TW201211094A - Low moisture permeability resin composition and cured product thereof - Google Patents

Abstract

The present invention provides a low moisture permeability resin composition for electronic devices which can be used as sealing agent of organic electroluminescent devices, electronic papers or solar cells and can form cured product having excellent low moisture permeability. The present invention provides a low moisture permeability resin composition for electronic devices requiring low moisture permeability and characterized by comprising compound (A), compound (B) and polymerization initiator (C). The compound (A) has more than two reactive functional groups(a) in one molecule. The compound (B) has one reactive functional group (b) in one molecule and its molecular weight is 50-1000.

Description

201211094 VI. Description of the Invention: [Technical Field] The present invention relates to an organic electroluminescent device, an electronic paper, a female solar battery, etc., which are required to have a reading, and a low Low-thirsty ketone resin composition for use in moisture permeable electronic devices and cured products thereof, - ", clogging agents, organic electroluminescent elements for forming a low-thirsty seal, electrically using this 4 r L Housed in paper and solar cells. [Prior Art] The present invention seeks to insert and at least a low-moisture-permeable sealing material and a resin composition for a dense electronic device which are sufficient for use in an organic electroluminescence element paper, a solar battery, or the like. It has been suggested that two: a hardened substance with low moisture permeability. Parts by weight: bismuth; a resin composition containing an epoxy compound up to a 2 fluorene ring skeleton, and a weight of 80:2 ...... a cyclic polymerization initiator having an aromatic ring as an organic electrophoresis /, first % ion literature υ. Specifically, the sealant is used for the part (see Patent ^^..8) which has an epoxy compound of a private ring skeleton, a compound having an epoxy compound of a square scent. However, at 85t8 two in two Under the condition of having an epoxy group C 8 5 /〇R 末端 at the end, the direct-purification humidity system is 55 g/m 2 · 24 h or more, and the permeation of the compound is not yet sufficient. Moreover, a new composition has been proposed, which contains: (4)! There are at least two or more epoxides in the molecule; (B) in the molecule of 1 remake right, and the ring of 200 to 7 _ is 20,000 to 1 土 soil knife activation, "Oxygen tree 曰" (C) is a potential photoacid catalyst that is irradiated by energy rays to produce sputum; and (D) a decane coupling agent containing propyl groups; 7C-block photocurable 201211094 resin composition containing: 30 to 150 parts by weight of the component (B) with respect to 100 parts by weight of the component, and relative to 100 parts by weight of the (A) The total amount of the component and the component (B), containing 〇] to 1 part by weight of the component (C), containing 〇.1 to 1 The component (see Patent Document 2). However, the moisture permeability of the cured product has not been examined. In addition, a resin composition containing (VIII) epoxy compound (B) is also known. a novolak resin, (c) a photocationic polymerization initiator, and (D) a filler are used as an adhesive for encapsulating an element such as an organic EL (see Patent Document 3). However, in order to obtain low moisture permeability, a filler must be present. In the case of no filler, the moisture permeability of the cured product is 60 g/m 2 · 24 h under the condition of 60 ° c 9 〇 % RH. The prior art document patent document 1 Japanese special open 2007-46035 Japanese Laid-Open Patent Publication No. 2010-126699 (Patent Document 3) Patent No. 2010-24364 [Draft of the Invention] [Problem to be Solved] The purpose of the present invention is to provide a resin composition. , can be:: organic electroluminescent elements, electronic paper, solar cells, etc.: low moisture permeability sealing materials and sealing materials for electronic devices that are required to be low in moisture permeability, giving excellent hardening and low moisture permeability Material The other purpose of the 纟七明 is to provide a low moisture permeability hardness, which is obtained by hardening the above low moisture permeable resin composition. The -5- is provided with a sealant, which is low in transparency/stupidity. The purpose of the closure material and the sealing material is to provide an organic electric energy battery, which is studied by using the above closed or sealed electronic device to reduce the problem of wetness, and finds that it will have a specific structure and has a workmanship with two The above reactive officer has the effect of having one of the specific structures to fill the free volume in the crosslinked compact of the cured resin; and also consisting of a reactive functional resin, particularly for organic electroluminescence or the like. An electron having a low moisture permeability is required to have a low moisture permeability electron characterized by containing: a compound (A) in one molecule (4), and a compound rolling compound having a molecular weight of 5 to 1000 in one molecule (B) It is preferable to have i 201211094. Further, the other object of the present invention is to form a sealant and a sealant which have excellent low moisture permeability. Further, the effect of the light-emitting element, the electronic paper, the solar low moisture permeability sealing material or the sealing material of the present invention is also affected. [Means for Solving the Problem] The present inventors have completed the present invention in order to solve the above facts: a compound having a reactive functional group is incorporated into a compound of a compound to make the degree of polymerization small, and on the other hand, from polymerization. The side chain of the material of the reactive group exhibits improvement of the moisture permeable element, the electronic paper, and the solar cell sub-device by hardening only the cured product having the two or more resins. That is, the present invention provides a device having a low moisture permeable resin composition having two or more reactive functional groups having one reactive functional group (1), and a component (B) and a polymerization initiator (c). . The above compound (A) and/or oxime or more cyclic skeleton. 201211094 In addition, a hexane ring. The cyclic skeleton is preferably the same or different benzene ring or cyclized compound (A), and the compound (B) is further preferably 10 to 250. The content of the above-mentioned compound is preferably 1 to 100 parts by weight. 1000 parts by weight, parts by weight. The low moisture permeable resin composition for the above electronic device may further contain an inorganic filler (D). Further, the low moisture permeable resin composition for an electronic device may further contain a decane coupling agent. The above polymerization initiator (C) is preferably a photo or thermal cationic polymerization initiator or a photo or thermal radical polymerization initiator. Further, the electronic device in the low moisture permeability resin composition for a low electronic device for an electronic device is preferably an organic electroluminescence device, an electronic paper or a solar cell. Further, the present invention provides a cured product obtained by hardening the above electronic device with a low moisture permeable resin composition. Further, the present invention provides a blocking agent comprising the above-mentioned low moisture permeable resin composition for an electronic device. Further, the present invention provides a sealant comprising the above-mentioned low moisture-permeable resin composition for an electronic device. Further, the present invention provides an organic electroluminescence element comprising the above-mentioned cured product. Further, the present invention provides an electronic paper containing the above hardened material. Further, the present invention provides a solar cell comprising the above-mentioned cured product. [Effect of the Invention] According to the present invention, it is possible to obtain a resin composition which is improved in an organic electroluminescent device, an electronic paper, a solar cell, or the like, which is required to have low moisture permeability, and a cured product thereof. The moisture permeability used is 'and a hardened material having a heat resistance of 1 Torr to 20 〇 ° C is imparted. Further, according to the present invention, it is possible to obtain a sealant and a sealant which can be used to form an organic electroluminescence device, which is excellent in electronic devices requiring low moisture permeability, such as electronic paper and solar cells. Moisture-permeable hard material (closed material, sealing material). The organic electroluminescence device, the electronic paper, and the solar cell system containing the cured product of the low moisture permeability resin composition of the present invention minimize the influence of humidity. [Embodiment] [Form of the invention for carrying out the invention] <Low moisture permeable resin composition for electronic device> The low moisture permeable resin composition for the sub-device of the invention has a wide range of special & a compound having two or more reactive functional groups (4) in one molecule, having a reactive functional group (b) and having a molecular weight of one compound (B) and a polymerization initiator (C) as essential components . A cured product (generally, 'hardening the moisture of a resin material containing a crosslinkable polyfunctional group, which is cured in a hardened material) has a 1-functional group-containing material which is inherently derived from the material skeleton and which penetrates the above-mentioned diluent. By holding the joint moment away from the shape 'Because the length of the copolymerized polymer is long, it is generally more than the moisture permeability of the resin monomer t -8 - 201211094 The polymerization initiator is doped into a resin having two or more reactive functional groups, and the polymerization initiator is activated by heat or light to be cross-linked and hardened, but the main water gas system is made from The free volume formed by the cross-linking of the material penetrates. In the present invention, a compound having one reactive functional group (b) in one molecule and having a molecular weight of from 50 to 1,000 is blended in one molecule to have two or more reactive functional groups (a) The compound (A) is polymerized to reduce the crosslinking density of the cured resin. On the other hand, the monomer unit derived from the compound (B) in the polymer exhibits a side chain of the polymer. The effect of packing the free volume is also to improve the moisture permeability more than hardening of the resin composed only of the compound (A). The following 'not intended to show the free volume packing configuration of the polymer of the present invention. The ellipsoid of the label A is derived from the monomer unit of the compound (A) (in the case of 2 B )), the ellipsoid of the label B is derived from the monomer unit of the compound (B), and the wavy line on both sides represents the polymer. Main chain. It is considered that the monomer unit derived from the compound (B) is filled with a gap derived from the monomer unit of the compound to fill the free volume.

-9 - 201211094 If the compound (A) and/or the compound (B) (either or both of the compound (a) and the compound (B)) has one or more cyclic skeletons, the free volume in the polymer It is easy to reduce, and it is better to improve the moisture permeability. It is considered that the cyclic skeleton mainly means that the alicyclic cyclic skeleton or the aromatic cyclic skeleton is multiplied by the hydrophobicity of the alicyclic cyclic skeleton and the aromatic cyclic skeleton, and also in the aromatic cyclic skeleton. The π-π stacking effect (layered aromatic ring skeleton) achieves an improvement in moisture permeability. In the case where both the compound (Α) and the compound (Β) have a cyclic skeleton, the respective cyclic skeletons may be the same or different. Further, when the compound (Α) or the compound (Β) has two or more cyclic skeletons, the plurality of cyclic skeletons may be the same or different, 0, a ring, a naphthalene ring, an anthracene ring, an aromatic ring; Specifically, the cyclic skeleton may be exemplified by a monocyclic or polycyclic ring such as a monocyclic ring of a phenanthrene ring or an anthracene ring or a condensed polycyclic ring of a hexane ring, a decahydronaphthalene ring, a norbornane ring or an adamantane ring. Aliphatic ring. Further, in the patent specification of the present invention, the number of the polycyclic ring skeletons which are narrowed by η rings or the like is one by one. The number of cyclic skeletons in the compound (Α)1 molecule is 1 to 3, preferably 1 to 10, further preferably 1 to 6, and 1 to 5, 彳4. The number of the cyclic skeleton in the molecule of the compound (Β) is, for example, 1 to 10, preferably 1 to 6, more preferably 1 to 3 having a benzene ring, a naphthalene ring, or a 'cyclic skeleton. In the case of the compound (Α), the cyclic skeleton is preferably a ring-containing or cyclohexane ring. Further, the compound (Β) contains a benzene ring or a cyclohexane ring. -10-201211094 <Compound (A) &gt; The compound (A) is a compound having two or more reactive functional groups (a) in the i molecule, and is not particularly limited. Specifically, the reactive functional group U) is exemplified by a cationically polymerizable group such as an epoxy group, a glycidyl group or a vinyl ether group; and a (meth)acryl fluorenyl group having a radical polymerizable property. Base. The vinyl ether group also has a case of having a radical polymerization property. The reactive functional group (a) can preferably be a group having a cationic polymerizable group, more preferably an epoxy group, and particularly preferably a cyclopropyl group. The number of the reactive functional groups (a) in the molecule of the compound (A) is, for example, 2 to 30, preferably 2 to 1 , and more preferably 2 to "solid, particularly preferably 2 to 3. A plurality of reactive functional groups (4) are also 戍 = although the molecular weight of the compound (4) is not particularly limited, but it is as heavy as 5 〇, such as 1 Γ, such as 匕 匕 3 and 1 〇 0 to 1 〇〇〇〇〇, It is preferably used in the form of 100. For example, the compound (A) can be exemplified by: (1) The combination of an ion I-combination Lueneng group and an aromatic ring has two or more radical polymerizable functional disks): 1 in a knife (A- 2). 丨 | | Λ | | | , , , , , , 刀 刀 刀 刀 刀 刀 刀 刀 刀 刀 刀 刀 刀 刀 刀 刀 刀 刀 刀 刀 刀 刀 刀 刀 刀 刀 刀 刀 刀 刀 刀 刀 刀 刀 刀 刀 刀 刀 刀 刀 刀 刀There are two or more compounds having an I-bonding functional group and an aliphatic ring (Α_4), etc. The radical has an aromatic ring and two or more cationic polymers (A - Π, you 丨1 soil S) v Oxygen: It can be exemplified by: double-type diepoxypropyl conversion, double-dissolved! - % oxypropyl ether, bisphenol F-type di-p-ethylene oxide propyl ether, tetramethyl": wide a compound having a benzene-11-201211094 ring and two epoxy groups, such as a S-type group and a phenol type-% oxypropyl ether; a naphthalenediol diepoxypropyl ether, a double-pregnant diglycidyl ether a compound having a condensed ring and two epoxy groups, such as biscresol second epoxy propyl ether, bisphenoxyethanol hydrazine diepoxypropyl ether; and having, for example, an alkali novolac type epoxy resin or a cresol novolac a type of epoxy resin, a phenolic epoxy resin containing a bisphenol skeleton, a polyphenyl hydroxypropyl group of a repeating unit containing a naphthyl skeleton, and a benzene ring and/or a condensed ring and the like a compound having more than one epoxy group; a compound having an aromatic ring and two epoxy propyl groups such as F bis(3-ethyl propylene oxide-3-ylmethyl) ether; Shout, double A diethylene ether, bisphenol F divinyl ether, bisphenol F bis (2-vinyl oxyethyl) ether, bisphenol s diethyl ether ether, tetradecyl double expectation divinyl a compound having a benzene ring and two vinyl ether groups such as ether; naphthalenediol divinyl ether, bisphenol quinone divinyl ether, biscresol second vinyl ether, bisphenoxyethanol second a compound having a condensed ring and two vinyl ether groups, such as an alkenyl ether; and such a halide, or a C丨-9 alkyl substituent thereof, etc., in a c! The CI-9 thiol substituent can be exemplified by a mercapto group, an ethyl group, a propyl group, a tributyl group, etc. The halogen in the halide can be exemplified by F, Cl, Br, etc. .. having an aromatic ring and 2 The above radical polymerizable functional group compound (A-2) 'e.g. can be exemplified by: bis(indenyl) acrylate, bisphenol A bis(indenyl) acrylate, bisphenol F di(meth)acrylic acid a compound having a benzene ring and two (fluorenyl) acrylonitrile groups, such as an ester, bisphenol S bis(indenyl) acrylate, tetrakisyl bisphenol di(meth) acrylate, or the like; Acrylate, bisphenol quinone di(indenyl) acrylate, biscresol bismuth (meth) acrylate, bisbenzyl methoxy hydrazine di(meth) acrylate vinegar, etc. -12-201211094 has a condensed ring and a compound of two (fluorenyl) acrylonitrile groups; and such halides, or such Ci_9 alkylate substituents, and the like. The Cw alkyl substituent in the Cu alkyl substituent may be exemplified by methyl, ethyl, propyl or secondary butyl. The halogen in the compound can be exemplified by F, Cl, Br, and the like. The compound (A-3) having an aliphatic ring and two or more cationically polymerizable functional groups can be exemplified by hydrogenated bisphenol octadecyl propyl ether, hydrogenated bisphenol F diglycidyl ether, hydrogenated double Phenol § diglycidyl ether, dicyclohexyl diepoxypropyl ether, bis(3,4-cyclohexylcyclohexyl)fluorenyl, 3,4, _epoxycyclohexyl-3,4-epoxy ring a compound having a cyclohexane ring and two epoxy groups; a compound having a cyclohexane ring and two epoxy propyl groups; and a hydrogenated double-aged A divinyl bond group, hydrogenated double F: ethylene A compound having a cyclohexane ring and two vinyl ethers, such as a base ether, hydrogenated bisphenol S divinyl ether, and dicyclohexyl divinyl ether. , having an aliphatic ring and two or more free i-polymerizable functional groups: (A·4) 'for example, for example: nitriding double... (meth)acrylic acid, chlorinated double-aged F (a) A compound having cyclohexane ketone/two (meth) acrylonitrile groups, such as acryl vinegar, vaporized (iv) acrylate, dicyclohexyl bis(methyl ketone, bismuth) acrylate. Further, the compound (A) is, for example, the following 彳(1) zH〇-Rl)m 化合物 a compound of the formula (1): [in the formula (1), the Z1 system represents from m ̄ ̄~ f 7] r nu\ + Xifu prepared base compound (Z(OH)m) removes the base of the Η Η , , , , , , , LV LV LV LV 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上A woman 醯 base. The m-series 2 or more integers of Bu, Ethyl, or (Methyl)-C-B-A A ^ ^ ^ group The above-mentioned z is preferably a basal skeleton having a cyclic structure, and the above-exemplified ones can be exemplified. The 201211094 m-valent polyhydroxy compound Z^OHh can be exemplified by a compound having two benzene rings such as bisphenol, bisphenol A, bisphenol F, bisphenol 8, etc., and these compounds or such C丨- a 9-alkyl substituted compound; a compound having a condensed ring such as naphthalene diol, bisphenol oxime, bisphenol oxime, bisphenoxyethanol oxime or the like, and such a halide or a c alkyl substituent thereof; hydrogenation a compound having two cyclohexane rings, such as bisphenol F, hydrogenated bisphenol S, and dicyclohexyl group; an aromatic ring having three or more stupid rings, such as a cresol novolak or a phenol novolak Compounds and such compounds, or such Cl-9 alkyl substituents, and the like. The cKs hydryl substituent in the C -9 alkyl substituent may, for example, be a methyl group, an ethyl group, a propyl group, a tertiary butyl group or the like. The halogen in the toothing can be exemplified by F, C1, B r and the like. In addition, the compound (A) is, for example, a compound represented by the following formula (1): [In the formula (I), "anthracene means a single bond or a linking group (having one or more original: a divalent group)" The hydrocarbon group, carbonyl group, and ether bond of the valence: &amp; building a reverse acid, *, a guanamine bond, or a plurality of such linked bases]. In the compound of the formula (1), the divalent smog group exemplified as the linking group is a linear or branched chain thiol group having a carbon number of 1 to 18, and a divalent alicyclic hydrocarbon group ( In particular, it is a divalent ring-forming base). A linear or branched chain alkyl group having 1 to 18 carbon atoms, for example, anthracene fluorenyl methylene group, dimethylmethylene group, ethyl group, propyl group, and trimethylene group Base. The divalent alicyclic hydrocarbon group may, for example, be an exocyclopentyl group, a 1,3·cyclopentyl group, a cycloarylene group, a 1&gt;2 cyclohexyl group _14-201211094 valence cyclohexyl group ( Examples include a cyclohexyl group, a 1,4-cyclohexylene group, a cyclohexylene group, and the like, and a ring-containing hexylene group. Representative examples are the compounds represented by the formula (I), and the compounds represented by the following formulas (1-1) to (1-7) of the alicyclic epoxy compound represented by the above formula (I). Upper % soil oxygen compound ' For example, Cell〇xide 2〇21p can also be used,

Celloxide 208 1. Commercial products such as Celloxide 8 0 00 (made by Daicel Chemical Industry Co., Ltd.). Further, in the following formula, n represents an integer from i to 3 〇. When such an alicyclic epoxy compound is used, the influence on the transparency of the cured product or the increase in the glass transition temperature can also be expected.

(1-3)

-15- 201211094 The compound (A) is preferably a compound having two epoxy groups, a glycidyl group, a vinyl ether group, or a (meth)acrylonitrile group, a benzene ring or a cyclohexane ring, and specifically 5 The compound (A) can preferably be used with bisphenol F diglycidyl ether 0 tetramethyl bisphenol diepoxypropyl ether or bisphenol phenoxyethanol second epoxy propyl ether having 2 to Diphenylepoxy propyl ether having 2 to 4 benzene rings, such as bisphenol epoxy propyl ether of benzene ring; bisphenol, F (3-ethyl propylene oxide _3_ fluorenyl) ether; a divinyl ether having 2 to 4 benzene rings such as F divinyl ether; or bisphenol? A (fluorenyl) acrylate having 2 to 4 benzene rings, such as bis(indenyl)acrylic acid. The compound (a) is particularly preferably a compound having two epoxypropyl groups and a benzene ring. The content of the compound (A) in the low moisture-permeable resin composition for electronic paper of the present invention is, for example, 5 to 95% by weight, preferably 1 to 9 % by weight, more preferably 20 to 85% by weight. When the content of the compound (A) is within such a target range, it is possible to provide a cured product which improves the coating property of the resin composition and has excellent low moisture permeability and hardness. <Compound (B) &gt; The compound (B) has one reactive functional group (b) in one molecule, and 50 to 1000 in molecular molecule 5, and the molecular weight of the compound (B) is from 5 to 1〇〇〇. In the case where it is hardened, the effect of the side chain packing free volume of the polymer can be effectively found. The molecular weight of the compound (B) is preferably from 5 Å to 5 Å. The compound (B) has, for example, one or more in one molecule, and has a ring shape of 1 to 4, and more preferably 2 to 4 in a single molecule. The plurality of cyclic skeletons may be the same or different. The cyclic skeleton of the compound (B) can be exemplified by the above compound (A). Among them, j is preferably a benzene ring or a cyclohexane ring. Further, the compound (B) can be used singly or in combination of two or more. -16- 201211094 The reactive functional group (b) can be exemplified by the above reaction '1: shown. When the reactive functional group (a) has a cation, the reactive functional group (b) is also cationically polymerized. The reactive functional group (a) is a radical polymerizable property 1, and the reactive functional group (b) is also It is preferably a combination of a radical polymerizable functional group (a) and a reactive functional group (b), and particularly preferably a glycidyl group. For example, the compound (B) can be exemplified by a compound (B-1) having an aromatic functional group; a compound (B-2) having an aromatic cyclic functional group; and a compound having an aliphatic ring and a functional group (B) -3); a compound having an aliphatic ring and an energy group (B-4); having an alkyl group and a cationic poly compound (B-5); and having an alkyl group and a radical polymerizable substance (B-6). The aromatic ring and the cationically polymerizable official compartment I (B -1 ), for example, may be exemplified by epoxy phenyl ether, alkyl ether, diphenyl phenol epoxy propyl ether, and triphenyl phenol ring having benzene. a compound of a ring and an epoxy group; an epoxy propyl methoxypropyl ethyl phenyl ether, a glycidyl propyl phenyl ether butyl phenyl ether, a glycidyl propyl tertiary phenyl ether, and the like a compound of a benzene ring and an epoxy group (for example, a compound having Cu and an epoxy group); a mercapto-based phenol propyl acrylate epoxy propyl ether, a propyl phenyl phenol epoxy propyl ether, an epoxy a propyl ether, a tertiary butyl phenol phenol propyl propyl phenol phenol propyl propyl ether (for example, a C! -9 alkyl substituted benzene t functional group (a) exemplified polymerizable functional group functional group; a functional functional group of a fluorenyl group. The reverse is preferably a compound of a epoxide group which is an epoxy ring and a cationically polymerized and radically polymerized cationically polymerizable functional group based on a functional group of a polymerizable functional group. a phenyl ether such as propoxypropyl ether, a ring, or a propylene group having an alkyl group, an alkyl group-substituted benzene ring ether, an ethyl phenyl n-butyl phenyl phenol, or the like Alkyl-substituted phenol epoxypropyl-17- 201211094 趟); benzyl (R)-(-)-epoxypropyl ether benzylidene benzyl epoxide propyl propyl ether compound; Epoxy-epoxy propyl ether compound; phenyl vinyl ether, phenyl phenoxymethyl vinyl ether, (phenylphenoxy) methyl Z phenoxy) ethyl vinyl ether, (2 -Phenylphenoxy)divinyl ether compound having 1 or 2 benzene rings; stupid phenyl propylene oxide, phenoxy decyl propylene oxide, methyl propylene oxide, (2-phenoxy) A compound having hydrazine or two benzene rings, such as ethyl epoxide oxide) ethyl propylene oxide, and the like, and the like. The above c ^ 9 alkyl substituent, ethyl, propyl, tert-butyl or the like. The aromatic ring and the radical polymerizable functional group (B-2), for example, may be exemplified by (phenyl) phenyl phenyl acrylate, phenoxymethyl (meth) acrylate, (methyl phenoxy) a compound having one (meth)acryl fluorenyl group such as an oxime ester or (2-phenoxy)propanol (2-phenylphenoxy)ethyl ester; and the like Halogenated Cu9 Hyun "based substituents and the like. The base of the a-alkyl substituent may, for example, be a methyl group, an ethyl group, a propyl group or a tertiary butyl group, and examples thereof include F, Cl, Br and the like. An aliphatic ring and a cationically polymerizable (B-3) 'for example' may be exemplified by a C5_20 squaring compound such as cyclohexylepoxypropyloxypropyl propyl hydride or tricyclohexyl epoxypropyl ether; cyclohexyl group; C5-2 anthracene ring of C5.2Q cycloalkyl ring compound such as epoxidized propyl ether or dicyclohexyltricyclohexyl epoxypropyl ether, cyclohexyl vinyl ether or dicyclohexyl vinyl ether a phenolic vinyl ether such as a cyclopropyl propyl ether such as an alkyl vinyl ether compound, or a dilute base test, (2-ethylidene ether, etc.: propylene oxide, (phenylphenoxy) '(2-Phenyloxy propylene oxide compound can be exemplified by a compound of a methyl group L, a (fluorenyl) propylene group) acrylic acid (phenethyl ester, (fluorenyl), 2 benzene rings, or Such a C 1 .9 * * group substitution, etc. in the halide i-based compound, dicyclohexylcyclocycloalkyl epoxide-epoxypropyl ether, oxypropyl ether compound, tricyclohexylethyl-18 - 201211094 The functional group of the compound 醆cyclohexyl ester, (meth) propylene, etc. (methyl) c5.2 (having an aliphatic ring and a radical polymerization (B-4), for example ' Examples: (meth) propionate dicyclohexyl ester, (mercapto)acrylic acid tricyclic ring-burning S compound, etc. Compound (B_5) having a burnt group and a cationically polymerizable functional group, for example, 'exemplification: ring C, -9 alkyl ring of oxypropyl methyl ether, epoxy propyl ethyl face, glycidyl propyl ether, butyl epoxy propyl test, 2-ethylhexyl epoxypropyl ether Oxypropyl propyl ether compound; methyl epoxypropyl hydrazine, ethyl epoxidized propyl ether, propyl epoxidized propyl ether, butyl epoxy propyl scale, etc. C! _ alkyl alkyl propyl ether compound a C19 alkyl ether compound such as mercapto vinyl ether, ethylene glycol ether, propyl vinyl ether or butyl vinyl ether, etc. a compound having an alkyl group and a radical polymerizable functional group, For example, 'exemplified by: (meth) methacrylate, (mercapto) acrylic acid, propyl (meth) acrylate, butyl (meth) acrylate, etc. Further, 'compound (B) is a compound represented by the following formula (2): Z2-OR2 (2) [In the formula (2), the Z2 system represents a hydroxyl group derived from a monovalent group. (Z2OH) The group of the OH group is removed, and the R2 is the same as the above R1. The Z2 is preferably a group having a cyclic skeleton. The cyclic skeleton may, for example, be the one exemplified above. The base compound Z2 〇Η, for example, For example: hydrazine, phenyl hydrazine, diphenyl phenol, triphenyl phenol, etc. having 1 to 3 benzene rings; nonylphenol, ethyl phenol, propyl phenol, n-butyl fluorene, tertiary butyl Substituted phenols (eg, 'C -9 alkyl substituted phenols); mercapto phenyl, ethyl phenyl 201211094 phenol, propyl streptophenol, n-butyl phenyl phenol, tertiary butyl An alkyl group substituted with a streptophenol or the like (for example, a C? -9 alkyl substituted streptophenol). An alcohol such as T-fermentation, ethanol, propanol or butanol (for example, a Cl-9 alkanol) An alcohol having an aliphatic ring such as benzyl alcohol or phenylhydrin; a alcohol having an aliphatic ring such as cyclohexanol, dicyclohexanol or tricyclohexanol; and a tooth such as these. The substituent of the C 1 9 alkyl group can be exemplified by a methyl group, an ethyl group, a propyl group, a tertiary butyl group or the like. The halogen in the halide can be exemplified by F, C1, Br and the like. The compound (B) is preferably an epoxy group, a glycidyl group, a vinyl ether group, or a compound having a (meth)acryl fluorenyl group and a benzene ring or a cyclohexane ring. Specifically, the compound (B) is a glycidyl phenyl ether or an epoxy propyl ether having 1 to 2 benzene rings, such as o-phenylphenol epoxypropyl ether; (methyl j-acrylic acid-2) - phenyl methacrylate having i to 2 benzene rings, etc., such as (phenylphenyloxy)ethyl ester, etc. 1 The compound is preferably contained in an amount of 1 to 1000 by weight based on 100 parts by weight of the compound (A). Further, it is preferably preferably 250 parts by weight. If the content of the compound (B) is such that it is so in the range of

Effectively packing the free *M 曰田 (free volume) of the polymer (hardened material), it is possible to obtain a polymer with better low moisture permeability. The combination of the compound (A) and the compound (b), and preferably, the compound (A) has two cyclic skeletons, and the compound (B) has one cyclic skeleton; The compound (A) has 9 彳田Α ★ 胥 2 裱-like skeletons, and the compound (Β) has a combination of two cyclic skeletons; the 彳 human compound (Α) has 5 cyclic skeletons, and the compound (Β) has 1 A ring of bones is interesting. The combination of the human team and the moon; and the compound has five cyclic skeletons and a compound (Bn glyph β has a combination of two cyclic skeletons. By making such a combination, it is possible to obtain a superiority from J. Lower-20-201211094 A low moisture permeability resin composition for electronic devices of a moisture permeable cured product. It is considered that in such a combination, the free volume of the hardened material is more effectively filled. In the low moisture permeability resin composition for an electronic device, the compound (A) has two cyclic skeletons with respect to 1 part by weight of the compound (A) from the viewpoint of effectively lowering the moisture permeability of the cured product. (B) The compound of the compound (8) having a combination of one cyclic skeleton is not particularly limited, and is preferably from i to 25 parts by weight, more preferably from 10 to 200 parts by weight. It is preferably from 2 to 15 parts by weight, particularly preferably from 25 to 1 part by weight. In addition, in the low moisture permeability resin composition for an electronic device of the present invention, the compound (A) has two cyclic skeletons and compounds. (B) The combination of two soil f frames The content of the compound (B) is not particularly limited, but in view of effectively reducing the moisture permeability of the cured product, 00 parts by weight of the compound (VIII) is preferably ... 5 parts by weight, and 1 part by weight. 〇 to 250 parts by weight, preferably 20 to 2 Torr, and particularly preferably 30 to 15 parts by weight. A preferred combination of the compound (A) and the compound (B), specifically, : Example. Group of bisphenol F diglycidyl ether and epoxy propyl phenyl ether: 'combination/combination of bisphenol F diglycidyl ether with o-phenylphenol epoxidopropyl ether F ^Ethoxypropyl group and ring, oxypropyl phenyl group, in the case of 100 parts by weight of the bisphenol F diepoxide as the compound (A) as the epoxy propylbenzene of the compound (B) The content of the ether is particularly good for... In addition, the combination of 'F diepoxypropyl group and the o-stupyl group g... the combination of the base of the case' relative to 1 part by weight of the act-21 - 201211094 The bisphenol F diglycidyl ether of the compound (A) is particularly preferably used in an amount of from 1 to 25 parts by weight as the ortho-phenyl epoxide propyl ether of the compound (B). c) &gt; The electronic paper low moisture permeable resin composition of the invention contains a polymer initiator (C). The polymer initiator (C) is not particularly limited, and a conventional polymerization initiator can be preferably used. A photo or thermal cationic polymerization initiator or a photo or thermal radical polymerization initiator can be used. The polymerization initiator can be used alone or in combination of two or more. <Photocationic polymerization initiator &gt; For example, 'light cation polymerization initiator can use Cyracure UVI-6970, Cyracure UVI-6974, Cyracure UVI-6990, Cyracure UVI-950 (above, manufactured by Union Carbide, USA); Irgacure 250, Irgacure 261, Irgacure 264 (manufactured by Ciba Specialty Chemicals Co., Ltd., trade name); SP-150, SP-1 51, SP-170, Optomer SP-1 7 1 (hereinafter, manufactured by Asahi Kasei Kogyo Co., Ltd., trade name); CG -24-61 (manufactured by Ciba Specialty Chemicals Co., Ltd., trade name); DAICATII (manufactured by Daicel Chemical Industry Co., Ltd., trade name); UVAC 1590, UVAC 1591 (manufactured by Daicel Cytec Co., Ltd., trade name); CI-2064, CI-2 639, CI-2624, CI-248 1, CI-2734, CI-2855, CI-2823, CI-2758, CIT-1682 (above, Sakamoto Soda Co., Ltd. products, trade names); PI-2074 (Rhodia Company, trade name, pentafluorophenyl borate toluene oxime isopropyl benzyl hydrazine salt; FFC5 09 (3M company products, trade names); BBI-102, BBI-101, BBI-103, MPI-103, TPS-103, MDS-103, DTS-103, -22- 201211094 NAT-1 03, NDS-103 (Midori Chemical Co., Ltd., trade name); CD-1010, CD-1011, CD-1012 (USA, Sodium rust salt, strontium salt, strontium salt, strontium salt, etc. represented by commercially available products such as CPI-100P and CPI-101 A (manufactured by Sun Apro Co., Ltd., trade name) Selenium salt, fresh salt, ammonium salt, etc. &lt;Thermal cationic polymerization initiator&gt; For example, the thermal cationic polymerization initiator can use San Aid SI-45 'San Aid SI-47 ' San Aid SI-60 ' San Aid SI-60L '

San Aid SI-80, San Aid SI-80L, San Aid SI-100, San Aid SI-100L, San Aid SI-110L, San Aid SI-145, San Aid SI-150, San Aid SI-160, San Aid SI-170L, San Aid SI-180L (above, Sanshin Chemical Industry Co., Ltd. products, trade name) ' CI-2921, CI-2920, CI-2946, CI-3128, CI-2624, CI-263 9. CI-2〇64 (above, Japan Soda Co., Ltd. product, trade name), PP-33, CP-66, CP-77 (Asahi Chemical Industry Co., Ltd. product, trade name), FC-509, FC-520 (3M The company's products, trade names, etc. represent the diazo sulfonium salts, strontium salts, strontium salts, scale salts, selenium salts, solder salts, ammonium salts, and the like. There is also a compound which can also be used with a metal such as aluminum or titanium, a chelate compound of acetonitrile or a diketone, a decyl alcohol such as trisyl decyl alcohol, or a metal such as aluminum or titanium and acetonitrile. It is a compound of a ketone of a diketone and a phenol of a bisphenol S or the like. 0.05. For example, the amount of the total polya compound 'light or thermal cationic polymerization initiator' of the compound (A) and the compound (b) contained in the low-transparent resin composition for electronic devices is 100 parts by weight. For example, about two to fifteen parts by weight, preferably from 1 to 12 parts by weight, particularly preferably from -23 to 201211094 to 10 parts by weight, preferably from about 〇 to about 10 parts by weight. By using it in this range, it is possible to obtain a cured product having superior low moisture permeability. &lt;hardening accelerator&gt; The low moisture permeability resin composition for an electronic device of the present invention may be hardened by a function of accelerating hardening speed when the polymerizable compound is cured by a light or thermal cationic polymerization initiator. Accelerator. A hardening accelerator which is conventionally used can be used as the hardening accelerator, and for example, 1,8-two can be exemplified.丫bicyclo[5·4 0]_7_undecene (DBU), and salts thereof (for example, salt, octanoate, p-benzoate, citrate, tetraphenyl sulphonate); 5-di-bicyclo[4.3.〇]-5-pinene (DBN) and its salts (eg, sulfonium salts,

婆 盐 salt, 4 grade money salt, strontium salt); benzyl dimercaptoamine, 2,4,6-tris(dimethylamino fluorenyl) age, hydrazine, fluorenyl-didecylcyclohexylamine, etc. An amine; an imidazole such as 2-ethyl-4-mercaptopurine, 1-cyanoethyl-2-ethyl-4-methylimidazole; a phosphine such as phosphoric acid vinegar or triphenylphosphine; tetraphenyl scale a scaly compound such as tetrakis(p-phenyl)borate; an organic metal salt such as tin octylate or octanoic acid; a metal integrator or the like. These can be used alone or in combination of two or more. In addition, 'hardening accelerators can also use U-CAT SA 506, U-CAT SA 102, U-CAT 5003, U-CAT 18X, 12XD (developed products) (any one is made by Sun Apro Co., Ltd.); τρρ- κ, TPP-MK (any one is manufactured by Kitakatsu Chemical Industry Co., Ltd.); commercially available products such as χ χ ΕΤ ΕΤ ΕΤ 制 。 。 。 。 。 。 。 。 。 。 For example, 'all of the polymerizable compounds contained in the low moisture permeability tree sap composition for electronic devices relative to the 丨〇〇 part by weight, 硬化 for the accelerator; for example, 0 to 05 parts by weight, preferably It is preferably from 0.2 to 3 parts by weight, more preferably from about 25 to 25 parts by weight, based on 3 parts by weight. -24- 201211094 4 ' The amount of the agent is less than 〇. 〇 5 parts by weight, the hardening acceleration effect becomes unsatisfactory, the knife, the U shape; on the other hand, if the amount of the hardening accelerator exceeds 5 When 畲I + , I know, there is a case where the hardened material will be colored and the color tone will be deteriorated. &lt;Photoradical polymerization initiator> J. Photo-radical polymerization initiator can be exemplified by dicuminone, phenylpropanoid 3 baskets, 牟 卞 卞 dimethyl ketone, benzoin, benzoin Methyl ether, benzoin ethyl ether, benzoin isopropyl ether, dimethoxy phenyl acetophenone, diphenyl phenyl acetophenone, diethoxy phenyl ethane, diphenyl disulfide Ether, p abbreviated methyl benzoate, ethyl 4-diamine benzoate (Kayacure EPA, manufactured by Nippon Kasaku Co., Ltd.), 2,4-diethyloxysulfate (Kayacure DETX, manufactured by Sakamoto Chemical Co., Ltd.), 2-methyl 1 [4-(methyl) phenyl] 咮 基 基 丙酮 — y y y I I I I I I I I I I I I I I I I I I I I I I I I Amino-2 (4 morpholinyl) alkaloid-1-phenylpropane, etc. 2-amino-2 benzoquinone-indole-alkyl compound, tetrakis(di-butylperoxycarbonyl)diphenyl An aminobenzene derivative such as anthrone, diphenyl hydrazine, 2-hydroxy-2-methyl-1-phenyl-propane fluorenyl ketone or 4,4-diethylaminodibenzophenone; , 2,-bis(2·chlorophenyl)_4,5,4,,5,_tetraphenyl qj, ·biimidazole Imidazole compound such as B_CIM, etc.; 2,6-bis(trimethylsulfonyl)_4_(4-methoxynaphthalene, tri-farming, etc. 曱 化 三 三 三 listening compound; 2_三气曱基·5_ a halogenated oxadiazole compound such as (2 benzofuran-2-yl-vinyl) oxadiazole compound, etc. These photoradical polymerization initiators can be used singly or in combination of two or more. Further, a photo sensitizer can be added as necessary. From the viewpoints of sensitivity, chemical resistance, etc., the photoradical polymerization initiator is preferably a combination of an imidazole compound and an aminobenzene derivative, and 2-amino group_2_ Phenylhydrazine-25- 201211094 -i-phenylalkane compound, halogen compound, etc. Methylated di-hinder, _methylated oxadiazole &lt;thermal radical polymerization initiator> For example, thermal radical polymerization The starting agent can be exemplified by the right 媳g ^ &amp; class. The organic peroxide can use 氡 = peroxide 迥 迥 oxide, ketone peroxide, peroxyester #.虱化S日尊. There have been rolling 2-ethylhexyl ester, 2-tert-butylation ρ _ , a soil ·, 5 bis (2-ethylhexyl) peroxy: oxygen: ankyl Peroxybenzoic acid Acid vinegar, tertiary butyl peroxide, gas oxidized isopropyl, hydrogen over "chemical-good", 2 5- dimethyl oxidized - one propyl base, two (peroxidized tertiary butyl 2 4 _ i +Γ土_2,5·2 (tributylbutyl peroxide) hexane, ruthenium peroxide (two gas (one over-rolled secondary butyl) cumene, = tertiary butyl peroxide) )-3,3,...Base ring home, methyl ethyl peroxide, hydrazine, 1,3,3, tetramethylbutyl-2-ethylhexanoate peroxide, and the like. Further, together with the above-mentioned thermal radical polymerization initiator, it is also possible to use a combination of a naphthenic sulfonium or a octenoic acid such as cobalt naphthenate, manganese naphthenate, zinc naphthenate or cobalt octylate. a metal salt of manganese, wrong, zinc, palladium or the like. Similarly, a tertiary amine such as dimethylaniline can also be used. The light or thermal radical polymerization initiator may be used singly or in combination of two or more kinds in any ratio. The resin composition is usually used in an amount of, for example, from 5% by weight to 5 parts by weight, preferably from 0 to 5 parts by weight to 4 parts by weight. <Inorganic filler (D)&gt; The low moisture permeable resin composition for an electronic device of the present invention may further contain an inorganic filler (D). Inorganic filler (D) is not specifically limited -26- 201211094 定' can be exemplified by oxidized stone sulphate, oxidized sulphate, mica, synthetic mica, talc, oxidized mother, carbonic acid mother, oxidized error, oxidized chin, acidified lock, high ^ Soil, bentonite, diatomaceous earth, boron nitride, aluminum nitride, tantalum carbide, zinc oxide, cerium oxide, oxidized planer, magnesia, glass beads, glass fiber, graphite, cerium oxide dance, magnesium hydroxide 'hydrogen Oxidation, cellulose, etc. The inorganic filler (D) can be used alone or in combination of two or more kinds. The inorganic filler (D) can be used, for example, by the flame hydrolysis method or the flame thermal decomposition method described in International Patent Publication No. 96/3 1 572. It is manufactured by a known method such as an electric shock method. A preferred inorganic filler (9) can be a nano-dispersed sol of colloidal inorganic particles, and a commercially available product is commercially available from BAYER Co., Ltd., G〇ldschmidt Co., Ltd. (4) 2 Sol, MERCK Ti〇2 sols, purchase

Commercial products such as Si〇2, Zr〇2, Al2〇3, and §Bu 3 Sol, manufactured by Chenucals Co., Ltd., or Aerosil dispersions manufactured by EGUSSA. - The inorganic filler (D) can be modified by the modification of the surface. The surface modification of the particles can use conventional surface modifiers. For example, such a surface modifying agent can use a compound which can interact with a functional group present on the surface of the inorganic filler (D) to form a covalent bond or a complex or the like, or a compound capable of interacting with the polymer array. For example, such a surface modifying agent can have a carboxyl group in the molecule, a (first, second, third) amine group, a 4- to ammonium group, a carbonyl group, a glycidyl group, a vinyl group, a (meth) group. A compound having a functional group such as an acryloxy group or a fluorenyl group. Such surface modifiers, usually at standard temperature and pressure

In the case of a liquid, the number of carbon atoms in the molecule is, for example, 15 or less, and preferably 1 Q' is preferably a low molecular organic compound having 8 or less. The molecular weight of the low molecular organic compound of the -27-201211094 is, for example, the following, and particularly preferably 200 or less. Hereinafter, preferably 350 preferred surface modification toughness can be exemplified by formic acid &amp;&amp;, butyric acid, valeric acid, caproic acid, acryl-acetic acid, propionic acid, adipic acid, gamma, methyl propyl • crotonic acid, fumaric acid, etc., carbon number 1 to 12, maleic acid (preferably single m acid wide & ° 5 = and mono or polycarboxylic acid methyl vinegar, etc. Cjc... charm class (preferably methacrylic 1 Η I); brewing amines; B-brewed acetone, 24-: 2:, acetamidine acetic acid and Cl... In addition, it is not possible to use a conventional ceramsite coupling agent as a surface modifier. 1 The inorganic filler (9) usually has a particle diameter of from about 1 nm to about 2 Å, preferably from 0.1 nm to 100 μm. When the total content of the compound (A) and the compound (B) is 1 part by weight, the content of the inorganic filler (D) is preferably 2 to 2 parts by weight. Further, it is preferably from 1 to 1000 parts by weight. Further, the content of the inorganic filler (D) is, for example, from 5 to 95% by weight, preferably 1 based on the total amount of the low moisture-permeable resin composition for the apparatus. 〇 〇 〇 。 矽 矽 矽 矽 矽 矽 矽 矽 矽 矽 矽 矽 矽 矽 矽 矽 矽 矽 矽 矽 矽 矽 矽 矽 矽 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低 低The decane coupling agent (E). The decane coupling agent (E) is not particularly limited, and a conventionally used sulphur coupling agent can be used. For example, the sulphur coupling agent (E) is obtained from an aqueous solution of the following decane or the like. Selected among the stabilizers: tetramethoxy zephyr, tetraethoxy zebra, methyl triethoxy zebra, dimethyl di-28-201211094 ethoxy ash, 曱 r 乙Tert-Ethyl decane, vinyl triethoxy decane, vinyl trimethoxy decane, hydrazine, ruthenium hexamethylene (methoxy methoxy decane), stupyl trimethoxy decane, - hydrazine _田^ - Benyl 1-methyl decyl decane, vinyl triethyl hydrazide (IV), γ_(methyl) propylene oxypropyl triethoxy ketone, 丫 (meth) propylene 醯 methoxy propyl trimethoxy Base ·, γ_(indenyl) propylene oxime propyl methoxy methoxy calcination &gt; A y \ 3C, γ (mercapto) propylene oxypropyl . Mercapto diethoxy zephyr, 3-epoxypropyl propyl = methyl 4, m ^ methyl sulfhydryl, 3-epoxypropyl propyl dimethoxy decane, 3 oxime % rolled propyl propyl triethoxy decane, 3_

Oxypropyl propylmethyl 2 y · rA monolacyl decane, 2-(3,4-epoxycyclohexyl)ethyldimethoxy dream, idiot △ 其 - - Tajima * τ 本 ethylene Dimethoxy oxane ' 3 _ propylene oxypropyl tri methoxy oxalate, · Gan, Ν (β_amine ethyl)-γ-aminopropyl methyl dimethoxy: ^, Ν - (β-amine γ ηΛ» Ρethyl)-γ_aminopropylmethyldiethoxy decane, Ν-(β-aminoethyl)-γ _amine propyl __田祭# ay makeup base Dimethoxydecane, N_(iamineethyl)_γ_aminopropyltriethoxylate, and N-benyl-丫-aminopropyltrimethoxy decane, γ-aminopropyltrimethoxy矽, γ-aminopropyltriethoxy oxacyclohexane, 3- propyl propyl dimethoxy decane, 3- propyl propyl triethoxy decane, 3 · propyl propyl methyl dimethoxy decane, four Sulfurized bis(triethoxydecanepropyl), 3-cyanoic acid propyl triethoxy decane, and the like. The amount of the agent (Ε) relative to 100 parts by weight of the inorganic filler is preferably 〇1 to 2 〇Cao Jin ρ 尤 争 : Du: Main 2^) weighs about 1 part, more preferably ❹^ to 8 weight: The 'step-step is better than $ 〇. 5 to 5 parts by weight. If it is lower than the weight, there is a lack of cross-linking effect of the resin caused by the decane coupling agent (E), so that a dense film cannot be obtained, and the lack of adhesion to the metal substrate is poor, and it is difficult to obtain the desired economy. When the sex and anti-ironing power are more than 20 parts by weight, the water resistance and the resistance to -29-201211094 due to hydrolysis are significantly reduced, and when the film-forming property is on the road*, the s In addition, at the point of economy, it is easy to become disadvantageous. <Other Additives> In the low moisture-permeable resin composition for an electronic device of the present invention, a polymerization inhibitor, an antioxidant, a light stabilizer, a plasticizer, a flat agent, and a defoaming agent can be used as needed. Conventional six-additives for pigments, organic solvents, m and collectors, ion adsorbents, pigments, phosphors, mold release agents, and the like. + &lt;Manufacturing method of low moisture-permeable resin composition for electronic device> The low moisture-permeable resin composition for an electronic device of the present invention is obtained by uniformly mixing the above respective components. In order to obtain the low moisture permeability resin composition for an electronic device of the present invention, it is preferable to use a self-revolving stirring device: a homogenizer, a homogenizer, a planetary agitator, a 3-roll mill, a bead mill, etc. The machine is stirred, dissolved, mixed, dispersed, and the like in such a manner that the components are as uniform as possible. &lt;Cured product&gt; The low moisture permeable resin composition for an electronic device of the present invention can be cured by light. In the case of hardening by light, for example, it is possible to irradiate light of 1 000 mJ/cm 2 or more with a mercury lamp or the like. Further, the case where it is hardened by, for example, the temperature is 5 Torr, preferably 50 to 1 Q 〇〇r 90 C, further preferably 50 to 18 〇t;; for example, a hard 曰 10 to 600 minutes' It is preferably from 10 to 480 minutes, and further: it is hardened under conditions of from 15 to 360 minutes. Hardening temperature; if the lower limit of the above range is low, the hardening becomes not the opposite of the knife, and the upper limit is higher than the upper limit of the above range, because there is a case where the resin component is decomposed by -30-201211094' Any situation is not good. When the hardening temperature is high, the hardening time is shortened; and the hardening temperature is low, and the curing time can be appropriately adjusted. By curing the low moisture permeability resin composition of the electronic device of the present invention, a cured product having excellent low moisture permeability can be obtained. The cured product obtained by curing the low moisture permeable resin composition for an electronic device of the present invention has low moisture permeability and superior moisture resistance. The moisture permeability of the cured product can be obtained by measuring the moisture permeability of the cured resin of the thickness ι〇〇 μηη under conditions of 60 ° C and 90% RH in accordance with JIS L1099 and JIS Z0208. The cured product of the present invention has a moisture permeability measured by the above method, for example, 50 g / m 2 . atm · day or less (for example, 0 to 50 g / m 2 . atm · day), preferably 3 〇 g / m 2 · Atm · day or less (for example, 0 to 3 〇 g / m 2 · atm · day), further preferably 25 g / m 2 · atm · day or less (for example, 〇 to 25 g / m 2 · atm · heart illusion. The inorganic filler (D) is added, for example, 2 〇g/m2 · atm · day or less (for example, 〇 to 20 g/m 2 · atm . day), particularly preferably 15 g/m 2 · atm · day or less (for example, 〇 to 15 g / When m2 · atin · day), it is possible to further increase the moisture permeability &lt;organic electroluminescence device, electronic paper, or solar cell&gt; as an electronic device in the low moisture permeability resin composition for an electronic device of the present invention. For example, an organic electroluminescence device, an electronic paper, or a solar cell can reduce the influence of humidity in such an electronic device according to the low moisture permeability resin composition for an electronic device of the present invention. - Use a low-moisture-permeable resin to form a vapor barrier organic cell, etc. The low moisture permeability is used as a material or the like. Specifically, the moisture permeable resin composition can be used as a condition that the electronic device can be formed by curing with a low moisture permeability sealant, and the electronic device of the present invention can be used. 201211094 &lt;Closed material, sealing material&gt; The electronic device of the present invention can be used as a sealing material for a superior water-electronic paper or a solar electric component, and a low-containing sealing agent for an electronic device of the invention. The sealing material and the sealing material contained in the essential component of the invention. The conditions of the cured product and the resin composition can also be exemplified below, and the present invention will be described in more detail by way of examples. Example 1 [Synthesis of hydrogenated bisphenol quinone divinyl ether] Sodium carbonate (31.8 g, 300. benzene (537.2 g), C) was added to a 4-neck flask equipped with a Dean &amp; Stark cooling tube and a 2 L stirrer. Acid ethyl vinegar (199.9.g, 2.00mol) A (62.0g, 257.7mmol), and [IrCI(cod)]2 (5.04g, installed in an oil bath of 130 ° C and heated to reflux. Water is pumped away from the reaction system and one side After the mixture is stirred, the reaction solution is allowed to cool to room temperature. After adding water, the aqueous layer is extracted with ethyl acetate, and the aqueous layer is extracted and washed with saturated brine. Thereafter, the organic layer is separated, and the light-emitting element is cured with anhydrous sulfuric acid. The desired electron structure is obtained by making the resin composition of the present essential component low in moisture permeability and obtaining the above-mentioned hard use low moisture permeability, but not as good as the thermometer (Ommol), and the hydrogenated bisphenol (7.5 mmol), and the reaction proceeds. And 4 hours. In its liquid funnel. After the magnesium was dehydrated in the organic layer, the solvent was distilled off at -32 - 201211094 to obtain a liquid crude product. The crude product (160 ° C, 30 Pa) was purified by vacuum distillation to obtain a colorless transparent liquid of the hydrogenated bisphenol A divinyl ether represented by the following formula (3), 7.16 g (yield 95%, purity). 99%). 'H-NMR (500 MHz, CDC13) '· δ0.72-〇.76(ϊη, 6Η) ' 1.01-l_46(m,12Η), 1.70-1.76(m,3Η), 2·〇〇_2.12( m,3Η), 3 · 6 0 - 3.6 6 (m,1 H), 3 · 9 7 - 4.0 4 (m,3 H), 4 · 2 7 - 4.3 〇(d, J = 1 5 〇Hz, 2H) ' 6.31-6.34(m, 2H)

[Synthesis of [(2-phenylphenoxy)ethyl vinyl ether] A sodium 2-hydride flask equipped with a cooling tube, a stirrer and a thermometer was added with sodium hydride (55% in mineral oil) (15.4§ , 352.9111111〇1), and DMSO (510.6g) 'cooled to 〇. After the hydrazine, a solution obtained by dissolving o-phenylphenol (5 〇 6 g, 297.3 mmol) in DMSO (1 9 1.0 g) was added dropwise thereto. Thereafter, it was placed in a 6 (TC oil bath, and a solution obtained by dissolving 2·Vethyl ethyl ether (38.2 g, 358.5 mm〇l) in DMSO (61.4 g) was dropped. The reaction solution was stirred for 6 hours. After that, it was cooled to 〇, and then slowly dripped in water and quenched and transferred to a separatory funnel. The aqueous layer was extracted with ethyl acetate, and the saturated brine was added to the organic layer to be washed. Thereafter, the organic layer was separated and used. After dehydration by anhydrous sodium sulfate, the solvent was distilled off to obtain a crude liquid product, and the crude product was purified by a sulphur column chromatography (hexane/b-33-201211094 ethyl ester = 10/1). 55.5 g (yield 78%, purity 98%) of a colorless transparent liquid of the (2-phenylphenoxy)ethylethylene group scale represented by the following formula (4). H-NMR (500 MHz, CDC13) : 63.96{t, J = 5.0 Hz, 2H) ' 4.17-4.21(m,3H), 6.44 (dd, J=14.1, 6.5 Hz, 1H), 6.98-7.01(m,1H), 7.04-7,07 (m, 1H), 7.28-7.41 (m, 6H), 7.56-7.57 (m, 2H)

(4) Production Example 3 [Synthesis of bisphenol F bis(3-ethyl propylene oxide _3_ ylmethyl) ether] Addition of hydrogenation in a 4-neck flask equipped with a cooling tube, a stirrer, and a thermometer Sodium (55% in mineral oil) (13 5g, 3〇9.4mmol), DMSO (295.0g)' was cooled to (after TC, bisphenol F (25.8g, 128.9mmol) was dissolved in DMS0 (104· lg The resulting solution was dropped into it. Thereafter, it was placed in an 80 C oil bath to dissolve decylsulfonic acid _3_ethyl-3 propylene oxide methyl ester (5 〇 〇 g, 257.4 mmol). The solution obtained in DMSO (100.6 g) was added dropwise to the reaction solution for 4 hours, and then cooled to hydrazine. The hydrazine was slowly added dropwise to the water and quenched and transferred to the separatory funnel. The aqueous layer was extracted with ethyl acetate. Saturated brine was added to the organic layer and washed. Thereafter, the organic layer was separated, and the residue was removed by dehydration with anhydrous sulfuric acid to obtain a liquid crude product. This was purified by Shixi rubber column chromatography. The crude product (hexane/ethyl acetate = 2/1 - &gt; 1/1) gave the bisphenol F double (3_ •34-201211094 ethyl oxypropyl -3-) represented by the following formula (5) Colorless and transparent 38.5 g (yield 75% &gt; purity 95%) H-NMR (500 MHz, CDC13): δ 0.85 - 0.94 (m, 6 Η) ' 1.78-1.89 (m, 4 Η), 3.87-3.96 (m , 2Η), 4.03-4.05 (m, 4Η), 4.38-4.57 (m, 8H), 6.81-7.23 (m, 8H)

Production Example 4 [Synthesis of ll-bis-diethyl-2-yl (3-ethylepoxypropanol-3-ylmethyl)ether] In a 4-neck flask equipped with a cooling tube, a stirrer, and a thermometer 1' Add sodium hydride (55% in mineral oil) (6.8 layers '154.7111111〇1), and DMS 〇 (145.0g), cool to 〇t: after 'o-phenylphenol (21.9g, 128:7mm〇l) A solution obtained by dissolving in DMSO (104.1 g) was dropped thereinto. Thereafter, it was mounted in an oil bath of 80 ° C, and a solution obtained by dissolving methanesulfonic acid _3_ethyl_J-propoxyl oxime ester (25.0 g, 128.9 mmol) in DMSO (50_3 g) was added dropwise. After the reaction solution was stirred for 5 hours, it was cooled to 〇 °c, and water was slowly dropped and quenched and transferred to a separatory funnel. The aqueous layer was extracted with ethyl acetate, and saturated brine was added to the organic layer to be washed. Thereafter, the knives were separated from the organic layer, dehydrated with anhydrous magnesium sulfate, and the solvent was distilled off to obtain a crude liquid product. This crude product (hexane/ethyl acetate = 2/1 - 1/1) was purified by a silica gel column chromatography to obtain a '1-biphenyl-2-yl group represented by the following formula (6). A colorless transparent liquid of 3-ethylepoxypropyl-3-ylmercapto)ether (29.4 g, yield: 85%, purity 98%). -35- 201211094 'H-NMR (500 MHz, CDC13): 60.85 (t, J = 7.6 Hz, 3H) ' 1.75 (m, 2H), 4.10 (s, 2H), 4.40 (d, J = 6.1 Hz, 2H), 4.50 (d, J = 6.1 Hz, 2H) ' 7.10-7.25(m, 2H) &gt; 7.31-7.42(m, 5H) ' 7.51(d, J = 7.6 Hz, 2H)

Production Example 5 [Synthesis of bisphenol F divinyl ether] A 2-liter 4-liter flask equipped with a Dean &amp; Stark cooling tube, a stirrer, and a thermometer was charged with sodium carbonate (31.8 g, 300.0 mmol) and toluene ( 537.2 g), vinyl propionate (199.9 g, 2.00 mol), bisphenol F (51.6 g, 257.7 mmol), and [IrCI(cod)] 2 (5.04 g, 7.50 mmol), mounted to 1 30 ° C The water was heated and refluxed in an oil bath. The water formed by the reaction was extracted outside the reaction system and allowed to mix for 4 hours. Thereafter, the reaction solution was allowed to cool to room temperature, and water was added and then transferred to a separating funnel. The aqueous layer was extracted with ethyl acetate, and saturated brine was added to the organic layer and washed. Thereafter, the organic layer was separated and dehydrated with anhydrous magnesium sulfate, and the solvent was evaporated to give a liquid crude product. This crude product (142 ° C, 30 Pa) was purified by distillation under reduced pressure to obtain 63.0 g of a colorless transparent liquid of bisphenol F divinyl ether represented by the following formula (7) (yield 97%, purity 9 9%). 0 -36- 201211094 »H-NMR(500 MHz, CDC13) : δ 3.9 0-4.0 1 (m} 2H) ' 4.36-4.400, 2H), 4.63-4.74 (m, 2H), 6.57-6.63 (m , 2H), 6.93-7.000, 4H), 7.10-7.21 (m, 4H)

Production Example 6 [Synthesis of o-phenylphenol vinyl ether] A 4-liter four-necked flask equipped with a Dean &amp; Stark cooling tube, a stirrer, and a thermometer was charged with sodium carbonate (18.9 g, 178_3 mmol) and toluene (557.2). g), Vinyl propionate vinegar (267.5 g, 2.67 mol), o-phenyl g fraction (5 0.0 g, 293.7 mmol), and [IrCI(cod)] 2 (3.02 g, 4.5 0 mmol), ampoule to 1 Heat the reflux in an oil bath of 3 0 C. The water formed by the reaction was extracted outside the reaction system and stirred for 4 hours. Thereafter, the reaction solution was allowed to cool to room temperature, and water was added and then transferred to a separating funnel. The aqueous layer was extracted with ethyl acetate, and saturated brine was added to the organic layer and washed. Thereafter, the organic layer was separated, dehydrated with anhydrous magnesium sulfate, and the solvent was evaporated to give a liquid crude product. The crude product (240 ° C, 50 Pa) was purified by Kugelrohr vacuum distillation to obtain 52 3 g of a colorless transparent liquid of o-phenylphenol vinyl ether represented by the following formula (8) (yield 91%, Purity 99%). 'H-NMR (500 MHz, CDC13): 84.33 (d, J = 6.1 Hz, 1H) &gt; 4.59 (d5 J = 13.8 Hz, 1H) ' 6.56 (dd, J = 13.8, 6.1 Hz, 1H) ' 7.10 (d, J = 7.6 Hz, lH) '7.18(t, J = 7.6 Hz, lH) '7.31-7.35(m, 2H), 7_39-7_42(m, 3H), 7.51 (d, J = 7.6 Hz, 2H) -37- 201211094

Production Example 7 [Synthesis of bisphenol F bis(2-vinyloxyethyl)ether] A four-necked flask equipped with a cooling fin, a stirrer, and a thermometer was placed in a four-necked flask, and sodium hydride (55% in mineral oil) was added ( 3〇8g, 7〇5 8mm〇1), and DMSO (5〇9.4g) 'After cooling to ye, bisphenol F (5〇2g, 250.7nm〇1) is dissolved in DMS〇(m 6g) The solution was dropped into it. Thereafter, install to 60. (In the oil bath, a solution obtained by dissolving 2_gas ethyl vinyl ether (58.6 g, 550.0 mmol) in DMS 〇 (46 〇g) was added dropwise. After mixing the reaction solution for 4 hours, it was cooled to 〇. After that, the mixture was slowly poured into water and quenched and transferred to a separatory funnel. The aqueous layer was extracted with ethyl acetate, and the saturated aqueous sodium chloride was added to the organic layer to be washed. Thereafter, the organic layer was separated and dried over anhydrous sodium sulfate. After that, the solvent was distilled off to obtain a crude liquid product, and the crude product (hexane / ethyl acetate = 10/1) was purified by silica gel column chromatography to obtain a double represented by the following formula (9). 37.5 g (yield 44%, purity 99%) of white solid of F (bis-ethoxyethyl)ether (H-NMR (500 MHz, CDC13): 53.85 = 4.05 (m, 6 Η) ^ 4.14 -4.16(m,4Η), 4.22-4.25(m,2Η), 6.47-6_54(m,2Η), 6.80-6_89(m,2H), 7.06-7,09(m,4H), 7.12-7.16( m,4H) -38- (9) 201211094

Example 1 69.3 parts by weight of bisphenol F diglycidyl ether (trade name: RE-303S; manufactured by Nippon Kayaku Co., Ltd.), 297 parts by weight of epoxypropyl phenyl ether (trade name G〇) 〇98; manufactured by Tokyo Chemical Industry Co., Ltd.), 1 part by weight of PI-2〇74, poured into a self-revolving stirring and defoaming device (type AR-250; manufactured by Thinky Co., Ltd.), stirred, dissolved, mixed Dispersing and modulating a solution of the resin composition. Examples 2 to 4 In the amounts shown in Table 1, 矣1 _ was used as the compound (A), the compound (B), the polymerization initiator (C), the polymerization initiator (C), and the machine (not shown in Table 1). D) A solution of the resin composition was prepared in the same manner as in Example 1. Also, for the ruthenium dioxide as the inorganic filler (D), the use of decane σ Μ Μ (trade name KBM-403; Shin-Etsu Chemical Co., Ltd. π...J table) will be used under the trade name Adomafine SC4500 (Ad〇 Matechs Co., Ltd. made a surface modification. In addition, as an inorganic filler (D)

u. u π , , 』, Moonstone, use the trade name MST

Hlgh Talc; manufactured by Takehara Chemical Industry Co., Ltd. Example 5 ° In addition to the compound (B), o-phenyl SY ΟΡΓ &gt; phenoxypropyl ether (trade name: SY-OPG, Sakamoto Music Industrial Co., Ltd., manufactured by Minku Co., Ltd.) was used in place of the epoxy propyl ether. A solution in which the resin composition was prepared in the same manner as in the Example η mode was carried out. -39-201211094 Examples 6 to 8. The compound (A), the compound (B), the polymerization initiator (C), and the inorganic filler (D) shown in Table 1 were used in the amounts shown in Table 1, and In the same manner as in Example 5, a solution of a resin composition was prepared. In addition, for the cerium oxide as the inorganic filler (D), the surface of the product name: Adomafine SC4500 (manufactured by Adhematech Co., Ltd.) was used as a surface of a ruthenium coupling agent (trade name: KBM_4〇3; manufactured by Shin-Etsu Chemical Co., Ltd.). Revised as a winner. Example 9 In addition to the compound (A), 3,4,3,4-penta-5 represented by the above formula (1-3) was used (trade name "ceii〇xide 8000",

Modification of the resin composition was carried out in the same manner as in Example 5 except that the amount of the blending of the components was changed in the manner of Table 1 in place of the double-aged F diglycidyl ether. a solution of the substance. Example 10 In addition to the compound (A), the hydrogenated bisphenol A divinyl ether (formula (3)) obtained in Production Example 1 was used in place of the bisphenol f diglycidyl ether, and the compound (B) was used. (2-phenylphenoxy)ethyl vinyl ether (formula (4)) obtained in Production Example 2 was substituted for epoxy propyl ether, and compound (c) was used in place of PI-2074'. In the manner of Table 1, the solution of the resin composition was prepared in the same manner as in Example 1 except that the blending amount of each component was changed. Example 11 In place of the compound (A), the bisphenol F bis(3-ethylglycidyl-3-ylindenyl) mystery (formula (5)) obtained in Production Example 3 was used instead of the production example 1. The hydrogenated bisphenol A divinyl ether obtained, and the compound (b) is substituted with the U, biphenyl-2-yl) ether (formula (6)) obtained in the preparation of the product of the preparation of -40-2012-11094, in the production example. :; B: Glycidyl-3 -ylethylethylidene bond, such as the aryloxy group of Table i)

Further, the dissolution of the resin composition was carried out in the same manner as in the case of the first embodiment (1), and the resin composition was dissolved. Example 1 2 ' In addition to the compound (A), it was used in praise! y, / bismuth 5 obtained by the bisphenol ρ divinyl ether (formula (7)) in place of the manufacturing &lt;column i

Divinyl ether, which was used in the production example 6 and -A, , /ΟΛλ to give o-phenylphenol vinyl ether (formula (8)) to replace the frost in the production example 2, 曰f ^ , ^ A solution of the resin composition was prepared in the same manner as in Example 10 except for the obtained (2-phenylphenoxy)ethyl vinyl ether. Example 1 3 In addition to the compound (Α) used in the preparation, &amp;7; bisphenol F bis(2-vinyloxyethyl)ether (Formula (9)) obtained in Preparation Example 7 &amp; The upper layer was replaced with the solution of the resin composition in the same manner as in Example 12 except for the double-prepared F-acetyl group obtained in Production Example 5. Example 1 4 The bisphenol f bis(2-ethylene ethoxyethyl)ether (formula (9)) obtained in Production Example 7 was used instead of the yttrium compound (yield) to obtain the product obtained in Production Example 1. A solution of the resin composition was prepared in the same manner as in Example 1 except that hydrogen (tetra) fluorene was used. Example 1 5 In addition to the compound (A), bisphenol F diacrylate vinegar (synthesized product of Nard Research Co., Ltd.) was used. 'Compound (B) was obtained by using 2_(o-phenylbenzene-4 1-201211094 oxy)acrylic acid B. Ester (trade name: hrd-o 1, manufactured by Sakamoto Distillation Co., Ltd.), and compound (C) using 1,1,3,3-tetramethylbutyl-2-ethylhexanoate (product) A solution of the resin composition was prepared in the same manner as in Example 1 except that the blending amount of each component was changed as shown in Table 1 in the manner of "Per 〇 cta 〇, manufactured by Nippon Oil & Fat Co., Ltd.". Example 1 6 The same procedure as in Example 1 was carried out except that the compound (A) was a novolak epoxy propyl ether resin (a novolak type epoxy resin) (trade name: jER-152, manufactured by Mitsubishi Chemical Corporation). The solution of the resin composition is prepared in the same manner. Comparative Examples 1 to 9 Using the compound (A) shown in Table 1 and a polymerization initiator (C) in the amounts shown in Table 1, a solution of a resin composition was prepared in the same manner as in Example 2. &lt;Curing of Resin Composition&gt; The resin compositions obtained in Examples 1, 2, 4 to 9, and 16 'Comparative Examples 1 to 3, 9 were subjected to 5 〇〇〇mj / cm 2 by using a mercury lamp. The light was irradiated, followed by heating in i 00 ° C for 1 hour in a heating drier to obtain a cured product. The resin composition obtained in Example 3 '1 〇 to 15 and Comparative Examples 4 to 8 was heated at 150 C for 2 hours to obtain a cured product. &lt;Evaluation of moisture permeability&gt; The moisture permeability of the cured product was measured and adjusted to the moisture permeability of the resin slab of thickness 丨〇〇 at 60 ° C and 90% RH in accordance with JIS L1099 and JIS Z0208. -42-201211094 Table 1 shows the results of measurement of the moisture permeability of the cured product of the resin compositions obtained in Examples 1 to 16 and Comparative Examples 1 to 9. The cured product of the resin composition obtained in Examples 1 to 8 of the copolymer of the compound (A) and the compound (B) was compared with the polymer obtained by only the compound (A) (Comparative Example 1). A hard flattening of low moisture permeability can be obtained. Similarly, the cured product of Example 9 is a cured product of Comparative Example 4 and the cured product of Comparative Example 1 and the cured product of Comparative Example 1 are compared with the cured product of Comparative Example 5, and Example 12 The cured product was cured as compared with the hardened material of Comparative Example 6, the cured product of Comparative Example 7 which was subjected to "3, 14 and the hardened material of Example 15, the cured product of Comparative Example, and the cured product of Example 16," The η compound was lower in moisture permeability (low moisture permeability) than the cured product of Comparative Example 9. β不*43- 201211094 | Moisture permeability | η Β 'ωι 二*/Ί (N 〇 〇 CN 〇〇 (N N CN OS CN m 〇〇 (N 00 (N m CO 〇\ m 9 〇 (N inorganic filler) 〇D) wt% 1 s § 1 structure 1 cerium dioxide cerium dioxide talc talc dioxide day 1 1 polymerization initiator (C) wt% inch d 〇卜d 1-^ inch 〇ι-Η 1-^ FH Construction PI-2074 PI-2074 SI-60 PI-2074 PI-2074 PI-2074 PI-2074 PI-2074 i PI-2074 SI-60 SI-60 ! SI-60 SI-60 1 SI-60 Perocta 0 1 PI-2074 PI-2074 PI-2074 PI-2074 SI-60 SI-60 SI-60 SI-60 Perocta Ο PI-2074 1-functional compound (Β) wt% 29.7 11.9 On 20.8 29.7 39.6 49.5 Ο) 49.5 39.6 49.5 39.6 39.6 39.6 :39.6 29.7 1 1 1 1 1 1 1 1 1 Construction of Epoxypropyl Phenyl Ether Epoxypropyl Phenyl Epoxy Propyl Phenyl Ether Epoxypropyl Phenyl Ether O-Phenylphenol Epoxy Propyl ether o-phenylphenol epoxypropyl ether o-phenylphenol epoxypropyl ether o-phenylphenol epoxypropyl ether o-phenylphenol epoxypropyl ether phenylphenoxy) ethyl vinyl bond 1,1 biphenyl-2-yl (3-ethyl epoxypropan-3-yl) Ether o-phenylphenol epoxypropyl ether o-phenylphenol epoxypropyl ether i (2-phenyl phenyloxy) ethyl vinyl ether HRD-01 epoxy propyl phenyl ether 1 1 1 1 1 1 1 1 1 Compound with more than 2 functional groups (Α) wt% 69.3 27.7 27.7 48.5 69.3 59.4 27.7 49-5 59.4 49.5 59.4 1 59.4 59.4 L6.93 〇\ σ\ 49.5 49.5 On Os On 〇\ Os On σ\ On On 〇\ On ON On On Construction bisphenol F diglycidyl ether bisphenol F diglycidyl ether bisphenol F diglycidyl ether bisphenol F diglycidyl ether bisphenol F epoxide Propyl ether bisphenol F diglycidyl ether bisphenol F diglycidyl ether bisphenol F diglycidyl ether 3,4,3',4'-diepoxy biscyclohexyl hydrogenated bisphenol A Vinyl ether bisphenol F bis(3-ethyl propylene oxide-3-ylmercapto) ether bisphenol F divinyl ether bisphenol F bis(2-vinyloxyethyl) 3⁄4 | bisphenol F double ( 2-vinyloxyethyl)ether bisphenol F diacrylate phenol novolak type epoxy resin bisphenol F diglycidyl ether tetramethyl bisphenol diepoxypropyl ether bisphenol F diepoxypropyl Ether 3,4,3',4'-diepoxybicyclohexyl hydrogenated bisphenol A divinyl ether bisphenol F bis(3-ethyl propylene oxide-3-yl Ether bisphenol F divinyl ether bisphenol F bis(2-vinyloxyethyl) ether bisphenol F diacrylate phenol novolac type epoxy resin Example 1 Example 2 Example 3 Example 4 Implementation Example 5 Example 6 丨 Example 7 | Example 8 1 | Example 9 1 Example 10 Example 11 Example 12 Example 13 Example 14 Example 15 | Example 16 I Comparative Example 1 Comparative Example 2 Comparative Example 3 Comparative Example 4 Comparative Example 5 Comparative Example 6 Comparative Example 7 Comparative Example 8 Comparative Example 9 - inch inch 丨 201211094 [Probability of industrial use] Hardening obtained by hardening the low moisture permeable resin composition of the electronic device of the present invention The material has a superior water vapor barrier property, and can be used as a sealing material or a sealing material for an electronic component requiring low treadiness such as an organic electroluminescence device, an electronic paper, or a solar battery. Further, the low moisture permeable resin composition for an electronic device of the present invention can also be used; ... [Simple description of the schema] None. [Main component symbol description] None. -45-

Claims (1)

201211094 VII. Patent application scope: 1. A low moisture permeability resin composition for electronic devices having low moisture permeability. It is characterized by containing: 2 or more reactive functional groups in one molecule (a) The compound (A), the compound (B) having one reactive functional group (b) in one molecule and having a molecular weight of from 5 Å to 1,000, and the polymerization initiator (C). 2. The low moisture permeable resin composition for an electronic device according to the first aspect of the invention, wherein the compound (A) and/or the compound (B) have one or more cyclic skeletons. 3. A low moisture permeable resin composition for an electronic device according to the second aspect of the invention, wherein the cyclic skeleton is the same or different benzene ring or cyclohexane ring. 4. If you apply for a patent scope! The low moisture permeable resin composition for an electronic device according to any one of the preceding claims, wherein the compound (A)' is contained in an amount of from 1 to 1000 parts by weight based on 1 part by weight of the compound. 5 · If the patent application scope is 4 ji $, the low moisture permeability resin composition for the electronic device of the spear, which is relative to the compound (A) which is produced in 1 liter, and the compound (B) The content is from 1 to 25 parts by weight. 6. The low moisture permeable resin composition for an electronic device according to the second aspect of the patent application, which further comprises an inorganic filler (9). 7. The low moisture permeability resin composition for an electronic device according to any one of claims 1 to 6, which further comprises a # coupling agent (8). The low moisture permeable resin composition for an electronic device according to any one of claims 1 to 7, wherein the polymerization initiator (c) is a photo or thermal cationic polymerization initiator, or light or Thermal radical polymerization initiator. The electronically permeable resin composition according to any one of claims 1 to 8, wherein the electronic device is an optical, electronic paper or solar cell. 1 0 - a hardened material which is hardened with a low moisture permeable resin composition for an electronic device according to claim 1 to 1. 1. A blocking agent containing the first to first patents as claimed The electronic device uses a low moisture permeable resin composition. A sealant comprising the low moisture permeable resin composition for an electronic device according to the first to the first aspect of the invention. An organic electroluminescence comprising a hardened material as claimed in the patent application. 1 4. An electronic paper containing the contents as claimed in the patent application. A solar cell comprising a hardened material as claimed in the patent application. The device uses a low number of electro-acceptances to generate η. Among the 9 items, 9 of them are the 10th item. The hardening of the item is 10 -47- 201211094 4. The designated representative figure: (1) The representative representative of the case is: None. (2) A brief description of the symbol of the representative figure: None 0. If there is a chemical formula in this case, please disclose the chemical formula that best shows the characteristics of the invention: 201211094 Amendment No. 100128662 "Low moisture permeable resin composition and cured product thereof Patent case.^ (Revised on December 9, 2011) VII. The scope of the patent application: 1 · A low moisture permeability resin composition for electronic devices requiring low moisture permeability' is characterized by: i a compound (A) having two or more reactive guanyl groups (a) in the molecule, a compound (b) having a reactive functional group (b) in the i molecule and having a molecular weight of 5 Å to 1 Å (10), and Polymerization initiator (C). 2. The low moisture permeability resin composition for an electronic device according to the first aspect of the invention, wherein the compound (A) and/or the compound (B) have i or more cyclic skeletons. 3. A low moisture permeable resin composition for an electronic device according to the second aspect of the invention, wherein the δH ring skeleton is the same or a +(tetra)H α ring. 4. The low moisture permeable resin composition for electronic devices of any one of claims 1 to 3, wherein the content of the compound (Β) is relative to 100 parts by weight of the compound (Α) 1 to 1 part by weight. 5. For example, in the application of patent item 4, φ, drink t, low moisture permeability resin composition for electronic devices, wherein the compound (A), the content of the compound (B) is sealed on the tongue. It is 10 to 25 parts by weight. 6. The composition of the low moisture permeable resin for electronic discharge according to any one of the claims of the invention, which further comprises an inorganic filler (9).士 t α # Μ 低 第 第 第 第 第 第 第 第 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 8. For example, the composition of the patent application No. 1 $7, the electronic device used in any of the items 1 to 7 is modified by the 201211094 modified moisture permeable resin composition, wherein the polymerization initiator (c, &gt; ion a polymerization initiator, or a light or thermal radical '&quot;, light or heat yang. 9. An electron according to any one of claims 1 to 8 of the patent application. The first moisture permeable resin composition, wherein the electron The device is a low-element, electronic paper or solar battery for organic electricity. A hardened material obtained by hardening a low moisture permeability resin composition of an electronic device according to the first to third aspects of the patent application, wherein the sealing agent contains a sealing agent as claimed in the patent application. A low moisture permeable resin composition for an electronic device of 1 to 9 °. Medium 1 2. A type of sealant' which contains a low moisture-permeable resin composition for an electronic device according to the first to ninth aspects of the patent application. Item 乜 1 3 · An organic electroluminescence element containing a cured product as claimed in the patent application. (5) Article 1 1-4. An electronic paper containing the items of the scope of the patent application. 1. A solar cell comprising a cured product as claimed in the patent application. U item history