to use, the cleaning water stored in the storage tank is supplied to the transfer line. Wafers were cleaned at 2 L/min for 1 minute using the cleaning water. The overall time required to process a wafer is 3 minutes. This cleaning process is continued for 10 wafers.

As a result, the preparation time (time until the cleaning water stabilizes) for cleaning the wafer is zero, and the amount of waste liquid per hour is 20 L. The hydrogen concentration in the water quality of the washing water is 10 ppm, and the deviation is within ±10%.

[Example 4] After adding ammonia to the ultrapure water so that the pH value becomes 9.0 to produce washing water, it is continuously transferred to the point of use at 50 L/min. While the use of the cleaning water at the point of use is interrupted, unused cleaning water is stored in the storage tank via the return line. After the cleaning water at the point of use is restored to use, the cleaning water stored in the storage tank is supplied to the transfer line. Wafers were cleaned at 2 L/min for 1 minute using the cleaning water. The overall time required to process a wafer is 3 minutes. This cleaning process is continued for 10 wafers.

As a result, the preparation time (time until the cleaning water stabilizes) for cleaning the wafer is zero, and the amount of waste liquid per hour is 20 L. The pH value of the cleaning water is 9.0, and the deviation is within ±10%.

[Example 5] To ultrapure water, add ammonia with a conductivity of 30 μS/cm, add hydrogen peroxide with a redox potential of 600 mV, add hydrogen with a hydrogen concentration of 10 ppm, and have a pH of 9.0 After adding ammonia to produce washing water, it is continuously transferred to the point of use at 50 L/min. While the use of the cleaning water at the point of use is interrupted, unused cleaning water is stored in the storage tank via the return line. After the cleaning water at the point of use is restored to use, the cleaning water stored in the storage tank is supplied to the transfer line. Wafers were cleaned at 2 L/min for 1 minute using the cleaning water. The overall time required to process a wafer is 3 minutes. This cleaning process is continued for 10 wafers.

As a result, the preparation time (time until the cleaning water stabilizes) for cleaning the wafer is zero, and the amount of waste liquid per hour is 20 L. The conductivity of the cleaning water is 30 μS/cm, the oxidation-reduction potential is 600 mV, the hydrogen concentration is 10 ppm, the pH value is 9.0, and the deviation is within ±10%.

In the following Comparative Example 1 to Comparative Example 10, the manufacturing system 200 for the cleaning water for electronic components shown in FIG. 3 was used to manufacture the cleaning water for electronic components. The manufacturing system 200 for cleaning water for electronic parts includes a transfer line L21 that connects the raw water supply unit and the point of use, and a flow meter 21, a functional substance addition device 22, and a physical property measurement device are sequentially provided on the transfer line L21 along the flow direction twenty three. The supply amount of ultrapure water from the raw water supply unit to the transfer line L21 can be adjusted by the on-off valve 24 provided on the upstream side of the flowmeter 21 in the transfer line L21. The functional substance addition device 22 is connected to the transfer line L21 via the on-off valve 25.

[Comparative Example 1] After adding ammonia to the ultrapure water so that the conductivity becomes 30 μS/cm to produce washing water, it is continuously transferred to the point of use at 50 L/min. Wafers were cleaned at 2 L/min for 1 minute using the cleaning water. The overall time required to process a wafer is 3 minutes. This cleaning process is continued for 10 wafers. During the period when the cleaning water at the point of use is interrupted, the cleaning liquid is also manufactured and continuously transferred to the point of use.

As a result, the preparation time (time until the cleaning water stabilizes) for cleaning the wafer is zero, the amount of waste liquid per hour becomes 3000 L, and a large amount of waste liquid appears. The conductivity of the cleaning water is 30 μS/cm, and the deviation is within ±10%.

[Comparative Example 2] After adding hydrogen peroxide water to the ultrapure water so that the oxidation-reduction potential becomes 600 mV to produce washing water, it is continuously transferred to the point of use at 50 L/min. Wafers were cleaned at 2 L/min for 1 minute using the cleaning water. The overall time required to process a wafer is 3 minutes. This cleaning process is continued for 10 wafers. During the period when the cleaning water at the point of use is interrupted, the cleaning liquid is also manufactured and continuously transferred to the point of use.

As a result, the preparation time (time until the cleaning water stabilizes) for cleaning the wafer is zero, the amount of waste liquid per hour becomes 3000 L, and a large amount of waste liquid appears. The redox potential of the cleaning water is 600 mV, and the deviation is within ±10%.

[Comparative Example 3] After adding hydrogen to ultrapure water so that the hydrogen concentration becomes 10 ppm to produce washing water, it is continuously transferred to the point of use at 50 L/min. Wafers were cleaned at 2 L/min for 1 minute using the cleaning water. The overall time required to process a wafer is 3 minutes. This cleaning process is continued for 10 wafers. During the period when the cleaning water at the point of use is interrupted, the cleaning liquid is also manufactured and continuously transferred to the point of use.

As a result, the preparation time (time until the cleaning water stabilizes) for cleaning the wafer is zero, the amount of waste liquid per hour becomes 3000 L, and a large amount of waste liquid appears. The hydrogen concentration in the water quality of the washing water is 10 ppm, and the deviation is within ±10%.

[Comparative Example 4] After adding ammonia to the ultrapure water so that the pH value becomes 9.0 to produce washing water, it is continuously transferred to the point of use at 50 L/min. Wafers were cleaned at 2 L/min for 1 minute using the cleaning water. The overall time required to process a wafer is 3 minutes. This cleaning process is continued for 10 wafers. During the period when the cleaning water at the point of use is interrupted, the cleaning liquid is also manufactured and continuously transferred to the point of use.

As a result, the preparation time (time until the cleaning water stabilizes) for cleaning the wafer is zero, the amount of waste liquid per hour becomes 3000 L, and a large amount of waste liquid appears. The pH value of the cleaning water is 9.0, and the deviation is within ±10%.

[Comparative Example 5] To ultrapure water, add ammonia with a conductivity of 30 μS/cm, add hydrogen peroxide with a redox potential of 600 mV, add hydrogen with a hydrogen concentration of 10 ppm, and have a pH of 9.0 After adding ammonia to produce washing water, it is continuously transferred to the point of use at 50 L/min. Wafers were cleaned at 2 L/min for 1 minute using the cleaning water. The overall time required to process a wafer is 3 minutes. This cleaning process is continued for 10 wafers. During the period when the cleaning water at the point of use is interrupted, the cleaning liquid is also manufactured and continuously transferred to the point of use.

As a result, the preparation time (time until the cleaning water stabilizes) for cleaning the wafer is zero, the amount of waste liquid per hour becomes 3000 L, and a large amount of waste liquid appears. The conductivity of the cleaning water is 30 μS/cm, the oxidation-reduction potential is 600 mV, the hydrogen concentration is 10 ppm, the pH value is 9.0, and the deviation is within ±10%.

[Comparative Example 6] After adding ammonia to the ultrapure water so that the conductivity becomes 30 μS/cm to produce washing water, it is transferred to the point of use at 50 L/min. Except for the wafer cleaning process, the transfer of cleaning water to the point of use is stopped. Wafers were cleaned at 2 L/min for 1 minute using the cleaning water. The overall time required to process a wafer is 3 minutes. This cleaning process is continued for 10 wafers. After the continuous cleaning process of the wafer ends, the supply of cleaning water to the point of use is stopped.

As a result, the preparation time (time until the cleaning water stabilizes) for the wafer cleaning process was 20 minutes, the amount of waste liquid per hour became 2500 L, and a large amount of waste liquid appeared. The conductivity of the cleaning water is 30 μS/cm, and the deviation is within ±10%.

[Comparative Example 7] After adding hydrogen peroxide water to the ultrapure water so that the oxidation-reduction potential becomes 600 mV to produce washing water, it was transferred to the point of use at 50 L/min. Except for the wafer cleaning process, the transfer of cleaning water to the point of use is stopped. Wafers were cleaned at 2 L/min for 1 minute using the cleaning water. The overall time required to process a wafer is 3 minutes. This cleaning process is continued for 10 wafers. After the continuous cleaning process of the wafer ends, the supply of cleaning water to the point of use is stopped.

As a result, the preparation time (time until the cleaning water stabilizes) for the wafer cleaning process was 20 minutes, the amount of waste liquid per hour became 2500 L, and a large amount of waste liquid appeared. The redox potential of the cleaning water is 600 mV, and the deviation is within ±10%.

[Comparative Example 8] After adding hydrogen to ultrapure water so that the hydrogen concentration becomes 10 ppm to produce washing water, it is transferred to the point of use at 50 L/min. Except for the wafer cleaning process, the transfer of cleaning water to the point of use is stopped. Wafers were cleaned at 2 L/min for 1 minute using the cleaning water. The overall time required to process a wafer is 3 minutes. This cleaning process is continued for 10 wafers. After the continuous cleaning process of the wafer ends, the supply of cleaning water to the point of use is stopped.

As a result, the preparation time (time until the cleaning water stabilizes) for the wafer cleaning process was 20 minutes, the amount of waste liquid per hour became 2500 L, and a large amount of waste liquid appeared. The hydrogen concentration in the water quality of the washing water is 10 ppm, and the deviation is within ±10%.

[Comparative Example 9] After adding ammonia to the ultrapure water so that the pH value becomes 9.0 to produce washing water, it was transferred to the point of use at 50 L/min. Except for the wafer cleaning process, the transfer of cleaning water to the point of use is stopped. Wafers were cleaned at 2 L/min for 1 minute using the cleaning water. The overall time required to process a wafer is 3 minutes. This cleaning process is continued for 10 wafers. After the continuous cleaning process of the wafer ends, the supply of cleaning water to the point of use is stopped.

As a result, the preparation time (time until the cleaning water stabilizes) for the wafer cleaning process was 20 minutes, the amount of waste liquid per hour became 2500 L, and a large amount of waste liquid appeared. The pH value of the cleaning water is 9.0, and the deviation is within ±10%.

[Comparative Example 10] To ultrapure water, add ammonia with a conductivity of 30 μS/cm, add hydrogen peroxide with a redox potential of 600 mV, add hydrogen with a hydrogen concentration of 10 ppm, and have a pH of 9.0 After adding ammonia to produce washing water, transfer it to the point of use at 50 L/min. Except for the wafer cleaning process, the transfer of cleaning water to the point of use is stopped. Wafers were cleaned at 2 L/min for 1 minute using the cleaning water. The overall time required to process a wafer is 3 minutes. This cleaning process is continued for 10 wafers. After the continuous cleaning process of the wafer ends, the supply of cleaning water to the point of use is stopped.

As a result, the preparation time (time until the cleaning water stabilizes) for the wafer cleaning process was 20 minutes, the amount of waste liquid per hour became 2500 L, and a large amount of waste liquid appeared. The conductivity of the cleaning water is 30 μS/cm, the oxidation-reduction potential is 600 mV, the hydrogen concentration is 10 ppm, the pH value is 9.0, and the deviation is within ±10%.

In the following comparative example 11, the manufacturing system 300 for the cleaning water for electronic components shown in FIG. 4 was used to manufacture the cleaning water for electronic components. The manufacturing system 300 for washing water for electronic parts temporarily stores unused washing water in a tank at a point of use, and manufactures and replenishes the tank with a portion of the washing water that has been reduced by use at the point of use. The manufacturing system 300 for cleaning water for electronic parts includes: a first transfer line L31 connecting the raw water supply unit and the storage tank 34; a second transfer line L32 connecting the storage tank 34 and the point of use; and a return line L33 located at the second The branch point on the downstream side of the transfer line L32 branches and communicates with the storage tank 34. A flow meter 31 and a functional substance addition device 32 are provided in this order along the flow direction on the first transfer line L31, and a physical property measuring device 33 is provided on the upstream side of the branch point in the second transfer line L32. The supply amount of ultrapure water from the raw water supply unit to the first transfer line L31 can be adjusted by the on-off valve 36 provided on the upstream side of the flowmeter 31 in the first transfer line L31. The functional substance addition device 32 is connected to the first transfer line L31 via an on-off valve 37. In the second transfer line L32, on the downstream side of the storage tank 34, an on-off valve 38 and a water supply pump 35 are provided in this order along the flow direction.

[Comparative Example 11] To ultrapure water, add ammonia with a conductivity of 30 μS/cm, add hydrogen peroxide with a redox potential of 600 mV, add hydrogen with a hydrogen concentration of 10 ppm, and have a pH of 9.0 After adding ammonia to produce washing water, transfer it to the point of use at 50 L/min. Except for the wafer cleaning process, the transfer of cleaning water to the point of use is stopped. Wafers were cleaned at 2 L/min for 1 minute using the cleaning water. The overall time required to process a wafer is 3 minutes. This cleaning process is continued for 10 wafers. After the continuous cleaning process of the wafer ends, the supply of cleaning water to the point of use is stopped.

As a result, the preparation time (time until the cleaning water stabilizes) for cleaning the wafer is zero, and the amount of waste liquid per hour is 20 L. The conductivity of the cleaning water is 30 μS/cm, the oxidation-reduction potential is 600 mV, the hydrogen concentration is 10 ppm, the pH value is 9.0, and the deviation is within ±30%.

〔result〕 Table 1 summarizes the results of Example 1 to Example 5 and Comparative Example 1 to Comparative Example 11. In Example 1 to Example 5, the preparation time (the time until the cleaning water stabilizes) for cleaning the wafer is zero, and the amount of waste liquid per hour is also as low as 20 L. On the other hand, in Comparative Example 1 to Comparative Example 5, the preparation time (time until the cleaning water stabilizes) for cleaning the wafer is zero, but the amount of waste liquid per hour is a huge amount. 3000 L. In Comparative Example 6 to Comparative Example 10, the preparation time (time until the cleaning water is stabilized) for cleaning the wafer is 20 minutes, and the amount of waste liquid per hour is a huge amount of 2500 L. In addition, in Comparative Example 11, the preparation time (time until the cleaning water stabilizes) for cleaning the wafer is zero, and the amount of waste liquid per hour is as low as 20 L, but the quality of the cleaning water varies Big.

[Table 1]

As described above, according to the manufacturing system and method for manufacturing cleaning water for electronic parts of the present invention, regardless of whether the cleaning water is used at the point of use, the manufactured cleaning water is transferred to the point of use, and It is also controlled by the control part to return the washing water to the return line and temporarily store it in the storage tank when the washing water is not used at the point of use, and to store it in the storage when the washing water is used at the point of use The washing water in the tank is supplied to the transfer line, which can greatly reduce the amount of waste water of the produced washing water, and can also shorten the preparation time of the washing water used at the point of use (the time until the washing water is stable under the set conditions) ). Furthermore, the cleaning water supplied from the storage tank to the transfer line can be mixed with the newly-made cleaning water on the transfer line to quantitatively measure the physical properties on the transfer line, so it is always possible to supply cleaning water with a certain physical value to the point of use . [Industry availability]

The present invention is useful as a manufacturing system for a washing water for electronic parts used in a manufacturing process of electronic parts such as semiconductors, liquid crystals, organic ELs, and a method for manufacturing the washing water for electronic parts using the same.

1: the first flowmeter 2: Functional substance addition device 3: Physical property measuring device 4: storage tank 5: Second flow meter 6: Water supply pump 7: Control components 8: branch point 9: confluence point 10: The first switch valve 11: Second on-off valve 12: Third switching valve 21: Flowmeter 22: Functional substance adding device 23: Physical property measuring device 24: On-off valve 25: On-off valve 31: Flowmeter 32: Functional substance adding device 33: Physical property measuring device 34: Storage tank 35: Water supply pump 36: On-off valve 37: On-off valve 38: On-off valve 81: Switch three-way valve 100: Washing water manufacturing system for electronic parts 200: Manufacturing system of cleaning water for electronic parts 300: Manufacturing system of cleaning water for electronic parts L1: Transfer pipeline L2: Return pipeline L21: Transfer pipeline L31: the first transfer pipeline L32: Second transfer pipeline L33: Return pipeline W: Ultra-pure water (raw water) W1, W1', W1'': washing water

FIG. 1 is a schematic explanatory diagram showing a washing water manufacturing system for electronic parts according to an embodiment of the present invention. FIGS. 2(a) to 2(c) are schematic explanatory diagrams showing the flow state of the washing water in the washing water manufacturing system for electronic parts of FIG. 1, (a) is showing whether the washing water is used or not at the point of use. The state where the washing water is transferred to the point of use, (b) indicates the case where the washing water is not used at the point of use, and (c) indicates the case where the washing water is used at the point of use after (b). 3 is a schematic explanatory diagram showing a conventional washing water manufacturing system for electronic parts used in Comparative Example 1 to Comparative Example 10. FIG. 4 is a schematic explanatory diagram showing a conventional washing water manufacturing system for electronic parts used in Comparative Example 11. FIG.

1: the first flowmeter

2: Functional substance addition device

3: Physical property measuring device

4: storage tank

5: Second flow meter

6: Water supply pump

8: branch point

9: confluence point

10: The first switch valve

11: Second on-off valve

12: Third switching valve

81: Switch three-way valve

100: Washing water manufacturing system for electronic parts

L1: Transfer pipeline

L2: Return pipeline

W: ultrapure water

W1, W1': washing water

Claims (8)

A cleaning water manufacturing system for electronic parts, including: Transfer pipeline to connect the raw water supply department and the point of use; The return line branches at a branch point on the downstream side of the transfer line and merges at a junction point on the upstream side; A functional substance addition device, connected to the upstream side of the confluence point in the transfer line, adding functional substances to the raw material water supplied to the transfer line to produce washing water; A physical property measuring device connected to the downstream side of the confluence point in the transfer line to measure the physical properties of the washing water; A storage tank provided in the return line and capable of storing the washing water; and The control part controls the flow path of the washing water. The cleaning water manufacturing system for electronic parts as described in item 1 of the patent scope, in which When it is determined that the washing water is not used at the point of use, the control unit controls to store the washing water in the storage tank via the return line, When it is determined that the washing water is used at the point of use, the control unit controls to supply the washing water stored in the storage tank to the transfer line. The cleaning water manufacturing system for electronic parts as described in item 1 or item 2 of the scope of patent application further includes: A first flow meter connected to the upstream side of the confluence point in the transfer line; and The second flowmeter is connected to the downstream side of the storage tank in the return line, When it is determined that the washing water is used at the point of use, the control unit controls the washing water produced on the transfer line based on the measured value of the first flowmeter and the measured value of the second flowmeter的量。 The amount. The washing water manufacturing system for electronic parts as described in any one of claims 1 to 3, wherein the combination of the functional substance and the physical property measurement device is selected from a substance imparted with conductivity and conductivity One, two or more of the group consisting of a meter, a redox potential adjustment substance and a redox potentiometer, a pH adjustment substance and a pH meter, and a gas and a gas concentration meter. An operation method of a cleaning water manufacturing system for electronic parts, wherein the cleaning water manufacturing system for electronic parts includes: Transfer the pipeline to connect the raw water supply unit and the point of use; The return line branches at a branch point on the downstream side of the transfer line and merges at a junction point on the upstream side; A functional substance addition device, connected to the upstream side of the confluence point in the transfer line, and adding functional substances to the raw material water supplied to the transfer line to produce washing water; A physical property measuring device connected to the downstream side of the confluence point in the transfer line to measure the physical properties of the washing water; A storage tank provided in the return line and capable of storing the washing water; and A control component that controls the flow path of the washing water, The operating method of the washing water manufacturing system for electronic parts is characterized in that the washing water is transferred to the usage point via the transfer line regardless of whether the washing water is used at the usage point. The operation method of the cleaning water manufacturing system for electronic parts as described in item 5 of the patent scope, in which When it is determined that the washing water is not used at the point of use, the control unit controls to store the washing water in the storage tank via the return line, When it is determined that the washing water is used at the point of use, the control unit controls to supply the washing water stored in the storage tank to the transfer line. The method for operating a manufacturing system for cleaning water for electronic parts as described in item 5 or 6 of the patent application scope, wherein the manufacturing system for cleaning water for electronic parts further includes: A first flow meter connected to the upstream side of the confluence point in the transfer line; and The second flowmeter is connected to the downstream side of the storage tank in the return line, When it is determined that the washing water is used at the point of use, the control unit controls the washing water produced on the transfer line based on the measured value of the first flowmeter and the measured value of the second flowmeter的量。 The amount. The operation method of the washing water manufacturing system for electronic parts as described in any one of claims 5 to 7, wherein the combination of the functional substance and the physical property measurement device is selected from the substances imparted by conductivity One or two or more of the group consisting of a conductivity meter, a redox potential adjusting substance and a redox potentiometer, a pH adjusting substance and a pH meter, and a gas and a gas concentration meter.

Images