TW201423328A - Memory expansion assembly - Google Patents
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Abstract
Description
本發明係關於一種擴充套件,特別是一種記憶體擴充套件。 The present invention relates to an expansion kit, and more particularly to a memory expansion kit.
電腦主機的中央處理單元(Central Processing Unit,CPU)係以隨機存取記憶體(Random Access Memory,RAM)當作資料儲存區,中央處理單元的計算結果與程式指令皆放置於隨機存取記憶體,而當程式執行需要時,可取用儲存區裡的資料。 The central processing unit (CPU) of the mainframe uses a random access memory (RAM) as a data storage area. The calculation results and program instructions of the central processing unit are placed in the random access memory. When the program needs to be executed, the data in the storage area can be accessed.
但現今電腦主機的功能越來越強大,對於資料處理速度與資料量的需求亦相對增加。因此,使用者通常會希望能夠增加記憶體插槽的數量以擴充記憶體的容量。然而,增加記憶體插槽的數量,勢必會需要加大主機板的面積,進而造成電腦主機的體積增加。如此一來,將與時下電腦主機之輕薄短小的趨勢相背馳。此外,如果要在不增加主機板面積的前提下增加記憶體插槽的數量,則又會擠壓到其他電子元件設置的空間。 However, the functions of computer mainframes are becoming more and more powerful, and the demand for data processing speed and data volume is relatively increased. Therefore, users often want to increase the number of memory slots to expand the capacity of the memory. However, increasing the number of memory slots will inevitably require an increase in the area of the motherboard, which in turn will increase the size of the host computer. As a result, it will be inconsistent with the trend of the current thin and light computer host. In addition, if you increase the number of memory slots without increasing the area of the motherboard, it will squeeze into the space set by other electronic components.
因此,如何在主機板有限的空間上增加記憶體插槽的數量,進而增加記憶體的容量,以提升電腦主機的運算效能將是設計人員應解決的問題之一。 Therefore, how to increase the number of memory slots in the limited space of the motherboard, thereby increasing the capacity of the memory to improve the computing performance of the host computer will be one of the problems that designers should solve.
本發明在於提供一種記憶體擴充套件,藉以在主機板有限的空間上增加記憶體插槽的數量,進而增加記憶體的容量,以提升電腦主機的運算效能。 The present invention provides a memory expansion kit, which increases the number of memory slots in a limited space of a motherboard, thereby increasing the capacity of the memory to improve the computing performance of the host computer.
本發明所揭露的記憶體擴充套件,包含一第一基板、一第二 基板、一第一卡扣組件及一第二卡扣組件。第一基板具有多個第一電性插槽及一第一電連接部。這些第一電性插槽與第一電連接部電性連接。第二基板樞設於第一基板。第二基板具有多個第二電性插槽及一第二電連接部。這些第二電性插槽與第二電連接部電性連接。第二基板可相對第一基板樞轉而具有相對靠攏或相對遠離的一收合位置及一展開位置。第一卡扣組件設於第一基板之一側。第二卡扣組件設於第二基板之一側。第一卡扣組件可分離地卡扣於第二卡扣組件。其中,第二基板於收合位置時,第一電連接部與第二電連接部位於記憶體擴充套件之同一側。第二基板於展開位置時,分別用以供這些記憶體插接於這些第一電性插槽與這些第二電性插槽。 The memory expansion kit disclosed in the present invention comprises a first substrate and a second a substrate, a first snap component and a second snap component. The first substrate has a plurality of first electrical sockets and a first electrical connection. The first electrical slots are electrically connected to the first electrical connection. The second substrate is pivotally disposed on the first substrate. The second substrate has a plurality of second electrical sockets and a second electrical connection. The second electrical sockets are electrically connected to the second electrical connection. The second substrate is pivotable relative to the first substrate and has a collapsed position and a deployed position that are relatively close or relatively distant. The first snap component is disposed on one side of the first substrate. The second snap component is disposed on one side of the second substrate. The first snap component is detachably snapped to the second snap component. Wherein, when the second substrate is in the folded position, the first electrical connection portion and the second electrical connection portion are located on the same side of the memory expansion kit. When the second substrate is in the deployed position, the memory is respectively inserted into the first electrical slots and the second electrical slots.
根據上述本發明所揭露的記憶體擴充套件,第一基板與第二基板分別包含多個供記憶體插接的電性插槽,且第一基板與第二基板相互樞設,使得記憶體擴充套件插設於擴充插槽時,第一基板與第二基板分別豎立於主機板,且各記憶體分別位於主機板上方之各電性插槽,進而在主機板有限的空間上增加供記憶體插接的電性插槽的數量而提升電腦主機所能插接的記憶體容量。 According to the memory expansion kit of the present invention, the first substrate and the second substrate respectively comprise a plurality of electrical sockets for the memory to be inserted, and the first substrate and the second substrate are pivoted to each other, so that the memory is expanded. When the kit is inserted into the expansion slot, the first substrate and the second substrate are respectively erected on the motherboard, and each memory is located in each electrical slot above the motherboard, thereby increasing the memory for the limited space of the motherboard. The number of electrical slots that are plugged in increases the amount of memory that can be docked by the host computer.
有關本發明的特徵、實作與功效,茲配合圖式作最佳實施例詳細說明如下。 The features, implementations, and utilities of the present invention are described in detail below with reference to the drawings.
請參照第1A圖至第2B圖,第1A圖為根據本發明一實施例之記憶體擴充套件插設於主機板之擴充插槽的立體示意圖,第1B圖為第1A圖之記憶體擴充套件的展開示意圖,第2A圖為第1A 圖之記憶體擴充套件的分解示意圖,第2B圖為第2A圖之第二卡扣組件的分解示意圖圖。 Please refer to FIG. 1A to FIG. 2B . FIG. 1A is a perspective view of a memory expansion kit inserted into an expansion slot of a motherboard according to an embodiment of the present invention, and FIG. 1B is a memory expansion kit of FIG. 1A . Schematic diagram of the expansion, Figure 2A is the 1A An exploded view of the memory expansion kit of the figure, and FIG. 2B is an exploded schematic view of the second buckle assembly of FIG. 2A.
本實施例之記憶體擴充套件10,用以供複數個記憶體20插接。記憶體擴充套件10包含一第一基板100、一第二基板200、一第一卡扣組件600及一第二卡扣組件700。此外,記憶體擴充套件10更包含一樞接件300。第一基板100具有多個第一電性插槽110及一第一電連接部120。這些第一電性插槽110分別與第一電連接部120電性連接。第二基板200透過樞接件300樞設於第一基板100。詳細來說,樞接件300之相對兩側分別樞接於第一基板100及第二基板200,以令第二基板200可相對第一基板100樞轉而具有相對靠攏或相對遠離的一收合位置及一展開位置。並且,透過樞接件300令第一基板100與第二基板200間保持一間距。第二基板200具有多個第二電性插槽210及一第二電連接部220。這些第二電性插槽210分別與第二電連接部220電性連接。此外,本實施例之第一電性插槽110與第二電性插槽210的數量各以五個為例,但並不以此為限,在其他實施例中,第一電性插槽110與第二電性插槽210的數量也可以各為五個以上或各為五個以下。 The memory expansion kit 10 of the embodiment is used for plugging a plurality of memories 20. The memory expansion kit 10 includes a first substrate 100, a second substrate 200, a first buckle assembly 600, and a second buckle assembly 700. In addition, the memory expansion kit 10 further includes a pivoting member 300. The first substrate 100 has a plurality of first electrical sockets 110 and a first electrical connection portion 120. The first electrical sockets 110 are electrically connected to the first electrical connection portion 120, respectively. The second substrate 200 is pivotally disposed on the first substrate 100 through the pivoting member 300. In detail, the opposite sides of the pivoting member 300 are pivotally connected to the first substrate 100 and the second substrate 200 respectively, so that the second substrate 200 can be pivoted relative to the first substrate 100 to have a relatively close or relatively distant position. The position and the unfolded position. Moreover, a distance between the first substrate 100 and the second substrate 200 is maintained through the pivoting member 300. The second substrate 200 has a plurality of second electrical sockets 210 and a second electrical connection portion 220. The second electrical slots 210 are electrically connected to the second electrical connection portion 220 , respectively. In addition, the number of the first electrical slot 110 and the second electrical slot 210 in this embodiment is exemplified by five, but not limited thereto. In other embodiments, the first electrical slot The number of the 110 and the second electrical slots 210 may also be five or more or five or less each.
第二基板200於收合位置時,第一電連接部120與第二電連接部220位於記憶體擴充套件10之同一側,使得第一電連接部120與第二電連接部220可分別插接於主機板30之二擴充插槽32。此外,在本實施例中,這些第一電性插槽110與這些第二電性插槽210位於第一基板100與第二基板200之間。更進一步來說,第一基板100與第二基板200之間距介於記憶體20的高度與記憶體20 的兩倍高度之間,且這些第一電性插槽110面向第二基板200,以及這些第二電性插槽210面向第一基板100,使這些第一電性插槽110與這些第二電性插槽210彼此交錯併排。但並不以此為限,在其他實施例中,也可以是第一基板100與第二基板200位於這些第一電性插槽110與這些第二電性插槽210之間。 When the second substrate 200 is in the folded position, the first electrical connection portion 120 and the second electrical connection portion 220 are located on the same side of the memory expansion kit 10, so that the first electrical connection portion 120 and the second electrical connection portion 220 can be respectively inserted. Connected to the expansion slot 32 of the motherboard 30. In addition, in the embodiment, the first electrical sockets 110 and the second electrical sockets 210 are located between the first substrate 100 and the second substrate 200 . Furthermore, the height between the first substrate 100 and the second substrate 200 is between the height of the memory 20 and the memory 20 Between the two heights, and the first electrical slots 110 facing the second substrate 200, and the second electrical slots 210 facing the first substrate 100, the first electrical slots 110 and the second The electrical slots 210 are staggered side by side. However, in other embodiments, the first substrate 100 and the second substrate 200 may be located between the first electrical sockets 110 and the second electrical sockets 210.
第二基板200於展開位置時,用以讓使用者將這些記憶體20分別插接於這些第一電性插槽110與這些第二電性插槽210,以增加插接在擴充插槽32上之記憶體20的數量。 When the second substrate 200 is in the unfolded position, the user can insert the memory 20 into the first electrical sockets 110 and the second electrical slots 210 to increase the insertion into the expansion slot 32. The number of memory 20 on it.
在本實施例及其他實施例中,記憶體擴充套件10更包含一第一板體400及一第二板體500。第一板體400裝設於第一基板100。第二板體500裝設於第二基板200。於第二基板200位於收合位置時,第一基板100與第二基板200位於第一板體400與第二板體500之間。第一卡扣組件600裝設於第一板體400。第二卡扣組件700裝設於第二板體500。第一卡扣組件600可分離地卡扣於第二卡扣組件700,以將第二基板200固定於收合位置。 In this embodiment and other embodiments, the memory expansion kit 10 further includes a first board 400 and a second board 500. The first plate body 400 is mounted on the first substrate 100. The second board 500 is mounted on the second substrate 200. When the second substrate 200 is in the folded position, the first substrate 100 and the second substrate 200 are located between the first plate 400 and the second plate 500. The first buckle assembly 600 is mounted on the first plate body 400. The second buckle assembly 700 is mounted on the second plate body 500. The first snap component 600 is detachably snapped to the second snap component 700 to fix the second substrate 200 to the collapsed position.
詳細來說,第一卡扣組件600包含二樞接座610及二卡扣片620。二樞接座610分別裝設於第一板體400的相對兩端角。二卡扣片620分別樞設於二樞接座610。二卡扣片620各具有一第一勾部621。同一卡扣片620上之第一勾部621位於遠離樞接座610之一側,使二第一勾部621分別位於第一板體400之中段。第二卡扣組件700包含一座體710及二第一扣件720。座體710設置於500第二板體之中段。二第一扣件720設置於座體710,且二第一扣件720分別具有一第二勾部724。二第二勾部724分別位於座體 710的相對兩側並凸出於座體710之兩側的表面。二第一勾部621分別可分離地與二第二勾部724相扣合。此外,在本實施例及其他實施例中,各樞接座610與各卡扣片620間分別裝設一第三彈性件630,第三彈性件630分別抵靠於樞接座610與卡扣片620,以常態令二卡扣片620相對分離。 In detail, the first buckle assembly 600 includes two pivoting seats 610 and two locking pieces 620 . The two pivoting seats 610 are respectively disposed at opposite ends of the first plate body 400. The two latching pieces 620 are respectively pivotally disposed on the two pivoting seats 610. The two snap tabs 620 each have a first hook portion 621. The first hook portion 621 of the same snap tab 620 is located away from one side of the pivot socket 610, so that the two first hook portions 621 are respectively located in the middle of the first board body 400. The second buckle assembly 700 includes a body 710 and two first fasteners 720. The seat body 710 is disposed in the middle of the second plate body of 500. The first fasteners 720 are disposed on the base 710, and the second fasteners 720 have a second hook 724. The second hook portion 724 is respectively located in the base The opposite sides of the 710 protrude from the surfaces on both sides of the seat 710. The second hook portions 621 are detachably coupled to the second hook portions 724, respectively. In addition, in the embodiment and other embodiments, a third elastic member 630 is disposed between each pivoting seat 610 and each of the locking pieces 620, and the third elastic member 630 abuts against the pivoting seat 610 and the buckle respectively. The sheet 620 is relatively separated from the two snap tabs 620 in a normal state.
此外,卡扣片620除了可與第二卡扣組件700之第一扣件720相互扣合,以令第一基板100與第二基板200固定於收合位置外,卡扣片620更可供使用者握持,以利於使用者將記憶體擴充套件10插入擴充插槽32。 In addition, the fastening piece 620 can be engaged with the first fastening component 720 of the second fastening component 700 to fix the first substrate 100 and the second substrate 200 to the folding position, and the locking piece 620 is further provided. The user holds the hand to facilitate the user to insert the memory expansion kit 10 into the expansion slot 32.
在本實施例及其他實施例中,第二卡扣組件700更包含一按壓件730及至少一第一彈性件740。按壓件730可滑動地設置於座體710。第一彈性件740設置於座體710,且介於座體710與按壓件730之間。二第一扣件720各具有一樞接部721、一第一懸臂722及一第二懸臂723。第一懸臂722及第二懸臂723分別自樞接部721朝相異方向延伸。二樞接部721分別樞設於座體710之相對兩側。二第一懸臂722皆位於二樞接部721之間。二第二勾部724分別位於二第二懸臂723。二第一懸臂722皆位於第一彈性件740與按壓件730之間,且分別抵靠於第一彈性件740與按壓件730。二第一扣件720可相對座體710樞轉而具有二第二勾部724凸出於座體710之側表面的一第一卡扣位置或二第二勾部724縮進座體710的一第一釋放位置。二第一懸臂722常態受第一彈性件740抵頂而位於第一卡扣位置。按壓件730可朝第一彈性件740位移,以帶動二第一扣件720自第一卡扣位置位移至第一釋放位 置以解除第一勾部621與第二勾部724間的卡扣關係,進而讓第二基板200能夠從收合位置位移至展開位置。 In the embodiment and other embodiments, the second fastening component 700 further includes a pressing member 730 and at least one first elastic member 740. The pressing member 730 is slidably disposed on the base 710. The first elastic member 740 is disposed on the base 710 and between the base 710 and the pressing member 730. The first fastening members 720 each have a pivoting portion 721 , a first cantilever 722 , and a second cantilever 723 . The first cantilever 722 and the second cantilever 723 respectively extend from the pivoting portion 721 in different directions. The two pivoting portions 721 are respectively pivoted on opposite sides of the base 710. The two first cantilevers 722 are located between the two pivoting portions 721. The second hook portions 724 are respectively located at the second second cantilever 723. The two first cantilevers 722 are located between the first elastic member 740 and the pressing member 730 and respectively abut against the first elastic member 740 and the pressing member 730. The first fastening member 720 can be pivoted relative to the base 710 to have a second hook portion 724 protruding from a side of the side surface of the seat body 710 or the second hook portion 724 being retracted into the seat body 710. A first release position. The first cantilever 722 is normally in the first buckle position by the first elastic member 740 abutting. The pressing member 730 can be displaced toward the first elastic member 740 to drive the two first fastening members 720 to be displaced from the first fastening position to the first release position. The snap relationship between the first hook portion 621 and the second hook portion 724 is released, and the second substrate 200 can be displaced from the folded position to the deployed position.
在本實施例及其他實施例中,按壓件730更包含二第三勾部731。二第三勾部731分別抵頂於第一彈性件740。第一卡扣組件600更包含二卡扣柱611。二卡扣柱611分別位於二樞接座610遠離第一基板100的表面。第二卡扣組件700更包含二第二扣件750及二第二彈性件760。二第二扣件750分別可滑動地設置於第二板體500,且二第二扣件750介於第二基板200與第二板體500之間。二第二扣件750之相對兩端各具有一卡扣孔751及一第四勾部752。同一第二扣件750之第四勾部752較卡扣孔751靠近按壓件730。二第二彈性件760分別抵靠於二第二扣件750及座體710。二第二扣件750皆具有相對靠近與相對遠離按壓件730的一第二卡扣位置及一第二釋放位置。當二第二扣件750位於第二卡扣位置時,二第二彈性件760分別受座體710與二卡扣件750擠壓,而二第四勾部752分別扣合於二第三勾部731。二卡扣柱611分別扣合於二卡扣孔751。當按壓件730朝第一彈性件740位移時,二第四勾部752分別與二第三勾部731分離,且二第二彈性件760用以將二第二扣件750分別自第二卡扣位置推至第二釋放位置,以令二卡扣孔751與二卡扣柱611相分離。 In this embodiment and other embodiments, the pressing member 730 further includes two third hook portions 731. The second third hook portions 731 respectively abut against the first elastic members 740. The first buckle assembly 600 further includes two buckle posts 611. The two latching posts 611 are respectively located on the surface of the two pivoting seats 610 away from the first substrate 100. The second buckle assembly 700 further includes two second fasteners 750 and two second elastic members 760. The second fasteners 750 are slidably disposed on the second board 500, and the second fasteners 750 are interposed between the second board 200 and the second board 500. The two opposite ends of the second fastening member 750 have a locking hole 751 and a fourth hook portion 752. The fourth hook portion 752 of the same second fastener 750 is closer to the pressing member 730 than the buckle hole 751. The second elastic members 760 respectively abut the two second fasteners 750 and the base 710. The second fastening members 750 all have a second fastening position and a second release position relatively close to and away from the pressing member 730. When the second fastening member 750 is located at the second fastening position, the second elastic members 760 are respectively pressed by the base 710 and the second fastening member 750, and the second and fourth hook portions 752 are respectively engaged with the second and third hooks. Part 731. The two latching posts 611 are respectively fastened to the two latching holes 751. When the pressing member 730 is displaced toward the first elastic member 740, the second and fourth hook portions 752 are respectively separated from the second and third hook portions 731, and the second second elastic members 760 are used to respectively remove the second and second fastening members 750 from the second card. The buckle position is pushed to the second release position to separate the two snap holes 751 from the two buckle posts 611.
在本實施例中,按壓件730係同時令二第二勾部724與二第一勾部621彼此分離,以及二第三勾部731與二第四勾部752彼此分離,但並不以此為限,在其他實施例中,可利用二按壓件730分別操控第二勾部724與第三勾部731之作動。 In this embodiment, the pressing member 730 separates the second hook portion 724 and the second hook portion 621 from each other, and the second hook portion 731 and the second hook portion 752 are separated from each other, but In other embodiments, the second hook 724 and the third hook 731 can be respectively operated by the two pressing members 730.
請參閱第3A圖至第3H圖,第3A圖至第3H圖為第1圖之操作示意圖。如第3A圖與第3B圖所示,第二基板200位於收合位置,第二基板200相對靠攏第一基板100,且二第一扣件720分別受二第一彈性件740推抵而位於第一卡扣位置,使得二第一勾部621分別與二第二勾部724相扣合。此外,二第二扣件750相對靠近而位於第二卡扣位置,使得二第三勾部731分別與二第四勾部752相扣合,且第二彈性元件760分別受到第二扣件750與座體710而處於彈性壓縮的狀態。 Please refer to FIG. 3A to FIG. 3H , and FIG. 3A to FIG. 3H are schematic diagrams of operation of FIG. 1 . As shown in FIG. 3A and FIG. 3B, the second substrate 200 is located at the folding position, the second substrate 200 is relatively close to the first substrate 100, and the two first fasteners 720 are respectively pushed by the two first elastic members 740. The first buckle position is such that the two first hook portions 621 are respectively engaged with the second hook portions 724. In addition, the second fastening members 750 are relatively close to each other and are located at the second fastening position, so that the second third hook portions 731 are respectively engaged with the second and fourth hook portions 752, and the second elastic members 760 are respectively received by the second fastening members 750. With the seat body 710, it is in an elastically compressed state.
如第3C圖與第3D圖所示,當使用者要將記憶體20裝設於記憶體擴充套件10內時,則必需打開記憶體擴充套件10。首先,按壓件730朝第一彈性件740的方向(沿箭頭a所指示的方向)壓抵第一扣件720之第二懸臂723,使第二扣件750相對座體710樞轉(沿箭頭c所指示的方向)而位於第一釋放位置,進而讓第一扣件720之第二勾部724與第二扣件750之第四勾部752解除卡扣關係。此外,按壓件730朝第一彈性件740的方向壓抵時,會一起讓第三勾部731朝第一彈性件740的方向位移而令第三勾部730與第四勾部752解除卡扣關係。第二扣件750會受到第二彈性元件760的推抵而位移至第二釋放位置,以令卡扣孔751與卡扣柱611解除卡扣關係。 As shown in FIGS. 3C and 3D, when the user wants to install the memory 20 in the memory expansion kit 10, it is necessary to open the memory expansion kit 10. First, the pressing member 730 is pressed against the second cantilever 723 of the first fastening member 720 in the direction of the first elastic member 740 (in the direction indicated by the arrow a), so that the second fastening member 750 pivots relative to the base 710 (along the arrow) The direction indicated by c is located in the first release position, and the second hook portion 724 of the first fastener 720 and the fourth hook portion 752 of the second fastener 750 are released from the buckle relationship. In addition, when the pressing member 730 is pressed in the direction of the first elastic member 740, the third hook portion 731 is displaced together in the direction of the first elastic member 740, and the third hook portion 730 and the fourth hook portion 752 are released from the buckle. relationship. The second fastening member 750 is displaced by the second elastic member 760 to be displaced to the second release position to release the snap hole 751 from the snap post 611.
如第3E圖所示,當第二基板200位於展開位置時,使用者可將記憶體20插入第一電性插槽110或第二電性插槽210以擴充記憶體擴充套件10之記憶體容量。 As shown in FIG. 3E, when the second substrate 200 is in the deployed position, the user can insert the memory 20 into the first electrical socket 110 or the second electrical socket 210 to expand the memory of the memory expansion kit 10. capacity.
如3F圖所示,擴充了記憶體擴充套件10之記憶體容量後, 將第一基板100與第二基板200相互靠攏以位於收合位置,並分別將二第二扣件750向內壓(沿箭頭d所指示之方向),使二第一基板100與第二基板200固定於收合位置。如此一來,使用者在裝設記憶體擴充套件10時,可握持著卡扣片620以便於將記憶體擴充套件10之第一電連接部120與第二電連接部220插設於二擴充插槽32。 As shown in the 3F figure, after the memory capacity of the memory expansion kit 10 is expanded, The first substrate 100 and the second substrate 200 are brought together to be in a folded position, and the second second fasteners 750 are pressed inwardly (in the direction indicated by the arrow d) to make the two first substrate 100 and the second substrate. 200 is fixed at the folding position. In this way, when the memory expansion kit 10 is installed, the user can hold the snap tab 620 to insert the first electrical connection portion 120 and the second electrical connection portion 220 of the memory expansion kit 10 into the second electrical connection portion 220. Expansion slot 32.
如第3G圖與第3H圖所示,最後再將二卡扣片620收合起來(沿箭頭f所指示的方向),則完成記憶體擴充套件10的組裝流程。 As shown in FIG. 3G and FIG. 3H, finally, the two snap tabs 620 are folded together (in the direction indicated by the arrow f), and the assembly process of the memory expansion kit 10 is completed.
根據上述本發明所揭露的記憶體擴充套件,第一基板與第二基板分別包含多個供記憶體插接的電性插槽,且第一基板與第二基板相互樞設,使得記憶體擴充套件插設於擴充插槽時,第一基板與第二基板分別豎立於主機板,且各記憶體分別插接於主機板上方之各電性插槽,進而在主機板有限的空間上增加供記憶體插接的電性插槽的數量而提升電腦主機所能插接的記憶體容量。 According to the memory expansion kit of the present invention, the first substrate and the second substrate respectively comprise a plurality of electrical sockets for the memory to be inserted, and the first substrate and the second substrate are pivoted to each other, so that the memory is expanded. When the kit is inserted into the expansion slot, the first substrate and the second substrate are respectively erected on the motherboard, and each memory is respectively inserted into each electrical slot above the motherboard, thereby increasing the space on the motherboard. The number of electrical slots that the memory is plugged in increases the amount of memory that can be docked by the host computer.
此外,按壓件可一次性地釋放第一勾部與第二勾部以及第三勾部與第四勾部間的卡扣關係,使得使用者要擴充記憶體時,僅需按下按壓件,即可令第一基板與第二基板位於可供記憶體插接之展開位置,以提升記憶體擴充套件的使用便利性。 In addition, the pressing member can release the first hook portion and the second hook portion and the snap relationship between the third hook portion and the fourth hook portion at one time, so that the user only needs to press the pressing member when expanding the memory. The first substrate and the second substrate are located in a deployed position for the memory to be inserted, thereby improving the usability of the memory expansion kit.
雖然本發明以前述的較佳實施例揭露如上,然其並非用以限定本發明,任何熟習相像技藝者,在不脫離本發明的精神和範圍內,當可作些許更動與潤飾,因此本發明的專利保護範圍須視本說明書所附的申請專利範圍所界定者為準。 While the present invention has been described above in its preferred embodiments, it is not intended to limit the invention, and the invention may be modified and modified without departing from the spirit and scope of the invention. The scope of patent protection shall be subject to the definition of the scope of the patent application attached to this specification.
10‧‧‧記憶體擴充套件 10‧‧‧Memory Expansion Kit
20‧‧‧記憶體 20‧‧‧ memory
30‧‧‧主機板 30‧‧‧ motherboard
32‧‧‧擴充插槽 32‧‧‧Expansion slot
100‧‧‧第一基板 100‧‧‧First substrate
110‧‧‧第一電性插槽 110‧‧‧First electrical slot
120‧‧‧第一電連接部 120‧‧‧First electrical connection
200‧‧‧第二基板 200‧‧‧second substrate
210‧‧‧第二電性插槽 210‧‧‧Second electrical slot
220‧‧‧第二電連接部 220‧‧‧Second electrical connection
300‧‧‧樞接件 300‧‧‧ pivotal parts
400‧‧‧第一板體 400‧‧‧ first board
500‧‧‧第二板體 500‧‧‧Second plate
600‧‧‧第一卡扣組件 600‧‧‧First buckle assembly
610‧‧‧樞接座 610‧‧‧ pivoting seat
611‧‧‧卡扣柱 611‧‧‧ buckle column
620‧‧‧卡扣片 620‧‧‧Card pieces
621‧‧‧第一勾部 621‧‧‧First hook
630‧‧‧第三彈性件 630‧‧‧ Third elastic parts
700‧‧‧第二卡扣組件 700‧‧‧Second snap assembly
710‧‧‧座體 710‧‧‧ body
720‧‧‧第一扣件 720‧‧‧First fastener
721‧‧‧樞接部 721‧‧‧ pivotal
722‧‧‧第一懸臂 722‧‧‧First cantilever
723‧‧‧第二懸臂 723‧‧‧second cantilever
724‧‧‧第二勾部 724‧‧‧Second Hook
730‧‧‧按壓件 730‧‧‧Pressing parts
731‧‧‧第三勾部 731‧‧‧The third hook
740‧‧‧第一彈性件 740‧‧‧First elastic parts
750‧‧‧第二扣件 750‧‧‧Second fasteners
751‧‧‧卡扣孔 751‧‧‧Snap hole
752‧‧‧第四勾部 752‧‧‧The fourth hook
760‧‧‧第二彈性元件 760‧‧‧Second elastic element
第1A圖為根據本發明一實施例之記憶體擴充套件插設於主機板之擴充插槽的立體示意圖。 FIG. 1A is a perspective view of a memory expansion kit inserted into an expansion slot of a motherboard according to an embodiment of the invention.
第1B圖為第1A圖之記憶體擴充套件的展開示意圖。 Figure 1B is a schematic exploded view of the memory expansion kit of Figure 1A.
第2A圖為第1A圖之記憶體擴充套件的分解示意圖。 Figure 2A is an exploded perspective view of the memory expansion kit of Figure 1A.
第2B圖為第2A圖之第二卡扣組件的分解示意圖圖。 2B is an exploded perspective view of the second snap assembly of FIG. 2A.
第3A圖至第3H圖為第1圖之操作示意圖。 3A to 3H are schematic views of the operation of Fig. 1.
20‧‧‧記憶體 20‧‧‧ memory
100‧‧‧第一基板 100‧‧‧First substrate
110‧‧‧第一電性插槽 110‧‧‧First electrical slot
200‧‧‧第二基板 200‧‧‧second substrate
210‧‧‧第二電性插槽 210‧‧‧Second electrical slot
300‧‧‧樞接件 300‧‧‧ pivotal parts
400‧‧‧第一板體 400‧‧‧ first board
500‧‧‧第二板體 500‧‧‧Second plate
600‧‧‧第一卡扣組件 600‧‧‧First buckle assembly
700‧‧‧第二卡扣組件 700‧‧‧Second snap assembly
Claims (9)
Priority Applications (1)
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TW101147614A TWI514113B (en) | 2012-12-14 | 2012-12-14 | Memory expansion assembly |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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TW101147614A TWI514113B (en) | 2012-12-14 | 2012-12-14 | Memory expansion assembly |
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TW201423328A true TW201423328A (en) | 2014-06-16 |
TWI514113B TWI514113B (en) | 2015-12-21 |
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