TW200912621A - Method and apparatus for providing a supplemental cooling to server racks - Google Patents
Method and apparatus for providing a supplemental cooling to server racks Download PDFInfo
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- TW200912621A TW200912621A TW097129957A TW97129957A TW200912621A TW 200912621 A TW200912621 A TW 200912621A TW 097129957 A TW097129957 A TW 097129957A TW 97129957 A TW97129957 A TW 97129957A TW 200912621 A TW200912621 A TW 200912621A
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- cooling
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- electronic device
- heat
- cooling assembly
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20736—Forced ventilation of a gaseous coolant within cabinets for removing heat from server blades
Description
200912621 六、發明說明: 【相關申請案】 本申請案主張本發明人所擁有,2007年8月7日申請 之發明名稱為 “Method and Apparatus for Providing Supplemental Cooling to Server Racks”的美國臨時專利申請 案序號60/964,025案的優先權。本申請案以引用的方式將 美國臨時專利申請案序號60/964,025案之完整内容納入本 文中。 【發明所屬之技術領域】 本發明大體上關於一種用於冷卻一發熱裝置的方法及 設備’特定言之係關於一種利用導管工件及流體基冷卻系 統冷卻伺服器應用機具的方法及設備。 【先前技術】 以高散熱率進行高效能積體電路之冷卻係電子設備冷 卻領域中之顯著挑戰。習知利用熱管及裝有風扇之熱壑 (heat sinks)進行之冷卻不足以冷卻瓦數要求日益提高的 晶片、包括超過100W者。 電子設備伺服器譬如刀鋒伺服器和機架伺服器因為一 個伺服器中每單位容積所能達到之較高處理器效能而使用 數量日益增加。但是’積體電路之高密度亦造成高熱密度, 其超過習知氣冷方法之能力。 …要冷卻電子織伺服器上之積體電路會有之一特殊問 題疋夕個電子a又備伺服器通常以緊密四等分方式安裝在— 伺服器機座内。在此等組態中,電子設備飼服器被有限的 200912621 空間量分隔丄從而減小可在内部提供-充分冷卻方案的尺 寸1又而σ電子设備伺服器之堆疊並不提供讓用於每 -電子5又備伺服n之大型風扇及触安裝的選擇。通常電 子·»又備機π又内之每-伺服器係由一專用内部風扇冷卻。就 刀鋒舰H制來說,刀鋒恤器群係由專屬於每 一刀鋒 偏艮器群之-或多個内部風扇冷卻。利用此等組態,每一 電子设備词服器上之積體電路利用風扇將空氣吹過電子設 備伺服器上之積體電路的方式冷卻。但是,考慮到祠服器 機架内之内部風扇的限制,可供冷卻積體電路的空氣量有 限。 辅助冷卻作用係由在電子設備飼服器外的電腦室空調 (CRAC)單提供。冷卻過的^氣贱驗過電子設備飼 服器,從機座之一側進入且從一反向側離開。隨著資料中 心持續增加其電腦密度,電子設備錬器更為頻繁地部 署。徹底裝滿的電子設備伺服器大幅提高機架熱產量。這 品,CRAC單;可提供之冷卻能力以外㈤辅助冷卻。輔助 冷卻系統可包含被定位在電子設備伺服財端外側用以降 低離開電子設侧服器之空氣溫度的風扇、泵、及熱交換 器j此等輔助冷卻系統中之熱交換器得到泵送冷卻劑、水 或製冷劑供應。有些輔助冷卻系統係構形為—附接於電子 設備機殼背面的、、冷卻門〃。但是對於一些電子設備機殼來 °兒,通常會在整個電子設備機殼當中遍佈不均勻熱負載, 這常會導致電子設備機殼内有某些區域冷卻不足,即便使 用了習知輔助冷卻系統亦如此。 200912621 【發明内容】 本發明之冷卻系統係針對一種用於伺服器機架或其他 電子設備機殼的可再構形導管工件總成。在一些實施例 中,該電子設備機殼之一前門、一後門、或是該前門和後 門一者被構开》為包含一或多個熱交換器之冷卻門。在其他 實施例中’該電子設備機殼之前門及/或後門被換成能夠出 入該電子設備機殼之内部的複數個可動區段。每一區段包 含一或多個熱交換器。 複數個發熱裝置譬如電子設備伺服器被定位在該電子 設備機殼内。該等熱交換器經由該導管工件耦接於該等電 子設備伺服器。該導管工件被定位在一介於該等電子設備 機设之責面與該等熱交換器之間的氣室内。在大多數應用 中,電子設備機殼内之熱負載並未均勻分布。一般而言, 電子設備機殼内之每一電子設備伺服器或相鄰電子設備伺 服器之群會產生不同於其他電子設備伺服器或相鄰電子設 備伺服器之群的熱負載。因此,電子設備機殼内之單位容 積熱負載並非恆定。電子設備機殼之内部概念上來說被劃 分成多個熱區。在一些實施例中,每一熱區具有相同熱輪 出,且導管工件係用來將等量受熱空氣導往每一熱交換 器,或者在單一熱交換器之案例中導管工件係用來使受熱 空氣均勻地分布於整個熱交換器。在一些實施例中,從單 一熱區輸出的受熱空氣被導管工件導往一對應單一熱交換 器。在其他貫施例中,從一群相鄰熱區輸出的受熱空氣在 單一導管工件導件内合併,該導件將合併的受熱空氣導往 200912621 對應數量之相鄰熱交換器。 包含一或多個熱交換器的該後門經構形用以提供通往 該電子設備機殼内之電纜和設備的出入口。此出入口可藉 由使該門如同普通的門在鉸鏈上旋轉打開的方式提供。在 有多個熱交換n的案财,該n可被構料乡個區段,每 個熱交換器一個區段,且每一區段包含鉸鏈以便獨立於其 他區段打開。此種組態減輕對於電子設備機殼内之其他電 子設備伺服器的冷卻中斷。在一些實施例中,每一區段如 同普通的Η旋轉打開。在其他實施例中,每—區段被構形 為待從電子設備機殼脫離並讓路,在此案例中每一熱交換 器係利用可被彎開讓路的可撓管件或是快拆件連接。在其 他實施例中,整個後門或是該後門之每一區段可被構形為 如同抽屜滑動打開和關閉。 在一些實施例中,各導管導件經構形具備一可變形末 端’该可變形末端經獅用以在從—或多個電子設備飼服 益後方伸出之電連接線附近局域變形。該可變形末端可由 刷毛製成(如同刷子中)或是包含狹縫及/或孔洞的發泡材 製成。 本發明之其他特徵和優點將在檢閱過下文提出之實施 例詳細說明之後變得明顯。 【實施方式】 _今將詳細參照本發明之冷卻系統的實施例,其實例已 例示於隨附圖式中。儘管將搭配下述實施例說明本發明, 應理解到不希望將本發明舰於這些實施例和實例。相反 200912621 地,本發明意欲涵蓋替代、修改及等效方案,這些可被包 含在如附屬申請專利範圍項所界定之發明精神和範圍内。 此外,在以下本發明詳細說财,將提出許多明確細節以 便更徹底地例示本發明。然㉟習習知技藝者會理解到本發 明可以不用這些明確細節就實施。在其他情況中,廣為人 知的方法和步驟、組件及程序未料細敘述以便不致不必 要地掩蓋本發明之觀點。 本發明之實補係針對-種冷卻线,翔於轉移一 電子設備機殼或舰器機架(在本說明書中統稱為電子設 備機殼)内之一或多個電子設備伺服器產生的熱。本文所 述=卻系統可應用於安裝在一底板(backplane ‘)、的任何電 T设備子系統,其非侷限性包含刀鋒伺服器和機架伺服 态,在本說明書中統稱為電子設備伺服器。電子設備機殼 ,構形用以容納多個電子設備舰器。每—電子設備飼服 器如眾所周知包含一或多個發熱裝置。 ^冷卻系統利用被包含為電子設備伺服器之一部分的内 巧扇所產生的氣流。電子設備機殼之畴概級地劃分 =個熱區。在—些實施例中,每―熱區内之熱負载係相 义的。因為電子設備機殼内之每一電子設備飼服器的獨特 2熱特性’該等熱區可能是或不是等容積。舉例來說,一 具有第-容積的第一熱區可能容積大於一具有第二容積的 f二熱區。一導管工件總成耦接於電子設備伺服器之—空 出側。導管導件被定位在電子設備飼服器之背面與熱 又換盗之間的氣室内。該導管工件總成包含複數個經定位 200912621 子設備飼服器輸出之氣流選擇性地導往-或多個 '、、、又換㈣導管導件。在—些實施财 ,流被該等導管導件導往單—熱交換器。在的 中,從多個相鄰熱d(譬如Ν個熱區)氣^例 =料叫岐-料㈣舰量之相 Γ 固H、)。在更其财施射,熱二 r的數量之間並非-對—的關係。整體而言, 娜德性地劃分成M個熱區,且冷卻面板包= Ί 。該轉管導件經整地定仙將 多個魅選擇性地導往-或多倾交換ϋ。在二 件經將空氣導往-或多個熱交i 卩’本貝上來說將該等熱交換器分段並且將 4_同熱交換器之不同區段。 k 整體”,該導k件總賴受触氣 t之概念熱區導往熱交換器。相反㈣具有—不 A,^之文熱空氣均勻地導往〆或多個熱交換器的方 導管ΐ件總成藉由使從較高熱1載區域輸出之受埶 =住熱交換e之較大相賴面區域的方式對於較^ 卻卻作用。換句話說,熱交換器:; b力更針在时冷卻電子設韻糾之韻區域。 第i _示—辆接於本發明—實施例之—導管工件細 人的電子设備機殼10之側剖面圖。電子設備機殼、 個發熱裝置(圖中未示)譬如電子設備伺服器^ °又機设10經構形用以讓空氣能從-第-侧Μ流往〜 200912621 °第—側14和第二側12經構形具備通風口以讓 工亂能夠流動。該等通風口可為格柵、網子、錯直板片、
t平板片、及電子設備機殼側面用以允許空動的任何 ,、他類型開口。此等開σ可係指—側面板結構内之多個開 口,或者開口可為—由電子設備機殼ω之側面板、頂面板 和底面板之末端框出的開放空間。整體而言,、、通風口,,一 辭係才曰側面板中之—或多個開口,或者在沒有側面板結 構的情況中係指-開放空間。空氣從電子賴機殼1〇之第 一,14流往第二側12。通過電子設備機殼10的氣流係由 定位在電子補機殼1Q内及/或每—電子設備伺服器或 電子設備伺服器群内的内部移氣系统(圖中未示)例如内 部風扇產生。空氣透過第―側14吸人電子設備機殼10内。 空氣流經電子賴驗1Q内之發練置,從而使空氣加 熱。又熱空氣流出電子設備機殼1〇之第二側12進入導管 工件總成30内。 導管工件總成30之第一端耦接於電子設備機殼1〇之 第一侧12,且導管工件總成3〇之第二端_接於一冷卻面板 20。冷卻面板20包含一或多個熱交換器。在第丨圖之範例 組態中有N個熱交換器,標示為熱交換器丨、熱交換器 2、...、熱交換器N。在一些實施例中,冷卻面板2〇是一 冷卻門。 第3圖例示第1圖之冷卻面板2〇的正視圖。第3圖之 冷卻面板20包含N個熱交換器1、2、...、N。每一熱交換 器1、2、…、N有一冷卻劑流過。隨著受熱空氣流過冷卻 200912621 面板20中之熱交換器丨、2、…、N ’熱從空氣轉移到流過 熱父換器1、2、…、N之冷卻劑,從而使離開冷卻面板2〇 的空氣冷卻。在一些實施例中,冷卻面板2〇耦接於一向冷 卻面板20供應冷卻劑且從冷卻面板2〇收回受熱冷卻劑的 外接冷卻系統(圖中未示)。該外接冷卻系統可包含一冷卻 塔、冷凍機、或是包含一用來冷卻離開冷卻面板2〇之冷卻 d之熱交換器的其他次級冷卻迴圈。使用水、製冷劑、或 任何其他冷卻劑。在一些實施例中,該冷卻劑是二相冷卻 劑。在其他實施例中,該冷卻劑是單相冷卻劑。
在一些實施例中,該等熱交換器係用一具備附接空氣 鰭片的微型管構造或是一種管_鰭片型設計製造。在其他實 施例中„亥等熱父換器是利用氣流轉移熱的任何習知執交 換器。冷卻面板20可包含單—熱交難或是—群並顺串 歹^附接之熱交換ϋ。獨立式熱交換器建造起來較好管理且 提供較好騎體分布控制。熱交換^卜2、..·、Ν在第! :::3,中被不為一者堆疊在另一者頂上的面板。應理 1態僅為範例,每―熱交換器可被構形為第3圖所 :面板組態以外的不同形狀,且可被定位為第1圖和第3 圖所示堆疊型樣以外的不同型樣。 書圖,議_lG之_概念性地 出〇 …電子設備機殼10整體產生—總熱負载輸 備A 為儲存在電子設備機殼10内之每一個別電子設 備词服器的獨特組態和使用爲 的熱負載電子設備機殼10内部 J在些實施例中,每一熱交換器1、 11 200912621 2、…、N組構形用以冷卻—相同熱負載。在此例中,每一 熱交換器冷卻從電子設備機殼10輸出之總熱負載Q之應 的分數等量。為促成此表現,經由從電子設備機殼1〇第二 側I2輸出之文熱空氣將等量熱負載導往熱交換器卜2、...、 N每-者。為了使從第二側12輸出之總熱負載Q分成欲導 往每-熱交㈣1、2、...、N _量,電子設備機殼1〇之 内部被聽性地劃分成多她區,其中每—熱區界定電子 設備機殼H)内之-指定容積。在此_巾,每—熱區經概 念性劃分為具有-等量熱負載。因此,從—熱區輸出的受 熱空氣會具有與從另-熱區輸出的受熱空氣相同之熱負 載,然每-熱區之容積可能不同。來自每-熱區的受孰空 氣經由導管工件總成3。内之導管導件導往熱交換器卜 2、…、N之對應一者。 由於熱區之大小並不一致,導管導件在導管工件總成 30内的位置亦不-致,目絲—導管導件驗置係依據對 應熱區及欲將受熱域導往之熱交換器的大小和位置個別 地決定。在第1圖之範.態中,熱區〗的容積大於熱區2 和熱㈣二者’且熱區N的容積大於熱區2。目此,熱區 2内之單位容積熱負載A於熱區丨和_ n内之單位容積 熱負載,且熱區N内之單位容積熱_大於熱區丨内之單 位容積熱負載。 導言導件;32 !玉疋位用以將從熱區1輪 轨 ^交換81。導料件32雜導料件3卜起用來^ 熱區2輸出之受熱㉗導往熱交換器2,因為祕2鄰近於 12 200912621 熱區卜相似地,導管導件34與另一導管導件(圖中未示) 一起用來將來自一熱區3 (圖中未示)之空氣導往一熱交換 器3 (圖中未示),因為熱區3鄰近於熱區2。導管導件38 經定位用以將從熱區N輪出的受熱空氣導往熱交換器N。 在一些實施例中,導管導件32、34、38每一者是橫跨導管 總成30之二側面板間之距離且橫跨電子設備機殼1〇與冷 卻面板20間之距離的大致平坦元件。另一選擇,該等導管 導件可為彎曲的。在一些實施例中,該等導管導件每一者 k跨冷卻面板20與電子設備機殼1〇内之電子設備伺服器 之後部間之距離。 在-些實施例中,每-熱交換器i、2、...、N經構形 用以冷卻相同熱負載Q/N。如果電子設備機殼10内之熱負 載係均勻分布,每一概念熱區1、2、…、n會是相同大小, 母一者之橫截面的面積會與每一熱交換器i、2、...、N之 橫截面的面積相同。在此均勻分布組態中,每一熱區被稱 為一基線熱區。相較於第1圖所示熱區,熱區丨大於基線 熱區。與大於基線熱區之一熱區譬如熱區1有關的導管工 件將從較大熱區輸出之受熱空氣送往熱交換器處之一相對 較小截面區域。在此例中,受熱空氣之氣流率隨著其朝熱 父換器移動而加大。相較之下,熱區2和熱區n每一者皆 小於基線熱區。與小於基線熱區之一熱區譬如熱區2和N 有關的導管工件將從較小熱區輸出之受熱空氣導往熱交換 器處之一相對較大截面區域。在此例中,受熱空氣之氣流 率隨著其朝熱交換器移動而減小。 13 200912621 額外的導管工件元件譬如導管導件、管道、及/或擋風 板可被加到導管導件總成内。此等額外導管工件元件舉例 來忒可用於調節氣流及使氣流均勻通過一或多個對應熱交 換器。舉例來說,擋風板39被定位在導管導件32和34之 間以降低從熱區2流往熱交換器2之氣流的速率。在一些 實施例中,擋風板被構形為一實心無孔結構,空氣完全被 擋住且被迫沿著擋風板結構流動。在其他實施例中,擋風 板被構形為-乡孔結構,其讓部分空氣通過擔風板結構。 該擋風板結構之多孔本質提供某_度流阻擋效果, 從而提供沒有擋風板時無法提供的氣流調節能力。在更其 他實施例巾’觀板可在無孔與各種多孔度之_整。該 可调式觀板結構經調整以允許不同程度的氣流通過該結 構概必上來說與可g周式百葉窗簾如何經調整以允許不同 程度的光線通過類似。 作為可用之額外導管工件元件的另—實例,導管導件 36和37被添加至導管導件%與導管工件總成%之底面板 之間以更進-步增進細熱交換器N之氣流的準直度。額 外的導管導件36和37亦可用來使可能存在之再循環區減 小甚至消5耳。 ,在-些實施例中,從多個相鄰熱區輸出之受熱空氣可 被併入一制導管卫件内並導往-群相鄰熱交換ϋ。第2A 圖例不輕接於依據本發明另—實施例之—較卫件總成5〇 的電子β又備棧设10的側剖面圖。第2Α圖之組態與第】圖 相似’差別在於第2Α ®中電子設備機殼1()内之熱負载分 14 200912621 熱空乳合併送往多個相鄰熱交換器σ 4輸出之受 態中,每—埶p # k 、 和4。在此範例組 管,譬如咖犧之受熱空立地接上導 交換器N。懈料料件、料56導往熱 接管路徑内。儘管第2入圖-山^及或叔風板可用在每一 K并人# 從三個相鄰魅輸出之受執 二1 入一共同導管工件内,應理解到可使來自多於C 於二個相鄰熱區之受熱空氣併入—共同導管工件内。… 換式斗f 4電子a又備機殼内之電子設備伺服器會定期更 作而導致電子設備機殼内之熱負載分佈改變。 ^ 了、又換裔和導管工件總成剛開始可經構形以匹配一對 j電子设備飼服器初始組態之特定熱負載分佈,一旦電 Ο 子设備伺服H中任-者被改變’熱負載分佈微變,且滿 足此新熱負載分佈的最佳氣流特性也會改變。由於導管導 ,的位置係可變,導管工件總成整體可適應於電子設備機 成内之變化熱條件。整體而言,如果電子設備機殼内之熱 負載條件改變’例如一或多個電子設備伺服器被換成不同 熱負載分佈的其他電子設備伺服器,熱區可能被重新界 疋’且導管導件依據新界定的熱區在導管工件總成内重新 定位。 第1圖和第2A圖之冷卻系統係針對將電子設備機殼内 。^概心性地劃分為具有相等熱負載之多個熱區的方面敘 15 200912621 述’且用於建立來自熱區之受熱空氣以導管輸送至對應熱 交換,之_ 1:1或刪關係。另—選擇涵蓋在熱區數量 與熱父換器數量之間不具備_對—關係。如前所述,電子 設備機殼内部被概念性賴分她區,且冷卻面板包 含N個熱父換ϋ。在—些案例中,導管導件經定位用以將 ^氣導往-或多個熱交換H之局部,本質上來說將熱交換 器分段並且將不㈤氣流導往相㈤熱交換器之不同區段。 第2Β圖例示經構形同於第2A 之電子設備機殼1〇, 差別在於第2A圖之導管導件54被重新定位成第2B圖中 之導管導件54,致使空氣被導往熱交換器4之一部分。 在一些實施例中,導管導件係由一可變形材料製成, 譬如包含孔洞及/或狹缝的發泡材或海綿,或是包含剛硬刷 毛用以允許電連接線譬如電纜或電線通過導管導件材料的 刷子。在其他實施例中,導管導件係由包含一剛性部分和 一可變形材料之材料組合製成,譬如一在一端附有刷毛以 允許電纜通過的金屬或塑膠薄片。導管導件被構形為可移 除且其位置可調整以適應電子設備機殼内之熱負載分佈譬 如因一或多個電子設備伺服器換成具有不同發熱特性之電 子設備伺服器而造成的改變。在一些實施例中,冷卻面板、 電子δ又備機殼之背端及/或其間之氣室經構形具備用於將導 管導件固持在定位的機械構件。此等機械構件的實例包含 槽孔、凸緣及螺釘。在其他實施例中,導管導件本身配備 配合於電子設備機殼上之對應特徵部的支撐用機械構件。 導管導件可被定位在導管工作總成内提供或可接納用於將 16 200912621 導官導件支撐在定位之機械器件的任一處。可供導管導件 使用的位置僅受所提供之支撐用機械構件的數量和種類限 制。 在一些實施例中,導管導件之可變形本質提供將導管 導件固持在定位的機械手段。舉例來說,導管導件係由可 1縮的發泡材製成,其在未壓驗態下例如是26英时寬。 要將導管導件裝入例如24射寬之電子設備機殼内時,發 泡材經壓縮且在健縮的_放人電子設備機殼内就定 位’然後解除壓縮。發泡材膨脹回其原始樣式的作用提供 ,住電子設備機殼之壓力,從而將發泡材導管導件固持在 定,。此種可變形導管導件可被放在導管卫件總 一處。 導官導件之可變形觀點的另—優點是容納所有連接 =設·服器背面之電連接線。可變形導管導件或J g導件之覽形部賴紐接、魏_ 仍保有導引氣流之能力。在一範例組態中^ =時 剛硬刷毛萝成。筮闰办丨-a , 等s導件係由 «邮成。4 10圖例不一包括刷毛 件。可利用任選的裝訂條或束帶62將刷 杨士官導 毛遇到電子設備舰器背端之電連接線的地方^在刷 電連接線變形。另一選擇,電連接線可 菩J毛沿者 導管導件上縣《冷卻面板林喊通過垂在 例不一包括耦接於剛性結構7〇之刷毛 》弟11圖 件,其中刷毛72構成導管導件之絕大部分。的執例導管導 一包括耦接於剛性結構80之刷毛 二第丨2圖例示 的粍例導管導件,其 17 200912621 中刷毛82構成導管導件 圖和第12圖所示不=應理解到可採用與第11 實伽Φ二Γ 對’結構其他比例。在一此 ϊ=1他Γ定位致使刷毛端面向電子設備飼服 ,導管導件較位致使刷毛端面向冷 ;:=r’電連接線垂在導管―
^另-範例組態中,導f導件係由具備狹縫、孔洞或 =與孔洞之組合的發泡材製成。電連接線在切入發泡材 2端的狹缝或孔洞内滑動。第1第3圖例示-包括具有 ^縫92之發泡材9_例導⑽件。狹縫92貫穿發泡材 之王厚且從-端91沿著發泡材9()之—部分長度延伸。 =圖例示-包括具有狹縫之發泡材94的範例導管導 件每-狹縫之末端均有一孔洞96。孔洞96貫穿發泡材 94、,全厚。在-替代組態中,發泡材型導管導件包含孔洞 ^又有狹縫。如闕毛型導管導件,發泡材型導管導件可 ‘疋位致使有狹縫之末端被定位為面向電子設備伺服器或 冷卻面板。 就第一側12 (第1圖)與熱交換器間之距離係相對較 短、例如小於或等於12英吋的實施來說,可用單一導管導 件横跨整個間隙。該導管導件可被附接在熱交換器侧面、 例如在冷卻面板20 (第1圖)上,且當冷卻面板關上時, 電線或電纜不管是存在於電子伺服器側面、譬如第二側(第 1圖)哪一處’電線和電缆會局域地礙到可變形材料,可變 形材料會彎曲配合。未被電線和電纜妨礙的剩餘可變形材 18 200912621 料保持在定位。 就第二側12與熱交換器間之距離係相對較長、例如大 於12英吋的實施來說,可利用二個獨立導管導件橫跨整個 間隙。第-導官導件係剛性且附接在熱交換器侧面譬如冷 卻面板20上。第二導管導件係可變形或是剛性與可變形之 組合,且附接在電子設備機殼侧面上。可變形第二導管導 件或是第二導管導件之可變形部分繞著電連接線變形。當 冷卻面板關上時,第-和第二導㈣件之末端緊貼或猶二 重疊,藉此概念性地形成一橫跨電子設備伺服器與熱交換 器間之距離的大致單一導管導件。第一和第二導管'導件均 可如前所述重新定位。 第1圖和第2圖顯示冷卻面板20、40和電子設備機殼1〇 f冷卻面板中之熱交換器數量與電子設備機殼中之熱區數 量之間成1:1關係。應理解到冷卻面板和電子設備機殼可被 構形為有其他隱。整體而言,敝換錄量與熱區數量 之間的比例是1 :n。 每一熱交換器在上文被敘述為經構形用以冷卻等量熱 負載,且每一熱區被概念性地定義為會產生等量熱負載。 在替代組態中,每一熱交換器可經構形用以冷卻與其他熱 父換器相較係不相干之熱負載量,且熱區可為依據不等熱 負载界定。每一熱交換器可因熱交換元件之大小及/或密度 而異。導管工件總成係可重新構形以調整導管導件之位置 和數量藉以依據按照電子設備機殼内之熱負載分佈及每一 熱父換器之組態決定的任何期望組態和規格改變氣流。 200912621 儘管電子設備機殼、導管工件總成、及具備熱交換器 之冷卻面板在上文被敘述為獨立組件,應理解到導管工: 總成可被整合為軒設備餘之—縣及/或冷卻面二之— 部分。又,賴形减姐有導红件顧的冷卻面板可 被整合為電子設職殼之後面板的—部分。在沒有導管工 件總成的案例_,電子設備機殼被構形為具備一後氣=, 導管導件可安置在該後氣室内。 〃至’ 在習知電子設備機殼中,後面板被構形為一門以提供 能夠通往内部電子設備舰㈣出人口。但#後面板或門 被構形為具備祕射卜接流體供應管_熱交換器時,且 在-些案财包含如前所述之細的導紅件總成,會採 用替代手段接近電子設備機殼之内部。 第4圖例示-具備處於關位置之第—實施例出入機 構之電子設備機殼的等角透視圖。電子設備機殼11〇包含 :含有-或多個熱交換器的後面板12G。該—或多個熱交換 器辆接於祕冷卻流體之以和㈣ 刚。在-些實施例中,電子設備機殼_含上 1-3圖所述之類型的氣室和導管工件。在其他實施例中,電 子设備機殼110可在電子設備祠服器16〇之背面(第5圖) 與後面板12G之間包含或不包含—氣室及/或導管工件。 ^第5A圖例示一具備處於開啟位置之出入機構之電子 设備機殼110的等角透視圖。滑軌ls〇祕於後面板12〇 麵接於電子設備機殼11〇之後端。滑執15〇讓後面板12〇 月b夠相對於電子設備機殼11〇來回滑移,與播案植之抽屜 20 200912621
類似。如第4圖所示,後面板120滑到關閉位置。如第5A 圖所示,後面板12G滑到開啟位置。可撓流體管線140讓 後面板120能夠在開啟位置與關閉位置之間移動同時保有 :、後面板120之流體連接。後面板12()來回滑移並不會在 流體管線上提供-扭轉屈曲作用,單純是—f曲運動。在 處=開啟位置之時’電子設備飼服器議之背面所包含的 導管工件(圖中未示)如果顯現則可被移除,且提供通往 電子设備飼服器16〇或是電子設備機殼⑽内所含其他組 件的出入口。 〃 、 第4圖和第μ圖顯示整個後面板來回滑移。另一選 擇,後面板和熱交換器可被構形為獨立部件且每一部件被 構形為具備·,如同檔鎌中之個別抽屜。在此組態中, 每-後面板部件配備可撓流體管線。在一些實施例中,後 面板部件㈣聯地流縣合,故—可撓流體管線將一後面 ,部件输到下-個後面板部件且依此類推,由最頂端和 最底端的後面板部件麵接於輪入和輸出可撓流體管線,如 第4圖和第5A圖之可撓流體管線14〇。在其他實施例中, 每-後面板部件配備自有的輸人和輸出可撓流體管線組。 將後面板A 有-優點為只會中斷電子設備飼服器之一部 刀的冷卻’恰與打開整個後面板並_斷所有電子設備飼服 器之冷卻的情況相反。此外,不需要—後門冷卻門總成中 所使用提供熱父換H與外接流體管線間之碰連接的 接頭。 雖然以上係就電子設備機殼之後面板敘述電子設備機 21 200912621 殼及具備熱錢n之滑移 應用在電子設備機殼之前面板世’/月移式抽履的概念亦可 第4圖和第5A圖之滑 致使後面板往經更進一步改造 故μ 额外方便度。第犯圖例示-罝備
C ^版之第5Β圖滑移式出入機構的電子H j 角透視圖。第5B圖之滑移 ^又的荨 滑銘式屮入舰…式出機構作用同於第5A圖之 、冓’但其額外有—經獅用 往兩侧滑移的第二滑移總成152。特定言之: 接於母-滑移總成⑸。—頂部滑移總成 «152^, 154^ 後面板120能夠相對於_總成15〇之運動大致正交地移 動。滑移總成152經構形用以獨立於滑移總成15〇移動。 因此,後面板120,可在滑移總成15〇處於關閉位置或開啟 位置之任何程度(亦即從一猶微開啟位置到一最大開啟位 置)之時被移動。第5B圖顯示後面板12〇,往左滑移。另一 選擇後面板120和滑移總成152可被構形為使後面板12〇, 往右滑移,或者可經改造使後面板120,可往左和往右滑移。 第6圖例示一具備第二實施例出入機構之電子設備機 殼的等角透視圖。電子設備機殼210之後面板被換成複數 個熱交換器222、224、226及導管工件232、234、236。三 組熱交換器和導管工件的内容僅為範例,可使用多於或少 於三組的熱交換器和導管工件。熱交換器222、224、226 22 200912621 母一者耦接於用於冷卻流體之輸入和輪出的流體管線 240。該等流體管線可為可撓的或硬接管的 (hard-plumbed)。從電子設備機殼210之背面輸出的空氣 分別經由導管工件232、234、236導往熱交換器222、224、 226每一者。熱交換器222、224、226各自被定位成大致水 平,且導管工件232、234、236將離開電子設備機殼21〇 之月面的大致水平载(流重新導向成一指向熱交換器222、 224、226之大致向上錯直氣流。如第6圖所示,導管工件 232、234、236每一者具有一孤形表面及二個侧面以使水平 氣流轉變成向上鉛直氣流。亦可採用其他導管工件組態以 完成此氣流方向變化。 導管工件232、234、236每一者可拆地麵接於電子設 備機殼210及對應熱交換器222、224、226。因此,導管工 件232、234、236每一者可被單獨移除以提供通往電子設 備機殼210内部的出入口。此種組態之一優點為不用移動 熱交換器以提供通往電子設備機殼内部之出入口。因此, 流體路徑可為硬接管的。此外,不需要一後門冷卻門總成 中所使用提供熱交換器與外接流體管線間之流體連接的旋 轉接頭。 在一些實施例中,電子設備機殼210亦包含上文參照 第1-3圖所述之類型的氣室和額外導管工件。儘管係就取代 電子设備機殼21〇之後面板的方面敘述熱交換器222、224、 226及導管工件232、234、236 ’類似的熱交換器和導管工 件亦可用於取代電子設備機殼之前面板。 23 200912621 在第6圖中,熱交換器及導管工件經構形用以將空氣 引導向上。在一替代組態中,熱交換器及導管工件經構形 用以將空氣引導向下。帛7圖例示-具備第三實施例出入 機構之電子設備機殼的等角透視圖。第7圖之出入機構經 構形與第6圖之出入機構類似,,差別在於熱交換器及導管 工件經構形用以將空氣引導向下。特定言之,熱交換器 322、324、326取代第6圖之熱交換器222、224、226,且 導管工件332、334、336取代第6圖之導管工件232、234、 236。熱交換器322、324、326每一者耦接於用於冷卻流體 之輸入和輸出的流體管線34〇。流體管線34〇可為可撓的或 更接9的。從電子设備機殼31〇之背面輸出的空氣分別經 由導ΐ工件332、334、3%導往熱交換器322、324、326 每一者。熱交換器322、324、326各自被定位成大致水平, 且導管工件332、334、336將離開電子設備機殼21〇之背 面的大致水平氣流重新導向成一指向熱交換器322、创、 326之大致向下鉛直氣流。如第7圖所示,導管工件%2、 334、336每-者具有-弧形表面及二個側面以使水平氣流 轉變成向下絲氣流。村制其他導紅雜態以完成 此氣流方向變化。 導管工件332、334、336每-者可拆地謝妾於電子設 備機殼310及對應熱交換器322、324、326。因此,導管工 件332、334、336每-者可被單獨移除以提供通往電子設 備機殼310内部的出入口。為在導管工件332、334、 被移除時保護熱交換器322、324、326,使用—具有穿孔圖 24 200912621 案的防護蓋。該穿孔圖案讓空氣能夠通過該蓋,但提供防 止與熱交換器表面實體接觸的保護作用。穿孔保護蓋之實 例非侷限性包含鐵絲網、經穿孔之金屬薄片、金屬棒之平 行圖案、及金屬棒之交叉影線圖案。 第9圖例示一具備第四實施例出入機構之電子設備機 殼的等角透視圖。電子設備機殼510之後面板被換成複數 個熱交換器522、似、526,每-者鉸接於電子設備機殼 51〇之背端。三個熱交換器的内容僅為範例,可使用多於或 少於三個熱交換器。熱交換器522、524、526每一者轉接 於用於冷卻流體之輸入和輸出的流體管線540。該等流體管 線可為可撓的或硬接管的。從電子設備機殼510之背面輸 出的空氣被導往熱交換器522、524、526每一者。熱交換 器522 524、526母一者被構形為向上旋轉。換句話說, 熱交換器522、524、526之頂端耦接於電子設備機殼51〇 致使每一熱交換器522、524、520之底端可往上擺動打開 及在下擺動關閉。熱交換器522、524、526每一者利用一 或多個旋轉接頭耦接於電子設備機殼510,該旋轉接頭在熱 父換器522、524、526處於上或下位置之時維持熱交換器 522'524、526與流體管線540間之流體連接。如第9圖所 示,母一熱交換器處於上位置。儘管全部三個熱交換器 522、524、526被示為處於上位置’應理解到熱交換器522、 524、526每一者可被獨立地打開和關閉。當處於上位置時, 會提供通往電子設備機殼510内部的出入口。熱交換器 522、524、526經構形用以旋轉〇至90度,在一些案例中 25 200912621 會超過90度。旋轉小於9q度會提供雜電顿備機殼内 部之内部Hi人π,但無法進行電子設備舰器之安裝及/或 移除。旋轉9〇度或更外允許進行電子設備伺服器之安裝 及/或移除。 在些實施例中,電子設備機殼51〇亦包含上文參照 第1-3圖親之_峨室和餐導管功。儘管係就取代 電子設備機殼510之後面板的方面敘述熱交換器522、52心 526,類似的熱交換ϋ亦可用於取代電子設備機殼之前面 板。 在第9圖中,熱交換器經構形讓底端上下旋轉。在一 替代組態中,熱交換器經構形用以向下旋轉。換句話說, 每一熱交換器之底端耦接於電子設備機殼致使每一熱交換 器之頂端可往下擺動打開及往上擺動關閉。可將防護蓋附 加於熱交換器每一者。 可將輔助冷卻作用添加至電子設備機殼而不修改後或 前出入面板,從而維持通往電子設備機殼内部之傳統出入 口。在此例中,將一輔助冷卻總成添加至電子設備機殼之 頂部’且從每一電子設備伺服器之後部輸出的空氣被導往 該輔助冷卻總成然後從電子設備機殼輸出。 第8圖例示一耦接於電子設備機殼之輔助冷卻總成的 側剖面圖。複數個發熱裝置譬如電子設備伺服器42〇儲放 在電子設備機殼410内。電子設備機殼41〇經構形用以讓 空氣從一第一側414流往一第二側412。第一側414經構形 具備通風口以讓空氣流入電子設備機殼41〇内。第二側412 26 200912621 被構形為實心面板以阻擋氣流。在一些實施例中,第二側 412係一實心門。通過電子設備機殼41〇的氣流係由被定位 在電子設備機殼410内之一或多個内部移氣系統(圖中未 示)、例如被包含為每一電子設備伺服器420之一部分的— 或多個内部風扇產生。 在每一電子設備伺服器420之後端與第二側412之間 有一後氣室430。後氣室430係由電子設備機殼410之一背 面部分形成,或者後氣室43◦及第二側412係當作一增設 部添加至一既有電子設備機殼。受熱空氣流出每一電子設 備伺服器420之後部進入後氣室430内。第二側412防止 受熱空氣離開電子設備機殼41〇,且因此受熱空氣上升到一 頂部氣室460。頂部氣室耦接於電子設備機殼41〇之一頂部 表面。頂部氣室460係由一頂面板及四個側面板形成。該 等面板當中至少一者是通風的。每一通風面板耦接有一或 夕個熱父換器。如第8圖所示,頂面板是通風的且包含至 少一熱交換器450, 一前面板是通風的且包含至少一熱交換 器454,且一後面板是通風的且包含至少一熱交換器452。 熱交換器450、452、454耦接於流入和流出流體管線44〇。 進入頂部氣室460的受熱空氣流過熱交換器45〇、452、454, 且冷卻過的空氣從熱交換器450、452、454輸出。在一些 實施例中,一或多個風扇可被定位在頂部氣室46〇内,或 者可將一輔助風扇托盤添加至熱交換器45〇之外侧及/或熱 交換器452、454上以增進氣流。 輔助冷卻總成之一優點為熱交換器不會阻止對於電子 27 200912621 設備機殼内部的出入。如第8圖所示暨其相關說明,了 氣室當作一增設部添加至一既有電子設備機殼。在其他實 施例中,一既有電子設備機殼之一頂部部分經改造以包含 一頂部氣室。建構此頂部氣室之面板的一或多者係通風 的,且每一通風面板耦接有一或多個熱交換器。為了在一 既有電子設備機殼内容納此頂部氣室空間,可能必須從電 子设備機殼之頂部部分移除一或多個電子設備伺服器。 Ο
以上所述冷卻系統係搭配電子設備機殼譬如伺服器機 架使用。在替代應財’該冷卻錢係搭配擁有風扇使空 氣通過熱交換器的其他冷卻器件、譬如用在資料中心的高 架式冷卻單元使用。整體而言,此等冷卻器件之動力效率 可透過本發明之冷卻系統的使用得以提升。 以上已就納入細節之特定實施例進行說明以利理解本 和運作原理。文中對於較實施锻其細節的 敘达並非碰限制附射請專利範31項之侧。熟習此技 之精神和範圍對被選上當作 藝者會理解到可不背離本發明 範例的實施例進行修改 28 200912621 【圖式簡單說明】 以下參照圖式之幾糊說明本發明。在適當情况 有全然相同的元件會在—以上的圖式中揭示,以下將 同參考數字代表此等相同元件。 第1圖例不一耦接於本發明一實施例之一導管工件總 的電子設備機殼之側剖面圖。 〜 第2A圖例示一轉接於本發明另一實施例之一導管 總成的電子設備機殼之側剖面圖。
第2B圖例示—輕接於本發明更另一實施例之一導其工 件總成的電子設備機殼之側剖面圖。 B 第3圖例示—第1圖之冷卻面板的正視圖。 第4圖例示一具備處於關閉位置之第-實施例出入機構 之電子設備機殼的等角透視圖。 械構 1, 第5A ®例示—具備處於開啟位置之出入機構之 備機殼的等角透視圖。 电于°又 =5B圖例示—具備依據另一實施例之滑移式出入機構 之電子设備機殼的等角透視圖。 =6 _示_具備第二實酬出人機構之電子設備機殼 的#角透視圖。 j &、圖例7^具備第三實施働人機構之電子設備機殼 的寺角透視圖。 目例示#接於一電子設備機殼之輔助的 侧剖面圖。 弟9圖例示—具備第四實施例出人機構之電子設備機殼 29 200912621 的等角透視圖。 第ίο圖例示一包括刷毛的範例導管導件。 第11圖例示一包括耦接於一剛性結構之刷毛的範例導管 導件,其中該等刷毛構成該導管導件之絕大部分。 第12圖例示一包括耦接於一剛性結構之刷毛的範例導管 導件,其中該等刷毛構成該導管導件之絕大部分。 第13圖例示一包括有狹縫之發泡材的範例導管導件。 第14圖例示一包括有孔洞之發泡材的範例導管導件。 【主要元件符號說明】 10 電子設備機殼 12 第二侧 14 第一側 20、40 冷卻面板 30、50 導管工件總成 32、34、36、37、38 導管導件 39 擋風板 52、54、56 導管導件 60 刷毛 62 裝訂條或束帶 70、80 剛性結構 72、82 刷毛 90 發泡材 91 發泡材一端 30 200912621 92 狹縫 94 發泡材 96 孔洞
110、210、310 120 、 120, 140 150 152 154 160 222、224、226 232、234、236 240、340 322、324、326 332、334、336 410 、 510 412 414 420 430 440 、 540 450、452、454 460 522、524、526 電子設備機殼 後面板 可撓流體管線 滑軌 第二滑移總成 框架 電子設備伺服器 熱交換器 導管工件 流體管線 熱交換器 導管工件 電子設備機殼 第二側 第一側 電子設備伺服器 後氣室 流體管線 熱交換器 頂部氣室 熱交換器 31
Claims (1)
- 200912621 七 1. 申請專利範圍: 一種冷卻總成,其包括: -電子設備機殼,包含具有—第—通風口之—第—側及 具有-第二通風口之-第二側’其找電 含-或多個發熱裝置,各發熱裝置產生—熱負載 其中,電子設韻殼之—⑽被概念性地齡成多個熱 區,每一熱區具有一決定的熱負載; 冷卻面板,耦接於該電子設備機殼的第二側 冷卻面板包含一或多個熱交換器;及 其中該 2· 3. 4. 複數辦管導件’输於該—或多個賴裝置與冷卻門 之間,其巾職數辦管導件經構_以將從該 個發熱裝置輸出之受熱空氣轉性轉往該冷卻面板。 如申請專利翻第1項所述之冷卻總成,更包括一導管 ==二:亥導官工件總成耦接於該電子設備機殼的第 =ίΓ板之間’其中複數個導管導件被定位在 該導官工件總成内。 如申請專利細第丨項所述之冷卻總成,其中該電子設 ::更於該一或多個發熱裝置與該冷卻面板 :=總成’其中複數個導管導件被定位在==圍;:項所述之冷卻總成,其中該複數個 等s導件之母—者的—位置係可調整的。 =料利翻第1顧叙冷卻域,射每-埶區 一谷積係取決於該電子設備機殼内之熱負載分佈。 32 5. 200912621 6’如申請專利範圍第1項所述之冷卻總成,其中每〜發熱 邊置包含一或多個移氣器件。 .如申請專利範圍第丨項所述之冷卻總成,其中相鄰的數 個發熱裝置被集結成群,且每一群發熱裝置包含一或多 個移氣器件。 g .如申請專利範圍第1項所述之冷卻總成,其中該電子設 備機殼被概念性地劃分成Ή個熱區且有Μ個熱交換器, 此外其中該複數個導管導件經構形用以將受熱空氣從一 9 或多個相鄰熱區導往一或多個相鄰熱交換器。 .如申請專利範圍第8項所述之冷卻總成,其中每一熱區 具有一等量熱負載。 •如申請專利範圍第8項所述之冷卻總成,其中每—熱區 具有一獨立決定的熱負載。 備機殼被概級地劃分成㈣祕,每―_且古—二 項所述之冷卻總成,其中該電子設如申請專利範圍第1 —ν %夕徊祁鄰熱交換器。如申請專利範圍第i項所述之冷卻總成,-部繼战,更包括一或多 或多個熱區與—或多個 33 200912621 14. 如申請專利範圍第1項所述之冷卻總成,更包括—或多 個擒風板’其位於介於一或多個熱區與一或多個熱交換 器之間之一氣流路徑内,其中每一擋風板經構形用以減 少氣流。 15. 如申請專利範圍第14項所述之冷卻總成,其中每—擔風 板被構形為'多孔結構、一無孔結構、或一可調式妹構, 該可調式結構構形為被調整成一無孔結構和具備不同多 孔度之一多孔結構。 16·如申請專利範圍第丨項所述之冷卻總成,其中該電子設 備機殼的第二側包含複數個被構形為用以將每—導管導 件固持在定位的導管導件座。 17.如申請專利範圍第1項所述之冷卻總成,其中該冷卻面 板包含複數個被構形為用以將每一導管導件固持在定位 的導管導件座。 ^ 、 18·如申請專利範圍第丨項所述之冷卻總成,其中一導管工 作總成外殼之側面板包含複數個被構形為用以將每一導 管導件固持在定位的導管導件座。 19.如申請專利範圍帛1項所述之冷卻總成,其中該複數個 可5周式導管導件之至少一者是剛性的。 SO·如申請專利範_ 1項所述之冷卻總成,其中該複數個 可調式導管導件之至少一者是可壓縮的。 21.如申請專利範圍» 項所述之冷卻總成,其中處於—未 ===該料導件比該電子⑽機殼寬,使得當該 s牛係處於一壓縮狀態且被定位在該電子設備機殼 34 200912621 内時’ 一向外減壓力施加於該電子設備機殼上,從而將 該已壓縮導管導件固持在定位。 22.如申請專利範圍第1項所述之冷卻總成,其中該複數個 可調式導管導件之至少一者是可變形的。 23· —種冷卻總成,其包括: 一電子設備機殼,其包含具有一第一通風口之一第一側 及具有一第二通風口之一第二側,其中該電子設傷機殼 包含一或多個發熱裝置,各發熱裝置產生一熱負载,此 外其中§亥電子設備機殼之一内部被概念性地劃分成多個 熱區,每一熱區具有一決定熱負載; —冷卻面板,其包含一或多個熱交換器;及 複數個導管導件,該導管導件經構形用以將從該—或多 個發熱裝置輸出之受熱空氣導往該冷卻面板,使得來自 一或多個相鄰熱區的受熱空氣被導往一或多個相鄰熱交 換器。 24· —種冷卻總成,其包括: 一冷卻面板,其複數個熱交換器,每一熱交換器獨立構 形為用以冷卻一指定熱負載; 一電子設備機殼,其包含一具有一第一通風口之一第一 側及具有一第二通風口之一第二側,其中該電子設備機 殼包含一或多個發熱裝置,各發熱裝置產生一熱負載, 此外其中該電子設備機殼之一内部\被概念性地劃分成多 個熱區,每一熱區具有一決定的熱負載;及 複數個導管導件,該導管導件經構形為用以將從該一或 35 200912621 多個發熱裝置輸出之受熱空氣導往該冷卻面板,使得來 自一或多個相鄰熱區的受熱空氣被導往一或多個熱交換 器。
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Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
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TW097129959A TW200924625A (en) | 2007-08-07 | 2008-08-06 | Deformable duct guides that accommodate electronic connection lines |
Family Applications After (2)
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Country Status (4)
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Families Citing this family (87)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7591302B1 (en) | 2003-07-23 | 2009-09-22 | Cooligy Inc. | Pump and fan control concepts in a cooling system |
US9025330B2 (en) * | 2007-09-30 | 2015-05-05 | Alcatel Lucent | Recirculating gas rack cooling architecture |
US8553416B1 (en) | 2007-12-21 | 2013-10-08 | Exaflop Llc | Electronic device cooling system with storage |
US8250877B2 (en) * | 2008-03-10 | 2012-08-28 | Cooligy Inc. | Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door |
JP4724730B2 (ja) * | 2008-04-09 | 2011-07-13 | 株式会社日立製作所 | 情報処理システムの運用管理方法、運用管理プログラム、および運用管理装置、ならびに情報処理システム |
DE102008019271A1 (de) * | 2008-04-16 | 2009-10-22 | Kenersys Gmbh | Windkraftanlage mit verbesserter Kühlluftführung |
US10058011B2 (en) * | 2008-06-19 | 2018-08-21 | Panduit Corp. | Passive cooling systems for network cabinet |
US9426903B1 (en) | 2008-06-27 | 2016-08-23 | Amazon Technologies, Inc. | Cooling air stack for computer equipment |
JP4922255B2 (ja) * | 2008-06-30 | 2012-04-25 | 株式会社日立製作所 | 情報処理システムおよびそのシステムにおける省電力制御方法 |
US9072200B2 (en) * | 2008-09-10 | 2015-06-30 | Schneider Electric It Corporation | Hot aisle containment panel system and method |
US8783336B2 (en) * | 2008-12-04 | 2014-07-22 | Io Data Centers, Llc | Apparatus and method of environmental condition management for electronic equipment |
US8184435B2 (en) | 2009-01-28 | 2012-05-22 | American Power Conversion Corporation | Hot aisle containment cooling system and method |
JP5017296B2 (ja) * | 2009-03-03 | 2012-09-05 | 株式会社東芝 | 電子機器 |
US8031468B2 (en) * | 2009-06-03 | 2011-10-04 | American Power Conversion Corporation | Hot aisle containment cooling unit and method for cooling |
DE202010003042U1 (de) * | 2010-03-03 | 2010-06-10 | Scholz, Markus | Aufbewahrungsvorrichtung für den Außenbereich |
US8789384B2 (en) * | 2010-03-23 | 2014-07-29 | International Business Machines Corporation | Computer rack cooling using independently-controlled flow of coolants through a dual-section heat exchanger |
US9727101B2 (en) * | 2010-03-30 | 2017-08-08 | Nec Corporation | Cooling apparatus and cooling system for electronic-device exhaustion |
US9894808B2 (en) | 2010-03-31 | 2018-02-13 | Amazon Technologies, Inc. | Compressed air cooling system for data center |
US9622387B1 (en) | 2010-03-31 | 2017-04-11 | Amazon Technologies, Inc. | Rack-mounted air directing device with scoop |
US8755192B1 (en) | 2010-03-31 | 2014-06-17 | Amazon Technologies, Inc. | Rack-mounted computer system with shock-absorbing chassis |
EP2648496B1 (en) | 2010-06-23 | 2019-05-01 | Inertech IP LLC | Space-saving high-density modular data center and an energy-efficient cooling system |
US10492331B1 (en) | 2010-09-29 | 2019-11-26 | Amazon Technologies, Inc. | System and method for cooling power distribution units |
TWI392432B (zh) * | 2010-11-23 | 2013-04-01 | Inventec Corp | 一種伺服器機櫃 |
CN103443550B (zh) | 2011-01-11 | 2018-11-20 | 施耐德电气It公司 | 冷却单元和方法 |
KR20140015416A (ko) | 2011-03-02 | 2014-02-06 | 이너테크 아이피 엘엘씨 | 모듈식 it 랙 냉각 어셈블리들 및 어셈블리 방법들 |
US9307674B2 (en) | 2011-05-06 | 2016-04-05 | International Business Machines Corporation | Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component |
US9027360B2 (en) | 2011-05-06 | 2015-05-12 | International Business Machines Corporation | Thermoelectric-enhanced, liquid-based cooling of a multi-component electronic system |
US8919143B2 (en) * | 2011-05-25 | 2014-12-30 | Lenovo Enterprise Solutions (Singapore) Pte. Ltd. | Air-cooling wall with slidable heat exchangers |
US8804334B2 (en) | 2011-05-25 | 2014-08-12 | International Business Machines Corporation | Multi-rack, door-mounted heat exchanger |
GB2493324A (en) * | 2011-05-27 | 2013-02-06 | Semper Holdings Ltd | Cooling System with heat-exchanger mounted within a server cabinet |
WO2012166031A1 (en) * | 2011-06-01 | 2012-12-06 | Telefonaktiebolaget L M Ericsson (Publ) | Cooling of electronic components in an enclosure |
DE102011117223B3 (de) * | 2011-10-28 | 2013-04-25 | Fujitsu Technology Solutions Intellectual Property Gmbh | Luftleithaube zur Strömungsführung von Luft in einem elektronischen Gerät und elektronisches Gerät mit einer solchen Luftleithaube |
US8687364B2 (en) | 2011-10-28 | 2014-04-01 | International Business Machines Corporation | Directly connected heat exchanger tube section and coolant-cooled structure |
US8817474B2 (en) | 2011-10-31 | 2014-08-26 | International Business Machines Corporation | Multi-rack assembly with shared cooling unit |
US8760863B2 (en) | 2011-10-31 | 2014-06-24 | International Business Machines Corporation | Multi-rack assembly with shared cooling apparatus |
US20130115869A1 (en) * | 2011-11-04 | 2013-05-09 | International Business Machines Corporation | Directed server rack air flow |
US8591625B2 (en) | 2011-11-13 | 2013-11-26 | International Business Machines Corporation | Server rack front door with contamination filter and sensor |
US9043035B2 (en) | 2011-11-29 | 2015-05-26 | International Business Machines Corporation | Dynamically limiting energy consumed by cooling apparatus |
EP2787801B1 (en) * | 2011-12-01 | 2017-04-12 | Fujitsu Limited | Rack for electronic equipment, and information processing device |
US9095070B2 (en) | 2011-12-05 | 2015-07-28 | Amazon Technologies, Inc. | Partial-width rack-mounted computing devices |
US8773861B2 (en) | 2011-12-15 | 2014-07-08 | Amazon Technologies, Inc. | Reconfigurable shelf for computing modules |
US8720043B2 (en) * | 2011-12-15 | 2014-05-13 | Amazon Technologies, Inc. | Method of allocating resources in a rack system |
US8867214B2 (en) | 2011-12-15 | 2014-10-21 | Amazon Technologies, Inc. | Modular server design for use in reconfigurable server shelf |
US9671837B2 (en) * | 2012-10-04 | 2017-06-06 | Compass Datacenters, Llc | Air dam for a datacenter facility |
US9016352B2 (en) | 2012-05-21 | 2015-04-28 | Calvary Applied Technologies, LLC | Apparatus and methods for cooling rejected heat from server racks |
US9273906B2 (en) | 2012-06-14 | 2016-03-01 | International Business Machines Corporation | Modular pumping unit(s) facilitating cooling of electronic system(s) |
US9110476B2 (en) | 2012-06-20 | 2015-08-18 | International Business Machines Corporation | Controlled cooling of an electronic system based on projected conditions |
US9879926B2 (en) | 2012-06-20 | 2018-01-30 | International Business Machines Corporation | Controlled cooling of an electronic system for reduced energy consumption |
US9439328B2 (en) * | 2012-07-31 | 2016-09-06 | Dell Products L.P. | System and method for directing exhaust from a modular data center |
US10082857B1 (en) | 2012-08-07 | 2018-09-25 | Amazon Technologies, Inc. | Cooling electrical systems based on power measurements |
US8436246B1 (en) | 2012-10-19 | 2013-05-07 | Calvary Applied Technologies, LLC | Refrigerant line electrical ground isolation device for data center cooling applications |
US9025331B2 (en) | 2012-11-12 | 2015-05-05 | International Business Machines Corporation | Inlet-air-cooling door assembly for an electronics rack |
US9042098B2 (en) | 2012-11-12 | 2015-05-26 | International Business Machines Corporation | Air-cooling and vapor-condensing door assembly |
US20140148086A1 (en) * | 2012-11-26 | 2014-05-29 | International Business Machines Corporation | Adjustable air inlet duct for rack systems |
US9313930B2 (en) | 2013-01-21 | 2016-04-12 | International Business Machines Corporation | Multi-level redundant cooling system for continuous cooling of an electronic system(s) |
US9173320B2 (en) | 2013-02-12 | 2015-10-27 | Lenovo Enterprise Solutions (Singapore) Pte. Ltd. | Targeted cooling to specific overheating rack-mounted servers |
US9198325B2 (en) | 2013-02-27 | 2015-11-24 | Lenovo Enterprise Solutions (Singapore) Pte. Ltd. | Targeted cooling to specific overheating rack-mounted servers |
US9894809B1 (en) | 2013-02-28 | 2018-02-13 | Amazon Technologies, Inc. | System for supplying cooling air from sub-floor space |
US9648784B2 (en) | 2013-03-15 | 2017-05-09 | Inertech Ip Llc | Systems and assemblies for cooling server racks |
US9332863B2 (en) | 2013-03-15 | 2016-05-10 | Panduit Corp. | Containment apparatus with movable door |
US20140360696A1 (en) * | 2013-06-06 | 2014-12-11 | International Business Machines Corporation | Dynamic surface area expansion in a rear door heat exchanger |
WO2016057854A1 (en) | 2014-10-08 | 2016-04-14 | Inertech Ip Llc | Systems and methods for cooling electrical equipment |
US10175005B2 (en) * | 2015-03-30 | 2019-01-08 | Infinera Corporation | Low-cost nano-heat pipe |
EP3430327A1 (en) | 2016-03-16 | 2019-01-23 | Inertech IP LLC | System and methods utilizing fluid coolers and chillers to perform in-series heat rejection and trim cooling |
US10390462B2 (en) * | 2017-02-16 | 2019-08-20 | Dell Products, Lp | Server chassis with independent orthogonal airflow layout |
US10395695B2 (en) | 2017-03-16 | 2019-08-27 | International Business Machines Corporation | Data storage library with media acclimation device and methods of acclimating data storage media |
US10026445B1 (en) | 2017-03-16 | 2018-07-17 | International Business Machines Corporation | Data storage library with interior access regulation |
US9916871B1 (en) | 2017-03-16 | 2018-03-13 | International Business Machines Corporation | Data storage library with acclimation chamber |
US9916869B1 (en) | 2017-03-16 | 2018-03-13 | International Business Machines Corporation | Method for servicing a self-cooled data storage library |
US10890955B2 (en) | 2017-03-16 | 2021-01-12 | International Business Machines Corporation | System for controlling environmental conditions within an automated data storage library |
US10417851B2 (en) | 2017-03-16 | 2019-09-17 | International Business Machines Corporation | Data storage library with service mode |
US9940976B1 (en) | 2017-03-16 | 2018-04-10 | International Business Machines Corporation | Data storage library with component locker for environmental acclimation |
US10431254B2 (en) | 2017-03-16 | 2019-10-01 | International Business Machines Corporation | System for providing an acclimation enclosure for a data storage library |
US10026455B1 (en) | 2017-03-16 | 2018-07-17 | International Business Machines Corporation | System and method for controlling environmental conditions within an automated data storage library |
US10509421B2 (en) | 2017-03-16 | 2019-12-17 | International Business Machines Corproation | Method for controlling environmental conditions within an automated data storage library |
US11500430B2 (en) | 2017-03-16 | 2022-11-15 | International Business Machines Corporation | Data storage library with service mode for protecting data storage drives |
US10566023B2 (en) | 2017-03-16 | 2020-02-18 | International Business Machines Corporation | Data storage library with service mode for protecting data storage drives |
US10045457B1 (en) * | 2017-03-16 | 2018-08-07 | International Business Machines Corporation | System for maintaining the environment of a self-cooled data storage library |
US10303376B2 (en) | 2017-03-16 | 2019-05-28 | International Business Machines Corporation | Data storage library with pass-through connected media acclimation chamber |
US10418071B2 (en) | 2017-03-16 | 2019-09-17 | International Business Machines Corporation | Data storage library with positive pressure system |
US10660240B2 (en) | 2017-03-16 | 2020-05-19 | International Business Machines Corporation | Method for providing an access area for a data storage library |
US10551806B2 (en) | 2017-03-16 | 2020-02-04 | International Business Machines Corporation | System for providing an access area for a data storage library |
US11609005B2 (en) | 2018-09-28 | 2023-03-21 | Johnson Controls Tyco IP Holdings LLP | Adjustable heat exchanger |
FR3091461B1 (fr) * | 2019-01-02 | 2020-12-04 | Safran Electrical & Power | Module de distribution électrique compartimenté par des cloisons comportant des canaux de ventilation et/ou de passage de câbles de commande |
CN111669935B (zh) * | 2019-03-08 | 2023-01-06 | 富联精密电子(天津)有限公司 | 冷却装置及应用所述冷却装置的电子装置冷却系统 |
US11340571B2 (en) * | 2020-02-11 | 2022-05-24 | Dell Products L.P. | System with retrofit enhancement of an ultra dense thermally challenged server |
US10998703B1 (en) | 2020-02-26 | 2021-05-04 | International Business Machines Corporation | Cable routing and bend radius defining tool |
Family Cites Families (371)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2273505A (en) * | 1942-02-17 | Container | ||
US596062A (en) | 1897-12-28 | Device for preventing bursting of freezing pipes | ||
US2039593A (en) * | 1935-06-20 | 1936-05-05 | Theodore N Hubbuch | Heat transfer coil |
US3361195A (en) * | 1966-09-23 | 1968-01-02 | Westinghouse Electric Corp | Heat sink member for a semiconductor device |
US3771219A (en) | 1970-02-05 | 1973-11-13 | Sharp Kk | Method for manufacturing semiconductor device |
DE2102254B2 (de) | 1971-01-19 | 1973-05-30 | Robert Bosch Gmbh, 7000 Stuttgart | Kuehlvorrichtung fuer leistungshalbleiterbauelemente |
US3800510A (en) * | 1972-05-09 | 1974-04-02 | Celanese Corp | Separating assembly |
FR2216537B1 (zh) * | 1973-02-06 | 1975-03-07 | Gaz De France | |
US3852806A (en) | 1973-05-02 | 1974-12-03 | Gen Electric | Nonwicked heat-pipe cooled power semiconductor device assembly having enhanced evaporated surface heat pipes |
US4072188A (en) | 1975-07-02 | 1978-02-07 | Honeywell Information Systems Inc. | Fluid cooling systems for electronic systems |
US3993123A (en) | 1975-10-28 | 1976-11-23 | International Business Machines Corporation | Gas encapsulated cooling module |
DE2658720C3 (de) | 1976-12-24 | 1982-01-28 | Deutsche Forschungs- und Versuchsanstalt für Luft- und Raumfahrt e.V., 5300 Bonn | Latentwärmespeicher zur Aufnahme eines wärmespeichernden Mediums |
DE2741244C2 (de) | 1977-09-14 | 1983-10-27 | Klöckner-Humboldt-Deutz AG, 5000 Köln | Kühlungsanordnung an einer luftgekühlten Brennkraftmaschine |
US4312012A (en) * | 1977-11-25 | 1982-01-19 | International Business Machines Corp. | Nucleate boiling surface for increasing the heat transfer from a silicon device to a liquid coolant |
US4203488A (en) * | 1978-03-01 | 1980-05-20 | Aavid Engineering, Inc. | Self-fastened heat sinks |
US4392362A (en) * | 1979-03-23 | 1983-07-12 | The Board Of Trustees Of The Leland Stanford Junior University | Micro miniature refrigerators |
US4235285A (en) | 1979-10-29 | 1980-11-25 | Aavid Engineering, Inc. | Self-fastened heat sinks |
US4332291A (en) | 1979-12-21 | 1982-06-01 | D. Mulock-Bentley And Associates (Proprietary) Limited | Heat exchanger with slotted fin strips |
US4345267A (en) | 1980-03-31 | 1982-08-17 | Amp Incorporated | Active device substrate connector having a heat sink |
US4450472A (en) * | 1981-03-02 | 1984-05-22 | The Board Of Trustees Of The Leland Stanford Junior University | Method and means for improved heat removal in compact semiconductor integrated circuits and similar devices utilizing coolant chambers and microscopic channels |
US4573067A (en) * | 1981-03-02 | 1986-02-25 | The Board Of Trustees Of The Leland Stanford Junior University | Method and means for improved heat removal in compact semiconductor integrated circuits |
US4574876A (en) * | 1981-05-11 | 1986-03-11 | Extracorporeal Medical Specialties, Inc. | Container with tapered walls for heating or cooling fluids |
JPS582276A (ja) | 1981-06-24 | 1983-01-07 | 株式会社日立製作所 | 金属−セラミツクス接合体及びその製造法 |
JPS58137285A (ja) | 1982-02-10 | 1983-08-15 | 株式会社日立製作所 | 金属板付セラミック基板の製造法 |
CH658511A5 (de) * | 1982-04-21 | 1986-11-14 | Ernst H Furrer Fa | Kuehlaggregat fuer ein geschlossenes geraet, insbesondere fuer einen schaltschrank. |
US4485429A (en) | 1982-06-09 | 1984-11-27 | Sperry Corporation | Apparatus for cooling integrated circuit chips |
US4516632A (en) * | 1982-08-31 | 1985-05-14 | The United States Of America As Represented By The United States Deparment Of Energy | Microchannel crossflow fluid heat exchanger and method for its fabrication |
GB8323065D0 (en) | 1983-08-26 | 1983-09-28 | Rca Corp | Flux free photo-detector soldering |
US4567505A (en) * | 1983-10-27 | 1986-01-28 | The Board Of Trustees Of The Leland Stanford Junior University | Heat sink and method of attaching heat sink to a semiconductor integrated circuit and the like |
JPH0673364B2 (ja) * | 1983-10-28 | 1994-09-14 | 株式会社日立製作所 | 集積回路チップ冷却装置 |
US4561040A (en) | 1984-07-12 | 1985-12-24 | Ibm Corporation | Cooling system for VLSI circuit chips |
US4612979A (en) * | 1984-08-31 | 1986-09-23 | Siemens Aktiengesellschaft | Apparatus for the cooling of electronic assemblies or components |
US4568431A (en) * | 1984-11-13 | 1986-02-04 | Olin Corporation | Process for producing electroplated and/or treated metal foil |
US4893174A (en) * | 1985-07-08 | 1990-01-09 | Hitachi, Ltd. | High density integration of semiconductor circuit |
DE3679978D1 (de) | 1985-12-13 | 1991-08-01 | Hasler Ag Ascom | Verfahren und vorrichtung zum abfuehren der verlustwaerme wenigstens einer baugruppe elektrischer elemente. |
US4758926A (en) | 1986-03-31 | 1988-07-19 | Microelectronics And Computer Technology Corporation | Fluid-cooled integrated circuit package |
US4716494A (en) | 1986-11-07 | 1987-12-29 | Amp Incorporated | Retention system for removable heat sink |
US4868712A (en) | 1987-02-04 | 1989-09-19 | Woodman John K | Three dimensional integrated circuit package |
US4791983A (en) | 1987-10-13 | 1988-12-20 | Unisys Corporation | Self-aligning liquid-cooling assembly |
US5016138A (en) * | 1987-10-27 | 1991-05-14 | Woodman John K | Three dimensional integrated circuit package |
US4894709A (en) * | 1988-03-09 | 1990-01-16 | Massachusetts Institute Of Technology | Forced-convection, liquid-cooled, microchannel heat sinks |
US4896719A (en) * | 1988-05-11 | 1990-01-30 | Mcdonnell Douglas Corporation | Isothermal panel and plenum |
US4908112A (en) | 1988-06-16 | 1990-03-13 | E. I. Du Pont De Nemours & Co. | Silicon semiconductor wafer for analyzing micronic biological samples |
US4866570A (en) | 1988-08-05 | 1989-09-12 | Ncr Corporation | Apparatus and method for cooling an electronic device |
US4938280A (en) | 1988-11-07 | 1990-07-03 | Clark William E | Liquid-cooled, flat plate heat exchanger |
CA2002213C (en) | 1988-11-10 | 1999-03-30 | Iwona Turlik | High performance integrated circuit chip package and method of making same |
US5145001A (en) | 1989-07-24 | 1992-09-08 | Creare Inc. | High heat flux compact heat exchanger having a permeable heat transfer element |
US5009760A (en) * | 1989-07-28 | 1991-04-23 | Board Of Trustees Of The Leland Stanford Junior University | System for measuring electrokinetic properties and for characterizing electrokinetic separations by monitoring current in electrophoresis |
US4978638A (en) | 1989-12-21 | 1990-12-18 | International Business Machines Corporation | Method for attaching heat sink to plastic packaged electronic component |
US5083194A (en) * | 1990-01-16 | 1992-01-21 | Cray Research, Inc. | Air jet impingement on miniature pin-fin heat sinks for cooling electronic components |
US5858188A (en) * | 1990-02-28 | 1999-01-12 | Aclara Biosciences, Inc. | Acrylic microchannels and their use in electrophoretic applications |
US6054034A (en) * | 1990-02-28 | 2000-04-25 | Aclara Biosciences, Inc. | Acrylic microchannels and their use in electrophoretic applications |
US6176962B1 (en) * | 1990-02-28 | 2001-01-23 | Aclara Biosciences, Inc. | Methods for fabricating enclosed microchannel structures |
US5070040A (en) | 1990-03-09 | 1991-12-03 | University Of Colorado Foundation, Inc. | Method and apparatus for semiconductor circuit chip cooling |
US4987996A (en) * | 1990-03-15 | 1991-01-29 | Atco Rubber Products, Inc. | Flexible duct and carton |
US5016090A (en) * | 1990-03-21 | 1991-05-14 | International Business Machines Corporation | Cross-hatch flow distribution and applications thereof |
US5043797A (en) | 1990-04-03 | 1991-08-27 | General Electric Company | Cooling header connection for a thyristor stack |
JPH07114250B2 (ja) | 1990-04-27 | 1995-12-06 | インターナショナル・ビジネス・マシーンズ・コーポレイション | 熱伝達システム |
US5265670A (en) | 1990-04-27 | 1993-11-30 | International Business Machines Corporation | Convection transfer system |
US5088005A (en) * | 1990-05-08 | 1992-02-11 | Sundstrand Corporation | Cold plate for cooling electronics |
US5161089A (en) | 1990-06-04 | 1992-11-03 | International Business Machines Corporation | Enhanced multichip module cooling with thermally optimized pistons and closely coupled convective cooling channels, and methods of manufacturing the same |
US5203401A (en) * | 1990-06-29 | 1993-04-20 | Digital Equipment Corporation | Wet micro-channel wafer chuck and cooling method |
US5057908A (en) | 1990-07-10 | 1991-10-15 | Iowa State University Research Foundation, Inc. | High power semiconductor device with integral heat sink |
CH680693A5 (zh) * | 1990-08-07 | 1992-10-15 | Sulzer Ag | |
US5420067A (en) | 1990-09-28 | 1995-05-30 | The United States Of America As Represented By The Secretary Of The Navy | Method of fabricatring sub-half-micron trenches and holes |
US5099910A (en) * | 1991-01-15 | 1992-03-31 | Massachusetts Institute Of Technology | Microchannel heat sink with alternating flow directions |
US5099311A (en) * | 1991-01-17 | 1992-03-24 | The United States Of America As Represented By The United States Department Of Energy | Microchannel heat sink assembly |
JPH06342990A (ja) | 1991-02-04 | 1994-12-13 | Internatl Business Mach Corp <Ibm> | 統合冷却システム |
US5131233A (en) | 1991-03-08 | 1992-07-21 | Cray Computer Corporation | Gas-liquid forced turbulence cooling |
US5232047A (en) | 1991-04-02 | 1993-08-03 | Microunity Systems Engineering, Inc. | Heat exchanger for solid-state electronic devices |
US5263251A (en) | 1991-04-02 | 1993-11-23 | Microunity Systems Engineering | Method of fabricating a heat exchanger for solid-state electronic devices |
US5125451A (en) * | 1991-04-02 | 1992-06-30 | Microunity Systems Engineering, Inc. | Heat exchanger for solid-state electronic devices |
US5105430A (en) * | 1991-04-09 | 1992-04-14 | The United States Of America As Represented By The United States Department Of Energy | Thin planar package for cooling an array of edge-emitting laser diodes |
US5199487A (en) * | 1991-05-31 | 1993-04-06 | Hughes Aircraft Company | Electroformed high efficiency heat exchanger and method for making |
FR2679729B1 (fr) * | 1991-07-23 | 1994-04-29 | Alcatel Telspace | Dissipateur thermique. |
US5239200A (en) | 1991-08-21 | 1993-08-24 | International Business Machines Corporation | Apparatus for cooling integrated circuit chips |
US5228502A (en) | 1991-09-04 | 1993-07-20 | International Business Machines Corporation | Cooling by use of multiple parallel convective surfaces |
US5386143A (en) * | 1991-10-25 | 1995-01-31 | Digital Equipment Corporation | High performance substrate, electronic package and integrated circuit cooling process |
JPH05217121A (ja) | 1991-11-22 | 1993-08-27 | Internatl Business Mach Corp <Ibm> | 磁気変換器付きチップ等の感熱素子を結合する方法及び装置 |
US5218515A (en) | 1992-03-13 | 1993-06-08 | The United States Of America As Represented By The United States Department Of Energy | Microchannel cooling of face down bonded chips |
US5239443A (en) | 1992-04-23 | 1993-08-24 | International Business Machines Corporation | Blind hole cold plate cooling system |
US5317805A (en) | 1992-04-28 | 1994-06-07 | Minnesota Mining And Manufacturing Company | Method of making microchanneled heat exchangers utilizing sacrificial cores |
JP3093441B2 (ja) | 1992-04-28 | 2000-10-03 | 昭和アルミニウム株式会社 | 高出力電子機器用ヒートシンク |
US5294834A (en) * | 1992-06-01 | 1994-03-15 | Sverdrup Technology, Inc. | Low resistance contacts for shallow junction semiconductors |
US5247800A (en) | 1992-06-03 | 1993-09-28 | General Electric Company | Thermal connector with an embossed contact for a cryogenic apparatus |
US5275237A (en) * | 1992-06-12 | 1994-01-04 | Micron Technology, Inc. | Liquid filled hot plate for precise temperature control |
US5308429A (en) * | 1992-09-29 | 1994-05-03 | Digital Equipment Corporation | System for bonding a heatsink to a semiconductor chip package |
US5316077A (en) | 1992-12-09 | 1994-05-31 | Eaton Corporation | Heat sink for electrical circuit components |
US5520244A (en) | 1992-12-16 | 1996-05-28 | Sdl, Inc. | Micropost waste heat removal system |
DE4242841C2 (de) | 1992-12-17 | 1995-05-11 | Litef Gmbh | Verfahren und Regeleinrichtung zur Temperaturregelung für ein peltierbetriebenes Temperiergerät |
US5269372A (en) | 1992-12-21 | 1993-12-14 | International Business Machines Corporation | Intersecting flow network for a cold plate cooling system |
US5397919A (en) * | 1993-03-04 | 1995-03-14 | Square Head, Inc. | Heat sink assembly for solid state devices |
US5534328A (en) | 1993-12-02 | 1996-07-09 | E. I. Du Pont De Nemours And Company | Integrated chemical processing apparatus and processes for the preparation thereof |
JP3512186B2 (ja) | 1993-03-19 | 2004-03-29 | イー・アイ・デユポン・ドウ・ヌムール・アンド・カンパニー | 化学処理及び製造のための一体構造及び方法、並びにその使用方法及び製造方法 |
JP3477781B2 (ja) * | 1993-03-23 | 2003-12-10 | セイコーエプソン株式会社 | Icカード |
US5436793A (en) | 1993-03-31 | 1995-07-25 | Ncr Corporation | Apparatus for containing and cooling an integrated circuit device having a thermally insulative positioning member |
US5459352A (en) | 1993-03-31 | 1995-10-17 | Unisys Corporation | Integrated circuit package having a liquid metal-aluminum/copper joint |
US5427174A (en) | 1993-04-30 | 1995-06-27 | Heat Transfer Devices, Inc. | Method and apparatus for a self contained heat exchanger |
US5380956A (en) * | 1993-07-06 | 1995-01-10 | Sun Microsystems, Inc. | Multi-chip cooling module and method |
US5727618A (en) * | 1993-08-23 | 1998-03-17 | Sdl Inc | Modular microchannel heat exchanger |
US5704416A (en) * | 1993-09-10 | 1998-01-06 | Aavid Laboratories, Inc. | Two phase component cooler |
ATE162616T1 (de) | 1993-09-27 | 1998-02-15 | Paul Eberhard Dipl Ing | Kanalwärmetauscher |
US5514906A (en) | 1993-11-10 | 1996-05-07 | Fujitsu Limited | Apparatus for cooling semiconductor chips in multichip modules |
KR100353020B1 (ko) | 1993-12-28 | 2003-01-10 | 쇼와 덴코 가부시키가이샤 | 적층형열교환기 |
US5383340A (en) * | 1994-03-24 | 1995-01-24 | Aavid Laboratories, Inc. | Two-phase cooling system for laptop computers |
US5424918A (en) | 1994-03-31 | 1995-06-13 | Hewlett-Packard Company | Universal hybrid mounting system |
US5544696A (en) | 1994-07-01 | 1996-08-13 | The United States Of America As Represented By The Secretary Of The Air Force | Enhanced nucleate boiling heat transfer for electronic cooling and thermal energy transfer |
US5811062A (en) | 1994-07-29 | 1998-09-22 | Battelle Memorial Institute | Microcomponent chemical process sheet architecture |
US6129973A (en) | 1994-07-29 | 2000-10-10 | Battelle Memorial Institute | Microchannel laminated mass exchanger and method of making |
US6126723A (en) | 1994-07-29 | 2000-10-03 | Battelle Memorial Institute | Microcomponent assembly for efficient contacting of fluid |
US5611214A (en) | 1994-07-29 | 1997-03-18 | Battelle Memorial Institute | Microcomponent sheet architecture |
US5641400A (en) | 1994-10-19 | 1997-06-24 | Hewlett-Packard Company | Use of temperature control devices in miniaturized planar column devices and miniaturized total analysis systems |
US5508234A (en) * | 1994-10-31 | 1996-04-16 | International Business Machines Corporation | Microcavity structures, fabrication processes, and applications thereof |
JP3355824B2 (ja) | 1994-11-04 | 2002-12-09 | 株式会社デンソー | コルゲートフィン型熱交換器 |
US5585069A (en) | 1994-11-10 | 1996-12-17 | David Sarnoff Research Center, Inc. | Partitioned microelectronic and fluidic device array for clinical diagnostics and chemical synthesis |
US5676198A (en) | 1994-11-15 | 1997-10-14 | Sundstrand Corporation | Cooling apparatus for an electronic component |
DE19514548C1 (de) | 1995-04-20 | 1996-10-02 | Daimler Benz Ag | Verfahren zur Herstellung einer Mikrokühleinrichtung |
JP3113793B2 (ja) * | 1995-05-02 | 2000-12-04 | 株式会社エヌ・ティ・ティ ファシリティーズ | 空気調和方式 |
US5548605A (en) | 1995-05-15 | 1996-08-20 | The Regents Of The University Of California | Monolithic microchannel heatsink |
US5575929A (en) | 1995-06-05 | 1996-11-19 | The Regents Of The University Of California | Method for making circular tubular channels with two silicon wafers |
US6057149A (en) | 1995-09-15 | 2000-05-02 | The University Of Michigan | Microscale devices and reactions in microscale devices |
US5696405A (en) | 1995-10-13 | 1997-12-09 | Lucent Technologies Inc. | Microelectronic package with device cooling |
US5757070A (en) | 1995-10-24 | 1998-05-26 | Altera Corporation | Integrated circuit package |
JPH09129790A (ja) * | 1995-11-07 | 1997-05-16 | Toshiba Corp | ヒートシンク装置 |
US5705018A (en) | 1995-12-13 | 1998-01-06 | Hartley; Frank T. | Micromachined peristaltic pump |
CN2292792Y (zh) * | 1995-12-20 | 1998-09-30 | 中国科学院长春应用化学研究所 | 自控温节能电热坐垫 |
JP3029792B2 (ja) * | 1995-12-28 | 2000-04-04 | 日本サーボ株式会社 | 多相永久磁石型回転電機 |
US5768104A (en) | 1996-02-22 | 1998-06-16 | Cray Research, Inc. | Cooling approach for high power integrated circuits mounted on printed circuit boards |
US5675473A (en) | 1996-02-23 | 1997-10-07 | Motorola, Inc. | Apparatus and method for shielding an electronic module from electromagnetic radiation |
DE19609651C2 (de) * | 1996-03-13 | 1998-01-22 | Loh Kg Rittal Werk | Schaltschrank-Klimatisierungseinrichtung |
US5703536A (en) | 1996-04-08 | 1997-12-30 | Harris Corporation | Liquid cooling system for high power solid state AM transmitter |
US5885470A (en) | 1997-04-14 | 1999-03-23 | Caliper Technologies Corporation | Controlled fluid transport in microfabricated polymeric substrates |
US6016864A (en) | 1996-04-19 | 2000-01-25 | Heatcraft Inc. | Heat exchanger with relatively flat fluid conduits |
US5740013A (en) * | 1996-07-03 | 1998-04-14 | Hewlett-Packard Company | Electronic device enclosure having electromagnetic energy containment and heat removal characteristics |
US5800690A (en) | 1996-07-03 | 1998-09-01 | Caliper Technologies Corporation | Variable control of electroosmotic and/or electrophoretic forces within a fluid-containing structure via electrical forces |
US5801442A (en) | 1996-07-22 | 1998-09-01 | Northrop Grumman Corporation | Microchannel cooling of high power semiconductor devices |
US5692558A (en) | 1996-07-22 | 1997-12-02 | Northrop Grumman Corporation | Microchannel cooling using aviation fuels for airborne electronics |
US5763951A (en) | 1996-07-22 | 1998-06-09 | Northrop Grumman Corporation | Non-mechanical magnetic pump for liquid cooling |
US5731954A (en) * | 1996-08-22 | 1998-03-24 | Cheon; Kioan | Cooling system for computer |
JPH1084139A (ja) | 1996-09-09 | 1998-03-31 | Technova:Kk | 熱電変換装置 |
DE29717480U1 (de) * | 1996-09-30 | 1998-02-05 | Siemens Ag | Anlage zur Kühlung von drehzahlgeregelten Antrieben |
US5835345A (en) | 1996-10-02 | 1998-11-10 | Sdl, Inc. | Cooler for removing heat from a heated region |
US5983997A (en) | 1996-10-17 | 1999-11-16 | Brazonics, Inc. | Cold plate having uniform pressure drop and uniform flow rate |
US5830806A (en) | 1996-10-18 | 1998-11-03 | Micron Technology, Inc. | Wafer backing member for mechanical and chemical-mechanical planarization of substrates |
DE19643717A1 (de) | 1996-10-23 | 1998-04-30 | Asea Brown Boveri | Flüssigkeits-Kühlvorrichtung für ein Hochleistungshalbleitermodul |
US5774779A (en) | 1996-11-06 | 1998-06-30 | Materials And Electrochemical Research (Mer) Corporation | Multi-channel structures and processes for making such structures |
US6167948B1 (en) * | 1996-11-18 | 2001-01-02 | Novel Concepts, Inc. | Thin, planar heat spreader |
JPH10176768A (ja) | 1996-11-27 | 1998-06-30 | Xerox Corp | マイクロデバイス支持システム及びマイクロデバイスのアレイ |
US5870823A (en) * | 1996-11-27 | 1999-02-16 | International Business Machines Corporation | Method of forming a multilayer electronic packaging substrate with integral cooling channels |
US5927390A (en) | 1996-12-13 | 1999-07-27 | Caterpillar Inc. | Radiator arrangement with offset modular cores |
US5964092A (en) | 1996-12-13 | 1999-10-12 | Nippon Sigmax, Co., Ltd. | Electronic cooling apparatus |
JPH10190071A (ja) | 1996-12-20 | 1998-07-21 | Aisin Seiki Co Ltd | 多段電子冷却装置 |
DE19653895A1 (de) * | 1996-12-21 | 1998-06-25 | Teves Gmbh Alfred | Pumpe, insbesondere für eine hydraulische Bremsschlupfregelanlage |
US5896869A (en) | 1997-01-13 | 1999-04-27 | International Business Machines Corporation | Semiconductor package having etched-back silver-copper braze |
SE9700205D0 (sv) | 1997-01-24 | 1997-01-24 | Peter Lindberg | Integrated microfluidic element |
DE19710783C2 (de) * | 1997-03-17 | 2003-08-21 | Curamik Electronics Gmbh | Kühler zur Verwendung als Wärmesenke für elektrische Bauelemente oder Schaltkreise |
US6391622B1 (en) | 1997-04-04 | 2002-05-21 | Caliper Technologies Corp. | Closed-loop biochemical analyzers |
US5993750A (en) | 1997-04-11 | 1999-11-30 | Eastman Kodak Company | Integrated ceramic micro-chemical plant |
US5921087A (en) | 1997-04-22 | 1999-07-13 | Intel Corporation | Method and apparatus for cooling integrated circuits using a thermoelectric module |
WO1998049548A1 (en) | 1997-04-25 | 1998-11-05 | Caliper Technologies Corporation | Microfluidic devices incorporating improved channel geometries |
WO1998049549A1 (en) | 1997-04-30 | 1998-11-05 | Orion Research, Inc. | Capillary electrophoretic separation system |
US5880524A (en) * | 1997-05-05 | 1999-03-09 | Intel Corporation | Heat pipe lid for electronic packages |
EP0980446A4 (en) | 1997-05-08 | 2000-08-23 | Nanosystems Inc | SILICON ETCHING PROCESS FOR THE PRODUCTION OF MICROCHANNEL PLATES |
US6090251A (en) | 1997-06-06 | 2000-07-18 | Caliper Technologies, Inc. | Microfabricated structures for facilitating fluid introduction into microfluidic devices |
US5901037A (en) * | 1997-06-18 | 1999-05-04 | Northrop Grumman Corporation | Closed loop liquid cooling for semiconductor RF amplifier modules |
US6001231A (en) * | 1997-07-15 | 1999-12-14 | Caliper Technologies Corp. | Methods and systems for monitoring and controlling fluid flow rates in microfluidic systems |
US6907921B2 (en) | 1998-06-18 | 2005-06-21 | 3M Innovative Properties Company | Microchanneled active fluid heat exchanger |
JP4048579B2 (ja) | 1997-08-28 | 2008-02-20 | 住友電気工業株式会社 | 冷媒流路を含む熱消散体とその製造方法 |
US6400012B1 (en) | 1997-09-17 | 2002-06-04 | Advanced Energy Voorhees, Inc. | Heat sink for use in cooling an integrated circuit |
US6049040A (en) * | 1997-09-17 | 2000-04-11 | Biles; Scott Douglas | Universal cable guide |
US6012902A (en) * | 1997-09-25 | 2000-01-11 | Caliper Technologies Corp. | Micropump |
US5842787A (en) * | 1997-10-09 | 1998-12-01 | Caliper Technologies Corporation | Microfluidic systems incorporating varied channel dimensions |
US6174675B1 (en) * | 1997-11-25 | 2001-01-16 | Caliper Technologies Corp. | Electrical current for controlling fluid parameters in microchannels |
US6140860A (en) | 1997-12-31 | 2000-10-31 | Intel Corporation | Thermal sensing circuit |
US6167910B1 (en) | 1998-01-20 | 2001-01-02 | Caliper Technologies Corp. | Multi-layer microfluidic devices |
US6100541A (en) | 1998-02-24 | 2000-08-08 | Caliper Technologies Corporation | Microfluidic devices and systems incorporating integrated optical elements |
US6084178A (en) | 1998-02-27 | 2000-07-04 | Hewlett-Packard Company | Perimeter clamp for mounting and aligning a semiconductor component as part of a field replaceable unit (FRU) |
US6163073A (en) | 1998-04-17 | 2000-12-19 | International Business Machines Corporation | Integrated heatsink and heatpipe |
US6227287B1 (en) | 1998-05-25 | 2001-05-08 | Denso Corporation | Cooling apparatus by boiling and cooling refrigerant |
KR100266698B1 (ko) | 1998-06-12 | 2000-09-15 | 김영환 | 반도체 칩 패키지 및 그 제조방법 |
US6196307B1 (en) * | 1998-06-17 | 2001-03-06 | Intersil Americas Inc. | High performance heat exchanger and method |
US5940270A (en) | 1998-07-08 | 1999-08-17 | Puckett; John Christopher | Two-phase constant-pressure closed-loop water cooling system for a heat producing device |
US6129260A (en) | 1998-08-19 | 2000-10-10 | Fravillig Technologies Company | Solderable structures |
US6119729A (en) | 1998-09-14 | 2000-09-19 | Arise Technologies Corporation | Freeze protection apparatus for fluid transport passages |
US6146103A (en) | 1998-10-09 | 2000-11-14 | The Regents Of The University Of California | Micromachined magnetohydrodynamic actuators and sensors |
US6021045A (en) * | 1998-10-26 | 2000-02-01 | Chip Coolers, Inc. | Heat sink assembly with threaded collar and multiple pressure capability |
US6032689A (en) * | 1998-10-30 | 2000-03-07 | Industrial Technology Research Institute | Integrated flow controller module |
US6086330A (en) | 1998-12-21 | 2000-07-11 | Motorola, Inc. | Low-noise, high-performance fan |
US6313992B1 (en) | 1998-12-22 | 2001-11-06 | James J. Hildebrandt | Method and apparatus for increasing the power density of integrated circuit boards and their components |
US6365962B1 (en) | 2000-03-29 | 2002-04-02 | Intel Corporation | Flip-chip on flex for high performance packaging applications |
ATE508200T1 (de) | 1999-02-23 | 2011-05-15 | Caliper Life Sciences Inc | Sequenzierung durch inkorporation |
US6553253B1 (en) * | 1999-03-12 | 2003-04-22 | Biophoretic Therapeutic Systems, Llc | Method and system for electrokinetic delivery of a substance |
US6406605B1 (en) | 1999-06-01 | 2002-06-18 | Ysi Incorporated | Electroosmotic flow controlled microfluidic devices |
US6096656A (en) | 1999-06-24 | 2000-08-01 | Sandia Corporation | Formation of microchannels from low-temperature plasma-deposited silicon oxynitride |
US6234240B1 (en) | 1999-07-01 | 2001-05-22 | Kioan Cheon | Fanless cooling system for computer |
US6131650A (en) | 1999-07-20 | 2000-10-17 | Thermal Corp. | Fluid cooled single phase heat sink |
US6396706B1 (en) | 1999-07-30 | 2002-05-28 | Credence Systems Corporation | Self-heating circuit board |
US6457515B1 (en) | 1999-08-06 | 2002-10-01 | The Ohio State University | Two-layered micro channel heat sink, devices and systems incorporating same |
JP3518434B2 (ja) * | 1999-08-11 | 2004-04-12 | 株式会社日立製作所 | マルチチップモジュールの冷却装置 |
US6360814B1 (en) * | 1999-08-31 | 2002-03-26 | Denso Corporation | Cooling device boiling and condensing refrigerant |
US6216343B1 (en) * | 1999-09-02 | 2001-04-17 | The United States Of America As Represented By The Secretary Of The Air Force | Method of making micro channel heat pipe having corrugated fin elements |
US6293333B1 (en) | 1999-09-02 | 2001-09-25 | The United States Of America As Represented By The Secretary Of The Air Force | Micro channel heat pipe having wire cloth wick and method of fabrication |
US6210986B1 (en) * | 1999-09-23 | 2001-04-03 | Sandia Corporation | Microfluidic channel fabrication method |
JP2001110956A (ja) * | 1999-10-04 | 2001-04-20 | Matsushita Electric Ind Co Ltd | 電子部品用の冷却機器 |
US6544662B2 (en) * | 1999-10-25 | 2003-04-08 | Alliedsignal Inc. | Process for manufacturing of brazed multi-channeled structures |
KR100338810B1 (ko) | 1999-11-08 | 2002-05-31 | 윤종용 | 냉각장치 |
US6166907A (en) | 1999-11-26 | 2000-12-26 | Chien; Chuan-Fu | CPU cooling system |
US7630198B2 (en) * | 2006-03-08 | 2009-12-08 | Cray Inc. | Multi-stage air movers for cooling computer systems and for other uses |
US6729383B1 (en) | 1999-12-16 | 2004-05-04 | The United States Of America As Represented By The Secretary Of The Navy | Fluid-cooled heat sink with turbulence-enhancing support pins |
US6324075B1 (en) | 1999-12-20 | 2001-11-27 | Intel Corporation | Partially covered motherboard with EMI partition gateway |
US6570764B2 (en) | 1999-12-29 | 2003-05-27 | Intel Corporation | Low thermal resistance interface for attachment of thermal materials to a processor die |
US6272012B1 (en) | 2000-02-03 | 2001-08-07 | Crystal Group Inc. | System and method for cooling compact PCI circuit cards in a computer |
US6415860B1 (en) | 2000-02-09 | 2002-07-09 | Board Of Supervisors Of Louisiana State University And Agricultural And Mechanical College | Crossflow micro heat exchanger |
US6337794B1 (en) * | 2000-02-11 | 2002-01-08 | International Business Machines Corporation | Isothermal heat sink with tiered cooling channels |
US6253835B1 (en) | 2000-02-11 | 2001-07-03 | International Business Machines Corporation | Isothermal heat sink with converging, diverging channels |
EP1123739B1 (en) | 2000-02-11 | 2006-11-29 | STMicroelectronics S.r.l. | Integrated device for microfluid thermoregulation, and manufacturing process thereof |
US6301109B1 (en) | 2000-02-11 | 2001-10-09 | International Business Machines Corporation | Isothermal heat sink with cross-flow openings between channels |
DE10008383A1 (de) * | 2000-02-23 | 2001-09-06 | Loh Kg Rittal Werk | Schaltschrank oder Gehäuse mit einer Klimatisierungseinrichtung |
US6417060B2 (en) | 2000-02-25 | 2002-07-09 | Borealis Technical Limited | Method for making a diode device |
US6761211B2 (en) | 2000-03-14 | 2004-07-13 | Delphi Technologies, Inc. | High-performance heat sink for electronics cooling |
WO2001072099A2 (en) | 2000-03-21 | 2001-09-27 | Liebert Corporation | Method and apparatus for cooling electronic enclosures |
US6347036B1 (en) * | 2000-03-29 | 2002-02-12 | Dell Products L.P. | Apparatus and method for mounting a heat generating component in a computer system |
US6366467B1 (en) * | 2000-03-31 | 2002-04-02 | Intel Corporation | Dual-socket interposer and method of fabrication therefor |
US6508301B2 (en) * | 2000-04-19 | 2003-01-21 | Thermal Form & Function | Cold plate utilizing fin with evaporating refrigerant |
JP2002028775A (ja) | 2000-05-10 | 2002-01-29 | Denso Corp | 耐腐食性熱交換器の製造方法 |
JP2001326311A (ja) | 2000-05-15 | 2001-11-22 | Hitachi Ltd | 電子機器の冷却装置 |
US6407916B1 (en) | 2000-06-12 | 2002-06-18 | Intel Corporation | Computer assembly for cooling high powered microprocessors |
US6787052B1 (en) * | 2000-06-19 | 2004-09-07 | Vladimir Vaganov | Method for fabricating microstructures with deep anisotropic etching of thick silicon wafers |
TW449040U (en) | 2000-06-20 | 2001-08-01 | Advanced Thermal Technologies | Improved structure of planar heat tube |
US6366462B1 (en) | 2000-07-18 | 2002-04-02 | International Business Machines Corporation | Electronic module with integral refrigerant evaporator assembly and control system therefore |
US6459582B1 (en) | 2000-07-19 | 2002-10-01 | Fujitsu Limited | Heatsink apparatus for de-coupling clamping forces on an integrated circuit package |
US6915648B2 (en) | 2000-09-14 | 2005-07-12 | Xdx Inc. | Vapor compression systems, expansion devices, flow-regulating members, and vehicles, and methods for using vapor compression systems |
US6317326B1 (en) | 2000-09-14 | 2001-11-13 | Sun Microsystems, Inc. | Integrated circuit device package and heat dissipation device |
JP2002099356A (ja) * | 2000-09-21 | 2002-04-05 | Toshiba Corp | 電子機器用冷却装置および電子機器 |
US6388317B1 (en) | 2000-09-25 | 2002-05-14 | Lockheed Martin Corporation | Solid-state chip cooling by use of microchannel coolant flow |
US6469893B1 (en) | 2000-09-29 | 2002-10-22 | Intel Corporation | Direct heatpipe attachment to die using center point loading |
US6324058B1 (en) | 2000-10-25 | 2001-11-27 | Chieh-Jen Hsiao | Heat-dissipating apparatus for an integrated circuit device |
US6537437B1 (en) * | 2000-11-13 | 2003-03-25 | Sandia Corporation | Surface-micromachined microfluidic devices |
US6367544B1 (en) * | 2000-11-21 | 2002-04-09 | Thermal Corp. | Thermal jacket for reducing condensation and method for making same |
US6578626B1 (en) | 2000-11-21 | 2003-06-17 | Thermal Corp. | Liquid cooled heat exchanger with enhanced flow |
US6437981B1 (en) | 2000-11-30 | 2002-08-20 | Harris Corporation | Thermally enhanced microcircuit package and method of forming same |
US6367543B1 (en) | 2000-12-11 | 2002-04-09 | Thermal Corp. | Liquid-cooled heat sink with thermal jacket |
US6459581B1 (en) | 2000-12-19 | 2002-10-01 | Harris Corporation | Electronic device using evaporative micro-cooling and associated methods |
JP3607608B2 (ja) * | 2000-12-19 | 2005-01-05 | 株式会社日立製作所 | ノート型パソコンの液冷システム |
JP2002188876A (ja) | 2000-12-20 | 2002-07-05 | Hitachi Ltd | 液冷システムおよびこれを用いたパーソナルコンピュータ |
US6431260B1 (en) * | 2000-12-21 | 2002-08-13 | International Business Machines Corporation | Cavity plate and jet nozzle assemblies for use in cooling an electronic module, and methods of fabrication thereof |
CA2329408C (en) * | 2000-12-21 | 2007-12-04 | Long Manufacturing Ltd. | Finned plate heat exchanger |
US6698924B2 (en) | 2000-12-21 | 2004-03-02 | Tank, Inc. | Cooling system comprising a circular venturi |
US6930737B2 (en) | 2001-01-16 | 2005-08-16 | Visteon Global Technologies, Inc. | LED backlighting system |
US6424531B1 (en) | 2001-03-13 | 2002-07-23 | Delphi Technologies, Inc. | High performance heat sink for electronics cooling |
US20020134543A1 (en) | 2001-03-20 | 2002-09-26 | Motorola, Inc | Connecting device with local heating element and method for using same |
US6600220B2 (en) | 2001-05-14 | 2003-07-29 | Hewlett-Packard Company | Power distribution in multi-chip modules |
US7177931B2 (en) * | 2001-05-31 | 2007-02-13 | Yahoo! Inc. | Centralized feed manager |
US7462852B2 (en) | 2001-12-17 | 2008-12-09 | Tecomet, Inc. | Devices, methods, and systems involving cast collimators |
US6449162B1 (en) | 2001-06-07 | 2002-09-10 | International Business Machines Corporation | Removable land grid array cooling solution |
WO2002102124A2 (en) | 2001-06-12 | 2002-12-19 | Liebert Corporation | Single or dual buss thermal transfer system |
US6519151B2 (en) * | 2001-06-27 | 2003-02-11 | International Business Machines Corporation | Conic-sectioned plate and jet nozzle assembly for use in cooling an electronic module, and methods of fabrication thereof |
US6385044B1 (en) | 2001-07-27 | 2002-05-07 | International Business Machines Corporation | Heat pipe heat sink assembly for cooling semiconductor chips |
AU2001285013A1 (en) | 2001-08-17 | 2003-03-03 | Honeywell International Inc. | Thermal transfer devices using heat pipes |
DE10141525B4 (de) | 2001-08-24 | 2009-12-31 | ZAE Bayern Bayerisches Zentrum für angewandte Energieforschung eV | Stoff- und Wärmeaustauschreaktor |
US6438984B1 (en) | 2001-08-29 | 2002-08-27 | Sun Microsystems, Inc. | Refrigerant-cooled system and method for cooling electronic components |
US6587343B2 (en) | 2001-08-29 | 2003-07-01 | Sun Microsystems, Inc. | Water-cooled system and method for cooling electronic components |
JP3636118B2 (ja) | 2001-09-04 | 2005-04-06 | 株式会社日立製作所 | 電子装置用の水冷装置 |
US6981543B2 (en) * | 2001-09-20 | 2006-01-03 | Intel Corporation | Modular capillary pumped loop cooling system |
TW516810U (en) | 2001-09-27 | 2003-01-01 | Hoya Tech Co Ltd | Fastening device for heat sink |
US6942018B2 (en) * | 2001-09-28 | 2005-09-13 | The Board Of Trustees Of The Leland Stanford Junior University | Electroosmotic microchannel cooling system |
US6449157B1 (en) | 2001-10-03 | 2002-09-10 | Ho Kang Chu | IC package assembly with retention mechanism |
US20030205363A1 (en) | 2001-11-09 | 2003-11-06 | International Business Machines Corporation | Enhanced air cooling of electronic devices using fluid phase change heat transfer |
US6581388B2 (en) | 2001-11-27 | 2003-06-24 | Sun Microsystems, Inc. | Active temperature gradient reducer |
DE20119352U1 (de) * | 2001-11-28 | 2002-03-14 | Festo Ag & Co | Anschlussstück, Fluidleitung und fluidtechnische Einrichtung |
US6477045B1 (en) | 2001-12-28 | 2002-11-05 | Tien-Lai Wang | Heat dissipater for a central processing unit |
US6700785B2 (en) * | 2002-01-04 | 2004-03-02 | Intel Corporation | Computer system which locks a server unit subassembly in a selected position in a support frame |
US6836407B2 (en) * | 2002-01-04 | 2004-12-28 | Intel Corporation | Computer system having a plurality of server units transferring heat to a fluid flowing through a frame-level fluid-channeling structure |
US6679315B2 (en) * | 2002-01-14 | 2004-01-20 | Marconi Communications, Inc. | Small scale chip cooler assembly |
US6606251B1 (en) | 2002-02-07 | 2003-08-12 | Cooligy Inc. | Power conditioning module |
JP3961843B2 (ja) | 2002-02-08 | 2007-08-22 | 株式会社日立製作所 | 液体冷却システムを有する小型電子計算機 |
JP4195392B2 (ja) * | 2002-02-26 | 2008-12-10 | ミクロス・マニュファクチュアリング・インコーポレーテッド | 毛管蒸発器 |
US6591625B1 (en) | 2002-04-17 | 2003-07-15 | Agilent Technologies, Inc. | Cooling of substrate-supported heat-generating components |
TWI234063B (en) | 2002-05-15 | 2005-06-11 | Matsushita Electric Ind Co Ltd | Cooling apparatus for electronic equipment |
CN1464357A (zh) * | 2002-06-19 | 2003-12-31 | 谢佐昌 | 一种可携式低温冷却液循环机 |
US6674642B1 (en) * | 2002-06-27 | 2004-01-06 | International Business Machines Corporation | Liquid-to-air cooling system for portable electronic and computer devices |
US6988534B2 (en) | 2002-11-01 | 2006-01-24 | Cooligy, Inc. | Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device |
US6588498B1 (en) | 2002-07-18 | 2003-07-08 | Delphi Technologies, Inc. | Thermosiphon for electronics cooling with high performance boiling and condensing surfaces |
US20040020225A1 (en) * | 2002-08-02 | 2004-02-05 | Patel Chandrakant D. | Cooling system |
US7420807B2 (en) * | 2002-08-16 | 2008-09-02 | Nec Corporation | Cooling device for electronic apparatus |
US6836131B2 (en) | 2002-08-16 | 2004-12-28 | Credence Systems Corp. | Spray cooling and transparent cooling plate thermal management system |
JP3641258B2 (ja) | 2002-08-26 | 2005-04-20 | 株式会社東芝 | 電子機器 |
US6963031B2 (en) * | 2002-08-28 | 2005-11-08 | Federal -Mogul World Wide, Inc. | Sleeve assembly for receiving elongated items within a duct |
TW578992U (en) * | 2002-09-09 | 2004-03-01 | Hon Hai Prec Ind Co Ltd | Heat sink assembly |
US6714412B1 (en) * | 2002-09-13 | 2004-03-30 | International Business Machines Corporation | Scalable coolant conditioning unit with integral plate heat exchanger/expansion tank and method of use |
US6894899B2 (en) * | 2002-09-13 | 2005-05-17 | Hong Kong Cheung Tat Electrical Co. Ltd. | Integrated fluid cooling system for electronic components |
US6881039B2 (en) * | 2002-09-23 | 2005-04-19 | Cooligy, Inc. | Micro-fabricated electrokinetic pump |
AU2003270882A1 (en) * | 2002-09-23 | 2004-05-04 | Cooligy, Inc. | Micro-fabricated electrokinetic pump with on-frit electrode |
US6807056B2 (en) * | 2002-09-24 | 2004-10-19 | Hitachi, Ltd. | Electronic equipment |
DE10246990A1 (de) * | 2002-10-02 | 2004-04-22 | Atotech Deutschland Gmbh | Mikrostrukturkühler und dessen Verwendung |
US6994151B2 (en) * | 2002-10-22 | 2006-02-07 | Cooligy, Inc. | Vapor escape microchannel heat exchanger |
US6986382B2 (en) | 2002-11-01 | 2006-01-17 | Cooligy Inc. | Interwoven manifolds for pressure drop reduction in microchannel heat exchangers |
US7000684B2 (en) | 2002-11-01 | 2006-02-21 | Cooligy, Inc. | Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device |
US20050211427A1 (en) | 2002-11-01 | 2005-09-29 | Cooligy, Inc. | Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device |
AU2003286855A1 (en) * | 2002-11-01 | 2004-06-07 | Cooligy, Inc. | Method and apparatus for achieving temperature uniformity and hot spot cooling in a heat producing device |
JP2006522463A (ja) | 2002-11-01 | 2006-09-28 | クーリギー インコーポレイテッド | 流体により冷却される超小型熱交換のための最適なスプレッダシステム、装置及び方法 |
US7156159B2 (en) | 2003-03-17 | 2007-01-02 | Cooligy, Inc. | Multi-level microchannel heat exchangers |
US6889515B2 (en) | 2002-11-12 | 2005-05-10 | Isothermal Systems Research, Inc. | Spray cooling system |
US6775137B2 (en) * | 2002-11-25 | 2004-08-10 | International Business Machines Corporation | Method and apparatus for combined air and liquid cooling of stacked electronics components |
US7210227B2 (en) | 2002-11-26 | 2007-05-01 | Intel Corporation | Decreasing thermal contact resistance at a material interface |
US6809928B2 (en) | 2002-12-27 | 2004-10-26 | Intel Corporation | Sealed and pressurized liquid cooling system for microprocessor |
KR20040065626A (ko) | 2003-01-15 | 2004-07-23 | 엘지전자 주식회사 | 열 교환기 |
US7205675B2 (en) | 2003-01-29 | 2007-04-17 | Hewlett-Packard Development Company, L.P. | Micro-fabricated device with thermoelectric device and method of making |
US7044196B2 (en) | 2003-01-31 | 2006-05-16 | Cooligy,Inc | Decoupled spring-loaded mounting apparatus and method of manufacturing thereof |
US7090001B2 (en) * | 2003-01-31 | 2006-08-15 | Cooligy, Inc. | Optimized multiple heat pipe blocks for electronics cooling |
US7201012B2 (en) | 2003-01-31 | 2007-04-10 | Cooligy, Inc. | Remedies to prevent cracking in a liquid system |
US7293423B2 (en) | 2004-06-04 | 2007-11-13 | Cooligy Inc. | Method and apparatus for controlling freezing nucleation and propagation |
US6798660B2 (en) | 2003-02-13 | 2004-09-28 | Dell Products L.P. | Liquid cooling module |
JP4199018B2 (ja) | 2003-02-14 | 2008-12-17 | 株式会社日立製作所 | ラックマウントサーバシステム |
US7017654B2 (en) * | 2003-03-17 | 2006-03-28 | Cooligy, Inc. | Apparatus and method of forming channels in a heat-exchanging device |
US6992891B2 (en) * | 2003-04-02 | 2006-01-31 | Intel Corporation | Metal ball attachment of heat dissipation devices |
US7112131B2 (en) | 2003-05-13 | 2006-09-26 | American Power Conversion Corporation | Rack enclosure |
TW587782U (en) * | 2003-06-13 | 2004-05-11 | Hon Hai Prec Ind Co Ltd | Ventilation device for computer system |
US6763880B1 (en) | 2003-06-26 | 2004-07-20 | Evserv Tech Corporation | Liquid cooled radiation module for servers |
CN100579348C (zh) | 2003-06-27 | 2010-01-06 | 日本电气株式会社 | 电子设备的冷却装置 |
US6819563B1 (en) * | 2003-07-02 | 2004-11-16 | International Business Machines Corporation | Method and system for cooling electronics racks using pre-cooled air |
US7021369B2 (en) * | 2003-07-23 | 2006-04-04 | Cooligy, Inc. | Hermetic closed loop fluid system |
US20050049692A1 (en) * | 2003-09-02 | 2005-03-03 | Numamoto Michael J. | Medical device for reduction of pressure effects of cardiac tricuspid valve regurgitation |
US20050061013A1 (en) * | 2003-09-10 | 2005-03-24 | Bond Richard C. | Method and apparatus for cooling devices that in use generate unwanted heat |
JP4157451B2 (ja) | 2003-09-30 | 2008-10-01 | 株式会社東芝 | 気液分離機構、リザーブタンク、及び電子機器 |
TWM248227U (en) * | 2003-10-17 | 2004-10-21 | Hon Hai Prec Ind Co Ltd | Liquid cooling apparatus |
US7273088B2 (en) | 2003-12-17 | 2007-09-25 | Hewlett-Packard Development Company, L.P. | One or more heat exchanger components in major part operably locatable outside computer chassis |
US7295444B1 (en) * | 2003-12-31 | 2007-11-13 | Ncr Corporation | Delivering chilled air to components in a hardware cabinet |
US6896612B1 (en) * | 2004-01-26 | 2005-05-24 | Sun Microsystems, Inc. | Self-cooled electronic equipment enclosure with failure tolerant cooling system and method of operation |
US6980435B2 (en) * | 2004-01-28 | 2005-12-27 | Hewlett-Packard Development Company, L.P. | Modular electronic enclosure with cooling design |
TWI243429B (en) * | 2004-02-05 | 2005-11-11 | Au Optronics Corp | Thin film transistor array substrate and repairing method of the same |
US7018169B2 (en) * | 2004-02-23 | 2006-03-28 | General Electric Company | Fluid flow control apparatus |
WO2005080901A1 (en) | 2004-02-24 | 2005-09-01 | Spec Co., Ltd | Micro heat exchanger for fuel cell and manufacturing method thereof |
US20050257532A1 (en) | 2004-03-11 | 2005-11-24 | Masami Ikeda | Module for cooling semiconductor device |
US7359197B2 (en) | 2004-04-12 | 2008-04-15 | Nvidia Corporation | System for efficiently cooling a processor |
US6955212B1 (en) | 2004-04-20 | 2005-10-18 | Adda Corporation | Water-cooler radiator module |
JP4234635B2 (ja) * | 2004-04-28 | 2009-03-04 | 株式会社東芝 | 電子機器 |
US7325588B2 (en) * | 2004-04-29 | 2008-02-05 | Hewlett-Packard Development Company, L.P. | High serviceability liquid cooling loop using flexible bellows |
US7011143B2 (en) | 2004-05-04 | 2006-03-14 | International Business Machines Corporation | Method and apparatus for cooling electronic components |
US7248472B2 (en) | 2004-05-21 | 2007-07-24 | Hewlett-Packard Development Company, L.P. | Air distribution system |
US7382613B2 (en) | 2004-05-21 | 2008-06-03 | Hewlett-Packard Development Company, L.P. | Computer system with external air mover |
US7301773B2 (en) * | 2004-06-04 | 2007-11-27 | Cooligy Inc. | Semi-compliant joining mechanism for semiconductor cooling applications |
US7188662B2 (en) | 2004-06-04 | 2007-03-13 | Cooligy, Inc. | Apparatus and method of efficient fluid delivery for cooling a heat producing device |
JP4056504B2 (ja) * | 2004-08-18 | 2008-03-05 | Necディスプレイソリューションズ株式会社 | 冷却装置及びこれを備えた電子機器 |
US7344636B2 (en) * | 2004-08-26 | 2008-03-18 | Hydro International Plc | Separator |
US7239516B2 (en) * | 2004-09-10 | 2007-07-03 | International Business Machines Corporation | Flexure plate for maintaining contact between a cooling plate/heat sink and a microchip |
US7243704B2 (en) | 2004-11-18 | 2007-07-17 | Delta Design, Inc. | Mechanical assembly for regulating the temperature of an electronic device, having a spring with one slideable end |
US6973801B1 (en) * | 2004-12-09 | 2005-12-13 | International Business Machines Corporation | Cooling system and method employing a closed loop coolant path and micro-scaled cooling structure within an electronics subsystem of an electronics rack |
US7327570B2 (en) | 2004-12-22 | 2008-02-05 | Hewlett-Packard Development Company, L.P. | Fluid cooled integrated circuit module |
US7143820B2 (en) | 2004-12-31 | 2006-12-05 | Intel Corporation | Systems for improved heat exchanger |
US7124811B2 (en) | 2004-12-31 | 2006-10-24 | Intel Corporation | Systems for integrated pump and cold plate |
US7280363B2 (en) | 2005-01-21 | 2007-10-09 | Delphi Technologies, Inc. | Apparatus for controlling thermal interface between cold plate and integrated circuit chip |
DE102005005296B3 (de) * | 2005-02-04 | 2006-05-18 | Knürr AG | Anordnung zur Kühlung von elektronischen Moduleinheiten in Geräte- und Netzwerkschränken |
US20060187639A1 (en) | 2005-02-23 | 2006-08-24 | Lytron, Inc. | Electronic component cooling and interface system |
US7385810B2 (en) | 2005-04-18 | 2008-06-10 | International Business Machines Corporation | Apparatus and method for facilitating cooling of an electronics rack employing a heat exchange assembly mounted to an outlet door cover of the electronics rack |
US7871578B2 (en) * | 2005-05-02 | 2011-01-18 | United Technologies Corporation | Micro heat exchanger with thermally conductive porous network |
US7342789B2 (en) * | 2005-06-30 | 2008-03-11 | International Business Machines Corporation | Method and apparatus for cooling an equipment enclosure through closed-loop, liquid-assisted air cooling in combination with direct liquid cooling |
DE102005033150A1 (de) | 2005-07-13 | 2007-01-25 | Atotech Deutschland Gmbh | Mikrostrukturierter Kühler und dessen Verwendung |
US7719837B2 (en) * | 2005-08-22 | 2010-05-18 | Shan Ping Wu | Method and apparatus for cooling a blade server |
US7434412B1 (en) * | 2005-10-27 | 2008-10-14 | Sun Microsystems, Inc. | Computer equipment temperature control system and methods for operating the same |
US7420806B1 (en) | 2005-11-22 | 2008-09-02 | Juniper Networks, Inc. | Airflow distribution through an electronic device |
JP2009527897A (ja) * | 2006-02-16 | 2009-07-30 | クーリギー インコーポレイテッド | 冷却システム |
US7355850B2 (en) * | 2006-03-31 | 2008-04-08 | National Instruments Corporation | Vented and ducted sub-rack support member |
US20070251938A1 (en) | 2006-04-26 | 2007-11-01 | Watlow Electric Manufacturing Company | Ceramic heater and method of securing a thermocouple thereto |
US20070297136A1 (en) | 2006-06-23 | 2007-12-27 | Sun Micosystems, Inc. | Modular liquid cooling of electronic components while preserving data center integrity |
JP2008016137A (ja) * | 2006-07-07 | 2008-01-24 | Hitachi Ltd | ディスクアレイ装置 |
US20080013283A1 (en) * | 2006-07-17 | 2008-01-17 | Gilbert Gary L | Mechanism for cooling electronic components |
WO2008011458A1 (en) * | 2006-07-18 | 2008-01-24 | Liebert Corporation | Integral swivel hydraulic connectors, door hinges, and methods and systems for the use thereof |
US7447026B2 (en) * | 2006-08-31 | 2008-11-04 | Hewlett-Packard Development Company, L.P. | System for hot swapping heat exchangers |
US8395896B2 (en) * | 2007-02-24 | 2013-03-12 | Hewlett-Packard Development Company, L.P. | Redundant cooling systems and methods |
US7430118B1 (en) * | 2007-06-04 | 2008-09-30 | Yahoo! Inc. | Cold row encapsulation for server farm cooling system |
-
2008
- 2008-08-06 TW TW097129957A patent/TW200912621A/zh unknown
- 2008-08-06 TW TW097129958A patent/TW200934352A/zh unknown
- 2008-08-06 TW TW097129959A patent/TW200924625A/zh unknown
- 2008-08-07 WO PCT/US2008/009644 patent/WO2009020669A1/en active Application Filing
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- 2008-08-07 US US12/228,053 patent/US20090046430A1/en not_active Abandoned
- 2008-08-07 WO PCT/US2008/009602 patent/WO2009020664A1/en active Application Filing
- 2008-08-07 WO PCT/US2008/009643 patent/WO2009020668A1/en active Application Filing
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US20090046430A1 (en) | 2009-02-19 |
CN101803488B (zh) | 2012-09-05 |
CN101803487A (zh) | 2010-08-11 |
CN101803488A (zh) | 2010-08-11 |
WO2009020664A1 (en) | 2009-02-12 |
WO2009020668A1 (en) | 2009-02-12 |
CN101803487B (zh) | 2012-08-22 |
WO2009020669A1 (en) | 2009-02-12 |
US7746634B2 (en) | 2010-06-29 |
TW200924625A (en) | 2009-06-01 |
US7660117B2 (en) | 2010-02-09 |
US20090046429A1 (en) | 2009-02-19 |
CN101861501A (zh) | 2010-10-13 |
TW200934352A (en) | 2009-08-01 |
CN101861501B (zh) | 2013-05-08 |
US20090046423A1 (en) | 2009-02-19 |
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