200925504 九、發明說明： '【發明所屬之技術領域】 • 本發明涉及一種散熱裝置，特別是一種 極體散熱裝置。 【先前技術】 發光二極體（Light Emitting Diode，簡》 燈具因其具有節能、環保等優點正得到廣泛 ❾但疋’兩党度、南功率發光二極體發熱量大 能及時將熱量排出，發光二極體燈具會因溫 高而導致其發光效率明顯下降，甚至造成元 壞，目前，業界通常做法是在發光二極體電 下方貼設散熱器以散發其熱量，如美國專 6,517,218 B2號即揭露了一種發光二極‘ 器’其包括一基板及自該基板上延伸而出的 熱鰭片，由基板吸收發光二極體的熱量傳到 ®片’依靠散熱鰭片向周圍輻射熱量的方式 熱。為了提南其散熱效率，一般需增加散熱 量或增大散熱鰭片尺寸，但如此一來使得發 體散熱器及整個照明裝置的體積過大、過童 【發明内容】 有鑒於此’有必要提供一種以有限的體 較佳的散熱效果的發光二極體散熱裝置。 一種散熱裝置包括一散熱器，該散熱器 數自上而下堆疊排列的散熱鰭片，該等散熱 發光二 I LED) 應用， ，若不 度的升 件的損 路板的 利 US 體散熱 多數散 散熱籍 進行散 韓片數 光二極 積獲得 包括複 韓片沿 7 200925504 排列方向相互間隔，每一散熱鰭片的邊緣開設 * 數開口，該等開口上下對應形成複數氣流通道 •等氣流流道自上而下貫穿散熱鰭片。 該散熱裝置豎直地放置於發光二極體模 上方，由發光二極體模組產生的一部分熱量輻 該散熱器底部的空氣中並使得空氣迅速升溫， 氣通過氣流通道可更為順暢地向上方散發，加 熱，同時，通過氣流通道的熱空氣還可與圍成 ®通道的散熱鰭片的側壁有更多更深地接觸，可 熱鰭片的熱量快速帶走，進一步提高該散熱裝 散熱效率。 【實施方式】 請參閱圖1及圖2，為本發明實施例一中 熱裝置100，該散熱裝置100用於對作為光源 發光二極體模組（圖未示）進行散熱。該散熱 ❹100包括一散熱器10、一穿插於散熱器10中 管30及一設於該散熱器10、熱管30的底部 形導熱板40。 所述散熱器10包括複數圓片形散熱鰭片 該等散熱鰭片12自上而下堆疊排列成一圓柱 每一散熱鰭片12的圓周邊緣形成複數相互間 矩形開口 120，該等矩形開口 120沿圓周方向 排佈，該等散熱鰭片12的各開口 120自上而 互對應，使得該散熱器10的圓周外圍形成複 有複 ，該 組的 射到 埶空 —* - 速散 氣流 將散 置的 的散 的一 裝置 的执 v ”、、 的方 12， 體， 隔的 均勻 下相 數上 8 200925504 下連通的氣流通道122。每一散熱，鰭片ΐ2上設有 .衝壓形成的二通孔124及自通孔124的周圍向上延 .伸的凸緣125,相鄰散熱鳍片12藉由凸緣a自 上而下相互間隔，·續-诵a . „ ^ 』如，该一通孔124分別鄰近一開口 12〇;所述散熱.鰭片12的通孔⑵自上而下相互對 應形成二圓形通道以供熱管3〇貫穿。該散越器ι〇 不限於散熱鰭片12的組合，亦 ^ „ 亦可為其他型式的散 ο 熱器，如圖3所示的散熱器如，該散熱器他包 括一中心導熱& &及自該導熱柱表面向周圍- 體水平延伸的多數散熱鰭片12a。 所述熱管3…形’該熱管3〇包括一中間 的吸熱段32及自該吸熱段32兩端 二放熱段35 ;該吸熱段32用私也言 Τ ' 該一放熱I又35貝穿連接於各 124中，從而將該等散埶續 f ’"、 12的通孔 ❹器1〇。 ^片12串接成所述散熱 所述導熱板40由高導熱性 銅、鋁，該導熱板40的頂部 卄衣成如 槽42用於容納該熱管3〇的凹槽42,該凹 30的表面或凹槽42、通孔U4“、、攸32。可在熱管 便該熱管30與導熱板40、散埶^塗佈導熱膠，以 所述散熱鳍片1 2也可相互二·曰片12焊接結合。 組裝時’可先將散熱鳍片：=於-體。 30的放熱段35上，接著將 T焊接在熱管 & 32烊接在導熱 9 200925504 .板40的凹槽42中’然後將該散熱裝置100豎直地 放置於所述發光二極體模組的上方，並使導熱板 40的底。卩與發光二極體模組貼設。工作時，發光 極體模纟且產生大量熱量，其中一部分熱量被導熱 才反4 0收 VZ ** I L. — 並措由熱管30傳遞到散熱器10上並進 步向四周散發’另一部分熱量輻射到該散熱器 該散底教的空氣中並使得空氣迅速升溫，熱空氣從 β笋.熱1〇的底部沿著散熱器10的邊緣向上散 方五…、二氣通過氣流通道i 22時可更為順暢地向上 ^ f發力π速散熱’如箭頭7〇所示，同時，通過 1埶=道122的熱空氣還可與圍成氣流通道122的 二％片12的側壁有更多更深地接觸，一方面可 量傳=^片12的熱量快速帶走，另一方面可將熱 八66^至讀散熱器10上半部分，充分利用上半部 ❹、政二•轉片12進行散熱，進一步提高散熱效率。 為发上述實施例一中的開口 120不限於矩形，也可 3〇α、他形*狀。如圖4及圖5中所示的散熱裝置200、 、該政熱裝置200的散熱鰭片的開口 220為圓 口形，政熱裝置300中的開口 32〇為梯形，這些開 =220、32〇相較開口 12〇的面積大由這些開口 Μ、3 20構成的氣流通道222、322比實施例一中 =氣机通道122具有更大的通道面積，能夠容納通 、更夕的熱空氣’且熱空氣與氣流通道222、322 周圍的散熱鰭片的接觸面積也隨之增加，因此，具 200925504 有圓弧形開口 220和梯形開口 320的散熱裝置 • 200、3 00相比散熱裝置100具有更高的散熱效率。 ' 值得注意的是，若將開口 220、320開得太大，也 會相應地減少散熱鰭片12的面積，對散熱效率會 有一定的不利影響。 上述實施例一中的散熱鰭片12不限於圓形， 也可為方形或其他形狀。 綜上所述，本發明符合發明專利要件，爰依法 @提出專利申請。惟，以上所述者僅為本發明之較佳 實施例，舉凡熟悉本案技藝之人士，在爰依本發明 精神所作之等效修飾或變化，皆應涵蓋於以下之申 請專利範圍内。 【圖式簡單說明】 圖1係本發明實施例一的散熱裝置的立體圖， 其中一散熱鰭片與該散熱裝置分離。 © 圖2係圖1的倒置組合圖。 圖3係本發明實施例二的散熱裝置的立體組.合 圖。 圖4係本發明實施例三的散熱裝置的立體組合 圖。 圖5係本發明實施例四的散熱裝置的立體組合 圖。 【主要元件符號說明】 11 200925504 散 執 ”》、 器 10,l〇a 散 孰 裝置 100,200,300 導 執 柱 11a 散 轨 鰭片 12,12a 開 Π 120,220,320 氣 流 通道 122,222,322 通 孔 124 凸 緣 125 熱 管 30 吸 敎 ! 段. 32 放 執 段 35 導 孰 板 40 凹 槽 42 箭 頭 70 12200925504 IX. Description of the invention: '[Technical field to which the invention pertains] The present invention relates to a heat sink, and more particularly to a pole heat sink. [Prior Art] Light Emitting Diodes (Lights) are widely used because of their energy saving and environmental protection. However, the two-party and South Power LEDs emit heat in a timely manner. Light-emitting diode lamps will have a significant decrease in luminous efficiency due to high temperature, and even cause bad. At present, it is common practice in the industry to place a heat sink under the LED to dissipate heat, such as the US No. 6,517,218 B2. That is, a light-emitting diode device includes a substrate and heat fins extending from the substrate, and the heat absorbed by the substrate from the light-emitting diode is transmitted to the ® film to radiate heat to the periphery by the heat-dissipating fins. In order to improve the heat dissipation efficiency of the south, it is generally necessary to increase the heat dissipation or increase the size of the heat sink fins, but this makes the hair radiator and the entire lighting device too large and oversized. It is necessary to provide a light-emitting diode heat sink with a limited heat dissipation effect. A heat sink includes a heat sink, and the heat sink is counted from above. Under the stacking of heat-dissipating fins, these heat-dissipating two-I LEDs are applied, and if the parts of the loss-reducing parts are damaged, the US body heats up most of the heat-dissipating heat. The strips are spaced apart from each other along the direction of 7 200925504, and the edges of each of the fins are opened with a number of openings, and the openings are formed to form a plurality of airflow passages up and down. • The airflow passages penetrate the fins from top to bottom. The heat sink is vertically placed above the light emitting diode mold, and a part of the heat generated by the light emitting diode module radiates the air in the bottom of the heat sink and causes the air to rapidly heat up, and the air can smoothly flow upward through the air flow passage. The side emits and heats, and at the same time, the hot air passing through the air passage can also contact the side wall of the heat dissipation fin surrounding the channel more deeply, and the heat of the heat fin can be quickly taken away, thereby further improving the heat dissipation efficiency of the heat sink. . [Embodiment] Referring to FIG. 1 and FIG. 2, a heat device 100 for dissipating heat as a light-emitting diode module (not shown) is provided. The heat sink 100 includes a heat sink 10, a tube 30 inserted through the heat sink 10, and a bottom heat conducting plate 40 disposed on the heat sink 10 and the heat pipe 30. The heat sink 10 includes a plurality of fin-shaped fins. The fins 12 are stacked from top to bottom to form a cylinder. The circumferential edges of each of the fins 12 form a plurality of mutually rectangular openings 120. Arranged in the circumferential direction, the openings 120 of the heat dissipating fins 12 correspond to each other from above, so that the circumferential periphery of the heat sink 10 forms a complex complex, and the group of shots to the hollow-*-speed airflow will be interspersed. The scatter of a device of the VS, the square 12, the body, the uniform lower phase number of the upper airflow channel 122 under the connection of 200925504. Each heat dissipation, the fin ΐ 2 is provided with a two-way formed by stamping The hole 124 and the periphery of the through hole 124 are extended upwards. The flanges 125 are extended, and the adjacent heat dissipation fins 12 are spaced apart from each other by the flange a. ·Continuous-诵a. „ ^ 』 The through holes (2) of the heat dissipation fins 12 respectively correspond to each other to form two circular passages for the heat pipes 3 to pass through from top to bottom. The diffuser 〇 is not limited to the combination of the heat sink fins 12, and may be other types of heat sinks, such as the heat sink shown in FIG. 3, such that the heat sink includes a central heat conduction && And a plurality of heat radiating fins 12a extending horizontally from the surface of the heat conducting column to the surrounding body. The heat pipe 3 is shaped to include an intermediate heat absorbing section 32 and two heat releasing sections 35 from the end of the heat absorbing section 32. The heat absorbing section 32 is also said to be privately-supplied. The heat-dissipating section I and the 35-shell are connected to each of the 124s, thereby circumventing the fuses of the 'following' and the 12-hole through-hole device. The heat conducting plate 40 is made of high thermal conductivity copper or aluminum, and the top of the heat conducting plate 40 is woven into a groove 42 for receiving the heat pipe 3, the surface or the groove of the concave 30. 42. Through hole U4 ", 攸 32. The heat pipe 30 and the heat conducting plate 40 may be coated with a heat conductive adhesive in the heat pipe, and the heat radiating fins 12 may be welded to each other. When assembling, the fins can be first fixed: = in the body. On the exothermic section 35 of 30, the T is then soldered to the heat pipe & 32 in the recess 42 of the heat conducting plate 9 200925504. The heat sink 100 is then placed vertically in the light emitting diode module. Above and make the bottom of the heat conducting plate 40.卩 and LED module are attached. During operation, the illuminating pole body is molded and generates a large amount of heat, and a part of the heat is heat-received to receive VZ ** I L. — and is transferred to the heat sink 10 by the heat pipe 30 and progressively radiates 'other part of heat' Radiating into the air of the radiator and causing the air to heat up rapidly, the hot air is scattered from the bottom of the bamboo shoot. The bottom of the radiator 10 is along the edge of the radiator 10, and the second gas passes through the airflow passage i 22 The π-speed heat dissipation can be performed more smoothly upwards as indicated by the arrow 7〇, and at the same time, the hot air passing through the 1埶=channel 122 can also have more sidewalls of the 2% sheet 12 surrounding the airflow passage 122. Deeper contact, on the one hand, can transfer the heat of the film 12 quickly, on the other hand, the heat can be taken from the upper part of the heat sink 10 to the upper half of the heat sink 10, making full use of the upper part of the ❹, Zheng 2 • turn 12 Heat dissipation to further improve heat dissipation efficiency. The opening 120 in the first embodiment described above is not limited to a rectangular shape, and may be in the form of a ?? The heat dissipation device 200 shown in FIG. 4 and FIG. 5 and the opening 220 of the heat dissipation fin of the political heating device 200 have a round mouth shape, and the opening 32 of the heat management device 300 is trapezoidal, and these openings are 220 and 32 〇. Compared with the opening 12〇, the airflow passages 222 and 322 formed by the openings 3, 3 20 have a larger passage area than the air passage 122 in the first embodiment, and can accommodate the hot air of the passage and the eve. The contact area between the hot air and the fins around the air passages 222, 322 also increases, so that the heat sink having the arcuate opening 220 and the trapezoidal opening 320 of 200925504 • 200, 300 has more heat sink 100 than the heat sink 100 High heat dissipation efficiency. It is worth noting that if the openings 220, 320 are opened too much, the area of the fins 12 will be reduced correspondingly, which will have a certain adverse effect on the heat dissipation efficiency. The heat dissipation fins 12 in the first embodiment are not limited to a circular shape, and may be square or other shapes. In summary, the present invention complies with the requirements of the invention patent, and submits a patent application according to the law. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art of the present invention should be included in the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a heat sink according to a first embodiment of the present invention, wherein a heat sink fin is separated from the heat sink. © Figure 2 is an inverted combination of Figure 1. 3 is a perspective view of a heat dissipation device according to a second embodiment of the present invention. Fig. 4 is a perspective assembled view of a heat sink according to a third embodiment of the present invention. Fig. 5 is a perspective assembled view of a heat sink according to a fourth embodiment of the present invention. [Main component symbol description] 11 200925504 Disperse", 10, l〇a Diver device 100, 200, 300 Guide post 11a Scattering fins 12, 12a Opening 120, 220, 320 Air flow passage 122, 222, 322 Through hole 124 Flange 125 Heat pipe 30 Sucking ! Section. 32 Release section 35 Guide plate 40 Groove 42 Arrow 70 12