TW201142325A - Inspection method and inspection apparatus for circuit substrate - Google Patents

Inspection method and inspection apparatus for circuit substrate Download PDF

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Publication number
TW201142325A
TW201142325A TW100107225A TW100107225A TW201142325A TW 201142325 A TW201142325 A TW 201142325A TW 100107225 A TW100107225 A TW 100107225A TW 100107225 A TW100107225 A TW 100107225A TW 201142325 A TW201142325 A TW 201142325A
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Taiwan
Prior art keywords
inspection
contact
probe
terminal
target
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TW100107225A
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Chinese (zh)
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TWI436078B (en
Inventor
Kengo Tsuchida
Keiichiro Sasamine
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Yamaha Fine Tech Co Ltd
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Priority to JP2010050432A priority Critical patent/JP2011185702A/en
Application filed by Yamaha Fine Tech Co Ltd filed Critical Yamaha Fine Tech Co Ltd
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Publication of TWI436078B publication Critical patent/TWI436078B/en

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R27/00Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
    • G01R27/02Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
    • G01R27/08Measuring resistance by measuring both voltage and current
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0266Marks, test patterns or identification means
    • H05K1/0268Marks, test patterns or identification means for electrical inspection or testing

Abstract

In an electrical inspection method/apparatus for performing an electrical inspection in which an inspection probe having a probe needle at a distal end moves toward a circuit substrate having a plurality of terminals, a plurality of representative terminals surrounding an inspected terminal is selected, so that the inspection probe moves toward each of the representative terminals so as to detect a position, at which electrical conduction with the probe needle is detected, as a contact position of the inspection probe. Interpolation is performed on the contact position of the inspection probe with respect to each of the representative terminals; a depression value necessary for a further movement of the inspection probe from the contact position to the inspected terminal is added, so that a target move position of the inspection probe is calculated. The inspection probe moves toward the target move position so as to perform an electrical inspection on the inspected terminal. Thus, regardless of dispersions of thickness and warp/waviness occurring on a circuit substrate, it is possible to perform an electrical inspection in which the inspection probe precisely comes in contact with the inspected terminal as it is adapted to non-linear displacements occurring on the surface of a circuit substrate.

Description

201142325 六、發明說明: 【發明所屬之技術領域】 本發明係關於一種使檢查探測器接觸於電路基板之檢查 點而進行電性檢查(例如導電檢查、絕緣檢查、靜電電容 或阻抗測定)之檢查方法及檢查裝置。 本申請案係基於2010年3月8曰於曰本所申請之專利申請 案2010-5 0432號,且主張優先權之權益者,此處引用其内 容。 【先前技術】 於對電路基板進行電性檢查之情形時,可進行使檢查探 測器接觸於電路基板之檢查點(例如導體端子)而通電之處 理。於該電性檢查中,重要的是使檢查探測器確切地接觸 於電路基板之檢查點。近年來,作為電路基板之電性檢查 方法及裝置,開發有各種技術,可列舉專利文獻1至專利 文獻6。 專利文獻1:曰本專利特開2008-261678號公報 專利文獻2:曰本專利第2718754號公報 專利文獻3:日本專利特開2002-48815號公報 專利文獻4:日本專利特開2003-172746號公報 專利文獻5:日本專利特開2005-233738號公報 專利文獻6:日本專利第3625813號公報 專利文獻1揭示有一種檢查探測器接觸偵測機構及電路 基板檢查裝置’使2根探針同時接觸於檢查對象之電路基 板中之同一被測定圖案,測定該被測定圖案中之探針相互 151254.doc 201142325 1的電阻值,並且壓入檢查探測器直至所測之電阻值為檢 一需要之谷許電阻值以下為止,藉此偵測向被測定圖案之 接觸狀態°此處’作為檢查探測器可使用四端子者,每次 使用其中之2根探針偵測接觸狀態。 專利文獻2揭示有—種基板之檢查方法與檢查裝置,使 包含成對之2根探針之檢查探測器(探針)分別接觸於電路基 板之2個端子,藉由四端子測量法而測定端子間之電阻 值。為了使檢查探測器接觸於電路基板之端子時之接觸力 適當化,藉由2根探針間之導通而對複數個端子求出探針 接觸位置,使該算術平均值為接觸點,自該接觸點以可得 到相當於適當接觸力之變形量之壓入量而使檢查探測器接 觸於電路基板之端子,從而測定該端子間之電阻值。 專利文獻3至專利文獻6係關於一種用於電路基板之電性 檢查之4双查探測器者,檢查探測器之探針藉由板彈簧等彈 性構件而支撐,於使探針接觸於電路基板之端子時,若藉 由電路基板之表面之凹凸而規定值以上之接觸反作用力作 用於探針,則藉由彈性構件而使探針退避。 於多數個端子形成於電路基板上之情形時,若使用如專 利文獻1般使檢查探測器接觸於每個端子從而測量電阻值 之接觸偵測方法,則操作繁雜且耗費時間。 又,檢查對象之電路基板亦存在沿著其面方向產生厚度 之不均或翹曲/起伏等之情形,較困難的是使檢查探測器 適當地接觸於所有檢查對象端子。 對存在尺寸或形狀之不均(或形狀之異常)之電路基板, 151254.doc 201142325 可應用專利文獻2,以藉由複數個端子之導通偵測而求出 之算術平均值之接觸點為基準而使檢查探測器接觸於檢查 對象端子。然而,專利文獻2中認為某種程度上可對應電 路基板之表面之線性變化/不均,但於如電路基板之厚度 之不均或翹曲/起伏等電路基板之表面之變化/不均為非線 性之情形時,無法使檢查探測器恰當地追隨檢查對象端 子。由此’專利文獻2無法實施正確的電性檢查。 為對應如上述之電路基板之表面之非線性變化/不均, 如專利文獻3至專利文獻6所揭示般,於規定值以上之接觸 反作用力作用於檢查探測器時,需要具備使探針退避之機 構。由此,需要採用結構複雜且高價之檢查探測器實施電 路基板之電性檢查。 本發明係鑒於如此之情況而成者,且提供一種檢查方法 及檢查裝置,其係即使於沿著電路基板之面方向產生厚度 之不均或翹曲/起伏之情形時,亦可適當對應電路基板之 表面之非線性變化/不均而實施正確的電性檢查者。 又,本發明係提供一種可採用具有簡單結構、廉價之檢 查探測器簡易地進行電路基板之檢查操作之檢查方法及檢 查裝置。 【發明内容】 本發明係關於一種使用頂端具有探針之檢查探測器對形 成有複數個端子之電路基板實施電性檢查之檢查方法者, 其包括:接觸位置偵測步驟,其係選擇複數個代表端子, 並使檢查探測器朝該代表端子移動,將藉由探針偵測導通 151254.doc • 6 · 201142325 之位置作為檢查探測器之接觸位置而偵測;移動目標位置 計算步驟,其係對相對於接近檢查對象端子之複數個代表 端子之檢查探測器的接觸位置進行内插運算,自檢查探測 器之接觸纟置起朝向檢查對象端子加丨需要之壓入量而計 算出移動目標位置;及電性檢查步驟,其係將檢查探測器 移動至移動目標位置而對檢查對象端子進行電性檢查。 專利文獻2所記載之方法中,使檢查探測器接觸於電路 基板上之端子而實施電性檢查時,需要以適當之接觸力使 檢查探測器接觸於端子。然而,於沿著電路基板之面方向 產生厚度之不均或翹曲/起伏之情形時,較困難的是使檢 查探測器適當地接觸於特定之端子。為解決該問題,本發 明中預先偵測相對於代表端子之檢查探測器之接觸位置, 選擇接近檢查對象端子之複數個代表端子並使該接觸位置 為基準。藉此,可將電路基板上由於厚度之不均或翹曲/ 起伏而引起之非線性移位或檢查上之影響限定於由複數個 代表端子所包圍的較小範圍内,且於該較小範圍内藉由内 插運算而決定檢查探測器之向檢查對象端子移動之目標移 動位置,因此,與先前技術相比,可使檢查探測器正確地 定位於檢查對象端子並適當地接觸於檢查對象端子。又, 無需進行如直接偵測檢查探測器之向檢查對象端子移動之 接觸位置之複雜的偵測步驟,可不使檢查探測器迅速地線 性移動至檢查對象端子而於短時間内正確地實施電性檢 查。 於本發明之檢查方法中,亦可簡化移動目標位置計算步 151254.doc 201142325 驟’於接觸位置偵測步驟之後,將檢查探測器自相對於複 數個代表端子之檢查探測器之接觸位置起移動至朝向檢查 對象端子加上需要之壓入量之移動目標位置為止,對檢查 對象端子進行電性檢查之電性檢查步驟。 即’並不基於預先偵測之檢查探測器與代表端子之接觸 位置而計算出向檢查對象端子之移動目標位置,將檢查探 測器自與代表端子之接觸位置起連續移動至檢查對象端子 為止而進行電性檢查。藉此,可1次解決檢查探測器與端 子之接觸操作,從而可有效地實施電性檢查。 於上述接觸位置偵測步驟中,亦可藉由偵測接觸於代表 端子之檢查探測器之探針之間的電阻為特定之閾值以下, 而偵測相對於代表端子之檢查探測器之接觸位置。藉此, 可確切地偵測導通從而正確地偵測檢查探測器與代表端子 之接觸位置。 本發明係關於一種使用頂端具有探針之檢查探測器對形 成有複數個端子之電路基板實施電性檢查的電性檢查裝置 者,其包括:基台,其係將電路基板支撐於特定位置;移 動機構,其係使檢查探測器朝電路基板上之所期望之端子 移動;接觸位置偵測部,其係選擇複數個代表端子,偵測 該代表端子與檢查探測器之探針之導通而偵測檢查探測器 之接觸位置,移動目標位置計算部,其係、對相對於接近檢 查對象端子之複數個代表端子之檢查探測器的接觸位置進 行内插運算,自檢查探測器之接觸位置起朝向檢查對象端 子加上需要之壓入量而計算出檢查探測器之移動目標位 I5I254.doc 201142325 置,及電性檢查部’其係將檢查探測器移動至移動目標位 置為止而對檢查對象端子進行電性檢查。 又’接觸位置偵測部包括··導通偵測部,其係偵測接觸 於代表端子之檢查探測器之探針間之電阻為特定的電阻值 以下’及位置檢測部,其係將該導通偵測部偵測出導通時 之位置作為檢查探測器之接觸位置而進行檢測。 具體而言’至少3個代表端子接近配置於檢查對象端 子’以三角形或矩形狀之區域劃分檢查對象端子,對相對 於配置於該區域之頂點之代表端子之上述檢查探測器的接 觸位置進行内插運算’自檢查探測器之接觸位置起朝向檢 查對象端子加上需要之壓入量而計算出檢查探測器之目標 移動位置。 如上述般,選擇包圍電路基板上之檢查對象端子之代表 端子並偵測代表端子與檢查探測器之接觸位置,實施内插 運算’自檢查探測器之接觸位置起對檢查對象端子加上需 要之壓入量而計算出移動目標位置,因此,可將藉由電路 基板之面方向之不均或翹曲/起伏而將非線性移位局部 化’可正確地計算出檢查探測器之移動目標位置,從而可 提高電性檢查之精度。又,藉由探針之導通而檢查探測器 之接觸位置之偵測只要僅對預先選擇之代表端子進行即 可,從而可簡化操作’且可迅速地實施電性檢查。又,由 於可適當地對應電路基板之面方向之不均或翹曲/起伏, 因此,檢查探測器本身無需包含避開反作用力之機構,從 而亦可簡化檢查探測器之結構,且可廉價地製造。 151254.doc 201142325 【實施方式】 參照隨附圖式與實施例一起說明本發明。 圖2係本發明之一實施例之電路基板之檢查裝置i的平面 圖。圖3係圖2之A-A箭頭方向觀察之縱剖面圖。該檢查裝 置1係相對電路基板2上之端子3依序移動檢查探測器4並使 其接觸而實施電性檢查之飛行方式的檢查裝置。該檢查裝 置1係可使用複數個配設於電路基板2之表面側及背面側之 檢查探測器4進行電路基板2的兩面上之電性檢查。具體而 言’ 一對上侧檢查探測器4設置於藉由支撐架5於特定之高 度保持水平之基台6之上方且可沿著X方向、γ方向及乙方 向移動,並且一對下側檢查探測器4設置於基台6之下方且 可沿著X方向、Y方向及z方向移動。由於該等檢查探測器 4均具有相同結構,因此,附上相同符號加以說明。又,X 方向表示與電路基板2之面平行之方向,γ方向表示與電路 基板2之面平行且正交於χ方向之方向,乙方向表示正交於 X方向及Υ方向、且與電路基板2之面垂直之方向。 基台6形成為於中央部具有開口部7之框板狀,於該開口 部7内部電路基板2藉由把持機構(未圖示)而保持水平。 上側檢查探測器4設置於電路基板2之左側及右側。同樣 地,下側檢查探測器4設置於電路基板2之左側及右側。 即’於基台6之上方 '下方分別配置有2個檢查探測器4。 上側檢查探測器4係檢查電路基板2之表面(上表面)者, 於各上側檢查探測器4中朝向斜 别间斜下方具有一對(即2根)探針 11 ° 15l254.doc 201142325 同樣地,下側檢查探測器4係檢查電路基板2之背面(下 表面)者,於各下側檢查探測器4中朝向斜上方具有一對(即 2根)探針11。 如圖4C所示,檢查探測器4之探針u係於頂端以相隔甚 微之空隙(例如20 μιη)之狀態相互接近配置,可使2根探針 11同時接觸於電路基板2之一端子3。 檢查探測器4具有X方向移動機構、γ方向移動機構13 及Ζ方向移動機構14。藉由該等移動機構12〜14,以相對於 電路基板2之兩面對向配置探針丨丨之狀態而使檢查探測器4 沿著X方向、Υ方向及Ζ方向移動。 如圖5所示,移動機構12〜14連接於控制其移動量之移動 控制部15 »移動控制部15連接於接觸位置偵測部16,該接 觸位置偵測部16係藉由檢查探測器4之2根探針丨丨間之導通 狀態而偵測探針11是否接觸於端子3。如圖6所示,一組上 側/下側檢查探測器4之探針11間包括進行電性檢查之電性 檢查部17。 接觸位置彳貞測部16包括:運算部18,其係用以進行電阻 值運算(下述);導通偵測部19,其係基於該運算結果偵測 探針11間之導通;位置檢測部2〇,其係依據該導通偵測部 19之偵測結果與藉由控制移動機構12〜14之移動控制部15 而得到之檢查探測器4的位置資訊,檢測檢查探測器4之接 觸位置;及儲存部21,其係儲存相對於由該位置檢測部20 所檢測之端子3之檢查探測器4之接觸位置。 接觸位置偵測部16與目標位置計算部25連接,該目標位 I51254.doc 201142325 置計算部25依據由位置檢測部20所檢測出之接觸位置而計 算出相對於被作為檢查對象之端子3之檢查探測器4的移動 目標位置。目標位置計算部25包括:内插運算部26,其係 對相對於被作為檢查對象之端子3之檢查探測器4之接觸位 置進行内插運算,儲存部2 7 ’其係儲存由該内插運算所計 算出之檢查探測器4之接觸位置;及壓入量加法運算部 28 ’其係對該檢查探測器4之接觸位置加上電性檢查所需 要之壓入量。另外’下文敍述上述構成元件之詳情。 其次,對使用本實施例之檢查裝置1實施電路基板2之電 性檢查之方法加以說明。 電路基板2係兩面印刷基板,於表面及背面露出複數個 端子3。於對該電路基板2實施之電性檢查中,自露出於電 路基板2之表面之端子3中預先選擇特定位置之複數個端子 (以下稱作「代表端子」)’使任一個檢查探測器4之探針1 j 接觸於該選擇端子。該電性檢查方法包括:接觸位置偵測 步驟’其係偵測相對於選擇端子3之檢查探測器4之探針u 之接觸位置;移動目標位置計算步驟,其係依據該偵測結 果計算出相對於檢查對象端子3之檢查探測器4之移動目標 位置;及電性檢查步驟,其係將檢查探測器4移動至該移 動目標位置而對檢查對象端子3進行電性檢查。以下依序 說明3個步驟。又,於以下說明中,將接觸位置偵測步驟 中預先選擇之代表端子之符號設為3A,將檢查對象端子之 符號設為3B而加以區別。又,於無需區別端子之情形時, 以符號3表示各端子。 151254.doc 12 201142325 <接觸位置偵測步驟> 此處,自露出於電路基板2之表面之所有端子3中選擇複 數個编子作為代表端子3A。於電路基板2中該代表端子3A . 無需連接於配線圖案,亦可為不屬於配線圖案之導體部分 (亦將如此之電路基板2之導體部分定義為「端子」)。然 而,作為代表端子3Α較理想為露出於電路基板2之表面, 並且以網羅該表面整體之方式以適當之間隔而配置。由於 5亥接觸位置偵測步驟中所偵測之探針丨丨之接觸位置成為其 後之電性檢查步驟中的檢查探測器4之移動目標位置之基 準,因此,為了實現正確的位置偵測,較理想為選擇特定 尺寸以上之端子作為代表端子3A。另外,對代表端子3A 之具體選擇方法,於其後之移動目標位置計算步驟中加以 說明,因此,此處對偵測相對於所選擇之代表端子3A之檢 查探測器4之接觸位置的方法加以說明。 使檢查探測器4接近經選擇之代表端子3A,並朝向代表 端子3A移動其探針11。接觸位置偵測部16偵測相對於代表 端子3A之探針11之接觸位置。如圖5所示,接觸位置偵測 . 部16包括:恆定電流源31,其係可使於檢查探測器4之2根 探針11間流通固定電流;及電壓表32,其係測定探針11間 之電壓;且根據探針11間之電阻值偵測接觸位置。即,當 檢查探測器4之探針11接觸於電路基板2上之代表端子3 A 時,流通電流I,以其與2根探針π間之電壓v之關係計算 出電阻值R=V/I。將該電阻值R為特定值以下時之探針}1之 位置設為檢查探測器4之接觸位置。 15I254.doc 201142325 於接觸位置彳貞測部1 6中’導通彳貞測部19對電阻值儲存預 先設定之閾值’比較由運算部18所計算出之電阻值R與間 值’伯測該電阻值R是否為閾值以下(即導通狀態)。探針 1 1間之電阻值R為閾值以下且偵測出導通狀態時,依據藉 由移動控制部15所得到之檢查探測器4之位置資訊,位置 檢測部20檢測檢查探測器4之位置。 於該接觸位置偵測部16中,亦可代替恆定電流源3丨而具 備恆定電壓源。於該情形時,以與對2根探針丨丨間施加固 定電壓時所流通之電流之關係而計算出電阻值。 檢查探測器4之接觸位置以X方向、γ方向及z方向之座 標表示。如上述般,代表端子3A係以網羅電路基板2之整 個表面之方式而配置,因此相對於該代表端子3八之檢查探 測器4之接觸位置係自電路基板2之整個表面選出的複數處 之座標位置》 可於電路基板2之上表面側及下表面側分別具有1個接觸 位置偵測步驟中使用之檢查探測器4。本實施例中,於電 路基板2之上表面及下表面分別具有2個檢查探測器4,因 此,例如可對屬於電路基板2之表面之左半邊區域之端子3 使用左側的檢查探測器4偵測接觸位置,對屬於右半邊區 域之端子3使用右側之檢查探測器4偵測接觸位置。又,於 將偵測區域分為2個區域之情形時,若同時移動2個檢查探 測益4並且並行地彳貞測接觸位置,則效率較高。 <移動目標位置計算步驟> 將相對於接觸位置偵測步驟中所偵測之代表端子3 A之檢 151254.doc 201142325 查探測器4之接觸位置設為基準,目標位置計算部25之内 插運算部26針對電路基板2上之檢查對象端子㈤計算出檢 查铋測器4之接觸位置。如此所計算之相對於檢查對象端 子3B之檢查探測器4之接觸位置係以接觸位置修正表而儲 存於儲存部27。 代表端子3A之選擇方法、基於相對於該代表端子3八之 檢查探測器4之接觸位置而求出相對於檢查對象端子邛的 檢查探測器4之接觸位置之内插運算方法無需特別限定, 但以下2個方法較為實用。於任一種方法中,電路基板2上 之所有端子3之X座標位置、γ座標位置係於設計電路基板 2時已預先決定,求出檢查探測器4之接觸位置意味著求出 位於特定之X座標位置、Y座標位置之端子3的Z座標位 置。 (1)將代表端子設為四角形之頂點之方法 如圖1A所示,以任意四角形(以雙點劃線表示)將電路基 板2之整個區域劃分為複數個區域,自電路基板2上之所有 端子3中選擇成為上述四角形之頂點的端子設為代表端子 3A ^檢測並儲存相對於該代表端子3八之檢查探測器*之接 觸位置。於求出相對於任意檢查對象端子3B之檢查探測器 4之接觸位置時,依據接近該檢查對象端子3B之複數個代 表端子3A即位於檢查對象端子3B所屬之四角形之四個頂 點之代表端子3 A的接觸位置,對應自該四個代表端子3 a 起至檢查對象端子3B為止之距離(即X方向及γ方向之距離) 進行内插,藉此,計算出相對於對檢查對象端子3B之檢查 151254.doc •15· 201142325 探測器4之接觸位置。 (2)將代表端子設為三角形之頂點之方法 如圖1B所示,以任意三角形(以雙點劃線表示)將電路基 板2之整個區域劃分為複數個區域,自電路基板2上之所有 端子3中選擇成為上述三角形之頂點之端子設為代表端子 3 A °檢測並儲存相對於該代表端子3 a之檢查探測器4之接 觸位置。於求出相對於任意檢查對象端子3 B之檢查探測器 4之接觸位置時,依據接近該檢查對象端子3B之複數個代 表端子3A即位於檢查對象端子3B所屬之三角形之三個頂 點之代表端子3A的接觸位置’將該三個代表端子3A設為 屬於一個平面或曲面上者,將檢查對象端子33之又座標位 置、Y座標位置代入該平面或曲面之方程式,藉此,計算 出相對於檢查對象端子3B之檢查探測器4之接觸位置。 除上述2個方法以外,可採用眾所周知的數學方法根據 代表端子3A之接觸位置計算出檢查對象端子3B之接觸位 置。又’於「(1)將代表端子設為四角形之頂點之方法」 中’可不根據自四角形之四個頂點起之距離進行内插運 算,而與「(2)將代表端子設為三角形之頂點之方法」相 同’亦可將四角形之四個頂點設為屬於一個局部表面上者 而進行内插運算。又’於「(2)將代表端子設為三角形之頂 點之方法」中,亦可對劃分複數個三角形之處理採用眾所 周知的數學方法。 關於如此求出之相對於檢查對象端子3B之檢查探測器4 之接觸位置’目標位置計算部25之壓入量加法運算部28計 151254.doc •16· 201142325 算出加上藉由檢查探測器4之電性檢查所需要之壓入量的 T動目標位置m量制以使探針叫性變形而摩擦 子之表面或者藉由控制擠壓力而使檢查探測器4確切 地接觸於端子3者’其取決於探針11之形狀或機械特性、 端子材料等。 <電性檢查步驟> 將檢查探測器4移動至上述所計算出之移動目標位置, 藉由電性檢查部17對檢查對象端子3B進行電性檢查。作為 此時之檢查探測器4之移動方法,檢查探測器4亦可線性移 動至移動目標位置為止,或沿著特定曲線移動。首先,檢 查探測器4沿著直線狀或曲線狀之任意移動執跡移動至檢 查對象端子3B之接觸位置為止,然後,自接觸位置起線性 垂直移動至移動目標位置為止^如此,較佳為檢查探測器 4經由檢查對象端子3B之接觸位置而移動至移動目標位置 為止。 電性檢查部17係藉由4端子凱文探針接點進行檢查者, 將2個檢查探測器4之各者之2根探針u之一根作為電流施 加用,將另一根作為電壓偵測用而進行檢查。如圖6所 不’電性檢查部17包括恆定電流源33與電壓表34,恆定電 流源33連接於2個檢查探測器4之一者之探針11之間,電壓 表3 4測定另一者之探針11之間之電麼。 若將2個檢查探測器4與連接於電路基板2上之特定檢查 對象電路35之2個檢查對象端子3B分別連接,則藉由恆定 電流源33通過檢查對象電路35而流通電流I,以與2根探針 151254.doc -17· 201142325 11間產生之電廢V之關係’計算出檢查對象電路3 5之電阻 值R=V/I。該電阻值R為特定閾值以-p時,判定檢查對象電 路35之導通檢查為良好。 該電性檢查不僅進行檢查對象電路35之導通檢查,而且 亦有時檢查2個檢查對象端子3B間之絕緣狀態。於此情形 時’電阻值R為閾值以上時,判定絕緣檢查為良好。 與接觸位置偵測部16之接觸位置偵測步驟相同,可取代 電性檢查部17之恆定電流源3 3而具備恆定電壓源。於此情 形時,可對2根探針11間施加固定電壓,以與檢查對象端 子3B間流通之電流之關係而計算出電阻值。該電性檢查不 僅應用於電路基板2上之電路圖案(配線圖案)之檢查,亦可 應用於特定電路(或配線圖案)間之阻抗等之電性特性之檢 查或女裝於電路基板2上的電阻、電容、電感等電子零件 之電性特性之檢查》 另外,電性檢查部17包括用以進行電阻值運算之運算部 3 6、及藉由該運算結果判定檢查結果之好壞之判定部η。 如以上說明般,本實施例之檢查方法中,預先對複數個 代表端子3Α偵測檢查探測器4之接觸位置,然後,根據接 近檢查對象端子3Β之複數個(例如3個或4個)代表端子3八之 接觸位置,藉由内插運算求出針對該檢查對象端子3Β之檢 查探測器4之接觸位置,因此,即使沿著電路基板2之面方 向產生厚度之不均或翹曲/起伏,亦可將該尺寸形狀之誤 差之影響限定於由所選擇之代表端子从的接觸位置所特定 之三角形或四角形之較小範I換言<,藉由將電路基板 151254.doc -18· 201142325 2之整體劃分為三角形或四角形之複數個小區域,可將電 路基板2之厚度之不均或翹曲/起伏限定於由小區域所特定 之較小範圍内。又,於檢查對象端子3B所屬之三角形或四 角形之小區域内進一步藉由内插運算而求出檢查對象端子 3B之接觸位置,因此,可考慮電路基板2之厚度之不均等 而正確地求出檢查對象端子3B之接觸位置》 計算出對如上述般而求出之檢查對象端子3B之接觸位置 加上需要之壓入量之移動目標位置,將檢查探測器4移動 至該移動目標位置而進行電性檢查,因此,可相對於檢查 對象端子3B而正確地定位檢查探測器4。201142325 VI. Description of the Invention: [Technical Field] The present invention relates to an inspection for performing electrical inspection (for example, conductive inspection, insulation inspection, electrostatic capacitance or impedance measurement) by inspecting a detector to be in contact with a checkpoint of a circuit substrate. Method and inspection device. The present application is based on the patent application No. 2010-5 0432 filed on Mar. 3, 2010, the disclosure of which is hereby incorporated by reference. [Prior Art] When the circuit board is electrically inspected, a check point (e.g., a conductor terminal) for bringing the inspection probe into contact with the circuit board can be energized. In this electrical inspection, it is important to make the inspection probe exactly contact the checkpoint of the circuit substrate. In recent years, various techniques have been developed as an electrical inspection method and apparatus for a circuit board, and Patent Document 1 to Patent Document 6 can be cited. Patent Document 1: Japanese Laid-Open Patent Publication No. 2008-261678. Patent Document 2: Japanese Patent Laid-Open Publication No. Hei. No. Hei. No. Hei. Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. Measuring the same measured pattern in the circuit substrate of the inspection object, measuring the resistance value of the probe 151254.doc 201142325 1 in the measured pattern, and pressing the inspection probe until the measured resistance value is a valley required for detection. The contact resistance to the measured pattern is detected as follows. Here, the four terminals can be used as the inspection detector, and the contact state is detected each time using two of the probes. Patent Document 2 discloses an inspection method and an inspection apparatus for a substrate, in which an inspection probe (probe) including two pairs of probes is brought into contact with two terminals of a circuit board, and is measured by a four-terminal measurement method. The resistance between the terminals. In order to optimize the contact force when the inspection probe is in contact with the terminal of the circuit board, the probe contact position is obtained for the plurality of terminals by the conduction between the two probes, and the arithmetic mean is the contact point. The contact point is such that the inspection probe is brought into contact with the terminal of the circuit board with a press-in amount corresponding to the amount of deformation of the appropriate contact force, and the resistance value between the terminals is measured. Patent Document 3 to Patent Document 6 relates to a double-detection detector for electrical inspection of a circuit board, and the probe of the inspection probe is supported by an elastic member such as a leaf spring to contact the probe with the circuit substrate. In the case of the terminal, when the contact reaction force of a predetermined value or more is applied to the probe by the unevenness of the surface of the circuit board, the probe is retracted by the elastic member. In the case where a plurality of terminals are formed on a circuit board, if a contact detecting method in which an inspection probe is brought into contact with each terminal to measure a resistance value as in Patent Document 1 is used, the operation is complicated and time consuming. Further, the circuit board to be inspected may have unevenness in thickness or warpage/undulation along the surface direction thereof, and it is difficult to appropriately contact the inspection probes with all the inspection target terminals. For a circuit board having an unevenness in size or shape (or an abnormal shape), 151254.doc 201142325 can be applied to Patent Document 2, based on the contact point of the arithmetic mean obtained by the conduction detection of a plurality of terminals. The inspection probe is brought into contact with the inspection target terminal. However, Patent Document 2 considers that the linear variation/disparity of the surface of the circuit substrate is somewhat compatible, but the variation/non-period of the surface of the circuit substrate such as the thickness unevenness or warpage/undulation of the circuit substrate In the case of nonlinearity, the inspection probe cannot be properly followed by the inspection target terminal. Thus, Patent Document 2 cannot perform a correct electrical inspection. In order to correspond to the nonlinear change/disparity of the surface of the circuit board as described above, as disclosed in Patent Documents 3 to 6, when the contact reaction force of a predetermined value or more acts on the inspection probe, it is necessary to have the probe retracted. The institution. Therefore, it is necessary to perform electrical inspection of the circuit substrate using a check detector having a complicated structure and high cost. The present invention has been made in view of such circumstances, and provides an inspection method and an inspection apparatus which can appropriately correspond to a circuit even when unevenness in thickness or warpage/fluctuation occurs in the direction of the surface of the circuit board. The correct electrical test is performed by nonlinear variation/disparity of the surface of the substrate. Further, the present invention provides an inspection method and inspection apparatus which can easily perform an inspection operation of a circuit board by using a simple inspection probe which is inexpensive and inexpensive. SUMMARY OF THE INVENTION The present invention relates to an inspection method for performing electrical inspection on a circuit substrate on which a plurality of terminals are formed using an inspection probe having a probe at the tip, which includes: a contact position detecting step, which selects a plurality of Representing the terminal, and moving the inspection probe toward the representative terminal, detecting the position of the probe 151254.doc • 6 · 201142325 as the contact position of the inspection probe; the moving target position calculation step Interpolating the contact position of the inspection probe with respect to a plurality of representative terminals close to the terminal of the inspection target, and calculating the moving target position by adding the required pressing amount to the inspection target terminal from the contact of the inspection detector And an electrical inspection step of electrically inspecting the inspection target terminal by moving the inspection probe to the moving target position. In the method described in Patent Document 2, when the inspection probe is brought into contact with the terminal on the circuit board and the electrical inspection is performed, it is necessary to bring the inspection probe into contact with the terminal with an appropriate contact force. However, in the case where unevenness in thickness or warpage/undulation occurs in the direction of the surface of the circuit board, it is difficult to properly contact the inspection probe with a specific terminal. In order to solve this problem, in the present invention, the contact position of the inspection probe with respect to the representative terminal is detected in advance, and a plurality of representative terminals close to the inspection target terminal are selected and the contact position is used as a reference. Thereby, the nonlinear displacement or inspection effect on the circuit substrate due to thickness unevenness or warpage/undulation can be limited to a small range surrounded by a plurality of representative terminals, and the smaller By the interpolation operation, the target moving position of the inspection probe to the inspection target terminal is determined by the interpolation operation. Therefore, the inspection probe can be correctly positioned at the inspection target terminal and appropriately contacted with the inspection object as compared with the prior art. Terminal. Further, it is not necessary to perform a complicated detecting step such as directly detecting the contact position of the inspection probe to the inspection target terminal, and the electric inspection can be accurately performed in a short time without quickly moving the inspection probe linearly to the inspection target terminal. an examination. In the inspection method of the present invention, the moving target position calculation step 151254.doc 201142325 can be simplified. After the contact position detecting step, the inspection probe is moved from the contact position of the inspection detector with respect to the plurality of representative terminals. The electrical inspection step of electrically checking the inspection target terminal until the target position of the required pressing amount is added to the inspection target terminal. That is, 'the moving target position to the inspection target terminal is not calculated based on the contact position of the inspection probe and the representative terminal detected in advance, and the inspection probe is continuously moved from the contact position with the representative terminal to the inspection target terminal. Electrical inspection. Thereby, the contact operation between the inspection probe and the terminal can be solved once, so that the electrical inspection can be performed efficiently. In the above contact position detecting step, the contact position of the inspection detector relative to the representative terminal may also be detected by detecting the resistance between the probes contacting the inspection probes representing the terminals to be below a specific threshold. . Thereby, the conduction can be accurately detected to correctly detect the contact position of the inspection probe with the representative terminal. The present invention relates to an electrical inspection apparatus for electrically inspecting a circuit substrate on which a plurality of terminals are formed using an inspection probe having a probe at the tip, comprising: a base that supports the circuit substrate at a specific position; a moving mechanism for moving the inspection detector toward a desired terminal on the circuit substrate; the contact position detecting portion selects a plurality of representative terminals, detecting the conduction of the representative terminal and the probe of the inspection detector Measuring the contact position of the detector, and moving the target position calculating unit, which interpolates the contact position of the inspection detector with respect to a plurality of representative terminals close to the terminal of the inspection target, from the contact position of the inspection detector The inspection target terminal is added with the required pressing amount to calculate the movement target position of the inspection probe I5I254.doc 201142325, and the electrical inspection unit's the inspection target terminal by moving the inspection probe to the moving target position. Electrical inspection. Further, the 'contact position detecting unit includes a conduction detecting unit that detects that the resistance between the probes of the inspection probe that is in contact with the representative terminal is below a specific resistance value' and the position detecting portion that turns the conduction The detecting unit detects the position at the time of conduction and detects it as the contact position of the inspection probe. Specifically, 'at least three representative terminals are arranged close to the inspection target terminal', and the inspection target terminal is divided by a triangular or rectangular region, and the contact position of the inspection probe with respect to the representative terminal disposed at the vertex of the region is performed. The interpolation operation 'calculates the target moving position of the inspection probe from the contact position of the inspection probe to the inspection target terminal plus the required pressing amount. As described above, the representative terminal of the inspection target terminal on the circuit board is selected and the contact position between the representative terminal and the inspection detector is detected, and the interpolation operation is performed. 'The contact position of the inspection probe is added to the inspection target terminal. The moving target position is calculated by the amount of pressing, so that the non-linear shift can be localized by the unevenness or warpage/undulation of the surface direction of the circuit board, and the moving target position of the inspection probe can be correctly calculated. Therefore, the accuracy of the electrical inspection can be improved. Further, the detection of the contact position of the detector by the conduction of the probe can be performed only by the preselected representative terminal, whereby the operation can be simplified and the electrical inspection can be performed quickly. Moreover, since the unevenness or warpage/undulation of the surface direction of the circuit board can be appropriately matched, the inspection detector itself does not need to include a mechanism for avoiding the reaction force, thereby simplifying the structure of the inspection detector and being inexpensive. Manufacturing. 151254.doc 201142325 [Embodiment] The present invention will be described with reference to the accompanying drawings. Fig. 2 is a plan view showing an inspection apparatus i of a circuit board according to an embodiment of the present invention. Figure 3 is a longitudinal sectional view of the arrow A-A of Figure 2 as viewed in the direction of the arrow. This inspection device 1 is an inspection device for a flight mode in which the inspection probe 4 is sequentially moved relative to the terminal 3 on the circuit board 2 to perform electrical inspection. In the inspection apparatus 1, electrical inspection of both surfaces of the circuit board 2 can be performed using a plurality of inspection probes 4 disposed on the front side and the back side of the circuit board 2. Specifically, a pair of upper inspection probes 4 are disposed above the base 6 that is horizontally held by the support frame 5 at a specific height and are movable along the X direction, the γ direction, and the B direction, and a pair of lower sides. The inspection detector 4 is disposed below the base 6 and is movable in the X direction, the Y direction, and the z direction. Since the inspection detectors 4 all have the same structure, the same reference numerals are attached to explain. Further, the X direction indicates a direction parallel to the surface of the circuit board 2, the γ direction indicates a direction parallel to the surface of the circuit board 2 and orthogonal to the χ direction, and the B direction indicates an orthogonal to the X direction and the Υ direction, and the circuit board The direction of 2 is perpendicular to the direction. The base 6 is formed in a frame plate shape having an opening portion 7 at the center portion, and the circuit board 2 is horizontally held by the holding mechanism (not shown) in the opening portion 7. The upper inspection probe 4 is disposed on the left and right sides of the circuit board 2. Similarly, the lower inspection probe 4 is disposed on the left and right sides of the circuit board 2. That is, two inspection probes 4 are disposed below the 'above the base 6'. The upper inspection detector 4 is for inspecting the surface (upper surface) of the circuit board 2, and has a pair of (i.e., two) probes 11 obliquely downward in the oblique direction between the upper inspection detectors. The lower inspection probe 4 inspects the back surface (lower surface) of the circuit board 2, and has a pair of (ie, two) probes 11 obliquely upward in each of the lower inspection probes 4. As shown in FIG. 4C, the probes u of the inspection detector 4 are arranged close to each other in a state in which the tips are separated by a small gap (for example, 20 μm), so that the two probes 11 can simultaneously contact one terminal of the circuit substrate 2. 3. The inspection probe 4 has an X-direction moving mechanism, a γ-direction moving mechanism 13, and a Ζ-direction moving mechanism 14. By the moving mechanisms 12 to 14, the inspection probe 4 is moved in the X direction, the Υ direction, and the Ζ direction with respect to the state in which the probe 配置 is disposed facing the two sides of the circuit board 2. As shown in FIG. 5, the moving mechanisms 12 to 14 are connected to the movement control unit 15 that controls the amount of movement. The movement control unit 15 is connected to the contact position detecting unit 16, and the contact position detecting unit 16 is connected to the inspection detector 4. The conduction state between the two probes is detected to detect whether the probe 11 is in contact with the terminal 3. As shown in Fig. 6, between the probes 11 of the upper/lower side inspection probes 4, an electrical inspection portion 17 for performing electrical inspection is included. The contact position detecting unit 16 includes a computing unit 18 for performing a resistance value calculation (described below), and a conduction detecting unit 19 for detecting conduction between the probes 11 based on the calculation result; and a position detecting unit 2〇, based on the detection result of the conduction detecting unit 19 and the position information of the inspection detector 4 obtained by controlling the movement control unit 15 of the moving mechanisms 12 to 14, detecting the contact position of the inspection detector 4; And a storage portion 21 that stores a contact position with respect to the inspection probe 4 of the terminal 3 detected by the position detecting portion 20. The contact position detecting unit 16 is connected to the target position calculating unit 25, and the target unit I51254.doc 201142325 calculates the unit 25 based on the contact position detected by the position detecting unit 20 with respect to the terminal 3 to be inspected. Check the moving target position of the detector 4. The target position calculating unit 25 includes an interpolation calculating unit 26 that interpolates the contact position with respect to the inspection probe 4 of the terminal 3 to be inspected, and the storage unit 27's is stored by the interpolation. The contact position of the inspection probe 4 calculated by the calculation; and the press-in amount adding unit 28' is a pressing amount required for the electrical inspection of the contact position of the inspection probe 4. Further, the details of the above constituent elements will be described below. Next, a method of performing electrical inspection of the circuit board 2 using the inspection apparatus 1 of the present embodiment will be described. The circuit board 2 is a printed circuit board on both sides, and a plurality of terminals 3 are exposed on the front and back surfaces. In the electrical inspection performed on the circuit board 2, a plurality of terminals (hereinafter referred to as "representative terminals") of a specific position are selected in advance from the terminals 3 exposed on the surface of the circuit board 2 to make any one of the inspection detectors 4 The probe 1 j is in contact with the selection terminal. The electrical inspection method includes: a contact position detecting step of detecting a contact position of the probe u relative to the inspection probe 4 of the selection terminal 3; and a moving target position calculation step, which is calculated according to the detection result The moving target position of the inspection probe 4 with respect to the inspection target terminal 3; and an electrical inspection step of electrically inspecting the inspection target terminal 3 by moving the inspection probe 4 to the moving target position. The following three steps are described in order. Further, in the following description, the symbol of the representative terminal selected in advance in the contact position detecting step is set to 3A, and the symbol of the inspection target terminal is set to 3B to be distinguished. Further, when it is not necessary to distinguish the terminals, the respective terminals are denoted by reference numeral 3. 151254.doc 12 201142325 <Contact position detecting step> Here, a plurality of clips are selected as the representative terminal 3A from all the terminals 3 exposed on the surface of the circuit board 2. The representative terminal 3A in the circuit board 2 does not need to be connected to the wiring pattern, and may be a conductor portion not belonging to the wiring pattern (the conductor portion of the circuit board 2 is also defined as "terminal"). However, it is preferable that the representative terminal 3 is exposed on the surface of the circuit board 2, and is disposed at an appropriate interval so as to cover the entire surface. Since the contact position of the probe 侦测 detected in the 5 Hz contact position detecting step becomes the reference of the moving target position of the inspection detector 4 in the subsequent electrical inspection step, in order to achieve correct position detection It is preferable to select a terminal of a specific size or more as the representative terminal 3A. In addition, the specific selection method of the representative terminal 3A will be described in the subsequent moving target position calculating step, and therefore, the method of detecting the contact position of the inspection probe 4 with respect to the selected representative terminal 3A is described here. Description. The inspection probe 4 is brought close to the selected representative terminal 3A, and its probe 11 is moved toward the representative terminal 3A. The contact position detecting portion 16 detects the contact position with respect to the probe 11 of the representative terminal 3A. As shown in FIG. 5, the contact position detecting unit 16 includes a constant current source 31 for circulating a fixed current between the two probes 11 of the inspection probe 4, and a voltmeter 32, which is a measuring probe. 11 voltages; and the contact position is detected based on the resistance between the probes 11. That is, when the probe 11 of the inspection probe 4 is in contact with the representative terminal 3 A on the circuit substrate 2, the current I is flown, and the resistance value R = V / is calculated by the relationship between the voltage I and the voltage v between the two probes π. I. When the resistance value R is equal to or less than a specific value, the position of the probe}1 is set as the contact position of the inspection probe 4. 15I254.doc 201142325 In the contact position detecting unit 16 the 'conduction detecting unit 19 stores a predetermined threshold value for the resistance value storage'. The resistance value R and the inter-value calculated by the calculation unit 18 are compared. Whether the value R is below the threshold (ie, the on state). When the resistance value R between the probes 1 is equal to or less than the threshold value and the conduction state is detected, the position detecting unit 20 detects the position of the inspection probe 4 based on the position information of the inspection probe 4 obtained by the movement control unit 15. The contact position detecting unit 16 may have a constant voltage source instead of the constant current source 3A. In this case, the resistance value is calculated in relation to the current flowing when a fixed voltage is applied between the two probes. The contact position of the inspection probe 4 is indicated by coordinates in the X direction, the γ direction, and the z direction. As described above, the representative terminal 3A is disposed so as to cover the entire surface of the circuit board 2, so that the contact position of the inspection probe 4 with respect to the representative terminal 3 is a plurality of points selected from the entire surface of the circuit substrate 2. The coordinate position "" has an inspection probe 4 used in one contact position detecting step on the upper surface side and the lower surface side of the circuit board 2, respectively. In the present embodiment, two inspection probes 4 are respectively provided on the upper surface and the lower surface of the circuit board 2. Therefore, for example, the inspection detector 4 on the left side can be used for the terminal 3 belonging to the left half of the surface of the circuit substrate 2. The contact position is measured, and the terminal 3 belonging to the right half area is used to detect the contact position using the inspection detector 4 on the right side. Further, when the detection area is divided into two areas, if two inspection probes 4 are simultaneously moved and the contact position is measured in parallel, the efficiency is high. <moving target position calculating step> The contact position of the detecting probe 4 with respect to the representative terminal 3 A detected in the contact position detecting step is set as a reference within the target position calculating portion 25 The insertion calculation unit 26 calculates the contact position of the inspection detector 4 with respect to the inspection target terminal (5) on the circuit board 2. The contact position of the inspection probe 4 with respect to the inspection target terminal 3B thus calculated is stored in the storage portion 27 by the contact position correction table. The method of selecting the terminal 3A and the interpolation method for determining the contact position of the inspection probe 4 with respect to the inspection target terminal 相对 based on the contact position of the inspection probe 4 with respect to the representative terminal 3 are not particularly limited, but The following two methods are more practical. In either method, the X coordinate position and the γ coordinate position of all the terminals 3 on the circuit board 2 are determined in advance when the circuit board 2 is designed, and the contact position of the inspection probe 4 is determined to mean that the specific X is located. The Z coordinate position of the terminal 3 of the coordinate position and the Y coordinate position. (1) A method of setting the representative terminal to the apex of the square shape as shown in FIG. 1A, dividing the entire area of the circuit substrate 2 into a plurality of areas in an arbitrary quadrangular shape (indicated by a two-dot chain line), all from the circuit substrate 2 The terminal selected as the apex of the above-mentioned quadrilateral in the terminal 3 is set as the representative terminal 3A^ to detect and store the contact position with respect to the inspection probe* of the representative terminal 3. When the contact position of the inspection probe 4 with respect to the inspection target terminal 3B is obtained, the representative terminal 3 located at the four vertices of the square to which the inspection target terminal 3B belongs is based on the plurality of representative terminals 3A close to the inspection target terminal 3B. The contact position of A corresponds to the distance from the four representative terminals 3 a to the inspection target terminal 3B (that is, the distance between the X direction and the γ direction), thereby calculating the relative position to the inspection target terminal 3B. Check 151254.doc •15· 201142325 Contact position of detector 4. (2) A method of setting the representative terminal to the apex of the triangle as shown in FIG. 1B, dividing the entire area of the circuit substrate 2 into a plurality of areas by an arbitrary triangle (indicated by a chain double-dashed line), all from the circuit board 2 The terminal selected as the apex of the above-mentioned triangle among the terminals 3 is set as the representative terminal 3A to detect and store the contact position with respect to the inspection probe 4 of the representative terminal 3a. When the contact position of the inspection probe 4 with respect to the inspection target terminal 3 B is obtained, the representative terminal 3A that is close to the inspection target terminal 3B is the representative terminal of the three vertices of the triangle to which the inspection target terminal 3B belongs. The contact position of 3A is set to belong to a plane or a curved surface, and the coordinate position of the inspection target terminal 33 and the Y coordinate position are substituted into the equation of the plane or the curved surface, thereby calculating Check the contact position of the inspection probe 4 of the object terminal 3B. In addition to the above two methods, the contact position of the inspection target terminal 3B can be calculated from the contact position of the representative terminal 3A by a well-known mathematical method. In the case of "(1) the method of setting the representative terminal to the apex of the square", the interpolation operation can be performed not based on the distance from the four vertices of the square, and "(2) the representative terminal is set as the apex of the triangle. The method "same" can also perform interpolation operations by setting the four vertices of the quadrilateral to belong to a partial surface. Further, in the method of "(2) setting the representative terminal to the apex of the triangle", a well-known mathematical method can be employed for the processing of dividing a plurality of triangles. The contact position of the inspection probe 4 with respect to the inspection target terminal 3B thus obtained is the amount of the pressing amount addition unit 28 of the target position calculating unit 25 151254.doc •16·201142325 Calculated by the inspection detector 4 The T-movement target position m required for the electrical inspection is measured so that the probe is deformed to the surface of the friction or the inspection detector 4 is brought into contact with the terminal 3 by controlling the pressing force. 'It depends on the shape or mechanical properties of the probe 11, the terminal material, and the like. <Electrical inspection step> The inspection probe 4 is moved to the above-described calculated movement target position, and the inspection target terminal 3B is electrically inspected by the electrical inspection unit 17. As a method of moving the inspection probe 4 at this time, the inspection probe 4 can also be linearly moved to the moving target position or moved along a specific curve. First, the inspection probe 4 is moved to a contact position of the inspection target terminal 3B along an arbitrary movement of a straight line or a curved shape, and then linearly and vertically moved from the contact position to the moving target position. The probe 4 is moved to the moving target position via the contact position of the inspection target terminal 3B. The electrical inspection unit 17 performs inspection by a 4-terminal Kevin probe contact, and one of the two probes u of each of the two inspection detectors 4 is used as a current application, and the other is used as a voltage. Check for inspection. As shown in Fig. 6, the electrical inspection unit 17 includes a constant current source 33 and a voltmeter 34. The constant current source 33 is connected between the probes 11 of one of the two inspection detectors 4, and the voltmeter 34 measures the other. What is the power between the probes 11? When the two inspection probes 4 are connected to the two inspection target terminals 3B of the specific inspection target circuit 35 connected to the circuit board 2, the constant current source 33 passes through the inspection target circuit 35, and the current I flows. The relationship between the two probes 151254.doc -17· 201142325 11 generated electric waste V 'calculates the resistance value R=V/I of the inspection target circuit 35. When the resistance value R is a specific threshold value of -p, it is determined that the conduction check of the inspection target circuit 35 is good. This electrical inspection not only performs the conduction inspection of the inspection target circuit 35, but also checks the insulation state between the two inspection target terminals 3B. In this case, when the resistance value R is equal to or higher than the threshold value, it is determined that the insulation inspection is good. The contact position detecting step of the contact position detecting unit 16 is the same as that of the constant current source 3 of the electrical inspection unit 17, and has a constant voltage source. In this case, a fixed voltage is applied between the two probes 11, and the resistance value is calculated in accordance with the relationship between the current flowing between the probe terminals 3B. This electrical inspection is applied not only to the inspection of circuit patterns (wiring patterns) on the circuit board 2 but also to the inspection of electrical characteristics such as impedance between specific circuits (or wiring patterns) or on the circuit board 2 Inspection of electrical characteristics of electronic components such as electric resistance, capacitance, and inductance" The electrical inspection unit 17 includes a calculation unit 36 for calculating the resistance value, and determining whether the inspection result is good or bad by the calculation result. Part η. As described above, in the inspection method of the present embodiment, the contact position of the inspection probe 4 is detected in advance for a plurality of representative terminals 3, and then, based on a plurality of (for example, three or four) representatives close to the inspection target terminal 3? At the contact position of the terminal 3, the contact position of the inspection probe 4 for the inspection target terminal 3Β is obtained by interpolation calculation, and therefore unevenness or warpage/fluctuation occurs even along the surface direction of the circuit board 2. Alternatively, the influence of the error of the size shape may be limited to a smaller radius of the triangle or quadrilateral specified by the contact position of the selected representative terminal, in other words, by the circuit substrate 151254.doc -18· 201142325 The whole of 2 is divided into a plurality of small areas of a triangle or a quadrangle, and the thickness unevenness or warpage/fluctuation of the circuit substrate 2 can be limited to a small range specified by a small area. Further, since the contact position of the inspection target terminal 3B is obtained by the interpolation calculation in the small area of the triangle or the square to which the inspection target terminal 3B belongs, the thickness of the circuit board 2 can be accurately determined in consideration of the unevenness of the thickness of the circuit board 2. The contact position of the inspection target terminal 3B is calculated by adding the required movement target position to the contact position of the inspection target terminal 3B obtained as described above, and moving the inspection probe 4 to the movement target position. The electrical inspection is performed, and therefore, the inspection probe 4 can be correctly positioned with respect to the inspection target terminal 3B.
I 本實施例中,由於無需針對檢查對象端子邛偵測檢查探 測器4之接觸位置,便可計算出移動目標位置並移動檢查 探測器4,因此,可不經由接觸位置偵測步驟而迅速地實 施檢查。 又’於將檢查探測器4向移動目標位置移動時,以經由 移動目標位置計算步驟之過程中所計算出之檢查對象端子 3B之接觸位置的方式移動檢查探測器4,因此,可對檢查 探測器4之探針u準確地進行摩擦動作,從而可正確地實 施電性檢查。 於對經選擇之代表端子3A實施電性檢查之情形時,接觸 位置偵測步驟中檢查探測器4接觸於代表端子3 A並偵測接 觸位置之後’可將檢查探測器4移動至對該接觸位置加上 堅入里之移動目標位置為止而進行電性檢查。即, 由於接觸位置偵測步驟中檢查探測器4直接接觸於代表端 I51254.doc 201142325 子’故而藉由保持接觸狀態而將檢查探測器4移動至移動 目標位置為止,可以1次操作實施電性檢查,從而可有效 地進行檢查》 以上對電路基板之檢查方法及檢查裝置進行了說明,然 而本發明並不限定於上述實施例,於由隨附之申請專利範 圍定義之發明之宗旨範圍内可施加各種變更。 (1)上述實施例中,預先決定電路基板2上之所有端子3 之X座標位置、Y座標位置,接觸位置偵測步驟中偵測位 於特定之X座標位置、γ座標位置之代表端子3人之2座標位 置,亦於移動目標計算步驟中計算出位於特定之χ座標位 置Υ座裇位置之檢查對象端子3Β之Ζ座標的目標位置。 然而,亦可於任一步驟中包含χ座標及γ座標而偵測接觸 位置,進行目標位置之計算。於此情形時,分別對χ座 標、Υ座標、Ζ座標偵測相對於代表端子3Α之檢查探測器4 之接觸位置,比較該乂座標及γ座標與預先設計之位置資 訊(X座標、γ座標)計算出其差量,可根據此差量修正設計 檢查對象端子3Β時之位置資訊(χ座標、γ座標)。 ⑺移動目標位置計算步驟中’將接觸位置㈣步驟中 所债測之檢查探測器4之向代表端子3Α之接觸位置作為基 準,藉由内插運算而求出向檢查對象端子3Β之接觸位置, 將所計算出之接觸位置儲存於儲存部27,加上電性檢查步 驟中所需要之壓人量而將檢查探測器4移動至移動目標位 置。然而,本發明中最終計算出移動目標位置即可,未必 求出且儲存檢查探測器4之向檢查對象端子紐之接觸位 151254.doc •20- 201142325 置。即’儲存對檢查探測器4之向檢查對象端子3B之接觸 位置加上需要之壓入量的移動目標位置即可。 (3) 於該情形時,可不控制檢查探測器4之向檢查對象端 子3B之接觸位置之移動,但於將檢查探測器4移動至移動 目標位置時,可藉由將於檢查對象端子化之上方之垂直移 動距離設定為大於摩擦操作所需要之距離,而檢查探測器 4必然經由檢查對象端子38之接觸位置而到達移動目標位 置。 /、 (4) 又,本發明之目標位置計算部只要計算出對檢查探 測器4之向檢查對象端子邛之接觸位置加上需要之壓入量 的移動目標位置即可。 (5) 由圖2〜圖4表示上述實施例之電路基板之檢查裝置叉 的構成,但其具體構成並不限定於圖示者。例如,亦可使 用圖7所示之具有彎曲成L字狀之探針42的檢查探測器μ取 代圖4所示之具有傾斜之探針丨丨之檢查探測器4。 (6) 上述實施例中,使圖5所示之接觸位置偵測部“之恆 定電流源31、電壓表32及運算部18與圖6所示之電性檢查 部17中之恆定電流源33、電壓表34及運算部%為不同之構 成要素,但亦可使該等為共同之構成要素,替換適當的配 線後作為接觸位置偵測部16或電性檢查部丨7而發揮功能。 (7) 上述實施例中表示了使電路基板2保持水平之構成, 但亦可採用使電路基板2保持除水平方向以外之狀態的機 構,如使電路基板2保持垂直之構成或使電路基板2保持傾 斜之構成等。 151254.doc •21· 201142325 【圖式簡單說明】 圖1A係表示於檢查探測器之移動目標位置計算步驟中為 了將電路基板整體劃分為複數,將代表端子配置於四角形 之頂點之狀態的平面圖。 圖1B係表示於檢查探測器之移動目標位置計算步驟中為 了將電路基板整體劃分為複數,將代表端子配置於三角形 之頂點之狀態的平面圖。 圖2係表示本發明之一實施例之電路基板之檢查裝置的 平面圖。 圖3係表示圖2之A-A箭頭方向觀察之縱剖面圖。 圖4A係檢查裝置所包含之檢查探測器之放大平面圖。 圖4B係表示檢查裝置中之檢查探測器及其周邊構成之故 大前視圖。 圖4C係圖4B之B-B箭頭方向觀察之放大圖。 圖5係表示檢查裝置之構成之方塊圖,於檢查探測器上 連接有移動控制部、接觸位置偵測部及目標位置計算部。 圖ό係表示檢查裝置之電性檢查部之構成之方塊圖。 圖7係表示可適用於檢查裝置之檢查探測器之其他例之 前視圖。 【主要元件符號說明】 1 檢查裝置 2 電路基板 3 端子 3Α 代表端子 151254.doc •22· 201142325 3B 檢查對象端子 4、41 檢查探測器 5 支撐架 6 基台 7 開口部 11、42 探針 12 X方向移動機構 13 Y方向移動機構 14 Z方向移動機構 15 移動控制部 16 接觸位置偵測部 17 電性檢查部 18 ' 36 運算部 19 導通偵測部 20 位置檢測部 21 > 27 儲存部 25 目標位置計算部 26 内插運算部 28 壓入量加法運算部 31 ' 33 恆定電流源 32 ' 34 電壓表 35 檢查對象電路 37 判定部 151254.doc -23-In the present embodiment, since it is not necessary to detect the contact position of the inspection probe 4 with respect to the inspection target terminal ,, the moving target position can be calculated and the inspection probe 4 can be moved, so that it can be quickly implemented without the contact position detecting step. an examination. Further, when the inspection probe 4 is moved to the movement target position, the inspection probe 4 is moved in such a manner that the contact position of the inspection target terminal 3B calculated in the course of the movement target position calculation step is performed, so that the inspection can be detected The probe u of the device 4 accurately performs the rubbing action, so that the electrical inspection can be performed correctly. When the electrical inspection of the selected representative terminal 3A is performed, the inspection detector 4 is moved to the contact after the inspection detector 4 contacts the representative terminal 3 A and detects the contact position in the contact position detecting step. The position is added to the moving target position in the rigor and the electrical inspection is performed. That is, since the inspection probe 4 directly contacts the representative end I51254.doc 201142325 in the contact position detecting step, the inspection probe 4 can be moved to the moving target position by maintaining the contact state, and the electrical operation can be performed once. The inspection and the inspection of the circuit board are described above. However, the present invention is not limited to the above embodiment, and can be within the scope of the invention defined by the accompanying patent application scope. Apply various changes. (1) In the above embodiment, the X coordinate position and the Y coordinate position of all the terminals 3 on the circuit substrate 2 are determined in advance, and the representative terminal 3 at the specific X coordinate position and the γ coordinate position is detected in the contact position detecting step. The coordinate position of the 2 coordinates is also calculated in the moving target calculation step to calculate the target position of the Ζ coordinate of the inspection target terminal 3 位于 at the specific χ coordinate position Υ 裇 position. However, it is also possible to include the χ coordinate and the γ coordinate in any step to detect the contact position and perform the calculation of the target position. In this case, the contact position of the χ coordinate, the Υ coordinate, and the Ζ coordinate with respect to the inspection detector 4 representing the terminal 3Α is respectively compared, and the 乂 coordinate and the γ coordinate are compared with the pre-designed position information (X coordinate, γ coordinate) The difference is calculated, and the position information (χ coordinate, γ coordinate) when the design inspection terminal 3 is designed can be corrected based on the difference. (7) In the moving target position calculation step, 'the contact position of the inspection probe 4 measured in the contact position (4) step to the terminal 3' of the representative terminal 3 is used as a reference, and the contact position to the inspection target terminal 3 is obtained by interpolation calculation. The calculated contact position is stored in the storage unit 27, and the inspection probe 4 is moved to the movement target position by the amount of pressing required in the electrical inspection step. However, in the present invention, the moving target position is finally calculated, and it is not necessary to find and store the contact position of the inspection probe 4 to the inspection target terminal 151254.doc • 20-201142325. That is, it is sufficient to store the moving target position of the inspection probe 4 to the contact position of the inspection target terminal 3B by the required pressing amount. (3) In this case, the movement of the contact position of the inspection probe 4 to the inspection target terminal 3B may not be controlled, but when the inspection probe 4 is moved to the movement target position, it may be terminated by the inspection object. The upper vertical movement distance is set to be larger than the distance required for the friction operation, and the inspection probe 4 necessarily reaches the movement target position via the contact position of the inspection target terminal 38. (4) Further, the target position calculating unit of the present invention may calculate the moving target position to which the required pressing amount is to be applied to the contact position of the inspection probe 4 to the inspection target terminal 邛. (5) The configuration of the inspection device fork of the circuit board of the above-described embodiment is shown in Figs. 2 to 4, but the specific configuration is not limited to the one shown in the drawings. For example, the inspection probe 4 having the probe 42 bent in an L shape as shown in Fig. 7 can be used instead of the inspection probe 4 having the inclined probe 所示 shown in Fig. 4. (6) In the above embodiment, the constant current source 31, the voltmeter 32, and the arithmetic unit 18 of the contact position detecting portion shown in Fig. 5 and the constant current source 33 in the electrical inspection portion 17 shown in Fig. 6 are caused. The voltmeter 34 and the calculation unit % are different constituent elements. However, these common constituent elements may be replaced by appropriate wiring and function as the contact position detecting unit 16 or the electrical inspection unit 丨7. 7) In the above embodiment, the circuit board 2 is horizontally held. However, a mechanism for keeping the circuit board 2 in a state other than the horizontal direction may be employed, such as keeping the circuit board 2 vertical or keeping the circuit board 2 151254.doc •21· 201142325 [Simplified Schematic Description] FIG. 1A shows a step of calculating the moving target position of the inspection probe. In order to divide the entire circuit board into plural numbers, the representative terminal is placed at the apex of the square. FIG. 1B is a plan view showing the movement target position in the inspection probe. In order to divide the entire circuit substrate into plural numbers, the representative terminal is placed at the top of the triangle. Fig. 2 is a plan view showing an inspection apparatus for a circuit board according to an embodiment of the present invention. Fig. 3 is a longitudinal sectional view of the arrow AA of Fig. 2. Fig. 4A is an inspection probe included in the inspection apparatus. Fig. 4B is a front view showing the structure of the inspection detector and its periphery in the inspection apparatus. Fig. 4C is an enlarged view of the direction of the arrow BB of Fig. 4B. Fig. 5 is a block diagram showing the constitution of the inspection apparatus. In the figure, a movement control unit, a contact position detecting unit, and a target position calculating unit are connected to the inspection probe. Fig. 7 is a block diagram showing the configuration of an electrical inspection unit of the inspection device. Fig. 7 is a view showing an applicable inspection device. Front view of other examples of inspection detectors [Description of main components] 1 Inspection device 2 Circuit board 3 Terminal 3Α Terminal 151254.doc •22· 201142325 3B Inspection target terminal 4, 41 Inspection detector 5 Support frame 6 Abutment 7 Openings 11, 42 Probe 12 X-direction moving mechanism 13 Y-direction moving mechanism 14 Z-direction moving mechanism 15 Movement control unit 16 Contact Detection unit 17 Electrical inspection unit 18' 36 Calculation unit 19 Continuity detection unit 20 Position detection unit 21 > 27 Storage unit 25 Target position calculation unit 26 Interpolation calculation unit 28 Press-in amount addition unit 31 ' 33 Constant Current source 32 ' 34 Voltmeter 35 Check object circuit 37 Judgment section 151254.doc -23-

Claims (1)

  1. 201142325 七、申請專利範圍: 種檢一方法,其係使用頂端具有探針之檢查探測器對 形成有複數個端子之電路基板實施電性檢查者,其包 括: ’、 接觸位置偵測步驟,其係選擇複數個代表端子,並使 檢查探測器朝該代表端子移動’將藉由探針谓測出導通 之位置作為檢查探測器之接觸位置而偵測; 移動目標位置計算步驟,其係對相對於接近檢查對象 端子之複數個代表端子之檢查探測器的接觸位置進行内 插運算’自檢查探測器之接觸位置起朝向檢查對象端子 加上需要之壓入量,從而計算出移動目標位置;及 電性檢查步驟,其係將檢查探測器移動至移動目標位 置而對檢查對象端子進行電性檢查。 2. -種電性檢查方法,其係使用頂端具有探針之檢查探測 器對形成有複數個端子之電路基板實施電性檢查者,其 包括: 〃 接觸位置偵測步驟,其係選擇複數個代表端子,並使 檢查探測器朝該代表端子移動’將藉由探針偵測出導通 之位置作為檢查探測器之接觸位置而偵測;及 電性檢查步驟,其係將檢查探測器自相對於複數個代 表端子之檢查探測器之接觸位置起移動至朝向檢查對象 端子加上需要之壓入量之移動目標位置為止,而對檢查 對象端子進行電性檢查。 3·如請求項1或2之檢查方法,其中於上述接觸位置偵測步 151254.doc 201142325 驟中’藉由偵測接觸於上述代表端子之上述檢查探測器 之楝針之間的電阻為特定之閾值以下’而彳貞測相對於上 述代表端子之上述檢查探測器之接觸位置。 4. 如請求項1或2之檢查方法,其中至少3個代表端子接近 配置於上述檢查對象端子,對相對於該代表端子之上述 檢查探測器之接觸位置進行内插運算,自上述檢查探測 器之接觸位置起朝向上述檢查對象端子加上需要之壓入 量’從而計算出上述檢查探測器之目標移動位置。 5. 一種電性檢查裝置,其係使用頂端具有探針之檢查探測 器對形成有複數個端子之電路基板實施電性檢查者,其 包括: 基台’其係將電路基板支撐於特定位置; 移動機構’其係使檢查探測器朝電路基板上之所期望 之端子移動; 接觸位置偵測部,其係選擇複數個代表端子,偵測該 代表端子與檢查探測器之探針之導通而偵測檢查探測器 之接觸位置; 移動目標位置計算部,其係對相對於接近檢查對象端 子之複數個代表端子之檢查探測器的接觸位置進行内插 運算,自檢查探測器之接觸位置起朝向檢查對象端子加 上需要之壓入量而計算出檢查探測器之移動目標位置;及 電性檢查部,其係將檢查探測器移動至移動目標位置 為止而對檢查對象端子進行電性檢查。 6. 如凊求項5之檢查裝置,其中上述接觸位置偵測部包 151254.doc 201142325 括:導通偵測部,其係偵測接觸於上述代表端子之上述 檢查探測器之探針間之電阻為特定之電阻值以下;及位 置檢測部,其係將該導通偵測部偵測出導通時之位置作 為上述檢查探測器之接觸位置而檢測。 如請求項5之檢查裝置,其巾至少3個代表料接近配置 於上述檢查對象端子,且對相對於該代表端子之上述檢 查探測器之接觸位置進行内插運算,自上述檢查探測器 之接觸位置起朝向上述檢查對象端子加上需要之壓入量 而計算出上述檢查探測器之目標移動位置。 151254.doc201142325 VII. Patent application scope: A method for seed inspection, which uses an inspection probe having a probe at the top to perform electrical inspection on a circuit substrate on which a plurality of terminals are formed, including: ', a contact position detecting step, Selecting a plurality of representative terminals and moving the inspection probe toward the representative terminal will be detected by the probe detecting the position of the conduction as the contact position of the inspection detector; the moving target position calculation step is relatively Performing an interpolation operation on the contact position of the inspection probe of the plurality of representative terminals close to the terminal of the inspection target', and adding the required pressing amount to the inspection target terminal from the contact position of the inspection probe to calculate the moving target position; The electrical inspection step is to electrically check the inspection target terminal by moving the inspection probe to the moving target position. 2. An electrical inspection method for electrically inspecting a circuit substrate having a plurality of terminals formed by using an inspection probe having a probe at the top, comprising: 〃 a contact position detecting step, which selects a plurality of Representing the terminal and moving the inspection probe toward the representative terminal' will be detected by detecting the position of the probe as the contact position of the inspection probe; and the electrical inspection step, which will check the detector self-phase The contact position of the inspection probe of the plurality of representative terminals is moved to the moving target position of the required pressing amount toward the inspection target terminal, and the inspection target terminal is electrically inspected. 3. The inspection method according to claim 1 or 2, wherein in the above-mentioned contact position detecting step 151254.doc 201142325, the specific resistance is detected by detecting the contact between the needles of the above-mentioned inspection probes contacting the representative terminals. Below the threshold value, the contact position of the above-mentioned inspection detector with respect to the above representative terminal is measured. 4. The inspection method according to claim 1 or 2, wherein at least three of the representative terminals are disposed close to the inspection target terminal, and an interpolation operation is performed on a contact position of the inspection detector with respect to the representative terminal, and the inspection detector is The contact position is increased toward the inspection target terminal by the required pressing amount ' to calculate the target moving position of the inspection probe. An electrical inspection device for electrically inspecting a circuit substrate on which a plurality of terminals are formed using an inspection probe having a probe at a tip, comprising: a base station that supports the circuit substrate at a specific position; The moving mechanism 'moves the inspection detector toward the desired terminal on the circuit substrate; the contact position detecting portion selects a plurality of representative terminals, and detects the conduction between the representative terminal and the probe of the inspection detector Measuring the contact position of the detector; the moving target position calculating unit interpolating the contact position of the inspection detector with respect to the plurality of representative terminals close to the terminal of the inspection target, and checking the contact position of the detector The target terminal is added with the required amount of press-fitting to calculate the moving target position of the inspection probe, and the electrical inspection unit performs electrical inspection of the inspection target terminal by moving the inspection probe to the moving target position. 6. The apparatus according to claim 5, wherein the contact position detecting unit package 151254.doc 201142325 includes: a conduction detecting portion that detects a resistance between the probes of the inspection detector that is in contact with the representative terminal; The position detection unit is configured to detect the position at which the conduction detecting unit is turned on as the contact position of the inspection probe. The inspection device of claim 5, wherein at least three representative materials of the towel are disposed close to the terminal to be inspected, and an interpolation operation is performed on a contact position of the inspection detector with respect to the representative terminal, and the contact with the inspection probe is At the position, the target moving position of the inspection probe is calculated by adding the required pressing amount to the inspection target terminal. 151254.doc
TW100107225A 2010-03-08 2011-03-03 Inspection method and inspection apparatus for circuit substrate TWI436078B (en)

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