TW201210727A - Processing method for workpiece, dividing method for workpiece, and laser processing apparatus - Google Patents

Processing method for workpiece, dividing method for workpiece, and laser processing apparatus Download PDF

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Publication number
TW201210727A
TW201210727A TW100111704A TW100111704A TW201210727A TW 201210727 A TW201210727 A TW 201210727A TW 100111704 A TW100111704 A TW 100111704A TW 100111704 A TW100111704 A TW 100111704A TW 201210727 A TW201210727 A TW 201210727A
Authority
TW
Taiwan
Prior art keywords
processed article
processed
pulse laser
workpiece
start point
Prior art date
Application number
TW100111704A
Other versions
TWI446984B (en
Inventor
Shohei Nagatomo
Ikuyoshi Nakatani
Mitsuru Sugata
Original Assignee
Mitsuboshi Diamond Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2010146249A priority Critical patent/JP5104912B2/en
Priority to JP2010146248A priority patent/JP5104911B2/en
Priority to JP2010146247A priority patent/JP5104910B2/en
Application filed by Mitsuboshi Diamond Ind Co Ltd filed Critical Mitsuboshi Diamond Ind Co Ltd
Publication of TW201210727A publication Critical patent/TW201210727A/en
Application granted granted Critical
Publication of TWI446984B publication Critical patent/TWI446984B/en

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Abstract

The present invention provides a processing method for divided body that restrains the formation of the processing marks and capable of forming the divided start point that exactly realizes the division of the processed article. The processing method for forming divided start point on a processed article includes: a loading step of loading the processed article on a platform; a transparent substance configuration step of adjacently configuring a transparent substance, which is substantially transparency relative to the pulse laser used in the process, on the processed surface of the processed article on the platform; and an irradiation step of irradiating the pulse laser on the processed article through a manner that allows the pulse laser passing through the transparent substance and discretely forming the irradiated regions per unit pulse laser on the processed surface. The irradiated regions may be sequentially generated with the parting or cleavage for the processed article to form the start point for division on the processed article.
TW100111704A 2010-06-28 2011-04-01 Processing method for a workpiece, dividing method for a workpiece, and laser processing apparatus TWI446984B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2010146249A JP5104912B2 (en) 2010-06-28 2010-06-28 The laser processing apparatus
JP2010146248A JP5104911B2 (en) 2010-06-28 2010-06-28 Method for processing a workpiece, the division method and laser processing apparatus of the workpiece
JP2010146247A JP5104910B2 (en) 2010-06-28 2010-06-28 The method of division processing method and workpiece of the workpiece

Publications (2)

Publication Number Publication Date
TW201210727A true TW201210727A (en) 2012-03-16
TWI446984B TWI446984B (en) 2014-08-01

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW100111704A TWI446984B (en) 2010-06-28 2011-04-01 Processing method for a workpiece, dividing method for a workpiece, and laser processing apparatus

Country Status (2)

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CN (1) CN102294546B (en)
TW (1) TWI446984B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103785957A (en) * 2012-10-29 2014-05-14 三星钻石工业股份有限公司 Laser processing apparatus and method of establishing processing condition of substrate with pattern

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6036173B2 (en) * 2012-10-31 2016-11-30 三星ダイヤモンド工業株式会社 The laser processing apparatus

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4659300B2 (en) * 2000-09-13 2011-03-30 浜松ホトニクス株式会社 Method for producing a laser processing method and a semiconductor chip
JP4563097B2 (en) * 2003-09-10 2010-10-13 浜松ホトニクス株式会社 Of the semiconductor substrate cutting method
CN100481337C (en) * 2004-12-08 2009-04-22 雷射先进科技株式会社 Division starting point forming method in body to be divided, and dividing method for body to be divided
JP5183892B2 (en) * 2006-07-03 2013-04-17 浜松ホトニクス株式会社 Laser processing method
DE102006033217A1 (en) * 2006-07-14 2008-01-17 Jenoptik Automatisierungstechnik Gmbh A method for producing optically perceptible laser-induced cracks in brittle material
JP2008212999A (en) * 2007-03-06 2008-09-18 Disco Abrasive Syst Ltd Laser beam machining apparatus
JP5025391B2 (en) * 2007-08-30 2012-09-12 住友重機械工業株式会社 Laser processing apparatus and processing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103785957A (en) * 2012-10-29 2014-05-14 三星钻石工业股份有限公司 Laser processing apparatus and method of establishing processing condition of substrate with pattern

Also Published As

Publication number Publication date
CN102294546A (en) 2011-12-28
TWI446984B (en) 2014-08-01
CN102294546B (en) 2015-02-25

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