TW201546003A - Breaking device for brittle material substrate - Google Patents

Breaking device for brittle material substrate Download PDF

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Publication number
TW201546003A
TW201546003A TW104101931A TW104101931A TW201546003A TW 201546003 A TW201546003 A TW 201546003A TW 104101931 A TW104101931 A TW 104101931A TW 104101931 A TW104101931 A TW 104101931A TW 201546003 A TW201546003 A TW 201546003A
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Taiwan
Prior art keywords
substrate
brittle
breaking
bar
scribe line
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TW104101931A
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Chinese (zh)
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TWI644872B (en
Inventor
Nao Tokunaga
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Mitsuboshi Diamond Ind Co Ltd
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Priority to JPJP2014-121940 priority Critical
Priority to JP2014121940A priority patent/JP6387695B2/en
Application filed by Mitsuboshi Diamond Ind Co Ltd filed Critical Mitsuboshi Diamond Ind Co Ltd
Publication of TW201546003A publication Critical patent/TW201546003A/en
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Publication of TWI644872B publication Critical patent/TWI644872B/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26FPERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F3/00Severing by means other than cutting; Apparatus therefor
    • B26F3/002Precutting and tensioning or breaking
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/01Means for holding or positioning work
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033Apparatus for opening score lines in glass sheets

Abstract

The subject of the present invention is to shorten the time required for breaking in a breaking device of glass substrate. The device is used for breaking along a first and a second scribe line on a glass substrate G, which is formed a first scribe line extending in a first direction and a second scribe line extending in a second direction crossing the first direction. The breaking device has a conveying belt 2, a first breaking mechanism 11, and a second breaking mechanism 12. The conveying belt 2 has a mounting surface 2a, and conveys the glass substrate G mounted on the mounting surface 2a along the first direction. The first breaking mechanism 11 breaks the glass substrate G mounted on the conveying belt 2 along the first scribe line. The second breaking mechanism 11 breaks the glass substrate G mounted on the conveying belt 2 along the second scribe line.

Description

脆性材料基板之裂斷裝置 Cracking device for brittle material substrate

本發明係關於一種裂斷裝置,尤其是關於一種用於對形成有於第1方向延伸之第1刻劃線、及於與第1方向交叉之第2方向延伸之第2刻劃線的脆性材料基板沿著第1及第2刻劃線進行分斷的裂斷裝置。 The present invention relates to a breaking device, and more particularly to a brittleness for forming a first scribe line extending in a first direction and a second scribe line extending in a second direction intersecting the first direction A cracking device in which the material substrate is separated along the first and second scribe lines.

專利文獻1及專利文獻2揭示有裂斷玻璃基板等脆性材料基板之裝置。在此等文獻中所揭示之裝置中,首先,藉由刻劃裝置於脆性材料基板形成刻劃線。然後,藉由裂斷裝置按壓脆性材料基板,沿著刻劃線將其裂斷。 Patent Document 1 and Patent Document 2 disclose an apparatus for breaking a substrate of a brittle material such as a glass substrate. In the devices disclosed in these documents, first, a scribe line is formed on a substrate of a brittle material by a scribing device. Then, the brittle material substrate is pressed by the rupture device, and it is broken along the scribe line.

裂斷裝置,具有:於表面具有橡膠等之緩衝墊之平台、及配置於平台上方之裂斷棒。脆性材料基板,係將形成有刻劃線之側之面向下並載置於平台上。然後,將裂斷棒從脆性材料基板之上面進行按壓。藉此,脆性材料基板於緩衝墊上撓曲,且沿著刻劃線裂斷。 The breaking device has a platform having a cushion such as rubber on the surface, and a split rod disposed above the platform. The brittle material substrate is formed with the side of the scored side facing down and placed on the platform. Then, the split rod is pressed from the upper surface of the brittle material substrate. Thereby, the brittle material substrate is deflected on the cushion and is broken along the score line.

專利文獻1:日本特開2002-103295號公報 Patent Document 1: Japanese Laid-Open Patent Publication No. 2002-103295

專利文獻2:日本特開2002-187098號公報 Patent Document 2: Japanese Laid-Open Patent Publication No. 2002-187098

此處,廣泛被採行有:於一片母基板之表面,形成相互正交之第1方向及第2方向之刻劃線,其後,沿著兩刻劃線裂斷成複數個單位基板。 Here, it is widely used to form a scribe line in the first direction and the second direction which are orthogonal to each other on the surface of one mother substrate, and then to form a plurality of unit substrates along the two scribe lines.

在藉由專利文獻1及2之裝置進行如上述般之裂斷的情形,首先,沿著第1方向之刻劃線而以如前述般之方法進行裂斷。此時,平台就每一刻劃線之間距進行移動,且裂斷棒依刻劃線之數量進行升降。其後,使平台旋轉90°。然後,沿著第2方向之刻劃線,以與第1方向之裂斷同樣之方法進行裂斷。 In the case where the above-described cracking is performed by the apparatus of Patent Documents 1 and 2, first, the scribe line along the first direction is broken by the method as described above. At this time, the platform moves at a distance between each scribe line, and the split rod is lifted and lowered according to the number of scribe lines. Thereafter, the platform is rotated by 90°. Then, the scribe line along the second direction is broken in the same manner as the crack in the first direction.

如上述之習知的裝置中,必須依照第1方向及第2方向之兩方之刻劃線之數量使一裂斷棒升降。又,用於使平台於水平面內旋轉之機構為必要。因此,伴隨刻劃線之數量增加而使得裂斷所需時間變長,此外,裂斷棒及其升降機構之磨損增加而使壽命變短。 In the conventional device described above, it is necessary to raise and lower a split bar in accordance with the number of the scribe lines in both the first direction and the second direction. Also, a mechanism for rotating the platform in a horizontal plane is necessary. Therefore, as the number of the score lines increases, the time required for the breakage becomes longer, and in addition, the wear of the split rod and its lifting mechanism increases to shorten the life.

本發明之課題係在於縮短裂斷所需之時間。 The subject of the present invention is to reduce the time required for cracking.

本發明之一脆性材料基板之裂斷裝置,係用於對形成有於第1方向延伸之第1刻劃線、及於與第1方向交叉之第2方向延伸之第2刻劃線的脆性材料基板,沿著第1及第2刻劃線進行分斷之裝置。 A device for breaking a brittle material substrate according to the present invention is for brittleness of a first scribe line extending in a first direction and a second scribe line extending in a second direction intersecting with a first direction The material substrate is a device that is broken along the first and second scribe lines.

該裂斷裝置,具備:搬送帶、第1裂斷機構、第2裂斷機構。搬送帶,具有載置面,將載置於載置面之脆性材料基板沿著第1方向進行搬送。第1裂斷機構,將載置於搬送帶之脆性材料基板沿著第1刻劃線進行分斷。第2裂斷機構,將載置於搬送帶之脆性材料基板沿著第2刻劃線進行分斷。 The breaking device includes a conveyor belt, a first breaking mechanism, and a second breaking mechanism. The conveyor belt has a mounting surface, and conveys the brittle material substrate placed on the placement surface in the first direction. In the first breaking mechanism, the brittle material substrate placed on the conveyor belt is divided along the first scribe line. In the second breaking mechanism, the brittle material substrate placed on the conveyor belt is cut along the second scribe line.

該裝置中,形成有第1及第2刻劃線之脆性材料基板,載置於搬送帶並被往第一方向搬送。而且,藉由第1裂斷機構,將脆性材料基板沿著第1刻劃線裂斷。又,藉由第2裂斷機構,將脆性材料基板沿著第2刻劃線裂斷。 In this apparatus, the brittle material substrate on which the first and second scribe lines are formed is placed on the conveyor belt and conveyed in the first direction. Further, the brittle material substrate is broken along the first scribe line by the first breaking mechanism. Further, the brittle material substrate is broken along the second scribe line by the second breaking mechanism.

此處,藉由第1裂斷機構及第2裂斷機構,能夠並行地進行 沿著第1刻劃線之裂斷與沿著第2刻劃線之裂斷。因此能夠縮短裂斷所需時間。 Here, the first breaking mechanism and the second breaking mechanism can be performed in parallel The break along the first scribe line and the break along the second scribe line. Therefore, the time required for the break can be shortened.

在本發明之另一脆性材料基板之裂斷裝置中,第1及第2裂斷機構,在已將脆性材料基板之搬送姿勢維持成相同姿勢之狀態下,沿著第1及第2刻劃線進行分斷。 In the cracking device for another brittle material substrate according to the present invention, the first and second rupture mechanisms are scribed along the first and second lands in a state in which the transport posture of the brittle material substrate is maintained in the same posture. The line is broken.

此處,不需要習知裝置中的90°旋轉機構。 Here, the 90° rotation mechanism in the conventional device is not required.

本發明之再另一脆性材料基板之裂斷裝置中,第1裂斷機構具有於第1方向延伸且可升降之第1裂斷棒。第2裂斷機構具有於第2方向延伸且可升降之第2裂斷棒。第1及第2裂斷棒,對形成有第1及第2刻劃線之脆性材料基板從與形成有各刻劃線之面相反側之面施加按壓力而進行分斷。搬送帶,可在已載置於載置面之脆性材料基板從第1及第2裂斷棒接受到按壓力時彈性變形。 In still another breaking device for a brittle material substrate according to the present invention, the first breaking mechanism has a first splitting bar that extends in the first direction and is movable up and down. The second breaking mechanism has a second splitting bar that extends in the second direction and is movable up and down. In the first and second splitting bars, the brittle material substrate on which the first and second scribe lines are formed is divided by applying a pressing force from a surface opposite to the surface on which each scribe line is formed. The conveyor belt is elastically deformable when the brittle material substrate that has been placed on the placement surface receives the pressing force from the first and second fracture bars.

該裝置中,脆性材料基板接受裂斷棒之按壓力。具體而言,對脆性材料基板之與形成有刻劃線之面相反側之面,直接地或者透過搬送帶,以各裂斷機構之裂斷棒按壓。藉由裂斷棒之按壓,搬送帶撓曲,因此脆性材料基板沿著刻劃線被裂斷。 In this device, the brittle material substrate receives the pressing force of the split rod. Specifically, the surface of the brittle material substrate opposite to the surface on which the score line is formed is directly or transmitted through the transfer belt, and is pressed by the split rod of each of the fracture mechanisms. The belt is deflected by the pressing of the split rod, so that the brittle material substrate is broken along the score line.

本發明之再另一脆性材料基板之裂斷裝置中,第1裂斷棒可於第2方向移動。 In still another breaking device for a brittle material substrate according to the present invention, the first splitting bar is movable in the second direction.

此處,第2裂斷棒於複數個第1刻劃線之各個位置移動,且於各移動位置實行裂斷處理。 Here, the second split bar moves at each of the plurality of first score lines, and the splitting process is performed at each of the moving positions.

本發明之再另一脆性材料基板之裂斷裝置中,第1裂斷機構,具有第1上裂斷棒與第1下裂斷棒。第1上裂斷棒,配置於搬送帶之 載置面之上方且於第1方向延伸。第1下裂斷棒,配置於載置面之下方且於第1方向延伸。第1上裂斷棒及第1下裂斷棒,可升降且可於第2方向移動。 In still another brittle device for a brittle material substrate according to the present invention, the first breaking mechanism has a first upper splitting bar and a first lower splitting bar. The first upper split bar is disposed on the conveyor belt It is above the mounting surface and extends in the first direction. The first lower splitting bar is disposed below the mounting surface and extends in the first direction. The first upper split bar and the first lower split bar are movable up and down and movable in the second direction.

而且,第1上裂斷棒,對在與載置面接觸之下表面形成有第1刻劃線之脆性材料基板從上方進行按壓,使搬送帶彈性變形而沿著第1刻劃線分斷脆性材料基板。又,第1下裂斷棒,對在上表面形成有第1刻劃線之脆性材料基板,透過搬送帶施加按壓力,使搬送帶彈性變形而分斷脆性材料基板。 Further, the first upper splitting bar presses the brittle material substrate having the first scribe line formed on the surface in contact with the mounting surface from above, and elastically deforms the conveying belt to break along the first scribe line. A brittle material substrate. In the first lower splitting bar, a brittle material substrate having a first scribe line formed on the upper surface is applied, and a pressing force is applied through the conveying belt to elastically deform the conveying belt to separate the brittle material substrate.

本發明之再另一脆性材料基板之裂斷裝置中,第2裂斷機構,具有第2上裂斷棒與第2下裂斷棒。第2上裂斷棒,配置於搬送帶之載置面之上方且於第2方向延伸。第2下裂斷棒,配置於載置面之下方且於第2方向延伸。第2上裂斷棒及第2下裂斷棒可升降。 In still another breaking device for a brittle material substrate according to the present invention, the second breaking mechanism has a second upper splitting bar and a second lower splitting bar. The second upper split bar is disposed above the mounting surface of the conveyor belt and extends in the second direction. The second lower split bar is disposed below the placement surface and extends in the second direction. The second upper splitting bar and the second lower splitting bar can be raised and lowered.

而且,第2上裂斷棒,對在與載置面接觸之下表面形成有第2刻劃線之脆性材料基板從上方進行按壓,使搬送帶彈性變形而分斷脆性材料基板。又,第2下裂斷棒,對在上表面形成有第2刻劃線之脆性材料基板,透過搬送帶施加按壓力,使搬送帶彈性變形而分斷脆性材料基板。 Further, the second upper split bar presses the brittle material substrate having the second scribe line formed on the surface in contact with the mounting surface from above, and elastically deforms the transfer belt to break the brittle material substrate. Further, in the second lower splitting bar, a brittle material substrate having a second scribe line formed on the upper surface is applied, and a pressing force is applied through the conveying belt to elastically deform the conveying belt to separate the brittle material substrate.

根據本發明,能夠對在第1方向及與第1方向交叉之第2方向形成有刻劃線之脆性材料基板,以較短的時間進行裂斷。 According to the present invention, it is possible to form a brittle material substrate in which the scribe line is formed in the first direction and the second direction intersecting the first direction, and the crack can be broken in a short time.

1‧‧‧裂斷裝置 1‧‧‧breaking device

2‧‧‧搬送帶 2‧‧‧Transportation belt

2a‧‧‧載置面 2a‧‧‧Loading surface

11‧‧‧第1裂斷機構 11‧‧‧1st fracture mechanism

12‧‧‧第2裂斷機構 12‧‧‧2nd Broken Mechanism

14‧‧‧第1上裂斷棒 14‧‧‧1st upper splitting bar

16‧‧‧第1下裂斷棒 16‧‧‧1st lower splitting bar

24‧‧‧第2上裂斷棒 24‧‧‧2nd upper splitting bar

26‧‧‧第2下裂斷棒 26‧‧‧2nd lower splitting bar

G‧‧‧玻璃基板 G‧‧‧glass substrate

圖1係裂斷裝置之概略俯視圖。 Figure 1 is a schematic plan view of a splitting device.

圖2係裂斷裝置之概略前視圖。 Figure 2 is a schematic front view of the breaking device.

圖3係第1裂斷機構之概略側視圖。 Fig. 3 is a schematic side view of the first breaking mechanism.

圖4係第1裂斷機構之概略側視圖。 Fig. 4 is a schematic side view of the first breaking mechanism.

圖5係第1裂斷機構之概略側視圖。 Fig. 5 is a schematic side view of the first breaking mechanism.

圖6係第1裂斷機構之概略側視圖。 Fig. 6 is a schematic side view of the first breaking mechanism.

圖7係第1裂斷機構之概略側視圖。 Fig. 7 is a schematic side view of the first breaking mechanism.

圖8係第1裂斷機構之概略側視圖。 Fig. 8 is a schematic side view of the first breaking mechanism.

圖9係第1裂斷機構之概略側視圖。 Fig. 9 is a schematic side view of the first breaking mechanism.

圖10係第1裂斷機構之概略側視圖。 Fig. 10 is a schematic side view of the first breaking mechanism.

圖11係第1裂斷機構之概略側視圖。 Figure 11 is a schematic side view of the first breaking mechanism.

圖1係本發明之一實施形態之裂斷裝置之概略俯視圖,圖2係其前視圖。如此等圖所示,裂斷裝置1係對作為脆性材料基板之玻璃基板G沿著刻劃線進行裂斷之裝置。 Fig. 1 is a schematic plan view of a breaking device according to an embodiment of the present invention, and Fig. 2 is a front view thereof. As shown in the figures, the breaking device 1 is a device for breaking a glass substrate G which is a substrate of a brittle material along a score line.

[玻璃基板G] [Glass substrate G]

本實施形態中,玻璃基板G係貼合基板。即,玻璃基板G藉由第1基板G1與第2基板G2所構成。在各基板G1、G2,於裂斷裝置1中的處理之前步驟中,形成有於第1方向(此處,為裂斷裝置1中的基板搬送方向)延伸之複數個第1刻劃線、及於第2方向延伸之複數個第2刻劃線。第1方向與第2方向係正交之方向。即,第1刻劃線與第2刻劃線正交。 In the present embodiment, the glass substrate G is bonded to the substrate. In other words, the glass substrate G is composed of the first substrate G1 and the second substrate G2. In each of the substrates G1 and G2, in the step before the processing in the cracking device 1, a plurality of first scribe lines extending in the first direction (here, the substrate transport direction in the rupture device 1) are formed. And a plurality of second scribe lines extending in the second direction. The direction in which the first direction and the second direction are orthogonal to each other. That is, the first scribe line is orthogonal to the second scribe line.

此處,於本實施形態中的玻璃基板G,以第1基板G1配置於上側、第2基板G2配置於下側之狀態搬送。而且,各基板G1、G2之刻劃線,形成於與貼合面相反側之面。即,在上方之第1基板G1,於上側之 面形成有刻劃線;在下方之第2基板G2,於下側之面形成有刻劃線。 Here, the glass substrate G in the present embodiment is placed in a state in which the first substrate G1 is disposed on the upper side and the second substrate G2 is disposed on the lower side. Further, the scribe lines of the respective substrates G1 and G2 are formed on the surface opposite to the bonding surface. That is, the upper first substrate G1 is on the upper side. A scribe line is formed on the surface, and a scribe line is formed on the lower surface of the second substrate G2.

於第1基板G1與第2基板G2之間構成有例如液晶層。又,玻璃基板G,具有配置於第1基板G1與第2基板G2之間的密封構件(省略圖示)。藉由該密封構件圍繞液晶層。 For example, a liquid crystal layer is formed between the first substrate G1 and the second substrate G2. Further, the glass substrate G has a sealing member (not shown) disposed between the first substrate G1 and the second substrate G2. The liquid crystal layer is surrounded by the sealing member.

[裂斷裝置1] [Cracking device 1]

裂斷裝置1,具備:搬送帶2、配置於搬送方向上游側之第1裂斷機構11、及配置於第1裂斷機構11之搬送方向下游側之第2裂斷機構12。 The breaking device 1 includes a conveyor belt 2, a first breaking mechanism 11 disposed on the upstream side in the conveying direction, and a second breaking mechanism 12 disposed on the downstream side in the conveying direction of the first breaking mechanism 11.

<搬送帶2> <Transport belt 2>

搬送帶2,具有載置玻璃基板G之載置面2a。搬送帶2具有可撓性,例如,可由天然橡膠、合成橡膠、布、或是合成樹脂等而形成。搬送帶2,以施有張力至不鬆弛之程度的狀態跨架於複數個搬送輥3之間。又,搬送帶2於圖2中順時針地旋轉。即,搬送帶2,將載置於載置面2a之玻璃基板G從圖2之左往右方向進行搬送。 The conveyor belt 2 has a mounting surface 2a on which the glass substrate G is placed. The conveyor belt 2 has flexibility, and can be formed, for example, of natural rubber, synthetic rubber, cloth, or synthetic resin. The conveyance belt 2 is bridged between the plurality of conveyance rollers 3 in a state where the tension is applied to the extent that it is not slack. Further, the conveyor belt 2 rotates clockwise in Fig. 2 . In other words, the conveyance belt 2 conveys the glass substrate G placed on the placement surface 2a from the left to the right in FIG. 2 .

<第1裂斷機構11> <1st fracture mechanism 11>

第1裂斷機構11,對載置於搬送帶2之玻璃基板G沿著第1刻劃線進行分斷。第1裂斷機構11,如圖1及圖2所示,具有第1上裂斷棒14、一對第1上支持構件15a、15b、第1下裂斷棒16、一對第1下支持構件17a、17b、及第1上門架18以及第1下門架。另外,未於圖中表示出第1下門架。 The first breaking mechanism 11 breaks the glass substrate G placed on the conveyor belt 2 along the first scribe line. As shown in FIGS. 1 and 2, the first breaking mechanism 11 includes a first upper splitting bar 14, a pair of first upper supporting members 15a and 15b, a first lower splitting bar 16, and a pair of first lower support. The members 17a and 17b and the first upper gantry 18 and the first lower gantry. In addition, the first lower gantry is not shown in the figure.

第1上裂斷棒14,配置於搬送帶2之載置面2a之上方,且於第1方向(搬送方向)延伸。第1上裂斷棒14,對載置於載置面2a上之玻璃基板G從上方進行按壓,且係用於對玻璃基板G沿著第1刻劃線S進行裂斷之構件。詳細而言,如圖3等所示,第1上裂斷棒14之前端部,係以 朝向前端而厚度漸漸變薄之方式構成。而且,第1上裂斷棒14,利用前端部(下端部)對玻璃基板G進行按壓。又,第1上裂斷棒14,例如藉由流體汽缸(圖示省略)驅動,且可升降。 The first upper split bar 14 is disposed above the mounting surface 2a of the conveyor belt 2 and extends in the first direction (transport direction). The first upper split bar 14 presses the glass substrate G placed on the mounting surface 2a from above and is used to break the glass substrate G along the first scribe line S. Specifically, as shown in FIG. 3 and the like, the front end of the first upper split bar 14 is It is formed toward the front end and gradually thicker. Further, the first upper split bar 14 presses the glass substrate G by the tip end portion (lower end portion). Further, the first upper split bar 14 is driven by, for example, a fluid cylinder (not shown), and is movable up and down.

一對第1上支持構件15a、15b,配置於搬送帶2之載置面2a之上方,且於第1方向延伸。又,一對第1上支持構件15a、15b,以夾著第1上裂斷棒14之方式配置。一對第1上支持構件15a、15b,係抵接於載置在載置面2a之玻璃基板G之表面(上面),用於支持玻璃基板G之構件。又,一對第1上支持構件15a、15b,例如藉由流體汽缸(圖示省略)驅動,且可升降。 The pair of first upper support members 15a and 15b are disposed above the placement surface 2a of the conveyor belt 2 and extend in the first direction. Further, the pair of first upper support members 15a and 15b are disposed so as to sandwich the first upper split bars 14. The pair of first upper support members 15a and 15b are in contact with the member (the upper surface) of the glass substrate G placed on the placement surface 2a, and are used to support the glass substrate G. Further, the pair of first upper support members 15a and 15b are driven by, for example, a fluid cylinder (not shown), and are movable up and down.

第1上門架18,配置於第1上裂斷棒14及一對第1上支持構件15a、15b之更上方,且對此等構件14、15a、15b於第2方向、即與搬送方向正交之方向移動自如地支持。 The first upper gantry 18 is disposed above the first upper split bar 14 and the pair of first upper support members 15a and 15b, and the members 14, 15a and 15b are positive in the second direction, that is, in the transport direction. The direction of the transfer is freely supported.

如從圖2可清楚得知,第1下裂斷棒16、一對第1下支持構件17a、17b及第1下門架(未圖示),配置於藉由進行循環之搬送帶2所構成之空間R內。第1下裂斷棒16及一對第1下支持構件17a、17b,分別相對於第1上裂斷棒14及一對第1上支持構件15a、15b以夾著載置面2a之方式構成上下對稱。第1下裂斷棒16、一對第1下支持構件17a、17b及第1下門架,係與第1上裂斷棒14、一對第1上支持構件15a、15b及第1上門架18基本上為相同之構成。 As is clear from FIG. 2, the first lower splitting bar 16, the pair of first lower supporting members 17a and 17b, and the first lower gantry (not shown) are disposed on the transport belt 2 by circulation. The space R is formed. The first lower splitting bar 16 and the pair of first lower supporting members 17a and 17b are respectively formed to sandwich the mounting surface 2a with respect to the first upper splitting bar 14 and the pair of first upper supporting members 15a and 15b. Symmetrical up and down. The first lower splitting bar 16, the pair of first lower supporting members 17a and 17b, and the first lower gantry are connected to the first upper splitting bar 14, the pair of first upper supporting members 15a and 15b, and the first upper gantry 18 is basically the same composition.

<第2裂斷機構12> <2nd fracture mechanism 12>

第2裂斷機構12,對載置於搬送帶2之玻璃基板G沿著第2刻劃線進行分斷。第2裂斷機構12,具有第2上裂斷棒24、一對第2上支持構件25a、 25b、第2下裂斷棒26、一對第2下支持構件27a、27b、及第2上門架28以及第2下門架。另外,未於圖中表示出第2下門架。 The second breaking mechanism 12 breaks the glass substrate G placed on the conveyor belt 2 along the second scribe line. The second breaking mechanism 12 has a second upper splitting bar 24, a pair of second upper supporting members 25a, 25b, the second lower split bar 26, the pair of second lower support members 27a and 27b, the second upper gantry 28, and the second lower gantry. In addition, the second lower gantry is not shown in the figure.

第2上裂斷棒24,配置於搬送帶2之載置面2a之上方,且於第2方向(與搬送方向正交之方向)延伸。第2上裂斷棒24,係對載置於載置面2a上之玻璃基板G從上方進行按壓,用於將玻璃基板G沿著第2刻劃線進行裂斷之構件。詳細而言,如圖2所示,第2上裂斷棒24之前端部,係以朝向前端而厚度漸漸變薄之方式構成。而且,第2上裂斷棒24,利用前端部(下端部)對玻璃基板G進行按壓。又,第2上裂斷棒24,例如藉由流體汽缸(圖示省略)驅動,且可升降。 The second upper split bar 24 is disposed above the placing surface 2a of the conveyor belt 2 and extends in the second direction (direction orthogonal to the conveying direction). The second upper split bar 24 is a member for pressing the glass substrate G placed on the mounting surface 2a from above, and is used to break the glass substrate G along the second scribe line. Specifically, as shown in FIG. 2, the front end portion of the second upper split bar 24 is configured to be gradually thinner toward the tip end. Further, the second upper split bar 24 presses the glass substrate G by the tip end portion (lower end portion). Further, the second upper split bar 24 is driven by, for example, a fluid cylinder (not shown), and is movable up and down.

一對第2上支持構件25a、25b,配置於搬送帶2之載置面2a之上方,且於第2方向延伸。又,一對第2上支持構件25a、25b,以夾著第2上裂斷棒24之方式配置。一對第2上支持構件25a、25b,係抵接於載置在載置面2a之玻璃基板G之表面(上面),用於支持玻璃基板G之構件。又,一對第2上支持構件25a、25b,例如藉由流體汽缸(圖示省略)驅動,且可升降。 The pair of second upper support members 25a and 25b are disposed above the placement surface 2a of the conveyor belt 2 and extend in the second direction. Further, the pair of second upper support members 25a and 25b are disposed so as to sandwich the second upper split bars 24. The pair of second upper supporting members 25a and 25b are in contact with the member (the upper surface) of the glass substrate G placed on the placing surface 2a, and are used to support the glass substrate G. Further, the pair of second upper support members 25a and 25b are driven by, for example, a fluid cylinder (not shown), and are movable up and down.

第2上門架28,配置於第2上裂斷棒24及一對第2上支持構件25a、25b之更上方,且對此等構件24、25a、25b於第1方向、即搬送方向移動自如地支持。 The second upper gantry 28 is disposed above the second upper split bar 24 and the pair of second upper support members 25a and 25b, and the members 24, 25a, and 25b are movable in the first direction, that is, in the transport direction. Support.

第2下裂斷棒26、一對第2下支持構件27a、27b及第2下門架(未圖示),與第1下裂斷棒16、一對第1下支持構件17a、17b及第1下門架一起配置於藉由進行循環之搬送帶2所構成之空間R內。第2下裂斷棒26及一對第2下支持構件27a、27b,係分別相對於第2上裂斷棒24 及一對第2上支持構件25a、25b以夾著載置面2a之方式構成上下對稱。第2下裂斷棒26、一對第2下支持構件27a、27b及第2下門架,係與第2上裂斷棒24、一對第2上支持構件25a、25b及第2上門架28基本上為相同之構成。 The second lower split bar 26, the pair of second lower support members 27a and 27b, and the second lower gantry (not shown), and the first lower split bar 16 and the pair of first lower support members 17a and 17b and The first lower gantry is disposed together in the space R formed by the transport belt 2 that circulates. The second lower split bar 26 and the pair of second lower support members 27a and 27b are respectively opposed to the second upper split bar 24 The pair of second upper support members 25a and 25b are vertically symmetrical with the mounting surface 2a interposed therebetween. The second lower split bar 26, the pair of second lower support members 27a and 27b, and the second lower gantry are connected to the second upper split bar 24, the pair of second upper support members 25a and 25b, and the second upper gantry 28 is basically the same composition.

[動作:第1裂斷機構11] [Action: 1st breaking mechanism 11]

首先,如圖1所示,將玻璃基板G載置於搬送帶2之載置面2a,且藉由搬送帶2搬送玻璃基板G。而且,在玻璃基板G到達第1上裂斷棒14之正下方之第1裂斷位置時,停止搬送帶2所進行之玻璃基板G之搬送。 First, as shown in FIG. 1, the glass substrate G is placed on the mounting surface 2a of the conveyance belt 2, and the glass substrate G is conveyed by the conveyance belt 2. When the glass substrate G reaches the first fracture position immediately below the first upper splitting bar 14, the conveyance of the glass substrate G by the conveyance belt 2 is stopped.

<沿著端部以外之刻劃線之裂斷> <cracking along the line other than the end>

當將玻璃基板G設定於第1裂斷位置時,如圖3(圖3以後之圖式,係從沿著搬送方向之方向觀察第1裂斷機構11)所示,使一對第1下支持構件17a、17b向上方移動,且藉由第1下支持構件17a、17b從下方支持搬送帶2。此處,一對第1下支持構件17a、17b,隔著搬送帶2而位於玻璃基板G之下。 When the glass substrate G is set to the first fracture position, as shown in FIG. 3 (the figure of FIG. 3 and later, the first fracture mechanism 11 is viewed from the direction along the conveyance direction), the pair is made to be the first one. The support members 17a and 17b move upward, and the conveyance belt 2 is supported from below by the first lower support members 17a and 17b. Here, the pair of first lower support members 17a and 17b are positioned below the glass substrate G with the conveyance belt 2 interposed therebetween.

接下來,如圖4所示,使第1上裂斷棒14往下方移動。藉此,第1上裂斷棒14對基板G往下方進行按壓。另外,第1上裂斷棒14按壓於第1刻劃線S上。藉由其按壓力,玻璃基板G與搬送帶2一起撓曲。其結果為,下方之第2基板G2沿著第1刻劃線S而被裂斷。 Next, as shown in FIG. 4, the first upper split bar 14 is moved downward. Thereby, the first upper split bar 14 presses the substrate G downward. Further, the first upper split bar 14 is pressed against the first scribe line S. The glass substrate G is flexed together with the conveyor belt 2 by the pressing force thereof. As a result, the lower second substrate G2 is broken along the first scribe line S.

接下來,在使第1上裂斷棒14及第1下支持構件17a、17b返回原本之位置後,如圖5所示,使一對第1上支持構件15a、15b往下方移動,且藉由第1上支持構件15a、15b從上方支持搬送帶2。此處,一對第1上支持構件15a、15b抵接於玻璃基板G之上面。 Next, after returning the first upper splitting bar 14 and the first lower supporting members 17a and 17b to the original position, as shown in FIG. 5, the pair of first upper supporting members 15a and 15b are moved downward and borrowed. The conveyance belt 2 is supported from above by the first upper support members 15a and 15b. Here, the pair of first upper support members 15a and 15b abut on the upper surface of the glass substrate G.

在以如以上之方式支持玻璃基板G的狀態下,如圖6所示,使第1下裂斷棒16往上方移動。藉此,第1下裂斷棒16對玻璃基板G透過搬送帶2往上方進行按壓。其結果為,玻璃基板G與搬送帶2一起撓曲,且上方之第1基板G1沿著第1刻劃線S而被裂斷。 In a state where the glass substrate G is supported as described above, as shown in FIG. 6, the first lower splitting bar 16 is moved upward. Thereby, the first lower splitting bar 16 presses the glass substrate G through the transport belt 2 upward. As a result, the glass substrate G is bent together with the conveyance belt 2, and the upper first substrate G1 is broken along the first scribe line S.

一邊使各裂斷棒14、16及各支持構件15a、15b、17a、17b於第2方向移動,一邊針對所有的刻劃線實行以上之處理。藉此,能夠沿著第1方向之複數個第1刻劃線裂斷玻璃基板G。 The above processing is performed for all the score lines while moving the split bars 14 and 16 and the support members 15a, 15b, 17a, and 17b in the second direction. Thereby, the glass substrate G can be broken along the plurality of first scribe lines in the first direction.

<沿著端部之刻劃線之裂斷> <cracking along the end of the line>

此處,在沿著形成於玻璃基板G之端部的第1刻劃線進行裂斷之情形,有時會有無法利用如前述般之方法進行裂斷的情形。亦即,例如,有時會有無法藉由一對第1下支持構件17a、17b支持玻璃基板G中的第1刻劃線兩側的情形。在沿著如此般之形成於端部之刻劃線進行裂斷之情形時,藉由如以下之方法進行。 Here, in the case where the first scribe line formed at the end portion of the glass substrate G is broken, there is a case where the cracking cannot be performed by the method as described above. In other words, for example, there may be cases where the both sides of the first scribe line in the glass substrate G cannot be supported by the pair of first lower support members 17a and 17b. In the case where the scribe line is formed in such a manner as to be broken at the end portion, it is carried out by the following method.

首先,如圖7所示,使一對第1下支持構件17a、17b往上方移動,且藉由第1下支持構件17a、17b從下方支持搬送帶2。另外,一方之(基板內側之)第1下支持構件17a,雖隔著搬送帶2而位於玻璃基板G之下,但另一方之(基板外側之)第1下支持構件17b並無隔著搬送帶2而位於玻璃基板G之下。 First, as shown in FIG. 7, the pair of first lower support members 17a and 17b are moved upward, and the conveyance belt 2 is supported from below by the first lower support members 17a and 17b. Further, the first lower support member 17a (on the inner side of the substrate) is positioned below the glass substrate G via the transfer belt 2, but the other lower support member 17b (outside the substrate) is not transported. The belt 2 is located below the glass substrate G.

接下來,如圖8所示,使第1上裂斷棒14往下方移動。藉此,第1上裂斷棒14對玻璃基板G往下方進行按壓,玻璃基板G與搬送帶2一起撓曲。另外,第1上裂斷棒14按壓於第1刻劃線S上。其結果為,沿著形成於第2基板G2之第1刻劃線S將第2基板G2裂斷。 Next, as shown in FIG. 8, the first upper split bar 14 is moved downward. Thereby, the first upper splitting bar 14 presses the glass substrate G downward, and the glass substrate G is bent together with the conveying belt 2. Further, the first upper split bar 14 is pressed against the first scribe line S. As a result, the second substrate G2 is broken along the first scribe line S formed on the second substrate G2.

接下來,在使各構件回到原本位置後,使上下之各裂斷棒14、16及上下之各支持構件15a、15b、17a、17b移動至玻璃基板G之更端部側。於圖9揭示有此狀態。然後,如圖10所示,使一方之(基板內側之)第1上支持構件15a往下方移動,並且使一方之(基板內側之)第1下支持構件17a往上方移動。其結果為,玻璃基板G之內側部分,藉由第1上支持構件15a與第1下支持構件17a夾持而被支持。另一方面,較玻璃基板G之第1刻劃線S更外側之端部,並未藉由第1上支持構件15b與第1下支持構件17b夾持。另外,第1上支持構件15a與第1下支持構件17a,不僅夾持玻璃基板G亦夾持搬送帶2。 Next, after returning each member to the original position, the upper and lower split bars 14, 16 and the upper and lower support members 15a, 15b, 17a, and 17b are moved to the more end side of the glass substrate G. This state is disclosed in FIG. Then, as shown in FIG. 10, the first upper support member 15a (the inner side of the substrate) is moved downward, and the first lower support member 17a (the inner side of the substrate) is moved upward. As a result, the inner portion of the glass substrate G is supported by being sandwiched by the first upper support member 15a and the first lower support member 17a. On the other hand, the end portion on the outer side of the first scribe line S of the glass substrate G is not sandwiched by the first upper support member 15b and the first lower support member 17b. Further, the first upper support member 15a and the first lower support member 17a sandwich the conveyance belt 2 not only by sandwiching the glass substrate G.

接下來,如圖11所示,使第1上裂斷棒14往下方移動。藉此,第1上裂斷棒14對玻璃基板G之端部往下方進行按壓,端部往下方撓曲。 Next, as shown in FIG. 11, the first upper split bar 14 is moved downward. As a result, the first upper split bar 14 presses the end portion of the glass substrate G downward, and the end portion is deflected downward.

其結果為,沿著形成於第1基板G1之刻劃線S將第1基板G1裂斷。 As a result, the first substrate G1 is broken along the scribe line S formed on the first substrate G1.

以如以上之方式,第1裂斷機構11能夠對玻璃基板G沿著第1刻劃線S進行裂斷。 As described above, the first breaking mechanism 11 can break the glass substrate G along the first scribe line S.

[動作:第2裂斷機構12] [Action: 2nd breaking mechanism 12]

接著,驅動搬送帶2,將玻璃基板G搬送至第2裂斷機構12之第2裂斷位置。此時,玻璃基板G以維持著相同搬送姿勢被搬送。亦即,不進行如習知裝置般使其90°反轉之處理。第2裂斷機構12中的裂斷處理,僅刻劃線之方向相異,基本之動作則與第1裂斷機構11中的動作相同。 Next, the conveyor belt 2 is driven to convey the glass substrate G to the second breaking position of the second breaking mechanism 12. At this time, the glass substrate G is conveyed while maintaining the same conveyance posture. That is, the processing of inverting 90° is not performed as in the conventional device. The cracking treatment in the second breaking mechanism 12 differs only in the direction in which the scribe lines are different, and the basic operation is the same as the operation in the first breaking mechanism 11.

另外,於第2裂斷機構12中,除了使裂斷棒等各構件於第1方向移動並對玻璃基板G進行裂斷之外,亦能夠在維持固定裂斷棒等各 構件之於第1方向之位置的狀態下驅動搬送帶2使玻璃基板G就每一第2刻劃線之間距進行移動並實行裂斷處理。 In addition, in the second breaking mechanism 12, in addition to moving the members such as the split rod in the first direction and breaking the glass substrate G, it is also possible to maintain the fixed crack bars and the like. When the member is in the position of the first direction, the conveyance belt 2 is driven to move the glass substrate G by the distance between each of the second scribe lines, and the breaking process is performed.

[其他實施形態] [Other Embodiments]

以上,雖已說明關於本發明之實施形態,但本發明並不限定於該等實施形態,可在不脫離本發明之趣旨下做各種變更。 The embodiments of the present invention have been described above, but the present invention is not limited to the embodiments, and various modifications can be made without departing from the scope of the invention.

變形例1 Modification 1

(a)於前述實施形態中,雖第1裂斷機構11位於搬送方向之上游側,第2裂斷機構12位於搬送方向之下游側,但各機構之位置關係並不特別限定於此。 (a) In the above embodiment, the first breaking mechanism 11 is located on the upstream side in the conveying direction, and the second breaking mechanism 12 is located on the downstream side in the conveying direction. However, the positional relationship of each mechanism is not particularly limited thereto.

(b)於前述實施形態中,作為脆性材料基板雖以貼合玻璃基板為例進行了說明,但脆性材料基板並不特別限定於此。 (b) In the above embodiment, the brittle material substrate has been described as an example in which the glass substrate is bonded, but the brittle material substrate is not particularly limited thereto.

1‧‧‧裂斷裝置 1‧‧‧breaking device

2‧‧‧搬送帶 2‧‧‧Transportation belt

2a‧‧‧載置面 2a‧‧‧Loading surface

11‧‧‧第1裂斷機構 11‧‧‧1st fracture mechanism

12‧‧‧第2裂斷機構 12‧‧‧2nd Broken Mechanism

14‧‧‧第1上裂斷棒 14‧‧‧1st upper splitting bar

15a、15b‧‧‧第1上支持構件 15a, 15b‧‧‧1st upper support member

18‧‧‧第1上門架 18‧‧‧1st gantry

24‧‧‧第2上裂斷棒 24‧‧‧2nd upper splitting bar

25a、25b‧‧‧第2上支持構件 25a, 25b‧‧‧2nd support member

28‧‧‧第2上門架 28‧‧‧2nd gantry

G‧‧‧玻璃基板 G‧‧‧glass substrate

Claims (6)

一種脆性材料基板之裂斷裝置,用於對形成有於第1方向延伸之第1刻劃線、及於與前述第1方向交叉之第2方向延伸之第2刻劃線的脆性材料基板,沿著前述第1及第2刻劃線進行分斷,其特徵在於,具備有:搬送帶,具有載置面,且將載置於前述載置面之脆性材料基板沿前述第1方向搬送;第1裂斷機構,將載置於前述搬送帶之脆性材料基板沿著前述第1刻劃線分斷;以及第2裂斷機構,將載置於前述搬送帶之脆性材料基板沿著前述第2刻劃線分斷。 A cracking device for a brittle material substrate, comprising: a brittle material substrate on which a first scribe line extending in a first direction and a second scribe line extending in a second direction intersecting the first direction are formed; The first and second scribe lines are divided along the first and second scribe lines, and the transfer belt is provided with a mounting surface, and the brittle material substrate placed on the mounting surface is transported in the first direction; The first breaking mechanism divides the brittle material substrate placed on the transfer belt along the first scribe line; and the second rupturing mechanism places the brittle material substrate placed on the transfer belt along the first 2 lines are broken. 如申請專利範圍第1項之脆性材料基板之裂斷裝置,其中,前述第1及第2裂斷機構,在已將脆性材料基板之搬送姿勢維持成相同姿勢之狀態下,沿著前述第1及第2刻劃線進行分斷。 The cracking device for a brittle material substrate according to the first aspect of the invention, wherein the first and second breaking mechanisms are maintained along the first posture in a state in which the transport posture of the brittle material substrate is maintained in the same posture. And the second scribe line is broken. 如申請專利範圍第1或2項之脆性材料基板之裂斷裝置,其中,前述第1裂斷機構具有於前述第1方向延伸且可升降之第1裂斷棒;前述第2裂斷機構具有於前述第2方向延伸且可升降之第2裂斷棒;前述第1及第2裂斷棒,對形成有前述第1及第2刻劃線之脆性材料基板從與形成有前述各刻劃線之面相反側之面施加按壓力而進行分斷;前述搬送帶,可在已載置於前述載置面之脆性材料基板從前述第1及第2裂斷棒接受到按壓力時彈性變形。 The cracking device for a brittle material substrate according to claim 1 or 2, wherein the first breaking mechanism has a first splitting bar extending in the first direction and capable of ascending and descending; and the second breaking mechanism has a second splitting bar extending in the second direction and capable of ascending and descending; the first and second splitting bars forming a slick on the brittle material substrate on which the first and second scribe lines are formed The surface opposite to the surface of the line is divided by a pressing force; and the conveying belt is elastically deformable when the brittle material substrate placed on the mounting surface receives the pressing force from the first and second splitting bars. . 如申請專利範圍第3項之脆性材料基板之裂斷裝置,其中,前述第1裂斷棒可於前述第2方向移動。 A breaking device for a brittle material substrate according to claim 3, wherein the first splitting bar is movable in the second direction. 如申請專利範圍第1項之脆性材料基板之裂斷裝置,其中,前述第1裂斷機構具有配置於前述搬送帶之前述載置面之上方且於前述第1方向延伸之第1上裂斷棒、及配置於前述載置面之下方且於前述第1方向延伸之第1下裂斷棒;前述第1上裂斷棒及前述第1下裂斷棒,係可升降且可於前述第2方向移動;前述第1上裂斷棒,對在與前述載置面接觸之下表面形成有第1刻劃線之脆性材料基板從上方進行按壓,使前述搬送帶彈性變形而分斷前述脆性材料基板;前述第1下裂斷棒,對在上表面形成有第1刻劃線之脆性材料基板,透過前述搬送帶施加按壓力,使前述搬送帶彈性變形而分斷前述脆性材料基板。 The cracking device for a brittle material substrate according to the first aspect of the invention, wherein the first breaking mechanism has a first upper fracture that is disposed above the mounting surface of the conveyor belt and extends in the first direction. a rod and a first lower splitting bar disposed below the mounting surface and extending in the first direction; the first upper splitting bar and the first lower splitting bar are movable up and down The first upper splitting bar presses the brittle material substrate having the first scribe line formed on the surface in contact with the mounting surface from above, and elastically deforms the conveying belt to break the brittleness. The material substrate; the first lower splitting bar, the brittle material substrate having the first scribe line formed on the upper surface thereof, and a pressing force applied through the conveying belt to elastically deform the conveying belt to separate the brittle material substrate. 如申請專利範圍第1或5項之脆性材料基板之裂斷裝置,其中,前述第2裂斷機構,具有配置於前述搬送帶之前述載置面之上方且於前述第2方向延伸之第2上裂斷棒、及配置於前述載置面之下方且於前述第2方向延伸之第2下裂斷棒;前述第2上裂斷棒及前述第2下裂斷棒可升降;前述第2上裂斷棒,對在與前述載置面接觸之下表面形成有第2刻劃線之脆性材料基板從上方進行按壓,使前述搬送帶彈性變形而分斷前述脆性材料基板; 前述第2下裂斷棒,對在上表面形成有第2刻劃線之脆性材料基板,透過前述搬送帶施加按壓力,使前述搬送帶彈性變形而分斷前述脆性材料基板。 The cracking device for a brittle material substrate according to the first or fifth aspect of the invention, wherein the second breaking mechanism has a second portion that is disposed above the mounting surface of the conveyor belt and extends in the second direction. a splitting bar and a second lower split bar disposed below the mounting surface and extending in the second direction; the second upper split bar and the second lower split bar are movable up and down; The upper cracking bar presses the brittle material substrate having the second scribe line formed on the surface in contact with the mounting surface from above, and elastically deforms the conveying belt to break the brittle material substrate; In the second lower splitting bar, a brittle material substrate having a second scribe line formed on the upper surface thereof is subjected to a pressing force by the conveying belt, and the conveying belt is elastically deformed to separate the brittle material substrate.
TW104101931A 2014-06-13 2015-01-21 Cracking device for brittle material substrate TWI644872B (en)

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