TW200943601A - Organic luminous diode, contact arrangement and method for the production of an organic luminous diode - Google Patents

Organic luminous diode, contact arrangement and method for the production of an organic luminous diode

Info

Publication number
TW200943601A
TW200943601A TW098106281A TW98106281A TW200943601A TW 200943601 A TW200943601 A TW 200943601A TW 098106281 A TW098106281 A TW 098106281A TW 98106281 A TW98106281 A TW 98106281A TW 200943601 A TW200943601 A TW 200943601A
Authority
TW
Taiwan
Prior art keywords
organic luminous
luminous diode
layer
terminal layer
production
Prior art date
Application number
TW098106281A
Other languages
English (en)
Inventor
Dirk Becker
Thomas Dobbertin
Markus Klein
Erwin Lang
Original Assignee
Osram Opto Semiconductors Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors Gmbh filed Critical Osram Opto Semiconductors Gmbh
Publication of TW200943601A publication Critical patent/TW200943601A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H10K50/81—Anodes
    • H10K50/814—Anodes combined with auxiliary electrodes, e.g. ITO layer combined with metal lines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H10K50/82—Cathodes
    • H10K50/824—Cathodes combined with auxiliary electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/88—Terminals, e.g. bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • H10K59/352—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels the areas of the RGB subpixels being different
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/26—Materials of the light emitting region
    • H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
    • H01L33/32—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H10K50/82—Cathodes
    • H10K50/828—Transparent cathodes, e.g. comprising thin metal layers

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electroluminescent Light Sources (AREA)
  • Led Devices (AREA)
TW098106281A 2008-02-29 2009-02-27 Organic luminous diode, contact arrangement and method for the production of an organic luminous diode TW200943601A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008011867 2008-02-29
DE102008020816.7A DE102008020816B4 (de) 2008-02-29 2008-04-25 Organische Leuchtdiode, flächiges, optisch aktives Element mit einer Kontaktanordnung und Verfahren zur Herstellung einer organischen Leuchtdiode

Publications (1)

Publication Number Publication Date
TW200943601A true TW200943601A (en) 2009-10-16

Family

ID=40911437

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098106281A TW200943601A (en) 2008-02-29 2009-02-27 Organic luminous diode, contact arrangement and method for the production of an organic luminous diode

Country Status (8)

Country Link
US (1) US8791490B2 (zh)
EP (1) EP2248202A1 (zh)
JP (1) JP2011513901A (zh)
KR (1) KR101548400B1 (zh)
CN (1) CN101965654B (zh)
DE (1) DE102008020816B4 (zh)
TW (1) TW200943601A (zh)
WO (1) WO2009106040A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI548131B (zh) * 2015-04-30 2016-09-01 Wisechip Semiconductor Inc Available for organic light emitting diode modules

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JP5460291B2 (ja) * 2009-12-17 2014-04-02 株式会社カネカ 有機発光装置の製造方法および有機発光装置
KR101671342B1 (ko) 2010-04-06 2016-11-02 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법
KR20120090595A (ko) * 2011-02-08 2012-08-17 삼성전자주식회사 유기 발광 소자
US8963420B2 (en) 2011-08-29 2015-02-24 Lg Display Co., Ltd. Organic electro-luminescence display panel for preventing the display panel from degrading and a method for fabricating the same
DE102012221191B4 (de) 2012-11-20 2022-03-17 Pictiva Displays International Limited Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements
DE102013107467A1 (de) * 2013-07-15 2015-01-15 Osram Opto Semiconductors Gmbh Organisches lichtemittierendes Bauteil
DE102014110067A1 (de) * 2014-07-17 2016-01-21 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zu seiner Herstellung
DE102014111345B4 (de) * 2014-08-08 2023-05-04 Osram Oled Gmbh Optoelektronisches Bauelement und Verfahren zu dessen Herstellung
DE102014119538A1 (de) * 2014-12-23 2016-06-23 Osram Oled Gmbh Optoelektronische Baugruppe und Verfahren zum Herstellen einer optoelektronischen Baugruppe
DE102015105756A1 (de) * 2015-04-15 2016-10-20 Osram Oled Gmbh Beleuchtungsanordnung und Verfahren zum Herstellen einer Beleuchtungsanordnung
DE102015114844A1 (de) 2015-09-04 2017-03-09 Osram Oled Gmbh Organische Leuchtdiode und Fahrzeugaußenbeleuchtung
CN106252525B (zh) * 2016-08-26 2018-03-27 京东方科技集团股份有限公司 Oled器件及制作方法、显示面板以及显示装置
FI128685B (en) 2016-09-27 2020-10-15 Teknologian Tutkimuskeskus Vtt Oy Layered device and its manufacturing method
CN114220895B (zh) * 2021-12-15 2024-07-05 安徽格恩半导体有限公司 一种发光器件及其制作方法

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JP4269195B2 (ja) 1998-09-25 2009-05-27 ソニー株式会社 発光又は調光素子、及びその製造方法
JP2002072907A (ja) * 2000-08-31 2002-03-12 Sony Corp 表示装置
US20060091126A1 (en) 2001-01-31 2006-05-04 Baird Brian W Ultraviolet laser ablative patterning of microstructures in semiconductors
JP2002299047A (ja) 2001-03-30 2002-10-11 Sanyo Electric Co Ltd エレクトロルミネッセンス表示装置およびその製造方法
US6771328B2 (en) * 2001-07-25 2004-08-03 Lg. Philips Lcd Co., Ltd. Active matrix organic electroluminescent device simplifying a fabricating process and a fabricating method thereof
GB2379317A (en) 2001-08-30 2003-03-05 Cambridge Display Tech Ltd Optoelectronic display operating by photoluminescence quenching
EP1418634A1 (de) * 2002-11-06 2004-05-12 Samsung SDI Co. Ltd. Display auf Basis organischer, lichtemittierender Bauelemente (OLED) mit niederohmigem Kathodenkontakt
US20040152240A1 (en) * 2003-01-24 2004-08-05 Carlos Dangelo Method and apparatus for the use of self-assembled nanowires for the removal of heat from integrated circuits
EP1469450A1 (en) 2003-04-18 2004-10-20 Barco N.V. Organic light-emitting diode display assembly for use in a large-screen display
JP4380242B2 (ja) * 2003-07-16 2009-12-09 セイコーエプソン株式会社 電気光学装置、電気光学装置の製造方法及び電子機器
JP2005122910A (ja) * 2003-10-14 2005-05-12 Hitachi Ltd 有機ｅｌディスプレイ装置および有機ｅｌ素子の構造体の製造方法
JP4027914B2 (ja) 2004-05-21 2007-12-26 株式会社半導体エネルギー研究所 照明装置及びそれを用いた機器
US7733441B2 (en) * 2004-06-03 2010-06-08 Semiconductor Energy Labortory Co., Ltd. Organic electroluminescent lighting system provided with an insulating layer containing fluorescent material
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KR101345344B1 (ko) 2005-12-19 2013-12-30 코닌클리케 필립스 엔.브이. 유기 ｅｌ 장치
KR101148720B1 (ko) * 2005-12-31 2012-05-23 엘지디스플레이 주식회사 유기전계발광소자 및 그 제조방법
DE102006052029B4 (de) * 2006-09-22 2020-01-09 Osram Oled Gmbh Lichtemittierende Vorrichtung

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI548131B (zh) * 2015-04-30 2016-09-01 Wisechip Semiconductor Inc Available for organic light emitting diode modules

Also Published As

Publication number Publication date
DE102008020816A1 (de) 2009-09-03
KR20100134561A (ko) 2010-12-23
JP2011513901A (ja) 2011-04-28
US20110198657A1 (en) 2011-08-18
EP2248202A1 (de) 2010-11-10
DE102008020816B4 (de) 2019-10-10
KR101548400B1 (ko) 2015-09-04
CN101965654B (zh) 2016-04-06
CN101965654A (zh) 2011-02-02
US8791490B2 (en) 2014-07-29
WO2009106040A1 (de) 2009-09-03

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