TW201726529A - Electronic component conveying device and electronic component inspection device can easily, quickly and properly carry out setting of a second reference height - Google Patents

Electronic component conveying device and electronic component inspection device can easily, quickly and properly carry out setting of a second reference height Download PDF

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Publication number
TW201726529A
TW201726529A TW106102837A TW106102837A TW201726529A TW 201726529 A TW201726529 A TW 201726529A TW 106102837 A TW106102837 A TW 106102837A TW 106102837 A TW106102837 A TW 106102837A TW 201726529 A TW201726529 A TW 201726529A
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TW
Taiwan
Prior art keywords
electronic component
height
tray
unit
inspection
Prior art date
Application number
TW106102837A
Other languages
Chinese (zh)
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TWI625294B (en
Inventor
Hiroyuki Shimizu
Naohisa Maeda
Satoshi Nakamura
Original Assignee
Seiko Epson Corp
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Publication date
Priority to JP2016014065A priority Critical patent/JP2017133946A/en
Priority to JP2016033929A priority patent/JP6668816B2/en
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of TW201726529A publication Critical patent/TW201726529A/en
Application granted granted Critical
Publication of TWI625294B publication Critical patent/TWI625294B/en

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Abstract

An object of the invention is to provide an electronic component conveying device and electronic component inspection device capable of easily and quickly setting an appropriate adsorption confirmation height. An electronic component conveying device of the invention is characterized by comprising: a negative pressure generating portion that generates a negative pressure; a holding portion operable to hold the electronic component by the actuation of the negative pressure generating portion; a flow path disposed between the negative pressure generating portion and the holding portion and allowing fluid to pass therethrough; a carrying portion for carrying the electronic component; and a detection portion that detects a pressure in the flow path. The holding portion is moved to a first reference height relative to the carrying portion, and the detection portion detects the pressure. The holding portion is closer to or away from the carrying portion according to the detection result of the detection portion, and a specific height of the holding portion relative to the carrying portion is set as a second reference height before the pressure detected by the detection portion occurs change.

Description

電子零件搬送裝置及電子零件檢查裝置Electronic component conveying device and electronic component inspection device

本發明係關於一種電子零件搬送裝置及電子零件檢查裝置。The present invention relates to an electronic component conveying device and an electronic component inspection device.

先前以來,例如已知有一種檢查IC(Integrated Circuit,積體電路)器件(半導體元件)等電子零件之電性特性之電子零件檢查裝置。 例如,於專利文獻1所示之電子零件檢查裝置中,組裝有用以將IC器件搬送至檢查部之保持部之電子零件搬送裝置。於檢查IC器件時,藉由電子零件搬送裝置之檢查用器件搬送頭將IC器件配置於保持部,且使設置於保持部之複數個探針銷與IC器件之各端子接觸。檢查用器件搬送頭具備具有藉由吸附而固持IC器件之吸附噴嘴之手單元。 如此之電子零件搬送裝置具有雙器件檢測(器件殘留檢測)功能。雙器件檢測係核對本應自保持部回收之IC器件是否殘留於保持部之功能。由於若於保持部殘留有IC器件,則該殘留之IC器件之檢查結果成為其後之所有IC器件之檢查結果,故藉由進行上述雙器件檢測而可防止此種弊端。 於雙器件檢測中,例如,使檢查用器件搬送頭之手單元之吸附噴嘴下降至檢查部之保持部,以該吸附噴嘴進行吸附動作,且以壓力感測器檢測連通於上述吸附噴嘴之流路內之壓力,並根據該檢測結果而判斷是否於保持部殘留有IC器件。於IC器件殘留於保持部之情形時,藉由吸附噴嘴吸附IC器件,故藉由壓力感測器檢測之壓力成為較小之值。又,於IC器件未殘留於保持部之情形時,不藉由吸附噴嘴吸附IC器件,故藉由壓力感測器檢測之壓力成為較大之值。又,將該雙器件檢測中之手單元之吸附噴嘴與保持部之底部之距離稱為「吸附確認高度」。而且,設定上述吸附確認高度之作業係使用者手動進行。 又,例如、專利文獻2、專利文獻3所示之電子零件檢查裝置係加熱電子零件而進行對該電子零件之檢查者。於專利文獻2記載之電子零件檢查裝置中,電子零件係逐個收納於測試托盤之凹部,連同該測試托盤一起加熱。藉由該加熱而測試托盤膨脹,從而該測試托盤之凹部(電子零件)之位置變化。因此,於欲利用手臂固持而提起測試托盤上之電子零件時,係於藉由運算求出凹部之位置變化量之修正值之後進行固持動作。又,於專利文獻3記載之電子零件檢查裝置中,亦構成為可使用手之噴嘴(吸附墊)固持電子零件。 [先前技術文獻] [專利文獻] [專利文獻1]日本專利特開2000-266810號公報 [專利文獻2]日本專利特開平08-194032號公報 [專利文獻3]日本專利特開平10-156639號公報For example, an electronic component inspection apparatus for inspecting electrical characteristics of an electronic component such as an IC (Integrated Circuit) device (semiconductor component) has been known. For example, in the electronic component inspection device disclosed in Patent Document 1, an electronic component conveying device that transports the IC device to the holding portion of the inspection portion is assembled. When the IC device is inspected, the IC device is placed in the holding portion by the inspection device transfer head of the electronic component transfer device, and the plurality of probe pins provided in the holding portion are brought into contact with the respective terminals of the IC device. The inspection device transfer head is provided with a hand unit having an adsorption nozzle for holding an IC device by adsorption. Such an electronic component transfer device has a dual device detection (device residue detection) function. The dual device detection system checks whether the IC device that should be recovered from the holding portion remains in the holding portion. If the IC device remains in the holding portion, the inspection result of the remaining IC device becomes the inspection result of all the subsequent IC devices, and thus the above-described dual device detection can prevent such a drawback. In the dual device detection, for example, the adsorption nozzle of the hand unit of the inspection device transport head is lowered to the holding portion of the inspection unit, the adsorption operation is performed by the adsorption nozzle, and the flow connected to the adsorption nozzle is detected by the pressure sensor. The pressure in the road is judged based on the detection result whether or not the IC device remains in the holding portion. When the IC device remains in the holding portion, the IC device is adsorbed by the adsorption nozzle, so that the pressure detected by the pressure sensor becomes a small value. Further, when the IC device does not remain in the holding portion, the IC device is not adsorbed by the adsorption nozzle, so that the pressure detected by the pressure sensor becomes a large value. Further, the distance between the adsorption nozzle of the hand unit in the two-device detection and the bottom of the holding portion is referred to as "adsorption confirmation height". Further, the user who sets the above-described adsorption confirmation height is manually operated. Further, for example, the electronic component inspection apparatuses disclosed in Patent Document 2 and Patent Document 3 heat the electronic components and perform inspection of the electronic components. In the electronic component inspection device described in Patent Document 2, the electronic components are housed in the recesses of the test tray one by one, and are heated together with the test tray. The tray is inflated by the heating, so that the position of the recess (electronic part) of the test tray changes. Therefore, when the electronic component on the test tray is to be lifted by the arm holding, the correction value of the positional change amount of the concave portion is calculated by calculation, and then the holding operation is performed. Further, in the electronic component inspection device described in Patent Document 3, the electronic component can be held by the nozzle (adsorption pad) of the hand. [Prior Art Document] [Patent Document 1] Japanese Patent Laid-Open Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. Bulletin

[發明所欲解決之問題] 於專利文獻1所示般之先前之電子零件檢查裝置中,因使用者手動進行設定雙器件檢測中之吸附確認高度之作業,故於該作業耗費精力及時間,又,難以設定適當之值作為吸附確認高度。 若吸附確認高度之設定值過高,則即使於IC器件殘留於檢查部之保持部之情形時,吸附噴嘴亦無法吸附該IC器件,而有無法檢測上述殘留之IC器件之虞。 又,若吸附確認高度之設定值過低,則即使於IC器件未殘留於檢查部之保持部之情形時,吸附噴嘴亦吸附保持部之底部,而判斷為殘留有IC器件。 又,於專利文獻2記載之電子零件檢查裝置中,即使藉由運算求出上述修正值,例如根據測試托盤之凹部之大小等,其運算精度有極限,從而亦有無法進行高精度之固持動作之問題。又,於專利文獻3記載之電子零件檢查裝置中,於手之噴嘴之剛性較低之情形時,噴嘴模仿托盤之貫通孔進入而未成為正確之位置,產生誤差。 [解決問題之技術手段] 本發明係為解決上述課題之至少一部分而完成者,可作為以下者實現。 [應用例1]本應用例之電子零件搬送裝置之特徵在於具備:負壓產生部,其產生負壓;固持部,其可藉由上述負壓產生部之作動而固持電子零件;流路,其配置於上述負壓產生部與上述固持部之間,且可通過流體;載置部,其載置上述電子零件;及檢測部,其檢測上述流路內之壓力;且使上述固持部相對於上述載置部移動至第1基準高度,藉由上述檢測部檢測上述壓力,並根據上述檢測部之檢測結果而使上述固持部相對於上述載置部靠近或離開,將藉由上述檢測部檢測之上述壓力發生變化之前之上述固持部相對於上述載置部之特定高度設為第2基準高度。 藉此,可容易、迅速且適當地進行第2基準高度之設定。 [應用例2]於本應用例之電子零件搬送裝置中,較佳為,使上述固持部相對於上述載置部階段性地靠近或離開。 藉此,可更適當地進行第2基準高度之設定。 [應用例3]於本應用例之電子零件搬送裝置中,較佳為,使上述固持部相對於上述載置部靠近或離開之距離係於每1階段為0.01 mm以上且1 mm以下。 藉此,可更迅速且適當地進行第2基準高度之設定。 [應用例4]於本應用例之電子零件搬送裝置中,較佳為,每當使上述固持部相對於上述載置部階段性地靠近或離開時藉由上述檢測部檢測上述壓力。 藉此,可更適當地進行第2基準高度之設定。 [應用例5]於本應用例之電子零件搬送裝置中,較佳為,將藉由上述檢測部檢測之上述壓力發生變化時之上述固持部相對於上述載置部之高度設為上述第2基準高度。 藉此,可更適當地進行第2基準高度之設定。 [應用例6]於本應用例之電子零件搬送裝置中,較佳為,上述第1基準高度係與上述載置部之底部相同之高度。 藉此,可更適當地進行第2基準高度之設定。 [應用例7]於本應用例之電子零件搬送裝置中,較佳為,於藉由上述檢測部檢測之上述壓力發生變化之情形時,將前一次之檢測上述壓力時之上述固持部相對於上述載置部之高度設為上述第2基準高度。 藉此,可更適當地進行第2基準高度之設定。 [應用例8]於本應用例之電子零件搬送裝置中,較佳為,上述第1基準高度係自上述載置部之底部離開特定距離之位置之高度。 藉此,可更適當地進行第2基準高度之設定。 [應用例9]於本應用例之電子零件搬送裝置中,較佳為,上述特定距離係1 mm以上且10 mm以下。 若上述特定距離過大則耗費時間,又,若過小則無法進行第2基準高度之設定,故藉此可更迅速且適當地進行第2基準高度之設定。 [應用例10]於本應用例之電子零件搬送裝置中,較佳為,上述第2基準高度之資訊係用於檢測於上述載置部有無上述電子零件。 藉此,可適當地進行載置部之電子零件之有無之檢測。 [應用例11]於本應用例之電子零件搬送裝置中,較佳為,上述載置部係於上述電子零件之檢查中保持上述電子零件之保持部。 藉此,於電子零件之檢查中,可適當地進行檢測於保持該電子零件之保持部有無上述電子零件。 [應用例12]於本應用例之電子零件搬送裝置中,較佳包含顯示部,其顯示上述第2基準高度。 藉此,使用者可容易地掌握所設定之第2基準高度。 [應用例13]本應用例之電子零件檢查裝置之特徵在於具備:負壓產生部,其產生負壓;固持部,其可藉由上述負壓產生部之作動而固持電子零件;流路,其配置於上述負壓產生部與上述固持部之間,且可通過流體;載置部,其載置上述電子零件;檢測部,其檢測上述流路內之壓力;及檢查部,其檢查上述電子零件;且使上述固持部相對於上述載置部移動至第1基準高度,藉由上述檢測部檢測上述壓力,且根據上述檢測部之檢測結果而使上述固持部相對於上述載置部靠近或離開,將藉由上述檢測部檢測之上述壓力發生變化之前之上述固持部相對於上述載置部之特定高度設為第2基準高度。 藉此,可容易、迅速且適當地進行第2基準高度之設定。 [應用例14]本應用例之電子零件搬送裝置係可搭載具有可收納電子零件之凹部之載置部者,其特徵在於具備:噴出部,其可於第1位置與第2位置之間移動,且可噴出氣體;及流量檢測部,其可檢測自上述噴出部噴出之上述氣體之流量;且於上述凹部位於上述第1位置與上述第2位置之間之情形時,當上述噴出部於上述第1位置與上述第2位置之間移動時,於上述凹部檢測上述流量變化之流量變化部。 藉此,可根據流量變化部而檢測俯視下之凹部之中心位置。例如,於欲以固持部固持收納於該凹部之電子零件時,可使該固持部面臨上述檢測出之中心位置。而且,藉由就此產生對電子零件之固持力,可高精度地(以較高精度)進行固持動作。又,於本應用例中,由於可不接觸而辨識凹部之位置,故即使於固持部之剛性較低之情形時,亦可防止產生模仿凹部側而進入該凹部般之誤差。 [應用例15]於上述應用例14記載之電子零件搬送裝置中,較佳為,上述噴出部可吸附而搬送上述電子零件。 藉此,可省略與噴出部不同地另行重新設置用以吸附而搬送電子零件之構成,因此,可使電子零件搬送裝置之構成為簡單者。 [應用例16]於上述應用例14或15記載之電子零件搬送裝置中,較佳為,將上述載置部固定。 藉此,例如於構成為載置部加熱電子零件而可調整其溫度之情形時,可穩定地進行對該電子零件之溫度調整。 [應用例17]於上述應用例14或15記載之電子零件搬送裝置中,較佳為,將上述載置部可移動地支持。 藉此,載置部可將電子零件自特定位置穩定地搬送至其他特定位置。 [應用例18]於上述應用例14或15記載之電子零件搬送裝置中,較佳為,上述載置部係於將上述電子零件裝填入該電子零件搬送裝置時使用者。 藉此,例如可將未檢查狀態之複數個電子零件連同載置部一併裝填入電子零件搬送裝置,因此,操作者(使用者)可容易地進行該裝填作業。 [應用例19]於上述應用例14至18中任一例之電子零件搬送裝置中較佳為具備中心位置檢測部,其根據上述流量變化部而檢測上述凹部之中心位置。 藉此,例如於欲藉由吸附噴嘴而吸附收納於凹部之電子零件時,可朝向電子零件之與上述中心位置對應之部分按壓吸附噴嘴。而且,藉由以該按壓狀態產生吸附噴嘴之吸引力,可高精度地(以較高精度)進行對電子零件之吸附動作。 [應用例20]於上述應用例19記載之電子零件搬送裝置中,較佳為於上述載置部,於一方向上至少配置有3個上述凹部,且上述中心位置檢測部可檢測位於最離開之兩側之2個上述凹部之間之上述凹部之中心位置。 藉此,於檢測載置部具有之所有凹部之中心位置時,例如與逐個檢測各凹部之中心位置相比,可迅速地進行該檢測處理、即縮短該檢測處理耗費之時間。 [應用例21]於上述應用例14至20中任一例之電子零件搬送裝置中,較佳為,上述噴出部亦可於與連結上述第1位置與上述第2位置之線段交叉之線段之方向上移動。 藉此,與僅沿連結第1位置與第2位置之線段移動而進行凹部之中心位置之檢測之情形相比,可高精度地(以更高精度)進行該中心位置之檢測。 [應用例22]於上述應用例21記載之電子零件搬送裝置中,較佳為,上述噴出部可沿上述線段往復移動。 藉此,與僅於去路進行凹部之中心位置之檢測之情形相比,可高精度地進行該中心位置之檢測。 [應用例23]於上述應用例14至22中任一例之電子零件搬送裝置中,較佳為,可根據上述流量之變化而檢測上述凹部之高度。 藉此,於將收納於載置部之凹部之電子零件例如藉由吸附而固持之情形時,可高精度地(以較高精度)進行該吸附。 [應用例24]於上述應用例14至23中任一例之電子零件搬送裝置中,較佳為,上述電子零件呈1邊為5 mm以下之矩形。 例如、於以固持部固持收納於凹部之呈1邊為5 mm以下之矩形之電子零件時,其固持動作顯著受到熱之影響。然而,藉由根據流量變化部來檢測俯視下之凹部之中心位置,可使該固持部面臨上述檢測之中心位置。而且,藉由就此產生對電子零件之固持力,可高精度地(以較高精度)進行固持動作。 [應用例25]本應用例之電子零件檢查裝置係可搭載具有可收納電子零件之凹部之載置部者,其特徵在於具備:噴出部,其可於第1位置與第2位置之間移動,且可噴出氣體;流量檢測部,其可檢測自上述噴出部噴出之上述氣體之流量;及檢查部,其檢查上述電子零件;且於上述凹部位於上述第1位置與上述第2位置之間之情形時,當上述噴出部於上述第1位置與上述第2位置之間移動時,於上述凹部檢測上述流量變化之流量變化部。 藉此,可根據流量變化部而檢測俯視下之凹部之中心位置。例如,於欲以固持部固持收納於該凹部之電子零件時,可使該固持部面臨上述檢測之中心位置。而且,藉由就此產生對電子零件之固持力,可高精度地(以較高精度)進行固持動作。[Problems to be Solved by the Invention] In the prior electronic component inspection apparatus as shown in Patent Document 1, since the user manually performs the operation of setting the adsorption confirmation height in the dual device detection, it takes time and effort for the operation. Further, it is difficult to set an appropriate value as the adsorption confirmation height. When the set value of the adsorption confirmation height is too high, even if the IC device remains in the holding portion of the inspection portion, the adsorption nozzle cannot adsorb the IC device, and there is a possibility that the residual IC device cannot be detected. In addition, when the setting value of the adsorption confirmation height is too low, even if the IC device does not remain in the holding portion of the inspection portion, the adsorption nozzle sucks the bottom portion of the holding portion, and it is determined that the IC device remains. Further, in the electronic component inspection device described in Patent Document 2, even if the correction value is obtained by calculation, for example, depending on the size of the concave portion of the test tray, the calculation accuracy is limited, and the high-precision holding operation cannot be performed. The problem. Further, in the electronic component inspection device described in Patent Document 3, when the rigidity of the nozzle of the hand is low, the nozzle mimics the through hole of the tray and does not become a correct position, resulting in an error. [Technical means for solving the problem] The present invention has been made to solve at least a part of the above problems, and can be realized as follows. [Application Example 1] The electronic component conveying apparatus according to the application example of the present invention includes: a negative pressure generating portion that generates a negative pressure; and a holding portion that holds the electronic component by the operation of the negative pressure generating portion; The filter is disposed between the negative pressure generating portion and the holding portion, and is configured to pass the fluid; the mounting portion mounts the electronic component; and the detecting portion detects a pressure in the flow path; and the holding portion is opposite to the holding portion The detecting unit moves to the first reference height, and the detecting unit detects the pressure, and the holding unit is moved closer to or away from the placing unit based on the detection result of the detecting unit, and the detecting unit is used by the detecting unit. The specific height of the holding portion with respect to the placing portion before the change in the detected pressure is set to be the second reference height. Thereby, the setting of the second reference height can be performed easily, quickly, and appropriately. [Application Example 2] In the electronic component conveying apparatus of the application example, it is preferable that the holding portion is brought closer to or away from the placing portion in a stepwise manner. Thereby, the setting of the second reference height can be performed more appropriately. [Application Example 3] In the electronic component conveying apparatus of the application example, it is preferable that the distance between the holding portion and the mounting portion is 0.01 mm or more and 1 mm or less per step. Thereby, the setting of the second reference height can be performed more quickly and appropriately. [Application Example 4] In the electronic component conveying apparatus of the application example, it is preferable that the pressure is detected by the detecting unit every time the holding portion is brought closer to or away from the mounting portion. Thereby, the setting of the second reference height can be performed more appropriately. [Application Example 5] In the electronic component conveying apparatus of the application example, it is preferable that the height of the holding portion with respect to the mounting portion when the pressure detected by the detecting portion is changed is the second Base height. Thereby, the setting of the second reference height can be performed more appropriately. [Application Example 6] In the electronic component transport apparatus of the application example, it is preferable that the first reference height is the same height as the bottom of the mounting portion. Thereby, the setting of the second reference height can be performed more appropriately. [Application Example 7] In the electronic component conveying apparatus of the application example, preferably, when the pressure detected by the detecting unit changes, the holding portion when the pressure is detected the previous time is relative to The height of the mounting portion is set to the second reference height. Thereby, the setting of the second reference height can be performed more appropriately. [Application Example 8] In the electronic component transport apparatus of the application example, it is preferable that the first reference height is a height from a position at a predetermined distance from a bottom portion of the mounting portion. Thereby, the setting of the second reference height can be performed more appropriately. [Application Example 9] In the electronic component conveying apparatus of the application example, it is preferable that the specific distance is 1 mm or more and 10 mm or less. If the specific distance is too large, it takes time, and if it is too small, the second reference height cannot be set. Therefore, the second reference height can be set more quickly and appropriately. [Application Example 10] In the electronic component conveying apparatus of the application example, it is preferable that the information of the second reference height is used to detect whether or not the electronic component is present in the mounting portion. Thereby, the presence or absence of the detection of the electronic component of the mounting part can be performed suitably. [Application Example 11] In the electronic component conveying apparatus of the application example, it is preferable that the mounting portion holds the holding portion of the electronic component during inspection of the electronic component. Thereby, in the inspection of the electronic component, it is possible to appropriately detect whether or not the electronic component is present in the holding portion holding the electronic component. [Application Example 12] The electronic component transport apparatus according to the application example preferably includes a display unit that displays the second reference height. Thereby, the user can easily grasp the set second reference height. [Application Example 13] The electronic component inspection apparatus according to the application example of the present invention includes: a negative pressure generating portion that generates a negative pressure; and a holding portion that holds the electronic component by the operation of the negative pressure generating portion; The filter is disposed between the negative pressure generating portion and the holding portion, and is configured to pass the fluid; the mounting portion mounts the electronic component; the detecting portion detects a pressure in the flow path; and the inspection portion checks the above And the electronic component moves to the first reference height with respect to the mounting portion, the detecting portion detects the pressure, and the holding portion approaches the mounting portion based on a detection result of the detecting portion Alternatively, the specific height of the holding portion before the pressure change detected by the detecting unit is set to a second reference height with respect to the mounting portion. Thereby, the setting of the second reference height can be performed easily, quickly, and appropriately. [Application Example 14] The electronic component transport apparatus according to the application example is characterized in that the mounting portion having the concave portion for accommodating the electronic component is mounted, and the discharge portion is provided to be movable between the first position and the second position. And a flow rate detecting unit that detects a flow rate of the gas ejected from the ejecting unit; and when the concave portion is located between the first position and the second position, when the ejecting unit is When moving between the first position and the second position, the flow rate changing unit that detects the flow rate change is detected in the concave portion. Thereby, the center position of the concave portion in a plan view can be detected based on the flow rate changing portion. For example, when the electronic component housed in the recessed portion is to be held by the holding portion, the holding portion can be faced to the detected center position. Further, by this, the holding force against the electronic component is generated, and the holding operation can be performed with high precision (with high precision). Further, in this application example, since the position of the concave portion can be recognized without contact, even when the rigidity of the holding portion is low, it is possible to prevent the occurrence of an error that is similar to the concave portion and enter the concave portion. [Application Example 15] In the electronic component conveying device according to the application example 14, the discharge unit is configured to adsorb and transport the electronic component. Thereby, it is possible to omit the configuration in which the electronic component is separately adsorbed and transported separately from the ejecting portion. Therefore, the configuration of the electronic component conveying device can be simplified. [Application Example 16] In the electronic component conveying device according to the application example 14 or 15, the mounting portion is preferably fixed. Thereby, for example, when the electronic component is heated by the mounting portion and the temperature can be adjusted, the temperature adjustment of the electronic component can be stably performed. [Application Example 17] In the electronic component conveying device according to the application example 14 or 15, it is preferable that the mounting portion is movably supported. Thereby, the placing unit can stably transport the electronic component from a specific position to another specific position. In the electronic component conveying apparatus according to the application example 14 or 15, the mounting unit is preferably a user when the electronic component is loaded into the electronic component conveying device. Thereby, for example, a plurality of electronic components in an uninspected state can be loaded together with the mounting portion into the electronic component conveying device, so that the operator (user) can easily perform the loading operation. In the electronic component conveying apparatus according to any one of the application examples 14 to 18, it is preferable that the electronic component conveying device includes a center position detecting unit that detects a center position of the concave portion based on the flow rate changing unit. Thereby, for example, when the electronic component housed in the concave portion is to be adsorbed by the adsorption nozzle, the adsorption nozzle can be pressed toward the portion of the electronic component corresponding to the center position. Further, by generating the suction force of the adsorption nozzle in the pressed state, the adsorption operation of the electronic component can be performed with high precision (high precision). In the electronic component conveying device according to the application example 19, preferably, the mounting portion has at least three recessed portions arranged in one direction, and the center position detecting portion detects that the center position detecting portion is located at the most The center position of the above-mentioned recess between the two recesses on both sides. Thereby, when detecting the center position of all the concave portions of the placing portion, for example, the detection processing, that is, the time taken to shorten the detection processing, can be performed more quickly than detecting the center position of each concave portion one by one. In the electronic component conveying apparatus according to any one of the application examples 14 to 20, preferably, the discharge unit may be in a direction of a line segment intersecting a line segment connecting the first position and the second position. Move on. Thereby, the detection of the center position can be performed with high precision (with higher precision) than when the center position of the concave portion is detected only by moving along the line segment connecting the first position and the second position. [Application Example 22] In the electronic component conveying device according to the application example 21, preferably, the discharge portion is reciprocally movable along the line segment. Thereby, the detection of the center position can be performed with high precision compared to the case where the detection of the center position of the concave portion is performed only in the outward path. [Application Example 23] In the electronic component conveying apparatus according to any one of the application examples 14 to 22, preferably, the height of the concave portion can be detected based on a change in the flow rate. Therefore, when the electronic component housed in the concave portion of the mounting portion is held by adsorption, for example, the adsorption can be performed with high precision (with high precision). [Application Example 24] In the electronic component conveying apparatus according to any one of the application examples 14 to 23, preferably, the electronic component has a rectangular shape with one side of 5 mm or less. For example, when the electronic component housed in the concave portion and having a rectangular shape of 5 mm or less on one side is held by the holding portion, the holding operation is remarkably affected by heat. However, by detecting the center position of the concave portion in a plan view in accordance with the flow rate changing portion, the holding portion can be faced to the center position of the above detection. Further, by this, the holding force against the electronic component is generated, and the holding operation can be performed with high precision (with high precision). [Application Example 25] The electronic component inspection apparatus according to the application example is characterized in that the mounting portion having the recess capable of accommodating the electronic component is mounted, and the discharge portion is provided to be movable between the first position and the second position. And a gas flow detecting unit that detects a flow rate of the gas ejected from the ejecting unit; and an inspection unit that inspects the electronic component; and the concave portion is located between the first position and the second position In the case where the discharge portion moves between the first position and the second position, the flow rate changing portion that changes the flow rate is detected in the concave portion. Thereby, the center position of the concave portion in a plan view can be detected based on the flow rate changing portion. For example, when the electronic component housed in the recessed portion is to be held by the holding portion, the holding portion can be faced to the center position of the detection. Further, by this, the holding force against the electronic component is generated, and the holding operation can be performed with high precision (with high precision).

以下,根據附圖所示之較佳實施形態對本發明之電子零件搬送裝置及電子零件檢查裝置進行詳細說明。 再者,為了便於說明,將圖中所示之相互正交之3軸設為X軸、Y軸及Z軸。又,包含X軸與Y軸之XY平面成為水平,Z軸成為鉛垂。又,將平行於X軸之方向亦稱為「X方向」,將平行於Y軸之方向亦稱為「Y方向」,將平行於Z軸之方向亦稱為「Z方向」。又,將各方向之箭頭所朝向之方向稱為「正」,將其相反方向稱為「負」。又,有時亦將圖中之Z方向正側稱為「上(或上方)」,將下側稱為「下(或下方)」。又,於本案說明書言及之「水平」並非限定於完全水平,只要不阻礙電子零件之搬送,則亦包含相對於水平略微(例如未達5°左右)傾斜之狀態。 以下之實施形態所示之檢查裝置(電子零件檢查裝置)係用以搬送例如作為BGA(Ball Grid Array:球狀柵格陣列)之IC器件等電子零件,並於該搬送過程中檢查、測試(以下簡稱為「檢查」)電性特性之裝置。再者,於以下,為了便於說明,針對使用IC器件作為上述電子零件之情形為代表進行說明,且將其設為「IC器件90」。 再者,檢查裝置(電子零件檢查裝置)係以配置有托盤供給區域A1、托盤去除區域A5之側(Y方向負側)成為正面側,且以其相反側、即配置有檢查區域A3之側(Y方向正側)作為背面側而使用。 <第1實施形態> 以下,參照圖1~圖6對第1實施形態進行說明。 如圖1、圖2所示,檢查裝置1分成托盤供給區域A1、器件供給區域(以下簡稱為「供給區域」)A2、檢查區域A3、器件回收區域(以下簡稱為「回收區域」)A4、及托盤去除區域A5。而且,IC器件90係自托盤供給區域A1至托盤去除區域A5依序經由上述各區域,且於中途之檢查區域A3進行檢查。如此,檢查裝置1具備於各區域搬送IC器件90之電子零件搬送裝置(處理機)、與於檢查區域A3內進行檢查之檢查部16。 又,電子零件搬送裝置具備具有記憶部810之控制部800、監視器(顯示部)300、信號燈400、揚聲器500、及操作面板700(參照圖1、圖3)。 托盤供給區域A1係被供給排列有未檢查狀態之複數個IC器件90之托盤(配置構件)100之供材部。於托盤供給區域A1中,可堆疊多個托盤100。 供給區域A2係將配置於來自托盤供給區域A1之托盤100上之複數個IC器件90分別供給至檢查區域A3之區域。再者,以跨及托盤供給區域A1與供給區域A2之方式,設置有逐片於水平方向上搬送托盤100之托盤搬送機構11A、11B。托盤搬送機構11A係可使托盤100連同載置於該托盤100上之IC器件90一併向Y方向之正側移動之移動部。藉此,可將IC器件90穩定地送入至供給區域A2。又,托盤搬送機構11B係可使空的托盤100向Y方向之負側、即自供給區域A2向托盤供給區域A1移動之移動部。 於供給區域A2設置有溫度調整部(均熱板(英語表述:soak plate,漢語表述(一例):均溫板))12、器件搬送頭13、及托盤搬送機構15。 溫度調整部12係可將複數個IC器件90一同冷卻或加熱者,有時被稱為「均熱板」。藉由該均熱板,可將利用檢查部16檢查前之IC器件90預先冷卻或加熱,而調整為適於該檢查之溫度。於圖2所示之構成中,溫度調整部12係於Y方向上配置並固定有2個。而且,藉由托盤搬送機構11A自托盤供給區域A1搬入(搬送來)之托盤100上之IC器件90被搬送至任一溫度調整部12。 器件搬送頭13被可於供給區域A2內於X方向及Y方向、進而亦可於Z方向上移動地支持。藉此,器件搬送頭13可承擔自托盤供給區域A1搬入之托盤100與溫度調整部12之間之IC器件90之搬送、及溫度調整部12與後述之器件供給部14之間之IC器件90之搬送。 器件搬送頭13具有複數個手單元131作為固持IC器件90之固持部(於圖2中,作為代表僅記載有1個符號「131」)。手單元131與後述之器件搬送頭17之手單元175同樣,具備吸附噴嘴,以該吸附噴嘴藉由吸附而固持IC器件90。 托盤搬送機構15係使已去除所有IC器件90之狀態之空的托盤100於供給區域A2內向X方向之正側搬送之機構。而且,於該搬送後,空的托盤100係藉由托盤搬送機構11B自供給區域A2返回至托盤供給區域A1。 檢查區域A3係檢查IC器件90之區域。於該檢查區域A3設置有檢查部16、與器件搬送頭17。又,亦設置有以跨及供給區域A2與檢查區域A3之方式移動之器件供給部14、及以跨及檢查區域A3與回收區域A4之方式移動之器件回收部18。 器件供給部14係可載置以溫度調整部12調整了溫度之IC器件90,且將該IC器件90搬送(移動)至檢查部16附近之載置部,有時被稱為「供給用梭板」。 器件供給部14具有於X方向及Y方向分別配置複數個、即配置成矩陣狀之凹部(凹穴)141(於圖2中,作為代表僅記載有1個符號「141」)。於各凹部141,逐個收納由檢查部16檢查前之IC器件90。 又,器件供給部14被可於供給區域A2與檢查區域A3之間沿X方向於水平方向上移動地支持。於圖2所示之構成中,器件供給部14於Y方向上配置有2個,且溫度調整部12上之IC器件90被搬送至任一器件供給部14。又,器件供給部14構成為可對經溫度調整之IC器件90維持其溫度調整狀態。藉此,可冷卻或加熱IC器件90,因此,可維持該IC器件90之溫度調整狀態。 檢查部16係載置(保持)IC器件90,並檢查、測試(進行電性檢查)該IC器件90之電性特性之單元,即為於檢查IC器件90時載置該IC器件90之構件。 於檢查部16之上表面,設置有複數個收容(載置)(保持)IC器件90之凹部即保持部161(參照圖2、圖4)(於圖2中,作為代表僅記載有1個符號「161」)。將IC器件90收容於保持部161,藉此,載置於檢查部16。 又,於檢查部16之對應於各保持部161之位置,分別設置有於將IC器件90保持於保持部161之狀態下與該IC器件90之端子電性連接之探針銷。而且,將IC器件90之端子與探針銷電性連接(接觸),而經由探針銷進行IC器件90之檢查。IC器件90之檢查係藉由連接於檢查部16之未圖示之測試器所具備之檢查控制部,根據該檢查控制部之記憶部所記憶之程式而進行。再者,於檢查部16中,可與溫度調整部12同樣,將IC器件90加熱或冷卻而將該IC器件90調整為適於檢查之溫度。 器件搬送頭17被可於檢查區域A3內於Y方向及Z方向上移動地支持。又,器件搬送頭17可將自供給區域A2搬入之器件供給部14上之IC器件90搬送並載置於檢查部16上,又,可將檢查部16上之IC器件90搬送並載置於器件回收部18上。又,於檢查IC器件90時,器件搬送頭17將IC器件90朝向檢查部16按壓,藉此,使IC器件90抵接於檢查部16。藉此,如上述般,將IC器件90之端子與檢查部16之探針銷電性連接。再者,器件搬送頭17亦可將IC器件90冷卻或加熱,而將該IC器件90調整為適於檢查之溫度。 該器件搬送頭17具有複數個手單元175作為固持IC器件90之固持部(參照圖2、圖4)(於圖2中,作為代表僅記載有1個符號「171」)。手單元175具備吸附噴嘴176,以該吸附噴嘴176藉由吸附而固持IC器件90。即,手單元175藉由以於吸附噴嘴176之前端部載置有IC器件90之狀態,驅動(作動)噴射器(負壓產生部)52吸引空氣(流體),使吸附噴嘴176之內腔為負壓狀態,而以吸附噴嘴176之前端部固持(吸附固持)IC器件90。又,藉由驅動噴射器52供給空氣而解除吸附噴嘴176之內腔之負壓狀態,放開以吸附噴嘴176固持之IC器件90。再者,包含吸附噴嘴176之內腔在內自噴射器52至吸附噴嘴176之前端部形成有可通過空氣(流體)之流路177。又,於器件搬送頭17設置有檢測該流路177內之壓力作為檢測值之壓力感測器(檢測部)51。再者,噴射器52係產生負壓之負壓產生部之一例,負壓產生部並不限定於此,可列舉例如泵等。 器件回收部18係載置以檢查部16之檢查結束後之IC器件90,且可將該IC器件90搬送(移動)至回收區域A4之載置部,有時被稱為「回收用梭板」。 器件回收部18具有於X方向及Y方向分別配置複數個、即配置成矩陣狀之凹部(凹穴)181(於圖2中,作為代表僅記載有1個符號「181」)。 又,器件回收部18被可於檢查區域A3與回收區域A4之間沿X方向於水平方向上移動地支持。又,於圖2所示之構成中,器件回收部18與器件供給部14同樣,於Y方向上配置有2個,且檢查部16上之IC器件90被搬送至任一器件回收部18並載置。該搬送係藉由器件搬送頭17而進行。 又,於檢查裝置1中,1個器件供給部14與1個器件回收部18係經由未圖示連結部而於X方向連結,構成向同方向一同移動之梭單元。再者,器件供給部14與器件回收部18亦可構成為可獨立移動。 回收區域A4係回收檢查結束後之複數個IC器件90之區域。於該回收區域A4,設置有回收用托盤19、器件搬送頭20、及托盤搬送機構21。又,於回收區域A4,亦準備有空的托盤100。 回收用托盤19係載置已利用檢查部16檢查之IC器件90之載置部,且以不於回收區域A4內移動之方式固定。藉此,即使於較多地配置有器件搬送頭20等各種可動部之回收區域A4,於回收用托盤19上,亦穩定地載置已檢查完畢之IC器件90。再者,於圖2所示之構成中,回收用托盤19沿X方向配置有3個。 又,空的托盤100亦沿X方向配置有3個。該空的托盤100亦成為載置已利用檢查部16檢查之IC器件90之載置部。而且,移動至回收區域A4之器件回收部18上之IC器件90被搬送並載置於回收用托盤19及空的托盤100中之任一者。藉此,將IC器件90依每一檢查結果分類並回收。 器件搬送頭20被可於回收區域A4內於X方向及Y方向、進而亦可於Z方向上移動地支持。藉此,器件搬送頭20可將IC器件90自器件回收部18搬送至回收用托盤19或空的托盤100。 器件搬送頭20具有複數個手單元201,作為固持IC器件90之固持部(於圖2中,作為代表僅記載有1個符號「201」)。手單元201與上述之器件搬送頭17之手單元175同樣,具備吸附噴嘴,而以該吸附噴嘴藉由吸附而固持IC器件90。 托盤搬送機構21係使自托盤去除區域A5搬入之空的托盤100於回收區域A4內於X方向上搬送之機構。而且,於該搬送後,空的托盤100配置於回收IC器件90之位置,即會成為上述3個空的托盤100中之任一個。 托盤去除區域A5係將排列有已檢查完畢狀態之複數個IC器件90之托盤100回收並去除之除材部。於托盤去除區域A5中,可堆疊多個托盤100。 又,以跨及回收區域A4與托盤去除區域A5之方式,設置有於Y方向上逐片搬送托盤100之托盤搬送機構22A、22B。托盤搬送機構22A係可使托盤100於Y方向上移動之移動部。藉此,可將已檢查完畢之IC器件90自回收區域A4搬送至托盤去除區域A5。又,托盤搬送機構22B係可使用以回收IC器件90之空的托盤100自托盤去除區域A5移動至回收區域A4之移動部。 控制部800控制例如托盤搬送機構11A、11B、溫度調整部12、器件搬送頭13、器件供給部14、托盤搬送機構15、檢查部16、器件搬送頭17、器件回收部18、器件搬送頭20、托盤搬送機構21、托盤搬送機構22A、22B、監視器300、信號燈400、揚聲器500、及噴射器52各部之驅動。 使用者(作業者)可經由監視器300設定或確認檢查裝置1之動作條件等。該監視器300具有例如以液晶畫面構成之顯示畫面(顯示部)301,且配置於檢查裝置1之正面側上部。如圖1所示,於托盤去除區域A5之圖中之X方向正側設置有滑鼠台600,該滑鼠台600載置對顯示於監視器300之畫面操作時所使用之滑鼠。 又,相對於監視器300而於圖1中之X方向正側下方配置有操作面板700。操作面板700係與監視器300不同地另行命令檢查裝置1進行所需動作。 又,信號燈400可藉由發光之顏色之組合而報知檢查裝置1之作動狀態等。信號燈400係配置於檢查裝置1之上部。再者,亦可於檢查裝置1內置有揚聲器500,即便藉由該揚聲器500亦可報知檢查裝置1之作動狀態等。 如圖2所示,檢查裝置1係藉由第1隔壁61而區隔(隔開)托盤供給區域A1與供給區域A2之間,藉由第2隔壁62而區隔供給區域A2與檢查區域A3之間,藉由第3隔壁63而區隔檢查區域A3與回收區域A4之間,藉由第4隔壁64而區隔回收區域A4與托盤去除區域A5之間。而且,供給區域A2與回收區域A4之間亦藉由第5隔壁65區隔。 於第2隔壁62形成有開口部621、開口部622。一器件供給部14可通過開口621。藉此,開口部621作為器件供給部14自供給區域A2進入檢查區域A3時之入口發揮功能,且作為器件供給部14自檢查區域A3出去到供給區域A2時之出口發揮功能。又,另一器件供給部14可通過開口622。藉此,開口部622亦作為器件供給部14自供給區域A2進入檢查區域A3時之入口發揮功能,且作為器件供給部14自檢查區域A3出去到供給區域A2時之出口發揮功能。 又,於第3隔壁63亦形成有開口部631、開口部632。一器件回收部18可通過開口631,另一器件回收部18可通過開口632。 檢查裝置1係最外裝被罩覆蓋,且該罩有例如前罩70、側罩71、側罩72、後罩73及頂罩74。 該檢查裝置1作為功能之一而具備雙器件檢測(器件殘留檢測)功能,即檢測於保持部161有無IC器件90之功能。關於雙器件檢測,因於先前技術已說明其一例,故省略其說明。 檢查裝置1構成為於進行雙器件檢測前,自動地設定該雙器件檢測中之器件搬送頭17之手單元175之吸附確認高度(第2基準高度)。上述吸附確認高度係器件搬送頭17之手單元175之吸附噴嘴176、與檢查部16之保持部161之底部(底面)162之距離(參照圖4)。 吸附確認高度之資訊係於雙器件檢測中使用。又,吸附確認高度於以未以保持部161保持IC器件90之狀態使噴射器52作動而以手單元175之噴嘴176進行吸引之情形時,較佳為吸附噴嘴176不吸附保持部161之底部162、且將吸附噴嘴176與保持部161之底部162之距離設定為最小之值。 該吸附確認高度之設定既可以器件搬送頭17之各手單元175與檢查部16之各保持部161之各者進行,又,亦可以一部分(例如、作為代表為1個)手單元175、與一部分(例如、作為代表而為1個)保持部161進行。於以下,作為一例,對以1個手單元175與1個各保持部161進行之情形進行說明。 首先,簡單地說明設定吸附確認高度時之檢查裝置1之動作。 首先,於以在保持部161上均無IC器件90等之狀態,使手單元175相對於保持部161移動至設定動作開始高度(第1基準高度)。上述設定動作開始高度係手單元175之吸附噴嘴176與保持部161之底部162之距離(吸附噴嘴176距底部162之高度)。如圖4所示,於本實施形態中,將設定動作開始高度設定為0(與保持部161之底部162相同之高度)。即,設為手單元175之吸附噴嘴176接觸於保持部161之底部162之狀態。 其次,使噴射器52作動而以手單元175之吸附噴嘴176吸引,並以壓力感測器51檢測流路177內之壓力作為檢測值。最初,吸附噴嘴176吸引保持部161之底部162,由此,流路177內之壓力減少,從而上述檢測值成為未達閾值。但,若吸附噴嘴176與保持部161之底部162越來越離開,則上述檢測值成為閾值以上。再者,即使吸附噴嘴176自保持部161之底部162略微離開,上述檢測值亦未達閾值。該狀態亦被稱為吸附噴嘴176吸附保持部161之底部162之狀態。 其次,如圖5所示,階段性地使手單元175相對於保持部161離開,以壓力感測器51檢測流路177內之壓力,且於以壓力感測器51檢測之壓力之檢測值變化為閾值以上之情形(壓力發生變化之情形)時,將此時之手單元175之吸附噴嘴176與保持部161之底部162之距離(吸附噴嘴176相對於底部162之高度)L設定為吸附確認高度。 此處,使手單元175相對於保持部161離開(於後述之第2實施形態中為靠近)之距離未特別限定,根可據諸條件而適當設定,但較佳為於每1階段為0.01 mm以上且1 mm以下,更佳為0.03 mm以上且0.5 mm以下,且最佳為0.05 mm以上且0.2 mm以下。 若上述距離小於上述下限值,則依其他條件而定,吸附確認高度之設定需要長時間。又,若上述距離大於上述上限值,則依其他條件而定,有無法將吸附確認高度設定為最優之值之虞。 其次,對吸附高度確認之設定動作之控制部800之控制動作進行說明。 如圖6所示,首先,使器件搬送頭17之手單元175移動至檢查部16之保持部161(步驟S101)(參照圖4)。 其次,使噴射器52作動,以手單元175之吸附噴嘴176開始吸引(步驟S102)。 其次,以壓力感測器51檢測流路177內之壓力(步驟S103)。 其次,判斷以壓力感測器51檢測之壓力之檢測值是否為閾值以上(步驟S104)。 此處,吸附噴嘴176吸附保持部161之底部162,由此,流路177內之壓力減少,壓力之檢測值成為未達閾值。將上述檢測值未達閾值稱為「感測器接通」。 於步驟S104中,於判斷為上述檢測值不為閾值以上(感測器接通)之情形(S104:否(NO)),使手單元175上升1階段(使手單元175相對於保持部161離開1階段)(步驟S105),並返回步驟S103,再次執行步驟S103以後之步驟。 於重複步驟S103~S105期間,吸附噴嘴176與保持部161之底部162之間之間隙增大,吸附噴嘴176變得無法吸附保持部161之底部162。由此,流路177內之壓力增大,而壓力之檢測值成為閾值以上。將上述檢測值為閾值以上稱為「感測器斷開」。 於步驟S104中,於判斷為上述檢測值為閾值以上(感測器斷開)之情形時(S104:是(YES)),將當前之手單元175之吸附噴嘴176與保持部161之底部162之距離登錄為吸附確認高度(步驟S106)。具體而言,將吸附確認高度記憶於記憶部810。以上,吸附確認高度之設定結束。 又,將所設定之吸附確認高度顯示於監視器300。藉此,使用者可容易地掌握該吸附確認高度。 如以上所說明般,根據檢查裝置1,可設定適當之值作為吸附確認高度。 又,因檢查裝置1自動地設定吸附確認高度,故可容易且迅速地進行該吸附確認高度之設定。 <第2實施形態> 以下,參照圖7~圖9對第2實施形態進行說明,但以與上述之實施形態之不同點為中心進行說明,且對相同之事項省略其說明。 首先,簡單地說明設定吸附確認高度時之檢查裝置1之動作。 首先,以在保持部161均無IC器件90等之狀態,使手單元175相對於保持部161移動至設定動作開始高度。如圖7所示,於本實施形態中,將設定動作開始高度設定為大於0(與保持部161之底部162相同之高度)之特定值、即自底部162離開特定距離之位置之高度。又,上述特定距離係以如下方式設定,即,於使噴射器52作動而以手單元175之吸附噴嘴176吸引,且以壓力感測器51檢測流路177內之壓力作為檢測值之情形時,其壓力之檢測值成為閾值以上。 此處,上述特定距離雖如上所述般,只要以壓力感測器51檢測之壓力之檢測值成為閾值以上則不特別限定,可根據諸條件適當設定,但較佳為1 mm以上且10 mm以下,更佳為2 mm以上且8 mm以下,且最佳為3 mm以上且7 mm以下。 若上述特定距離小於上述下限值,則根據其他條件,有一開始手單元175之吸附噴嘴176就吸附保持部161之底部162,而無法設定吸附確認高度之虞。又,若上述特定距離大於上述上限值,則根據其他條件,吸附確認高度之設定需要長時間。 其次,使噴射器52作動而以手單元175之吸附噴嘴176吸引,且以壓力感測器51檢測流路177內之壓力作為檢測值。最初,吸附噴嘴176未吸附保持部161之底部162,由此,上述檢測值為閾值以上。但,若吸附噴嘴176與保持部161之底部162越來越靠近,則上述檢測值成為未達閾值。 其次,如圖8所示,階段性地使手單元175相對於保持部161靠近,以壓力感測器51檢測流路177內之壓力作為檢測值,且於以壓力感測器51檢測之壓力之檢測值成為未達閾值之情形(壓力發生變化之情形)時,將前一次之壓力檢測時之手單元175之吸附噴嘴176與保持部161之底部162之距離(吸附噴嘴176之相對於底部162之高度)設定為吸附確認高度。 其次,對吸附高度確認之設定動作之控制部800之控制動作進行說明。 如圖9所示,首先,使器件搬送頭17之手單元175移動至檢查部16之保持部161之上空(步驟S201)(參照圖7)。 其次,使噴射器52作動,以手單元175之吸附噴嘴176開始吸引(步驟S202)。 其次,以壓力感測器51檢測流路177內之壓力(步驟S203)。 其次,判斷以壓力感測器51檢測之壓力之檢測值是否為閾值以上(步驟S204)。 於本實施形態之設定吸附確認高度時之檢查裝置1之動作中,最初,吸附噴嘴176不吸附保持部161之底部162。由此,壓力之檢測值為閾值以上。 於步驟S204中,於判斷為上述檢測值為閾值以上(感測器斷開)之情形(S204:是)時,使手單元175下降1階段(使手單元175相對於保持部161靠近1階段)(步驟S205),並返回步驟S203,再次執行步驟S203以後。 於重複步驟S203~S205期間,吸附噴嘴176與保持部161之底部162之間之間隙減少,吸附噴嘴176吸附保持部161之底部162。由此,流路177內之壓力減少,壓力之檢測值成為未達閾值。 於步驟S204中,於判斷為上述檢測值不為閾值以上(感測器接通)之情形時(S204:否),將較當前之手單元175之吸附噴嘴176與保持部161之底部162之距離短1階段量之距離、即前一次之以壓力感測器51檢測壓力時之吸附噴嘴176與保持部161之底部162之距離登錄為吸附確認高度(步驟S206)。具體而言,將吸附確認高度記憶於記憶部810。以上,吸附確認高度之設定結束。 又,將所設定之吸附確認高度顯示於監視器300。藉此,使用者可容易地掌握該吸附確認高度。 根據如以上般之第2實施形態,亦可發揮與上述之實施形態相同之效果。 <第3實施形態> 以下,參照圖10對第3實施形態進行說明,但以與上述之實施形態之不同點為中心進行說明,且對相同之事項省略其說明。 於第3實施形態之檢查裝置1中,將設定動作開始高度設定為大於0(與保持部161之底部162相同之高度)之特定值、即自底部162離開特定距離之位置之高度。 又,上述特定距離係設定為於使噴射器52作動而以手單元175之噴嘴176吸引,且以壓力感測器51檢測流路177內之壓力作為檢測值之情形時,該壓力之檢測值自閾值以上與未達閾值之一者向另一者變化時之距離的附近之值。即,將上述特定距離設定為成為「感測器接通」之距離與成為「感測器斷開」之距離之分界附近。 其次,對吸附高度確認之設定動作之控制部800之控制動作進行說明。 如圖10所示,首先,使器件搬送頭17之手單元175移動至檢查部16之保持部161之上空之特定高度(步驟S301)。 其次,使噴射器52作動,以手單元175之吸附噴嘴176開始吸引(步驟S302)。 其次,以壓力感測器51檢測流路177內之壓力(步驟S303)。 其次,判斷以壓力感測器51檢測之壓力之檢測值是否為閾值以上(步驟S304)。 根據該步驟S304之結果而決定手單元175(器件搬送頭17)之移動方向。 於上述檢測值不為閾值以上之情形時,將手單元175之移動方向設為手單元175自保持部161離開之方向。又,於上述檢測值為閾值以上之情形時,將手單元175之移動方向設為手單元175靠近保持部161之方向。 於步驟S304中,於判斷為上述檢測值不為閾值以上(感測器接通)之情形(S304:否)時,使手單元175上升1階段(使手單元175相對於保持部161離開1階段)(步驟S305),並以壓力感測器51檢測流路177內之壓力(步驟S306)。 其次,判斷以壓力感測器51檢測之壓力之檢測值是否為閾值以上(步驟S307)。 於步驟S307中,於判斷為上述檢測值不為閾值以上(感測器接通)之情形(S307:否)時,返回步驟S305,再次執行步驟S305以後之步驟。 於重複步驟S305~S307期間,吸附噴嘴176與保持部161之底部162之間之間隙增大,吸附噴嘴176變得無法吸附保持部161之底部162。由此,流路177內之壓力增大,上述檢測值成為閾值以上。 於步驟S307中,於判斷為上述檢測值為閾值以上(感測器斷開)之情形時(S307:是),將當前之手單元175之吸附噴嘴176與保持部161之底部162之距離登錄為吸附確認高度(步驟S308)。具體而言,將吸附確認高度記憶於記憶部810。 又,於步驟S304中,於判斷為上述檢測值為閾值以上(感測器斷開)之情形(S304:是)時,使手單元175下降1階段(使手單元175相對於保持部161靠近1階段)(步驟S309),並以壓力感測器51檢測流路177內之壓力(步驟S310)。 其次,判斷以壓力感測器51檢測之壓力之檢測值是否為閾值以上(步驟S311)。 於步驟S311中,於判斷為上述檢測值為閾值以上(感測器斷開)之情形(S311:是)時,返回步驟S309,再次執行步驟S309以後。 於重複步驟S309~S311期間,吸附噴嘴176與保持部161之底部162之間之間隙減少,吸附噴嘴176吸附保持部161之底部162。由此,流路177內之壓力減少,上述檢測值成為未達閾值。 於步驟S311中,於判斷為上述檢測值不為閾值以上(感測器接通)之情形時(S311:否),將較當前之手單元175之吸附噴嘴176與保持部161之底部162之距離短1階段量之距離、即前一次之以壓力感測器51檢測壓力時之吸附噴嘴176與保持部161之底部162之距離登錄為吸附確認高度(步驟S312)。具體而言,將吸附確認高度記憶於記憶部810。以上,吸附確認高度之設定結束。 又,將所設定之吸附確認高度顯示於監視器300。藉此,使用者可容易地掌握該吸附確認高度。 根據如以上般之第3實施形態,亦可發揮與上述之實施形態相同之效果。 <第4實施形態> 以下,參照圖11~圖24對本發明之電子零件搬送裝置及電子零件檢查裝置之第4實施形態進行說明。再者,對與上述實施形態相同之構成構件標註相同符號而說明。再者,於圖14、圖17中,省略IC器件90之記載。 圖11、圖12所示之電子零件檢查裝置1a內置有電子零件搬送裝置10。又,IC器件90於本實施形態中為於俯視下呈矩形(正方形)者。 又,電子零件檢查裝置1a(電子零件搬送裝置10)係預先搭載依IC器件90之每一種類而更換之被稱為所謂「變更套件」者而使用。於該更換套件中,有載置IC器件90之載置部,作為該載置部,有例如後述之溫度調整部12a、器件供給部14a等。 又,作為載置IC器件90之載置部,亦有與如上述般之更換套件不同而由使用者另行準備之板狀之托盤200。該托盤200亦搭載於電子零件檢查裝置1a(電子零件搬送裝置10)。該作為載置部之托盤200係例如於將電子零件即IC器件90裝填於電子零件檢查裝置1a(電子零件搬送裝置10)時使用者。藉此,可將未檢查狀態之複數個IC器件90連同托盤200一併裝填於後述之托盤供給區域A1,因此,操作者(使用者)可容易地進行該裝填作業。 電子零件檢查裝置1a分成托盤供給區域A1、器件供給區域(以下簡稱為「供給區域」)A2、檢查區域A3、器件回收區域(以下簡稱為「回收區域」)A4、及托盤去除區域A5,該等區域如後述般以各壁部分開。而且,IC器件90係自托盤供給區域A1至托盤去除區域A5沿箭頭α90 方向依序經由上述各區域,且於中途之檢查區域A3進行檢查。如此,電子零件檢查裝置1a成為具備於各區域搬送IC器件90之電子零件搬送裝置(處理機)10、於檢查區域A3內進行檢查之檢查部16a、及控制部800a者。又,此外,電子零件檢查裝置1a亦具備監視器300、信號燈400、及操作面板700。 托盤供給區域A1係被供給排列有未檢查狀態之複數個IC器件90之托盤200之供材部。於托盤供給區域A1中,可堆疊多個托盤200。 供給區域A2係將配置於來自托盤供給區域A1之托盤200上之複數個IC器件90分別供給至檢查區域A3之區域。再者,以跨及托盤供給區域A1與供給區域A2之方式,設置有逐片於水平方向上搬送托盤200之托盤搬送機構11A、11B。托盤搬送機構11A係可使托盤200連同載置於該托盤200上之IC器件90一併向Y方向之正側、即圖12中之箭頭α11A 方向移動之移動部。藉此,可將IC器件90穩定地送入供給區域A2。又,托盤搬送機構11B係可使空的托盤200向Y方向之負側、即圖12中之箭頭α11B 方向移動之移動部。藉此,可使空的托盤200自供給區域A2移動至托盤供給區域A1。 於供給區域A2設置有溫度調整部(均熱板(英語表述:soak plate,漢語表述(一例):均溫板))12a、器件搬送頭13a、及托盤搬送機構15。 溫度調整部12a構成為載置複數個IC器件90之載置部,被稱為可將該等載置之IC器件90一同加熱之「均熱板」。藉由該均熱板,可將利用檢查部16a檢查前之IC器件90預先加熱而調整為適於該檢查(高溫檢查)之溫度。於圖12所示之構成中,溫度調整部12a係於Y方向上配置並固定有2個。而且,藉由托盤搬送機構11A自托盤供給區域A1搬入之托盤200上之IC器件90被搬送至任一溫度調整部12a。 再者,藉由將該作為載置部之溫度調整部12a固定,而可對該溫度調整部12a上之IC器件90穩定地進行溫度調整。 器件搬送頭13a被可於供給區域A2內於X方向及Y方向、進而亦可於Z方向上移動地支持。藉此,器件搬送頭13a可承擔自托盤供給區域A1搬入之托盤200與溫度調整部12a之間之IC器件90之搬送、及溫度調整部12a與後述之器件供給部14a之間之IC器件90之搬送。再者,於圖12中,以箭頭α13X 表示器件搬送頭13a之X方向之移動,以箭頭α13Y 表示器件搬送頭13a之Y方向之移動。 托盤搬送機構15係使已去除所有IC器件90之狀態之空的托盤200於供給區域A2內向X方向之正側、即箭頭α15 方向搬送之機構。而且,於該搬送後,空的托盤200係藉由托盤搬送機構11B自供給區域A2返回至托盤供給區域A1。 檢查區域A3係檢查IC器件90之區域。於該檢查區域A3設置有檢查部16a、與器件搬送頭17a。又,亦設置有以跨及供給區域A2與檢查區域A3之方式移動之器件供給部14a、及以跨及檢查區域A3與回收區域A4之方式移動之器件回收部18a。 器件供給部14a構成為載置利用溫度調整部12a調整了溫度之IC器件90之載置部,且係被稱為可將該等IC器件90搬送至檢查部16a附近之「供給用梭板」或簡稱為「供給梭」者。 又,該作為載置部之器件供給部14a被可於供給區域A2與檢查區域A3之間沿X方向、即箭頭α14 方向往復移動地支持。藉此,器件供給部14a可將IC器件90自供給區域A2穩定地搬送至檢查區域A3之檢查部16a附近,又,可於檢查區域A3將IC器件90藉由器件搬送頭17a取出後再次返回供給區域A2。 於圖12所示之構成中,器件供給部14a於Y方向上配置有2個,且溫度調整部12a上之IC器件90被搬送至任一器件供給部14a。又,器件供給部14a與溫度調整部12a同樣,構成為可加熱載置於該器件供給部14a之IC器件90。藉此,可將利用溫度調整部12a調整了溫度之IC器件90維持其溫度調整狀態,而搬送至檢查區域A3之檢查部16a附近。 器件搬送頭17a係固持維持溫度調整狀態之IC器件90且於檢查區域A3內搬送該IC器件90之動作部。該器件搬送頭17a被可於檢查區域A3內於Y方向及Z方向上往復移動地支持,而成為被稱為「指標手臂」之機構之一部分。藉此,器件搬送頭17a可將自供給區域A2搬入之器件供給部14a上之IC器件90搬送並載置於檢查部16a上。再者,於圖12中,以箭頭α17Y 表示器件搬送頭17a之Y方向之往復移動。又,器件搬送頭17a被可於Y方向上往復移動地支持,但並不限定於此,亦可被亦可於X方向上往復移動地支持。 又,器件搬送頭17a與溫度調整部12a同樣,構成為可將所固持之IC器件90加熱。藉此,可自器件供給部14a至檢查部16a持續維持IC器件90之溫度調整狀態。 檢查部16a構成為載置電子零件即IC器件90且檢查該IC器件90之電性特性之載置部。於該檢查部16a,設置有與IC器件90之端子部電性連接之複數個探針銷。而且,可藉由將IC器件90之端子部與探針銷電性連接、即接觸,而進行IC器件90之檢查。IC器件90之檢查係藉由與檢查部16a連接之測試器具備之檢查控制部中記憶之程式而進行。再者,檢查部16a亦可與溫度調整部12a同樣,將IC器件90加熱而將該IC器件90調整為適於檢查之溫度。 再者,檢查部16a、溫度調整部12a、器件供給部14a、器件搬送頭17a各者亦可構成為除可加熱IC器件90以外,還可冷卻IC器件90。 器件回收部18a構成為載置利用檢查部16a之檢查結束後之IC器件90,且可將該IC器件90搬送至回收區域A4之載置部,有時被稱為「回收用梭板」或簡稱為「回收梭」。 又,器件回收部18a被可於檢查區域A3與回收區域A4之間沿X方向、即箭頭α18 方向移動地支持。又,於圖12所示之構成中,器件回收部18a與器件供給部14a同樣,於Y方向上配置有2個,且檢查部16a上之IC器件90被搬送並載置於任一器件回收部18a。該搬送係藉由器件搬送頭17a進行。 回收區域A4係回收檢查結束後之複數個IC器件90之區域。於該回收區域A4,設置有回收用托盤19、器件搬送頭20a、及托盤搬送機構21。又,於回收區域A4,亦準備有空的托盤200。 回收用托盤19係載置已利用檢查部16a檢查之IC器件90之載置部,且以不於回收區域A4內移動之方式固定。藉此,即使於較多地配置有器件搬送頭20a等各種可動部之回收區域A4,於回收用托盤19上,亦穩定地載置已檢查完畢之IC器件90。再者,於圖12所示之構成中,回收用托盤19沿X方向配置有3個。 又,空的托盤200亦沿X方向配置有3個。該空的托盤200亦成為載置已利用檢查部16a檢查之IC器件90之載置部。而且,移動至回收區域A4之器件回收部18a上之IC器件90被搬送並載置於回收用托盤19及空的托盤200中之任一者。藉此,將IC器件90依每一檢查結果分類並回收。 器件搬送頭20a被可於回收區域A4內於X方向及Y方向、進而亦可於Z方向上移動地支持。藉此,器件搬送頭20a可將IC器件90自器件回收部18a搬送至回收用托盤19或空的托盤200。再者,於圖12中,以箭頭α20X 表示器件搬送頭20a之X方向之移動,以箭頭α20Y 表示器件搬送頭20a之Y方向之移動。 托盤搬送機構21係將自托盤去除區域A5搬入之空的托盤200於回收區域A4內於X方向、即箭頭α21 方向上搬送之機構。而且,於該搬送後,空的托盤200成為配置於回收IC器件90之位置,即,可成為上述3個空的托盤200中之任一個。 托盤去除區域A5係將排列有已檢查完畢狀態之複數個IC器件90之托盤200回收並去除之除材部。於托盤去除區域A5中,可堆疊多個托盤200。 又,以跨及回收區域A4與托盤去除區域A5之方式,設置有於Y方向上逐片搬送托盤200之托盤搬送機構22A、22B。托盤搬送機構22A係可使托盤200於Y方向、即箭頭α22A 方向上往復移動之移動部。藉此,可將已檢查完畢之IC器件90自回收區域A4搬送至托盤去除區域A5。又,托盤搬送機構22B可使用以回收IC器件90之空的托盤200向Y方向之正側、即箭頭α22B 方向移動。藉此,可使空的托盤200自托盤去除區域A5移動至回收區域A4之移動部。 控制部800a控制例如托盤搬送機構11A、托盤搬送機構11B、溫度調整部12a、器件搬送頭13a、器件供給部14a、托盤搬送機構15、檢查部16a、器件搬送頭17a、器件回收部18a、器件搬送頭20a、托盤搬送機構21、托盤搬送機構22A、及托盤搬送機構22B各部之作動。 操作者可經由監視器300設定、或確認電子零件檢查裝置1a之動作條件等。該監視器300具有例如以液晶畫面構成之顯示畫面301,且配置於電子零件檢查裝置1a之正面側上部。如圖11所示,於托盤去除區域A5之圖中之X方向正側設置有載置滑鼠之滑鼠台600。該滑鼠係於操作顯示於監視器300之畫面時使用。 又,相對於監視器300而於圖11中之X方向正側下方配置有操作面板700。操作面板700係與監視器300不同地另行命令電子零件檢查裝置1a進行所需之動作者。 又,信號燈400可藉由發光之顏色之組合而報知電子零件檢查裝置1a之作動狀態等。信號燈400係配置於電子零件檢查裝置1a之上部。再者,於電子零件檢查裝置1a亦可內置有揚聲器500,藉由該揚聲器500而報知電子零件檢查裝置1a之作動狀態等。 電子零件檢查裝置1a係藉由第1隔壁231而區隔(隔開)托盤供給區域A1與供給區域A2之間,藉由第2隔壁232而區隔供給區域A2與檢查區域A3之間,藉由第3隔壁233而區隔檢查區域A3與回收區域A4之間,藉由第4隔壁234而區隔回收區域A4與托盤去除區域A5之間。而且,供給區域A2與回收區域A4之間亦藉由第5隔壁235區隔。 電子零件檢查裝置1a係最外裝被罩覆蓋,且該罩有例如前罩241、側罩242、側罩243、後罩244及頂罩245。 如上所述,電子零件檢查裝置1a(電子零件搬送裝置10)可搭載載置IC器件90之載置部。而且,於載置部中,有托盤200、被稱為更換套件之溫度調整部12a、器件供給部14a等。此種載置部具有可逐個收納電子零件即IC器件90之複數個凹穴(凹部)。以下,針對載置部,以托盤200為代表進行說明。 如圖14所示,於作為載置部之托盤200形成有24個以凹部構成之凹穴PK,該等凹穴PK係配置成於X方向上6個、於Y方向上4個之矩陣狀。再者,關於凹穴PK之個數或配置,當然並不限定於圖14所示之構成。此點對於溫度調整部12a或器件供給部14a等亦相同。於以後,有時將該等凹穴PK根據XY平面上之位置(配置部位)稱為「凹穴PKmn」。此處,m意指自X方向之負側數起第m個,為1~6之整數,n意指自Y方向負側數起第n個,為1~4之整數。例如、位於X方向之最負側、且於Y方向亦位於最負側之凹穴PK成為凹穴PK11。又,位於X方向之最正側、且於Y方向亦位於最正側之凹穴PK成為凹穴PK64。 且說,於供給區域A2,由於如上述般以溫度調整部12a或器件供給部14a加熱IC器件90,故因該熱而環境亦成為加熱狀態。因此,於托盤200,因熱膨脹等而產生少許變形(翹曲),而凹穴PK之高度亦變化。又,供給區域A2內之環境成為加熱狀態以前所示教之器件搬送頭13a之X方向、Y方向之位置調整亦於加熱狀態後產生偏移。於如此情形,即使欲以器件搬送頭13a固持凹穴PK內之IC器件90,亦有時產生無法固持之現象、即卡住(jam)。 因此,於電子零件檢查裝置1a中,以防止此種現象之方式構成。以下,對該構成予以說明。 如圖13所示,器件搬送頭13a具備:基部130,其被可於X方向、Y方向移動地連結、支持;及1個固持單元3,其支持於基部130。再者,固持單元3之設置數於圖13所示之構成中為1個,但並不限定於此,亦可為2個以上。 於基部130內置有使固持單元3於上下方向驅動之驅動源。 固持單元3係將托盤200之凹穴PK內之IC器件90固持而提起、或解除該固持狀態而放開IC器件90者。 固持單元3具備於基部130之下方延伸之支持部30、相對於支持部30被動地上下移動之被動部31、及吸附固持IC器件90之固持部32。又,於支持部30之內部設置有供給吸附用之空氣壓之空氣配管341。 被動部31係其上部側可進退地嵌入於支持部30之下部,且於與支持部30之間設置有賦予向下方之彈性力之未圖示之彈簧。藉由該彈簧之彈性力,而通常向支持部30之下方最大程度前進。另一方面,被動部31係於設於其下部側之固持部32等受到較彈簧之彈性力更大之向上方向之力時,被動部31之上部藉由支持部30進入而後退,亦向支持部30之方向(上方)移動。於被動部31之內部設置有與支持部30之空氣配管341連結之空氣配管342。 固持部32係藉由於其下端部產生之負壓而吸附固持與其下端部抵接之IC器件90者,且連結於固持單元3之被動部31。 如圖15所示,固持部32係使貫通形成於其內部之空氣通道321連通於被動部31之空氣配管342。於固持部32,於其外周部形成有使該外周部向下方延伸而成之筒狀之外筒部322,且於被外筒部322包圍之形成於其內部上側之空氣通道321之周圍形成有向下方突出的凸部323。於該凸部323,安裝有橡膠等具有彈性或可撓性等之吸附噴嘴35,且該吸附噴嘴35之吸附口351與空氣通道321連通。 藉此,將吸附噴嘴35之吸附口351經由固持部32之空氣通道321、被動部31之空氣配管342、支持部30之空氣配管341而連結於近接檢測裝置4(參照圖13)。 近接檢測裝置4係用於對吸附口351賦予吸附用、脫離用、高度測定用(高度檢測)及中心位置檢測用之各流量之氣體之裝置。 如圖13所示,於近接檢測裝置4連接有供給為正壓之特定供給壓之氣體之正壓電路39,且設置有第1閥門41、第1流量調整閥42、第2流量調整閥43、第2閥門44、流量計45(流量檢測部)、及第3閥門46、負壓產生器47、及過濾器48。 藉此,近接檢測裝置4於使吸附於噴嘴35之IC器件90脫離時,驅動第1閥門41而將配管494連接於配管493,對配管493供給供給壓之氣體。又,第2閥門44使具有第1流量調整閥42之配管493連接於配管492,且經由流量計45連接於配管491,而對吸附噴嘴35供給藉由第1流量調整閥42自供給壓調整成脫離用流量之氣體。藉此,自吸附噴嘴35噴出脫離用流量之氣體,而使固持於該吸附噴嘴35之IC器件90自該吸附噴嘴35脫離。 又,近接檢測裝置4於以吸附噴嘴35等測定托盤200等之高度時,驅動第1閥門41而將配管494連接於配管493,對配管493供給供給壓之空氣。又,第2閥門44使具有第2流量調整閥43之配管493連接於配管492且經由流量計45連接於配管491,而對吸附噴嘴35供給藉由第2流量調整閥43自供給壓調整成高度測定用流量之氣體。藉此,自吸附噴嘴35噴出高度測定用流量之氣體,而可利用作為流量檢測部之流量計45高精度地測定(檢測)自該吸附噴嘴35(噴出部)噴出之高度測定用流量之氣體之流量。 再者,近年之小型化之IC器件90係若一面自吸附噴嘴35噴出氣體一面下降,則有產生儘管為載置於托盤200上之情形,亦會被噴出之氣體吹飛等異常之虞。因此,藉由評估實驗或模擬、計算等預先求出不會產生此種異常之適當之流量(例如0.6[L/min])作為高度測定用流量,並以對吸附噴嘴35供給該高度測定用流量之方式調整第2流量調整閥43。 再者,如圖15所示,於檢測托盤200之凹穴PK之中心位置OPK 時,亦自吸附噴嘴35噴出與高度測定用流量相同流量之氣體。如此,吸附噴嘴35可作為能噴出氣體之噴出部發揮功能。將檢測該凹穴PK之中心位置OPK 時之氣體之流量稱為「中心位置檢測用流量」。 進而,圖13所示之近接檢測裝置4於在吸附口351吸附IC器件90時,驅動第3閥門46而將配管494連接於配管495,對配管495供給供給壓之空氣。於配管495連接有負壓產生器47,伴隨對配管495供給之供給壓之空氣通過而產生負壓,並將該負壓經由過濾器48供給至所連接之配管492。供給至配管492之負壓係藉由經由流量計45供給至所連接之配管492而亦供給至吸附噴嘴35。藉此,於吸附噴嘴35產生吸引力,從而可於該吸附噴嘴35吸附固持IC器件90。 如此,吸附噴嘴35雖如上述般作為可噴出氣體之噴出部發揮功能,但亦作為可吸附IC器件90之吸附部發揮功能。藉此,作為噴出部發揮功能之吸附噴嘴35於亦作為吸附部發揮功能之情形時,吸附電子零件即IC器件90,並可以該吸附狀態搬送IC器件90。藉由如此般將吸附噴嘴35於噴出部與吸附部切換,可省略分別另行設置噴出部與吸引部。藉此,可使器件搬送頭13a之構成簡單,因此,可謀求例如器件搬送頭13a之輕量化。 如圖16所示,控制部800a係以具有中央運算處理裝置(CPU:Central Processing Unit,中央處理單元)801、作為記憶裝置之非揮發性記憶體(ROM:Read-only Memory,唯讀記憶體)802、及揮發性記憶體(RAM:Random Access Memory,隨機存取記憶體)803等之微型電腦為中心構成,且根據儲存於記憶體之各種資料及程式而執行搬送IC器件90之處理等各種控制。 於本實施形態中,以控制部800a測定托盤200之上下方向之位置(高度),並執行根據所測定之高度而算出該托盤200之變形之托盤變形處理,及根據該算出之托盤200之變形而算出載置於托盤200之各IC器件90之高度、即固持單元3下降之高度之高度算出處理。 又,於非揮發性記憶體802,預先保存有托盤變形算出處理及高度算出處理所需之各種參數等。又,於本實施形態中,除托盤變形算出處理及高度算出處理之外,亦可執行如後述般檢測俯視下之托盤200之凹穴PK之中心位置OPK 之中心位置檢測處理。 控制部800a係電性連接於供給X軸馬達驅動電路MXD1、供給Y軸馬達驅動電路MYD1、及供給Z軸馬達驅動電路MZD1。 供給X軸馬達驅動電路MXD1應答於自控制部800a接收之驅動信號,根據該驅動信號運算驅動量,並根據所運算出之驅動量而驅動控制供給X軸馬達MX1。又,於控制部800a,經由供給X軸馬達驅動電路MXD1輸入藉由供給X軸馬達編碼器EMX1檢測之供給X軸馬達MX1之旋轉速度。藉此,控制部800a掌握器件搬送頭13a之固持單元3之X方向之位置。然後,求出該掌握之位置、與托盤200之上方位置等目標位置之X方向之偏移,而驅動控制供給X軸馬達MX1,使器件搬送頭13a之固持單元3移動至目標位置。 供給Y軸馬達驅動電路MYD1應答於自控制部800a接收之驅動信號,根據該驅動信號運算驅動量,並根據所運算出之驅動量而驅動控制供給Y軸馬達MY1。又,於控制部800a,經由供給Y軸馬達驅動電路MYD1輸入藉由供給Y軸馬達編碼器EMY1檢測之供給Y軸馬達MY1之旋轉速度。藉此,控制部800a掌握器件搬送頭13a之固持單元3之Y方向之位置。然後,求出該掌握之位置、與托盤200之上方位置等目標位置之Y方向之偏移,而驅動控制供給Y軸馬達MY1,使器件搬送頭13a之固持單元3移動至目標位置。 供給Z軸馬達驅動電路MZD1應答於自控制部800a接收之驅動信號,根據該驅動信號運算驅動量,並根據所運算出之驅動量而驅動控制供給Z軸馬達MZ1。又,供給Z軸馬達驅動電路MZD1與供給Z軸馬達MZ1之驅動控制同步,而進行供給Z軸馬達制動器BMZ1之放開、緊固。進而,於控制部800a,經由供給Z軸馬達驅動電路MZD1輸入藉由供給Z軸馬達編碼器EMZ1檢測之供給Z軸馬達MZ1之旋轉速度。藉此,控制部800a掌握器件搬送頭13a之固持單元3之Z方向之位置(高度),且求出該高度位置、與托盤200之上方位置等目標位置之Z方向之偏移,而驅動控制供給Z軸馬達MZ1,使器件搬送頭13a之固持單元3移動至目標之高度位置。 控制部800a係與閥門驅動電路41D電性連接。閥門驅動電路41D係應答於自控制部800a接收之控制信號而驅動控制第1閥門41。又,藉由控制部800a驅動控制之第1閥門41切換是否對固持部32之吸附噴嘴35供給正壓之氣體。於對吸附噴嘴35供給正壓之氣體時自吸附噴嘴35噴出壓縮空氣。 控制部800a係與閥門驅動電路44D電性連接。閥門驅動電路44D係應答於自控制部800a接收之控制信號而驅動控制第2閥門44。又,藉由控制部800a驅動控制之第2閥門44將對固持部32之吸附噴嘴35供給之正壓之氣體之流量於脫離用流量與高度測定用流量之間切換。再者,高度測定用流量係與檢測托盤200之凹穴PK等之位置時之中央位置檢測用流量相同之流量。 控制部800a係與閥門驅動電路46D電性連接。閥門驅動電路46D係應答於自控制部800a接收之控制信號而驅動控制第3閥門46。又,藉由控制部800a驅動控制之第3閥門46切換是否對固持部32之吸附口351供給負壓。於使吸附口351為負壓時於固持部32吸附IC器件90。 控制部800a係與流量計45電性連接。對控制部800a傳輸根據藉由流量計45測定之氣體之流量之信號。藉此,控制部800a算出藉由流量計45測定之氣體之流量,並將該流量與預定之近接檢測用流量閾值TH1(參照圖21)比較,且於該流量少於近接檢測用流量閾值TH1時,判斷為吸附噴嘴35被堵塞,而檢測吸附噴嘴35之向托盤200等之靠近。 其次,參照圖14、圖17及圖21對以電子零件檢查裝置1a(電子零件搬送裝置10)自動測定托盤200之高度並算出其變形之原理進行說明。 如圖14、圖17所示,於托盤200上,預先設定有用於測定其高度之複數個測定點CP11、測定點CP12、測定點CP13。而且,於例如因熱膨脹而於托盤200產生不規則之變形之情形等,有時該等各測定點CP11~測定點CP13之高度變得各自不同。即,於圖17中圖中左側(Y方向負側)之測定點CP11之高度為高度L11,於圖17中圖中中央附近(Y方向中央附近)之測定點CP12之高度為高度L12,該高度L12較測定點CP11之高度L11低差d12。又,於圖17中圖中右側(Y方向正側)之測定點CP13之高度為高度L13,該高度L13較測定點CP11之高度L11高出差d13。 再者,於本實施形態中,將測定點CP11~測定點CP13設定於與凹穴PK不同之位置,且較佳例如設定於托盤200之X方向之儘可能負側。又,除測定點CP11~測定點CP13以外,亦存在測定點CP21、測定點CP22、測定點CP23、測定點CP31、測定點CP32、測定點CP33。 測定點CP21~測定點CP23較佳設定於例如托盤200之X方向之中央部。測定點CP31~測定點CP33較佳設定於例如托盤200之X方向之儘可能正側。 此時,於本實施形態中,於算出托盤200之變形之前,控制部800a藉由固持單元3,自動測定托盤200之測定點CP11~測定點CP13之高度。 詳細而言,控制部800a於使固持單元3之固持部32配置於托盤200之測定點CP11~測定點CP13之上方,並且一面對該固持部32之吸附噴嘴35供給成為高度測定用之壓力之氣體而自吸附噴嘴35噴出氣體,一面使固持單元3下降。於吸附噴嘴35與托盤200分離時,例如於將托盤200之上表面之高度設為高度H0,將距托盤200之上表面具有特定距離之高度設為高度H2時,於吸附噴嘴35之高度距高度H0為高度H2以上之情形、即吸附噴嘴35與托盤200之間之距離為特定距離以上之情形時,對吸附噴嘴35供給之氣體大部分自吸附噴嘴35噴出(參照圖21)。又,於吸附噴嘴35與托盤200之間之距離成為特定距離以下時,例如吸附噴嘴35之高度低於高度H2之情形時,來自吸附噴嘴35之氣體之噴出量減少,從而藉由流量計45測定之氣體之流量減少。 進而,於吸附噴嘴35抵接於托盤200而堵塞其吸附口351時,例如當吸附噴嘴35之高度為高度H0之情形時,不自該吸附噴嘴35噴出氣體,藉由流量計45測定之氣體之流量成為「0」。即,若將近接檢測用流量閾值TH1設定為近接檢測用之閾值,則於吸附噴嘴35之高度成為高度H1時、即吸附噴嘴35與托盤200之間之距離成為「高度H0-高度H1」時,流量變得少於該近接檢測用流量閾值TH1,檢測出吸附噴嘴35向托盤200靠近(參照圖21)。再者,以相同方式,亦測定測定點CP21~測定點CP33之高度。 如此,藉由根據高度測定用流量之氣體之流量之變化而非接觸壓力等來檢測測定點CP11~測定點CP33,而減輕於高度測定時對托盤200賦予多餘之載荷之憂慮。又,固持單元3發揮如下功能(緩衝功能),即,當被動部31受到較彈簧之彈性力強之力時,使固持部32向上方移動而吸收高度方向之誤差。因此,若發揮緩衝功能,則雖有於藉由固持部32測定之高度包含基於藉由該緩衝功能吸收之高度之誤差之虞,但因藉由根據氣體流量之變化來測定高度,而可於被動部31受到較強之力之前測定高度,故可較高地維持測定之高度之精度。進而,若測定位置為凹穴PK,則根據IC器件90之有無而高度變化,但藉由將測定點CP11~測定點CP13設定於與凹穴PK不同之位置,可不受IC器件90之高度之影響而測定托盤200之高度(變形)。 其次,根據上述之測定之結果,算出托盤200之變形。詳細而言,於測定點CP11與測定點CP12之間相鄰配置有凹穴PK11、凹穴PK12。此時,根據測定點CP11之高度L11及測定點CP12之高度L12、測定點CP11與凹穴PK11之間之距離、測定點CP12與凹穴PK12之間之距離、凹穴PK11或凹穴PK12之深度尺寸等,而分別算出凹穴PK11、凹穴PK12之高度。 同樣,於測定點CP12與測定點CP13之間相鄰配置有凹穴PK13、凹穴PK14。而且,以與算出凹穴PK11、凹穴PK12之高度相同之方式,分別算出凹穴PK13、凹穴PK14之高度。又,可同樣地,使用測定點CP21~測定點CP33之高度而算出凹穴PK21~凹穴PK64之高度。 如以上,於電子零件檢查裝置1a(電子零件搬送裝置10)中,即使托盤200因熱膨脹而變形,亦可根據自吸附噴嘴35噴出之氣體之流量之變化,而檢測以凹部構成之各凹穴PK之高度。藉此,可高精度地檢測(算出)各凹穴PK之高度,從而可實現對收納於該凹穴PK之IC器件90之高精度之吸附。 又,如上述般,於供給區域A2內之環境成為加熱狀態以前所示教之器件搬送頭13a之X方向、Y方向之位置調整亦於加熱狀態後產生偏移。於該情形時,執行檢測俯視下之托盤200之各凹穴PK之中心位置OPK 之中心位置檢測處理。其次,對中心位置檢測處理進行說明。再者,於進行中心位置檢測處理時,算出各凹穴PK之高度,故記憶該各凹穴PK之大致各自位置,但處於檢測不到中心位置OPK 之狀態。 如圖15所示,例如於檢測凹穴PK11之中心位置OPK 時,首先,將介隔凹穴PK11而位於X方向之兩側之2個點設為第1位置PS1、第2位置PS2。再者,作為各凹穴PK之第1位置PS1、第2位置PS2,可設為成為設定第1位置PS1、第2位置PS2之對象之凹穴PK、與該凹穴PK之於X方向上相鄰之凹穴PK之間之任意點。例如,於凹穴PK11之情形時,作為第2位置PS2,較佳設定為凹穴PK11與凹穴PK21之中間點。又,於不存在成為設定第1位置PS1、第2位置PS2之對象之凹穴PK之於X方向上相鄰之凹穴PK之情形時,可設定為該成為設定對象之凹穴PK、與托盤200之位於X方向之緣部之間之任意點。例如,於凹穴PK11之情形時,作為第1位置PS1,較佳設定為凹穴PK11與托盤200之緣部之中間點。 其次,將固持單元3之吸附噴嘴35配置於第1位置PS1上,並將該吸附噴嘴35之高度設為高度H1。然後,使調整為中心位置檢測用流量之氣體(以下將該氣體稱為「氣體GS」)自吸附噴嘴35噴出。藉此,吸附噴嘴35作為可噴出氣體GS之噴出部發揮功能。 該作為噴出部發揮功能之吸附噴嘴35(固持單元3)噴出氣體GS,可維持著高度H1而於第1位置PS1與第2位置PS2之間沿X方向、即沿連結第1位置PS1與第2位置PS2之線段往復移動。 而且,於自第1位置PS1朝向第2位置PS2移動時、即於去路PR1上,以流量計45檢測(測定)之氣體GS之流量之變化成為圖22中以實線表示之曲線GR1。根據該曲線GR1可知,於在吸附噴嘴35自第1位置PS1移動至第2位置PS2之過程中,超過凹穴PK11之位於X方向之負側之側壁WL1(壁部)時,流量轉為增加。又,根據該曲線GR1可知,吸附噴嘴35超過凹穴PK11之位於X方向之正側之側壁WL2(壁部)時,流量轉為減少。 另一方面,於自第2位置PS2朝向第1位置PS1移動時、即於返路PR2上,以流量計45檢測之氣體GS之流量之變化成為圖22中以虛線表示之曲線GR2。根據該曲線GR2可知,於在吸附噴嘴35自第2位置PS2移動至第1位置PS1之過程中,超過凹穴PK11之側壁WL2時,流量轉為增加。又,根據該曲線GR2可知,吸附噴嘴35超過凹穴PK11之側壁WL1時,流量轉為減少。 如此,於托盤200中,以凹部構成之凹穴PK11之側壁WL1及側壁WL2於該凹穴PK11位於第1位置PS1與第2位置PS2之間之情形時,具有以下之功能。該功能係於吸附噴嘴35作為噴出部於第1位置PS1與第2位置PS2之間移動時,於以凹部構成之凹穴PK11成為氣體GS之流量變化之流量變化部。而且,於控制部800a中,作為成為所檢測出之流量變化部之側壁WL1之位置,記憶例如於去路PR1氣體GS之流量轉為增加時之供給X軸馬達編碼器EMX1之編碼值。又,作為成為流量變化部之側壁WL2之位置,記憶返路PR2氣體GS之流量轉為增加時之供給X軸馬達編碼器EMX1之編碼值。 又,作為噴出部發揮功能之噴嘴35(固持單元3)亦可於與連結第1位置PS1與第2位置PS2之線段交叉、即於本實施形態中正交之線段之方向(Y方向)上往復移動(移動)。再者,將成為該往復移動之起點、終點之位置、即相當於第1位置PS1之位置稱為「第3位置PS3」,將折回點、即相當於第2位置PS2之位置稱為「第4位置PS4」。 而且,於自第3位置PS3朝向第4位置PS4移動時、即去路上,以流量計45檢測之氣體GS之流量之變化成為圖23中之以實線表示之曲線GR3。根據該曲線GR3可知,於在吸附噴嘴35自第3位置PS3移動至第4位置PS4之過程中,超過凹穴PK11之位於Y方向之負側之側壁WL3時,流量轉為增加。又,根據曲線GR3可知,於吸附噴嘴35超過凹穴PK11之位於Y方向之正側之側壁WL4時,流量轉為減少。 另一方面,於自第4位置PS4朝向第3位置PS3移動時、即返路上,以流量計45檢測之氣體GS之流量之變化成為圖23中之以虛線表示之曲線GR4。根據該曲線GR4可知,於在吸附噴嘴35自第4位置PS4移動至第3位置PS3之過程中,超過凹穴PK11之側壁WL4時,流量轉為增加。又,根據曲線GR4可知,於吸附噴嘴35超過凹穴PK11之側壁WL3時,流量轉為減少。 如此,於托盤200中,以凹部構成之凹穴PK11之側壁WL3及側壁WL4亦成為氣體GS之流量變化之流量變化部。而且,於控制部800a中,作為成為流量變化部之側壁WL3之位置,記憶例如於去路氣體GS之流量轉為增加時之供給Y軸馬達編碼器EMY1之編碼值。又,作為成為流量變化部之側壁WL4之位置,記憶返路氣體GS之流量轉為增加時之供給Y軸馬達編碼器EMY1之編碼值。 而且,於控制部800a中,算出(運算)將側壁WL1之位置與側壁WL2之位置之間2等分、且將側壁WL3之位置與側壁WL4之位置之間2等分之位置,並記憶該算出之位置作為凹穴PK11之中心位置OPK 。又,於控制部800a中,對於除凹穴PK11以外之其餘凹穴PK(PK12~PK64)之中心位置OPK 亦可同樣地檢測並予以記憶。 如以上所述,控制部800a亦具有作為中心位置檢測部之功能,即,檢測流量變化部,並根據該檢測之流量變化部,而檢測以凹部構成之凹穴PK11之中心位置OPK 。而且,於電子零件檢查裝置1a(電子零件搬送裝置10)中,可於與藉由檢測凹穴PK11之中心位置OPK 而檢測凹穴PK11之高度相輔,藉由吸附而固持該凹穴PK11中所收納之IC器件90時,朝向IC器件90之與中心位置OPK 對應之部分按壓吸附噴嘴35。藉由維持該按壓狀態使吸附噴嘴35產生吸引力,而可高精度地進行對IC器件90之固持動作。 又,如上述般,作為噴出部發揮功能之吸附噴嘴35可沿連結第1位置PS1與第2位置PS2之線段之方向(X方向)往復移動(移動),且亦可沿與該線段交叉之線段之方向(Y方向)往復移動(移動)。藉此,與僅於X方向或Y方向移動而進行中心位置OPK 之檢測之情形、或僅於去路進行中心位置OPK 之檢測之情形相比,可高精度地進行中心位置OPK 之檢測。 再者,中心位置OPK 之檢測於圖15所示之構成中以將IC器件90收納於凹穴PK11之狀態進行,但並不限定於此,亦可以未將IC器件90收納於凹穴PK11之狀態進行。 如以上般之中心位置檢測處理於電子零件即IC器件90於俯視下呈1邊為5 mm以下之矩形之情形時尤其有效。其原因在於,於此種小型之IC器件90之固持,顯著受到供給區域A2中之環境之加熱狀態之影響(IC器件90之無法固持)。 如圖19所示,於電子零件檢查裝置1a(電子零件搬送裝置10)中,於監視器300之顯示畫面301顯示選擇IC器件90之大小之選單302。於選單302中,包含表示IC器件90之圖標303、該IC器件90之1邊超過5 mm之旨意之訊息304、指示依照訊息304之按鈕305、表示IC器件90之圖標306、該IC器件90之1邊超過5 mm之旨意之訊息307、及指示依照訊息307之按鈕308。而且,於操作按鈕308之情形時,執行中心位置檢測處理。 又,如圖20所示,於中心位置檢測處理執行中,於監視器300之顯示畫面301顯示「中心位置檢測處理執行中」之旨意之訊息309。 又,於電子零件檢查裝置1a(電子零件搬送裝置10)中,亦可對托盤200之所有凹穴PK執行中心位置檢測處理(以下將該處理稱為「第1中心位置檢測處理」)而進行該等所有凹穴PK之中心位置OPK 之檢測。但,藉由以下所述之處理(以下將該處理稱為「第2中心位置檢測處理」)亦可進行所有凹穴PK之中心位置OPK 之檢測。 參照圖18對第2中心位置檢測處理進行說明。再者,於托盤200中,於X方向上相鄰之凹穴PK彼此之間隔(間距間距離)PCX 、與於Y方向上相鄰之凹穴PK彼此之間隔(間距間距離)PCY 係預先決定(例如於關於托盤200之說明書明示)而設為已知。 於作為載置IC器件90之載置部之托盤200,以凹部構成之凹穴PK於X方向(一方向)至少配置有3個、即於本實施形態中6個(凹穴PK11、凹穴PK21、凹穴PK31、凹穴PK41、凹穴PK51、凹穴PK61)。而且,於進行第2中心位置檢測處理時,中心位置檢測部即控制部800a首先進行第1中心位置檢測處理,而檢測最離開之兩側之2個由凹部構成之凹穴PK、即凹穴PK11與凹穴PK61之各中心位置OPK 。 其次,算出連結凹穴PK11之中心位置OPK 與凹穴PK61之中心位置OPK 之線段、與X方向所成之角度θX 。藉此,可檢測位於凹穴PK11與凹穴PK61之間之由凹部構成之凹穴PK(凹穴PK21、凹穴PK31、凹穴PK41、凹穴PK51)之中心位置OPK 。例如凹穴PK21之中心位置OPK 係檢測為自凹穴PK11之中心位置OPK 向X方向之正側移動「間隔PCX 」量,且向Y方向之正側移動「(間隔PCX )×(tanθX )」量之位置。 又,於作為載置IC器件90之載置部之托盤200,凹穴PK於Y方向(一方向)至少配置有3個、即於本實施形態中4個(凹穴PK11、凹穴PK12、凹穴PK13、凹穴PK14)。而且,於進行第2中心位置檢測處理時,控制部800a首先進行第1中心位置檢測處理,而檢測最離開之兩側之2個凹穴PK、即凹穴PK11與凹穴PK14之各中心位置OPK 。 其次,算出連結凹穴PK11之中心位置OPK 與凹穴PK14之中心位置OPK 的線段與Y方向所成之角度θY 。藉此,可檢測位於凹穴PK11與凹穴PK14之間之凹穴PK(凹穴PK12、凹穴PK13)之中心位置OPK 。例如凹穴PK12之中心位置OPK 係檢測為自凹穴PK11之中心位置OPK 向Y方向之正側移動「間隔PCY 」量,向X方向之正側移動「(間隔PCY )×(tanθY )」量之位置。 又,對於其他之其餘凹穴PK之中心位置OPK 亦可藉由第2中心位置檢測處理檢測。 如此,於第2中心位置檢測處理中,於檢測托盤200具有之所有凹穴PK之中心位置時,與例如逐個檢測各凹穴PK之中心位置OPK 相比,可迅速地進行該處理、即縮短該檢測處理所耗費之時間。 又,作為載置IC器件90之載置部而構成之溫度調整部12a或器件供給部14a亦形成有可逐個收納IC器件90之凹穴。而且,對於該等凹穴之中心位置,亦可與托盤200之凹穴PK之中心位置OPK 同樣,藉由第1中心位置檢測處理或第2中心位置檢測處理而檢測。 其次,參照圖24說明於電子零件檢查裝置1a(電子零件搬送裝置10)操作於監視器300之顯示畫面301顯示之選單302之按鈕308之後至開始IC器件90的搬送之前之流程圖。又,較佳亦參照圖18。 首先,對托盤200之凹穴PK11、凹穴PK61、凹穴PK14施以高度算出處理,而檢測(算出)凹穴PK11、凹穴PK61、凹穴PK14之各高度(步驟S401)。將該檢測之高度之資訊記憶於控制部800a。 其次,對托盤200之凹穴PK11、凹穴PK61、凹穴PK14施以第1中心位置檢測處理,而檢測凹穴PK11、凹穴PK61、凹穴PK14之各中心位置OPK (步驟S402)。將該檢測之中心位置OPK 之資訊記憶於控制部800a。 其次,藉由第2中心位置檢測處理而算出連結凹穴PK11之中心位置OPK 與凹穴PK61之中心位置OPK 之線段與X方向所成的角度θX ,且算出連結凹穴PK11之中心位置OPK 與凹穴PK14之中心位置OPK 之線段與Y方向所成的角度θY (步驟S403)。 其次,如上述般,檢測托盤200之凹穴PK11、凹穴PK61、凹穴PK14以外之其餘凹穴PK之中心位置OPK (步驟S404)。將該檢測之中心位置OPK 之資訊記憶於控制部800a。 其次,對於各溫度調整部12a,亦以與托盤200時相同之方式、即以與步驟S401~步驟S404相同之方式,檢測該溫度調整部12a之各凹穴之中心位置等,即依序進行步驟S405、步驟S406、步驟S407、步驟S408。將藉由執行步驟S405~步驟S408檢測之中心位置等之資訊記憶於控制部800a。 其次,對於各器件供給部14a,亦以與托盤200時相同之方式、即以與步驟S401~步驟S404相同之方式,檢測該器件供給部14a之各凹穴之中心位置等,即依序進行步驟S409、步驟S410、步驟S411、步驟S412。將藉由執行步驟S409~步驟S412檢測之中心位置等之資訊記憶於控制部800a。 藉由經由如以上般之步驟S401~步驟S412,可檢測托盤200之所有凹穴PK之中心位置OPK 、各溫度調整部12a之所有凹穴之中心位置、及各器件供給部14a之所有凹穴之中心位置。而且,若開始IC器件90之搬送,則器件搬送頭13a之吸附噴嘴35於例如欲固持托盤200上之各IC器件90時,朝向成為該固持對象之IC器件90之與中心位置OPK 對應之部分每次高精度地按壓。藉此,可高精度地進行對IC器件90之固持動作。此點於欲固持溫度調整部12a上之各IC器件90時亦相同,且於欲固持器件供給部14a上之各IC器件90時亦相同。藉此,可於中途不中斷地持續進行IC器件90之搬送。即,可防止IC器件之搬送中之無法固持IC器件90之現象(卡住)。 再者,於不進行第1中心位置檢測處理或第2中心位置檢測處理之先前之情形時,卡住之產生率為1/500~1/50(分母為IC器件90之搬送個數)。但,若進行第1中心位置檢測處理或第2中心位置檢測處理,則可將卡住之產生率抑制至1/200000~1/10000(分母為IC器件90之搬送個數)。又,較佳於監視器300之顯示畫面301顯示卡住之產生率。 又,步驟S401~步驟S412既可對托盤200逐片進行,亦可對堆疊複數片托盤200之每1個批次進行。又,步驟S401~步驟S412亦可每經過特定時間、或每搬送特定個數IC器件90而進行。 以上,雖根據圖示之實施形態對本發明之電子零件搬送裝置及電子零件檢查裝置予以說明,但本發明並非限定於此,各部之構成可置換為具有相同功能之任意之構成者。又,亦可附加其他任意之構成物。 又,本發明亦可為組合上述之各實施形態中之任意2以上之構成(特徵)者。 又,作為第1~第3實施形態、及先前技術所述之方法以外之雙器件檢測(器件殘留檢測)之方法,例如可列舉下述(1)~(5)之方法。 (1)藉由雷射位移感測器求出保持部之底面之高度,而根據該結果,進行異物檢測(IC器件之有無之判定)。 (2)藉由CCD相機等電子相機,拍攝保持部,而根據獲得之圖像資料進行異物檢測。 (3)藉由近接感測器進行異物檢測。 (4)檢測器件搬送頭17之按壓時之反作用力,而根據其結果進行異物檢測。 (5)使光通過設置於保持部之孔,檢測該光,且根據其結果進行異物檢測。 又,於第4實施形態中,IC器件雖為俯視下矩形者,但並不限定於此,亦可為例如圓形或橢圓形者。Hereinafter, the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention will be described in detail based on preferred embodiments shown in the drawings. Furthermore, for convenience of explanation, the three axes orthogonal to each other shown in the drawing are referred to as an X-axis, a Y-axis, and a Z-axis. Further, the XY plane including the X-axis and the Y-axis is horizontal, and the Z-axis is vertical. Further, the direction parallel to the X-axis is also referred to as "X-direction", the direction parallel to the Y-axis is also referred to as "Y-direction", and the direction parallel to the Z-axis is also referred to as "Z-direction". Further, the direction in which the arrows in the respective directions are directed is referred to as "positive", and the opposite direction is referred to as "negative". In addition, the positive side in the Z direction in the figure may be referred to as "upper (or upper)", and the lower side may be referred to as "lower (or lower)". Further, the "level" as used in the specification of the present invention is not limited to a complete level, and includes a state in which it is slightly inclined (for example, less than about 5 degrees) with respect to the horizontal level as long as it does not hinder the conveyance of the electronic component. The inspection apparatus (electronic component inspection apparatus) shown in the following embodiment is used to transport electronic components such as IC devices such as BGA (Ball Grid Array), and to inspect and test during the transportation ( Hereinafter, the device is referred to as "inspection" for electrical characteristics. In the following, for convenience of explanation, a case where an IC device is used as the above-described electronic component will be described as a representative, and this will be referred to as "IC device 90". In addition, the inspection device (electronic component inspection device) is disposed on the side where the tray supply region A1 and the tray removal region A5 are disposed (the negative side in the Y direction), and on the opposite side, that is, the side on which the inspection region A3 is disposed. (The positive side in the Y direction) is used as the back side. <First Embodiment> Hereinafter, a first embodiment will be described with reference to Figs. 1 to 6 . As shown in FIG. 1 and FIG. 2, the inspection apparatus 1 is divided into a tray supply area A1, a device supply area (hereinafter simply referred to as "supply area") A2, an inspection area A3, and a device collection area (hereinafter simply referred to as "recovery area") A4. And the tray removal area A5. Further, the IC device 90 is sequentially inspected from the tray supply area A1 to the tray removal area A5 via the above-described respective areas and in the inspection area A3 in the middle. In this way, the inspection apparatus 1 includes an electronic component transport apparatus (processing machine) that transports the IC device 90 in each area, and an inspection unit 16 that performs inspection in the inspection area A3. Further, the electronic component transport apparatus includes a control unit 800 having a storage unit 810, a monitor (display unit) 300, a signal lamp 400, a speaker 500, and an operation panel 700 (see FIGS. 1 and 3). The tray supply area A1 is supplied with a supply unit of a tray (arrangement member) 100 in which a plurality of IC devices 90 in an unchecked state are arranged. In the tray supply area A1, a plurality of trays 100 can be stacked. The supply area A2 supplies a plurality of IC devices 90 disposed on the tray 100 from the tray supply area A1 to the area of the inspection area A3. Further, the tray transport mechanisms 11A and 11B that transport the tray 100 one by one in the horizontal direction are provided so as to straddle the tray supply area A1 and the supply area A2. The tray transport mechanism 11A is a moving portion that can move the tray 100 together with the IC device 90 placed on the tray 100 toward the positive side in the Y direction. Thereby, the IC device 90 can be stably fed to the supply region A2. Further, the tray transport mechanism 11B is a movable portion that can move the empty tray 100 to the negative side in the Y direction, that is, from the supply area A2 to the tray supply area A1. A temperature adjustment unit (a soak plate, a Chinese expression (one case): a temperature equalization plate) 12, a device transfer head 13, and a tray conveyance mechanism 15 are provided in the supply region A2. The temperature adjustment unit 12 may cool or heat a plurality of IC devices 90 together, and may be referred to as a "soaking plate". By the heat equalizing plate, the IC device 90 before inspection by the inspection portion 16 can be previously cooled or heated to be adjusted to a temperature suitable for the inspection. In the configuration shown in FIG. 2, the temperature adjustment unit 12 is disposed and fixed in the Y direction. Further, the IC device 90 on the tray 100 carried in (transferred) from the tray supply area A1 by the tray transport mechanism 11A is transported to any of the temperature adjustment units 12. The device transfer head 13 is supported in the supply region A2 so as to be movable in the X direction, the Y direction, and further in the Z direction. Thereby, the device transfer head 13 can carry the IC device 90 between the tray 100 loaded from the tray supply area A1 and the temperature adjustment unit 12, and the IC device 90 between the temperature adjustment unit 12 and the device supply unit 14 to be described later. Transfer. The device transfer head 13 has a plurality of hand units 131 as a holding portion for holding the IC device 90 (in FIG. 2, only one symbol "131" is shown as a representative). Similarly to the hand unit 175 of the device transfer head 17 to be described later, the hand unit 131 includes an adsorption nozzle, and the IC nozzle 90 is held by the adsorption nozzle by adsorption. The tray transport mechanism 15 is a mechanism that transports the empty tray 100 in which the state of all the IC devices 90 has been removed to the positive side in the X direction in the supply region A2. Then, after the transfer, the empty tray 100 is returned from the supply area A2 to the tray supply area A1 by the tray transport mechanism 11B. The inspection area A3 is an area in which the IC device 90 is inspected. The inspection unit 16 and the device transfer head 17 are provided in the inspection area A3. Further, a device supply unit 14 that moves so as to straddle the supply area A2 and the inspection area A3, and a device recovery unit 18 that moves so as to straddle the inspection area A3 and the recovery area A4 are provided. The device supply unit 14 can mount the IC device 90 whose temperature has been adjusted by the temperature adjustment unit 12, and transport (move) the IC device 90 to the placement unit near the inspection unit 16, which may be referred to as a “supply shuttle”. board". The device supply unit 14 has a plurality of concave portions (pits) 141 which are arranged in a matrix in the X direction and the Y direction (in FIG. 2, only one symbol "141" is shown as a representative). The IC device 90 before inspection by the inspection unit 16 is housed in each of the concave portions 141. Further, the device supply unit 14 is supported to be movable in the horizontal direction between the supply region A2 and the inspection region A3 in the X direction. In the configuration shown in FIG. 2, two device supply units 14 are arranged in the Y direction, and the IC device 90 on the temperature adjustment unit 12 is transported to any of the device supply units 14. Further, the device supply unit 14 is configured to maintain the temperature adjustment state of the temperature-adjusted IC device 90. Thereby, the IC device 90 can be cooled or heated, and therefore, the temperature adjustment state of the IC device 90 can be maintained. The inspection unit 16 is a unit that mounts (holds) the IC device 90, and inspects, tests (electrically checks) the electrical characteristics of the IC device 90, that is, a member that mounts the IC device 90 when the IC device 90 is inspected. . On the upper surface of the inspection unit 16, a plurality of holding portions 161 (see FIGS. 2 and 4) which are recessed portions for housing (holding) the IC device 90 are provided (see FIG. 2, only one is shown as a representative). Symbol "161"). The IC device 90 is housed in the holding portion 161 and placed on the inspection portion 16 . Further, probe pins that are electrically connected to the terminals of the IC device 90 in a state where the IC device 90 is held by the holding portion 161 are provided at positions corresponding to the respective holding portions 161 of the inspection portion 16. Further, the terminal of the IC device 90 is electrically connected (contacted) to the probe pin, and the inspection of the IC device 90 is performed via the probe pin. The inspection of the IC device 90 is performed by an inspection control unit provided in a tester (not shown) connected to the inspection unit 16 based on a program stored in the memory unit of the inspection control unit. Further, in the inspection unit 16, similarly to the temperature adjustment unit 12, the IC device 90 can be heated or cooled to adjust the IC device 90 to a temperature suitable for inspection. The device transfer head 17 is supported to be movable in the Y direction and the Z direction in the inspection area A3. Further, the device transfer head 17 can transport the IC device 90 on the device supply unit 14 carried in from the supply region A2 to the inspection unit 16, and can transport and mount the IC device 90 on the inspection unit 16 The device recovery unit 18 is provided. Further, when the IC device 90 is inspected, the device transfer head 17 presses the IC device 90 toward the inspection portion 16, whereby the IC device 90 is brought into contact with the inspection portion 16. Thereby, the terminal of the IC device 90 is electrically connected to the probe pin of the inspection portion 16 as described above. Furthermore, the device transfer head 17 can also cool or heat the IC device 90 to adjust the IC device 90 to a temperature suitable for inspection. The device transfer head 17 has a plurality of hand units 175 as holding portions for holding the IC device 90 (see FIGS. 2 and 4) (in FIG. 2, only one symbol "171" is shown as a representative). The hand unit 175 is provided with an adsorption nozzle 176, and the adsorption nozzle 176 holds the IC device 90 by adsorption. That is, the hand unit 175 drives (actuates) the ejector (negative pressure generating portion) 52 to attract air (fluid) in a state in which the IC device 90 is placed at the end portion of the adsorption nozzle 176, so that the inner cavity of the adsorption nozzle 176 is made. In the negative pressure state, the IC device 90 is held (adsorbed and held) at the front end of the adsorption nozzle 176. Further, by supplying air to the driving ejector 52, the negative pressure state of the inner cavity of the adsorption nozzle 176 is released, and the IC device 90 held by the adsorption nozzle 176 is released. Further, a flow path 177 through which air (fluid) can pass is formed at an end portion from the ejector 52 to the adsorption nozzle 176 including the inner cavity of the adsorption nozzle 176. Further, the device transfer head 17 is provided with a pressure sensor (detection unit) 51 that detects the pressure in the flow path 177 as a detected value. Further, the ejector 52 is an example of a negative pressure generating portion that generates a negative pressure, and the negative pressure generating portion is not limited thereto, and examples thereof include a pump and the like. The device recovery unit 18 mounts the IC device 90 after the inspection by the inspection unit 16 is completed, and the IC device 90 can be transported (moved) to the placement portion of the recovery area A4, which may be referred to as a “recycling shuttle plate”. "." The device collecting unit 18 has a plurality of concave portions (pits) 181 arranged in a matrix in the X direction and the Y direction (in FIG. 2, only one symbol "181" is shown as a representative). Further, the device recovery portion 18 is supported by being movable in the horizontal direction between the inspection region A3 and the recovery region A4 in the X direction. Further, in the configuration shown in FIG. 2, the device recovery unit 18 is disposed in the Y direction in the same manner as the device supply unit 14, and the IC device 90 on the inspection unit 16 is transported to any device recovery unit 18. Placed. This transfer is performed by the device transfer head 17. Further, in the inspection apparatus 1, one device supply unit 14 and one device collection unit 18 are connected in the X direction via a connection unit (not shown), and constitute a shuttle unit that moves together in the same direction. Furthermore, the device supply unit 14 and the device recovery unit 18 may be configured to be independently movable. The recovery area A4 is a region of a plurality of IC devices 90 after the end of the inspection. In the collection area A4, a recovery tray 19, a device transfer head 20, and a tray transfer mechanism 21 are provided. Further, in the collection area A4, an empty tray 100 is also prepared. The collection tray 19 mounts the mounting portion of the IC device 90 that has been inspected by the inspection unit 16 and is fixed so as not to move in the recovery area A4. By this means, even if the collection area A4 of the various movable parts such as the device transfer head 20 is disposed in a large amount, the IC device 90 that has been inspected is stably placed on the recovery tray 19. Further, in the configuration shown in Fig. 2, three collection trays 19 are arranged in the X direction. Further, three empty trays 100 are also arranged in the X direction. The empty tray 100 also serves as a mounting portion on which the IC device 90 that has been inspected by the inspection unit 16 is placed. Then, the IC device 90 moved to the device recovery unit 18 of the recovery area A4 is transported and placed on either of the collection tray 19 and the empty tray 100. Thereby, the IC device 90 is sorted and recovered according to each inspection result. The device transfer head 20 is supported in the X-direction, the Y-direction, and further the Z-direction in the recovery area A4. Thereby, the device transfer head 20 can transport the IC device 90 from the device recovery unit 18 to the recovery tray 19 or the empty tray 100. The device transfer head 20 has a plurality of hand units 201 as a holding portion for holding the IC device 90 (in FIG. 2, only one symbol "201" is shown as a representative). Similarly to the hand unit 175 of the device transfer head 17 described above, the hand unit 201 includes an adsorption nozzle, and the IC device 90 is held by the adsorption nozzle by adsorption. The tray transport mechanism 21 is a mechanism that transports the empty tray 100 loaded from the tray removal area A5 in the X direction in the collection area A4. Further, after the transfer, the empty tray 100 is placed at the position where the IC device 90 is collected, that is, it becomes one of the above three empty trays 100. The tray removal area A5 is a removal unit that collects and removes the tray 100 of the plurality of IC devices 90 in which the inspection has been completed. In the tray removal area A5, a plurality of trays 100 can be stacked. Further, the tray transport mechanisms 22A and 22B for transporting the tray 100 one by one in the Y direction are provided so as to span the recovery area A4 and the tray removal area A5. The tray transport mechanism 22A is a moving portion that can move the tray 100 in the Y direction. Thereby, the IC device 90 that has been inspected can be transported from the recovery area A4 to the tray removal area A5. Further, the tray transport mechanism 22B can use a moving portion in which the tray 100 in which the IC device 90 is empty is moved from the tray removal area A5 to the recovery area A4. The control unit 800 controls, for example, the tray transport mechanisms 11A and 11B, the temperature adjustment unit 12, the device transport head 13, the device supply unit 14, the tray transport mechanism 15, the inspection unit 16, the device transport head 17, the device recovery unit 18, and the device transport head 20. Driving of each of the tray transport mechanism 21, the tray transport mechanisms 22A and 22B, the monitor 300, the signal lamp 400, the speaker 500, and the ejector 52. The user (operator) can set or confirm the operating conditions and the like of the inspection device 1 via the monitor 300. The monitor 300 has a display screen (display portion) 301 composed of, for example, a liquid crystal screen, and is disposed on the upper portion of the front side of the inspection apparatus 1. As shown in FIG. 1, a mouse table 600 is disposed on the positive side in the X direction in the drawing of the tray removing area A5, and the mouse table 600 mounts a mouse used for the screen operation displayed on the monitor 300. Further, the operation panel 700 is disposed below the positive side in the X direction of FIG. 1 with respect to the monitor 300. The operation panel 700 instructs the inspection apparatus 1 to perform a desired operation separately from the monitor 300. Further, the signal lamp 400 can notify the operating state of the inspection apparatus 1 or the like by a combination of colors of light emission. The signal lamp 400 is disposed on the upper portion of the inspection device 1. Further, the speaker 500 may be built in the inspection device 1, and the operation state of the inspection device 1 or the like may be reported by the speaker 500. As shown in FIG. 2, the inspection apparatus 1 is partitioned (separated) between the tray supply area A1 and the supply area A2 by the first partition wall 61, and the supply area A2 and the inspection area A3 are partitioned by the second partition wall 62. Between the inspection area A3 and the collection area A4, the third partition wall 63 partitions between the collection area A4 and the tray removal area A5 by the fourth partition wall 64. Further, the supply area A2 and the recovery area A4 are also partitioned by the fifth partition wall 65. An opening 621 and an opening 622 are formed in the second partition 62. A device supply portion 14 can pass through the opening 621. Thereby, the opening 621 functions as an inlet when the device supply unit 14 enters the inspection area A3 from the supply area A2, and functions as an outlet when the device supply unit 14 goes out of the inspection area A3 to the supply area A2. Also, another device supply portion 14 can pass through the opening 622. Thereby, the opening 622 also functions as an inlet when the device supply unit 14 enters the inspection area A3 from the supply area A2, and functions as an outlet when the device supply unit 14 goes out of the inspection area A3 to the supply area A2. Further, an opening 631 and an opening 632 are formed in the third partition wall 63. A device recovery portion 18 can pass through the opening 631 and another device recovery portion 18 can pass through the opening 632. The inspection device 1 is covered by a cover, and the cover includes, for example, a front cover 70, a side cover 71, a side cover 72, a rear cover 73, and a top cover 74. The inspection device 1 has a dual device detection (device residual detection) function as one of the functions, that is, a function of detecting whether or not the IC 190 is present in the holding portion 161. The dual device detection has been described as an example of the prior art, and the description thereof is omitted. The inspection apparatus 1 is configured to automatically set the adsorption confirmation height (second reference height) of the hand unit 175 of the device transfer head 17 in the dual device detection before performing the dual device detection. The adsorption confirmation height is the distance between the adsorption nozzle 176 of the hand unit 175 of the device transport head 17 and the bottom (bottom surface) 162 of the holding portion 161 of the inspection portion 16 (see FIG. 4). The information on the height of the adsorption confirmation is used in the dual device test. Further, when the suction confirmation height is such that the injector 52 is not moved by the holding unit 161 to move the nozzle 52, the suction nozzle 176 does not adsorb the bottom of the holding portion 161. 162. The distance between the adsorption nozzle 176 and the bottom 162 of the holding portion 161 is set to a minimum value. The setting of the adsorption confirmation height may be performed by each of the hand unit 175 of the device transfer head 17 and each of the holding units 161 of the inspection unit 16, or a part (for example, as one representative) of the hand unit 175, and A part (for example, one as a representative) is held by the holding unit 161. Hereinafter, a case where one hand unit 175 and one holding unit 161 are performed will be described as an example. First, the operation of the inspection apparatus 1 when the adsorption confirmation height is set will be briefly described. First, the hand unit 175 is moved to the set operation start height (first reference height) with respect to the holding unit 161 in a state where the IC device 90 or the like is not present in the holding portion 161. The setting operation starts the distance between the adsorption nozzle 176 of the height hand unit 175 and the bottom 162 of the holding portion 161 (the height of the adsorption nozzle 176 from the bottom portion 162). As shown in FIG. 4, in the present embodiment, the setting operation start height is set to 0 (the same height as the bottom portion 162 of the holding portion 161). That is, it is assumed that the adsorption nozzle 176 of the hand unit 175 is in contact with the bottom 162 of the holding portion 161. Next, the ejector 52 is actuated to be sucked by the adsorption nozzle 176 of the hand unit 175, and the pressure in the flow path 177 is detected by the pressure sensor 51 as a detected value. Initially, the adsorption nozzle 176 attracts the bottom portion 162 of the holding portion 161, whereby the pressure in the flow path 177 is reduced, so that the detected value does not reach the threshold value. However, when the adsorption nozzle 176 and the bottom portion 162 of the holding portion 161 are more and more separated, the detected value becomes equal to or higher than the threshold value. Furthermore, even if the adsorption nozzle 176 is slightly separated from the bottom 162 of the holding portion 161, the above-described detected value does not reach the threshold. This state is also referred to as a state in which the adsorption nozzle 176 adsorbs the bottom 162 of the holding portion 161. Next, as shown in FIG. 5, the hand unit 175 is gradually separated from the holding portion 161, the pressure in the flow path 177 is detected by the pressure sensor 51, and the detected value of the pressure detected by the pressure sensor 51 is detected. When the change is above the threshold (when the pressure changes), the distance between the adsorption nozzle 176 of the hand unit 175 and the bottom 162 of the holding portion 161 (the height of the adsorption nozzle 176 with respect to the bottom 162) L is set to be adsorbed. Confirm the height. Here, the distance between the hand unit 175 and the holding unit 161 (close to the second embodiment to be described later) is not particularly limited, and the root can be appropriately set according to conditions, but is preferably 0.01 per stage. It is more than mm and not more than 1 mm, more preferably 0.03 mm or more and 0.5 mm or less, and most preferably 0.05 mm or more and 0.2 mm or less. If the distance is less than the above lower limit, the setting of the adsorption confirmation height takes a long time depending on other conditions. Further, when the distance is larger than the upper limit value, depending on other conditions, the adsorption confirmation height cannot be set to an optimum value. Next, the control operation of the control unit 800 for setting the operation of the suction height confirmation will be described. As shown in FIG. 6, first, the hand unit 175 of the device transfer head 17 is moved to the holding unit 161 of the inspection unit 16 (step S101) (see FIG. 4). Next, the ejector 52 is actuated to start suction by the adsorption nozzle 176 of the hand unit 175 (step S102). Next, the pressure in the flow path 177 is detected by the pressure sensor 51 (step S103). Next, it is judged whether or not the detected value of the pressure detected by the pressure sensor 51 is equal to or larger than the threshold (step S104). Here, the adsorption nozzle 176 adsorbs the bottom portion 162 of the holding portion 161, whereby the pressure in the flow path 177 is reduced, and the detected value of the pressure is less than the threshold value. The above detection value is less than the threshold value is referred to as "sensor on". In step S104, when it is determined that the detected value is not equal to or greater than the threshold (sensor is turned on) (S104: NO), the hand unit 175 is raised by one step (the hand unit 175 is moved relative to the holding portion 161). The first stage is left (step S105), and the process returns to step S103, and the steps subsequent to step S103 are performed again. During the repetition of steps S103 to S105, the gap between the adsorption nozzle 176 and the bottom portion 162 of the holding portion 161 is increased, and the adsorption nozzle 176 becomes unable to adsorb the bottom portion 162 of the holding portion 161. Thereby, the pressure in the flow path 177 is increased, and the detected value of the pressure is equal to or higher than the threshold value. The above detection value is referred to as a threshold value or more as "sensor disconnection". In the case where it is determined in the step S104 that the detected value is equal to or greater than the threshold value (the sensor is turned off) (S104: YES), the suction nozzle 176 of the current hand unit 175 and the bottom portion 162 of the holding portion 161 are provided. The distance registration is the adsorption confirmation height (step S106). Specifically, the adsorption confirmation height is memorized in the memory unit 810. As described above, the setting of the adsorption confirmation height is completed. Further, the set adsorption confirmation height is displayed on the monitor 300. Thereby, the user can easily grasp the adsorption confirmation height. As described above, according to the inspection apparatus 1, an appropriate value can be set as the adsorption confirmation height. Further, since the inspection device 1 automatically sets the suction confirmation height, the adsorption confirmation height can be easily and quickly set. [Second Embodiment] The second embodiment will be described below with reference to Figs. 7 to 9. However, the description of the same matters will be omitted, and the description of the same matters will be omitted. First, the operation of the inspection apparatus 1 when the adsorption confirmation height is set will be briefly described. First, the hand unit 175 is moved to the set operation start height with respect to the holding unit 161 in a state where none of the holding unit 161 is provided with the IC device 90 or the like. As shown in Fig. 7, in the present embodiment, the setting operation start height is set to a specific value greater than 0 (the same height as the bottom portion 162 of the holding portion 161), that is, a height from a position at which the bottom portion 162 is separated by a specific distance. Further, the specific distance is set in such a manner that when the ejector 52 is actuated and sucked by the adsorption nozzle 176 of the hand unit 175, and the pressure sensor 51 detects the pressure in the flow path 177 as a detected value, The detected value of the pressure is equal to or higher than the threshold. Here, the specific distance is not particularly limited as long as the detected value of the pressure detected by the pressure sensor 51 is equal to or greater than the threshold value, and may be appropriately set according to various conditions, but is preferably 1 mm or more and 10 mm. Hereinafter, it is more preferably 2 mm or more and 8 mm or less, and most preferably 3 mm or more and 7 mm or less. If the specific distance is smaller than the lower limit value, the adsorption nozzle 176 of the start hand unit 175 adsorbs the bottom portion 162 of the holding portion 161 according to other conditions, and the height of the adsorption confirmation height cannot be set. Moreover, if the specific distance is larger than the above upper limit, it takes a long time to set the adsorption confirmation height according to other conditions. Next, the ejector 52 is actuated to be sucked by the adsorption nozzle 176 of the hand unit 175, and the pressure in the flow path 177 is detected by the pressure sensor 51 as a detected value. First, the adsorption nozzle 176 does not adsorb the bottom portion 162 of the holding portion 161, whereby the detection value is equal to or higher than the threshold value. However, if the adsorption nozzle 176 is closer to the bottom 162 of the holding portion 161, the detected value becomes less than the threshold. Next, as shown in FIG. 8, the hand unit 175 is stepped closer to the holding portion 161, the pressure in the flow path 177 is detected by the pressure sensor 51 as a detected value, and the pressure is detected by the pressure sensor 51. When the detected value becomes less than the threshold (when the pressure changes), the distance between the adsorption nozzle 176 of the hand unit 175 and the bottom 162 of the holding portion 161 at the time of the previous pressure detection (the adsorption nozzle 176 is opposite to the bottom) The height of 162 is set to the adsorption confirmation height. Next, the control operation of the control unit 800 for setting the operation of the suction height confirmation will be described. As shown in Fig. 9, first, the hand unit 175 of the device transporting head 17 is moved to the upper portion of the holding portion 161 of the inspection unit 16 (step S201) (see Fig. 7). Next, the ejector 52 is actuated to start suction by the adsorption nozzle 176 of the hand unit 175 (step S202). Next, the pressure in the flow path 177 is detected by the pressure sensor 51 (step S203). Next, it is judged whether or not the detected value of the pressure detected by the pressure sensor 51 is equal to or larger than the threshold (step S204). In the operation of the inspection apparatus 1 when the adsorption confirmation height is set in the present embodiment, first, the adsorption nozzle 176 does not adsorb the bottom portion 162 of the holding portion 161. Thereby, the detected value of the pressure is equal to or greater than the threshold. In step S204, when it is determined that the detected value is equal to or greater than the threshold (sensor is off) (S204: YES), the hand unit 175 is lowered by one step (the hand unit 175 is brought closer to the holding unit 161 by one stage). (Step S205), and returning to step S203, step S203 and subsequent steps are executed again. During the repetition of steps S203 to S205, the gap between the adsorption nozzle 176 and the bottom portion 162 of the holding portion 161 is reduced, and the adsorption nozzle 176 adsorbs the bottom portion 162 of the holding portion 161. As a result, the pressure in the flow path 177 is reduced, and the detected value of the pressure is less than the threshold value. In step S204, when it is determined that the detected value is not equal to or greater than the threshold (sensor is turned on) (S204: NO), the suction nozzle 176 of the current hand unit 175 and the bottom 162 of the holding portion 161 are The distance from the short one-stage amount, that is, the distance between the adsorption nozzle 176 and the bottom portion 162 of the holding portion 161 when the pressure sensor 51 detects the pressure is registered as the suction confirmation height (step S206). Specifically, the adsorption confirmation height is memorized in the memory unit 810. As described above, the setting of the adsorption confirmation height is completed. Further, the set adsorption confirmation height is displayed on the monitor 300. Thereby, the user can easily grasp the adsorption confirmation height. According to the second embodiment as described above, the same effects as those of the above-described embodiment can be exhibited. <Third Embodiment> A third embodiment will be described below with reference to Fig. 10. However, the differences from the above-described embodiments will be mainly described, and the description of the same matters will be omitted. In the inspection apparatus 1 of the third embodiment, the setting operation start height is set to a specific value greater than 0 (the same height as the bottom portion 162 of the holding portion 161), that is, a height from a position at which the bottom portion 162 is separated by a specific distance. Further, the specific distance is set to a value at which the pressure is detected by the nozzle 176 of the hand unit 175 when the ejector 52 is actuated, and the pressure in the flow path 177 is detected by the pressure sensor 51 as a detected value. A value near the distance between the threshold and the distance when one of the thresholds does not reach the other. That is, the specific distance is set to be near the boundary between the distance that becomes "sensor on" and the distance that becomes "sensor disconnection". Next, the control operation of the control unit 800 for setting the operation of the suction height confirmation will be described. As shown in FIG. 10, first, the hand unit 175 of the device transfer head 17 is moved to a specific height above the holding portion 161 of the inspection portion 16 (step S301). Next, the ejector 52 is actuated to start suction by the adsorption nozzle 176 of the hand unit 175 (step S302). Next, the pressure in the flow path 177 is detected by the pressure sensor 51 (step S303). Next, it is judged whether or not the detected value of the pressure detected by the pressure sensor 51 is equal to or larger than the threshold (step S304). The moving direction of the hand unit 175 (device transfer head 17) is determined based on the result of this step S304. When the detected value is not equal to or greater than the threshold value, the moving direction of the hand unit 175 is set to the direction in which the hand unit 175 is separated from the holding portion 161. Moreover, when the detection value is equal to or greater than the threshold value, the moving direction of the hand unit 175 is set to the direction in which the hand unit 175 approaches the holding portion 161. When it is determined in the step S304 that the detected value is not equal to or greater than the threshold (the sensor is turned on) (S304: NO), the hand unit 175 is raised by one step (the hand unit 175 is moved away from the holding portion 161 by one). Stage) (step S305), and the pressure in the flow path 177 is detected by the pressure sensor 51 (step S306). Next, it is judged whether or not the detected value of the pressure detected by the pressure sensor 51 is equal to or larger than the threshold (step S307). When it is determined in step S307 that the detected value is not equal to or greater than the threshold (sensor is turned on) (S307: NO), the process returns to step S305, and the steps from step S305 onward are performed again. During the repetition of steps S305 to S307, the gap between the adsorption nozzle 176 and the bottom portion 162 of the holding portion 161 is increased, and the adsorption nozzle 176 becomes unable to adsorb the bottom portion 162 of the holding portion 161. Thereby, the pressure in the flow path 177 is increased, and the detected value is equal to or higher than the threshold value. In the case where it is determined in the step S307 that the detected value is equal to or greater than the threshold value (the sensor is turned off) (S307: YES), the distance between the adsorption nozzle 176 of the current hand unit 175 and the bottom portion 162 of the holding portion 161 is registered. The height is confirmed for adsorption (step S308). Specifically, the adsorption confirmation height is memorized in the memory unit 810. Further, in the case where it is determined in the step S304 that the detected value is equal to or greater than the threshold value (the sensor is turned off) (S304: YES), the hand unit 175 is lowered by one step (the hand unit 175 is brought closer to the holding portion 161). One stage) (step S309), and the pressure in the flow path 177 is detected by the pressure sensor 51 (step S310). Next, it is judged whether or not the detected value of the pressure detected by the pressure sensor 51 is equal to or larger than the threshold (step S311). If it is determined in the step S311 that the detected value is equal to or greater than the threshold value (the sensor is turned off) (S311: YES), the process returns to the step S309, and the step S309 and the subsequent steps are executed again. During the repetition of steps S309 to S311, the gap between the adsorption nozzle 176 and the bottom portion 162 of the holding portion 161 is reduced, and the adsorption nozzle 176 adsorbs the bottom portion 162 of the holding portion 161. Thereby, the pressure in the flow path 177 is reduced, and the detected value is less than the threshold value. In step S311, when it is determined that the detected value is not equal to or greater than the threshold (sensor is turned on) (S311: NO), the suction nozzle 176 of the current hand unit 175 and the bottom 162 of the holding portion 161 are The distance from the short one-stage amount, that is, the distance between the adsorption nozzle 176 and the bottom portion 162 of the holding portion 161 when the pressure sensor 51 detects the pressure is registered as the suction confirmation height (step S312). Specifically, the adsorption confirmation height is memorized in the memory unit 810. As described above, the setting of the adsorption confirmation height is completed. Further, the set adsorption confirmation height is displayed on the monitor 300. Thereby, the user can easily grasp the adsorption confirmation height. According to the third embodiment as described above, the same effects as those of the above-described embodiment can be exhibited. <Fourth Embodiment> A fourth embodiment of an electronic component conveying apparatus and an electronic component inspection apparatus according to the present invention will be described below with reference to Figs. 11 to 24 . In addition, the same components as those of the above-described embodiment are denoted by the same reference numerals. In addition, in FIGS. 14 and 17, the description of the IC device 90 is omitted. The electronic component inspection device 1a shown in Figs. 11 and 12 incorporates an electronic component conveying device 10. Further, in the present embodiment, the IC device 90 has a rectangular shape (square shape) in plan view. In addition, the electronic component inspection device 1a (electronic component transfer device 10) is used by being called a so-called "change kit" which is replaced by each type of the IC device 90. In the replacement kit, the mounting portion of the IC device 90 is placed, and the mounting portion includes, for example, a temperature adjusting portion 12a and a device supply portion 14a which will be described later. Further, as the mounting portion on which the IC device 90 is placed, there is also a plate-shaped tray 200 which is separately prepared by the user unlike the replacement kit as described above. This tray 200 is also mounted on the electronic component inspection device 1a (electronic component conveying device 10). The tray 200 as the mounting portion is, for example, a user who mounts the IC device 90, which is an electronic component, in the electronic component inspection device 1a (electronic component conveying device 10). Thereby, a plurality of IC devices 90 in an unchecked state can be loaded together with the tray 200 in a tray supply region A1 to be described later, so that the operator (user) can easily perform the loading operation. The electronic component inspection device 1a is divided into a tray supply area A1, a device supply area (hereinafter simply referred to as "supply area") A2, an inspection area A3, a device collection area (hereinafter simply referred to as "recovery area") A4, and a tray removal area A5. The other regions are partially opened as described later. Moreover, the IC device 90 is along the arrow α from the tray supply area A1 to the tray removal area A5. 90 The direction is sequentially checked through the above-described respective areas and in the inspection area A3 in the middle. In this way, the electronic component inspection device 1a is an electronic component conveying device (processing machine) 10 that is provided in each region to transport the IC device 90, an inspection portion 16a that performs inspection in the inspection region A3, and a control portion 800a. Moreover, the electronic component inspection apparatus 1a also has the monitor 300, the signal light 400, and the operation panel 700. The tray supply area A1 is supplied with a supply unit of the tray 200 in which a plurality of IC devices 90 in an unchecked state are arranged. In the tray supply area A1, a plurality of trays 200 can be stacked. The supply area A2 supplies a plurality of IC devices 90 disposed on the tray 200 from the tray supply area A1 to the area of the inspection area A3. Further, the tray transport mechanisms 11A and 11B that transport the tray 200 one by one in the horizontal direction are provided so as to straddle the tray supply area A1 and the supply area A2. The tray transport mechanism 11A allows the tray 200 to be collectively directed to the positive side of the Y direction, i.e., the arrow α in FIG. 12, together with the IC device 90 placed on the tray 200. 11A The moving part that moves in the direction. Thereby, the IC device 90 can be stably fed into the supply region A2. Further, the tray transport mechanism 11B can make the empty tray 200 to the negative side in the Y direction, that is, the arrow α in FIG. 11B The moving part that moves in the direction. Thereby, the empty tray 200 can be moved from the supply area A2 to the tray supply area A1. A temperature adjustment unit (a soak plate, a Chinese expression (one case): a temperature equalization plate) 12a, a device transfer head 13a, and a tray conveyance mechanism 15 are provided in the supply area A2. The temperature adjustment unit 12a is configured as a mounting portion on which a plurality of IC devices 90 are placed, and is referred to as a "soaking plate" that can heat the IC devices 90 placed thereon. By the heat equalizing plate, the IC device 90 before inspection by the inspection portion 16a can be preheated and adjusted to a temperature suitable for the inspection (high temperature inspection). In the configuration shown in FIG. 12, the temperature adjustment unit 12a is disposed and fixed in the Y direction. Further, the IC device 90 on the tray 200 carried in from the tray supply area A1 by the tray transport mechanism 11A is transported to any of the temperature adjustment units 12a. Further, by fixing the temperature adjusting portion 12a as the placing portion, the temperature of the IC device 90 on the temperature adjusting portion 12a can be stably adjusted. The device transfer head 13a is supported in the supply region A2 so as to be movable in the X direction, the Y direction, and further in the Z direction. Thereby, the device transfer head 13a can carry the IC device 90 between the tray 200 loaded from the tray supply area A1 and the temperature adjustment unit 12a, and the IC device 90 between the temperature adjustment unit 12a and the device supply unit 14a to be described later. Transfer. Furthermore, in Figure 12, with the arrow α 13X Indicates the movement of the device transfer head 13a in the X direction by the arrow α 13Y Indicates the movement of the device transfer head 13a in the Y direction. The tray transport mechanism 15 is such that the empty tray 200 in which the state of all the IC devices 90 has been removed is in the supply region A2 toward the positive side in the X direction, that is, the arrow α. 15 The mechanism of the direction of transportation. Then, after the transfer, the empty tray 200 is returned from the supply area A2 to the tray supply area A1 by the tray transport mechanism 11B. The inspection area A3 is an area in which the IC device 90 is inspected. The inspection unit 16a and the device transfer head 17a are provided in the inspection area A3. Further, a device supply unit 14a that moves so as to straddle the supply area A2 and the inspection area A3, and a device recovery unit 18a that moves so as to straddle the inspection area A3 and the recovery area A4 are also provided. The device supply unit 14a is configured to mount the mounting portion of the IC device 90 whose temperature has been adjusted by the temperature adjustment unit 12a, and is referred to as a "supply shuttle plate" that can transport the IC device 90 to the vicinity of the inspection portion 16a. Or simply referred to as "supply shuttle". Further, the device supply portion 14a as the placing portion is provided in the X direction, that is, the arrow α between the supply region A2 and the inspection region A3. 14 The direction is supported in a reciprocating manner. Thereby, the device supply unit 14a can stably transport the IC device 90 from the supply region A2 to the vicinity of the inspection portion 16a of the inspection region A3, and can return the IC device 90 by the device transfer head 17a in the inspection region A3 and then return it again. Supply area A2. In the configuration shown in FIG. 12, two device supply portions 14a are arranged in the Y direction, and the IC device 90 on the temperature adjustment portion 12a is transported to any of the device supply portions 14a. Further, similarly to the temperature adjustment unit 12a, the device supply unit 14a is configured to heat the IC device 90 placed on the device supply unit 14a. Thereby, the IC device 90 whose temperature has been adjusted by the temperature adjustment unit 12a can be maintained in the temperature adjustment state, and can be transported to the vicinity of the inspection unit 16a of the inspection area A3. The device transfer head 17a holds the IC device 90 that maintains the temperature adjustment state and transports the operation portion of the IC device 90 in the inspection region A3. The device transfer head 17a is supported by the reciprocating movement in the Y direction and the Z direction in the inspection area A3, and becomes part of a mechanism called an "index arm". Thereby, the device transfer head 17a can transport the IC device 90 on the device supply portion 14a carried in from the supply region A2 and carry it on the inspection portion 16a. Furthermore, in Figure 12, with the arrow α 17Y Reciprocating movement in the Y direction of the device transfer head 17a is indicated. Further, the device transfer head 17a is supported to be reciprocally movable in the Y direction. However, the present invention is not limited thereto, and may be supported by reciprocating movement in the X direction. Further, similarly to the temperature adjustment unit 12a, the device transfer head 17a is configured to heat the held IC device 90. Thereby, the temperature adjustment state of the IC device 90 can be continuously maintained from the device supply portion 14a to the inspection portion 16a. The inspection unit 16a is configured as a mounting portion that mounts the IC device 90, which is an electronic component, and inspects the electrical characteristics of the IC device 90. The inspection unit 16a is provided with a plurality of probe pins electrically connected to the terminal portions of the IC device 90. Further, the IC device 90 can be inspected by electrically connecting, that is, contacting, the terminal portion of the IC device 90 to the probe pin. The inspection of the IC device 90 is performed by a program stored in the inspection control unit provided in the tester connected to the inspection unit 16a. Further, similarly to the temperature adjustment unit 12a, the inspection unit 16a may heat the IC device 90 to adjust the IC device 90 to a temperature suitable for inspection. Further, each of the inspection unit 16a, the temperature adjustment unit 12a, the device supply unit 14a, and the device transfer head 17a may be configured to cool the IC device 90 in addition to the heatable IC device 90. The device recovery unit 18a is configured to mount the IC device 90 after the inspection by the inspection unit 16a, and the IC device 90 can be transported to the placement portion of the collection area A4, which may be referred to as a "recycling shuttle" or Referred to as "recycling shuttle". Further, the device recovery portion 18a is provided between the inspection region A3 and the recovery region A4 in the X direction, that is, the arrow α. 18 The direction is supported by the mobile. Further, in the configuration shown in FIG. 12, the device recovery unit 18a is disposed in the Y direction in the same manner as the device supply unit 14a, and the IC device 90 on the inspection unit 16a is transported and placed in any device for recycling. Part 18a. This transfer is performed by the device transfer head 17a. The recovery area A4 is a region of a plurality of IC devices 90 after the end of the inspection. In the collection area A4, a recovery tray 19, a device transfer head 20a, and a tray transfer mechanism 21 are provided. Further, in the collection area A4, an empty tray 200 is also prepared. The collection tray 19 mounts the mounting portion of the IC device 90 that has been inspected by the inspection unit 16a, and is fixed so as not to move in the recovery area A4. By this means, even if the collection area A4 of the various movable parts such as the device transfer head 20a is disposed in a large amount, the IC device 90 that has been inspected is stably placed on the recovery tray 19. Further, in the configuration shown in Fig. 12, three collection trays 19 are arranged in the X direction. Further, three empty trays 200 are also arranged in the X direction. The empty tray 200 also serves as a mounting portion on which the IC device 90 that has been inspected by the inspection unit 16a is placed. Then, the IC device 90 moved to the device collection portion 18a of the recovery area A4 is transported and placed on either of the collection tray 19 and the empty tray 200. Thereby, the IC device 90 is sorted and recovered according to each inspection result. The device transfer head 20a is supported in the X-direction, the Y-direction, and further in the Z-direction in the recovery area A4. Thereby, the device transfer head 20a can transport the IC device 90 from the device recovery portion 18a to the recovery tray 19 or the empty tray 200. Furthermore, in Figure 12, with the arrow α 20X Indicates the movement of the device transport head 20a in the X direction by the arrow α 20Y Indicates the movement of the device transfer head 20a in the Y direction. The tray transport mechanism 21 is a tray 200 in which the empty tray 200 loaded from the tray removal area A5 is placed in the X direction, that is, the arrow α in the collection area A4. twenty one The mechanism that is transported in the direction. Further, after the transfer, the empty tray 200 is placed at the position where the IC device 90 is collected, that is, it can be any one of the above three empty trays 200. The tray removal area A5 is a removal unit that collects and removes the tray 200 of the plurality of IC devices 90 in which the inspection has been completed. In the tray removal area A5, a plurality of trays 200 can be stacked. Further, the tray transport mechanisms 22A and 22B that transport the tray 200 one by one in the Y direction are provided so as to straddle the collection area A4 and the tray removal area A5. The tray transport mechanism 22A can cause the tray 200 to be in the Y direction, that is, the arrow α 22A a moving portion that reciprocates in the direction. Thereby, the IC device 90 that has been inspected can be transported from the recovery area A4 to the tray removal area A5. Further, the tray transport mechanism 22B can use the tray 200 that collects the empty space of the IC device 90 in the Y direction, that is, the arrow α. 22B Move in direction. Thereby, the empty tray 200 can be moved from the tray removal area A5 to the moving part of the collection area A4. The control unit 800a controls, for example, the tray transport mechanism 11A, the tray transport mechanism 11B, the temperature adjustment unit 12a, the device transport head 13a, the device supply unit 14a, the tray transport mechanism 15, the inspection unit 16a, the device transport head 17a, the device recovery unit 18a, and the device. The movement of each of the transport head 20a, the tray transport mechanism 21, the tray transport mechanism 22A, and the tray transport mechanism 22B. The operator can set or confirm the operating conditions and the like of the electronic component inspection device 1a via the monitor 300. The monitor 300 has a display screen 301 composed of, for example, a liquid crystal screen, and is disposed on the front side of the electronic component inspection device 1a. As shown in FIG. 11, a mouse table 600 on which a mouse is placed is provided on the positive side in the X direction in the drawing of the tray removal area A5. This mouse is used when operating the screen displayed on the monitor 300. Further, the operation panel 700 is disposed below the positive side in the X direction of FIG. 11 with respect to the monitor 300. The operation panel 700 separately commands the electronic component inspection apparatus 1a to perform the required actor differently from the monitor 300. Further, the signal lamp 400 can notify the operating state of the electronic component inspection device 1a and the like by a combination of colors of light emission. The signal lamp 400 is disposed on the upper portion of the electronic component inspection device 1a. Further, the electronic component inspection device 1a may have a built-in speaker 500, and the speaker 500 may notify the operation state of the electronic component inspection device 1a and the like. The electronic component inspection device 1a is partitioned between the tray supply region A1 and the supply region A2 by the first partition wall 231, and is partitioned between the supply region A2 and the inspection region A3 by the second partition wall 232. The third partition wall 233 separates the inspection area A3 from the collection area A4, and partitions between the collection area A4 and the tray removal area A5 by the fourth partition wall 234. Further, the supply area A2 and the recovery area A4 are also partitioned by the fifth partition wall 235. The electronic component inspection device 1a is covered by a cover, and the cover includes, for example, a front cover 241, a side cover 242, a side cover 243, a rear cover 244, and a top cover 245. As described above, the electronic component inspection device 1a (electronic component conveying device 10) can mount the mounting portion on which the IC device 90 is placed. Further, the placement unit includes a tray 200, a temperature adjustment unit 12a called a replacement kit, a device supply unit 14a, and the like. Such a mounting portion has a plurality of recesses (recesses) in which the IC device 90, which is an electronic component, can be housed one by one. Hereinafter, the tray 200 will be described as a representative for the placement unit. As shown in Fig. 14, in the tray 200 as the placing portion, 24 recesses PK each having a recessed portion are formed, and the pits PK are arranged in a matrix of six in the X direction and four in the Y direction. . Further, the number or arrangement of the pockets PK is of course not limited to the configuration shown in FIG. This point is also the same for the temperature adjustment unit 12a, the device supply unit 14a, and the like. Hereinafter, the pits PK may be referred to as "pits PKmn" in accordance with the position (arrangement portion) on the XY plane. Here, m means the mth from the negative side in the X direction, and is an integer of 1 to 6, and n means the nth from the negative side in the Y direction, and is an integer of 1 to 4. For example, the pocket PK located on the most negative side in the X direction and also on the most negative side in the Y direction becomes the pocket PK11. Further, the pocket PK located on the most positive side in the X direction and located on the most positive side in the Y direction serves as the pocket PK64. In addition, in the supply region A2, since the IC device 90 is heated by the temperature adjustment portion 12a or the device supply portion 14a as described above, the environment is also heated by the heat. Therefore, in the tray 200, a slight deformation (warpage) occurs due to thermal expansion or the like, and the height of the pocket PK also changes. Further, the environment in the supply region A2 is adjusted in the X direction and the Y direction of the device transport head 13a taught before the heating state is also shifted after the heating state. In such a case, even if the IC device 90 in the cavity PK is to be held by the device carrying head 13a, there is a case where it is impossible to hold, that is, jam. Therefore, the electronic component inspection apparatus 1a is configured to prevent such a phenomenon. Hereinafter, this configuration will be described. As shown in FIG. 13, the device transfer head 13a includes a base portion 130 that is movably coupled and supported in the X direction and the Y direction, and a holding unit 3 that is supported by the base portion 130. Further, the number of the holding units 3 is one in the configuration shown in FIG. 13, but the number of the holding units 3 is not limited thereto, and may be two or more. A drive source for driving the holding unit 3 in the vertical direction is built in the base portion 130. The holding unit 3 holds the IC device 90 by holding or holding the IC device 90 in the pocket PK of the tray 200 to release the IC device 90. The holding unit 3 includes a support portion 30 that extends below the base portion 130, a passive portion 31 that passively moves up and down with respect to the support portion 30, and a holding portion 32 that adsorbs and holds the IC device 90. Further, an air pipe 341 for supplying air pressure for suction is provided inside the support portion 30. The passive portion 31 is fitted to the lower portion of the support portion 30 so that the upper portion thereof can be advanced and retracted, and a spring (not shown) that imparts a downward elastic force is provided between the passive portion 31 and the support portion 30. By the elastic force of the spring, it is generally advanced to the lower side of the support portion 30. On the other hand, when the holding portion 32 provided on the lower side of the passive portion 31 receives a force in an upward direction that is larger than the elastic force of the spring, the upper portion of the passive portion 31 is retracted by the support portion 30, and The direction of the support unit 30 (above) moves. An air pipe 342 that is coupled to the air pipe 341 of the support portion 30 is provided inside the passive portion 31. The holding portion 32 sucks and holds the IC device 90 abutting on the lower end portion thereof due to the negative pressure generated at the lower end portion thereof, and is coupled to the passive portion 31 of the holding unit 3. As shown in FIG. 15, the holding portion 32 communicates with the air pipe 342 that passes through the passive portion 31 through the air passage 321 formed therein. In the outer peripheral portion of the holding portion 32, a cylindrical outer tubular portion 322 that extends downward from the outer peripheral portion is formed, and is formed around the air passage 321 formed on the upper side of the inner portion surrounded by the outer tubular portion 322. There is a convex portion 323 that protrudes downward. An adsorption nozzle 35 having elasticity or flexibility such as rubber is attached to the convex portion 323, and the adsorption port 351 of the adsorption nozzle 35 communicates with the air passage 321 . Thereby, the adsorption port 351 of the adsorption nozzle 35 is connected to the proximity detecting device 4 via the air passage 321 of the holding portion 32, the air pipe 342 of the passive portion 31, and the air pipe 341 of the support portion 30 (see FIG. 13). The proximity detecting device 4 is a device for applying a gas for each of the adsorption, the detachment, the height measurement (height detection), and the center position detection to the adsorption port 351. As shown in FIG. 13, a positive pressure circuit 39 for supplying a gas having a specific supply pressure of a positive pressure is connected to the proximity detecting device 4, and a first valve 41, a first flow rate adjusting valve 42, and a second flow rate adjusting valve 43 are provided. The second valve 44, the flow meter 45 (flow rate detecting unit), the third valve 46, the negative pressure generator 47, and the filter 48. As a result, when the IC device 90 adsorbed to the nozzle 35 is detached, the proximity detecting device 4 drives the first valve 41 to connect the pipe 494 to the pipe 493, and supplies the gas to the pipe 493 with the supply pressure. In addition, the second valve 44 connects the pipe 493 having the first flow rate adjustment valve 42 to the pipe 492, and is connected to the pipe 491 via the flow meter 45, and supplies the adsorption nozzle 35 with the self-supply pressure adjustment by the first flow rate adjustment valve 42. A gas that is separated from the flow rate. Thereby, the gas for discharging the flow rate is discharged from the adsorption nozzle 35, and the IC device 90 held by the adsorption nozzle 35 is detached from the adsorption nozzle 35. When the height of the tray 200 or the like is measured by the suction nozzle 35 or the like, the proximity detecting device 4 drives the first valve 41 to connect the pipe 494 to the pipe 493, and supplies the supply air to the pipe 493. In addition, the second valve 44 connects the pipe 493 having the second flow rate adjustment valve 43 to the pipe 492, and is connected to the pipe 491 via the flow meter 45, and supplies the adsorption nozzle 35 to the supply pressure by the second flow rate adjustment valve 43. The gas for measuring the flow rate. In this way, the gas for measuring the flow rate of the height is discharged from the adsorption nozzle 35, and the flow rate of the height measurement flow discharged from the adsorption nozzle 35 (discharge unit) can be accurately measured (detected) by the flow meter 45 as the flow rate detecting unit. Traffic. In addition, in the case of the IC device 90 which has been miniaturized in recent years, when the gas is ejected from the adsorption nozzle 35, the gas is blown off by the gas which is ejected, even if it is placed on the tray 200. Therefore, an appropriate flow rate (for example, 0.6 [L/min]) which does not cause such an abnormality is obtained in advance by an evaluation experiment, simulation, calculation, or the like as a flow rate for height measurement, and the height measurement is performed on the adsorption nozzle 35. The second flow rate adjustment valve 43 is adjusted in such a manner as to flow rate. Furthermore, as shown in FIG. 15, the center position O of the pocket PK of the detecting tray 200 is shown. PK At the same time, a gas having the same flow rate as the flow rate for height measurement is ejected from the adsorption nozzle 35. In this manner, the adsorption nozzle 35 can function as a discharge portion that can eject a gas. The center position of the pocket PK will be detected. PK The flow rate of the gas at this time is called "flow rate for center position detection". Further, when the IC device 90 is adsorbed by the adsorption port 351, the proximity detecting device 4 shown in FIG. 13 drives the third valve 46 to connect the pipe 494 to the pipe 495, and supplies the supply air to the pipe 495. The negative pressure generator 47 is connected to the pipe 495, and a negative pressure is generated by the passage of the air supplied to the pipe 495, and the negative pressure is supplied to the connected pipe 492 via the filter 48. The negative pressure supplied to the pipe 492 is also supplied to the adsorption nozzle 35 by being supplied to the connected pipe 492 via the flow meter 45. Thereby, an attraction force is generated in the adsorption nozzle 35, so that the IC device 90 can be adsorbed and held by the adsorption nozzle 35. As described above, the adsorption nozzle 35 functions as a discharge portion that can eject the gas as described above, but also functions as an adsorption portion that can adsorb the IC device 90. In this case, when the adsorption nozzle 35 functioning as the discharge unit functions as the adsorption unit, the IC device 90, which is an electronic component, is adsorbed, and the IC device 90 can be transported in the adsorption state. By thus switching the adsorption nozzle 35 between the discharge portion and the adsorption portion, it is possible to omit the separate supply of the discharge portion and the suction portion. Thereby, the configuration of the device transfer head 13a can be simplified. Therefore, for example, the weight of the device transfer head 13a can be reduced. As shown in FIG. 16, the control unit 800a includes a central processing unit (CPU: Central Processing Unit) 801 and a non-volatile memory (ROM: Read-only Memory) as a memory device. 802, and a microcomputer such as a volatile memory (RAM: Random Access Memory) 803, and the processing of the IC device 90 is performed based on various data and programs stored in the memory. Various controls. In the present embodiment, the control unit 800a measures the position (height) in the vertical direction of the tray 200, and performs a tray deformation process for calculating the deformation of the tray 200 based on the measured height, and a deformation of the tray 200 calculated based on the calculated The height calculation process for calculating the height of each IC device 90 placed on the tray 200, that is, the height at which the holding unit 3 is lowered is calculated. Further, in the non-volatile memory 802, various parameters required for the tray deformation calculation processing and the height calculation processing are stored in advance. Further, in the present embodiment, in addition to the tray deformation calculation processing and the height calculation processing, the center position O of the pocket PK of the tray 200 in a plan view can be detected as will be described later. PK Center position detection processing. The control unit 800a is electrically connected to the supply X-axis motor drive circuit MXD1, the supply Y-axis motor drive circuit MYD1, and the supply Z-axis motor drive circuit MZD1. The X-axis motor drive circuit MXD1 is supplied to the X-axis motor drive circuit MX1 in response to the drive signal received from the control unit 800a, and the drive amount is calculated based on the drive signal, and is driven and supplied to the X-axis motor MX1 based on the calculated drive amount. Further, the control unit 800a inputs the rotational speed of the supplied X-axis motor MX1 detected by the supply X-axis motor encoder EMX1 via the supply X-axis motor drive circuit MXD1. Thereby, the control unit 800a grasps the position of the holding unit 3 of the device transfer head 13a in the X direction. Then, the X-axis direction of the target position such as the position of the grasp and the position above the tray 200 is obtained, and the X-axis motor MX1 is driven and controlled to move the holding unit 3 of the device transfer head 13a to the target position. The Y-axis motor drive circuit MYD1 is supplied to the drive signal received from the control unit 800a, calculates the drive amount based on the drive signal, and drives and controls the supply of the Y-axis motor MY1 based on the calculated drive amount. Further, the control unit 800a inputs the rotational speed of the Y-axis motor MY1 supplied by the Y-axis motor encoder EMY1 via the supply Y-axis motor drive circuit MYD1. Thereby, the control unit 800a grasps the position of the holding unit 3 of the device transfer head 13a in the Y direction. Then, the position of the grasped position and the Y position of the target position such as the position above the tray 200 are obtained, and the drive control is supplied to the Y-axis motor MY1 to move the holding unit 3 of the device transfer head 13a to the target position. The supply Z-axis motor drive circuit MZD1 responds to the drive signal received from the control unit 800a, calculates the drive amount based on the drive signal, and drives and controls the supply of the Z-axis motor MZ1 based on the calculated drive amount. Further, the Z-axis motor drive circuit MZD1 is supplied in synchronization with the drive control of the Z-axis motor MZ1, and the Z-axis motor brake BMZ1 is released and fastened. Further, the control unit 800a inputs the rotational speed of the supply Z-axis motor MZ1 detected by the supply of the Z-axis motor encoder EMZ1 via the supply Z-axis motor drive circuit MZD1. Thereby, the control unit 800a grasps the position (height) in the Z direction of the holding unit 3 of the device transporting head 13a, and obtains the shift in the Z direction of the target position such as the height position and the position above the tray 200, and drives the control. The Z-axis motor MZ1 is supplied to move the holding unit 3 of the device transfer head 13a to the target height position. The control unit 800a is electrically connected to the valve drive circuit 41D. The valve drive circuit 41D drives and controls the first valve 41 in response to a control signal received from the control unit 800a. Further, the first valve 41 that is driven and controlled by the control unit 800a switches whether or not the positive pressure gas is supplied to the adsorption nozzle 35 of the holding unit 32. The compressed air is ejected from the adsorption nozzle 35 when the positive pressure gas is supplied to the adsorption nozzle 35. The control unit 800a is electrically connected to the valve drive circuit 44D. The valve drive circuit 44D drives and controls the second valve 44 in response to a control signal received from the control unit 800a. Further, the second valve 44 that is driven and controlled by the control unit 800a switches the flow rate of the positive pressure gas supplied to the adsorption nozzle 35 of the holding unit 32 between the flow rate for desorption and the flow rate for height measurement. In addition, the flow rate for height measurement is the same as the flow rate for detecting the central position when the position of the pocket PK of the tray 200 is detected. The control unit 800a is electrically connected to the valve drive circuit 46D. The valve drive circuit 46D drives and controls the third valve 46 in response to a control signal received from the control unit 800a. Further, the third valve 46 that is driven and controlled by the control unit 800a switches whether or not the negative pressure is supplied to the adsorption port 351 of the holding portion 32. When the adsorption port 351 is under a negative pressure, the IC device 90 is attracted to the holding portion 32. The control unit 800a is electrically connected to the flow meter 45. A signal according to the flow rate of the gas measured by the flow meter 45 is transmitted to the control unit 800a. Thereby, the control unit 800a calculates the flow rate of the gas measured by the flow meter 45, and compares the flow rate with the predetermined proximity detection flow rate threshold TH1 (see FIG. 21), and the flow rate is less than the proximity detection flow threshold TH1. At this time, it is determined that the adsorption nozzle 35 is clogged, and the approach of the adsorption nozzle 35 to the tray 200 or the like is detected. Next, the principle of automatically measuring the height of the tray 200 and calculating the deformation thereof by the electronic component inspection device 1a (electronic component conveying device 10) will be described with reference to FIG. 14, FIG. 17, and FIG. As shown in FIGS. 14 and 17, a plurality of measurement points CP11, measurement points CP12, and measurement points CP13 for measuring the height thereof are set in advance on the tray 200. In addition, for example, when the tray 200 is deformed irregularly due to thermal expansion, the heights of the respective measurement points CP11 to CP13 may be different. That is, the height of the measurement point CP11 on the left side (the negative side in the Y direction) in the figure in FIG. 17 is the height L11, and the height of the measurement point CP12 in the vicinity of the center (near the center in the Y direction) in the drawing of FIG. 17 is the height L12, which is the height L12. The height L12 is lower than the height L11 of the measurement point CP11 by d12. Further, the height of the measurement point CP13 on the right side (the positive side in the Y direction) in the figure of FIG. 17 is the height L13, and the height L13 is higher than the height L11 of the measurement point CP11 by a difference d13. In the present embodiment, the measurement point CP11 to the measurement point CP13 are set at positions different from the pocket PK, and are preferably set, for example, on the negative side of the X direction of the tray 200 as much as possible. Further, in addition to the measurement point CP11 to the measurement point CP13, the measurement point CP21, the measurement point CP22, the measurement point CP23, the measurement point CP31, the measurement point CP32, and the measurement point CP33 are also present. The measurement point CP21 to the measurement point CP23 are preferably set, for example, at the central portion of the tray 200 in the X direction. The measurement point CP31 to the measurement point CP33 are preferably set to, for example, the positive side of the X direction of the tray 200 as much as possible. At this time, in the present embodiment, before the deformation of the tray 200 is calculated, the control unit 800a automatically measures the heights of the measurement points CP11 to CP13 of the tray 200 by the holding unit 3. Specifically, the control unit 800a causes the holding portion 32 of the holding unit 3 to be placed above the measurement point CP11 to the measurement point CP13 of the tray 200, and supplies the pressure to the adsorption nozzle 35 of the holding unit 32 to the height measurement. The gas is ejected from the adsorption nozzle 35, and the holding unit 3 is lowered. When the adsorption nozzle 35 is separated from the tray 200, for example, when the height of the upper surface of the tray 200 is set to the height H0 and the height from the upper surface of the tray 200 is set to the height H2, the height of the adsorption nozzle 35 is When the height H0 is equal to or higher than the height H2, that is, when the distance between the adsorption nozzle 35 and the tray 200 is equal to or greater than a specific distance, most of the gas supplied to the adsorption nozzle 35 is ejected from the adsorption nozzle 35 (see FIG. 21). Moreover, when the distance between the adsorption nozzle 35 and the tray 200 is equal to or less than a certain distance, for example, when the height of the adsorption nozzle 35 is lower than the height H2, the amount of gas discharged from the adsorption nozzle 35 is reduced, and the flow rate is reduced by the flow meter 45. The flow rate of the measured gas is reduced. Further, when the adsorption nozzle 35 abuts on the tray 200 to block the adsorption port 351, for example, when the height of the adsorption nozzle 35 is the height H0, gas is not ejected from the adsorption nozzle 35, and the gas is measured by the flow meter 45. The flow rate becomes "0". In other words, when the proximity detection flow rate threshold value TH1 is set to the threshold value for the proximity detection, when the height of the adsorption nozzle 35 becomes the height H1, that is, when the distance between the adsorption nozzle 35 and the tray 200 becomes "height H0 - height H1" The flow rate becomes smaller than the proximity detection flow rate threshold value TH1, and it is detected that the adsorption nozzle 35 approaches the tray 200 (see FIG. 21). Further, in the same manner, the heights of the measurement points CP21 to CP33 are also measured. In this way, the measurement point CP11 to the measurement point CP33 are detected by the change in the flow rate of the gas for the flow rate measurement without the contact pressure, and the like, and the unnecessary load on the tray 200 at the time of height measurement is reduced. Further, the holding unit 3 functions as a buffering function, that is, when the passive portion 31 receives a force stronger than the elastic force of the spring, the holding portion 32 is moved upward to absorb the error in the height direction. Therefore, if the buffer function is used, the height measured by the holding unit 32 includes an error based on the height absorbed by the buffer function, but the height can be measured by the change in the gas flow rate. Since the passive portion 31 measures the height before receiving a strong force, the accuracy of the height of the measurement can be maintained high. Further, when the measurement position is the recess PK, the height varies depending on the presence or absence of the IC device 90. However, by setting the measurement point CP11 to the measurement point CP13 at a position different from the recess PK, the height of the IC device 90 is not required. The height (deformation) of the tray 200 is measured by the influence. Next, the deformation of the tray 200 is calculated based on the results of the above measurement. Specifically, a pocket PK11 and a pocket PK12 are disposed adjacent to each other between the measurement point CP11 and the measurement point CP12. At this time, according to the height L11 of the measurement point CP11 and the height L12 of the measurement point CP12, the distance between the measurement point CP11 and the pocket PK11, the distance between the measurement point CP12 and the pocket PK12, the pocket PK11 or the pocket PK12 The height of the pocket PK11 and the pocket PK12 are calculated separately for the depth dimension and the like. Similarly, a pocket PK13 and a pocket PK14 are disposed adjacent to each other between the measurement point CP12 and the measurement point CP13. Further, the heights of the pockets PK13 and PK14 are calculated in the same manner as the heights of the pockets PK11 and PK12. Further, similarly, the heights of the pockets PK21 to PK64 can be calculated using the heights of the measurement points CP21 to CP33. As described above, in the electronic component inspection apparatus 1a (electronic component conveying apparatus 10), even if the tray 200 is deformed by thermal expansion, the pockets formed by the recesses can be detected based on the change in the flow rate of the gas ejected from the adsorption nozzle 35. The height of PK. Thereby, the height of each of the pockets PK can be detected (calculated) with high precision, and the high-accuracy adsorption of the IC device 90 housed in the recess PK can be realized. Further, as described above, the position adjustment in the X direction and the Y direction of the device transport head 13a taught before the environment in the supply region A2 is heated is also shifted after the heating state. In this case, the detection of the center position of each pocket PK of the tray 200 in a plan view is performed. PK Center position detection processing. Next, the center position detection processing will be described. Furthermore, when the center position detecting process is performed, the height of each pocket PK is calculated, so that the respective positions of the pockets PK are memorized, but the center position is not detected. PK State. As shown in FIG. 15, for example, the center position O of the detection pocket PK11 is shown. PK At this time, first, two points located on both sides in the X direction, which are separated by the pocket PK11, are referred to as a first position PS1 and a second position PS2. Further, as the first position PS1 and the second position PS2 of each of the pockets PK, the pocket PK for setting the first position PS1 and the second position PS2 and the pocket PK may be in the X direction. Any point between adjacent pockets PK. For example, in the case of the pocket PK11, the second position PS2 is preferably set to an intermediate point between the pocket PK11 and the pocket PK21. Further, when there is no recess PK adjacent to the X direction in which the pocket PK for setting the first position PS1 and the second position PS2 is set, the pocket PK to be set can be set, and The tray 200 is located at any point between the edges of the X direction. For example, in the case of the pocket PK11, the first position PS1 is preferably set to be an intermediate point between the pocket PK11 and the edge of the tray 200. Next, the adsorption nozzle 35 of the holding unit 3 is placed at the first position PS1, and the height of the adsorption nozzle 35 is set to the height H1. Then, a gas adjusted to a flow rate for detecting the center position (hereinafter referred to as "gas GS") is ejected from the adsorption nozzle 35. Thereby, the adsorption nozzle 35 functions as a discharge portion that can eject the gas GS. The adsorption nozzle 35 (holding unit 3) functioning as a discharge unit ejects the gas GS to maintain the height H1, and the first position PS1 and the second position PS2 are in the X direction, that is, the first position PS1 and the first position are connected. The line segment of the 2 position PS2 reciprocates. When the first position PS1 moves toward the second position PS2, that is, on the outward path PR1, the change in the flow rate of the gas GS detected (measured) by the flow meter 45 becomes the curve GR1 shown by the solid line in FIG. According to the curve GR1, when the adsorption nozzle 35 moves from the first position PS1 to the second position PS2, the flow rate is increased when the side wall WL1 (wall portion) of the recess PK11 on the negative side in the X direction is exceeded. . Further, according to the curve GR1, when the adsorption nozzle 35 exceeds the side wall WL2 (wall portion) of the pocket PK11 on the positive side in the X direction, the flow rate is reduced. On the other hand, when the second position PS2 moves toward the first position PS1, that is, on the return path PR2, the change in the flow rate of the gas GS detected by the flow meter 45 becomes the curve GR2 indicated by a broken line in FIG. According to the curve GR2, when the adsorption nozzle 35 moves from the second position PS2 to the first position PS1 and exceeds the side wall WL2 of the pocket PK11, the flow rate increases. Further, according to the curve GR2, when the adsorption nozzle 35 exceeds the side wall WL1 of the pocket PK11, the flow rate is reduced. As described above, in the tray 200, the side wall WL1 and the side wall WL2 of the recess PK11 having the concave portion have the following functions when the recess PK11 is located between the first position PS1 and the second position PS2. This function is a flow rate changing portion in which the flow rate of the gas GS changes as the recess PK11 formed in the recessed portion when the adsorption nozzle 35 moves between the first position PS1 and the second position PS2 as the discharge portion. Further, in the control unit 800a, as the position of the side wall WL1 of the detected flow rate changing unit, the code value of the X-axis motor encoder EMX1 supplied to the X-axis motor encoder EMX1 when the flow rate of the outward path PR1 gas GS is increased is stored. Further, as the position of the side wall WL2 of the flow rate changing unit, the code value of the X-axis motor encoder EMX1 is supplied when the flow rate of the memory return path PR2 gas GS is increased. Further, the nozzle 35 (holding unit 3) functioning as the discharge portion may intersect the line segment connecting the first position PS1 and the second position PS2, that is, in the direction (Y direction) of the line segment orthogonal to the present embodiment. Reciprocating (moving). In addition, the position which is the starting point and the end point of the reciprocating movement, that is, the position corresponding to the first position PS1 is referred to as "third position PS3", and the position of the folding point, that is, the position corresponding to the second position PS2 is referred to as "the 4 position PS4". Further, when the third position PS3 moves toward the fourth position PS4, that is, when the path is removed, the flow rate of the gas GS detected by the flow meter 45 becomes a curve GR3 indicated by a solid line in FIG. According to the curve GR3, when the adsorption nozzle 35 moves from the third position PS3 to the fourth position PS4 and exceeds the side wall WL3 of the recess PK11 on the negative side in the Y direction, the flow rate is increased. Further, as is clear from the curve GR3, when the adsorption nozzle 35 exceeds the side wall WL4 of the pocket PK11 on the positive side in the Y direction, the flow rate is reduced. On the other hand, when the fourth position PS4 moves toward the third position PS3, that is, when it returns to the road, the change in the flow rate of the gas GS detected by the flow meter 45 becomes the curve GR4 indicated by a broken line in FIG. According to the curve GR4, when the adsorption nozzle 35 moves from the fourth position PS4 to the third position PS3 and exceeds the side wall WL4 of the pocket PK11, the flow rate increases. Further, as is clear from the curve GR4, when the adsorption nozzle 35 exceeds the side wall WL3 of the pocket PK11, the flow rate is reduced. As described above, in the tray 200, the side wall WL3 and the side wall WL4 of the recess PK11 formed of the concave portion also become the flow rate changing portion in which the flow rate of the gas GS changes. Further, in the control unit 800a, as the position of the side wall WL3 of the flow rate changing unit, the code value of the Y-axis motor encoder EMY1 supplied to the Y-axis motor encoder EMY1 when the flow rate of the outward gas GS is increased is stored. Further, as the position of the side wall WL4 of the flow rate changing portion, the code value of the Y-axis motor encoder EMY1 is supplied when the flow rate of the return return gas GS is increased. Further, the control unit 800a calculates (calculates) a position in which the position of the side wall WL1 and the position of the side wall WL2 are equally divided into two, and the position of the side wall WL3 and the position of the side wall WL4 are equally divided into two, and the memory is calculated. Calculated position as the center position of the pocket PK11 PK . Further, in the control unit 800a, the center position O of the remaining pockets PK (PK12 to PK64) excluding the pocket PK11 PK It can also be detected and memorized in the same way. As described above, the control unit 800a also has a function as a center position detecting unit that detects the flow rate changing unit and detects the center position O of the pocket PK11 formed by the recess based on the detected flow rate changing unit. PK . Further, in the electronic component inspection apparatus 1a (electronic component conveying apparatus 10), the center position O of the pocket PK11 can be detected by PK The height of the detecting pocket PK11 is complementary, and when the IC device 90 housed in the recess PK11 is held by the adsorption, the IC device 90 is oriented toward the center position O. PK The corresponding portion presses the adsorption nozzle 35. By maintaining the suction state, the suction nozzle 35 generates an attractive force, and the holding operation of the IC device 90 can be performed with high precision. Further, as described above, the adsorption nozzle 35 functioning as the discharge portion can reciprocate (move) in the direction (X direction) connecting the line segment of the first position PS1 and the second position PS2, and can also cross the line segment. The direction of the line segment (Y direction) reciprocates (moves). Thereby, the center position O is performed by moving only in the X direction or the Y direction. PK The detection situation, or only the way to the center position O PK Center position O can be performed with high precision compared to the case of detection PK Detection. Furthermore, the central location O PK In the configuration shown in FIG. 15, the IC device 90 is housed in the recess PK11. However, the present invention is not limited thereto, and the IC device 90 may not be stored in the recess PK11. The center position detecting process as described above is particularly effective when the electronic component, that is, the IC device 90, has a rectangular shape with one side of 5 mm or less in plan view. The reason for this is that the holding of such a small IC device 90 is significantly affected by the heating state of the environment in the supply region A2 (the IC device 90 cannot be held). As shown in FIG. 19, in the electronic component inspection device 1a (electronic component conveying device 10), a menu 302 for selecting the size of the IC device 90 is displayed on the display screen 301 of the monitor 300. In the menu 302, a message 304 indicating the IC device 90, a message 304 indicating that one side of the IC device 90 exceeds 5 mm, a button 305 indicating the message 304, an icon 306 indicating the IC device 90, and the IC device 90 are included. A message 307 with a side exceeding 5 mm and a button 308 indicating a message 307. Moreover, in the case of operating the button 308, the center position detecting process is performed. Further, as shown in FIG. 20, during the execution of the center position detection processing, a message 309 "When the center position detection processing is being executed" is displayed on the display screen 301 of the monitor 300. Further, in the electronic component inspection device 1a (electronic component conveying device 10), the center position detection processing (hereinafter referred to as "first center position detection processing") may be performed on all the pockets PK of the tray 200. The center position of all the pockets PK PK Detection. However, the center position of all the pockets PK can be performed by the processing described below (hereinafter referred to as "second center position detecting processing"). PK Detection. The second center position detecting process will be described with reference to Fig. 18 . Further, in the tray 200, the pits PK adjacent in the X direction are spaced apart from each other (distance between the pitches) PC X The distance between the pockets PK adjacent to the Y direction (the distance between the pitches) PC Y It is known in advance (for example, as indicated in the specification regarding the tray 200). In the tray 200 on which the mounting portion of the IC device 90 is placed, at least three pockets PK are formed in the X direction (one direction), that is, six in the present embodiment (the pocket PK11, the pocket) PK21, pocket PK31, pocket PK41, pocket PK51, pocket PK61). Further, when the second center position detecting process is performed, the control unit 800a, which is the center position detecting unit, first performs the first center position detecting process, and detects the two pockets PK, which are recessed portions, which are the most separated sides, that is, the pockets. Center position of PK11 and pocket PK61 PK . Next, calculate the center position of the coupling pocket PK11. PK Center position with the pocket PK61 O PK The line segment and the angle formed by the X direction X . Thereby, the center position O of the recess PK (the recess PK21, the recess PK31, the recess PK41, the recess PK51) formed by the recess between the pocket PK11 and the recess PK61 can be detected. PK . For example, the center position of the pocket PK21 PK It is detected as the center position of the self-cavity PK11. PK Move the "interval PC" to the positive side of the X direction X "Quantity, and move to the positive side of the Y direction" (interval PC X )×(tanθ X )" The location of the quantity. Further, in the tray 200 on which the mounting portion of the IC device 90 is placed, at least three pockets PK are arranged in the Y direction (one direction), that is, four in the present embodiment (the pocket PK11, the pocket PK12, Pocket PK13, pocket PK14). Further, when the second center position detecting process is performed, the control unit 800a first performs the first center position detecting process, and detects the center positions of the two pockets PK on both sides, that is, the pocket PK11 and the pocket PK14. O PK . Next, calculate the center position of the coupling pocket PK11. PK Center position with the pocket PK14 O PK The angle between the line segment and the Y direction Y . Thereby, the center position O of the pocket PK (the pocket PK12, the pocket PK13) between the pocket PK11 and the pocket PK14 can be detected. PK . For example, the center position of the pocket PK12 PK It is detected as the center position of the self-cavity PK11. PK Move the "interval PC" to the positive side of the Y direction Y "Quantity, move to the positive side of the X direction" (interval PC Y )×(tanθ Y )" The location of the quantity. Also, for the rest of the other pockets PK center position O PK It can also be detected by the second center position detecting process. In the second center position detecting process, when detecting the center position of all the pockets PK of the tray 200, for example, the center position of each pocket PK is detected one by one. PK In contrast, the processing can be performed promptly, that is, the time taken for the detection processing is shortened. Further, the temperature adjustment unit 12a or the device supply unit 14a, which is a mounting portion on which the IC device 90 is placed, is also formed with a recess in which the IC device 90 can be housed one by one. Moreover, the center position of the pockets may also be centered with the center of the pocket PK of the tray 200. PK Similarly, it is detected by the first center position detecting process or the second center position detecting process. Next, a flow chart after the electronic component inspection device 1a (electronic component conveying device 10) operates on the button 308 of the menu 302 displayed on the display screen 301 of the monitor 300 until the transfer of the IC device 90 is started will be described with reference to FIG. Further, it is preferable to refer to FIG. 18. First, the pocket PK11, the pocket PK61, and the pocket PK14 of the tray 200 are subjected to height calculation processing, and the heights of the pocket PK11, the pocket PK61, and the pocket PK14 are detected (calculated) (step S401). The information of the detected height is stored in the control unit 800a. Next, the first center position detecting process is applied to the pocket PK11, the pocket PK61, and the pocket PK14 of the tray 200, and the center positions O of the pocket PK11, the pocket PK61, and the pocket PK14 are detected. PK (Step S402). Center position of the test O PK The information is stored in the control unit 800a. Next, the center position O of the coupling pocket PK11 is calculated by the second center position detecting process. PK Center position with the pocket PK61 O PK The angle between the line segment and the X direction X And calculate the center position of the connection pocket PK11. PK Center position with the pocket PK14 O PK The angle between the line segment and the Y direction Y (Step S403). Next, as described above, the center position O of the remaining pocket PK other than the pocket PK11, the pocket PK61, and the pocket PK14 of the tray 200 is detected. PK (Step S404). Center position of the test O PK The information is stored in the control unit 800a. Next, the temperature adjustment unit 12a detects the center position of each of the pockets of the temperature adjustment unit 12a in the same manner as in the case of the tray 200, that is, in the same manner as in the steps S401 to S404. Step S405, step S406, step S407, and step S408. Information such as the center position detected in steps S405 to S408 is stored in the control unit 800a. Next, the device supply unit 14a detects the center position of each pocket of the device supply unit 14a in the same manner as in the case of the tray 200, that is, in the same manner as in the steps S401 to S404, that is, sequentially. Step S409, step S410, step S411, and step S412. Information such as the center position detected in steps S409 to S412 is stored in the control unit 800a. By the steps S401 to S412 as above, the center position O of all the pockets PK of the tray 200 can be detected. PK The center position of all the pockets of each temperature adjusting portion 12a and the center position of all the pockets of the respective component supply portions 14a. When the transfer of the IC device 90 is started, the adsorption nozzle 35 of the device transfer head 13a faces the center position O of the IC device 90 to be held, for example, when the IC device 90 on the tray 200 is to be held. PK The corresponding portion is pressed with high precision each time. Thereby, the holding operation of the IC device 90 can be performed with high precision. This point is also the same when each IC device 90 on the temperature adjustment portion 12a is to be held, and is also the same when the IC device 90 on the device supply portion 14a is to be held. Thereby, the transfer of the IC device 90 can be continued without interruption in the middle. That is, it is possible to prevent the phenomenon (clamping) in which the IC device 90 cannot be held in the transfer of the IC device. In addition, when the first center position detecting process or the second center position detecting process is not performed, the jamming rate is 1/500 to 1/50 (the denominator is the number of transports of the IC device 90). However, when the first center position detecting process or the second center position detecting process is performed, the occurrence rate of the jam can be suppressed to 1/200000 to 1/10000 (the denominator is the number of transports of the IC device 90). Further, it is preferable that the display screen 301 of the monitor 300 displays the generation rate of the jam. Further, steps S401 to S412 may be performed on the tray 200 piece by piece or on each of the plurality of stacked trays 200. Further, steps S401 to S412 may be performed every time a specific time elapses or a specific number of IC devices 90 are transferred. Although the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention have been described above based on the embodiments shown in the drawings, the present invention is not limited thereto, and the configuration of each unit may be replaced by any one having the same function. Further, any other constituents may be added. Furthermore, the present invention may be a combination of any two or more of the above-described respective embodiments. In addition, as a method of the dual device detection (device residue detection) other than the methods of the first to third embodiments and the prior art, the following methods (1) to (5) are exemplified. (1) The height of the bottom surface of the holding portion is obtained by the laser displacement sensor, and based on the result, foreign matter detection (determination of the presence or absence of the IC device) is performed. (2) The holding unit is photographed by an electronic camera such as a CCD camera, and foreign matter detection is performed based on the obtained image data. (3) Foreign matter detection by proximity sensor. (4) The reaction force at the time of pressing the device transfer head 17 is detected, and foreign matter detection is performed based on the result. (5) The light is passed through a hole provided in the holding portion, the light is detected, and foreign matter detection is performed based on the result. Further, in the fourth embodiment, the IC device is rectangular in plan view, but is not limited thereto, and may be, for example, a circular shape or an elliptical shape.

1‧‧‧檢查裝置(電子零件檢查裝置)
1a‧‧‧電子零件檢查裝置
3‧‧‧固持單元
4‧‧‧近接檢測裝置
10‧‧‧電子零件搬送裝置
11A‧‧‧托盤搬送機構
11B‧‧‧托盤搬送機構
12‧‧‧溫度調整部
12a‧‧‧溫度調整部
13‧‧‧器件搬送頭
13a‧‧‧器件搬送頭
14‧‧‧器件供給部
14a‧‧‧器件供給部
15‧‧‧托盤搬送機構
16‧‧‧檢查部
16a‧‧‧檢查部
17‧‧‧器件搬送頭
17a‧‧‧器件搬送頭
18‧‧‧器件回收部
18a‧‧‧器件回收部
19‧‧‧回收用托盤
20‧‧‧器件搬送頭
20a‧‧‧器件搬送頭
21‧‧‧托盤搬送機構
22A‧‧‧托盤搬送機構
22B‧‧‧托盤搬送機構
23‧‧‧連結部
30‧‧‧支持部
31‧‧‧被動部
32‧‧‧固持部
35‧‧‧吸附噴嘴
39‧‧‧正壓電路
41‧‧‧第1閥門
41D‧‧‧閥門驅動電路
43‧‧‧蜂鳴器
44‧‧‧第2閥門
44D‧‧‧閥門驅動電路
45‧‧‧流量計
46‧‧‧第3閥門
46D‧‧‧閥門驅動電路
47‧‧‧負壓產生器
48‧‧‧過濾器
51‧‧‧壓力感測器
52‧‧‧噴射器
61‧‧‧第1隔壁
62‧‧‧第2隔壁
63‧‧‧第3隔壁
64‧‧‧第4隔壁
65‧‧‧第5隔壁
70‧‧‧前罩
71‧‧‧側罩
72‧‧‧側罩
73‧‧‧後罩
74‧‧‧頂罩
90‧‧‧IC器件
100‧‧‧托盤(載置構件)
130‧‧‧基部
131‧‧‧手單元
141‧‧‧凹部(凹穴)
161‧‧‧保持部
162‧‧‧底部
175‧‧‧手單元
176‧‧‧吸附噴嘴
177‧‧‧流路
181‧‧‧凹部(凹穴)
200‧‧‧托盤
201‧‧‧手單元
231‧‧‧第1隔壁
232‧‧‧第2隔壁
233‧‧‧第3隔壁
234‧‧‧第4隔壁
235‧‧‧第5隔壁
241‧‧‧前罩
242‧‧‧側罩
243‧‧‧側罩
244‧‧‧後罩
245‧‧‧頂罩
300‧‧‧監視器
301‧‧‧顯示畫面
302‧‧‧選單
303‧‧‧圖標
304‧‧‧訊息
305‧‧‧按鈕
306‧‧‧圖標
307‧‧‧訊息
308‧‧‧按鈕
309‧‧‧訊息
321‧‧‧空氣通道
322‧‧‧外筒部
323‧‧‧凸部
351‧‧‧吸附口
341‧‧‧空氣配管
342‧‧‧空氣配管
400‧‧‧信號燈
491~495‧‧‧配管
500‧‧‧揚聲器
600‧‧‧滑鼠台
621‧‧‧開口部
622‧‧‧開口部
631‧‧‧開口部
632‧‧‧開口部
700‧‧‧操作面板
800‧‧‧控制部
800a‧‧‧控制部
801‧‧‧中央運算處理裝置(CPU)
802‧‧‧非揮發性記憶體(ROM)
803‧‧‧揮發性記憶體(RAM)
810‧‧‧記憶部
A1‧‧‧托盤供給區域
A2‧‧‧器件供給區域(供給區域)
A3‧‧‧檢查區域
A4‧‧‧器件回收區域(回收區域)
A5‧‧‧托盤去除區域
BMZ1‧‧‧供給Z軸馬達制動器
CP11~CP13‧‧‧測定點
CP21~CP23‧‧‧測定點
CP31~CP33‧‧‧測定點
d12‧‧‧差
d13‧‧‧差
EMX1‧‧‧供給X軸馬達編碼器
EMY1‧‧‧供給Y軸馬達編碼器
EMZ1‧‧‧供給Z軸馬達編碼器
GR1~GR4‧‧‧曲線圖
GS‧‧‧氣體
H0‧‧‧高度
H1‧‧‧高度
H2‧‧‧高度
L‧‧‧距離
L11~L13‧‧‧高度
MXD1‧‧‧供給X軸馬達驅動電路
MYD1‧‧‧供給Y軸馬達驅動電路
MZD1‧‧‧供給Z軸馬達驅動電路
MX1‧‧‧供給X軸馬達
MY1‧‧‧供給Y軸馬達
MZ1‧‧‧供給Z軸馬達
OPK‧‧‧中心位置
PCX‧‧‧間隔
PCY‧‧‧間隔
PK‧‧‧凹穴
PK11~PK14‧‧‧凹穴
PK21~PK24‧‧‧凹穴
PK31~PK34‧‧‧凹穴
PK41~PK44‧‧‧凹穴
PK51~PK54‧‧‧凹穴
PK61~PK64‧‧‧凹穴
PR1‧‧‧去路
PR2‧‧‧返路
PS1‧‧‧第1位置
PS2‧‧‧第2位置
PS3‧‧‧第3位置
PS4‧‧‧第4位置
S101~S106‧‧‧步驟
S201~S210‧‧‧步驟
S301~S312‧‧‧步驟
S401~S412‧‧‧步驟
TH1‧‧‧近接檢測用流量閾值
WL1~WL4‧‧‧側壁
X‧‧‧方向
Y‧‧‧方向
Z‧‧‧方向
α11A‧‧‧箭頭
α11B‧‧‧箭頭
α13X‧‧‧箭頭
α13Y‧‧‧箭頭
α14‧‧‧箭頭
α15‧‧‧箭頭
α17Y‧‧‧箭頭
α18‧‧‧箭頭
α20X‧‧‧箭頭
α20Y‧‧‧箭頭
α21‧‧‧箭頭
α22A‧‧‧箭頭
α22B‧‧‧箭頭
α90‧‧‧箭頭
θX‧‧‧角度
θY‧‧‧角度
1‧‧‧Inspection device (electronic parts inspection device)
1a‧‧‧Electronic parts inspection device
3‧‧‧ Holding unit
4‧‧‧ proximity detection device
10‧‧‧Electronic parts conveying device
11A‧‧‧Tray transport mechanism
11B‧‧‧Tray transport mechanism
12‧‧‧ Temperature Adjustment Department
12a‧‧‧Temperature Adjustment Department
13‧‧‧Device Transfer Head
13a‧‧‧Device transfer head
14‧‧‧Device Supply Department
14a‧‧‧Device Supply Department
15‧‧‧Tray transport mechanism
16‧‧‧Inspection Department
16a‧‧‧Inspection Department
17‧‧‧Device transfer head
17a‧‧‧Device transfer head
18‧‧‧Device Recycling Department
18a‧‧‧Device Recycling Department
19‧‧‧Recycling tray
20‧‧‧Device Transfer Head
20a‧‧‧Device transfer head
21‧‧‧Tray transport mechanism
22A‧‧‧Tray transport mechanism
22B‧‧‧Tray transport mechanism
23‧‧‧Connecting Department
30‧‧‧Support Department
31‧‧‧ Passive Department
32‧‧‧ Holding Department
35‧‧‧Adsorption nozzle
39‧‧‧ positive voltage circuit
41‧‧‧1st valve
41D‧‧‧Valve drive circuit
43‧‧‧ buzzer
44‧‧‧2nd valve
44D‧‧‧Valve drive circuit
45‧‧‧ flowmeter
46‧‧‧3rd valve
46D‧‧‧Valve drive circuit
47‧‧‧Negative pressure generator
48‧‧‧Filter
51‧‧‧ Pressure Sensor
52‧‧‧Injector
61‧‧‧1st next door
62‧‧‧2nd next door
63‧‧‧3rd next door
64‧‧‧4th next door
65‧‧‧5th next door
70‧‧‧ front cover
71‧‧‧ side cover
72‧‧‧ side cover
73‧‧‧back cover
74‧‧‧ top cover
90‧‧‧IC devices
100‧‧‧Tray (placement member)
130‧‧‧ base
131‧‧‧Hand unit
141‧‧‧ recess (dent)
161‧‧‧ Keeping Department
162‧‧‧ bottom
175‧‧‧Hand unit
176‧‧‧Adsorption nozzle
177‧‧‧flow path
181‧‧‧ recess (dent)
200‧‧‧Tray
201‧‧‧Hand unit
231‧‧‧1st next door
232‧‧‧2nd next door
233‧‧‧3rd next door
234‧‧‧4th next door
235‧‧‧5th next door
241‧‧‧ front cover
242‧‧‧ side cover
243‧‧‧ side cover
244‧‧‧back cover
245‧‧‧ top cover
300‧‧‧ monitor
301‧‧‧Display screen
302‧‧‧ menu
303‧‧‧ icon
304‧‧‧Information
305‧‧‧ button
306‧‧‧ icon
307‧‧‧Information
308‧‧‧ button
309‧‧‧Information
321‧‧‧Air passage
322‧‧‧Outer tube
323‧‧‧ convex
351‧‧ ‧ adsorption port
341‧‧‧Air piping
342‧‧‧Air piping
400‧‧‧Signal lights
491~495‧‧‧Pipe
500‧‧‧Speakers
600‧‧‧mouse table
621‧‧‧ openings
622‧‧‧ openings
631‧‧‧ openings
632‧‧‧ openings
700‧‧‧Operator panel
800‧‧‧Control Department
800a‧‧‧Control Department
801‧‧‧Central Processing Unit (CPU)
802‧‧‧ Non-volatile memory (ROM)
803‧‧‧Volatile Memory (RAM)
810‧‧‧Memory Department
A1‧‧‧Tray supply area
A2‧‧‧Device supply area (supply area)
A3‧‧‧ inspection area
A4‧‧‧Device recycling area (recycling area)
A5‧‧‧Tray removal area
BMZ1‧‧‧Supply Z-axis motor brake
CP11~CP13‧‧‧measuring point
CP21~CP23‧‧‧ measuring point
CP31~CP33‧‧‧ measuring point
d12‧‧‧Poor
D13‧‧‧Poor
EMX1‧‧‧Supply X-axis motor encoder
EMY1‧‧‧ supply Y-axis motor encoder
EMZ1‧‧‧Supply Z-axis motor encoder
GR1~GR4‧‧‧Graph
GS‧‧ gas
H0‧‧‧ Height
H1‧‧‧ Height
H2‧‧‧ Height
L‧‧‧ distance
L11~L13‧‧‧ Height
MXD1‧‧‧Supply X-axis motor drive circuit
MYD1‧‧‧Supply Y-axis motor drive circuit
MZD1‧‧‧Supply Z-axis motor drive circuit
MX1‧‧‧ supply X-axis motor
MY1‧‧‧ supply Y-axis motor
MZ1‧‧‧ supply Z-axis motor
O PK ‧‧‧ central location
PC X ‧‧‧ interval
PC Y ‧‧‧ interval
PK‧‧‧ pocket
PK11~PK14‧‧‧ recess
PK21~PK24‧‧‧ recess
PK31~PK34‧‧‧ recess
PK41~PK44‧‧‧ recess
PK51~PK54‧‧‧ recess
PK61~PK64‧‧‧ recess
PR1‧‧‧Going the way
PR2‧‧‧Return
PS1‧‧‧1st position
PS2‧‧‧2nd position
PS3‧‧‧3rd position
PS4‧‧‧4th position
S101~S106‧‧‧Steps
S201~S210‧‧‧Steps
S301 ~ S312‧‧‧ steps
S401~S412‧‧‧Steps
TH1‧‧‧ Near detection flow threshold
WL1~WL4‧‧‧ sidewall
X‧‧‧ direction
Y‧‧‧ direction
Z‧‧‧ Direction α 11A ‧‧‧Arrow α 11B ‧‧‧Arrow α 13X ‧‧‧Arrow α 13Y ‧‧‧Arrow α 14 ‧‧‧Arrow α 15 ‧‧‧Arrow α 17Y ‧‧‧Arrow α 18 ‧ ‧‧ arrow α 20X ‧‧‧ arrow α 20Y ‧‧‧ arrow α 21 ‧‧‧ arrow α 22A ‧‧‧ arrow α 22B ‧‧‧ arrow α 90 ‧‧‧ arrow θ X ‧‧‧ angle θ Y ‧‧‧ angle

圖1係自正面側觀察本發明之電子零件檢查裝置之第1實施形態之概略立體圖。 圖2係表示圖1所示之電子零件檢查裝置之動作狀態之概略俯視圖。 圖3係圖1所示之電子零件檢查裝置之方塊圖。 圖4係用以說明圖1所示之電子零件檢查裝置之設定吸附確認高度時之動作之圖。 圖5係用以說明圖1所示之電子零件檢查裝置之設定吸附確認高度時之動作之圖。 圖6係表示圖1所示之電子零件檢查裝置之控制動作之流程圖。 圖7係用以說明於本發明之電子零件檢查裝置之第2實施形態中,設定吸附確認高度時之動作之圖。 圖8係用以說明於本發明之電子零件檢查裝置之第2實施形態中,設定吸附確認高度時之動作之圖。 圖9係表示本發明之電子零件檢查裝置之第2實施形態之控制動作之流程圖。 圖10係表示本發明之電子零件檢查裝置之第3實施形態之控制動作之流程圖。 圖11係自正面側觀察本發明之電子零件檢查裝置之實施形態之概略立體圖。 圖12係表示圖11所示之電子零件檢查裝置之動作狀態之概略俯視圖。 圖13係設置於圖12中之器件供給區域之器件搬送頭之立體圖。 圖14係表示設置於圖12中之器件供給區域之器件搬送頭與托盤之位置關係之立體圖。 圖15係表示設置於圖12中之器件供給區域之器件搬送頭與托盤之位置關係之垂直剖視圖。 圖16係圖11所示之電子零件檢查裝置之主要部分之方塊圖。 圖17係用於對圖12中之器件供給區域之托盤之高度之測定進行說明之垂直剖視圖。 圖18係圖12中之器件供給區域之托盤之俯視圖。 圖19係選擇於圖11所示之電子零件檢查裝置搬送之IC器件之大小之畫面之一例。 圖20係圖11所示之電子零件檢查裝置之顯示動作狀態之畫面之一例。 圖21係表示圖12中之器件供給區域之器件搬送頭(固持部)之高度、與自器件搬送頭噴出之氣體之流量之關係之曲線圖。 圖22係表示圖12中之器件供給區域之托盤上之器件搬送頭(固持部)之X方向之位置、與自器件搬送頭噴出之氣體之流量之關係之曲線圖。 圖23係表示圖12中之器件供給區域之托盤上之器件搬送頭(固持部)之Y方向之位置、與自器件搬送頭噴出之氣體之流量之關係之曲線圖。 圖24係於圖11所示之電子零件檢查裝置開始IC器件之搬送之前之流程圖。Fig. 1 is a schematic perspective view showing a first embodiment of the electronic component inspection device of the present invention as seen from the front side. Fig. 2 is a schematic plan view showing an operation state of the electronic component inspection device shown in Fig. 1; Figure 3 is a block diagram of the electronic component inspection apparatus shown in Figure 1. Fig. 4 is a view for explaining an operation when the height of the electronic component inspection device shown in Fig. 1 is set to confirm the height. Fig. 5 is a view for explaining an operation of setting an adsorption confirmation height of the electronic component inspection device shown in Fig. 1. Fig. 6 is a flow chart showing the control operation of the electronic component inspection device shown in Fig. 1. FIG. 7 is a view for explaining an operation when the suction confirmation height is set in the second embodiment of the electronic component inspection device according to the present invention. FIG. 8 is a view for explaining an operation when the suction confirmation height is set in the second embodiment of the electronic component inspection device according to the present invention. Fig. 9 is a flow chart showing the control operation of the second embodiment of the electronic component inspection device of the present invention. Fig. 10 is a flow chart showing the control operation of the third embodiment of the electronic component inspection device of the present invention. Fig. 11 is a schematic perspective view showing an embodiment of the electronic component inspection device of the present invention as seen from the front side. Fig. 12 is a schematic plan view showing an operation state of the electronic component inspection device shown in Fig. 11; Figure 13 is a perspective view of the device transport head disposed in the device supply region of Figure 12; Fig. 14 is a perspective view showing the positional relationship between the device transfer head and the tray provided in the device supply region of Fig. 12. Figure 15 is a vertical cross-sectional view showing the positional relationship between the device transfer head and the tray provided in the device supply region of Figure 12; Fig. 16 is a block diagram showing the main part of the electronic component inspection apparatus shown in Fig. 11. Figure 17 is a vertical cross-sectional view for explaining the measurement of the height of the tray of the device supply region in Figure 12 . Figure 18 is a top plan view of the tray of the device supply area of Figure 12. Fig. 19 is an example of a screen for selecting the size of the IC device to be transported by the electronic component inspection device shown in Fig. 11. Fig. 20 is a view showing an example of a screen showing the display operation state of the electronic component inspection device shown in Fig. 11. Fig. 21 is a graph showing the relationship between the height of the device transfer head (holding portion) in the device supply region of Fig. 12 and the flow rate of the gas ejected from the device transfer head. Fig. 22 is a graph showing the relationship between the position of the device transfer head (holding portion) on the tray in the device supply region of Fig. 12 in the X direction and the flow rate of the gas ejected from the device transfer head. Fig. 23 is a graph showing the relationship between the position of the device transfer head (holding portion) on the tray in the device supply region of Fig. 12 in the Y direction and the flow rate of the gas ejected from the device transfer head. Fig. 24 is a flow chart before the electronic component inspection apparatus shown in Fig. 11 starts the transfer of the IC device.

1‧‧‧檢查裝置(電子零件檢查裝置) 1‧‧‧Inspection device (electronic parts inspection device)

61‧‧‧第1隔壁 61‧‧‧1st next door

64‧‧‧第4隔壁 64‧‧‧4th next door

70‧‧‧前罩 70‧‧‧ front cover

71‧‧‧側罩 71‧‧‧ side cover

72‧‧‧側罩 72‧‧‧ side cover

73‧‧‧後罩 73‧‧‧back cover

74‧‧‧頂罩 74‧‧‧ top cover

300‧‧‧監視器 300‧‧‧ monitor

301‧‧‧顯示畫面 301‧‧‧Display screen

400‧‧‧信號燈 400‧‧‧Signal lights

500‧‧‧揚聲器 500‧‧‧Speakers

600‧‧‧滑鼠台 600‧‧‧mouse table

700‧‧‧操作面板 700‧‧‧Operator panel

800‧‧‧控制部 800‧‧‧Control Department

A1‧‧‧托盤供給區域 A1‧‧‧Tray supply area

A4‧‧‧器件回收區域(回收區域) A4‧‧‧Device recycling area (recycling area)

A5‧‧‧托盤去除區域 A5‧‧‧Tray removal area

X‧‧‧方向 X‧‧‧ direction

Y‧‧‧方向 Y‧‧‧ direction

Z‧‧‧方向 Z‧‧‧ direction

Claims (13)

一種電子零件搬送裝置,其特徵在於具備: 負壓產生部,其產生負壓; 固持部,其可藉由上述負壓產生部之作動而固持電子零件; 流路,其配置於上述負壓產生部與上述固持部之間,且可通過流體; 載置部,其載置上述電子零件;及 檢測部,其檢測上述流路內之壓力;且 使上述固持部相對於上述載置部移動至第1基準高度, 藉由上述檢測部而檢測上述壓力,且 根據上述檢測部之檢測結果而使上述固持部相對於上述載置部靠近或離開, 將藉由上述檢測部檢測之上述壓力發生變化之前之上述固持部相對於上述載置部之特定高度設為第2基準高度。An electronic component conveying apparatus comprising: a negative pressure generating unit that generates a negative pressure; a retaining portion that holds an electronic component by actuation of the negative pressure generating unit; and a flow path that is disposed in the negative pressure generation Between the portion and the holding portion, a fluid is passed through; the mounting portion mounts the electronic component; and the detecting portion detects a pressure in the flow path; and moves the holding portion to the mounting portion to The first reference height detects the pressure by the detecting unit, and the holding portion is moved closer to or away from the placing portion based on the detection result of the detecting portion, and the pressure detected by the detecting portion is changed. The specific height of the aforementioned holding portion with respect to the mounting portion is set to be the second reference height. 如請求項1之電子零件搬送裝置,其中使上述固持部相對於上述載置部階段性地靠近或離開。The electronic component transport apparatus of claim 1, wherein the holding portion is brought closer to or away from the loading portion. 如請求項2之電子零件搬送裝置,其中使上述固持部相對於上述載置部靠近或離開之距離係於每1階段為0.01 mm以上、1 mm以下。The electronic component conveying apparatus according to claim 2, wherein the distance between the holding portion and the holding portion is 0.01 mm or more and 1 mm or less per step. 如請求項2或3之電子零件搬送裝置,其中每當使上述固持部相對於上述載置部階段性地靠近或離開時,藉由上述檢測部檢測上述壓力。The electronic component transport apparatus according to claim 2 or 3, wherein the pressure is detected by the detecting unit each time the holding portion is brought closer to or away from the mounting portion. 如請求項1至4中任一項之電子零件搬送裝置,其中將藉由上述檢測部檢測之上述壓力發生變化時之上述固持部相對於上述載置部之高度設為上述第2基準高度。The electronic component conveying apparatus according to any one of claims 1 to 4, wherein a height of the holding portion with respect to the mounting portion when the pressure detected by the detecting portion is changed is the second reference height. 如請求項1至5中任一項之電子零件搬送裝置,其中上述第1基準高度係與上述載置部之底部相同之高度。The electronic component transport apparatus according to any one of claims 1 to 5, wherein the first reference height is the same height as a bottom of the mounting portion. 如請求項1至4中任一項之電子零件搬送裝置,其中於藉由上述檢測部檢測之上述壓力發生變化之情形時,將前一次之檢測上述壓力時之上述固持部相對於上述載置部之高度設為上述第2基準高度。The electronic component conveying apparatus according to any one of claims 1 to 4, wherein, when the pressure detected by the detecting unit changes, the holding portion when the pressure is detected the previous time is relative to the loading The height of the portion is set to the second reference height. 如請求項1至4、7中任一項之電子零件搬送裝置,其中上述第1基準高度係自上述載置部之底部離開特定距離之位置之高度。The electronic component conveying apparatus according to any one of claims 1 to 4, wherein the first reference height is a height from a position of a bottom of the mounting portion by a predetermined distance. 如請求項8之電子零件搬送裝置,其中上述特定距離係1 mm以上且10 mm以下。The electronic component transport apparatus of claim 8, wherein the specific distance is 1 mm or more and 10 mm or less. 如請求項1至9中任一項之電子零件搬送裝置,其中上述第2基準高度之資訊係用於檢測於上述載置部有無上述電子零件。The electronic component transporting apparatus according to any one of claims 1 to 9, wherein the information of the second reference height is used to detect presence or absence of the electronic component in the mounting portion. 如請求項1至10中任一項之電子零件搬送裝置,其中上述載置部係於上述電子零件之檢查中保持上述電子零件之保持部。The electronic component transporting apparatus according to any one of claims 1 to 10, wherein the mounting portion holds the holding portion of the electronic component during inspection of the electronic component. 如請求項1至11中任一項之電子零件搬送裝置,其包含顯示上述第2基準高度之顯示部。The electronic component transport apparatus according to any one of claims 1 to 11, comprising a display unit that displays the second reference height. 一種電子零件檢查裝置,其特徵在於具備: 負壓產生部,其產生負壓; 固持部,其可藉由上述負壓產生部之作動而固持電子零件; 流路,其配置於上述負壓產生部與上述固持部之間,且可通過流體; 載置部,其載置上述電子零件; 檢測部,其檢測上述流路內之壓力;及 檢查部,其檢查上述電子零件;且 使上述固持部相對於上述載置部移動至第1基準高度, 藉由上述檢測部而檢測上述壓力,且 根據上述檢測部之檢測結果而使上述固持部相對於上述載置部靠近或離開, 將藉由上述檢測部檢測之上述壓力發生變化之前之上述固持部相對於上述載置部之特定高度設為第2基準高度。An electronic component inspection apparatus comprising: a negative pressure generating portion that generates a negative pressure; a retaining portion that holds an electronic component by actuation of the negative pressure generating portion; and a flow path that is disposed in the negative pressure generating Between the portion and the holding portion, a fluid is passed through; the mounting portion mounts the electronic component; the detecting portion detects a pressure in the flow path; and the inspection portion checks the electronic component; and holds the electronic component The portion moves to the first reference height with respect to the mounting portion, and the pressure is detected by the detecting portion, and the holding portion is moved closer to or away from the placing portion based on the detection result of the detecting portion, The specific height of the holding portion before the change in the pressure detected by the detecting unit with respect to the placing portion is set to a second reference height.
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