TW201834858A - 異向性導電連接構造體、異向性導電連接構造體之製造方法、異向性導電膜、及異向性導電糊 - Google Patents

異向性導電連接構造體、異向性導電連接構造體之製造方法、異向性導電膜、及異向性導電糊 Download PDF

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Publication number
TW201834858A
TW201834858A TW107104672A TW107104672A TW201834858A TW 201834858 A TW201834858 A TW 201834858A TW 107104672 A TW107104672 A TW 107104672A TW 107104672 A TW107104672 A TW 107104672A TW 201834858 A TW201834858 A TW 201834858A
Authority
TW
Taiwan
Prior art keywords
anisotropic conductive
electronic component
less
film
connection structure
Prior art date
Application number
TW107104672A
Other languages
English (en)
Chinese (zh)
Inventor
宮內幸一
Original Assignee
日商迪睿合股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商迪睿合股份有限公司 filed Critical 日商迪睿合股份有限公司
Publication of TW201834858A publication Critical patent/TW201834858A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Adhesive Tapes (AREA)
  • Wire Bonding (AREA)
  • Non-Insulated Conductors (AREA)
TW107104672A 2017-02-15 2018-02-09 異向性導電連接構造體、異向性導電連接構造體之製造方法、異向性導電膜、及異向性導電糊 TW201834858A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-026025 2017-02-15
JP2017026025 2017-02-15

Publications (1)

Publication Number Publication Date
TW201834858A true TW201834858A (zh) 2018-10-01

Family

ID=63169276

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107104672A TW201834858A (zh) 2017-02-15 2018-02-09 異向性導電連接構造體、異向性導電連接構造體之製造方法、異向性導電膜、及異向性導電糊

Country Status (3)

Country Link
JP (1) JP2018133331A (https=)
TW (1) TW201834858A (https=)
WO (1) WO2018150897A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7510292B2 (ja) * 2020-07-17 2024-07-03 京都エレックス株式会社 導電性接着剤組成物
WO2025134747A1 (ja) * 2023-12-22 2025-06-26 株式会社レゾナック 回路接続用接着剤フィルム、接続構造体の製造方法、導電材料、及び接続構造体

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11224976A (ja) * 1998-02-05 1999-08-17 Matsushita Electric Ind Co Ltd 配線基板
JP3447569B2 (ja) * 1998-07-23 2003-09-16 シャープ株式会社 異方性導電膜およびそれを用いた電極接続構造
JP5140816B2 (ja) * 2009-03-31 2013-02-13 デクセリアルズ株式会社 接合体及びその製造方法
JP6002500B2 (ja) * 2011-08-05 2016-10-05 積水化学工業株式会社 接続構造体の製造方法
JP6024235B2 (ja) * 2011-08-30 2016-11-09 日立化成株式会社 接着剤組成物及び回路接続構造体
JP2013199525A (ja) * 2012-03-23 2013-10-03 Dic Corp 共重合ポリエステル樹脂及び樹脂組成物
JP2014046622A (ja) * 2012-08-31 2014-03-17 Dexerials Corp 透明導電体、入力装置および電子機器
JP6061643B2 (ja) * 2012-09-24 2017-01-18 株式会社タムラ製作所 異方性導電性ペーストおよびそれを用いたプリント配線基板
JP2014102943A (ja) * 2012-11-19 2014-06-05 Dexerials Corp 異方性導電フィルム、接続方法、及び接合体
KR20150059376A (ko) * 2013-11-22 2015-06-01 삼성전기주식회사 터치센서 모듈 및 그 제조 방법
JP2016072097A (ja) * 2014-09-30 2016-05-09 デクセリアルズ株式会社 接続方法、接合体、及びタッチパネル装置
JP6609406B2 (ja) * 2014-10-16 2019-11-20 デクセリアルズ株式会社 接続体の製造方法、電子部品の接続方法、接続体
JP2016170330A (ja) * 2015-03-13 2016-09-23 富士ゼロックス株式会社 画像形成方法、画像形成装置、液体現像剤カートリッジ、及び液体現像剤

Also Published As

Publication number Publication date
WO2018150897A1 (ja) 2018-08-23
JP2018133331A (ja) 2018-08-23

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