TW201807150A - Surface treatment method and surface treatment liquid - Google Patents

Surface treatment method and surface treatment liquid Download PDF

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TW201807150A
TW201807150A TW106110567A TW106110567A TW201807150A TW 201807150 A TW201807150 A TW 201807150A TW 106110567 A TW106110567 A TW 106110567A TW 106110567 A TW106110567 A TW 106110567A TW 201807150 A TW201807150 A TW 201807150A
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surface treatment
resin
treatment liquid
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TWI737707B (en
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先崎尊博
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東京應化工業股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/06Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00Materials not provided for elsewhere
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00Materials not provided for elsewhere
    • C09K3/18Materials not provided for elsewhere for application to surfaces to minimize adherence of ice, mist or water thereto; Thawing or antifreeze materials for application to surfaces
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/075Silicon-containing compounds
    • G03F7/0757Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/40Treatment after imagewise removal, e.g. baking
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/42Stripping or agents therefor

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Combustion & Propulsion (AREA)
  • Materials For Photolithography (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Paints Or Removers (AREA)
  • Materials Applied To Surfaces To Minimize Adherence Of Mist Or Water (AREA)

Abstract

To provide: a surface treatment method which is able to achieve good hydrophilization or hydrophobization of the surface of an object to be processed, and which is capable of forming a region that has a high surface treatment effect and a region that has a low surface treatment effect on the object to be processed; and a surface treatment liquid which is suitably used in this surface treatment method. A surface treatment method wherein a thin film that has a surface modification function, while having a film thickness of 10 nm or less is formed by rinsing a coating film which is formed from a photosensitive surface treatment liquid and has been exposed to light and then baked. In this surface treatment method, the photosensitive surface treatment liquid is configured to contain (A) a resin, (B) a photoacid generator and (C) a solvent; a resin having a functional group I that is composed of one or more groups selected from the group consisting of a hydroxyl group, a cyano group and a carboxy group and a functional group II that is a hydrophilic group or a hydrophobic group other than the functional group I is used as the resin (A); and a compound that generates a strong acid having a pKa of 1 or less by the action of light is used as the photoacid generator (B).

Description

表面處理方法及表面處理液 Surface treatment method and surface treatment liquid

本發明係有關表面處理方法及於該表面處理方法中較好地使用之表面處理液。 The present invention relates to a surface treatment method and a surface treatment liquid which is preferably used in the surface treatment method.

過去以來,使用各種表面處理液進行各種物品表面之性質改質。表面改質中,針對物品表面之親水化或疏水化之要求增大,而提案多數之進行親水化或疏水化之表面處理方法,及該方法所用之表面處理液。 In the past, various surface treatment liquids have been used to modify the surface properties of various articles. In the surface modification, the requirements for the hydrophilization or hydrophobization of the surface of the article are increased, and most of the surface treatment methods for hydrophilization or hydrophobization are proposed, and the surface treatment liquid used in the method.

關於該表面處理方法,已提案有使用至少含有使丙烯醯胺單體與特定骨架之含有矽氧之單(甲基)丙烯酸酯單體共聚合而成之重量平均分子量1500~50000之共聚物之表面調整劑,而對被膜表面賦予親水性及防污性之方法(專利文獻1)。 Regarding this surface treatment method, it has been proposed to use a copolymer containing at least 1,500 to 50,000 of a weight average molecular weight obtained by copolymerizing at least an acrylamide monomer and a silicon-containing mono (meth) acrylate monomer having a specific skeleton. A method for imparting hydrophilicity and antifouling properties to the surface of a film by using a surface conditioner (Patent Document 1).

[先前技術文獻] [Prior technical literature] [專利文獻] [Patent Literature]

[專利文獻1]日本專利第5437523號公報 [Patent Document 1] Japanese Patent No. 5435223

然而,使用專利文獻1中記載之表面調整劑進行親水化處理時,即使使用僅含表面調整劑之溶液處理被處理體之表面,表面調整劑亦不易附著於被處理體表面,而難以獲得期望之親水化效果。 However, when the surface conditioner described in Patent Document 1 is used for the hydrophilization treatment, even if the surface of the object to be treated is treated with a solution containing only the surface conditioner, the surface conditioner does not easily adhere to the surface of the object to be treated, and it is difficult to obtain expectations. Hydrophilizing effect.

因此,專利文獻1中記載之方法,係使用於表面調整劑之溶液中調配丙烯酸樹脂、聚酯樹脂、胺基甲酸酯樹脂、醇酸樹脂、環氧樹脂、聚胺樹脂等之樹脂作為被膜形成成分之液體作為表面處理液。 Therefore, the method described in Patent Document 1 uses a resin such as an acrylic resin, a polyester resin, a urethane resin, an alkyd resin, an epoxy resin, or a polyamine resin as a coating film to be used in a solution of a surface conditioner. The component-forming liquid is used as a surface treatment liquid.

因此,使用含有專利文獻1中記載之表面調整劑與被膜形成成分之表面處理液時,由於被處理體表面以含樹脂之被膜被覆,故即使為良好親水化,但亦會損及到被處理體所具有之有用表面特性。 Therefore, when a surface treatment liquid containing a surface conditioner and a film-forming component described in Patent Document 1 is used, the surface of the object to be treated is covered with a resin-containing film, so even if it is well hydrophilized, it will damage the treated object. Useful surface properties of the body.

且,根據經表面處理之材料用途而定,有時必須於應進行表面處理之部位與不應進行表面處理之部位使表面處理效果產生差異。理想上,經表面處理之部位與未經表面處理之部位較好經微細圖型化。 In addition, depending on the use of the surface-treated material, it may be necessary to make a difference in the surface treatment effect between the part where the surface treatment should be performed and the part where the surface treatment should not be performed. Ideally, the surface-treated part and the non-surface-treated part are better patterned.

然而,使用專利文獻1中記載之方法中使用之表面調整劑之方法難以於每部位使表面處理效果產生差異,亦難以分別微細且精密地塗佈表面處理劑而設置經表面處理之部位與未經表面處理之部位。其結果,以專利文獻1所記載之方法,難以於應進行表面處理之部位與不應進行表面處理之部位使表面處理效果產生差異。 However, the method of using the surface conditioner used in the method described in Patent Document 1 makes it difficult to make a difference in the surface treatment effect for each part, and it is also difficult to apply the surface treatment agent finely and precisely to provide a surface-treated part and an untreated part. Surface treated area. As a result, with the method described in Patent Document 1, it is difficult to make the surface treatment effect different between the part where surface treatment should be performed and the part where surface treatment should not be performed.

本發明係鑑於上述課題,目的在於提供即使不含被膜形成性之樹脂,亦可進行被處理體表面之良好親 水化或疏水化,且可於被處理體上形成表面處理效果高的區域與表面處理效果低的區域之表面處理方法、及該表面處理方法中較佳使用之表面處理液。 The present invention is made in view of the above-mentioned problems, and an object thereof is to provide a good affinity for the surface of an object to be treated even without a film-forming resin. A surface treatment method that hydrates or hydrophobs and can form a region with a high surface treatment effect and a region with a low surface treatment effect on the object to be treated, and a surface treatment liquid that is preferably used in the surface treatment method.

本發明人等發現藉由對於施以曝光及烘烤之由感光性表面處理液所成之塗佈膜進行清洗,而形成膜厚10nm以下之具有表面改質功能之薄膜的表面處理方法中,於感光性表面處理液含有(A)樹脂、(B)光酸產生劑及(C)溶劑,作為(A)樹脂係使用具有選自由羥基、氰基及羧基所成之群之1個以上之基的官能基I及官能基I以外之親水性基或疏水性基的官能基II之樹脂,且作為(B)光酸產生劑係使用藉由光之作用而產生pKa為1以下之強酸之化合物,可解決上述課題,因而完成本發明。具體而言,本發明提供以下者。 The present inventors have discovered that by cleaning a coating film made of a photosensitive surface treatment liquid subjected to exposure and baking, a surface treatment method for forming a thin film having a surface modification function with a film thickness of 10 nm or less, The photosensitive surface treatment liquid contains (A) a resin, (B) a photoacid generator, and (C) a solvent, and as the (A) resin, one or more members selected from the group consisting of a hydroxyl group, a cyano group, and a carboxyl group are used. Functional group I of functional groups and functional groups II of hydrophilic groups or hydrophobic groups other than functional groups I, and (B) a photoacid generator that uses a light to generate a strong acid with a pKa of 1 or less The compound can solve the above-mentioned problems, and thus completed the present invention. Specifically, the present invention provides the following.

本發明之第一樣態係一種表面處理方法,其係使用感光性表面處理液之表面處理方法,且包含下述步驟:於被處理體表面塗佈感光性表面處理液,形成塗佈膜,使塗佈膜之至少一部分曝光,使經曝光之塗佈膜進行烘烤,及使經烘烤之塗佈膜進行清洗,而於被處理體之表面經曝光部位形成膜厚10nm以下之薄膜, 感光性表面處理液含有(A)樹脂、(B)光酸產生劑及(C)溶劑,(A)樹脂具有選自由羥基、氰基及羧基所成之群之1個以上之基的官能基I、及官能基I以外之親水性基或疏水性基的官能基II,(B)光酸產生劑係產生pKa為1以下之強酸。 The first aspect of the present invention is a surface treatment method, which is a surface treatment method using a photosensitive surface treatment liquid, and includes the following steps: applying a photosensitive surface treatment liquid on a surface of a subject to form a coating film, Exposing at least a part of the coating film, baking the exposed coating film, and cleaning the baked coating film, and forming a thin film with a thickness of 10 nm or less on the exposed portion of the surface of the object to be treated, The photosensitive surface treatment liquid contains (A) a resin, (B) a photoacid generator, and (C) a solvent. The (A) resin has a functional group of one or more groups selected from the group consisting of a hydroxyl group, a cyano group, and a carboxyl group. A functional group II of a hydrophilic group or a hydrophobic group other than I and the functional group I, (B) the photoacid generator generates a strong acid having a pKa of 1 or less.

本發明之第二樣態係一種感光性表面處理液,其係第一樣態之該表面處理方法中所用之感光性表面處理液,且含有(A)樹脂、(B)光酸產生劑及(C)溶劑,(A)樹脂具有選自由羥基、氰基及羧基所成之群之1個以上之基的官能基I、及官能基I以外之親水性基或疏水性基的官能基II,(B)光酸產生劑係產生pKa為1以下之強酸。 A second aspect of the present invention is a photosensitive surface treatment liquid, which is the photosensitive surface treatment liquid used in the surface treatment method in the first aspect, and contains (A) a resin, (B) a photoacid generator, and (C) a solvent, (A) a resin having a functional group I of one or more groups selected from the group consisting of a hydroxyl group, a cyano group, and a carboxyl group, and a functional group II of a hydrophilic group or a hydrophobic group other than the functional group I (B) The photoacid generator generates a strong acid with a pKa of 1 or less.

本發明之第三樣態係一種感光性表面處理液,其含有(A)樹脂、(B)光酸產生劑及(C)溶劑,(A)樹脂具有選自由羥基、氰基及羧基所成之群之1個以上之基的官能基I、及官能基I以外之親水性基或疏水性基的官能基II,(B)光酸產生劑係產生pKa為1以下之強酸。 A third aspect of the present invention is a photosensitive surface treatment liquid containing (A) a resin, (B) a photoacid generator, and (C) a solvent. (A) the resin has a member selected from the group consisting of a hydroxyl group, a cyano group, and a carboxyl group. The functional group I of one or more groups of the group and the functional group II of a hydrophilic group or a hydrophobic group other than the functional group I, (B) the photoacid generator generates a strong acid having a pKa of 1 or less.

依據本發明,即使不含被膜形成性之樹脂,亦可進行被處理體表面之良好親水化或疏水化,且可於被 處理體上形成表面處理效果高的區域與表面處理效果低的區域。 According to the present invention, even if the film-forming resin is not contained, the surface of the object to be treated can be hydrophilized or hydrophobized well. A region having a high surface treatment effect and a region having a low surface treatment effect are formed on the processing body.

《表面處理方法》 《Surface treatment method》

以下,針對使用感光性表面處理液之表面處理方法進行說明。 Hereinafter, a surface treatment method using a photosensitive surface treatment liquid will be described.

該表面處理方法係包含下述步驟之方法:於被處理體表面塗佈感光性表面處理液,形成塗佈膜,使塗佈膜之至少一部分曝光,使經曝光之塗佈膜進行烘烤,及使經烘烤之塗佈膜進行清洗,而於被處理體之表面經曝光部位形成膜厚10nm以下之薄膜。 The surface treatment method includes a method of applying a photosensitive surface treatment liquid on the surface of a treatment object to form a coating film, exposing at least a part of the coating film, and baking the exposed coating film. And the baked coating film is cleaned, and a thin film with a thickness of 10 nm or less is formed on the surface of the object to be treated through the exposed portion.

作為感光性表面處理液(以下亦記為「處理液」)係使用下述處理液:含有(A)樹脂、(B)光酸產生劑及(C)溶劑,且(A)樹脂具有選自由羥基、氰基及羧基所成之群之1個以上之基的官能基I、及前述官能基I以外之親水性基或疏水性基的官能基II,(B)光酸產生劑係產生pKa為1以下之強酸。 As the photosensitive surface treatment liquid (hereinafter also referred to as "treatment liquid"), a treatment liquid containing (A) a resin, (B) a photoacid generator, and (C) a solvent is used, and (A) the resin has a material selected from Functional group I of one or more groups consisting of a hydroxyl group, a cyano group, and a carboxyl group, and a functional group II of a hydrophilic group or a hydrophobic group other than the aforementioned functional group I, (B) The photoacid generator generates pKa Strong acid below 1.

以下針對感光性表面處理液與表面處理方法中所含之各步驟加以說明。 Hereinafter, each step included in the photosensitive surface treatment liquid and the surface treatment method will be described.

<感光性表面處理液> <Photosensitive surface treatment liquid>

以下針對感光性表面處理液所含之必需或任意成分加以說明。 The necessary or optional components contained in the photosensitive surface treatment liquid are described below.

[(A)樹脂] [(A) Resin]

(A)樹脂具有選自由羥基、氰基及羧基所成之群之1個以上之基的官能基I。藉由後述之(B)光酸產生劑產生之pKa為1以下之強酸,而提高官能基I與非處理體表面之反應性、或提高相互作用,而使(A)樹脂結合或者附著於被處理體表面。 (A) The resin has a functional group I of one or more groups selected from the group consisting of a hydroxyl group, a cyano group, and a carboxyl group. The strong acid having a pKa of 1 or less generated by the (B) photoacid generator described later increases the reactivity or interaction between the functional group I and the surface of the non-treated body, thereby binding (A) the resin or attaching it to the substrate. Treat the body surface.

(A)樹脂具有官能基I以外之親水性基或疏水性基的官能基II。若使用含有具有親水性基之(A)樹脂之處理液則可進行親水化處理,若使用含有具有疏水性基之(A)樹脂之處理液則可進行疏水化處理。 (A) The resin has a functional group II of a hydrophilic group or a hydrophobic group other than the functional group I. If a treatment liquid containing a resin having a hydrophilic group (A) is used, the hydrophilization treatment can be performed, and if a treatment liquid containing a resin having a hydrophobic group (A) is used, the hydrophobization treatment can be performed.

親水性基或疏水性基只要是過去以來被本技藝者認知為親水性基或疏水性基之官能基則未特別限定,可於其中適當選擇。 The hydrophilic group or the hydrophobic group is not particularly limited as long as it is a functional group which has been recognized as a hydrophilic group or a hydrophobic group by those skilled in the art, and may be appropriately selected among them.

(A)樹脂之種類只要具有特定官能基且於(C)溶劑中可溶,則未特別限定。作為(A)樹脂之例,舉例為(甲基)丙烯酸樹脂、酚醛清漆樹脂、聚酯樹脂、聚醯胺樹脂、聚醯亞胺樹脂、聚醯胺醯亞胺樹脂及聚矽氧樹脂等。該等樹脂中,基於官能基之導入、及容易調整具有官能基之單位之含有比率之觀點,較好為(甲基)丙烯酸樹脂。 The type of (A) resin is not particularly limited as long as it has a specific functional group and is soluble in the (C) solvent. Examples of the (A) resin include a (meth) acrylic resin, a novolac resin, a polyester resin, a polyamide resin, a polyimide resin, a polyimide resin, and a silicone resin. Among these resins, a (meth) acrylic resin is preferred from the viewpoint of introduction of a functional group and the ease of adjusting the content ratio of a unit having a functional group.

作為親水性基之具體例,舉例為聚氧伸烷基(例如聚氧伸乙基、聚氧伸丙基、氧伸乙基與氧伸丙基經嵌段或無規鍵結之聚氧伸烷基等)、胺基、羧基、羥基、磺酸基等。且含有該等基之有機基亦較好作為親水性基。 As specific examples of the hydrophilic group, polyoxyalkylene (e.g., polyoxyethylene, polyoxypropyl, oxyethyl and oxypropyl through a block or random bonding of polyoxyethylene) Alkyl groups, etc.), amine groups, carboxyl groups, hydroxyl groups, sulfonic groups, and the like. Moreover, an organic group containing these groups is also preferable as a hydrophilic group.

親水性基為酸性基時,該酸性基亦可形成鹽。構成鹽之陽離子並未特別限定,可為金屬離子,亦可為有機陽離子。作為陽離子,較好為金屬離子,更好為鹼金屬離子,特佳為鈉離子或鉀離子。 When the hydrophilic group is an acidic group, the acidic group may form a salt. The cation constituting the salt is not particularly limited, and may be a metal ion or an organic cation. The cation is preferably a metal ion, more preferably an alkali metal ion, and particularly preferably a sodium ion or a potassium ion.

(A)樹脂具有含有羥基、氰基及羧基之親水性基或疏水性基作為官能基II時,該親水性基或疏水性基中所含之羥基、氰基或羧基亦可發揮作為官能基I之角色。 (A) When the resin has a hydrophilic group or a hydrophobic group containing a hydroxyl group, a cyano group, and a carboxyl group as the functional group II, a hydroxyl group, a cyano group, or a carboxyl group contained in the hydrophilic group or the hydrophobic group may also function as a functional group. The role of I.

因此,(A)樹脂具有含有羥基、氰基及羧基之親水性基或疏水性基作為官能基II時,(A)樹脂亦可不具有官能基I。 Therefore, when the (A) resin has a hydrophilic group or a hydrophobic group containing a hydroxyl group, a cyano group, and a carboxyl group as the functional group II, the (A) resin may not have the functional group I.

又,含有羥基及羧基之親水性基中,包含羥基本身及羧基本身。 The hydrophilic group containing a hydroxyl group and a carboxyl group includes the hydroxyl group itself and the carboxyl group itself.

基於使處理液之親水化效果優異之觀點,作為親水性基,較好為以下述式(A1)表示之基:-NH-R1‧‧‧(A1) From the viewpoint of improving the hydrophilizing effect of the treatment liquid, as the hydrophilic group, a group represented by the following formula (A1) is preferred: -NH-R 1 ‧‧‧ (A1)

(式(A1)中,R1係經選自胺基、磺酸基及羥基所成之群之1個以上之基取代之碳原子數1~4之烷基、或氫原子)。 (In the formula (A1), R 1 is an alkyl group having 1 to 4 carbon atoms or a hydrogen atom substituted with one or more groups selected from the group consisting of an amine group, a sulfonic acid group, and a hydroxyl group).

作為式(A1)表示之親水性基中之R1之具體例 舉例為胺基及以下述式表示之基。 Specific examples of R 1 in the hydrophilic group represented by the formula (A1) include an amine group and a group represented by the following formula.

上述式(A1)表示之親水性基中之R1之具體例中,作為更佳之基舉例為以下之基。 Among specific examples of R 1 in the hydrophilic group represented by the above formula (A1), the more preferable examples are the following groups.

上述式(A1)表示之親水性基中之R1之具體例中,作為特佳之基舉例為以下之基。 Among the specific examples of R 1 in the hydrophilic group represented by the above formula (A1), examples of particularly preferred examples include the following examples.

作為疏水性基之具體例舉例為例如氟化烴基、矽烷基、矽氧烷基、碳原子數6~20之烷基及碳原子數10~20之芳香族烴基等。 Specific examples of the hydrophobic group include a fluorinated hydrocarbon group, a silyl group, a siloxyalkyl group, an alkyl group having 6 to 20 carbon atoms, and an aromatic hydrocarbon group having 10 to 20 carbon atoms.

作為氟化烴基較好為針對式(A3)中後述之基。 The fluorinated hydrocarbon group is preferably a group described later in the formula (A3).

矽烷基之較佳例,舉例為後述式(A4)表示之n為0之基。作為矽烷基之具體例舉例為例如三甲基矽烷基、三乙基矽烷基、三丙基矽烷基、三異丙基矽烷基、第三丁基二甲基矽烷基及三苯基矽烷基等。 A preferable example of the silane group is a group in which n represented by the formula (A4) described later is 0. Specific examples of the silyl group include, for example, trimethylsilyl, triethylsilyl, tripropylsilyl, triisopropylsilyl, third butyldimethylsilyl, and triphenylsilyl. .

矽烷氧基可為直鏈狀,亦可為分支鏈狀。矽烷氧基可為1價基,亦可為2價以上之多價基。因此,所謂有機矽氧烷化合物相當於具有矽氧烷基作為疏水性基之化合物。作為矽氧烷基之較佳例舉例為後述式(A4)表示之n為1以上之基。 The silyloxy group may be linear or branched. The silyloxy group may be a monovalent group or a polyvalent group having a divalent or higher valence. Therefore, the so-called organosiloxane compound corresponds to a compound having a siloxane group as a hydrophobic group. A preferable example of the siloxane group is a group in which n represented by the formula (A4) described below is 1 or more.

作為(A)樹脂,基於易導入各種官能基、容易調整官能基量之觀點,較好為含有不飽和鍵之單體的聚合物。該聚合物可為均聚物,亦可為共聚物。 The resin (A) is preferably a polymer of an unsaturated bond-containing monomer, from the viewpoints that various functional groups can be easily introduced and the amount of functional groups can be easily adjusted. The polymer may be a homopolymer or a copolymer.

該情況,較好為(A)樹脂具有之官能基I係源自以下述式(A2)或下述式(A2-1)表示之單體:CH2=CR2-(R3)a-CO-R4‧‧‧(A2) In this case, it is preferable that the functional group I possessed by the (A) resin is derived from a monomer represented by the following formula (A2) or the following formula (A2-1): CH 2 = CR 2- (R 3 ) a- CO-R 4 ‧‧‧ (A2)

(式(A2)中,R2為氫原子或甲基,R3為2價之烴基,a為0或1,R4為-OH、-O-R5、或-NH-R5,R5係經選自羥基、氰基及羧基所成之群之1個以上之官能基取代之烴基),CH2=CR2-(R3)a-SO3X‧‧‧(A2-1) (In the formula (A2), R 2 is a hydrogen atom or a methyl group, R 3 is a divalent hydrocarbon group, a is 0 or 1, R 4 is -OH, -OR 5 , or -NH-R 5 , and R 5 is A hydrocarbon group substituted with one or more functional groups selected from the group consisting of a hydroxyl group, a cyano group, and a carboxyl group), CH 2 = CR 2- (R 3 ) a -SO 3 X‧‧‧ (A2-1)

(式(A2-1)中,R2、R3及a與式(A2)相同,X為氫原子或鹼金屬)。 (In the formula (A2-1), R 2 , R 3, and a are the same as those in the formula (A2), and X is a hydrogen atom or an alkali metal).

上述式(A2)中,R3為2價烴基。2價烴基之碳原子數只要不阻礙本發明目的之範圍,則未特別限定。基於容易獲得或調製(A)樹脂之觀點,作為R3之2價烴基之碳原子數較好為1~20,更好為1~12,特佳為1~10,最好為1~6。 In the formula (A2), R 3 is a divalent hydrocarbon group. The number of carbon atoms of the divalent hydrocarbon group is not particularly limited as long as it does not hinder the object of the present invention. From the viewpoint of easily obtaining or preparing the (A) resin, the carbon number of the divalent hydrocarbon group as R 3 is preferably 1 to 20, more preferably 1 to 12, particularly preferably 1 to 10, and most preferably 1 to 6. .

作為R3之2價烴基可為脂肪族基,亦可為芳香族基,亦可為含脂肪族部分與芳香族部分之烴基。2價烴基為脂肪族基時,該脂肪族基可為飽和脂肪族基亦可為不飽和脂肪族基。且,該脂肪族基之構造可為直鏈狀、分支狀、環狀,亦可為該等構造之組合。 The divalent hydrocarbon group as R 3 may be an aliphatic group, an aromatic group, or a hydrocarbon group containing an aliphatic portion and an aromatic portion. When the divalent hydrocarbon group is an aliphatic group, the aliphatic group may be a saturated aliphatic group or an unsaturated aliphatic group. In addition, the structure of the aliphatic group may be linear, branched, or cyclic, or a combination of these structures.

作為R3之較佳具體例舉例為亞甲基、乙烷- 1,2-二基、乙烷-1,1-二基、丙烷-1,3-二基、丙烷-1,1-二基、丙烷-2,2-二基、正丁烷-1,4-二基、正戊烷-1,5-二基、正己烷-1,6-二基、正庚烷-1,7-二基、正辛烷-1,8-二基、正壬烷-1,9-二基、正癸烷-1,10-二基、鄰-伸苯基、間-伸苯基、對-伸苯基、萘-2,6-二基、萘-2,7-二基、萘-1,4-二基、聯苯-4,4’-二基等。 As specific examples of R 3 , methylene, ethane-1,2-diyl, ethane-1,1-diyl, propane-1,3-diyl, propane-1,1-di Base, propane-2,2-diyl, n-butane-1,4-diyl, n-pentane-1,5-diyl, n-hexane-1,6-diyl, n-heptane-1,7 -Diyl, n-octane-1,8-diyl, n-nonane-1,9-diyl, n-decane-1,10-diyl, o-phenylene, m-phenylene, p-phenylene -Phenylene, naphthalene-2,6-diyl, naphthalene-2,7-diyl, naphthalene-1,4-diyl, biphenyl-4,4'-diyl, etc.

R4為-OH、-O-R5、或-NH-R5,R5係經選自羥基、氰基及羧基所成之群之1個以上之官能基取代之烴基。 R 4 is -OH, -OR 5 , or -NH-R 5 , and R 5 is a hydrocarbon group substituted with one or more functional groups selected from the group consisting of a hydroxyl group, a cyano group, and a carboxyl group.

構成R5基之主骨架之烴基可為直鏈狀、分支鏈狀、或環狀之脂肪族基,亦可為芳香族烴基。 The hydrocarbon group constituting the main skeleton of the R 5 group may be a linear, branched, or cyclic aliphatic group, or an aromatic hydrocarbon group.

直鏈狀、分支鏈狀、或環狀之脂肪族基之碳原子數較好為1~20,更好為1~12。 The number of carbon atoms of the linear, branched, or cyclic aliphatic group is preferably from 1 to 20, more preferably from 1 to 12.

作為直鏈狀或分支鏈狀之脂肪族基之較佳具體例舉例為甲基、乙基、正丙基、異丙基、正丁基、異丁基、第二丁基、第三丁基、正戊基、異戊基、新戊基、第二戊基、第三戊基、正己基、正庚基、正辛基、正壬基、正癸基等。 Specific examples of the linear or branched aliphatic group include methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, second butyl, and third butyl. , N-pentyl, isopentyl, neopentyl, second pentyl, third pentyl, n-hexyl, n-heptyl, n-octyl, n-nonyl, n-decyl and the like.

作為環狀脂肪族基之較佳例舉例為環丙基、環丁基、環戊基、環己基、環庚基及環辛基等之環烷基,或自金剛烷、降冰片烷、異冰片烷、三環癸烷、及四環癸烷等之多環烷去除1個氫原子之基、或此等之多環烷之C1-C4烷基取代物去除1個氫原子之基。 Examples of preferred examples of the cyclic aliphatic group include cycloalkyl groups such as cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl, cycloheptyl, and cyclooctyl; Boronane, tricyclodecane, and tetracyclodecane polycyclic alkanes remove one hydrogen atom, or these polycycloalkane C 1 -C 4 alkyl substituents remove one hydrogen atom. .

作為芳香族烴基之較佳具體例,舉例為苯基、萘基、 蒽基、菲基及聯苯基等。芳香族烴基亦可經甲基、乙基等之C1-C4烷基取代。 As specific examples of the aromatic hydrocarbon group, phenyl, naphthyl, Anthracenyl, phenanthryl and biphenyl. The aromatic hydrocarbon group may be substituted with a C1-C4 alkyl group such as a methyl group or an ethyl group.

作為源自以式(A2)表示之單體之單位之特佳具體例舉例為下述a2-1~a2-9之單位。下述a2-1~a2-9之單位中,更好為a2-1~a2-4之單位。 Particularly preferred specific examples of the unit derived from the monomer represented by the formula (A2) are the units of a2-1 to a2-9 below. Among the following units a2-1 to a2-9, the units a2-1 to a2-4 are more preferable.

作為以式(A2-1)表示之單體之較佳例舉例為對-乙烯基苯磺酸、對-乙烯基苯磺酸鈉、對-乙烯基苯磺酸鉀、間-乙烯基苯磺酸、間-乙烯基苯磺酸鈉、間-乙烯基苯磺酸鉀、乙烯基磺酸、乙烯基磺酸鈉及乙烯基磺酸鉀。 Preferred examples of the monomer represented by the formula (A2-1) include p-vinylbenzenesulfonic acid, sodium p-vinylbenzenesulfonate, potassium p-vinylbenzenesulfonate, and m-vinylbenzenesulfonate. Acid, sodium m-vinylbenzenesulfonate, potassium m-vinylbenzenesulfonate, vinylsulfonic acid, sodium vinylsulfonate and potassium vinylsulfonate.

(A)樹脂具有疏水性基作為官能基II時,較好為官能基II為源自下式(A3)表示之單體:CH2=CR2-(CO-O)b-R6‧‧‧(A3) (A) When the resin has a hydrophobic group as the functional group II, the functional group II is preferably derived from a monomer represented by the following formula (A3): CH 2 = CR 2- (CO-O) b -R 6 ‧‧ ‧ (A3)

(式(A3)中,R2為氫原子或甲基,b為0或1,R6為氟化烴基或以下式(A4)表示之基:-SiR7R8-(-O-SiR7R8-)n-R9‧‧‧(A4) (In the formula (A3), R 2 is a hydrogen atom or a methyl group, b is 0 or 1, R 6 is a fluorinated hydrocarbon group or a group represented by the following formula (A4): -SiR 7 R 8 -(-O-SiR 7 R 8- ) n -R 9 ‧‧‧ (A4)

R7、R8及R9分別獨立為碳原子數1~6之烴基,n為0以上之整數)。 R 7 , R 8 and R 9 are each independently a hydrocarbon group having 1 to 6 carbon atoms, and n is an integer of 0 or more).

式(A3)中,R6為氟化烴基時,構成該氟化烴基之主骨架之烴基與構成前述R5之基的主骨架之烴基相同。該氟化烴基亦可為烴基所具有之氫原子全部經氟原子取代之基。 In formula (A3), when R 6 is a fluorinated hydrocarbon group, the hydrocarbon group constituting the main skeleton of the fluorinated hydrocarbon group is the same as the hydrocarbon group constituting the main skeleton of the aforementioned R 5 group. The fluorinated hydrocarbon group may be a group in which all hydrogen atoms in the hydrocarbon group are substituted with fluorine atoms.

作為R6之氟化烴基之具體例,舉例為-CF3、-CF2CF3、-(CF2)2CF3、-(CF2)3CF3、-(CF2)4CF3、-(CF2)5CF3、-(CF2)6CF3、-(CF2)7CF3、-(CF2)8CF3、-(CF2)9CF3、-CH2CF3、-CH2CF2CF3、-CH2(CF2)2CF3、-CH2(CF2)3CF3、-CH2(CF2)4CF3、-CH2(CF2)5CF3、-CH2(CF2)6CF3、-CH2(CF2)7CF3、-CH2(CF2)8CF3、-CH2CH2CF3、-CH2CH2CF2CF3、-CH2CH2(CF2)2CF3、-CH2CH2(CF2)3CF3、-CH2CH2(CF2)4CF3、-CH2CH2(CF2)5CF3、-CH2CH2(CF2)6CF3、-CH2CH2(CF2)7CF3、-CH2CF2H、-CH2CF2CF2H、-CH2(CF2)2CF2H、-CH2(CF2)3CF2H、-CH2(CF2)4CF2H、-CH2(CF2)5CF2H、-CH2(CF2)6CF2H、-CH2(CF2)7CF2H、-CH2(CF2)8CF2H、-CH2CH2CF2H、-CH2CH2CF2CF2H、-CH2CH2(CF2)2CF2H、-CH2CH2(CF2)3CF2H、-CH2CH2(CF2)4CF2H、-CH2CH2(CF2)5CF2H、-CH2CH2(CF2)6CF2H、-CH2CH2(CF2)7CF2H、及-CH(CF3)2等之鏈狀氟化烷基;五氟苯基、鄰-三氟甲基苯基、間-三氟甲基苯基、對-三氟甲基苯基等之氟化芳香族烴基;八氟金剛烷基等之氟化脂環式基。 Specific examples of the fluorinated hydrocarbon group of R 6 include -CF 3 , -CF 2 CF 3 ,-(CF 2 ) 2 CF 3 ,-(CF 2 ) 3 CF 3 ,-(CF 2 ) 4 CF 3 , -(CF 2 ) 5 CF 3 ,-(CF 2 ) 6 CF 3 ,-(CF 2 ) 7 CF 3 ,-(CF 2 ) 8 CF 3 ,-(CF 2 ) 9 CF 3 , -CH 2 CF 3 , -CH 2 CF 2 CF 3 , -CH 2 (CF 2 ) 2 CF 3 , -CH 2 (CF 2 ) 3 CF 3 , -CH 2 (CF 2 ) 4 CF 3 , -CH 2 (CF 2 ) 5 CF 3 , -CH 2 (CF 2 ) 6 CF 3 , -CH 2 (CF 2 ) 7 CF 3 , -CH 2 (CF 2 ) 8 CF 3 , -CH 2 CH 2 CF 3 , -CH 2 CH 2 CF 2 CF 3 , -CH 2 CH 2 (CF 2 ) 2 CF 3 , -CH 2 CH 2 (CF 2 ) 3 CF 3 , -CH 2 CH 2 (CF 2 ) 4 CF 3 , -CH 2 CH 2 (CF 2 ) 5 CF 3 , -CH 2 CH 2 (CF 2 ) 6 CF 3 , -CH 2 CH 2 (CF 2 ) 7 CF 3 , -CH 2 CF 2 H, -CH 2 CF 2 CF 2 H, -CH 2 (CF 2 ) 2 CF 2 H, -CH 2 (CF 2 ) 3 CF 2 H, -CH 2 (CF 2 ) 4 CF 2 H, -CH 2 (CF 2 ) 5 CF 2 H, -CH 2 ( CF 2 ) 6 CF 2 H, -CH 2 (CF 2 ) 7 CF 2 H, -CH 2 (CF 2 ) 8 CF 2 H, -CH 2 CH 2 CF 2 H, -CH 2 CH 2 CF 2 CF 2 H, -CH 2 CH 2 (CF 2 ) 2 CF 2 H, -CH 2 CH 2 (CF 2 ) 3 CF 2 H, -CH 2 CH 2 (CF 2 ) 4 CF 2 H, -CH 2 CH 2 ( CF 2 ) 5 CF 2 H, -CH 2 CH 2 (CF 2 ) 6 CF 2 H, -CH 2 CH 2 (CF 2 ) 7 CF 2 H, and -CH (CF 3 ) 2 Groups; fluorinated aromatic hydrocarbon groups such as pentafluorophenyl, o-trifluoromethylphenyl, m-trifluoromethylphenyl, and p-trifluoromethylphenyl; fluorination of octafluoroadamantyl Alicyclic base.

式(A3)中,R6為式(A4)表示之基時,R7、R8及R9較好分別獨立為甲基、乙基或苯基,更好R7、R8及R9均為甲基。 In formula (A3), when R 6 is a group represented by formula (A4), R 7 , R 8 and R 9 are preferably independently methyl, ethyl or phenyl, more preferably R 7 , R 8 and R 9 Both are methyl.

式(A4)中,n之上限,在不損及本發明目的之範圍內並未特別限定。n較好為0以上35以下之整數,更好為0以上10以下之整數。 In the formula (A4), the upper limit of n is not particularly limited as long as the object of the present invention is not impaired. n is preferably an integer of 0 to 35, more preferably an integer of 0 to 10.

作為源自式(A3)表示之單體之具有疏水性基 之單位之特佳具體例舉例為下述a3-1~a3-24之單位。下述單位中,更佳為a3-8、a3-12、a3-18、a3-19及a3-22之單位。 Hydrophobic group as a monomer derived from the formula (A3) Specific examples of the unit are particularly preferable as the units of a3-1 to a3-24 below. Among the following units, the units a3-8, a3-12, a3-18, a3-19, and a3-22 are more preferable.

又,(A)樹脂具有親水性基作為官能基II時,官能基II較佳為源自下式(A5)表示之單體:CH2=CR2-CO-NH-R1‧‧‧(A5) When the (A) resin has a hydrophilic group as the functional group II, the functional group II is preferably derived from a monomer represented by the following formula (A5): CH 2 = CR 2 -CO-NH-R 1 ‧‧‧ ( A5)

(式(A5)中,R1係經選自胺基、磺酸基及羥基所成之群之1個以上之基取代之碳原子數1~4之烷基、或氫原子,R2為氫原子或甲基)。 (In formula (A5), R 1 is an alkyl group having 1 to 4 carbon atoms or a hydrogen atom substituted with one or more groups selected from the group consisting of an amine group, a sulfonic acid group, and a hydroxyl group, and R 2 is Hydrogen atom or methyl).

式(A5)中,關於R1係如前述。 In formula (A5), R 1 is as described above.

作為源自式(A5)表示之單體之具有親水性基之單位的特佳具體例舉例為下述a5-1~a5-5之單位。下述單位中,更好為a5-1~a5-4之單位。 A particularly preferable specific example of the unit having a hydrophilic group derived from the monomer represented by the formula (A5) is a unit of the following a5-1 to a5-5. Among the following units, the units of a5-1 to a5-4 are more preferable.

(A)樹脂為具有不飽和鍵之單體之聚合物時,該聚合物在不阻礙本發明目的之範圍內,亦可含有前述之源自式(A2)表示之單體之單位、源自式(A3)表示之單體之單位及源自式(A5)表示之單體之單位以外之其他構成單位。 (A) When the resin is a polymer of a monomer having an unsaturated bond, the polymer may contain a unit derived from the monomer represented by the formula (A2) and a source as long as the polymer does not hinder the object of the present invention. The unit of the monomer represented by the formula (A3) and constituent units other than the unit derived from the monomer represented by the formula (A5).

作為其他構成單位,舉例為源自例如(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸異丙酯、(甲基)丙烯酸正丙酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸異丁基、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸正戊酯、(甲基)丙烯酸異戊酯、(甲基)丙烯酸苯酯、N-甲基(甲基)丙烯醯胺、N-乙基(甲基)丙烯醯胺、N-正丙基(甲基)丙烯醯胺、N-異丙基(甲基)丙烯醯胺、N-正丁基(甲基)丙烯醯 胺、N-正戊基(甲基)丙烯醯胺、N-異戊基(甲基)丙烯醯胺、N-苯基(甲基)丙烯醯胺、N,N-二甲基(甲基)丙烯醯胺、N,N-二乙基(甲基)丙烯醯胺、N,N-二正丙基(甲基)丙烯醯胺、N,N-二正丁基(甲基)丙烯醯胺、N,N-二正戊基(甲基)丙烯醯胺、苯乙烯、α-甲基苯乙烯、β-甲基苯乙烯、鄰-甲基苯乙烯、間-甲基苯乙烯、對-甲基苯乙烯及氯苯乙烯等之單體之構成單位。 Examples of other constituent units are derived from, for example, methyl (meth) acrylate, ethyl (meth) acrylate, isopropyl (meth) acrylate, n-propyl (meth) acrylate, or n- (meth) acrylate Butyl ester, isobutyl (meth) acrylate, third butyl (meth) acrylate, n-amyl (meth) acrylate, isoamyl (meth) acrylate, phenyl (meth) acrylate, N- Methyl (meth) acrylamide, N-ethyl (meth) acrylamide, N-n-propyl (meth) acrylamide, N-isopropyl (meth) acrylamide, N- N-butyl (meth) acrylic acid Amine, N-n-pentyl (meth) acrylamide, N-isoamyl (meth) acrylamide, N-phenyl (meth) acrylamide, N, N-dimethyl (methyl) Acrylamide, N, N-diethyl (meth) acrylamide, N, N-di-n-propyl (meth) acrylamide, N, N-di-n-butyl (meth) acrylamine Amine, N, N-di-n-pentyl (meth) acrylamide, styrene, α-methylstyrene, β-methylstyrene, o-methylstyrene, m-methylstyrene, p-methylstyrene -A constituent unit of monomers such as methylstyrene and chlorostyrene.

(A)樹脂為具有不飽和鍵之單體之聚合物時,該聚合物所含之全部構成單位中之源自式(A2)表示之單體之構成單位之莫耳比率較好為0.1~50莫耳%,更好為1~20莫耳%,特佳為1~15莫耳%。 (A) When the resin is a polymer of a monomer having an unsaturated bond, the molar ratio of the constituent units derived from the monomer represented by the formula (A2) in all the constituent units contained in the polymer is preferably 0.1 to 50 mol%, more preferably 1-20 mol%, particularly preferred is 1-15 mol%.

(A)樹脂為具有不飽和鍵之單體之聚合物時,該聚合物所含之全部構成單位中之源自式(A3)或(A5)表示之單體之構成單位之莫耳比率較好為50~99.9莫耳%,更好為60~99莫耳%,特佳為70~99莫耳%。 (A) When the resin is a polymer of a monomer having an unsaturated bond, the molar ratio of the constituent units derived from the monomer represented by formula (A3) or (A5) in all constituent units contained in the polymer is smaller than It is preferably 50 to 99.9 mole%, more preferably 60 to 99 mole%, and particularly preferably 70 to 99 mole%.

惟,源自式(A5)表示之單體之構成單位含有羥基、氰基、羧基之任一基時,聚合物所含之全部構成單位中之源自式(A5)表示之單體之構成單位之比率可為100%。 However, when the constituent unit derived from the monomer represented by the formula (A5) contains any one of a hydroxyl group, a cyano group, and a carboxyl group, the constituent derived from the monomer represented by the formula (A5) among all the constituent units contained in the polymer The ratio of units can be 100%.

且,以下述式(A6)表示之矽氧烷化合物作為(A)樹脂亦較佳:A1-SiR10R11-O-(-SiR10A2-O-)p-SiR10R11A3‧‧‧(A6) In addition, a siloxane compound represented by the following formula (A6) is also preferable as the (A) resin: A 1 -SiR 10 R 11 -O-(-SiR 10 A 2 -O-) p -SiR 10 R 11 A 3 ‧‧‧ (A6)

(式(A6)中,R10及R11分別獨立為碳原子數1~6之烴基,A1、A2及A3分別獨立為羥基、氰基、羧基或碳原子數1~6之烴基,A1、A2及A3之至少1個為羥基、氰基或 羧基,p為0以上之整數)。以式(A6)表示之矽氧烷化合物相當為具有矽烷氧基作為疏水性基之(A)樹脂。 (In the formula (A6), R 10 and R 11 are each independently a hydrocarbon group having 1 to 6 carbon atoms, and A 1 , A 2 and A 3 are each independently a hydroxyl group, a cyano group, a carboxyl group, or a hydrocarbon group having 1 to 6 carbon atoms. , At least one of A 1 , A 2 and A 3 is a hydroxyl group, a cyano group or a carboxyl group, and p is an integer of 0 or more). The siloxane compound represented by the formula (A6) is quite a (A) resin having a silaneoxy group as a hydrophobic group.

式(A6)中,分別複數存在之R10可相同亦可不同。且式(A6)中,分別複數存在之R11可相同亦可不同。 In formula (A6), each of R 10 in plural may be the same or different. Moreover, in formula (A6), R 11 existing plurally may be the same or different.

較好R10及R11分別獨立為甲基、乙基或苯基,更好R10及R11均為甲基。 Preferably, R 10 and R 11 are independently methyl, ethyl or phenyl, and more preferably R 10 and R 11 are both methyl.

且,A1、A2及A3為碳原子數1~6之烴基時,較好A1、A2及A3分別獨立為甲基、乙基或苯基,更好為甲基。 When A 1 , A 2 and A 3 are hydrocarbon groups having 1 to 6 carbon atoms, it is preferred that A 1 , A 2 and A 3 are each independently methyl, ethyl or phenyl, and more preferably methyl.

處理液中所含之(A)樹脂之量,在不阻礙本發明目的之範圍內並未特別限定,可考慮處理液之塗佈性等而適當決定。典型上,處理液中之(A)樹脂量較好為處理液中之(A)樹脂量與後述之(C)溶劑之量之關係為以下關係之量。 The amount of the (A) resin contained in the treatment liquid is not particularly limited as long as it does not hinder the object of the present invention, and can be appropriately determined in consideration of the applicability of the treatment liquid and the like. Typically, the amount of the (A) resin in the treatment liquid is preferably an amount having the following relationship between the amount of the (A) resin in the treatment liquid and the amount of the (C) solvent described later.

將處理液中之樹脂質量設為100質量份時,後述之(C)溶劑之量較好為100~100000質量份,更好為500~80000質量份,特佳為1000~60000質量份。 When the mass of the resin in the treatment liquid is 100 parts by mass, the amount of the solvent (C) described later is preferably 100 to 100,000 parts by mass, more preferably 500 to 80,000 parts by mass, and particularly preferably 1,000 to 60,000 parts by mass.

[(B)光酸產生劑] [(B) Photoacid generator]

處理液含有(B)光酸產生劑。(B)光酸產生劑係藉由光之作用產生pKa為1以下之強酸。又,pKa為水中之值。 The treatment liquid contains (B) a photoacid generator. (B) The photoacid generator generates a strong acid with a pKa of 1 or less by the action of light. In addition, pKa is a value in water.

(B)光酸產生劑所產生之強酸藉由作用於(A)樹脂具有之官能基I而促進(A)樹脂對被處理體表面之附著或鍵結。 The strong acid produced by the (B) photoacid generator acts on the functional group I of the (A) resin to promote the adhesion or bonding of the (A) resin to the surface of the object to be treated.

(B)光酸產生劑之種類若為藉由光之作用產生pKa為1以下之強酸之化合物,則未特別限定。(B)光酸產生劑可組合2種以上使用。 (B) The type of the photoacid generator is not particularly limited as long as it is a compound that generates a strong acid with a pKa of 1 or less by the action of light. (B) A photoacid generator can be used in combination of 2 or more type.

作為(B)光酸產生劑所產生之強酸之較佳例舉例為氟化脂肪族羧酸(例如三氟乙酸等)、氟磺酸、碳原子數1~30之烷磺酸(例如甲烷磺酸、十二烷磺酸等)、芳基磺酸(例如苯磺酸、對-甲苯磺酸等)、碳原子數1~30之氟烷磺酸(例如三氟甲烷磺酸、五氟乙烷磺酸、七氟丙烷磺酸、九氟丁烷磺酸、十一氟戊烷磺酸及十三氟己烷磺酸)、雙磺醯亞胺化合物、2個磺醯基以氟伸烷基連結之環狀磺醯亞胺化合物及N-醯基氟烷磺酸醯胺等。 Preferred examples of the strong acid generated by the (B) photoacid generator include fluorinated aliphatic carboxylic acids (e.g., trifluoroacetic acid, etc.), fluorosulfonic acids, and alkanesulfonic acids having 1 to 30 carbon atoms (e.g., methanesulfonic acid). Acid, dodecanesulfonic acid, etc.), arylsulfonic acids (e.g., benzenesulfonic acid, p-toluenesulfonic acid, etc.), fluoroalkanesulfonic acids having 1 to 30 carbon atoms (e.g., trifluoromethanesulfonic acid, pentafluoroethyl) Sulfonic acid, heptafluoropropane sulfonic acid, nonafluorobutane sulfonic acid, undecyl pentane sulfonic acid, and tridecafluorohexane sulfonic acid), bissulfinoimide compounds, and two sulfofluorenyl groups connected by fluoroalkylene Cyclic sulfonimide compounds and N-fluorenyl fluoransulfonium sulfonamide.

該等強酸含有氟烷基或氟伸烷基時,該等基可為部分氟化之氟烷基或氟伸烷基,亦可為完全氟化之全氟烷基或全氟伸烷基。 When the strong acids contain a fluoroalkyl group or a fluoroalkylene group, the groups may be a partially fluorinated fluoroalkyl group or a fluoroalkylene group, or a fully fluorinated perfluoroalkyl group or a perfluoroalkylene group.

該等強酸中,較好為氟磺酸、碳原子數1~30之烷磺酸、碳原子數1~30之氟烷磺酸、雙(氟烷基磺醯基)醯亞胺酸、2個磺醯基以氟伸烷基連結之環狀磺醯亞胺酸及N-醯基氟烷磺酸醯胺,較佳為碳原子數1~30之氟烷磺酸、雙磺醯亞胺化合物、2個磺醯基以氟伸烷基連結之環狀磺醯亞胺化合物及N-醯基氟烷磺酸醯胺。 Among these strong acids, fluorosulfonic acid, alkanesulfonic acid having 1 to 30 carbon atoms, fluoroalkanesulfonic acid having 1 to 30 carbon atoms, bis (fluoroalkylsulfonyl) fluorenimine, and 2 Cyclic sulfoimino acids and N-fluorenylfluoroalkanesulfonamides whose sulfofluorenyl groups are connected by a fluoroalkylene group, preferably fluoroalkanesulfonic acids and bissulfimidines having 1 to 30 carbon atoms Compound, cyclic sulfoimine compound in which two sulfofluorenyl groups are connected by a fluoroalkylene group, and fluorenamine N-fluorenylfluoroalkanesulfonate.

作為碳原子數1~30之氟烷磺酸較佳為三氟甲烷磺酸、五氟乙烷磺酸、七氟丙烷磺酸及九氟壬烷磺酸等。 The fluoroalkanesulfonic acid having 1 to 30 carbon atoms is preferably trifluoromethanesulfonic acid, pentafluoroethanesulfonic acid, heptafluoropropanesulfonic acid, nonafluorononanesulfonic acid, and the like.

作為雙磺醯亞胺化合物較好為以下式(B1)表 示之化合物。 The bissulfinoimide compound is preferably represented by the following formula (B1) Shown compounds.

式(B1)中,X1及X2分別獨立表示經至少1個拉電子性基取代之烴基。烴基在不損及(B1)表示之化合物之強酸性之範圍內,亦可經拉電子性基以外之各種基取代。X1及X2之碳原子數較好為1~20,更好為1~10,特佳為1~7。 In the formula (B1), X 1 and X 2 each independently represent a hydrocarbon group substituted with at least one electron-withdrawing group. The hydrocarbon group may be substituted with various groups other than the electron-withdrawing group within a range that does not impair the strong acidity of the compound represented by (B1). The carbon number of X 1 and X 2 is preferably 1 to 20, more preferably 1 to 10, and particularly preferably 1 to 7.

作為以拉電子性基取代之烴基較好為氟化烷基、具有硝基之芳基。氟化烷基可為直鏈狀,可為分支鏈狀,亦可為環狀。氟化烷基較好為完全氟化之全氟烷基。作為具有硝基之芳基,較好為鄰-硝基苯基、間-硝基苯基及對-硝基苯基,更好為對-硝基苯基。 The hydrocarbon group substituted with an electron-withdrawing group is preferably a fluorinated alkyl group or an aryl group having a nitro group. The fluorinated alkyl group may be linear, branched, or cyclic. The fluorinated alkyl group is preferably a fully fluorinated perfluoroalkyl group. As the aryl group having a nitro group, preferred are o-nitrophenyl, m-nitrophenyl and p-nitrophenyl, and more preferred is p-nitrophenyl.

作為式(B1)表示之化合物之較佳具體例舉例為下式之化合物。 Preferred specific examples of the compound represented by the formula (B1) include compounds of the following formula.

2個磺醯基以氟伸烷基連結之環狀磺醯亞胺化合物較好為下式(B2)表示之化合物。 The cyclic sulfoimide compound in which the two sulfofluorenyl groups are connected by a fluoroalkylene group is preferably a compound represented by the following formula (B2).

式(B2)中,X3表示至少1個氫原子經氟原子取代之直鏈狀或分支狀之伸烷基。X3之碳原子數較好為2~6,更好為3~5,特佳為3。 In the formula (B2), X 3 represents a linear or branched alkylene group having at least one hydrogen atom substituted with a fluorine atom. The carbon number of X 3 is preferably 2 to 6, more preferably 3 to 5, and particularly preferably 3.

作為式(B2)表示之化合物之較佳具體例舉例為下式化合物。 Preferred specific examples of the compound represented by the formula (B2) include compounds of the following formula.

作為N-醯基氟烷磺醯胺較好為下式(B3)表示之化合物。 As the N-fluorenylfluoroalkanesulfonamide, a compound represented by the following formula (B3) is preferred.

式(B3)中,X4表示至少1個氫原子經氟原子取代之直鏈狀或分支狀之烷基。X4之碳原子數較好為1~10,更好為1~7,特佳為1~3。 In the formula (B3), X 4 represents a linear or branched alkyl group in which at least one hydrogen atom is replaced by a fluorine atom. The carbon number of X 4 is preferably from 1 to 10, more preferably from 1 to 7, and particularly preferably from 1 to 3.

X5為烴基。關於烴基,與構成前述R5之基的主骨架之烴基相同。 X 5 is a hydrocarbon group. The hydrocarbon group is the same as the hydrocarbon group constituting the main skeleton of the aforementioned R 5 group.

作為式(B3)表示之化合物之較佳具體例舉例為下式化合物。 Preferred specific examples of the compound represented by the formula (B3) include compounds of the following formula.

作為(B)光酸產生劑較好為可產生上述說明之較佳強酸的化合物。 The (B) photoacid generator is preferably a compound capable of generating the above-mentioned preferred strong acid.

作為該化合物較好為由源自上述強酸之陰離子與鎓離子所成之鎓鹽化合物。作為鎓離子,更好為錪離子及鋶離子,更好為鋶離子。 The compound is preferably an onium salt compound composed of an anion derived from the strong acid and an onium ion. As an onium ion, a sulfonium ion and a sulfonium ion are more preferable, and a sulfonium ion is more preferable.

作為鎓離子之較佳例舉例為三苯基鋶、三-對-甲苯基鋶、4-(苯硫基)苯基二苯基鋶、雙[4-(二苯基鋶)苯基]硫醚、雙[4-{雙[4-(2-羥基乙氧基)苯基]鋶}苯基]硫醚、雙{4-[雙(4-氟苯基)鋶]苯基}硫醚、4-(4-苯甲醯基-2-氯苯硫基)苯基雙(4-氟苯基)鋶、7-異丙基-9-氧代-10-硫雜-9,10-二氫蒽-2-基二-對甲苯鋶、7-異丙基-9-氧代-10-硫雜-9,10-二氫蒽-2-基二苯基鋶、2-[(二苯基)鋶]噻噸酮、4-[4-(4-第三丁基苯甲醯基)苯硫基]苯基二-對-甲苯基鋶、4-(4-苯甲醯基苯硫基)畚箕二苯基鋶、二苯基苯甲醯甲基鋶、4-羥基苯基甲基苄基鋶、2-萘基甲基(1-乙氧羰基)乙基鋶、4-羥基苯基甲基苯甲醯甲基鋶、苯基[4-(4-聯苯基硫基)苯基]4-聯苯基鋶、苯基[4-(4-聯苯基硫基)苯基]3-聯苯基鋶、[4-(4-乙醯基苯硫基)苯基]二苯基鋶、十八烷基甲基苯甲醯甲基鋶、二苯基錪、二-對-甲苯基錪、雙(4-十二烷基苯基)錪、雙(4-甲氧基苯基)錪、(4-辛氧基苯基)苯基 錪、雙(4-癸氧基)苯基錪、4-(2-羥基十四烷氧基)苯基苯基錪、4-異丙基苯基(對-甲苯基)錪或4-異丁基苯基(對-甲苯基)錪等。 Preferred examples of onium ions are triphenylphosphonium, tri-p-tolylfluorene, 4- (phenylthio) phenyldiphenylphosphonium, and bis [4- (diphenylphosphonium) phenyl] sulfur. Ether, bis [4- {bis [4- (2-hydroxyethoxy) phenyl] 鋶} phenyl] sulfide, bis {4- [bis (4-fluorophenyl) 鋶] phenyl} sulfide 4-, 4- (4-benzylidene-2-chlorophenylthio) phenylbis (4-fluorophenyl) fluorene, 7-isopropyl-9-oxo-10-thia-9, 10- Dihydroanthracene-2-yldi-p-toluenehydrazone, 7-isopropyl-9-oxo-10-thia-9,10-dihydroanthracene-2-yldiphenylphosphonium, 2-[(di Phenyl) fluorene] thioxanthone, 4- [4- (4-Third-butylbenzylidene) phenylthio] phenyldi-p-tolylfluorene, 4- (4-benzylidenebenzene) Thio) fluorene diphenylfluorene, diphenylbenzylmethylfluorene, 4-hydroxyphenylmethylbenzylfluorene, 2-naphthylmethyl (1-ethoxycarbonyl) ethylfluorene, 4-hydroxy Phenylmethyl benzamidinemethylfluorene, phenyl [4- (4-biphenylthio) phenyl] 4-biphenylfluorene, phenyl [4- (4-biphenylthio) benzene Group] 3-biphenylfluorene, [4- (4-ethylfluorenylphenylthio) phenyl] diphenylfluorene, octadecylmethylbenzylmethylfluorene, diphenylfluorene, di- P-Tolylfluorene, bis (4-dodecylphenyl) fluorene, bis (4-methoxyphenyl) fluorene, (4-octyloxyphenyl) phenyl Fluorene, bis (4-decoxy) phenylfluorene, 4- (2-hydroxytetradecanyloxy) phenylphenylfluorene, 4-isopropylphenyl (p-tolyl) fluorene, or 4-iso Butylphenyl (p-tolyl) fluorene and the like.

又,以下式(B4)表示之鋶離子亦較好作為構成鎓鹽之鎓離子。 Moreover, a sulfonium ion represented by the following formula (B4) is also preferable as the onium ion constituting the onium salt.

上述式(B4)中,Rb1分別獨立表示選自由氫原子、烷基、羥基、烷氧基、烷羰基、烷羰氧基、烷氧羰基、鹵素原子、可具有取代基之芳基、芳羰基所成之群之基。X6係以下述式(B5)表示之構造。 In the formula (B4), R b1 each independently represents a member selected from the group consisting of a hydrogen atom, an alkyl group, a hydroxyl group, an alkoxy group, an alkoxy group, an alkoxy group, an alkoxycarbonyl group, a halogen atom, an aryl group which may have a substituent, The group formed by a carbonyl group. X 6 has a structure represented by the following formula (B5).

上述式(B5)中,X7表示碳原子數1~8之伸烷基、碳原子數6~20之伸芳基、或碳原子數8~20之雜環化合物之2價基,X7亦可經選自碳原子數1~8之烷基、碳原子數1~8之烷氧基、碳原子數6~10之芳基、羥基、氰基、硝基之各基及鹵素所成之群選出之至少一種取代。X8表示-O-、-S-、-SO-、-SO2-、-NH-、-NRb2-、-CO-、 -COO-、-CONH-、碳原子數1~3之伸烷基或伸苯基。h表示括弧內構造之重複單位數。h+1個X6及h個X7各可相同亦可不同。Rb2係碳原子數1~5之烷基或碳原子數6~10之芳基。 In the formula (B5), X 7 represents an alkylene group having 1 to 8 carbon atoms, an aryl group having 6 to 20 carbon atoms, or a divalent group of a heterocyclic compound having 8 to 20 carbon atoms, and X 7 It can also be formed from alkyl groups having 1 to 8 carbon atoms, alkoxy groups having 1 to 8 carbon atoms, aryl groups having 6 to 10 carbon atoms, hydroxyl, cyano, nitro groups and halogen Group selected at least one substitution. X 8 represents -O-, -S-, -SO-, -SO 2- , -NH-, -NR b2- , -CO-, -COO-, -CONH-, butane with 1 to 3 carbon atoms Or phenylene. h represents the number of repeating units constructed in parentheses. The h + 1 X 6 and h X 7 may be the same or different. R b2 is an alkyl group having 1 to 5 carbon atoms or an aryl group having 6 to 10 carbon atoms.

上述式(B4)表示之鋶離子之具體例舉例為4-(苯硫基)苯基二苯基鋶、4-(4-苯甲醯基-2-氯苯硫基)苯基雙(4-氟苯基)鋶、4-(4-苯甲醯基苯硫基)苯基二苯基鋶、苯基[4-(4-聯苯硫基)苯基]4-聯苯基鋶、苯基[4-(4-聯苯硫基)苯基]3-聯苯基鋶、[4-(4-乙醯基苯硫基)苯基]二苯基鋶、二苯基[4-(對-聯三苯硫基)苯基]二苯基鋶。 Specific examples of the phosphonium ion represented by the above formula (B4) are 4- (phenylthio) phenyldiphenylphosphonium, 4- (4-benzylmethyl-2-chlorophenylthio) phenylbis (4 -Fluorophenyl) fluorene, 4- (4-benzylidenephenylthio) phenyldiphenylfluorene, phenyl [4- (4-biphenylthio) phenyl] 4-biphenylfluorene, Phenyl [4- (4-biphenylthio) phenyl] 3-biphenylphosphonium, [4- (4-Ethylphenylthio) phenyl] diphenylphosphonium, diphenyl [4- (P-bitriphenylthio) phenyl] diphenylphosphonium.

又,由具有萘環之陽離子部與源自上述強酸之陰離子部所成之鎓鹽亦較好作為(B)光酸產生劑。所謂該「具有萘環」意指具有源自萘之構造,意指維持至少2個環之構造與該等之芳香族性。該萘環可具有碳原子數1~6之直鏈狀或分支狀之烷基、羥基、碳原子數1~6之直鏈狀或分支狀之烷氧基等之取代基。源自萘環之構造可為1價基(游離原子價為1個),亦可為2價基以上(游離原子價為2個),但期望為1價基(惟,此時與上述取代基鍵結之部分除外而算游離原子價)。萘環之數較好為1~3。 In addition, an onium salt formed from a cationic moiety having a naphthalene ring and an anion moiety derived from the strong acid is also preferably used as the (B) photoacid generator. The "having a naphthalene ring" means having a structure derived from naphthalene, and means maintaining a structure of at least two rings and an aromatic nature thereof. The naphthalene ring may have substituents such as a linear or branched alkyl group having 1 to 6 carbon atoms, a hydroxyl group, or a linear or branched alkoxy group having 1 to 6 carbon atoms. The structure derived from the naphthalene ring may be a monovalent group (one free atomic valence), or may be a divalent group or more (free atomic valence is two), but it is desired to be a monovalent group (but in this case, the substitution with the above) Except for the base bond, the free atomic valence is counted). The number of naphthalene rings is preferably 1 to 3.

作為具有萘環之鎓離子較好為下述式(B6)表示之鎓離子。 The onium ion having a naphthalene ring is preferably an onium ion represented by the following formula (B6).

上述式(B6)中,Rb3、Rb4、Rb5中之至少1個表示下述式(B7)表示之基,其餘為碳原子數1~6之直鏈狀或分支狀烷基、可具有取代基之苯基、羥基、或碳原子數1~6之直鏈狀或分支狀烷氧基。或者,亦可為Rb3、Rb4、Rb5中之至少1個表示下述式(B7)表示之基,其餘2個各獨立為碳原子數1~6之直鏈狀或分支狀伸烷基,且該等之末端鍵結成為環狀。 In the above formula (B6), at least one of R b3 , R b4 , and R b5 represents a group represented by the following formula (B7), and the rest are linear or branched alkyl groups having 1 to 6 carbon atoms. A phenyl group having a substituent, a hydroxyl group, or a linear or branched alkoxy group having 1 to 6 carbon atoms. Alternatively, at least one of R b3 , R b4 , and R b5 may be a group represented by the following formula (B7), and the remaining two are each a linear or branched linear alkylene group having 1 to 6 carbon atoms. And the ends of these are bonded to form a ring.

上述式(B7)中,Rb6、Rb7分別獨立表示羥基、碳原子數1~6之直鏈狀或分支狀之烷氧基、或碳原子數1~6之直鏈狀或分支狀之烷基,Rb8表示單鍵或可具有取代基之碳原子數1~6之直鏈狀或分支狀之伸烷基。l及m分別獨立表示0~2之整數,l+m為3以下。惟,Rb6存在複數時,該等相互可相同亦可不同。且,Rb7存在複數時,該等相互可相同亦可不同。 In the above formula (B7), R b6 and R b7 each independently represent a hydroxyl group, a linear or branched alkoxy group having 1 to 6 carbon atoms, or a linear or branched group having 1 to 6 carbon atoms. Alkyl group, R b8 represents a single bond or a linear or branched alkylene group having 1 to 6 carbon atoms which may have a substituent. l and m each independently represent an integer from 0 to 2, and l + m is 3 or less. However, when R b6 is plural, these may be the same as or different from each other. When there is a plural number of R b7 , these may be the same as or different from each other.

上述Rb3、Rb4、Rb5中以上述式(B7)表示之基之數,基於化合物之安定性之觀點,較佳為1個,其餘為 為碳原子數1~6之直鏈狀或分支狀伸烷基,且該等之末端亦可鍵結成為環狀。該情況下,上述2個伸烷基構成含硫原子之3~9員環。構成環之原子(包含硫原子)之數較好為5~6。 The number of the bases represented by the above formula (B7) in the above R b3 , R b4 , and R b5 is preferably one from the viewpoint of the stability of the compound, and the rest are linear or 1 to 6 carbon atoms. The branched alkylene group may be bonded to form a ring. In this case, the above-mentioned two alkylene groups constitute a 3 to 9-membered ring containing a sulfur atom. The number of atoms (including sulfur atoms) constituting the ring is preferably 5 to 6.

且,作為上述伸烷基可具有之取代基舉例為氧原子(該情況,與構成伸烷基之碳原子一起形成羰基)、羥基等。 In addition, examples of the substituent which the above-mentioned alkylene group may have include an oxygen atom (in this case, a carbonyl group is formed with a carbon atom constituting the alkylene group), a hydroxyl group, and the like.

且,作為苯基可具有之取代基舉例為羥基、碳原子數1~6之直鏈狀或分支狀之烷氧基、碳原子數1~6之直鏈狀或分支狀之烷基等。 Examples of the substituent which the phenyl group may have include a hydroxyl group, a linear or branched alkoxy group having 1 to 6 carbon atoms, a linear or branched alkyl group having 1 to 6 carbon atoms, and the like.

作為該等陽離子部之較佳者可舉例為下述式(B8)、(B9)表示者等,特佳為下述式(B9)表示之構造。 Preferred examples of the cationic moiety include those represented by the following formula (B8) and (B9), and particularly preferred is a structure represented by the following formula (B9).

處理液中之(B)光酸產生劑之含量,只要可良好進行利用處理液之表面處理則未特別限定。處理液中之(B)光酸產生劑含量相對於(A)樹脂100質量份,較好為0.1~20質量份,更好為0.1~10質量份,特佳為0.1~5質量份。 The content of the (B) photoacid generator in the processing liquid is not particularly limited as long as the surface treatment with the processing liquid can be performed satisfactorily. The content of the (B) photoacid generator in the treatment liquid is preferably 0.1 to 20 parts by mass, more preferably 0.1 to 10 parts by mass, and particularly preferably 0.1 to 5 parts by mass with respect to 100 parts by mass of the resin (A).

[(C)溶劑] [(C) Solvent]

(C)溶劑若為可溶解(A)樹脂與(B)光酸產生劑之溶劑則未特別限定。處理液中,(A)樹脂與(B)光酸產生劑若溶解特定量,則處理液亦可含有未溶解狀態之(A)樹脂與(B)光酸產生劑。(A)樹脂與(B)光酸產生劑較好於處理液中完全溶解。 The solvent (C) is not particularly limited as long as it is a solvent capable of dissolving (A) the resin and (B) the photoacid generator. If the (A) resin and (B) photoacid generator are dissolved in the treatment solution in a specific amount, the treatment liquid may also contain (A) resin and (B) photoacid generator in an undissolved state. (A) The resin and (B) the photoacid generator are preferably completely dissolved in the treatment liquid.

處理液含不溶物時,於表面處理時,有於被處理體表面附著不溶物之情況。該情況,經表面處理之被處理體表面可藉由如後述之方法清洗,而去除附著於被處理體表面之不溶物。 When the treatment liquid contains insoluble matter, insoluble matter may be adhered to the surface of the object during surface treatment. In this case, the surface of the object to be treated may be cleaned by a method described later to remove insoluble matter adhering to the surface of the object to be treated.

(C)溶劑可為水,亦可為有機溶劑,亦可為有機溶劑之水溶液。 (C) The solvent may be water, an organic solvent, or an aqueous solution of an organic solvent.

作為(C)溶劑使用之有機溶劑之具體例舉例為甲醇、乙醇、正丙醇、異丙醇、正丁醇、第二丁醇、異丁醇、第三丁醇、正戊醇、第二戊醇、異戊醇、第三戊醇等之C1-C5之醇類;二甲基亞碸等之亞碸類;二甲基碸、二乙基碸、雙(2-羥基乙基)碸、四亞甲基碸等之碸類;N,N-二甲基甲醯胺、N-甲基甲醯胺、N,N-二甲基乙醯胺、N-甲基乙醯胺、N,N-二乙基乙醯胺等之醯胺類;N-甲基-2-吡咯啶酮、N-乙基-2-吡咯啶酮、N-丙基-2-吡咯啶酮、N-羥甲基-2-吡咯啶酮、N-羥乙基-2-吡咯啶酮等之內醯胺類;1,3-二甲基-2-咪唑啶酮、1,3-二乙基-2-咪唑啶酮、 1,3-二異丙基-2-咪唑啶酮等之咪唑啶酮類;二甲基甘醇、二甲基二甘醇、二甲基三甘醇;甲基乙基二甘醇、二乙基二甘醇、三乙二醇丁基甲基醚等之二烷二醇醚類;乙二醇單甲醚、乙二醇單乙醚、乙二醇單正丙醚、乙二醇單正丁醚、二乙二醇單甲醚、二乙二醇單乙醚、二乙二醇單正丙醚、二乙二醇單正丁醚、三乙二醇單甲醚、三乙二醇單乙醚、丙二醇單甲醚、丙二醇單乙醚、丙二醇單正丙醚、丙二醇單正丁醚、二丙二醇單甲醚、二丙二醇單乙醚、二丙二醇單正丙醚、二丙二醇單正丁醚、三丙二醇單甲醚、三丙二醇單乙醚等之(聚)烷二醇單烷醚類;乙二醇單甲醚乙酸酯、乙二醇單乙醚乙酸酯、二乙二醇單甲醚乙酸酯、二乙二醇單甲醚乙酸酯、丙二醇單甲醚乙酸酯、丙二醇單乙醚乙酸酯等之(聚)烷二醇單烷醚乙酸酯類;二甲醚、二乙醚、甲基乙基醚、二丙醚、二異丙醚、二丁醚、二異戊醚、二乙二醇二甲醚、二乙二醇甲基乙基醚、二乙二醇二乙醚、四氫呋喃等之其他醚類;甲基乙基酮、環己酮、2-庚酮、3-庚酮等之酮類;2-羥基丙酸甲酯、2-羥基丙酸乙酯等之乳酸烷酯類;2-羥基-2-甲基丙酸乙酯、3-甲氧基丙酸甲酯、3-甲氧基丙酸乙酯、3-乙氧基丙酸甲酯、3-乙氧基丙酸乙酯、乙氧基乙酸乙酯、羥基乙酸乙酯、2-羥基-3-甲基丁酸甲酯、乙酸3-甲基-3-甲氧基丁酯、丙酸3-甲基-3-甲氧基丁酯、乙酸 乙酯、乙酸正丙酯、乙酸異丙酯、乙酸正丁酯、乙酸異丁酯、甲酸正戊酯、乙酸異戊酯、丙酸正丁酯、丁酸乙酯、丁酸正丙酯、丁酸異丙酯、丁酸正丁酯、丙酮酸甲酯、丙酮酸乙酯、丙酮酸正丙酯、乙醯乙酸甲酯、乙醯乙酸乙酯、2-氧代丁酸乙酯等之其他酯類;β-丁內酯、γ-丁內酯、δ-戊內酯等之內酯類;正己烷、正庚烷、正辛烷、正壬烷、甲基辛烷、正癸烷、正十一烷、正十二烷、2,2,4,6,6-五甲基庚烷、2,2,4,4,6,8,8-七甲基壬烷、環己烷、甲基環己烷等之直鏈狀、分支鏈狀或環狀之脂肪族烴類;苯、甲苯、二甲苯、1,3,5-三甲基苯、萘等之芳香族烴類;對-薄荷烷、二苯基薄荷烷、檸烯、松油烯、冰片烷、降冰片烷、蒎烷等之萜品類;等。 Specific examples of the organic solvent used as the (C) solvent include methanol, ethanol, n-propanol, isopropanol, n-butanol, second butanol, isobutanol, third butanol, n-pentanol, and second C1-C5 alcohols such as pentanol, isoamyl alcohol, tertiary pentanol, etc .; fluorenes such as dimethyl fluorene, dimethyl fluorene, diethyl fluorene, bis (2-hydroxyethyl) fluorene , Tetramethylene hydrazone, etc .; N, N-dimethylformamide, N-methylformamide, N, N-dimethylacetamide, N-methylacetamide, N , N-diethylacetamide and other amines; N-methyl-2-pyrrolidone, N-ethyl-2-pyrrolidone, N-propyl-2-pyrrolidone, N- Limonamines such as hydroxymethyl-2-pyrrolidone, N-hydroxyethyl-2-pyrrolidone, etc .; 1,3-dimethyl-2-imidazolidone, 1,3-diethyl- 2-imidazolidone, 1,3-diisopropyl-2-imidazolidone and other imidazolidinones; dimethyl glycol, dimethyl diethylene glycol, dimethyl triethylene glycol; methyl ethyl diethylene glycol, di Dioxane glycol ethers such as ethyl diethylene glycol, triethylene glycol butyl methyl ether; ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol mono-n-propyl ether, ethylene glycol mono-n-butyl ether , Diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol mono-n-propyl ether, diethylene glycol mono-n-butyl ether, triethylene glycol monomethyl ether, triethylene glycol monoethyl ether, propylene glycol Monomethyl ether, propylene glycol monoethyl ether, propylene glycol mono-n-propyl ether, propylene glycol mono-n-butyl ether, dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, dipropylene glycol mono-n-propyl ether, dipropylene glycol mono-n-butyl ether, tripropylene glycol monomethyl ether (Poly) alkanediol monoalkanes such as tripropylene glycol monoethyl ether; ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, diethylene glycol monomethyl ether acetate, diethyl ether (Poly) alkanediol monoalkyl ether acetates such as glycol monomethyl ether acetate, propylene glycol monomethyl ether acetate, and propylene glycol monoethyl ether acetate; dimethyl ether, diethyl ether, and methyl ethyl ether ,two Ethers, diisopropyl ether, dibutyl ether, diisopentyl ether, diethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether, diethylene glycol diethyl ether, tetrahydrofuran and other ethers; methyl Ketones such as ethyl ketone, cyclohexanone, 2-heptanone, 3-heptanone; alkyl lactates such as methyl 2-hydroxypropionate and ethyl 2-hydroxypropionate; 2-hydroxy-2- Ethyl methyl propionate, methyl 3-methoxypropionate, ethyl 3-methoxypropionate, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, ethoxy Ethyl acetate, ethyl hydroxyacetate, methyl 2-hydroxy-3-methylbutanoate, 3-methyl-3-methoxybutyl acetate, 3-methyl-3-methoxybutyl propionate Acetic acid Ethyl acetate, n-propyl acetate, isopropyl acetate, n-butyl acetate, isobutyl acetate, n-amyl formate, isoamyl acetate, n-butyl propionate, ethyl butyrate, n-propyl butyrate, Isopropyl butyrate, n-butyl butyrate, methyl pyruvate, ethyl pyruvate, n-propyl pyruvate, methyl ethyl acetate, ethyl ethyl acetate, ethyl 2-oxobutanoate, etc. Other esters; β-butyrolactone, γ-butyrolactone, δ-valerolactone and other lactones; n-hexane, n-heptane, n-octane, n-nonane, methyloctane, n-decane , N-undecane, n-dodecane, 2,2,4,6,6-pentamethylheptane, 2,2,4,4,6,8,8-heptamethylnonane, cyclohexane Linear, branched chain or cyclic aliphatic hydrocarbons such as methylcyclohexane; aromatic hydrocarbons such as benzene, toluene, xylene, 1,3,5-trimethylbenzene, and naphthalene; Terpenoids such as p-menthane, diphenylmenthane, limonene, terpinene, norbornane, norbornane, pinane, etc .; etc.

(C)溶劑為水與有機溶劑之混合溶劑時,(C)溶劑中之有機溶劑含量較好為10質量%以上,更好為20質量%以上。 When (C) the solvent is a mixed solvent of water and an organic solvent, the content of the organic solvent in the (C) solvent is preferably 10% by mass or more, more preferably 20% by mass or more.

<其他成分> <Other ingredients>

處理液在不阻礙本發明範圍內,亦可含有(A)樹脂、(B)光酸產生劑及(C)溶劑以外之各種成分。作為其他成分舉例為例如著色劑、界面活性劑、消泡劑、黏度調整劑等。 The treatment liquid may contain various components other than (A) a resin, (B) a photoacid generator, and (C) a solvent within the scope of the present invention. Examples of the other components include a coloring agent, a surfactant, a defoaming agent, and a viscosity adjusting agent.

<處理液之調製方法> <Method for preparing treatment liquid>

調製處理液之方法並未特別限定。處理液典型上藉由均一混合個別特定量之(A)樹脂、(B)光酸產生劑與(C)溶劑及根據需要之其他成分而調製。 The method for preparing the treatment liquid is not particularly limited. The treatment liquid is typically prepared by uniformly mixing individual specific amounts of (A) resin, (B) photoacid generator and (C) solvent, and other components as necessary.

<塗佈膜形成步驟> <Coated film formation step>

將以上說明之表面處理液塗佈於被處理體表面而形成塗佈膜。 The surface treatment liquid described above is applied to the surface of the object to be treated to form a coating film.

表面處理液之塗佈方法並未特別限定。作為塗佈方法之具體例舉例為旋轉塗佈法、噴霧法、輥塗佈法、浸漬法等。被處理體為基板時,基於可均一塗佈表面處理液而可使基板表面均一親水化或疏水化,作為塗佈方法較好為旋轉塗佈法。 The method for applying the surface treatment liquid is not particularly limited. Specific examples of the coating method include a spin coating method, a spray method, a roll coating method, and a dipping method. When the object to be processed is a substrate, the surface of the substrate can be uniformly hydrophilicized or hydrophobized based on the uniform application of the surface treatment liquid, and a spin coating method is preferred as the coating method.

被處理體之塗佈表面處理液之面的材質並未特別限定,可為有機材料,亦可為無機材料。 The material of the surface of the object to be coated with the surface treatment liquid is not particularly limited, and may be an organic material or an inorganic material.

作為有機材料舉例為PET樹脂及PBT樹脂等之聚酯樹脂、各種尼龍、聚醯亞胺樹脂、聚醯胺醯亞胺樹脂、聚乙烯及聚丙烯等之聚烯烴、聚苯乙烯、(甲基)丙烯酸樹脂等之各種樹脂材料。 Examples of organic materials include polyester resins such as PET resins and PBT resins, various nylons, polyimide resins, polyimide resins, polyolefins such as polyethylene and polypropylene, polystyrene, (methyl ) Various resin materials such as acrylic resin.

且,各種阻劑材料中所含之感光性樹脂成分及鹼可溶性之樹脂成分亦較好作為有機材料。 In addition, photosensitive resin components and alkali-soluble resin components contained in various resist materials are also preferable as organic materials.

作為無機材料舉例為玻璃、矽及、酮、鋁、鐵、鎢等之各種金屬。金屬亦可為合金。 Examples of the inorganic material include various metals such as glass, silicon, ketone, aluminum, iron, and tungsten. The metal may also be an alloy.

利用前述表面處理液進行表面處理之面的材 質並未特別限定,塗佈表面處理液之面的材質為有機材料時,較好使用含有具有羥基及/或羧基作為官能基I之(A)樹脂之表面處理液。 Material of the surface to be surface-treated with the aforementioned surface treatment liquid The quality of the surface treatment liquid is not particularly limited. When the material of the surface to which the surface treatment liquid is applied is an organic material, a surface treatment liquid containing a (A) resin having a hydroxyl group and / or a carboxyl group as the functional group I is preferably used.

塗佈表面處理液之面的材質為無機材料時,作為(A)樹脂所具有之官能基I較好為羥基、羧基及氰基之任一者。 When the material of the surface to which the surface treatment liquid is applied is an inorganic material, the functional group I included in the (A) resin is preferably any of a hydroxyl group, a carboxyl group, and a cyano group.

被處理體之形狀並未特別限定。被處理體可為平坦基板例如球狀,及可為柱狀等之立體形狀。且,被處理體表面可為平滑,亦可為具有規則或不規則之凹凸。 The shape of the object to be processed is not particularly limited. The object to be processed may be a flat substrate such as a spherical shape, and may be a three-dimensional shape such as a columnar shape. In addition, the surface of the object to be treated may be smooth or may have irregularities or irregularities.

表面處理液於塗佈於被處理體表面後,亦可根據需要加熱塗佈膜去除(C)溶劑之至少一部分。 After the surface treatment liquid is applied on the surface of the object to be treated, the coating film may be heated to remove at least a part of the solvent (C) as necessary.

<曝光步驟> <Exposure Step>

對於如以上形成之塗佈膜照射例如波長為300~500nm之紫外線或可見光線進行曝光。曝光係對欲進行親水化或疏水化之部位進行。 The coating film formed as described above is irradiated with ultraviolet rays or visible rays having a wavelength of 300 to 500 nm, for example. The exposure is performed on a site to be hydrophilized or hydrophobized.

欲使形成塗佈膜之部位全體高度親水化或疏水化時,對於塗佈膜全面進行曝光。欲使形成塗佈膜之部位之一部分高度親水化或疏水化,其他部位之親水化或疏水化程度降低時,僅對欲高度親水化或疏水化之處位置選擇性地進行曝光。 When it is desired to highly hydrophilize or hydrophobize the entire portion where the coating film is formed, the entire coating film is exposed. When it is desired to make a part of the coating film forming part highly hydrophilized or hydrophobized, and the degree of hydrophilization or hydrophobization of the other parts is reduced, only the positions to be highly hydrophilized or hydrophobized are selectively exposed.

位置選擇性地進行曝光之方法並未特別限定,但通常透過光罩進行。 The method for positionally selective exposure is not particularly limited, but is usually performed through a photomask.

作為放射線之線源,可使用低壓水銀燈、高 壓水銀燈、超高壓水銀燈、金屬鹵素燈、氬氣雷射等。且,放射線包含微波、紅外線、可見光線、紫外線、X射線、γ射線、電子束、正子束、中子束、離子束等。放射線照射量(曝光量)典型上於例如使用超高壓水銀燈時,為100~10000mJ/cm2As the radiation source, low-pressure mercury lamps, high-pressure mercury lamps, ultra-high-pressure mercury lamps, metal halide lamps, argon lasers, and the like can be used. The radiation includes microwaves, infrared rays, visible rays, ultraviolet rays, X-rays, gamma rays, electron beams, positron beams, neutron beams, ion beams, and the like. The radiation exposure amount (exposure amount) is typically 100 to 10,000 mJ / cm 2 when an ultrahigh-pressure mercury lamp is used, for example.

<烘烤步驟> <Baking step>

其次,烘烤經曝光之塗佈膜。烘烤溫度典型上較好為40~200℃,更好為60~150℃。烘烤時間較好為10~6000秒,更好為10~300秒。 Second, the exposed coated film is baked. The baking temperature is typically preferably 40 to 200 ° C, more preferably 60 to 150 ° C. The baking time is preferably 10 to 6000 seconds, and more preferably 10 to 300 seconds.

<清洗步驟> <Washing steps>

經烘烤之塗佈膜進行清洗。 The baked coating film is cleaned.

如前述,含有具有特定官能基之(A)樹脂與(B)光酸產生劑之表面處理液塗佈於被處理體表面後進行曝光時,藉由自(B)光酸產生劑產生之強酸之作用,使(A)樹脂良好地附著或鍵結於被處理體表面。 As described above, when a surface treatment liquid containing (A) a resin having a specific functional group and (B) a photoacid generator is applied on the surface of the object to be treated and exposed, a strong acid generated from the (B) photoacid generator is used. This action allows the (A) resin to adhere or bond well to the surface of the object to be treated.

不過,被處理體表面尤其是未曝光部,亦以某程度之量存在有未附著或鍵結於該表面之(A)樹脂。 However, the surface of the object to be treated, especially the unexposed portion, also contains (A) resin which is not adhered or bonded to the surface in a certain amount.

因此,藉由清洗塗佈膜,將未附著或鍵結於該表面之(A)樹脂等沖洗掉。 Therefore, the (A) resin or the like that is not adhered or bonded to the surface is washed away by cleaning the coating film.

其結果,藉由清洗,於被處理體表面之經曝光部位形成膜厚10nm以下之薄膜。 As a result, a thin film having a thickness of 10 nm or less is formed on the exposed portion of the surface of the object by cleaning.

薄膜膜厚可使用分光橢圓偏振儀測定。 The film thickness can be measured using a spectroscopic ellipsometry.

使用含有具有親水性基作為官能基II之(A)樹脂之表面處理液時,較好利用水進行清洗。且,使用含有具有疏水性基作為官能基II之(A)樹脂之表面處理液時,較好利用有機溶劑進行清洗。有機溶劑較好為表面處理液中作為(C)溶劑而含有之有機溶劑。 When the surface treatment liquid containing the (A) resin having a hydrophilic group as the functional group II is used, washing with water is preferred. When a surface treatment liquid containing a (A) resin having a hydrophobic group as the functional group II is used, it is preferred that the surface treatment liquid be washed with an organic solvent. The organic solvent is preferably an organic solvent contained as the (C) solvent in the surface treatment liquid.

清洗後,藉由使被處理體之表面乾燥,獲得良好親水化或疏水化之物品。 After cleaning, the surface of the object to be treated is dried to obtain a good hydrophilized or hydrophobized article.

藉由以上說明之方法表面處理之各種物品,可僅於必要之部位高度親水化或疏水化,另一方面可使其他部位之親水化或疏水化程度降低。作為施以該表面處理之物品較好為例如細胞培養器具及供包含細胞等之生物試料之液體流通之微流路裝置等。藉由表面處理,而對各種物品賦予防污性及防霧性等。 Various articles surface-treated by the method described above can be highly hydrophilized or hydrophobized only in necessary parts, and on the other hand, the degree of hydrophilization or hydrophobization in other parts can be reduced. As the article to be subjected to the surface treatment, for example, a cell culture device, a micro-flow path device for circulating a liquid including a biological sample including cells, and the like are preferable. Through surface treatment, various articles are provided with antifouling properties and antifogging properties.

[實施例] [Example]

以下,藉由實施例更詳細說明本發明,但本發明不受該等實施例之限定。 Hereinafter, the present invention will be described in more detail by examples, but the present invention is not limited by these examples.

[實施例1~10及比較例1~4] [Examples 1 to 10 and Comparative Examples 1 to 4]

各實施例及比較例中,作為(A)樹脂係使用表1記載之樹脂。 In each of Examples and Comparative Examples, the resin described in Table 1 was used as the (A) resin.

表1中記載之構成單位A-1a~A-6a係對(A)樹脂賦予親水性基或疏水性基之構成單位。表示A-6a之式中,n係括弧內之單位重複數。 The constituent units A-1a to A-6a described in Table 1 are constituent units that impart a hydrophilic group or a hydrophobic group to the (A) resin. In the formula of A-6a, n is the unit repeat number in parentheses.

表1中記載之構成單位A-1b~A-3b係對(A)樹脂賦予羥基、氰基或羧基之構成單位。 The constituent units A-1b to A-3b described in Table 1 are constituent units that impart a hydroxyl group, a cyano group, or a carboxyl group to the (A) resin.

表1中記載之構成單位A-1c~A-2c係不具有親水性基、疏水性基、羥基、氰基及羧基之任一者之構成單位。 The constituent units A-1c to A-2c described in Table 1 are constituent units that do not have any of a hydrophilic group, a hydrophobic group, a hydroxyl group, a cyano group, and a carboxyl group.

表1中記載之化合物1~4分別係下述構造之有機矽氧烷化合物。表示化合物1~4之式中,n、n1及n2分別為括弧內之單位重複數。 Compounds 1 to 4 described in Table 1 are organosiloxane compounds having the following structures, respectively. In the formulas for compounds 1 to 4, n, n1, and n2 are unit repeat numbers in parentheses, respectively.

以下之矽氧烷化合物中,化合物1之羥基量為58mgKOH/mol,化合物3之羧基量為4000g/mol,化合物4之直接鍵結於矽原子之氫原子量為60g/mol。 Among the following siloxane compounds, the hydroxyl amount of Compound 1 is 58 mgKOH / mol, the carboxyl amount of Compound 3 is 4000 g / mol, and the hydrogen atom amount of Compound 4 directly bonded to the silicon atom is 60 g / mol.

實施例及比較例中,使用以下之光酸產生劑B1~B3。B1及B2係產生pKa為1以下之強酸的光酸產生劑,B3係產生pKa超過1之酸的光酸產生劑。 In Examples and Comparative Examples, the following photoacid generators B1 to B3 were used. B1 and B2 are photoacid generators that generate strong acids with a pKa of 1 or less, and B3 are photoacid generators that generate acids with a pKa of more than 1.

將表1記載之種類的(A)樹脂10質量份、表2記載之種類及量的(B)光酸產生劑均一混合於表2記載之種類及量之(C)溶劑中,獲得各實施例及比較例之表面處理液。 10 parts by mass of (A) resin of the kind described in Table 1 and (B) photoacid generator of the kind and amount described in Table 2 were uniformly mixed in the (C) solvent of the kind and amount described in Table 2 to obtain each implementation. Examples and Comparative Examples.

表2中之PGME係丙二醇單甲醚,PGMEA係丙二醇單甲醚乙酸酯。 In Table 2, PGME is propylene glycol monomethyl ether, and PGMEA is propylene glycol monomethyl ether acetate.

所得表面處理液以1000rpm 30秒之條件旋轉塗佈於玻璃基板上後,進行100℃ 60秒之乾燥獲得塗佈膜。 The obtained surface treatment liquid was spin-coated on a glass substrate at 1000 rpm for 30 seconds, and then dried at 100 ° C for 60 seconds to obtain a coating film.

對於所得塗佈膜透過遮罩,使用HMW-532D(ORC公司製)以曝光量1000mJ/cm2進行曝光。 The obtained coating film was exposed through a mask using HMW-532D (manufactured by ORC) at an exposure amount of 1000 mJ / cm 2 .

經曝光之塗佈膜於100℃烘烤60秒後,予以清洗,獲得經表面處理之玻璃基板。 After the exposed coating film was baked at 100 ° C. for 60 seconds, it was washed to obtain a surface-treated glass substrate.

使用具有親水性之樹脂之實施例1~3、實施例7、比較例1及比較例4以水進行清洗。其他實施例及比較例以PGMEA進行清洗。 Examples 1 to 3, Example 7, Comparative Examples 1 and 4 using hydrophilic resins were washed with water. Other examples and comparative examples were cleaned with PGMEA.

使經清洗之玻璃基板乾燥後,針對曝光部與未曝光部分別測定玻璃基板之水接觸角。水接觸角之測定係使用Dropmaster700(協和界面科學股份有限公司製)將純水液滴(2.0μL)滴下於經表面處理之基板表面,測定滴下10秒後之接觸角。水接觸角之測定結果記於表2。 After the cleaned glass substrate is dried, the water contact angle of the glass substrate is measured for the exposed portion and the unexposed portion, respectively. The measurement of the water contact angle was performed using Dropmaster 700 (manufactured by Kyowa Interface Science Co., Ltd.) by dropping pure water droplets (2.0 μL) on the surface of the surface-treated substrate, and measuring the contact angle after dropping for 10 seconds. The measurement results of the water contact angle are shown in Table 2.

又,針對乾燥後之基板,以分光橢圓偏振儀確認經曝光部位,於實施例觀察到膜厚10nm以下之薄膜存在,比較例未觀察到薄膜存在。 In addition, with respect to the dried substrate, the exposed portion was confirmed with a spectroscopic ellipsometer, and the presence of a thin film with a thickness of 10 nm or less was observed in the examples, and the thin film was not observed in the comparative examples.

依據實施例可知,使用含有具有選自由羥基、氰基及羧基所成之群之1個以上之基的官能基I及官能基I以外之親水性基或疏水性基的官能基II之(A)樹脂及產生pKa為1以下之強酸之(B)光酸產生劑的表面處理液時,使由表面處理液所成之塗佈膜曝光後,施以烘烤及 清洗,可僅使基板上之經曝光部位良好親水化或疏水化。 According to the examples, it can be seen that a functional group II (A having a functional group I having one or more groups selected from the group consisting of a hydroxyl group, a cyano group, and a carboxyl group and a hydrophilic group or a hydrophobic group other than the functional group I is used. ) For resins and surface treatment liquids that generate (B) photoacid generators with a strong acid with a pKa of 1 or less, the coating film formed from the surface treatment liquid is exposed, followed by baking and Cleaning can make only the exposed part of the substrate well hydrophilic or hydrophobic.

依據比較例1~3可知,(A)樹脂不含羥基、氰基及羧基之任一者時,表面處理液即使含有產生pKa為1以下之強酸之(B)光酸產生劑,亦無法使曝光部良好地親水化或疏水化。 According to Comparative Examples 1 to 3, when (A) the resin does not contain any of hydroxyl, cyano, and carboxyl groups, even if the surface treatment liquid contains (B) a photoacid generator that generates a strong acid with a pKa of 1 or less, The exposed part is well hydrophilized or hydrophobized.

依據比較例4可知,即使(A)樹脂具有羧基的官能基I及親水性基之官能基II,於含有產生pKa超過1之酸之(B)光酸產生劑時,亦無法使曝光部良好地親水化或疏水化。 From Comparative Example 4, it can be seen that even if (A) the resin has a functional group I of a carboxyl group and a functional group II of a hydrophilic group, when the (B) photoacid generator which generates an acid having a pKa of more than 1, the exposed portion cannot be made good. It is hydrophilized or hydrophobized.

[實施例11~15] [Examples 11 to 15]

實施例11中,使用使(A)樹脂之10質量份與(B)光酸產生劑0.1質量份、PGMEA 1000質量份均一混合所得之表面處理液。 In Example 11, a surface treatment liquid obtained by uniformly mixing 10 parts by mass of (A) resin with 0.1 parts by mass of (B) photoacid generator and 1,000 parts by mass of PGMEA was used.

實施例11之表面處理液所含之樹脂係以莫耳比95:5(A-4a:A-2b)含有前述A-4a單位與A-2b單位之樹脂。 The resin contained in the surface treatment liquid of Example 11 is a resin containing the above-mentioned A-4a unit and A-2b unit at a molar ratio of 95: 5 (A-4a: A-2b).

又,實施例11之表面處理液中所含之(B)光酸產生劑係前述之B2化合物。 The (B) photoacid generator contained in the surface treatment liquid of Example 11 is the aforementioned B2 compound.

除分別使用表3記載之種類的表面處理液,且將基板種類變更為表3記載之種類,並對塗佈膜全面進行曝光以外,與實施例1同樣,測定表面處理後之水的接觸角。測定結果記於表1。又,PET薄膜、矽晶圓之未處理狀態的水接觸角,於PET薄膜係約70°,矽晶圓約10°。 The contact angle of water after the surface treatment was measured in the same manner as in Example 1, except that the surface treatment liquids of the types described in Table 3 were used, and the substrate type was changed to the type described in Table 3, and the coating film was fully exposed. . The measurement results are shown in Table 1. In addition, the water contact angle of the PET film and silicon wafer in the unprocessed state is about 70 ° for the PET film and about 10 ° for the silicon wafer.

依據實施例11可知,作為表面處理液中所含之樹脂(A)具有氰基作為官能基I時,由無機材料(矽)所成之基板表面經良好疏水化。 According to Example 11, it can be seen that when the resin (A) contained in the surface treatment liquid has a cyano group as the functional group I, the surface of the substrate made of an inorganic material (silicon) is well hydrophobicized.

依據實施例12~15可知,作為表面處理液中所含之樹脂(A)具有羥基或羧基作為官能基I時,由無機材料(矽)所成之基板表面及由有機材料(PET)所成之基板表面均經良好疏水化。 According to Examples 12 to 15, when the resin (A) contained in the surface treatment liquid has a hydroxyl group or a carboxyl group as the functional group I, the substrate surface made of an inorganic material (silicon) and the organic material (PET) The substrate surface is well hydrophobicized.

Claims (11)

一種表面處理方法,其係使用感光性表面處理液之表面處理方法,且包含下述步驟:於被處理體表面塗佈前述感光性表面處理液,形成塗佈膜,使前述塗佈膜之至少一部分曝光,使經曝光之前述塗佈膜進行烘烤,及使經烘烤之前述塗佈膜進行清洗,而於前述被處理體之表面經曝光部位形成膜厚10nm以下之薄膜,前述感光性表面處理液含有(A)樹脂、(B)光酸產生劑及(C)溶劑,前述(A)樹脂具有選自由羥基、氰基及羧基所成之群之1個以上之基的官能基I、及前述官能基I以外之親水性基或疏水性基的官能基II,前述(B)光酸產生劑係產生pKa為1以下之強酸。 A surface treatment method is a surface treatment method using a photosensitive surface treatment liquid, and includes the steps of applying the photosensitive surface treatment liquid on a surface of a treatment object to form a coating film, and at least the coating film is Partial exposure, baking the exposed coating film, and cleaning the baked coating film, and forming a thin film with a film thickness of 10 nm or less on the exposed portion of the surface of the object to be processed. The surface treatment liquid contains (A) a resin, (B) a photoacid generator, and (C) a solvent. The (A) resin has a functional group I of one or more groups selected from the group consisting of a hydroxyl group, a cyano group, and a carboxyl group. And a functional group II of a hydrophilic group or a hydrophobic group other than the functional group I, the (B) photoacid generator generates a strong acid with a pKa of 1 or less. 如請求項1之表面處理方法,其中前述塗佈膜之曝光係透過光罩位置選擇性地進行。 The surface treatment method according to claim 1, wherein the exposure of the aforementioned coating film is selectively performed through the position of the photomask. 如請求項1或2之表面處理方法,其中前述官能基II之前述親水性基係以下述式(A1)表示之基:-NH-R1‧‧‧(A1)(式(A1)中,R1係經選自胺基、磺酸基及羥基所成之 群之1個以上之基取代之碳原子數1~4之烷基、或氫原子)。 The surface treatment method of claim 1 or 2, wherein the aforementioned hydrophilic group of the aforementioned functional group II is a group represented by the following formula (A1): -NH-R 1 ‧‧‧ (A1) (in the formula (A1), R 1 is an alkyl group having 1 to 4 carbon atoms or a hydrogen atom substituted with one or more groups selected from the group consisting of an amine group, a sulfonic acid group, and a hydroxyl group; 如請求項1或2之表面處理方法,其中前述官能基I係源自以下述式(A2)或下述式(A2-1)表示之單體:CH2=CR2-(R3)a-CO-R4‧‧‧(A2)(式(A2)中,R2為氫原子或甲基,R3為2價之烴基,a為0或1,R4為-OH、-O-R5、或-NH-R5,R5係經選自羥基、氰基及羧基所成之群之1個以上之官能基取代之烴基),CH2=CR2-(R3)a-SO3X‧‧‧(A2-1)(式(A2-1)中,R2、R3及a與式(A2)相同,X為氫原子或鹼金屬)。 The surface treatment method according to claim 1 or 2, wherein the aforementioned functional group I is derived from a monomer represented by the following formula (A2) or the following formula (A2-1): CH 2 = CR 2- (R 3 ) a -CO-R 4 ‧‧‧ (A2) (In the formula (A2), R 2 is a hydrogen atom or a methyl group, R 3 is a divalent hydrocarbon group, a is 0 or 1, and R 4 is -OH, -OR 5 Or -NH-R 5 , R 5 is a hydrocarbon group substituted with one or more functional groups selected from the group consisting of hydroxyl, cyano, and carboxyl groups), CH 2 = CR 2- (R 3 ) a -SO 3 X‧‧‧ (A2-1) (In the formula (A2-1), R 2 , R 3 and a are the same as the formula (A2), and X is a hydrogen atom or an alkali metal). 如請求項1或2之表面處理方法,其中前述官能基II之前述疏水性基係選自由氟化烴基、矽烷基及矽氧烷基所成之群之1個以上之基。 The surface treatment method according to claim 1 or 2, wherein the hydrophobic group of the functional group II is one or more groups selected from the group consisting of a fluorinated hydrocarbon group, a silane group, and a siloxane group. 如請求項1或2之表面處理方法,其中前述官能基II為疏水性基且係源自下式(A3)表示之單體:CH2=CR2-(CO-O)b-R6‧‧‧(A3)(式(A3)中,R2為氫原子或甲基,b為0或1,R6為氟化烴基或以下式(A4)表示之基:-SiR7R8-(-O-SiR7R8-)n-R9‧‧‧(A4) R7、R8及R9分別獨立為碳原子數1~6之烴基,n為0以上之整數)。 The surface treatment method according to claim 1 or 2, wherein the aforementioned functional group II is a hydrophobic group and is derived from a monomer represented by the following formula (A3): CH 2 = CR 2- (CO-O) b -R 6 ‧ ‧ (A3) (In the formula (A3), R 2 is a hydrogen atom or a methyl group, b is 0 or 1, R 6 is a fluorinated hydrocarbon group or a group represented by the following formula (A4): -SiR 7 R 8- ( -O-SiR 7 R 8- ) n -R 9 ‧‧‧ (A4) R 7 , R 8 and R 9 are each independently a hydrocarbon group having 1 to 6 carbon atoms, and n is an integer of 0 or more). 如請求項1或2之表面處理方法,其中前述官能基II為親水性基且係源自下式(A5)表示之單體:CH2=CR2-CO-NH-R1‧‧‧(A5)(式(A5)中,R1係經選自胺基、磺酸基及羥基所成之群之1個以上之基取代之碳原子數1~4之烷基、或氫原子,R2為氫原子或甲基)。 The surface treatment method of claim 1 or 2, wherein the aforementioned functional group II is a hydrophilic group and is derived from a monomer represented by the following formula (A5): CH 2 = CR 2 -CO-NH-R 1 ‧‧‧ ( A5) (In the formula (A5), R 1 is an alkyl group having 1 to 4 carbon atoms or a hydrogen atom substituted with one or more groups selected from the group consisting of an amine group, a sulfonic acid group, and a hydroxyl group; R 2 is a hydrogen atom or a methyl group). 如請求項5之表面處理方法,其中前述疏水性基為前述矽氧烷基,且前述(A)樹脂係以下述式(A6)表示之矽氧烷化合物:A1-SiR10R11-O-(-SiR10A2-O-)p-SiR10R11A3‧‧‧(A6)(式(A6)中,R10及R11分別獨立為碳原子數1~6之烴基,A1、A2及A3分別獨立為羥基、氰基、羧基或碳原子數1~6之烴基,A1、A2及A3之至少1個為羥基、氰基或羧基,p為0以上之整數)。 The surface treatment method according to claim 5, wherein the hydrophobic group is the aforementioned siloxane group, and the aforementioned (A) resin is a siloxane compound represented by the following formula (A6): A 1 -SiR 10 R 11 -O -(-SiR 10 A 2 -O-) p -SiR 10 R 11 A 3 ‧‧‧ (A6) (in formula (A6), R 10 and R 11 are each independently a hydrocarbon group having 1 to 6 carbon atoms, A 1 , A 2 and A 3 are each independently a hydroxyl group, a cyano group, a carboxyl group or a hydrocarbon group having 1 to 6 carbon atoms; at least one of A 1 , A 2 and A 3 is a hydroxyl group, a cyano group or a carboxyl group; Integer). 如請求項1或2之表面處理方法,其中塗佈前述表面處理液之面的材質為有機材料,前述(A)樹脂具有羥基及/或羧基作為前述官能基I。 The surface treatment method according to claim 1 or 2, wherein a material of the surface on which the surface treatment liquid is applied is an organic material, and the resin (A) has a hydroxyl group and / or a carboxyl group as the functional group I. 一種感光性表面處理液,其係如請求項1或2之表面 處理方法中所用之感光性表面處理液,且含有(A)樹脂、(B)光酸產生劑及(C)溶劑,前述(A)樹脂具有選自由羥基、氰基及羧基所成之群之1個以上之基的官能基I、及前述官能基I以外之親水性基或疏水性基的官能基II,前述(B)光酸產生劑係產生pKa為1以下之強酸。 A photosensitive surface treatment liquid, such as the surface of claim 1 or 2 The photosensitive surface treatment liquid used in the treatment method contains (A) a resin, (B) a photoacid generator, and (C) a solvent. The (A) resin has a group selected from the group consisting of a hydroxyl group, a cyano group, and a carboxyl group. The functional group I of one or more groups, and the functional group II of a hydrophilic group or a hydrophobic group other than the functional group I, the (B) photoacid generator generates a strong acid with a pKa of 1 or less. 一種感光性表面處理液,其含有(A)樹脂、(B)光酸產生劑及(C)溶劑,前述(A)樹脂具有選自由羥基、氰基及羧基所成之群之1個以上之基的官能基I、及前述官能基I以外之親水性基或疏水性基的官能基II,前述(B)光酸產生劑係產生pKa為1以下之強酸。 A photosensitive surface treatment liquid comprising (A) a resin, (B) a photoacid generator, and (C) a solvent, wherein the (A) resin has at least one selected from the group consisting of a hydroxyl group, a cyano group, and a carboxyl group; The functional group I of the group I, and the functional group II of a hydrophilic group or a hydrophobic group other than the functional group I, the (B) photoacid generator generates a strong acid having a pKa of 1 or less.
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