TW201512119A - Scribing wheel, holder unit, scribing device, method for manufacturing scribing wheel, and scribing method - Google Patents

Scribing wheel, holder unit, scribing device, method for manufacturing scribing wheel, and scribing method Download PDF

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Publication number
TW201512119A
TW201512119A TW103121514A TW103121514A TW201512119A TW 201512119 A TW201512119 A TW 201512119A TW 103121514 A TW103121514 A TW 103121514A TW 103121514 A TW103121514 A TW 103121514A TW 201512119 A TW201512119 A TW 201512119A
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Taiwan
Prior art keywords
wheel
blade
scribing
leading edge
diamond
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TW103121514A
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Chinese (zh)
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TWI657060B (en
Inventor
Mitsuru Kitaichi
Kenji Murakami
Naoko Tomei
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Mitsuboshi Diamond Ind Co Ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0017Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
    • B28D5/0029Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rotating
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/10Glass-cutting tools, e.g. scoring tools
    • C03B33/105Details of cutting or scoring means, e.g. tips
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B3/00Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools
    • B24B3/60Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of tools not covered by the preceding subgroups
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/225Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00Accessories specially adapted for use with machines or devices of the preceding groups
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/027Scoring tool holders; Driving mechanisms therefor
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033Apparatus for opening score lines in glass sheets

Abstract

Provided is a kind of scribing wheel having a blade made solely of diamond to perform the cutting on the ceramic substrate which is harder than glass substrate and having a longer service life, a holder unit, a scribing device, a method for manufacturing the scribing wheel, and a scribing method. The present invention contains a blade 42 made solely of diamond, and a front edge 43 of the blade having an R angle processing of radius 0.8-5 [mu]m used for the scribing wheel 40, which can significantly reduce a gap formation in the front edge as compared to that without R angle processing.

Description

刻劃輪、保持具單元、刻劃裝置、刻劃輪之製造方法及刻劃方法 Scoring wheel, holder unit, scoring device, manufacturing method of scoring wheel and scribing method

本發明係關於適合在陶瓷基板、藍寶石基板、矽基板等較一般的非晶質玻璃基板更硬質之脆性材料基板表面形成刻劃線之刻劃輪、具備此刻劃輪之保持具單元、刻劃裝置、刻劃輪之製造方法及劃線方法。 The present invention relates to a scribing wheel which is formed by scribing a surface of a brittle material substrate which is more rigid on a relatively ordinary amorphous glass substrate such as a ceramic substrate, a sapphire substrate or a tantalum substrate, and a holder unit having the engraved wheel, engraved The drawing device, the manufacturing method of the marking wheel, and the scribing method.

對用於液晶面板等之非晶質玻璃基板進行分斷時,一般而言,係使用如專利文獻1所揭示之由超硬合金構成之刻劃輪、或由較超硬合金硬質之多晶鑽石(金剛石)燒結體構成之刻劃輪。此種多晶鑽石燒結體,係將混合了鑽石粒子(含有量75~90vol%)與結合材(鈷等)之物,在高温高壓下加以燒結者。 When the amorphous glass substrate used for a liquid crystal panel or the like is divided, generally, a scribing wheel made of a super hard alloy as disclosed in Patent Document 1 or a polycrystalline harder than a super hard alloy is used. A diamond (diamond) sintered body constitutes a marking wheel. Such a polycrystalline diamond sintered body is obtained by mixing diamond particles (containing 75 to 90 vol%) with a binder (such as cobalt) and sintering them under high temperature and high pressure.

然而,在進行例如較玻璃基板硬質之氧化鋁等陶瓷基板之分斷時,專利文獻1所揭示之由超硬合金構成之刻劃輪、及由多晶鑽石燒結體構成之刻劃輪,刃前緣會立刻產生缺口或摩耗,僅數十m程度即無法形成裂痕。因此,使用由超硬合金構成之刻劃輪、或由多晶鑽石燒結體構成之刻劃輪來進行較玻璃基板更硬質之陶瓷基板等之分斷,實際上是不可行的。 However, when the ceramic substrate such as alumina which is harder than the glass substrate is cut, the scribing wheel made of a super hard alloy and the scoring wheel composed of the polycrystalline diamond sintered body disclosed in Patent Document 1 are used. The leading edge will immediately produce a gap or wear, and only a few tens of meters will not form a crack. Therefore, it is practically impossible to perform the division of a ceramic substrate or the like which is harder than a glass substrate by using a scribing wheel made of a super-hard alloy or a scribing wheel composed of a polycrystalline diamond sintered body.

因此,在進行陶瓷基板等之硬質基板之分斷時,使用由較超硬合金及多晶鑽石燒結體更硬質之多晶鑽石及單晶鑽石構成之刻劃輪來進行一事,一直以來皆有所探討。 Therefore, when performing the cutting of a hard substrate such as a ceramic substrate, a scribing wheel composed of a polycrystalline diamond and a single crystal diamond which are harder than the super hard alloy and the polycrystalline diamond sintered body is used, and it has been conventionally Discussed.

先行技術文獻Advanced technical literature

[專利文獻1]日本實開昭55-106635號公報 [Patent Document 1] Unexamined Japanese Patent Publication No. 55-106635

當使用僅由多晶鑽石及單晶鑽石等鑽石構成之刻劃輪進行、陶瓷基板之分斷時,與使用由超硬合金或多晶鑽石燒結體構成之刻劃輪相較,可形成更長之分斷所須的裂痕。 When the ceramic substrate is cut by a scribe wheel composed of only diamonds such as polycrystalline diamonds and single crystal diamonds, it can be formed more than the use of a scribed wheel composed of a superhard alloy or a polycrystalline diamond sintered body. The cracks required for the long break.

然而,即使是僅由鑽石構成之刻劃輪,由於陶瓷基板非常的硬,因此並無法完全防止刃前緣缺口之形成或摩耗。因此,希望能有一種能盡可能防止刃前緣之缺口及摩耗,可長時間使用之刻劃輪。 However, even in the case of a scribing wheel composed only of diamonds, since the ceramic substrate is extremely hard, formation or wear of the leading edge of the blade cannot be completely prevented. Therefore, it is desirable to have a scribing wheel that can prevent the notch of the leading edge of the blade and the wear of the blade as long as possible.

本發明之目的在提供一種使用刃僅由鑽石構成之刻劃輪進行較玻璃基板硬質之陶瓷基板等之分斷時,具有更長壽命之刻劃輸、保持具單元、刻劃裝置、刻劃輪之製造方法及劃線方法。 SUMMARY OF THE INVENTION An object of the present invention is to provide a sculpt, a holder unit, a scoring device, and a scriber having a longer life span when a dicing wheel composed of only a diamond is used to break a ceramic substrate or the like which is harder than a glass substrate. Wheel manufacturing method and scribing method.

為達成上述目的,本發明之刃僅由鑽石構成之刻劃輪,其刃之刃前緣施有半徑0.8~5μm之R角加工。 In order to achieve the above object, the blade of the present invention is only a scribing wheel composed of diamonds, and the leading edge of the blade edge is processed by an R angle having a radius of 0.8 to 5 μm.

根據本發明之刻劃輪,由於刃前緣施有R角加工而成圓弧,因此即使是用於陶瓷基板等之分斷,與未施有R角加工之刻劃輪相較,能大幅減少刃前緣形成缺口,使刻劃輪之壽命更長。 According to the scribing wheel of the present invention, since the leading edge of the blade is processed by the R angle to form an arc, even if it is used for the division of the ceramic substrate or the like, it can be significantly larger than the scribing wheel which is not subjected to the R angle processing. Reduce the gap at the leading edge of the blade to make the life of the scribe wheel longer.

又,本發明之刻劃輸中,前述鑽石為單晶鑽石。 Further, in the scribing of the present invention, the diamond is a single crystal diamond.

根據本發明之刻劃輸,能在透過單晶鑽石之結晶方位減少對 強度之影響的同時,抑制刃前緣缺口之形成,延長刻劃輪之壽命。 According to the engraving of the present invention, the crystal orientation of the single crystal diamond can be reduced. At the same time of the influence of the strength, the formation of the leading edge of the blade is suppressed, and the life of the scoring wheel is prolonged.

又,本發明之刻劃輪,係用於選自陶瓷、藍寶石及矽構成之群中之至少一種脆性材料基板之分斷。 Further, the scribing wheel of the present invention is used for the division of at least one brittle material substrate selected from the group consisting of ceramics, sapphire and rhodium.

根據本發明之刻劃輪,對較用於液晶面板等一般之非晶質玻璃基板更硬之脆性材料基板,能良好的進行長距離之切斷。 According to the scribing wheel of the present invention, the brittle material substrate which is harder than a general amorphous glass substrate such as a liquid crystal panel can be cut well over a long distance.

又,本發明之保持具單元,具有上述任一項之刻劃輪、與將前述刻劃輪保持成旋轉自如之保持具。 Further, the holder unit of the present invention includes the scribing wheel of any of the above, and a holder for holding the scribing wheel in a rotatable manner.

根據本發明之保持具單元,能大幅減少刻劃輪刃前緣缺口之形成,延長刻劃輪之壽命,為一適合進行陶瓷基板等之分斷的保持具單元。 According to the holder unit of the present invention, the formation of the leading edge notch of the scribing wheel blade can be greatly reduced, and the life of the scoring wheel can be extended, and the holder unit can be used for the separation of the ceramic substrate or the like.

又,本發明之刻劃裝置,具備上述保持具單元。 Moreover, the scoring device of the present invention includes the above-described holder unit.

根據本發明之刻劃裝置,能大幅減少刻劃輪刃前緣缺口之形成,延長刻劃輪之壽命,為一適合進行陶瓷基板等之分斷的刻劃裝置。 According to the scoring device of the present invention, the formation of the leading edge notch of the scribing wheel blade can be greatly reduced, and the life of the scoring wheel can be prolonged, which is a scribing device suitable for breaking the ceramic substrate or the like.

又,本發明之刻劃輪之製造方法,包含於僅由鑽石構成之圓板狀構件形成刃的步驟、與對前述刃之刃前緣進行R角加工的步驟。 Moreover, the manufacturing method of the scribe wheel of the present invention includes a step of forming a blade by a disk-shaped member made of only diamond, and a step of performing R-angle processing on the leading edge of the blade edge.

根據本發明之刻劃輪之製造方法,由於在形成刃後,進行刃前緣之R角加工,因此藉由對刃表面進行充分之研磨降低刃之表面粗糙度,而能防止刃表面形成缺口,進一步延長刻劃輪之壽命。此外,在形成刃後,進行刃前緣之R角加工,因此較易進行達到作為目標之刃前緣半徑之加工。 According to the manufacturing method of the scribing wheel of the present invention, since the R-angle processing of the leading edge of the blade is performed after the blade is formed, the surface roughness of the blade is reduced by sufficiently grinding the surface of the blade, thereby preventing the blade surface from forming a gap. To further extend the life of the scoring wheel. Further, after the blade is formed, the R angle processing of the leading edge of the blade is performed, so that it is easier to perform the processing of the target leading edge radius.

又、本發明之劃線方法,係以刃僅由鑽石構成之刻劃輪,於選自由陶瓷、藍寶石及矽構成之群中之至少一種脆性材料基板上形成刻劃線,其係使用前述該刃之刃前緣施有半徑0.8~5μm之R角加工的前述刻劃輪。 Further, the scribing method of the present invention is characterized in that the scribing wheel is composed of only a diamond, and the scribing line is formed on at least one of the brittle material substrates selected from the group consisting of ceramics, sapphire and samarium. The cutting edge of the blade edge is applied with an R angle of 0.8 to 5 μm.

根據本發明之劃線方法,藉由刃僅由鑽石構成之刻劃輪,對較用於液晶面板等一般之非晶質玻璃基板更硬之脆性材料基板,能形成更長距離之刻劃線。 According to the scribing method of the present invention, the scribing wheel composed of only the diamond is used to form a longer-distance line for a brittle material substrate which is harder than a general amorphous glass substrate such as a liquid crystal panel. .

10‧‧‧刻劃裝置 10‧‧‧ scoring device

11‧‧‧移動台 11‧‧‧Mobile Station

12a、12b‧‧‧導軌 12a, 12b‧‧‧ rails

13‧‧‧滾珠螺桿 13‧‧‧Ball screw

14、15‧‧‧馬達 14, 15‧‧ ‧ motor

16‧‧‧桌台 16‧‧‧Table

17‧‧‧玻璃基板 17‧‧‧ glass substrate

18‧‧‧CCD攝影機 18‧‧‧CCD camera

19‧‧‧橋架 19‧‧‧ Bridge

20a、20b‧‧‧支柱 20a, 20b‧‧ ‧ pillar

21‧‧‧刻劃頭 21‧‧‧Scratch

22‧‧‧導件 22‧‧‧ Guides

23‧‧‧保持具接頭 23‧‧‧Holding joints

23a‧‧‧旋轉軸部 23a‧‧‧Rotary shaft

23b‧‧‧接頭部 23b‧‧‧Connector

24a、24b‧‧‧軸承 24a, 24b‧‧‧ bearing

24c‧‧‧間隔件 24c‧‧‧ spacer

25‧‧‧圓形開口 25‧‧‧Circular opening

26‧‧‧內部空間 26‧‧‧Internal space

27‧‧‧磁石 27‧‧‧ Magnet

28‧‧‧平行銷 28‧‧‧ parallel sales

30‧‧‧保持具單元 30‧‧‧Holding unit

31‧‧‧保持具 31‧‧‧Holding

32‧‧‧安裝部 32‧‧‧Installation Department

32a‧‧‧傾斜部 32a‧‧‧ inclined section

32b‧‧‧平坦部 32b‧‧‧flat

33‧‧‧保持槽 33‧‧‧ Keep the slot

34a、34b‧‧‧支承部 34a, 34b‧‧‧ support

35‧‧‧支承孔 35‧‧‧Support hole

40、140‧‧‧刻劃輪 40, 140‧‧‧ marking wheel

41‧‧‧刀輪本體部 41‧‧‧Cutter wheel body

42、52‧‧‧刃 42, 52‧‧ ‧ blade

43‧‧‧刃前緣 43‧‧‧blade front

43a‧‧‧稜線部 43a‧‧‧Ring Department

44‧‧‧貫通孔 44‧‧‧through holes

51‧‧‧銷 51‧‧ ‧ sales

52a、53a‧‧‧旋轉軸 52a, 53a‧‧‧Rotary axis

52b、53b‧‧‧砥石之平面 52b, 53b‧‧‧ plane of the meteorite

53‧‧‧砥石 53‧‧‧砥石

圖1係實施形態之刻劃裝置的概略圖。 Fig. 1 is a schematic view showing a scribing apparatus of an embodiment.

圖2係實施形態之保持具接頭的前視圖。 Figure 2 is a front elevational view of the holder joint of the embodiment.

圖3係實施形態之保持具單元的立體圖。 Fig. 3 is a perspective view of the holder unit of the embodiment.

圖4(A)係實施形態之刻劃輪的側視圖、圖4(B)係刻劃輪的前視圖。 Fig. 4(A) is a side view of the scribing wheel of the embodiment, and Fig. 4(B) is a front view of the scoring wheel.

圖5(A)係實施形態之刃前緣之R角加工前的前視圖、圖5(B)係刃前緣之R角加工後的前視圖。 Fig. 5(A) is a front view of the rake front edge of the embodiment before the R angle machining, and Fig. 5(B) is a front view of the rake front edge after the R angle machining.

圖6(A)係顯示R角加工之一方法的概念圖、圖6(B)係顯示R角加工之另一方法的概念圖。 Fig. 6(A) is a conceptual diagram showing one of the methods of R angle processing, and Fig. 6(B) is a conceptual diagram showing another method of R angle processing.

圖7(A)係顯示實施形態之刻劃輪之拍攝點的說明圖、圖7(B)係實施形態之刻劃輪之刃前緣的照片。 Fig. 7(A) is an explanatory view showing a photographing point of the marking wheel of the embodiment, and Fig. 7(B) is a photograph of the leading edge of the marking wheel of the embodiment.

圖8係用以比較之刻劃輪之刃前緣的照片。 Figure 8 is a photograph of the leading edge of the scribe wheel for comparison.

圖9(A)係關於實施形態之刻劃輪的圖表、圖9(B)係關於用以比較之刻劃輪的圖表。 Fig. 9(A) is a diagram of a scribe wheel of the embodiment, and Fig. 9(B) is a diagram for a scribe wheel for comparison.

以下,使用圖面說明本發明之實施形態。不過,以下所示實施形態僅為使本發明之技術思想具體化之一例,並無任何將本發明特定於此實施形態之意圖。本發明當然可適用於申請專利範圍中所含之其他實施 形態。 Hereinafter, embodiments of the present invention will be described using the drawings. However, the embodiments described below are merely examples of the technical idea of the present invention, and the present invention is not intended to be specific to the embodiments. The invention is of course applicable to other implementations included in the scope of the patent application. form.

圖1係本發明一實施形態之刻劃裝置10的概略圖。刻劃裝置10具備移動台11。移動台11與滾珠螺桿13螺合,藉由馬達14之驅動使此滾珠螺桿13旋轉,據以沿一對導軌12a、12b移動於y軸方向。 Fig. 1 is a schematic view of a scoring apparatus 10 according to an embodiment of the present invention. The scribing device 10 is provided with a mobile station 11. The moving table 11 is screwed to the ball screw 13, and the ball screw 13 is rotated by the driving of the motor 14, thereby moving in the y-axis direction along the pair of guide rails 12a, 12b.

於移動台11之上面設置有馬達15。馬達15使位於上部之桌台16於xy平面旋轉並將之定位於既定角度。作為分斷(scribe)對象物之強化玻璃基板17被裝載於桌台16上,以未圖示之真空吸引手段等加以保持。 A motor 15 is disposed above the mobile station 11. The motor 15 rotates the upper table 16 in the xy plane and positions it at a predetermined angle. The tempered glass substrate 17 as a scribe object is placed on the table 16 and held by a vacuum suction means (not shown) or the like.

此脆性材料基板17係由低温燒成陶瓷及高温燒成陶瓷構成之陶瓷基板、矽基板、藍寶石基板等,選自由陶瓷、藍寶石及矽所構成之群中之至少一種脆性材料基板,較液晶面板之基板等一般所使用之非晶質玻璃基板更硬質的脆性材料基板。 The brittle material substrate 17 is a ceramic substrate made of a low-temperature fired ceramic or a high-temperature fired ceramic, a tantalum substrate, a sapphire substrate, or the like, and is selected from at least one type of brittle material substrate composed of ceramic, sapphire, and tantalum. A substrate such as a substrate, which is generally used as an amorphous glass substrate, is a harder brittle material substrate.

刻劃裝置10,於裝載在桌台16之強化玻璃基板17上方,裝備有用以拍攝形成在此強化玻璃基板17表面之對準標記的二台CCD攝影機18。橋架19以跨於移動台11與其上部之桌台16之方式,沿x軸方向架設於支柱20a、20b。 The scribing device 10 is mounted on the tempered glass substrate 17 of the table 16 and equipped with two CCD cameras 18 for taking an alignment mark formed on the surface of the tempered glass substrate 17. The bridge 19 is mounted on the pillars 20a and 20b in the x-axis direction so as to straddle the table 11 of the moving table 11 and the upper portion thereof.

於橋架19安裝有導件22,刻劃頭21設置成可被此導件22引導而往x軸方向移動。於刻劃頭21,透過保持具接頭23安裝有保持具單元30。 A guide 22 is mounted to the bridge 19, and the scribing head 21 is disposed to be guided by the guide 22 to move in the x-axis direction. At the scribe head 21, the holder unit 30 is attached through the holder joint 23.

圖2係安裝有保持具單元30之保持具接頭23的前視圖。又,圖3係保持具單元30的立體圖。 2 is a front view of the holder joint 23 to which the holder unit 30 is mounted. 3 is a perspective view of the holder unit 30.

保持具接頭23呈略圓柱狀,具備旋轉軸部23a與接頭部 23b。在保持具接頭23安裝於刻劃頭21之狀態下,旋轉軸部23a透過圓筒形之間隔件24c安裝於二個軸承24a、24b,此保持具接頭23被保持成旋動自如。 The holder joint 23 has a substantially cylindrical shape and includes a rotating shaft portion 23a and a joint portion. 23b. In a state where the holder joint 23 is attached to the scribing head 21, the rotating shaft portion 23a is attached to the two bearings 24a, 24b through the cylindrical spacer 24c, and the holder joint 23 is held to be rotatable.

於圓柱形之接頭部23b,設有下端側具圓形開口25之內部空間26。此內部空間26之上部埋設有磁石27。而藉由磁石27裝卸自如之保持具單元30,插入安裝在此內部空間26。 The cylindrical joint portion 23b is provided with an inner space 26 having a circular opening 25 at the lower end side. A magnet 27 is embedded in the upper portion of the internal space 26. The holder unit 30 is detachably mounted by the magnet 27, and is inserted into the internal space 26.

保持具單元30係保持具31、刻劃輪40、以及銷(pin、未圖示)成一體者。保持具31具有圖3所示之略圓柱形,以磁性體金屬形成。於保持具31之上部設有定位用安裝部32。此安裝部32係將保持具31之上部切開形成,具備傾斜部32a與平坦部32b。 The holder unit 30 is a holder 31, a scoring wheel 40, and a pin (pin, not shown). The holder 31 has a substantially cylindrical shape as shown in Fig. 3 and is formed of a magnetic metal. A positioning attachment portion 32 is provided on the upper portion of the holder 31. The mounting portion 32 is formed by cutting the upper portion of the holder 31, and includes an inclined portion 32a and a flat portion 32b.

將保持具31之安裝部32側透過開口25插入內部空間26。此時,保持具31之上端側被磁石27吸引,安裝部32之傾斜部32a與通過內部空間26之平行銷28接觸,據以進行保持具單元30對保持具接頭23之定位與固定。又,在從保持具接頭23取下保持具單元30時,只要將保持具31往下方拉即能輕易地取下。 The mounting portion 32 side of the holder 31 is inserted into the internal space 26 through the opening 25. At this time, the upper end side of the holder 31 is attracted by the magnet 27, and the inclined portion 32a of the mounting portion 32 comes into contact with the parallel pin 28 passing through the internal space 26, whereby the positioning and fixing of the holder unit 30 to the holder joint 23 are performed. Further, when the holder unit 30 is removed from the holder joint 23, the holder 31 can be easily removed by pulling it downward.

由於刻劃輪40係消耗品,需定期進行更換。本實施形態中,為了容易地進行保持具單元30之裝拆,係藉由更換保持具單元30本身,以進行構成保持具單元30之刻劃輪40之更換,能迅速地更換刻劃輪40。 Since the scoring wheel 40 is a consumable item, it needs to be replaced periodically. In the present embodiment, in order to easily attach and detach the holder unit 30, the holder unit 30 itself is replaced, and the scribing wheel 40 constituting the holder unit 30 is replaced, so that the scribing wheel 40 can be quickly replaced. .

於保持具31下部,設有切開保持具31形成之保持槽33。在為設置此保持槽33而切開之保持具31之下部,夾著保持槽33有支承部34a、34b。於此保持槽33,刻劃輪40以旋轉自如之方式配置。又,於支承部34a、34b分別形成有用以旋轉自如的保持刻劃輪40之銷插入的支承孔 35。 In the lower portion of the holder 31, a holding groove 33 in which the slit holder 31 is formed is provided. The lower portion of the holder 31 which is cut to provide the holding groove 33 has support portions 34a and 34b sandwiching the holding groove 33. Here, the groove 33 is held, and the scribing wheel 40 is rotatably arranged. Further, a support hole for inserting a pin for holding the scribing wheel 40 rotatably is formed in each of the support portions 34a and 34b. 35.

其次,說明用以分斷脆性材料基板17之刻劃輪40之細節。圖4(A)安裝在保持具31前端之刻劃輪40的側視圖、圖4(B)係刻劃輪40的前視圖。 Next, details of the scribing wheel 40 for breaking the brittle material substrate 17 will be described. 4(A) is a side view of the scribe wheel 40 attached to the front end of the holder 31, and FIG. 4(B) is a front view of the scribe wheel 40.

如圖4所示,刻劃輪40呈圓板狀,具備刀輪本體部41、刃42、與刃前緣43。 As shown in FIG. 4, the scoring wheel 40 has a disk shape and includes a cutter wheel body portion 41, a blade 42, and a blade leading edge 43.

於刀輪本體部41之中心附近,形成有將此刀輪本體部41貫通於旋轉軸方向之貫通孔44。藉由於貫通孔44插入銷,刻劃輪40即能透過此銷被旋轉自如地保持於保持具31。 A through hole 44 that penetrates the cutter wheel main body portion 41 in the direction of the rotation axis is formed in the vicinity of the center of the cutter wheel main body portion 41. By inserting the pin through the through hole 44, the scribing wheel 40 can be rotatably held by the holder 31 through the pin.

刃42,於刀輪本體部41之外周形成為圓環狀。刃42在前視下呈略V字狀,相對於旋轉軸方向之刃52之厚度,隨著朝向刃前端43而漸漸變小。 The blade 42 is formed in an annular shape on the outer circumference of the cutter wheel main body portion 41. The blade 42 has a substantially V shape in a front view, and the thickness of the blade 52 with respect to the rotation axis direction gradually decreases toward the tip end 43 of the blade.

刃前緣43,與一般之刻劃輪之刃前緣不同,刃42之前端施有後述之R角加工,沿最外周部呈圓弧狀。 The blade leading edge 43 is different from the leading edge of the general scribing wheel, and the front end of the blade 42 is subjected to an R-angle machining to be described later, and has an arc shape along the outermost peripheral portion.

接著,使用圖面說明刻劃輪40之製造方法。圖5係以圖4(B)之圓A所示之刃42前端的放大圖、圖5(A)係加工前之刃前緣43的前視圖、圖5(B)係加工後之刃前緣43的前視圖。 Next, a method of manufacturing the scribing wheel 40 will be described using a drawing. Fig. 5 is an enlarged view of the front end of the blade 42 shown by a circle A of Fig. 4(B), Fig. 5(A) is a front view of the blade leading edge 43 before machining, and Fig. 5(B) is a blade front after machining. Front view of the edge 43.

刻劃輪40,係如多晶鑽石及單晶鑽石般,不包含結合材而僅以鑽石形成。本實施形態中,刻劃輪40係以單晶鑽石形成。 The scoring wheel 40, like a polycrystalline diamond and a single crystal diamond, does not contain a bonding material but is formed only of diamonds. In the present embodiment, the scoring wheel 40 is formed of a single crystal diamond.

由單晶鑽石構成之刻劃輪40,首先,係形成由單晶鑽石構成之圓板狀構件。具體而言,單晶鑽石係人工合成之物,以高温高壓合成法或化學氣相沉積法製造。接著,將此單晶鑽石以雷射等方式切出具有所 欲半徑之圓板。 The scribing wheel 40 composed of a single crystal diamond first forms a disc-shaped member made of a single crystal diamond. Specifically, the single crystal diamond is a synthetic product produced by a high temperature high pressure synthesis method or a chemical vapor deposition method. Then, the single crystal diamond is cut out by laser or the like. A circular plate of radius.

其次,圓板狀之單晶鑽石,藉由分別沿削圓板之圓周部之兩面側,以形成具有如圖5(A)所示之前端尖形狀之刃前緣43的刃42。又,此時之刃前緣43之稜線部以符號43a表示。此狀態係一般的刻劃輪。此時,單晶鑽石與習知PCD及超硬合金相較能使表面粗糙度更小,其結果,刃前緣稜線部更為銳利。 Next, a disk-shaped single crystal diamond is formed on both sides of the circumferential portion of the circular plate to form a blade 42 having a blade leading edge 43 having a tip end shape as shown in Fig. 5(A). Further, the ridge line portion of the blade leading edge 43 at this time is indicated by reference numeral 43a. This state is a general scoring wheel. At this time, the single crystal diamond can have a smaller surface roughness than the conventional PCD and the superhard alloy, and as a result, the ridgeline portion of the blade leading edge is sharper.

其次,對刃42之刃前緣43進行R角加工,從稜線部43a進行研磨,沿圖5(B)所示之最外周部、於前視下使刃前緣43之前端成圓形。 Next, the blade leading edge 43 of the blade 42 is subjected to R-angle processing, and is polished from the ridge portion 43a to form a circular shape at the front end of the blade leading edge 43 in the front view along the outermost peripheral portion shown in Fig. 5(B).

此處,針對使刃前緣43之前端成圓弧之R角加工之具體方向,使用圖面加以說明。例如,作為一個方法,如圖6(A)所示,於刻劃輪40之貫通孔44插入支承用之銷51,一邊使刻劃輪40旋轉、一邊相對以旋轉軸52a為中心旋轉之圓板狀砥石52之平面52b垂直的抵接刃前緣43,並使銷51於箭頭所示方向交互的擺動。據此,即能使刃前緣43之前端成圓形。 Here, the specific direction of the R-angle machining in which the front end of the blade leading edge 43 is formed into a circular arc will be described using the drawings. For example, as shown in FIG. 6(A), the support pin 51 is inserted into the through hole 44 of the scribing wheel 40, and the scribing wheel 40 is rotated while rotating around the rotation shaft 52a. The plane 52b of the slab-shaped vermiculite 52 abuts the blade leading edge 43 perpendicularly and causes the pin 51 to alternately oscillate in the direction indicated by the arrow. Accordingly, the front end of the blade leading edge 43 can be made circular.

又,另一方法,則係如圖6(B)所示,於刻劃輪40之貫通孔44插入支承用之銷51,一邊使刻劃輪40旋轉、一邊相對以旋轉軸53a為中心旋轉之具柔軟性之軟質的砥石53之平面53b垂直的抵接刃前緣43。此時,會陷入砥石53之平面53b,即能使刃前緣43之前端成圓形。 In addition, as shown in FIG. 6(B), the support pin 51 is inserted into the through hole 44 of the scribing wheel 40, and the scoring wheel 40 is rotated while rotating about the rotation shaft 53a. The flat 53b of the soft, soft vermiculite 53 is perpendicular to the leading edge 43 of the blade. At this time, it will fall into the plane 53b of the vermiculite 53, that is, the front end of the blade leading edge 43 may be rounded.

藉由以上方法,能製造刃42之刃前緣43呈圓形之刻劃輪40。又,本實施形態中,如圖5(A)所示,係在使刃前緣43之前端成圓形之前,先分別沿削圓板之圓周部兩面側,以形成前端尖的傾斜面。因此,能將刃42之傾斜面好好的研磨至鏡面狀,使刃42之表面粗糙度為最小,而 進一步延長刃42之壽命。又,由於是先完成刃42之傾斜面、再進行刃前緣43之R角加工,因此較易加工至作為目標之R半徑。 By the above method, the cutting edge 40 of the blade leading edge 43 of the blade 42 can be made circular. Further, in the present embodiment, as shown in Fig. 5(A), before the front end of the blade leading edge 43 is rounded, the inclined surfaces of the tip end are formed along the both sides of the circumferential portion of the circular plate. Therefore, the inclined surface of the blade 42 can be polished to a mirror shape to minimize the surface roughness of the blade 42. The life of the blade 42 is further extended. Further, since the inclined surface of the blade 42 is completed first and the R angle of the leading edge 43 is processed, it is easy to process to the target R radius.

其次,說明刻劃輪40之尺寸。刻劃輪40之外徑為1.0~10.0mm、較佳為1.0~5.0mm之範圍、尤以1.0~3.0mm更佳。刻劃輪40之外徑小於1.0mm時,刻劃輪40之操作性將降低。另一方面,當刻劃輪40之外徑大於10.0mm時,則有可能產生刻劃時之垂直裂痕相對脆性材料基板17無法充分深入形成的情形。 Next, the size of the scoring wheel 40 will be described. The outer diameter of the scoring wheel 40 is preferably 1.0 to 10.0 mm, preferably 1.0 to 5.0 mm, and more preferably 1.0 to 3.0 mm. When the outer diameter of the scoring wheel 40 is less than 1.0 mm, the operability of the scoring wheel 40 will be lowered. On the other hand, when the outer diameter of the scribing wheel 40 is larger than 10.0 mm, there is a possibility that the vertical crack at the time of scribing cannot be sufficiently formed with respect to the brittle material substrate 17.

刻劃輪40之厚度為0.4~1.2mm、較佳的是0.4~1.1mm之範圍。刻劃輪40之厚度小於0.4mm時,有可能會使加工性及操作性降低。另一方面,當刻劃輪40之厚度大於1.2mm時,刻劃輪40之材料及製造成本變高。此外,貫通孔45之孔徑,例如為0.8mm。 The thickness of the scoring wheel 40 is in the range of 0.4 to 1.2 mm, preferably 0.4 to 1.1 mm. When the thickness of the scoring wheel 40 is less than 0.4 mm, workability and workability may be lowered. On the other hand, when the thickness of the scribing wheel 40 is larger than 1.2 mm, the material and manufacturing cost of the scoring wheel 40 become high. Further, the diameter of the through hole 45 is, for example, 0.8 mm.

刃42之刃前緣角通常為鈍角之90~160°、較佳為100~150°之範圍。 The leading edge angle of the blade 42 is usually in the range of 90 to 160 degrees, preferably 100 to 150 degrees.

又,關於前端之圓形刃前緣43,R角加工之R半徑若小於0.8μm的話,荷重會集中於刃前緣之前端,造成局部的壓力而易於產生刃前緣之缺口或磨損。另一方面,R半徑過大的話,劃線時之荷重將大幅増加使分斷後基板之剖面品質降低。因此,R半徑之範圍以0.8~5μm、尤以3μm以下較佳。R半徑在0.8~5μm之範圍的話,因接觸面積大而能適度分散荷重,能抑制局部的壓力防止刃前緣之缺口及磨耗。 Further, with respect to the rounded blade leading edge 43 of the tip end, if the R radius of the R angle processing is less than 0.8 μm, the load concentrates on the front end of the blade leading edge, causing local pressure and easily causing chipping or wear of the leading edge of the blade. On the other hand, if the R radius is too large, the load at the time of scribing will greatly increase the cross-sectional quality of the substrate after the division. Therefore, the range of the R radius is preferably 0.8 to 5 μm, particularly preferably 3 μm or less. When the R radius is in the range of 0.8 to 5 μm, the load can be appropriately dispersed due to the large contact area, and the local pressure can be suppressed to prevent the chip front edge from being indented and worn.

又,一般而言,脆性材料基板17中之氧化鋁基板等,因燒結後之氧化鋁粒子之粒徑會使表面較粗,例如,後述經測量氧化鋁基板之表面粗糙度Ra,表面粗糙度Ra為0.296μm。因此,刃前緣43之R半徑, 在考慮分斷對象之脆性材料基板17之表面粗糙度後,藉由取充分大之值,防止因基板凹凸造成之缺口等方面效果非常大。 Further, in general, the alumina substrate or the like in the brittle material substrate 17 has a coarser surface due to the particle diameter of the alumina particles after sintering, for example, the surface roughness Ra of the measured alumina substrate described later, and the surface roughness. Ra was 0.296 μm. Therefore, the R radius of the leading edge 43 of the blade, After considering the surface roughness of the brittle material substrate 17 to be separated, it is very effective to prevent the chipping due to the unevenness of the substrate by taking a sufficiently large value.

接著,具體說明使用實際上刃前緣43經R角加工而成圓形之刻劃輪40、與刃前緣43未經R角加工之刻劃輪140,進行脆性材料基板17之分斷的結果。分斷條件如下。 Next, a description will be given of the use of the scribing wheel 40 which is processed by the R edge of the blade leading edge 43 and the scribing wheel 140 which is not R-angled with the blade leading edge 43 to perform the breaking of the brittle material substrate 17. result. The breaking conditions are as follows.

由單晶鑽石構成之刻劃輪40,外徑為2mm、刃前緣角為120°。又,經R角加工,刃前緣43之R半徑為1.0μm。另一方面,刻劃輪140與刻劃輪40之差異僅在有無R角加工,係由單晶鑽石構成之外徑2mm、刃前緣角120°之刻劃輪。又,未經R角加工之刻劃輪40之前端R半徑經測定,為0.17μm。 The scribe wheel 40 composed of a single crystal diamond has an outer diameter of 2 mm and a blade leading edge angle of 120°. Further, the R radius of the blade leading edge 43 was 1.0 μm. On the other hand, the difference between the scoring wheel 140 and the scoring wheel 40 is only in the presence or absence of the R angle processing, and is formed by a single crystal diamond having an outer diameter of 2 mm and a blade leading edge angle of 120°. Further, the radius of the front end R of the scribe wheel 40 which was not processed by the R angle was measured to be 0.17 μm.

進行了分斷枝脆性材料基板17係板厚0.635mm之氧化鋁基板(京瓷株式會社製、材料號:A476T)。 An alumina substrate (manufactured by Kyocera Co., Ltd., material number: A476T) having a thickness of 0.635 mm was obtained.

切斷速度為100mm/sec、以裂痕之滲透量120μm為目標調整劃線荷重等進行了切斷。 The cutting speed was 100 mm/sec, and the scribing load was adjusted so that the penetration amount of the crack was 120 μm.

針對以上述分斷條件於脆性材料基板17表面形成刻劃線後之刃前緣的狀態,使用所拍攝之照片等加以說明如後。圖7係關於刻劃輪40之分斷結果,圖7(A)係顯示所拍攝之點的說明圖、圖7(B)係拍攝刃前緣43之照片與裂痕之滲透量。圖8係拍攝刻劃輪140之刃前緣之照片與裂痕之滲透量。圖9係顯示相對行走距離之刃前緣缺口之發生量的圖表,圖9(A)係關於刻劃輪40之圖表、圖9(B)則係關於刻劃輪140之圖表。 The state in which the leading edge of the blade after the scribe line is formed on the surface of the brittle material substrate 17 by the above-described breaking condition is described using the photographed photograph or the like as follows. Fig. 7 is a view showing the result of the division of the scoring wheel 40, Fig. 7(A) showing an explanatory view of the photographed point, and Fig. 7(B) showing the amount of penetration of the photographing edge 43 and the crack. Figure 8 is a photograph showing the amount of penetration of the photograph of the leading edge of the scoring wheel 140 and the crack. Fig. 9 is a graph showing the amount of occurrence of the leading edge gap of the blade relative to the walking distance. Fig. 9(A) is a graph relating to the scoring wheel 40, and Fig. 9(B) is a graph relating to the scoring wheel 140.

如圖7(A)所示,刃前緣43之拍攝,係於刻劃輪40決定一任意的點P1,以該點P1為基準,以約45°刻度決定P2、P3、P4、P5,於 P1~P5之各點從刻劃輪40之前面進行了拍攝。又,關於圖8之刻劃輪140之刃前緣,亦以和刻劃輪40相同之點進行了拍攝。 As shown in Fig. 7(A), the edge of the blade edge 43 is determined by the scoring wheel 40 to determine an arbitrary point P1. Based on the point P1, P2, P3, P4, and P5 are determined at a scale of about 45 degrees. to Each point of P1 to P5 was taken from the front side of the scoring wheel 40. Further, with respect to the leading edge of the scribing wheel 140 of Fig. 8, the same position as that of the scoring wheel 40 was also taken.

又,圖9中,將於刃前緣形成之缺口之大小(寬度),以10~50μm者為數量a、50~100μm者為數量b、100μm~者為數量c的棒狀圖加以顯示。又,圖7(B)與圖8中所示之裂痕之滲透量(μm)以d之彎折線圖表顯示。 Further, in Fig. 9, the size (width) of the notch formed at the leading edge of the blade is displayed as a bar graph of the number b and 100 μm to the number c in the case of 10 to 50 μm and the number a and 50 to 100 μm. Further, the amount of penetration (μm) of the crack shown in Fig. 7(B) and Fig. 8 is shown by a curve diagram of d.

由圖9可知,刃前緣43為圓形之刻劃輪40與刃前緣未成圓形之刻劃輪140相較,具有毫不遜色之裂痕之滲透量。因此,即使對刃前緣43進行R角加工,亦不會產生滲透量之降低。 As can be seen from Fig. 9, the front edge 43 of the blade has a rounded shape. The scribe wheel 40 has a penetration amount of a crack which is not inferior to the scribe wheel 140 whose front edge is not rounded. Therefore, even if the R edge processing is performed on the leading edge 43 of the blade, the decrease in the amount of penetration does not occur.

另一方面,關於刃前緣之缺口,於刻劃輪140,在刃前緣之行走距離超過500m之地方開始起,刃前緣之缺口急遽増加,特別是產生了100μm以上之大缺口。然而,於刻劃輪40,在刃前緣之行走距離為1000m程度,刃前緣43幾乎不會產生變化,即使到1500m亦沒有產生100μm以上之大缺口。 On the other hand, regarding the notch of the leading edge of the blade, the notch of the leading edge of the blade starts at a position where the travel distance of the leading edge of the blade exceeds 500 m, and the notch of the leading edge of the blade is sharply increased, and in particular, a large notch of 100 μm or more is generated. However, in the scoring wheel 40, the walking distance of the leading edge of the blade is about 1000 m, and the leading edge 43 of the blade hardly changes, and even if it reaches 1500 m, no large gap of 100 μm or more is generated.

如以上所述,如刻劃輪40般藉由對刃前緣43進行R角加工,使刃前緣43成圓形,可大幅減少刃前緣43產生缺口,延長刻劃輪40之壽命。特別是單晶鑽石之情形時,於圖5(A)之狀態下由於刃前緣43之前端係非常銳利的形狀,因此當用於氧化鋁基板之分斷時,刃前緣43非常易產生缺口。然而,藉由使刃前緣43成圓形,即使是由單晶鑽石構成之刻劃輪40,亦能大幅減少刃前緣43之缺口。 As described above, by performing the R-angle machining of the leading edge 43 of the cutting edge 40, the leading edge 43 of the blade is rounded, which greatly reduces the occurrence of a gap in the leading edge 43 of the blade and extends the life of the marking wheel 40. In particular, in the case of a single crystal diamond, in the state of FIG. 5(A), since the front end of the blade leading edge 43 has a very sharp shape, the blade leading edge 43 is very likely to be generated when used for the division of the alumina substrate. gap. However, by rounding the leading edge 43 of the blade, even if the scribe wheel 40 is made of single crystal diamond, the notch of the leading edge 43 of the blade can be greatly reduced.

當觀察圖8所示之刃前緣未經R角加工之刻劃輪140之刃前緣之照片,可發現在拍攝點之P4、P5產生了大的缺口,另一方面,P1、P2 則幾乎未產生缺口。 When observing the photograph of the leading edge of the scribing wheel 140 of the leading edge of the blade shown in FIG. 8 without the R angle processing, it can be found that P4 and P5 at the photographing point have a large gap, and on the other hand, P1 and P2. There is almost no gap.

此係由於刻劃輪140由單晶鑽石構成,單晶鑽石由於具有結晶方位,且由於此結晶方位使硬度有大的差異之故。因此,若係由多晶鑽石構成之刻劃輪的話,不會太有因刃前緣位置之不同而產生缺口未至不同之情形,而會於刃前緣全體同樣的產生缺口。另一方面,係由單晶鑽石構成之刻劃輪之情形時,如圖8所示,一般會因單晶鑽石之結晶方位,使得因刃前緣之位置不同而有缺口產生之狀況大幅相異的情形。 This is because the scoring wheel 140 is composed of a single crystal diamond, and the single crystal diamond has a crystal orientation, and the crystal orientation has a large difference in hardness. Therefore, if the scribing wheel is made of polycrystalline diamond, the gap will not be too different due to the difference in the position of the leading edge of the blade, and the same gap will be generated in the entire leading edge of the blade. On the other hand, in the case of a scribing wheel composed of a single crystal diamond, as shown in Fig. 8, generally, due to the crystal orientation of the single crystal diamond, the position of the leading edge of the blade is different, and a gap is generated. Different situation.

然而,如本實施形態之由單晶鑽石構成之刻劃輪40般,藉由刃前緣43之R角加工之進行使刃前緣43成圓形,如圖7(B)所示,無論在刃前緣43之哪一點皆能抑制大缺口之產生,因此能降低因單晶鑽石之結晶方位對強度之影響。此外,由於單晶鑽石之結晶方位影響,將圖5(A)所示之前端尖的刃前緣43之形狀,於刻劃輪40之圓周全體均勻的予以加工是非常困難的。然而,為進行如圖5(B)所示之刃前緣43之R角加工,並不要求如圖5(A)之刃前緣43之加工般,對圓周整體均一的進行。 However, as in the scribing wheel 40 composed of single crystal diamond of the present embodiment, the blade leading edge 43 is rounded by the R angle processing of the blade leading edge 43, as shown in Fig. 7(B), regardless of At any point on the leading edge 43 of the blade, the occurrence of large notches can be suppressed, so that the influence of the crystal orientation of the single crystal diamond on the strength can be reduced. Further, due to the influence of the crystal orientation of the single crystal diamond, it is extremely difficult to uniformly process the shape of the leading edge leading edge 43 of the tip end shown in Fig. 5(A) on the entire circumference of the scribing wheel 40. However, in order to perform the R-angle machining of the blade leading edge 43 as shown in Fig. 5(B), it is not required to perform the uniformity of the entire circumference as in the processing of the blade leading edge 43 of Fig. 5(A).

如以上所述,刃42僅由鑽石構成、刃前緣43經半徑0.8~5μm之R角加工而成圓形之刻劃輪40,即使是用於選自由陶瓷、藍寶石及矽構成群中之至少一種脆性材料基板17之分斷,與未經R角加工之刻劃輪相較,能大幅減少刃前緣43形成缺口,延長刻劃輪40之壽命。 As described above, the blade 42 is composed only of diamonds, and the leading edge 43 of the blade is machined into a circular scribed wheel 40 through an R angle of a radius of 0.8 to 5 μm, even if it is selected from the group consisting of ceramics, sapphires and enamels. The breaking of the at least one brittle material substrate 17 can significantly reduce the formation of the notch of the leading edge 43 and prolong the life of the scoring wheel 40 as compared with the scribing wheel which is not processed by the R angle.

又,本實施形態中,雖係例示刻劃輪40整體由單晶鑽石構成者,但本發明亦能適用於例如僅刃42由單晶鑽石構成,而以超硬合金構成刀輪本體部41,將刀輪本體部41與刃42以黏著劑加以固定之刻劃輪40,或刻劃輪40之圓周上之傾斜面中、僅至少與脆性材料基板接觸之刃42部分 以單晶鑽石形成之刻劃輪。若係此種構成之刻劃輪的話,能減少昂貴單晶鑽石之使用,提供便宜的刻劃輪。 Further, in the present embodiment, the scribing wheel 40 is generally composed of a single crystal diamond. However, the present invention is also applicable to, for example, only the blade 42 is made of a single crystal diamond, and the cutter wheel body portion 41 is formed of a super hard alloy. The scribing wheel 40 that fixes the cutter wheel body portion 41 and the blade 42 with an adhesive, or the portion of the inclined surface on the circumference of the scoring wheel 40 that is at least at least in contact with the brittle material substrate A circular wheel formed by a single crystal diamond. In the case of such a scribing wheel, the use of expensive single crystal diamonds can be reduced, and an inexpensive scoring wheel can be provided.

又,本實施形態中,作為刻劃輪40雖係使用單晶鑽石做了說明,但亦可亦是刃42由多晶鑽石構成之刻劃輪40。多晶鑽石中,有以具有微細結晶粒組織、或非晶質之石墨型碳素物質作為起始材料,於超高壓高温下直接燒結轉換成鑽石者、或以化學氣相沉積(CVD)法合成之鑽石。多晶鑽石,雖無於上述之刃前緣圓周因結晶方位導致之硬度差異,但有可能因形成刃前緣之鑽石粒子脫落而形成缺口的情形。本發明在使用此種多晶鑽石之刻劃輪40之缺口防止上亦是有效的。 Further, in the present embodiment, although the single-crystal diamond is used as the scribing wheel 40, the scribing wheel 40 in which the blade 42 is made of polycrystalline diamond may be used. Among the polycrystalline diamonds, those having a fine crystal grain structure or an amorphous graphite-type carbon material as a starting material, directly sintered to a diamond at an ultrahigh pressure and high temperature, or by chemical vapor deposition (CVD) Synthetic diamond. Although the polycrystalline diamond does not have a difference in hardness due to the crystal orientation of the leading edge of the blade, there is a possibility that the diamond particles forming the leading edge of the blade fall off to form a notch. The present invention is also effective in the prevention of the gap of the scribe wheel 40 using such a polycrystalline diamond.

又,此等單晶鑽石及多晶鑽石實質上係僅由鑽石構成之物,雖不包含作為結合材之鐵系金屬,但亦包含於鑽石結晶內刻意添加硼或磷等之微量雜質者。藉由此種雜質之添加,可對鑽石賦予導電性,提高耐熱性。 Further, these single crystal diamonds and polycrystalline diamonds are substantially composed of only diamonds, and do not contain iron-based metals as bonding materials, but are also included in the diamond crystals in which minute impurities such as boron or phosphorus are intentionally added. By adding such impurities, it is possible to impart conductivity to the diamond and improve heat resistance.

又,本實施形態之刻劃裝置10,在將保持刻劃輪40之保持具31安裝於刻劃頭21時,係透過保持具接頭23安裝之構成。然而,刻劃裝置10亦可以是於刻劃頭21直接安裝保持具31之構成。 Further, in the scribing device 10 of the present embodiment, when the holder 31 holding the scribing wheel 40 is attached to the scribing head 21, it is configured to be attached to the holder joint 23. However, the scoring device 10 may also be configured to directly mount the holder 31 on the scribing head 21.

又,本實施形態之刻劃裝置10,雖係例示了設有用以使刻劃頭21移動之導件22及橋架19,具備使裝載脆性材料基板17之桌台16旋轉之移動台11者,但不限定於此種刻劃裝置10。亦能適用於,例如為使使用者能握持安裝有保持具31之刻劃頭21,將刻劃頭21之部分形狀作成柄的形狀,使用者握持此柄進行移動以進行脆性材料基板17之分斷之所謂的手動式刻劃裝置。 In addition, the scribing device 10 of the present embodiment is provided with a guide 22 for moving the scribing head 21 and a bridge 19, and includes a moving table 11 for rotating the table 16 on which the brittle material substrate 17 is mounted. However, it is not limited to such a scoring device 10. It can also be applied, for example, to enable the user to hold the scribe head 21 on which the holder 31 is attached, and to shape the portion of the scribe head 21 into a shape of a shank, and the user holds the shank to move to perform a brittle material substrate. The so-called manual scoring device of 17 is divided.

42‧‧‧刃 42‧‧‧blade

43‧‧‧刃前緣 43‧‧‧blade front

43a‧‧‧稜線部 43a‧‧‧Ring Department

Claims (7)

一種刃僅由鑽石構成之刻劃輪,其特徵在於:該刃之刃前緣施有半徑0.8~5μm之R角加工。 A scriber wheel composed only of diamonds, characterized in that the leading edge of the blade edge is subjected to an R-angle processing having a radius of 0.8 to 5 μm. 如申請專利範圍第1項之刻劃輪,其中,該鑽石為單晶鑽石。 For example, the marking wheel of claim 1 of the patent scope, wherein the diamond is a single crystal diamond. 如申請專利範圍第1或2項之刻劃輪,其係用於選自由陶瓷、藍寶石及矽構成之群中之至少一種脆性材料基板之分斷。 The marking wheel of claim 1 or 2 is for the breaking of at least one substrate of brittle material selected from the group consisting of ceramics, sapphires and enamel. 一種保持具單元,具備申請專利範圍第1至3項中任一項之刻劃輪、與將該刻劃輪保持成旋轉自如之保持具。 A holder unit having a scriber wheel of any one of claims 1 to 3 and a holder for holding the scribe wheel in a rotatable manner. 一種刻劃裝置,具備如申請專利範圍第4項之保持具單元。 A scoring apparatus having a holder unit as in item 4 of the patent application. 一種刻劃輪之製造方法,包含:於僅由鑽石構成之圓板狀構件形成刃的步驟;以及對該刃之刃前緣施以R角加工的步驟。 A method of manufacturing a scoring wheel, comprising: a step of forming a blade on a disk-shaped member composed only of diamonds; and a step of applying an R-angle to the leading edge of the blade. 一種劃線方法,係以刃僅由鑽石構成之刻劃輪,於選自由陶瓷、藍寶石及矽構成之群中之至少一種脆性材料基板上形成刻劃線,其特徵在於:係使用該刃之刃前緣施有半徑0.8~5μm之R角加工的該刻劃輪。 A scribing method is a scribing wheel formed by a blade consisting only of diamonds, and a scribing line is formed on at least one of the brittle material substrates selected from the group consisting of ceramics, sapphires and rhodium, characterized in that the blade is used. The scriber wheel is machined with an R angle of a radius of 0.8 to 5 μm.
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