TW201302969A - 接著膜、切割晶片接合膜及使用其之半導體加工方法 - Google Patents
接著膜、切割晶片接合膜及使用其之半導體加工方法 Download PDFInfo
- Publication number
- TW201302969A TW201302969A TW101115335A TW101115335A TW201302969A TW 201302969 A TW201302969 A TW 201302969A TW 101115335 A TW101115335 A TW 101115335A TW 101115335 A TW101115335 A TW 101115335A TW 201302969 A TW201302969 A TW 201302969A
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- Prior art keywords
- film
- bonding film
- dicing
- wafer
- semiconductor wafer
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
- C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
- H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68377—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support with parts of the auxiliary support remaining in the finished device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/27—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Dicing (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011147778 | 2011-07-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW201302969A true TW201302969A (zh) | 2013-01-16 |
Family
ID=47436829
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW101115335A TW201302969A (zh) | 2011-07-01 | 2012-04-30 | 接著膜、切割晶片接合膜及使用其之半導體加工方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5449622B2 (ko) |
KR (1) | KR101649020B1 (ko) |
CN (1) | CN103620742B (ko) |
TW (1) | TW201302969A (ko) |
WO (1) | WO2013005470A1 (ko) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
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TWI667703B (zh) * | 2014-12-12 | 2019-08-01 | 日商日東電工股份有限公司 | Cutting piece, dicing wafer bonding film, and manufacturing method of semiconductor device |
TWI687985B (zh) * | 2015-09-18 | 2020-03-11 | 日商迪思科股份有限公司 | 分割裝置及晶圓之分割方法 |
TWI811437B (zh) * | 2018-08-28 | 2023-08-11 | 日商迪思科股份有限公司 | 光元件晶圓加工方法 |
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KR101643184B1 (ko) * | 2013-08-28 | 2016-07-27 | 후지모리 고교 가부시키가이샤 | 화학 연마용 표면 보호 필름 |
JP6223155B2 (ja) * | 2013-11-29 | 2017-11-01 | サムスン エスディアイ カンパニー, リミテッドSamsung Sdi Co., Ltd. | 接着剤層用塗布組成物、半導体用接着フィルムおよびその製造方法、ならびに、これを用いた半導体装置の製造方法 |
JP6310748B2 (ja) * | 2014-03-31 | 2018-04-11 | 日東電工株式会社 | ダイボンドフィルム、ダイシングシート付きダイボンドフィルム、半導体装置、及び、半導体装置の製造方法 |
JP6068386B2 (ja) * | 2014-03-31 | 2017-01-25 | 日東電工株式会社 | 熱硬化型ダイボンドフィルム、ダイシング・ダイボンドフィルム及び半導体装置の製造方法 |
WO2016027883A1 (ja) * | 2014-08-22 | 2016-02-25 | リンテック株式会社 | 保護膜形成用シートおよび保護膜付き半導体チップの製造方法 |
CN106816412B (zh) * | 2017-01-19 | 2019-05-24 | 吉林麦吉柯半导体有限公司 | 晶圆的切割工艺及晶圆的生产方法 |
JP6995505B2 (ja) * | 2017-06-22 | 2022-01-14 | 日東電工株式会社 | ダイシングダイボンドフィルム |
JP6876540B2 (ja) * | 2017-06-27 | 2021-05-26 | 日東電工株式会社 | ダイシングテープ一体型接着性シート |
JP7280661B2 (ja) * | 2017-12-28 | 2023-05-24 | 日東電工株式会社 | ダイシングダイボンドフィルム |
CN108913076A (zh) * | 2018-06-29 | 2018-11-30 | 佛山市高明区爪和新材料科技有限公司 | 一种导热绝缘灌封胶 |
CN110828352A (zh) * | 2018-08-07 | 2020-02-21 | 福科胶研股份有限公司 | 晶圆承载方法 |
WO2020194613A1 (ja) * | 2019-03-27 | 2020-10-01 | 日立化成株式会社 | 半導体装置の製造方法、ダイボンディングフィルム、及びダイシング・ダイボンディング一体型接着シート |
JP7328807B2 (ja) * | 2019-06-26 | 2023-08-17 | 日東電工株式会社 | ダイシングテープ、及び、ダイシングダイボンドフィルム |
KR20230114759A (ko) * | 2019-12-18 | 2023-08-01 | 세키스이가가쿠 고교가부시키가이샤 | 점착제 조성물, 점착 테이프, 전자 기기 부품 또는차재 부품의 고정 방법, 및, 전자 기기 부품 또는 차재 부품의 제조 방법 |
WO2022044766A1 (ja) * | 2020-08-28 | 2022-03-03 | 株式会社村田製作所 | 積層コンデンサ、積層コンデンサ群および積層コンデンサの製造方法 |
KR102544311B1 (ko) | 2021-03-22 | 2023-06-15 | 세키스이가가쿠 고교가부시키가이샤 | 점착 테이프, 전자 기기 부품 또는 차재 기기 부품의 고정 방법, 및 전자 기기 또는 차재 기기의 제조 방법 |
TWI787104B (zh) * | 2021-03-22 | 2022-12-11 | 日商積水化學工業股份有限公司 | 黏著帶、電子機器零件或車載機器零件之固定方法、及電子機器或車載機器之製造方法 |
US11912905B2 (en) | 2021-03-22 | 2024-02-27 | Sekisui Chemical Co., Ltd. | Adhesive tape, method for immobilizing electronic device component or on-vehicle device component, method for manufacturing electronic device or on-vehicle device |
CN116867868A (zh) * | 2021-06-23 | 2023-10-10 | 积水化学工业株式会社 | 粘合剂组合物及粘合带 |
CN114512412B (zh) * | 2022-04-20 | 2022-07-12 | 苏州科阳半导体有限公司 | 一种声表面波滤波器晶圆封装方法及芯片 |
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DE69511843T2 (de) * | 1995-04-03 | 2000-06-29 | Minnesota Mining And Mfg. Co., Saint Paul | Druckempfindlicher Klebstoff |
CN1089356C (zh) | 1995-04-04 | 2002-08-21 | 日立化成工业株式会社 | 粘合剂、胶膜及带粘合剂底面的金属箔 |
JP2001131501A (ja) * | 1999-11-04 | 2001-05-15 | Hitachi Chem Co Ltd | 三層接着フィルム、半導体チップ搭載用基板及び半導体装置 |
JP2001152107A (ja) * | 1999-11-25 | 2001-06-05 | Hitachi Chem Co Ltd | 積層接着フィルム、半導体チップ搭載用基板及び半導体装置 |
JP4647830B2 (ja) | 2001-05-10 | 2011-03-09 | 株式会社ディスコ | 被加工物の分割処理方法および分割処理方法に用いるチップ間隔拡張装置 |
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JP5374972B2 (ja) * | 2008-05-09 | 2013-12-25 | 日立化成株式会社 | 接着フィルム、接着シート、半導体装置及び半導体装置の製造方法 |
KR101023240B1 (ko) * | 2008-12-12 | 2011-03-21 | 제일모직주식회사 | 스텔스 다이싱용 반도체용 접착 조성물 및 이를 이용한 접착필름 |
JP2010251727A (ja) * | 2009-03-24 | 2010-11-04 | Furukawa Electric Co Ltd:The | 半導体ウエハ加工用テープ |
JP5411827B2 (ja) * | 2009-10-02 | 2014-02-12 | 丸尾カルシウム株式会社 | 表面処理炭酸カルシウム充填材を配合してなる2液型硬化性樹脂組成物 |
KR101045262B1 (ko) | 2009-12-21 | 2011-06-29 | 제일모직주식회사 | 스텔스 다이싱용 반도체용 접착 조성물 및 이를 이용한 접착 필름 |
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2012
- 2012-04-26 CN CN201280027417.6A patent/CN103620742B/zh active Active
- 2012-04-26 WO PCT/JP2012/061247 patent/WO2013005470A1/ja active Application Filing
- 2012-04-26 JP JP2013522506A patent/JP5449622B2/ja active Active
- 2012-04-26 KR KR1020137032619A patent/KR101649020B1/ko active IP Right Grant
- 2012-04-30 TW TW101115335A patent/TW201302969A/zh unknown
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI667703B (zh) * | 2014-12-12 | 2019-08-01 | 日商日東電工股份有限公司 | Cutting piece, dicing wafer bonding film, and manufacturing method of semiconductor device |
TWI687985B (zh) * | 2015-09-18 | 2020-03-11 | 日商迪思科股份有限公司 | 分割裝置及晶圓之分割方法 |
TWI811437B (zh) * | 2018-08-28 | 2023-08-11 | 日商迪思科股份有限公司 | 光元件晶圓加工方法 |
Also Published As
Publication number | Publication date |
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CN103620742B (zh) | 2016-05-25 |
KR101649020B1 (ko) | 2016-08-17 |
KR20140033100A (ko) | 2014-03-17 |
CN103620742A (zh) | 2014-03-05 |
WO2013005470A1 (ja) | 2013-01-10 |
JP5449622B2 (ja) | 2014-03-19 |
JPWO2013005470A1 (ja) | 2015-02-23 |
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