TW202000560A - Board processing apparatus - Google Patents

Board processing apparatus Download PDF

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TW202000560A
TW202000560A TW107122322A TW107122322A TW202000560A TW 202000560 A TW202000560 A TW 202000560A TW 107122322 A TW107122322 A TW 107122322A TW 107122322 A TW107122322 A TW 107122322A TW 202000560 A TW202000560 A TW 202000560A
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module
workpiece
axial
board
board processing
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TW107122322A
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Chinese (zh)
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TWI660897B (en
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游振輝
邱玟棋
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威至科技股份有限公司
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Abstract

The present invention relates to a board processing apparatus. The apparatus comprises, arranged in sequence, a feeding section, a preparation section and a laminating section. The sections are equipped with a conveyor module, a detection module, a feeder plate, an inspecting module, and a transferring module. The transferring module is adapted to transfer a workpiece located atop the feeder plate to the inspecting module, where the workpiece is inspected for its number and position on the electrostatic chuck. If the number and position are correct, the workpiece will be placed on a board piece transferred beforehand to the preparation section. The board piece is then advanced along with the workpiece placed thereon to the laminating section by the conveyor module, where they are laminated.

Description

板件處理裝置Plate processing device
本發明係有關一種改善製程作業方式,提升單位時間產能之板件處理裝置。The invention relates to a panel processing device which improves the process operation mode and enhances the unit time productivity.
按,一般電子元件的種類廣泛,然基於必要的需求常有將二種以上的電子元件結合者,例如撓性基板(flexible substrate,又稱軟性印刷電路板FPC)與一載體的貼合,此種撓性基板之電子元件與一載體貼合的方法,先前技術中所採用者包括以熱源進行壓合的方式,以及以黏膠進行貼合的方式,茲以黏膠進行貼合的方式為例,先前技術通常採用人工逐一取用撓性基板將其逐一覆設對位於欲貼合其上的載體,再於貼合後予以一壓力進行平整,以確定黏貼定位。Generally, there are a wide range of electronic components. However, based on the necessary requirements, there are often two or more electronic components combined, such as a flexible substrate (flexible substrate, also known as flexible printed circuit board FPC) and a carrier. A method for bonding the electronic components of a flexible substrate to a carrier. The methods used in the prior art include a method of pressing with a heat source and a method of bonding with an adhesive. The method of bonding with an adhesive is: For example, in the prior art, a flexible substrate is manually taken one by one to cover it one by one on the carrier that is to be attached to it, and then a pressure is applied after the attachment to smooth it out to determine the adhesion position.
惟,上述人工對位進行壓合之先前技術僅適用於少量的貼合作業,對於大量的撓性基板貼合除將耗用龐大的人力資源,對於貼合的品質亦構成疑慮,而由於時下智慧型手機盛行,其量大且輕薄短小、功能強的屬性,使撓性基板的面積更微小,其上的電子線路佈設亦3D化,已不再僅是單純的2D線路佈設,故其黏覆在載體的位置精確性要求更高,產能效率的提昇與產品品質的穩定性要求亦日益嚴苛,加上人工成本逐日攀昇,實不容再以人工進行貼合作業。However, the above-mentioned prior art of manual alignment is only applicable to a small number of bonding industries. In addition to the large number of flexible substrate bonding, it will consume huge human resources, and it also poses doubts about the quality of bonding. The prevalence of smart phones is prevalent. The large quantity, thinness, shortness, and strong function make the area of the flexible substrate smaller, and the electronic circuit layout on it is also 3D. It is no longer just a simple 2D circuit layout. The accuracy of the position of the adhesive on the carrier is higher, the improvement of production efficiency and the stability of product quality are also increasingly stringent, and the labor cost is rising day by day. It is no longer possible to manually paste the cooperative industry.
本發明的主要目是提供一種板件處理裝置,導入一自動化作業流程,藉由整合自動化傳輸及對位,能將對位時所會耗費的時間與誤差,降至最低,所以在改善製程作業方式的同時,縮短每單位壓合時間,提升單位時間產能,更方便調整生產製程,以爭取商機,並更能降低整體的成本、人力的負擔與不良率,提昇產品競爭力之目的。The main purpose of the present invention is to provide a board processing device that introduces an automated operation process. By integrating automated transmission and alignment, the time and error that would be spent in alignment can be minimized, so the process is improved At the same time, it shortens the pressing time per unit, improves the production capacity per unit time, makes it easier to adjust the production process to win business opportunities, and can reduce the overall cost, labor burden and defect rate, and enhance the purpose of product competitiveness.
本發明的次要目的是提供一種板件處理裝置,利用自動檢測比對,來提供壓合位置之精確性,達到產品品質的高穩定性,以及提升產品良率之目的。The secondary object of the present invention is to provide a board processing device that uses automatic detection and comparison to provide accuracy of the pressing position, achieve high stability of product quality, and improve product yield.
本發明之板件處理裝置至少包含有:依序排列之一送料區段、一預備區段以及一壓合區段;一輸送模組,用以輸送一板件運行於該送料區段、該預備區段以及該壓合區段;一偵測模組,係位於該送料區段用以偵測該板件之位置,並可輸出一位置訊號;一供料平台,係位於該預備區段之第一軸向位置,係用以堆疊放置至少一待壓合於該板件上之工件;一檢測模組,係位於該預備區段之第二軸向位置,係預先儲存有至少一對位參數;以及一傳送模組,具有一機械手臂以及受該機械手臂帶動之靜電吸盤,該機械手臂係帶動該靜電吸盤移動至該第一軸向位置或第二軸向位置。The board processing device of the present invention at least includes: a feeding section, a preliminary section and a pressing section arranged in sequence; a conveying module for conveying a board running on the feeding section, the The preparation section and the pressing section; a detection module located in the feeding section for detecting the position of the board and outputting a position signal; a feeding platform located in the preparation section The first axial position is used to stack and place at least one workpiece to be pressed on the plate; a detection module is located at the second axial position of the preparation section, and at least one pair is stored in advance Position parameter; and a transmission module with a mechanical arm and an electrostatic chuck driven by the mechanical arm, the mechanical arm drives the electrostatic chuck to move to the first axial position or the second axial position.
其中,該傳送模組之靜電吸盤係吸取該供料平台最上層之一工件,並將該工件移動至該檢測模組,供檢測模組進行檢測並與該對位參數進行比對,藉以確認該靜電吸盤所吸取之工件其數量及位置是否正確,若比對正確則將該工件放置於預先輸送至該預備區段之該板件上方,且該傳送模組並可接收該位置訊號調整該工件之相對位置,該板件及其上方之工件由輸送模組傳送至該壓合區段進行壓合。Among them, the electrostatic chuck of the conveying module sucks one of the uppermost workpieces of the feeding platform and moves the workpieces to the inspection module for the inspection module to inspect and compare with the alignment parameters to confirm Whether the quantity and position of the workpiece sucked by the electrostatic chuck are correct, if the comparison is correct, the workpiece is placed above the plate pre-transported to the preparation section, and the transmission module can receive the position signal to adjust the The relative position of the workpiece, the plate and the workpiece above it are transferred by the conveying module to the pressing section for pressing.
依據上述技術特徵,所述第一軸向位置與該第二軸向位置之間夾角係為90度。According to the above technical features, the angle between the first axial position and the second axial position is 90 degrees.
依據上述技術特徵,所述供料平台上所堆疊之每一層工件可具有至少一薄板。According to the above technical features, each layer of workpieces stacked on the feeding platform may have at least one thin plate.
依據上述技術特徵,所述傳送模組進一步設有一電源供應器,係控制該靜電吸盤之電性強度。According to the above technical features, the transmission module is further provided with a power supply to control the electrical strength of the electrostatic chuck.
依據上述技術特徵,所述供料平台下方進一步設有至少一動力件,可控制該供料平台於該第一軸向位置之上下高度。According to the above technical features, at least one power member is further provided below the feeding platform to control the height of the feeding platform above and below the first axial position.
依據上述技術特徵,所述輸送模組具有至少一輸送帶以及帶動該輸送帶運作之作動件。According to the above technical features, the conveyor module has at least one conveyor belt and an actuator for driving the conveyor belt.
依據上述技術特徵,所述輸送帶相對之兩外側進一步設有至少一組定位塊。According to the above technical features, at least two sets of positioning blocks are further provided on the opposite outer sides of the conveyor belt.
依據上述技術特徵,所述測模組係為CCD(Charge Coupled Device,電荷耦合器件)攝像元件。According to the above technical features, the measurement module is a CCD (Charge Coupled Device, charge coupled device) imaging element.
依據上述技術特徵,所述檢測模組係具有一控制器以及與該控制器連接之雷射組件。According to the above technical features, the detection module has a controller and a laser component connected to the controller.
依據上述技術特徵,所述對位參數係包含由該控制器輸入該工件數量、該工件厚度以及該工件相對於該板件之壓合位置。According to the above technical features, the alignment parameter includes the controller inputting the number of the workpiece, the thickness of the workpiece, and the pressing position of the workpiece relative to the plate.
除非另外說明,否則本申請說明書和申請專利範圍中所使用的下列用語具有下文給予的定義。請注意,本申請說明書和申請專利範圍中所使用的單數形用語「一」意欲涵蓋在一個以及一個以上的所載事項,例如至少一個、至少二個或至少三個,而非意味著僅僅具有單一個所載事項。此外,申請專利範圍中使用的「包含」、「具有」等開放式連接詞是表示請求項中所記載的元件或成分的組合中,不排除請求項未載明的其他組件或成分。亦應注意到用語「或」在意義上一般也包括「及/或」,除非內容另有清楚表明。本申請說明書和申請專利範圍中所使用的用語「約(about)」或「實質上(substantially)」,是用以修飾任何可些微變化的誤差,但這種些微變化並不會改變其本質。Unless otherwise stated, the following terms used in the specification and patent scope of this application have the definitions given below. Please note that the singular term "a" used in the specification and patent scope of this application is intended to cover one or more of the items contained, such as at least one, at least two, or at least three, and does not mean to have only The single item contained. In addition, open connection terms such as "include", "have", etc. used in the scope of patent application mean that the combination of elements or components described in the request does not exclude other components or components not specified in the request. It should also be noted that the term "or" also generally includes "and/or" in the sense, unless the content clearly indicates otherwise. The terms "about" or "substantially" used in the specification and patent scope of this application are used to modify any slight variation error, but such slight variation will not change its essence.
首先,本案方法涉及一種板件處理裝置,請參閱第1圖所示為本發明中板件處理裝置之結構示意圖,至少包含有:依序排列之送料區段101、預備區段102以及壓合區段103,與配置於上述區段之輸送模組1、偵測模組(圖未示)、供料平台2、檢測模組以及傳送模組3。First of all, the method in this case involves a board processing device. Please refer to FIG. 1 for a schematic view of the structure of the board processing device in the present invention, which at least includes: a feeding section 101, a preparation section 102 and a pressing section arranged in sequence Section 103, and the delivery module 1, the detection module (not shown), the feeding platform 2, the detection module, and the transfer module 3 disposed in the above section.
輸送模組1用以輸送一板件運行於該送料區段101、該預備區段102以及該壓合區段103。請同時參閱第2圖及第3圖所示,該輸送模組1具有至少一輸送帶11以及帶動該輸送帶11運作之作動件12,如圖所示之實施例中,係具有二個輸送帶11並受一作動件12帶動而同向運作,該作動件12可以包含有馬達或汽缸及其帶動之傳動組件,以供板件41可於輸送帶11上穩定地被傳送;而該輸送帶11相對之兩外側進一步設有至少一組定位塊,如圖所示之實施例中,係具有第一組、第二組定位塊131、132,第一組定位塊131與第二組定位塊132係具有不同間距大小,如第3圖及第4圖所示,且第一組定位塊131與第二組定位塊132可選擇性凸伸於輸送模組1,可供固定不同寬度的板件41。或者,該輸送帶11相對之兩外側僅設有一組第一組定位塊131,如第2圖所示,該第一組定位塊131上設有調整件133可供調整其間距大小,亦可供固定不同寬度的板件41。The conveying module 1 is used to convey a plate to run on the feeding section 101, the preparation section 102 and the pressing section 103. Please also refer to FIG. 2 and FIG. 3, the conveyor module 1 has at least one conveyor belt 11 and an actuator 12 that drives the conveyor belt 11 to operate. In the embodiment shown in the figure, there are two conveyors The belt 11 is driven by an actuating member 12 and operates in the same direction. The actuating member 12 may include a motor or a cylinder and a transmission component driven by it, so that the plate 41 can be stably transferred on the conveyor belt 11; At least two sets of positioning blocks are further provided on opposite sides of the belt 11. In the embodiment shown in the figure, there are first and second sets of positioning blocks 131 and 132. The first set of positioning blocks 131 and the second set of positioning blocks The blocks 132 have different pitch sizes, as shown in FIG. 3 and FIG. 4, and the first group of positioning blocks 131 and the second group of positioning blocks 132 can selectively protrude from the conveying module 1 for fixing different widths板件41。 41. Or, the two outer sides of the conveyor belt 11 are only provided with a first set of positioning blocks 131. As shown in FIG. 2, the first set of positioning blocks 131 is provided with an adjusting member 133 for adjusting the distance between them, or For fixing plates 41 of different widths.
偵測模組係位於該送料區段101用以偵測該板件41之位置,並可輸出一位置訊號,該位置訊號係關於該板件之大小以及位於該輸送模組1上之相對位置。The detection module is located in the feeding section 101 for detecting the position of the board 41, and can output a position signal, the position signal relates to the size of the board and the relative position on the conveyor module 1 .
供料平台2係位於該預備區段102之第一軸向位置X,係用以堆疊放置至少一待壓合於該板件上之工件42。The feeding platform 2 is located at the first axial position X of the preparation section 102 and is used to stack and place at least one workpiece 42 to be pressed on the plate.
檢測模組係位於該預備區段102之第二軸向位置Y,如第2圖及第5圖所示,係預先儲存有至少一對位參數。如圖所示之實施例中,該第一軸向位置X與該第二軸向位置Y之間夾角係為90度,該夾角為90度之限定係為機構配置上所佔用範圍較小之設計;當然,該第一軸向位置X與該第二軸向位置Y亦可以為相同軸向之配置,抑或者可為其他夾角之配置。其中,該檢測模組係具有一控制器51以及與該控制器51連接之雷射組件(圖未示),上述之對位參數係可包含由該控制器51輸入該工件數量、該工件厚度以及該工件相對於該板件之壓合位置等數據,並由該雷射組件進行掃描檢測後之檢測結果傳送至該控制器51與該對位參數進行比對。The detection module is located at the second axial position Y of the preparation section 102. As shown in FIGS. 2 and 5, at least one pair of alignment parameters is stored in advance. In the embodiment shown in the figure, the included angle between the first axial position X and the second axial position Y is 90 degrees. The limit of the included angle is 90 degrees is that the occupied range of the mechanism configuration is smaller Design; of course, the first axial position X and the second axial position Y may also be configured in the same axial direction, or may be configured at other included angles. Wherein, the detection module has a controller 51 and a laser component (not shown) connected to the controller 51. The above-mentioned alignment parameters may include the controller 51 inputting the number of workpieces and the thickness of the workpiece And the data such as the pressing position of the workpiece relative to the board, and the detection result after the scanning detection by the laser assembly is transmitted to the controller 51 and compared with the alignment parameter.
傳送模組3具有一機械手臂31以及受該機械手臂31帶動之靜電吸盤32,該機械手臂31係帶動該靜電吸盤32移動至該第一軸向位置X或第二軸向位置Y,如圖所示之實施例中,該第一軸向位置X與該第二軸向位置Y之間夾角係為90度,故機械手臂31可帶動該靜電吸盤32於90度的角度範圍內進行翻轉定位,讓靜電吸盤32可移動至該第一軸向位置X以吸取供料平台2上之工件42,以及吸取工件42並翻轉至第二軸向位置Y供檢測模組進行檢測。The transmission module 3 has a mechanical arm 31 and an electrostatic chuck 32 driven by the mechanical arm 31. The mechanical arm 31 drives the electrostatic chuck 32 to move to the first axial position X or the second axial position Y, as shown in FIG. In the illustrated embodiment, the included angle between the first axial position X and the second axial position Y is 90 degrees, so the robotic arm 31 can drive the electrostatic chuck 32 to rotate and position within an angle range of 90 degrees , So that the electrostatic chuck 32 can be moved to the first axial position X to suck the workpiece 42 on the feeding platform 2, and the workpiece 42 is sucked and turned to the second axial position Y for the detection module to detect.
本發明之板件41可以為金屬基板、高分子基板、複合式基板或其他習知使用於電路板的板件,而該供料平台2上所堆疊之每一層工件42可具有至少一薄板421,該薄板421可以為介電材料或金屬材料,如第6圖所示之實施例中,每一層工件42具有二個多孔型薄板421,而靜電吸盤32可一次性將每一層工件42所具有之複數多孔型薄板421吸取定位且穩定的傳送。The board 41 of the present invention may be a metal substrate, a polymer substrate, a composite substrate or other conventional boards used for circuit boards, and each layer of workpiece 42 stacked on the feeding platform 2 may have at least one thin plate 421 The thin plate 421 may be a dielectric material or a metal material. As shown in the embodiment shown in FIG. 6, each layer of work piece 42 has two porous thin plates 421, and the electrostatic chuck 32 can store each layer of work piece 42 at once. The plurality of porous thin plates 421 are sucked and positioned and transported stably.
整體處理裝置使用時,由輸送模組1之輸送帶11將一板件41輸送至送料區段101,如第2圖所示,由偵測模組偵測該板件41之位置,並可輸出一位置訊號,該位置訊號係關於該板件之大小以及位於該輸送模組1上之相對位置。偵測完成後,輸送模組1之輸送帶11再將板件41輸送至預備區段102。When the overall processing device is in use, the conveyor belt 11 of the conveyor module 1 conveys a plate 41 to the feeding section 101. As shown in FIG. 2, the position of the plate 41 is detected by the detection module, and A position signal is output, which is about the size of the board and the relative position on the conveying module 1. After the detection is completed, the conveyor belt 11 of the conveyor module 1 conveys the board 41 to the preparation section 102 again.
同時,傳送模組3之機械手臂31帶動靜電吸盤32移動至該第一軸向位置X以吸取供料平台2最上層之工件42,請同時參閱第5圖及第6圖所示,機械手臂31再進行翻轉,將吸取工件42之靜電吸盤32翻轉至第二軸向位置Y供檢測模組進行檢測;檢測模組之雷射組件進行掃描檢測後,並將檢測所得到之檢測結果傳送至該控制器51與該對位參數進行比對,藉以確認該靜電吸盤32所吸取之工件42其數量及位置是否正確。At the same time, the mechanical arm 31 of the conveying module 3 drives the electrostatic chuck 32 to the first axial position X to suck the uppermost workpiece 42 of the feeding platform 2, please refer to FIGS. 5 and 6 for the mechanical arm 31 Turn over again, and turn the electrostatic chuck 32 that sucks the work piece 42 to the second axial position Y for the detection module to detect; after the laser component of the detection module is scanned and detected, the detection result obtained by the detection is transmitted to The controller 51 compares the alignment parameters to confirm whether the number and position of the workpieces 42 sucked by the electrostatic chuck 32 are correct.
若比對正確,機械手臂31則帶動靜電吸盤32將工件42移動於預先輸送至該預備區段102之該板件41上方,且該傳送模組之機械手臂31並可接收該位置訊號調整該工件之相對位置,再將工件42放置於板件41上,而該板件41及其上方之工件42由輸送模組傳送至該壓合區段進行壓合。If the comparison is correct, the robotic arm 31 drives the electrostatic chuck 32 to move the workpiece 42 over the plate 41 that is pre-transported to the preparation section 102, and the robotic arm 31 of the transfer module can receive the position signal to adjust the The relative position of the workpieces, and then the workpiece 42 is placed on the plate 41, and the plate 41 and the workpiece 42 above it are transferred by the conveying module to the pressing section for pressing.
另外,該供料平台2下方進一步設有至少一動力件21,如第6圖所示,該動力件21可以為氣壓缸,可控制該供料平台2於該第一軸向位置X之上下高度,達到緩衝作用;再者,該傳送模組進一步設有一電源供應器(圖未示),可控制該靜電吸盤之電性強度,藉以調整靜電吸盤之靜電吸引力強度,可吸取不同厚度的薄板。In addition, at least one power member 21 is further provided below the feeding platform 2. As shown in FIG. 6, the power member 21 may be a pneumatic cylinder, which can control the feeding platform 2 above and below the first axial position X The height achieves the buffer effect; furthermore, the transmission module is further provided with a power supply (not shown), which can control the electrical strength of the electrostatic chuck, thereby adjusting the electrostatic attraction strength of the electrostatic chuck, and can absorb different thicknesses sheet.
如第7圖所示,本發明中板件處理裝置除了上述依序排列之送料區段101、預備區段102以及壓合區段103外,可進一步於壓合區段103之後配置一待收料區段104,用以接收完成壓合之板件並等待收料;另外,送料區段101前配置一自動輸送單元60,以利用自動化方式將板件傳輸至該送料區段101,以及待收料區段104之後亦配置一自動輸送單元60,以利用自動化方式將完成壓合板件進行收料。As shown in FIG. 7, in addition to the above-mentioned sequentially arranged feeding section 101, preparation section 102 and pressing section 103, the board processing device of the present invention may further be arranged after the pressing section 103 The material section 104 is used to receive the plate parts that have been pressed and wait for the receipt; in addition, an automatic conveying unit 60 is arranged in front of the feed section 101 to transfer the plate parts to the feed section 101 in an automated manner, and After the receiving section 104, an automatic conveying unit 60 is also arranged to collect the finished laminated plates in an automated manner.
本發明主要係導入一自動化作業流程,藉由整合自動化傳輸及對位,能將對位時所會耗費的時間與誤差,降至最低,所以在改善製程作業方式的同時,縮短每單位壓合時間,提升單位時間產能,更方便調整生產製程,以爭取商機,並更能降低整體的成本、人力的負擔與不良率,提昇產品競爭力之目的;再者,利用自動檢測比對,來提供壓合位置之精確性,達到產品品質的高穩定性,以及提升產品良率之目的。The present invention mainly introduces an automated operation process. By integrating automated transmission and alignment, the time and error that will be spent in alignment can be minimized, so while improving the process operation method, shortening the pressure per unit Time, increase the production capacity per unit time, more convenient to adjust the production process to win business opportunities, and can reduce the overall cost, labor burden and defect rate, and improve the purpose of product competitiveness; Furthermore, the use of automatic detection and comparison to provide The accuracy of the pressing position achieves the high stability of product quality and the purpose of improving product yield.
綜上所述,本發明提供一種板件處理裝置,爰依法提呈發明專利之申請;本發明之技術內容及技術特點巳揭示如上,然而熟悉本項技術之人士仍可能基於本發明之揭示而作各種不背離本案發明精神之替換及修飾。因此,本發明之保護範圍應不限於實施例所揭示者,而應包括各種不背離本發明之替換及修飾,並為以下之申請專利範圍所涵蓋。In summary, the present invention provides a board processing device, and an application for an invention patent is filed according to law; the technical content and technical features of the present invention have been disclosed as above, but those familiar with the technology may still be based on the disclosure of the present invention Make various substitutions and modifications that do not deviate from the spirit of the present invention. Therefore, the protection scope of the present invention should not be limited to those disclosed in the embodiments, but should include various replacements and modifications without departing from the present invention, and be covered by the following patent application scope.
X‧‧‧第一軸向位置 Y‧‧‧第二軸向位置 101‧‧‧送料區段 102‧‧‧預備區段 103‧‧‧壓合區段 104‧‧‧待收料區段 1‧‧‧輸送模組 11‧‧‧輸送帶 12‧‧‧作動件 131‧‧‧第一組定位塊 132‧‧‧第二組定位塊 133‧‧‧調整件 2‧‧‧供料平台 21‧‧‧動力件 3‧‧‧傳送模組 31‧‧‧機械手臂 32‧‧‧靜電吸盤 41‧‧‧板件 42‧‧‧工件 421‧‧‧薄板 51‧‧‧控制器 60‧‧‧自動輸送單元 X‧‧‧ First axial position Y‧‧‧Second axial position 101‧‧‧Feeding section 102‧‧‧Preparation section 103‧‧‧ Compression section 104‧‧‧Pending section 1‧‧‧Conveying module 11‧‧‧Conveyor belt 12‧‧‧Actuator 131‧‧‧The first group of positioning blocks 132‧‧‧Second group positioning block 133‧‧‧Adjustment 2‧‧‧ Feeding platform 21‧‧‧Power Parts 3‧‧‧Transmission module 31‧‧‧Robot 32‧‧‧Electrostatic suction cup 41‧‧‧Plate 42‧‧‧Workpiece 421‧‧‧Thin plate 51‧‧‧Controller 60‧‧‧Automatic conveying unit
第1圖為本發明中處理裝置之結構示意圖。 第2圖為本發明中輸送模組之結構示意圖。 第3圖為本發明中輸送模組之放大示意圖。 第4圖為本發明中輸送模組之另一放大示意圖。 第5圖為本發明中傳送模組之結構示意圖。 第6圖為本發明中供料平台之結構示意圖。 第7圖為本發明中處理裝置之另一結構示意圖。Figure 1 is a schematic diagram of the structure of the processing device in the present invention. Figure 2 is a schematic diagram of the structure of the conveying module in the present invention. FIG. 3 is an enlarged schematic diagram of the conveying module in the present invention. FIG. 4 is another enlarged schematic diagram of the conveying module in the present invention. FIG. 5 is a schematic structural view of the transmission module in the present invention. Figure 6 is a schematic diagram of the structure of the feeding platform in the present invention. FIG. 7 is another schematic structural view of the processing device in the present invention.
101‧‧‧送料區段 101‧‧‧Feeding section
102‧‧‧預備區段 102‧‧‧Preparation section
103‧‧‧壓合區段 103‧‧‧ Compression section
1‧‧‧輸送模組 1‧‧‧Conveying module
2‧‧‧供料平台 2‧‧‧ Feeding platform
3‧‧‧傳送模組 3‧‧‧Transmission module
31‧‧‧機械手臂 31‧‧‧Robot
32‧‧‧靜電吸盤 32‧‧‧Electrostatic suction cup
51‧‧‧控制器 51‧‧‧Controller

Claims (10)

  1. 一種板件處理裝置,至少包含有: 依序排列之一送料區段、一預備區段以及一壓合區段; 一輸送模組,用以輸送一板件運行於該送料區段、該預備區段以及該壓合區段; 一偵測模組,係位於該送料區段用以偵測該板件之位置,並可輸出一位置訊號; 一供料平台,係位於該預備區段之第一軸向位置,係用以堆疊放置至少一待壓合於該板件上之工件; 一檢測模組,係位於該預備區段之第二軸向位置,係預先儲存有至少一對位參數;以及 一傳送模組,具有一機械手臂以及受該機械手臂帶動之靜電吸盤,該機械手臂係帶動該靜電吸盤移動至該第一軸向位置或第二軸向位置; 其中,該傳送模組之靜電吸盤係吸取該供料平台最上層之一工件,並將該工件移動至該檢測模組,供檢測模組進行檢測並與該對位參數進行比對,藉以確認該靜電吸盤所吸取之工件數量及位置是否正確,若比對正確則將該工件放置於預先輸送至該預備區段之該板件上方,且該傳送模組並可接收該位置訊號調整該工件之相對位置,該板件及其上方之工件由輸送模組傳送至該壓合區段進行壓合。A board processing device at least includes: a feeding section, a preparation section and a pressing section arranged in sequence; a conveying module for conveying a board running on the feeding section and the preparation Section and the pressing section; a detection module located in the feeding section for detecting the position of the board and outputting a position signal; a feeding platform located in the preparation section The first axial position is used to stack and place at least one workpiece to be pressed on the plate; a detection module is located at the second axial position of the preparation section, and at least one pair of positions is stored in advance Parameters; and a transfer module with a mechanical arm and an electrostatic chuck driven by the mechanical arm, the mechanical arm drives the electrostatic chuck to move to the first axial position or the second axial position; wherein, the transfer module The electrostatic chuck of the group sucks one of the uppermost workpieces of the feeding platform and moves the workpiece to the detection module for the detection module to detect and compare with the alignment parameters to confirm that the electrostatic chuck is sucked Whether the number and position of the workpieces are correct, if the comparison is correct, the workpiece is placed above the plate pre-delivered to the preparation section, and the transmission module can receive the position signal to adjust the relative position of the workpiece, the The board and the workpiece above it are transported by the conveying module to the pressing section for pressing.
  2. 如請求項1所述之板件處理裝置,其中,該第一軸向位置與該第二軸向位置之間夾角係為90度。The board processing device according to claim 1, wherein the angle between the first axial position and the second axial position is 90 degrees.
  3. 如請求項1所述之板件處理裝置,其中,該供料平台上所堆疊之每一層工件可具有至少一薄板。The board processing device according to claim 1, wherein each layer of workpieces stacked on the feeding platform may have at least one thin board.
  4. 如請求項1至3任一項所述之板件處理裝置,其中,該傳送模組進一步設有一電源供應器,係控制該靜電吸盤之電性強度。The board processing device according to any one of claims 1 to 3, wherein the transmission module is further provided with a power supply to control the electrical strength of the electrostatic chuck.
  5. 如請求項1至3任一項所述之板件處理裝置,其中,該供料平台下方進一步設有至少一動力件,可控制該供料平台於該第一軸向位置之上下高度。The board processing device according to any one of claims 1 to 3, wherein at least one power member is further provided below the feed platform to control the height of the feed platform above and below the first axial position.
  6. 如請求項1至3任一項所述之板件處理裝置,其中,該輸送模組具有至少一輸送帶以及帶動該輸送帶運作之作動件。The board processing device according to any one of claims 1 to 3, wherein the conveyor module has at least one conveyor belt and an actuator that drives the conveyor belt to operate.
  7. 如請求項6所述之板件處理裝置,其中,該輸送帶相對之兩外側進一步設有至少一組定位塊。The board processing device according to claim 6, wherein at least two sets of positioning blocks are further provided on two opposite sides of the conveyor belt.
  8. 如請求項1至3任一項所述之板件處理裝置,其中,該偵測模組係為CCD(Charge Coupled Device,電荷耦合器件)攝像元件。The board processing device according to any one of claims 1 to 3, wherein the detection module is a CCD (Charge Coupled Device, charge coupled device) imaging element.
  9. 如請求項1至3任一項所述之板件處理裝置,其中,該檢測模組係具有一控制器以及與該控制器連接之雷射組件。The board processing device according to any one of claims 1 to 3, wherein the detection module has a controller and a laser component connected to the controller.
  10. 如請求項9所述之板件處理裝置,其中,該對位參數係包含由該控制器輸入該工件數量、該工件厚度以及該工件相對於該板件之壓合位置。The panel processing device according to claim 9, wherein the alignment parameter includes the controller inputting the number of the workpiece, the thickness of the workpiece, and the pressing position of the workpiece relative to the panel.
TW107122322A 2018-06-28 2018-06-28 Board processing apparatus TWI660897B (en)

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CN203590599U (en) * 2013-09-30 2014-05-07 赫比(苏州)通讯科技有限公司 Automatic laminating machine for flexible circuit board
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