TW201226824A - Heat-dissipating device - Google Patents

Heat-dissipating device

Info

Publication number
TW201226824A
TW201226824A TW99144503A TW99144503A TW201226824A TW 201226824 A TW201226824 A TW 201226824A TW 99144503 A TW99144503 A TW 99144503A TW 99144503 A TW99144503 A TW 99144503A TW 201226824 A TW201226824 A TW 201226824A
Authority
TW
Taiwan
Prior art keywords
heat
heat dissipating
portion
outer layer
connecting portion
Prior art date
Application number
TW99144503A
Other languages
Chinese (zh)
Other versions
TWI400422B (en
Inventor
Takeshi Omori
xin-hong Lin
Original Assignee
Microtips Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Microtips Electronics Co Ltd filed Critical Microtips Electronics Co Ltd
Priority to TW99144503A priority Critical patent/TWI400422B/zh
Publication of TW201226824A publication Critical patent/TW201226824A/en
Application granted granted Critical
Publication of TWI400422B publication Critical patent/TWI400422B/zh

Links

Abstract

A heat-dissipating device is disclosed for contacting a heating element for the cooling purpose, the heat-dissipating device includes a base, and a heat-dissipating unit disposed on the base. The base includes a contact part in contact with the heating element, and at least a coupling part extended from the contact part toward the direction away from the heating element. The heat-dissipating unit includes at least one heat-dissipating member set within the contact part and extended into the coupling part, and a plurality of first cooling fins extended laterally from the coupling part, the heat-dissipating member has an outer layer body, and a metal layer coated in the outer layer body, the outer layer body is filled with refrigerant, the refrigerant flows among the metal layers. By the non-planar design of the base, and matching the heat-dissipating member with the shape of the base, the refrigerant can flow in different planes to effectively increase the heat-dissipating efficiency.

Description

201226824 VI. Description of the Invention: [Technical Field] The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device that is attached to a heating element for heat dissipation. [Prior Art] Referring to FIG. 1, the "heat sink structure" disclosed in the Patent No. M261972 of the Republic of China is one of the commonly used heat sinks, including a base 10 and a base 10 disposed thereon. The sheet-shaped heat dissipating portion n, as shown in FIG. 2, is formed in the susceptor 10 with a plurality of staggered flow paths 1 〇丨 for the cooling medium 100 to flow horizontally therein. In use, the susceptor 10 is brought into contact with a heat generating body (not shown), and the heat medium generated by the heat generating body is absorbed by the cooling medium 100, and is then dissipated by the sheet-shaped heat radiating portion u. Since the cooling medium 100 usually uses the conversion of gas and liquid to achieve the absorption of external heat energy and repeated use, the above design can only make the cooling medium 1 〇〇 flow horizontally, and there is not enough space for the cooling medium to perform gas. Liquid conversion, which in turn affects heat dissipation efficiency. Referring to Fig. 3, the structure of the circular-covered heat sink disclosed in the Patent No. M36〇551 of the Republic of China is another heat-dissipating device commonly used for wrapping the heat-generating body in a circular tube shape. A metal mesh tube 22 is disposed between an inner tube 21 and an outer tube 23, and a refrigerant can be poured between the inner tube 21 and the outer tube 23, and the phase change cycle of the metal mesh tube 22 guides the flow of the refrigerant to generate heat. The heat generated by the body is conducted from the inside to the outside of the outer tube 23 to achieve the effect of heat dissipation. However, the above design can only be dissipated by the outer surface of the outer tube 23, and the heat dissipation area is limited, which also affects the heat dissipation efficiency. 201226824 SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a heat sink that can improve the efficiency of teaching. Therefore, the heat dissipating device 1 of the present invention is in contact with a heat generating body for heat dissipation. The heat dissipating device comprises a base and a heat radiating unit disposed on the base. The base includes a contact portion that contacts the heat generating body, and at least one connecting portion that extends from the contact portion away from the heat generating body. The heat dissipating unit includes at least one heat dissipating member disposed in the connecting portion and extending into the connecting portion, and a plurality of first heat dissipating fins extending laterally from the connecting portion, the heat dissipating member having an outer layer body, and an outer layer covering the outer layer The metal layer in the body is filled with a refrigerant, and the refrigerant flows between the metal layers. The effect of the invention is that the non-planar design of the pedestal, while allowing the heat dissipating member of the heat dissipating unit to match the shape of the pedestal, allows the refrigerant to flow in different planes, thereby effectively improving the heat dissipation efficiency. The above and other technical contents, features and effects of the present invention will be apparent from the following detailed description of the preferred embodiments of the invention. Before the present invention is described in detail, it is noted that in the following description, similar elements are denoted by the same reference numerals. Referring to FIG. 4, a first preferred embodiment of the heat dissipating device 3 of the present invention is configured to contact a heat generating body 9 for heat dissipation. The heat dissipating device 3 includes a base 31' and a base η disposed on the base η. Heat sink unit 32. The base portion 31 201226824 includes a contact portion 311 contacting the heat generating body 9 and a connecting portion 312 extending from the heat generating body 9 in the contact portion. The heat radiating unit 32 includes a heat receiving unit 32 disposed at the contact portion. The heat dissipating member 321 extending into the connecting portion 312 and the plurality of heat dissipating fins 322' extending laterally from the connecting portion 312 are as shown in FIG. 5. The heat dissipating member 321 has an upper outer layer body 323, and - The metal layer covered in the outer layer body 323, the outer layer body 323 is filled with a refrigerant, and the refrigerant flows between the metal | 324

And as shown in FIG. 4, the heat dissipating member 321 can be divided into a heat absorbing portion 325 located in the contact port 311, and a heat dissipating portion 326 connected to the heat absorbing portion milk and located in the connecting portion 312. In this embodiment, the contact portion 311 of the pedestal 31 and the connecting portion 312 疋 are in an inverted τ shape, so that the heat dissipating member 321 g has the shape of the pedestal 31, so that the heat absorbing portion 325 and the heat dissipating portion The portion 326 is also in an inverted τ shape after being connected, and the heat absorbing portion 325 and the heat radiating portion 326 are in communication with each other. Referring to FIG. 4 and FIG. 5, when the susceptor 31 is in contact with the heating element 9, the heat absorbing action is performed, so that the refrigerant absorbs heat and changes from a liquid state to a gaseous state, and the heat absorbing portion 325 rises toward the heat radiating portion 326. Moving, and transferring the thermal energy of the gaseous refrigerant to the first heat dissipation fin 322 through the metal layer 324 and the outer layer body 323 to dissipate, to achieve a heat dissipation effect, and then, after the heat dissipation of the refrigerant, the gas state is converted into a liquid state, and The heat radiating portion 326 flows down to the heat absorbing portion 325 to repeatedly perform heat absorbing action. The pedestal 31 has a non-planar design, and the heat dissipating member 321 of the heat dissipating unit 32 is matched with the shape of the pedestal 31, so that the refrigerant can flow in different planes during gas-liquid I conversion, thereby effectively improving Cooling efficiency. 201226824 Referring to FIG. 6 is a second preferred embodiment of the heat sink 3 of the present invention, which is substantially similar to the first preferred embodiment described above, except that the heat sink unit 32 includes two heat sinks 321 for each heat dissipation. The piece 321 is a dome shape, and the piece is cut into a symmetrical arrangement. This also allows the refrigerant to flow in a different plane of the gas-liquid phase, and also provides another use. Referring to FIG. 7 ′, a third preferred embodiment of the heat sink 3 of the present invention is substantially similar to the first preferred embodiment described above, except that the base Η further includes a plurality of extending outwardly from the connecting portion 312. Ribs 313, and the heat sink W32 further includes a plurality of (four) sheets 327 laterally from the ribs 313. Therefore, in addition to the same effect as the first preferred embodiment, the first embodiment and the second loose money sheet and the heat dissipation function are simultaneously performed, thereby effectively improving the heat dissipation effect. Referring to FIG. 8 , a fourth preferred embodiment of the heat sink 3 of the present invention is substantially similar to the first preferred embodiment described above, except that the base 包括 includes a plurality of connecting portions that are spaced apart from each other. The heat sink is cut to have a heat absorbing portion 325 located in the contact portion 3U, and two heat radiating portions respectively connected to the two ends of the suction rail portion 325 and extending into the two connecting portions 312 to make the heat sink 321 The first heat dissipation fins 322 are laterally extended by the connecting portion 312, respectively. Therefore, in addition to the same effect as the first preferred embodiment, the present embodiment can increase the number of the first heat dissipation fins 4 322 and the heat dissipation portion 326 in contact with the first heat dissipation fins #2. The area effect enhances the heat dissipation effect. 201226824 Referring to FIG. 9, the fifth (four) embodiment of the heat sink 3 of the present invention is substantially similar to the first preferred embodiment described above, and the same is that the heat sink 3 is detachably coupled to each other. The pedestal 31 and the venting unit 2 are respectively disposed on the two pedestals 31 (four) heat dissipating members 321 , and each of the heat dissipating members 321 is L-shaped and disposed in the contact portion 311 and extending to the connecting portion In 312, the two heat dissipating members 321 are symmetrically disposed.

As for the manner of bonding the two pedestals 31, in the embodiment, a plurality of bumps 314 are formed on the pedestal 31, and a plurality of recesses 315 corresponding to the bumps 314 are formed on the other pedestal 3 ι. The two bases 31 are detachably coupled. However, it is also possible to combine with each other in a manner that can achieve the phase@efficiency, and is not limited to the contents disclosed in this embodiment. With the above design, in addition to the same effect as the first preferred embodiment, the number of the first heat dissipation fins 322 can be increased, and the heat dissipation effect can be effectively improved, and the two bases 31 can be The detachable design also provides another use. In summary, the susceptor 31 has a non-planar design, and the heat dissipating member 321 of the heat dissipating unit 32 is matched with the shape of the pedestal 31 to allow the refrigerant to flow in different planes, so that the refrigerant is in the The gas liquid conversion has sufficient space to flow, and the heat dissipation efficiency can be effectively improved, so that the object of the present invention can be achieved. The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent. 201226824 [Simple description of the schema] The disclosed, stereoscopic view illustrates the structure of the heat sink of the Republic of China 帛M261972 patent;

Figure 2 is a diagram of a, A, B, and Figure 3, which is a schematic view of the first embodiment of the present invention. FIG. 1 is a cross-sectional view of the r-gate/sub-section of the Chinese Patent No. M360551. The preferred embodiment; and the sectional view 'describes the first-comparative aspect of the heat dissipating device of the present invention; the present drawing' illustrates the cross-section of the VV-J line along the line of FIG. 4, which is a preferred embodiment; 1 is a preferred embodiment of the heat sink of the present invention; FIG. 7 is a cross-sectional view showing a third embodiment of the heat sink of the present invention; FIG. 8 is a preferred embodiment; The fourth comparison with Figure 9 is a ~shirt\. A good example. . View, the fifth embodiment of the heat sink of the present invention is more than 201226824 [Description of main component symbols] 3 heat sink 321 heat sink 31 pedestal 322 first heat sink fin 311 contact portion 323 outer layer body 312 connection portion 324 metal layer 313 rib 325 heat absorption portion 314 Bump 326 Heat sink 315 Groove 327 Second heat sink fin 32 Heat sink unit Heating element

Claims (1)

  1. 201226824 VII. Patent application scope: 1 heat dissipating device for contacting heat on a heat generating body, the heat dissipating device comprising: a base comprising a contact portion contacting the heat generating body, and at least one contact a connecting portion extending away from the heating element; and a heat dissipating unit including at least one heat dissipating member disposed in the contact portion and extending to the connecting portion (four), and extending mostly by the connecting (four)
    And a heat dissipating fin having an outer layer body and a metal layer covering the outer layer body, wherein the outer layer body is filled with a refrigerant, and the refrigerant flows between the metal layers. The heat dissipating device according to the scope of the application, wherein the heat member can be divided into a heat absorbing portion located in the contact portion, and at least one heat dissipating portion connected to the heat absorbing portion and located in the connecting portion. The heat dissipating heat-dissipating member according to the scope of the patent application 帛 2 is an inverted T shape. , 〒 j月 2. 3. The heat sink described in the item, the towel, (4), each heat sink is L-shaped, and the two scattered
    4. According to the scope of the patent application, the second thermal unit consists of two heat sinks.乂 According to the patent, the %~ shape heat is set, among which, the seat also includes most of the extension from the connection, and the 'yuan is still the wheel. 6. According to the patent application scope ^, ,., fin. The scattered (four) seat described in the Gele I item includes a plurality of spaced apart ones, which are self-transported. P, and the heat dissipating member has a suction portion in the contact portion of 10 201226824, a _ eight-day 及 及 and - respectively connected to the end of the heat absorbing portion and extending to two of the connecting portions ^ S ^ Τΐ ^ ) mature.卩, so that the heat sink is extended to the U-shape of the horse and extends in the first direction. ..., the cymbal cymbals are respectively connected by the connecting portion side, a heat dissipating device, the thermal device comprises: for contacting the heat generating body for heat dissipation, the scatter
    The pedestal is detachably coupled to each other, each pedestal including a contact portion that contacts the heat generating body, and at least one of which is moved away from the contact portion. a connecting portion extending in a direction of the heat generating body; and a heat dissipating unit comprising: two heat dissipating members respectively disposed in the two bases; and a plurality of first heat dissipating fins extending laterally from the connecting portion, each heat dissipating member is disposed In the contact portion of each of the pedestals and extending into the connecting portion, the heat dissipating member has an outer layer body and a metal layer covering the outer layer body, the outer layer body is filled with a refrigerant, and the refrigerant flows between the metal layers . 8. The heat dissipating device according to claim 7, wherein each of the heat dissipating members is divided into a heat absorbing portion ′ located in a contact portion of the corresponding pedestal and at least one heat absorbing portion connected to the heat absorbing portion and located in the connecting portion The heat dissipating device according to claim 8, wherein each of the heat dissipating members is L-shaped and the two heat dissipating members are symmetrically disposed. 10. The heat dissipating device according to claim 7, wherein at least one of the bumps is formed on one of the bases, and at least one pair of recesses that should be convex is formed on the other base to enable the The two bases are detachably coupled. 11
TW99144503A 2010-12-17 2010-12-17 TWI400422B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW99144503A TWI400422B (en) 2010-12-17 2010-12-17

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW99144503A TWI400422B (en) 2010-12-17 2010-12-17
JP2011002682U JP3169367U (en) 2010-12-17 2011-05-16 Heat dissipation device

Publications (2)

Publication Number Publication Date
TW201226824A true TW201226824A (en) 2012-07-01
TWI400422B TWI400422B (en) 2013-07-01

Family

ID=46932984

Family Applications (1)

Application Number Title Priority Date Filing Date
TW99144503A TWI400422B (en) 2010-12-17 2010-12-17

Country Status (2)

Country Link
JP (1) JP3169367U (en)
TW (1) TWI400422B (en)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW376171U (en) * 1998-11-24 1999-12-01 Foxconn Prec Components Co Ltd Radiating device
TWM261972U (en) * 2003-12-05 2005-04-11 Yi-Ming Liou Cooling fin
TWM257090U (en) * 2004-04-30 2005-02-11 Hon Hai Prec Ind Co Ltd Heat dissipating device
TWI269018B (en) * 2005-06-03 2006-12-21 Foxconn Tech Co Ltd Heat dissipating device
TWI313153B (en) * 2006-07-07 2009-08-01 Heat sink clip and assembly
JP2007281504A (en) * 2007-06-04 2007-10-25 Fujikura Ltd Heat sink and fin module
TWM360551U (en) * 2009-03-09 2009-07-01 Thermasol Technology Co Ltd Heat dissipater structure enclosed by circular rod

Also Published As

Publication number Publication date
JP3169367U (en) 2011-07-28
TWI400422B (en) 2013-07-01

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MM4A Annulment or lapse of patent due to non-payment of fees