201218927 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明係與散熱器有關，特別係與散熱器之固定結構有 關。 【先前技冬好】 [0002] 隨著半導體元件效能的不斷提升，其對散熱器之需求也 與曰俱增。另一方面，電子裝置朝向輕薄短小發展的趨 勢也始終曾稍歇或改變。因此，散熱器除本身之散熱能 力必需不斷提高以滿足電子裝置之散熱需求，也同時需 力求輕量化及薄型化。 [0003] 我國發明專利第1 305825號揭露一種典型的中央處理器 (CPU)散熱器固定結構，其以一導熱板置於並緊貼於發熱 元件CPU上方，故導熱板必需能對CPU產生一定之壓力， 在該案中之導熱板係以位於四角落之彈性固定栓所固定 ，每一固定栓係由一螺栓及一彈簧所組成，該螺栓需貫 貫穿導熱板及主機板始能將導熱板固定於主機板上，故 螺栓需具有一定長度。另一方面，導熱板尚需設置套筒 以供螺栓穿置。固整體而言，此種傳統固定結構之結構 較為複雜、整體高度難以降低，且重量也會隨著複雜的 結構而提高，非常不利於電腦之輕薄設計。 [0004] 另一件專利第M276267號揭露另一種類似之散熱器固定結 構，所不同者係在於導熱板係先以螺絲鎖固二延伸板， 再將延伸板以螺栓穿置鎖固於電路板上，仍然具有與上 述’ 8 2 5相同之缺點。 【發明内容】 099135505 表單編號A0101 第4頁/共17頁 0992062062-0 201218927 [w本㈣之主要目_在於提供1賴器之薄型化扣具 ，其可有效簡化散熱器扣具之結構，降低扣具整體之高 度，並可減低其重*：，有助於電子裝置之輕薄化。 剛為了料上述目的’本發縣提供—贿㈣之薄型化 扣具’包括一導熱板及一彈性金屬線，該導熱板成型有 一對樞部；該彈性金屬線具有—對彈性臂及連接該對彈 性臂的一中段部份，每一該彈性臂是連接在每_該樞部 上。 〇 [0007]為了達成上述目的，本發明係提供一種散熱器之薄型化 扣具，包括一導熱板及一對彈性金屬線，該導熱板成型 有一對樞部；每一該彈性金屬線具有一對彈性臂及連接 該對彈性臂的一中段部份，每一該中段部份是連接在每 一該樞部上。 [0008] 本發明相較於先前技術還具有以下功效，中段部份露出 於擋片位置處形成一V形彎折部，並#靠;_該擋片 术 备 ^ 將彈性金屬線之二彈性臂末端插入設於電路板上之環套 時，因其中段部份受擋片之擔靠而使彈性臂彎曲，以對 導熱板形成下壓固定力。 【實施方式】 圆效就本發明之較佳實施例之構造及特徵，配合圖式，今、 細說明如後。 J ’詳 首請參閱第1，其係為本發明之立_，本發明之散 熱器扣具主要係由一導熱板α二彈性金屬線2a，2b所組 099135505 表單編號A0I01 第5頁/共17頁 0992062062-0 [0010] 201218927 [0011] [0012] [0013] 導熱板1之對應邊分別成型有一樞部，本實施例的樞部為 一中空筒體11a，lib; 12a，12b，每一對中空筒體 11a’ lib; 12a，12b係為分離且成直線排列，其可由導熱 板1端緣處彎曲捲繞而成，每對中空筒體 11a，llb;lia’ 12b之間係延伸有一擋片13a，13b，該擋 片13a，13b與導熱板1共平面，並凸出於一對中空筒體 1 la, 1 lb ; 12a, 12b之間。 此二彈性金屬線2a，2b係為完全相同之形狀，略成门字形 ，可區分為一令段部份23a，23b及二外側彈性臂 21a’22a; 21b，22b，其中段部份23a，23b係分別穿置於 一對中空筒體11a’ lib; 12a，12b内形成樞接，且該中段 部份23a，23b露出於擋片l3a，13b位置處形成有一彎折部 231a’ 231b，該彎折部231a，231b較佳可為¥字形，當然 亦可彎折成其他形狀，該彎折部231a，231b可擋靠於該 檔片13a，13b上，使彈性金屬線2a，2b之中段部份 2 3 a，2 3 b無法向下旋轉。另夕卜，各彈性臂 21a’ 22a; 21b，22b之自由端可較佳地成型有鉤部 211a，221a;211b，221b，便於穿置固定於電路板上。此 外，在導熱板1之頂面係可供一熱管3之一蒸發端銜接， 其冷凝端則設有鰭片組4。 續請參閱第二圖，其係為本發明與待安裝電子元件之分 解示意圖，本發明之導熱板丨係用以安裝於一電子元件6 上方，電子元件6係設於一電路板5上，在電路板5位於電 子凡件6周圍之板面上設有四環套51a，51b，51c，51d , 分別對應於彈性金屬線2a，2b之四鉤部 099135505 表單編號A0101 第6頁/共17頁 〇992〇62〇62-〇 201218927 2lla，221a; 211b，221b，將導熱板1置於電子元件6上， 並將彈性金屬線2a，2b之彈性臂21 a, 22a，· 21b，22b略為 f折即可其末端之鉤部211a，221a; 211b，22lb穿入環套 51a，51b，51c，51d内，即如第三、四圖所示，此時，因 中段部份23a，23b之彎折部23la, 231b受擋片13a，13b之 擋靠而使彈性臂21 a, 22a;21b，22b產生彎曲，即對導熱 板1形成下壓固定力，而緊貼於電子元件6上，形成極佳 之熱接觸。 ^ [0014] Ο 本發明之扣具結構無需使用螺栓，亦無需貫穿電路板， 利用彈性金屬線2a, 2b之形變彈力而產生下壓力，不但結 構獲得有效簡化，重量得以減輕，甚至可降低整體結構 高度，有利於電子裝置之輕薄化。 [0015] 第五圖所示者為導熱板之另一種變化，由圖中可看出， 導熱板Γ之厚度較大，可將熱管3之蒸發端包覆於其内 ’如此可使熱管3與導熱板Γ之間形成更好的接觸性， 不僅接觸面積更大，且接觸性亦更佳。 ❹[0016] 第六圖為本發明薄型化扣具之又一種變化，由圖中可看 出，此彈性金屬線2c亦呈门字形，可區分為一中段部份 23c及二彈性臂21c，22c，其中二彈性臂21c，22c係分別 穿設於一對中空筒體11&，111);123，121)内而固定，中段 部份2 3 c則形成在導熱板1的一側邊處。另外，在二彈性 臂21c，22c的自由端和中段部份23c的中間位置處分別形 099135505 成有鉤部211c，221c，231c，便於如上述實施例穿置固定 於電路板上（圖未示出）。此外，在導熱板丨之頂面係可供 一熱管3之一蒸發端銜接，其冷凝端則設有鰭片組4。本 表單編號第7頁/共17 W 0992062062_0 201218927 實施例的彈性金屬線2c為具有三鉤部211c，221c，231c ，是以在電路板上設有三環套（圖未示出），以供各鉤部 211c，221c，231c來勾設連接。 [0017] 第七圖為本發明薄型化扣具之再一種變化，由圖中可看 出，導熱板Γ的二相對應邊沖設成型有一樞部，且本實 施例的樞部為一中空筒體11c，lid; 12c, 1 2d，每一對中 空筒體11c，lid; 12c，1 2d係為分離且成直線排列；彈 性金屬線2c的二彈性臂21c，22c分別穿設於一對中空筒 體11c，lid ;1 2c，1 2d内而固定。同理，在導熱板Γ之 頂面係可供一熱管3之一蒸發端銜接，其冷凝端則設有鰭 片組4。 [0018] 以上所述者，乃本發明較佳實施例之具體說明而已，非 用以侷限本發明之專利範圍，其他運用本發明之發明精 神所為之一切等效變化，均應俱屬本案之專利範圍内。 【圖式簡單說明】 [0019] 第一圖本發明之立體外觀圖。 [0020] 第二圖本發明與待結合電路板之示意圖。 [0021] 第三圖本發明與電路板結合後之上視圖。 [0022] 第四圖本發明與電路板結合後之侧視剖面圖。 [0023] 第五圖本發明之另一實施例與電路板結合後之側視剖面 圖。 [0024] 第六圖本發明之又一實施例組合示意圖。 [0025] 第七圖本發明之再一實施例組合示意圖。 099135505 表單編號A0101 第8頁/共17頁 0992062062-0 201218927 【主要元件符號說明】 [0026] 1，1’，Γ…導熱板 11a，llb;12a，12b;llc，lid 12c，12d…中空筒體 13a，13b…擋片 2a，2b，2c…彈性金屬線 21a，22a ; 21b，22b; 21c，22c…彈性臂 211a’ 221a;211b’ 221b;211c，221c*·.鉤部 23a，23b，23c…中段部份 231a，231b，231c··* 彎折部 Ο 3…熱管 4…鰭片組201218927 VI. Description of the Invention: [Technical Field to Which the Invention Is Applicable] [0001] The present invention relates to a heat sink, particularly to a fixed structure of a heat sink. [Previous winter good] [0002] As the performance of semiconductor components continues to increase, the demand for heat sinks has also increased. On the other hand, the trend toward the development of electronic devices toward lightness and thinness has also been somewhat delayed or changed. Therefore, the heat dissipation capability of the heat sink must be continuously increased to meet the heat dissipation requirements of the electronic device, and at the same time, it is required to be lightweight and thin. [0003] Chinese Patent No. 1,305,825 discloses a typical central processing unit (CPU) heat sink fixing structure which is placed with a heat conducting plate and is placed above the heating element CPU, so the heat conducting plate must be able to generate a certain amount of CPU The pressure in the case is fixed by the elastic fixing bolts located at the four corners. Each fixing bolt is composed of a bolt and a spring. The bolt needs to penetrate the heat conducting plate and the main board to conduct heat. The board is fixed to the motherboard, so the bolts must have a certain length. On the other hand, the heat conducting plate still needs to be provided with a sleeve for the bolt to be placed. As a whole, the structure of such a conventional fixed structure is complicated, the overall height is difficult to reduce, and the weight is also increased with complicated structure, which is not conducive to the thin and light design of the computer. [0004] Another patent No. M276267 discloses another similar heat sink fixing structure, the difference being that the heat conducting plate first locks the two extension plates with screws, and then the extension plate is bolted to the circuit board. On, still has the same shortcomings as the above '8 2 5 . SUMMARY OF THE INVENTION 099135505 Form No. A0101 Page 4 / Total 17 Page 0992062062-0 201218927 [The main purpose of w (4) is to provide a thin buckle for the device, which can effectively simplify the structure of the radiator clip and reduce The overall height of the buckle and its weight* can be reduced to help reduce the weight of the electronic device. Just for the above purpose, 'the present invention provides a thin briquette for bribe (4)' including a heat conducting plate and an elastic metal wire, the heat conducting plate is formed with a pair of pivot portions; the elastic metal wire has a pair of elastic arms and a connection For a mid-section of the resilient arms, each of the resilient arms is attached to each of the pivots. [0007] In order to achieve the above object, the present invention provides a thinned fastener for a heat sink, comprising a heat conducting plate and a pair of elastic metal wires, the heat conducting plate being formed with a pair of pivot portions; each of the elastic metal wires having a For each of the elastic arms and a middle portion connecting the pair of resilient arms, each of the middle portions is coupled to each of the pivot portions. [0008] Compared with the prior art, the present invention has the following effects: the middle portion is exposed at the position of the blocking piece to form a V-shaped bent portion, and ## depends on; When the end of the arm is inserted into the ring sleeve provided on the circuit board, the elastic arm is bent because the middle portion is supported by the blocking piece to form a pressing force on the heat conducting plate. [Embodiment] The structure and the features of the preferred embodiment of the present invention, as well as the drawings, will now be described in detail. For details, please refer to Chapter 1, which is the standpoint of the present invention. The heat sink clip of the present invention is mainly composed of a heat conducting plate α2 elastic metal wire 2a, 2b group 099135505 Form No. A0I01 Page 5 / Total 17 pages 0992062062-0 [0010] [0013] [0013] [0013] The corresponding sides of the heat conducting plate 1 are respectively formed with a pivot portion, the pivot portion of this embodiment is a hollow cylinder 11a, lib; 12a, 12b, each A pair of hollow cylinders 11a' lib; 12a, 12b are separated and arranged in a line, which can be bent and wound from the end edge of the heat conducting plate 1, and each pair of hollow cylinders 11a, 11b; lia' 12b is extended There is a flap 13a, 13b which is coplanar with the heat conducting plate 1 and protrudes between a pair of hollow cylinders 1 la, 1 lb; 12a, 12b. The two elastic metal wires 2a, 2b are completely identical in shape, and are slightly gate-shaped, and can be divided into a segment portion 23a, 23b and two outer elastic arms 21a'22a; 21b, 22b, wherein the segment portion 23a, 23b is respectively disposed in a pair of hollow cylinders 11a' lib; 12a, 12b to form a pivotal connection, and the middle section 23a, 23b is exposed at the position of the flaps 13a, 13b to form a bent portion 231a' 231b, The bent portions 231a, 231b are preferably in the shape of a chevron, and may of course be bent into other shapes. The bent portions 231a, 231b may abut against the flaps 13a, 13b to make the middle of the elastic metal wires 2a, 2b. Part 2 3 a, 2 3 b cannot rotate downward. Further, the free ends of the respective elastic arms 21a' 22a; 21b, 22b are preferably formed with hook portions 211a, 221a; 211b, 221b for facilitating the wearing and fixing on the circuit board. In addition, the top surface of the heat conducting plate 1 is connected to one of the heat-emitting tubes 3, and the condensation end is provided with a fin group 4. Please refer to the second figure, which is an exploded view of the present invention and the electronic components to be mounted. The heat conducting plate of the present invention is used for mounting on an electronic component 6, and the electronic component 6 is disposed on a circuit board 5. Four ring sleeves 51a, 51b, 51c, 51d are provided on the surface of the circuit board 5 around the electronic component 6, respectively corresponding to the elastic metal wires 2a, 2b, four hooks 099135505 Form No. A0101 Page 6 of 17 〇992〇62〇62-〇201218927 2lla, 221a; 211b, 221b, the heat conducting plate 1 is placed on the electronic component 6, and the elastic arms 21 a, 22a, 21b, 22b of the elastic metal wires 2a, 2b are slightly F is folded so that the end hook portions 211a, 221a; 211b, 22lb penetrate into the loop sleeves 51a, 51b, 51c, 51d, as shown in the third and fourth figures, at this time, due to the middle portion 23a, 23b The bent portions 23a, 231b are biased by the blocking pieces 13a, 13b to bend the elastic arms 21a, 22a; 21b, 22b, that is, a pressing force is applied to the heat conducting plate 1 to be in close contact with the electronic component 6, Forms excellent thermal contact. ^ [0014] 扣 The buckle structure of the present invention does not need to use bolts, and does not need to penetrate the circuit board, and the downward pressure is generated by the deformation elastic force of the elastic metal wires 2a, 2b, not only the structure is effectively simplified, the weight is reduced, and the whole can be reduced. The height of the structure is conducive to the thinning of the electronic device. [0015] The fifth figure shows another variation of the heat conducting plate. As can be seen from the figure, the thickness of the heat conducting plate 较大 is large, and the evaporation end of the heat pipe 3 can be covered therein. Better contact is formed with the heat conducting plate, not only the contact area is larger, but also the contact is better. [0016] The sixth figure is still another variation of the thinned buckle of the present invention. As can be seen from the figure, the elastic metal wire 2c is also gate-shaped and can be divided into a middle portion 23c and two elastic arms 21c. 22c, wherein the two elastic arms 21c, 22c are respectively fixed through a pair of hollow cylinders 11&, 111); 123, 121), and the middle portion 2 3 c is formed at one side of the heat conducting plate 1 . In addition, at the intermediate position of the free end of the two elastic arms 21c, 22c and the middle portion 23c, the hook portions 211c, 221c, 231c are formed in the shape of the hooks 211c, 221c, 231c, respectively, so as to be fixed and fixed on the circuit board as in the above embodiment (not shown). Out). In addition, a top surface of the heat conducting plate is connected to one of the heat pipes 3, and a fin group 4 is provided at the condensation end. The form number 7/17 W 0992062062_0 201218927 The elastic metal wire 2c of the embodiment has three hook portions 211c, 221c, 231c, which are provided with a three-ring sleeve (not shown) on the circuit board for Each of the hook portions 211c, 221c, and 231c is hooked. [0017] The seventh figure shows another variation of the thinned buckle according to the present invention. As can be seen from the figure, the two opposite sides of the heat conducting plate 冲 are formed with a pivot portion, and the pivot portion of the embodiment is one. The hollow cylinders 11c, lid; 12c, 1 2d, each pair of hollow cylinders 11c, lid; 12c, 1 2d are separated and arranged in line; the two elastic arms 21c, 22c of the elastic metal wire 2c are respectively disposed in one The hollow cylinder 11c, lid; 1 2c, 12 2d is fixed. Similarly, on the top surface of the heat conducting plate, one of the heat pipes 3 can be connected to the evaporation end, and the condensation end is provided with the fin group 4. [0018] The above description of the preferred embodiments of the present invention is not intended to limit the scope of the invention, and all other equivalent variations of the inventive concept of the invention should be Within the scope of the patent. BRIEF DESCRIPTION OF THE DRAWINGS [0019] The first figure is a perspective view of the present invention. [0020] The second figure shows a schematic diagram of the invention and the circuit board to be combined. [0021] FIG. 3 is a top view of the present invention in combination with a circuit board. [0022] Figure 4 is a side cross-sectional view of the present invention in combination with a circuit board. [0023] Figure 5 is a side cross-sectional view showing another embodiment of the present invention in combination with a circuit board. [0024] FIG. 6 is a schematic view showing a combination of still another embodiment of the present invention. [0025] FIG. 7 is a schematic view showing a combination of still another embodiment of the present invention. 099135505 Form No. A0101 Page 8 of 17 0992062062-0 201218927 [Explanation of main component symbols] [0026] 1,1', Γ...thermal plate 11a, llb; 12a, 12b; llc, lid 12c, 12d... hollow cylinder Body 13a, 13b...Blocks 2a, 2b, 2c...elastic wires 21a, 22a; 21b, 22b; 21c, 22c... resilient arms 211a' 221a; 211b' 221b; 211c, 221c*.. hook portions 23a, 23b, 23c... middle section 231a, 231b, 231c··* bending section Ο 3... heat pipe 4... fin group
6…電子元件 ❹6...electronic components ❹
099135505 表單編號A0101 第9頁/共π頁 0992062062-0099135505 Form number A0101 Page 9 / Total π page 0992062062-0