TW201810360A - Semiconductor drying apparatus and circulating and filtering method of drying liquid used for the apparatus - Google Patents

Abstract

The present invention provides a semiconductor drying apparatus and a circulating and filtering method of drying liquid used in the apparatus. The semiconductor drying apparatus includes a drying tank, a liquid storage tank, and a circulation piping system connected between the drying tank and the liquid storage tank and including a first filter. When the semiconductor drying liquid is stored in the liquid storage tank, the cleaning and drying liquid is outputted from the liquid storage tank through the circulation piping system, and passes through the first filter to return to the liquid storage tank, whereby a quantity of microparticles in the drying liquid can be always kept under a permissible quantity.

Description

Semiconductor drying device and cycle and filtration method for processing liquid for semiconductor drying of the device

The present invention relates to a semiconductor drying apparatus and a method of circulating and filtering a processing liquid for semiconductor drying, and more particularly to a semiconductor drying apparatus having an internal circulation system, and filtering the semiconductor drying processing liquid by the internal circulation system.

In the manufacturing process of semiconductor components, the cleanliness of the wafer surface is an important factor affecting the process yield of semiconductor components. If excessive moisture or fine particles or dust adhere to the surface of the wafer, it will have a considerable adverse effect on subsequent processes, such as poor etching effect and affecting the electrical characteristics of the semiconductor device. Therefore, drying the wafer surface is an important step in the semiconductor process. That is to say, the wafer must be subjected to wafer cleaning and drying steps before and after deposition, lithography, etching, etc., in order to remove moisture, metal impurities, organic matter contamination, and particles attached to the surface of the wafer. Or dust, etc.

In a conventional semiconductor drying apparatus, a drying treatment method has been widely used: a solvent having a low boiling point and a small surface tension, such as isopropyl alcohol (IPA), is used as a solvent for drying to remove residues on a wafer surface. Moisture and possible chemicals, metal impurities, particles or dust. More specifically, the solvent is injected into a treatment tank. Then, the wafer is immersed in the processing tank, and the high volatility of the solvent can quickly remove the surface moisture of the wafer and remove possible particulates and metal impurities. The solvent is then removed from the processing tank. The solvent remaining on the wafer will volatilize and the wafer will be completely dried before proceeding to the next step. The wafer thus dried does not have water marks.

However, in the above drying treatment method, the solvent is reused. That is to say, after a plurality of drying steps of the wafer, the solvent may carry a large amount of moisture or impurities such as metal impurities, particles or dust. If the impurities in the solvent are not completely filtered, the wafer will be contaminated. In view of the above, it is necessary to propose a method for recycling and filtering a semiconductor drying device and a semiconductor drying processing liquid for solving the problem of impurities in the solvent.

In order to solve the above problems of the prior art, an object of the present invention is to provide a semiconductor drying apparatus and a method for circulating and filtering a processing liquid for semiconductor drying by providing an internal circulation system in a circulation piping system of a semiconductor drying apparatus, and The semiconductor drying treatment liquid is filtered by the internal circulation system. According to the cycle and filtration method of the semiconductor drying treatment liquid of the present invention, the semiconductor drying treatment liquid is passed through a filter a plurality of times to remove impurities in the semiconductor drying treatment liquid, thereby reducing the wafer remaining after the drying treatment. There is the possibility of particles or dust and moisture, etc., to avoid the subsequent processes that affect the wafer, such as moisture, thereby increasing the yield.

In order to achieve the above object, the present invention provides a recycling and filtering method for a semiconductor drying processing liquid, which is suitable for use in a semiconductor drying apparatus comprising: a drying processing tank, a liquid temporary storage tank, and a circulation piping system Between the drying treatment tank and the liquid temporary storage tank, comprising a first filter, the semiconductor drying treatment liquid The ring and the filtering method include: transferring the semiconductor drying processing liquid in the liquid temporary storage tank to the drying processing tank through the first pipeline through the circulating pipeline system; placing at least one wafer in the drying treatment In the tank, the moisture on the surface of the at least one wafer is replaced with the processing liquid for drying the semiconductor by the processing liquid for semiconductor drying; and the semiconductor in the drying chamber is dried by the circulation piping system. The treatment liquid is transferred into the liquid temporary storage tank through the first filter; and the semiconductor drying treatment liquid in the liquid temporary storage tank is output by the circulation pipeline system, and is sent back to the liquid through the first filter The liquid is temporarily stored in the tank.

In a preferred embodiment of the present invention, the circulating piping system of the semiconductor drying apparatus further includes: a first pipeline, a first valve is disposed, and is connected to the liquid temporary storage tank and a first gang a second pipe connected between the first pump and a pipe connection point, and the second pipe is provided with the first filter; and a third pipe is provided with a second pipe a valve connected between the pipe connection point and the drying treatment tank; wherein the semiconductor drying treatment liquid in the liquid temporary storage tank is transferred to the drying through the first filter by the circulation piping system The step of processing the tank includes: opening the first valve and the second valve of the circulation pipeline system; and starting the first pump to extract the semiconductor drying treatment liquid in the liquid temporary storage tank to the first a pipeline and leading to the second pipeline, wherein the semiconductor drying treatment liquid is transferred to the drying treatment tank through the third pipeline after passing through the first filter.

In a preferred embodiment of the present invention, the circulation piping system of the semiconductor drying apparatus further includes: a fourth pipeline, a third valve is disposed, and is connected to the drying treatment tank and the first pump And a fifth conduit, a fourth valve is disposed, and is connected between the pipeline connection point and the liquid temporary storage tank; wherein the system is The step of transferring the semiconductor drying treatment liquid in the drying treatment tank to the liquid temporary storage tank via the first filter comprises: closing the first valve and the second valve, and opening the third valve and the first a fourth valve; and the first pump is activated to draw the semiconductor drying treatment liquid in the drying treatment tank to the fourth pipeline and to the second pipeline, so that the semiconductor drying treatment liquid passes through the first A filter is then transferred to the liquid holding tank via the fifth line.

In a preferred embodiment of the present invention, the second conduit, the third conduit, and the fifth conduit are in communication with each other at the conduit connection point.

In a preferred embodiment of the present invention, the semiconductor drying processing liquid in the liquid temporary storage tank is output by the circulation piping system, and is returned to the liquid temporary storage tank through the first filter. The step of: closing the second valve and the third valve and opening the first valve and the fourth valve; and starting the first pump to extract the semiconductor drying processing liquid in the liquid temporary storage tank to The first pipeline leads to the second pipeline, so that the semiconductor drying treatment liquid passes through the first filter and is returned to the liquid temporary storage tank through the fifth pipeline.

In a preferred embodiment of the present invention, the semiconductor drying apparatus further includes a water content analyzer coupled to the liquid temporary storage tank, wherein the recycling and filtering method of the semiconductor drying processing liquid further comprises: The water content of the semiconductor drying treatment liquid is detected by the water content analyzer, and when the water content of the semiconductor drying treatment liquid exceeds a water content standard value, a warning signal for replacing the semiconductor drying treatment liquid is issued.

In a preferred embodiment of the present invention, the semiconductor drying apparatus further includes a particle detector coupled to the liquid temporary storage tank, wherein the semiconductor drying processing liquid The method for recycling and filtering further comprises: detecting, by the particle detector, the number of particles of the semiconductor drying treatment liquid, and issuing a replacement of the semiconductor drying when the number of particles of the semiconductor drying treatment liquid exceeds a standard value of a particle amount Use the warning signal to process the liquid.

In a preferred embodiment of the present invention, the semiconductor drying apparatus further includes an internal circulation system, including: an inner circulation line having a first end and a second end, the first end being connected to the liquid temporarily a bottom of the storage tank and the second end are connected at the top of the liquid temporary storage tank; and a second pump and a second filter are respectively disposed on the inner circulation pipeline, wherein the circulation pipeline system is used After the step of transferring the semiconductor drying treatment liquid in the drying treatment tank to the liquid temporary storage tank, the method further comprises: starting the second pump to pass the first end of the inner circulation pipeline The semiconductor drying processing liquid in the liquid temporary storage tank is taken out, and the semiconductor drying processing liquid is passed through the second filter and then returned to the liquid temporary storage tank through the second end of the inner circulation line.

In a preferred embodiment of the present invention, at least one wafer is placed in the drying treatment tank to replace moisture on the surface of the at least one wafer with semiconductor drying by the semiconductor drying processing liquid. The step of treating the liquid further comprises: impinging on the surface of the at least one wafer with a nitrogen gas bubble to accelerate the efficiency of replacing the moisture adhering to the surface of the at least one wafer to the processing liquid for drying the semiconductor.

In a preferred embodiment of the present invention, after the step of transferring the semiconductor drying treatment liquid in the drying treatment tank to the liquid temporary storage tank through the first filter by the circulation piping system The method further includes: applying a hot nitrogen gas to the surface of the at least one wafer to cause the semiconductor drying processing liquid attached to the surface of the at least one wafer to volatilize.

The invention also provides a semiconductor drying device comprising: a drying treatment tank; a liquid temporary storage tank; and a circulation pipeline system connected between the drying treatment tank and the liquid temporary storage tank, comprising a first filter, wherein a semiconductor drying treatment liquid is discharged from the circulation pipeline system When the liquid temporary storage tank is transferred to the drying treatment tank or is transferred from the drying treatment tank to the liquid temporary storage tank, the semiconductor drying treatment liquid flows through the first filter; and wherein the drying treatment tank When the operation is stopped, the semiconductor drying processing liquid is stored in the liquid temporary storage tank, and the semiconductor drying processing liquid is output from the liquid temporary storage tank through the circulating piping system and is sent back through the first filter. To the liquid temporary storage tank.

In a preferred embodiment of the present invention, the circulation pipeline system comprises: a first pipeline, a first valve is disposed, and is connected between the liquid temporary storage tank and a first pump; a second pipeline connected between the first pump and a pipeline connection point, wherein the second pipeline is provided with a first filter; a third pipeline is provided with a second valve, and is connected to the pipeline a connection point between the connection point and the drying treatment tank; a fourth line, a third valve is disposed between the drying treatment tank and the first pump; and a fifth line is provided with a fourth valve And connecting between the pipe connection point and the liquid temporary storage tank, wherein the first valve is transferred from the liquid temporary storage tank to the drying treatment tank through the circulation pipeline system And the second valve is opened and the third valve and the fourth valve are closed, and the first pump is activated, so that the semiconductor drying processing liquid sequentially passes through the first pipeline, the second pipeline, and the first Three pipelines are transferred to the drying treatment tank .

In a preferred embodiment of the present invention, when the semiconductor drying processing liquid is transferred from the drying processing tank to the liquid temporary storage tank via the circulation piping system, the third valve and the fourth valve are opened and The first valve and the second valve are closed, and the first pump is activated, so that the semiconductor drying treatment liquid sequentially passes through the fourth pipeline, the second pipeline, and The fifth line is transferred into the liquid temporary storage tank.

In a preferred embodiment of the present invention, when the drying treatment tank is stopped, the semiconductor drying treatment liquid is stored in the liquid temporary storage tank, and the first valve and the fourth valve are opened and the The second valve and the third valve are closed, and the first pump is activated, and the semiconductor drying treatment liquid is output from the liquid temporary storage tank to the first pipeline through the circulation pipeline system and leads to the The second conduit flows through the first filter and is finally returned to the liquid temporary storage tank via the fifth conduit.

In a preferred embodiment of the present invention, the semiconductor drying apparatus further includes an internal circulation system, including: an inner circulation line having a first end and a second end, the first end being connected to the liquid temporarily a bottom of the storage tank and the second end are connected at the top of the liquid temporary storage tank; and a second pump and a second filter are respectively disposed on the inner circulation pipeline, wherein when the drying treatment tank is stopped, the The semiconductor drying processing liquid is stored in the liquid temporary storage tank, and the semiconductor drying processing liquid in the liquid temporary storage tank is started by the first end of the inner circulation pipeline by starting the second pump The semiconductor drying drying treatment liquid is withdrawn through the second filter and then returned to the liquid temporary storage tank through the second end of the inner circulation line.

In a preferred embodiment of the present invention, the semiconductor drying apparatus further includes a reserve liquid temporary storage tank for storing another semiconductor drying processing liquid, and the piping system of the standby liquid temporary storage tank and the cycle The piping system is connected, wherein when the liquid temporary storage tank performs the replacement operation of the semiconductor drying processing liquid, the other semiconductor drying processing liquid is supplied into the drying processing tank by the standby liquid temporary storage tank.

10, 20, 30‧‧‧Semiconductor drying equipment

100‧‧‧Drying tank

200‧‧‧Liquid storage tank

202‧‧‧Processing liquid for semiconductor drying

204‧‧‧Nitrogen bubbles

206‧‧‧Hot nitrogen

300‧‧‧Circulating piping system

310‧‧‧First pump

320‧‧‧First filter

400‧‧‧Water Content Analyzer

500‧‧‧Particle detector

600‧‧‧Inner Circulatory System

610‧‧‧Inner circulation

620‧‧‧Second pump

630‧‧‧Second filter

700‧‧‧Reserved liquid storage tank

P1‧‧‧First line

P2‧‧‧Second pipeline

P3‧‧‧ third pipeline

P4‧‧‧ fourth pipeline

P5‧‧‧ fifth pipeline

P6‧‧‧ sixth pipeline

P7‧‧‧ seventh pipeline

V1‧‧‧ first valve

V2‧‧‧Second valve

V3‧‧‧ third valve

V4‧‧‧fourth valve

V5‧‧‧ fifth valve

V6‧‧‧ sixth valve

V7‧‧‧ seventh valve

V8‧‧‧ eighth valve

V9‧‧‧ninth valve

C1‧‧‧pipe connection point

W‧‧‧ wafer

1 to 6 show a schematic view showing a semiconductor drying apparatus according to a first preferred embodiment of the present invention, wherein the processing liquid system for semiconductor drying is in a different process according to the cycle and filtering method of the present invention; The figure shows a schematic view showing a semiconductor drying apparatus according to a second preferred embodiment of the present invention, wherein the semiconductor drying processing liquid system is subjected to internal circulation processing; and FIG. 8 shows a third preferred embodiment according to the present invention. A schematic diagram of a semiconductor drying apparatus in which a semiconductor drying treatment liquid system is injected into a drying treatment tank from a reserve liquid temporary storage tank.

The above and other objects, features and advantages of the present invention will become more <RTIgt;

Referring to FIGS. 1 through 6, there is shown a schematic diagram of a semiconductor drying apparatus 10 according to a first preferred embodiment of the present invention, wherein the semiconductor drying processing liquid 202 is treated differently according to the recycling and filtering method of the present invention. In the process. Preferably, the surface of the wafer must be dried by the semiconductor drying device 10 before and after the wafer is subjected to deposition, lithography, etching, etc., thereby removing moisture attached to the surface of the wafer. And possible metal impurities, organic contamination, particles or dust. The moisture is typically deionized water or pure water that is used to clean the wafer prior to the drying process and remain on the wafer.

As shown in FIG. 1, the semiconductor drying apparatus 10 includes a drying processing tank 100, a liquid temporary storage tank 200, and a circulation piping system 300. A wafer boat carrying a plurality of wafers can be accommodated in the drying treatment tank 100 to perform batch drying treatment on the wafers. The liquid The temporary storage tank 200 is used for storing a semiconductor drying treatment liquid 202 having a low boiling point and a small surface tension, such as isopropyl alcohol (IPA), as a chemical agent for removing moisture remaining on the surface of the wafer and possibly present, A dry solvent for metal impurities, particles or dust. The circulation line system 300 is connected between the drying treatment tank 100 and the liquid temporary storage tank 200 for conveying the semiconductor drying treatment liquid 202 from the liquid temporary storage tank 200 to the drying treatment tank 100 or The drying treatment tank 100 is sent to the liquid temporary storage tank 200.

As shown in FIG. 1, the circulation pipeline system 300 includes a first pipeline P1, a second pipeline P2, a third pipeline P3, a fourth pipeline P4, and a fifth pipeline P5. One end of the first pipeline P1, the second pipeline P2 and the fourth pipeline P4 are commonly connected to a first pump 310, and the second pipeline P2, the third pipeline P3 and the first The five lines P5 are in communication with each other at a pipe connection point C1. The specific connections of these lines are detailed below. One end of the first pipeline P1 is connected to the bottom of the liquid temporary storage tank 200, the other end is connected to the first pump 310, and the first pipeline P1 is provided with a first valve V1. One end of the second line P2 is connected to the first pump 310, the other end is connected to the line connection point C1, and the second line P2 is provided with a first filter 320. One end of the third line P3 is connected to the line connection point C1, the other end is connected to the top of the drying treatment tank 100, and the second line P3 is provided with a second valve V2. One end of the fourth line P4 is connected to the bottom of the drying treatment tank 100, the other end is connected to the first pump 310, and the fourth line P4 is provided with a third valve V3. One end of the fifth line P5 is connected to the line connection point C1, the other end is connected to the liquid temporary storage tank 200, and the fourth line P5 is provided with a fourth valve V4. It should be noted that in the drawings, if the interior of the valve is blacked out, the valve is in the closed state, and if the interior of the valve is not colored, the valve is in the open state.

As shown in FIG. 1, the semiconductor drying method of the first preferred embodiment of the present invention The circulation and filtration method of the treatment liquid 202 includes first conveying the semiconductor drying treatment liquid 202 from the liquid temporary storage tank 200 to the drying treatment tank 100 by the circulation piping system 300. Specifically, in this step, the first valve V1 and the second valve V2 are opened, and the third valve V3 and the fourth valve V4 are closed. Then, the first pump 310 is activated, so that the semiconductor drying processing liquid 202 located in the liquid temporary storage tank 200 is drawn out to the first pipeline P1 and leads to the second pipeline P2, so that the The semiconductor drying treatment liquid 202 flows through the first filter 320 and is then transferred into the drying treatment tank 100 via the third line P3.

Referring to FIG. 2, after the semiconductor drying processing liquid 202 is transported from the liquid temporary storage tank 200 to the drying processing tank 100 by the circulating piping system 300, the wafer boat carrying the plurality of wafers W is Placed in the drying treatment tank 100, the high volatility of the semiconductor drying treatment liquid 202 can replace the moisture on the surface of the wafer W with the semiconductor drying processing liquid 202, and remove the possible adhesion to the crystal The particles, dust or metal impurities on the surface of the circle W, thereby achieving the drying process of the wafers W. In this step, the first valve V1, the second valve V2, the third valve V3, and the fourth valve of the circulation line system 300 are all closed.

Referring to FIG. 3, when the wafers W are subjected to a drying process, a large amount of nitrogen gas bubbles 204 are generated at the bottom of the drying treatment tank 100 by a nitrogen gas bubble generating device, and the nitrogen gas bubbles 204 are impacted by the nitrogen gas bubbles 204. The surface of the wafer W is accelerated to accelerate the efficiency of replacing the moisture adhering to the surface of the wafer W to the semiconductor drying processing liquid 202. It should be understood that this step may be omitted in other preferred embodiments. It is also understood that the effect of the application of the nitrogen gas bubble 204 can also be achieved by the application of other energy, such as ultrasonic vibration, so that the semiconductor drying treatment liquid 202 can quickly replace the moisture on the surface of the wafer W. And exclude.

Please refer to FIG. 4, when the wafer W is completely immersed in the semiconductor drying After the liquid 202 is processed to perform the drying process of the first half, the semiconductor drying processing liquid 202 in the drying processing tank 100 is transferred to the liquid temporary storage via the first filter 320 by the circulating piping system 300. Inside the slot 200. Specifically, in this step, the third valve V3 and the fourth valve V4 are opened, and the first valve V1 and the second valve V2 are closed. Next, the first pump 310 is activated to draw the semiconductor drying processing liquid 202 in the drying processing tank 100 to the fourth line P4 and to the second line P2, so that the semiconductor drying process is performed. The liquid 202 passes through the first filter 320 and is then transferred into the liquid temporary storage tank 200 via the fifth line P5.

Referring to FIG. 5, after the semiconductor drying treatment liquid 202 is transported from the drying processing tank 100 to the liquid temporary storage tank 200 by the circulation piping system 300, the wafers W are subjected to a drying process. In detail, a hot nitrogen gas 206 (shown by an arrow) is applied from above the drying treatment tank 100 to the wafers W to promote the semiconductor drying processing liquid 202 attached to the surface of the wafers W. Volatilizing, thereby removing moisture from the surface of the wafer W and drying the wafers W. The wafer W dried in this manner has no water marks on its surface. While the wafer W is being dried, the first valve V1 and the fourth valve V4 of the circulation line system 300 are opened, and the second valve V2 and the third valve V3 are closed. Next, the first pump 310 is activated to draw the semiconductor drying processing liquid 202 in the liquid temporary storage tank 200 to the first line P1 and to the second line P2, so that the semiconductor drying process is performed. The liquid 202 passes through the first filter 320 and is returned to the liquid temporary storage tank 200 via the fifth line P5. That is, the first line P1, the second line P2, and the fifth line P5 of the circulation line system 300 together constitute an internal circulation system of the semiconductor drying apparatus 10. It should be noted that in this step, the semiconductor drying treatment liquid 202 is continuously and continuously circulated by the internal circulation system. filter.

Referring to FIG. 6, after the wafers W are dried, the wafers W are removed from the drying processing tank 100 for subsequent processing. At this time, the semiconductor drying processing liquid 202 located in the liquid temporary storage tank 200 is continuously circulated and filtered by the internal circulation system until a new batch of wafers W are to be dried by the semiconductor drying apparatus 10. After the treatment, the cycle of the semiconductor drying treatment liquid 202 and the filtration method in the first to sixth drawings are sequentially operated again.

It is to be understood that after the wafer W is subjected to the above-described drying treatment, the semiconductor drying treatment liquid 202 may carry a large amount of moisture or impurities such as metal impurities, particles or dust. Further, in general, based on cost considerations, the semiconductor drying treatment liquid 202 is not only used once, but is reused many times, so that the impurities in the semiconductor drying treatment liquid 202 are not used. Filtration is complete, which can cause contamination of the wafer. Therefore, in the recycling and filtering method of the semiconductor drying processing liquid 202 according to the first preferred embodiment of the present invention, the semiconductor drying processing liquid is transported from the liquid temporary storage tank 200 to the drying processing tank 100 or When the drying processing tank 100 is transported to the liquid temporary storage tank 200, the semiconductor drying processing liquid 202 flows through the first filter 320. When the semiconductor drying treatment liquid 202 is stored in the liquid temporary storage tank 200, the semiconductor drying treatment liquid 202 is passed through the internal circulation system (ie, the first pipeline P1 and the second pipeline P2). And the fourth pipeline P4) performs a plurality of cycles and filtration steps to ensure that the impurities in the semiconductor drying treatment liquid 202 can be completely filtered, and the wafers are still stored with particles or dust and moisture after the drying process. The possibility of avoiding moisture and other subsequent processes affecting the wafer, thereby increasing the yield yield. On the other hand, since the semiconductor drying treatment liquid 202 is subjected to a plurality of filtration steps, the batch is effectively extended. The semiconductor drying treatment liquid 202 has a service life without frequently changing the entire semiconductor drying treatment liquid 202, thereby reducing the production cost. Meanwhile, according to the present invention, since the clean semiconductor drying processing liquid 202 is always available in the liquid temporary storage tank 200, the wafer W drying process can be performed instantaneously to ensure that the processing of the wafer W can be smoothly performed. Conducted.

Furthermore, as shown in FIGS. 1 to 6, the semiconductor drying apparatus 10 further includes a water content analyzer 400 coupled to the liquid temporary storage tank 200. When the semiconductor drying treatment liquid 202 is stored in the liquid temporary storage tank 200, the moisture content of the semiconductor drying treatment liquid 202 is detected by the water content analyzer 400. When the water content of the semiconductor drying treatment liquid 202 exceeds a water content standard value, the moisture content analyzer 400 emits a warning signal that the semiconductor drying treatment liquid 202 needs to be replaced. It should be understood that the water content standard value is determined according to different process conditions. In addition, the semiconductor drying device 10 can further include a particle detector 500 coupled to the liquid temporary storage tank 200. When the semiconductor drying treatment liquid 202 is stored in the liquid temporary storage tank 200, the particle detector 500 detects the amount of particles of the semiconductor drying treatment liquid 202. When the number of particles of the semiconductor drying treatment liquid 202 exceeds a standard value of the number of particles, the particle detector 500 emits a warning signal that the semiconductor drying treatment liquid 202 needs to be replaced. It should be understood that the standard value of the amount of particles is determined according to different process conditions. Therefore, in the present invention, by setting the water content analyzer 400 and the particle detector 500, and providing a quantized standard value (such as the water content standard value and the particle number standard value), the user has specific The reference value determines the timing of replacement of the semiconductor drying treatment liquid 202, instead of determining the replacement time of the semiconductor drying treatment liquid 202 by a fixed use time or the number of uses, thereby effectively extending the semiconductor drying of the entire tank. The service life of the liquid 202 is treated to reduce production costs.

Referring to Fig. 7, there is shown a schematic view showing the semiconductor drying apparatus 20 according to the second preferred embodiment of the present invention in which the semiconductor drying processing liquid 202 is internally circulated. The semiconductor drying device 20 includes: a drying processing tank 100, a liquid temporary storage tank 200, a circulation piping system 300, and an internal circulation system 600, wherein the drying processing tank 100, the liquid temporary storage tank 200, and the circulation tube The structure and operation mechanism of the road system 300 is the same as that of the semiconductor drying apparatus 10 of the first embodiment of the present invention, and will not be described herein.

As shown in FIG. 7, the inner circulation system 600 includes an inner circulation line 610, a second pump 620, and a second filter 630. The inner circulation line 610 has a first end connected to the bottom of the liquid temporary storage tank 200 and the second end connected to the top of the liquid temporary storage tank 200. And the inner circulation line 610 is provided with a fifth valve V5 at a position close to the first end, and a sixth valve V6 is disposed at a position close to the second end. The second pump 620 and the second filter 630 are respectively disposed on the inner circulation line 610 and located between the fifth valve V5 and the sixth valve V6. After the step of circulating the semiconductor drying processing liquid 202 in the drying processing tank 100 through the first piping 320 to the liquid temporary storage tank 200 by the circulation piping system 300, the first pump 310 Starting to draw the semiconductor drying processing liquid 202 in the liquid temporary storage tank 200 to the first line P1 and to the second line P2, so that the semiconductor drying processing liquid 202 passes through the first filter After 320, it is returned to the liquid temporary storage tank 200 via the fifth line P5. At the same time, the second pump 620 is also activated to extract the semiconductor drying processing liquid 202 in the liquid temporary storage tank 200 through the first end of the inner circulation line 610, and to process the semiconductor drying process. The liquid 202 passes through the second filter 630 and is returned to the liquid temporary storage tank 200 via the second end of the inner circulation line 610. That is, the semiconductor drying treatment liquid 202 stored in the liquid temporary storage tank 200 not only passes through the circulation tube The inner circulation system of the road system 300 itself (ie, the first pipeline P1, the second pipeline P2, and the fourth pipeline P4) performs a plurality of cycles and filtration steps, and is also simultaneously performed by the inner circulation system 600 A plurality of cycles and filtration steps are performed to ensure that the impurities in the semiconductor drying treatment liquid 202 can be completely filtered, thereby reducing the possibility of particles, dust, moisture, and the like remaining after the drying process, and avoiding moisture. Such as affecting the subsequent process of the wafer, thereby increasing the yield yield. On the other hand, another advantage of the addition of the inner circulation system 600 to the semiconductor drying apparatus 20 of the present invention is that when the first filter 320 is replaced, it can be stored without interruption by the inner circulation system 600. The semiconductor drying treatment liquid 202 in the liquid temporary storage tank 200 is continuously subjected to circulation and filtration treatment.

Referring to FIG. 8, there is shown a schematic view showing a semiconductor drying apparatus 30 according to a third preferred embodiment of the present invention for injecting a semiconductor drying processing liquid 202 from a reserve liquid temporary storage tank 700 into a drying processing tank 100. The semiconductor drying device 30 includes: the drying processing tank 100, a liquid temporary storage tank 200, a circulation piping system 300, and the standby liquid temporary storage tank 700, wherein the drying processing tank 100, the liquid temporary storage tank 200, and the The structure of the circulation piping system 300 is the same as that of the semiconductor drying apparatus 10 of the first embodiment of the present invention, and will not be described herein.

As shown in FIG. 8, the standby liquid temporary storage tank 700 is used to store another new semiconductor drying processing liquid 202, and the pipeline of the standby liquid temporary storage tank 700 is connected to the circulating piping system 300. The connection is described below. The reserve liquid storage tank 700 is connected to the circulation line system 300 by a sixth line P6 and a seventh line P7. One end of the sixth line P6 is connected to the bottom of the standby liquid temporary storage tank 700, the other end is connected to the first pump 310, and the sixth line P6 is provided with a seventh valve V7. One end of the seventh pipeline P7 is connected to the upper part of the standby liquid temporary storage tank 700, the other end is connected to the pipeline connection point C1, and an eighth valve V8 is respectively disposed adjacent to the two ends of the seventh pipeline P7. And a ninth valve V9. As shown in Figure 8, When the semiconductor drying processing liquid 202 stored in the standby liquid temporary storage tank 700 is transferred to the drying processing tank 100, the seventh valve V7 and the second valve V2 are opened, and the remaining valves are closed. The first pump 310 is activated, so that the semiconductor drying processing liquid 202 located in the standby liquid temporary storage tank 700 is drawn out to the sixth pipeline P6 and leads to the second pipeline P2, so that the semiconductor The flow of the drying treatment liquid 202 passes through the first filter 320 and is then transferred into the drying treatment tank 100 via the third line P3. Similarly, when the semiconductor drying treatment liquid 202 is transferred from the drying treatment tank 100 to the reserve liquid temporary storage tank 700, the third valve V3, the eighth valve V8 and the ninth valve V9 are opened, and the rest The valves are closed. The first pump 310 is activated to draw the semiconductor drying processing liquid 202 in the drying processing tank 100 to the fourth line P4 and to the second line P2, so that the semiconductor drying processing liquid 202 The first filter 320 is then transferred to the liquid temporary storage tank 200 via the seventh line P7.

Therefore, since the pipeline of the reserve liquid temporary storage tank 700 is connected to the circulation pipeline system 300, when the liquid temporary storage tank 200 performs the replacement operation of the semiconductor drying treatment liquid 202, the standby liquid can be temporarily suspended. The storage tank 700 supplies the new semiconductor drying drying treatment liquid 202 to the drying processing tank 100, thereby avoiding waste of time caused by waiting for the semiconductor drying processing liquid 202 to be replaced, thereby causing the machine to stop. The use time of the semiconductor drying device 30 is increased (Uptime). Furthermore, the semiconductor drying device 30 further includes a moisture content analyzer 400 and a particle detector 500 coupled to the reserve liquid temporary storage tank 700. When the semiconductor drying treatment liquid 202 is stored in the reserve liquid temporary storage tank 700, the water content analyzer 400 and the particle detector 500 detect the water content and the number of particles of the semiconductor drying treatment liquid 202. When the water content of the semiconductor drying treatment liquid 202 exceeds a water content standard value, the moisture content analyzer 400 issues a warning message that the semiconductor drying treatment liquid 202 needs to be replaced. No., and when the number of particles of the semiconductor drying treatment liquid 202 exceeds a standard value of the number of particles, the particle detector 500 emits a warning signal that the semiconductor drying treatment liquid 202 needs to be replaced. Therefore, in the present invention, by setting the water content analyzer 400 and the particle detector 500, and providing a quantized standard value (such as the water content standard value and the particle number standard value), the user has specific The reference value determines the timing of replacement of the semiconductor drying treatment liquid 202, instead of determining the replacement time of the semiconductor drying treatment liquid 202 by a fixed use time or the number of uses, thereby effectively extending the semiconductor drying of the entire tank. The service life of the liquid 202 is treated to reduce production costs.

The above is only a preferred embodiment of the present invention, and it should be noted that those skilled in the art can also make several improvements and refinements without departing from the principles of the present invention. These improvements and refinements should also be considered as the present invention. protected range.

Claims (19)

The invention relates to a method for circulating and filtering a processing liquid for semiconductor drying, which is suitable for a semiconductor drying device, comprising: a drying processing tank, a liquid temporary storage tank, and a circulation pipeline system connected to the drying treatment tank and The liquid temporary storage tank includes a first filter, and the method for circulating and filtering the semiconductor drying processing liquid includes: passing the semiconductor drying processing liquid in the liquid temporary storage tank through the circulation piping system Disposing a first filter into the drying processing tank; placing at least one wafer in the drying processing tank to replace moisture on a surface of the at least one wafer with semiconductor drying by the semiconductor drying processing liquid Using the treatment liquid; transferring the semiconductor drying treatment liquid in the drying treatment tank to the liquid temporary storage tank through the circulation pipeline system; and using the circulation pipeline system to discharge the liquid The semiconductor drying processing liquid in the temporary storage tank is output, and is returned to the liquid temporary storage tank through the first filter. The recycling and filtering method for a semiconductor drying processing liquid according to claim 1, wherein the circulating piping system of the semiconductor drying device further comprises: a first pipeline, a first valve is disposed, and is connected a liquid between the liquid storage tank and a first pump; a second line connected between the first pump and a pipe connection point, and the first pipe is provided with the first filter; a third pipe, a second valve is disposed, and is connected to the pipe connection point and the dry Between the drying treatment tanks; wherein the step of transferring the semiconductor drying treatment liquid in the liquid temporary storage tank to the drying treatment tank through the circulation pipeline system comprises: opening the circulation pipe The first valve and the second valve of the road system; and starting the first pump to draw the semiconductor drying processing liquid in the liquid temporary storage tank to the first pipeline and to the second pipeline, The semiconductor drying treatment liquid is passed through the third filter and then transferred into the drying treatment tank. The cyclic filtration method of the semiconductor drying treatment liquid according to the second aspect of the invention, wherein the circulation pipeline system of the semiconductor drying apparatus further comprises: a fourth pipeline, a third valve is disposed, and is connected thereto Between the drying treatment tank and the first pump; and a fifth pipeline, a fourth valve is disposed, and is connected between the pipeline connection point and the liquid temporary storage tank; wherein the circulation pipeline is The step of transferring the semiconductor drying treatment liquid in the drying treatment tank to the liquid temporary storage tank via the first filter comprises: closing the first valve and the second valve, and opening the third valve and The fourth valve; and the first pump is activated to draw the semiconductor drying treatment liquid in the drying treatment tank to the fourth pipeline and to the second pipeline, so that the semiconductor drying treatment liquid passes The first filter is then transferred to the liquid holding tank via the fifth line. The method of circulating filtration of a semiconductor drying treatment liquid according to claim 3, wherein the second conduit, the third conduit, and the fifth conduit are in communication with each other at the conduit connection point. The method for circulating a semiconductor drying treatment liquid according to claim 3, wherein the semiconductor drying treatment liquid in the liquid temporary storage tank is output by the circulation piping system, and the first filtration is performed. The step of returning the device to the liquid temporary storage tank includes: closing the second valve and the third valve and opening the first valve and the fourth valve; and starting the first pump to temporarily store the liquid The semiconductor drying treatment liquid is pumped out to the first pipeline and leads to the second pipeline, so that the semiconductor drying treatment liquid passes through the first filter and is returned to the liquid temporary storage tank through the fifth pipeline. Inside. The method for circulating a processing liquid for semiconductor drying according to claim 1, wherein the semiconductor drying apparatus further comprises a water content analyzer coupled to the liquid temporary storage tank, wherein the semiconductor drying processing liquid The recycling and filtering method further comprises: detecting the water content of the semiconductor drying treatment liquid by the water content analyzer, and issuing a replacement of the semiconductor drying when the water content of the semiconductor drying treatment liquid exceeds a water content standard value Use the warning signal to process the liquid. The method for circulating a processing liquid for semiconductor drying according to claim 1, wherein the semiconductor drying device further comprises a particle detector coupled to the liquid temporary storage tank, wherein the semiconductor drying processing liquid The method for recycling and filtering further comprises: detecting, by the particle detector, the number of particles of the semiconductor drying treatment liquid, and issuing a replacement of the semiconductor drying when the number of particles of the semiconductor drying treatment liquid exceeds a standard value of a particle amount Use the warning signal to process the liquid. The method of circulating filtration of a semiconductor drying treatment liquid according to claim 1, wherein the semiconductor drying apparatus further comprises an internal circulation system comprising: An inner circulation line has a first end and a second end, the first end is connected to the bottom of the liquid temporary storage tank and the second end is connected to the top of the liquid temporary storage tank; and a second pump and a second filter is disposed on the inner circulation line, wherein the semiconductor drying processing liquid in the drying processing tank is transferred to the liquid temporary storage tank through the first filter by the circulating pipeline system The step further includes: starting the second pump to extract the semiconductor drying treatment liquid in the liquid temporary storage tank through the first end of the inner circulation pipeline, and passing the semiconductor drying treatment liquid through the The second filter is then returned to the liquid holding tank via the second end of the inner circulation line. The method of circulating filtration of a semiconductor drying treatment liquid according to claim 1, wherein at least one wafer is placed in the drying treatment tank to be positioned in the at least one crystal by the semiconductor drying treatment liquid. The step of replacing the moisture on the surface of the circle into the processing liquid for semiconductor drying further comprises: impinging the surface of the at least one wafer with a nitrogen gas bubble to accelerate replacement of moisture adhering to the surface of the at least one wafer to the semiconductor drying Use the efficiency of the treatment liquid. The cyclic filtration method for processing liquid for semiconductor drying according to claim 1, wherein the semiconductor drying treatment liquid in the drying treatment tank is transferred to the first filter through the circulation line system to The step of the liquid temporary storage tank further comprises: applying a hot nitrogen gas to the surface of the at least one wafer to cause the semiconductor drying processing liquid attached to the surface of the at least one wafer to volatilize. A semiconductor drying apparatus comprising: a drying treatment tank; a liquid temporary storage tank; a circulating piping system connected between the drying processing tank and the liquid temporary storage tank, comprising a first filter, wherein a semiconductor drying processing liquid is transferred from the liquid temporary storage tank to the liquid temporary storage tank When the drying treatment tank is transferred from the drying treatment tank to the liquid temporary storage tank, the semiconductor drying treatment liquid flows through the first filter; and wherein the semiconductor drying is performed when the drying treatment tank stops operating The treatment liquid is stored in the liquid temporary storage tank, and the semiconductor drying treatment liquid is output from the liquid temporary storage tank through the circulation pipeline system and is returned to the liquid temporary storage tank through the first filter. . The semiconductor drying apparatus of claim 11, wherein the circulation piping system comprises: a first pipeline, a first valve is disposed, and is connected between the liquid temporary storage tank and a first pump a second pipeline connected between the first pump and a pipeline connection point, and the second pipeline is provided with a first filter; a third pipeline is provided with a second valve, and is connected a conduit connection point and the drying treatment tank; a fourth conduit, a third valve is disposed between the drying treatment tank and the first pump; and a fifth conduit is provided a fourth valve connected between the pipe connection point and the liquid temporary storage tank, wherein when the semiconductor drying processing liquid is transferred from the liquid temporary storage tank to the drying processing tank via the circulation piping system, The first valve and the second valve are opened and the third valve and the fourth valve are closed, and the first pump is activated, so that the semiconductor drying treatment liquid sequentially passes through the first pipeline and the second pipeline And the third pipeline transmission That Dry in the treatment tank. The semiconductor drying apparatus of claim 12, wherein the third valve and the fourth when the semiconductor drying processing liquid is transferred from the drying processing tank to the liquid temporary storage tank via the circulation piping system The valve is opened and the first valve and the second valve are closed, and the first pump is activated, so that the semiconductor drying processing liquid is sequentially transmitted through the fourth pipeline, the second pipeline, and the fifth pipeline To the liquid temporary storage tank. The semiconductor drying apparatus of claim 12, wherein when the drying treatment tank is stopped, the semiconductor drying treatment liquid is stored in the liquid temporary storage tank, and the first valve and the fourth valve Opening and the second valve and the third valve are closed, and the first pump is activated, and the semiconductor drying treatment liquid is output from the liquid temporary storage tank to the first pipeline by the circulation pipeline system and The second conduit is passed through the first filter and finally returned to the liquid temporary storage tank via the fifth conduit. The semiconductor drying apparatus of claim 12, wherein the second conduit, the third conduit, and the fifth conduit are in communication with each other at the conduit connection point. The semiconductor drying apparatus of claim 11, wherein the semiconductor drying apparatus further comprises a water content analyzer coupled to the liquid temporary storage tank for detecting the water content of the semiconductor drying processing liquid, Wherein, when the water content of the semiconductor drying treatment liquid exceeds a water content standard value, the water content analyzer emits a warning signal for replacing the semiconductor drying treatment liquid. The semiconductor drying device of claim 11, wherein the semiconductor drying device further comprises a particle detector coupled to the liquid temporary storage tank for detecting the amount of particles of the semiconductor drying processing liquid, When the amount of particles of the semiconductor drying treatment liquid exceeds When a standard value of the amount of particles is used, the particle detector emits a warning signal for replacing the processing liquid for drying the semiconductor. The semiconductor drying apparatus of claim 11, wherein the semiconductor drying apparatus further comprises an internal circulation system, comprising: an inner circulation line having a first end and a second end, the first end being connected a bottom portion of the liquid temporary storage tank and the second end are connected to the top of the liquid temporary storage tank; and a second pump and a second filter are respectively disposed on the inner circulation pipeline, wherein when the drying treatment tank is stopped The semiconductor drying treatment liquid is stored in the liquid temporary storage tank, and the semiconductor is dried in the liquid temporary storage tank by starting the second pump through the first end of the inner circulation pipeline. The treatment liquid is withdrawn, and the semiconductor drying treatment liquid is passed through the second filter and then returned to the liquid temporary storage tank through the second end of the inner circulation line. The semiconductor drying device of claim 11, wherein the semiconductor drying device further comprises a spare liquid temporary storage tank for storing another semiconductor drying processing liquid, and the standby liquid temporary storage tank piping system And connecting to the circulation line system, wherein when the liquid temporary storage tank performs the replacement operation of the semiconductor drying processing liquid, the other semiconductor drying treatment liquid is supplied to the drying treatment by the standby liquid temporary storage tank Inside the slot.