TW201345985A - 導電性墨水組合物、導電性圖案之製造方法及導電性電路 - Google Patents
導電性墨水組合物、導電性圖案之製造方法及導電性電路 Download PDFInfo
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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Abstract
本發明提供一種可形成高精細之導電性圖案,可實現更低溫、更短時間內之煅燒且可獲得導電性較高之圖案的導電性墨水組合物。藉由含有導電性填料、環氧化合物、封端劑為活性亞甲基化合物及/或吡唑化合物之封端聚異氰酸酯、封端聚異氰酸酯之反應觸媒及有機溶劑作為必須成分而解決上述問題。本發明之導電性墨水組合物可實現更低溫、更短時間內之煅燒,且可印刷更高精細之導電性圖案。
Description
本發明係關於一種用以形成導電性皮膜之導電性墨水組合物、導電性圖案之製造方法及導電性電路。
作為觸控面板、電子紙及各種電子零件中所使用之導電電路、電極等之導電圖案形成方法,已知有印刷法或蝕刻法。
於藉由蝕刻法形成導電圖案之情形時,必需於在蒸鍍有各種金屬膜之基板上形成藉由光微影法而經圖案化之抗蝕劑膜之後,將不需要之蒸鍍金屬膜以化學方式或電化學方式溶解去除,最後去除抗蝕劑膜,該步驟非常繁雜且缺乏量產性。
另一方面,印刷法的情況下,能以低成本來進行所需圖案之大量生產,進而藉由使印刷塗膜乾燥或硬化,可容易地賦予導電性。
作為該等印刷方式,根據欲形成之圖案之線寬、厚度、生產速度而提出有柔版印刷、絲網印刷、凹版印刷、凹版膠印、噴墨等。
作為印刷圖案,就電子裝置之小型化、提高設計性等觀點而言,要求形成線寬50 μm以下之高精細之導電圖案。
又,為應付對於電子裝置之薄型化、輕量化、可撓化之要求的提高或生產性較高之卷對卷印刷,需求以下之導電性墨水,該導電性墨水係印刷於塑膠膜上,且藉由低溫短時間之煅燒可獲得較高之導電性、基材密接性、膜硬度等。進而需求以下之導電性墨水,該導電性墨水係於印刷在塑膠膜中之廉價且透明性較高之PET(polyethylene
terephthalate,聚對苯二甲酸乙二酯)膜、或於PET膜之上形成有ITO(indium tin oxide,氧化銦錫)膜之透明導電膜上時,可獲得上述物性。
此種狀況下,已知有以下之導電性糊劑組合物,該導電性糊劑組合物係含有銀粉末、加熱硬化性成分及溶劑之加熱硬化型導電性糊劑組合物,且上述加熱硬化性成分包含封端化聚異氰酸酯化合物、環氧樹脂以及選自由胺系、酸酐系及咪唑系所組成之群中之硬化劑(專利文獻1)。然而,存在以下缺點:煅燒溫度為150℃,由於不含異氰酸酯反應觸媒故硬化溫度較高,而且由於異氰酸酯之封端劑為MEK(methyl ethyl ketone,甲基乙基酮)肟故煅燒時間較長。
又,已知以下之導電性糊劑組合物,該導電性糊劑組合物係含有有機黏合樹脂、導電粉末、著色劑、有機溶劑及交聯劑而成,且上述有機黏合樹脂之數量平均分子量為3000~50000之範圍(專利文獻2)。該技術亦與上述專利文獻1之技術同樣地存在以下問題:煅燒條件為130℃、30分鐘,由於未加入異氰酸酯反應觸媒故煅燒時間較長,且由於異氰酸酯之封端劑為MEK肟故煅燒時間較長。
進而,已知以下之導電性糊劑組合物,該導電性糊劑組合物係含有有機黏合樹脂、導電粉末、著色劑、有機溶劑及交聯劑者,且導電粉末含有其形狀為球狀之球狀粉末,其含有率相對於導電粉末總體量而為50~95質量%(專利文獻3)。該技術亦存在與上述技術相同之問題。
[專利文獻1]日本專利特開2002-161123
[專利文獻2]日本專利特開2009-26558
[專利文獻3]日本專利特開2009-24066
因此,本發明所欲解決之問題在於提供一種導電性墨水組合物,其可形成高精細之導電性圖案,可於更低溫、更短時間內煅燒,且可獲得導電性較高之圖案。
本發明者等人為解決上述問題而進行了潛心研究,結果發現,藉由使用特定之封端聚異氰酸酯化合物及封端聚異氰酸酯之反應觸媒,可解決上述問題,從而完成了本發明。
即,本發明提供一種導電性墨水組合物,其含有導電性填料、環氧化合物、封端劑為活性亞甲基化合物及/或吡唑化合物之封端聚異氰酸酯、封端聚異氰酸酯之反應觸媒及有機溶劑作為必須成分。
又,本發明提供一種導電性圖案之製造方法,其係將上述導電性墨水組合物塗佈於非耐熱性基材上並進行加熱。
進而,本發明提供一種導電性電路,其包含於非耐熱性基材上形成有上述導電性墨水組合物之硬化皮膜而成的導電性圖案。
本發明之導電性墨水組合物係藉由含有封端劑為活性亞甲基化合物或吡唑化合物之任一種之封端聚異氰酸酯及封端異氰酸酯之反應觸媒,而可實現更低溫、更短時間內之煅燒。藉此,即便於使用PET膜等非耐熱性基材之情形時,亦不會引起膜之變形,能以較高之生產性製造高精細且高導電性之導電圖案,且可形成高精細之導電性圖案。
作為本發明中使用之導電性填料,可使用公知者。例如可列
舉:鎳、銅、金、銀、鋁、鋅、鎳、錫、鉛、鉻、鉑、鈀、鎢、鉬等及該等中2種以上之合金、混合物或該等金屬之化合物且具有良好之導電性者等。尤其銀粉容易實現穩定之導電性,且導熱特性亦良好,故較佳。
於將銀粉用作本發明之導電性填料之情形時,較佳為使用作為平均粒徑之中值粒徑(D50)為0.1~10 μm之球狀銀粉末,更佳為0.1~3 μm。若為該範圍,則可使導電性墨水組合物之流動性更良好,且於柔版印刷、絲網印刷、凹版印刷或凹版膠印等特定印刷方法中,即便於在該等印刷機上連續地進行印刷之情形時,亦不易發生故障而容易穩定地獲得良好之導電性圖案印刷物。
作為此種銀粉,例如可列舉:AG2-1C(DOWA electronics(股)製造,平均粒徑D50:0.8 μm)、SPQ03S(三井金屬礦山(股)製造,平均粒徑D50:0.5 μm)、EHD(三井金屬礦山(股)製造,平均粒徑D50:0.5 μm)、Silbest C-34(德力化學研究所(股)製造,平均粒徑D50:0.35 μm)、AG2-1(DOWA electronics(股)製造,平均粒徑D50:1.3 μm)、Silbest AgS-050(德力化學研究所(股)製造,平均粒徑D50:1.4 μm)等。
於本發明中使用環氧化合物。作為所使用之環氧樹脂,並無特別限定,較佳為使用脂肪族之環氧化合物。具體而言,較佳為使用聚乙二醇、聚丙二醇、己二醇、三羥甲基丙烷、甘油、季戊四醇、山梨糖醇等之縮水甘油醚化物等環氧化物,或脂環式環氧化合物。其中,更佳為聚乙二醇、聚丙二醇、三羥甲基丙烷等之縮水甘油醚化物。
脂肪族之環氧化合物於室溫下為液狀或半固態,故可使導電性墨水組合物之流動性良好,且於柔版印刷、絲網印刷、凹版印刷、或
凹版膠印等特定印刷方法中,即便於在該等印刷機上連續地進行印刷之情形時,亦不易發生故障而容易穩定地獲得良好之導電性圖案印刷物。芳香族之環氧化合物中亦有一部分係液狀或半固態者,但就安全上之理由而言使用欠佳。
又,藉由將該環氧化合物與封端聚異氰酸酯併用,可獲得導電性優異、且更為強韌並且耐溶劑性優異之塗膜。
於本發明中,可於不損及本發明效果之範圍內使用其他公知之皮膜形成性之熱塑性樹脂。作為本發明中可使用之其他樹脂,例如可列舉:聚酯樹脂、氯乙烯樹脂、縮醛樹脂、丙烯酸系樹脂、聚酯樹脂、聚胺基甲酸酯樹脂等。該等可單獨使用或亦可併用兩種以上。或者亦能以將該等樹脂系作為基礎之共聚物的形式使用。
本發明中使用之使封端劑熱解離而產生游離異氰酸酯基之封端聚異氰酸酯化合物係使用以下者:包含封端劑與聚異氰酸酯化合物,且封端劑為活性亞甲基化合物或吡唑化合物之任一種之封端聚異氰酸酯。只要為此種化合物,則可無特別限定地使用,尤其於將PET膜作為塑膠膜而用於基材之情形時,若使導電性墨水組合物中含有使用如生成異氰酸酯基時之溫度達到70~125℃之封端劑的封端聚異氰酸酯化合物,則PET膜中不會產生翹曲等,可於其上形成導電性圖案。
對本發明中使用之封端聚異氰酸酯加以更詳細說明。作為封端聚異氰酸酯化合物之種類,並無特別限定,為芳香族、脂肪族、脂環族二異氰酸酯,由二異氰酸酯之改性所得之二或三聚物,末端含有異氰酸酯基之化合物等。可單獨使用亦可併用。作為芳香族二異氰酸酯,例如可列舉:2,4-甲苯二異氰酸酯、2,6-甲苯二異氰酸酯、二苯基甲烷-4,4'-二異氰酸酯、二苯基甲烷-2,4'-二異氰酸酯、二甲氧苯胺
二異氰酸酯等。作為脂肪族二異氰酸酯,例如可列舉:1,4-四亞甲基二異氰酸酯、1,5-五亞甲基二異氰酸酯、1,6-六亞甲基二異氰酸酯(以下記作HMDI)、2,2,4-三甲基-1,6-六亞甲基二異氰酸酯等。作為脂環族二異氰酸酯,例如可列舉:離胺酸二異氰酸酯、異佛爾酮二異氰酸酯(以下記作IPDI)、1,3-雙(異氰酸酯基甲基)-環己烷、4,4'-二環己基甲烷二異氰酸酯等,進而可列舉由該等二異氰酸酯之改性所得之二或三聚物。作為改性之方法,可列舉縮二脲化、異氰尿酸酯化等。或者可列舉:使上述二或聚異氰酸酯化合物與例如乙二醇、丙二醇、三羥甲基丙烷、乙醇胺、聚酯多元醇、聚醚多元醇、聚醯胺等活性氫化合物反應所獲得之末端含有異氰酸酯基之化合物等。
另一方面,作為封端劑,為活性亞甲基化合物或吡唑化合物之任一種,具體而言,作為活性亞甲基化合物,可列舉:丙二酸環亞異丙酯、丙二酸二烷基酯、乙醯乙酸烷基酯、甲基丙烯酸-2-乙醯乙醯氧基乙酯、乙醯丙酮、氰基乙酸乙酯等,作為吡唑化合物,可列舉:吡唑、3,5-二甲基吡唑、3-甲基吡唑、4-苄基-3,5-二甲基吡唑、4-硝基-3,5-二甲基吡唑、4-溴-3,5-二甲基吡唑、3-甲基-5-苯基吡唑等。其中較佳為丙二酸二乙酯、3,5-二甲基吡唑等。作為市售品,活性亞甲基化合物可列舉Duranate MF-K60B(Asahi Kasei Chemicals公司製造)、Desmodur BL-3475(Sumika Bayer Urethane公司製造),吡唑化合物可列舉TRIXENE BI-7982(Baxenden公司製造),活性亞甲基與吡唑化合物之混合類型可列舉TRIXENE BI-7992(Baxenden公司製造)。
於製備本發明之導電性墨水組合物時,就可提高最終所獲得之導電性、強韌性、耐溶劑性等導電性圖案之性能之方面而言,較佳為相對於環氧化合物之非揮發成分100份,封端聚異氰酸酯化合物係以質量換算計而使用50~500份。
與具有游離異氰酸酯基之聚異氰酸酯化合物相比較,此種封端
劑熱解離而產生游離異氰酸酯基之封端聚異氰酸酯化合物可藉由以下方式而容易地獲得:一面監視紅外線吸收光譜,一面使封端劑反應直至基於異氰酸酯基之固有吸收光譜消失為止。
本發明中使用之封端聚異氰酸酯之反應觸媒並無特別限定,封端異氰酸酯之反應觸媒較佳為有機銨鹽或有機脒鹽。具體而言,有機銨鹽可使用四烷基銨鹵化物、四烷基銨氫氧化物、四烷基銨有機酸鹽等,有機脒鹽可使用1,8-二氮雙環[5.4.0]十一烯-7(以下記作DBU)、1,5-二氮雙環[4.3.0]壬烯-5(以下記作DBN)之酚鹽、辛酸鹽、油酸鹽、對甲苯磺酸鹽、甲酸鹽。其中,較佳為使用DBU-辛酸鹽、DBN-辛酸鹽等。作為市售品,有機銨鹽可列舉TOYOCAT-TR20(Tosoh公司製造),有機脒鹽可列舉U-CAT SA1、U-CAT SA102、U-CAT SA106、U-CAT SA506、U-CAT SA603、U-CAT SA1102(San-Apro公司製造)。
作為本發明中可使用之熱硬化性樹脂或熱塑性樹脂,由於其大部分係其本身於25℃下為固體,故通常必需於溶解於溶液介質中等後,於基材上塗佈或印刷細線圖案。因此,於選擇該樹脂時,必需考慮對溶液介質之溶解性。
就此種觀點而言,於本發明之導電性墨水組合物中,使用溶解上述樹脂、而且不具有與樹脂之反應性的於25℃下為液體之有機化合物。
此種有機化合物係所謂之有機溶劑,其種類並無限制,可列舉:酯系、酮系、氯系、醇系、醚系、烴系、醚酯系等。具體而言,例如可列舉:甲基乙基酮、甲基異丁基酮、環己酮、正丁醇、異丁醇、異佛爾酮、γ-丁內酯、DBE(Invista Japan製造)、N-甲基-2-吡咯啶酮、乙基卡必醇乙酸酯、乙酸丁基賽路蘇、丙二醇單烷基醚乙酸酯
等。該等可單獨使用一種,亦可併用兩種以上。其中,無論後述印刷方法之種類如可,為容易地獲得導電性圖案,於乾燥速度之方面而言較佳為使用沸點100~250℃者作為該有機溶劑。
如下文將述般,於採用凹版印刷法或凹版膠印法之情形時,此種有機溶劑較佳為聚矽氧橡皮布膨潤率為5~20%,尤佳為二乙二醇單丁醚乙酸酯或二乙二醇單乙醚乙酸酯等醚酯系有機溶劑。
本發明之導電性墨水組合物可藉由以下方式製備:將導電性填料、環氧化合物、封端劑為活性亞甲基化合物或吡唑化合物之任一種之封端聚異氰酸酯、封端聚異氰酸酯之反應觸媒及有機溶劑混合。於製備導電性墨水組合物時,就可提高最終所獲得之導電性圖案之性能之方面及可緩和導電性圖案形成條件之方面而言,較佳為相對於銀粉100份,以質量換算計而使用非揮發成分為0.1~10份之環氧樹脂、及5~30份之有機溶劑。
銀粉導電性填料於導電性墨水組合物中之含有率較佳為60~95質量%,若為70~90質量%則進而較佳。若為該範圍,則皮膜中之填料之密度充分而可獲得良好之導電性,容易製備成具有流動性之糊劑狀。
環氧樹脂於導電性墨水組合物中之含有率較佳為0.1~10質量%,若為1~5質量%則進而較佳。該範圍就可提高最終所獲得之導電性、對基材之密接性、耐溶劑性等導電性圖案之性能之方面而言較佳。
封端異氰酸酯於導電性墨水組合物中之含量以非揮發成分計,較佳為0.5~15重量%,若為2~10重量%則進而較佳。該範圍就可提高最終所獲得之導電性、對基材之密接性、耐溶劑性等導電性圖案之性能之方面而言較佳。
封端聚異氰酸酯之反應觸媒於導電性墨水組合物中之含量較佳
為0.05~3重量%,若為0.1~1重量%則進而較佳。該範圍就可提高最終所獲得之導電性、耐溶劑性等導電性圖案之性能之方面而言較佳。
有機溶劑之導電性墨水組合物中之含有率較佳為5~30質量%,若為7~15質量%則進而較佳。若為該範圍,則糊劑黏度變得更適當,尤其於凹版印刷或凹版膠印中,不會於畫線之角隅部分或矩陣之交叉點產生針孔缺陷,可形成更高精細之導電性圖案。
於本發明之導電性墨水組合物中,除上述成分以外,視需要亦可適當適量調配分散劑、消泡劑、剝離劑、調平劑、塑化劑等各種添加劑。
本發明之導電性墨水組合物可藉由利用任意之方法塗佈或印刷於例如塑膠膜、陶瓷膜、矽晶圓、玻璃或金屬平板之任一種基材上而形成導電性圖案。
本發明之導電性墨水組合物可藉由利用例如柔版印刷、絲網印刷、凹版印刷或凹版膠印之印刷方法印刷於任意之基材上而形成導電性圖案。
作為由本發明之導電性墨水組合物形成導電性圖案之方法,可列舉以下方法:將本發明之導電性墨水組合物塗佈於非耐熱性基材上並進行加熱。更佳為以下方法:進行將導電性墨水組合物填充於凹版中,將所填充之該墨水組合物向橡皮布輥轉印後,自橡皮布輥向非導電性支持體等轉印塗佈該墨水組合物,藉此於非耐熱性基材等之表面上印刷所需之圖案之所謂凹版膠印,繼而進行加熱,藉此形成導電性圖案。
作為此時之凹版印刷版,可使用:通常之凹版,藉由使玻璃板上之感光性樹脂曝光、顯影、清洗而形成之凹版,藉由使玻璃板、金屬板、金屬輥進行化學蝕刻及雷射蝕刻而形成之凹版。
又,作為聚矽氧橡皮布,係具有如聚矽氧橡膠層、PET層、海綿
層般之層構造之片材。通常,可於捲繞於被稱為橡皮布筒之具有剛性之圓筒上的狀態下使用。
於由本發明之導電性墨水組合物形成導電性圖案之方法中,於採用上述凹版膠印方法之情形時,對聚矽氧橡皮布要求自凹版之轉印性、及向基材之轉印性。為獲得向基材之充分之轉印性,必需於橡皮布表面中以一定比率吸收導電性墨水組合物中之液體成分。若吸收不充分,則於向基材之轉印時導電性墨水組合物層容易發生層間剝離,反之,若吸收超過一定比率,則有導電性墨水組合物於橡皮布表面乾燥,容易發生向基材之轉印不良之問題。
藉由將導電性墨水組合物之25℃下之黏度設為1~50 Pa.s,於採用凹版膠印法連續地進行導電性圖案之印刷之情形時,容易於畫線之角隅部分或矩陣之交叉點發生針孔缺陷,可形成良好之導電性細線圖案,且亦難以產生對凹版之上墨性、自凹版向橡皮布之轉移性之問題。
由本發明之導電性墨水組合物形成之導電性圖案亦可為如實體圖案般之線寬粗之畫線,但使用本發明之導電性墨水組合物之情形時的特徵係於將如上所述之細於先前之線寬畫線設置於基材上時尤其明顯地發揮。
又,由本發明之導電性墨水組合物所得之導電性圖案可於較先前低之溫度下且於短時間內形成,因此,相較於如陶瓷膜、玻璃或金屬平板般之耐熱性較高之基材,於耐熱性更低而容易發生熱變形的如PET般之通用塑膠膜上形成導電性圖案時,本發明之導電性墨水組合物之特徵尤其明顯地發揮。因此,於非耐熱性基材上形成本發明之導電性墨水組合物之硬化皮膜而成的導電性圖案可較佳地用作形成於非耐熱性基材上之導電性電路。
對於如此般使用本發明之導電性墨水組合物並利用各種印刷方
法印刷於各種基材上,藉此設有導電性圖案之基材而言,藉由將該基材作為導電性電路並視需要進行配線等,可製成各種電氣零件、電子零件。具體而言,本發明之導電性墨水組合物對如透明ITO電極般之透明導電膜之密接性優異。
作為最終產品,例如可列舉:觸控面板之引出電極或顯示器之引出電極、電子紙、太陽電池、其他配線品等。
以下,以實施例具體說明本發明。此處「%」只要無特別說明則為「質量%」。
以成為表1所記載之質量份數之方式使用各原料,將該等原料充分混合,製備作為實施例之本發明之各導電性墨水組合物及作為比較例之先前之各導電性墨水組合物。
對於該等各導電性墨水組合物,以如下測定項目評價導電性墨水組合物本身之特性及由其所得之導電性圖案之特性。其評價結果亦匯總示於以下表1、表2中。
使用敷料器,將導電性墨水組合物以乾燥後之膜厚成為4 μm之方式塗佈於透明導電膜上(ITO膜面)並於125℃下乾燥10分鐘。使用該墨水塗膜,利用Loresta GP MCP-T610(三菱化學公司製造)藉由四端子法進行測定。
使用與上述體積電阻率之評價同樣地製作之墨水塗膜,以ISO2409(油漆與清漆-劃格試驗(Paints and varnishes-Cross-cut test))之次序實施試驗,並依據以下基準進行評價。
利用截切刀以貫穿墨水塗膜之方式,以1 mm間隔描畫相對於墨水面正交之縱橫11條線,以覆蓋所切出之100個方格之方式貼附
Sellotape(註冊商標),抓住膠帶之端部以0.5~1秒剝下。觀察交叉切割部分之墨水塗膜,依據表面狀態分類為以下分類0~5,將分類0或分類1視為合格。
分類0:切割之邊緣完全光滑,無論哪一網格均未剝落。
分類1:於交叉切割部受到影響者未超過5%。
分類2:於交叉切割部受到影響者超過5%但未超過15%。
分類3:於交叉切割部受到影響者超過15%但未超過35%。
分類4:於交叉切割部受到影響者超過35%但未超過65%。
分類5:亦無法分至分類4中之任一種剝落程度。
使用本發明之導電性墨水組合物,藉由下述方法進行凹版膠印,製作導電電路。
藉由刮刀將導電性墨水組合物上墨至玻璃製之凹版上後,向捲繞有橡皮布之圓筒擠壓、接觸,使所需之圖案轉移至橡皮布上。其後,使該橡皮布上之塗膜擠壓、轉印至作為基材之透明導電膜上,製作線寬40 μm~100 μm之導電電路。對上述導電電路中之線寬40 μm之線進行顯微觀察,並依據以下基準評價細線再現性。
◎:線之直線性特別優異,無斷線部位
○:線之直線性優異,無斷線部位
×:線之直線性較差,有斷線部位
˙銀粉
AG-2-1C(DOWA electronics(股)製造,平均粒徑D50:0.8 μm)
˙S-LEC KS-10:分子量17,000、玻璃轉移點溫度(Tg)106℃之縮醛樹脂(積水化學工業公司製造)
˙Solbine AL:數量平均分子量22,000、玻璃轉移點溫度(Tg)76℃、且氯乙烯/乙酸乙烯酯/乙烯醇之共聚合質量比為93/2/5之氯乙烯-乙酸乙烯酯共聚物(日信化學工業公司製造)
˙TRIXENE BI 7982:封端劑為3,5-二甲基吡唑之封端異氰酸酯(Baxenden公司製造)
˙TRIXENE BI 7992:封端劑為3,5-二甲基吡唑及丙二酸二乙酯之封端異氰酸酯(Baxenden公司製造)
˙Coronate 2507:封端劑為MEK肟類型之封端異氰酸酯(日本Polyurethane工業公司製造)
˙Denacol EX-321:三羥甲基丙烷聚縮水甘油醚(Nagase chemteX公司製造)
˙Denacol EX-830:聚乙二醇二縮水甘油醚(Nagase chemteX公司製造)
˙Toho聚乙二醇400:聚乙二醇(東邦化學工業公司製造)
˙U-CAT SA 102:DBU-辛酸鹽(San-Apro公司製造)
˙U-CAT SA 603:DBU-甲酸鹽(San-Apro公司製造)
˙Curezol 2E4MZ:2-乙基-4-甲基咪唑(四國化成公司製造)
˙BDGAc:二乙二醇單丁醚乙酸酯
如根據表1、2之評價結果所得知般,明白含有環氧化合物之實施例1~6之導電性墨水組合物為均可滿足體積電阻率、基材密接性、印刷適性之水準,相對於此,不含環氧化合物之比較例1之導電性墨水組合物處於不滿足所有項目之水準。又,明白封端異氰酸酯之封端
劑並非低溫解離性之活性亞甲基化合物及或吡唑化合物的比較例2之導電性墨水組合物處於不滿足體積電阻率、基材密接性之水準。進而,明白於不含封端異氰酸酯之反應觸媒之比較例3之導電性墨水組合物亦處於不滿足體積電阻率、基材密接性之水準。
本發明之導電性墨水組合物可用作各種電氣零件‧電子零件之導電性圖案形成用之導電性銀漿。
Claims (7)
- 一種導電性墨水組合物,其含有導電性填料、環氧化合物、封端劑為活性亞甲基化合物及/或吡唑化合物之封端聚異氰酸酯、封端聚異氰酸酯之反應觸媒及有機溶劑作為必須成分。
- 如請求項1之導電性墨水組合物,其中封端異氰酸酯之反應觸媒為有機銨鹽或有機脒鹽。
- 如請求項1之導電性墨水組合物,其中該導電性填料為平均粒徑0.1~10 μm之球狀銀粉。
- 如請求項1之導電性墨水組合物,其中該環氧化合物為脂肪族之環氧化合物。
- 如請求項1之導電性墨水組合物,其中除該環氧化合物以外,進而含有皮膜形成性之熱塑性樹脂。
- 一種導電性圖案之製造方法,其係將如請求項1之導電性墨水組合物塗佈於非耐熱性基材上並進行加熱。
- 一種導電性電路,其包含於非耐熱性基材上形成有如請求項1之導電性墨水組合物之硬化皮膜而成的導電性圖案。
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WO2013147047A1 (ja) | 2013-10-03 |
CN104204114B (zh) | 2016-03-30 |
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JPWO2013147047A1 (ja) | 2015-12-14 |
US20150322275A1 (en) | 2015-11-12 |
TWI609934B (zh) | 2018-01-01 |
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US10301488B2 (en) | 2019-05-28 |
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