201201932 九、發明說明： 【發明所屬之技術領域】 本發明之一種具潤滑與導熱功能之鑽孔導板，主要用 於軟式印刷電路板（Flexible Printed Circuit，FPC)之 鑽孔定位的用途。除了可以將柔軟之印刷電路板壓平定位 外’並具潤滑與導熱功能，可降低孔洞之溫度，及有效潤 滑鑽頭’避免高韌性之聚亞醯胺（P〇lyimide，PI)樹脂軟 化後纏繞沾附於鑽頭表面，造成孔徑精度誤差增加，及鑽 頭清理時間之浪費。 【先前技術】 軟式印刷電路板（Flexible Printed Circuit, FPC，俗 稱軟板），具有柔軟、輕、薄及可彎曲之優點，已被廣泛應 用於可攜帶式之電子產品，如手機、手提電腦及數位相機 等。軟式印刷電路板主要由聚亞醯胺（Polyimide，PI)膜與 一面或雙面金屬銅箔所組成，中間一般可有環氧膠黏著； 許多新製程產品，則無膠料層，使尺寸安定性提升。 傳統上執行軟板鐵孔加工時，會將軟板以低強度之膠料 固定於一基材上，使其平整以利定位加工。然而，鑽頭之 強大扭力，仍舊會造成軟板局部形變與位移。有時會在鑽 孔裝備上設計壓腳，以固定軟板及提升精度。 由於軟板基材為韌性極佳之聚亞酿胺（Polyimide，pi) 樹脂，在塑膠材料中，屬於高耐溫高玻璃轉化溫度之材料 (Glass transition temperature, Tg)，然而，鑽孔時產 201201932 生之高溫，若未加以散熱，會導致聚亞醯胺融熔，然後纏 繞沾附於鑽頭表面，造成孔徑精度誤差增加，及鑽頭清理 時間之浪費。 日本專利jP2〇〇3332742A改善錯孔操作性，犧牲軟板 之柔軟性，採用多層式半柔軟之印刷電路板設計，内層柔 軟外層則為環氧樹脂之硬質材料，如此雖可改善鑽孔位置 的精準度。而日本專利jP2〇〇2252469A則利用高勁度 (modulus)的膠，製作成雙面銅箔之三明治結構，增加整體 • 材料勁度，以提升鑽孔時之便利性，但兩者皆犧牲了軟板 最珍貴的柔軟特性。 曰本專利JP09199632A中揭示，鑽孔時在軟板表面， 加一絕緣膜，再加一金屬板協助導熱，然而金屬板材厚 重，操作性不佳，且絕緣層一般具低導熱性，在無潤滑劑 的情形下’無法散去累積在軟性印刷電路板上之熱量因 此，仍有聚亞醯胺樹脂軟化後纏繞沾附於鑽頭之現象。 曰本日立化學公司（Hitachi Chemical co.) • JP2004009270A專利，則揭示一種以熱塑性板材加金屬膜的 鑽孔導板’以板材扮演壓腳，避免軟板受扭力之影響，導 板上並有金屬薄膜協助鑽孔之導熱，然而，為了鑽孔時定 位之精碟性’金屬膜與熱塑性板材需平整貼附，製作成本 較高。且導板需有足夠厚度與勁度，以滿足使用時之操作 方便性’如此表層之金屬膜往往不足以散去低導熱性之熱 塑性板與軟板之聚亞醯胺的溫度，因此仍有聚亞醯胺軟化 201201932 後纏繞沾附於鑽頭表面，造成孔徑精度誤差增加之問題。 美國專利USP-4781495及USP-4929370中揭示，利用 鑽孔機在印刷電路板上製造傳導孔時，以紙張浸潰水溶性 潤滑劑所形成之片材，放置於電路板之一侧或兩侧，協助 潤滑鑽針，減少熱量之產生及電路板孔邊材料之變質，更 能減少斷針之機率。此水溶性潤滑劑係為合成蠟之混合 物，其包括二元醇諸如二乙二醇或二丙二醇及脂肪酸與非 離子性表面活性劑所形成。中華民國專利TWHue?更 • 進一步將此水溶性潤滑劑塗佈於鋁箔上。鋁箔之強度使潤 滑用之片材之操作性增加，鋁箔更進一步協助將鑽孔時產 生之熱量帶走。然而，針對軟式印刷電路板鑽孔時所面臨 之位移、變形與水溶性潤滑劑對聚亞醯胺（Polyiraide，ρι) 樹脂之潤溼性（wett i ng)不佳，造成纏繞沾附於鑽頭表面 之問題則不適用。 【發明内容】 • 如第1圖所示，軟式印刷電路板主要由聚亞醯胺 (Polyimide，PI)膜（1)與一面或雙面金屬銅箔（2)所組成。 為了解決軟式印刷電路板鑽孔時，鑽頭之強大扭力，造成 軟板局部形變與位移的問題◊本發明採用高勁度之金屬或 高分子材料當壓板（3)，以提升軟板鑽孔之精度。 本發明的主要目的在於，改善軟式印刷電路板鑽孔 時，低導熱性之聚亞醯胺融熔後纏繞沾附於鑽頭表面’造 201201932 成孔徑精度誤差增加之問題，本發明採用具導熱功能之固 態水溶性潤滑層（4)，因鑽頭（5)產生的熱將導熱潤滑層融 溶’隨著鑽頭（5 )流入錢頭和聚亞醯胺材料之接觸面，潤滑 界面避免過度磨擦過熱，並有效降低孔洞周圍聚亞醯胺材 料的溫度，如此熱能不會因使用金屬基板時之絕緣膜或塑 膠導板之低熱傳性質，而持續累積熱量，導致聚亞醯胺樹 脂缠軟化及沾附於鑽頭表面之問題》 本發明的另一目的在於’解決水溶性潤滑劑對聚亞醯 鲁 胺（Polyimide，PI)樹脂之潤渔性（wetting)不佳，造成聚 亞醯胺軟化後纏繞沾附於鑽頭表面，本發明之固態水溶性 潤滑層，更藉由介面活性劑之改質，控制固態水溶性潤滑 材料之對水的表面接觸角介於60度至90度之間，使固態 水溶性潤滑層融化後，能充分的披覆在聚亞醯胺上，以達 到表面潤滑與冷卻，以致於不會纏繞沾附於鑽頭表面。 本發明的另一目的在於，改善固態水溶性潤滑材料之 導熱效果，更藉由添加導熱材料之粉末，以協助散熱。常 • 用之導熱添加劑有奈米或亞微米級氮化鋁粉體、六方氮化 硼、碳粉、鋁粉及以上之組合，以5%至3〇%的比例添加到 到固態潤滑層配方中，使潤滑層材料中的導熱率從原來的 瓦每米絕對度（w/mK)提高到〇 7至5w/mK。 為了達到此一目的，本發明之材料配方由水溶性樹脂 與水不溶性潤滑劑組成，藉著界面活性劑使兩者形成均— 相藉由調整水溶性樹脂與水不溶性潤滑劑之比例，再以 201201932 適量之界面活性劑使其乳化分散，即可得到不同程度親水 性之水溶性潤滑劑配方。此材料配方，則有較多之水不溶 性潤滑劑，其黏度範圍介於 50至 200百分泊 (centipoises)，可調整其表面之水接觸角介於60度至 90度之間。 本發明中使用之水溶性樹脂並無特殊之限制，只要樹 脂之軟化溫度介於30°C至150°C之間皆可以。他也可以是 許多不同軟化點的材料混掺物。常用之材料包括聚乙二 醇、聚丙二醇、聚環氧乙烷、聚還氧丙烯、聚丙烯醯胺、 聚丙烯酸鈉、羧甲基纖維素、聚四亞曱基二醇及聚醚酯等， 可以單獨或組合使用。 本發明中使用之低親水性的潤滑劑，主要是脂肪酸 類，例如：月桂酸、棕櫚酸、硬脂酸等和高分子量酯類如 十四酸十四酯、十四酸十六酯等；及脂族烴為基礎之化合 物，例如：液態石蠟烴、聚乙烯蠟等。 本發明中使用之界面活性劑，主要包含陽離子型、陰 離子與非離子型。陽離子界面活性劑，例如：十六烷基三 甲基漠化敍 Cetyl trimethylammonium bromide (CTAB)、 十六烧基三甲基溴化敍hexadecyl trimethyl ammonium bromide 及其他 四級敍鹽 alkyltrimethylamraonium salts ' 西0比氣敍 Cetylpyridinium chloride (CPC)、氣 化苯二甲烴敍Benzalkonium chloride (BAC)或苄索氣敍 Benzethonium chloride (BZT)。陰離子界面活性劑，例如： 201201932201201932 IX. Description of the Invention: [Technical Field] The present invention relates to a drill guide having a lubricating and heat conducting function, which is mainly used for drilling and positioning of a Flexible Printed Circuit (FPC). In addition to flattening the flexible printed circuit board, it has the function of lubrication and heat conduction, which can reduce the temperature of the hole and effectively lubricate the drill bit. Avoid the high toughness of the P〇lyimide (PI) resin after softening and winding. Adhering to the surface of the bit causes an increase in the accuracy of the aperture accuracy and a waste of the cleaning time of the bit. [Previous Technology] Flexible Printed Circuit (FPC), which is soft, light, thin and flexible, has been widely used in portable electronic products such as mobile phones and laptops. Digital camera, etc. The flexible printed circuit board is mainly composed of a polyimide (PI) film and one or double-sided metal copper foil, and the epoxy resin is generally adhered in the middle; many new process products have no rubber layer, so that the size is stable. Sexual improvement. Traditionally, when the soft hole processing is performed, the soft board is fixed to a substrate with a low-strength rubber material, which is flattened for positioning processing. However, the strong torque of the drill bit still causes local deformation and displacement of the soft plate. Presser feet are sometimes designed on the drilling equipment to secure the soft board and improve accuracy. Since the soft board substrate is a polyimide (Polyimide, pi) resin with excellent toughness, it is a high temperature-resistant glass transition temperature (Tg) in plastic materials. However, it is produced during drilling. 201201932 The high temperature of the heat, if not dissipated, will cause the polyamine to melt, and then entangled and adhered to the surface of the drill bit, resulting in an increase in the accuracy of the aperture accuracy and waste of the cleaning time of the drill bit. Japanese patent jP2〇〇3332742A improves the hole-operating operation, sacrificing the softness of the soft board, adopting a multi-layer semi-soft printed circuit board design, and the inner soft outer layer is a hard material of epoxy resin, so that the drilling position can be improved. Precision. The Japanese patent jP2〇〇2252469A uses a high-density (modulus) glue to make a double-sided copper foil sandwich structure, which increases the overall material stiffness to improve the convenience of drilling, but both sacrifice. The most precious softness of the soft board.曰 JP09199632A discloses that when drilling, on the surface of the soft board, an insulating film is added, and a metal plate is added to assist heat conduction. However, the metal plate is heavy and has poor operability, and the insulating layer generally has low thermal conductivity and is not lubricated. In the case of the agent, it is impossible to dissipate the heat accumulated on the flexible printed circuit board. Therefore, there is still a phenomenon in which the polyimide resin is softened and entangled and adhered to the drill bit. Hitachi Chemical Co. • JP2004009270A patent discloses a drilled guide plate with a thermoplastic sheet and a metal film. The plate is used as a presser foot to prevent the soft plate from being affected by the torsion. The guide plate has metal. The film assists in the heat conduction of the drill hole. However, in order to locate the fine disc, the metal film and the thermoplastic sheet are required to be flat and attached, and the manufacturing cost is high. And the guide plate needs to have sufficient thickness and stiffness to meet the ease of operation in use. The metal film of the surface layer is often insufficient to dissipate the temperature of the low thermal conductivity thermoplastic sheet and the soft plate polyamine, so there is still Polyimine softens 201201932 and wraps on the surface of the drill bit, causing an increase in the accuracy of the aperture accuracy. U.S. Patent No. 4,681, 495 and U.S. Patent No. 4,929, 370, the disclosure of each of which is incorporated herein by reference in its entirety, the entire entire entire entire entire entire entire entire entire- It helps to lubricate the drill pin, reduce the generation of heat and the deterioration of the material of the hole edge of the circuit board, and can reduce the probability of broken needle. The water-soluble lubricant is a mixture of synthetic waxes including a glycol such as diethylene glycol or dipropylene glycol and a fatty acid and a nonionic surfactant. Republic of China Patent TWHue? More • Further apply this water-soluble lubricant to aluminum foil. The strength of the foil increases the operability of the sheet for lubrication, and the foil further assists in carrying away the heat generated during drilling. However, the displacement, deformation and water-soluble lubricants that are faced with the drilling of flexible printed circuit boards are not good for the wettability of polyimide (Polyiraide, ρι) resin, causing the entanglement to adhere to the drill bit. The problem of the surface does not apply. SUMMARY OF THE INVENTION • As shown in Fig. 1, a flexible printed circuit board is mainly composed of a polyimide (PI) film (1) and a one-sided or double-sided metal copper foil (2). In order to solve the problem of local deformation and displacement of the soft plate when drilling the flexible printed circuit board, the present invention adopts high-strength metal or polymer material as the pressing plate (3) to improve the drilling of the soft board. Precision. The main object of the present invention is to improve the problem that the aperture of the low thermal conductivity polytheneamine is entangled and adhered to the surface of the drill bit when the hole is drilled in the flexible printed circuit board, and the error of the aperture precision is increased. The invention adopts the heat conduction function. The solid water-soluble lubricating layer (4) melts the heat-conductive lubricating layer due to the heat generated by the drill bit (5). As the drill bit (5) flows into the contact surface of the head and the polyimide material, the lubrication interface avoids excessive friction and overheating. And effectively reducing the temperature of the polytheneamine material around the hole, so that the heat energy does not continue to accumulate heat due to the low heat transfer property of the insulating film or the plastic guide plate when the metal substrate is used, resulting in the softening and sticking of the polyamidamide resin The problem attached to the surface of the drill bit" Another object of the present invention is to solve the problem that the water-soluble lubricant has poor wetting property on the polyimide (PI) resin, resulting in the softening of the polyamidamine. Adhered to the surface of the drill bit, the solid water-soluble lubricating layer of the present invention is further modified by an surfactant to control the surface contact angle of the solid water-soluble lubricating material to water of 60 To 90 degrees, the solid water-soluble lubricant layer after the thawing, the fully coated on polyalkylene Amides, to achieve lubrication and cooling to the surface, so that the wound does not buildup on the face of the bit. Another object of the present invention is to improve the heat conduction effect of the solid water-soluble lubricating material, and to further assist the heat dissipation by adding a powder of the heat conductive material. Frequently used thermal conductivity additives are nano or sub-micron aluminum nitride powder, hexagonal boron nitride, carbon powder, aluminum powder and a combination of the above, added to the solid lubricant layer formula in a ratio of 5% to 3% The thermal conductivity in the lubricating layer material is increased from the original wattage per meter absolute (w/mK) to 〇7 to 5w/mK. In order to achieve the above object, the material formulation of the present invention consists of a water-soluble resin and a water-insoluble lubricant, and by means of a surfactant, the two are formed into a homogenous phase by adjusting the ratio of the water-soluble resin to the water-insoluble lubricant, and then 201201932 A proper amount of surfactant can be emulsified and dispersed to obtain a water-soluble lubricant formulation with different degrees of hydrophilicity. This material formulation has a large number of water-insoluble lubricants with a viscosity range of 50 to 200 centipoises and a water contact angle of between 60 and 90 degrees. The water-soluble resin used in the present invention is not particularly limited as long as the softening temperature of the resin is between 30 ° C and 150 ° C. He can also be a blend of materials for many different softening points. Commonly used materials include polyethylene glycol, polypropylene glycol, polyethylene oxide, polyoxypropylene, polypropylene decylamine, sodium polyacrylate, carboxymethyl cellulose, polytetradecyl diol and polyether ester. , can be used alone or in combination. The low hydrophilic lubricant used in the present invention is mainly a fatty acid such as lauric acid, palmitic acid, stearic acid or the like and a high molecular weight ester such as tetradecyl myristate or hexadecyl myristate; And aliphatic hydrocarbon-based compounds such as liquid paraffin hydrocarbons, polyethylene waxes, and the like. The surfactant used in the present invention mainly comprises a cationic type, an anion type and a nonionic type. Cationic surfactants, such as: cetyl trimethylammonium bromide (CTAB), hexadecyl trimethyl ammonium bromide and other four-stage alkyltrimethylamraonium salts Cetylpyridinium chloride (CPC), gasified phthalic acid Benzalkonium chloride (BAC) or benzethium chloride (BZT). Anionic surfactants, for example: 201201932
十二院基硫酸鈉Sodium lauryl sulfate (SLS)、十二燒基 硫酸納 sodium dodecyl sulfate (SDS 或 NaDS)聚氧乙 稀烧基硫酸納Sodium laureth sulfate、十二院基醚硫酸 納 sodium lauryl ether sulfate (SLES)、炫•基苯績酸納 Alkyl benzene sulfonate 、全氟辛酸 Perfluorooctanoic acid (PFOA)、全氟辛基績酸 Perfluorooctanesulfonic acid (PFOS)或酯肪酸鹽。非離子型介面活性劑，例如： 山梨聚糖單月桂酸酯、山梨聚糖烷基酯及山梨聚糖單硬脂 酸酯。界面活性劑用量佔0.1至10重量百分比。 本發明與現有技術相比具有明顯的優點和有益效果。 由以上技術方案可知，本發明的主要技術内容如下： 1. 除了採用金屬或高分子板扮演壓腳之功能’更結合低污 染之水溶性固態潤滑層，以降低鑽頭與軟性印刷電路板 界面產生之熱量與溫度。 2. 本發明之調整一般水溶性固態潤滑層之親水特性’使水 溶性固態潤滑層水溶性固態潤滑層能充分潤溼聚亞醯 胺，而達到有效潤滑之效果。 3. 本發明之水溶性固態潤滑層，含有高導熱添加劑’因此 可在鑽頭與軟性印刷電路板界面’充分潤溼、潤滑與散 熱。 【實施方式】 201201932 此一導熱固態水溶性潤滑層，主要是表面以脂肪酸類如 月桂酸、棕櫚酸、硬脂酸等和高分子量酯類如十四酸十四 酯、十四酸十六酯等經界面活性劑乳化改質成塗料，此實施 例中使用乳化之十四酸十六酯塗料。藉由組成材料之比例調 整，可控制材料之水接觸角介於70度至90度之間。在此 實施例中選用之材料配方，在25°C及相對濕度55%下，其接 觸角介於83.2°至80.5。；放置於相對濕度85% 一小時 後’接觸角介於78. 6°至76. 2。。此固態潤滑層配方中，包 • 括10%亞微米級氮化鋁導熱粉體，潤滑層材料的導熱率從原 來的0.5瓦每米絕對度（w/mK)提高到5W/mK。 以上所述，僅是本發明的較佳實施例而已，並非對本發明 作任何形式上的限制’雖然本發明已以較佳實施例揭露如 上，然而並非用以限定本發明，任何熟悉本專業的技術人員， 在不脫離本發明技術方案範圍内，當可利用上述揭示的方法 及技術内容作出些許的更動或修飾為等同變化的等效實施 例’但凡疋未脫離本發明技術方案的内容，依據本發明的技 鲁術實質對以上實施例所作的任何簡單修改、等同變化與修 飾’均仍屬於本發明技術方案的範圍内。 【圖式簡單說明】 為讓本發明之上述和其他目的、特徵、優點與實施例能更 明顯易懂，所附圖式之詳細說明如下： 第1圖係繪示本發明之一種具潤滑與導熱功能之鑽孔導板 201201932 的結構示意圖。 【主要元件符號說明】 1. 聚亞醯胺樹脂膜 2. 銅箔 3. 基板 4. 水溶性固態潤滑層 5. 鑽頭Sodium lauryl sulfate (SLS), sodium dodecyl sulfate (SDS or NaDS) sodium sulphate sodium, sodium lauryl ether sulfate (SLES), Alkyl benzene sulfonate, perfluorooctanoic acid (PFOA), perfluorooctanesulfonic acid (PFOS) or fatty acid salt. Nonionic surfactants such as: sorbitan monolaurate, sorbitan alkyl ester and sorbitan monostearate. The amount of surfactant used is from 0.1 to 10% by weight. The present invention has significant advantages and advantageous effects over the prior art. It can be seen from the above technical solutions that the main technical contents of the present invention are as follows: 1. In addition to the function of using a metal or polymer plate to act as a presser foot, a combination of a low-pollution water-soluble solid lubricating layer is used to reduce the interface between the drill bit and the flexible printed circuit board. Heat and temperature. 2. The hydrophilic property of the generally water-soluble solid lubricating layer of the present invention is adjusted to make the water-soluble solid lubricating layer of the water-soluble solid lubricating layer sufficiently wet the polyamine to achieve an effective lubricating effect. 3. The water-soluble solid lubricating layer of the present invention contains a highly thermally conductive additive' so that it can be sufficiently wetted, lubricated and dissipated at the interface between the drill bit and the flexible printed circuit board. [Embodiment] 201201932 This heat-conductive solid water-soluble lubricating layer is mainly composed of fatty acids such as lauric acid, palmitic acid, stearic acid and the like and high molecular weight esters such as tetradecyl myristate and hexadecyl myristate. The emulsion is modified into a coating by emulsification of the surfactant. In this embodiment, an emulsified hexadecyl octadecamate coating is used. By adjusting the proportion of the constituent materials, the water contact angle of the controllable material is between 70 and 90 degrees. The material formulation selected in this example has a contact angle of 83.2° to 80.5 at 25 ° C and a relative humidity of 55%. The contact angle is between 78. 6° and 76.2. . This solid lubricant layer formulation includes 10% sub-micron aluminum nitride thermal powder. The thermal conductivity of the lubricant layer material is increased from the original 0.5 watts per meter absolute (w/mK) to 5 W/mK. The above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention, A person skilled in the art can make a few changes or modifications to the equivalent embodiment by using the methods and technical contents disclosed above without departing from the technical scope of the present invention. It is still within the scope of the technical solution of the present invention to make any simple modifications, equivalent changes and modifications of the above embodiments. BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features, advantages and embodiments of the present invention will become more <RTIgt; Schematic diagram of the hole guide 201201932 of the heat conduction function. [Explanation of main component symbols] 1. Polyimide resin film 2. Copper foil 3. Substrate 4. Water-soluble solid lubricating layer 5. Drill bit