TW201447310A - Probe card and manufacturing method thereof - Google Patents

Abstract

A probe card includes a wiring substrate, a connecting portion, at least one electronic element, and at least one probe. The wiring substrate has a wafer side and a test side opposite to each other. The wiring substrate includes at least one pad on the wafer side. The connecting portion is disposed on the wafer side, and the connecting portion has at least one through hole formed therein. The through hole exposes the pad of the wiring substrate. A pad terminal of the electronic element is electrically connected to the pad, and a connecting terminal of the electronic element opposite to the pad terminal is electrically connected to the connecting portion. The probe is electrically connected to the connecting portion.

Description

Probe card and manufacturing method thereof

The invention relates to a probe card.

With the rapid development of integrated circuits, integrated circuits with high-density components are a trend in the industry. In order to ensure the yield of the integrated circuit, testing the integrated circuit is an indispensable process. The device for testing the integrated circuit usually uses the probe to contact the components of the integrated circuit, transmits the electrical signal for testing, and the test signal is advanced from the early low operating frequency to the high operating frequency.

Generally, when the components of the integrated circuit are packaged, the electrical properties of the components of the integrated circuit may be affected by the material and/or structure of the package. However, the general components will not be packaged after the test is completed. As a result, the electrical changes caused by the package are usually not known during the test, and therefore how to obtain reliable test results before packaging is currently solved in the industry. The problem.

One aspect of the present invention provides a probe card including a wiring substrate, The adapter, the at least one electronic component and the at least one probe. The wiring substrate has a wafer side and a test side opposite to each other. The wiring substrate includes at least one solder joint on the wafer side. The adapter is located on the wafer side and the adapter has at least a uniform perforation therein. The through holes expose solder joints of the wiring substrate. The soldering point of the electronic component is electrically connected to the soldering point, and the electronic component is electrically connected to the switching end of the soldering end of the soldering end. The probe is electrically connected to the adapter.

In one or more embodiments of the present invention, the adapter portion includes a substrate and at least one adapter unit. The substrate is on the wafer side and the through holes are in the substrate. The adapter unit is located on one side of the substrate relative to the wiring substrate and disposed adjacent to the through hole. The adapter end of the electronic component and the probe are electrically connected to the adapter unit.

In one or more embodiments of the present invention, the material of the substrate is an insulating material. The probe card further includes a backing between the wiring substrate and the substrate.

In one or more embodiments of the present invention, the number of the switching unit, the electronic component, and the probe are plural, and the switching units are insulated from each other. The switching end of any of the electronic components is electrically connected to one of the switching units and one of the probes.

In one or more embodiments of the present invention, the probe card further includes a holding member for holding the probe, so that the holding member and the probe together constitute the probe module. The adapter is annular or arcuate and located on the periphery of the probe module.

In one or more embodiments of the present invention, the electronic component is a Surface Mounted Device (SMD).

Another aspect of the present invention provides a method of fabricating a probe card, comprising the following steps: (It should be understood that the steps mentioned in the embodiment, Except for the order in which they are specifically stated, they can be adjusted according to actual needs, and can even be executed simultaneously or partially. ):

(1) A wiring board is provided.

(2) Production of the transfer unit.

(3) The adapter portion is disposed on the wafer side of the wiring substrate such that at least one solder joint of the wiring substrate is exposed from the through hole of the adapter portion.

(4) electrically connecting the solder joint end of the at least one electronic component to the solder joint of the wiring substrate, and electrically connecting the electronic component to the adapter end of the solder joint end.

(5) electrically connecting at least one probe to the adapter.

In one or more embodiments of the present invention, the manufacturing method further includes:

(6) Provide a probe module. The probe module includes a holder and a probe. The holding member holds the probe, and the probe module is fixed on the wafer side.

In one or more embodiments of the present invention, the above step (2) may include the following sub-steps:

(2.1) A raw material substrate is provided.

(2.2) A through hole is formed in the raw material substrate.

In one or more embodiments of the present invention, the raw material substrate includes a substrate and a conductor layer. The conductor layer is on the substrate. The above step (2) may further comprise the following sub-steps:

(2.3) Removing at least a portion of the conductor layer such that the conductor layer is separated into a plurality of switching units that are insulated from each other.

In one or more embodiments of the present invention, the above step (2) may Contains the following substeps:

(3.1) The adapter is attached to the wafer side of the wiring substrate with a backing.

The above probe card is connected with an electronic component between the probe and the signal source, so that the electrical change of the device under test after packaging can be simulated. Moreover, since the solder joint end and the transfer end of the electronic component are respectively connected to the solder joint and the adapter portion of the wiring substrate, the electronic component can be substantially lying on the adapter portion, thereby strengthening the structural strength of the electronic component, such that Therefore, when the probe is stuck in the cleaning needle or tested, the peeling of the electronic component can be greatly improved.

100‧‧‧Wiring substrate

102‧‧‧ Wafer side

104‧‧‧Test side

106, 206, 456‧‧

110‧‧‧ solder joint area

120‧‧‧Drop area

122‧‧‧Wire

130‧‧‧Test area

132‧‧‧Test solder joints

200‧‧‧Transfer Department

210‧‧‧Substrate

212‧‧‧through holes

214‧‧‧ Face

220‧‧‧Transfer unit

300‧‧‧Electronic components

302‧‧‧ solder joint

304‧‧‧Transfer

400‧‧‧ Probe Module

410‧‧‧Probe

450‧‧‧ holding parts

Lines 2-2, 6-6, 8-8‧‧

P‧‧‧ area

S100, S200, S300, S400, S500, S600‧‧‧ steps

112‧‧‧ solder joints

1 is a bottom view of a probe card in accordance with an embodiment of the present invention.

Figure 2 is a cross-sectional view taken along line 2-2 of Figure 1.

Fig. 3 is a partially enlarged view showing a region P of Fig. 1.

FIG. 4 is a flow chart showing a method of fabricating the probe card of FIG. 1.

Fig. 5 is a bottom view showing the wiring board of Fig. 1.

Figure 6 is a cross-sectional view taken along line 6-6 of Figure 5.

Fig. 7 is a bottom view showing the adapter portion of Fig. 1.

Figure 8 is a cross-sectional view taken along line 8-8 of Figure 7.

FIG. 9 is a bottom view of the adapter portion according to another embodiment of the present invention.

In the following, a plurality of embodiments of the present invention will be disclosed in the drawings. For the sake of explanation, many practical details will be explained in the following description. However, it should be understood that these practical details are not intended to limit the invention. That is, in some embodiments of the invention, these practical details are not necessary. In addition, some of the conventional structures and elements are shown in the drawings in a simplified schematic manner in order to simplify the drawings.

Please refer to FIG. 1 to FIG. 3, wherein FIG. 1 is a bottom view of the probe card according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view along line 2-2 of FIG. 3 is a partial enlarged view of a region P of Fig. 1. Please refer to Figure 1 and Figure 2 first. The probe card includes a wiring substrate 100, an adapter portion 200, at least one electronic component 300, and at least one probe 410. The wiring substrate 100 generally means a printed circuit board. The wiring substrate 100 has a wafer side 102 and a test side 104 opposite to each other. The adapter portion 200 is located on the wafer side 102. It should be noted that the dimensions of the adapter portion 200 of FIG. 1 with respect to the wiring substrate 100 are merely exemplary, and the purpose thereof is mainly for highlighting the structural details on the adapter portion 200, but the invention is not limited thereto. Those skilled in the art to which the present invention pertains should flexibly design the dimensions of the adapter portion 200 relative to the wiring substrate 100 as needed. Next, please refer to Figure 2 and Figure 3. The wiring substrate 100 includes at least one solder joint 112 on which the solder joint 112 is located. The adapter portion 200 has at least a uniform perforation 212 therein. The through holes 212 expose the solder joints 112 of the wiring substrate 100. The solder joint end 302 of the electronic component 300 is electrically connected to the solder joint 112, and the electronic component 300 is electrically connected to the adapter portion 200 with respect to the adapter end 304 of the solder joint end 302. The probe 410 is electrically connected to the adapter 200.

In the embodiment, the test signal can be self-made on the wiring substrate 100. The solder joint 112 is transferred to the adapter portion 200 via the electronic component 300. By the configuration of the electronic component 300, the characteristics of the device under test can be simulated in the process of test signal transmission, so that the package can be reliably estimated even if the device under test is tested in an unpackaged state. After the test results. On the other hand, since the solder joint end 302 and the adapter end 304 of the electronic component 300 are respectively connected to the solder joint 112 of the wiring substrate 100 and the adapter portion 200, that is, the electronic component 300 can be substantially lying on the adapter portion 200, The structural strength of the electronic component 300 is reinforced. In this way, when the probe is stuck in the cleaning needle or tested, the peeling condition of the electronic component 300 can be greatly improved. It should be noted that the above-mentioned "substantially lying" may indicate that the extending direction of the electronic component 300 is not parallel to the normal of the surface 214 of the adapter portion 200. For example, in FIG. 3, the extending direction of the electronic component 300 may be The normal to face 214 is substantially parallel.

Please continue to refer to Figures 2 and 3. In one or more embodiments, the adapter 200 can include a substrate 210 and at least one adapter unit 220. The substrate 210 is located on the wafer side 102 of the wiring substrate 100, and the through hole 212 is located in the substrate 210. The adapter unit 220 is disposed on the surface 214 of the substrate 210 opposite to the wiring substrate 100 and disposed adjacent to the through hole 212. The probe 410 and the adapter end 304 of the electronic component 300 are electrically connected to the switching unit 220. Therefore, the test signal transmitted from the solder joint 112 of the wiring substrate 100 can be transmitted to the switching unit 220 of the switching portion 200 via the electronic component 300, and then the test signal is transmitted to the probe 410 via the switching unit 220. The material of the substrate 210 may be an insulating material, and the material of the adapter unit 220 may be a conductor such as a copper foil.

Please refer to both Figure 1 and Figure 3. In one or more implementations In the mode, the number of the switching unit 220, the electronic component 300, and the probe 410 are plural. The switching units 220 are insulated from each other, and the switching end 304 of any of the electronic components 300 is electrically connected to one of the switching units 220 and one of the probes 410. In other words, each electronic component 300 is electrically connected to a single pad 112 of the wiring substrate 100, a single switching unit 220 of the adapter 200, and a pin tail of the single probe 410, so that each probe 410 can be correspondingly obtained. Test signal, such a design can provide different test signals for different probes 410.

Then return to Figure 1 and Figure 2. In one or more embodiments, the probe card can further include a holder 450. The holder 450 is used to hold the probe 410 such that the holder 450 and the probe 410 together form the probe module 400. As described above, in an embodiment having a plurality of probes 410, in order to facilitate testing of the components to be tested, the spacers 450 can be used to fix the spacing between the probes 410. In this way, not only the probe module 400 can be prevented from damaging the probe 410 due to random movement, but also the vertical distance of each probe 410 can be fixed to facilitate testing.

Please return to Figure 2. In one or more embodiments, the probe card further includes a backing 500 disposed between the wiring substrate 100 and the substrate 210 for bonding the adapter portion 200 to the wafer side 102 of the wiring substrate 100. It should be noted that the above-mentioned adhesive 500 is merely illustrative and is not intended to limit the present invention. A person having ordinary skill in the art to which the present invention pertains should be elastically selected such that the adapter portion 200 is fixed to the wafer side 102 of the wiring substrate 100.

Then go back to Figure 3. As described above, the electronic component 300 can be substantially lying flat on the surface of the adapter 200, thus one or more implementers In the formula, the electronic component 300 can be implemented by a surface mounted device (SMD). The surface mount component can be fixed by soldering, thereby enhancing the structural strength of the electronic component 300. In addition, the surface mount component also has the advantage of being lightweight, and even if the probe card contains a large number of electronic components 300, it does not burden the probe card. In addition, in the embodiment, the electronic component 300 is a resistor or an inductor. However, in other embodiments, the electronic component 300 may be a capacitor, and the invention is not limited thereto.

Next, please refer to FIG. 4, which is a flow chart showing a method of manufacturing the probe card of FIG. 1. First, step S100 is performed to provide a wiring substrate. Referring to FIG. 5 and FIG. 6 together, FIG. 5 is a bottom view of the wiring substrate 100 of FIG. 1, and FIG. 6 is a cross-sectional view taken along line 6-6 of FIG. 5. In the present embodiment, the maker can first determine the type of the wiring substrate 100 to be used. For example, the wiring substrate 100 may alternatively use an off-the-shelf universal board. The universal board refers to the printed circuit board produced in batches. The internal circuit is unified. When applied to various different components to be tested, the universal board is matched with different circuit design, different probes, and different probes. The probe pin end and the universal board solder joint are electrically connected to test various different components to be tested. The author can first determine the size of the probe card to be made, and then select the general-purpose board specification of the wiring substrate 100 according to the size of the probe card to simplify the process of the probe card. However, the above-mentioned general purpose boards are merely illustrative and are not intended to limit the present invention. In other embodiments, the wiring substrate 100 can also be fabricated by the manufacturer himself.

In one or more embodiments, the wiring substrate 100 can sequentially define the solder joint region 110, the trace region 120, and the test region from the center of the circle in the radial direction. 130. On the test side 104 of the wiring substrate 100, the test area 130 is partially provided with at least one test pad 132. These test pads 132 can be electrically connected to a test machine (not shown) to transmit the test signals of the test machine to the wiring substrate 100. On the wafer side 102 of the wiring substrate 100, the solder joint region 110 is partially provided with solder joints 112. The solder joints 132 and the solder joints 112 are electrically connected by wires 122 (internal traces of the wiring substrate 100). Specifically, the wire 122 is connected to the test pad 132 in the test zone 130, passes through the trace area 120, and is connected to the pad 112 in the pad area 110. In this way, the test signals provided by the testing machine can be transmitted to the solder joints 112 by the test solder joints 132 and the wires 122 in sequence. It should be noted that the dimensions of the solder joint area 110, the trace area 120 and the test area 130 of FIG. 5 are merely exemplary, and the purpose thereof is mainly to highlight the structural details of the solder joint area 110, but the present invention does not This is limited. Those skilled in the art to which the present invention pertains should flexibly design the dimensions of the solder joint region 110, the trace region 120, and the test region 130 as needed.

Next, in step S200 of Fig. 4, an adapter is produced. Please refer to FIG. 7 and FIG. 8 together, wherein FIG. 7 is a bottom view of the adapter portion 200 of FIG. 1 and FIG. 8 is a cross-sectional view of the line segment 8-8 along the seventh diagram. In the present embodiment, the manufacturer may first provide a raw material substrate, and then form the through hole 212 and the transfer unit 220 on the raw material substrate. In detail, the raw material substrate may include the substrate 210 and the conductor layer, wherein the conductor layer is located on the substrate 210. Therefore, the creator can first form the through hole 212 in the raw material substrate, and then remove part of the conductor layer, so that the conductor layer is divided into a plurality of switching units 220 insulated from each other. However, the above process sequence is merely illustrative and is not intended to limit the invention. In other embodiments, the producer may also go ahead The transfer unit 220 is fabricated, and then the process of forming the through holes 212 is performed.

The material of the substrate 210 may be an insulating material, and the material of the conductor layer may be a copper foil. The steps of forming the through hole 212 and removing at least a portion of the conductor layer can be achieved by a Computer Numerical Control Machine Tool (CNC Machine Tool).

Next, step S300 of FIG. 4 is performed, and at the same time, referring to FIGS. 1 and 2, the adapter portion 200 is disposed on the wafer side 102 of the wiring substrate 100 such that at least one solder joint 112 of the wiring substrate 100 rotates. The through hole 212 of the joint 200 is exposed. In detail, since the pad 112 is provided in the pad region 110 of the wiring substrate 100, the adapter portion 200 can be disposed in alignment with the pad region 110. As for the installation method, the creator can select the adapter 200 to be attached to the wafer side 102 of the wiring substrate 100 by using the adhesive 500. For example, the adhesive 500 is first applied to the adapter 200, and then the adapter 200 is placed. The bonding paste 500 may be applied to the wafer side 102 of the wiring substrate 100, and the adapter portion 200 may be bonded to the wiring substrate 100. However, the above arrangement is merely illustrative and is not intended to limit the present invention. A person skilled in the art to which the present invention pertains can flexibly select a mode in which the adapter unit 200 is disposed on the wafer side 102 of the wiring substrate 100 as needed.

Then, step S400 of FIG. 4 is performed, and at the same time, referring to FIG. 3, the solder joint end 302 of the at least one electronic component 300 is electrically connected to the solder joint 112 of the wiring substrate 100, and the electronic component 300 is opposite to the solder joint end 302. The adapter end 304 is electrically connected to the adapter portion 200. For example, in FIG. 3, the adapter end 304 of the electronic component 300 can be electrically connected to the adapter unit 220 of the adapter portion 200. Wherein the solder joint end 302 and the transfer end 304 of the electronic component 300 For example, it can be soldered to the solder joint 112 and the switching unit 220 respectively, but the invention is not limited thereto.

Next, step S500 of FIG. 4 is performed, and at least one probe 410 is electrically connected to the adapter portion 200 with reference to FIGS. 1 and 2, for example, in the second diagram, the probe 410 can be electrically connected. Connected to the switching unit 220 of the adapter 200. The probe 410 can be soldered to the adapter unit 220, although the invention is not limited thereto. In this way, the process of the probe card is completed. Therefore, when the probe card is electrically connected to the testing machine (not shown), the test signal of the testing machine can pass through the test soldering point 132, the wire 122, the solder joint 112, the electronic component 300, the switching unit 220, and the probe. The pin 410 is transmitted to the device under test to simulate the characteristics of the device under test after packaging by the electronic component 300.

In one or more embodiments, the creator may choose to perform step S600 of Figure 4 to provide a probe module. Referring to FIG. 1 and FIG. 2 together, in detail, the probe module 400 includes a holding member 450 and a probe 410. The holding member 450 is used to hold the probe 410, and then the probe module 400 is fixed on the probe module 400. Wafer side 102. Therefore, if the probes 410 of the probe module 400 are plural, the manufacturer can separately connect the probes 410 to the corresponding switching unit after the probe module 400 is fixed on the wafer side 102. 220, to complete the process of the probe card. In addition, in the fourth embodiment, step S600 is performed between step S100 and step S400. However, in other embodiments, step S600 may also be performed between step S400 and step S500, and the present invention is not limited thereto.

In one or more embodiments, the adapter portion 200 can be annular and located at the periphery of the probe module 400, that is, the center of the adapter portion 200 has an opening. 206, the holder 450 can be connected to the wiring substrate 100 through the opening 206 of the adapter portion 200. However, in other embodiments, referring to FIG. 9 , the adapter portion 200 may also be in an arc shape and located at a portion of the periphery of the probe module 400 . The invention is not limited thereto. On the other hand, the shape and size of the opening 206 can also be appropriately designed in accordance with the solder joint 112 of the solder joint region 110 of the wiring substrate 100.

Please refer to both Figure 1 and Figure 5. In one or more embodiments, the wiring substrate 100 may have an opening 106 and the holder 450 may have an opening 456. When the probe card is completed, the openings 106 and 456 can at least partially overlap in the vertical direction, that is, when the test side 104 of the wiring substrate 100 (as shown in FIG. 2) is viewed in the direction of the probe 410, a tester The tip of the probe 410 located in the opening 456 can be observed. In this way, when the probe card is used to test the component to be tested, the tester can see the position of the probe 410 from the openings 106 and 456 of the probe card, and perform the alignment of the probe 410 with the component to be tested. Conducive to the progress of the test. However, the invention is not limited thereto, and in other alignment modes, the openings 106 and 456 may not exist.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and the present invention can be modified and modified without departing from the spirit and scope of the present invention. The scope is subject to the definition of the scope of the patent application attached.

100‧‧‧Wiring substrate

106, 206, 456‧‧

110‧‧‧ solder joint area

120‧‧‧Drop area

130‧‧‧Test area

200‧‧‧Transfer Department

300‧‧‧Electronic components

400‧‧‧ Probe Module

410‧‧‧Probe

450‧‧‧ holding parts

2-2‧‧‧ segments

P‧‧‧ area

Claims (11)

A probe card comprising: a wiring substrate having a wafer side and a test side, wherein the wiring substrate comprises at least one solder joint on the wafer side; and an adapter portion located at the On the wafer side, the adapter has at least a uniform through hole therein, the through hole exposing the solder joint of the wiring substrate; at least one electronic component, one of the solder joints of the electronic component is electrically connected to the solder joint, The electronic component is electrically connected to the adapter portion with respect to one of the soldering end ends; and the at least one probe is electrically connected to the adapter portion. The probe card of claim 1, wherein the adapter portion comprises: a substrate on the wafer side, wherein the through hole is located in the substrate; and at least one switching unit located on the substrate The switching end is disposed on one side of the wiring substrate adjacent to the through hole, wherein the switching end of the electronic component and the probe are electrically connected to the switching unit. The probe card of claim 2, wherein the substrate is made of an insulating material, and the probe card further comprises a backing between the wiring substrate and the substrate. The probe card of claim 2, wherein the number of the switching unit, the electronic component and the probe are plural, and the switching units are mutually Insulation, the switching end of any of the electronic components is electrically connected to one of the switching units and one of the probes. The probe card of claim 1, further comprising: a holding member that holds the probe such that the holding member and the probe together form a probe module; and wherein the adapter portion has a ring shape or an arc It is located on the periphery of the probe module. The probe card of claim 1, wherein the electronic component is a Surface Mounted Device (SMD). A method for manufacturing a probe card, comprising: providing a wiring substrate; forming an adapter portion; the adapter portion is disposed on a wafer side of the wiring substrate, so that at least one solder joint of the wiring substrate is rotated from the wiring One of the through holes is exposed; the solder joint end of the at least one electronic component is electrically connected to the solder joint of the wiring substrate, and the electronic component is electrically connected to the one end of the solder joint end An adapter; electrically connecting at least one probe to the adapter. The method of claim 7, further comprising: providing a probe module, wherein the probe module includes a holder and the The probe holds the probe and fixes the probe module on the wafer side. The manufacturing method of claim 7, wherein the step of fabricating the adapter portion comprises: providing a raw material substrate; and forming the through hole in the raw material substrate. The method of claim 9, wherein the raw material substrate comprises: a substrate; and a conductor layer on the substrate; and wherein the step of fabricating the adapter further comprises: removing at least a portion of the conductor layer The conductor layer is separated into a plurality of switching units insulated from each other. The method of claim 7, wherein the step of disposing the adapter portion on the wafer side of the wiring substrate comprises: bonding the adapter portion to the wafer side of the wiring substrate by adhesive bonding on.