200936266 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種LED基板製作方法，尤指一種可 有效簡化LED基板之製程，以減少製作時之工時及程序， 達到易於製作以及降低成本之功效者。 【先前技術】 按，一般習用之LED製作方法，其製程係包括下列步 驟： (1) 準備材料：係為一可印刷用電路板； (2) 第一次鑽孔：利用CNC鑽孔將所有導通孔全鑽透； (3) 第二次鑽孔：利用CNC鑽孔將凹杯位置半鑽透（前 導孔簡稱盲孔）； (4) 第三次鑽孔：利用特殊銑刀配合CNC鑽孔將凹杯成 型； 〇 (5)喷砂：將印刷電路板凹杯四周及底部打平整； (6) 導孔被覆：於導孔匹覆導電藥劑； (7) 電鍍：一次銅電鍍； (8) 底片製作：棕色底片； (9) 真空壓模：利用乾式線路油墨； (10) 油墨曝光：利用紫外燈管曝光； (11) 電路顯像：利用純鹼顯影完成後，以純水清洗； (12) 電鍍：二次銅電鍍； (13) 電鍍金屬：電鍍軟鎳，供LED固晶打線之用； 5 200936266 (14) 電鍍金屬：電鍍軟金（電解金），以防止表面氧化； (15) 去墨：以荷性鈉去除蝕刻部分油墨； (16) 蝕刻：以氣化氨蝕刻掉不要的部分； (17) 品檢：（刪修品檢）修護斷、短路； (18) 覆膜：（Liguide)防焊漆（通常正、反面皆需要）； (19) 烘烤：將防焊油墨烘烤乾； (20) 油墨曝光：利用紫外燈管（UV燈管）曝光； (21) 油墨顯像.以純驗顯影完’用純水清洗， (22) 油墨定型：烘烤定型； (23) 品檢測試：以高、低電流測試； (24) 成型：CNC銑刀或沖模成型； (25) 包裝：以真空包裝機包裝； 藉由上述步驟即可製作出凹杯式LED所用之凹杯印刷 電路板； (26) 準備材料：LED晶粒； (27) 點膠：以自動定量點膠機點上銀膠； (28) 固晶.以電腦自動固晶機固定晶粒位置， (29) 烘烤：烘烤固晶； (30) 連線：以自動打線機燒結正、負極使之導通； (31) 品檢測試：以電流衝擊測試； (32) 灌膠：以環氧樹酯灌注入灌膠模粒中再置入LED ; (33) 烘烤：烘烤完成。 如此，可藉由上述步驟即可製作成凹杯式LED。 雖然，上述習用之步驟可製成所需型式之LED，但是 200936266 由於其製作步驟較多，使得製作 之缺點 孔位'·至少三—之 時及程序之㈣，㈣導致成本t 【發明内容】 的係在於，可有效簡化LED基 工時及程序，達到易於製作以 因此，本發明之主要目 ❹板之製程，以減少製作時之 及降低成本之功效。 f達上述之目的，本發明係—種LED基板製作方法， 包3冲孔、影轉、鈷孔、表面處理、防焊以及成型等步驟； 而製作時係於一基板上沖壓出所需之多數孔位，於沖孔後 之基板上設置線路層，待線路層設置後，於基板之適當位 置處開設有多數螺旋凹孔，再於基板之線路層及螺旋凹孔 中層疊設有一導體層，之後於導體層上疊設有一保護層， ⑩ 並以沖模方式將基板分割成多數所需之LED基板單體。 【實施方式】 請參閱『第一圖〜第九圖』所示，係分別為本發明之 步驟流程示意圖、本發明之沖孔步驟示意圖、本發明之影 轉步驟示意圖、本發明第三圖之A部分放大示意圖、本發 明之鈷孔步驟示意圖、本發明第五圖之B部分放大俯視 圖、本發明之表面處理步驟示意圖、本發明之防焊步驟示 意圖及本發明之成型步驟示意圖。如圖所示：本發明係一 200936266 種LED基板製作方法，係可去 … ^ 乐』有效簡化LED基板之製程， 以減少製作時之工時及程戽，、去 建到易於製作以及降低成本 之功效。其包含下列步驟： 沖孔1 :係提供一某柘Ί Ί . _ 土板1 1 ’並於基板1 1上以沖壓 出所需之多數孔位1 1 !，而該孔位工 1 1包含有^位孔、螺絲孔及相關之通孔（如第二圖所 示）。 影轉2 :於沖孔後之基板1 i 一面上利用壓膜、曝光、 _影、姓刻與S膜之製程而於基板i丄上财所需之線路 層2 1 (如第二及第四圓所示），且於一般製程上，基板1 1上會先以前處理工程而設有一層阻隔層i i 2，例如膠 層，而線路層2 1則是依上述方式設於基板1 1上。 >鈷孔3 :待線路層2 1設置之後，再於基板丄丄之適 备位置處以鑽頭3 〇鑽設有多數螺旋凹孔3 1及螺旋凹孔 3 1周圍之小凹孔3 1 1 (如第五及第六圖所示）。 表面處理4 :係於基板1 1之線路層2 1及螺旋凹孔 3 1中以電鍍或其他化學方式層疊設有一導體層4丄，而 此導體層4 1係例如為金/鎳鍍層（如第七圖所示）。 防焊5 :再於導體層4 1上疊設有一保護層5 1，以 防止潮濕、灰塵或其他髒污影響基板1 1之特性（如第八 _所示）。 成型6 .以沖模方式將基板1 1分割成多數所需之 基板單體1 1 3 (如第九圖所示）。 綜上所述，本發明led基板製作方法可有效改善習用 200936266 點’可有效簡化LED基板之製程，以減少製作時 生達=於製作以及降低成本之功效，進: 生犯更進步、更實用、更符合使用者之所 、惟發明專利申請之要件’爰依法提出專利申請。 处 、所述者，僅為本發明之較佳實施例而已，當不 Ξ二:範圍;& ’凡依本發明申請專利 應仍屬本發明專H谷所作之簡軍的等效變化與修飾，皆 钱月專利涵蓋之範圍内。 【圖式簡單說明】 係本發明之步驟流程示意圖。 係本發明之沖孔步驟示意圖。 係本發明之影轉步驟示意圖。 φ 第一圖 第二圖 第三圖 第四圖 第五圖 第六圖 第七圖 第八圖 第九圖 係本發明第三圖之A部分放大示意圖 係本發明之钻孔步驟示意圖。 係本發明第五圖之B部分放大俯視圖 係本發明之表面處理步驟示意圖。 係本發明之防焊步驟示意圖。 係本發明之成型步驟示意圖。 【主要元件符號說明】 、沖?L 1 沖壓單元 1〇 基板 11 200936266 孔位 阻隔層 基板單體 影轉 線路層 钻孔 鑽頭 螺旋凹孔 小凹孔 表面處理 導體層 防焊 保護層 成型200936266 IX. Description of the Invention: [Technical Field] The present invention relates to a method for fabricating an LED substrate, and more particularly to a process for effectively simplifying an LED substrate, thereby reducing man-hours and procedures during production, and facilitating fabrication and reduction. The cost of the effect. [Prior Art] According to the conventional LED manufacturing method, the process includes the following steps: (1) Preparation of materials: a printed circuit board; (2) First drilling: using CNC drilling to The through hole is fully drilled through; (3) The second drilling: the hole is semi-drilled by the CNC drilling (the leading hole is referred to as the blind hole); (4) The third drilling: using a special milling cutter with CNC drilling The hole will be formed into a concave cup; 〇 (5) sand blasting: flattening the periphery and bottom of the concave surface of the printed circuit board; (6) covering the guide hole: covering the conductive hole with the conductive agent; (7) electroplating: primary copper plating; 8) Negative film production: brown negative film; (9) Vacuum molding: using dry line ink; (10) Ink exposure: exposure with UV lamp; (11) Circuit imaging: After pure developing with pure alkali, clean with pure water; (12) Electroplating: secondary copper plating; (13) Electroplating metal: electroplated soft nickel for LED solid crystal wire bonding; 5 200936266 (14) Electroplated metal: electroplated soft gold (electrolytic gold) to prevent surface oxidation; 15) Deinking: removing some of the ink by etching sodium; (16) etching: etching with vaporized ammonia (17) Quality inspection: (repair inspection) repair and short circuit; (18) Film: (Liguide) solder resist (usually required for both front and back); (19) Baking: (B) Ink exposure: Exposure with UV lamp (UV lamp); (21) Ink development. Pure development, 'clean with pure water, (22) Ink shaping: baking (23) Product testing: high and low current testing; (24) molding: CNC milling or die forming; (25) packaging: packaging in a vacuum packaging machine; by the above steps can be made into a concave cup (36) Preparation material: LED die; (27) Dispensing: silver glue on the automatic quantitative dispenser; (28) Solid crystal. Fixed crystal with computer automatic die bonding machine Grain position, (29) Baking: baking solid crystal; (30) Wiring: Sintering the positive and negative electrodes with an automatic wire machine to turn on; (31) Product testing: current impact test; (32) Glue: The epoxy resin is poured into the potting mold and placed in the LED; (33) Baking: baking is completed. Thus, the concave cup type LED can be fabricated by the above steps. Although the above-mentioned conventional steps can be made into the LED of the required type, the 200936266 has many manufacturing steps, so that the defective hole position of the production is at least three-times and the fourth (4) of the program, and (4) causes the cost t [invention content] The system is that the LED base time and the program can be effectively simplified, and the process of the main target board of the present invention can be easily made, so as to reduce the production time and the cost reduction effect. For the purpose of the above, the present invention is a method for fabricating an LED substrate, which comprises the steps of punching, shadowing, cobalt hole, surface treatment, soldering prevention, and molding; and manufacturing is performed on a substrate. In most of the holes, a circuit layer is disposed on the substrate after the punching. After the circuit layer is disposed, a plurality of spiral recesses are formed at appropriate positions of the substrate, and a conductor layer is laminated on the circuit layer and the spiral recess of the substrate. Then, a protective layer is stacked on the conductor layer, and the substrate is divided into a plurality of required LED substrate monomers by die. [Embodiment] Please refer to the "first to ninth" diagrams, which are schematic diagrams of the steps of the present invention, a schematic diagram of the punching steps of the present invention, a schematic diagram of the shadowing steps of the present invention, and a third figure of the present invention. A partially enlarged schematic view, a schematic diagram of a cobalt pore step of the present invention, an enlarged plan view of a portion B of the fifth embodiment of the present invention, a schematic diagram of a surface treatment step of the present invention, a schematic view of the solder resisting step of the present invention, and a schematic view of the molding step of the present invention. As shown in the figure: the present invention is a method for manufacturing LED substrates of 200936266, which can be used to simplify the process of LED substrates, to reduce the man-hours and process time during production, to be easy to manufacture and to reduce costs. The effect. The method comprises the following steps: punching 1: providing a certain 柘Ί _ soil plate 1 1 ′ and punching out a plurality of required hole positions 1 1 ! on the substrate 1 1 , and the hole position 1 1 contains There are ^ holes, screw holes and related through holes (as shown in the second figure). Shadow 2: On the surface of the substrate 1 i after punching, using the lamination, exposure, _ shadow, surname and S film process, the circuit layer 2 1 required for the substrate i (such as the second and the In the general process, the substrate 1 1 is firstly treated with a barrier layer ii 2, such as a glue layer, and the circuit layer 2 1 is disposed on the substrate 1 in the above manner. . >Cobalt hole 3: After the circuit layer 2 1 is to be disposed, a plurality of spiral recessed holes 3 1 and small recessed holes 3 1 around the spiral recessed holes 3 1 are drilled by the drill bit 3 at a suitable position of the substrate 。 (as shown in the fifth and sixth figures). Surface treatment 4: a conductive layer 4 is laminated on the circuit layer 2 1 and the spiral recess 3 1 of the substrate 1 1 by electroplating or other chemically, and the conductor layer 41 is, for example, a gold/nickel plating layer (eg, Figure 7). Solder Mask 5: A protective layer 5 1 is further laminated on the conductor layer 4 1 to prevent moisture, dust or other dirt from affecting the characteristics of the substrate 11 (as shown in the eighth). Molding 6. The substrate 11 is divided into a plurality of desired substrate monomers 1 1 3 by a die (as shown in Fig. 9). In summary, the method for fabricating the LED substrate of the present invention can effectively improve the process of using the 200936266 point to effectively simplify the process of the LED substrate, so as to reduce the effect of production and production and cost reduction, and the production is more progressive and practical. More in line with the user's premises, but the requirements of the invention patent application '爰 patent application. The present invention is only a preferred embodiment of the present invention, and is not limited to the scope of the present invention, and the patent application of the present invention should still be the equivalent change of the simplified army of the present invention. Modifications are covered by the patents of Qianyue. [Simplified description of the drawings] is a schematic flow chart of the steps of the present invention. A schematic view of the punching step of the present invention. A schematic diagram of the shadowing steps of the present invention. φ first diagram second diagram third diagram fourth diagram fifth diagram sixth diagram seventh diagram eighth diagram ninth diagram is a schematic diagram of part A of the third diagram of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 5 is an enlarged plan view of a portion of the surface of the present invention. It is a schematic diagram of the anti-welding step of the present invention. It is a schematic diagram of the molding steps of the present invention. [Main component symbol description], punching? L 1 stamping unit 1〇 substrate 11 200936266 hole position barrier layer substrate unit shadow circuit layer drilling hole drill hole concave hole small concave surface treatment conductor layer solder mask protective layer molding