TW201037388A - Wafer level lens module array - Google Patents

Wafer level lens module array Download PDF

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Publication number
TW201037388A
TW201037388A TW98111979A TW98111979A TW201037388A TW 201037388 A TW201037388 A TW 201037388A TW 98111979 A TW98111979 A TW 98111979A TW 98111979 A TW98111979 A TW 98111979A TW 201037388 A TW201037388 A TW 201037388A
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Taiwan
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lens
array
region
alignment
wafer level
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TW98111979A
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Chinese (zh)
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TWI454777B (en
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Tai-Cherng Yu
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Hon Hai Prec Ind Co Ltd
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Publication of TWI454777B publication Critical patent/TWI454777B/en

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Abstract

The present disclosure relates to a wafer level lens module array. The wafer level lens module array includes a first lens array, a second lens array, and a spacer array positioned between the first lens array and the second lens array. The first lens array includes a plurality of first lenses, and at least a first positioning member. The second lens array includes a plurality of second lenses, and at least a second positioning member. The spacer array includes a plurality of through holes for light passing therethrough, at least a third positioning member, and at least a forth positioning member. The first positioning member and the second positioning member respectively work with the third positioning member and the forth positioning member to make the central axis of the first lens, the central axis of the second lens, and the central axis of the through hole coaxial to each other.

Description

201037388 六、發明說明: 【發明所屬之技術領域】 本^明涉及一種鏡頭模組,尤其涉及一種晶圓級(wafer levd) .鏡頭模組陣列。 【先前技術】 ^般之鏡頭模組主要包括鏡片組、容納鏡片組之鏡筒、影像 士測器與鏡座,影像感測器設置於鏡座内,鏡座容納可旋轉之鏡 筒。惟,該鏡頭模組一般體積較大。 G 隨賴像技狀發展’鏡聰城各觀攜式電子裝置如行 =話、攝像機、電腦等之結合,得縣多消費者之#昧,所以 市場對小型化鏡頭模組之需求增和。 前小型化鏡頭模組多採用晶圓級鏡片,其一般係利用精密 型鏡片_,織財晶®製成之影像感測器電連 .此裝/最後切割,得到之每一小單元都係一晶圓級之相機模 ΐ/έ、、&得到之相機模組亦常常因兩個鏡片之光轴並不重合而出 〜、況’偏心之存在嚴重影響該相機模組所拍攝影像之品質。 【發明内容】201037388 VI. Description of the Invention: [Technical Field] The present invention relates to a lens module, and more particularly to a wafer level (lens levd) lens array array. [Prior Art] The general lens module mainly includes a lens group, a lens barrel for accommodating the lens group, an image sensor and a lens holder, and the image sensor is disposed in the lens holder, and the lens holder accommodates the rotatable lens barrel. However, the lens module is generally bulky. G With the development of technology like the technology of the mirror, the combination of electronic devices such as mobile phones, cameras, computers, etc., the number of consumers in the county, so the market demand for miniaturized lens modules increased . The front miniaturized lens module mostly uses wafer-level lenses, which are generally made up of precision lenses _, weaving jingjing® image sensor electrical connection. This device / final cutting, each unit is obtained A wafer-level camera module/έ,, & camera module is often obtained because the optical axes of the two lenses do not coincide. The condition of the eccentricity seriously affects the image captured by the camera module. quality. [Summary of the Invention]

Q 有#於此’有必要提供—種能減少偏心之晶圓級_模組陣 陣列最陣列包括第—鏡片陣列、與該第一鏡片 片陣列。該第一鏡片陣列包括具有第-表面之第 片i且右:ί—基板具有第—鏡片區及第—非鏡片區。該第一鏡 少二第—鏡片。該第一表面上之第—非鏡片區設置有至 板。該第該第二鏡片陣列包括具有第二表面之第二基 第二面表面相對。該第二基板具有第二鏡片區及 、兄品。该第二鏡片區具有複數第二鏡片。該第二表面之 4 201037388 第=非鏡片區設置有至少一第二對位元件。該間隔片陣列為具有 透光孔區及非透光孔區之板體。該透光孔區具有複數透光孔了該 ^透光孔區具有靠近該第—表面之第三表面及靠近該第二表面二 弟四表面。該第三表面之非透光區設有至少—第三對位元件。該 弟=表面之非透光區設有至少一第四對位元件。該第一對位元^ 與第三對位元件、第二對位元件與第四對位元件分 以使第-制1二鏡狀透光孔之中叫重合。 配口 Ο 與先别技術相比,本發明提供之晶圓級鏡頭模組陣列之第一 鏡片陣列、第二鏡片陣列及間隔牌列均具有對位元件,從秘 得該晶圓級鏡頭模組陣列之一第一鏡片之光軸、第二鏡片之光軸 及間隔片之透光孔之中心軸重合,減少了產生偏心之可能,提言 =由此陣列得到之鏡頭模組之成像品f,進而提高了具有該鏡^ 模組之相機模組之成像品質。 【實施方式】 下面將結合附圖對本發明作進一步詳細說明。 請參閱圖1及圖2,本發明第一實施例提供之晶圓級鏡頭模組 陣列10,其包括第一鏡片陣列21、與第_鏡片陣列21疊置之第二 鏡片陣列23以及夹設於該第一鏡片陣列21與該第二鏡片2 〇 間之間隔片陣列25。 s亥第一鏡片陣列21包括一具有第一表面211之第一基板212。 該第-基板212具有第一鏡片區213及第—非鏡片區別。該第一鏡 片區214具有複數第—鏡片215。該第—表面211之第一非鏡片區 2U设有至少-第-對位元件216。該第_非鏡片區214具有一圍繞 該第-鏡片區213之第-週_217及一位於該複數第—鏡片215 巧之第-中央區218。本實施例中’該第一對位元件216為貫穿 该第-基板212之_通孔,且其個數為兩個,均設於該第一表面 211之第一週邊區217上。 當然,該第一對位元件216亦可以為方形通孔、三角形通孔、 5 201037388 凹陷或凸起等其它對位元件。當然,該第一對位元件216之個數亦 可以為一個、三個、四個或者更多個。當然,該複數第一對位元 :件216亦可均设於該第一中央區218上,亦可部分設於該第一週邊 區217,部分設於該第一中央區218上。It is necessary to provide a wafer level that can reduce eccentricity. The array of arrays includes a first lens array and an array of first lens sheets. The first lens array includes a first sheet i having a first surface and a right: ί - the substrate has a first lens region and a first non-lens region. The first mirror is less than the second lens. The first non-lens area on the first surface is provided with a plate. The second second lens array includes a second base second surface having a second surface opposite. The second substrate has a second lens area and a brother. The second lens zone has a plurality of second lenses. The second surface 4 201037388 the second non-lens area is provided with at least one second alignment element. The spacer array is a plate body having a light transmitting hole region and a non-light transmitting hole region. The light-transmissive aperture region has a plurality of light-transmissive apertures having a third surface adjacent the first surface and a surface adjacent the second surface. The non-transmissive region of the third surface is provided with at least a third alignment element. The younger = non-transparent area of the surface is provided with at least one fourth alignment element. The first pair of bits ^ and the third aligning element, the second aligning element and the fourth aligning element are divided so that the first two mirror-shaped light-transmissive holes are coincident. The first lens array, the second lens array and the spacer card array of the wafer level lens module array provided by the present invention have alignment components, and the wafer level lens module is obtained from the wafer level lens module. The optical axis of the first lens, the optical axis of the second lens, and the central axis of the transparent aperture of the spacer overlap each other, thereby reducing the possibility of eccentricity. For example, the image of the lens module obtained by the array is f , thereby improving the imaging quality of the camera module having the mirror module. [Embodiment] Hereinafter, the present invention will be further described in detail with reference to the accompanying drawings. Referring to FIG. 1 and FIG. 2, a wafer level lens module array 10 according to a first embodiment of the present invention includes a first lens array 21, a second lens array 23 stacked on the _ lens array 21, and an interlayer. A spacer array 25 between the first lens array 21 and the second lens 2 . The first lens array 21 includes a first substrate 212 having a first surface 211. The first substrate 212 has a first lens region 213 and a first-non-lens difference. The first mirror region 214 has a plurality of first lenses 215. The first non-lens zone 2U of the first surface 211 is provided with at least a - aligning element 216. The first non-lens area 214 has a first-circumference 217 surrounding the first lens region 213 and a first central region 218 located in the plurality of first lens 215. In the embodiment, the first aligning element 216 is a through hole extending through the first substrate 212, and the number thereof is two, and is disposed on the first peripheral region 217 of the first surface 211. Of course, the first alignment component 216 can also be a square via, a triangular via, a 5 201037388 recess or bump, and other alignment components. Of course, the number of the first alignment elements 216 can also be one, three, four or more. Of course, the first plurality of aligning elements 216 may be disposed on the first central area 218, or partially disposed in the first peripheral area 217, and partially disposed on the first central area 218.

斤一該第二鏡片陣列23包括具有第二表面231之第二基板232。該 第一表,231與第一表面211相對。該第二基板232具有第二鏡片區 233及第二非鏡片區234。該第二鏡片區233具有複數第二鏡片 235。該第二表面231之第二非鏡片區234設置有至少一第二對位元 件236。5亥第一非鏡片區234具有一圍繞該第二鏡片區233之第二週 邊區237及一位於該複數第二鏡片235之間之第二中央區幻8。本實 施例中’該第二對位元件236為貫穿該第二基板232之圓形通孔,、 且其個數為兩個,均設於該第二表面231之第二週邊區挪上。 當然,該第二對位元件236亦可以為方形通孔三肖形通孔、 =或^凸起等其㈣位元件。韻,該第二射^元件236之個數 Ιίϋ—個、/個了個或者更多個。當然,該複數第二對位 1^7亦可均⑤於鄉二巾央區238上,村部分設於該第二週 邊區237,部分設於該第二中央區238上。 Μ 參閱圖3,該間隔片陣列25為具有透光孔區251及非透 ίϋίίϋ該透光縣251具有魏透光孔253。該非透光 面第:表面211之第三表面254及靠近該第二表 四表4·面%。该第三表面254之非透光孔區252設有至少 笛弟二對兀件η。1亥第四表面255之非透光孔區252設有至少一 二::喜Γ^Γ257。S亥非透光孔區252具有圍繞該透光孔區251之第 該複數透光孔253之間之第三中央區259。該第 元細對: 253之Φ、、紅舌人1 /使弟一鏡片 第二鏡片235及透光孔 元牛施例*,該第三對位元件256及第四對位 軸,車軟嶋孔,肅為兩個,同 6 201037388 當然’該第三對位元件256亦可為謂通孔、 陷或者凸起等其它對位元件。當然,該第三對位: 可以為一個、三個、四個或更多個。當然,1 :: 256亦可以設於第三中央區259,亦可以部分設於件 部分設於第三中央區259。 、弟一週以£258 ’ 件。=亦可為凹陷或者凸起等其它對位元 ί二,、、ί第 牛7之個數亦可以為-個、三個、四個 =更夕個。該複數第四對位元件257亦可以設於第三中央區 259,亦可以部分設料三週邊_,部分設於帛三^區中挪: Ο ❹ 轴。當然,該第三對位元件256與該第四對位元件W亦可以不同 當然’若該第一對位元件216、第二對位 % 別位於第%二218 位元件256及第畴位元件257分 乃Jτ兴(^218、弟二中央區238、第二中 央區259之正中央亦能實現本發明之目的中^ 59及弟二令 談第3tf16為“十”、“E,,或“中,,字形通孔,那麼 ^。—兀為—或“口”字形通孔亦能實現本發明之目 彬内陣列25稱有複數分別圍繞該複數透光孔253之環 ^入ΐ㈣。:目f-了,防光線經第一鏡片215及第二鏡片235反射後 卜机:枚’攸而形成眩光,造成影像模糊,該環形内壁260 上汉有鉻層261,以減少形成眩光之可能。 設有,三絲2_四絲255上均 圓級鏡頭模組陣列1G時,先於第一鏡片陣列21之每 、見 週圍塗上膠水27,然後藉由第-對位元件216及第 7 201037388 三對位το件256之相互配合,使得每一透光孔253之中心 一 -鏡片215之光轴重合,並將間隔片陣列25之第三表面254^ :鏡片陣列21藉由膠水27固接為一體,隨之,於該間隔片陣歹仍之 第四表面255上塗上膠水27,然後藉由第謂位元件说及第四對 -位兀件257之相互配合,使得每一透光孔253之中心軸盥一 片235之光軸重合,並將間隔片陣列25之第三表面254與第二鏡 ΪΞί由膠水糊接為—體,即完成了該晶圓級鏡頭模組陣列 〇 圖4’本發明第二實施例提供之晶圓級鏡頭模組 陣列40,其與曰曰圓級鏡頭模組陣列4〇大體上相同,呈 陣列41、第二鏡片陣列43及夾設於該第一鏡片陣列41斑該第二 鏡片陣列43之間間隔片陣列45,該第—鏡片陣列41呈 =件’該第二鏡片陣列43具有第二對位元件436,該間隔 片障列45具有第二對位元件456及第四對位元件457,不同之處 ^ :該第-對位元件416為凸起,第二對位元件4%為凸起, =j位兀件456及第四對位元件457均為凹陷,且其個數均 馬複數個。 當然’因為該第-對位元件416、第二對位元件436、第 位7L件456及第謂位元件457亦能將該第—鏡片陣列41 陣^及第二鏡片卩翔43及間隔片_45固接為—體,所以該 位元件416、第4位元件436、第三對位元件456及第四對位 兀件457不僅具有對位元功能,還具有連接功能。The second lens array 23 includes a second substrate 232 having a second surface 231. The first table 231 is opposite the first surface 211. The second substrate 232 has a second lens area 233 and a second non-lens area 234. The second lens zone 233 has a plurality of second lenses 235. The second non-lens area 234 of the second surface 231 is provided with at least one second alignment element 236. The first non-lens area 234 has a second peripheral area 237 surrounding the second lens area 233 and a The second central zone between the plurality of second lenses 235 is imaginary 8. In the embodiment, the second alignment component 236 is a circular through hole penetrating through the second substrate 232, and the number thereof is two, and is disposed on the second peripheral region of the second surface 231. Of course, the second alignment component 236 can also be a (four) bit component such as a square via hole, a three-dimensional via hole, a = or a bump. Rhyme, the number of the second shot elements 236 Ιίϋ—one, one or more. Of course, the plurality of second alignments 1^7 may also be 5 in the township second central area 238, the village portion is disposed in the second peripheral zone 237, and the portion is disposed on the second central zone 238. Referring to FIG. 3, the spacer array 25 has a light-transmissive aperture region 251 and is non-transparent. The non-transmissive surface: the third surface 254 of the surface 211 and the surface of the second surface. The non-transparent aperture region 252 of the third surface 254 is provided with at least a pair of two pairs of elements η. The non-transparent aperture area 252 of the 1st fourth surface 255 is provided with at least one of two:: Γ Γ Γ 257. The S-non-transmissive aperture region 252 has a third central region 259 between the plurality of transparent apertures 253 surrounding the aperture portion 251. The first element is: 253 Φ, red tongue 1 / 弟 一 1 lens second lens 235 and light hole 牛牛 instance *, the third alignment element 256 and the fourth alignment axis, the car soft Pupils, two for the same, the same as 6 201037388 Of course, the third alignment component 256 can also be referred to as through holes, traps or bumps and other alignment components. Of course, the third pair: can be one, three, four or more. Of course, 1: 256 may also be located in the third central area 259, or may be partially located in the third central area 259. The younger brother is £258. = can also be concave or convex and other alignments ί 2,,, ί The number of the number 7 can also be -, three, four = even more. The plurality of fourth alignment elements 257 may also be disposed in the third central zone 259, or may be partially provided with three peripherals _, and some of them may be located in the middle of the third zone: Ο ❹ axis. Certainly, the third alignment component 256 and the fourth alignment component W may also be different. Of course, if the first alignment component 216 and the second alignment component are located at the second and second 218-bit components 256 and the third domain component 257 points are Jτ Xing (^218, the second central area of 238, the second central area 259, the center of the center can also achieve the purpose of the invention ^ 59 and the second brother to talk about the 3tf16 as "ten", "E,, or "Medium, the shape of the through hole, then ^. - 兀 - or "mouth" shaped through hole can also achieve the present invention, the inner array 25 said a plurality of rings around the plurality of transparent apertures 253 respectively (four). : 目 f-, the anti-light reflected by the first lens 215 and the second lens 235 after the machine: 攸 攸 形成 形成 形成 ,, resulting in blurred image, the annular inner wall 260 has a chrome layer 261 on the Han to reduce the formation of glare If the three-wire 2_four-wire 255 upper-equal lens module array 1G is provided, the glue 27 is applied to each of the first lens arrays 21, and then the first-alignment element 216 is The 7th 201037388 three-position το member 256 cooperates with each other such that the center of each of the light transmission holes 253 is the optical axis of the lens 215 And the third surface 254 of the spacer array 25: the lens array 21 is integrally fixed by the glue 27, and then the glue is applied to the fourth surface 255 of the spacer array, and then The mutual component and the fourth pair of the positioning member 257 cooperate with each other such that the central axis of each of the light transmission holes 253 coincides with the optical axis of the slice 235, and the third surface 254 of the spacer array 25 and the second mirror晶圆 由 胶 由 由 胶 胶 胶 胶 胶 胶 胶 胶 该 该 该 该 该 该 该 该 该 该 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆The array 4 is substantially the same, in the array 41, the second lens array 43 and the spacer array 45 interposed between the first lens array 41 and the second lens array 43. The first lens array 41 is a member. The second lens array 43 has a second alignment element 436 having a second alignment component 456 and a fourth alignment component 457. The difference is that the first alignment component 416 is a bump. 4% of the second alignment element is a protrusion, and the =j position element 456 and the fourth alignment element 457 are both concave, and The number of the number of the horses is plural. Of course, because the first-alignment element 416, the second alignment element 436, the seventh 7L piece 456, and the dummy position element 457 can also use the first lens array 41 and the second lens. The flying element 43 and the spacer _45 are fixed to each other, so the bit element 416, the fourth bit element 436, the third aligning element 456 and the fourth aligning element 457 have not only the bit function but also the connection. Features.

當然’為了能將該第—鏡牌列41與間隔片陣列45與第 片陣列43及間隔牌列45之間固接地更牢固,亦可以於 設置一些膠水。 J "於製造時’首絲造出第—鏡片陣列41及第二鏡片陣列43, 已經加工好之薄片狀之間隔片陣列45置於第—鏡片陣 ”第二鏡片陣列43之間’並藉由第—對位元件416與第三對位 8 201037388Of course, in order to secure the ground between the first mirror array 41 and the spacer array 45 and the first array 43 and the spacer row 45, some glue may be provided. J " at the time of manufacture, the first lens array 41 and the second lens array 43 are formed, and the processed sheet-like spacer array 45 is placed between the second lens array 43 of the first lens array' By the first-alignment element 416 and the third alignment bit 8 201037388

元件456及第二對位元件436與第四對位元件457相配合,以使 鏡片光軸與間隔片之透光孔之中心柚重合,然後與石夕晶圓製成之 影像感測為壓合封裝,最後切割成晶圓級相機模組D 綜上所述’本發明確已符合發明專利之要件,遂依法提出專 利申请。惟’以上所述者僅為本發明之較佳實施方式,自不能以 此限制本案之申請專利範圍。舉凡熟悉本案技藝之人士援依本發 明之精神所作之等效修飾或變化,皆應涵蓋於以下申請專利範 内。 【圖式簡單說明】The component 456 and the second alignment component 436 cooperate with the fourth alignment component 457 to make the optical axis of the lens coincide with the center of the light-transmissive aperture of the spacer, and then sense the image with the image made by Shi Xi wafer. Packaged, and finally cut into wafer level camera module D. In summary, the invention has indeed met the requirements of the invention patent, and patent application is filed according to law. However, the above description is only a preferred embodiment of the present invention, and the scope of the patent application of the present invention cannot be limited thereby. Any equivalent modifications or variations made by those who are familiar with the skill of the present invention in accordance with the spirit of the present invention shall be covered by the following patent applications. [Simple description of the map]

一圖1係本發明第一實施例提供之晶圓級鏡頭模組陣列之妗 示意圖,其具有間隔片陣列。 圖2係沿圖1之剖開後之截面示意圖。 圖3係圖1中之間隔片陣列之示意圖。 示咅^ 4。係本發明第二實施例提供《晶圓級鏡頭模組睁列之結構 圖5係沿圖3之V-V剖㈤後之截面示意圖。 〇 【主要元件符號說明】 晶圓級鏡頭模組陣列 第一鏡片陣列 第二鏡片陣列 間隔片陣列 第一表面 第一基板 第一鏡片區 第一非鏡片區 第一鏡片 第一對位元件 10、40FIG. 1 is a schematic diagram of a wafer level lens module array according to a first embodiment of the present invention, which has an array of spacers. Figure 2 is a schematic cross-sectional view taken along line 1 of Figure 1. Figure 3 is a schematic illustration of the spacer array of Figure 1. Show 咅 ^ 4. A second embodiment of the present invention provides a structure of a wafer level lens module array. FIG. 5 is a cross-sectional view taken along line V-V of FIG. 〇[Main component symbol description] wafer level lens module array first lens array second lens array spacer array first surface first substrate first lens area first non-lens area first lens first alignment element 10, 40

25'45 211 212 213 214 215 216、416 9 20103738825'45 211 212 213 214 215 216, 416 9 201037388

第一週邊區 217 第一中央區 218 第二表面 231 第二基板 232 弟二鏡片區 233 弟·一非鏡片區 234 弟一鏡月 235 第二對位元件 236 第二週邊區 237 第二中央區 238 透光孔區 251 非透光孔區 252 透光孔 253 第三表面 254 第四表面 255 第三對位元件 256 第四對位元件 257 第三週邊區 258 第三中央區 259 内壁 260 鉻層 261 膠水 27 436 456 457 262First peripheral zone 217 first central zone 218 second surface 231 second substrate 232 second lens zone 233 brother a non-lens zone 234 brother one mirror month 235 second alignment element 236 second peripheral zone 237 second central zone 238 light transmission hole area 251 non-light transmission hole area 252 light transmission hole 253 third surface 254 fourth surface 255 third alignment element 256 fourth alignment element 257 third peripheral area 258 third central area 259 inner wall 260 chrome layer 261 glue 27 436 456 457 262

Claims (1)

201037388 七、申請專利範圍: 1. 一種晶圓級鏡頭模組陣列,其包括: 一一W丨六姐丨平夕丨】,具包栝: 有及%^帛—基板,該第—基板具 片,該第-表面上之第_4片/片’^弟晉區具有複數第一鏡 巧-鏡片陣列疊置有 ^第二表面與第—表面相對,該第二基板具有ί二鏡 “ii ’該第二鏡片區具有複數第二鏡片,該第二 非鏡片區設置有至少—第二對位元件; Ο 列夾設於該第—鏡片陣列與該第二鏡片 及ίίϊίυί透光孔區具有靠近該第-表面之第三表面 第四表面’該第三表面之非透光區設有至少 件ϊϊ= ϊ第四表面之非透光區設有至少-第四對位元 分杜丨知恤凡件與第二對位兀件、第二對位元件與第四對位 別相互配合,以使第—鏡片、第二鏡片及透光孔之中心轴 2. 如申請專利範圍第1項所述之晶圓級鏡頭模組陣列,其中:該第 :非鏡片區包括-圍繞該第—鏡片區之第―週邊區及位於該複數 〇 t鏡片之間之第—中央區,該第二非鏡片區包括—圍繞該第二 鏡片區之第二週邊區及位於該複數第二鏡片之間之第二中央區, 邊非透光孔區包括一圍繞該透光孔區之第三週邊區及位於該複數 透光孔之間之第三中央區。 3. 如申請專利範圍第2項所述之晶圓級鏡頭模組陣列,其中:該第 了對位元件之個數為至少兩個,且該複數第—對位元件'均位^該 第一週邊區,該第三對位元件之個數為至少兩個,且該複數第三 對位元件均位於該第三週邊區。 4. 如申睛專利範圍第2項所述之晶圓級鏡頭模組陣列’其中:該第 二對位元件之個數為至少兩個,且該複數第—對位元件均位於該 第一中央區,該第三對位元件之個數為至少兩個,且該複數第三 11 201037388 對位元件均位於該第三中央區。 tit專利範圍第3或4項所述之晶圓級鏡頭模組陣列’其中: 兀件之個數為至少兩個,且該複數第二對位元件均位 .第中元:ί個數為至少兩個’且該複數 利範圍第3或4項所述之晶圓級鏡頭模組_,其中: 、二件之個數為至少兩個’且該複數第二對位元件均位 ‘對^4均:條為至少兩個’且該複數 Ο 之晶圓級鏡頭模組陣列’其中:該第 對位元:二二 =陷或:;= 列=;或對:凹元:為终 8」,申請,利範圍第7項所述之晶圓 中 二Ξϊ ί:穿:Γ基板之通孔或者凹陷,=四= 列:通第:::為與該第二對位•相 ❹ 陣列,其^該間 透光孔,且均設有i層。/ ρ碰環形_分糊繞該複數 如宇請專利範圍第〗項所 曰^片_之第三表面及第喊面㈣,其中:該 j·如_請專利範圍第!項所述之 ° $鉻層。 ㈡陣列及_列分別藉由=^列| 12201037388 VII. Patent application scope: 1. A wafer-level lens module array, which includes: one by one W丨六姐丨平丨】, with packaging: and %^帛-substrate, the first substrate a piece, the _4 piece/piece on the first surface has a plurality of first Mirrors - the lens array is stacked with the second surface opposite to the first surface, and the second substrate has a second mirror Ii 'the second lens area has a plurality of second lenses, the second non-lens area is provided with at least a second alignment element; the Ο column is sandwiched between the first lens array and the second lens and the λίίίίί 孔a non-transmissive region having a third surface adjacent to the first surface, the non-transmissive region of the third surface is provided with at least a portion ϊϊ = ϊ a fourth surface of the non-transmissive region is provided with at least a fourth pair of bits The immersive piece and the second aligning element, the second aligning element and the fourth pair of bits cooperate to make the central axis of the first lens, the second lens and the light transmission hole 2. As claimed in the patent scope The wafer level lens module array of the item, wherein: the first: non-lens area includes - surrounding the first a first peripheral region of the region and a first central region between the plurality of lenses, the second non-lens region including - a second peripheral region surrounding the second lens region and between the plurality of second lenses The second central region, the non-transmissive aperture region includes a third peripheral region surrounding the transparent aperture region and a third central region located between the plurality of transparent apertures. 3. As claimed in claim 2 The wafer level lens module array, wherein: the number of the first alignment elements is at least two, and the plurality of first-alignment elements are 'localized' to the first peripheral area, the third alignment element The number is at least two, and the plurality of third alignment elements are located in the third peripheral region. 4. The wafer level lens module array according to claim 2, wherein: the second The number of the alignment elements is at least two, and the plurality of the first alignment elements are located in the first central area, the number of the third alignment elements is at least two, and the plural third 11 201037388 is aligned The components are all located in the third central zone. The wafer level mirror described in item 3 or 4 of the tit patent range The head module array 'where: the number of the components is at least two, and the plurality of second alignment components are all in position. The middle element: ί is at least two ' and the plural range is the third or fourth item The wafer level lens module _, wherein: the number of the two pieces is at least two 'and the plurality of second aligning elements are all ''for ^4: the strip is at least two' and the plural Ο Wafer-level lens module array 'where: the first bit: two or two = trap or :; = column =; or right: concave: for the end 8", application, the scope of the seventh paragraph In the middle of the circle ί: wear: through the hole or depression of the substrate, = four = column: pass::: is the second alignment with the array, the light hole, and are provided i layer. / ρ 碰 环 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ $chrome layer. (2) Array and _ column by =^ column | 12
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