201125459 六、發明說明： 【發明所屬之技術領域】 殼，尤其是一種能夠利用 以使得電子產品具有超耐 本發明係一種電子產品的外 真空金屬鍍膜法形成超硬鍍膜， 磨性質的外殼》 【先前技術】 目前3C電子產品的内部硬體性能已趨於穩定，彼此間 的差異不大’所以3C電子產品的價值端賴其外觀設計，而 • 3C電子產品外觀材質的變化即係展現更高層次且富變化性 的價值所在，如手機外殼表面、筆記型電腦外殼表面、pDA 外忒表面的設計、色彩、光澤等皆為使用者挑選3C產品的 重點，所以3C電子產品未來將向外觀設計差異化，方能奠 定產品自身的價值。故外觀設計及產品之實用性均為3C電 子產業重要之課題。 為保護3C電子產品的外觀，曾嘗試濺鑛一層超硬鍍膜 於一定硬度的基材上，以展現表面超硬的特質，但若基材 # 太軟或硬度不足，當受到外力的瞬間，基材已經變形，而 且一般的超硬鍍膜材料皆屬於硬脆材料，故當基材變形時， 超硬鍍膜亦因之變形而產生應力脆裂現象，一旦脆裂後， 就再也不具有外觀保護及耐磨的作用β 而一般3C電子產品外殼的基材為硬度高的不銹鋼或鋁 鎂合金，該基材的的硬度雖然足夠，卻不耐刮，因此長期 使用仍會產生無方向性之外表刮傷，所以即使是不鎸鋼或 紹鎂合金之外殼材質仍需進行表面硬化處理。而且3C電子 產品之外殼’不論其使用何種材質或成钽技術，在成型的 3 201125459 過程中’其外觀多少都會有規範中無法容許之瑕疵，其可 忐係起因於材料本身的缺陷，或是在成型過程中所造成的 表面傷害（刮傷、應力龜裂、流道痕及模具瑕疵等），這 些都疋無法利用超硬鍍膜技術修補的瑕疵，甚至經過超硬 鍍膜後，更突顯瑕疵之所在，因此無論基材的材質為何， 都需經過表面精飾處理。 下列呈現數種目前普遍應用於電子產品外觀的精飾製 程技術： 籲 1·塑膠材質的表面金屬化（真空金屬鍍膜技術（VM)或 不連續性真空金屬鍍膜技術（NCVM)) 聚碳酸酯（PC)的原料是石油，由聚酯切片工廠加工 為聚酯切片顆粒，再經塑料廠加工為成品。從實用的角度 來看，該材質的散熱性優於丙烯腈-苯乙烯-丁二烯共聚物 (ABS)工程塑膠，熱量分散也比較均匀，但質地較為脆弱。 不官在表面質地還是觸感上，聚碳酸酯（pc)材料的感覺 都近似於金屬。 # 2·鋁鎂合金與硬化處理 铭鎖合金為近年來大量使用的航太級輕金屬材料，是 目前全球實際應用中重量最輕的金屬結構材料。同時，該 材質强度高、散熱快、吸震能力好、電磁波絕緣性佳，並 能在特定環境下產生抗菌效果。更重要的是，鋁鎮合金可 回收率尚’疋最佳的電子產品環保材質，因此在未來的3C 產品應用中具有顯著優勢，在其上尚需經過硬化處理，才 能達到理想的硬度，然而’銘鎮合金的成本相當高，並非 一般消費者能夠接受。 201125459 3.鋁合金拉絲與硬化處理 拉絲是反覆用砂紙將紹板到出線條的製程，其主要流 程包括脱酯、沙磨機、水洗之三個步驟，惟有具備純金屬 質感的銘合金可以承載此種向精度技術。然而，將其實施 在3C電子產品的外殼上，需要耗費至少2〇個工作日，才 能打磨出不留指痕的細腻金屬觸感，而且以低温表面帶來 更舒適的應用享受，在其上尚需經過硬化處理，才能達到 理想的硬度。由於製程上的繁複與難度，目前拉絲技術僅 用於部分高級家電產品，而一些高階筆記型電腦通常也只 選擇在掌托部分呈現拉絲效果。 4_模内轉印技術（IMR) 模内轉印技術是將通常最後實施於產品表層的印刷步 :，提前納入到外殼的洗鑄過程中，利用印有指定圖樣文 字的模具一次成型，塑造出精緻的高光澤表面。由於摒棄 傳統的喷塗方式，❹轉印技術有效免除了掉漆的困擾， 並且硬度更高，更耐刮擦。 5.碳織維材質 碳纖維材質的優點很多，它既擁有鋁鎂合金高雅堅g 的特性’又有ABS工程塑料的高可塑性。它的外觀類似蜜 料’但是强度和導熱能力優於普通的ABS塑料而且由友 4身是—種導電㈣’可以達到類似金屬的屏蔽作用_ 外殼需要另鍍-層金属膜來屏蔽同時，碳纖維的强㈣ 疋鋁鎂合金的兩倍，並且擁有最佳散熱效果。 6. —般烤漆、鋼琴烤漆 鋼琴烤㈣製程技料料殼素料行冑精度噴漆和 201125459 長時間的表面處理，最終使表層獲得水晶質感的絢亮光澤， 在汽車及各種家電身上常見這種技術應用。由於3C電子產 〇 口較上述產οσ更頻繁地接觸使用者，因此鋼琴烤漆機型的 硬度要求也相對更高。目前製程依照覆蓋皮膜'底漆、補 土、色漆，並依次進行υν硬化處理和6_8道抛光處理的烤 漆程序，已最高達到了 4Η水晶級硬度。 综上所述，除了上述的製程技術外，由於對於3C電子 產品外觀的維護，還會再進行喷塗的表面硬化處理，因為 • 表面的刮傷、磨損、掉漆及髒污等，皆會影響消費者的使 用感覺，亦會損及產品之價值。因為3C電子產品已經佔據 民生消費支出最大之比例，且大多都為價值不斐，外觀之 維護關係著產品的使用壽命，以及消費者對品牌的觀感， 但是各家的表面硬化處理的喷塗技術實際上相去不遠，差 別只在硬化樹脂的選擇，其他並無太大的技術突破。 而表面精飾技術就是一種噴塗技術，任何3C電子產品 成型後的第一道精飾處理，就是先喷一道底塗（Primer)，其 鲁作用就在修補不管任何材質的機殼的成型瑕疵，還有增加 後續製程的附著密著，而目前機殼喷塗的產業鏈上，所使 用的底塗材料大多都為軟質材料（硬度大多只有HB以下）。 所述的後續製程就是表面硬化處理，傳統的硬化處理 是先喷塗一層塗料，經UV照射固化後，形成一層薄膜硬 化層’硬度約在1H~3H之間，厚度約12~25以m左右，目 前的耐磨測試，需通過RCA橡皮擦來回1000次的摩擦， 對樹脂型的硬化膜來說，已經是相當嚴苛之規範了。 而各相關產業亦竭盡全力地發展非樹脂喷塗的表面硬 6 201125459 化技術’如刀具和模具的表面超硬鍵膜技術乃是3c電子產 品設計極欲導入之表面硬化技術’若此項技術能應用於3C 電子產品的外觀硬化處理’其超硬、財磨之特性，對使用 頻繁的3C電子產品，確實可以達到保護及耐用之功效。然 而，業界廠商投入此項技術的研發已有時日，卻未能量產 應用，研發大多以失敗告終，實為可惜。 其中若要進行真空金屬鍍膜（VM)的製程，係於底塗完 成後進行，而一般真空金屬鍍膜所形成的鍍膜厚度大約在 # 1000〜3000 A (亦即 0.1 〜〇_3" m)左右。 由於真空金屬鍍膜的表面硬化技術在刀具與模具的應 用上已經相當成熟，一般應用於刀具及模具的超硬鍍膜， 雖然鑛膜厚度僅約只有3~5A ’卻已經可以展現出其超硬且 耐磨之特性。就製程技術轉換至3C電子產品的外觀精飾的 硬化處理應用，即使鍍臈厚度從3A —直增加到400A，仍 無法通過通訊產品的檢驗規範，至今仍無法有所突破。 【發明内容】 籲 本發明人有鑑於目前將真空金屬鍍膜技術應用於電子 產品的想法經相關產業長時間的研究，仍無法落實，因此 著手進行研究，分析其失敗之原因，且已經發展出能夠應 用真空金屬鍍膜技術形成超硬鍍膜之電子產品的外殼。 本發明之目的係在於提供一種能夠利用真空金屬鍍膜 法形成超硬鍍膜，以使得電子產品具有超耐磨性質之链膜 的外殼《» 為達上述目的’本發明之電子產品的外殼，其係包括： 一基材； 201125459 一底塗層’係硬度在2H至8H之間的高分子材料，其 設置於該基材的表面； 一超硬鑛膜’係利用真空金屬鍍膜技術形成於該底塗 層之上。 其中，該電子產品可為手機、筆記型電腦或pDA等。 其中，該超硬鍍膜以及該底塗層之間尚可設有一保護 層，該保護層可選自於中塗層、真空金屬鍍膜層、不連性 續真空金屬鍍膜（NCVM)層及其組合。 籲 該保護層若為中塗層能夠提升電子產品外殼的物性和 耐候性’滿足客戶的需求。 該保護層若為真空金屬鍍膜層或不連性續真空金屬鍍 膜層，則可增加電子產品外觀的金屬質感，而更能吸引購 買者的目光。其令最佳的是，該保護層為不連性續真空金 屬鍍膜層，其係結合了一般真空金屬鍍膜技術的特性，採 用新的鍍臈技術、新的材料，能夠呈現出不同顏色的金屬 外觀效果。 • 車交佳的是’該基材的材質為丙烯腈-苯乙烯-丁二烯共聚 物（ABS)、鋁鎂合金、聚氣乙烯（pvc)、聚碳酸酯（pc)或 PC/ABS等塑材。 較佳的是’該底塗層之硬度為4H至7H。 較佳的是，該底塗層為聚甲基丙烯酸曱酯（pMMA)、聚 氨醋（PU)或環氧樹脂（epoxy)。 最佳的是，該底塗層為硬度為4H至7H的聚甲基丙烯 酸甲酯。 較佳的是，該超硬鍍膜之材料包括，但不限制在二氧 8 201125459 化矽（Si〇2)、氧化鋁（aI2〇3)、氮化碳（C3N4)、氮化硼（BN)、 氮化鋁（AIN)、氮化矽（SiN)、碳化矽（SiC)、氮化鉻（CrN)、 氮化鈦（TiN)、碳氮化鈦（TiCN)、氮化鋁鈦（TiAIN)、碳化鈕 (TaC)、碳化鈦（TiC)、類鑽碳（DLC)、碳化硼（b4C)、二氧 化鈦（Ti〇2)、五氧化二鈕（τ32〇5)、三氧化二鉻（c「2〇3)、三 氧化鎢（W〇3)、氮化鈦鍅（TiZrN)、氮化鋁鉻（A|CrN)、氮化 錯（ZrN)或碳化鎢（WC)等。 本發明尚關於一種電子產品的外殼製作方法，其係包 • 括： 提供一基材； 將一底塗劑塗布於該基材之表面，以形成一底塗層， 該底塗層的硬度在2H至8H之間； 利用真空金屬鍍膜技術在該底塗層上形成一超硬鍍 膜。 其中，該電子產品可為手機、筆記型電腦或pDA等。 其中，形成底塗層之後，尚可包括於該底塗層之表面 鲁形成有一保護層，再將該超硬鑛膜卩真空金屬㈣技術於 該保護層上形成一超硬錄膜。 較佳的是，該保護層係以塗佈方式所形成的中塗層、 以真空金屬鍍膜技術所形成的真空金屬鍍膜層、以不^續 真空金屬鍍膜技術所形成的真空金屬鍍臈層及其組合。 較佳的是，該基材的材質為丙烯腈·笨乙稀_丁二稀共聚 物（ABS)、紹鎮合金、聚氣乙烯（pvc)、聚碳酸酷（pc PC/ABS等塑材》 較佳的是，該底塗層之硬度為斗㈠至 201125459 較佳的是，該底塗層為聚甲基丙烯酸甲酯（PMMA)、聚 氨酯（PU)或環氧樹脂（epoxy)。 最佳的是’該底塗層為硬度為4H至7H的聚甲基丙烯 酸甲S旨。 較佳的是，該超硬鑛膜之材料包括，但不限制在二氧 化矽（Si〇2)、氧化鋁（AI2〇3)、氮化碳（C3N4)、氮化硼（BN)、 氮化鋁（AIN)、氮化矽（SiN)、碳化矽（SiC)、氮化鉻（C「N)、 氮化鈦（TiN)、碳氮化鈦（TiCN)、氮化鋁鈦（TiAIN)、碳化鈕 • (TaC)、碳化鈦（TiC)、類鑽碳（DLC)、碳化硼（b4C)、二氧 化欽（Ti〇2)、五氧化二鈕（Ta2〇5)、三氧化二鉻（c「2〇3)、三 氧化鎢（W〇3)、氮化鈦鍅（TiZrN)、氮化鋁鉻（AlCrN)、氮化 锆（ZrN)或碳化鎢（\^(：)等》 本發明人經研究後發現既有使用真空金屬鍍膜技術失 敗的原因係在於其底塗的硬度未經控制，所以本發明將底 塗劑的硬度控制在2H至8H之間，即可讓以真空金屬鑛膜 技術所形成的超硬鍍膜，且不會使超硬鍍膜剝離，故能使 _ 電子產品之外殼具有良好的耐磨性。 【實施方式】 請參看第一圖所示，本發明之電子產品的外殼的一實 施例，其係包括： 一基材（10);201125459 VI. Description of the invention: [Technical field to which the invention pertains] A shell, in particular, an outer vacuum metal coating method capable of utilizing an electronic product having an ultra-resistance to the invention to form an ultra-hard coating, a shell of abrasive properties. Prior Art] At present, the internal hardware performance of 3C electronic products has stabilized and there is little difference between them. So the value of 3C electronic products depends on their design, and the changes in the appearance of 3C electronic products are higher. The value of tiered and versatile, such as the surface of the phone case, the surface of the notebook computer case, the design of the pDA outer surface, color, gloss, etc., are the focus of the user's choice of 3C products, so 3C electronic products will be designed in the future. Differentiation can lay the value of the product itself. Therefore, the design of the product and the practicality of the product are all important issues in the 3C electronics industry. In order to protect the appearance of 3C electronic products, I tried to splash a layer of super-hard coating on a substrate with a certain hardness to show the super-hardness of the surface, but if the substrate # is too soft or insufficient in hardness, when it is subjected to external force, the base The material has been deformed, and the general super-hard coating materials are hard and brittle materials. Therefore, when the substrate is deformed, the super-hard coating is also deformed by stress to cause stress cracking. Once it is brittle, it has no appearance protection. And the effect of wear resistance β. Generally, the substrate of the outer casing of 3C electronic product is stainless steel or aluminum-magnesium alloy with high hardness. Although the hardness of the substrate is sufficient, it is not scratch-resistant, so the long-term use will still produce non-directionality. Scratch, so even the shell material of stainless steel or magnesium alloy needs to be surface hardened. Moreover, the outer casing of 3C electronic products, regardless of the material or entanglement technology used, in the process of forming 3 201125459, its appearance may be unacceptable in the specification, which may be caused by defects in the material itself, or It is the surface damage caused by the molding process (scratches, stress cracks, runner marks and mold defects, etc.), which are not repaired by the super-hard coating technology, even after super-hard coating, it is more prominent. Wherever it is, the surface finish is treated regardless of the material of the substrate. The following are a few of the finishing process technologies commonly used in the appearance of electronic products: 11·Surface metallization of plastic materials (Vacuum Metal Coating Technology (VM) or Discontinuous Vacuum Metal Coating Technology (NCVM)) Polycarbonate ( The raw material of PC) is petroleum, which is processed into polyester chip granules by a polyester chip factory and processed into finished products by a plastics factory. From a practical point of view, the material has better heat dissipation than acrylonitrile-styrene-butadiene copolymer (ABS) engineering plastics, and the heat dispersion is relatively uniform, but the texture is relatively fragile. Polycarbonate (pc) material feels similar to metal in terms of surface texture or touch. # 2· Aluminium-magnesium alloy and hardening treatment Ming-lock alloy is aerospace-grade light metal material which has been widely used in recent years. It is the lightest weight metal structure material in practical applications in the world. At the same time, the material has high strength, fast heat dissipation, good shock absorption, good electromagnetic wave insulation, and can produce antibacterial effects under certain circumstances. What's more, the aluminum alloy's recoverable rate is still the best environmentally friendly material for electronic products, so it has a significant advantage in the future 3C product application, and it needs to be hardened to achieve the desired hardness. The cost of 'Mingzhen alloy is quite high and is not acceptable to the average consumer. 201125459 3. Brushed and hardened aluminum alloy wire drawing is a process of repeatedly using sandpaper to remove the board to the line. The main process includes three steps of deesterification, sanding machine and water washing. Only the alloy with pure metal texture can carry This kind of precision technology. However, it takes at least 2 working days to implement it on the outer casing of the 3C electronic product, in order to polish the delicate metallic touch without leaving a finger mark, and to enjoy a more comfortable application with a low temperature surface. It is still hardened to achieve the desired hardness. Due to the complexity and difficulty of the process, the current drawing technology is only used for some advanced home appliances, and some high-end notebook computers usually only choose the brushing effect in the palm rest. 4_In-mold transfer technology (IMR) In-mold transfer technology is a printing step that is usually applied to the surface of the product: it is incorporated into the process of cleaning the casing in advance, and is molded at a time by using a mold printed with the specified pattern. A delicate high-gloss surface. Due to the abandonment of the traditional spray method, the transfer technology effectively eliminates the problem of paint detachment and is harder and more scratch resistant. 5. Carbon Weaving Material The carbon fiber material has many advantages. It has the characteristics of elegant and strong aluminum-magnesium alloy, and the high plasticity of ABS engineering plastics. Its appearance is similar to that of honey, but its strength and thermal conductivity are superior to ordinary ABS plastics, and it is a kind of conductive (4) that can achieve a metal-like shielding effect. _ The outer shell needs another plating-layer metal film to shield the same, carbon fiber. The strong (four) bismuth aluminum-magnesium alloy is twice as large and has the best heat dissipation effect. 6. General paint, piano paint piano baking (four) process technology material shell material line precision painting and 201125459 long time surface treatment, and finally make the surface layer of crystal texture bright, this is common in cars and various home appliances Technical application. Since the 3C electronic product contacts the user more frequently than the above-mentioned production, the hardness of the piano paint model is relatively higher. At present, the process has reached a maximum of 4 Η crystal hardness according to the coating procedure of covering the film 'primer, soil, paint, and υ 硬化 hardening and 6_8 polishing. In summary, in addition to the above-mentioned process technology, due to the maintenance of the appearance of 3C electronic products, surface hardening treatment will be carried out again, because • surface scratches, abrasion, paint smearing and dirt will be Affecting the consumer's feeling of use will also hurt the value of the product. Because 3C electronic products have occupied the largest proportion of people's livelihood consumption expenditure, and most of them are worthless, the maintenance of appearance is related to the service life of the product, and the consumer's perception of the brand, but the surface hardening treatment technology of each family. In fact, not far from each other, the difference is only in the choice of hardened resin, and there is not much technical breakthrough. The surface finishing technology is a kind of spraying technology. The first finishing treatment of any 3C electronic product is to spray a primer, which is used to repair the molding of the casing regardless of any material. There is also an increase in the adhesion of subsequent processes, and in the current industry chain of casing coating, most of the primer materials used are soft materials (hardness is mostly only below HB). The subsequent process is a surface hardening treatment. The conventional hardening treatment is to first spray a layer of paint, and after curing by UV irradiation, a thin film hardened layer is formed, which has a hardness of about 1H to 3H and a thickness of about 12 to 25 nm. At present, the abrasion resistance test requires 1000 rubbing back and forth by the RCA eraser, which is already a very strict specification for the resin type hardened film. And the related industries have also made every effort to develop non-resin-sprayed surface hard 6 201125459 Chemical technology 'The surface superhard key film technology such as tools and molds is the surface hardening technology that 3c electronic product design is very popular to introduce'. It can be applied to the appearance hardening treatment of 3C electronic products. Its super-hard and rich-cutting characteristics can effectively protect and durable the 3C electronic products that are frequently used. However, it has been a pity that industry players have invested in the development of this technology for a long time, but they have not applied energy production. The process of vacuum metallization (VM) is performed after the primer is applied, and the thickness of the coating formed by the general vacuum metal coating is about #1000~3000 A (that is, 0.1 to 〇_3" m). . Because the surface hardening technology of vacuum metal coating is quite mature in the application of tools and molds, it is generally applied to the super-hard coating of tools and molds. Although the thickness of the mineral film is only about 3~5A', it can already show its superhardness. Wear-resistant properties. In the hardening process of converting the process technology to the appearance of 3C electronic products, even if the thickness of the rhodium plating is increased from 3A to 400A, it is still impossible to pass the inspection specifications of communication products, and there is still no breakthrough. SUMMARY OF THE INVENTION The present inventors have in view of the fact that the current application of vacuum metallization technology to electronic products has not been implemented through long-term research in related industries, so the research is started and the reasons for the failure are analyzed, and The vacuum metal coating technology is used to form the outer casing of the ultra-hard coated electronic product. An object of the present invention is to provide an outer casing of an electronic product of the present invention which is capable of forming a super-hard coating film by a vacuum metal plating method so that an electronic product has an ultra-abrasive property. Including: a substrate; 201125459 a primer coating is a polymer material having a hardness between 2H and 8H, which is disposed on the surface of the substrate; a superhard mineral film is formed on the bottom by vacuum metal coating technology. Above the coating. The electronic product can be a mobile phone, a notebook computer or a pDA. Wherein, a protective layer may be disposed between the super-hard coating and the undercoat layer, and the protective layer may be selected from the group consisting of a middle coating layer, a vacuum metal plating layer, a discontinuous continuous vacuum metallization (NCVM) layer, and combinations thereof. . If the protective layer is a medium coating, it can improve the physical properties and weather resistance of the electronic product casing to meet the needs of customers. If the protective layer is a vacuum metallization layer or a non-continuous vacuum metallization layer, the metal texture of the appearance of the electronic product can be increased, and the purchaser's eyes can be more attractive. It is preferable that the protective layer is a non-continuous vacuum metallization layer which combines the characteristics of general vacuum metallization technology, and adopts new rhodium plating technology and new materials to exhibit different colors of metal. Appearance effect. • The best for the car is 'the material of the substrate is acrylonitrile-styrene-butadiene copolymer (ABS), aluminum-magnesium alloy, polyethylene (pvc), polycarbonate (pc) or PC/ABS. Plastic material. Preferably, the undercoat layer has a hardness of from 4H to 7H. Preferably, the undercoat layer is poly(meth) methacrylate (pMMA), polyurethane (PU) or epoxy. Most preferably, the undercoat layer is polymethyl methacrylate having a hardness of 4H to 7H. Preferably, the material of the super-hard coating includes, but is not limited to, dioxin 8 201125459 bismuth (Si〇2), aluminum oxide (aI2〇3), carbon nitride (C3N4), boron nitride (BN). , aluminum nitride (AIN), tantalum nitride (SiN), tantalum carbide (SiC), chromium nitride (CrN), titanium nitride (TiN), titanium carbonitride (TiCN), titanium aluminum nitride (TiAIN) , carbonized button (TaC), titanium carbide (TiC), diamond-like carbon (DLC), boron carbide (b4C), titanium dioxide (Ti〇2), pentoxide (τ32〇5), chromium oxide (c" 2〇3), tungsten trioxide (W〇3), titanium nitride (TiZrN), aluminum nitride chromium (A|CrN), nitrided (ZrN) or tungsten carbide (WC), etc. A method for manufacturing an outer casing of an electronic product, comprising: providing a substrate; applying a primer to the surface of the substrate to form an undercoat layer having a hardness of 2H to 8H An ultra-hard coating is formed on the undercoat layer by a vacuum metallization technique, wherein the electronic product can be a mobile phone, a notebook computer, or a pDA, etc., wherein after forming the undercoat layer, the primer can be included in the primer. Layer The surface layer is formed with a protective layer, and the super hard ore film 卩 vacuum metal (4) technology is used to form a super hard film on the protective layer. Preferably, the protective layer is a medium coating formed by coating. a vacuum metal plating layer formed by a vacuum metal plating technique, a vacuum metal plating layer formed by a vacuum metal plating technique, and a combination thereof. Preferably, the substrate is made of acrylonitrile and stupid Dilute-small dilute copolymer (ABS), Shaozhen alloy, polystyrene (pvc), polycarbonate (pc PC/ABS and other plastic materials) Preferably, the hardness of the primer layer is bucket (1) to 201125459 Preferably, the undercoat layer is polymethyl methacrylate (PMMA), polyurethane (PU) or epoxy. The best is that the undercoat layer is a polymethyl group having a hardness of 4H to 7H. Preferably, the material of the super hard ore film includes, but is not limited to, cerium oxide (Si〇2), aluminum oxide (AI2〇3), carbon nitride (C3N4), nitriding. Boron (BN), aluminum nitride (AIN), tantalum nitride (SiN), tantalum carbide (SiC), chromium nitride (C"N), titanium nitride (TiN), carbon nitrogen Titanium (TiCN), Titanium Nitride (TiAIN), Carbonized Button (TaC), Titanium Carbide (TiC), Drilling Carbon (DLC), Boron Carbide (b4C), Dioxin (Ti〇2), Oxidation of two knobs (Ta2〇5), chromium oxide (c"2〇3), tungsten trioxide (W〇3), titanium nitride tantalum (TiZrN), aluminum nitride chromium (AlCrN), zirconium nitride ( ZrN) or tungsten carbide (\^(:), etc.) The inventors have found through research that the failure to use vacuum metallization technology is due to the fact that the hardness of the primer is not controlled, so the hardness of the primer is Controlled between 2H and 8H, the ultra-hard coating formed by vacuum metal ore film technology can be used without peeling off the super-hard coating, so that the outer casing of the electronic product can have good wear resistance. [Embodiment] Referring to the first figure, an embodiment of the outer casing of the electronic product of the present invention comprises: a substrate (10);
一表面，且其 之間的PMMA 一底塗層（20)，其係設置於該基材（1〇)的 係硬度在2H至8H之間，且最佳為4H至7H 材質； 一超硬鍍膜（30)， 其係利用真空金屬鍍膜技術形成於 201125459 該底塗層（20)之上。 請參看第二圖所示，本發明之電子產品的外殼的一實 施例，其係包括： 一基材（10);a surface, and a PMMA-priming layer (20) therebetween, which is disposed on the substrate (1〇) with a hardness between 2H and 8H, and preferably 4H to 7H; A coating (30) is formed on the undercoat layer (20) by 201125459 using a vacuum metallization technique. Referring to the second figure, an embodiment of the outer casing of the electronic product of the present invention comprises: a substrate (10);
一底塗層（20) ’其係設置於該基材（10)的一表面，且其 係硬度在2H至8H之間，且最佳為4|H至7H之間的PMMA 材質； 一保護層（40)，其係塗佈於該底塗層（2〇)上； 0 一超硬鑛膜（30) ’其係利用真空金屬鍍膜技術形成於 該保護層（40)之上。 其中，所述的底塗層（20)之「硬度在2H至8H之間」， 其意指包括在2H至7H之間'2H至6H之間、2H至5H 之間、2H至4H之間、2H至3H之間、3H至8H之間、3H 至7H之間、3H至6H之間、3H至5H之間、3H至41~1之 間、4 Η至8 Η之間、4 Η至7 Η之間、4 Η至6 Η之間、4 Η 至5Η之間、5Η至8Η之間、5Η至7Η之間、5H至6Η之 瞻間、6H至8H之間、6H至7H之間或7H至8H之間的數 值範圍，或者為2H、3H、4H、5H、6H、7H或8H之單一 數值。 而本發明之電子產品的外殼製作方法，其係包括： 提供一基材； 將一底塗劑塗布於該基材之表面’並使其以紫外光（uv) 和熱固化（therma丨curing)作用而固化而成為一底塗層； 利用真空金屬锻膜技術在該底塗層上形成一超硬鍍 膜’所利用的真空金屬鍍膜技術係與既有用於在刀具及模 11 201125459 =成^硬链膜的技術—樣，而且此技術已經在所屬技術 研九已久，雖然未得到成果，但於所屬領域中具有通 力知識者皆可得知其操料式及條件。 本發明人對於超硬_應用於3C電子產品的失敗原因 —、下的研〜’由於此研究亦為本發明之所以具有新賴 性與進步性的因素，故特在此陳述： Λ本發月人研究發現既有使用真空金屬鑛膜技術失敗 關鍵就在於表面精飾製程這個環節，若基材為塑膠材質， 其硬度不足原本就可理解，但若是金屬材質的基材，並無 硬度不足的疑慮。 現在就其中的關鍵詳細說明如下： «月參看第二Α至三〇圖所示，當外力（Α)壓迫基材（1〇) 而致使底塗層（2〇a)變形時，因為現有之底塗層（2Qa)多為硬 度不冋的彈性體，超硬鍍膜（3〇a)便會在壓力點上隨底 塗層（2Ga)之變形而產生應力，因超硬鑛膜（心)之材料大多 都是硬脆的材料，無法隨著底塗層（20a)而變形延展，遂發 生脆裂現象，如此便無保護之作用了。 再明參看第三E及三F圖所示，若此時再有橫向之摩 擦力（B)，該超硬鍍膜（3〇a)隨即會剝離，連同底塗層（2〇a) 亦會隨之剝離。 既有製作超硬鍍膜的產業人士皆認為是鍍膜厚度不 足，才致使鍍臈破裂，卻一再地增加鍍膜厚度，可是結果 卻一樣失敗，其係因為其並未將底塗層的材料一併考慮所 導致的結果。 而今’本發明之硬質底塗（Primer)材料，其硬度在 [S3 12 201125459 2H~8H之間，而原來超硬鍍膜因為底塗受外力變型所造成 的脆裂現象，已不復存在，亦即底塗已可承載外在壓力且 因本身之硬度足夠，不因外力而產生變形，所以超硬鍍膜 的膜厚即使只有10 A〜500 A，仍然沒有脆裂，仍可維持 其超对磨之特性。An undercoat layer (20) is disposed on a surface of the substrate (10) and has a hardness of between 2H and 8H, and is preferably a PMMA material between 4|H and 7H; a layer (40) coated on the undercoat layer (2 Å); 0 a super hard ore film (30) 'which is formed on the protective layer (40) by a vacuum metallization technique. Wherein, the undercoat layer (20) has a "hardness between 2H and 8H", which means that it is between 2H and 7H, between 2H and 6H, between 2H and 5H, and between 2H and 4H. Between 2H and 3H, between 3H and 8H, between 3H and 7H, between 3H and 6H, between 3H and 5H, between 3H and 41~1, between 4 Η and 8 、, 4 Η to Between 7 Η, 4 Η to 6 、, 4 Η to 5 、, 5 Η to 8 、, 5 Η to 7 、, 5H to 6 瞻, 6H to 8H, 6H to 7H Or a range of values between 7H and 8H, or a single value of 2H, 3H, 4H, 5H, 6H, 7H or 8H. The method for fabricating the outer casing of the electronic product of the present invention comprises: providing a substrate; applying a primer to the surface of the substrate and tempering it with ultraviolet light (UV) and heat (curing) The effect is to solidify and become a primer; the vacuum metal forging technology is used to form a super-hard coating on the undercoat layer. The vacuum metal coating technology used by the system is used both in the tool and the mold 11 201125459 = The technology of the chain film is the same, and this technology has been researched for a long time in the related art. Although no results have been obtained, those skilled in the art can know the mode and conditions of the operation. The inventor's failure reason for super hard application to 3C electronic products - the next research ~ ' Because this research is also a reason for the new and progressive nature of the invention, it is hereby stated: The monthly research found that the key to the failure of using vacuum metal ore film technology lies in the process of surface finishing process. If the substrate is made of plastic material, the hardness is not enough. However, if it is a metal substrate, there is no hardness. Doubt. The key details are as follows: «See the second to third figures for the month. When the external force (Α) presses the substrate (1〇) and causes the undercoat layer (2〇a) to deform, because of the existing The undercoat layer (2Qa) is mostly an elastic body with a hard hardness. The super-hard coating (3〇a) will cause stress at the pressure point with the deformation of the undercoat layer (2Ga) due to the super hard ore film (heart). Most of the materials are hard and brittle materials, which cannot be deformed and extended with the undercoat layer (20a), and the crucible phenomenon occurs, so that there is no protection. Referring again to the third and third F diagrams, if there is a lateral frictional force (B) at this time, the super-hard coating (3〇a) will be peeled off immediately, together with the undercoat layer (2〇a). Stripped with it. In the industry, people who made super-hard coatings thought that the thickness of the coating was insufficient, which caused the ruthenium to rupture, but repeatedly increased the thickness of the coating, but the result was the same, because it did not consider the material of the primer. The result. Nowadays, the hardness of the primer material of the present invention is between [S3 12 201125459 2H~8H, and the brittle fracture phenomenon of the original super-hard coating due to the deformation of the primer is no longer existed. That is, the primer can carry the external pressure and is sufficient for its own hardness, and does not deform due to external force. Therefore, even if the film thickness of the super-hard coating is only 10 A~500 A, there is still no brittle fracture, and the super-pair grinding can be maintained. Characteristics.
請參看第四A及四B圖所示，然而，因為大多的3C 電子產品外殼，在組裝時都會因機構的設計及環扣的方式 (即在近側邊處施以壓力（C)，此時基材（1〇)會施以反作用力 # (D))，容許外殼組裝時的壓扣變形，當底塗層（20b)之硬度 超過8H時’硬質底塗層（2〇b)也會因組裝壓扣的變形而直 接脆裂’如此導致超硬鍍膜（3〇b)也因底塗層（2〇b)的脆裂也 隨之脆裂（如下圖所示），故底塗層（2〇b)若超過8H之硬 度，在實際3C電子產品領域上，並無太大的應用功效。 因此，本發明將該底塗層（2〇b)的材料硬度界定於2H 至8H之間。 藉由上述之說明，本發明藉由控制底塗層之硬度在 籲2H-8H之間，避免該底塗層的彈性過大或硬度過大，故能 使以真空金屬鍍膜方式所形成的超硬鍍膜緊密結合於該底 塗層而不會產生脆裂或剝離的情形，故能保障電子產品 外殼之耐磨性，提升電子產品的品質。 實施例 [S] 以下各實施例係在不同硬度的底塗上以真空金屬鑛膜 技術施加超硬鑛膜，而以下實施例所提供之如材質、鍵膜 厚度等條件並㈣以限制本發明，而是用於示範本發明， 13 201125459 讓於所屬技術領域中具有通常知識者能夠據以實施，且經 過各種測試’證明本發明藉由調整底塗硬度，即可克服先 前技術存在已久的問題。 本發明實施例係將外殼進行以下測試： 1 · 4B附著力測試：用劃格器在鍍膜上切出十字形的格 子圖形，切口直至基板，用毛刷在對角線的方向各刷五次， 用膠帶貼在切口上再拉開；觀察格子區域的情況，且可用 放大鏡觀察。而所謂的4B係指丨S0等級為1、asTM等級 籲為4 B，其係在切口的相交處有小片剝落，劃格區内實際破 損不超過5%。 2· RCA 2000次耐磨擦測試：其係以型號為at_56〇l (法碼為275g，175g，55g三種）的RCA耐摩試驗機所 進行的試驗’來回摩擦的次數為2000次。 3· 1〇〇公分落球衝擊試驗：其係以型號為zb_lq _2〇〇 落球衝擊試驗機所進行的試驗，球重為3〇g，球直徑為 25mm ’試驗開始前將球調整為距基材彳〇〇公分。 鲁 4. 45撓曲後情形：其係於1〇公分的基材，兩端向内 把力’中間會產生勉曲變形，而夾角由原來的18〇。轉變為 135 °，亦即產生了 45。撓曲變形。 實施例1. 將形成於基材上的底塗層之硬度分別控制在HB~9H，， 該底塗層的厚度為20微米，再於該底塗層上以真空金屬鍍 膜的方式形成連續相的氧化鋁超硬鍍膜，本發明係利用型 號為YH-8H216-4C-4C的NCVM真空金屬鑛膜機，其壓力 ' m 14 201125459 係控制在2~5 X E-3，功率為4000 W，鍍膜時間為120秒， 令鍍膜厚度為1〇〇人（由於鍍膜厚度會影響45°撓曲後的情 形，因此調整為一致）。 其測試結果請參看表一所示。 表一 超硬鍍 膜材質 底塗硬度 4Β附著力測試 RCA 2000次 耐磨擦測試 100公分 落球衝擊試驗 45°撓曲 後情形 氧化鋁 HB Pass Pass 龜裂 Pass 氧化紹 Η Pass Pass 龜裂 Pass 氧化鋁 2Η Pass Pass 龜裂 Pass 氧化鋁 3Η Pass Pass 龜裂 Pass 氧化鋁 4Η Pass Pass Pass Pass 氧化鋁 5Η Pass Pass Pass Pass 氧化鋁 6Η Pass Pass Pass Pass 氧化鋁 7Η Pass Pass Pass Pass 氧化鋁 8Η Pass Pass Pass Pass 氧化鋁 9Η Pass Pass Pass 龜裂 由上表可知，當超硬鍍膜的材質為氧化鋁時，在底塗 層之硬度為4H至8H時可通過各項的試驗。而若底塗層之 硬度小於3H，則無法通過1 00公分落球衝擊試驗，而若該 底塗層之硬度大於9H，則經過45°撓曲後會產生龜裂的現 象。 實施例2. 將形成於基材上的底塗層之硬度分別控制在HB~9H，， 該底塗層的厚度為20微米，再於該底塗層上以真空金屬鍍 膜的方式形成連續相的二氧化矽超硬鍍膜，本發明係利用 型號為YH-8H216-4C-4C的NCVM真空金屬鍍膜機，其壓 力係控制在2~5 X E-3，功率為5600 W，鍍膜時間為100 [S] 15 201125459 秒，令鑛膜厚度為250 A。 其測試結果請參看表二所示。 表二 超硬鍍膜 材質 底塗硬度 4Β附著力測試 RCA 2000次 耐磨擦測試 100cm 落球衝擊試驗 45°撓曲 後情形 二氧化矽 ΗΒ Pass Pass 龜裂 Pass 二氧化矽 Η Pass Pass 龜裂 Pass 二氧化矽 2Η Pass Pass Pass Pass 二氧化矽 3Η Pass Pass Pass Pass 二氧化矽 4Η Pass Pass Pass Pass 二氧化矽 5Η Pass Pass Pass Pass 二氧化矽 6Η Pass Pass Pass Pass 二氧化矽 7Η Pass Pass Pass Pass 二氧化矽 8Η Pass Pass Pass 龜裂 二氧化矽 9Η Pass Pass Pass 龜裂Please refer to Figures 4A and 4B. However, because most 3C electronic products are assembled, they are assembled according to the design of the mechanism and the way of buckle (ie, applying pressure (C) at the near side). When the substrate (1〇) is subjected to a reaction force # (D)), the buckle of the outer casing is allowed to be deformed. When the hardness of the undercoat layer (20b) exceeds 8H, the hard undercoat layer (2〇b) is also It will be directly brittle due to the deformation of the assembly crimping buckle. This will cause the super-hard coating (3〇b) to also be brittle due to the brittle cracking of the undercoat layer (2〇b) (as shown in the figure below). If the layer (2〇b) exceeds the hardness of 8H, it does not have much application effect in the field of actual 3C electronic products. Therefore, the present invention defines the material hardness of the undercoat layer (2〇b) between 2H and 8H. By the above description, the present invention can prevent the undercoat layer from being excessively elastic or excessively hard by controlling the hardness of the undercoat layer between 2H and 8H, so that the superhard coating film formed by vacuum metal plating can be formed. It is tightly bonded to the undercoat layer without brittle or peeling, so that the wear resistance of the electronic product casing can be ensured and the quality of the electronic product can be improved. EXAMPLES [S] The following examples apply a superhard ore film by a vacuum metal ore film technique on a primer of different hardness, and the following examples provide conditions such as material, bond film thickness, and the like (4) to limit the present invention. Rather, it is used to demonstrate the invention, and 13 201125459 allows those of ordinary skill in the art to implement it, and through various tests 'proving that the present invention overcomes the long-standing nature of the prior art by adjusting the primer hardness. problem. In the embodiment of the present invention, the outer casing is subjected to the following tests: 1 · 4B adhesion test: a cross-shaped lattice pattern is cut on the coating film by a cross-cutter, the slit is up to the substrate, and the brush is brushed five times in the diagonal direction. Apply tape to the incision and pull it apart; observe the area of the grid and observe with a magnifying glass. The so-called 4B refers to the S0 level of 1, the asTM level is called 4 B, and there is a small piece of peeling at the intersection of the incisions, and the actual damage in the cross-cut area is not more than 5%. 2· RCA 2000 abrasion test: The test conducted by the RCA anti-friction tester of model at_56〇l (method 275g, 175g, 55g) was used for 2000 times. 3·1〇〇cm drop impact test: It is tested by the model zb_lq _2 drop ball impact tester, the ball weight is 3〇g, the ball diameter is 25mm 'The ball is adjusted to the distance from the substrate before the test starts.彳〇〇 cents. Lu 4. 45 After the deflection: It is tied to the base of 1 cm, and the ends are inward and the force is deformed in the middle, and the angle is from the original 18〇. The transition to 135 ° yielded 45. Flexure deformation. Example 1. The hardness of the undercoat layer formed on the substrate was controlled to be HB~9H, and the thickness of the undercoat layer was 20 micrometers, and a continuous phase was formed on the undercoat layer by vacuum metal plating. The alumina superhard coating, the invention uses the NCVM vacuum metal film machine of the model YH-8H216-4C-4C, the pressure ' m 14 201125459 is controlled at 2~5 X E-3, the power is 4000 W, The coating time is 120 seconds, and the coating thickness is 1 ( (the coating thickness is affected by the 45° deflection, so the adjustment is consistent). See Table 1 for the test results. Table 1 Super Hard Coating Material Primer Hardness 4Β Adhesion Test RCA 2000 Rub Test 100cm Falling Ball Impact Test 45° After Flexing Alumina HB Pass Pass Crack Pass Oxidation Pass Pass Crack Pass Alumina 2Η Pass Pass Crack Pass Alumina 3Η Pass Pass Crack Pass Alumina 4Η Pass Pass Pass Pass Alumina 5Η Pass Pass Pass Pass Alumina 6Η Pass Pass Pass Pass Alumina 7Η Pass Pass Pass Pass Alumina 8Η Pass Pass Pass Pass Alumina 9Η Pass Pass Pass As can be seen from the above table, when the super-hard coating is made of alumina, the hardness of the primer can be tested from 4H to 8H. If the hardness of the undercoat layer is less than 3H, the ball impact test of 100 cm cannot be passed, and if the hardness of the undercoat layer is greater than 9H, cracking may occur after 45° deflection. Example 2. The hardness of the undercoat layer formed on the substrate was controlled to be HB~9H, and the thickness of the undercoat layer was 20 μm, and a continuous phase was formed by vacuum metal plating on the undercoat layer. The ultra-hard coating of cerium oxide, the invention uses the NCVM vacuum metal coating machine of model YH-8H216-4C-4C, the pressure system is controlled at 2~5 X E-3, the power is 5600 W, and the coating time is 100. [S] 15 201125459 sec, making the film thickness 250 A. See Table 2 for the test results. Table 2 Super Hard Coating Material Primer Hardness 4Β Adhesion Test RCA 2000 Rubbing Test 100cm Falling Ball Impact Test 45° After Flexing Condition Ceria Pass Pass Crack Passing Ceria Pass Pass Crack Passing Dioxide矽2Η Pass Pass Pass Pass 二3Η Pass Pass Pass Pass 二2Η Pass Pass Pass Pass 二2Η Pass Pass Pass Pass 6 二 Pass Pass Pass Pass 二2Η Pass Pass Pass Pass 二8矽 Pass Pass Pass Pass Pass Pass Pass 9 Η Pass Pass Pass Crack
由上表可知，當超硬鍍膜的材質為二氧化矽時，在底 塗層之硬度為2H至7H時可通過各項的試驗。而若底塗層 之硬度為Η以下，則無法通過100公分落球衝擊試驗，而 若該底塗層之硬度為8Η以上，則經過45°撓曲後會產生龜 裂的現象。 综上所論，本發明提供控制底塗層之厚度即可使超硬 鍍膜具有高度穩定性，以通過各項耐摩 '耐衝擊之測試， 除此之外，本發明亦明確指出底塗層之厚度為2Η〜8Η，因 為無論超硬鍍膜為何種材質，只要當底塗層之硬度未達到 2Η或超過8Η勢必會造成外殼的損傷，而無法通過測試， 所以本發明能解決既有無法在基材上施加超硬鍍膜的問 題，使得3C電子產業往前邁進，且提供消費者更好的選擇， 因此爰以申請專利。 [S] 16 201125459 【圖式簡單說明】 第—圖係本發明之一實施例的側面剖視圖。 第二圖係本發明之另一實施例的側面剖視圖。 第三A至F圖係既有業界在底塗層上形成超硬鍍膜後 遇外力而使超硬鍍膜脆裂剝離的流程示意圖。 第四A及B圖係既有業界在底塗層上形成超硬鍍膜後 因外殼組裝時的壓扣變形而使超硬鍍膜脆裂的流程示意 圖。 ^ 【主要元件符號說明】 (10)基材 (20) (20a) (20b)底塗層 (30) (30a) (30b)超硬鍍膜 (40)保護層 (50)壓力點 (A) 外力 (B) 摩擦力 φ (C)壓力 (D)反作用力 [S] 17As can be seen from the above table, when the material of the super-hard coating is cerium oxide, the test can be passed when the hardness of the undercoat layer is 2H to 7H. On the other hand, if the hardness of the undercoat layer is Η or less, the 100 cm drop impact test cannot be passed, and if the hardness of the undercoat layer is 8 Å or more, cracking occurs after 45° deflection. In summary, the present invention provides that the thickness of the undercoat layer can be controlled to make the super-hard coating highly stable to pass various anti-wear and impact resistance tests. In addition, the present invention also clearly indicates the thickness of the undercoat layer. It is 2Η~8Η, because no matter what kind of material is used for the super-hard coating, if the hardness of the undercoat layer does not reach 2Η or exceeds 8Η, the damage of the outer casing will be caused, and the test cannot be passed. Therefore, the present invention can solve the problem that the substrate cannot be used. The problem of applying super-hard coating makes the 3C electronics industry move forward and provide consumers with better choices, so they apply for a patent. [S] 16 201125459 [Brief Description of the Drawings] The first drawing is a side cross-sectional view of an embodiment of the present invention. The second drawing is a side cross-sectional view of another embodiment of the present invention. The third A to F diagrams are schematic diagrams of the process in which the superhard coating is formed by superhard coating after the super-hard coating is formed on the undercoat layer. The fourth and fourth graphs are schematic diagrams of the process in which the superhard coating is brittle and cracked due to the deformation of the outer casing when the super-hard coating is formed on the undercoat layer. ^ [Main component symbol description] (10) Substrate (20) (20a) (20b) Undercoat (30) (30a) (30b) Super hard coating (40) Protective layer (50) Pressure point (A) External force (B) Friction force φ (C) Pressure (D) Reaction force [S] 17