201106411 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明是有關於一種擷取圖案化基板影像的裝置與方法 ，特別是有關於一種於連續移動平台上以一帶電粒子束 陣列掃描（raster scan) —圖案化基板的裝置與方法。 [先前技術] [0002] 傳統帶電粒子束成像系統例如掃描式電子顯微鏡 (Scanning Electron Microscope, SEM)利用一主帶 電粒子束（primary charged-particle beam)例如 —電子束（e-beam)陣列掃摇(raster scan)置於一靜止 平台上的試片。參考本發明圖示，第—属顯示一傳統的 帶電粒子束顯微鏡1 00。一帶電粒子東源]1〇例如一電子 搶（electron beam gun)產生一主帶電粒子束。_主帶 電粒子束透過聚光鏡模組（Condenser lens nmdule：) 120聚光並由一物鏡模組（〇bjective iens mQd-ule)130聚焦以形成一帶電‘手束探針 (charged-particle bedm probe)140。一偏向單元 (deflection uni t)150線性掃描帶電粒子束探針14〇橫 過置於一位於試片平台190上一試片195的表面。藉由移 動粒子束中心或將試片平台190朝垂直線性掃描方向移動 可將一維線性掃描轉換為二維陣列掃描。在帶電粒子束 探針140撞擊試片195之後，試片195將發出二次帶電粒 子160例如二次電子以及背向散射電子’並由一帶電粒子 偵測器170收集。由於二次電子數量對應於掃描區域電壓 或表面起伏形態（surface topography)，因此可以獲 0993142884-0 得表面起伏形態對比或電壓對比的二維影像。試片1 9 5可 099108483 表單編號A0101 第4頁/共46頁 201106411 以是圖案化基板例如一晶圓、一微影光罩或一半導體元 件，以及晶圓、微影光罩或半導體元件的組合等。 [0003] ❹ 第二（a)圖顯示一應用傳統技術的陣列掃描。如圖所示， 陣列掃描係沿垂直於線性掃描的方向重複線性掃描N次進 行。第二（b)圖顯示經傳統技術陣列掃描之基板的成像。 二次電子以及/或背向散射電子由一偵測器或多個偵測器 收集。在線性掃描進行時，於均等的時間區間内對偵測 器的輸出訊號進行取樣，以產生Μ像素之一線矩陣201。 將所有線性掃描的線像素矩陣結合可形成一二維像素矩 陣202，稱為一畫面，其中一畫面呈現經基板陣列掃描區 域的影像。影像的尺寸稱為可視範圍或視野範圍（Field of View, FOV)。 [0004] Ο 在一實際陣列掃描中，當進行到一掃描線的最後像素時 ，一主電子束移至下一掃描線的起始點。花在此一主電 子束驰返回（fly-back)所需額外的時間稱為線額外負 擔（line overhead)時間。為了易於解釋，線掃描僅 由以下所有的圖示中的有效線掃描表示，但線掃描時間 或線掃描重複週期實際上是在一晝面中量測開始進行一 線掃描至開始進行下一線掃描之間的時間，因而基本上 就會包含驰返回所需時間或是線額外負擔時間。畫面更 換時同樣需要驰返回時間。畫面時間或陣列掃描重複週 期是從開始顯示一畫面至顯示下一線畫面之間量測的時 間，包含返馳回或是額外負擔移動所需時間。 為了要提高畫面的品質，經常使用線平均與晝面平均二 種影像平均法。 099108483 表單編號A0101 第5頁/共46頁 0993142884-0 [0005] 201106411 [0006] 線平均法係於 線掃描多之前於同—位置重複進行 每一像素之錄&母影像線獲得像素ρ矩陣。逐一平均 矩陣結合形成:陣2生—平均線矩陣。將所有平均線 一維像素陣列的一線平均影像。 里面平Φ /*係重複進行相同的陣 — ，其中承疋的次數3 组一唯像^ 的狀態。此過程產生s 組一維像素起陣。逐 像素矩陣^ h料之矩村形成二維 《早-影像’即為-晝面平均影像。畫面平均 法可應用於線平均畫面。 一 [0007] 帶電粒子束檢查系統是以掃描式電子顯微鏡（EB !n_ spector)為基礎，通常以重複步進（step_and Repeat)模式與連續㈣模式這二種影像獲得模式 中任一種模式獲取檢查影像。 在進行檢查時，使用者選定基板（例如晶圓或光罩）上 圖案的特定區域進行掃描成像。這些區域稱為待檢查區 域（Areas of Interest，A〇I)。帶電粒子束檢查系 統或電子束檢查裝置（EB InspectOr)獲取涵蓋待檢查 區域的電子束影像並處理這些影像以辨識圖案中異常部 分或圖案上的外來異物。201106411 VI. Description of the Invention: [Technical Field] [0001] The present invention relates to an apparatus and method for capturing an image of a patterned substrate, and more particularly to scanning a charged particle beam array on a continuous moving platform (raster scan) — Apparatus and method for patterning a substrate. [Prior Art] [0002] A conventional charged particle beam imaging system such as a Scanning Electron Microscope (SEM) utilizes a primary charged-particle beam such as an electron beam (e-beam) array to sweep (raster scan) A test piece placed on a stationary platform. Referring to the illustration of the present invention, the first genus shows a conventional charged particle beam microscope 100. A charged particle east source, for example, an electron beam, produces a main charged particle beam. The main charged particle beam is condensed by a Condenser lens nmdule 120 and focused by an objective lens module to form a charged 'particle-mounted bed probe (charged-particle bedm probe) 140. A deflection uni 150 150 linearly scanned charged particle beam probe 14 is placed across a surface of a test strip 195 located on the test strip platform 190. One-dimensional linear scanning can be converted to a two-dimensional array scan by moving the center of the particle beam or moving the test piece platform 190 in a vertical linear scanning direction. After the charged particle beam probe 140 strikes the test strip 195, the test strip 195 will emit secondary charged particles 160 such as secondary electrons and backscattered electrons' and collected by a charged particle detector 170. Since the number of secondary electrons corresponds to the scanning area voltage or surface topography, a two-dimensional image of surface relief or voltage contrast can be obtained with 0993142884-0. Test piece 1 9 5 099108483 Form No. A0101 Page 4 / Total 46 page 201106411 To be a patterned substrate such as a wafer, a lithography mask or a semiconductor component, and a wafer, lithography mask or semiconductor component Combination, etc. [0003] The second (a) diagram shows an array scan using conventional techniques. As shown, the array scan is repeated linearly N times in a direction perpendicular to the linear scan. The second (b) image shows the imaging of the substrate scanned by the conventional technology array. The secondary electrons and/or backscattered electrons are collected by a detector or detectors. While the linear scan is in progress, the output signal of the detector is sampled in an equal time interval to produce a one-line matrix 201 of pixels. Combining all linearly scanned line pixel matrices to form a two dimensional pixel matrix 202, referred to as a picture, wherein a picture presents an image through the scanning area of the substrate array. The size of the image is called the visual range or field of view (FOV). [0004] Ο In an actual array scan, when the last pixel to a scan line is made, a main electron beam moves to the start of the next scan line. The extra time required to spend a fly-back on this primary electron is called the line overhead time. For ease of explanation, the line scan is only represented by the effective line scan in all of the following diagrams, but the line scan time or line scan repetition period is actually a one-line scan starting in one side of the measurement to start the next line scan. The time between them will basically include the time required for the return or the additional time of the line. It is also necessary to return the time when the screen is changed. The picture time or array scan repetition period is the time from the start of displaying a picture to the display of the next line of picture, including the time required to return or reload the extra load. In order to improve the quality of the picture, two methods of line averaging and line averaging are often used. 099108483 Form No. A0101 Page 5 / Total 46 Page 0993142884-0 [0005] 201106411 [0006] The line averaging method repeats the recording of each pixel in the same position before the line scan is performed. . The average matrix is combined one by one to form: matrix 2 - average line matrix. A one-line average image of all average line one-dimensional pixel arrays. The flat Φ /* system repeats the same array - in which the number of times of bearing is 3 and the state of ** is like ^. This process produces a set of one-dimensional pixels from the s group. The pixel-by-pixel matrix ^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^ The picture averaging method can be applied to the line average picture. [0007] The charged particle beam inspection system is based on a scanning electron microscope (EB!n_ spector), and is usually acquired in either of the two image acquisition modes: step_and repeat mode and continuous (four) mode. image. At the time of inspection, the user selects a particular area of the pattern on the substrate (e.g., wafer or reticle) for scanning imaging. These areas are called Areas of Interest (A〇I). A charged particle beam inspection system or an electron beam inspection device (EB InspectOr) acquires electron beam images covering the area to be inspected and processes the images to identify foreign objects in the abnormal portions or patterns in the pattern.
[0008] 在重複步進模式中，一連串的影像係透過連續 (sequential)方式獲得。第三圖顯示涵蓋一基板的待檢 查區域的傳統重複步進模式成像過程。承載基板的平台 沿平台步進方向移動使影像301成像於基板上，使圖案成 像區域的中心移至電子光軸（electr〇n 〇ptical )的中央（小誤差通常可容忍並由系統控制）。檢查區 099108483 表單編號A0101 第6頁/共46頁 0993142884-0 201106411 加的成像動作依所需步進動作進行，舉例來說，如箭頭 ，1所不。當移動完成，舉例來說，平台係處於靜止位置 命電粒子束則對成像區域進行陣列掃描。因此可獲得 代表掃插區域影像的二維㈣像素資料4台接著步進 靜止位置。此種過程重複至涵蓋所需之待檢查區 為止。線平均與畫面平均二種影像平均法經常用來 提内衫像的品質以達成所需的檢查靈敏度。 [0009] Ο 系統以重複步進模式操作的檢查產能大大受限於影像可 視乾圍以及平台步進時間。祕可視範H決定涵蓋待檢 —區域所需平台步進總次數，而平台步進時間主要取決 ;V進距離與可容忍位置誤差。平台步進時間純粹是額 外負擔時間（overhead Ume)且範圍在〇1至〇 5秒之 間。減少步進次數與平台步進時間係非常重要。 [0010] ❹ 最新式以重複步進模式作為預設影像獲得模式的電子束 檢查裝置’係狀電子光學設計達成大可視區域（Ui_ge Held of View，LF〇v).以—澥決上述產能受限的問題。e 第四（a)圖顯示傳統技術中使用;大可視區域 進模式。若大可視區机倍大於一般二= 域，涵蓋待檢查區域所需平台步進次數將以一係數L2減 少。如圖所示，保持與第三圖所示相同其他設定，影像 401的獲得係以相較於影像3〇1的可視區域三倍大的可視 區域。若影像301的尺寸為單一可視區域，則影像 尺寸為三個可視區域。成像動作再次依所需步進動作進 行，如箭頭402所示。如第四（a)圖所示，若使用大可視 區域影像4 01僅需要三個平台步進動作以涵蓋相同的待檢 099108483 表單編號A0101 第7頁/共46頁 0993142884-0 201106411 查區域303。與第三圖所示使用可視區域影像3〇1所需較 多步進動作相比’第四（3)圖所示實施例的產能明顯有所 提高。 [0011] 實際上大可視區域區分為多個次可視區域（sub_F〇V fields)以獲得低雜訊與利於進行高速陣列掃描。當每 一個次可視區域以傳統陣列掃描方式成像時，一相對低 頻率且與次可視區域畫面更新率同步的步進訊號，重疊 至陣列掃描訊號以依序定位或連結每一次可視區域。第 四（b)圖顯不傳統使用區會多個次可視區域的大可視區域 重複步進模式陣列掃描成像的無作。如圖所示一個平 0步進動作擁取的大可視區域影像M3包含四個次可視區 域404。成像動作再次如箭頭4〇2所示。每一次可視區域 陣列掃描之間帶電粒子束例如電子束的馳返回時間係可 心略'人可視區域的數目並不會改變平台步進的次數。 平U步進的次數主要取決羚大可視區域的尺寸。當所應 用大可視區域12倍大於-般正常可視區域，理想情況下 所需平台步進次數將以—係數144減少。儘管如此，當對 電子束檢查裝置更兩蓋能的無止盡需求驅使推升更高的 像素率、越來越短的影像陣列時間，平台步進時間仍然 是重複步進模式成像最主要的產能限制因素。 [0012] 第四（b)圖中顯示次可視區域4〇4的寬度遠小於其高度。 線掃描須以高速（高頻寬）電子電路驅動，維持雜訊符 合需求的規格則限制掃描線延伸的長度。粒子束掃描光 學架構須以㈣單方式建構，掃描範圍限以使粒子 束的模糊維持在可容忍_度。移動線掃描至下一掃描 099108483 表單編號A0101 第8頁/共46頁 0993142884-0 201106411 j需要較慢的f子電路，可允輕計者設計較大的動態 範圍但維持雜5fl在可容忍的程度。較慢的操作亦可允許 〜十者選擇-更複雜粒子束偏向架構，當線掃描逐漸自 次可视區域頂端移動-大段距離至底端時 ，允許虛擬 (nominal)粒子束路徑相對於粒子束性質而言受到最小 衝擊。 [0013] Ο 第五圖顯示傳統連續掃描模式成像技術。不像重複步進 模式依__如達錢掃描與掃減至掃描線步進 動作以涵蓋完整影像晝面，如圖所示，連續掃描模式中 平台以固定速度移動。平台以固定速度沿一平台移動方 向502移動’而電子束沿-線掃描方向50」自-與光轴間 有固定偏移的位置進行重複線掃描，線掃描方向5〇1通常 與平台移動方向502垂直。平台連續轉使成像動作連續 進行，如箭_3所示，直到獲得所需的影像量（長度） 為止。如此可關成相對長影⑹晝面。速續掃描模式中 G [0014] 試片係以平台速度乘以線掃描週期所得的相等間距進行 掃描。 第六⑷圖顯科統以連續掃料式進行之待檢查區域的 成像。如圖㈣…大面積待檢查區細丨可^連續朴 模式陣卿㈣彡成的魏絲像料蓋。相《像之門田 的平台移動方向係交替變換，如曲線箭_所示 蜿蜒平台掃描（serpentine 為 ta§e scan)，以於主 影像掃^間縮小平台移動㈣。㈣平台移時l 稱為平台轉向時間。 得間 099108483 對於大面積待檢魏域”連續料模式提供遠 表單編號A0101 馬於重 第9頁/共46頁[0008] In the repeat step mode, a series of images are obtained in a sequential manner. The third figure shows a conventional repeating step mode imaging process that covers the area to be inspected of a substrate. The platform carrying the substrate moves in the stepwise direction of the platform to image the image 301 onto the substrate such that the center of the patterned imaging region is moved to the center of the electron optical axis (electr〇n 〇ptical) (small errors are generally tolerable and controlled by the system). Inspection area 099108483 Form No. A0101 Page 6 of 46 0993142884-0 201106411 The added imaging action is performed according to the required stepping action, for example, as an arrow, 1 is not. When the movement is completed, for example, the platform is in a stationary position, and the life beam is scanned in an array of the imaged area. Therefore, 4 pieces of two-dimensional (four) pixel data representing the image of the swept area can be obtained and then stepped at the rest position. This process is repeated until the required area to be inspected is covered. Line averaging and picture averaging Two image averaging methods are often used to improve the quality of the blouse to achieve the desired inspection sensitivity. [0009] 检查 The inspection throughput of the system operating in repetitive step mode is greatly limited by the image viewable perimeter and platform step time. The secret visual H decides to cover the total number of steps required for the platform to be inspected, while the platform step time is mainly determined; the V-input distance and the tolerable position error. The platform step time is purely overhead Ume and ranges from 〇1 to 〇 5 seconds. It is important to reduce the number of steps and the stepping time of the platform. [0010] ❹ The latest version of the electron beam inspection device with the repeating step mode as the preset image acquisition mode 'systemized electro-optical design achieves a large visible area (Ui_ge Held of View, LF〇v). Limit problem. e The fourth (a) chart shows the use in the traditional technology; the large visual area enters the mode. If the large visible area is larger than the normal two = field, the number of steps required to cover the area to be inspected will be reduced by a factor L2. As shown, the other settings are maintained as shown in the third figure, and the image 401 is obtained by a visible area that is three times larger than the visible area of the image 3〇1. If the size of the image 301 is a single viewable area, the image size is three viewable areas. The imaging action is again performed in accordance with the desired step motion as indicated by arrow 402. As shown in the fourth (a) diagram, if the large visible area image 4 01 is used, only three platform stepping actions are required to cover the same pending 099108483 Form No. A0101 Page 7 / Total 46 Page 0993142884-0 201106411 Check Area 303 . The throughput of the embodiment shown in the fourth (3) diagram is significantly improved compared to the more stepping operations required to use the visible area image 3〇1 as shown in the third figure. [0011] In fact, the large visible area is divided into multiple sub-visible areas (sub_F〇V fields) to obtain low noise and facilitate high-speed array scanning. When each of the secondary visible regions is imaged by conventional array scanning, a relatively low frequency and synchronized signal with the secondary visible region picture update rate is superimposed to the array scan signal to sequentially locate or link each of the visible regions. The fourth (b) figure shows that the conventional use area will have a large visible area of multiple secondary visible areas. The large visible area image M3 captured by a flat 0 step motion as shown in the figure includes four secondary visible areas 404. The imaging action is again shown as arrow 4〇2. The return time of a charged particle beam, such as an electron beam, between each visible area array scan is such that the number of human visible areas does not change the number of steps of the platform. The number of flat U steps depends mainly on the size of the visible area of the antelope. When the applied large visible area is 12 times larger than the normal visible area, the desired number of platform steps will be reduced by a factor of 144. Nevertheless, when the endless demand for the two-capacity of the electron beam inspection device drives a higher pixel rate and a shorter image array time, the platform step time is still the most important step-by-step mode imaging. Capacity constraints. [0012] The width of the secondary visible area 4〇4 is shown in the fourth (b) diagram to be much smaller than its height. Line scans must be driven by high-speed (high-bandwidth) electronic circuits, and the specifications that maintain the noise requirements limit the length of the scan line extension. The particle beam scanning optical architecture must be constructed in a (4) single mode, and the scanning range is limited to maintain the blur of the particle beam to a tolerable degree. Moving Line Scan to Next Scan 099108483 Form No. A0101 Page 8 / Total 46 Page 0993142884-0 201106411 j A slower sub-circuit is required to allow the lighter to design a larger dynamic range but maintain a miscellaneous 5fl in tolerable degree. Slower operation can also allow ~10 choices - a more complex particle beam deflection architecture that allows the virtual particle beam path relative to the particle as the line scan gradually moves from the top of the secondary visible area - the large distance to the bottom end The beam is subjected to minimal impact. [0013] 第五 The fifth figure shows a conventional continuous scan mode imaging technique. Unlike the repeating step mode, the scan and sweep to the scan line step action is performed to cover the full image plane. As shown in the figure, the platform moves at a fixed speed in the continuous scan mode. The platform moves at a fixed speed along a platform moving direction 502 and the electron beam is in a line-scanning direction 50. The line is scanned at a fixed offset from the optical axis. The line scanning direction 5〇1 is usually the direction of the platform movement. 502 vertical. The continuous rotation of the platform causes the imaging action to continue continuously, as indicated by arrow _3, until the desired amount of image (length) is obtained. This can be turned into a relatively long shadow (6) face. In the continuous scan mode G [0014] The test piece is scanned at an equal interval obtained by multiplying the plate speed by the line scan period. The sixth (4) map shows the imaging of the area to be inspected by continuous sweeping. As shown in the figure (4)... A large area to be inspected in the area can be ^ 朴 朴 朴 模式 模式 模式 模式 模式 模式 模式 模式 模式 模式 模式 模式 模式 模式 模式 模式The direction of the platform movement of the image field is alternated, as shown by the curve arrow _ 蜿蜒 platform scan (serpentine is ta§e scan), to reduce the platform movement between the main image scans (4). (4) Platform shift time l is called platform turnaround time.得间 099108483 For the large area to be inspected Wei domain" continuous material mode provides far form number A0101 Ma Yuzhong Page 9 of 46
09931428S4H 201106411 時的產能，因為重複步進模式所需的平台步進 t連續掃指模式中將大幅減少。平台轉向的次數只 掃'掃描寬度劃分之待檢查區域高度的函數，因此平台 =方向一般選擇與長方形待檢查區域的長邊平行。 &掃為寬度’即連續掃描模式中檢查影像的高度，受限 因素，（1)電子光學設計的影像可視區域；（？）高速 掃為需求及可容忍掃描/仙雜訊。對於檢錢度相對窄 的小面積待檢查區域而言，舉例來說沿著平台移動方向 古檢查m須累積許錢查影像以涵蓋待檢查區域的 113度’累積平台轉向動作，而由於小面積待檢查區域有 限寬度導致每—影像的實際咸像時間，。平台轉向時間 、常以大約〇 · 7至2. 〇的係數‘，大於平台.步進哼間。 [0015] 第六⑻圖顯示傳統大可視區域以連續掃描模式與重 複步進模式進行之小面積待檢查區域的成像。如圖所示 ’假設待檢查區域603具有高度？4K，如果連續掃描模式 影像的高度為2Κ像素’將需要8平台轉向動作以涵蓋待檢 查區域603。另-方面利用大可視區域及m像素的尺寸 ’重複步進模式只須3平台步進動作。因此利用大可視區 域與重複步進模式利於小面積待檢查區域的成像，平台 步進次數少於連續掃描模式平台轉向次數。 〇 [0016] 對於分散的小面積待檢查區域或—晶方（die)中小面積 待檢查區域陣列而言，連續掃描模式中平台於非待檢查 區域以固定成像速度移動會浪費更多時間，或平台頻繁 以高速跳過非待檢查區域’但在平台進人待檢查區域前 需花費額外時間以使平台回心11定成像速度移動，此 099108483 表單編號A0101 第10頁/共46 頁 0993142884-0 201106411 時連續择描极 模式相較重複更？時間。此時原先連續掃描 於重複步進模式的產能優勢將快速消失，甚至劣 [0017] 連續掃插•nb)圓分別顯示傳統利用大可視區域以 區域701的^傻複乂進楱式進行之分散小面積待檢查 模式有利。如圖所示，利用大可視區域，重複步進 、Φ積待檢查區域701的成像，平台步進的次 (3x3=9)可少於連續掃描模式中平台轉向的次數09931428S4H 201106411 capacity, because the stepping t required for the repeat step mode t will be greatly reduced in the continuous sweep mode. The number of times the platform turns is only a function of the height of the area to be inspected divided by the scan width, so the platform = direction is generally chosen to be parallel to the long side of the rectangular area to be inspected. &sweep to width', that is, the height of the image in the continuous scan mode, limited factors, (1) the image visible area of the electro-optical design; (?) high-speed sweep for demand and tolerable scanning / sensation. For a small area to be inspected with a relatively narrow check rate, for example, along the direction of the platform movement, the ancient inspection m must accumulate a search image to cover the 113 degree 'cumulative platform steering action of the area to be inspected, and due to the small area The limited width of the area to be inspected results in an actual salt image time for each image. The platform turns to time, often with a factor of 〇 · 7 to 2. 〇 ‘, greater than the platform. [0015] The sixth (8) diagram shows the imaging of a small area to be inspected in the conventional large viewing area in the continuous scanning mode and the repeated stepping mode. As shown in the figure 'Assuming that the area to be inspected 603 has a height? 4K, if the height of the continuous scan mode image is 2 pixels], 8 platform steering actions will be required to cover the area to be inspected 603. Another aspect is to use the large visible area and the size of the m pixel. The repeat step mode requires only 3 platform stepping actions. Therefore, the large visible area and the repeated stepping mode are advantageous for imaging of a small area to be inspected, and the number of steps of the platform is less than the number of times of the continuous scanning mode platform. 〇[0016] For a small area of the area to be inspected or a small area of the area to be inspected in the die, the platform in the continuous scan mode will waste more time moving at a fixed imaging speed in the unchecked area, or The platform frequently skips the non-checked area at high speeds. However, it takes extra time to move the platform back to the imaging speed before the platform enters the inspection area. This 099108483 Form No. A0101 Page 10 of 46 0993142884-0 At 201106411, the continuous selection of the polar mode is more than the repetition? time. At this time, the capacity advantage of the original continuous scanning in the repeated stepping mode will quickly disappear, and even the inferior [0017] continuous sweeping • nb) circle respectively shows the dispersion of the traditional large-visible area by the region 701. A small area to be inspected is advantageous. As shown in the figure, using the large visible area, repeating the stepping, Φ imaging of the area to be inspected 701, the step of the platform stepping (3x3=9) can be less than the number of times the platform turns in the continuous scanning mode.
(6+6+3=15)。 [0018] [0019] 因此需要提H減財法以克服以題，本發明 可滿足此需求。 ： J( ->··*} f 【發明内容】 本發明提出電子束檢查裝置及獲得像素陣列影像的方法 ，獲得像素陣列影像的方法係藉由定速移動晶圓平台並 以電子束陣列掃描（一維持描）進行。 ^ .¾.. .... Ο [0020] 本發明提出的方法取消傳統重複步進模式中陣列掃描中 所需影像晝面更替之間的平台步進額外負擔時間（over head time) 。 此外 ’由於使用放大的可視區域因此減 少平台轉向的次數。 [0021] 在本發明的一些實施例中，本發明提出的方法亦提供獲 得沿平台移動方向平均或隨機分佈之小面積待檢查區域 (沿平台移動方向相對見度較窄）影像有效率的彈性作 法，而傳統連續掃描模式成像卻造成產能損失。 [0022] 在本發明其他實施例中，本發明提出的方法允許線掃描 099108483 表單編號A0101 第Π頁/共46頁 0993142884-0 201106411 沿平台移動方向，而 傳統連續掃_式成像*可能做到 [0023] [0024] [0025] :實施方式】 本發明係關於一獲得試片影像的裝置與方 、'左。式片可為 一圖案化基板例如一晶圓或微影製程光罩，伯土 ^ 1一未了簡化 起見僅稱試 >；。以下的敘述以實施例為範例以使本領域 具有一般技術者能製作及使用本發明並記栽於專利申& 書及相關所需文件中。較佳實施例的各種替換、修改與 等效實施例以及敘述中的上位原理與特徵對於本領域具 有一般技術者為顯而易見。因此本發a月的範圍並不阼； 所舉的實施例《本發明的最寬範固涵藎符合本發明^原理與特徵的實施例。 μ -傳統陣列掃描訊號-般是為了構成正方形區域晝面的 成像，亦即線掃描寬度等於畫面高度。所有實施例與相 關圖示並非本發明的限制，而可以延伸至，舉例來^ 其他長方形或一邊比相鄰另一邊長或短的平 T订四邊形。 如先前所述，本發明揭露固定於一連續移動平△上之試 片的陣列掃描裝置與方法。平台可以固定速产移動，1、 即固定速度與方向，或僅沿固定方向。陣列掃描於= 表面形成掃描線。陣列掃描產生的相鄰掃描線妒成一。 用為形成畫面（試片的影像資料）的二維線陣列。為 方便解釋，此線陣列的形成被視為一陣列掃描的—成了(6+6+3=15). [0019] Therefore, it is necessary to raise the H-cutting method to overcome the problem, and the present invention can satisfy this requirement. The present invention provides an electron beam inspection apparatus and a method for obtaining a pixel array image. The method for obtaining a pixel array image is to move the wafer platform at a constant speed and to use an electron beam array. The scanning (a maintenance drawing) is performed. ^ .3⁄4.. .... Ο [0020] The method proposed by the present invention cancels the additional stepping of the platform stepping between the required image replacement in the array scanning in the conventional repeated stepping mode Over head time. In addition, the number of platform turns is reduced due to the use of the enlarged viewable area. [0021] In some embodiments of the invention, the method proposed by the present invention also provides for obtaining an average or random distribution along the direction of movement of the platform. The small area to be inspected (the relative visibility is relatively narrow along the direction of the platform movement) is an efficient method of image elasticity, while the conventional continuous scanning mode imaging causes a loss of productivity. [0022] In other embodiments of the invention, the invention proposes Method allows line scan 099108483 Form No. A0101 Page / Total 46 Page 0993142884-0 201106411 Move along the platform, while traditional continuous scan _ imaging * possible [0025] [0025] Embodiments of the present invention relate to a device for obtaining a test piece image, and the left lens can be a patterned substrate such as a wafer or a lithography process mask. The following descriptions are given by way of example only to enable those skilled in the art to make and use the invention and to document the patent application and related Various alternatives, modifications, and equivalent embodiments of the preferred embodiments, as well as the above-described principles and features of the present invention, will be apparent to those of ordinary skill in the art. The embodiment of the present invention is in accordance with the embodiment of the present invention. The μ-traditional array scanning signal is generally used to form an image of a square region, that is, the line scan width is equal to the height of the image. All embodiments and related illustrations are not limiting of the invention, but may be extended to, for example, other rectangular or flat T-shaped quadrilaterals that are longer or shorter than the other adjacent side. As previously described, the present invention discloses An array scanning device and method for continuously moving a test piece on a flat △. The platform can be fixed to move at a fixed speed, 1. that is, a fixed speed and direction, or only in a fixed direction. The array scans on the surface to form a scan line. The adjacent scan lines are merged into one. A two-dimensional line array for forming a picture (image data of the test piece). For convenience of explanation, the formation of the line array is regarded as an array scan.
[0026] 099108483 在本發明一實施例中，揭露沿線掃描方向針對位於 續移動平台上之試片的陣列掃描方法。第八 連 國顯不本發 明一實施例中陣列掃描方法的操作。 表單編號Α0101 第12頁/共46頁 0993142884-0 201106411 [0027] [0028]Ο [0029] ❾ [0030] 於第八（a)圖中，τ電粒子束透過陣列掃描通過_位於靜 止位置的試片—方形或長方形影像資料經掃描成像'， 且-影像8 G1透過後稱為系統座標的靜止座標系統獲得。 系統座標永為靜止雜。另—方面，—本說明f經常使 用的對應移動座標為當平台移動時的試片座標。當平台 移動時取樣的座標為移動座標，當平台停止時則為靜止 (系統）座標。 於第八⑻圖中’平台上的試片沿―指向左與線掃描方向 802相反的方向803移動。如圖所示，粒子束掃過一試片 之偏斜平行四邊形（長方形）區域，當以移動試片座標 來看將獲得一影像804。影像8()1與8_第―掃描線的 位置係相同。因此為了枝轉町範例，第一掃描線 的起點设疋作為靜止座標系統的原點。 於第八（c)圖中’為了校正因移動平台所造成的偏斜掃描 區域，將使用補償偏移。第八（c)圖對應钤系統（靜止） 座標下具有補償偏移的陣列掃描操作:。':.如圖所示，每當 線掃描移向下一條線時，掃描粒子束（因此下一條線的 起點形成）則偏移一累積固定距離 d =平台速度（Stage Speed) X線掃插週期（Line Scan Period) 距離d大致4於一線知*描時的平台移動，如第八（b)圖所 示。換句話說，為了補償平台動作形成影像晝面的偏斜 角度，陣列掃描可以藉由每一線掃描起始點偏移以追隨 平台移動之偏斜方式進行，如第八（c)圖所示。 099108483 表單編號A0101 第13頁/共46頁 0993142884-0 201106411 [0031] 線掃描週期相當於物理掃描線的形成相_ 線的寬度視為線掃描的寬度。物理搞 田 哪抱線不必缺為影像 訊號收集㈣成影像的有效掃料。有欵掃描線寬度可 較物理掃描線寬度短。 又 [0032] 經以上描述後本領域具有-般技術者能了解影像晝面可 由有效掃描線寬度而非物理掃描線形成。因此所形成晝 面的長度或稱為畫面長度可較物理掃描線寬度長或短^ 此外，在本實施射，線掃描的方向平行於平台移動的 方向，掃描線寬度、有效掃描線寬度與畫面長度均沿平 台移動方向量測。 於第八⑷圖中’顯示-以移動試片座標觀看的校正影像 。如圖所示，若偏移距離精確配合平台移動，可獲得具 有校正垂直邊緣的一影像8〇5。 [0033] 由於進行線掃描時平台係連續移動，當平台朝線掃描相 反方向時試片上有效線掃描t度會擴展―距靴，當平 台朝線掃描相同方㈣試片上有效線_寬度會縮短距 離dL 〇 [0034] I平台速度（StageSpeed)x有效線掃描時間（Ef_ fective Line Scan Time) [0035] 2致線掃描時間為有效掃描線形成的時間_。有效線 =時間為整個線掃描錢週_—較部分。線掃描 ^度取決於線掃描訊號強度1此，線掃描寬度，亦即 、·泉掃描訊號強度係調整至補償dI 厶心ώ 用1城以使減片上掃描寬度符 。預疋線掃描寬度’如第八(e)圖與第八⑴圖所示4 099108483 4單蝙號A0101 第14頁/共46頁 201106411 此可得到具有校正掃描區域寬度的影像8〇6。 [0036] 在一實施例中’揭露於—陣列掃描操作中執行線平均的 方法。第九圖顯示本發明一實施例中執行線平均的方法 。線平均的執行可使用累積偏移量d，如第八（b)圖與第 Ο 八（c)圖所示’於每一單一線掃描依序並於陣列掃描線至 線偏移方向902中一固定位置進行。偏移量d可使用累積 ，舉例來說，目前影像之第一線掃描的起點，無論目前 影像是否經畫面平均。換句話說，當即將形成的影像中 第一線掃描起點通過目前線掃描起點時，累積偏移量為 可被看見的平台移動的距離。同時畫面平均亦可應用於 上述影像’相關内容則伴隨第十圖將進行更進一步的敘 述。線至鍊偏移方向902垂直線掃描方向。為了方便 解釋，本發明所有實施例中此特徵均為真。舉例來說， 取X為線掃描方向與y為線至線偏移方向〗線平均可藉由 ο 沿X方向於固定y位置重複緣掃描執行。接著，自重複線 掃描而獲得之線矩陣則被平均，像素接著像素，如前述 先前技術的相同方式…經平均化的線像素矩陣因此獲 得。於第九U)圖中，顯示一未經線平均的影像。於 第九（b)圖與第九（c)圖中，顯示分別經二重與三重線平 原始掃描線’ *錢線與箭财域續形柄重複掃描 線以表現線平均的效應。第九圖中左手侧部份係由系統 (静幻座標觀之，而第九圖中右手侧部份係由試片（ 移動）座標觀之。 [0037] 於一實施财，揭露於-陣列掃描操作中執行晝面平均 099108483 表單編號A0101 第15頁/共46頁 0993142884-0 201106411 的方法。第十圖顯示本發明一實施例中執行畫面平均的 方法。如圖所示，藉由於移動試片之相同位置上重複相 同陣列掃描及加入累積偏移量dF至連續陣列掃描可執行 畫面平均。偏移量dF可為累積經畫面平均的影像之第一 陣列掃描之第一線掃描起點。因此偏移量dF可表示為： [0038] dF =平台速度（Stage Speed ) X陣列掃描重複週期（ Raster Scan Repetition Period) [0039] 如先前所述，累積偏移量為當經晝面平均的影像之第一 陣列掃描之第一線掃描起點通過現有陣列掃描之現有線 掃描起點時平台移動的距離。然後，獲得之畫面影像被 像素接著像素平均化，以形成經平均化的畫面像素。如 前述先前技術的相同方式。經平均化的畫面像素。於第 十（a)圖中，試片是處於靜止狀態。對於畫面1 (實線與 箭頭）與畫面2 (灰斷線與箭頭）而言陣列掃描僅為於試 片上相同位置簡單重複進行，對應的像素則被平均化以 表示右侧平均影像1001的像素。於第十（b)圖中，試片以 定速沿一方向1100移動以指向左方。畫面2 (灰斷線與箭 頭）的陣列掃描緊隨畫面1(實線與箭頭）的陣列掃描之 後，同時具有累積偏移量dF以補償平台移動。畫面1與畫 面2之間對應線掃描重疊於試片（移動）座標。對應的像 素被平均化以表示右側被平均化影像1 002的像素。 [0040] 於一實施例中，揭露一於移動試片上獲得多個連續晝面 的方法。重複具有累積線掃描偏移的陣列掃描產生一連 串等距試片表面長方形影像。線掃描偏移係於影像的畫 面之間重設。每當一畫面影像完成，帶電粒子束指向下 099108483 表單編號A0101 第16頁/共46頁 0993142884-0 201106411 一個晝面影像的第一線掃描起始位置，下一個畫面影像 之線掃描自第一線掃描起始位置再開始累積線掃描偏移 〇 [0041] Ο 第十一圖顯示本發明一實施例中不同模式之影像獲得方 法。在進入第十一圖的細節之前，須先定義影像寬度此 一物理量。當對一試片進行陣列掃描，具有平行四邊形 形狀的畫面影像係由複數彼此相鄰掃描線組成的二維線 陣列形式形成。此包含最常見正方形與長方形的平行四 邊形具有二對平行邊。二對平行邊中至少一對的平行邊 或其延伸線會與平台移動軸相交。本發明一實施例中影 像寬度為沿平台移動軸平行邊（或其延伸線）二相交點 之間的距離。此定義適用本發明所有實施例，無論形成 的畫面影像形狀為何。以影像寬度為選擇性因素，可以 不同方法獲得一系列的影像。如圖所示，取決於平台速 度所獲得的一系列的影像為： [0042] Ο (a) 若平台速度〈影像寬度/陣列掃描重複週期為部分重疊 9 (b) 若平台速度=影像寬度/陣列掃描重複週期為連結， (c) 若平台速度〉影像寬度/陣列掃描重複週期為以一空隙 隔開。 [0043] 於本實施例中影像寬度約等於第十一圖中所示之有效掃 描線的長度。 本實施例亦可提供於一大面積待檢查區域内影像區域平 均取樣片段（區域平均取樣影像片段）。舉例來說，若 一畫面影像寬度均分為二部份，可應用50%取樣比率。 099108483 表單編號A0101 第17頁/共46頁 0993142884-0 201106411 [0044] [0045] 於第十一（a)圖中，獲得一系列沿平台移動方向丨丨“的部 刀重疊畫面影像111〇。平台速度設定為小於影像寬度/陣 列掃私重複週期。實際上當擷取―系列畫面影像以補償 可能的位置誤差或為了獲得更多賴後影像處理例如影像 對準時犧牲之邊緣區域時—定程度的部份重叠是屬必要 〇 若重疊比率不小於K且可被表示為（2N_1)/2N， (N=1’2’3’…），將產生N個畫面平均的連續影像。舉如 例來說’重疊比率％對應於二個畫面平均；重疊比率％對 應於四個獲得的畫面平轉。在一逮績畫面獲得過程中第 一與最後畫面間有-片段並未以㈣畫面大小完全重4 且應被犧牲。在此晝面平觸實施第十圖所示者不 同’如第十圖所不影像由—具有完整尺寸影像的畫面平 均’而第十—圖的影像係由—僅有片段影像的畫面平均 〇 ;第十（b)圖中，顯不獲得一系对沿平合移動方向彼此 連接的畫面影像1120。第十二圖中進-步顯示更多細節 平D速度^為A料於影像寬度"車騎描重複週期 。第十二圖顯轉據本發明—實施_得之連結影像， ’、中W系統（靜止）座標角度觀看的獲得影像Η ^顯示 於左侧，而以试片（移動）座標角度觀看的相同影像 1201顯示於右側。如第十二圖所示，類似於第四圖所示 之傳統重複步進模式，但不同的是本發明之實施例沿平 台移動方向的成像殘平台步進額外負擔（Gverhead) 時間，因此提升產能。 099108483 表單編號A0101 第18頁/共46 頁 0993142884-0 201106411 [0046] ❹ [0047] 另一方面，當與第五圖所示之傳統連續掃描模式成像相 比，第十二圖中顯示之實施例的優點為其彈性晝面長度 控制，首先，畫面影像的高度可大於傳統連續掃描模式 晝面影像的高度，而大致等於線掃描寬度。本實施例可 使待檢查區域成像高度大於線掃描寬度，使涵蓋待檢查 區域所需的平台轉向次數較少。此外畫面影像的高度亦 可以短於傳統連續掃描模式線掃描寬度。本實施例可使 待檢查區域成像高度小於線掃描寬度，使晝面影像之線 掃描次數減少且平台可以更快速度移動。 ❹ 於第十一（c)圖中，顯示獲得一系列沿平台移動方向1101 彼此等距的晝面影像1130。第十三圖中進一步顯示更多 細節。平台速度設定為大於影像寬度/陣列掃描重複週期 。第十三圖顯示根據本發明一實施例獲得之彼此等距影 像，其中以系統（靜止）座標角度觀看的獲得影像1130 顯示於左側，而以試片（移動）座標角度取看的相同影 像1301顯示於右側。本實施例影像1301的每一畫面為彼 此等距。本實施例的一個特別應用為彼此等距狹窄待檢 查區域1310陣列的成像。待檢查區域1310的狹窄一側可 由一線掃描涵蓋且相鄰待檢查區域1310之間空間小於影 像1301的最大長度。每一影像1301的長度及二連續晝面 1301之間空間係由平台速度、每一晝面的線掃描次數及 線掃描步進尺寸控制。 於第十三圖中，檢查區域陣列中單一待檢查區域1310不 須彼此等距，若基於掃描式電子顯微鏡（電子束檢查裝 置）帶電粒子束檢查系統是基於以下設定（1)陣列畫面可 099108483 表單編號A0101 第19頁/共46頁 0993142884-0 [0048] 201106411 被觸發（2)陣列畫_發時機由定序”式化，將平么 位置設定於定序器（3)每—序 ° 移並由定序！^纽。 之陣觸轉受掃描偏 [0049] [0050] ㈣„的切掃描方向平行於 平台移動方向㈣列掃描方法。於其他實施例中，線掃 描方向與平台移動方向的不同關係亦為可能。第十四圖 顯示本發明m财，針對-位於-以定速移動之 平台上的試片之陣列掃描，其平台移動方向垂直於線掃 描方向。 於第十四时，平台移財向為水平並由指向左方箭頭 1402顯示’而線掃描方向為垂直並由指向上方箭頭1401 顯不。第切圖的上方部分顯示傳統連續掃描模式。左 側箭頭1403表示重複線掃描動作。右侧箭頭"μ表示以 试片（移動）座標角度觀看的獲得影像。如圖所示傳 統連續掃描成像模式中線掃描係助利距重複，間距 等於平台職絲_贿期。第十_的下方部分顯 示目前實施例的陣列掃描操作1左侧箭頭陣列14〇 陣列掃描動作。右手侧圖形14_示以試片（移動 標角度觀看的獲得影像。 第十四圖的實施例中陣列掃描之線掃描方向i4qi保持與 平台移動方向魔垂直，而線至線推進為平台機械移動 與陣列掃描内電偏移的結合效應。當進行陣列掃描時線 掃描保持在一固定位置時，本實施例與第五圖所示之傳 統連續掃描成像相同。 根據此貫施例，取決於平台速度，陣列掃描方法所得系 099108483 表單編號A0101 第20頁/共46頁 0993142884-0 201106411 列的影像可為： I:平台速度〈影像寬度/陣列掃描重複週期為邹分重40900268483 In an embodiment of the invention, an array scanning method for a test piece located on a continuously moving platform along a line scanning direction is disclosed. The eighth operation shows the operation of the array scanning method in an embodiment. Form No. 1010101 Page 12/46 Pages 0993142884-0 201106411 [0028] [0030] In the eighth (a) diagram, the τ electro-particle beam is transmitted through the array through the _ in the rest position The test piece—square or rectangular image data is scanned and imaged', and the image 8 G1 is obtained by a static coordinate system called a system coordinate. The system coordinates are always static. On the other hand, the corresponding moving coordinates that are often used in this description f are the test piece coordinates when the platform is moved. The coordinates sampled when the platform moves are moving coordinates, and when the platform stops, it is a stationary (system) coordinate. In the eighth (8) diagram, the test piece on the 'platform' moves in a direction 803 opposite to the left direction of the line scanning direction 802. As shown, the particle beam sweeps across the skewed parallelogram (rectangular) region of a test strip, and an image 804 is obtained when moving the test strip coordinates. The positions of the image 8 () 1 and the 8_th scan line are the same. Therefore, for the Shimonoseki example, the starting point of the first scanning line is set as the origin of the stationary coordinate system. In the eighth (c) diagram, in order to correct the skewed scan area caused by the mobile platform, the offset offset will be used. The eighth (c) map corresponds to the array scan operation with compensation offset under the ( system (still) coordinates: ': As shown in the figure, each time the line scan moves to the next line, the particle beam is scanned (so the starting point of the next line is formed) offset by a cumulative fixed distance d = Stage Speed X-ray sweep Line Scan Period The distance d is approximately 4 in the first-line knowledge of the platform movement, as shown in Figure 8(b). In other words, in order to compensate for the skew angle of the image plane to form the image plane, the array scan can be performed by following each line scan starting point offset to follow the skew of the platform movement, as shown in the eighth (c). 099108483 Form No. A0101 Page 13 of 46 0993142884-0 201106411 [0031] The line scan period is equivalent to the formation of the physical scan line. The width of the line is considered to be the width of the line scan. Physics to engage in the field Which line does not need to be lack of image signal collection (four) into the effective scanning of images. The width of the scan line can be shorter than the width of the physical scan line. [0032] It will be apparent to those skilled in the art, after the above description, that the image plane can be formed by an effective scan line width rather than a physical scan line. Therefore, the length of the formed face, or the length of the picture, can be longer or shorter than the width of the physical scan line. Further, in the present embodiment, the direction of the line scan is parallel to the direction in which the stage moves, the scan line width, the effective scan line width, and the picture. The length is measured along the direction of movement of the platform. In the eighth (4) diagram, 'Display' - the corrected image viewed with the moving test piece coordinates. As shown, if the offset distance is precisely matched to the movement of the platform, an image 8〇5 with a corrected vertical edge can be obtained. [0033] Since the platform moves continuously during the line scan, when the platform scans in the opposite direction of the line, the effective line scan t degree on the test piece will expand - the distance from the boot, when the platform scans the same side of the line (4), the effective line _ width is shortened. Distance dL 〇 [0034] I Stage Speed x Effective Line Scan Time [0035] The 2-line scan time is the time _ when the effective scan line is formed. Effective line = time is the entire line scan money week _ - the part. Line scan ^ degree depends on the line scan signal intensity 1 this, the line scan width, that is, the spring scan signal strength is adjusted to compensate dI 厶 heart ώ Use 1 city to make the scan width on the minus. The pre-twist line scan width is as shown in the eighth (e) and eighth (1) figures. 4 099108483 4 single bat number A0101 page 14 / page 46 201106411 This results in an image 8〇6 having the corrected scan area width. [0036] In one embodiment, a method of performing line averaging in an array scan operation is disclosed. The ninth diagram shows a method of performing line averaging in an embodiment of the present invention. The line average execution may use the cumulative offset d, as shown in the eighth (b) and the eighth (c) diagrams, in each single line scan sequentially in the array scan line to line offset direction 902. A fixed position is made. The offset d can be accumulated, for example, the starting point of the first line scan of the current image, regardless of whether the current image is averaged over the screen. In other words, when the first line scan start point in the image to be formed passes the current line scan start point, the cumulative offset is the distance that the visible platform can move. At the same time, the average picture can also be applied to the above image. The related content will be further described with the tenth figure. Line to chain offset direction 902 vertical line scan direction. For ease of explanation, this feature is true in all embodiments of the invention. For example, taking X as the line scan direction and y as the line to line offset direction line average can be performed by repeating the edge scan at the fixed y position along the X direction. Next, the line matrix obtained from the repeated line scan is averaged, and the pixels are followed by pixels, which are obtained in the same manner as in the prior art described above...the averaged line pixel matrix is thus obtained. In the ninth U) diagram, an image that is not line averaged is displayed. In the ninth (b) and ninth (c) diagrams, the effect of the line average is repeated by repeating the scan lines with the double and triple lines of the original scan line '*$ and the arrow's continuation handle respectively. In the ninth figure, the left-hand side part is viewed by the system (the static coordinate view, and the right-hand side part of the ninth figure is viewed from the test piece (moving) coordinates. [0037] In the implementation of the financial, the disclosure is in the array The method of performing face average 099108483 form number A0101 page 15 / page 46 0993142884-0 201106411 in the scan operation. The tenth figure shows a method of performing picture averaging in an embodiment of the present invention. The same array scan is repeated at the same position of the slice and the cumulative offset dF is added to the continuous array scan executable picture average. The offset dF may be the first line scan start point of the first array scan of the accumulated picture-averaged image. The offset dF can be expressed as: [0038] dF = Stage Speed Xaster Scan Repetition Period [0039] As previously described, the cumulative offset is the image that is averaged over the surface The first line scan starting point of the first array scan is the distance moved by the platform when the existing line scans the existing line scan. Then, the obtained picture image is averaged by the pixel and then the pixel to The averaged picture pixels are the same as in the previous prior art. The averaged picture pixels. In the tenth (a) picture, the test piece is in a stationary state. For picture 1 (solid line and arrow) and picture 2 (Gray break line and arrow) The array scan is simply repeated at the same position on the test piece, and the corresponding pixels are averaged to represent the pixels of the right average image 1001. In the tenth (b) figure, try The slice moves at a constant speed in a direction of 1100 to point to the left. The array scan of picture 2 (gray break line and arrow) follows the array scan of picture 1 (solid line and arrow) with a cumulative offset dF to compensate The platform moves. The corresponding line scan between screen 1 and screen 2 is superimposed on the test piece (moving) coordinates. The corresponding pixels are averaged to represent the pixels on the right side of the averaged image 1 002. [0040] In an embodiment, the disclosure A method of obtaining a plurality of continuous faces on a moving test piece. Repeating an array scan with an accumulated line scan offset produces a series of rectangular images of the surface of the equidistant test piece. The line scan offset is reset between the images of the image. Whenever a picture is completed, the charged particle beam points down. 099108483 Form No. A0101 Page 16 / Total 46 Page 0993142884-0 201106411 The first line scan start position of a face image, the line of the next picture image is scanned from the first The line scan start position resumes the accumulated line scan offset 〇 [0041] Ο The eleventh figure shows an image acquisition method for different modes in an embodiment of the present invention. Before entering the details of the eleventh figure, the image width must be defined. This physical quantity is formed by performing an array scan on a test piece, and a picture image having a parallelogram shape is formed by a two-dimensional line array composed of a plurality of adjacent scanning lines. This parallelogram with the most common squares and rectangles has two pairs of parallel sides. The parallel sides of at least one of the two pairs of parallel sides or their extension lines will intersect the platform movement axis. In one embodiment of the invention, the image width is the distance between two intersecting points along the parallel side of the axis of movement of the platform (or its extension). This definition applies to all embodiments of the present invention regardless of the shape of the formed picture image. With the image width as an optional factor, a series of images can be obtained in different ways. As shown, the series of images obtained depending on the platform speed are: [0042] Ο (a) If the platform speed <image width/array scan repetition period is partially overlapped 9 (b) If platform speed = image width / The array scan repetition period is a link, (c) if the platform speed > image width / array scan repetition period is separated by a gap. [0043] In the present embodiment, the image width is approximately equal to the length of the effective scanning line shown in the eleventh figure. This embodiment can also provide an average sampling segment (area average sampled video segment) of an image area in a large area to be inspected. For example, if the width of a screen image is divided into two parts, a 50% sampling ratio can be applied. 099108483 Form No. A0101 Page 17 / Total 46 Page 0993142884-0 201106411 [0045] In the eleventh (a) figure, a series of partial knife overlapping screen images 111 沿 along the direction of movement of the platform are obtained. The platform speed is set to be less than the image width/array sweep repetition period. In fact, when capturing a series of image images to compensate for possible positional errors or to obtain more edge regions for image processing such as image alignment, Partial overlap is necessary. If the overlap ratio is not less than K and can be expressed as (2N_1)/2N, (N=1'2'3'...), a continuous image of N picture averages will be generated. Say 'overlap ratio % corresponds to two picture averages; overlap ratio % corresponds to four obtained picture pans. There is a - segment between the first and last pictures in the capture picture acquisition process is not completely (4) picture size 4 and should be sacrificed. In this case, the one shown in the tenth figure is different. 'If the image is not in the tenth image—the average of the image with the full size image' and the image of the tenth image is only—only Fragment image The average value of the picture is 〇; in the tenth (b) figure, a series of picture images 1120 connected to each other along the moving direction of the flattening are not obtained. In the twelfth figure, the step-by-step display shows more details of the flat D speed ^ Image Width "Car Riding Repetition Cycle. Twelfth Figure shows the image obtained by the present invention-implementing the connected image, ', the middle W system (still) coordinate angle viewing Η ^ is displayed on the left side, and The same image 1201 viewed at the coordinate angle of the test piece (moving) is displayed on the right side. As shown in the twelfth figure, it is similar to the conventional repeated stepping mode shown in the fourth figure, but the embodiment of the present invention moves along the platform. The direction of the image remnant platform steps the extra burden (Gverhead) time, thus increasing the capacity. 099108483 Form No. A0101 Page 18 of 46 0993142884-0 201106411 [0046] ❹ [0047] On the other hand, when compared with the fifth figure Compared with the conventional continuous scan mode imaging, the advantage of the embodiment shown in the twelfth figure is the elastic face length control. First, the height of the image of the screen can be greater than the height of the image of the conventional continuous scan mode. The image scanning width is equal to the line scan width. In this embodiment, the image height of the area to be inspected is greater than the line scan width, so that the number of times of the platform required to cover the area to be inspected is less. Moreover, the height of the image of the screen can be shorter than that of the conventional continuous scan mode line scan. Width. In this embodiment, the imaging height of the area to be inspected is smaller than the line scanning width, so that the number of line scans of the kneading image is reduced and the platform can be moved at a faster speed. 于 In the eleventh (c) figure, the display obtains a series of edges. The platform movement direction 1101 is a facet image 1130 that is equidistant from each other. Further details are shown in the thirteenth diagram. The platform speed is set to be greater than the image width/array scan repeat period. Figure 13 shows an equidistant image obtained in accordance with an embodiment of the present invention, wherein the acquired image 1130 viewed at a system (still) coordinate angle is displayed on the left side, and the same image 1301 taken at the coordinate angle of the test piece (moving) coordinates Shown on the right. Each picture of the image 1301 of this embodiment is equidistant from each other. One particular application of this embodiment is imaging of an array of equally narrow regions to be inspected 1310 from each other. The narrow side of the area to be inspected 1310 can be covered by a line scan and the space between adjacent areas to be inspected 1310 is smaller than the maximum length of the image 1301. The length of each image 1301 and the space between two consecutive faces 1301 are controlled by the platform speed, the number of line scans per face, and the line scan step size. In the thirteenth figure, the single area to be inspected 1310 in the inspection area array does not have to be equidistant from each other, and the charged particle beam inspection system based on the scanning electron microscope (electron beam inspection apparatus) is based on the following settings (1) the array screen can be 099108483 Form No. A0101 Page 19/Total 46 Page 0993142884-0 [0048] 201106411 Triggered (2) Array Drawing _ The timing is set by the sequence, and the position is set to the sequencer (3) per-order Shifted by the sequence! ^ Newton. The touch of the array is affected by the scan bias [0049] [4] The scan direction of the cut is parallel to the direction of the platform movement (four) column scan method. In other embodiments, a different relationship between the line scanning direction and the direction of movement of the platform is also possible. Fig. 14 shows an array scan of the test piece on the platform which is located at a constant speed, and the direction of movement of the platform is perpendicular to the line scanning direction. At the fourteenth hour, the platform moves horizontally and is displayed by pointing to the left arrow 1402' while the line scan direction is vertical and is indicated by the upward pointing arrow 1401. The upper part of the first cut shows the traditional continuous scan mode. The left arrow 1403 indicates a repeating line scanning action. The right arrow "μ indicates the acquired image viewed at the angle of the test piece (moving) coordinate. As shown in the figure, in the traditional continuous scanning imaging mode, the line scan system is used to repeat the distance, and the spacing is equal to the platform position. The lower portion of the tenth_ shows the array scanning operation 1 of the present embodiment, the left arrow array 14 阵列 array scanning operation. The right-hand side graphic 14_ shows the test piece (the obtained image is viewed by moving the target angle. In the embodiment of the fourteenth embodiment, the line scan direction i4qi of the array scan remains perpendicular to the direction of the platform movement, and the line-to-line advancement is the mechanical movement of the platform. The combined effect of the internal electrical offset with the array scan. This embodiment is identical to the conventional continuous scan imaging shown in the fifth figure when the line scan is held at a fixed position during the array scan. According to this embodiment, depending on the platform Speed, array scanning method is obtained 099108483 Form No. A0101 Page 20 / Total 46 Page 0993142884-0 201106411 The image of the column can be: I: platform speed <image width / array scan repetition period is Zou points 4
若重叠比率可被表示為（2n_1)/2n，（I 產生N個晝面平均的連續影像。舉如例，將 對應於二個畫面平均；重疊 5 ’重疊比料 平均。 登匕羊靖應於四個獲得的畫面 Ο ❹ [0051] 099108483 (b)若平台速度=影像寬度/陣列掃描 ::,_影像寬度"車=空隙 於此實施财，當料線垂直 形影像形成自-陣列掃描而其邊中之=向，-長方 軸以直角相交。影像寬度因此為陣⑽邊。平台移動之 列中第-形成掃描線1415與最後=形成—線陣 距離⑷卜如第十四圖的下方部分所^線⑷6之間的 本實施例亦可為# ,、 取樣…二— ，若一書面影德 ’、 又）的方式。舉例來說 第十四圖时施“度均分為二部份對應於50%取樣比率。 列掃描之—制勒為窄待檢查區域的陣 的窄待檢奸：發明實施例中彼此相隔-距離 π乍待檢查區域的陣列掃描。 十四圖所示，陣 第十五圖所示，再如第 平台移動方_2‘。°4之線掃描方向“°1設定為與 第十五圖底部區域 描模式，其中左側箭頭 圖）圖形顯示傳統連續掃 貝403表7㈣㈣# 〇 表軍編號删1第_8㈣ 201106411 上方右手部分說明以試 影像U12，以用於.—1移動）座標角度觀看的獲得 形成）咖2隔開的待檢查或空白區域（無圖案 連續掃插成像模式中心—區域1501。如圖所示，傳統 於平台速度乘以结/ ^系以相等間距重複，間距等 疋沒H線掃描週期。 查或空白區域l5〇2i=、* 得檢查區域1501與非待檢 浪費在掃描待檢查或與成像。此時部份工具時間 實施例的陣列掃插操=11域1502。第十五（a)圖顯示此 代表陣列掃 、左側陣列掃描或箭頭陣列1404 )座標角二獲 [0052] [0053] 099108483 待檢查區域15〇1。像，以用於涵蓋彼此隔開的窄 如圖所示，此實施例 沿平台移動方向線掃描次數=為試片上畫面的寬度（ ⑸卜類似於第)可小到符合窄待檢查區域 固定的情況，導致—此^陣列掃描時線掃描寬度保持 1501外的每-線掃:些費在”檢查區域 方向沿窄待檢查區 五圖實施例中，其線掃描 用來涵蓋窄待檢查區域15^長邊’一線掃描的主要部分 線掃描動作。因此 1致更有效率地運用每_ 域之陣列，㈣五圖的實施例適合-窄待檢杳區 以㈣’例如沿平台 -L· 對較短間距彼此相_轉檢卸術分佈或排列且以相 產能可被提高。 ~~區域15(Π。因此檢查的 由於待檢查區域1501沿平 寸，針對待檢查 。動方向1 402的相對較窄尺 即時平台位置誤差、㈣陣列掃描可能容易因為 電政應等因素錯過目標。石 第22頁/共46頁 表單編號A0101 201106411 過目標位置的飄移預期將為緩慢。因此系統可設定監控 待檢查區域1501位置位於最近影像晝面1511之内，並即 時應用掃描偏移以保持待檢查區域1 50 1位於接下來的影 像畫面1511之内。 [0054] ❹ [0055] 於此實施例中，待檢查區域1501不須彼此等距或狹窄隔 開，若電子束檢查裝置是基於以下設定（1)陣列畫面可被 觸發（2)陣列畫面觸發時機由定序器程式化，將平台位 置設定於定序器（3)每一序列中之陣列掃描接受掃描偏移 並由定序器程式化。 ❹ 於另一實施例中，線掃描方向設計為與平台移動方向成 一角度。換句話說，線掃描與平台移動主要方向維持一 偏離角。第十六圖顯示本發明實施例中線捧描方向與平 台移動方向維持一偏離角的一移動試片的陣列掃描。第 十六圖左手侧部分顯示於系統（靜止）座標執行之陣列 掃描。第十六圖右手側部分顯示於試片（移動）座標執 行之陣列掃描。平台移動方向為水平並且指向左側，如 箭頭1602所示，線掃描方向如箭頭1601所示。如圖所示 ，線掃描方向1601沿一與平台移動方向1 602相交介於0 至180度的一角度的方向延伸，但偏移主要系統方向，即 X與y方向。換句話說，平台移動方向1602與線掃描方向 1601之間的角度並非0、90或180度，亦即所形成的掃描 線自平台移動軸視點傾斜。 於此實施例中，取決於平台速度，陣列掃描方法所得系 列的影像可為： [0056] (a)若平台速度〈影像寬度/陣列掃描重複週期為部分重疊 099108483 表單編號A0101 第23頁/共46頁 0993142884-0 201106411 (b) 若平台速度=影像寬度/陣列掃描重複週期為連結， (c) 若平台速度〉影像寬度/陣列掃描重複週期為以一空隙 隔開。 [0057] 根據第十六圖針對此實施例的描繪，陣列掃描形成之畫 面或線陣列為一傾斜之平行四邊形，其二垂直邊（或延 伸線）與平台移動軸相交。此實施例之較佳影像寬度因 此為沿平台移動軸二垂直邊與平台移動軸相交點之間的 距離。 f > [0058] 對於本技術領域中具有一般技術者而言，雖然所獲得之 一系列畫面為彼此連結，但選擇平台移動速度亦可獲得 部分重疊、或以一空隙隔開的連續影像畫面。 [0059] 以上伴隨相關圖示敘述的陣列掃描方法可以多種方式實 施以完成試片的帶電粒子束成像。舉例來說，可藉由一 控制器控制例如第一圖所示之傳統可執行連續掃描模式 的帶電粒子束顯微鏡100以實施陣列掃描方法。第十七圖 顯示一帶電粒子束成像系統1 700，此帶電粒子束成像系 統1 700包含連接至傳統帶電粒子束顯微鏡100 (參見第一 圖）之控制器1710。為了簡化敘述，帶電粒子束顯微鏡 被視為一帶電粒子束提供者而可包含帶電粒子束源110、 聚光鏡模組120、物鏡模組130以提供聚焦帶電粒子束 140、一相當於偏向單元150的偏向模組以使帶電粒子束 140掃描通過試片195表面，及一相當於平台190之移動 平台，其中試片195固定於平台190以進行成像。平台 190可朝固定方向移動。 099108483 表單編號A0101 第24頁/共46頁 0993142884-0 201106411 [0060] 控制器171 0可利用一單純硬體電路實施，例如一獨立的 積體電路，或是一韌體或一單純電腦程式。舉例來說， 控制器1710包含存有電腦程式的電腦可讀取媒體，其中 此程式可下達指令並協調帶電粒子束成像系統之部件以 執行上述實施例中敘述的方法。 [0061] 儘管本發明已根據上述之實施例做了說明，熟悉本技術 領域之人士將能輕易了解到上述之實施例的等效改變， 而這些等效改變仍包含在本發明所揭示精神及所揭露的 〇 範圍内。即凡其他未脫離本發明所揭示精神所完成之各 種等效改變或修飾都涵蓋在本發明之申請專利範圍内。 【圖式簡單說明】 [0062] 第一圖顯示一傳統的帶電粒子束顯微鏡。 第二（a)圖顯示一應用傳統技術的陣列掃描。 第二（b)圖顯示經傳統技術陣列掃描之基板的成像。 第三圖顯示涵蓋一基板的待檢查區域的傳統重複步進模 式成像過程。 〇 第四圖顯示傳統技術中使用大可視區域的—重複步進 模式。 ’ 第四（b)圖顯不傳統使用區分多個次可視區域的大可視區 域重複步進模式陣列掃描成像的操作。 第五圖顯示傳統連續掃描模式成像技術。 第六（a)圖顯示傳統以連續掃描模式進行之待檢查區域的 成像。 °° 第六（b)圖顯示傳統利用大可視區域以連續掃描模式與重 複步進模式進行之小面積待檢查區域的成像。 099108483 表單編號A0101 第25頁/共46頁 0993142884-0 201106411 第七（a)圖顯示傳統利用大可視區域以連續掃描模式進行 之分散小面積待檢查區域的成像。 第七（b)圖顯示傳統利用大可視區域以重複步進模式進行 之分散小面積待檢查區域的成像。 第八圖顯示本發明一實施例中陣列掃描方法的操作。 第九圖顯示本發明一實施例中執行線平均的方法。 第十圖顯示本發明一實施例中執行畫面平均的方法。 第十一圖顯示本發明一實施例中不同模式之影像獲得方 法。 第十二圖顯示根據本發明一實施例獲得之連結影像。 第十三圖顯示根據本發明一實施例獲得之彼此等距影像 〇 第十四圖顯示本發明之一實施例中針對一位於一以定速 移動之平台上的試片之陣列掃描，其平台移動方向垂直 於線掃描方向。 第十五圖顯示本發明實施例中彼此相隔一距離的窄待檢 查區域的陣列掃描。 第十六圖顯示本發明實施例中線掃描方向與平台移動方 向維持一偏離角的一移動試片的陣列掃描。 第十七圖顯示本發明一實施例之帶電粒子束成像系統。 【主要元件符號說明】 [0063] 100帶電粒子束顯微鏡 11 0帶電粒子束源 120聚光鏡模組 130物鏡模組 099108483 140帶電粒子束探針 表單編號A0101 第26頁/共46頁 0993142884-0 201106411 150偏向單元 160二次帶電粒子 170帶電粒子偵測器 190試片平台 195試片 201線矩陣 202二維像素矩陣 301影像 Ο 302步進動作 303待檢查區域 401影像 402步進動作 403大可視區域影像 404次可視區域 501線掃描方向 502平台移動方向If the overlap ratio can be expressed as (2n_1)/2n, (I produces N consecutive images of the average of the facets. For example, it will correspond to the average of the two pictures; the overlap of 5' overlaps will be averaged. For the four images obtained Ο ❹ [0051] 099108483 (b) If the platform speed = image width / array scan::, _ image width " car = gap in this implementation, when the line vertical image is formed from the - array Scan and the = direction of the side, the - square axis intersects at right angles. The image width is therefore the edge of the array (10). The first-formed scan line 1415 and the last = formation-line array distance (4) in the column of the platform movement are as for the fourteenth The embodiment between the lower part of the figure and the line (4) 6 can also be #,, sampling...two-, if a written illusion ', again). For example, in the fourteenth figure, the "degrees are divided into two parts corresponding to the 50% sampling ratio. The column scanning - the narrowing of the array of narrow areas to be inspected: in the embodiment of the invention, separated from each other - π 乍 阵列 阵列 阵列 阵列 阵列 阵列 阵列 阵列 阵列 阵列 阵列 阵列 阵列 阵列 阵列 阵列 阵列 阵列 阵列 阵列 阵列 阵列 阵列 阵列 阵列 阵列 阵列 阵列 阵列 阵列 阵列 阵列 阵列 阵列 阵列 阵列 阵列 阵列 阵列 阵列 阵列 阵列 阵列Bottom area drawing mode, where the left arrow diagram) shows the traditional continuous sweeping 403 table 7 (four) (four) # 〇 table army number deletion 1 _8 (four) 201106411 upper right hand part description to test image U12 for .-1 movement) coordinate angle viewing The acquisition is formed by the coffee 2 separated to be inspected or blank area (no pattern continuous sweeping imaging mode center - area 1501. As shown, the traditional platform speed multiplied by the knot / ^ system is repeated at equal intervals, spacing is equal There is no H-line scan period. Check or blank area l5〇2i=, * Check area 1501 and non-check waste are scanned for inspection or imaging. At this time, some tool time embodiment array sweep operation = 11 field 1502 Figure 15 (a) shows this generation Sweep array, the left array scanning array or arrow 1404) is eligible for two angular coordinates [0052] [0053] 099 108 483 15〇1 region to be examined. The image is used to cover the narrowness of each other as shown in the figure. The number of scans in the direction of the platform moving direction of this embodiment = the width of the picture on the test piece ((5) is similar to the first) can be small enough to conform to the narrow area to be inspected. In the case of the array scan, the line scan width is kept outside the line scan of 1501: some charges are in the direction of the inspection area along the narrow to-be-checked area in the fifth embodiment, and the line scan is used to cover the narrow to-be-checked area 15 ^Long side 'the main part of the line scan is the line scan action. Therefore, the array of each _ field is used more efficiently. (4) The five figure embodiment is suitable for the narrow to be tested area. (4) For example, along the platform-L· The shorter spacings are distributed or aligned with each other and the phase capacity can be increased. ~~ Area 15 (Π. Therefore, because the area to be inspected 1501 is flat, the relative to be inspected. The relative direction of the moving direction 1 402 The narrower-footed real-time platform position error, (4) Array scan may be easy to miss the target due to factors such as electricity. Stone page 22/46 page number A0101 201106411 The drift of the target position is expected to be slow. So the system can be set to monitor The inspection area 1501 is located within the nearest image plane 1511, and the scan offset is applied immediately to keep the area to be inspected 1 501 within the next image frame 1511. [0054] In this embodiment, The area to be inspected 1501 need not be equidistant or narrowly spaced from each other. If the electron beam inspection apparatus is based on the following settings (1) the array screen can be triggered (2) the array screen trigger timing is programmed by the sequencer, and the platform position is set to The array scan in each sequence of the sequencer (3) accepts the scan offset and is programmed by the sequencer. 另一 In another embodiment, the line scan direction is designed to be at an angle to the direction of movement of the platform. In other words, the line The scanning maintains an off-angle with the main direction of the platform movement. The sixteenth embodiment shows an array scan of a moving test piece in which the line drawing direction maintains an off-angle with the moving direction of the platform in the embodiment of the present invention. Array scan performed on the system (stationary) coordinates. The right hand side of the sixteenth image is displayed in the array scan performed on the test piece (moving) coordinates. The platform moves in the horizontal direction and To the left, as indicated by arrow 1602, the line scan direction is indicated by arrow 1601. As shown, the line scan direction 1601 extends in an direction that intersects the platform movement direction 1 602 at an angle of 0 to 180 degrees, but Offset the main system direction, that is, the X and y directions. In other words, the angle between the platform moving direction 1602 and the line scanning direction 1601 is not 0, 90 or 180 degrees, that is, the formed scanning line is inclined from the viewpoint of the platform moving axis. In this embodiment, depending on the platform speed, the image obtained by the array scanning method may be: [0056] (a) If the platform speed <image width / array scan repetition period is partially overlap 099108483 Form No. A0101 Page 23 / Total 46 pages 0993142884-0 201106411 (b) If the platform speed = image width / array scan repetition period is connected, (c) if the platform speed > image width / array scan repetition period is separated by a gap. [0057] According to a sixteenth diagram for the depiction of this embodiment, the array or line array formed by the array scan is a slanted parallelogram with two vertical edges (or extension lines) intersecting the platform movement axis. The preferred image width for this embodiment is therefore the distance between the two vertical edges of the axis of movement of the platform and the point of intersection of the axis of movement of the platform. f > [0058] For those of ordinary skill in the art, although one series of pictures obtained is connected to each other, the selection of the platform moving speed may also obtain a partial image overlap or a continuous image frame separated by a gap. . The array scanning method described above in connection with the related drawings can be implemented in a variety of ways to complete charged particle beam imaging of the test strip. For example, an array scanning method can be implemented by a controller that controls a charged particle beam microscope 100, such as the conventional executable continuous scan mode shown in the first figure. Figure 17 shows a charged particle beam imaging system 1 700 that includes a controller 1710 coupled to a conventional charged particle beam microscope 100 (see the first figure). For simplicity of description, the charged particle beam microscope is considered to be a charged particle beam provider and may include a charged particle beam source 110, a concentrating mirror module 120, an objective lens module 130 to provide a focused charged particle beam 140, and a deflection unit 150. The module is biased such that the charged particle beam 140 is scanned through the surface of the test strip 195, and a mobile platform corresponding to the platform 190, wherein the test strip 195 is fixed to the platform 190 for imaging. The platform 190 is movable in a fixed direction. 099108483 Form No. A0101 Page 24 of 46 0993142884-0 201106411 [0060] The controller 171 0 can be implemented by a simple hardware circuit, such as a separate integrated circuit, or a firmware or a simple computer program. For example, controller 1710 includes a computer readable medium having a computer program, wherein the program can issue instructions and coordinate components of the charged particle beam imaging system to perform the methods described in the above embodiments. [0061] While the invention has been described in terms of the embodiments described above, those skilled in the art will be able to readily understand the equivalents of the embodiments described herein. Within the scope of the disclosure. That is, various equivalent changes or modifications which are made without departing from the spirit of the invention are intended to be included in the scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS [0062] The first figure shows a conventional charged particle beam microscope. The second (a) diagram shows an array scan using conventional techniques. The second (b) image shows the imaging of the substrate scanned by the conventional technology array. The third figure shows a conventional repeating step mode imaging process that covers the area to be inspected of a substrate. 〇 The fourth figure shows the repeating stepping mode using the large visible area in the conventional technology. The fourth (b) diagram shows the operation of repeating step-wise pattern scanning imaging using a large visible area that distinguishes multiple secondary visible areas. The fifth figure shows a conventional continuous scan mode imaging technique. The sixth (a) chart shows the imaging of the area to be inspected which is conventionally performed in the continuous scanning mode. °° Figure 6(b) shows the imaging of a small area to be inspected in the continuous scanning mode and the repeated stepping mode using a large visible area. 099108483 Form No. A0101 Page 25 of 46 0993142884-0 201106411 The seventh (a) diagram shows the imaging of a small area to be inspected in a continuous scanning mode using a large visible area. The seventh (b) diagram shows the imaging of a small area to be inspected which is conventionally performed using a large visible area in a repeating step mode. The eighth figure shows the operation of the array scanning method in an embodiment of the present invention. The ninth diagram shows a method of performing line averaging in an embodiment of the present invention. The tenth diagram shows a method of performing picture averaging in an embodiment of the present invention. The eleventh diagram shows an image acquisition method for different modes in an embodiment of the present invention. A twelfth diagram shows a linked image obtained in accordance with an embodiment of the present invention. Figure 13 shows an isometric image of each other obtained in accordance with an embodiment of the present invention. Figure 14 shows an array scan of a test piece located on a platform moving at a constant speed in an embodiment of the present invention, the platform The direction of movement is perpendicular to the line scan direction. The fifteenth diagram shows an array scan of a narrow region to be inspected at a distance from each other in the embodiment of the present invention. Fig. 16 is a view showing an array scan of a moving test piece in which the line scanning direction maintains an off angle with the moving direction of the platform in the embodiment of the present invention. Figure 17 shows a charged particle beam imaging system in accordance with an embodiment of the present invention. [Main component symbol description] [0063] 100 charged particle beam microscope 11 0 charged particle beam source 120 concentrating mirror module 130 objective lens module 099108483 140 charged particle beam probe form number A0101 Page 26 of 46 page 0993142884-0 201106411 150 Biasing unit 160 secondary charged particle 170 charged particle detector 190 test piece platform 195 test piece 201 line matrix 202 two-dimensional pixel matrix 301 image Ο 302 step action 303 to be inspected area 401 image 402 step action 403 large visible area image 404 visible areas 501 line scan direction 502 platform moving direction
G 503平台連續移動 601大面積待檢查區域 602交替變換平台移動方向 603待檢查區域 701小面積待檢查區域 801影像 802線掃描方向 8 0 3試片移動方向 804影像 805影像 099108483 表單編號A0101 第27頁/共46頁 0993142884-0 201106411 806影像 9 01線掃描方向 902線偏移方向 910影像 920二重線平均影像 930三重線平均影像 1001右側平均影像 1 002平均化影像 1100試片移動方向 1101平台移動方向 1110部分重疊畫面影像 1120彼此連接的畫面影像 1130彼此等距的畫面影像 1201以試片（移動）座標角度觀看的影像 1301以試片（移動）座標角度觀看的影像 1310待檢查區域 1401線掃描方向 1402平台移動方向 1403線掃描動作 1404陣列掃描動作 1405以試片（移動）座標角度觀看的獲得影像 1406以試片（移動）座標角度觀看的獲得影像 1411第一形成掃描線與最後形成掃描線之間的距離 1415第一形成掃描線 1 41 6最後形成掃描線 1501待檢查區域 099108483 表單編號A0101 第28頁/共46頁 0993142884-0 201106411 1 502待檢查或空白區域 1511以試片（移動）座標角度觀看的獲得影像 1512以試片（移動）座標角度觀看的獲得影像 1601線掃描方向 1 602平台移動方向 1 700帶電粒子束成像系統 1710控制器 Ο 099108483 表單編號A0101 第29頁/共46頁 0993142884-0G 503 platform continuously moves 601 large area to be inspected area 602 alternately changes platform moving direction 603 to be inspected area 701 small area to be inspected area 801 image 802 line scanning direction 8 0 3 test piece moving direction 804 image 805 image 099108483 form number A0101 27 Page / Total 46 Pages 0993142884-0 201106411 806 Image 9 01 Line Scanning Direction 902 Line Offset Direction 910 Image 920 Double Line Average Image 930 Triple Line Average Image 1001 Right Side Average Image 1 002 Average Image 1100 Test Strip Movement Direction 1101 Platform The moving direction 1110 partially overlaps the screen image 1120. The screen image 1130 is connected to each other. The screen image 1201 is equidistant from each other. The image 1301 viewed at the coordinate angle of the test piece (moving) is viewed at the coordinate angle of the test piece (moving) at the coordinate angle 1310. Scanning direction 1402 Platform moving direction 1403 Line scanning action 1404 Array scanning action 1405 Obtaining image 1406 viewed at the test piece (moving) coordinate angle Obtaining image 1411 at the coordinate angle of the test piece (moving) The first forming scan line and the last forming scan The distance between the lines 1415 first forms the scan line 1 41 6 finally Forming the scan line 1501 to be inspected 099108483 Form No. A0101 Page 28/Total 46 Page 0993142884-0 201106411 1 502 To be inspected or blank area 1511 Obtained image 1512 at the angle of the test piece (moving) coordinate to obtain the test piece (moving) coordinates Angle view acquisition image 1601 line scan direction 1 602 platform movement direction 1 700 charged particle beam imaging system 1710 controller Ο 099108483 Form No. A0101 Page 29 / Total 46 Page 0993142884-0