201012199 九、發明說明： 【發明所屬之技術領域】 本發明係有關一種影像感測模組，特別是關於一種可 配置多鏡頭之影像感測模組。 【先前技術】 現今技術的影像感測模組運用領域相當廣泛，如數位 相機、數位攝影機、影像電話及視訊會議等等，其係將一 Ο 影像感測半導體晶片封裝於光學裝置内，以感測擷取光學 影像訊號，並將光學影像訊號轉換成電子訊號傳遞至電路 基板，使光學影像$虎可加以辨識、處理或儲存。 習知的影像感測模组可如第-圖所示，影像感測模组 100包括一鏡頭1〇2、鏡座104、影像感測晶片106以及基 板108。影像感測晶片106形成於基板1〇8上具有一影 像感測區域。鏡座104固定於基板108上並覆蓋影像感^ 測晶片上。鏡頭102係設置於鏡座104内，且對準影像感 測晶片之影像感測區域。透過鏡頭1〇2，影像感測晶片可 擷取外部的影像訊號。201012199 IX. Description of the Invention: [Technical Field] The present invention relates to an image sensing module, and more particularly to an image sensing module that can be configured with multiple lenses. [Prior Art] The image sensing module of today's technology has a wide range of applications, such as digital cameras, digital cameras, video phones, and video conferencing, etc., which encapsulates an image sensing semiconductor chip in an optical device. The optical image signal is captured and the optical image signal is converted into an electronic signal and transmitted to the circuit substrate, so that the optical image can be identified, processed or stored. The conventional image sensing module can be as shown in the first figure. The image sensing module 100 includes a lens 1 , a lens holder 104 , an image sensing wafer 106 , and a substrate 108 . The image sensing wafer 106 is formed on the substrate 1 to have an image sensing area. The lens holder 104 is fixed to the substrate 108 and covers the image sensing wafer. The lens 102 is disposed in the lens holder 104 and is aligned with the image sensing area of the image sensing chip. Through the lens 1〇2, the image sensing chip can capture external image signals.
^如中華民國公告第伽42專利揭露了類似的影像 結構m —種咖及⑽s影像擷取模組， 二電路基板該電路基板上具有—⑽及CMC)S 一：測凡件及相關之電子元件’該影像感測元件頂面 由又將r頭尺寸與影像感測元件相同大小之鏡頭座，藉 由將鏡頭座與影像感測元件 影像或測元件之馆品且鏡頭屋底面與 牛之頂面均系平面接觸，使鏡頭座之抽心 5 201012199 像感測兀件之中心間不會生產位差及角度差，以達到避免 影像產生像差之功效。 中華民國公告第1297920專利亦揭露一種微型攝影模 組，主要包含一基板、一感測模組晶片以及一鏡片模組， 該基板係具有一表面，該表面定義有一黏晶區與一模組結 合區，以分別設置該感測模組晶片與該鏡片模組，其中，該模 組結合區係環繞該黏晶區，並且在該黏晶區内定義有一檢 0測點。該基板係包含複數個連接墊及複數個位於該黏晶區 外侧之檢測條，其中該些檢測條之中垂線交叉點係對準於 该檢測點，藉由該些檢測條之中垂線交叉點在黏晶後自主 檢查該感測模組晶片之感測區中心位置。 中華民國公告第M250470專利亦揭露一種玻璃覆晶 攝影模組，其攝影模組包含有一鏡頭座，該鏡頭座包含有 一座體及一濾光片’該座體係具有一基座部及一鏡頭結合 部’該基座部係形成有複數個電性導接元件，該濾光片係 ❹設於該基座部與該鏡頭結合部之間，該濾光片係具有複數 個線路，該些線路係與該些電性導接元件電性連接，該遽 光片係覆晶接合有一影像感測晶片，該影像感測晶片與該 鏡頭座之該濾、光片之間係設有一第一密封膠，以密封該影 像感測晶片之感測面，避免該感測面被污染。 上述習知技術皆未揭露一種具有360視角之全方向影 像感測模組。 【發明内容】 基於上述，本發明之目的係在於提供一種具有多個透 201012199 鏡之影像感測模組。 本發明之另一 影像感測模組。 目的係在於提供一種具有36〇度視角的 本發明之另一目的係利用光學系統作為透鏡與影像感 測區域間之路徑傳輸，以遞影像訊號。 本發明之另一目的係利用分隔罩將影像感測模組之感 測區域分割成複數個區域，每一個區域皆有其對應之透鏡 ❺與光學系統傳輸路徑。 ^ 本發明係揭露一種可配置多鏡頭之影像感測模組，包 含：一基板；一影像感測晶片，形成於基板上，影像感測晶 片具有一影像感測區域形成於其上；一分隔罩，形成於基 板上’並覆蓋於影像感測晶片上方’分隔罩具有複數個開 口對應至影像感測區域’根據複數個開口將影像感測區域 刀割成複數區域，一光學系統’輛合至分隔罩；以及複數 個鏡頭，耦合於光學系統，透過光學系統將影像訊號傳遞 ®至影像感測區域。 本發明亦揭露一種可配置多鏡頭之影像感測模組，包 含：一基板；一影像感測晶片’形成於基板上，影像感測晶 片具有一影像感測區域形成於其上；一分隔罩，形成於基 板上’並覆蓋於影像感測晶片上方，分隔罩具有複數個開 口對應至影像感測區域，根據複數個開口將影像感測區域 分割成複數區域；一鏡片組，配置於複數個開口之上；一 光纖輸出固定座，覆蓋於分隔罩之複數個開口之上；複數 個光纖輸入固定座，透過光纖連接至光纖輸出固定座；以 201012199 及複數個鏡頭，個別設置於複數個光纖輸入固定座，透過 光纖將影像訊號傳遞至影像感測區域。 本發明之可配置多鏡頭之影像感測模組，其中基板為 多層印刷電路板（multilayerPCB)。上述影像感測晶片可包 括電荷耦合元件或互補式金氧半導體感測晶片。上述鏡頭 數目至少為三個，使其影像感測模組達到360度視角。 、本發明之可配置多鏡頭之影像感測模組將影像感測區 0域分割成複數個獨立區域，每一個區域皆有對應的鏡頭與 光纖傳輸路徑，如此則僅需一個影像感測模組即可以獲得 360度之寬廣視角，節省影像感測模組數目。再者，=發 明之可配置多鏡頭之影像感測模組利用光纖作為透鏡與至 影像感測模組之感測區域的光信號傳輸途徑，如此可延長 影像感測模組與透鏡間的距離。 【實施方式】 本發明將配合其較佳實施例與後附之圖式詳述於下。 ©應可理解，本發明中之較佳實施例係僅用以說明，而非用 以限定本發明。此外，除文中之較佳實施例外，本發明亦 可廣泛應用於其他實施例’並且本發明並不限定於任何實 施例’而應視後附之申請專利範圍而定。 貫穿本說明書之「一實施例（one embodiment)」或「實 施例（a embodiment)」’其意指描述關於較佳實施例之—特 殊特徵、結構或特性’且包含至少一個本發明之較佳實施 例。因此’於本發明書之各處出現之片語於「一實施例中 (in one embodiment)」或「於實施例中（in a embodiment)」， 8 201012199 不須完全參照相同之會余々 特性可以任何適告之方弋 其特殊特徵、結構或 中。 適田之方式結合於-個或多個較佳實施例 J 一種具有多個鏡頭的影像感測模纪，利用 ^象^賴組分隔罩將影像感測晶片的影像擷取區域糾 成複數㈣像區域H透H取—部份分割 有:分割的影像區域利用已知之演算技術處 可獲得大角度(可達360度)的寬廣視 二一個影像感測模組則可獲得與多個影像感 測模組的視野，節省了影像感測模組的數目。 本發明之影像感測模組透過光學系統連接複數個鏡 頭’加長影像感測模組與鏡頭間的蹄，以利於提升適用 圍’其影像感測模組透過較遠距離的鏡頭可操取較遠的 影像。將複數個鏡頭分別地水平配置於視角，可獲得3⑹ 度的寬廣視野的影像。 第二圖根據較佳實施例，為本發明之可配置多鏡頭之 影像感測模組200之架構圖。影像感測模組200包括影像 感測晶片202、光學系統206、鏡片組208以及複數個鏡頭 216。 自外部的影像訊號透過光學系統206傳輸至影像感測 晶片202。影像訊號經過光學系統206傳輸後，會透過分 隔罩（未顯示）以分隔影像訊號成為個別獨立、互不影響的 訊號。分隔罩將影像感測晶片202之影像感測區域分成複 數個子區域。每一個子區域皆有對應的鏡頭216。外部的 201012199 影像訊號依照順序透過鏡頭216、光學系統206、鏡片組 208、分隔罩至影像感測晶片202之影像感測區域上。上述 的複數個光學傳輸路徑是獨立的路徑，並不會互相影響其 傳輸。當影像感測晶片202接收影像訊號後，則將其光影 像訊號傳送至類比數位轉換器218，使其影像訊號轉換成 數位的影像訊號。 於較佳實施例，上述光學系統206可由凸透鏡、凹透 @鏡及平面鏡所組成之。上述光學系統206可為一光纖傳輸 系統。 請參照第三圖，根據本發明之實施例，為本發明之可 配置多鏡頭之影像感測模組300之分解圖。可配置多鏡頭 之影像感測模組300包括影像感測晶片302、基板304、影 像感測模組分隔罩306、鏡片組308、光纖輸出固定座310、 光纖312、複數個光纖輸入固定座314以及複數個鏡頭316。 影像感測晶片302係設置於基板304上，具有一影像 ©感測區域303，用以擷取影像。基板304為多層印刷電路 板（multilayer PCB)，但並不限於多層板，任何合適的電路 板皆可應用於本發明。基板304亦可包括類比與數位電路 形成於其上（未顯示），例如，數位信號控制器（DSP)、記憶 體晶片、特殊應用積體電路（Application Specific Integrated Circuit, ASIC)晶片以及被動元件。影像感測晶片302的影 像感測區域303接收光學訊號，並經由數位訊號控制器與 特殊應用積體電路晶片將類比影像訊號轉換成數位影像訊 號，並將數位影像訊號儲存於記憶體晶片。 201012199 影像感測晶片302可包括電荷搞合元件（Charge Coupled Device, CCD)或互補式金氧半導體 (Complementary Metal-Oxide Semiconductor, CMOS)影像 感測晶片。電荷耦合元件為數位相機中可記錄光線變化的 半導體，通常以百萬像素（pixel)為單位，其主要材質為矽 晶半導體，將感光元件表面上的光轉換成儲存電荷的能 力。當電荷麵合元件表面感受到光線照射時，產生電荷反 @應在元件上，再透過通道傳輸至放大與解碼原件，就能還 原電荷耦合元件上的所有感光元件產生的訊號，並構成了 一幅完整的晝面。互補式金氧半導體影像感測晶片和電荷 耦合元件一樣同為在數位相機中可記錄光線變化的半導 體。但互補式金氧半導體的製造技術和電荷耦合元件不 同，反而比較接近一般電腦晶片。互補式金氧半導體的材 質主要是利用矽和鍺這兩種元素所做成的半導體，其影像 感測模組利用電流處理晶片紀錄和解讀成影像。 〇 影像感測模組分隔罩306配置於影像感測晶片302上 方，並固定於基板304上。影像感測模組分隔罩306具有 開口 307，開口 307係對應著影像感測晶片302的影像感 測區域303。影像感測模組302透過開口 307擷取外部的 影像。影像感測模組分隔罩306利用複數個隔板309間隔 開口 307,將其分隔成複數個開口 307,使影像感測區域 303分隔成複數個區域。在此實施例中，影像感測模組分 隔罩306係將影像感測區域分隔成四個區域，但並不僅限 於四個。 11 201012199 鏡片組308與光纖輸出固定座310係配置於影像感測 模組分隔罩306之開口 307上。具有複數個鏡片的鏡片組 308其複數個鏡片係個別地對應個別的開口 307。光纖輸出 固定座310、鏡頭308、影像感測模組分隔罩306與基板 307所形成空間可抽真空或是填充低濕度的鈍態氣體（氮氣 或氬氣），以防止水氣入侵其内而影響影像感測晶片的感測 能力。光纖輸出固定座310透過光纖312連接至個別的光 ❹纖輸入固定座314。光纖輸入固定座314之開口 315具有 螺紋，以便鏡頭316可旋入光纖輸入固定座之開口 315内。 可配置多鏡頭之影像感測模組300並透過光纖312將 自外部的光學訊號傳送至影像感測晶片302上的影像感測 區域303。利用光纖通訊傳遞光學訊號能得到很好的傳輸 效率。自鏡頭316至影像感測區域303的光纖傳輸路徑皆 獨立存在’互不干涉彼此間的信號傳輸。 本發明加長透鏡與影像感測區域的距離，可將鏡頭 © 3 16與光纖輸入固定座3 14放置於距離影像感測晶片3〇2 與基板304相離很遠的位置，如使只需將鏡頭架設至任何 想要的位置，特別是有些狹小難以放置整個影像感測模組 的空間。 藉由影像感測模組分隔罩’影像感測晶片3〇2上的感 測區域303將被分割成多個區域，每個鏡頭316只需負責 部份的感測區域，如此可獲得36〇度的寬廣視角。於本實 施例中的鏡頭數目為四個，但並不限於四個，任何合適數 目的鏡頭皆可應用於本發明。 12 201012199 根據本發明之實施例，參照第四圖，為本發明之可配 置多鏡頭之影像感測模組3〇〇之立體圖。於較佳實施例， 本發明之可配置多鏡頭之影像感測模組3〇〇可應用於需要 360度視角的設備，例如，會行走且定出方向的機器人或 是用於量測距離的場合。在水平方向，透過光纖將每個鏡 頭316配置於特定位置，以個別分配約9〇度視野，如此影 像感測模組300則可獲得36〇度之視角。於較佳實施例， ❹影像感測模組300亦可利用三個鏡頭，每一個鏡頭分配12〇 度之視角。 本發明利用光織傳輸光學訊號，可將透鏡配置於任和 想要的位置。若是一般習知技術想要獲得的全方位的視 角，則必須利用多個影像感測模組個別配置在多個方位。 本發明之可配置多鏡頭之影像感測模組僅需利用一個影像 感測模組即可達到全方向的功效。 本發明以較佳實施例說明如上，然其並非用以限定本 發明所主張之專利權利範圍。其專利保護範圍當視後附之 申請專利範圍及其等同領域較。凡熟悉此領域之技蔽 者，在不脫離本專利精神或範圍内，所作之更動或潤飾， 均屬於本發明所揭示精神下所完成之等效改變或設計，且 應包含在下述之申請專利範圍内。 【圖式簡單說明】 上述元件，以及本發明其他特徵與優點，藉由閱讀實 施方式之内谷及其圖式後，將更為明顯： 第一圖根據較佳實施例，為先前技術之影像感測模組 13 201012199 立體圖。 為本發明之可配置多鏡頭之 第二圖根據較佳實施例 影像感測模組之架構圖。 第三圖根據較佳實施例，為本發明之可配置多鏡頭之 影像感測模組之分解圖。 第四圖根據較佳實施例’為本發明之可配置多鏡頭之 影像感測模組之立體圖。 ❹【主要元件符號說明】 1〇〇 影像感測模組 102 鏡頭 104 鏡座 106影像感測晶片 108 基板 200可配置多鏡頭之影像感測模組 2〇2影像感測晶片^ For example, the Republic of China Announcement No. 42 patent discloses a similar image structure m-type coffee and (10)s image capture module, and the second circuit substrate has -(10) and CMC on the circuit substrate. S: Measurement of parts and related electronics The top surface of the image sensing element is a lens holder having the same size as the image sensing element, and the lens holder and the image sensing component image or the component of the measuring component are connected to the bottom of the lens housing. The top surface is flat contact, so that the center of the lens holder 5 201012199 will not produce the difference between the center and the center of the sensing element, so as to avoid the image aberration. The Republic of China Publication No. 1297920 also discloses a miniature photographic module, which mainly comprises a substrate, a sensing module wafer and a lens module, the substrate having a surface defining a die bonding region and a module The sensing module chip and the lens module are respectively disposed, wherein the module bonding region surrounds the die bonding region, and a zero detection point is defined in the die bonding region. The substrate includes a plurality of connection pads and a plurality of detection strips located outside the die bond region, wherein the intersections of the vertical lines of the test strips are aligned with the detection points, and the intersections of the perpendicular lines among the test strips After the die bonding, the center position of the sensing area of the sensing module chip is self-checked. The Republic of China Announcement No. M250470 also discloses a glass flip chip photographic module, the photographic module comprising a lens mount comprising a body and a filter. The base system has a base portion and a lens combination The portion of the base portion is formed with a plurality of electrical guiding elements, the filter is disposed between the base portion and the lens coupling portion, and the filter has a plurality of lines, the lines And electrically connected to the electrical conductive elements, the light-emitting sheet is flip-chip bonded to an image sensing wafer, and the image sensing wafer and the filter holder of the lens holder are provided with a first seal a glue to seal the sensing surface of the image sensing wafer to prevent the sensing surface from being contaminated. None of the above prior art techniques disclose an omnidirectional image sensing module having a 360 viewing angle. SUMMARY OF THE INVENTION Based on the above, an object of the present invention is to provide an image sensing module having a plurality of 201012199 mirrors. Another image sensing module of the present invention. Another object of the present invention is to provide an optical system as a path transmission between a lens and an image sensing area for transmitting image signals. Another object of the present invention is to divide the sensing area of the image sensing module into a plurality of regions by using a spacer, each of which has its corresponding lens and optical system transmission path. The invention discloses a configurable multi-lens image sensing module, comprising: a substrate; an image sensing chip formed on the substrate, the image sensing chip having an image sensing area formed thereon; a separation a cover is formed on the substrate and covers the image sensing wafer. The spacer has a plurality of openings corresponding to the image sensing region. The image sensing region is cut into a plurality of regions according to the plurality of openings. To the partition cover; and a plurality of lenses coupled to the optical system to transmit the image signal to the image sensing area through the optical system. The invention also discloses a configurable multi-lens image sensing module, comprising: a substrate; an image sensing chip ′ is formed on the substrate, the image sensing chip has an image sensing area formed thereon; a partition cover Formed on the substrate and overlying the image sensing wafer, the partition cover has a plurality of openings corresponding to the image sensing area, and the image sensing area is divided into a plurality of areas according to the plurality of openings; a lens group is disposed in the plurality of Above the opening; an optical fiber output fixing seat covering a plurality of openings of the partition cover; a plurality of optical fiber input fixing bases connected to the optical fiber output fixing base through the optical fiber; and a plurality of optical fibers respectively arranged in 201012199 and a plurality of lenses The input holder is used to transmit the image signal to the image sensing area through the optical fiber. The configurable multi-lens image sensing module of the present invention, wherein the substrate is a multilayer printed circuit board (multilayer PCB). The image sensing wafer may comprise a charge coupled device or a complementary MOS sensing wafer. The number of lenses mentioned above is at least three, making the image sensing module reach a 360-degree viewing angle. The configurable multi-lens image sensing module of the present invention divides the image sensing area 0 into a plurality of independent areas, each of which has a corresponding lens and fiber transmission path, so that only one image sensing mode is needed. The group can obtain a wide viewing angle of 360 degrees, saving the number of image sensing modules. Furthermore, the configurable multi-lens image sensing module of the invention utilizes an optical fiber as a light signal transmission path for the lens and the sensing region of the image sensing module, thereby extending the distance between the image sensing module and the lens. . [Embodiment] The present invention will be described in detail below in conjunction with the preferred embodiments and the appended drawings. The preferred embodiments of the present invention are to be construed as illustrative only and not limiting. Further, the present invention is also applicable to other embodiments in addition to the preferred embodiments, and the present invention is not limited to any embodiment and should be construed as the scope of the appended claims. Throughout the specification, "one embodiment" or "an embodiment" is intended to describe a particular feature, structure, or characteristic of the preferred embodiment and includes at least one preferred embodiment of the invention. Example. Therefore, the phrase "in one embodiment" or "in a embodiment" appears in the description of the present invention, 8 201012199 does not have to fully refer to the same feature. Any special features, structure or medium may be used in any way. The method of adapting to the field is combined with one or more preferred embodiments. J. An image sensing module having a plurality of lenses, and the image capturing area of the image sensing wafer is multiplexed into plural numbers by using the image separation mask (4) The image area H is H--partitioned: the divided image area can be obtained by using a known algorithm to obtain a wide angle (up to 360 degrees) wide-view two image sensing module. Sensing the field of view of the module saves the number of image sensing modules. The image sensing module of the present invention connects a plurality of lenses through an optical system to lengthen the hoof between the image sensing module and the lens, so as to facilitate the improvement of the application of the image sensing module through a longer distance lens. Far image. By arranging a plurality of lenses horizontally at a viewing angle, a wide field of view image of 3 (6) degrees can be obtained. The second figure is an architectural diagram of a configurable multi-lens image sensing module 200 according to a preferred embodiment of the present invention. The image sensing module 200 includes an image sensing chip 202, an optical system 206, a lens group 208, and a plurality of lenses 216. The image signal from the outside is transmitted to the image sensing wafer 202 through the optical system 206. After the image signal is transmitted through the optical system 206, the image signal is separated by a partition cover (not shown) to become individual independent signals that do not affect each other. The divider covers the image sensing area of the image sensing wafer 202 into a plurality of sub-areas. Each sub-area has a corresponding lens 216. The external 201012199 image signal passes through the lens 216, the optical system 206, the lens group 208, and the spacer cover to the image sensing area of the image sensing chip 202 in sequence. The above plurality of optical transmission paths are independent paths and do not affect each other's transmission. After the image sensing chip 202 receives the image signal, the image signal is transmitted to the analog digital converter 218 to convert the image signal into a digital image signal. In a preferred embodiment, the optical system 206 can be comprised of a convex lens, a concave mirror, and a mirror. The optical system 206 described above can be a fiber optic transmission system. Referring to the third embodiment, an exploded view of the configurable multi-lens image sensing module 300 of the present invention is provided in accordance with an embodiment of the present invention. The multiplexable image sensing module 300 includes an image sensing chip 302, a substrate 304, an image sensing module spacer 306, a lens group 308, an optical fiber output fixing base 310, an optical fiber 312, and a plurality of optical fiber input fixing bases 314. And a plurality of lenses 316. The image sensing chip 302 is disposed on the substrate 304 and has an image © sensing area 303 for capturing images. The substrate 304 is a multilayer PCB, but is not limited to a multilayer board, and any suitable circuit board can be applied to the present invention. Substrate 304 may also include analog and digital circuitry formed thereon (not shown), such as digital signal controllers (DSPs), memory chips, Application Specific Integrated Circuit (ASIC) wafers, and passive components. The image sensing area 303 of the image sensing chip 302 receives the optical signal, and converts the analog image signal into a digital image signal through the digital signal controller and the special application integrated circuit chip, and stores the digital image signal on the memory chip. The image sensing wafer 302 may include a Charge Coupled Device (CCD) or a Complementary Metal-Oxide Semiconductor (CMOS) image sensing wafer. A charge-coupled component is a semiconductor that records light changes in a digital camera, usually in megapixels. Its main material is a germanium semiconductor, which converts the light on the surface of the photosensitive element into the ability to store charge. When the surface of the charge-fitting element senses the light, the charge is generated on the component, and then transmitted through the channel to the amplification and decoding original, the signal generated by all the photosensitive elements on the charge-coupled component is restored, and constitutes a A complete picture. A complementary MOS image sensing wafer, like a charge coupled device, is a semiconductor that can record light changes in a digital camera. However, the manufacturing technology of complementary MOS is different from that of charge-coupled components, but it is closer to the general computer chip. Complementary MOS materials are mainly made of semiconductors made of yttrium and lanthanum. The image sensing module uses current to process wafers and interpret them into images. The image sensing module spacer 306 is disposed above the image sensing die 302 and is fixed on the substrate 304. The image sensing module divider cover 306 has an opening 307 corresponding to the image sensing area 303 of the image sensing wafer 302. The image sensing module 302 captures an external image through the opening 307. The image sensing module spacer 306 is separated by a plurality of spacers 309 to form an opening 307, which is divided into a plurality of openings 307 to divide the image sensing area 303 into a plurality of areas. In this embodiment, the image sensing mode component spacer 306 separates the image sensing area into four areas, but is not limited to four. 11 201012199 The lens assembly 308 and the fiber output holder 310 are disposed on the opening 307 of the image sensing module divider 306. A plurality of lenses of lens group 308 having a plurality of lenses individually correspond to individual openings 307. The space formed by the optical fiber output mount 310, the lens 308, the image sensing module partition cover 306 and the substrate 307 can be evacuated or filled with a low-humidity passive gas (nitrogen or argon) to prevent moisture from entering the space. Affects the sensing capability of the image sensing wafer. The fiber optic output mount 310 is coupled to the individual fiber optic input mounts 314 via optical fibers 312. The opening 315 of the fiber optic input mount 314 is threaded so that the lens 316 can be threaded into the opening 315 of the fiber optic input mount. The multi-lens image sensing module 300 can be configured to transmit optical signals from the outside to the image sensing area 303 on the image sensing wafer 302 via the optical fiber 312. The transmission of optical signals by optical fiber communication can achieve good transmission efficiency. The optical fiber transmission paths from the lens 316 to the image sensing area 303 are independently present and do not interfere with each other's signal transmission. The distance between the elongated lens and the image sensing area of the present invention can be used to place the lens © 3 16 and the fiber input holder 3 14 at a distance from the image sensing chip 3〇2 and the substrate 304. The lens is erected to any desired position, especially in a small space where it is difficult to place the entire image sensing module. The sensing area 303 on the image sensing chip 3〇2 by the image sensing module spacer will be divided into a plurality of areas, and each lens 316 only needs to be responsible for a part of the sensing area, so that 36〇 can be obtained. A wide viewing angle. The number of lenses in this embodiment is four, but is not limited to four, and any suitable number of lenses can be applied to the present invention. 12 201012199 According to an embodiment of the present invention, referring to the fourth figure, a perspective view of a multi-lens image sensing module 3〇〇 according to the present invention is shown. In a preferred embodiment, the configurable multi-lens image sensing module 3 of the present invention can be applied to a device that requires a 360 degree viewing angle, for example, a robot that walks and sets the direction or measures the distance. occasion. In the horizontal direction, each of the lenses 316 is disposed at a specific position through the optical fiber to individually distribute about 9 degrees of field of view, so that the image sensing module 300 can obtain a viewing angle of 36 degrees. In the preferred embodiment, the image sensing module 300 can also utilize three lenses, each of which is assigned a viewing angle of 12 degrees. The present invention utilizes optical woven optical signals to position the lens at any desired location. If the omnidirectional viewing angle is desired by conventional techniques, multiple image sensing modules must be individually arranged in multiple orientations. The configurable multi-lens image sensing module of the present invention can achieve omnidirectional effect by using only one image sensing module. The present invention has been described above by way of a preferred embodiment, and is not intended to limit the scope of the invention as claimed. The scope of patent protection is based on the scope of the patent application and its equivalent. Any modification or refinement made by those skilled in the art without departing from the spirit or scope of this patent belongs to the equivalent changes or designs made under the spirit of the present invention and should be included in the following patent application. Within the scope. BRIEF DESCRIPTION OF THE DRAWINGS The above-described elements, as well as other features and advantages of the present invention, will become more apparent after reading the inner valleys of the embodiments and the drawings thereof. FIG. 1 is a prior art image according to a preferred embodiment. Sensing module 13 201012199 Stereogram. The second embodiment of the configurable multi-lens of the present invention is an architectural diagram of an image sensing module according to a preferred embodiment. The third embodiment is an exploded view of a configurable multi-lens image sensing module according to the preferred embodiment of the present invention. The fourth embodiment is a perspective view of a configurable multi-lens image sensing module according to the preferred embodiment of the present invention. ❹[Main component symbol description] 1〇〇 Image sensing module 102 Lens 104 Mirror base 106 Image sensing chip 108 Substrate 200 Configurable multi-lens image sensing module 2〇2 image sensing chip
206光學系統 2〇8 鏡片組 216 鏡頭 218類比數位轉換器 3〇〇可配置多鏡頭之影像感測模組 302影像感測晶片 303影像感測區域 基板 306影像感測模組分隔罩 201012199 307 開口 308 鏡片組 310 光纖輸出固定座 312 光纖 314 光纖輸入固定座 315 開口 316 鏡頭206 optical system 2〇8 lens group 216 lens 218 analog digital converter 3〇〇 configurable multi-lens image sensing module 302 image sensing chip 303 image sensing area substrate 306 image sensing module partition cover 201012199 307 opening 308 lens set 310 fiber output mount 312 fiber 314 fiber input mount 315 opening 316 lens
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