TW201231219A - Grinding/polishing device for polygonal column member and grinding/polishing method - Google Patents

Abstract

Provided are: a silicon block grinding/polishing device comprising a grinding function capable of grinding a square column-shaped silicon block within tolerance ranges of +-0.5 mm for the cross-section dimensions thereof and +-0.1 DEG for the perpendicular angles thereof, said block having been formed by cutting a silicon ingot using a wire saw, and comprising a polishing function capable of removing micro cracks in the surface layer of the cut silicon block (W); and a processing method therefor. The device comprises: a holding means (1) that holds the silicon block (W); a measuring means (2) that measures the cross-section dimensions of the silicon block (W); a grinding means (3) that grinds the planar sections (F) and the angular sections (C) of the silicon block (W); a polishing means (4) that polishes the planar sections (F) and the angular sections (C) of the silicon block (W) which has completed grinding and removes micro cracks; a transfer means (5) that transfers the holding means (1) holding the silicon block (W), between the measuring means (2), the grinding means (3), and the polishing means (4); and a control means (6) that operates each of the means.

Description

201231219 VI. Description of the Invention: [Technical Field] The present invention relates to a grinding/grinding apparatus for a hard and brittle material and a grinding/grinding method. More specifically, the present invention is provided with grinding and grinding. Grinding/grinding and lifting device and grinding/grinding method for the plane and corner functions of the object. Further, in the grinding step using the apparatus of the present invention, the workpiece is processed into a cross-sectional shape having a predetermined size, and in the grinding step, the micro-crack existing in the surface layer of the workpiece is removed. [Prior Art] The hard and brittle material of the present invention, which is a hard and brittle material, has a stone block obtained by cutting out from the Shi Xi key in the step of manufacturing a substrate such as a solar cell panel. There are two kinds of polycrystals and single crystals with different crystal structures. Hereinafter, although the cross-sectional shape is a tetragonal polycrystal and a single 14-piece grinding/polishing is described as an example, the cross-sectional shape of the broken workpiece of the present invention is not limited to a quadrangular shape, even if it is an even angle of four or more corners. A polygonal column can also be used. The polycrystalline stone block is cut into a step by step by cutting the surface layer portion (6 sides) of the cube-shaped stone ingot into a forming mold by stripping the molten material into a forming mold. The corner of the square has a columnar shape and forms a four-plane portion, and the shape is such that the two planar portions intersect each other at right angles, and a minute plane (chamfered portion) is formed at the corner portion. The single crystal stone block is formed by cutting the crystal surface of the cylindrical stellate by the crystal pulling method at a right angle to the column axis of the bismuth ingot, and parallel to each other, using a belt ore or wire ore to cut After the flat end face, further use belt or mine 3 201231219

Wrong' is to divide 4 sides into A. 4, form a right angle, and cut the surface part of the round ◊ ◊ ' , , , , , , , , , , , 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 , % set processing, g Xuan broken and dangerous arrogant knife in addition to the face is formed by 4 planes. : For those who know the technical requirements of the processing of Shi Xi block. η在石夕块的保持机构 and its rotating mechanism, in Patent Document 1: 1 and ϋ 6 have not disclosed a holding mechanism and a rotating mechanism; the holding mechanism is used to hold the stone block μ 1U * w ( Both ends of the longitudinal direction), the rotating mechanism (4) the holding mechanism performs rotation control to make the processing part of the stone block

Flat/face and corners) become opposite to the means of reinforcement

The surface is subjected to a grinding process - and the scorpion scorpion raises the U T in the horizontal direction (the long side direction of the block). It is disclosed in paragraphs _0 and 6 of Patent Document 1. It is also known to carry out the grinding and grinding on the opposite side, and the grinding/grinding and grinding device is moved in the horizontal direction (longitudinal direction of the block). The grinding step consists of a coarse grinding step in which the coarseness of the abrasive grains is coarse and a two-step polishing step in which the coarseness of the abrasive grains is finer, or the grinding fixture is formed by mixing the diamond abrasive grains in the resin brush. It is also known that a ring-shaped rotating brush is known for the type of the stone block to be processed, and the seed is processed in a polycrystalline or single crystal stone block or a circular grinding machine containing abrasive grains in the polishing jig. Stone or diamond wheels (grinding wheels) are also known for obtaining high dimensional accuracy. In addition, when the bismuth ingot is cut and formed, the micro-cracks or minute irregularities occurring on the surface layer of the bismuth block are removed, and the slab is cut and processed to form a crack or a defect caused by the flaw. The processing method of the 201231219 block with a reduced incidence of good products has also become known. Further, it has been known to form a tantalum wafer by cutting a tantalum block. [Patent Document 1] Japanese Patent Publication No. 4133935 (Discussion of the Invention) As described above, the slabs of polycrystalline or single crystals are cut into a square shape so that the cross-sectional shape is quadrangular. The size of the formation is: a square section having a cross-sectional dimension of 125 mm (referred to as: 5 吋 156 156 mm (referred to as · 6 吋), and one side 21 〇 (called: 8 吋)) The length can be cut to any length between 15 〇 and __. In the method of cutting the bismuth ingot, there is a method of using a band saw or a wire saw, but the wire saw is cut by a plurality of wires at the same time. The cutting efficiency is higher than that of the band saw. The cutting method of the wire saw is generally a method of separating the abrasive grains by spraying the abrasive grains to the cutting portion by the pressure of the pressure water, and the free abrasive grains for cutting. In recent years, in order to improve the cutting efficiency, a new steel wire in which the abrasive grains are melted and fixed to the steel wire as a fixed abrasive grain method has been developed. The new cutting method using this new wire saw has been gradually adopted. Confirm the cutting efficiency of the new line error In the improvement, the polycrystalline tantalum ingot and the single crystal tantalum ingot are cut by a conventional wire saw and a new wire saw, as shown in FIG. 9 and FIG. 11 , with a vertical line of 5 lines, a width of 5 lines, and a total of 25 sections. The result of forming a block having a size of 6 吋 (having a square cross section of 156 mm) and a dimension of 3 〇〇 mm in length 'to confirm the time required for cutting, the conventional wire saw needs more than 8 hours, and the new wire saw is only required When it is completed in about 3 hours, it is confirmed that the cutting time can be greatly shortened. 201231219 As a reason why the cutting time can be shortened, it is estimated that the wire saw of the conventional free-grain type is a high-speed steel wire during cutting. When the rotation, the abrasive grains will scatter and the cutting efficiency will be lowered. However, since the new wire saw is melted and fixed to the steel wire, the abrasive grains which are rotated with the wire do not scatter. However, when the wire is cut by the new wire saw In the case of polycrystalline germanium ingots, the four crucibles (A) located at the corners of Fig. 9 and the three crucibles (B) that are located between the crucibles (A) and the portion of the crucible (A) are facing the crucible. The cut surface on the outer peripheral side (the block (there are 2 sides in △I, and there are in the block (B)) The center of the surface is in a state of protruding outward (see Fig. 10). When the single wire saw is cut by the new wire saw, as shown in Fig. U, since the blocks are individually and independently cut, the figure is as shown in the figure. ^No, the center of the four sections of the single crystal block is cut out to the outside, resulting in a new problem that the cross-sectional dimension is not within the specified dimensional tolerance. To solve this problem, it has been required The outer shape of the cymbal block is a grinding processing device within a predetermined outer dimension tolerance. As described above, the slab formed by cutting the bismuth ingot has a surface roughness of "(7) in the surface portion of the flat portion and the corner portion. ~川卜爪(1)%%::1994) The micro-cracks with a depth of 80~ΙΟΟμΓη from the surface of the surface will occur = in the gas-making step. Therefore, in the subsequent step, it is carried out with a wire saw: cutting When processing into a tantalum wafer, a defective product may be generated due to the unevenness or the U crack. Therefore, it has been required to have a preparation device for rough grinding ability and fine grinding ability; the coarse grinding system is used to grind and remove the ice from the surface portion of the block to the right of the bark before the cutting process. This is for removing microcracks having a depth of 80 to 1 ΟΟμηι from the surface of the surface of the surface of the surface of the surface of the surface of the surface of the surface of the surface of the surface of the surface of the surface. Further, in the prior art document, a known technique of a processing apparatus having both the grinding processing and the polishing processing is not disclosed. The present invention has been made in view of the above problems, and an object thereof is to provide a grinding machine/grinding processing device and a grinding/grinding method thereof, which are capable of performing a grinding process function and a grinding process function by a processing device of a ring machine. The production efficiency can be improved; the grinding function is to grind a square columnar polycrystalline block or a single crystal block formed by cutting a bismuth ingot, one side is i 25 mm (referred to as: 5 吋), and one side is 156 mm (referred to as :6吋), one side is 21〇mm (referred to as: 8吋) in any of the cross-sectional dimensions; the grinding processing function is to refine the surface roughness of the flat portion and the corner of the ' block and will be formed inside the surface layer The processing device for the micro-crack plus two polygonal columnar members of the present invention comprises: a holding means (1) for holding a hard and brittle material of a multi-angle column, which is a workpiece; the measuring hand: holding the cross-sectional dimension of the two workpieces Measurement, center position b for holding the position of the workpiece of the holding hand slave (1) b grinding means (3) and grinding means (4) cutting amount, "zero" $, and measuring; grinding means (3), will make '$" The base point is in the slave (). The flat part (F) and the corner () of the sinusoidal workpiece are processed: the slab is ground to make the cross-sectional dimension and the cross-sectional shape into tolerances. (2) 'The grinding will be finished. The processing 'the grinding part (6) performs the grinding force... to remove the presence of: - the means (7)' is the workpiece to be held by the holding means (1): flat: 201231219 4 (F) and angle 4 (〇 Measuring and grinding the grinding, and transferring the gripper (1) holding the workpiece to a position where the measuring means (2), the grinding means (3), the grinding means (4) are disposed, and the controlling means (6), according to the start Before the processing, the measurement signal of the start (3)疋 item and the measurement means (2) is subjected to arithmetic processing, and an operation signal (the i invention) is output to each means. According to the 3th invention, the present invention is The grinding/grinding skirt of the angular columnar member has a grinding processing function and a grinding processing function, and the grinding processing force applies a certain cutting to the workpiece (3) to trim the workpiece. Shapes such as deformation, cutting the outer dimensions into one The polishing processing function applies a certain waste force to the workpiece (4) to the workpiece, and performs contouring along the surface of the workpiece to grind the surface layer to tens to tens (four) for embossing And the crack is 2' and the surface roughness is ground to be fine'. Therefore, in the multi-angle: shape of the money (W), etc., even if the cross-sectional dimension and the straight angle deviate from the tolerance angle, the column member can be moved. After the difference between the cross-sectional size and the cross-sectional shape, the micro-cracks in the surface layer are removed. : 'The grinding means (3) can also be used as a grinding stone; the grinding stone is made of damascene: solid = abrasive grains. The surface of the portion (32) is formed by the rotation of the workpiece == contact rotation #A (31), and the rotation of the rotary disk = ::: source (four) axis _); the polishing means (4) (4)) The hair/, the abrasive brush is rotated by the brush material of the smelting fixed abrasive grain; the rotation of the workpiece in contact with the processing surface of the workpiece 5: the core (4)), and the rotating disk B (41) It is configured to convey the % rotation axis B (43) of the rotary drive source (the second invention). 8 201231219 According to the second aspect of the invention, the grinding means (3) is provided by cutting the deformation of the workpiece, cutting the deformation of the workpiece, and cutting the shape and cutting the outer diameter into a tolerance. The grinding and machining capabilities are within, so the grinding process can be carried out. Further, the polishing means (4) is selected such that the raw material of the melt-fixed abrasive grains is used as a bristle material (4 is a polishing brush, and the bristle material (42) is pressed against the reinforcing surface of the workpiece in the polishing process, and the hair is removed. The end portion is contoured, and the surface is rotated by a contact, and the surface layer of the workpiece is polished by a number of μm to tens of _ to remove the microcrack, and the surface can be processed into a fine grinding process. The abrasive brush of the grinding means (4) has two forms, one is bundled with the bristle material (42) of the mixed abrasive grains, and is detachably mounted on the red turntable cymbal (41), when the brush material (42) is consumed (4) changing the form of the brush material (42) (refer to FIG. 7 and the embodiment), and fixing the brush material (not shown) to the rotating disk. When the brush material is consumed, the disk is replaced with the rotating disk. The form (not shown) may be used in any form. Further, the grinding stone of the grinding means (7) may be set to have a particle size of two or more kinds of abrasive grains fixed to the abrasive grain portion (32); The grinding means (4) can be used to grind (4) (4) to the bristles The particle size of the abrasive grains of the material (42) is set to two or more types (third invention). Further, the polishing brush of the polishing means (4) may be set to have two or more types of abrasive grains which are melt-fixed and fixed to the bristle material (4). (4) The coarse brush material (42) is implanted in the inner ring portion near the center of rotation of the rotating disk β (41) and the fine-grained brush material (42) of the abrasive grain is planted in the rotating disk. The outer circumference of the rotation center is farther away (the fourth invention). 201231219 Regarding the configuration of the polishing brush used in the polishing method (4), when the particle size of the melt-fixed abrasive grains is set to two types, "in the past, two polishing brushes must be provided for each abrasive grain size, but according to the fourth invention , the coarse-grained brush material (42) of the abrasive grain is implanted in the inner ring portion near the rotation center of the rotating disk β (41), and the fine-grained brush material (42) of the abrasive grain can be implanted in the rotation. It is only necessary to provide one polishing brush having two types of bristle materials (42) having different particle sizes of the abrasive grains, and it is possible to reduce the production cost and the downsizing of the apparatus. Further, the method of grinding (3) can also be used as a grinding stone composed of abrasive grains having a particle size of F90 to F220 (JISR6001: 1998) and #24〇~#5〇〇卬6〇〇1: Η%); The polishing means (4) may be provided with a polishing brush for rough polishing composed of abrasive grains having a particle size of #24〇~#5_ISR_: 1998) and a particle size of the abrasive grains of #800 to #l200 (JISR6〇〇1: 1998) A polishing brush for fine polishing (the fifth invention). In the third invention and the fifth invention, the size of the abrasive grains of the sifting section (10) is selected from the _~f22 〇戈 coarse grain division specified by the 〇〇6〇〇1:1998, and #24〇〜#5〇 The advantages of the two groups of precision grinding are described. In the previous step, when cutting into a rectangular block of four corners, the section size is called: 5吋一袼】μ Λ 125mm±〇.5mm, called: 6 ° inch κ side 156mm ±〇.5mm, called .a &

冉 Two 8 inches with a side of 210mm ± 0.5mm A, depending on the situation, there is a tolerance of the left I, or the shape of the four-column 4 stone block (W) $ __ 13⁄4. . The straight angle of each corner (C) is 90±0. The angle of the angle is allowed to be outside the tolerance ^ ^ 卜 It rises y. In this case, according to the third invention, the fifth invention, the surface size and the cross-sectional shape of the section size + life are set within the tolerance. 10 201231219 There is a choice of coarse grain division of F90 to F220 and #24〇~#5 The precision grinding of 〇〇 区分 优点 区分 精密 精密 F F F F F F F F F F F F F F 精密 精密 精密 精密 精密 精密 精密 精密 精密 精密 精密 精密 精密 精密 精密 精密 精密 精密 精密 精密 精密 精密 精密 精密 精密 精密 240 240 240 In the grinding process of cracks and defects (polycrystalline block (w): corner (C), etc.), it is possible to prevent the occurrence of such chips and perform grinding. Further, when the abrasive grain portion (32) of the grinding device (3) is applied to the melt-solidified abrasive grains having two kinds of particle sizes, for example, a circular or ring-shaped inner ring (four) is provided on the ground surface of the abrasive grain portion, And a ring-shaped outer ring region disposed outside the inner ring region, or 'melting and solidifying the fine-grained abrasive grains in the inner ring region, refining and solidifying the coarse-grained abrasive grains in the outer ring region, and making the inner The loop area protrudes by more than the outer ring area, and the amount of protrusion can be formed as a fine abrasive cut amount. = As the abrasive grains of the polishing means (4), the particle size of #240 to #5〇〇 prescribed by JISR6〇〇丨:Η% is applied to the abrasive brush for rough grinding, and #800〜#12G( The particle size is suitable for the abrasive brush for fine polishing, and has two kinds of abrasive brushes. By virtue of the high grinding ability of the abrasive brush for rough grinding, there will be micro cracks in the surface layer of the moxibustion block (processed object). After the high efficiency is removed, the surface roughness of the surface layer portion which is coarsened by the rough polishing is finely ground by the fine grinding ability of the polishing brush for fine polishing, and the crack occurring in the subsequent step can be eliminated or Defect. The side-measuring method (2) is composed of a reference block (15), a measuring tool eight (1), and a measuring tool B (22); and a sea reference block (15) is formed on both sides and has The reference plane of the interval; in order to make the direction of the column axis of the reference block (1)) parallel to the direction of the axis of the workpiece to be reinforced, 201231219, in the direction of the clamping axis (13) of the holding means (1); A (21) (21), measuring the position of the reference datum of the reference block (15) in the horizontal direction from both sides orthogonal to the column axis direction of the object to be reinforced, and opposing the workpiece The position of the flat portion (F) or the position of the opposite corner portion, thereby measuring the outer shape of the workpiece; the measuring tool B (22), and measuring the upper side flat portion (7) or the upper side of the workpiece The height position of the corner portion (C) in the vertical direction (the sixth invention). According to the sixth aspect of the invention, for example, the case where the workpiece is a square column-shaped stone block (5) is described as an example, and the direction orthogonal to the column axis direction (the Y direction of FIGS. i and 4) is used by The measuring tool a (21) (21) measures the position of the reference surface of the reference block (15) of the holding means (1) and the position of the plane portion (7) or the corner portion (c) of the money (w) by measuring the money ( w) The actual size of the interval between the plane portion (7) or the corner portion (6) (the size of the figure and the direction of the figure): and the center position of the plane portion (F) relative to the plane can be measured. Further, by measuring the position of the B, the height position of the upper side plane portion (F) or the upper side corner portion (6) of the money (W) (the direction of the second direction of FIGS. 2 and 4) can be measured to thereby measure the vertical position. The center position of the stone block (5) in the direction (the direction of 2 in Fig. 2 and Fig. 4). The function of the measuring means (7) disclosed in the third invention is supplemented by the constituent elements disclosed in the measuring method (2) of the invention of the sixth invention. &lt;1&gt; The measurement of the cross-sectional dimension is measured by the measurement A(21)(7)), and the cross-sectional dimension of the plane portion (7) or the 2 corner portion of the stone block (5) is measured, and the result is stored in the control. Means (6), 12 201231219 &lt; 2〉^ When the holding means (1) holds the stone block (w), the center of the center position of the holding position is placed on the base of the holding means (1) The center position of the γ direction shown in Fig. 1 and Fig. 4 of the block (W). The center position is calculated based on the measured value of the measuring tool a(2 1) of the measuring means (2). Further, in order to match the center position of the calculated block (W) with the center of the gripping means (1), the pressing members (12) and (12) shown in Figs. 1 and 3 are moved back and forth to perform the block (W). ) Positioning. Further, the center position in the z direction shown in Figs. 2 and 4 is calculated based on the measured value of the measuring tool B (22) of the measuring means (2). Further, in order to make the calculated center position in the height direction of the block (W) coincide with the holding means (the center of the height direction of the cymbal, the base (11) moves up and down and is positioned. In this way, the έ 矽 block is The center position of both end faces of the column axis direction of W) coincides with the center position of the clamp shaft (13) (13) so that the grip can be performed. &lt;3&gt; The following processing is performed to store the position of the base point corresponding to the position where the cutting amount (3) and the cutting means (4) are "zero". First, the spacing dimension of the reference plane (15) relative to the reference plane is measured by the measuring tool A (21) (21) of the measuring means (7) shown in Figures i and 4 (the spacing dimension is known, in advance It is input to the control means (6)) and stored in the control means (6). Then, the front end of the grinding means (3) and the section (4) are respectively touched to the reference plane of the reference block (15), and the storage position is controlled by the <&gt; The actual size between the planar portion (7) or the two corner portions (c) of the sentence block (W) before the grinding/grinding of the means (6), the cutting means (3) and the grinding means (4) The position of the quantity becomes "zero": 13 201231219 The position is calculated and calculated, and the result is stored in the control means (6). Further, in the measuring means (2), there is a contact type which allows direct contact with the measurement site for measurement, and a non-contact type which emits laser light for measurement, but any of them may be used. Also, according to the input, it is revealed in the first! The initial setting of the control means (6) of the invention: the measurement signal of the item and the measuring means (2), and the control means (6) is used for the arithmetic processing, and the holding means (1)' measuring means is controlled by the action signal according to the calculation result ( 2), means for grinding (3), polishing means (4), and means for transferring (5). That is, as described in the supplementary description of the role of the above-mentioned measuring means (7) &lt; 1 &gt;&lt; 2 &gt; In each of the steps of &lt; 3 &gt;, the control means (6) performs the arithmetic processing 'and stores the result, and automatically sets the grinding according to the result of the (4) storage and the section size after the grinding/grinding of the control means (6). The cutting amount of the means (3) and the grinding means (4). When the type (polycrystal or early crystal) of the block (w) to be processed is polycrystalline, in order to be a processing step disclosed in the third invention described later, a means for holding and holding the block (w) by transfer is used. (1) The transfer means (5) operates, and when it is a single crystal, it is used as a processing step disclosed in the fourth invention described later, and the transfer means (1) for transferring and holding the block (w) is used. Hand (5) action. Further, in the case of the single crystal block (w), the processing of the corner portion (c) is also input as described in the description of "continuous rotation" of the rotating mechanism (14). X is set at the rotation speed of the control means (6) to continuously rotate the clamping shaft (13) holding the single crystal block (w). Further, the control means (6) includes: 201231219 The front end of the grinding means (3) and the front end of the polishing means (4) are respectively brought into contact with the reference faces on both sides of the reference block (15), and the grinding device (3) is at the front end. And a function of performing arithmetic processing on the base point of the front end of the grinding means (4) (the position of the cutting amount "zero"); by using the measuring tool A (21), measuring the reference surface on both sides of the reference block (15) and being processed The position of the two plane portions (F) or the two corner portions (c) on both sides of the object, the function of calculating the cross-sectional dimension of the workpiece; and placing the workpiece on the base of the holding means (1) ( 11), by pressing the 02) to position the two sides thereof, and by measuring the side position of the workpiece by the measuring tool eight (21) and the measuring tool B (22), the holding of the workpiece is performed. The function of the operation of the axial position of the clamping shaft (13) on both ends and the positioning of the column axis of the workpiece; and the initial setting item and the measuring means (2) input by starting the machining The output measurement signal is processed and processed, and the means for grinding/grinding the processing device is lost. The function of the action signal (the seventh invention). • The frequency of the arithmetic processing of the grinding method disclosed in the seventh invention of the invention and the base point (the position where the cutting amount is "zero") at the front end of the polishing means will be described. When the grinding method is used for grinding, the grinding method is terminated before the grinding means, and the reference surface on both sides of the reference block is subjected to the transfer processing of the position of the cutting amount "zero", and then the cutting amount is set, and the grinding and polishing means is performed only. When replacing the new abrasive brush, the front end of the polishing means is brought into contact with the reference surface on both sides of the reference block, and the operation of cutting into the position of "贲»零" is performed. Therefore, the setting of the amount of cutting of the polishing brush in the polishing process is calculated by the number of times of grinding by the grinding machine 15 201231219, and the cutting amount of the tip end of the brush material is adjusted to perform the grinding process. «Seventh Invention" Since the control means (6) is provided (4) to automate the functions of the grinding/grinding apparatus for the horn-shaped member of the present invention, the flat portion (f) and the corner portion (6) of the workpiece can be surely performed. Grinding and grinding, and labor saving. In addition, the profile of the workpiece is a quadrangular shape, and the cross-sectional dimension and the tolerance of the four-column column-shaped object to be ground/grinding can be set to 125 sides of the soil _5_ (referred to as: 5 servant - side 156_ The gemstone 5 (referred to as: 6-inch), - it 2H) nostalgia. 5mm (referred to as: 8 leaves) may also cross the two planar portions (7) of the four-corner workpiece. The straight angle of the corner portion (9) is set to be 1 degree ± 1 degree (the eighth invention). According to the eighth invention, the workpiece can be ground in the initial setting item of the input control means (6) before starting the machining. /The size of the section after the grinding process and its tolerances are carried out. The holding means (1) is provided with: a base (11), which can place the workpiece into its column axis. And moving up and down in the vertical direction; the pressing device (12) moves forward and backward across the base (1), and moves to the side perpendicular to the column axis of the workpiece, and presses both sides of the workpiece. Positioning the column axis of the workpiece on the center of the abutment (丨丨); clamping shaft (13) (13), the core Positioned in the same direction as the column axis of the workpiece, and placed on both ends of the column axis direction of the workpiece, so that the clamping shaft (13) is advanced to the base. (1)) Both ends of the workpiece to be processed at the center; and 16 201231219 Red-turn mechanism (14) 'The clamp shaft (13) (13) is intermittently rotated or continuously rotated about its axis (ninth invention). The clamping shaft. 3) (13) has a function of holding both ends of the workpiece in the direction of the column axis and measuring the dimension of the column axis direction of the workpiece so as to be stored in the control means (6). According to the dimensional measurement result of the column axis direction of the workpiece, the measurement, the grinding process, and the polishing process of the workpiece are transferred to the positions where the means for measuring (2), the grinding means (7), and the polishing means (4) are disposed. Further, the transfer shaft (13) (13) is connected to the rotating mechanism (14), and the workpiece is rotatably driven. The other side is the driven side clamp shaft. (14) "Intermittent rotation", which is to make the workpiece should be machined 'Becomes so that the grinding means (3) or the grinding means relative to the position ⑷' direction for performing alignment by rotation. That is, the processing order is determined in accordance with the type of the stone block (w) of the input control means (6) before the start of processing, and the motion signal is output to the rotating mechanism (10) in accordance with the processing sequence. Rotating mechanism (10): According to the motion signal, the clamper 3) is rotated, so that the two blocks or corners (C) of the grinding block (W) which are held by the lost shaft (10) should be subjected to grinding or grinding. It is placed at a position opposite to the grinding means (3) or the grinding means (4). Hereinafter, the case of processing the polycrystalline germanium block (w) will be described as an example. When the 邵 邵 ( (F) plus animal relative to the ' ～ 利 利 1 pair of plane parts (F) processing, the 矽 block (w) is rotated 9 degrees, processing the remaining 1 pair of plane parts (F) After that, after the processing of the two pairs of plane portions (F), that is, the four plane portions (7), the block (W) is rotated by 45 degrees, and the opposite direction is processed to the i-corner portion (〇. Next, the block (w) Rotating 90 degrees and performing the remaining i diagonal portion (4)) 17 201231219 Processing 'All the flat portions (F) and corners (C) are finished. The "continuous rotation" of the rotating mechanism (14), The corner (c) of the object to be processed (for example, a single crystal block (W)) having a shape of a circular surface is studied. In the case of force or grinding, the workpiece is continuously rotated while being processed on one side. The clamp shaft (13) holding the workpiece is continuously rotated in accordance with the rotational speed set by the input. According to the ninth aspect of the invention, the force month b of the measuring means (2) of the sixth invention is used to perform the positive and horizontal orientation with respect to the column axis direction of the workpiece placed on the base (11) (Fig. 1). After the centering of the vertical direction (the direction of FIG. 2 and the Z direction), the clamping axis (丨3) (1 3) can be surely held at the center position of the both end faces of the column axis of the workpiece. χWhen grinding or grinding the workpiece, the workpiece can be "intermittently rotated" or "continuously rotated" as described above. In the first aspect of the invention, the workpiece may be a square columnar block (first invention). Further, the grinding/grinding method of the polygonal columnar member of the polygonal columnar member of the polygonal columnar member is provided with a holding means (1) for holding a hard and brittle material having a polygonal column shape as a workpiece; Measuring means (2) 'Used to measure the cross-sectional dimension of the workpiece, the centering measurement of the position of the workpiece by the holding means (1), and the grinding means (3) and the grinding means (4) The cutting amount is taken as the measurement of the base point position of "zero"; the grinding means (3) 'the plane part (?) for grinding the workpiece and 18 201231219 corner part (c); the plane part of the workpiece ( F) and grinding means (4) for grinding the position of the cornered portion (C); and 'manufacturing slave (6)' according to the initial setting item input before starting the processing and the measuring means (2 The measured value 'measured processing' is used to output an operation signal to each means; and the multi-angle columnar member is used in the grinding/grinding apparatus. The grinding means (3) grinds the workpiece, and then grinds the workpiece by the polishing means (4) (u invention).曰 Again. In the invention of the first aspect of the invention, the cross-section of the workpiece is a quadrangular shape, and the particle size of the abrasive grains of the grinding stone used in the grinding device (3) is set to f9〇F2〇(JISR6001:1998)&amp;#24〇 ~#5〇〇(jisr6〇〇i: 1998); the particle size of the abrasive grains used for the polishing brush for rough grinding of the polishing means is set to #24〇~#500 (JISR6〇〇丨:丨998), The particle size of the abrasive grains used in the polishing brush for polishing the polishing means (4) is set to 〇〇 # # # # # # # # # # 116 116 116 116 116 116 116 116 116 # # # # # # # # # # # # # # # # # # # The section size and its tolerance are set to one side of 125 claws + 0.5 mm (referred to as: 5 吋), one side of 156 mm ± 〇 5 mm (referred to as: 6 吋), _ side of 21 〇 mm ± 0.5 mm (referred to as: 8 吋) In either case, the straight angle of the corner portion (c) where the two planar portions (F) of the four-corner workpiece are intersected is set as a tolerance of the cross-sectional shape to 90 degrees of soil 1 degree (12th) invention). 19 201231219 In the 3rd invention, or the i2nd invention, the cutting amount in the grinding means (7) is set to 20/zm to 700 &quot;m, and the surface roughness of the workpiece is measured in the grinding means (7). After grinding into A Ry2.〇~10." _ brain 06〇1:1994), the cutting amount in the polishing method (4) is set to 75 ρ or more. In the polishing means (4), one object is added. The surface roughness grinding process is Ryl. Um (JISB 〇 6 〇 1 : 丨 994) or less (the third invention). In the first invention, the shai processed object is a four-corner column-shaped stone 第 第 14th invention. Further, in the thirteenth invention, the workpiece is a polycrystalline block (5), and the flat portion (F) is ground and the corner portion (c) is ground. The flat portion (7) ▲ Processing step (15th invention) In the 15th invention of the invention, only the 4 plane portion (7) is subjected to the polishing process, and the corner portion (6)' is not polished and reinforced because the portion where the micro-I slit is formed is substantially flat. Part (F), in the corner (in the middle, there is a micro crack in the vicinity of the joint with the plane portion (7), so if the 4 plane portion (F) is used ".5 or more, the micro-cracks existing in the vicinity of the joint portion between the corner portion (C) and the flat portion (F) may be simultaneously removed. Further, in the U-th invention, the workpiece may be in accordance with the plane Processing step of the grinding process of the part (7), the grinding process of the corner part (6), the grinding process of the corner part (C), and the grinding process of the flat part (F), the processing step of the single stone block (w) (the 16th invention) In the invention of 1il16, the reason for performing the corner 1 σ before the polishing process of the plane portion (F) is that it is the same as the polycrystalline stone block (w) in the single crystal stone. In the case of the block (W), the microcrack can be removed in the corner portion (near the joint portion of the crucible and the flat portion (7): 20 201231219, and the micro crack can be removed as long as the flat portion (F) is polished. For example, if you are defended by 线 勿 勿 勿 勿 勿 勿 勿 勿 勿 勿 勿 勿 勿 ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί Called: 5 leaves), one side l56mm (called: 6 ° inch), - side 2 Η) face (called: 8 hours), its size is public The right angle piece/input ϋ A Λ β with a section of ±〇·5mm 圮4 μ „“ inch' and the plane part (F) intersecting each other is formed by X 罝The grinding function of the cross-sectional shape of 1 degree and (7) the removal of the micro-cracks of the surface layer of the stone block (W), so that the surface roughness is two functions of the fine grinding function, and (3) the block from the processing ( w) When the grinding/grinding apparatus of the present invention is carried out, the steps of finishing the grinding/grinding and unloading can be automated, so that the grinding/grinding can be surely performed, and labor saving can be achieved. In the cutting step of Shi Xi Qian in the manufacturing line of Shi Xi block (W), even if the cross-sectional dimension and the straight angle deviate from the specifications, the grinding stone is used as the grinding means when carrying the grinding I grinding device of the present invention. (3) By this, the cross-sectional dimension and the cross-sectional shape can be machined within tolerances. Further, an abrasive brush is used as the polishing means (4), whereby microcracks can be removed. As a result, in the next step, the wire saw is used to cut the block (w) into a thickness of several hundred μm, thereby forming a stone wafer, and the outer dimensions of the stone wafer can be processed within the tolerance. Moreover, it is possible to suppress cracks and defects which occur when the wafer is processed, and the incidence of defective products can be reduced. 21 201231219 Further, since the clamping shaft (丨3) (π) of the gripping means (1) of the gripping block (W) is provided with the "intermittent rotation" or "continuous rotation" of the lost shaft (13) (13) Since the rotating mechanism (14) is formed, a polycrystalline block (W) having a c-plane (flat chamfered surface) shape and a single-crystal block formed into an arc shape can be formed on the shape of the corner portion (c) of the block (W). (W) Both are ground/grinding. Therefore, the processing steps for both the polycrystalline block (w) and the single crystal block (W) can be automated. [Embodiment] The construction of the ridge/grinding apparatus of the polygonal columnar member of the present invention and the operation steps thereof will be described with reference to the processing of the rectangular columnar block. As shown in FIG. 1 , the grinding device/grinding device of the present invention has: a holding means (1) 'for holding a square column-shaped stone block (W); and measuring means (2) 'for The measurement of the cross-sectional dimension of the block (W), the measurement of the centering of the position of the holding block (W) by the gripping means (1), and the calculation of the cutting amount of the grinding means (3) and the grinding means (4) Measurement required for the base point position of "zero"; Grinding means (3) 'The flat part and the corner part (c) of the block (W) are ground and ground to a side of 125 mm (referred to as: 5吋) One of the cross-sectional dimensions of one side of 156 mm (referred to as: 6吋) and one side of 2丨0 mm (referred to as: 8吋); the polishing means (4) 'will end the plane portion of the stone block (%) of the grinding process (F) and the corner portion (C) are ground to remove micro cracks present on the surface layer thereof; the transfer means (5) are the flat portion (F) and the corner portion (C) of the block to be held by the holding means The measurement, grinding, and grinding are performed, and the holding means (1) for holding the block 22 201231219 (W) is transferred to the measuring device (2) and the grinding hand is disposed. The position of the segment (3) and the polishing means (4); and the control means (6)' perform an arithmetic processing based on the initial setting item input before the start of processing and the measurement signal of the measuring means (2), and output the means Action signal. Before starting the machining, the initial setting item is input to the control means (6), which includes the interval size (known) of the reference faces formed on both sides of the reference block (丨5), and the machining block (W) Type (polycrystalline or single crystal), the slab of the slab (W) / the cross-sectional dimension after grinding and its tolerance, and the rotating mechanism when processing the corner portion (c) of the single crystal slab (W) (14) Rotation speed, grinding means (3), and the size of the grinding means (4), the particle size of the abrasive grains, the rotation speed, and the enthalpy in the grinding/grinding process by the transfer means (5) w) Transfer speed. The transfer speed of the enthalpy block (W) input to the control means (6) must be set to a range where the grinding process or the grinding process mark is not left, and the plane portion of the polycrystalline block (W) is processed (F) ) when the corner portion (C) and the flat portion (F) of the single crystal block (W) are set to 1 〇 to 40 mm/sec, when the corner portion (C) of the single crystal block (W) is processed. Set to 1 〇mm/sec or less. In order to set an appropriate transfer speed, it is necessary to consider the setting conditions of the particle size, the cutting amount, and the rotation speed of the grinding/grinding abrasive. For example, if the particle size of the abrasive grain is coarse, the transfer speed must be set in the slow region of the range. If the particle size of the abrasive particles is thinner, the transfer speed must be set in a fast region of the range. The processing switch (W) provided at the start of the control means (6) is turned ON, and the processing block (W) is transported from the loading conveyor (V) through a not-shown shift 23 201231219 carrier device. The base station (u) i of the holding means (1) shown in 2. Then, from both sides of the Shishi block (W), the pressing shown in Figs. 1 and 2 advances in each of (1 2), and is positioned on the connecting clamp axis (13) and the grinding means disposed on both sides (3). ) and the center of the polishing means (4) (the center of the Y direction shown in Fig. 1). In this state, one of the 'clamp shafts (13) advances toward the X direction, i.e., the stone block (w) side, and the block (W) is held by the clamp shaft (13). The holding means (1) is transferred to the position where the grinding means (3) and the polishing means (4) are disposed by the transfer means (5), and the front end of the abrasive grain portion (32) of the grinding means (3) is brought into contact with the load. The reference surface ' on both sides of the reference block (15) of the holding means (1) is placed in contact with the front end of the brushing material (42) for rough grinding and fine polishing of the polishing means (4). Thereby, the amount of cutting of the abrasive grain portion (32) of the grinding means (3) and the rough grinding material for polishing means (4) and the brush material (42) for fine polishing is stored as a base point of "zero" in the control. Means (6&quot; The amount of cut-in refers to the surface (the surface to be processed) of the block (W) as "zero (base point)", the abrasive grain portion (32) of the grinding means (3), and the grinding means (4) The amount of movement of the tip end of the brush material (42) from the base point in the direction of the column axis, that is, the amount of cutting of the block (w) is determined by the amount of cutting of the grinding means (3) and the grinding means (4). The operation steps of the type of the block (W) in the case of polycrystalline or single crystal common will be described below. The operation steps for grinding/grinding the polycrystalline block (W) will be described. Next, the holding means (1) is transferred to the configuration. The position of the measuring means (2) is as shown in FIG. 4, and the pair of plane portions (F), one pair of plane portions (F), which are opposite to each other on both sides of the polycrystalline germanium block (W), are measured by the measuring tool A (21). The Y-direction position is stored in the control means (6)' for calculating the Y-square of the polycrystalline block (W) 24 201231219 The thickness is determined by automatically setting the grinding means (3) according to the thickness of the actual size and the previously set size of the input. The cutting means (3) is formed by the abrasive grain portion (10) formed on the circle 5 The grinding stone of the disk A (31) is formed. The sea holding means (1) is transferred to the position where the grinding means (3) is disposed by the transfer means (5), and the i # plane part (F) is ground by the grinding means (7) After the grinding process, after confirming that the section size is within the A difference of the inch by the measurement, the II is caused by the suspect mechanism (J 4), and the axis (1) of the holding means (1) is intermittently rotated by 90 degrees. This is the same as the processing of the flat portion of the i-plane. The remaining one pair of flat portions (F) is ground, and the four-flat (F) grinding process is completed. Then, the holding means (1) is again transferred to a position where the measuring means is disposed, and the rotating shaft (13) intermittently rotates the clamping shaft (13) by C degrees, whereby the polycrystalline silicon held by the clamping shaft (13) is held. The blocks (w) are opposed to each other with respect to the opposite corners (c) in the horizontal direction. In this state, by measuring the position of both sides of the diagonal portion (C) of the measuring piece A (2〇, the actual size of the interval of the i diagonal portion (c) is calculated 'and the cutting amount of the grinding means (3) is automatically The holding means (1) is transferred to the position where the grinding means (3) is disposed by the transfer means (5), and the i diagonal portion (c) is ground by the measuring tool A (2 1) It is true that the cross-sectional dimension is within the tolerance of the machining size. Then, the clamping mechanism (1) of the holding means (1) is intermittently rotated by 90 degrees by the rotating mechanism (14), and the diagonal portion (C) of the shai 1 The grinding process is the same, and the remaining 1 diagonal part is ground. The cross-sectional dimension of the polycrystalline block (W) is ground to the tolerance of the machined size. 25 201231219 ”. The polycrystalline block of the beam grinding process (w The polishing process is performed by the polishing means (4) according to the operation steps shown below. By the grinding process, the micro-cracks of the surface layer of the 4 plane portion (f) are removed and processed to make the surface size the processing size. Within the tolerances. The grinding means (4) uses the particle size of the abrasive particles. The polishing brush composed of the rough grinding processing mat j (42) and the fine polishing and processing bristle material (42). The bristle material (42) is shown in Fig. 7 and Fig. 8. Here, the grinding process is performed. Plane. Measurement method of the cross-sectional dimension of 卩(F) 'The setting method of the cutting amount of the grinding brush for rough grinding processing and fine grinding processing, the operation procedure of the grinding processing of the rough grinding processing and the fine grinding processing, and the grinding operation In the polishing process of the polycrystalline germanium block (W), as described above, the polishing process is completed only to the four plane portions (F), and the polishing process of the corner portion (c) is not performed. The polycrystalline block (w) subjected to the grinding and polishing process is returned to the original position by the transfer means (5)' together with the holding means (1), and the gripping state by the clamp shaft (13) and the pressing tool (12) is released. Then, the processed polycrystalline block (W) is transferred to the carry-out conveyor (port) shown in Fig. 并 by a transfer device (not shown) and carried out. The above-mentioned polycrystalline germanium block (W) The operation steps of the grinding/grinding process are explained. Next, a description will be given of the case of the single crystal germanium block (W). The grinding and working steps are performed. $ Right the starting of the control means (6) to start the processing switch (〇N), and the single crystal block for grinding/grinding is performed. (W) is set on the beauty of the holding means △ (11) 'The two sides of the holding device (1 2) are held by the pressing device, and the two sides are held by the missing shaft (13). The band-shaped volts of the corner of the block (W) is only 26 201231219. The arc-shaped part formed by the part of the stone-shield key is used. Therefore, when the corner portion (c) is ground, the single-crystal block must be made. Continuous rotation. Therefore, positioning (疋.) must be performed so that the axis of the clamping shaft (丨3) holding the single crystal stone block (w) coincides with the column axis of the stone block (w). The measuring means (2) is as shown in Fig. 4. The position of each side of the single crystal block can be measured by the measurement of the gamma direction A(2 i ) and the measuring tool B (22) in the z direction. . Moreover, according to the measurement result, the centering of the single crystal block (W) can be performed such that the axis of the clamping shaft (13) coincides with the column axis of the block (w), and the clamping shaft (13) holds the block ( w). Then, the holding means (1) is transferred to the position where the measuring means is disposed. 'With the measuring tool A(2 1)' as shown in FIG. 4, the two sides of the single crystal block (w) are operated opposite to each other.厚度 The thickness dimension of the plane portion (F) in the γ direction. After the cutting amount of the grinding means (3) is automatically set, the flat portion (f) is ground. Then, 'the holding means (1)' of the single crystal block (W) that is processed is used to measure the remaining portion to the plane portion (F), and the single crystal stone block (5) is provided with the measuring means (2) and The position of the grinding means (3) is moved back and forth, similar to the pair of plane parts (F), and the remaining pair of plane parts (F) are also ground, and the grinding of the 4 plane parts (F) is finished. . The above processing sequence is the same as that of the polycrystalline hard block (W). Then, the meta-grip means (1) is further transferred to the position where the measuring means (7) is disposed. By rotating the mechanism (14), the clamping shaft (13) is intermittently rotated by 45 degrees so that the single crystal blocks (W) are opposed to each other. The pair of corner portions (c) are disposed to face each other in the horizontal direction. Next, the angle is measured by the measuring tool A (21) (between the two sides of the cymbal, the distance between the diagonal portions (C) of the operation 1) 3⁄4 p , h size 'the cutting amount of the grinding means (3) 27 201231219 It is automatically set. After the gripping means (1) is transferred to the position where the grinding means (3) is disposed by the transfer means (5), the grip shaft (13) is continuously rotated by inputting the rotational speed of the set rotating mechanism in advance. Grinding of the corner portion (c) of the single crystal block (w). After the grinding process of the corner portion (C) is completed, the rotation speed of the rotating mechanism (14) is input in advance, and the clamping shaft (13) of the gripping means (?) is continuously rotated to sequentially perform the four corners. Part (c) rough grinding and fine grinding. After the grinding of the corner portion (c) is completed, the clamping shaft (13) is rotated by the rotating mechanism (14), and the single crystal block (W) subjected to the polishing process is opposed to the pair of plane portions. (F) Arranged to face in the horizontal direction and perform polishing processing. Then, by knowing that the rotating mechanism (14) rotates the clamping shaft (丨3) by 90 degrees, the remaining one pair of flat portions (F) are also subjected to grinding processing, and all the polishing steps are completed. The holding means (1) for placing the single crystal block (W) at the end of all the grinding/grinding processing is returned to the original position, and the gripping state of the clamping shaft (丨3) and the pressing tool (12) is released. On the base (Π) of (1), the single crystal block (w) is transferred to the carry-out conveyor (port) shown in Fig. 1 through a transfer device (not shown) and carried out. Then, the apparatus and method of the present invention can reduce the cracks and defects of the tantalum wafer by cutting the saw block (W) after the grinding/polishing process with a wire saw to form a tantalum wafer. An example of the incidence of defective products will be described. In addition, the stone block (W) used herein is a tetragonal column-shaped polycrystal 28 201231219 block (W) and a single crystal block (W), which are ground by the grinding means (3) of the present invention. After the planar portion (F) and the four corner portions (C) of the block (W) are ground, the cross-sectional size is ground into a tolerance, and then the surface layer of the single crystal block (W) is ground by the polishing means (4). Thereby the microcracks are removed. [Embodiment 1] In the first embodiment, the stone block (W) subjected to processing is cut out from one bismuth ingot as shown in Fig. 9 . When cutting from a bismuth ingot, using a new wire saw as a fixed abrasive grain method, a four-corner columnar polycrystalline stone block (W) composed of four plane portions (F) and four corner portions (C) of a right-angled shape is used. Cut into 5 rows x 5 rows = total 25 pieces. The block (W) used in the first embodiment is a block A cut out from the four corners of the bismuth ingot shown in Figs. 9 and 10, and the block A is formed in two flat portions. Protrusion. The contents of the initial setting items of the input control means (6) before starting the machining are shown in Tables 1 and 2. [Table 1] The actual size between the reference planes of the conditional reference block is set to 100 mm. The type of the block _ _ -. (Example 1) Polycrystalline (Example 2) Single crystal (worked object) Size after grinding/grinding ( Section X length) (Example 1) Port 156±0. 5mmx500fl· 0mm (Example 2) Port 125±0·5mmx300±l. 0mm Rotation speed at the corner of single crystal (reference cycle speed) 105min_1 (0 · 5~1. lm/sec) [Table 2] 29 201231219 Grinding means (grinding stone) Grinding means: rough grinding (abrasive brush) Grinding means: fine grinding (abrasive brush) Dimensions φ250mm φ210mm φ270mm Particle size of abrasive grains Example 1) F100 (Example 2) F180 #240 #800 Rotation speed 2700min'' 1300min_1 1300min'' (reference week speed) (30 to 40m/sec) (10~20m/sec) (10~20m/sec) The distance between the reference surface of the reference block (15) and the interval dimension (1 00 mm) within the initial setting item shown in Table 1 is measured in advance by the measuring instrument A (21) using the laser method, and the measurement result is stored in the control means. (6). Next, the polycrystalline block A is referred to as: 6 剖面 a side of 156 mm (length is 500 mm), as shown in FIG. 4, the cross section of the polycrystalline block A (W) is measured relative to each other using the measuring tool A (21). In the height direction of the plane portion, the three portions in the longitudinal direction of the X portion (the total of nine portions) and the nine portions of the remaining one pair of the flat portions are combined into eight portions. As a result, the cross-sectional side of the polycrystalline block A had a size of 156.9 to 157.6 mm (average: 157.1 mm), a surface roughness of Ry21 to 27 μm (average: 24 μm), and a length of 499.6 mm. The grinding means (3) is a cup-shaped grinding stone shown in Figs. 5 and 6, and the average cross-sectional dimension of the polycrystalline block A (W) subjected to the grinding/grinding process is relative to a side called 6 σ inch 1 56 mm , is + 1.1 mm. Therefore, it is necessary to grind one side = 0.55 mm by means of grinding (3). The particle size of the abrasive grains of the abrasive grain portion (32) forming the grinding means (3) was selected from Table 3 to select coarse abrasive grains, and diamond abrasive grains having a particle size equivalent to F100 (JISR6001: 1998) were selected. Further, the width of the abrasive grain portion (32) was set to 8 mm, the outer dimension was set to 0 250 mm, the amount of cut was set to 0.7 mm, and the rotational speed was set to 2700 min_1 (corresponding to the reference peripheral speed of the grinding process of 30 to 40 m/sec). The polycrystalline block A (W) is passed through the position where the grinding means (3) is disposed at a speed of 20 mm/sec, and 30 pairs of plane portions (F) are ground by 30 201231219, and the clamping shaft (13) is rotated by the rotating mechanism (14). ) The rotation of 90 degrees and the like is left, and the i-plane is ground in the same manner as described above, and the grinding of the * flat portion (F) is finished. [Table 3] Particle size of (grinding stone) abrasive grain <JISR6GQ1 : Just 8, 矽 block Surface roughness after grinding: Ry(ym) &lt;JISB0601 : F100 _5.0 ～10.0 4.0 ～6.0 ^Γ80~ #320 3.0~5 D #500 '2.ϋ ～4.0 After the grinding of the 4 plane part (F), the rotation mechanism (14) The grip shaft 〇 3) holding the polycrystalline block A (w) is rotated by 45 degrees so as to be disposed opposite to the grinding means (7) on both sides with respect to the pair of 2 corner portions (C) in the horizontal direction. In the corner portion (C), the particle size of the abrasive grains (3) and the transfer speed of the polycrystalline block A (W) are ground under the same conditions as when the flat portion (f) is ground, and then in the plane portion (F) and When the joint portion of the corner portion (c) is found to be a crack known as chipping, the grain size of the abrasive grains of the grinding method (3) is changed to the fine stone #500 (JISR6001: 1998). The transfer speed of MW) was changed to 3 mm/sec, and the result of the grinding was reduced, but the chamfered portion of the corner portion (c) was formed without causing the above-described fragmentation. Therefore, the grinding of the remaining one diagonal portion (c) also sets the particle size of the abrasive grains of the grinding means to #500, and the rotation mechanism 901' rotates the clamping shaft 901' in the same manner as described above, and ends. 4 Corner (6) grinding processing. As a result, the plane portions (F) are opposed to each other, and the total of the pair of plane portions (f) is μ 31 201231219. The interval between the portions is (5) to (10) planes (average 丨 56 2_) 2 pairs of planes. The grinding amount (= calculated by the measured value / 2) is 390~48〇μΐΏ (average: 43〇_, the surface roughness is Ry5~8μηι (average: 7_.; after 4 grinding (grinding) The former) is the result of the ', ' and micro-cracks, which exist at a depth of ~ from the surface. In order to confirm the cutting of the polycrystalline block A(w) into crystal The incidence of cracks, defects, etc. in the round equivalent is used as a reference. The result of cutting the polycrystalline stone block A(W) into a thickness of 2〇 using a wire saw, the incidence of crack defects, etc. is 3.8%. In the rough grinding step and the fine grinding step in the lower grinding method, the cup type abrasive brush of FIG. 7 and FIG. 8 is used, and the brush material (42) is used to bundle the mounting base with a metal tube to be freely disassembled. The method is mounted on the rotary disk B (41), and when it is worn, the replaceable fan-shaped brush is used. In the abrasive brush for coarse grinding, the abrasive particles fixed on the brush material (42) are melted. The particle size is the diamond abrasive grain of #240 (JISR6001: 1998) shown in Table 2. The inch is set to 021 〇mm, the cutting amount is set to 〇.5mm, and the grinding speed is set to UOOmin-1 from the reference cycle speed of the grinding process of 1〇~2〇m/sec. The polycrystalline block A (w) will be ground. The transfer speed is set to 2〇mm/sec for rough grinding. [Table 4] Grinding grain size of grinding stage (abrasive brush) &lt;JISR6001 : 1998&gt; 表面 Surface roughness after grinding: Ry(pm) &lt;JISB0601 : 1994&gt;#240 3.0 〜 5.0 #500 1.0 〜3.0 #800 0.5 〜1.0 #1000 0.3 〜0.5 32 201231219 As a result of the rough grinding process, the measuring plane portions (F) are opposed to each other in two pairs of plane portions ( F) The total size of the 18-part spacing is 156.0 to 1 56.4mm (average: 1 56_ 1 mm), the grinding amount is 75~78 μηι (average: 77μηι), and the surface roughness is Ry2.9~4.0 Μηι (average: 3.4 μηι). In the polishing brush for fine polishing, the particle size of the abrasive grains melt-fixed to the bristle material (42) was the diamond abrasive grains #800 shown in Table 4. The outer shape of the polishing brush was set to 0 270 mm, and the amount of cut was set to 0.8 mm. The rotation speed was set to 1 300 min_l from the reference peripheral speed of the polishing process of 10 to 20 m/sec, and the transfer means (5) was 20 mm/ In the second transfer speed, the polished polycrystalline block A (W) is passed between the polishing brushes for polishing, and the four flat portions (F) are polished to complete all the processing. As a result of the completion of the finish grinding process, the interval between the flat portions (F) facing each other and the total of the two flat portions (F) is 155.9 to 156.4 mm (average: 1 56.1 mm), and the grinding amount is 1 6~ 1 9μηι (average: 1 8μΓη), the surface roughness is Ry0.9~Ι.ίμηι (average: Ι.Ομηι). The results of the processing of the grinding process, the rough grinding process, and the finish grinding process of the polycrystalline block A (W) of the first embodiment described above are summarized in Table 5 below. [Table 5] After rough grinding processing after grinding, the cross-sectional dimensions of the finished section are 156.1 to 156.6 mm (average: 156.2 mm) 156.0 to 156.4 mm (average: 156.1 mm) 155.9 to 156.4 mm (average: 156.1 mm) 390 ~ 480μηι (Average: 43〇um) 75 ~ 78μηι (Average: 77um) 16 ~ 19μηι (Average: 18_) Surface roughness (half-faced animal Ο Ry5 ~ 8μιη (Average: 7_) Ry2.9 ~ 4.0μηα (Average: 3.4um) Ry0.9 ～Ι.ίμηι (Average: 1.0 mouth m) Also, using a wire saw, the grinding and grinding processes are all completed. 33 201231219 The spar block A (W) is cut and cut into Wafer, investigate the incidence of defective products due to cracks, defects, etc. of the wafer. As described above, the polycrystalline block A (w) after the grinding process is cut and cut into wafers. Although the incidence of defective products caused by cracks, defects, etc. is 3 to 4%, as shown in Table 5, the rough grinding process and the finish grinding process are performed, and the total amount of the polishing is 85 μm, and the Ry of the surface roughness is: 1 .Ομιτι 'This will reduce its incidence to 12%. Example 2 In the second embodiment, I (w) is a single crystal crucible (w) which is cut into a cylindrical single crystal crucible ingot by a crystal pulling method. The upper end portion is cut off, and the length (the direction perpendicular to the paper surface in FIG. n) is cut into a range of 299.0 to 301. 〇mm (referred to as: 3〇〇mm), as shown in FIG. X5 rows = a total of 25 pieces are vertically fixed to the fixed jig. Using the new wire saw of the fixed abrasive grain method used in this embodiment, the peripheral portion of the carcass of each of the 25 single crystal bismuth ingots At this time, one part of the outer circumference is processed into an arc-shaped four-corner portion (C) having a width of about 25 axes, and is cut into four flat portions (F)' which are substantially right angles as a single crystal 11 block (W). One of the 25 cut single crystal blocks was randomly selected and used as a sample for grinding 'grinding. The cross section of the outer shape was 125 mm on one side (referred to as: 5 吋)&gt; (length 3) 〇〇mm. The shape of the single crystal block (w) used in the second embodiment is a quadrangular columnar shape composed of four planar portions (F) and arcuate four corner portions (C), and In the same manner, the measurement of the cross-sectional dimensions of the cross-section was carried out in the same manner as in Example 1. That is, the result of measuring the interval between the two opposing flat portions (F) and the portion ι8, the interval of the flat portion (7) 34 201231219 was 125.4 to 126 mm (average: 126). Lmm), the length is 300.8, the surface roughness is Ry22~28_ (average: 25 (four). The specification of grinding/grinding is the same as that of the example i except that the particle size of the abrasive grains of the cup-shaped grinding stone used in the grinding means is changed to ρ ΐ 8 选择 selected from Table 3 (refer to 4 2). The reason why the particle size of the abrasive grains of the grinding means is changed 4 F180 is that the average cross-sectional dimension of the single crystal block (w) relative to the grinding/grinding process is called: 5 125 one side 125 mm' measured size is + 〇 .7_, one side = 〇 ^ entangled cutting amount, so the use of the fine-grained F180 (JISR6001: 1998) measured by | 3 used in the example i is used. In the grinding process, the single crystal block (W) prepared by the clamp shaft (13) is set to a state in which the pair of plane portions (F) are opposed to each other in the horizontal direction, so that the pass: the grinding means (3) In the same manner as the polycrystalline fragments (w) of this embodiment, the two pairs of plane portions (ρ) are ground. In accordance with the operating conditions of the rotating mechanism (14) shown in Table 1 of the pre-input setting, the _ plane is rotated at a speed of iQ5min| around the axis, and the 'rotating' side is at a low speed of 2 mm/sec. The single-crystal block (w) is passed between the grinding means (3) composed of - the pair of grinding stones, and the grinding of the two diagonal portions (C) is completed. , '° fruit plane portion (F) facing each other, the total of two pairs of flat portions (F), the spacing between the two parts is 124.9~125 8 faces (average: 125 4 -, the cutting amount of the 4 plane portion is 283~ 354μηι (average: Μ-), the surface roughness of the 4th plane portion (f) and the 4th corner portion (C) is Ry4~—(Average: The grinding process of the person is the same as above, while rotating by one side Mechanism (丨4) 35 201231219 The single crystal block (w) subjected to the grinding process is continuously rotated, and the single crystal stone block (W) is passed through the coarse grinding at a low speed of 2 mm/sec by the transfer means (5). The polishing process of the four corners (C) is completed between the polishing means (4) using the polishing brush and the polishing brush for fine polishing. Then, in the same manner as in the first embodiment, by the transfer means (5), At a transfer speed of 20 mm/sec, the polishing process of the two pairs of flat portions (F) of the single crystal block (W) is passed between the polishing means (4), and the polishing process of the two pairs of flat portions (F) is completed, and all the ends are completed. In this polishing process, as in the above, the flat portion (F) at the point where the rough grinding process is finished is measured, and the pair of plane portions are opposed to each other. The result of the total area of (F) is 1 24.8~1 25 · 6mm (average: 1 25.3 mm), the amount of polishing is 69~75μηι (average: 73μτη), and the surface roughness is Ry2.8~3· 8μηη (average: 3.3 μηι). Further, when the measurement is completed, the flat portion of the point where the flat portion is opposed to each other, and the interval between the two flat portions (F) is 18, and the result is 124.7 to 125.5 mm (average: 125.2 mm). The processing amount is 17 to 25 μΓη (average: 20 μηι), and the surface roughness is Ry 0.8 Ι.ΟμΓη (average: 0·9 μηΊ). The grinding of the single crystal block (W) of the second embodiment described above is completed. The outline dimensions and surface roughness of the processing, rough grinding, and finish grinding are summarized as shown in Table 6. [Table 6] Cross-sectional dimensions of the finished grinding after rough grinding after grinding 124.9 ~ 125.8mm (Average: 125.4mm) 124.8 ~ 125.6mm (Average: 125.3mm) 124.7 ~ 125.5mm (Average: 125.2mm) Cutting amount 283 ~ 354μηι (Average: 316_) 69 ~ 75μπι (Average: 73μηι) 17 ~ 25μιη (average: 20um) surface roughness (flat Ry4 ~ 6μπι (Average: 5um) Ry2.8 ~ 3.8μιη (Average: 3.3um) Ry0.8 ~ Ι.Ομιη (Average: 0.9_) 36 201231219 Again, with a wire saw, the grinding The single crystal block (w) which has been processed and polished is subjected to a cutting process to cut into a silicon wafer, and the result of the occurrence of defective products caused by cracks and defects of the germanium wafer is examined, and the result of the embodiment j is The polycrystalline germanium block (W) is the same, and the rough grinding process and the finish grinding process after the grinding process are set to a total of 135 μη 1 and the surface roughness is set to Ry average: 〇.9 μηι, whereby it can be generated. The rate is reduced to i 〇%. The present invention is directed to the invention relating to the grinding/grinding of the block, but is not limited to the block, and can be applied to all hard and brittle materials such as glass, stone, and ceramic. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view of a grinding/grinding apparatus of the present invention. Fig. 2 is a front view showing the state in which the dam is placed on the base of the holding means of the present invention. Fig. 3 is a side view showing the state in which the stone block is placed on the base of the holding means of the present invention. Figure 4 is a side elevational view showing the configuration of the measuring instrument without the measuring means of the present invention. Fig. 5 is a front view of a grinding stone used as a grinding means of the present invention. Figure 6 is a bottom view of the grindstone of the $ m * -r· port). Fig. 7 is a front view of the abrasive brush used as the polishing means of the present invention. Figure 8 is a bottom plan view of the abrasive brush of Figure 7. Fig. 9 is a perspective view showing a state in which a polycrystalline tantalum ingot is cut by a wire saw to form a block (A) (B) (C). 37 201231219 Figure 10 is a perspective view of a polycrystalline block (A) (B) (C). Fig. 1 is a view showing a state in which a single crystal crucible is cut by a wire saw in a plan view. Fig. 1 is a three-dimensional circle of a single crystal crucible. Fig. 1 is a flow chart showing the processing steps of the polycrystalline germanium block and the single crystal germanium block. [Main component symbol description] C 矽 block corner portion F 矽 block flat portion W 矽 block 1 holding means 2 measuring means 3 grinding means 4 grinding means 5 Transfer means 6 Control means 11 Base 12 Presser 13 Clamping axis 14 Rotating mechanism 15 Reference block

21 measuring tool A

22 Measuring tool B 31 Rotating disc A 38 201231219 32 Abrasive grain

33 Rotary axis A 41 Rotating plate B 4 2 Brush material 43 Rotary axis B

Claims (1)

201231219 Seven patent scope: The grinding/grinding of the column-shaped column members is provided with '4: 'The feature name holding means' is used to hold the measuring method of the workpiece, and is used to enter (4) the corner column member. a dike 仃 被 被 用以 用以 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该Measurement; The zero-point grinding method is used to make the plane and angle of the workpiece into a tolerance.仃 grinding and grinding means 'grinding the processed corner portion to finish the grinding process for removing and smearing the micro cracks in the surface layer; the transfer means 'is the workpiece to be held by the holding means The flat portion and the corner portion are measured and grounded, and the liver is used to transfer the holding means of the workpiece to the measuring means, the grinding means "grinding means", and the control means, according to the initial setting input before starting the processing. The measurement signal of the measuring means is subjected to arithmetic processing, and an operation signal is output to each means. 2. The grinding/grinding apparatus of the polygonal columnar member according to claim 1, wherein the grinding means is a grinding stone which is formed by polishing the surface of the abrasive grain formed by the polishing and polishing The rotating disk A that rotates the machined surface of the workpiece and rotates, and the rotating shaft A that transmits the rotation of the rotating drive source to the rotating disk A; 40 201231219 The polishing means is used as a polishing brush, and the polishing brush is The rotating disk B, in which the hair end portion of the abrasive grain and the fixed brush material is rotated in contact with the processing surface of the workpiece, and the rotating shaft B that transmits the rotation of the rotary driving source to the rotating disk B are configured. ^ Grinding/grinding of the polygonal columnar member of the second paragraph of the patent application section 2, the grinding stone of the grinding means, the particle size of the abrasive grains melt-fixed to the abrasive grain portion is set to 1 or 2 In the polishing brush of the polishing method, the particle size of the abrasive grains melted and fixed to the bristle material is set to two or more. 4. The grinding/grinding apparatus of the polygonal columnar member according to the second aspect of the invention, wherein the polishing brush of the polishing means sets the particle size of the abrasive grains melted and fixed to the bristle material to two or more types; The coarse-grained brush material of the abrasive grain is implanted in the inner ring portion near the rotation center of the rotary disk B, and the fine-grained brush material of the abrasive grain is implanted at a distance from the rotation center of the rotary disk B. . 5. The grinding/grinding apparatus for a polygonal columnar member according to the third or fourth aspect of the invention, wherein the grinding means is used as a grinding stone; and the grinding stone has a particle size of F90 to F22 (JISR6〇) 〇1: 1998) and #24〇~#500(JISR6001: 1998); &quot;Hai grinding means: used for coarse grinding by the particle size of abrasive grains #24〇~#500(JISR6001 ·· 1998) The abrasive brush and the abrasive grain have a particle size of #800 to #1200 (JISR6001: 1998). 6. Grinding/grinding of a polygonal columnar member according to item 5 of the patent application scope of claim 5 201231219 Processing, wherein S is composed of B; The metaphysical measurement method is composed of a reference block, a measuring tool A, and a measuring door partitioning plane, which are formed on both sides, and the column axis direction of the known axis square block is parallel to the sweeping direction of the workpiece to be processed. The clamping means of the gripping means are integrally formed; the measuring means is formed on both sides orthogonal to the direction of the column axis of the workpiece. Measuring the position of the reference datum of the reference block in the horizontal direction, and the position of the flat portion of the object to be twisted or the position of the opposite corner portion, thereby measuring the outer shape of the workpiece; and the quantity &quot;Β" measurement The height position in the vertical direction of the upper side plane portion or the upper side corner portion of the upper object. A grinding/grinding apparatus for a polygonal columnar member of the patent scope of the sixth aspect, wherein the control means includes: a front surface of the grinding means and a front end of the polishing means respectively contacting a reference surface on both sides of the reference block - the grinding means The front end and the front end of the grinding means (the position of zero in the cut-in) are subjected to arithmetic processing; the measurement is carried out by measuring the reference plane on both sides of the reference block and the two plane portions on both sides of the workpiece &lt; 2 corner position, the function of calculating the cross-sectional dimension of the workpiece; the workpiece to be placed on the base of the holding means, and the state of the eight sides being clamped by the pressing device, by the measuring tool Α 测量 测量 测量 测量 Β 测量 测量 测量 测量 测量 测量 测量 测量 测量 测量 测量 测量 测量 测量 测量 测量 测量 测量 测量 测量 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被Function; and 42 201231219, the initial setting item input before starting the processing and the measurement nickname output by the measuring means are processed, and each of the grinding/grinding processing devices is Segment output signals of motor function. 8. The grinding/grinding apparatus for a polygonal columnar member according to the seventh aspect of the invention, wherein the workpiece has a quadrangular cross section, and the section of the quadrangular workpiece to be subjected to the grinding/grinding process is performed. The size and tolerance are set to one side of l25mm±0.5mm (referred to as: 5吋), one side of 156mm±〇.5mm (referred to as: 6 吋), and one side of 21〇mm±〇.5mm (referred to as: 8 吋) In one case, the straight angle of the corner portion at which the planar portions of the workpieces of the rectangular column-shaped workpiece are intersected is set to a tolerance of 9 degrees ± 〇. 9. The grinding/grinding apparatus of the polygonal columnar member according to the eighth aspect of the invention, wherein the holding means comprises: a base, capable of placing the workpiece so that the column axis is horizontal and moving up and down in the vertical direction The pressing device 'moves in a direction orthogonal to the column axis of the workpiece through the both sides of the base, and presses both sides of the workpiece to position the yoke of the workpiece on the base The center of the table; the axis of the shaft is disposed in the same direction as the column axis of the workpiece, and is disposed on both end sides of the column axis direction of the workpiece, and advances the lost axis to be used for holding and positioning Both ends of the workpiece in the center of the abutment and the center are intermittently rotated or rotated to continuously rotate the axis with its axis. 43 201231219 Machining f: V: The grinding/grinding apparatus of the polygonal columnar member of the first item, wherein the workpiece is a square column-shaped stone block. 11 · A grinding/grinding method for a multi-corner column member, which is provided with a gripping means for gripping a workpiece, that is, a polygonal columnar member; and a measuring means for measuring a cross-sectional dimension of the workpiece: The method of measuring the centering of the position of the workpiece and measuring the position of the base of the grinding means and the grinding means as "zero"; the grinding means for grinding and processing the flat portion of the workpiece and a polishing means for polishing a flat portion and a corner portion of the workpiece; and a transfer means for transferring the workpiece held by the holding means to the measuring means, the grinding means, and the grinding means Position and control means, according to the initial setting items input before starting the processing and the measured values measured by the measuring means, performing arithmetic processing to output the action signals to the respective means; the multi-angle columnar member is studied, 丨/grinding In the apparatus, the workpiece is subjected to grinding processing by the grinding means, and then the workpiece is polished by the polishing means. 1 2. The grinding/grinding method of the polygonal columnar member according to the nth aspect of the patent application, wherein the workpiece has a quadrangular cross section, and the granularity of the abrasive grains of the grinding stone used in the grinding method is set to F90~ F220 (JISR6001: 1998) and #240 to #500 (JISR6001: 1998); The particle size of the abrasive grains used in the polishing brush for rough grinding is set to #240 to #500 (JISR6001: 1998) 'The grinding The particle size of the abrasive grains used in the polishing brush for the fine polishing method is set to #800 to #1200 (JISR6001: 1998), and the square shape of the grinding/grinding processing is performed. 44 201231219 The cross-sectional dimension of the workpiece and its tolerance are set to One side of 125mm + 0.51^ (referred to as: 5吋), one side of 1561^±〇5〇1111 (referred to as: 6吋), —'· side 210mm±0.5mm (referred to as: 8吋), The straight angle of the corner portion where the planar portions of the two-corner workpiece are intersected with each other is set to a tolerance of 9 degrees ± 〇 · 丨. 13. The grinding/grinding method of a polygonal columnar member according to claim u or 12, wherein the cutting amount in the grinding means is set to am~700 &quot;m, in the grinding means, the workpiece is to be processed After the surface roughness grinding process is Ry2.0~1〇_〇&quot; m (JISB〇6〇1: 1994), the cutting amount in the polishing means is set to 75 // m or more, and in the polishing means, The surface roughness of the workpiece is ground to a ratio of Ryl丨 to m (JiSB0601: 1994) or less. 14. The grinding/grinding method of a polygonal columnar member according to the scope of claim U, wherein the workpiece is a square columnar block. The method of grinding/grinding a polygonal columnar member according to claim 13, wherein the workpiece is a polycrystalline block, and is subjected to grinding processing at a flat portion, grinding at a corner portion, and grinding at a flat portion. In the order, the processing steps of the polycrystalline block are performed. 〜1 6. The grinding/grinding method of the polygonal columnar member according to the thirteenth aspect of the patent scope, wherein the workpiece is a single crystal block, according to a grinding process of a flat portion, a grinding process of a corner portion, and a corner portion. The polishing process and the polishing of the flat portion are sequentially performed, and the processing steps of the one-day daily material are performed. 45