TW201613069A - Light emitting module - Google Patents

Light emitting module

Info

Publication number
TW201613069A
TW201613069A TW103132830A TW103132830A TW201613069A TW 201613069 A TW201613069 A TW 201613069A TW 103132830 A TW103132830 A TW 103132830A TW 103132830 A TW103132830 A TW 103132830A TW 201613069 A TW201613069 A TW 201613069A
Authority
TW
Taiwan
Prior art keywords
light emitting
emitting module
circuit board
circuit
disposed
Prior art date
Application number
TW103132830A
Other languages
English (en)
Other versions
TWI566375B (zh
Inventor
sheng-yuan Sun
Original Assignee
Playnitride Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Playnitride Inc filed Critical Playnitride Inc
Priority to TW103132830A priority Critical patent/TWI566375B/zh
Priority to US14/829,627 priority patent/US9761759B2/en
Publication of TW201613069A publication Critical patent/TW201613069A/zh
Application granted granted Critical
Publication of TWI566375B publication Critical patent/TWI566375B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/049—PCB for one component, e.g. for mounting onto mother PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
TW103132830A 2014-09-23 2014-09-23 發光模組 TWI566375B (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW103132830A TWI566375B (zh) 2014-09-23 2014-09-23 發光模組
US14/829,627 US9761759B2 (en) 2014-09-23 2015-08-18 Light emitting module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW103132830A TWI566375B (zh) 2014-09-23 2014-09-23 發光模組

Publications (2)

Publication Number Publication Date
TW201613069A true TW201613069A (en) 2016-04-01
TWI566375B TWI566375B (zh) 2017-01-11

Family

ID=55525419

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103132830A TWI566375B (zh) 2014-09-23 2014-09-23 發光模組

Country Status (2)

Country Link
US (1) US9761759B2 (zh)
TW (1) TWI566375B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI621249B (zh) * 2017-03-27 2018-04-11 英屬開曼群島商錼創科技股份有限公司 微型發光二極體及顯示面板
NL2024328B1 (en) * 2019-09-06 2021-04-13 Illumina Inc Pcb interconnect scheme for co-planar led strips

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4959506B2 (ja) * 2007-10-31 2012-06-27 株式会社ジャパンディスプレイイースト 液晶表示装置
TWI349754B (en) * 2008-06-18 2011-10-01 An extending type lighting device and circuit module
TWM406694U (en) * 2010-08-20 2011-07-01 Lite On Technology Corp LED lamp
TWI425279B (zh) * 2010-08-31 2014-02-01 Au Optronics Corp 發光組件、背光模組以及液晶顯示裝置
WO2014186730A1 (en) * 2013-05-17 2014-11-20 Nelson Anders Kristofer Fabric-encapsulated light arrays and systems for displaying video on clothing

Also Published As

Publication number Publication date
US9761759B2 (en) 2017-09-12
US20160084484A1 (en) 2016-03-24
TWI566375B (zh) 2017-01-11

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