TW201602559A - Electronic-component inspection device - Google Patents

Abstract

This invention provides an electronic-component inspection device that, after inspecting and classifying an electronic component, can use the results of that inspection to perform re-inspection and reclassification, reducing the overkill rate or minimizing quality variability. Observation-result information (i1) for an electronic component is analyzed to determine whether said electronic component is acceptable or defective, and on the basis of determination information (i2), the electronic component is classified into a container corresponding to the quality of said electronic component. Identifying information (i3) indicating the position of the electronic component inside the container into which said electronic component was classified is generated and associated with the observation-result information (i1). The quality of the electronic component is re-determined on the basis of said observation-result information (i1), and the result of the re-determination is further associated with the identifying information (i3) associated with the observation-result information (i1). The electronic component at the position indicated by said identifying information (i3) is then reclassified, on the basis of the result of the re-determination, into the container corresponding to the quality of said electronic component.

Description

Electronic component inspection device

The present invention relates to an electronic component inspection apparatus for inspecting electronic components and classifying them according to quality.

The electronic component inspection device is used to inspect electronic components, and to classify them into good products and defective products according to the inspection results, and classify them into good-quality housings for electronic components and storage containers for defective products. For inspection of electronic components, for example, inspection of visual inspection of electronic components for damage, dirt, and damage, inspection of electrical characteristics of electrical characteristics of electronic components, or mixing thereof.

If the basis of the inspection is strict, the overkill rate of the electronic parts that are good products classified into the defective product will increase, and the production efficiency will decrease. If the benchmark for inspection is loose, electronic parts that are defective products will be shipped as good products, resulting in inconsistent quality and reduced reliability of inspection. In the electronic components of integrated circuits such as ICs and LSIs, which have a high unit price per component, problems such as high false positive rate and inconsistent quality are particularly problematic.

In view of this, it is desirable to have an electronic component inspection device that can change the inspection items, inspection methods, or inspection accuracy, and check the good product group again. Whether it contains defective products or whether there are good products in the defective product group. However, the inspection consists of the observation phase of the electronic component and the analysis and determination phase of the observation result. The return of the observation phase causes the production time of each electronic component to become longer and the production efficiency to decrease.

Therefore, a technique has been proposed in which the wafer ring is scanned before the electronic component is peeled off from the wafer ring, and after visual inspection by computer analysis, the electronic component is further visually confirmed before being peeled off from the wafer ring. The scanning result is a technique of performing re-inspection by visual observation (for example, refer to Patent Document 1). This technology is to establish the relationship between the inspection result data of the initial scan and the position data of the electronic component on the wafer ring, and to check the result data according to the location information of the defective electronic component. Displayed on the screen.

Prior technical literature Patent literature

Patent Document 1: Japanese Laid-Open Patent Publication No. 2005-134282

However, sometimes it is desirable to strip electronic components from the wafer one by one before inspecting the electronic components. For example, in the case where the electronic component is attached to the wafer, only the exposed surface of the electronic component can be visually inspected. In addition, if the electronic component is attached to the wafer, the electrical characteristics of the electronic component may not be checked.

In such a case, the electronic components are first picked up from the wafer ring and transported to the unit for inspecting the electronic components, and the classification results are sorted, and the inspection is re-inspected and re-classified after the classification. According to this method, even if the supply source, that is, the electronic component on the wafer ring, is combined with the inspection result, and the quality is re-determined based on the inspection result, it is still impossible to find the current judgment. The inspection result of the electronic parts contained in the location of the classification is therefore impossible to reclassify according to the result of the re-inspection.

Therefore, for an electronic component inspection device that re-inspects and reclassifies electronic components, even if the inspection results obtained by inspection are preserved, it is impossible to inspect and re-classify, and the high false positive rate cannot be solved. Or the problem of inconsistent quality.

The present invention has been made to solve the problems of the above-described conventional techniques, and an object of the present invention is to provide an electronic component inspection apparatus capable of inspecting and classifying electronic components, and performing re-inspection and re-classification using the inspection results, thereby enabling a false positive rate. Reduce or inhibit inconsistencies in quality.

In the electronic component inspection device of the present invention, the good-use container and the defective-use container are held, and one of them is a re-inspection object to be used as an electronic component to be re-inspected, and the electronic component is inspected and the inspection result is determined. The electronic component is classified into the above-described good product container and the defective product container, and the electronic component inspection device includes an observation means, an observation electronic component, an inspection means, and an analysis of the foregoing The observation result of the measuring means determines the difference between the good product and the defective product of the electronic component; and the first classification means classifies the electronic component into one of the good product container and the defective product container according to the determination result of the inspection means; The identification information generating means generates identification information indicating a position of the electronic component housed in the re-inspection object housing in the housing; and the memory means provides the observation result of the electronic component and the identification information indicating the position of the electronic component Establishing a connection and memorizing; and re-inspecting means for re-determining the difference between the good and the defective product of the electronic component housed in the re-inspection container according to the observation result by different viewpoints, techniques, or precision; The information generating means further establishes the relationship between the re-judgment made by the re-inspection means for the aforementioned identification information that has been associated with the observation result; the second classification means, based on the re-determination result of the re-inspection means, The foregoing identification information that has been associated with the re-judgment result is shown Home electronic parts, and then classified to yield products with a housing or housing body defective wherein one.

The re-inspection object housing may have a plurality of housing areas for accommodating electronic components, and the first classification means continuously fills a predetermined number of electronic components in a continuous storage area to fill the electronic components. An adjacent area of the continuous area is maintained as an empty receiving area.

Further, in the re-inspection object storage body, a row of continuous electronic components may be separated by an empty storage area, and the identification information may be arranged in columns and columns to which the electronic components belong. The number is indicated.

In addition, the second classification means may include: a holding means for holding the electronic component and detaching it from the good product container or the defective product container; and the re-feeding means to move the re-inspection container; The storage area of the electronic component is sequentially located at a position where the holding means releases the electronic component; the feeding error detecting means sequentially captures the storage area moved to the predetermined position, and the empty storage is confirmed every a certain number of movements. The existence of the area; if the feed error detecting means fails to confirm the existence of the empty storage area every predetermined number of times, the reclassification is suspended.

Alternatively, the supply unit may be configured to supply the electronic component attached to the wafer ring to the first classification means, and the identification information generation unit may indicate the electronic component on the wafer ring for the identification information. The cutting line information of the position is further established, and the foregoing re-inspection means, according to the cutting line information, and other electronic parts that are re-determined as good or defective electronic parts on the same row or column side by side on the wafer ring, It is judged to be the same quality.

Further, the re-inspection means may include a display unit that displays the observation result, and an operation unit that accepts an operation of visually recognizing the observation result displayed on the display unit as a good or defective product.

Further, the supply unit may be configured to supply the electronic component attached to the wafer ring to the first classification means, and the re-inspection means includes a display unit for displaying the observation result, and an operation unit for receiving and displaying the electronic component. The observation result of the display unit is visually re-determined as a good or defective product; the identification information generating unit displays the identification information Further, the cutting line information of the electronic component on the row of the wafer ring is further related, and the display portion is arranged side by side with the electronic component in the same row or column on the wafer ring according to the cutting line information. Information on observations of other electronic components is continuously displayed.

Alternatively, the first classification means and the second classification means may be configured by a common machine.

According to the present invention, the observation result of the electronic component can be related to the position of the electronic component on the container body, so that the re-judgment can be made according to the observation result, and the electronic component can be re-classified according to the re-determination result, thereby enabling The false positive rate is reduced or the quality is not consistent.

1‧‧‧Electronic parts inspection device

2‧‧‧Rechecking device

21‧‧‧Display Department

22‧‧‧Operation Department

23‧‧‧ Receiving Department

24‧‧‧Communication Department

25‧‧‧ Observations Memory

26‧‧‧Re-determination of information generation department

3‧‧‧Check classification device

3a‧‧‧Rack

3b‧‧‧Transportation path

31‧‧‧Transport platform

31a‧‧‧Adsorption nozzle

32‧‧‧Direct drive motor

33‧‧‧Supply unit

33a‧‧‧ ring bracket

33b‧‧‧ picking device

35a~35e‧‧‧ observation unit

36‧‧‧Good housing unit

37‧‧‧Don't contain the unit

38‧‧‧Resupply unit

39‧‧‧Forced discharge

4‧‧‧Control Department

41‧‧‧Classification Mode Control Department

42‧‧‧ Containment Unit Control Department

43‧‧‧ Observing Results Reception Department

44‧‧‧ Inspection Department

45‧‧‧ Identification Information Generation Department

46‧‧‧ Observations Memory

47‧‧‧ Observations Department

48‧‧‧Re-determination of information receiving department

49‧‧‧Reclassification Mode Control Department

50‧‧‧ Ring Holder Control Department

I1‧‧‧ Observations Information

I2‧‧‧decision information

I3‧‧‧ identification information

I4‧‧‧ cutting line information

Fig. 1 is a schematic configuration diagram of an electronic component inspection device according to a first embodiment.

Fig. 2 is a schematic configuration diagram of a classification device according to a first embodiment.

Fig. 3 is a schematic block diagram showing a configuration of a control unit of the sorting device of the first embodiment.

Fig. 4 is a schematic diagram showing the data stored in the observation result storage unit of the first embodiment.

Fig. 5 is a schematic configuration diagram of a reinspection apparatus according to a first embodiment.

Fig. 6 is a schematic diagram showing a display screen displayed by the reinspection apparatus of the first embodiment.

Fig. 7 is a flow chart showing the control operation of the classification mode of the electronic component inspection device.

Fig. 8 is a flow chart showing the re-inspection operation of the electronic component inspection device.

FIG. 9 is a flow chart showing the resupply of electronic components in the control operation of the reclassification mode of the electronic component inspection device.

Fig. 10 is a flow chart showing the reclassification of electronic components in the control operation of the reclassification mode of the electronic component inspection device.

[Fig. 11] A state schematic model diagram in which the storage position of the electronic component and the observation result information are related.

Fig. 12 is a schematic block diagram showing a configuration of a control unit of the electronic component inspection device according to the second embodiment.

[Fig. 13] Schematic diagram of an arrangement of electronic components on a wafer.

Fig. 14 is a schematic diagram showing the data stored in the observation result storage unit of the second embodiment.

Fig. 15 is a schematic diagram showing a display screen displayed by the reinspection apparatus of the second embodiment.

(First embodiment) (constitution) (electronic parts inspection device)

Hereinafter, a first embodiment of the electronic component inspection device of the present invention will be described in detail with reference to the drawings. Fig. 1 is a schematic configuration diagram of an electronic component inspection device according to a first embodiment. The electronic component inspection device 1 classifies and reclassifies electronic components into good and defective products in response to the inspection and re-inspection of electronic components. During the re-inspection, the observations obtained during the inspection of the electronic components are analyzed by different viewpoints, techniques, or precisions, and the results of the inspections are derived. Different views or techniques, such as the visual observations made by the reinspector.

Here, the electronic component is a component used in an electrical product. Examples of the electronic component include a semiconductor element and a resistor or a capacitor other than the semiconductor element. Examples of the semiconductor element include a discrete semiconductor such as a transistor, a diode, an LED, and a thyristor, and an integrated circuit such as an IC or an LSI. A good product is an electronic component that has a certain quality standard by inspection or re-inspection. The so-called defective product is an electronic component that does not meet a certain quality standard by inspection and re-inspection. Electronic parts classified as either good or defective will be re-examined and reclassified. In the classification and reclassification, electronic parts are packaged according to their quality.

The electronic component inspection device 1 includes an inspection classification device 3 and a reinspection device 2. The inspection sorting device 3 and the re-inspection device 2 have a so-called computer connected by a network such as a LAN and can perform data communication. Alternatively, the computer having the inspection sorting device 3 can function as the re-inspection device 2. The sorting device 3 is inspected to inspect electronic components, and the electronic components are classified into good and defective products in accordance with the inspection results. Recheck device 2, benefit The re-inspection is supported by the observation result of the electronic component classified into the good or the defective product in the classification device 3. Further, the sorting device 3 is inspected, and the electronic components subjected to the re-inspection in the re-inspection device 2 are reclassified into good products and defective products in accordance with the results of the re-inspection. Electronic parts subject to re-inspection are based on quality standards. When the quality standard is set to a strict condition, the electronic parts classified as defective products are re-examined, and when the quality standard is set to be loose, the electronic parts classified into good products are re-examined.

(classification device)

FIG. 2 is a schematic configuration diagram of a detailed configuration of the inspection sorting device 3. The inspection sorting device 3 is a transport path 3b in which electronic components are placed on the upper surface of the gantry 3a, and a plurality of pre-inspected and re-inspected electronic components are simultaneously queued along the transport path 3b. The electronic parts to be inspected and the electronic parts that have been re-inspected are handled in different projects.

The inspection and sorting device 3 includes a supply unit 33 that supplies electronic components to be inspected to the conveyance path 3b, and a resupply unit 38 that re-feeds the re-inspected electronic components to the conveyance path 3b. The good product storage unit 36 and the defective product storage unit 37 are arranged on the downstream side of the supply unit 33 and the resupply unit 38 in the transport direction, and the good product storage unit 36 or the defective product storage unit 37 accommodates the electronic product in response to the inspection result and the re-inspection result. Components.

Each of the electronic components is arranged on the conveyance path 3b between the supply unit 33 and the good product storage unit 36 and the defective product storage unit 37. Observation units 35a to 35e. The various observation units 35a to 35e observe the electronic components of the preliminary inspection supplied from the supply unit 33 on the conveyance path 3b, and obtain observation results. The electronic components supplied from the re-feeding unit 38 are re-examined by the re-inspection device 2, and are not required to be inspected by the inspection sorting device 3, but pass through the observation units 35a to 35e.

The conveyance path 3b of the inspection classification device 3 is annular, and the start of the route is connected to the terminal. Therefore, in order to prevent the electronic component from being separated from the conveyance path 3b and entering the supply unit 33 again, the forced discharge pin 39 is disposed immediately before the supply unit 33.

A control unit 4 including a computer or a controller is provided inside the gantry 3a, and controls the transport path 3b, the supply unit 33, the observation units 35a to 35e, the good product storage unit 36, the defective product storage unit 37, and the like. Supply unit 38. The control unit 4 evaluates the observation result of the electronic component, controls and classifies the electronic component, and connects to the re-inspection device 2 to perform data communication, and outputs the observation result to the re-inspection device 2. Further, the control unit 4 receives the re-inspection result from the re-inspection device 2, and controls the re-classification of the electronic component corresponding to the re-inspection result. In addition to the control unit 4, a power source, a connection line, a compressor, or an air tube for driving the inspection sorting device 3 are housed inside the gantry 3a.

Detailed for each department. The conveyance path 3b is formed by the conveyance platform 31 provided in the upper surface of the gantry 3a. The transport platform 31 has a shape such as a disk or a star extending radially from a point, and is intermittently rotated in parallel with the upper surface of the gantry 3a at a predetermined angle in the circumferential direction. The power source of the transport platform 31 is a direct drive. Motor 32. The transport platform 31 is carried out at a position higher than the upper surface of the gantry 3a by directly driving the motor 32.

An adsorption nozzle 31a is attached to the outer circumference of the conveyance platform 31. The adsorption nozzle 31a is movable up and down along the axial direction thereof. The adsorption nozzle 31a is circumferentially equally spaced along the outer circumference of the conveyance platform 31, and is mounted at a plurality of times at the same distance from the center of the conveyance platform 31. When the transport platform 31 is in a star shape, the transport platform 31 is formed by radially arranging the arms, and an adsorption nozzle 31a is attached to the tip end of the arm.

The adsorption nozzle 31a is a holding means of the electronic component. The adsorption nozzle 31a has a hollow interior and is open at one end, and the open end faces the upper surface of the gantry 3a and hangs from the transport platform 31. The inside of the adsorption nozzle 31a is in communication with an air pressure line of a vacuum generating device such as a vacuum pump or an ejector. The adsorption nozzle 31a is sequentially lowered toward the supply unit 33, the observation units 35a to 35e, the good product storage unit 36, the defective product storage unit 37, and the resupply unit 38, and the electronic component is detached by vacuum destruction or atmospheric pressure release. The electronic parts are delivered to the units, or the electronic parts of the units are adsorbed by the open ends to pick up the electronic parts, so that the electronic parts are returned from the units to the transport path 3b.

The transport platform 31 and the adsorption nozzle 31a constitute a sorting means for the electronic component, and the rotation locus of the opening end of the adsorption nozzle 31a becomes the conveyance path 3b of the electronic component. That is, the direct drive motor 32 is controlled to intermittently rotate at every pitch by the control unit 4. This pitch is equal to the arrangement interval of the adsorption nozzles 31a. Thereby, the adsorption nozzle 31a is passed along with the intermittent rotation of the conveyance platform 31. The passage of the passage is stopped at the common stop position and is raised and lowered in the axial direction of the adsorption nozzle 31a. By providing the supply unit 33, the observation units 35a to 35e, the good product storage unit 36, the defective product storage unit 37, and the resupply unit 38 at the stop position, the adsorption nozzle 31a can sequentially pass through the units along the conveyance path 3b. Inspection, classification and reclassification of electronic components.

The supply unit 33 includes a ring holder 33a and a pickup device 33b when the electronic component is singulated and held in the wafer ring WR. The ring holder 33a holds the wafer ring WR, and the pickup device 33b picks up the electronic components one by one from the wafer ring WR and supplies it to the conveyance path 3b.

The ring holder 33a has the wafer ring WR longitudinally disposed such that the bonding surface of the electronic component faces the outer edge of the transport platform 31. That is, the wafer ring WR is made orthogonal with respect to the moving surface of the adsorption nozzle 31a. The pick-up device 33b has an arm extending radially from a point on a plane that is orthogonal to the moving surface of the adsorption nozzle 31a and the plane from which the wafer ring WR is formed. An adsorption nozzle 31a is provided at the tip end of each arm. The adsorption nozzle 31a is such that the shaft extends along the arm and the open end of the adsorption electronic component faces outward in the radial direction. The pick-up device 33b is submerged below the transport platform 31, and is disposed at a position where the vertex of the pick-up device 33b overlaps the transport path 3b, and the lateral direction thereof faces the wafer ring WR.

The pickup device 33b intermittently rotates the adsorption nozzle 31a around the radiation center. The ring holder 33a, by means of an upper pin (not shown), tops the electronic component from the back side, and delivers the electronic component on the wafer ring WR to the The wafer ring WR faces the adsorption nozzle 31a. The adsorption nozzle 31a of the pickup device 33b of the electronic component is received, and the adsorption nozzle 31a of the conveyance stage 31 faces the vertex of the pickup device 33b, and the electronic component is delivered to the adsorption nozzle 31a of the conveyance platform 31. Thereby, the supply unit 33 supplies the electronic component to the conveyance path 3b.

The observation units 35c to 35e acquire observation results of data which are visual inspections of electronic components. The visual inspection is to check whether the electronic parts are damaged, dirty or damaged, and is checked by image analysis. The observation result is the appearance image data of the electronic part. Each of the observation units 35c to 35e is a camera having an imaging element such as a CCD or a CMOS and a lens, and the imaging optical system faces the surface of the electronic component defined by each of them, and photographs the surface.

For example, the observation unit 35c captures the bottom surface of the electronic component, the observation unit 35d captures the adjacent two side faces of the electronic component, and the observation unit 35e captures the other adjacent two side faces. The bottom surface of the electronic component is the opposite surface to the holding surface to which the adsorption nozzle 31a is attracted. The observation units 35c to 35e are connected to the control unit 4 by signal lines to perform data communication, and transmit the appearance image data to the control unit 4.

The observation unit 35a and the observation unit 35b are processing units that obtain observation results by the observation units 35c to 35e, and correct the electronic components to a predetermined correct posture. The observation unit 35a is a camera having an imaging element such as a CCD or a CMOS and a lens, and the imaging optical system faces the bottom surface of the electronic component and captures the surface. The image data is transmitted to the control unit 4. The control unit 4 analyzes the image data to measure the posture misalignment of the electronic component. The position is misaligned, and the direction of the electronic component is misaligned and the position of the center is misaligned.

The observation unit 35b has a platform on which the electronic components are placed, moves the platform in two directions along the placement surface, and rotates the platform about a rotation axis orthogonal to the placement surface. The amount of movement and the amount of rotation in each direction of the two-dimensional direction are the amount of posture misalignment measured by the elimination control unit 4, and the correction information of the dislocation posture misalignment transmitted from the control unit 4 is followed.

Further, the electronic component inspection device 1 may be designed to perform various inspections without being limited to visual inspection. For example, the observation units 35a to 35e may be mixed with a unit such as an electrical characteristic test, or may be configured only by a unit for checking electrical characteristics. The electrical characteristic inspection is to apply voltage or current to the electronic components to check the voltage, current, resistance, or frequency of the electronic components, and the output signals for the logic signals.

The good product storage unit 36 and the defective product storage unit 37 hold the housing T for accommodating the electronic components in the blank area, and move the housing T at intervals of 1 or 2 so that the blank area is located immediately adjacent to the conveyance path 3b. Below. The adsorption nozzle 31a located immediately above the good product storage unit 36 or the defective product storage unit 37 allows the electronic component to be packaged in a blank area by detaching the electronic component.

The good product storage unit 36 and the defective product storage unit 37 are, for example, a taping unit. The housing T is a carrier tape. The carrier tape has pockets along the long sides of the belt in which the electronic components are packaged. The binding unit moves the carrier tape along the long side of the belt at every 1 pitch or 2 intervals to move the empty area, that is, the empty pocket, to the immediately below the conveyance path 3b. In addition, the strapping unit sequentially seals the seal to densely attach the pocket of the carrier tape containing the electronic component. seal.

In principle, the good product storage unit 36 and the defective product storage unit 37 are moved at a pitch. However, when the electronic component to be inspected is a good product, the good product storage unit 36 moves the storage body T every other interval by a certain number of times. It will be doped with a 2-pitch movement of the receiving body T once. When the electronic component to be inspected is a defective product, the defective product storage unit 37 is doped every two times at a predetermined interval, and the two-pitch movement of the container T is once doped. This is to clearly distinguish the packaged electronic components at a certain number so that each of the plurality of electronic components can be easily found by the number of columns and the number of the array.

The good product storage unit 36 and the defective product storage unit 37 are not limited to the binding unit, and may be other units that move the storage body. As another container, a wafer ring WR, a tray, etc. are mentioned. Further, the good product storage unit 36 and the defective product storage unit 37 are not limited to the same type of unit, and may be a different type of unit such as one of the binding units and the other of the ring holders 33a.

The resupply unit 38 holds the housing T of the electronic component that is re-examined and re-classified, and supplies the electronic component to the conveyance path 3b. When the defective product storage unit 37 accommodates the electronic component determined to be defective, the worker takes out the storage body T from the defective product storage unit 37 and installs it in the resupply unit 38. Further, the resupply unit 38 has a camera that causes the imaging optical system to face a point of the housing T, and confirms the presence of a blank area in the image. When there is a certain amount of time, there should be no empty space where the electronic parts are not packed. In the case of a white area, or when there is a blank area at other time points, an error is reported and the inspection sorting device 3 is stopped.

The resupply unit 38 may be designed as a supply device 33 when the housing for storing the electronic component to be inspected is the same as the housing T in which the electronic component to be re-classified and re-classified is packaged. One of the resupply devices 38 also serves as the other. For example, when the housing for the electronic component to be inspected is the wafer ring WR and the housing T held by the resupply unit 38 is also the wafer ring WR, the classification and re-inspection of the electronic components for preliminary inspection are completed. Since the electronic components are reclassified into different projects, the supply device 33 can also serve as the resupply device 38.

In the case where the housing T of the electronic component to be inspected for packaging is a carrier tape, the resupply unit 38 is a detaper. The unsealing machine peels off the seal from the carrier tape while moving the carrier tape, thereby moving the reclassified electronic components to the immediately below the transport path 3b. Once the reclassified electronic component is moved immediately below the conveyance path 3b, the adsorption nozzle 31a of the conveyance platform 3b adsorbs the electronic component immediately below, and is wound along the conveyance path 3b.

(Control Department)

As shown in FIG. 3, the control unit 4 includes a classification mode control unit 41 that controls each unit of the inspection classification device 3 to inspect and classify the electronic components for preliminary inspection, and a reclassification mode control unit 49 that controls the inspection classification device 3. The various parts of the department, which are reclassified and re-examined.

The classification mode control unit 41 controls the operation of the supply unit 33, the intermittent rotation of the direct drive motor 32, the amount of rotation per pitch, the lifting and lowering of the adsorption nozzle 31a, the adsorption and desorption, and the driving time points of the observation units 35a to 35e. The image data analysis and the correction amount data of the observation unit 35a for deriving the posture misalignment and the correction amount of the electronic component are controlled by the observation unit 35b, and the housing T of the good product storage unit 36 and the defective product storage unit 37 is used. The movement time point, the command of the 1st pitch movement or the 2 pitch movement of the good product storage unit 36 or the defective product storage unit 37, the electronic component of the adsorption nozzle 31a immediately above the good product storage unit 36, or the electron immediately above the defective product storage unit 37 Selection and instructions for part separation.

The reclassification mode control unit 49 controls the amount of movement of the container T of the resupply unit 38, the intermittent rotation of the direct drive motor 32, the amount of rotation per one pitch, the lifting and lowering of the adsorption nozzle 31a, the adsorption and detachment, and the reclassification of the housing. The movement time point of the storage unit T of the electronic component, the storage unit T of the defective product storage unit 37, and the movement amount of the storage unit T of the electronic component containing the re-classified electronic component or the defective product storage unit 37. The reclassification mode control unit 49 receives the re-judgment information generated by the re-inspection device 2 by the re-determination information receiving unit 48 of the control unit 4, and controls the inspection classification device 3 in accordance with the re-determination information.

In other words, the classification mode control unit 41 and the reclassification control unit 49 have the storage unit control unit 42 as one component, and the storage unit control unit 42 manages and controls the good storage unit for the electronic components that are used for the preliminary re-inspection. 36 or 1 pitch shift of the defective product storage unit 37 Move or move at 2 pitches.

In addition, the control unit 4 evaluates the observation result of the electronic component, and determines the electronic component storage location as the good product storage unit 36 or the defective product storage unit 37 in response to the inspection result, and controls the inspection classification device 3 in accordance with the determination. The control unit 4 includes an observation result receiving unit 43 and an inspection unit 44, an identification information generating unit 45, an observation result storage unit 46, and a signaling unit 47.

The observation result receiving unit 43 mainly includes a LAN adapter or a serial port interface such as RS232/485, and receives the observation result information i1 which is the data of the observation result from the observation units 35c to 35e.

The inspection unit 44 mainly includes a CPU, and analyzes the observation result information i1, determines the quality of the electronic component, and generates determination information i2 indicating the determination result. The judgment information i2 indicates the difference between the good or the defective product of the electronic component. The determination information i2 is output to the classification mode control unit 41. In accordance with the determination information i2, the classification mode control unit 41 controls the movement of the adsorption nozzle 31a for holding the electronic component and the time when the electronic component is detached, and the movement of the container T of the good product storage unit 36 or the defective product storage unit 37 to control the electrons. The parts are housed in the good product storage unit 36 or the defective product storage unit 37.

The identification information generating unit 45 mainly includes a CPU, and as shown in FIG. 4, it establishes an association between the observation result information i1 and the determination information i2. The identification information i3 is information for identifying the main body of the observation result information i1 and the determination information i2, that is, the electronic parts.

The identification information i3, as shown in FIG. 4, indicates an electronic part The storage place after sorting is also the position inside the container T. There are blank areas in a certain number of the containers T which are moved at intervals of 2 at a certain number. A certain number of electronic component groups that are sandwiched by blank areas can be identified as a unit of batch size. The identification information i3 is composed of the lot number, that is, the number of columns of the electronic component group, and the arrangement number in the column.

Here, the storage unit control unit 42 manages and controls the one-pitch movement or the two-pitch movement of the good-quality storage unit 36 or the defective product storage unit 37 that accommodates the electronic parts to be re-examined. The identification information generating unit 45 searches for the position of the electronic component in the housing T in accordance with the management and control of the electronic component storage position by the storage unit control unit 42, and generates the identification information i3 and establishes the connection.

The observation result storage unit 46 is mainly composed of a memory, and the observation result information i1 and the determination information i2 and the identification information i3 that are related to each other are stored. The observation result transmitting unit 47 mainly includes a LAN adapter or a serial interface such as RS232/485, and transmits the observation result information i1 and the determination information i2 and the identification information i3 of the electronic component to be re-examined to the re-inspection. Device 2.

(recheck device)

Next, the detailed configuration of the reinspection apparatus 2 will be described. FIG. 5 is a detailed schematic configuration diagram of the reinspection apparatus 2. As shown in FIG. 5, the reinspection apparatus 2 includes a receiving unit 23, an observation result storage unit 25, a display unit 21, an operation unit 22, a re-determination information generation unit 26, and a transmission unit 24, and receives the reception from the inspection classification device 3. The observation result information i1 is re-examined. This embodiment In the re-inspection device 2, the observation result information i1 is displayed, and the re-inspector visually observes the observation result information i1 to support the visual re-examination.

The receiving unit 23 mainly includes a LAN adapter or a serial interface such as RS232/485, and receives the observation result information i1, the determination information i2, and the identification information i3 of the electronic component to be re-inspected from the inspection classification device 3. The observation result storage unit 25 mainly includes a RAM, and stores the observation result information i1, the determination information i2, and the identification information i3.

The display unit 21 mainly includes a display having a display screen such as a liquid crystal display or an organic electroluminescence display, and a CPU, and sequentially displays the observation result information i1, the determination information i2, and the identification information i3 in response to the operation of the reinspector. GUI screen. The operation unit 22 is mainly an input interface such as a mouse or a touch panel, and its operation is displayed on the GUI screen of the display unit 21.

The re-determination information generating unit 26 mainly includes a CPU, and updates the determination information i2 associated with the observation result information i1 in response to the operation accepted by the operation unit 22. Specifically, the difference between the good or defective product of the electronic component indicated by the determination information i2 is changed.

The transmitting unit 24 mainly includes a LAN adapter or a serial interface such as RS232/485, and returns the observation result information i1, the determination information i2, and the identification information i3 to the inspection classification device 3. The determination information i2 sent to one of the inspection classification devices 3 is changed by the re-determination information generation unit 26. The observation result information i1 and the determination information i2 and the identification information i3 sent back from the transmitting unit 24 are stored in the inspection classification device 3 The information receiving unit 48 is determined again.

FIG. 6 is a schematic diagram of a GUI screen of the display unit 21. As shown in FIG. 6, the observation result information i1, the determination information i2, and the identification information i3 are arranged in the screen. When the observation result information i1 is image data due to the visual inspection, an image in which the appearance of the electronic component is drawn is displayed on the screen. Further, in the screen, the NG button 22a for changing the determination information i2 to the defective product, the GOOD button 22b for changing the determination information i2 to the good product, and the observation result information i1, the determination information i2, and the identification information i3 in the screen are displayed. A button 22c for the next electronic component. Further, a cursor 22d that moves in the screen by the operation of the operation unit 22 is displayed on the screen.

The re-inspector, in the case where the observation information i1 in the visual screen is different from the determination information i2 in the display, the NG button 22a or the GOOD button 22b is pressed by the cursor 22d. With this pressing as an opportunity, the determination information generating unit 26 updates the determination information i2 to the content corresponding to the pressing of the button. Further, when the send button 22c is pressed by the cursor 22d, the display unit 21 displays the determination information i2 and the identification information i3 corresponding to the next electronic component of the identification information i3 being displayed.

(action) (classification mode action)

The control operation of the electronic component inspection device 1 as described above in the classification mode will be described. FIG. 7 is a flow chart showing the control operation of the classification mode of the electronic component inspection device 1. In addition, in this control action, an example is given to the electronic The quality standard of the component is set to be strict, and the container T held by the defective product storage unit 37 is used as a re-inspection target body for the electronic component to be re-inspected, and the container T may be mixed with a good product or a defective product. The status of electronic parts.

First, in the supply unit 33, the pickup device 33b sequentially picks up the electronic components from the wafer ring WR held by the ring holder 33a. The pickup device 33b intermittently rotates so that the adsorption nozzles 31a from which the electronic components are picked up are sequentially positioned at the apexes, and the electronic components are sequentially delivered to the adsorption nozzles 31a on the side of the face-to-face conveyance platform 3b.

The electronic components held by the adsorption nozzles 31a of the transport platform 3b are sequentially rotated in the observation units 35a and 35b by the intermittent rotation of the transport platform 3b, and are sequentially transmitted to the respective observation units 35c to 35e. The observation result information i1 of each electronic component is sequentially generated by the observation units 35c to 35e.

In the drive of the inspection sorting device 3, in step S01, the storage unit control unit 42 initializes the electronic component storage array N and the array number M for preliminary re-inspection to 1 in advance.

Next, in step S02, the observation result receiving unit 43 receives the observation result information i1 of the electronic component that was first conveyed from the observation units 35c to 35e. When the observation units 35c to 35e are used for visual inspection, the observation result information i1 is an appearance image data of the electronic component. When the observation units 35c to 35e are used for electrical characteristic inspection, the observation result information i1 is a voltage value, a current value, a resistance value, a frequency, or an output signal for a logic signal of the electronic component.

Upon receiving the observation result information i1, in step S03, the inspection unit 44 analyzes the observation result information i1 to determine the difference between the good and the defective product of the electronic component. When the observation result information i1 is image data, the inspection unit 44 performs binarization or emphasis processing on the image data, and then scans whether or not the area is surrounded by the line image indicating the outline of the electronic component. There are line images that indicate damage, dirt or damage. When the number of pixels constituting the line image indicating damage, dirt, or damage is equal to or greater than a certain number, the inspection unit 44 determines that the electronic component is defective, and if it is less than a certain number, the inspection unit 44 determines that the electronic component is a good product.

In step S04, if the electronic component is judged to be good (step S04, Yes), the electronic component is transported to the good product storage unit 36 by the adsorption nozzle 31a, and is accommodated in the containment of the good product storage unit 36 in step S05. Body T.

If the electronic component is not determined to be good (step S04, No), the electronic component is determined to be defective, and in step S06, the storage unit control unit 42 determines whether or not the array number M is the maximum value. The storage unit control unit 42 stores the maximum value of the array number M in advance. The maximum value of the array number M corresponds to the number of each batch of the electronic component to be re-examined.

When the arrangement number M is not the maximum value (step S06, No), in step S07, the defective product storage unit 37 moves the container T under holding by one pitch by the control of the storage unit control unit 42. In other words, blank areas that do not contain electronic components are not manufactured. Then, the storage unit control unit 42 will arrange the number M in step S08. Add 1 to you.

On the other hand, if the arrangement number M is the maximum value (step S06, Yes), in step S09, the defective product storage unit 37 moves the container T under holding by two pitches under the control of the storage unit control unit 42. In other words, a blank area that does not contain electronic components is created. Then, in step S10, the storage unit control unit 42 increments the column N by one and initializes the array number M to 1.

Then, in step S11, the classification mode control unit 41 causes the electronic component determined to be defective to be located immediately above the defective product storage unit 37, and the electronic component is detached from the adsorption nozzle 31a, thereby accommodating the electronic component in the blank area.

Further, in step S12, the identification information generating unit 45 generates identification information i3 indicating the storage position of the electronic component stored therein. In other words, the identification information generating unit 45 obtains the numerical information of the column N and the array number M counted by the storage unit control unit 42 in steps S08 and S10, and uses the numerical information of the column N and the arrangement number M as the identification information i3. . Then, in step S13, the observation result storage unit 46 associates and memorizes the observation result information i1 of the electronic component accommodated in the defective product storage unit 37, the determination information i2, and the identification information i3.

In the inspection and classification, if all the electronic components have not been completed (step S14, No), the process returns to step S02, and the observation result information i1 is acquired one by one for each electronic component, and the difference between the good product and the defective product and the defective product are determined. Determining the storage position, and information information i1 and determination information i2 and identification information i3 of the electronic component determined to be defective To establish a relationship.

(recheck action)

FIG. 8 is a schematic flow chart showing the re-inspection operation of the electronic component inspection device 1. The re-inspection is performed in the next project after the classification mode ends. In the re-inspection device 2, in step S21, the observation result receiving unit 43 receives the observation result information i1, the determination information i2, and the identification information i3 that are related to each other from the inspection classification device 3. The timing of the transmission and reception of the information is not particularly limited. For example, the inspection and classification device 3 may be designed to check the classification device 3 after the inspection and classification device 3 ends the inspection and classification of all the electronic components that can be stored in the container T. The device 2 is inspected again. Further, it is also possible to design the inspection sorting device 3 to be operated by the reinspector, and then in response to the operation, the inspection sorting device 3 is requested to transmit information, and then the inspection sorting device 3 is sent to the re-inspection device 2 in response to the request.

Upon receiving the observation result information i1 or the like, in step S22, the display unit 21 displays the observation result information i1, the determination information i2, and the identification information i3 which are related to each other on the GUI screen. In the GUI screen, the NG button 22a for changing the determination information i2 to the defective product, the GOOD button 22b for changing the determination information i2 to the good product, and the observation result information i1, the determination information i2, and the identification information i3 in the screen are also displayed. A button 22c for the next electronic component.

The re-inspector visually checks the observation result information i1 to re-examine the electronic component. If the GOOD button 22b determined to be good is pressed in step S23 (step S23, Yes), or the step S24 is pressed to determine that the defective product is defective. In the NG button 22a (step S24, Yes), in step S25, the re-determination information generating unit 26 updates the determination information i2 of the electronic component being displayed to a good product corresponding to the button press in response to the button press. Information on defective products.

Then, after the electronic inspection of all the electronic components to be inspected is completed, the transmitting unit 24 transmits the observation result information i1, the determination information i2, and the identification information i3 to the inspection classification device 3. The result of the re-inspection is reflected in the determination information i2. The polling time point is an operation when the re-inspector inputs an operation indicating the end of the re-inspection, or may be requested by the inspection sorting device 3 when the re-classification of the sorting device 3 is started.

(Reclassification mode action)

FIG. 9 is a flow chart showing the resupply of electronic components in the control operation of the reclassification mode of the electronic component inspection device 1. In the present control operation, the quality standard of the electronic component is set to be strict, and the container T held by the defective product storage unit 37 is used as the re-inspection storage body, and the container T may be mixed with good products. The status of electronic parts with defective products. Further, the camera provided in the resupply unit 38 is disposed so as to capture the previous position of the position at which the adsorption nozzle 31a picks up the electronic component.

The reclassification mode is performed in the next project after the action of the classification mode and the re-inspection. First, in step S31, the operator takes out the electronic zero that is determined to be defective from the defective product storage unit 37. The housing T of the piece is placed in the resupply unit 38. Further, in step S32, the reclassification mode control unit 49 initializes the column N and the array number M of the electronic component to be reclassified to 1 in advance.

Then, the resupply unit 38, in the case of the unsealing machine, peels off the seal seal from the container T while the electronic component of the Nth column M is located immediately below the adsorption nozzle 31a. In step S33, the reclassification mode control unit 49 controls the adsorption nozzle 31a to pick up the electronic component of the Nth column No. M and transport it along the conveyance path 3b.

The reclassification mode control unit 49 confirms the image of the camera included in the resupply unit 38 in step S34, and determines whether or not a blank area exists. The presence of a blank area, for example, can binarize and emphasize the image of the camera, and analyze whether there is an outline of the electronic part inside the blank area.

If there is no blank area in the image of the camera (step S34, No), and M is not the maximum value (step S35, No), the reclassification mode control unit 49 causes the container body T to move at a pitch in step S36. In step S37, M is incremented by one until the electronic component is picked up (Yes in step S41), and the electronic parts of the Nth column No. M are repeatedly picked up and transported. This is because if M is not the maximum value, then the blank area is detected next to it, and it is normal that there is no blank area.

If there is a blank area in the image of the camera (Yes in step S34), and M is the maximum value (Yes in step S38), the reclassification mode control unit 49 causes the container T to be 2 in step S39. The pitch moves, and in step S40, N is incremented by 1 and M is initialized to 1. Until the end of the pickup of the electronic component (Yes in step S41), the electronic components of the Nth column No. M are repeatedly picked up and transported. This is because when M is the maximum value, in the blank area detection position beside it, it is normal that there is a blank area, and in order to pick up the next batch of electronic parts through the blank area, it is moved at 2 pitches.

On the other hand, if there is no blank area in the image of the camera (step S34, No), but M is the maximum value (step S35, Yes), or there is a blank area in the image of the camera (step S34, Yes) In the case where M is not the maximum value (step S38, No), the reclassification mode control unit 49 notifies that there is a mechanical error in the movement of the container T in step S42, and causes the inspection sorting device 3 to stop driving.

That is to say, the electronic parts are continuously packaged every M groups, and the group should be sandwiched by blank areas. When M becomes maximum, a blank area should be captured in the camera, and a blank area does not exist, and it can be inferred that there is a mechanical error in the movement of the housing T. Further, when M is not the maximum, a group of electronic parts should be continuous without taking a blank area, and a blank area exists, and it can be inferred that there is a mechanical error in the movement of the container T.

The notification may be designed such that the inspection sorting device 3 is provided with an alarm or indicator light to activate the devices, or may be displayed on the display of the inspection classification device 3, or may be displayed on the inspection classification device 3 through the network. The monitor of the connected monitoring computer.

Next, the reclassification of the electronic components in the control operation of the reclassification mode of the electronic component inspection device 1 will be described. Figure 10 is an electronic part In the control operation of the reclassification mode of the inspection apparatus 1, a flow chart of reclassification of electronic components is shown. In the present control operation, the quality standard of the electronic component is set to be strict, and the electronic component in which the defective product storage unit 37 may be mixed with the defective product or the defective product is described.

This operation is performed in parallel with the following operation, that is, the housing T of the electronic component determined to be defective in the first inspection is provided in the resupply unit 38, and the electronic component of the Nth column M is picked up and After the handling, the blank area inspection operation is performed in order to supply the electronic parts again. In other words, in step S51, the housing T of the electronic component determined to be defective in the first inspection is placed in the resupply unit 38, and in step S52, the electronic component of the Nth column M is picked up and transported. Further, in the defective product storage unit 37, a new storage body T for packaging an electronic component determined to be defective by re-inspection is provided in advance.

Then, in step S53, the reclassification mode control unit 49 determines whether or not the electronic component of the Nth column M is a good product by the re-inspection when the electronic component of the Nth column M reaches the good product storage unit 36. Specifically, the reclassification mode control unit 49 reads the determination information i2 associated with the identification information i3 of the Nth column M received by the re-determination information receiving unit 48, and determines whether or not the determination information i2 is indicated as good.

As a result of the determination, if the electronic components of the N-column M number are re-inspected as good (step S54, Yes), in step S55, the re-classification mode control unit 49 causes the housing T of the good-quality storage unit 36 to pack the N-column M number. Electronic parts.

That is, the adsorption nozzle 31a is oriented toward the good containment list. Yuan 36 lowered. The good-storage unit 36 moves the container T, and prepares a blank area immediately below the adsorption nozzle 31a. The lowered adsorption nozzle 31a disengages the electronic component of the Nth column of the Nth column that is being held toward the blank area.

On the other hand, if the electronic components of the N-column M number are re-inspected as defective products (step S54, No), the reclassification mode control unit 49 does not cause the electronic components to be detached in the good-quality storage unit 36. The handling path 3b will be directly transported. Then, in step S56, the electronic component of the Nth column M number determined to be defective is returned to the defective product storage unit 37 (step S56, Yes), and in step S57, the reclassification mode control unit 49 orders The housing T of the defective product storage unit 37 is packed with N parts of the electronic components of the M number.

That is, the adsorption nozzle 31a is lowered toward the defective product storage unit 37. The defective product storage unit 37 moves the container T, and prepares a blank area immediately below the adsorption nozzle 31a. The lowered adsorption nozzle 31a disengages the electronic component of the Nth column of the Nth column that is being held toward the blank area.

(Effect)

The electronic component inspection apparatus 1 includes observation units 35a to 35e for observing electronic components, and an inspection unit 44 for analyzing observation information i1 of the observation units 35a to 35e to determine the difference between the good and the defective products of the electronic component; The classification means classifies the electronic component into one of the housings T for the good and the defective product based on the determination information i2 of the inspection unit 44. By. In the present embodiment, the first classification means is composed of a conveyance platform 31 and an adsorption nozzle 31a.

Further, the identification information generating unit 45 generates identification information i3 indicating the position of the electronic component housed in the re-inspection container in the housing, and displays the observation result i1 of the electronic component and the position of the electronic component. The information i3 is established in association with the observation result storage unit 46.

Further, the reinspection apparatus 2 is provided for re-determining the electronic components accommodated in the re-inspection object storage body as good and defective products based on the observation result information i1, and re-determining the information generation unit 26 As a result, the information i1 establishes the related identification information i3 to further establish the correlation between the results of the re-determination. As a result of the re-judgment, the relationship is established by updating the decision information i2.

Then, by the second classification means, based on the re-determination result of the re-inspection device 2, the electronic component at the position indicated by the identification information i3 associated with the re-determination result is classified into a good product or a defective product. One of the containers T. In the present embodiment, the second classification means is a device common to the first classification means, and is a inspection platform 31 and an adsorption nozzle 3a of the inspection sorting device 3.

According to the electronic component inspection apparatus 1, as shown in FIG. 11, the electronic component D that has been inspected and the observation result information i1 are connected by the identification information i3 indicating the position of the electronic component on the housing T. Therefore, the observation information i1 can be used for re-inspection, and the re-inspection can be used to find the electronic component D that is re-determined as good. Yes Therefore, the observation information i1 can be used for re-inspection, and the electronic component D is disposed correspondingly to the result. Since the re-inspection process can be performed, it is possible to re-examine the good and defective products of the electronic component D with high precision without performing the acquisition processing of the new observation result information i1.

For example, the electronic components lined up in the Kth from the start of transportation are observed by the observation units 35a to 35e at the Kth. Then, the observation result information i1 with the queue number No. K is generated by the observation, and the difference between the good product and the defective product is determined by analyzing the observation result information i1 for the electronic component of the Kth.

Here, it is assumed that Ma (maximum number of electronic parts in the batch ≧Ma+1) defective product has occurred before the observation result information i1 of the Kth is determined. In this case, the value of Ma is memorized in advance by the count of defective products, and once the judgment of the observation information i1 of the Kth is made, the determination of the defective product is made, and the addition of Ma becomes 1 Ma+1 is the identification information i3. Then, for the observation information i1 of the Kth, the determination information i2 indicating the defective product and the identification information i3 of the newly generated Ma+1 are associated with and memorized.

During the determination process, the electronic component that is queued to the Kth number will arrive at the good-quality storage unit 37, but the determination information i2 that is related to the observation result information i1 with the queue number No. K is indicated. If it is a defective product, it passes through the container T of the defective product storage unit 38.

At this time, Ma electronic parts are already accommodated in the continuous storage area, and the electronic parts of the Kth are contained in the identification information i3. The same Ma x+1 containment area. Therefore, the identification information i3 coincides with the position in the container T, and the position in the container T and the observation result information i1 and the determination information i2 are tied together by the identification information i3.

Therefore, it is possible to find out which observation information i1 of the electronic component housed in the container T is being re-determined, and the electronic component can be re-classified according to the result of the re-determination.

In addition, at least the object storage system, such as a carrier tape, has a plurality of storage areas for accommodating electronic components. In the first classification means, a predetermined number of electronic components are continuously filled in a continuous storage area, and an adjacent one of the continuous areas filled with the electronic components is maintained as an empty storage area.

That is to say, the container body T is moved by 1 pitch or 2 pitch to accommodate the next electronic component depending on whether or not the arrangement number M of the electronic component is the maximum value. Therefore, in the housing T, as shown in FIG. 11, a certain number of electronic components D are continuously arranged in each of the housing regions P, and a predetermined number of electronic component groups are disposed with one blank area Pa therebetween.

This blank area Pa acts as a sign for detecting a mechanical feed failure of the container T. When the electronic component is re-supplied to the transport path 3b for reclassification, the camera provided in the resupply unit 38 functions as a feed error detecting means, and if there is no blank area Pa every certain number, or a certain number exists, there is a blank. In the area Pa, it is possible to detect that a mechanical error has occurred in the movement of the container T. Therefore, it is possible to prevent the electronic component that has been judged to be a good product by the re-inspection from being accommodated in the housing T for defective products. On the other hand, the misalignment of the electronic component that has been judged to be defective by the re-inspection is stored in the housing T for good use. In the case where a feed failure occurs, the control section 4 can suspend the reclassification.

For example, it is designed to set a camera to capture a storage area existing in the first k positions where the electronic parts are re-supplied to the conveyance path 3b, and set a certain number to C. At this time, in the resupply unit 38, from the previous detection of the blank area Pa, by the movement body C moving the C pitch, the shooting position of the camera should have the blank area Pa again, and the other time points should not be taken. Go to the blank area Pa.

However, when the non-C pitch is moved but the blank area Pa is captured, or the C pitch is moved but the blank area Pa is not captured, it indicates that the resupply unit 38 does not move the container T according to the regulation, and the movement misalignment occurs. This movement misalignment, in the control pattern of distinguishing between good and bad products according to the order of arrangement of electronic parts, will result in reclassification of good products into defective products and reclassification of defective products into good products, so the suspension will be immediately suspended. classification.

(Second embodiment)

Next, the electronic component inspection device 1 of the second embodiment will be described in detail with reference to the drawings. In the first embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and the detailed description thereof will be omitted.

Fig. 12 is a schematic block diagram showing the configuration of the control unit 4 of the electronic component inspection device 1 according to the second embodiment. As shown in FIG. 12, in the electronic component inspection apparatus 1, the control part 4 is equipped with the ring holder control part 50. Ring bracket control The manufacturing unit 50 controls the driving of the ring holder 33a to supply the electronic component to the conveying path 3b. Specifically, the electronic component to be supplied is specified, and the amount of movement in the respective dimensional directions of the plane movement of the wafer ring WR by the ring holder 33a and the time of the top of the electronic component caused by the upper pin are controlled. In order to supply the designated electronic component to the transport path 3b.

The electronic component to be supplied is specified by the arrangement position of the electronic components on the wafer ring WR. The arrangement position is specified in rows and columns as shown in FIG. That is to say, the electronic component is searched in rows and columns by a mapping process on the wafer ring WR.

As shown in FIG. 14, the identification information generating unit 45 displays the dicing line information i4 indicating the position of the electronic component on the wafer ring WR in a matrix, and further the observation result information i1, the determination information i2, and the identification information i3. Establish a relationship.

For example, the classification mode control unit 41 searches for each electronic component that is queued and transported in the transport path 3b in advance by the cutting line information i4 in the order of conveyance, and synchronizes with the time point at which the observation result information i1 is input to the inspection unit 44, one by one. Submit the cutting line information i4. That is, in the inspection unit 44, the cutting line information i4 and the observation result information i1 are related to each other. The identification information generating unit 45 acquires the related cutting line information i4, the observation result information i1, and the determination result information i2 in a state in which the correlation is established.

The re-inspection device 2 receives the cutting line information i4 and the observation result information i1 and the determination result information i2 and the identification information i3 which are associated with each other. Figure 15 is a GUI drawing displayed on the display unit 21 of the reinspection device 2. The model diagram is shown. The display unit 21 further arranges the button 22e, the button 22f, and the button 22g on the GUI screen.

The button 22e accepts the operation of reading the same cutting line. The display unit 21, after the button 22e is pressed, displays the electronic component that is aligned with the currently displayed electronic component on the same cutting line when the delivery button 22c is pressed.

Specifically, the cutting line information i4 associated with the currently displayed observation information i1 is searched for from the observation information storage unit 25 to be the same cutting line information i4 of the row or column, and the matching cutting line information i4 is established with the cutting line information i4. The related observation result information i1 and the judgment result information i2 and the identification information i3 are stacked in the queue. Then, when the delivery button 22c is pressed, the observation result information i1 and the determination result information i2 and the identification information i3 which are related to each other are sequentially displayed from the queue.

The button 22f accepts an operation of changing all the determination information i2 regarding the cutting line of the same line to a defective product. After the button 22f is pressed, the re-judgment information generating unit 26 determines that all the electronic components that are aligned with the cutting line on the same line as the currently displayed electronic component are defective.

Specifically, the same cutting line information i4 is created from the observation information storage unit 25 or the queue and the currently displayed observation information i1 is created, and the cutting line information i4 is established with the matching cutting line information i4. The related determination result information i2 is changed to the defective product determination.

The button 22g accepts an operation of changing all the determination information i2 of the cutting line in the same column to a good one. The re-judgment information generating unit 26, after the button 22g is pressed, will be directed to the electronic component currently displayed. All electronic components side by side in the same column of cutting lines are judged to be defective.

Specifically, the same information about the cutting line information i4 of the associated cutting line information i4 is created from the observation information storage unit 25 or the queue and the currently displayed observation information i1, and the matching cutting line information i4 is established. The related determination result information i2 is changed to the defective product determination.

As described above, in the electronic component inspection apparatus 1, the identification information generating unit 45 is designed to further establish the relationship between the cutting line information i4 indicating the position of the electronic component on the wafer ring WR in the identification information i3. The wafers of the wafer ring WR are cut in the row and column direction, and the defects during cutting are likely to spread to the same cutting line.

Therefore, the re-determination information generating unit 26 of the re-inspection device 3 is designed to re-determine the electronic components of the good or defective product in the same row or column on the wafer ring WR in accordance with the cutting line information i4. The parts are then judged to be of the same quality. Thereby, the time required for the re-inspection can be greatly shortened. In particular, when the observation result information i1 is visually confirmed and the determination information i2 is changed by the manual operation of the re-inspector, the time required for the re-inspection can be drastically shortened, and the labor of the re-inspector can be reduced, and It can reduce the misjudgment caused by the distraction of the reinspector.

Further, the display unit 21 is designed to continuously display observation information i1 of other electronic components arranged in the same row or column on the wafer ring as the electronic components in the display, by comparing the cutting lines without distinguishing the cutting lines. Visual inspection of the information i1 to check the electronic components in sequence, there will still be a significant time reduction and labor reduction.

(Other embodiments)

Although the above embodiments have been described as an example, the electronic component inspection apparatus 1 classifies and reclassifies electronic components into good and defective products in response to the inspection and re-inspection of electronic components, and at the time of re-inspection, In the case where the observation result obtained when the electronic component is inspected is analyzed by a different viewpoint, technique, or precision, and the result of the re-inspection is derived, various omissions, substitutions, and changes can be made without departing from the scope of the invention. It is to be understood that the scope of the invention and the scope of the invention are included in the scope of the invention and the scope of the invention.

For example, the holding nozzle 31a is exemplified as the holding means, but an electrostatic adsorption method, a Bernoulli chuck method, or a chuck for mechanically holding electronic parts may be disposed. mechanism. Further, the transport platform 31 is described by way of an example of an annular shape, but may be a linear transport method. Fundamentally, it is also possible to design such that the holding means is attached to the multi-joint arm without attaching the holding means to the transport platform 31, and the holding means is moved from the supply unit 33 to each of the storage bodies T by the operation of the arms.

In addition, the classification means is a common transportation platform 31 and adsorption nozzle 31a in the classification of the inspection and the re-classification according to the re-inspection, but it is also possible to design the transportation route according to the classification and the re-classification.

Further, the housing T is not limited to the carrier tape, and may be a tray in which the storage regions are arranged in an array in a plane, or may be a wafer ring WR.

Moreover, the observation unit arranged side by side on the conveyance path 3b is not limited to For a single type, it is also possible to design a plurality of units of different types of inspection items side by side, and to combine different types of inspection items to determine the difference between good and bad products.

Further, in the present embodiment, the re-inspection is performed by visual inspection by a different method, but it may be designed to perform computer analysis on the observation result information i1 by different analysis methods without relying on the human hand to do the re-inspection. The decision may also be designed to perform computer analysis by the same analytical method that is more detailed and precise than the analysis at the time of inspection.

Claims (8)

An electronic component inspection device that holds a good product container and a defective product container, and one of which is an object to be inspected as an electronic component to be re-inspected, and inspects an electronic component, and the electronic component is inspected according to the inspection result. In the electronic component inspection apparatus, the electronic component inspection apparatus includes: an observation means, an observation electronic component, an inspection means, analyzes an observation result of the observation means, and determines a good product of the electronic component. The first classification means, based on the determination result of the inspection means, classifies the electronic component into one of the good-use container and the defective-use container; and the identification information generating means generates the re-inspection target The identification information of the position of the electronic component contained in the container in the container; the memory means to establish and associate the observation result of the electronic component with the identification information indicating the position of the electronic component; For the above-mentioned re-examination based on the aforementioned observations Checking the difference between the good and the defective products of the electronic components of the object storage body, and re-determining them with different viewpoints, techniques, or precision; and then determining the information generating means to establish the aforementioned identification information that has been associated with the observation results, and the foregoing re-inspection means The result of the re-determination is further established; the second classification means, based on the re-determination result of the re-inspection means, the position indicated by the aforementioned identification information that has been associated with the re-determination result The electronic component is subdivided into one of the good-use container or the defective product container. The electronic component inspection device according to the first aspect of the invention, wherein the re-inspection object housing has a plurality of housing regions for accommodating electronic components, and the first classification means is continuously filled in a continuous storage region. The number of electronic components maintains an adjacent area of the continuous area filled with the electronic parts as an empty containment area. The electronic component inspection device according to the second aspect of the invention, wherein the plurality of electronic component rows are separated by an empty storage region to form a plurality of the identification information, It is represented by the column in the column to which the electronic part belongs and the number in the column. The electronic component inspection device according to the second aspect of the invention, wherein the second classification means includes: a holding means for holding the electronic component and accommodating the electronic component from the good product container or the defective product The re-feeding means moves the re-inspection object storage body such that the storage area of the electronic component is sequentially located at a position where the holding means disengages the electronic component; and the feeding error detecting means sequentially photographs the movement to the predetermined position The storage area confirms the existence of the empty storage area every a predetermined number of movements, and if the feed failure detecting means fails to confirm the existence of the empty storage area every predetermined number of times, the reclassification is suspended. The electronic component inspection device according to any one of the first to fourth aspect of the present invention, further comprising: a supply unit that supplies an electronic component attached to the wafer ring to the first classification means, the identification information The generating unit further establishes a relationship between the cutting line information indicating the position of the electronic component on the wafer ring in the identification information, and the re-inspection means determines and determines the good or defective product according to the cutting line information. The electronic components are judged to be of the same quality in the same row or column of other electronic components on the aforementioned wafer ring. The electronic component inspection apparatus according to any one of the first to fifth aspect, wherein the re-inspection means includes: a display unit that displays the observation result; and an operation unit that displays the pair on the display unit The aforementioned observation results are visually judged as operations of good or defective products. The electronic component inspection device according to any one of the first to fourth aspect, wherein the electronic component inspection device includes a supply unit that supplies the electronic component attached to the wafer ring to the first classification means. The re-inspection means includes: a display unit that displays the observation result; and an operation unit that accepts an operation of visually recognizing the observation result displayed on the display unit as a good or defective product, and the identification information generation unit recognizes the identification The information further indicates that the cutting line information of the electronic component on the row of the wafer ring is further related, and the display portion is identical to the electronic component in the display on the wafer ring according to the cutting line information or Information on observations of other electronic components placed side by side is continuously displayed. The electronic component inspection device according to any one of the first to seventh aspect, wherein the first classification means and the second classification means are constituted by a common machine.