TW201734174A - Lid material - Google Patents

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TW201734174A
TW201734174A TW105138397A TW105138397A TW201734174A TW 201734174 A TW201734174 A TW 201734174A TW 105138397 A TW105138397 A TW 105138397A TW 105138397 A TW105138397 A TW 105138397A TW 201734174 A TW201734174 A TW 201734174A
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Taiwan
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layer
cover material
mass
melt adhesive
hot
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TW105138397A
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Chinese (zh)
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TWI671390B (en
Inventor
Shinji Misawa
Takeshi Nakajima
Keigo Kurita
Kenji Ishiguro
Sho Higasa
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Dynic Corp
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29Laminated material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/18Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/28Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D77/00Packages formed by enclosing articles or materials in preformed containers, e.g. boxes, cartons, sacks or bags
    • B65D77/10Container closures formed after filling
    • B65D77/20Container closures formed after filling by applying separate lids or covers, i.e. flexible membrane or foil-like covers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D201/00Coating compositions based on unspecified macromolecular compounds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/04Non-macromolecular additives inorganic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08Macromolecular additives
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/04Homopolymers or copolymers of ethene
    • C09J123/08Copolymers of ethene
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/04Homopolymers or copolymers of ethene
    • C09J123/08Copolymers of ethene
    • C09J123/0846Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
    • C09J123/0853Vinylacetate
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J131/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, of carbonic acid, or of a haloformic acid; Adhesives based on derivatives of such polymers
    • C09J131/02Homopolymers or copolymers of esters of monocarboxylic acids
    • C09J131/04Homopolymers or copolymers of vinyl acetate
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22Plastics; Metallised plastics
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/28Metal sheet
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35Heat-activated

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Packages (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Wrappers (AREA)
  • Paints Or Removers (AREA)

Abstract

To achieve favorable sealing with a sealing condition similar to the conventional condition even when restraining the elution amount of an organic solvent by changing the material composing a hot melt adhesive layer to a higher molecular-weight material in a lid material comprising laminating a substrate layer/anchor coat layer/stress relaxation layer/hot melt adhesive layer in this order. A lid material includes at least a substrate layer, anchor coat layer, stress relaxation layer and hot melt adhesive layer and has a structure in which those layers are laminated in this order. The hot melt adhesive composing the hot melt adhesive layer contains 20-50 mass% of ethylene-vinyl acetate copolymer as a component (A), and further contains 8-80 pts.mass of a tackifier (component (B)), 85-230 pts.mass of a wax (component (C)) and 15-200 pts.mass of a talc (component (D)) based on 100 pts.mass of the ethylene-vinyl acetate copolymer of the component (A).

Description

蓋材 Cover material

本發明係關於一種用以將收容酸凝酪、乳酸菌飲料、果汁飲料等液狀、流動食品、小麥粉等粉狀食品、火腿或起司等固體食品、各種醫藥品等之塑膠製容器之開口部藉由加熱板加熱或高頻感應加熱而接著從而密封的蓋材。 The present invention relates to an opening for a plastic container for accommodating liquid foods such as acid condensate, lactic acid bacteria beverage, fruit juice beverage, powdered food such as wheat flour, solid food such as ham or cheese, and various pharmaceuticals. A cover material that is then sealed by heating plate heating or high frequency induction heating.

關於收容食品等之容器本體之開口部,一般而言,利用具有熱接著性之蓋材進行密封。近年來,對於此種蓋材,就確保食品等之安全性之觀點而言,要求將蓋材浸漬於有機溶劑時,於有機溶劑溶出之物質之量(於有機溶劑中之溶出量)少。作為應對此種要求之蓋材,提出了鋁箔等基材層/胺酯(urethane)系樹脂等增粘塗佈層/聚乙烯膜等應力緩和層/乙烯-乙酸乙烯酯樹脂系熱熔接著劑層之積層構成之蓋材(專利文獻1)。 The opening of the container body for accommodating food or the like is generally sealed by a lid member having thermal adhesion. In recent years, in order to ensure the safety of foods and the like, it is required that the amount of the substance eluted in the organic solvent (the amount of elution in the organic solvent) is small when the cover material is immersed in the organic solvent. As a cover material for such a request, a stress relaxation layer such as a tackifier coating layer/polyethylene film such as a base material layer such as an aluminum foil/urethane resin or a vinyl-vinyl acetate resin-based hot melt adhesive is proposed. A cover material composed of a laminate of layers (Patent Document 1).

於該蓋材中,關於與收容於容器本體之內容物直接接觸之熱熔接著劑層之構成材料,提出了選擇於有機溶劑溶出之物質相對較少之材料。具體而言,由含有乙酸乙烯酯含量為24~35重量%且熔融指數為30~400g/10min之乙烯-乙酸乙烯酯共聚物25~55重量%、分子量為700~3,500且熔點95~125℃之聚乙烯蠟30~65重量%、及分子量為700~1,400 且軟化點100~125℃之高分子系黏著性賦予劑10~30重量%之熱熔接著劑,形成熱熔接著劑層。 In the cover material, a material having a relatively small amount of a substance selected to be eluted in an organic solvent has been proposed as a constituent material of the hot-melt adhesive layer which is in direct contact with the contents of the container body. Specifically, the ethylene-vinyl acetate copolymer having a vinyl acetate content of 24 to 35% by weight and a melt index of 30 to 400 g/10 min is 25 to 55 wt%, the molecular weight is 700 to 3,500, and the melting point is 95 to 125 ° C. Polyethylene wax 30~65% by weight, and molecular weight 700~1,400 Further, the polymer-based adhesion imparting agent having a softening point of 100 to 125 ° C is 10 to 30% by weight of a hot-melt adhesive to form a hot-melt adhesive layer.

專利文獻1:日本特開平10-156995號公報 Patent Document 1: Japanese Laid-Open Patent Publication No. Hei 10-156995

此處,雖然專利文獻1中所提出之蓋材於食用油脂或乙醇中溶出之物質之溶出量非常小,通常之使用中完全不成問題,但對於己烷而言,存在與食用油脂或乙醇相比,物質之溶出量(於己烷中之溶出量)增大之情況。因此,考慮將熱熔接著劑之各構成材料變更為分子量更高者,而使低分子量之雜質之含量相對地減少化,藉此降低於己烷中之溶出量。 Here, although the amount of elution of the material eluted from the edible oil or the ethanol proposed in Patent Document 1 is very small, it is generally not a problem in use, but for hexane, it exists in the presence of edible fat or ethanol. The ratio of the amount of eluted material (dissolved in hexane) is increased. Therefore, in consideration of changing the constituent materials of the hot-melt adhesive to a higher molecular weight, the content of the low-molecular-weight impurities is relatively reduced, thereby reducing the amount of elution in hexane.

然而,若使用分子量更高者作為構成熱熔接著劑之材料,則蓋材之熱熔接著劑層之密封性會降低,故而若為與以往相同之密封條件,則密封強度之降低令人擔憂。為了避免該情況,考慮使密封條件變得嚴格,但在變得嚴格之狀態下,發現最佳之密封條件非常困難。 However, when a material having a higher molecular weight is used as a material constituting the hot-melt adhesive, the sealing property of the hot-melt adhesive layer of the lid member is lowered, so that the sealing strength is lowered if the sealing condition is the same as in the related art. . In order to avoid this, it is considered that the sealing condition is made strict, but in a state where it is strict, it is extremely difficult to find the optimum sealing condition.

本發明之目的係欲解決上述以往技術之課題,目的在於:對於基材層/增粘塗佈層/應力緩和層/熱熔接著劑層依此順序積層而成之蓋材,藉由將構成熱熔接著劑層之材料變更為分子量更高者而抑制了於有機溶劑中之溶出量,即便於該情形時,亦可於與以往同樣之密封條件下實現良好之密封。 An object of the present invention is to solve the above problems of the prior art, and an object of the present invention is to provide a cover material in which a base material layer, a tackifying coating layer, a stress relieving layer, and a hot-melt adhesive layer are laminated in this order. The material of the hot-melt adhesive layer is changed to a higher molecular weight, and the amount of elution in the organic solvent is suppressed. Even in this case, a good sealing can be achieved under the same sealing conditions as in the related art.

本發明人等發現,若由「在乙烯-乙酸乙烯酯共聚物、黏著 性賦予劑及蠟以特定範圍量混合而成者中摻合有特定量之滑石之熱熔接著劑」形成「基材層/增粘塗佈層/應力緩和層/熱熔接著劑層依此順序積層而成之蓋材」之該熱熔接著劑層,則即便於為了降低蓋材於有機溶劑中之溶出量,而選擇分子量更高者作為構成熱熔接著劑之材料之情形時,亦可不使密封性降低,從而完成了本發明。 The present inventors have found that if the "ethylene-vinyl acetate copolymer, adhesion" The heat-adhesive agent of the talc blended with a specific amount of the wax and the wax is mixed in a specific range to form a "base material layer / tackifying coating layer / stress relieving layer / hot-melt adhesive layer The hot-melt adhesive layer of the cover material which is sequentially laminated, even when a material having a higher molecular weight is selected as a material constituting the hot-melt adhesive, in order to reduce the elution amount of the cover material in the organic solvent The present invention can be completed without lowering the sealing property.

即,本發明提供一種蓋材,其係至少具有基材層、增粘塗佈層、應力緩和層及熱熔接著劑層,該等依此順序積層而成者,構成熱熔接著劑層之熱熔接著劑含有乙烯-乙酸乙烯酯共聚物20~50質量%作為成分(A),進一步,相對於成分(A)100質量份,含有以下之質量份之下述成分(B)~(D)。 That is, the present invention provides a cover material having at least a base material layer, a tackifying coating layer, a stress relieving layer, and a hot-melt adhesive layer, which are laminated in this order to constitute a hot-melt adhesive layer. The hot-melt adhesive contains 20 to 50% by mass of the ethylene-vinyl acetate copolymer as the component (A), and further contains the following components (B) to (D) in the following parts by mass based on 100 parts by mass of the component (A). ).

(A)乙烯-乙酸乙烯酯共聚物 100質量份;(B)黏著性賦予劑 8~80質量份;(C)蠟 85~230質量份;及(D)滑石 15~200質量份。 (A) Ethylene-vinyl acetate copolymer 100 parts by mass; (B) Adhesive imparting agent 8 to 80 parts by mass; (C) wax 85 to 230 parts by mass; and (D) talc 15 to 200 parts by mass.

又,本發明提供一種容器裝之食品,由具有形成有凸緣部之開口部的食品容器、收容於其中之液狀或固體食品、及與形成於該食品容器之開口部之凸緣部接著的蓋材構成,其特徵在於:該蓋材為如上所述之蓋材,該蓋材自熱熔接著劑層側接著於開口部之凸緣部。 Moreover, the present invention provides a container-packed food product comprising a food container having an opening portion in which a flange portion is formed, a liquid or solid food contained therein, and a flange portion formed in an opening portion of the food container The lid member is characterized in that the lid member is a lid member as described above, and the lid member is attached to the flange portion of the opening portion from the side of the hot-melt adhesive layer.

於依序積層有基材層、增粘塗佈層、應力緩和層及熱熔接著劑層之本發明之蓋材中,考慮密封性及於有機溶劑中之溶出量,而使用「於 乙烯-乙酸乙烯酯共聚物、黏著性賦予劑及蠟以特定範圍量混合而成者中摻合有特定量之滑石之熱熔接著劑」作為用以形成熱熔接著劑層之熱熔接著劑。因此,即便於為了降低蓋材於有機溶劑中之溶出量,而選擇分子量更高者作為構成熱熔接著劑之材料之情形時,亦可不使密封性降低。 In the cover material of the present invention in which the base material layer, the adhesion-promoting coating layer, the stress relaxation layer, and the hot-melt adhesive layer are sequentially laminated, the sealing property and the amount of elution in the organic solvent are considered, and A hot melt adhesive in which a specific amount of talc is blended in an ethylene-vinyl acetate copolymer, an adhesion imparting agent, and a wax in a specific range" as a hot-melt adhesive for forming a hot-melt adhesive layer . Therefore, even when a material having a higher molecular weight is selected as a material constituting the hot-melt adhesive in order to lower the elution amount of the cover material in the organic solvent, the sealing property may not be lowered.

1‧‧‧基材層 1‧‧‧ substrate layer

2‧‧‧增粘塗佈層 2‧‧‧Adhesive coating layer

3‧‧‧應力緩和層 3‧‧‧stress relaxation layer

4‧‧‧熱熔接著劑層 4‧‧‧Hot melt adhesive layer

10‧‧‧蓋材 10‧‧‧Cleaning

圖1係本發明之蓋材之概略剖面圖。 BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic cross-sectional view of a cover material of the present invention.

圖2係著眼於填料之種類之情形時之利用加熱板加熱時之密封強度特性圖。 Fig. 2 is a graph showing the sealing strength characteristics when heated by a heating plate in the case of the type of the filler.

圖3係著眼於填料之種類之情形時之利用高頻感應加熱時之密封強度特性圖。 Fig. 3 is a graph showing the sealing strength characteristics when high-frequency induction heating is used in the case of the type of the filler.

圖4係著眼於滑石之摻合量之情形時之利用加熱板加熱時之密封強度特性圖。 Fig. 4 is a graph showing the sealing strength characteristics when heated by a hot plate in the case where the amount of talc is blended.

圖5係著眼於滑石之摻合量之情形時之利用高頻感應加熱時之密封強度特性圖。 Fig. 5 is a graph showing the sealing strength characteristics when high-frequency induction heating is used in the case where the amount of talc is blended.

圖6係著眼於滑石之平均粒徑之情形時之利用加熱板加熱時之密封強度特性圖。 Fig. 6 is a graph showing the sealing strength characteristics when heated by a hot plate in the case of the average particle diameter of talc.

圖7係著眼於滑石之平均粒徑之情形時之利用高頻感應加熱時之密封強度特性圖。 Fig. 7 is a graph showing the sealing strength characteristics when high-frequency induction heating is used in the case of the average particle diameter of talc.

以下,一面參照圖式,一面對本發明之蓋材進行說明。 Hereinafter, the cover material of the present invention will be described with reference to the drawings.

<蓋材> <Cover material>

如圖1所示,本發明之蓋材10具有依序積層有基材層1、增粘塗佈層2、應力緩和層3及熱熔接著劑層4之構造。該蓋材10係用以藉由密封而將容器本體之開口部密閉之材料。作為此種容器本體之構成材料,可列舉:聚苯乙烯、聚丙烯、聚乙烯、聚氯乙烯、聚碳酸酯、聚丙烯腈等塑膠、內襯該等塑膠而成之複合積層體、金屬、聚乙烯層壓紙、玻璃等。 As shown in FIG. 1, the cover material 10 of the present invention has a structure in which a base material layer 1, a tackifying coating layer 2, a stress relieving layer 3, and a hot-melt adhesive layer 4 are sequentially laminated. The cover member 10 is a material for sealing the opening of the container body by sealing. Examples of the constituent material of the container body include a plastic such as polystyrene, polypropylene, polyethylene, polyvinyl chloride, polycarbonate, or polyacrylonitrile, a composite laminate lined with the plastic, and a metal. Polyethylene laminated paper, glass, and the like.

「基材層1」 "Substrate layer 1"

基材層1係對蓋材賦予初始機械強度之主要之層,可設為與以往之蓋材之基材層相同之構成。例如,可根據使用目的,自鐵、不鏽鋼、銅、鋁、金等金屬或合金之薄膜、氮化矽等陶瓷之薄膜、聚對酞酸乙二酯、聚胺酯、聚苯乙烯、聚醯胺、聚醯亞胺等樹脂之膜、抄紙紙、使其等積層而成之複合材料等之中進行選擇。尤其是,為了對蓋材10賦予高頻感應加熱特性,較佳使用在施加高頻時於其本身感應渦電流而發熱之金屬薄膜作為基材層1。其中,就成形性、高頻加熱適應性、經濟性之方面而言,可較佳地列舉鋁箔。 The base material layer 1 is a main layer that imparts initial mechanical strength to the lid member, and can be formed in the same configuration as the base material layer of the conventional lid member. For example, according to the purpose of use, a film of a metal or alloy such as iron, stainless steel, copper, aluminum or gold, a ceramic film such as tantalum nitride, polyethylene terephthalate, polyurethane, polystyrene, polyamine, A film of a resin such as polyimine, a papermaking paper, a composite material obtained by laminating the film, and the like are selected. In particular, in order to impart high-frequency induction heating characteristics to the lid member 10, a metal thin film which generates heat by inducing an eddy current itself when a high frequency is applied is preferably used as the base material layer 1. Among them, an aluminum foil is preferably used in terms of moldability, high-frequency heating suitability, and economy.

作為基材層1之層厚,考慮機械強度或所使用之材料,通常為5~300μm厚,例如,於使用鋁箔等金屬薄膜之情形時,考慮高頻感應加熱特性等,較佳為5~50μm厚,更佳為20~40μm厚。 The layer thickness of the base material layer 1 is usually 5 to 300 μm in consideration of mechanical strength or a material to be used. For example, when a metal film such as aluminum foil is used, high-frequency induction heating characteristics and the like are considered, and it is preferably 5~. 50 μm thick, more preferably 20 to 40 μm thick.

基材層1可根據其素材之種類或厚度,藉由公知之方法形成。於為金屬或合金之薄膜之情形時,可利用冷軋法、真空蒸鍍法、無電鍍法、電鍍法等形成。於為樹脂薄膜之情形時,可利用熔融擠出成形法、 溶液流鑄(flow casting)法、壓延法等形成。又,亦可對樹脂之薄膜實施延伸處理。 The base material layer 1 can be formed by a known method depending on the kind or thickness of the material. In the case of a film of a metal or an alloy, it can be formed by a cold rolling method, a vacuum deposition method, an electroless plating method, a plating method, or the like. In the case of a resin film, a melt extrusion method can be utilized, Formed by a flow casting method, a calendering method, or the like. Further, the film of the resin may be subjected to an elongation treatment.

再者,作為高頻感應加熱之條件,可例示140W、1.4秒之條件,但可根據層之構成或所使用之素材而適當變更。 In addition, as conditions for high-frequency induction heating, conditions of 140 W and 1.4 seconds can be exemplified, but they can be appropriately changed depending on the constitution of the layer or the materials used.

「增粘塗佈層2」 "Tackifying coating layer 2"

增粘塗佈層2係使基材層1與應力緩和層3密接之層,可根據其等之材質進行選擇。 The adhesion-promoting coating layer 2 is a layer in which the base material layer 1 and the stress relaxation layer 3 are in close contact with each other, and can be selected according to the material of the material.

作為增粘塗佈層2,可應用由經氯或酸改質之改質聚烯烴系增粘塗佈劑、聚酯系增粘塗佈劑、聚胺酯系之增粘塗佈劑而形成之層。再者,可於不阻礙基材層1與應力緩和層3之間之密接性之範圍內,於增粘塗佈層2中含有各種填料等添加劑。 As the tackifier coating layer 2, a layer formed of a modified polyolefin-based tackifier coating agent modified with chlorine or acid, a polyester-based tackifier coating agent, or a polyurethane-based tackifier coating agent can be applied. . Further, an additive such as various fillers may be contained in the adhesion-promoting coating layer 2 within a range that does not inhibit the adhesion between the base material layer 1 and the stress relieving layer 3.

關於此種增粘塗佈層2之層厚,若層厚變得過薄,則有導致密封強度之降低之傾向,若變得過厚,則有因增粘塗佈層2內部之凝聚破壞而密封強度降低之傾向,故而較佳為0.1~6.0μm,更佳為0.2~4.5μm。 When the layer thickness of the thickening coating layer 2 is too thin, the sealing strength tends to be lowered, and if it is too thick, the aggregation of the coating layer 2 may be weakened. The tendency of the seal strength to decrease is preferably from 0.1 to 6.0 μm, more preferably from 0.2 to 4.5 μm.

增粘塗佈層2可利用溶液塗佈法而形成。 The adhesion-promoting coating layer 2 can be formed by a solution coating method.

「應力緩和層3」 "stress relaxation layer 3"

應力緩和層3亦作為「補強蓋材之機械強度,緩和高頻加熱時之應力,又,抑制過度之熱量附加於熱熔接著劑層4,使熱熔接著劑層4牢固地接著於蓋材背面之層」而發揮功能。作為此種應力緩和層3,可應用由聚乙烯、聚丙烯等聚烯烴系熱塑性樹脂所形成之樹脂層、由聚對酞酸乙二酯等聚酯系熱塑性樹脂所形成之樹脂層。若考慮高頻密封強度之穩定性等,則可較佳地應用聚乙烯層,可尤佳地應用無延伸聚乙烯層。 The stress relieving layer 3 also serves as "the mechanical strength of the reinforcing cover material to alleviate the stress during high-frequency heating, and the excessive heat is suppressed from being added to the hot-melt adhesive layer 4, so that the hot-melt adhesive layer 4 is firmly adhered to the cover material. It functions as a layer on the back. As the stress relieving layer 3, a resin layer formed of a polyolefin-based thermoplastic resin such as polyethylene or polypropylene or a resin layer formed of a polyester-based thermoplastic resin such as polyethylene terephthalate can be used. If the stability of the high-frequency sealing strength or the like is considered, a polyethylene layer can be preferably applied, and a non-extended polyethylene layer can be preferably applied.

應力緩和層3之層厚較佳為6~60μm,更佳為9~50μm。只要為該範圍,則可實現充分之應力緩和及熱鬆弛,並且可使充分之熱量自基材層1傳導至熱熔接著劑層4。 The layer thickness of the stress relaxation layer 3 is preferably from 6 to 60 μm, more preferably from 9 to 50 μm. As long as it is in this range, sufficient stress relaxation and thermal relaxation can be achieved, and sufficient heat can be conducted from the substrate layer 1 to the hot-melt adhesive layer 4.

再者,於應力緩和層3為聚乙烯層之情形時,關於其層厚,若考慮高頻密封特性及成形性,則較佳為10~50μm,更佳為15~40μm。 In the case where the stress relieving layer 3 is a polyethylene layer, the layer thickness is preferably 10 to 50 μm, more preferably 15 to 40 μm, in consideration of high-frequency sealing property and moldability.

作為將應力緩和層3設置於增粘塗佈層2之方法,可採用公知之方法。例如,可於增粘塗佈層2直接將構成應力緩和層3之材料進行熔融擠出層壓,亦可對由構成應力緩和層3之材料構成之膜進行乾式層壓。 As a method of providing the stress relieving layer 3 on the adhesion-promoting coating layer 2, a known method can be employed. For example, the material constituting the stress relieving layer 3 may be directly melt-extruded and laminated on the tackifying coating layer 2, or the film formed of the material constituting the stress relieving layer 3 may be dry-laminated.

「熱熔接著劑層4」 "hot melt adhesive layer 4"

熱熔接著劑層4係藉由自基材層1傳導來之熱而接著於容器本體之開口部之層,並且係與收容於容器本體之內容物接觸之層。 The hot-melt adhesive layer 4 is adhered to the opening of the container body by the heat conducted from the substrate layer 1 and is in contact with the contents of the container body.

熱熔接著劑層4之附著量較佳為3~40g/m2,更佳為5~30g/m2。只要為該範圍內,則可藉由高頻加熱而獲得充分之高頻密封特性(尤其是密封強度),並且,可將蓋材穩定地剝離,進一步,可減小於有機溶劑中之溶出量。 The adhesion amount of the hot-melt adhesive layer 4 is preferably from 3 to 40 g/m 2 , more preferably from 5 to 30 g/m 2 . As long as it is within this range, sufficient high-frequency sealing characteristics (especially sealing strength) can be obtained by high-frequency heating, and the lid member can be stably peeled off, and further, the amount of elution in the organic solvent can be reduced. .

熱熔接著劑層4之形成可藉由凹版塗佈法等公知之方法進行。 The formation of the hot-melt adhesive layer 4 can be carried out by a known method such as gravure coating.

熱熔接著劑層4由於係與收容於容器本體之內容物接觸之層,故而要求由能夠接著於所應用之容器本體、並且不易溶出至內容物之接著性材料構成。於本發明中,由含有下述成分(A)~(D)之熱熔接著劑而形成。 Since the hot-melt adhesive layer 4 is a layer which is in contact with the contents accommodated in the container main body, it is required to be composed of an adhesive material which can be attached to the applied container body and which is not easily eluted to the contents. In the present invention, it is formed of a hot-melt adhesive containing the following components (A) to (D).

(A)乙烯-乙酸乙烯酯共聚物 (A) ethylene-vinyl acetate copolymer

(B)黏著性賦予劑 (B) Adhesive imparting agent

(C)蠟 (C) wax

(D)滑石 (D) Talc

<成分(A)> <ingredient (A)>

成分(A)之乙烯-乙酸乙烯酯共聚物係作為熱熔接著劑之主成分而發揮功能,使用其之理由在於:容易接著於金屬、樹脂、玻璃等,又,與蠟等容易相溶。 The ethylene-vinyl acetate copolymer of the component (A) functions as a main component of a hot-melt adhesive, and is used because it is easily adhered to a metal, a resin, a glass, or the like, and is easily compatible with a wax or the like.

熱熔接著劑中之成分(A)之乙烯-乙酸乙烯酯共聚物之含量為20~50質量%,較佳為25~45質量%。只要為該範圍,則可不使熱密封強度降低,又,抑制於有機溶劑中之溶出量。 The content of the ethylene-vinyl acetate copolymer of the component (A) in the hot-melt adhesive is 20 to 50% by mass, preferably 25 to 45% by mass. If it is in this range, the heat-sealing strength can be prevented from being lowered, and the amount of elution in the organic solvent can be suppressed.

於本發明中,較佳使用具有以下之特性(a1)~(a3)之乙烯-乙酸乙烯酯共聚物。 In the present invention, an ethylene-vinyl acetate copolymer having the following characteristics (a1) to (a3) is preferably used.

(特性(a1):乙酸乙烯酯含量) (characteristic (a1): vinyl acetate content)

乙烯-乙酸乙烯酯共聚物之乙酸乙烯酯含量較佳為14~41質量%,更佳為19~33質量%。只要為該範圍,則可不使密封強度降低,又,可抑制於有機溶劑中之溶出量。乙酸乙烯酯含量之測量可根據JIS K6924-2而進行。 The vinyl acetate content of the ethylene-vinyl acetate copolymer is preferably from 14 to 41% by mass, more preferably from 19 to 33% by mass. When it is this range, it is possible to suppress the amount of elution in the organic solvent without lowering the sealing strength. The measurement of the vinyl acetate content can be carried out in accordance with JIS K6924-2.

(特性(a2):MFR值) (characteristic (a2): MFR value)

乙烯-乙酸乙烯酯共聚物之MFR值(JIS K7210)較佳為5~400g/10min,更佳為5~150g/10min。只要為該範圍,則不會損害熱熔接著劑之塗佈性,又,可抑制於有機溶劑中之溶出量。MFR值之測量可根據JIS K7210 而進行。 The MFR value (JIS K7210) of the ethylene-vinyl acetate copolymer is preferably from 5 to 400 g/10 min, more preferably from 5 to 150 g/10 min. If it is in this range, the coating property of the hot-melt adhesive is not impaired, and the amount of elution in the organic solvent can be suppressed. The MFR value can be measured according to JIS K7210 And proceed.

(特性(a3):菲卡軟化點) (Characteristic (a3): Fica softening point)

乙烯-乙酸乙烯酯共聚物之菲卡軟化點較佳為25~75℃,更佳為30~65℃。只要為該範圍,則可抑制於有機溶劑中之溶出量,又,可抑制密封強度之降低。菲卡軟化點之測量可根據JIS K7206而進行。 The thicarb softening point of the ethylene-vinyl acetate copolymer is preferably from 25 to 75 ° C, more preferably from 30 to 65 ° C. When it is in this range, the amount of elution in the organic solvent can be suppressed, and the decrease in the sealing strength can be suppressed. The measurement of the Fica softening point can be carried out in accordance with JIS K7206.

作為具有以上所說明之特性(a1)~(a3)之乙烯-乙酸乙烯酯共聚物之具體例,可較佳地列舉:DU PONT-MITSUI POLYCHEMICALS(股)製造之「EVAFLEX(註冊商標)EV420或EV220」、Tosoh(股)製造之「Ultrathene(註冊商標)750」等。例如,「EVAFLEX EV420」之特性(a1)~(a3)如下所述。 Specific examples of the ethylene-vinyl acetate copolymer having the characteristics (a1) to (a3) described above are preferably EVAFLEX (registered trademark) EV420 manufactured by DU PONT-MITSUI POLYCHEMICALS (share). EV220", "Ultrathene (registered trademark) 750" manufactured by Tosoh Co., Ltd., etc. For example, the characteristics (a1) to (a3) of "EVAFLEX EV420" are as follows.

特性(a1):乙酸乙烯酯含量19質量% Characteristic (a1): vinyl acetate content of 19% by mass

特性(a2):MFR值150g/10min Characteristic (a2): MFR value 150g/10min

特性(a3):菲卡軟化點42℃ Characteristic (a3): Ficam softening point 42 ° C

<成分(B)> <ingredient (B)>

成分(B)之黏著性賦予劑係對熱熔接著劑賦予黏著性之成分。 The adhesiveness imparting agent of the component (B) is a component which imparts adhesiveness to the hot melt adhesive.

熱熔接著劑中之成分(B)之黏著性賦予劑之含量相對於成分(A)之乙烯-乙酸乙烯酯共聚物100質量份為8~80質量份,較佳為14~60質量份。只要為該範圍,則可抑制密封強度之降低,又,可抑制於有機溶劑中之溶出量。 The content of the tackifier of the component (B) in the hot-melt adhesive is from 8 to 80 parts by mass, preferably from 14 to 60 parts by mass, per 100 parts by mass of the ethylene-vinyl acetate copolymer of the component (A). When it is this range, the fall of the sealing strength can be suppressed, and the elution amount in an organic solvent can be suppressed.

作為黏著性賦予劑,可使用公知之黏著性賦予劑,例如可列舉:脂環族飽和烴樹脂、脂肪族芳香族共聚樹脂、萜烯樹脂、松香系樹脂。 其中,就接著力提高之觀點而言,可較佳地使用松香系樹脂。 As the adhesiveness-imparting agent, a known adhesiveness-imparting agent can be used, and examples thereof include an alicyclic saturated hydrocarbon resin, an aliphatic aromatic copolymer resin, a terpene resin, and a rosin-based resin. Among them, a rosin-based resin can be preferably used from the viewpoint of improving the force.

於本發明中,以此種松香系樹脂為代表之黏著性賦予劑具有以下之特性(b1)。 In the present invention, the adhesiveness imparting agent represented by such a rosin-based resin has the following characteristics (b1).

(特性(b1):軟化點) (characteristic (b1): softening point)

以松香系樹脂為代表之黏著性賦予劑之軟化點較佳為80~150℃,更佳為85~130℃。只要為該範圍,則可抑制於有機溶劑中之溶出量之增大,又,可抑制密封強度之降低。軟化點之測量可藉由環球法進行。 The softening point of the tackifier as a representative of the rosin-based resin is preferably from 80 to 150 ° C, more preferably from 85 to 130 ° C. When it is in this range, the increase in the amount of elution in the organic solvent can be suppressed, and the decrease in the sealing strength can be suppressed. The measurement of the softening point can be carried out by the ring and ball method.

作為具有以上所說明之特性(b1)之黏著性賦予劑之具體例,可列舉:荒川化學工業(股)製造之「Arkon(註冊商標)P-125」(軟化點125℃)、日本瑞翁(股)製造之「Quintone(註冊商標)D100」(軟化點99℃)、荒川化學工業(股)製造之「SUPER ESTER A-115」(軟化點108℃)、荒川化學工業(股)之「PENSEL(註冊商標)AZ」(軟化點95℃)、哈利瑪化成(股)製造之「HARITACK ER95」(軟化點85℃)等。 Specific examples of the adhesiveness-imparting agent having the above-described characteristics (b1) include "Arkon (registered trademark) P-125" (softening point 125 ° C) manufactured by Arakawa Chemical Industries Co., Ltd., and Japanese Ryan "Quintone (registered trademark) D100" (softening point 99 °C) manufactured by the company, "SUPER ESTER A-115" (softening point 108 ° C) manufactured by Arakawa Chemical Industry Co., Ltd., and "Arakawa Chemical Industry Co., Ltd." PENSEL (registered trademark) AZ" (softening point 95 ° C), "HARITACK ER95" (softening point 85 ° C) manufactured by Halima Chemicals Co., Ltd., etc.

<成分(C)蠟> <ingredient (C) wax>

成分(C)之蠟係降低熱熔接著劑之黏度,且賦予潤濕性之成分。 The wax of the component (C) is a component which lowers the viscosity of the hot melt adhesive and imparts wettability.

熱熔接著劑中之成分(C)之蠟之含量相對於成分(A)之乙烯-乙酸乙烯酯共聚物100質量份,為85~230質量份,較佳為110~200質量份。只要為該範圍,則可抑制因接著材料之高黏度化所導致之塗佈加工性之降低,又,亦可抑制因低黏度化所導致之塗佈加工性之降低,且亦可抑制密封強度之降低。 The content of the wax of the component (C) in the hot-melt adhesive is from 85 to 230 parts by mass, preferably from 110 to 200 parts by mass, per 100 parts by mass of the ethylene-vinyl acetate copolymer of the component (A). When it is in this range, it is possible to suppress a decrease in coating processability due to high viscosity of the adhesive material, and also to suppress a decrease in coating processability due to low viscosity, and also to suppress the seal strength. Reduced.

作為蠟,可使用公知之蠟。例如,可列舉:精製蜂蠟、精製卡拿巴蠟、精製褐煤蠟、石蠟、微晶蠟等天然蠟;聚乙烯蠟、聚丙烯蠟、 費雪-闕布希(Fischer-Tropsch)蠟等合成蠟等。其中,就熔點或分子量分佈之穩定性等方面而言,較佳為合成蠟,更佳為費雪-闕布希蠟。 As the wax, a known wax can be used. For example, a natural wax such as refined beeswax, refined kanabah wax, refined montan wax, paraffin wax, or microcrystalline wax; polyethylene wax, polypropylene wax, Synthetic waxes such as Fischer-Tropsch wax. Among them, in terms of the stability of the melting point or the molecular weight distribution, etc., a synthetic wax is preferred, and a Fisher-Bush Bus wax is more preferred.

作為此種蠟,較佳具有以下之特性(c1)。 As such a wax, it is preferred to have the following characteristics (c1).

(特性(c1):熔點) (characteristic (c1): melting point)

以聚乙烯蠟等為代表之蠟之熔點較佳為80~130℃,更佳為85~120℃。只要為該範圍,則可抑制於有機溶劑中之溶出量,又,可抑制低溫下之密封性之降低。熔點之測量可藉由DSC法進行。 The melting point of the wax represented by polyethylene wax or the like is preferably 80 to 130 ° C, more preferably 85 to 120 ° C. When it is in this range, the amount of elution in the organic solvent can be suppressed, and the decrease in the sealing property at a low temperature can be suppressed. The measurement of the melting point can be carried out by the DSC method.

作為具有以上所說明之特性(c1)之蠟之具體例,可列舉:Yasuhara Chemical(股)製造之「Neo Wax L」(熔點110±10℃)、三井化學(股)製造之「HI-WAX NL900」(熔點103℃)、日本精蠟(股)製造之「FT105」(熔點102℃)等。 Specific examples of the wax having the above-described characteristics (c1) include "Neo Wax L" (melting point 110 ± 10 ° C) manufactured by Yasuhara Chemical Co., Ltd., and "HI-WAX" manufactured by Mitsui Chemicals Co., Ltd. NL900" (melting point: 103 °C), "FT105" (melting point: 102 °C) manufactured by Japan Fine Wax Co., Ltd., etc.

<成分(D)滑石> <ingredient (D) talc>

本發明中所使用之熱熔接著劑含有滑石作為成分(D)。滑石於其他樹脂成分中之分散性優異,並且可提高熱熔接著劑之凝聚力,進一步,係用以在不使自基材層1向熱熔接著劑層4的熱之移動過度擴散之情況下傳遞熱之成分。 The hot-melt adhesive used in the present invention contains talc as the component (D). The talc is excellent in dispersibility in other resin components, and can improve the cohesive force of the hot-melt adhesive, and further, is used to prevent excessive diffusion of heat from the base material layer 1 to the hot-melt adhesive layer 4. Pass the ingredients of heat.

熱熔接著劑中之成分(D)之滑石之含量相對於成分(A)之乙烯-乙酸乙烯酯共聚物100質量份,為15~200質量份,較佳為60~170質量份。只要為該範圍,則可抑制低溫下之密封性之降低,並且抑制於有機溶劑中之溶出量,又,可抑制對樹脂等其他摻合物之相容性之降低,並且抑制因流動性之降低所導致之塗佈性之降低。 The content of the talc of the component (D) in the hot-melt adhesive is 15 to 200 parts by mass, preferably 60 to 170 parts by mass, per 100 parts by mass of the ethylene-vinyl acetate copolymer of the component (A). When it is in this range, the decrease in the sealing property at a low temperature can be suppressed, and the amount of elution in the organic solvent can be suppressed, and the decrease in compatibility with other blends such as a resin can be suppressed, and the fluidity can be suppressed. Reduce the resulting decrease in coatability.

於本發明中,較佳使用具有以下之特性(d1)~(d3)之滑 石。 In the present invention, it is preferable to use a slip having the following characteristics (d1) to (d3). stone.

(特性(d1):粒徑(D50)) (characteristic (d1): particle size (D50))

滑石之粒徑(D50)(中值粒徑)較佳為0.1~50μm,更佳為0.5~25μm。只要為該範圍,則可抑制粒子體積之增大而使塗料製備容易化,又,可抑制導熱性之降低而抑制熱密封性之降低。粒徑(D50)之測量可利用雷射繞射法進行。 The particle diameter (D50) (median diameter) of the talc is preferably from 0.1 to 50 μm, more preferably from 0.5 to 25 μm. When it is in this range, it is possible to suppress the increase in the volume of the particles, thereby facilitating the preparation of the coating material, and suppressing the decrease in the thermal conductivity and suppressing the decrease in the heat-sealing property. The measurement of the particle size (D50) can be carried out by a laser diffraction method.

(特性(d2):視密度) (characteristic (d2): apparent density)

滑石之視密度較佳為0.05~0.7g/mL,更佳為0.08~0.6g/mL。只要為該範圍,則可抑制粒子體積之增大而使塗料製備容易化,又,可抑制導熱性之降低而抑制熱密封性之降低。視密度之測量可根據JIS K5101而進行。 The apparent density of talc is preferably from 0.05 to 0.7 g/mL, more preferably from 0.08 to 0.6 g/mL. When it is in this range, it is possible to suppress the increase in the volume of the particles, thereby facilitating the preparation of the coating material, and suppressing the decrease in the thermal conductivity and suppressing the decrease in the heat-sealing property. The measurement of the apparent density can be performed in accordance with JIS K5101.

(特性(d3):比表面積) (characteristic (d3): specific surface area)

滑石之比表面積較佳為1.5~100m2/g,更佳為2.5~40m2/g。只要為該範圍,則可抑制導熱性之降低,而抑制密封強度之降低,又,可使塗料製備容易化。比表面積之測量可藉由BET法進行。 The specific surface area of the talc is preferably from 1.5 to 100 m 2 /g, more preferably from 2.5 to 40 m 2 /g. When it is in this range, the decrease in thermal conductivity can be suppressed, and the decrease in sealing strength can be suppressed, and the preparation of the coating can be facilitated. The measurement of the specific surface area can be carried out by the BET method.

作為具有以上所說明之特性(d1)~(d3)之滑石之具體例,可較佳地列舉:Nippon Talc(股)製造之「MICRO ACE(註冊商標)K-1」(粒徑(D50)8.0μm,視密度0.25g/mL,比表面積7.0m2/g)、Nippon Talc(股)製造之「MS-K」(粒徑(D50)16μm,視密度0.40g/mL,比表面積4.0m2/g)、Nippon Talc(股)製造之「MS-KY」(粒徑(D50)25μm,視密度0.55g/mL,比表面積2.5m2/g)等。 As a specific example of the talc having the characteristics (d1) to (d3) described above, "MICRO ACE (registered trademark) K-1" (particle diameter (D50)) manufactured by Nippon Talc Co., Ltd. is preferably exemplified. 8.0 μm, apparent density 0.25 g/mL, specific surface area 7.0 m 2 /g), Nippon Talc (MS) manufactured by "MS-K" (particle size (D50) 16 μm, apparent density 0.40 g/mL, specific surface area 4.0 m 2 / g), "MS-KY" (particle diameter (D50) 25 μm, apparent density 0.55 g / mL, specific surface area 2.5 m 2 /g) manufactured by Nippon Talc Co., Ltd., and the like.

以上所說明之熱熔接著劑層4可藉由利用凹版塗佈機、缺角輪塗佈機(comma coater)、模塗佈機(die coater)等公知之塗佈方法,將熱 熔接著劑塗佈於應力緩和層3,並進行冷卻而形成。於此情形時,可為平坦之膜形狀、壓紋加工膜形狀、點形狀、線形狀。 The hot-melt adhesive layer 4 described above can be heated by a known coating method such as a gravure coater, a comma coater, a die coater or the like. The flux is applied to the stress relieving layer 3 and formed by cooling. In this case, it may be a flat film shape, an embossed film shape, a dot shape, or a line shape.

「印刷層、保護層」 "Printing layer, protective layer"

對於本發明之蓋材,可於基材層1外表面設置可利用公知之方法形成之印刷層。進一步,亦可設置透明保護層。又,亦可視需要對蓋材之基材層1側之外表面實施壓紋加工。亦可視需要於加工熱熔接著劑層之面設置印刷層,亦可於基材層設置印刷層。 For the cover material of the present invention, a printed layer which can be formed by a known method can be provided on the outer surface of the base material layer 1. Further, a transparent protective layer may also be provided. Further, the outer surface of the base material layer 1 side of the lid member may be embossed as needed. It is also possible to provide a printing layer on the surface of the hot-melt adhesive layer, or to provide a printing layer on the substrate layer.

「密封特性」 "sealing characteristics"

本發明之蓋材由於具有如上所說明之構成,故而於藉由加熱板加熱、高頻感應加熱、超音波加熱等進行密封處理之情形時,會顯示出良好之密封特性(強度)。例如,於採用加熱板加熱之情形時,作為密封條件,可列舉:密封溫度80~240℃、密封時間0.5~3秒、密封壓力0.1~0.5MPa。於採用高頻感應加熱之情形時,作為密封條件,可列舉:功率110~170W、密封時間0.5~1.5秒、密封壓力0.1~0.3Mpa。 Since the lid member of the present invention has the above-described configuration, it exhibits good sealing properties (strength) when it is subjected to a sealing treatment by heating with a hot plate, high-frequency induction heating, ultrasonic heating or the like. For example, when heating with a hot plate, the sealing conditions include a sealing temperature of 80 to 240 ° C, a sealing time of 0.5 to 3 seconds, and a sealing pressure of 0.1 to 0.5 MPa. In the case of using high-frequency induction heating, the sealing conditions include a power of 110 to 170 W, a sealing time of 0.5 to 1.5 seconds, and a sealing pressure of 0.1 to 0.3 Mpa.

(於有機溶劑中之溶出量) (dissolution amount in organic solvent)

本發明之蓋材係由「在乙烯-乙酸乙烯酯共聚物、黏著性賦予劑及蠟以特定範圍量混合而成者中摻合有特定量之滑石之熱熔接著劑」形成與容器之內容物接觸之熱熔接著劑層4。因此,即便於為了能夠防止密封性降低而選擇分子量更高者作為構成熱熔接著劑之材料之情形時,亦可使蓋材於有機溶劑中之溶出量降低。尤其是,本發明之蓋材可基於食品衛生法之規格基準(1959年厚生省告示第370號)之器具及容器包裝之規格試驗中所規定之蒸發殘留物試驗法(溶出液為正庚烷)之油性食品溶出試驗,而將 殘留物(於庚烷中之溶出量)設為30μg/mL以下。 The cover material of the present invention is formed from the contents of the container by "a hot-melt adhesive in which a specific amount of talc is blended in an ethylene-vinyl acetate copolymer, an adhesive imparting agent and a wax in a specific range". The hot melt adhesive layer 4 is in contact with the object. Therefore, even when a material having a higher molecular weight is selected as a material constituting the hot-melt adhesive in order to prevent a decrease in the sealing property, the elution amount of the lid member in the organic solvent can be lowered. In particular, the cover material of the present invention can be based on the specification of the Food Sanitation Law (No. 370 of the Ministry of Health and Welfare No. 370 of 1959) and the evaporation residue test method specified in the specification test of the appliance and container packaging (the eluate is n-heptane) Oily food dissolution test, and will The residue (the amount of elution in heptane) was set to 30 μg/mL or less.

進一步,本發明之蓋材可將利用以下所說明之試驗方法進行時所獲得之殘留物(於己烷中之溶出量)設為30mg/L以下。 Further, the lid material of the present invention can be made into a residue (the amount of elution in hexane) obtained by the test method described below as 30 mg/L or less.

(利用正己烷所獲得之溶出試驗蒸發殘留物) (Dissolution test evaporation residue obtained with n-hexane)

根據中華人民共和國國家標準「關於食品包裝用聚乙烯、聚苯乙烯、聚丙烯之成型品之衛生標準之分析方法」(GB/T5009.60-2003),將切取為10cm見方之大小之試樣於25℃整個面浸漬於200mL之正己烷2小時,藉此製備試驗溶液。將該試驗溶液移至茄型燒瓶中,進行減壓濃縮直至殘留量成為數mL。於所獲得之濃縮液中添加分別利用5mL之正己烷對用於減壓濃縮之燒瓶之內壁進行2次洗淨而獲得之洗液,並將其取於預先於105℃經乾燥之重量已知之蒸發皿中,使其蒸發乾固。繼而,於105℃乾燥2小時之後,於乾燥器中進行放冷。放冷之後,進行稱量而求出蒸發皿於試驗前後之質量差,並算出試驗溶液每1L之蒸發殘留物之量(mg)。 According to the National Standard of the People's Republic of China, “Analytical Method for Sanitary Standards for Molded Polyethylene, Polystyrene and Polypropylene for Food Packaging” (GB/T5009.60-2003), the sample shall be cut to a size of 10 cm square. The test solution was prepared by immersing in 200 mL of n-hexane over the entire surface at 25 ° C for 2 hours. The test solution was transferred to an eggplant type flask, and concentrated under reduced pressure until the residual amount became several mL. To the obtained concentrate, a washing liquid obtained by separately washing the inner wall of the flask for concentration under reduced pressure with 5 mL of n-hexane was added, and the dried liquid was dried at 105 ° C in advance. Know the evaporating dish, let it evaporate and dry. Then, after drying at 105 ° C for 2 hours, it was allowed to cool in a desiccator. After cooling, the amount of the evaporating dish before and after the test was determined by weighing, and the amount (mg) of the evaporation residue per 1 L of the test solution was calculated.

「蓋材之製造方法」 "Manufacturing method of cover material"

如以上所說明般,本發明之蓋材可藉由利用公知之方法,於基材層1形成增粘塗佈層2,進一步,設置應力緩和層3,進一步設置熱熔接著劑層4而製造。 As described above, the cover material of the present invention can be formed by forming the adhesion-promoting coating layer 2 on the base material layer 1 by a known method, further providing the stress relaxation layer 3, and further providing the hot-melt adhesive layer 4. .

<蓋材之用途> <Use of cover material>

本發明之蓋材可較佳地作為「由具有形成有凸緣部之開口部的食品容器、收容於其中之液狀或固體食品、及與形成於該食品容器之開口部之凸緣部接著的蓋材構成之容器裝之食品」之該蓋材而使用。於此情形時,蓋材自接著劑層側應用於開口部之凸緣部並藉由高頻感應加熱而被熱接著。 如此獲得之「容器裝之食品」亦為本發明之一態樣。作為食品容器,可列舉聚苯乙烯製之公知之食品容器等。 The lid member of the present invention can be preferably used as a "food container having an opening portion in which a flange portion is formed, a liquid or solid food contained therein, and a flange portion formed in an opening portion of the food container. The lid material is used for the lid material of the food container. In this case, the cover material is applied to the flange portion of the opening from the adhesive layer side and is thermally heated by high frequency induction heating. The "container-packed food" thus obtained is also an aspect of the present invention. As the food container, a known food container made of polystyrene or the like can be mentioned.

液狀或固體食品中之「液狀或固體」意指:若使容器傾斜,則作為內容物之食品之形狀發生變形(流出、流動等)之狀態,或作為內容物之食品之形狀不發生變形之狀態(固體)。作為此種液狀或固體食品,可列舉:酸凝酪、乳酸飲料等乳製品、果醬製品、湯、咖哩醬、燉菜、拌飯料等食品等,但不限定於該等食品。 "Liquid or solid" in a liquid or solid food means that if the container is tilted, the shape of the food as a content is deformed (flow, flow, etc.), or the shape of the food as a content does not occur. The state of deformation (solid). Examples of such liquid or solid foods include, but are not limited to, dairy products such as sourdough and lactic acid beverages, jam products, soups, curry sauces, stews, and rice-filled foods.

[實施例] [Examples]

以下,列舉實施例及比較例,對本發明更具體地進行說明。 Hereinafter, the present invention will be more specifically described by way of examples and comparative examples.

實施例1 Example 1

(A1箔/增粘塗佈層/LDPE/熱熔接著劑層) (A1 foil / tackifying coating layer / LDPE / hot melt adhesive layer)

藉由於厚度30μm之鋁箔(JIS H4160中所規定之合金編號:1N30)之單面,利用凹版塗佈機塗佈2液硬化型擠出層壓用增粘塗佈劑(異氰酸酯系),並進行乾燥,而形成0.35μm厚之增粘塗佈層,於該增粘塗佈層上,擠出厚度30μm之低密度聚乙烯(MFR=7)並進行層壓,進一步,利用凹版塗佈機將以下配方之熱熔接著劑以塗佈量成為12.7g/m2之方式塗佈為點狀,而獲得蓋材。 A two-layer hardening type extrusion-adhesive thickening coating agent (isocyanate type) is applied by a gravure coater on one side of an aluminum foil having a thickness of 30 μm (alloy number: 1N30 specified in JIS H4160). Drying to form a 0.35 μm thick tackifying coating layer, and on the tackifying coating layer, a low density polyethylene (MFR=7) having a thickness of 30 μm was extruded and laminated, and further, using a gravure coater The hot-melt adhesive of the following formulation was applied in a dot shape so that the coating amount became 12.7 g/m 2 to obtain a lid material.

比較例1 Comparative example 1

不將滑石添加至熱熔接著劑中,且將熱熔接著劑之塗佈量設為12.1g/m2,除此以外,與實施例1同樣地製備熱熔接著劑,進一步製作蓋材。 A hot-melt adhesive was prepared in the same manner as in Example 1 except that the talc was added to the hot-melt adhesive and the amount of the hot-melt adhesive applied was 12.1 g/m 2 , and a cover material was further prepared.

比較例2 Comparative example 2

使用碳酸鈣(輕質碳酸鈣,平均粒徑2.0×0.4μm)代替滑石,且將熱熔接著劑之塗佈量設為14.4g/m2,除此以外,與實施例1同樣地製備熱熔接著劑,進一步製作蓋材。 Heat was prepared in the same manner as in Example 1 except that calcium carbonate (light calcium carbonate, average particle diameter: 2.0 × 0.4 μm) was used instead of talc, and the amount of the hot-melt adhesive applied was 14.4 g/m 2 . The adhesive is further melted to further prepare a cover material.

比較例3 Comparative example 3

使用金紅石型二氧化鈦(平均粒徑0.25μm,比重4.1,吸油量19g/100g)代替滑石,且將熱熔接著劑之塗佈量設為14.6g/m2,除此以外,與實施例1同樣地製備熱熔接著劑,進一步製作蓋材。 The rutile type titanium dioxide (having an average particle diameter of 0.25 μm, a specific gravity of 4.1, and an oil absorption of 19 g/100 g) was used instead of the talc, and the coating amount of the hot-melt adhesive was set to 14.6 g/m 2 , and Example 1 was used. A hot melt adhesive was prepared in the same manner to further prepare a cover material.

比較例4 Comparative example 4

使用銳鈦礦型二氧化鈦(平均粒徑0.25μm,吸油量25g/100g)代替滑石,且將熱熔接著劑之塗佈量設為14.0g/m2,除此以外,與實施例1同樣地製備熱熔接著劑,進一步製作蓋材。 In the same manner as in Example 1, except that anatase type titanium dioxide (average particle diameter: 0.25 μm, oil absorption amount: 25 g/100 g) was used instead of talc, and the amount of the hot-melt adhesive applied was set to 14.0 g/m 2 . A hot melt adhesive is prepared to further prepare a cover material.

比較例5 Comparative Example 5

使用高嶺黏土(平均粒徑0.4μm,吸油量43g/100g)代替滑石,且將熱熔接著劑之塗佈量設為12.2g/m2,除此以外,與實施例1同樣地製備熱熔接著劑,進一步製作蓋材。 A hot-melt joint was prepared in the same manner as in Example 1 except that the talc was used in place of the talc (average particle diameter: 0.4 μm, oil absorption: 43 g/100 g), and the amount of the hot-melt adhesive was 12.2 g/m 2 . The agent is further used to make a cover material.

比較例6 Comparative Example 6

使用二氧化矽(平均粒徑3.5~4.3μm,吸油量300~350mL/100g(亞麻籽油))10質量份代替滑石,且將熱熔接著劑之塗佈量設為11.8g/m2,除此以外,與實施例1同樣地製備熱熔接著劑,進一步製作蓋材。 10 parts by mass of cerium oxide (average particle diameter of 3.5 to 4.3 μm, oil absorption of 300 to 350 mL/100 g (linseed oil)) was used instead of talc, and the coating amount of the hot melt adhesive was set to 11.8 g/m 2 . A hot-melt adhesive was prepared in the same manner as in Example 1 except that the cover material was further prepared.

(評價試驗) (evaluation test)

「利用加熱板加熱所獲得之密封強度」 "The sealing strength obtained by heating with a hot plate"

將實施例1及比較例1~6中所獲得之蓋材分別切取為長度10cm、寬度15mm之短條而製成試片。於聚苯乙烯板以表2之密封溫度、密封時間1秒、密封壓力0.2MPa對該試片之端部20mm進行密封。將端部被密封於聚苯乙烯板之試片之另一端部設置於拉伸試驗機(Autograph(註冊商標)AGS-500NJ,島津製作所(股)),以剝離速度300mm/min分別進行5次180°剝離試驗。將所獲得之5次試驗之密封強度之平均值示於表2及圖2中。於本次試驗之密封條件下,於實用方面,密封強度較佳為於密封溫度為140℃時為10N/15mm寬以上。進一步,更佳為於密封溫度為100℃時,為5N/15mm寬以上。 The cover materials obtained in Example 1 and Comparative Examples 1 to 6 were each cut into short strips having a length of 10 cm and a width of 15 mm to prepare test pieces. The end portion of the test piece was sealed to 20 mm at a sealing temperature of Table 2, a sealing time of 1 second, and a sealing pressure of 0.2 MPa. The other end of the test piece in which the end portion was sealed to the polystyrene plate was placed in a tensile tester (Autograph (registered trademark) AGS-500NJ, Shimadzu Corporation (stock)), and the peeling speed was 300 mm/min, respectively, 5 times. 180° peel test. The average values of the seal strengths of the five tests obtained are shown in Table 2 and Figure 2. Under the sealing conditions of this test, in practical terms, the sealing strength is preferably 10 N/15 mm or more when the sealing temperature is 140 °C. Further, it is more preferably 5 N/15 mm or more when the sealing temperature is 100 °C.

「利用高頻感應加熱所獲得之密封強度」 "The sealing strength obtained by high frequency induction heating"

將實施例1及比較例1~6中所獲得之蓋材切斷為外徑38mm之圓狀,並將其安裝於開口部外徑24mm、開口部內徑20mm且呈瓶型形狀之容積65mL之聚苯乙烯製容器,以功率110~170W、密封壓力0.05MPa、密封時間1.4秒進行密封。密閉之後,將蓋材之端部以300mm/min之速度相對於密封有蓋材之容器表面於45度方向剝離,將剝離時之最大值設為密封強度。剝離試驗係進行5次,並使用其平均值。於實用方面,較佳為保持功率125W且7N以上之密封強度。將所獲得之結果示於表3及圖3中。 The lid member obtained in Example 1 and Comparative Examples 1 to 6 was cut into a circular shape having an outer diameter of 38 mm, and was attached to a container having an outer diameter of 24 mm in the opening and an inner diameter of 20 mm in the opening and having a bottle shape of 65 mL. The polystyrene container was sealed at a power of 110 to 170 W, a sealing pressure of 0.05 MPa, and a sealing time of 1.4 seconds. After the sealing, the end portion of the lid member was peeled off at a speed of 300 mm/min with respect to the surface of the container sealed with the lid member in a direction of 45 degrees, and the maximum value at the time of peeling was defined as the sealing strength. The peel test was carried out 5 times and the average value was used. In practical terms, it is preferred to maintain a sealing strength of 125 W and 7 N or more. The results obtained are shown in Table 3 and Figure 3.

實施例2~6 Example 2~6

將滑石之添加量自30質量份變更為5質量份(實施例2)、10質量份(實施例3)、20質量份(實施例4)、50質量份(實施例5)或70質量份(實施例6),且將熱熔接著劑之塗佈量自12.7g/m2分別設為12.5g/m2、14.5g/m2、14.0g/m2、14.2g/m2或14.8g/m2,除此以外,與實施例1同樣地製備熱熔接著劑,進一步製作蓋材。 The amount of talc added was changed from 30 parts by mass to 5 parts by mass (Example 2), 10 parts by mass (Example 3), 20 parts by mass (Example 4), 50 parts by mass (Example 5) or 70 parts by mass. (Example 6), and the hot-melt agent is then coated amount of from 12.7g / m 2, respectively, to 12.5g / m 2, 14.5g / m 2, 14.0g / m 2, 14.2g / m 2 or 14.8 A hot-melt adhesive was prepared in the same manner as in Example 1 except that g/m 2 was used, and a lid member was further prepared.

(評價試驗) (evaluation test)

對於實施例2~6之蓋材,與實施例1同樣地對「利用加熱板加熱所獲得之密封強度」及「利用高頻感應加熱所獲得之密封強度」進行試驗。將所獲得之結果與實施例1及比較例1之結果一併表示,將前者示於表4及圖4中,將後者示於表5及圖5中。 In the cover materials of Examples 2 to 6, the "sealing strength obtained by heating with a hot plate" and "sealing strength obtained by high-frequency induction heating" were tested in the same manner as in the first embodiment. The results obtained are shown together with the results of Example 1 and Comparative Example 1, and the former is shown in Table 4 and Figure 4, and the latter is shown in Table 5 and Figure 5.

實施例7、8 Examples 7, 8

將平均粒徑(D50)16μm之滑石(實施例1)變更為平均粒徑(D50)8μm之滑石(視密度0.25g/mL,比表面積7.0m2/g)(實施例7)、或平均粒徑(D50)25μm之滑石(視密度0.55g/mL,比表面積2.5m2/g)(實施例8),且將熱熔接著劑之塗佈量自12.7g/m2分別設為12.4g/m2或12.8g/m2,除此以外,與實施例1同樣地製備熱熔接著劑,進一步製作蓋材。 The talc having an average particle diameter (D50) of 16 μm (Example 1) was changed to talc having an average particle diameter (D50) of 8 μm (visual density: 0.25 g/mL, specific surface area: 7.0 m 2 /g) (Example 7), or average Talc having a particle diameter (D50) of 25 μm (visual density: 0.55 g/mL, specific surface area: 2.5 m 2 /g) (Example 8), and the coating amount of the hot-melt adhesive was set to 12.4 from 12.7 g/m 2 , respectively. A hot-melt adhesive was prepared in the same manner as in Example 1 except that g/m 2 or 12.8 g/m 2 was used, and a cover material was further prepared.

(評價試驗) (evaluation test)

對於實施例7、8之蓋材,與實施例1同樣地對「利用加熱板加熱所獲得之密封強度」及「利用高頻感應加熱所獲得之密封強度」進行試驗。將所獲得之結果與實施例1之結果一併表示,將前者示於表6及圖6中,將後者示於表7及圖7中。 In the cover materials of Examples 7 and 8, the "sealing strength obtained by heating with a hot plate" and "sealing strength obtained by high-frequency induction heating" were tested in the same manner as in the first embodiment. The results obtained are shown together with the results of Example 1, and the former is shown in Table 6 and Figure 6, and the latter is shown in Table 7 and Figure 7.

「於正己烷中之溶出量」 "Dissolution in n-hexane"

將比較例1(無滑石)、實施例1(滑石30質量份)、實施例5(滑石50質量份)及實施例6(滑石70質量份)之蓋材分別切取為10cm見方之大小,而製成試樣片。根據中華人民共和國國家標準「關於食品包裝用聚乙烯、聚苯乙烯、聚丙烯之成型品之衛生標準之分析方法」(GB/T5009.60-2003),將該試樣片於25℃整個面浸漬於200mL之正己烷2小時,藉此製備試驗溶液。將所獲得之試驗溶液分別移至茄型燒瓶中,進行減壓濃縮直至殘留量成為數mL。於所獲得之濃縮液中添加分別利用5mL之正己烷對用於減壓濃縮之燒瓶之內壁進行2次洗淨而獲得之洗液,並將其取於預先於105℃經乾燥之重量已知之蒸發皿中,使其蒸發乾固。繼而,於105℃乾燥2小時之後,於乾燥器中進行放冷。放冷之後,進行稱量而求出蒸發皿於試驗前後之質量差,並算出試驗溶液每1L之蒸發殘留物之量(mg)。將所獲得之結果示於表8中。 The cover materials of Comparative Example 1 (without talc), Example 1 (30 parts by mass of talc), Example 5 (50 parts by mass of talc), and Example 6 (70 parts by mass of talc) were each cut to a size of 10 cm square. A sample piece was prepared. According to the National Standard of the People's Republic of China, “Analytical Method for Sanitary Standards for Shaped Products of Polyethylene, Polystyrene and Polypropylene for Food Packaging” (GB/T5009.60-2003), the sample piece is applied at 25 ° C. The test solution was prepared by immersing in 200 mL of n-hexane for 2 hours. The obtained test solution was separately transferred to an eggplant type flask, and concentrated under reduced pressure until the residual amount became several mL. To the obtained concentrate, a washing liquid obtained by separately washing the inner wall of the flask for concentration under reduced pressure with 5 mL of n-hexane was added, and the dried liquid was dried at 105 ° C in advance. Know the evaporating dish, let it evaporate and dry. Then, after drying at 105 ° C for 2 hours, it was allowed to cool in a desiccator. After cooling, the amount of the evaporating dish before and after the test was determined by weighing, and the amount (mg) of the evaporation residue per 1 L of the test solution was calculated. The results obtained are shown in Table 8.

(考察) (examine)

由表2(圖2)及表3(圖3)之結果可知,各種填料之中,滑石可提高利用加熱板加熱或高頻感應加熱所獲得之密封強度。可知,尤其於使用滑石之實施例1之情形時,於加熱板加熱中,於140℃獲得15.2N/15mm寬之密封強度,與使用其他填料之比較例2~6之情形相比,保持更優異之密封強度。於高頻感應加熱中,與其他填料相比,亦保持更優異之密封強度。 From the results of Table 2 (Fig. 2) and Table 3 (Fig. 3), it is understood that among the various fillers, talc can improve the sealing strength obtained by heating with a hot plate or high frequency induction heating. It can be seen that, especially in the case of Example 1 using talc, a sealing strength of 15.2 N/15 mm width was obtained at 140 ° C in heating of the hot plate, and it was kept more than in the case of Comparative Examples 2 to 6 using other fillers. Excellent sealing strength. In high frequency induction heating, it also maintains superior sealing strength compared to other fillers.

由表4(圖4)及表5(圖5)之結果,可見如下傾向:若將滑石之含量自5質量份逐漸增加,則密封強度提高(實施例1~6)。可知,於加熱板加熱之情形時,若添加滑石5質量份以上,則於140℃之密封強度為較佳之密封強度,即,10N/15mm寬以上,若滑石添加量為20質量份以上,則於100℃亦保持5N/15mm寬以上,故而更佳。可知,於高頻感應加熱中,藉由添加滑石5質量份以上,即便於功率較低之125W,亦保持7.1N之密封強度,而於功率較低之區域亦可進行加工。 From the results of Table 4 (Fig. 4) and Table 5 (Fig. 5), the following tendency was observed: when the content of talc was gradually increased from 5 parts by mass, the sealing strength was improved (Examples 1 to 6). When the talc is added in an amount of 5 parts by mass or more, the sealing strength at 140 ° C is preferably a sealing strength, that is, 10 N/15 mm or more, and when the talc is added in an amount of 20 parts by mass or more, the talc is added in an amount of 20 parts by mass or more. It is also kept at 5 N/15 mm or more at 100 ° C, and thus is more preferable. In the high-frequency induction heating, by adding 5 parts by mass or more of talc, even at a low power of 125 W, a sealing strength of 7.1 N is maintained, and processing can be performed in a region where power is low.

由表6(圖6)及表7(圖7)之結果,可見如下傾向:若滑石之粒徑變小,則於相對較高之密封條件下,密封強度提高(實施例1、7、8)。可知,於本次實驗結果之範圍內,於較低之密封條件下,亦獲得優異之密封強度。 From the results of Table 6 (Fig. 6) and Table 7 (Fig. 7), it can be seen that if the particle size of the talc becomes small, the sealing strength is improved under relatively high sealing conditions (Examples 1, 7, and 8). ). It can be seen that in the range of the results of this experiment, excellent sealing strength is also obtained under the lower sealing conditions.

再者,由表8之結果可知,若滑石之含量增加,則正己烷溶出量減少。又,根據食品衛生法之規格基準,利用溶出液正庚烷進行蒸發殘留物試驗之結果為,於實施例1、5、6中,於正庚烷中之殘留物均為20μg/mL以下,且基於食品衛生法之規格基準之正庚烷溶出亦保持優異之品質。 Further, as is clear from the results of Table 8, when the content of talc is increased, the amount of n-hexane eluted is decreased. Moreover, as a result of the evaporation residue test using the eluate n-heptane according to the specifications of the Food Sanitation Law, in Examples 1, 5, and 6, the residue in n-heptane was 20 μg/mL or less. The n-heptane dissolution based on the specifications of the Food Sanitation Law also maintains excellent quality.

[產業上之可利用性] [Industrial availability]

於依序積層有基材層、增粘塗佈層、應力緩和層及熱熔接著劑層之本發明之蓋材中,考慮密封性及於有機溶劑中之溶出量,而使用「於乙烯-乙酸乙烯酯共聚物、黏著性賦予劑及蠟以特定範圍量混合而成者中摻合有特定量之滑石之熱熔接著劑」作為用以形成熱熔接著劑層之熱熔接著劑。因此,即便於為了降低蓋材於有機溶劑中之溶出量,而選擇分子量更高者作為構成熱熔接著劑之材料之情形時,亦可不使密封性降低。因此,作為食品容器或醫藥品容器之蓋材是有用的。 In the cover material of the present invention in which the substrate layer, the adhesion-promoting coating layer, the stress relaxation layer, and the hot-melt adhesive layer are sequentially laminated, the sealing property and the amount of elution in the organic solvent are considered, and "ethylene" is used. A vinyl acetate copolymer, an adhesion imparting agent, and a hot-melt adhesive in which a wax is blended in a specific amount by a specific amount of talc is used as a hot-melt adhesive for forming a hot-melt adhesive layer. Therefore, even when a material having a higher molecular weight is selected as a material constituting the hot-melt adhesive in order to lower the elution amount of the cover material in the organic solvent, the sealing property may not be lowered. Therefore, it is useful as a cover material for a food container or a pharmaceutical container.

1‧‧‧基材層 1‧‧‧ substrate layer

2‧‧‧增粘塗佈層 2‧‧‧Adhesive coating layer

3‧‧‧應力緩和層 3‧‧‧stress relaxation layer

4‧‧‧熱熔接著劑層 4‧‧‧Hot melt adhesive layer

10‧‧‧蓋材 10‧‧‧Cleaning

Claims (14)

一種蓋材,其係至少具有基材層、增粘塗佈(anchor coat)層、應力緩和層及熱熔接著劑層,該等依此順序積層而成者,構成熱熔接著劑層之熱熔接著劑含有乙烯-乙酸乙烯酯共聚物20~50質量%作為成分(A),進一步,相對於成分(A)100質量份,含有以下質量份之下述成分(B)~(D):(A)乙烯-乙酸乙烯酯共聚物 100質量份;(B)黏著性賦予劑 8~80質量份;(C)蠟 85~230質量份;及(D)滑石 15~200質量份。 A cover material having at least a base material layer, an anchor coat layer, a stress relaxation layer, and a hot-melt adhesive layer, which are laminated in this order to form a heat of a hot melt adhesive layer The fluxing agent contains 20 to 50% by mass of the ethylene-vinyl acetate copolymer as the component (A), and further contains the following components (B) to (D) of the following parts by mass based on 100 parts by mass of the component (A): (A) 100 parts by mass of the ethylene-vinyl acetate copolymer; (B) 8 to 80 parts by mass of the adhesion imparting agent; (C) 85 to 230 parts by mass of the wax; and (D) 15 to 200 parts by mass of the talc. 如申請專利範圍第1項之蓋材,其中,成分(D)之滑石具有以下之特性(d1)~(d3):(d1)粒徑(D50) 0.1~50μm;(d2)視密度 0.05~0.7g/mL;及(d3)比表面積 1.5~100m2/g。 For example, the cover material of the first item of the patent scope, wherein the talc of the component (D) has the following characteristics (d1) to (d3): (d1) particle size (D50) 0.1 to 50 μm; (d2) apparent density 0.05~ 0.7 g/mL; and (d3) specific surface area of 1.5 to 100 m 2 /g. 如申請專利範圍第1或2項之蓋材,其中,成分(A)之乙烯-乙酸乙烯酯共聚物具有以下之特性(a1)~(a3):(a1)乙酸乙烯酯含量 14~41質量%;(a2)MFR值 5~400g/10min;及(a3)菲卡軟化點 25~75℃。 The cover material of claim 1 or 2, wherein the ethylene-vinyl acetate copolymer of the component (A) has the following characteristics (a1) to (a3): (a1) vinyl acetate content of 14 to 41 mass %; (a2) MFR value 5~400g/10min; and (a3) Ficam softening point 25~75 °C. 如申請專利範圍第1至3項中任一項之蓋材,其中,成分(B)之黏著性賦予劑具有以下之特性(b1): (b1)軟化點 80~150℃。 The cover material according to any one of claims 1 to 3, wherein the adhesive imparting agent of the component (B) has the following characteristics (b1): (b1) Softening point 80~150 °C. 如申請專利範圍第4項之蓋材,其中,成分(B)之黏著性賦予劑為松香系樹脂。 The cover material of the fourth aspect of the patent application, wherein the adhesive imparting agent of the component (B) is a rosin-based resin. 如申請專利範圍第1至5項中任一項之蓋材,其中,成分(C)之蠟具有以下之特性(c1):(c1)熔點 80~130℃。 The cover material according to any one of claims 1 to 5, wherein the wax of the component (C) has the following characteristics (c1): (c1) a melting point of 80 to 130 °C. 如申請專利範圍第1至6項中任一項之蓋材,其中,成分(C)之蠟為合成蠟。 The cover material according to any one of claims 1 to 6, wherein the wax of the component (C) is a synthetic wax. 如申請專利範圍第7項之蓋材,其中,合成蠟為費雪-闕布希(Fischer-Tropsch)蠟。 A cover material according to item 7 of the patent application, wherein the synthetic wax is a Fischer-Tropsch wax. 如申請專利範圍第1至8項中任一項之蓋材,其中,基材層之層厚為5~300μm,增粘塗佈層之層厚為0.1~6.0μm,應力緩和層之層厚為6~60μm,熱熔接著劑層之附著量為3~40g/m2The cover material according to any one of claims 1 to 8, wherein the substrate layer has a layer thickness of 5 to 300 μm, the adhesion-promoting layer has a layer thickness of 0.1 to 6.0 μm, and the stress relaxation layer has a layer thickness. It is 6 to 60 μm, and the adhesion amount of the hot-melt adhesive layer is 3 to 40 g/m 2 . 如申請專利範圍第1至9項中任一項之蓋材,其中,基材層為金屬或合金薄膜或者樹脂膜,增粘塗佈層為改質聚烯烴系增粘塗佈劑層、聚酯系增粘塗佈劑層或聚胺酯(polyurethane)系增粘塗佈劑層,應力緩和層為聚烯烴系或聚酯系熱塑性樹脂層。 The cover material according to any one of claims 1 to 9, wherein the base material layer is a metal or alloy film or a resin film, and the adhesion-promoting coating layer is a modified polyolefin-based adhesion-promoting coating agent layer. The ester-based thickening coating agent layer or the polyurethane-based thickening coating agent layer, and the stress relieving layer is a polyolefin-based or polyester-based thermoplastic resin layer. 如申請專利範圍第9或10項之蓋材,其中,基材層為5~50μm厚之鋁箔。 The cover material of claim 9 or 10, wherein the base material layer is an aluminum foil having a thickness of 5 to 50 μm. 如申請專利範圍第9或10項之蓋材,其中,應力緩和層為10~50μm厚之無延伸聚乙烯層。 The cover material of claim 9 or 10, wherein the stress relieving layer is a non-extended polyethylene layer of 10 to 50 μm thick. 如申請專利範圍第1至12項中任一項之蓋材,其中,於基材層之外表面形成有印刷層。 The cover material according to any one of claims 1 to 12, wherein a printed layer is formed on the outer surface of the substrate layer. 一種容器裝之食品,由具有形成有凸緣部之開口部的食品容器、收容於其中之液狀或固體食品、及與形成於該食品容器之開口部之凸緣部接著的蓋材構成,其特徵在於:該蓋材為申請專利範圍第1至13項中任一項之蓋材,該蓋材自熱熔接著劑層側接著於開口部之凸緣部。 A container-packed food comprising a food container having an opening formed with a flange portion, a liquid or solid food contained therein, and a lid member attached to a flange portion formed in an opening of the food container. The cover material is a cover material according to any one of claims 1 to 13, which is attached to the flange portion of the opening from the side of the hot melt adhesive layer.
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