TW200900816A - Hardening resin composition for liquid crystal sealing and manufacturing method for liquid crystal display panel using the same - Google Patents

Hardening resin composition for liquid crystal sealing and manufacturing method for liquid crystal display panel using the same Download PDF

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TW200900816A
TW200900816A TW097105893A TW97105893A TW200900816A TW 200900816 A TW200900816 A TW 200900816A TW 097105893 A TW097105893 A TW 097105893A TW 97105893 A TW97105893 A TW 97105893A TW 200900816 A TW200900816 A TW 200900816A
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liquid crystal
resin
crystal sealing
resin composition
group
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TW097105893A
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Chinese (zh)
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TWI420205B (en
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Yasushi Mizuta
Kenichi Nakamura
Toshikazu Gomi
Hiroaki Otsuka
Takahisa Miyawaki
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Mitsui Chemicals Inc
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04Homopolymers or copolymers of esters
    • C09J133/06Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/062Copolymers with monomers not covered by C09J133/06
    • C09J133/068Copolymers with monomers not covered by C09J133/06 containing glycidyl groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32Epoxy compounds containing three or more epoxy groups
    • C08G59/3209Epoxy compounds containing three or more epoxy groups obtained by polymerisation of unsaturated mono-epoxy compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04Homopolymers or copolymers of esters
    • C08L33/06Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C08L33/062Copolymers with monomers not covered by C08L33/06
    • C08L33/068Copolymers with monomers not covered by C08L33/06 containing glycidyl groups
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2190/00Compositions for sealing or packing joints
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/04Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04Homopolymers or copolymers of esters
    • C08L33/06Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C08L33/062Copolymers with monomers not covered by C08L33/06
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04Homopolymers or copolymers of esters
    • C08L33/06Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C08L33/08Homopolymers or copolymers of acrylic acid esters
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1341Filling or closing of cells
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2202/00Materials and properties
    • G02F2202/02Materials and properties organic material
    • G02F2202/022Materials and properties organic material polymeric
    • G02F2202/023Materials and properties organic material polymeric curable
    • G02F2202/025Materials and properties organic material polymeric curable thermocurable

Abstract

This invention relates to a hardening resin composition for liquid crystal sealing which can become an liquid crystal seal agent. The hardening resin composition for liquid crystal sealing includes a acrylic acid resin and/or a (meth)acrylic denaturation epoxy resin having at least one epoxy group and one (meth)acrylic group in one molecule, a heat radical polymerization initiator and a filler, which is characterized by that the viscosity measured by an E type viscometer at 25 degrees Celsius and in 1. 0rpm is 50-500Pa*s and the viscosity measured by an E type viscometer at 80 degrees Celsius and in 1. 0rpm is more than 500Pa*s. Because the cure rate of the hardening resin composition for liquid crystal sealing is fast, the leak of the liquid crystal and the pollution of the liquid crystal can be controlled. Therefore, high quality liquid crystal display panels can be produced with high productivity be using the liquid crystal seal agent which consists of the hardening resin composition for liquid crystal sealing.

Description

200900816 九、發明說明: 【發明所屬之技術領域】 用其用硬化性樹脂組成物及使 【先前技術】 ^ 近年來,液晶顯示面板由於呈200900816 IX. Description of the invention: [Technical field to which the invention pertains] The use of a curable resin composition and the use thereof [Prior Art] ^ In recent years, liquid crystal display panels have been

:特:7乏用作以行動電話為代表的各』電子:ΐ: =====裝置:其具有以液晶密 變,從而顯示圖像。】夜日日配向’调即透射光的調 液晶顯不面板例如可藉由如下所示的液晶注入技術而 衣造。關於液晶注人技術,首纽2塊基板中的任一塊上 塗佈液晶密封劑而形成框’之後再藉由預硬化處理使此框 狀的液晶密封劑乾燥。此處,框的—部分上預先設置有成 為液晶注入口的切口部。接著,將2塊基板對向重疊後, 對其進行熱壓,藉此使基板彼此接著在一起。藉此,於2 魏基板之間形成用於封入液晶的單元。並且’於真空下將 液晶自液晶注入口注入至空的單元内,之後利用液晶密封 劑等對液晶注入口進行密封,藉此來製造液晶顯示面板。 液晶注入技術用液晶密封劑,例如提出有以環氧樹脂 作為主要成分的熱硬化性液晶密封劑(以下,簡稱為熱硬 化性密封劑)(例如,參照國際公開第2004/039885號手 冊)。 6 200900816 27285pif 但是,近年來,隨著電子機器的小型、薄型、高晝質 化等,對液晶顯示面板的需求正顯著增加。因此,於液晶 顯示面板的製造領域中,業者強烈期望提高生產性,包括 製品的高品質化或縮短製造時間等在内。然而,上述液晶 注入技術中’由於液晶的注入時間長、以及為了使熱硬化 性密封劑硬化而必須在120〜15(TC的溫度下加熱處理數 小時等原因,故認為其存在生產性低的問題。 針對上述情況,近期,液晶滴入技術正作為可提高生 產性的液晶顯示面板之製造方法而受到矚目。液晶滴入技 術通常由以下步驟所構成。首先,藉由分注器(disp enser ) 或網版印刷(screen printing )等’於構成液晶顯示面板的 2塊基板中的任一塊上塗佈液晶密封劑,而形成填充液晶 的框。接著,於此框内滴入適量的液晶後,於高度真空下 經由未硬化狀態的液晶密封劑而將2塊基板重疊。並且, 使經重疊的2塊基板恢復至大氣壓下,使基板彼此相貼 合,之後使液晶密封劑硬化,藉此來製造於2塊基板之間 封入有液晶的液晶顯示面板。此外,於本發明中,將利用 液晶密封劑所製作的框稱為密封部或密封圖案。 另外,於液晶滴入技術中,為了縮短液晶密封劑的硬 化時間等目的而採用有如下方法:使用光及熱硬化性液晶 密封劑,對液晶密封劑照射紫外線等而使液晶密封劑暫時 硬化,之後藉由加熱來進行後硬化(例如,參照曰本專利 特開200M33794號公報、日本專利特開2〇〇2_214626號 公報)。若利用此液晶滴入技術,則與先前的液晶注入技術u 7 200900816 相比,可於更短的時間内將液晶密封於基板之間,且縮短 液晶密封劑的硬化時間,從而提高生產性,因此,近期上 述液晶滴入技術逐漸成為液晶顯示面板之製造方法的主 流。 但疋’隨著安裝於行動電話上的小型面板的配線日趨 複雜’造成密封圖案與配線等相互重疊,密封圖案上容易 產生光無法直接照射到的遮光部分。然而,於遮光部分由 於液晶岔封劑的硬化並不充分,故而藉由加熱進行後硬化 時,液晶會侵入密封圖案,導致如下情況大量發生:密封 圖案變形、或液晶透過密封圖案而產生洩漏的液晶洩漏。 若液晶產生洩漏,則液晶顯示面板的顯示特性會顯著下 降’而產生大問題。 並且,若液晶與未硬化狀態的液晶密封劑相接觸,則 =硬化的液晶密封劑會滲人至液晶中,容易對液晶造成污 染,液晶污染亦會導致液晶顯示面板的顯示特性顯著降 t因此’ #界期望提出—種可抑制液的漏或液晶污染 的液晶密封劑。: Special: 7 is used as each of the "electronics" represented by a mobile phone: ΐ: ===== Device: It has a liquid crystal density to display an image. 】 夜 夜 调 调 调 调 调 调 调 调 调 调 调 调 调 调 调 调 调 调 调 调 调 调 调 调 调 调 调 调 调 调 调In the liquid crystal injection technique, a liquid crystal sealing agent is applied onto any of the two substrates of the first base to form a frame, and then the frame-shaped liquid crystal sealing agent is dried by a pre-hardening treatment. Here, a cutout portion which becomes a liquid crystal injection port is previously provided on the portion of the frame. Next, after the two substrates are opposed to each other, they are hot-pressed, whereby the substrates are brought together. Thereby, a unit for enclosing the liquid crystal is formed between the two substrates. Then, the liquid crystal is injected into the empty cell from the liquid crystal injection port under vacuum, and then the liquid crystal injection port is sealed with a liquid crystal sealing agent or the like to thereby manufacture a liquid crystal display panel. For the liquid crystal sealing agent for liquid crystal injection, for example, a thermosetting liquid crystal sealing agent containing an epoxy resin as a main component (hereinafter, simply referred to as a thermosetting sealing agent) has been proposed (for example, refer to International Publication No. 2004/039885). 6 200900816 27285pif However, in recent years, with the small size, thinness, and high quality of electronic equipment, the demand for liquid crystal display panels has increased remarkably. Therefore, in the field of manufacturing liquid crystal display panels, there is a strong desire for improvement in productivity, including high quality of products or shortened manufacturing time. However, in the above liquid crystal injection technique, it is considered to have a low productivity due to the long injection time of the liquid crystal and the necessity of heat treatment at 120 to 15 (temperature of TC for several hours) in order to cure the thermosetting sealant. In view of the above, liquid crystal dropping technology has recently attracted attention as a manufacturing method of a liquid crystal display panel which can improve productivity. Liquid crystal dropping technology generally consists of the following steps. First, by a dispenser (dispenser) Or screen printing or the like, applying a liquid crystal sealing agent to any one of the two substrates constituting the liquid crystal display panel to form a frame filled with liquid crystal. Then, an appropriate amount of liquid crystal is dropped into the frame. Two substrates are superposed under a high vacuum through an uncured liquid crystal sealing agent, and the two substrates that have been overlapped are returned to atmospheric pressure to bond the substrates to each other, and then the liquid crystal sealing agent is cured. A liquid crystal display panel in which liquid crystal is sealed between two substrates is produced. Further, in the present invention, a frame made of a liquid crystal sealing agent is used. In the liquid crystal dropping technique, in order to shorten the curing time of the liquid crystal sealing agent, the liquid crystal sealing agent is irradiated with ultraviolet rays or the like by using a light and a thermosetting liquid crystal sealing agent. The liquid crystal sealing agent is temporarily hardened, and then post-hardened by heating (for example, refer to Japanese Patent Laid-Open Publication No. JP-A No. Hei. No. Hei. No. Hei. No. 2-214626). Compared with the prior liquid crystal injection technology u 7 200900816, the liquid crystal can be sealed between the substrates in a shorter time, and the hardening time of the liquid crystal sealing agent is shortened, thereby improving productivity. Therefore, the liquid crystal dropping technology has gradually become the recent technology. The mainstream of the manufacturing method of the liquid crystal display panel. However, as the wiring of the small panel mounted on the mobile phone becomes more complicated, the seal pattern and the wiring are overlapped with each other, and the light-shielding portion where the light cannot be directly irradiated is easily generated on the seal pattern. However, since the hardening of the liquid crystal sealing agent is insufficient in the light shielding portion, it is heated by heating. When the post-hardening is performed, the liquid crystal intrudes into the sealing pattern, causing a large amount of occurrence of the following: the sealing pattern is deformed, or the liquid crystal leaks through the sealing pattern to cause leakage of the liquid crystal. If the liquid crystal leaks, the display characteristics of the liquid crystal display panel may significantly decrease. Moreover, if the liquid crystal is in contact with the uncured liquid crystal sealing agent, the hardened liquid crystal sealing agent may infiltrate into the liquid crystal, which may easily cause contamination of the liquid crystal, and liquid crystal contamination may also cause display characteristics of the liquid crystal display panel. Significantly lower t is therefore a 'liquid crystal sealant that can inhibit liquid leakage or liquid crystal contamination.

至今為止’可改善液晶茂漏的液晶密封劑,例如提出 二„示元件用硬化性樹脂組成物,其利用e型黏 疋的於25°C、h〇啊之測定條件下的黏度為200 2〇 PaV:: ’於8〇t、1,0 rPm之測定條件下的黏度為 F八起〜 (例如,參照日本專簡開2_-308811 光專利特開屬初·號公報)。另外,於遮 4可充分硬化的液晶密封劑,例如提出有—種液晶 8 200900816 27285pif 密^,其含有光硬化性樹脂、光自由基聚合起始劑、及 具有雙硫鍵(disulfide bond")的白ά jl力太 u . Γ 、 的自由基鏈轉移劑(radical :伽agentX例如,參照日本專利_屬·48i 就公報)。 另外,於日本專利特開2〇〇5_3〇8813號公 液晶污染抑制在低水平的液晶密封劑,提出有__種i分子 =鍵官能基量大於等於3.5χ1〇、液晶密封用熱硬化In the liquid crystal sealing agent which can improve the liquid crystal leakage, for example, a curable resin composition for a device is proposed, and the viscosity under the measurement condition of 25 ° C and h 疋 using the e-type adhesive is 200 2 . 〇PaV:: 'The viscosity under the measurement conditions of 8〇t, 1,0 rPm is F 八~ (for example, refer to the Japanese Special Edition 2_-308811 Light Patent Special Opening · · ). A liquid crystal sealing agent which can be sufficiently cured, for example, a liquid crystal 8 200900816 27285pif dense, which contains a photocurable resin, a photoradical polymerization initiator, and a chalk having a disulfide bond (disulfide bond). l 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 自由基 自由基 自由基 自由基 自由基 自由基 自由基 自由基 自由基 自由基 自由基 自由基 自由基 自由基 自由基 自由基 自由基 自由基 自由基 自由基 自由基 自由基 自由基 自由基 自由基 自由基 自由基 自由基Low level of liquid crystal sealing agent, proposed to have __ kind of i molecule = bond functional group amount is greater than or equal to 3.5 χ 1 〇, liquid crystal sealing with thermal hardening

处其:^此文獻巾的1分子内的氫鍵官能基量是由氫鍵官 3數仏子量所定義,由於此值大於等於3篇3的樹脂 對^晶的親和性低,故而可降個作液晶密的 巧·染性。 【發明内容】 主然而,近年來隨著資訊量的增加,液晶顯示面板的高 >月=化獲得進—步發展,液晶齡面板上的遮光部分的比 例Ik之增力π。上述各文獻所揭示的先前技術無法充分抑制 加熱硬化時密封部變形、或液晶向密封部洩漏。另外,如 日本專利特開2006_030481號公報所示的利用由光自由基 所產生之高活化能的液晶密封劑,於目前的高清晰化下難 以於不殘留未硬化部分之情況下使液晶密封劑硬化。 了有致減少遮光部分的液晶密封劑未產生硬化之情況 的方法,可考慮如下方法等Μ )考慮光的照射情況來設計 进封圖案;2 )將液晶滴入技術中使液晶密封劑硬化時的紫 外線照射改為加熱。然而,1)的方法會對面板設計產生限 制故而欠佳。另外,自先前以來,由於光硬化性液晶密 9 200900816 封劑會耗費紫外線照射用之設備成本或能源成本 製造成本方面存在問題。另-方面,2)的方法_ 化反應比光魏反應慢,並且於域_職度容易、 低。因此,自先前以來使用熱硬化性樹月旨的液晶密 在難以解決液晶洩漏問題等問題。 …廿 基於上述情況,本發明者等人對耐浅漏性優 ^劑進行了髓研究。其結果魏:1)熱硬化時曰曰曰 拔封劑的黏度、2)與自由基鏈轉移劑或液晶密封劑: ,硬化性餘等所對應的液晶密封細域, = 或耐洩漏性產生影響。 %彳匕性 另外,本發明者等人於上述預備研究中,對日本 :開2〇〇5-遍813號公報中所揭示的液晶密封劑的耐沒漏 ^進订了研究,從㈣瞭其耐$漏性並不充分。於 彳 =;樹脂咖^ 充分。 研% 瞭此密封劑的耐$漏性亦不Where: ^ The amount of hydrogen bond functional groups in one molecule of the document towel is defined by the number of hydrogen bonds of the hydrogen bond, and since the value of the resin is greater than or equal to 3, the resin has a low affinity for the crystal, so it can be lowered. It is a clever and dyeable liquid crystal. SUMMARY OF THE INVENTION However, in recent years, with the increase in the amount of information, the high > month=ization of the liquid crystal display panel has progressed further, and the ratio of the light-shielding portion of the liquid crystal age panel is increased by π. The prior art disclosed in each of the above documents cannot sufficiently suppress deformation of the sealing portion at the time of heat curing or leakage of liquid crystal to the sealing portion. In addition, a liquid crystal sealing agent using a high activation energy generated by photo radicals as shown in Japanese Laid-Open Patent Publication No. 2006-030481 is difficult to make a liquid crystal sealing agent without leaving an uncured portion under the current high definition. hardening. In the case where the liquid crystal sealing agent which reduces the light-shielding portion is not hardened, the following method or the like can be considered, and the sealing pattern is designed in consideration of the irradiation of light; 2) when the liquid crystal sealing agent is hardened by the liquid crystal dropping technique Ultraviolet radiation was changed to heating. However, the method of 1) imposes limitations on the panel design and is therefore poor. In addition, since the photocurable liquid crystal has been used for a long time, there is a problem in terms of equipment cost or energy cost for manufacturing the ultraviolet ray. On the other hand, the method of 2) _ the reaction is slower than the reaction of the light, and it is easy and low in the domain. Therefore, it has been difficult to solve the problem of liquid crystal leakage problems such as the use of the liquid crystal of the thermosetting tree. ... 廿 Based on the above, the inventors of the present invention conducted a marrow study on the shallow leak resistance agent. The result is: 1) the viscosity of the sealing agent during thermosetting, 2) the liquid crystal sealing domain corresponding to the radical chain transfer agent or liquid crystal sealing agent: the remainder of the hardening property, = or leakage resistance influences. In addition, in the above preliminary study, the present inventors have studied the resistance of the liquid crystal sealing agent disclosed in Japanese Patent Publication No. 813, No. 813, from (4) Its resistance to $ leak is not sufficient. Yu 彳 =; resin coffee ^ full. Research% of the sealant's resistance to leakage is not

因#於上鱗題,本發_目的在於提供一種可 抑制液晶沒漏及液晶汚·逃沾、、六曰—I 物、以及使用此液晶密封用硬旨組成 生產性之狀態ί製造高品質板3 =保持高 的組ί發:=ί=Γ:::究,結果著眼於樹脂組成物 明。即,上述課的樹脂組成物的黏度而完成了本發 σ 1用本發明的液晶密封用硬化性樹脂 10 200900816 27285pif 組成物來解決。 士匕π]種液晶密封用硬化性樹脂組成物,其含有丙烯酸 树月曰、及/或(曱基)丙烯酸改質環氧樹脂,其於1分子内具 有各1 1個或1個以上的環氧基及(曱基)丙烯醯基、熱自 ^基聚合起始劑、以及填充料,上述液晶密封用硬化性樹 月旨組成物以E型黏度計所測定的於25。〇、1.0 rpm下的黏 為0 Pa s〜500 Pa.s,且於80°C ' 1_0 rpm下的黏度大 於 500 pa. s。 、[2]如[1]所述之液晶密封用硬化性樹脂組成物,其中上 返填,料的平均一次粒徑(average primary 於等於1.5 ,比表面積(speciflc smface虹⑸)為^ 叻/g二5〇〇m2/g ’且相對於上述丙烯酸樹脂及(甲基)丙烯酸 改質裱氧樹脂的合計100重量份,上述填充料的含量為卫 重置份〜50重量份,由[以E型黏度計所測定的於25〇c、 〇.5 rpm下的黏度]/[以E型黏度計所測定的於25。(:、5.0 rpm 下的黏度]所定義的觸變指數(thix〇tr〇py index)為·丨」〜 5,〇 〇 [3 ]如[1 ]或[2 ]所述之液晶密封用硬化性樹脂組成物, 其中由在一定溫度下使上述熱自由基聚合起始劑進行川 小時熱分解反應時,熱自由基聚合起始劑濃度減少至一半 的溫度所定義的上述熱自由基聚合起始劑之1()小 期溫度為4(TC〜8〇t。 义 [4]一種液晶密封用硬化性樹脂組成物,其含有·· }分 子内具有可進行自由基聚合_•碳雙鍵的自由基硬化: 200900816 樹脂、熱自由基聚合起始劑、自由基鏈轉移劑、及填充料。 [5]如[4]所述之液晶密封用硬化性樹脂組成物,其中上 述自由基鏈轉移劑為硫醇類。 [6]如[4]或[5]所述之液晶密封用硬化性樹脂組成物, 其中作為上述自由基鏈轉移劑之硫醇類是數量平均分子量 為400〜2000的二級硫醇類。In view of the above-mentioned problem, the purpose of the present invention is to provide a state in which the liquid crystal is prevented from leaking, the liquid crystal is smeared, the hexagram-I, and the liquid crystal sealing is used to form a productive state. Plate 3 = group that remains high ί发:=ί=Γ::: The result is focused on the resin composition. That is, the viscosity of the resin composition of the above-mentioned course was completed, and the present invention was solved by the composition of the curable resin for liquid crystal sealing of the present invention 10 200900816 27285pif.匕 匕 ] 种 种 硬化 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶The epoxy group, the (fluorenyl) acrylonitrile group, the thermal self-polymerization initiator, and the filler, and the curable composition for liquid crystal sealing are 25 measured by an E-type viscosity meter. 〇, the viscosity at 1.0 rpm is 0 Pa s~500 Pa.s, and the viscosity at 80 ° C ' 1_0 rpm is greater than 500 pa. s. [2] The curable resin composition for liquid crystal sealing according to [1], wherein the upper primary particle diameter (average primary is equal to 1.5 and the specific surface area (speciflc smface rainbow (5)) is ^ 叻 / g 2 5 〇〇 m 2 /g 'and 100 parts by weight of the total of the acrylic resin and the (meth)acrylic modified epoxy resin, the content of the filler is 〜50 parts by weight of the protective portion, Viscosity at 25 〇c, 〇.5 rpm measured by an E-type viscometer] / [Temperature index defined by an E-type viscometer at 25 ((:, viscosity at 5.0 rpm)]硬化tr〇py index) is a hardenable resin composition for liquid crystal sealing according to [1] or [2], wherein the thermal radical polymerization is carried out at a certain temperature. When the initiator is subjected to a thermal decomposition reaction at a temperature of one hour, the temperature of the thermal radical polymerization initiator is reduced to half, and the temperature of the thermal radical polymerization initiator defined by the above-mentioned thermal radical polymerization initiator is 4 (TC to 8 〇t). [4] A curable resin composition for liquid crystal sealing, which contains a molecule capable of undergoing radical polymerization _•carbon double The radical hardening of the bond: 200900816 A resin, a thermal radical polymerization initiator, a radical chain transfer agent, and a filler. [5] The curable resin composition for liquid crystal sealing according to [4], wherein the radical [6] The sulphuric acid resin composition for liquid crystal sealing according to [4] or [5], wherein the thiol group as the radical chain transfer agent has a number average molecular weight of 400 〜 2000 secondary thiols.

[7]如[4]至[6]中任-項所述之液晶密封用硬化性樹脂 組成物,其中上述液晶密封用硬化性樹脂組成物以E型黏 度計所測定的於25。(:、1.0 rpm下的黏度為5〇 Pa.s〜5〇〇 Pa.s,且於80°C、l.Orpm下的黏度大於5〇〇Pa.s。 [8]—種液晶密封用硬化性樹脂組成物,其含有具有可 進行自由絲合的碳_碳雙鍵、驗官能基、及環氧基的樹 脂組成物,熱自由絲合起始劑,以及填充料;上述樹脂 組成物包含選自由如下樹脂所組成之族群的兩種或兩種以 上的樹脂:(1A)自由基反應性樹脂,其於丨分子内具有 ,鍵官能基、及可進行自由基聚合的2個务碳雙鍵且上述 氫鍵官能基量為 1.5xl〇·3 mc)i/g〜6 Gxl(r3 mGl/g,自 由基反應性樹月旨,其於【分子内具有氫鍵官能基、環氧基、 及可進*行自由絲合的碳碳魏且上述氫鍵宫能基量為 LOxKT moi/g〜5.0xl0-V〇1/g,及(lc)環氧樹脂,其於 =内曰t有環氧基但不具有可進行自由基聚合的碳_碳雙 鍵並且/、猎由壤球法(ringandballmeth〇d)測得的軟化 點(S〇ftenmgp〇int)大於等於4〇它,且重量 獅〜遲;上述樹脂組成物中的氫鍵宫能基量為·〇: 12 200900816 27285pif Γ=:6.°Γ_ mo】/g;上述_組成物中的環氧基量為 1.0x10 mol/g〜2.6x】(T3 m〇i/g。 [9] 如[8]所述之液晶密封用硬化性樹脂絚成物,其中上 述樹脂組成物中的氫鍵官能基為羥基。 [10] 如[8]或[9]所述之液晶密封用硬化性樹脂組成 物’其中上述(1A)的自由基反應性樹脂為下述通式⑽) 或通式(a2)所表示的樹脂。[7] The curable resin composition for liquid crystal sealing according to any one of [4], wherein the curable resin composition for liquid crystal sealing is 25 measured by an E-type viscosity meter. (:, the viscosity at 1.0 rpm is 5 〇Pa.s~5〇〇Pa.s, and the viscosity at 80 ° C, l.Orpm is greater than 5 〇〇 Pa.s. [8] - for liquid crystal sealing a curable resin composition comprising a resin composition having a carbon-carbon double bond, a functional group, and an epoxy group which can be freely bonded, a hot free-knit starter, and a filler; the above resin composition Containing two or more resins selected from the group consisting of: (1A) a radical reactive resin having a bond functional group and two carbons capable of undergoing radical polymerization in a ruthenium molecule The double bond and the above hydrogen bond functional group amount is 1.5 x 1 〇 · 3 mc) i / g 〜 6 Gxl (r3 mGl / g, a radical reactive tree, which has a hydrogen bond functional group, epoxy in the molecule a base, and a carbon fiber which can be freely bonded, and the above hydrogen bond ruthenium base amount is LOxKT moi/g~5.0xl0-V〇1/g, and (lc) epoxy resin, which is in the inner t has an epoxy group but does not have a carbon-carbon double bond capable of undergoing radical polymerization and/, a softening point (S〇ftenmgp〇int) measured by a ball and ball method (ringandballmeth〇d) is greater than or equal to 4〇 , and the weight of the lion is delayed; the amount of hydrogen bond in the above resin composition is 〇: 12 200900816 27285pif Γ =: 6. ° Γ _ mo 】 / g; the amount of epoxy groups in the above composition is 1.0 [10] The curable resin composition for liquid crystal sealing according to the above [8], wherein the hydrogen bond functional group in the resin composition is a hydroxyl group. [10] The curable resin composition for liquid crystal sealing according to [8] or [9] wherein the radical reactive resin of the above (1A) is represented by the following formula (10) or the formula (a2) Resin.

, ......通式(al) 上述通式(al)中, ]I、R3、R4分別獨立地表示氫原子或甲基; 別獨立地表示氫原子、碳數為丨〜斗的烷基、烯 土^數為1〜4的贱基或碳數為卜4的统氧基; 11表示1〜4的整數; 1表示1〜4的整數;(al) In the above formula (al), ]I, R3 and R4 each independently represent a hydrogen atom or a methyl group; and independently represent a hydrogen atom, and the carbon number is 丨~斗An alkyl group or an olefin group having 1 to 4 or an alkyl group having a carbon number of 4; 11 representing an integer of 1 to 4; and 1 representing an integer of 1 to 4;

通式(a2) 13 200900816 / t l 上述通式(a2)中, R5、R_6、R7、Κ·8分別獨立地表示氫原子或曱基;General formula (a2) 13 200900816 / t l In the above formula (a2), R5, R_6, R7, and Κ8 each independently represent a hydrogen atom or a fluorenyl group;

Rq分別獨立地表示氫原子、碳數為1〜4的烷基、烯 丙基、碳數為1〜4的羥烷基或碳數為1〜4的烷氧基; r表示1〜4的整數; ρ表示1〜4的整數。 [11]如[8]至[10]中任一項所述之液晶密封用硬化性樹 脂組成物,其中上述(1A)的自由基反應性樹脂為下述通 式(a3)或通式(a4)所表示的樹脂。Rq each independently represents a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, an allyl group, a hydroxyalkyl group having 1 to 4 carbon atoms or an alkoxy group having 1 to 4 carbon atoms; and r represents 1 to 4; Integer; ρ represents an integer from 1 to 4. [11] The curable resin composition for liquid crystal sealing according to any one of [10], wherein the radical reactive resin of the above (1A) is represented by the following formula (a3) or A4) Resin represented.

......通式(a3) 上述通式(a3)中,(general formula (a3) in the above formula (a3),

Ri、R2分別獨立地表示氫原子或曱基;Ri and R2 each independently represent a hydrogen atom or a fluorenyl group;

Rm*別獨立地表示氳原子、碳數為1〜4的烷基、烯 丙基、碳數為1〜4的羥烷基或碳數為1〜4的烷氧基; η表示1〜4的整數; Α為以-CH2-、-C(CH3)2-、-S02-、或表示的有機基Rm* independently represents a halogen atom, an alkyl group having 1 to 4 carbon atoms, an allyl group, a hydroxyalkyl group having 1 to 4 carbon atoms or an alkoxy group having 1 to 4 carbon atoms; η represents 1 to 4; An integer of - is an organic group represented by -CH2-, -C(CH3)2-, -S02-, or

通式U4) 14 200900816 27285pif 上述通式(a4)中, R5、R6分別獨立地表示氫原子或曱基。 [12]如[8]所述之液晶密封用硬化性樹脂組成物,其中 上述液BB氆封用硬化性樹脂組成物以E型黏度計所測定的 於25X:、l.Orpm下的黏度為5〇Pa.s〜5〇〇Pa.s,且於g0 °C、l.Orpm下的黏度大於5〇〇Pa.s。 [13]如[8]所述之液晶岔封用硬化性樹脂組成物,其中 f 上述液晶㈣用硬化性樹脂組成物更含有自由基鍵轉# 劑。 、[14]如[13]所述之液晶密封用硬化性樹脂組成物,其中 上述液晶密封用硬錄樹餘成物以E型減計所測定的 於25C、l.〇rpm下的黏度為5〇pa s〜5〇〇pa s,且於g〇 C、l.Orpm下的黏度大於5〇〇Pa s。 方法來^決返課題可利用本發明的液晶顯示面板的製造 封用液晶顯示面板的製造方法,其纽由液晶密 萝&y a生曰組成物而將相對向的2塊基板進行貼合而 二2广面板的製造方法,上述液晶顯示面板的製造 驟:準備第1基板的步驟,上述第1基板 或_述之此框狀顯示區域由利用上述[ι]、[4]、 區域而封用硬化性樹频成物包圍像素陣列 基硬化狀態的上述顯示區域内、或另-塊 的第2基板^ = 2 ’將上述第1基板、和與其相對向 扳重宜的步驟;藉由加熱而使上述液晶密封用樹 15 200900816 脂組成物硬化的步驟。 ㈣’可提供—種可抑制液㈣漏及液晶污染 用硬化性樹脂組成物、以及使用此樹脂組成物 …㈤生產性之狀態製造高品質液晶顯示面板的方 法0 【實施方式] 人對本發明進行詳細說明。於以下說明中,以「〜 來規定數值範圍,但本發明的「〜」包括其邊界值(b_dary ,mi Γ10^100- ft發!的所謂「液晶密封用」,意指「用於密封液晶」; 而口月後封液a曰」,意指「將液晶密封於某空間中」。因 此,<本發明中所謂「液晶密封用硬化性樹脂組成物」,與一 般稱為「液晶密封劑I者音羞士曰ρη 「、— s h 玎削」t思義相冋。「液晶密封劑」於液晶 顯不面板中’可將液晶密封於2塊基板之間,亦可發揮用 於貼合2塊基板的接著劑之個。另外,液晶密封劑中, 可用於液晶滴入技術的液晶密封劑,在本發明中有時稱為 「液晶滴入技術用液晶密封劑」。並且,於以下說明中,有 時將「液晶密封用硬化性樹脂組成物」稱為「組成物」、「液 晶密封劑」或「密封劑」。 1.液晶密封用硬化性樹脂組成物 ^明的第-液晶密封用硬化性樹腊組成物的特徵在 於.其含有(1)丙烯酸樹腊、及/或(2)—分子内具有至 少各為1胸縣基及(甲基)丙_細(甲基)丙婦酸改 16 200900816 27285pif 質環氧樹脂、(3)熱自由基聚合起始劑、及⑷填充料; 上述液晶韻用硬化性樹脂組成㈣E難度計所測定的 於25 C I0 rPm下的黏度為50 Pa.s〜500 Pa.s,且於80 C l.0rPm下的黏度大於5〇〇pa.s。於本發明中,將丙烯 鼪基(acryl)、甲基丙燦醯基(methacr州並稱為(甲基)丙稀醯 基((meth)acryl)。另外,具有上述特徵的本發明的液晶密封 用硬化性樹驗成物亦稱為「液晶㈣用硬化性樹脂组成 .勿I」或「樹脂組成物I」。 ,上述黏度是使用E型旋轉黏度計(rotating viscometer) 例如BROOKFIEL公司製造的數位流變計(出幽 也歐^),型號:Dn_m ULTRa),且使用半徑為i2 mm又為3的CP-52型錐-板型感測器(c〇ne and plate =),將旋轉速度設為1〇 —而進行測定。此時,於 方行測^,所謂於25°CT的黏度,是指將液晶 匕性樹脂組成物1於坑下放置5分鐘後,再利 則得的黏度。所謂於8〇。°下的黏度,是指將 J升轉黏度計的杯中,以5°c/分的升溢 速度H 8G C,其後於啊下 方法所測得_度。 刀㈣冉以上迷General formula U4) 14 200900816 27285pif In the above formula (a4), R5 and R6 each independently represent a hydrogen atom or a fluorenyl group. [12] The curable resin composition for liquid crystal sealing according to [8], wherein the viscosity of the liquid BB sealing curable resin composition measured at 25X:, 1.0 rpm measured by an E-type viscosity meter is 5〇Pa.s~5〇〇Pa.s, and the viscosity at g0 °C, l.Orpm is greater than 5〇〇Pa.s. [13] The liquid crystal enthalpy-curable resin composition according to [8], wherein the liquid crystal (IV) hardenable resin composition further contains a radical bond agent. [14] The curable resin composition for liquid crystal sealing according to [13], wherein the viscosity of the hard-recorded resin residue for liquid crystal sealing is measured at 25 C and 1.0 rpm as measured by the E-type reduction. 5〇pa s~5〇〇pa s, and the viscosity at g〇C, l.Orpm is greater than 5〇〇Pa s. According to the method for manufacturing a liquid crystal display panel for manufacturing a liquid crystal display panel of the present invention, a liquid crystal melamine & ya composition is used to bond two substrates facing each other. In the manufacturing method of the second wide panel, the manufacturing step of the liquid crystal display panel is a step of preparing a first substrate, and the first substrate or the frame-shaped display region is sealed by the above [1], [4], and region. a step of surrounding the first substrate and the opposite direction of the first substrate in the display region surrounding the pixel array-based hardened state by the hardening tree frequency, or by moving it to the opposite direction; Further, the liquid crystal sealing tree 15 200900816 is subjected to a step of hardening the fat composition. (4) A method for producing a high-quality liquid crystal display panel in a state in which the liquid crystal contamination panel can be produced by using a curable resin composition for suppressing liquid (4) leakage and liquid crystal contamination, and the like. (5) Method for producing a high-quality liquid crystal display panel in a state of productivity [Embodiment] Detailed description. In the following description, the numerical range is defined by "~", but the "~" of the present invention includes the boundary value (b_dary, mi Γ10^100-ft, the so-called "liquid crystal sealing", meaning "for sealing liquid crystal" "In the present invention, the sealing liquid is sealed in a certain space", and the "curable resin composition for liquid crystal sealing" in the present invention is generally referred to as "liquid crystal sealing". Agent I is a shy 曰 ρη ", - sh 玎 」 t t t t 「 「 「 「 「 「 「 「 「 「 「 「 「 「 「 「 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶 液晶In the liquid crystal sealing agent, a liquid crystal sealing agent which can be used for a liquid crystal dropping technique is sometimes referred to as a "liquid crystal sealing agent for liquid crystal dropping technology" in the present invention. In the following description, the "curable resin composition for liquid crystal sealing" is referred to as "composition material", "liquid crystal sealing agent" or "sealant". The characteristics of the curable wax composition for liquid crystal sealing are It contains (1) acrylic wax, and/or (2)-molecule having at least 1 chest county base and (methyl) propyl-fine (methyl) propylene glycol acid modified 16 200900816 27285pif epoxy resin (3) a thermal radical polymerization initiator, and (4) a filler; the liquid crystal rhyme is composed of a curable resin (4). The viscosity at 25 C I0 rPm measured by an E difficulty meter is 50 Pa.s to 500 Pa.s, And the viscosity at 80 C l.0rPm is greater than 5 〇〇 pa.s. In the present invention, acryl, methacrylic acid (methacr state is also called (meth) propyl hydrazine Further, the sclerosing tree test composition for liquid crystal sealing of the present invention having the above characteristics is also referred to as "liquid crystal (four) curable resin composition. "No I" or "resin composition I". The above viscosity is an E-type rotary viscometer such as a digital rheometer manufactured by BROOKFIEL (Model: Dn_m ULTRa), and a CP-52 having a radius of i2 mm and 3 is used. The cone-plate type sensor (c〇ne and plate =), the rotation speed is set to 1 〇 - and the measurement is performed. At this time, the square line is measured, so-called 25 ° CT Viscosity refers to the viscosity obtained by placing the liquid crystalline inert resin composition 1 under the pit for 5 minutes. The viscosity at 8 〇 is the value of the J to the viscometer cup. The rate of rise and fall of °c/min is H 8G C, and then measured by the method of _ degrees. Knife (four) 冉 above fans

method)進行測定。其 F F 使用轉子_ (咖;J Λ上^型旋轉黏度計於 藉由平行板法的測定,:,測定界限約為780 Pa.S。 “疋例如可使用RheoStress RS150 17 200900816 (HAAKE製造)4黏彈性细泪丨丨令奖 準法而進行。 料並依據其機種的標 h/ί晶密封1 硬樹脂組成物1的特徵在於:其於25 C、. rpm 下的黏度為 5Gpa.s〜5G()p 7、 τ* aa 味i· ώ:丄 (λλ η Λ b C N1.0 rpmMethod). The FF is measured by the parallel plate method using a rotor _ (coffee; J Λ upper-type rotary viscometer:: the measurement limit is about 780 Pa. S. " For example, RheoStress RS150 17 200900816 (manufactured by HAAKE) can be used. The viscoelastic tears are made by the quasi-method. The material is based on the standard h/ί crystal seal of the model. The hard resin composition 1 is characterized by a viscosity of 5 GPa.s at 25 C, . rpm~ 5G()p 7, τ* aa taste i· ώ:丄(λλ η Λ b C N1.0 rpm

下的黏度大於500 Pa.s ;更好的是於^ P 黏度為100 Pa.s〜400 pa.s。此錄、 · rpm下的 S此種組成物在作為液晶密封 1塗佈於絲上的步财,由於㈣除錄 所含的氣泡,因此可提供高品·晶顯示面板。 外.所述’液晶密封用硬化性細旨組成物I的 寸,在於:八於8〇t、1.〇 rpm下的黏度大於_ pa s。 通常’熱硬化性樹脂在藉由加熱而進行硬化時,樹脂黏产 =時降低後,隨著硬化反應的進行,黏度會再次上升。= 常,於製造液晶顯示面板時,液晶密封劑的硬化溫度為8〇 〜150 C左右。如上所述’若於此硬化步驟中組成物的黏度 過度降低,則會發生液晶洩漏等問題。 口此為了防止液晶洩漏(提高耐茂漏性),有效方法 為抑制加熱硬化時組成物的黏度降低。為了抑制加敎硬化 時組成物的黏度降低,有效的是於此黏度降低發生之前進 行組成物的硬化反應,而使組成物黏度上升。另外,為了 抑制液晶茂漏,而將於8叱、1G啊下的組成物黏度為 5〇〇Pa*s作為一個標準。因此,本發明的樹脂組成物工是 =如下目;^進行組成設計的:藉由如下所述使用小時半 衰期溫度在預定範圍内的熱自由基聚合起始劑,來促進組 成物的硬化。藉此,此組成物於80°C、1.0 rpm下的黏度 18 200900816 27285pif 大於500 Pa s ’可於發生黏度降低前使組成物黏度上 因此,可抑制加熱硬化時的黏度降低。此處,就 物的黏度降低情況抑制在更低水平的觀點而言,上述於⑽ c下的黏度較好的是1〇3pa.s〜1〇9pa.s、更好的是i〇3pa. s〜10’ Pa.s。 並且,液晶密封用硬化性樹脂組成物j的由[於乃它、 0/ rpm下的黏度;j/[於25。〇、5.〇啊下的黏度]所定義的觸 η ί指數為u〜5.0,較好的是1.2〜2.5。所謂觸變指數, 疋指f較低的剪切速度(shear vek)dty) _定的黏度鱼 以較局的剪切速度所測定的黏度的比值。若此比值高 上述樹脂組成物J之流體於低剪切速度下會以高黏度進行 流動’而於高剪切速度下會以低黏度進行流動。 於製造液晶顯示面板時,於基板上塗佈液晶密封劑的 步驟中:液晶密封劑處於剪切速度較高的情況下,其後將 基板重疊而進行後硬化的步驟中,液晶密封劑處於剪切速 r 度才ίΐ的情況下。此處,於基板上塗佈液晶密封劑的步驟 ' (尚勇切速度區域)中,必須容易進行塗佈,且容易將液 晶密封劑消泡,故而較好的是液晶密封劑為低黏度。另外, 於硬化過程(低剪域度區域)巾,如上所述,不會發生 液晶j漏,故而較好的是液晶密封劑為高黏度。就丄4觀 點而言’由於液晶密封用硬化性樹月旨組成物工於製成液晶 密封劑時的塗佈性'消泡性、可靠性良好,故而將觸變指 數設為上述範圍。 此組成物I的特徵在於:將(1)丙烯酸樹脂、及/或 19 200900816 内具有至少各為1個的環氧基及(甲基)丙烯酿 ^的(甲基)丙烯酸改質環氧樹脂作為基礎樹脂,且盆中含 自由絲合起始劑、⑷填充料;並錢組成物 有未硬化狀態社劑(硬化性樹脂)及硬化劑(硬 "且的所謂一液硬化_脂組成物。-液硬化性樹 =在使用時無須將主劑與硬化劑混合,故而作 各成t行用硬化性樹脂組成物1的 (1)丙烯酸樹脂 烯酸酉! Ϊ ’是指丙稀酸醋及/或甲基丙 聚乙二醇或,、4养聚物。此等的例子亦包括如下者。 甲基丙烯酸酉旨;等的二丙烯酸酯及/或二 或二甲基丙烯酸酯;於二二氣酸酯的1丙烯酸酯及/ 中加成大於箄於Λ 、的新戊二醇(neopentyl glyC〇i) 二醇之二丙S3耳戈的^ A (bisPhen〇1 A彳或—甲基丙婦酸酯;於1莫耳的雙酚 而獲得的二醇$ _ ^成2莫耳的環氧乙烷或者環氧丙烷 耳的三經甲基、—@烯酸酉旨及/或二甲基丙缔酸S旨;於1莫 環氧丙燒而^大於等莫耳的環氧乙院或者 基丙埽酸酯;於、醇之—或二丙烯酸酯及/或二或三甲 環氧乙燒或者;Λ莫耳的雙齡A中加成大於等於4莫耳的 二甲基丙稀酸^乳丙燒而獲得的二醇之二丙烯酸酯及/或 田,二(2-羥基乙基)異氰酸酯三丙烯酸酯及/ 20 200900816 27285pif 或三曱基丙烯酸酯;三羥甲基丙烷三丙烯酸酯及/或三甲基 丙烯酸S旨、或其寡聚物;季戊四醇三丙烯酸醋及/或三曱基 丙烯酸酯、或其寡聚物;二季戊四醇的聚丙烯酸醋及/或聚 甲基丙烯酸酯;三(丙烯醯氧基乙基)異氰酸酯;己内酯改 質三(丙烯醯氧基乙基)異氰酸酯;己内酯改質三(甲基丙稀The viscosity is greater than 500 Pa.s; more preferably, the viscosity is 100 Pa.s to 400 pa.s. In this recording, the composition of S at the rpm is applied as a liquid crystal seal 1 to the wire, and since (4) the bubbles contained in the recording are provided, a high-quality crystal display panel can be provided. Further, the thickness of the composition I for the liquid crystal sealing is such that the viscosity at 8 〇t and 1. 〇 rpm is larger than _ pa s . Usually, when the thermosetting resin is cured by heating, the viscosity of the resin increases again as the curing reaction progresses. = Often, when manufacturing a liquid crystal display panel, the curing temperature of the liquid crystal sealing agent is about 8 〜 to 150 C. As described above, if the viscosity of the composition in the hardening step is excessively lowered, problems such as liquid crystal leakage occur. In order to prevent liquid crystal leakage (to improve leakage resistance), an effective method is to suppress a decrease in viscosity of the composition at the time of heat hardening. In order to suppress the decrease in the viscosity of the composition during the hardening, it is effective to carry out the hardening reaction of the composition before the viscosity reduction occurs, and to increase the viscosity of the composition. In addition, in order to suppress liquid crystal leakage, the viscosity of the composition at 8 叱 and 1 G is 5 〇〇 Pa*s as a standard. Therefore, the resin composition of the present invention is as follows: • The composition design is carried out: the hardening of the composition is promoted by using a thermal radical polymerization initiator having an hour-half-life temperature within a predetermined range as described below. Thereby, the viscosity of the composition at 80 ° C and 1.0 rpm 18 200900816 27285pif is more than 500 Pa s ', and the viscosity of the composition can be made before the viscosity is lowered. Therefore, the viscosity at the time of heat curing can be suppressed from being lowered. Here, in view of suppressing the decrease in the viscosity of the object at a lower level, the viscosity at (10) c above is preferably 1〇3pa.s~1〇9pa.s, more preferably i〇3pa. s~10' Pa.s. Further, the viscosity of the curable resin composition j for liquid crystal sealing is [Yu Nai, viscosity at 0/rpm; j/[ at 25.黏, 5. 〇 的 viscosity] The defined touch η ί index is u ~ 5.0, preferably 1.2 ~ 2.5. The so-called thixotropic index, 疋 refers to the lower shear rate (shear vek) dty) _ the viscosity of the fish determined by the shear rate measured by the shear rate. If the ratio is high, the fluid of the resin composition J will flow at a high viscosity at a low shear rate and will flow at a low viscosity at a high shear rate. When the liquid crystal display panel is manufactured, in the step of coating the liquid crystal sealing agent on the substrate: in the case where the liquid crystal sealing agent is in a high shearing speed, and then the substrate is superposed and post-hardened, the liquid crystal sealing agent is in the shearing The rate of r-speed is only ΐ. Here, in the step of applying a liquid crystal sealing agent on a substrate (the cutting speed region), it is necessary to easily apply the film, and it is easy to defoam the liquid crystal sealing agent. Therefore, it is preferred that the liquid crystal sealing agent has a low viscosity. Further, in the hardening process (low shear region), as described above, liquid crystal leakage does not occur, and therefore it is preferred that the liquid crystal sealing agent has a high viscosity. In the case of the liquid crystal sealing agent, the coating property of the liquid crystal sealing agent for liquid crystal sealing is good in defoaming property and reliability, and the thixotropic index is set to the above range. The composition I is characterized in that (1) an acrylic resin, and/or a (meth)acrylic modified epoxy resin having at least one epoxy group and (meth)acrylic acid in 19200900816 As a base resin, the pot contains a free silk starter and (4) a filler; and the money composition has an unhardened state agent (curable resin) and a hardener (hard) and a so-called one-liquid hardening_fat composition - Liquid-hardening tree = (1) Acrylic resin olefin strontium 酉 是 是 是 丙 是 液 液 液 液 液 液 液 液 是 是 是 是 是 是 是 是 是 是 是 是 是 是 是 是 是Vinegar and/or methacrylic polyethylene glycol or 4, an amphoteric polymer. Examples of these include the following: methacrylic acid ester; etc. Diacrylate and/or di- or dimethacrylate; The acrylate and/or addition of the di-diester acid ester to the di-propylene S3 ergo of the neopentyl lysine (neopentyl gly C〇i) diol (bisPhen〇1 A彳 or Methyl propyl acrylate; diol $ _ ^ obtained in 1 mole of bisphenol into 2 moles of ethylene oxide or propylene oxide ear , - olefinic acid and / or dimethyl propyl sulphate S; in 1 epoxiconate and ^ greater than the molar epoxy acetonitrile or propyl phthalate; in, alcohol - or Diacrylate and/or di- or trimethyl epoxiconate or diol diacrylate obtained by adding 2 mol of dimethyl acrylate acid to the double age A of Λmol And/or field, bis(2-hydroxyethyl)isocyanate triacrylate and / 20 200900816 27285pif or tridecyl acrylate; trimethylolpropane triacrylate and / or trimethacrylic acid S, or its Polymer; pentaerythritol triacrylate acrylate and/or tridecyl acrylate, or oligomer thereof; polyacrylic acid vinegar and/or polymethacrylate of dipentaerythritol; tris(propylene oxyethyl) isocyanate; Ester-modified tris(propylene oxyethyl) isocyanate; caprolactone modified tris (methyl propylene)

醯氧基乙基)異氰酸酯;烷基改質二季戊四醇的聚丙烯酸酯 及/或聚曱基丙烯酸酯;己内酯改質二季戊四醇的聚丙烯酸 酯及/或聚甲基丙晞酸酯;經基新戊酸新戊二醇二丙稀酸酿 及/或二曱基丙烯酸酯;己内酯改質羥基新戊酸新戊二醇二 内歸酸0曰及/驭二T基丙烯酸酯;環氧乙烷改質磷酸丙烯酸 醋及/或二甲基丙烯酸酯;環氧乙烷改質烷基化磷酸丙烯酸 酯及/或二甲基丙烯酸酯;新戊二醇、三羥曱基丙烷、季戊 四醇的寡聚丙烯酸酯及/或寡聚曱基丙烯酸酯等。 另外,上述丙烯酸樹月旨的具體例亦包括:將使甲祕 酸清漆(CreS〇lnCm)lac)型環氧樹脂、苯紛祕清漆(phenol 丽oiac),氧樹脂、雙紛A型環氧樹脂、雙紛f型環氧 樹脂、三苯紛甲燒型環氧樹脂 三苯_環氧_旨、倾乙烧型環氧樹脂、 樹脂、鮮财氧娜=^二烯型環氧 應而獲得的環氧樹脂,完全(甲=基與(:基)丙烯酸反 月化tr丙烯酸樹脂較好的是藉由水洗法等使 本發明的丙細酸樹脂,較# Μ θ U ,〜2_的範圍内,且^的是其數量平均分子量在 ed〇rs的理論溶解度參數 200900816 (S〇M^ty]parameter ’ 叩值)在 1〇 〇 ㈤/cm3广〜咖 (cal/cm ) 0 la圍内。此種丙烯酸樹脂 性、擴散性降低,因此,含有此樹脂的液晶密封劑可提= 顯示特性良好的液晶顯示面板,㈣較好 =下述⑷環氧樹脂的相容性亦良好,故而= 封劑。上述數量平均分子量,例如可藉由 、二 I ( GPC > gel permeation chromatography) ^ 以聚本乙烯作為標準進行測定。 溶解度參數(sp值)的計算方 論溶解度參數較好的是基二 、而'^出者(參照曰本接著學會刊,vol22、 =986)(53)(566)等)。其原因在 要密度值,故而可交晷砧首山田%此云不而 理論溶解度參數可根據解度參數。上述Μ⑽的 sp 值=(ΣΑεΙ/ΣΔνΙ) 1/2醯 oxyethyl)isocyanate; polyacrylate and/or polydecyl acrylate of alkyl modified dipentaerythritol; polyacrylate and/or polymethyl propyl phthalate of caprolactone modified dipentaerythritol; Neopentyl glycol neopentyl glycol diacrylic acid brewing and / or dimercapto acrylate; caprolactone modified hydroxypivalic acid neopentyl glycol diendoic acid 0 曰 and / 驭 di T acrylate; Ethylene oxide modified phosphoric acid acrylate vinegar and / or dimethacrylate; ethylene oxide modified alkylated phosphoric acid acrylate and / or dimethacrylate; neopentyl glycol, trihydroxy decyl propane, An oligomeric polyacrylate and/or an oligomeric methacrylate of pentaerythritol. In addition, the specific examples of the above-mentioned acrylic tree include: an epoxy resin (CreS〇lnCm) lac) type epoxy resin, a benzene oligo oliac, an oxygen resin, and a double-type A-type epoxy resin. Resin, double-type f-type epoxy resin, triphenyl sinter-type epoxy resin triphenyl _ epoxy _ purpose, simmering type epoxy resin, resin, fresh yoghurt = ^ diene type epoxy should The obtained epoxy resin is completely (a = base and (: base) acrylic acid anti-monthly tr acrylic resin is preferably made by the water washing method or the like to make the acrylic acid resin of the present invention, more than # Μ θ U , ~ 2 _ Within the range, and ^ is its number average molecular weight in the theoretical solubility parameter of ed〇rs 200900816 (S〇M^ty]parameter '叩 value) at 1〇〇(五)/cm3广~咖(cal/cm) 0 la In this case, the acrylic resin and the diffusibility are lowered. Therefore, the liquid crystal sealing agent containing the resin can provide a liquid crystal display panel having excellent display characteristics, and (4) preferably = (4) the compatibility of the epoxy resin is also good. Therefore, the sealant. The above number average molecular weight, for example, can be determined by GPC > gel permeation chromatography ^ The ethylene is determined as a standard. The calculation parameter of the solubility parameter (sp value) is preferably the base 2, and the '^ is the one (see 曰 接着 学会 学会, vol22, = 986) (53) (566) Wait). The reason is in the density value, so it can be transferred to the anvil head Yamada%. This theoretical cloud solubility parameter can be based on the solution parameter. The sp value of the above Μ(10) = (ΣΑεΙ/ΣΔνΙ) 1/2

/、中ΣΔεΙ- (δη —RT)、2△啦莫耳容量的和 晶中的、、容數在上述粑圍内’則上述丙烯酸樹脂於液 面板的顯示特性變得良好,故而較好。 成的混月:’亦可為將數種上述丙烯酸樹脂組合而 於所此口的各丙烯酸酿單體及/或曱基丙 22 200900816 27285pif 烯酸醋單體、或者其等的寡聚物的莫耳百分率之和而算 的範圍内。 數置平均刀子昼為3〇〇〜2〇〇〇且Fed〇rs的理論溶解产/, Σ Σ ε Ι - (δ η - RT), the sum of the 2 △ 莫 耳 容量 容量 容量 、 、 、 、 、 ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ Mixed moon: 'may also be a combination of several kinds of the above acrylic resins in the mouth of each of the acrylic styrene monomer and / or mercapto propyl 22 200900816 27285pif oleic acid vinegar monomer, or the like of the oligomer Within the range of the sum of the percentages of the moles. The number of average knives is 3〇〇~2〇〇〇 and the theoretical dissolution of Fed〇rs

^f〇(Cal/-3)1/2-13.0(calW 丙烯酸樹脂的例子,可列舉:季細醇四_酸|旨(數量 平均分子量為352,sp值為12.1)。 盆、工一分子内具有各為1個或1個以上的環氧基及Γ甲 ^烯醯基的(甲基)丙烯酸改質環氧樹脂 ,發月的分子内具有各為】個或工個以上的環氧 0 丙烯醒基的(甲基)丙烯酸改質環氧樹脂(亦 了間私為改質環氧樹脂」) 丙烯醯基及環氧基的化合物。 子内1、(甲基) 紛包ΐ:藉由使雙嶋氧樹脂或 稀酸笑㉛“=魏樹脂與(甲基)_酸或甲基丙 :物於驗性觸媒下進行反應而獲得的樹脂。 括:甲酚氧1脂之原料的環氧樹脂的例子包 雙盼㈣氧脂' 氧樹脂、三苯紛 ^乳树月曰、二本紛曱燒型環 環戊㈣樹脂、三苯_環氧樹脂、二 :_&_脂、聯苯型環氧樹脂等。 比率氧基與丙烯酸大致為1:1的莫耳 具有2個環祕樹脂、魏F型環氧樹脂等分子内 土的一s能性環氧樹脂與丙烯酸反應而獲得 23 200900816 ’上述環氧樹脂較好的是藉由分子蒸鶴法、 /月/无去等而鬲純度化。 f甲其由f改f魏獅於樹崎㈣兼具環氧基及 r ^ ' 。基,故而液晶密封用硬化性樹脂組成物中的 ):烯酸樹脂與下述(6)環氧樹脂的相容性優異。因 t 提供玻璃轉移溫度(_ transition temperature,τ ) 成物的硬化物。由於組成物的硬化物 一 優異’忍味著此硬化物與基板之間的接著強度 尚,故而可提供高品質液晶顯示面板。 以任中’⑴丙烯酸樹脂及⑵改質環氧樹脂可 而不:用二用。其中包括:〇僅使用⑴丙烯酸樹脂 而不使用(2)改質環氧樹脂的形態;或b)僅使 改質環氧樹脂而不使用⑴丙烯酸樹脂的形態。此時,於 a的情況下’可提供耐$漏性良好的液晶密封用硬化性樹 =物:於b)的情況下,藉由將(2)改質環氧樹脂與 _硬_適當組合’可提供接著強度大的液晶 1用硬化性樹脂組成物。於本發明中,液晶密封劑的特 性中’將液晶密封劑與如基板的被接著對象部件的接著強 度大的情況,稱為接著可靠性優異。 另外’亦可合併使用⑴丙烯酸樹脂及⑵改質環 氧樹脂。各樹脂的混合比以重量比計,較好岐⑴丙烯 酸樹脂:(2)改質環氧樹脂=1〇〜7〇 : 9〇〜3〇,更好的β 20〜50 : 80〜50。藉此,可提供接著可靠性優異的液^ 封用硬化性樹脂組成物。另外,於本發明中,有時將合併 24 200900816 27285pif 有(1 )丙烯酸樹脂盥 為「樹脂組合」。’、 貝環氧樹脂的樹脂組成物稱 (3)熱自由基聚合起始劑 所明熱自由基聚合起始劑, 的化合物,即糾熱能進行分解^生自由基 物。此種熱自由基聚合起始劑 ^由基種的化合 熱使液晶密封劑硬化的情況。 ;貝s基板後藉由加 較好的是’熱自由基聚合起 士 在3(TC〜8(TC的範圍 ^ +日寸半衰期溫度 是5(TC〜70t。所袖⑺^^㈣〜阶’尤其好的 基聚合起始劑於^氣_。=度^=熱自由 來的一半時的溫度。使用KH、時半衰降至原 的熱自由基聚合起始劑的液晶 内 化性的平衡性良好。 町剎一黏度鈿疋性與硬 起的液曰ν;ϊΐ等於化時黏度過度降低所引 較好的是抑制上述黏度_樹脂組成物 ::㈣㈣而加快凝膠化。就加心膠化的成 …、自由基聚合起始劑的10小時半衰期严 ‘ώ 了 g8〇°C,更好的是小於等於耽。‘:對上 物進仃加熱硬化時(通常硬化溫度為8〇t〜15〇t),容易 此可抑制加熱硬化時ς黏 25 200900816 为一 度過低,卿時半衰期溫 劑的料時半衰期溫度熱自,聚合起始 ί進、或塗佈至基板上的步驟(通常是t二 下進仃)+’液日日日密封劑的穩定性良好。疋於至脈 此處10小4半衰期溫度大於8 始劑難以產生自由美。 I、、目由基聚合起 士…、一、Λ _起D剑的10小時半衰期溫度小於30°C 士 ;至皿下亦可谷易地進行硬化反應’因此含有此熱自 基聚合起始_液晶密封_黏度穩定性會顯著降低。 艮據以上情況,較好的是熱自由基聚合起始劑的10小時半 衰期溫度在上述範圍内。 _ 10小時半衰期溫度具體可以如下方式求得。首先,若 將熱刀解反應看作一階反應(first-order reaction)式,則 以下關係式成立。^f〇(Cal/-3) 1/2-13.0 (Example of calW acrylic resin, quaternary alcohol tetra-acid) (the number average molecular weight is 352, and the sp value is 12.1). A (meth)acrylic acid-modified epoxy resin having one or more epoxy groups and a fluorenyl fluorene group, each having one or more epoxy groups in the molecule 0 propylene-based (meth)acrylic acid-modified epoxy resin (also modified as epoxy resin). Acryl sulfhydryl and epoxy compound. In-situ 1, (methyl) A resin obtained by reacting a bis-oxygen resin or a dilute acid 31" = a Wei resin with a (meth) acid or a methyl propyl group under an inert catalyst. Examples of the epoxy resin of the raw material include bis (4) oxyester oxy-resin, triphenyl sulphate, milk sap, two sinter-type cyclopentane (tetra) resin, triphenyl _ epoxy resin, two: _ & _ Lipid, biphenyl type epoxy resin, etc. A s-energy epoxy resin and acrylic acid having a ratio of oxy group and acrylic acid of approximately 1:1 with two ring-shaped resin, Wei F-type epoxy resin and the like. React得得23 200900816 'The above epoxy resin is preferably purified by molecular steaming method, /month/no go, etc. f A is changed from f to f lion in Shuqi (4) both epoxy and r ^ '. Base, and therefore in the curable resin composition for liquid crystal sealing): The olefinic resin is excellent in compatibility with the following (6) epoxy resin. Since t provides a glass transition temperature (? transition temperature, τ ) The cured product of the material. Since the cured product of the composition is excellent in the endurance of the cured product and the substrate, a high-quality liquid crystal display panel can be provided. In the middle of the '(1) acrylic resin and (2) modified ring The oxy-resin may be used instead of: 〇 only: (1) acrylic resin is used instead of (2) modified epoxy resin; or b) only modified epoxy resin is used instead of (1) acrylic resin In this case, in the case of a, it is possible to provide a curable tree for liquid crystal sealing which is excellent in resistance to leakage (in the case of b), by (2) modifying epoxy resin and _hard_ A suitable combination can provide a curable resin composition for liquid crystal 1 having a high strength. In the invention, in the characteristics of the liquid crystal sealing agent, the case where the liquid crystal sealing agent and the substrate to be bonded are as high as the bonding strength of the substrate is referred to as excellent reliability. Further, '1) acrylic resin and (2) modified ring may be used in combination. Oxygen resin. The mixing ratio of each resin is preferably by weight (1) acrylic resin: (2) modified epoxy resin = 1 〇 ~ 7 〇: 9 〇 ~ 3 〇, better β 20 〜 50 : 80 In this case, it is possible to provide a curable resin composition for liquid sealing which is excellent in reliability. Further, in the present invention, the (1) acrylic resin may be combined into a "resin combination" in the combination of 200920091616 27285pif. The resin composition of the epoxy resin is called (3) Thermal radical polymerization initiator The compound of the thermal radical polymerization initiator, that is, the heat-correcting energy, decomposes the radical. Such a thermal radical polymerization initiator ^ is a case where the liquid crystal sealing agent is hardened by the heat of combination of the base species. After the s substrate is added by the better 'thermal radical polymerization gliding in 3 (TC ~ 8 (TC range ^ + day half-life temperature is 5 (TC ~ 70t. Sleeve (7) ^ ^ (four) ~ order ' Especially good base polymerization initiator in the gas _. = degree ^ = half of the temperature when the heat is free. Using KH, the half-life to the original thermal radical polymerization initiator liquid crystal internalization The balance is good. The squeaky and sturdy liquid 曰 ν; the ϊΐ is equal to the excessive decrease in viscosity, which is better to suppress the above viscosity _ resin composition: (4) (four) and accelerate gelation. The gelatinization of the ..., the free-radical polymerization initiator has a 10-hour half-life of 'g8〇 °C, more preferably less than or equal to 耽.': When the upper material is heated and hardened (usually the hardening temperature is 8 〇t~15〇t), it is easy to suppress the heat-hardening ς 25 25 200900816 is too low, the half-life temperature of the aging half-life temperature agent is hot, the polymerization starts, or is applied to the substrate. Step (usually t two into the 仃) + 'liquid day and day sealing agent stability is good. 疋 to the pulse here 10 small 4 half-life temperature More than 8 initiators are difficult to produce free beauty. I, the purpose of the base polymerization of the cheese ..., one, Λ _ from the D sword 10 hours half-life temperature is less than 30 ° C; to the dish can also be hard to react Therefore, the heat-based polymerization initiation _liquid crystal sealing_viscosity stability is remarkably lowered. According to the above, it is preferred that the 10-hour half-life temperature of the thermal radical polymerization initiator is within the above range. _ 10 hour half life The temperature can be specifically determined as follows. First, if the hot knife solution reaction is regarded as a first-order reaction formula, the following relationship holds.

In (C〇/Ct) =kdxt c〇 :熱自由基起始劑的初始濃度 ct :熱自由基起始劑於t小時後的濃度 kd ·’熱分解速率常數 t:反應時間 26 200900816 27285pif 半衰期是指熱自由基聚合起始劑的濃度減少至一般的 時間,即Ct=C〇/2的情況下的時間。因此,t小時後,熱 自由基聚合起始劑到達半衰期時,下式成立。 kd= (1/t) χ1η2 另一方面,由於速率常數的溫度依賴性是以阿瑞尼斯 方私·式(Arrhenius1 equation)表示,故而下式成立。 kd = Aexp (-ΔΕ/RT) 根據上述式可導出下式。 (1/t) xln2 = Aexp (-ΔΕ/RT) A:頻率因數 △ E :活化能 R:氣體常數(8.314J/mol.K) τ :絕對溫度(K) A及ΔΕ的值揭示於j Brandrup等人所著的PolymerIn (C〇/Ct) = kdxt c〇: initial concentration of thermal radical initiator ct: concentration of thermal radical initiator after t hours kd · 'thermal decomposition rate constant t: reaction time 26 200900816 27285pif half-life It means that the concentration of the thermal radical polymerization initiator is reduced to a normal time, that is, the time in the case of Ct=C〇/2. Therefore, after the hour, when the thermal radical polymerization initiator reaches the half life, the following formula holds. Kd = (1/t) χ1η2 On the other hand, since the temperature dependence of the rate constant is expressed by the Arrhenius 1 equation, the following formula holds. Kd = Aexp (-ΔΕ/RT) The following equation can be derived from the above formula. (1/t) xln2 = Aexp (-ΔΕ/RT) A: frequency factor △ E : activation energy R: gas constant (8.314 J/mol. K) τ : absolute temperature (K) The values of A and ΔΕ are revealed in j Polymer by Brandrup et al.

HandBook fourth edition,volume 1,Π 〜Π -69, WILEY-INTERSCIENCE ( 1999)中。根據以上内容,若設 t=10小時,則可求出10小時半衰期溫度τ。 熱自由基聚合起始劑可使用眾所周知的化合物。其代 表例包括.有機過氧化物 '偶氮化合物(aZ〇_C〇mp〇und )。 27 200900816 Ζ/Ζ6〇ρΐΤ 有機過氧化物較好的是分類為過氧化酮(ketone peroxide )'過氧化縮酮(per〇xyketal )、氫過氧化物 j hydr〇per〇xide )、二烷基過氧化物(此丨㈣pe祖此)、過 氧化自日(peroxyester )、一醯·基過氧化物(diacyl peroxide )、 過氧化一奴酸g旨(per〇XydiCarb〇nate)的有機過氧化物,但 並無特別限定,可使用眾所周知的有機過氧化物。 將上述有機過氧化物的具體例示於如下。括弧内的數 字是指10小時半衰期溫度(參照和光純藥商品目錄、AplHandBook fourth edition, volume 1, Π ~ Π -69, WILEY-INTERSCIENCE (1999). From the above, if t = 10 hours, the 10-hour half-life temperature τ can be obtained. Well-known compounds can be used as the thermal radical polymerization initiator. Its representative examples include the organic peroxide 'azo compound (aZ〇_C〇mp〇und). 27 200900816 Ζ/Ζ6〇ρΐΤ Organic peroxides are preferably classified as ketone peroxide 'per 〇 ketket, hydroperoxide j hydr〇per〇xide ), dialkyl Peroxide (this 丨 四 四 ) )), peroxyester, diacyl peroxide, peroxidation However, it is not particularly limited, and a well-known organic peroxide can be used. Specific examples of the above organic peroxides are shown below. The number in parentheses refers to the 10-hour half-life temperature (refer to the Wako Pure Chemicals Catalog, Apl).

Corporation 商品目錄及上述 p〇iymer HandB〇〇k)。 产過氧化酮類的例子包括:過氧化甲基乙基酮(1〇9r )、 過氧化壤己酮(1〇〇。〇)等。另外,過氧化縮酮類的例子包 括.1,1-雙(第三己基過氧化)·3,3,5·三甲基環己烷(87〇c )、 1,1-雙(第二己基過氧化)環己烧(87°c)、1,;[_雙(第三丁基 過氧化)¾己院(91°C )、2,2-雙(第三丁基過氧化)丁烷(1〇3 c)、ι,ι-(第三戊基過氧化)環己烷(93ΐ)、4,4_雙(第三丁 基過氧化)戊酸正丁醋(105t )、2,2_雙(4,4_二第三丁基過 氧化環己基)丙烷(95¾ )。 。氫過氧化物類的例子包括:過氧化氫對薄荷烷(128 °C )、二異丙苯過氧化氫(145°C ) ( diis〇propylbenzene hydr〇peroxide)、u,3,3_四甲基丁基過氧化氫(i53〇c )、過 乳化氫異丙苯(156。〇、帛三丁基過氧化氫(167。〇等。 二烧基過氧化物的例子包括雙(第三丁基過氧 化)二異丙苯(1I9°C)、二異丙苯基過氧化物(116。〇 (d1Cumyl peroxide)、2,5_二甲基_2,5_雙(第三丁基過氧化) 28 200900816 27285pif 己烷(118C)、第二丁基異丙笨基過氧化物(12〇。〇、第 三戊基過氧化物U23X:)、二第三丁基過氧化物(124。〇)、 2,5-一甲基-2,5-雙(第二丁基過氧化)_3_己烯(129它)。 過氧化酯類的例子包括:過氧化新癸酸異丙苯酯 (cumyl per〇Xyne〇deCan〇ate ) ( 37。〇)、過氧化新癸酸 。1,1,3,3-四甲基丁酯(41。〇、過氧化新癸酸第三己酯(45 C )、過氧化新癸酸第二丁酯(4yc )、過氧化新癸酸第三 (Ί 戊酯(46t:)、過氧化新戊酸第三己酯(53它)、過氧化新 戊酸第三丁酯(55°C)、過氧化新戊酸第三戊酯(55。〇、' 過氧化2-乙基己酸U,3,3-四甲基丁酯(65£3(:)、2,5_:τ 基-2,5-雙(2-乙基己醯基過氧化)己烧(66。〇)、過氧化:乙 基己酸第三己酯(70 C)、過氧化2-乙基己酸第三丁酯(72 °C )、過氧化2-乙基己酸第三戊酯(7rc )、過氧化異曰丁酸 第三丁酯(82°C )、過氧化異丙基單碳酸第三己酯(95。〇)、 過氧化馬來酸第三丁酯(%°c)、過氧化正辛酸第三戊酯(96 ( °C)、過氧化異壬酸第三戊酯(96。〇、過氧化3,55_曰三甲 基已酸第三丁醋(97 C )、過氧化月桂酸第三丁醋(98。匸)、 過氣化異丙基單碳酸第三丁酯(99。〇、過氧化厶乙美己 基單碳酸第三丁酯(99°C )、過氧化笨曱酸第三己酯^99 它)、2,5_二甲基-2,5-雙(苯曱醯基過氧化)己烷(1〇〇^)、 過氧化乙酸第三戊酯(100°C)、過氧化苯甲酸第三戊g °C)、過氧化乙酸第三丁酯(102°C)、過氧化苯甲酸^三丁 酯(104〇C)。 — 二醯基過氧化物類的例子包括:二異丁醯基過氧化 29 200900816 )、一_3,5,5-三甲基己醯基過氧化物(60。〇)、二月 桂1過氧化物⑽)、過氧化琥賴(_恤心 peroxie (66C)、二笨曱醯基過氧化物(73。〇。 r U過ηΪ化二俩賴的例子包括:過氧化二碳酸二正丙 二第:匕二碳酸二異丙_ (41°C )、過氧化二碳 酉=(木第二丁基環己基)醋(4rc)、過氧化二碳酸二-2_Corporation catalogue and the above p〇iymer HandB〇〇k). Examples of the oxy ketones produced include methyl ethyl ketone peroxide (1 〇 9r ), hexanone peroxide (1 〇〇 〇), and the like. Further, examples of the peroxy ketals include .1,1-bis(Third hexylperoxy)·3,3,5·trimethylcyclohexane (87〇c), 1,1-double (second Hexyl peroxidation) cyclohexene (87 ° c), 1,; [_ double (t-butyl peroxy) 3⁄4 hexane (91 ° C), 2,2-bis (t-butyl peroxy) butyl Alkane (1〇3 c), ι,ι-(third amyl peroxide) cyclohexane (93ΐ), 4,4_bis(t-butylperoxy)pentanoic acid n-butyl vinegar (105t), 2 , 2_bis(4,4_di-t-butylperoxycyclohexyl)propane (953⁄4 ). . Examples of hydroperoxides include: hydrogen peroxide versus menthane (128 ° C), diisopropyl hydrazine hydroperoxide (145 ° C) (diis〇 propylbenzene hydr〇peroxide), u, 3, 3_4 Butyl butyl hydroperoxide (i53〇c), emulsified hydrogen cumene (156. 〇, 帛 tributyl hydroperoxide (167. 〇, etc.. Examples of di-based peroxide include bis (third butyl) Base oxidized) diisopropylbenzene (1I9 ° C), diisopropylphenyl peroxide (116. d1Cumyl peroxide, 2,5-dimethyl-2,5_bis (t-butyl) Oxidation) 28 200900816 27285 pif Hexane (118C), a second butyl isopropyl carbamide peroxide (12 〇. 〇, a third amyl peroxide U23X:), a di-tert-butyl peroxide (124). 〇), 2,5-monomethyl-2,5-bis(t-butylperoxy)_3_hexene (129 it) Examples of peroxyesters include: cumene peroxy neodecanoate (cumyl per〇Xyne〇deCan〇ate ) ( 37. 〇), peroxy neodecanoic acid, 1,1,3,3-tetramethylbutyl ester (41. 〇, perhexyl peroxy neodecanoate ( 45 C ), peroxy neodecanoic acid second butyl ester (4yc), peroxy neodecanoic acid (Ίpentyl ester (46t:), perhexyl peroxypivalate (53), third butyl peroxypivalate (55 ° C), third amyl peroxypivalate (55). 〇, 'U,3,3-tetramethylbutyl peroxy 2-ethylhexanoate (65£3(:), 2,5_:τ-group-2,5-bis(2-ethylhexyl) Peroxidation) (66. 〇), peroxidation: trihexyl ethylhexanoate (70 C), tert-butyl peroxy 2-ethylhexanoate (72 ° C), 2-B peroxide Third amyl hexanoate (7rc), third butyl peroxybutyrate (82 ° C), hexyl isopropyl monocarbonate (95 〇), maleic acid peroxide Tributyl ester (% ° c), third amyl peroxyoctanoate (96 ( ° C), third amyl peroxyisophthalate (96. 〇, peroxidation 3, 55 曰 trimethyl hexanoic acid Third vinegar (97 C), oxidized lauric acid, third butyl vinegar (98. 匸), pervaporated butyl butyl phthalate (99. 〇, 过 过 厶 美 己 单 单 单 第三Butyl ester (99 ° C), trihexyl peroxydecanoate ^99 it), 2,5-dimethyl-2,5-bis(phenylhydrazine peroxy)hexane (1〇〇^ ), Oxidized acetic acid third amyl ester (100 ° C), benzoic acid benzoic acid third pentane g ° C), peracetic acid tert-butyl acetate (102 ° C), benzoic acid benzoic acid tributyl acrylate (104 〇 C) — Examples of the dimercapto peroxides include: diisobutyl hydrazino peroxide 29 200900816 ), a _3,5,5-trimethylhexyl decyl peroxide (60. 〇), 2 laurel 1 peroxide (10)), oxidized sulphate (_ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Di-n-propanedicarbonate dicarbonate: diisopropyl hydrazine dicarbonate (41 ° C), dicarbenium oxyhydroxide = (wood t-butylcyclohexyl) vinegar (4rc), di-dicarbonate di-2 -

^土己_ (44°C)、過氧化丙基碳酸第三戊醋(96。〇、過 氧化2-乙基己基碳酸第三戍酯(99。〇。 心、’「、人’對起熱自由基聚合起始劑作用的偶氤化合物(亦 稱為偶氮^系熱自由基聚合起始劑」)進行說明。偶氮系熱 自由基聚合起始劑的例子包括:水溶性偶氤系熱自由基聚 ,起始劑、油溶性偶氮系熱自由基聚合起始劑、高分子偶 氮糸熱自由基聚合起始劑。 水溶性偶氮系熱自由基聚合起始劑的例子包括:2,2,-偶氮雙0(2-咪唑啉_2-基)丙烷]二硫酸鹽二水合物(46 。〇) 2’2·偶氮雙[N-〇羧基乙基)-;2-曱基丙胨]水合物(5? ^ )、2,2’-偶氮雙(2_[1-(2-經基乙基»米唑啉_2_基]丙烧} 二鹽酸鹽(60¾ )、2,2|-偶氮雙(1-亞胺基_1_吡咯烷酮基_2_ 乙基丙烷)二鹽酸鹽(67°C )、2,2'_偶氮雙[2-甲基_N_(2_羥基 土)丙胺](87 C )、2,2 -偶氮雙[2-(2-口米唾琳_2_基)丙烧] ,鹽酸鹽(44。〇、2,2,_偶氮雙(2_曱基丙脒)二鹽酸鹽(56 ^ )、2,2'_偶氮雙[2-(2-咪唑啉-2-基)丙院](61〇c )、2,2,·偶 。氮,{2甲基_Ν-[ι,ι_雙(輕基甲基)_2_經基乙基]丙醯胺} ( 8〇 30 200900816 27285pif 油溶性偶氮系熱自由基聚合起始劑的例子包括:2,2,_ 偶氮雙(4-甲氧基从二甲基戍腈)(3叱)、2,2,_偶氣雙(2_ 甲基丙酸一曱酯)(66°c )、Ι,Γ-偶氮雙(環己烷-1-曱腈)(88 C ) 1,1 [(氰基-1-曱基乙基)偶氮]甲醯胺(1〇4。〇 )、2,2’- 偶氮雙(Ν-環己基么甲基丙醯胺)(i i i t )、2,2,_偶氮雙(2,4· 二甲基,腈)(5rc)、2,2,_偶氮雙(2_甲基丁腈)(6rc)、^土己_ (44 ° C), peracetic acid propyl carbonate third vinegar (96. 〇, peroxy 2-ethylhexyl carbonate third oxime ester (99. 〇. heart, '", people' right An argon compound (also referred to as an azo-based thermal radical polymerization initiator) which acts as a thermal radical polymerization initiator is described. Examples of the azo-based thermal radical polymerization initiator include: water-soluble oxime Thermal radical polymerization, initiator, oil-soluble azo thermal radical polymerization initiator, polymer azo anthracene thermal radical polymerization initiator. Examples of water-soluble azo thermal radical polymerization initiator Including: 2,2,-azobis(2-imidazolin-2-yl)propane]disulfate dihydrate (46 〇) 2'2·azobis[N-fluorenylcarboxyethyl)- ; 2-mercaptopropyl hydrazine] hydrate (5? ^), 2,2'-azobis(2_[1-(2-transethylethyl)mazoline-2-yl]propane} Acid salt (603⁄4), 2,2|-azobis(1-imino-1-pyrrolidino-2-ylpropane) dihydrochloride (67 ° C), 2,2'-azo double [ 2-methyl_N_(2-hydroxyl)propylamine](87 C ), 2,2-azobis[2-(2-m-mistyl-2-yl)propanone], hydrochloride (44 〇 2,2,_Azobis(2-mercaptopropionamidine) dihydrochloride (56^), 2,2'-azobis[2-(2-imidazolin-2-yl)propyl] 61〇c ), 2, 2, · Even. Nitrogen, {2 methyl Ν-[ι,ι_ bis(light-based methyl)_2_ylidylethyl]propanamide} ( 8〇30 200900816 27285pif Examples of oil-soluble azo-based thermal radical polymerization initiators include: 2,2,-azobis(4-methoxy from dimethylformonitrile) (3叱), 2,2,_even double (2_monodecyl methacrylate) (66 ° c ), hydrazine, Γ-azobis(cyclohexane-1-carbonitrile) (88 C ) 1,1 [(cyano-1-indenyl) Azo]carbamamine (1〇4.〇), 2,2'-azobis(Ν-cyclohexylmethylpropionamide)(iiit), 2,2,_azo double (2 , 4· dimethyl, nitrile) (5rc), 2, 2, azobis(2-methylbutyronitrile) (6rc),

2,2’_偶氮雙[Ν·(2-丙烯基)-2-曱基丙酸胺](96。(:) 、2,2,-偶 氮雙(N-丁基-2-甲基丙醯胺)(11〇艺)。 一间刀子偶氮系熱自由基聚合起始劑的例子包括:含有 聚二甲基魏燒單^的高分子偶氮系熱自由基聚合起始 劑二含有紅二料元的高分子錢綠自由基聚合起始 劑等。另外’將此等化合物任意組合而成的混合物亦可用 作熱自由基聚合起始劑。 相對於100重量份合併有上述⑴及⑵的樹脂組 合,,自由基聚合起始劑較好的是001重量份〜30重量 份j熱自由基聚合起始劑的量過多,則黏度穩定性會變 差’右熱自由基聚合起始劑的量過少,則硬化性會變差。 (4)填充料 ^發,的填充料,是指為了控制液晶密封劑的黏度、 挺雨硬化物的強度、控制線膨脹性(li娜expansion)等 ==充劑。藉由填充填充料,可提高液晶密封劑的 ☆ ^。填充料若為通常電子材料領域中所使用的埴 充料,則無限制。 〃 酸鋇 上述填充料的例子包括:如碳賴 、竣酸鎮、硫 200900816 Ζ/Ζδ^ρΐΓ 硫酸鎂、矽酸鋁、矽酸锆、氧化鐵、氧化鈦、氧化鋁 ^alumma)、氧化鋅、二氧化矽、鈦酸鉀、高嶺土(ka〇iin)、 /月石粉(talc )、玻璃珠(giass beads )、絹雲母(sericite )、 活性白土( activated clay )、膨潤土( bentonite )、iuh 奴 氮化矽的無機填充料。 、,、 、,另外’於本發明中亦可使用有機填充料。所謂有機填 充料’是指通常藉由環球法(JACT試驗法:Rs_2)所測 定的軟化點溫度大於120。(:的有機化合物。其中,於本發 月中軟化點小於等於室溫的橡膠粒子亦可用作有機填充 料。有機填充料的例子包括:聚曱基丙烯酸曱酯、將聚笨 乙烯及可與其進行共聚合的單體類共聚合而形成的共聚 物、聚酯微粒子、聚胺基甲酸乙酯微粒子、橡膠微粒$Λ。 其中,就可降低液晶密封劑的線膨脹率而使其保持良 好形狀的方面而言,填充料較好的是無機填充料,'其中^ 二氧化矽、滑石粉因紫外線難以透過,故而尤佳。 無論是無機或有機的填充料,填充料的形狀均無特別 限定。即,可使用球狀、板狀、針狀等固定形狀或^非固 定形狀中的任一形狀的填充料。另外,填充料的平均一次 粒徑較好的是小於等於L5 _,且其比表面積較好的= 1 m2/g〜500 m2/g。含有此種填充料的液晶密封用硬化性樹 脂組成物,其觸變性與黏度的平衡性良好。填充料的平均 -次粒徑可藉由〗ISZ8825_1巾所揭示的雷射騎法㈤沉 diffractometry)進行測定,比表面積測定可藉由Jisz8^ 中揭示的 BET 法(Bmnauer-Emmett-Tdler meth〇d)進行 32 200900816 27285pif 測定。 或兩種以上:==:::觀點而言,較好的是將兩種 充料是指··材質不 使用。所謂兩種或兩種以上的填 同但平均粒徑不同的兩種種以上的填充料,材質相 二ί於:平^,,填充料較Si: 的是10重量份〜3〇重量;〜50重量份,更好 圍内,則易於將液晶密封用:tLf4的填充量在上述範 控制在u〜5.0的範圍ί用硬化性樹脂組成物的觸變指數 據[以Ε型黏;故而較好。上述觸變指數是根 嶋==:2rr5㈣的黏度_ 值。 5·〇 rpm下的黏度;|而求得的 (5)環氧硬化劑 液晶密封用硬化性樹脂組成 氧硬化,好的是潛伏性二二' 劑室到環氧樹脂中,於= 刪伏性環氧硬硬化劑。藉由 成物I的熱硬化性。 w文晶密封用硬化性樹月旨組 潛伏性環氧硬化劑可使用眾所周知者。其中,就勘度 33 200900816 ζ /ζδ^ρΐΓ 穩疋性優異的觀點^言,較好的是_或者藉由環球法 測得的軟化點溫度大於等於觸。c的潛伏性環氧硬化劑。 含^此潛錄環氧魏_組祕可用作—液型士 性環氧硬化劑的例子包括··有機酸二輯(。柳^ _ ^ihydrazuie)化合物 '味.坐(imidaz〇le)及其衍生物、雙 氰胺(dicyandiamide)、芳香族胺(ar〇matic amine)等。 此等潛伏性環氧硬化劑可適當組合成混合物使用。 對於塗佈組成物時所使用的網版印刷或分注哭,由於 組成物於裝置_滯留時間長,故而難以❹保;穩定性 差的組成物。就此方面而言,尤其是含有紐或藉由環球 法所測得的軟化點温度大於特·c之胺系潛伏性硬化 劑的組成物,由於在室溫下的黏度穩定性極為良好,故而 可於網版印刷或分注器中長時間使用。 。上述胺系潛伏性硬化劑的例子包括:雙氰胺(熔點為 209C )等雙氰胺類;己二酸二醯肼(熔點為181。〇 )、1,孓 又(肼基羰乙基)-5-異丙基乙内醯脲(⑽ carb0ethyl)-5-iS0pr0pyl hydantoin)(炼點為 l2(TC)、十二 烷二酸二醯肼(熔點為190。〇、癸二酸二醯肼(熔點為 C )_等有機酸二醯肼;2,4_二胺基_6_[2,_乙基咪唑_丨,-美]乙 基三嗪(熔點為215t〜225t )、2_苯基咪唑(溶點為土 137 C〜147°C)等咪唑衍生物。 就獲得黏度穩定性及接著可靠性優異的液晶密封用硬 化性樹脂組成物〗的觀點而言,相對於1〇〇重量份的樹脂 、、且δ,潛伏性環氧硬化劑的含量較好的是3重量份〜%重 34 200900816 27285pif 結晶法等而高劑較好的是藉由水洗法、再 (6)環氧樹脂 液晶密封用硬化性樹脂秀且成物j亦可 脂。所謂本發明的環氧樹脂, I氧樹 以上環氧基的化合物(其中,上;:以, Α、二應二ΐΓ中的環氧樹㈣例子包括=ί; 及將上述芳香族二醇類以乙二醇:丙^ 醇類以 f , (epi〇Worohy 而獲侍的料族乡元縮水甘 :反應 雙^作為原料而製成者表2二^將以 由苯紛或甲齡盘甲酸^―斗/、 1辰虱樹脂」); 苯紛或其共聚物等所二表的开 = 的^清漆樹脂、聚烯基 氯醇反應而獲得的.'^ ^^101)類’與表 ‘基㈣uy】yieneph-resm)的縮水甘㈣匕二 苯』:清1=!的是_清漆型環氧樹脂、 環氧樹赌、三苯紛;,卢月曰:雙齡A型環氧樹脂、雙齡F型 腊、三笨_環氧樹:型苯齡乙炫型環氧樹 環氧樹脂、聯—衣戊一烯型環氧樹脂、苯醚型 理而形成者。 疋稽由刀子瘵餾法等進行高純度化處 35 200900816 較好的是 等於贼,且得陳化點大於 於:若環氧樹脂的軟化點或〜10_。其原因在 内,則環氧樹脂於液晶中的溶 =刀子量在上述範圍 晶顯示面板的顯示特性^ 、擴散性低,所得的液 二,,上述⑴丙稀酸樹脂的:於上,環2,2'-azobis[Ν·(2-propenyl)-2-mercaptopropionic acid amine](96.(:), 2,2,-azobis(N-butyl-2-methyl) Propylamine (11 〇). An example of a knife azo-based thermal radical polymerization initiator includes: a polymer azo-based thermal radical polymerization initiator containing polydimethyl carbaryl 2. A polymer green-green radical polymerization initiator containing a red binary material, etc. Further, a mixture of any of these compounds may be used as a thermal radical polymerization initiator. In the resin combination of the above (1) and (2), the radical polymerization initiator is preferably from 001 parts by weight to 30 parts by weight, and the amount of the thermal radical polymerization initiator is too large, and the viscosity stability is deteriorated. When the amount of the polymerization initiator is too small, the hardenability is deteriorated. (4) The filler is a filler which is used to control the viscosity of the liquid crystal sealing agent, the strength of the hardened product, and the control line expansion property.娜expansion) etc. == Filling agent. By filling the filler, the liquid crystal sealant can be improved. If the filler is used in the field of common electronic materials, There are no restrictions on the filling. 〃 钡 钡 钡 钡 钡 钡 钡 钡 钡 钡 钡 钡 钡 钡 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 Aluminum ^alumma), zinc oxide, cerium oxide, potassium titanate, kaoliniin, talc, giass beads, sericite, activated clay, Inorganic filler of bentonite (bentonite) and iuh slave tantalum nitride. Further, an organic filler may be used in the present invention. The term "organic filler" means that the softening point temperature is usually greater than 120 as measured by the ring and ball method (JACT test method: Rs_2). (: an organic compound. Among them, rubber particles having a softening point less than or equal to room temperature in the present month can also be used as an organic filler. Examples of the organic filler include: polydecyl acrylate, polystyrene and a copolymer, a polyester fine particle, a polyurethane fine particle, and a rubber fine particle formed by copolymerization of a monomer copolymerized therewith, wherein the linear expansion ratio of the liquid crystal sealing agent can be kept low. In terms of shape, the filler is preferably an inorganic filler, and it is particularly preferable that the cerium oxide and talc are difficult to permeate due to ultraviolet rays. No matter the inorganic or organic filler, the shape of the filler is not particularly special. That is, a filler of any shape such as a spherical shape, a plate shape, or a needle shape, or a non-fixed shape may be used. Further, the average primary particle diameter of the filler is preferably L5 _ or less, and The specific surface area is preferably from 1 m 2 /g to 500 m 2 /g. The curable resin composition for liquid crystal sealing containing such a filler has good balance between thixotropy and viscosity. Average-secondary particle size of the filler By〗 ISZ8825_1 napkin disclosed laser riding Shen Diffractometry v) is measured, the measurement may be disclosed by Jisz8 ^ BET method (Bmnauer-Emmett-Tdler meth〇d) the specific surface area was measured for 32 200900816 27285pif. Or two or more: ==::: From the point of view, it is better to use two kinds of materials to mean that the material is not used. Two or more kinds of fillers with two or more kinds of filling materials but different average particle diameters, the material phase is two: flat, and the filler is 10 parts by weight to 3 〇 by weight of Si: ~50 In parts by weight, it is easier to use for liquid crystal sealing: the filling amount of tLf4 is controlled in the range of u~5.0 in the above range, and the data of the thixotropic index of the curable resin composition is used. . The above thixotropic index is the viscosity _ value of root 嶋 ==: 2rr5 (four). 5·〇 〇 rpm viscosity; | and obtained (5) epoxy hardener liquid crystal sealing with curable resin composed of oxygen hardening, preferably latent two or two 'agent room to epoxy resin, = deflated Epoxy hard hardener. By the thermosetting property of the product I. W-crystal seals for hardening trees. The latent epoxy hardeners can be used. Among them, in the case of the survey 33 200900816 ζ /ζδ^ρΐΓ excellent stability, it is better that the temperature of the softening point measured by the ring and ball method is greater than or equal to the touch. a latent epoxy hardener for c. Examples of the inclusion of this smear epoxy wei group can be used as a liquid-type epoxy hardener: ······························································ And its derivatives, dicyandiamide, ar〇matic amine, and the like. These latent epoxy hardeners can be suitably combined into a mixture. The screen printing or dispensing crying used in coating the composition is difficult to maintain due to the long residence time of the composition in the apparatus, and the composition is inferior in stability. In this respect, in particular, a composition containing a neodymium or an amine-based latent hardener having a softening point temperature greater than that of the specific one measured by the ring and ball method is extremely excellent in viscosity stability at room temperature. Used for a long time in screen printing or dispensers. . Examples of the above amine-based latent curing agent include dicyandiamides such as dicyandiamide (melting point: 209C); diterpene adipate (melting point: 181. 〇), 1, hydrazine (mercaptocarbonylethyl) -5-isopropylethyl carbazide ((10) carb0ethyl)-5-iS0pr0pyl hydantoin) (refining point is l2 (TC), dodecanedioic acid dihydrazide (melting point 190. bismuth, azelaic acid diterpenoid) (melting point C) _ and other organic acid dioxins; 2,4-diamino _6_[2,_ethylimidazolium oxime,-beauty]ethyltriazine (melting point 215t~225t), 2_benzene An imidazole derivative such as a thiol imidazole (melting point is 137 C to 147 ° C). The weight of the curable resin composition for liquid crystal sealing excellent in viscosity stability and subsequent reliability is relative to 1 〇〇. The content of the resin, and δ, the latent epoxy hardener is preferably 3 parts by weight to 3% by weight. The crystallization method is preferably used by a water washing method or a (6) epoxy resin. The curable resin for resin liquid crystal sealing can also be used as a resin. The epoxy resin of the present invention is a compound of an epoxy group having an oxygen tree or more (in which: Examples of the epoxy tree (4) in the sputum include = ί; and the above aromatic diols are ethylene glycol: propyl alcohols, f, (epi 〇 Worohy, the material of the family is shrinking: reaction double ^ As a raw material, the manufacturer 2 2 will be a varnish resin which is opened by the benzene or the age of the formic acid, and the styrene resin or the copolymer thereof. The polystyyl chlorohydrin obtained by the reaction of ''^^^101)' and 'table' (4) uy] yieneph-resm) is a varnish-type epoxy resin. Epoxy tree gambling, triphenyl sulphate;, Lu Yuexi: double age A type epoxy resin, double age F type wax, three stupid _ epoxy tree: type benzene age Ethylene epoxy resin, joint - It is formed by the epoxy resin and phenyl ether type. The high purity is carried out by the knife retort method. 35 200900816 It is better to be equal to the thief, and the aging point is greater than: if epoxy The softening point of the resin is 〜10_. The reason is that the solubility of the epoxy resin in the liquid crystal = the amount of the knife in the above range, the display characteristics of the crystal display panel, and the diffusibility are low, and the obtained liquid 2, the above (1) propylene Acid resin: on, ring

靠性。就此觀點而言其且物件的接著可 分子量在1000〜2000的範目„疋%氧樹脂的重量平均 量例如可藉由 ⑺光自由基聚合起始作為—進行測定。 液晶密封用硬化性樹脂組成物χ亦可更含 t合起始劑。戶斤謂光自由美平人 土 產生白*其祕人^基起劑,是指可藉由光而 2自由基的化合物。含有光自由基聚合起始劑的液晶密 作旨組成物1可藉由光硬化而暫時硬化,故而 :。虽然,液晶密封用硬化性樹脂組成物I亦可不 2光自由基聚合起始劑。不含光自由基聚合起始劑的液 阳密封用硬化雜驗成物可僅藉由加熱㈣行硬化,故 而具有可省略於成本;§·面貞擔大的光硬化步驟的優點。 光自由基聚合起始劑並無特別限定,可使用眾所周知 的化合物。例如包括:安息香(benzoin)系化合物、苯乙 酉同(acetophenone )類、二苯曱酮(benzophenone )類、售 嘴_ Cthioxanthone)類、α •醯基肟g旨(α _acyl〇xime ester) 類、乙盤酸苯酯(phenyl glyoxylate )類、苄基(benzyl) 36 200900816 27285pif 類、偶糸化合物、二苯硫( diphenylsulfide )系化合物、 醯基膦氧化物(acyl phosphine oxide)系化合物、有機色 素(organic dye)系化合物、耿菁鉄(iron phthalocyanine ) 系、安息香類、安息香醚(benzoin ether )類、蒽醌 (anthraquinone)類 °Rely on sex. From this point of view, the weight average amount of the article having a molecular weight of 1000 to 2000 in the range of 1000 to 2000 can be determined, for example, by (7) photoradical polymerization initiation. The liquid crystal sealing is composed of a curable resin. The substance may also contain a t-initiator. The household is said to be light free. The human body produces white * its secret person ^ base agent, which refers to a compound which can be free radical by light. The liquid crystal dense composition of the initiator can be temporarily cured by photohardening. Therefore, the curable resin composition for liquid crystal sealing I may not be a photoradical polymerization initiator. The hardened hybrid test for the liquid positive seal of the polymerization initiator can be hardened only by heating (four), so that it can be omitted from the cost; § · The advantage of the photohardening step of the surface is large. Photoradical polymerization initiator It is not particularly limited, and well-known compounds can be used, for example, including: benzoin-based compounds, acetophenones, benzophenones, thiophenanthones, and α-mercaptopurines. g purpose _acyl〇xime ester), phenyl glyoxylate, benzyl 36 200900816 27285pif, oxime compound, diphenylsulfide compound, acyl phosphine oxide ) compounds, organic dye compounds, iron phthalocyanine, benzoin, benzoin ether, anthraquinone

相對於100重量份的樹脂組合,光自由基聚合起始劑 的含量較好的是0.1重量份〜5.〇重量份,更好的是0.3重 量份〜5.0重量份。此光自由基聚合起始劑的含量大於等 於0.3重量份的組成物藉由光照射的硬化性良好。另一方 面,此光自由基聚合起始劑的含量小於等於5 〇重量份的 組成物塗佈於基板上時的穩定性良好。 於使含有光自由基聚合起始劑的樹脂組成物硬化時, 其光源較好的是紫外線、可見光等。另外,光的照射量較 好的是 500 mJ/cm2〜1800 mj/em2。 (8)熱塑性聚合物The content of the photoradical polymerization initiator is preferably 0.1 part by weight to 5% by weight based on 100 parts by weight of the resin combination, more preferably 0.3 part by weight to 5.0 parts by weight. The photoradical polymerization initiator is more than 0.3 parts by weight of the composition, and the hardenability by light irradiation is good. On the other hand, the composition of the photoradical polymerization initiator having a content of 5 Å or less by weight or less is excellent in stability when applied to a substrate. When the resin composition containing a photoradical polymerization initiator is hardened, the light source is preferably ultraviolet light, visible light or the like. Further, the amount of light irradiation is preferably 500 mJ/cm2 to 1800 mj/em2. (8) Thermoplastic polymer

液晶密封用硬化性樹脂組成物工亦可更含有熱塑性聚 合物。所明熱雜聚合物,技藉由 成形為目標形狀的高分子化合物。 ^趴從而J 為50^2^7巾㈣塑絲合物雜化點溫度通常 為50C〜120C,較好的是崎〜 上述範_,則於上述樹脂㈣ 讀化點,皿度在 人物會於榭浐组心二:成的熱硬化時,熱塑性聚 進行一 月曰、(2)改貝%虱樹脂、(6)環 ^ 加熱時組成偏_度降低,目、3相谷’故而可抑制 啤低目此可抑制液晶线漏等。 37 200900816 相對於100重量份的樹脂組合,熱塑性聚合物的含量 較好的是1重量份〜3〇重量份。上述軟化點溫度可藉由環 球法(JACT試驗法:rs-2)進行測定。 、另外,由於熱塑性聚合物於液晶密封劑用硬化性樹脂 組,物中表現出良好的相容性,故而較理想的是平均粒經 通常為0.05㈣〜5㈣、較好的是〇 〇7轉〜3 _的 範圍。此種熱塑性聚合物可使用眾所周知者,較好的是以 50 Wt%〜99.9 wt% (重量百分比):5〇 wt%〜〇」站% (更 好的是60 wt%〜80 wt% : 4〇 wt%〜2〇研%),使(甲基)丙 烯酸S旨單體、和可與此單體進行絲合料體進行共聚合 而獲得的共聚物。並且,上述共㈣較好的是藉域化& 合(emulsion p〇lymerization )或懸浮聚合(卿⑽_ polymerization )等’以乳液狀態進行聚合而形成的共聚物。 上述(甲基)丙烯酸g旨單體的例子包括:(甲基)丙稀酸甲 醋、(甲基)丙烯酸乙醋、(甲基)丙烯酸两醋、丙稀酸丁醋、 (甲基)丙烯酸2-乙基己醋、(甲基)丙烯酸柄 酸十六s旨、(甲基)丙烯酸十八醋、(甲基)丙烯酸丁I)基乙 酷、(甲基)丙烯酸苯氧基乙醋、(甲基)⑽酸2_經美乙醋、 (甲基)丙烯酸縮水甘油酯等單官能(甲基)丙騎^單體或 此等單體的混合物。其巾,較好的是(甲基)⑽酸甲醋、 丙烯酸丁 S旨、(曱基)丙烯酸2·乙基已自旨或此等單體的混合 物。 口 可與上述(¥基)_咖賴it行料合的單體的例 子包括:丙烯酿胺(acrylamide)類;(甲基)丙稀酸、衣康 38 200900816 27285pif 酸(itaconic acid)、馬來酸(maleic acid)等酸單體;苯乙 烯、苯乙烯衍生物等芳香族乙烯化合物;1,3-丁二烯、1,3-戊二稀、異戊二稀、1,3·己二稀、氯丁二浠(chloroprene) 等共軛二烯(conjugated diene)類;二乙烯基苯、二丙烯 酸酯類等多官能單體。此等單體亦可混合使用。 (9)其他添加劑 液晶密封用硬化性樹脂組成物I亦可視需要而更含 有·石夕烧偶合劑(silane coupling agent)等偶合劑、離子 捕獲劑(ion trapping agent)、離子交換劑(ion exchange agent)、均化劑(levenng agent )、顏料、染料、塑化劑 (plasticizing agent)、消泡劑(antifoaming agent)等添力口 劑。另外’為了調整液晶顯示面板的間隙(gap),亦可調 配入間隔物(spacer)等。 本發明的第二液晶密封用硬化性樹脂組成物的特徵在 於:其除了含有上述(3)熱自由基聚合起始劑、(4)填充 料以外,還含有(10) 1分子内具有可進行自由基聚合的 碳·碳雙鍵的自由基硬化性樹脂、及(U)自由基鏈轉移劑。 具有上述特徵的本發明的液晶密封用硬化性樹脂組成物亦 稱為「液晶密封用硬化性樹脂組成物Π」或「樹脂組成物 Π」。 樹脂組成物Π中所含的(3 )熱自由基聚合起始劑、(4 ) 填充料的具體例如上述已說明的内容。其中,樹脂組成物 Π的(3)熱自由基聚合起始劑尤其好的是有機過氧化物、 偶氮化合物、安息香類、安息香醚類、苯乙酮類。 39 200900816 (10) 1分子内具有可進行自由基聚合的碳_碳雙鍵的 自由基硬化性樹脂 所謂本發明的1分子内具有可進行自由基聚合的碳_ 碳雙鍵的自由基硬化性樹脂(亦簡稱為「自由基硬化性樹 脂」),是指1分子内具有如乙烯性不飽和鍵的可進行自由 基聚合的碳-碳雙鍵的化合物。The curable resin composition for liquid crystal sealing may further contain a thermoplastic polymer. The known thermally heteropolymer is formed by molding a polymer compound having a target shape. ^趴 thus J is 50^2^7 towel (four) plastic wire compound hybrid point temperature is usually 50C~120C, preferably is the same as the above-mentioned van _, then in the above resin (four) reading point, the dish in the character will In the group of two cores: when the heat is hardened, the thermoplastic polymer is polymerized for one month, (2) the shell is modified by the resin, and (6) the ring is heated. The composition is reduced by _degree, and the phase and the three phase valleys are Inhibition of beer is low, which can suppress liquid crystal line leakage and the like. 37 200900816 The content of the thermoplastic polymer is preferably 1 part by weight to 3 parts by weight based on 100 parts by weight of the resin combination. The above softening point temperature can be measured by a ball method (JACT test method: rs-2). Further, since the thermoplastic polymer exhibits good compatibility in the curable resin group for a liquid crystal sealing agent, it is preferred that the average particle diameter is usually 0.05 (four) to 5 (four), preferably 〇〇7 rotation. ~3 _ range. Such a thermoplastic polymer can be used as is well known, preferably 50 Wt% to 99.9 wt% (by weight): 5 wt% to 〇% of the station (more preferably 60 wt% to 80 wt%: 4) 〇wt%~2〇研%), a copolymer obtained by copolymerizing a (meth)acrylic acid S monomer and a silk-blendable body with the monomer. Further, the above-mentioned total (four) is preferably a copolymer formed by polymerization in an emulsion state, such as emulsion p〇 lymerization or suspension polymerization (clear polymerization). Examples of the above-mentioned (meth)acrylic acid-based monomer include (meth)acrylic acid methyl vinegar, (meth)acrylic acid ethyl vinegar, (meth)acrylic acid vinegar, acrylic acid butyl vinegar, (methyl) 2-ethylhexyl acrylate, (meth)acrylic acid, 16 s, (meth)acrylic acid octadecyl, (meth)acrylic acid butyl I), ethyl (meth) acrylate phenoxy Vinegar, (meth) (10) acid 2 - a monofunctional (meth) propyl monomer such as acetaminophen, glycidyl (meth) acrylate or a mixture of such monomers. The towel is preferably a mixture of (meth)(10) acid methyl vinegar, acryl butyl acrylate or (mercapto)acrylic acid 2 ethyl group or a monomer thereof. Examples of the monomer which can be combined with the above (¥基)_咖赖it include: acrylamide; (meth)acrylic acid, itacon 38 200900816 27285pif acid (itaconic acid), horse Acid monomer such as maleic acid; aromatic vinyl compound such as styrene or styrene derivative; 1,3-butadiene, 1,3-pentadiene, isoprene, 1,3· A conjugated diene such as dichloro, chloroprene or a polyfunctional monomer such as divinylbenzene or diacrylate. These monomers can also be used in combination. (9) Other additives The curable resin composition for liquid crystal sealing I may further contain a coupling agent such as a silane coupling agent, an ion trapping agent, or an ion exchanger. Agent), a homogenizing agent, a pigment, a dye, a plasticizing agent, an antifoaming agent, and the like. Further, in order to adjust the gap of the liquid crystal display panel, a spacer or the like may be disposed. The second liquid crystal sealing curable resin composition of the present invention is characterized in that it contains (10) 1 molecule in addition to the above (3) thermal radical polymerization initiator and (4) filler. A radically curable resin of a radically polymerized carbon-carbon double bond and a (U) radical chain transfer agent. The curable resin composition for liquid crystal sealing of the present invention having the above-described characteristics is also referred to as "curable resin composition for liquid crystal sealing" or "resin composition". Specific examples of the (3) thermal radical polymerization initiator and (4) filler contained in the resin composition crucible are as described above. Among them, the (3) thermal radical polymerization initiator of the resin composition is particularly preferably an organic peroxide, an azo compound, a benzoin, a benzoin ether or an acetophenone. 39 200900816 (10) A radically curable resin having a carbon-carbon double bond capable of undergoing radical polymerization in one molecule, and a radical curable property of a carbon-carbon double bond capable of undergoing radical polymerization in one molecule of the present invention The resin (also simply referred to as "radical curable resin") refers to a compound having a carbon-carbon double bond capable of undergoing radical polymerization such as an ethylenically unsaturated bond in one molecule.

上述自由基硬化性樹脂的例子包括:(甲基)丙烯酸酯 單體或其等的募聚物、烯丙醇衍生物(allyl alcohol derivative)、乙烯基化合物,並無特別限定。上述⑴丙 烯酸樹脂及(2)改質環氧樹脂包括在上述自由基硬化性樹 脂中。 —上述(甲基)丙烯酸酯單體或其等的寡聚物並無特別限 疋,例如包括上述(丨)丙烯酸樹脂中所列舉者。 ^上述烯丙醇衍生物的例子包括:氰尿酸三烯丙酯、異 ,尿酉夂一烯、馬來酸二稀丙g旨、己二酸二烯丙醋、鄰 J二甲酸二烯丙酯、間苯二曱酸二烯丙酯、偏苯三曱酸三 、丙知、均苯四甲酸四烯丙酯、甘油二婦丙ϋ、三經甲基 稀丙_季戊四醇二烯丙謎、季戊四醇三稀丙鱗、 丙酉日翻日類。上述乙烯基化合物的例子包括二乙稀基苯。 I含ίί 自由基硬化性樹脂,可使用1分子内兼 物。^了 官能基、及環氧基等不同官能基的化合 較好的炭其雙鍵較好的是(甲基)丙稀酿基;不同官能基 環氧基及2自由基硬化性樹脂_时架内兼具 (甲基)丙烯醯基,故而與其他自由基硬化性樹 40 200900816 27285pif 目曰容=成^成物Π之任意成分的上述⑷環氧樹脂的 質乂:封:觀:二自由,硬化性一 較奸“以外,接著可靠性亦變得良好。Examples of the radical curable resin include a (meth) acrylate monomer or a like polymer, an allyl alcohol derivative, and a vinyl compound, and are not particularly limited. The above (1) acrylic resin and (2) modified epoxy resin are included in the above-mentioned radical curable resin. The oligomer of the above (meth) acrylate monomer or the like is not particularly limited, and includes, for example, those exemplified above. ^Examples of the above allyl alcohol derivatives include: triallyl cyanurate, iso-, urinary mono-ene, maleic acid di-propyl propylene glycol, adipic acid diene vinegar, ortho-J dicarboxylic acid diene propylene Ester, diallyl isophthalate, trimellitic acid tris, propionate, tetraallyl pyromellitate, dipotassium glycerin, trimethyl propyl propylene pentaerythritol diene Pentaerythritol, tri-propyl propyl scales, and propylene-dyed days. Examples of the above vinyl compound include diethylbenzene benzene. I contains ίί free radical curable resin, which can be used in one molecule. The carbon having a different functional group such as a functional group and an epoxy group is preferably a (meth) acrylonitrile group; a different functional group epoxy group and a 2-radical curable resin. The (meth) acrylonitrile group in the frame is combined with other radical sclerosis tree 40 200900816 27285pif = = = = = = = = = = = Freedom, hardenability, and more, the reliability is also good.

Fed〇rs ^ (1) 性、二舰1於此自由基硬化性樹脂於液晶中的溶解 接供顯_护(14自而含有此自由基硬化性樹脂的組成物可 L义好的液晶顯示面板。另外,由於此自由基 =樹紀、上述(6)環氧樹脂的相容性亦良好,故而可 3均質二:物,因此可提供接著可靠性優異的樹脂組 Γ分子量及溶解度參數㈣值)的計算方 而將烯酸樹脂的說明中所提示的方法相同,故 (η)自由基鏈轉移劑 本發明的自由 藉由指於自由基聚合反應中 鏈轉移劑⑺如Ti4^應騎性點轉移的化合物。自由基 radical)( P ·)反庳:()所不’與增長自由基(ProP卿ting (T.)。所謂增長^生成具有新的聚合活化能的自由基 起始劑分^(Ρ.),是指聚合性化合物依序與 此而生成的新的自2由基進行加成而生成的自由基。如 合性化合物(M)及f (T.)如下述式(2)所示,與聚 應而生成增長自由基(Ρ1.)。 41 200900816 力 邪卜述式(3)所示,堉吾白士甘 化合物反應而生成增長自由性 率常數設為Κρ,將下述式(1)的正反庫二=正增長速 則為了產生自由基鏈轉移反應,必須。設為ktr, 此處所示的自由基反應的詳細内容是揭示於^外, Polymerization HandBook ( 年)的第 % 辇 lcal 式⑴Ρ.+Τ_ρ + Τ. Μ寺肀。 式(2) Τ. +Μ—Ρ1 ·Fed〇rs ^ (1) Sexuality, the second ship 1 dissolves in the liquid crystal in this free radical curable resin. (14) The liquid crystal display of the composition containing the radical curable resin In addition, since the free radical = the tree and the (6) epoxy resin have good compatibility, the product can be homogenized, so that the molecular weight and solubility parameters of the resin group excellent in reliability can be provided (4) The calculation method of the value is the same as the method suggested in the description of the enoic acid resin, so the (η) radical chain transfer agent is freely represented by the chain transfer agent (7) such as Ti4^ in the radical polymerization reaction. Sex transfer compound. Free radical radical) (P ·) 庳: () does not 'with increasing free radicals (ProP Qing ting (T.). The so-called growth ^ generates a radical initiator with new polymerization activation energy ^ (Ρ. In the meantime, the polymerizable compound is sequentially added to the new radical formed by the addition of the two groups. The compound (M) and f (T.) are as shown in the following formula (2). And the accumulation of free radicals (Ρ1.). 41 200900816 The force of the evil spirits (3) shows that the growth-freeness rate constant generated by the Liguline compound is set to Κρ, and the following formula (1) The positive and negative library 2 = positive growth rate in order to generate a free radical chain transfer reaction, it must be set to ktr, the details of the radical reaction shown here are disclosed in the outside, the first part of the Polymerization HandBook (year) Lcal (1)Ρ.+Τ_ρ + Τ. Μ寺肀. Equation (2) Τ. +Μ—Ρ1 ·

式(3 ) Ρ* + Μ·—Ρ2. 如上所述§有自由基鏈轉移劑的本發明的液晶密封 用硬化性樹脂組成物Π,其於硬化反應中所生成的增長自 由基Ρ.,與上述式(3)相比,更容易產生上述式〇)的 反應。即,容易生成自由基Τ·。Τ.根據式(2)與聚合性 化合物反應而生成Ρ1.。Ρ1.進而根據式(1)的反應而產 生新的Τ·自由基。由於上述式(1)、(2)的反應是連續進 行的’故而於液晶密封劑中會生成大量τ.、ρι.等的自由 基’因此,上述自由基可到達液晶密封劑的各處而高效地 進行硬化反應。其結果為:聚合性化合物的消耗速度加快, 液晶密封劑的硬化時間縮短,且硬化後的液晶密封劑中所 含的未硬化之聚合性化合物的量減少。 上述自由基鏈轉移劑的例子包括:i)硫醇類、i〇 α-甲基苯乙烯二聚物類、iii)末端不飽和曱基丙烯酸酯類、 iv )二苯基二硫醚等二硫醚類、及v )卟淋鈷錯合物 (porphyrin-cobalt complex)类頁。 42 200900816 27285pif i)硫醇類 ▲其中’根據以下原因,自由基鏈轉移 硫醇類。所謂硫醇類,是指j分子内具有 、^ :=: =,故而表現出其他自 0)自由基硬化性樹脂之碳-碳雙鍵的 加成反應性。因此,若將硫醇類用作自由基鏈轉移劑,則(3) Ρ* + Μ·-Ρ2. The sclerosing resin composition for liquid crystal sealing of the present invention having a radical chain transfer agent as described above, which is a growth radical which is formed during the hardening reaction. The reaction of the above formula () is more likely to occur than the above formula (3). That is, it is easy to generate a radical Τ·. Τ. According to formula (2), it reacts with a polymerizable compound to form hydrazine 1. Ρ1. Further, a new ruthenium radical is produced according to the reaction of the formula (1). Since the reaction of the above formulas (1) and (2) is carried out continuously, a large amount of radicals such as τ., ρι, etc. are generated in the liquid crystal sealing agent. Therefore, the radicals can reach the entire surface of the liquid crystal sealing agent. The hardening reaction is carried out efficiently. As a result, the rate of consumption of the polymerizable compound is increased, the curing time of the liquid crystal sealing agent is shortened, and the amount of the uncured polymerizable compound contained in the liquid crystal sealing agent after curing is reduced. Examples of the above radical chain transfer agent include: i) mercaptans, i〇α-methylstyrene dimers, iii) terminally unsaturated mercaptoacrylates, iv) diphenyl disulfide, etc. Thioethers, and v) porphyrin-cobalt complex type sheets. 42 200900816 27285pif i) Mercaptans ▲ Among them, free radical chain transfer thiols for the following reasons. The term "mercaptan" means that in the molecule of j, ^ :=: =, and thus the addition reactivity of the other carbon-carbon double bond of the radical curing resin is exhibited. Therefore, if a thiol is used as a radical chain transfer agent,

除了引起上述自由基鏈轉移反應以外,進而可引起上述加 成反應,故而可提高液晶密封劑的硬化速度。 另外,硫醇基對環氧基亦表現出加成反應性。因此, 如下所述,本發明的樹脂組成物![除了含有上述成分以 外,亦可更含有如上述(6)環氧樹脂的含有環氧基之化合 物’此種樹脂組成物Π可進一步提高硬化速度。 另外’伴隨自由基鏈轉移反應的硬化反應,通常雖可 提高硬化速度,但會使硬化物的分子量降低。但是,若使 用硫醇類作為自由基鏈轉移劑,則亦可期待由上述加成反 應所引起的硬化物之分子增大效果,故而亦可獲得可提高 硬化後的液晶密封劑的強度等進一步的效果。 可用作自由基鏈轉移劑的硫醇類的例子包括:(i-1) 疏基酯(mercaptoester )類、(i-2 )脂肪族多元硫醇(polythiol) 類、(i-3)芳香族多元硫醇類、(i-4)硫醇改質反應性矽油 (silicon oil)類。 所謂(i-1)巯基酯類,是指巯基羧酸與多元醇反應而 獲得的酯系硫醇化合物。以下,對可用於獲得魏基醋類的 酼基羧酸及多元醇、以及毓基酯類進行說明。 43 200900816 / ^υ_/ριι 上述魏基叛酸的例子包括:硫乙醇酸(thioglycolic acid)、2·魏基丙酸、3-魏基丙酸、2-疏基異丁酸、3-魏基 異丁酸。上述多元醇的例子包括:乙二醇、丙二醇、1,4_ 丁二醇、1,6-己二醇、甘油、三羥曱基丙烷、二(三羥曱基 丙烧)、季戊四醇、二季戊四醇、I,3,5-三(2-經基乙基)異三 氰尿酸、山梨糖醇(sorbitol)。 上述巯基酯類的例子包括:三羥甲基丙烷三(3-酼基丙 酸酯)、季戊四醇四(3-魏基丙酸酯)、3-疏基丙酸2_乙基己 酯。 (i-2)脂肪族多元硫醇類的例子包括:癸硫醇、乙二 硫醇、丙二硫醇、1,6-己二硫醇、1,1〇-癸二硫醇、二乙二 琉醇(diglycol dimercaptan)、三乙二硫醇、四乙二硫醇、 硫代一乙二硫醇、硫代三乙二硫醇、硫代四乙二硫醇。此 外’含有1,4-二售烧環(1,4-dithiane ring)的多元硫醇化 合物等環狀硫醚化合物、或藉由環硫樹脂(episulflderesin) 與胺等活性氫化物的加成反應而獲得的環硫樹脂改質多元 硫醇等亦包括在上述脂肪族多元硫醇類中。 (i-3)芳香族多元硫醇的例子包括:甲苯_2,4_二硫 醇、二甲苯二硫醇。另外,(⑷硫醇改質反應性石夕油類 的例子包括1基改質二甲基魏燒、M基改f二苯基石夕 氧炫。 上述硫醇類包括-級硫醇類、二級硫醇類。所謂一級 硫醇類’是指在與硫醇基鍵結的碳上鍵結有丨個烴基的硫 酵化3物。所謂二級硫醇’是指在與硫醇基鍵結的碳上鍵 44 200900816 27285pif 結有2個烴基的硫醇化合物。 右使用-級硫醇作為自由基鏈轉移劑,則如上所述, 其與碳_碳雙鍵基團的加成反應性優異,故而具有硬化物的 物性優異的優點。其中,由於反應性高,故而液晶密封劑 的保存穩定性有時會降低。另一方面,二級硫醇與碳_碳雙 鍵基團的加成反應性不及—級硫醇,故而具有液晶密封劑 的保存穩定性優異的優點。因此,本發明的自由基鏈轉移 ('> 舰好的是二級硫醇。含有此種二級硫醇的液晶密封劑尤 其適用於如下所述的所謂—液型液晶密封劑。 其中,二級硫醇較好的是分子内具有2個或2個以上 的二級硫醇基且數量平均分子量為4〇〇〜2〇〇〇者。於使含 有自由基鏈轉移劑的液晶密封劑進行硬化時,於此硬化物 中,若自由基鏈轉移劑未進入交聯體中,而作為單體殘留 下來,則自由基鏈轉移劑會於液晶中溶解、擴散,有降低 所製造的液晶顯示面板的顯示特性之虞。另一方面,數量 平均分子量為400〜2000的多官能二級硫醇容易進入交聯 體中。因此,由於含有此自由基鏈轉移劑的液晶密封劑不 易於液晶中溶解、擴散,故而所製造的液晶顯示面板的顯 示特性良好。 、 如上所述的二級硫醇,如上所述,較好的是使多元醇 與二級巯基羧酸反應而獲得者。數量平均分子量為4〇〇〜 2000的二級硫醇的例子包括:上述季戊四醇四酼基丁酸 醋)(數量平均分子量為544 8)、认^三⑶親基丁氧基乙 基)-1,3,5-三嗪-2,4,6(111,3氏511)-三酮)(數量平均分子量為 45 200900816 / ^u^/yn 567·7)。自由基鏈轉移劑的數量平均分子量例如可藉由 GPC,^以聚苯乙烯作為標準而進行測定。 曰 其-人’對硫醇類以外的鏈轉移劑進行說明。 ii) α-甲基苯乙烯二聚物類 。所谓α-曱基苯乙烯二聚物類,是指〗分子内具有反應 性%.-·碳雙鍵且發揮加成裂解型鏈轉移劑 (addition-fragmentation chain transfer agent)之作用的化 合物。上述曱基苯乙烯二聚物類的例子包括:2,4-二笨 基斗甲基小戊烯、2,4_二苯基斗甲基_2_戊烯、及三 曱基各笨基印貌(H^trimethyl-S-phenyl indane)。本發 明的甲基苯乙烯二聚物類並無特別限定,可使用眾所周 知者。 iii) 末端不飽和甲基丙烯酸_類 所謂末端不飽和曱基丙烯酸酯類,是指末端具有不飽 和鍵且有助於加成反應的甲基丙烯酸酯化合物。此種末端 不飽和甲基丙蝉酸酯類的例子包括:單體、二聚物........ η聚物。 iv) 二硫醚類 二琉醚類的例子包括:二苯硫醚、聚硫醚改質環氧樹 脂、二乙氧基曱烷-聚硫醚聚合物。 v) 卟啉鈷錯合物類 卟啉鈷錯合物類的例子包括:四(2,4,6-三甲苯基)外啉 姑(瓜)(cobalt(n)tetramesitylporphyrin)錯合物、四笨基 卟淋銘(皿)(cobalt(HI) tetraphenyl porphyrin)錯合物。另 46 200900816 27285pif 外,鈷錯合物亦可為 c〇-ch2c(ch3)3 、 c〇_ch(co2ch3)ch3 、 c〇-ch(co2ch3)ch2ch(co2ch3)ch3。 自由基鏈轉移劑亦可為具有起始轉移終止性 (iniferter)者。所謂起始轉移終止性,是指可實現自由基 聚合起始劑、自由基鏈轉移劑、自由基終止劑的三個作用 的性質。此種具有起始轉移終止性的自由基鏈轉移劑,可 藉由提供光能或熱能而產生上述式(丨)的逆反應,因此可 使自由基產生鏈轉移,並且提高液晶密封劑的硬化性。 上述具有起始轉移終止性的自由基鏈轉移劑的例子包 括.一硫化四乙基秋蘭姆(tetraethylthiuram disulfide)等 硫代胺基曱酸酯(thiocarbamate )系化合物、三苯基曱基 偶氮苯、四苯基乙烧衍生物。 上述液晶密封用硬化性樹脂組成物Π,除了含有上述 (3)、(4)、(1〇)、(11)以外,亦可更含有上述(5)環氧 硬化劑、(6)環氧樹脂、(7)光自由基聚合起始劑、(8) 熱塑,聚合物、(9)其他添加劑。關於上述化合物等的詳 、、-田内谷,以上已進行了說明,故而此處將說明省略。 > 士 ;樹月曰、、且成物;[[中,各成分的調配量並無特別限定, 就,脂組成物Π的硬化性或保存穩定性等觀點而言,較好 ^疋相對於1GG重量份的上述(1Q)自由基硬化性樹脂,⑴ …自由基聚合起始劑的含量4 0.01重量份〜5.G重量份。 此樹餘成物Π藉由熱自由基的硬化性良好,且其硬化物 ’、基板的接著強度提高。其中,若相對於(10)自由基硬 47 200900816 化性樹脂’(3)熱自由基聚合起始劑的含量大於5 〇重量 份,則樹脂組成物Π的黏度穩定性會變差。另一方面,若 上述含量小於0.01重量份,則熱自由基聚合起始劑的量過 少,故而樹脂組成物JI的硬化性有時會降低。 另外,相對於(10)自由基硬化性樹脂,(11 )自由基 鏈,移劑的含量較好的是_重量份〜5•。重量份,更ς 2是0.05重量份〜3.0重量份。此樹脂組成物^的黏度穩 =性優異’料,即使於基板上的配線複紅微細的情況 :組成物π的硬化反應亦可充分進行,故而未硬化 =二,Γ此可抑制液晶㈣液晶污染。其中,若相 自由基硬化性樹脂,(11)自 盥上述〔Ο产則曰產生如(10)自由基硬化性樹脂 ί的产1 / 的反應過度進行等硬化反應未適當進 自由黏度敎性有時會惡化。另—方面,若(⑴ 含量小於GQ1 轉效ff故而樹脂組成物她= 份〜25 Ha 3G重1份,更好的是5重量 高且流“故 有時會降低。另—方面,:而形成的硬化物的硬化強度 會降低。就 ,右,,,、機填充料少,則耐濕性有時 就上迷方面而言,將無機填充料的含量調節在上 48 200900816 27285pif 馳絲Π,其硬化物與基板的接著強度會 種特Π的如硬化性或保存穩定性等的各 自由基硬化性樹;旨,相對於削重量份的⑽ Η)重量份,更好的是2重^^ = ”為1重量份〜 :竭内的樹脂組成物D,可保持優異的 又心 且可4造接著可靠性高的液晶顯千面;。另 外,於樹腊組成物ϋ中,相 舌f曰U不面板另 基硬化性樹脂,⑷環氧樹重置伤的⑽)自由 40重量份。 衣贿月曰的含讀好的是1重量份〜 樹脂組成物Ε麵料所 己量二樹脂組成物π的黏度可根據各成分的調 = i節。利用Ε型黏度計於H5-度(初始黏度)在上述範圍内的樹脂 因==ί塗佈不均的情況下塗一^ 其中’若初始黏度大於等於5〇〜,則塗佈後的密封 遗保持性尤其優異。所謂密封形狀保持性,是彳 :使經過-段時間,密封形狀亦保持不變的性質。曰: 度大於# 15〇 Pa_s ’則密封形狀保持性會變得 /更力口良好。另外,若初始黏度小於等於伙^,則利用 刀左以錢晶密封辦,即使分注^的噴嘴餘為O b 49 200900816 mm〜0.5 mm的細徑,其塗佈作業性亦良好。 另外,樹脂組成物Π的觸變指數,即利用e型黏度古十 所測定的於25°C、0.5 rpm下的黏度7/ 1 ’與在25。〇、5 〇印功 下的黏度7? 2的比值7? 1/7? 2較好的是1.1〜5.0,更好的是 1.2〜2.5。此樹脂組成物Π的黏度是利用E型旋轉黏产’ (例如,BROOKFIELD公司製造的數位流變計,型號· DV-瓜ULTRA)’且利用半徑為12 mm、角度為3。的Cp_52In addition to the above-mentioned radical chain transfer reaction, the above-mentioned addition reaction can be caused, so that the curing rate of the liquid crystal sealing agent can be increased. Further, the thiol group also exhibits addition reactivity to the epoxy group. Therefore, the resin composition of the present invention is as follows. [In addition to the above-mentioned components, the resin composition containing an epoxy group-containing compound as in the above (6) epoxy resin may further increase the curing rate. Further, the hardening reaction accompanying the radical chain transfer reaction generally increases the curing rate, but lowers the molecular weight of the cured product. However, when a mercaptan is used as the radical chain transfer agent, the molecular growth effect of the cured product by the above-described addition reaction can be expected, and further, it is possible to further improve the strength of the liquid crystal sealing agent after curing. Effect. Examples of the mercaptans which can be used as the radical chain transfer agent include: (i-1) mercaptoester, (i-2) aliphatic polythiol, (i-3) aromatic Group of polythiols, (i-4) thiol modified reactive silicon oil (silicon oil). The (i-1) thiol ester refers to an ester thiol compound obtained by reacting a mercaptocarboxylic acid with a polyhydric alcohol. Hereinafter, the mercaptocarboxylic acid, the polyhydric alcohol, and the mercaptoester which can be used to obtain the Weiji vinegar will be described. 43 200900816 / ^υ_/ριι Examples of the above-mentioned Weiji retinoic acid include: thioglycolic acid, 2·weikipropionic acid, 3-weisylpropionic acid, 2-sulfisoisobutyric acid, 3-weiki Isobutyric acid. Examples of the above polyol include: ethylene glycol, propylene glycol, 1,4-butanediol, 1,6-hexanediol, glycerin, trishydroxypropylpropane, bis(trihydroxymethylpropane), pentaerythritol, dipentaerythritol , I, 3, 5-tris(2-p-ethylethyl)isotricyanoic acid, sorbitol. Examples of the above mercapto esters include trimethylolpropane tris(3-mercaptopropionate), pentaerythritol tetrakis(3-propionylpropionate), and 2-cisylpropionic acid 2-ethylhexyl ester. (i-2) Examples of the aliphatic polythiol include: decyl mercaptan, ethanedithiol, propylene dithiol, 1,6-hexanedithiol, 1,1 fluorene-dithiol, diethyl Diglycol dimercaptan, triethylenedithiol, tetraethylenedithiol, thio-ethanedithiol, thiotriethyldithiol, thiotetraethylenedithiol. Further, a cyclic thioether compound such as a polythiol compound containing a 1,4-dithiane ring or an addition reaction of an episulfide sulphur (episulflderesin) with an active hydride such as an amine The obtained cyclosulfide-modified polythiol or the like is also included in the above aliphatic polythiol. (i-3) Examples of the aromatic polythiol include toluene-2,4-dithiol and xylenedithiol. Further, ((4) Examples of the thiol-modified reactive lycopene oil include a 1-based modified dimethyl-Wei-sinter, a M-based modified bis-diphenyl oxaxan. The above-mentioned thiols include a -stage thiol, and Class thiols. The term "first-order thiols" refers to a thiol compound in which a hydrocarbon group is bonded to a carbon bonded to a thiol group. The so-called secondary thiol refers to a bond with a thiol group. Bonded carbon upper bond 44 200900816 27285pif has two hydrocarbyl thiol compounds. Right-use mercaptan as a radical chain transfer agent, as described above, its addition reactivity with carbon-carbon double bond groups It is excellent in the physical properties of the cured product, and therefore, the reactivity is high, and the storage stability of the liquid crystal sealing agent may be lowered. On the other hand, the addition of the secondary thiol and the carbon-carbon double bond group is added. The reaction is inferior to the grade thiol, and therefore has an advantage of excellent storage stability of the liquid crystal sealing agent. Therefore, the radical chain transfer of the present invention ('> ship is a secondary thiol. Containing such secondary sulfur The liquid crystal sealing agent for alcohol is particularly suitable for a so-called liquid crystal sealing agent as described below. The secondary thiol is preferably one having two or more secondary thiol groups in the molecule and having a number average molecular weight of 4 Å to 2 Å. The liquid crystal sealing agent containing the radical chain transfer agent is used. When the agent is hardened, if the radical chain transfer agent does not enter the crosslinked body and remains as a monomer, the radical chain transfer agent dissolves and diffuses in the liquid crystal, and the manufactured product is reduced. The display characteristics of the liquid crystal display panel. On the other hand, the polyfunctional secondary thiol having a number average molecular weight of 400 to 2000 easily enters the crosslinked body. Therefore, the liquid crystal sealing agent containing the radical chain transfer agent is not easy. Since the liquid crystal display panel is dissolved and diffused, the display characteristics of the liquid crystal display panel produced are good. The secondary thiol as described above is preferably obtained by reacting a polyol with a secondary mercaptocarboxylic acid as described above. Examples of the secondary thiol having a number average molecular weight of from 4 〇〇 to 2,000 include: the above pentaerythritol tetradecanoic acid vinegar (the number average molecular weight is 544 8), and the tris(3)-tert-butoxyethyl)-1 ,3,5-triazine -2,4,6 (111, 3 511)-trione) (the number average molecular weight is 45 200900816 / ^u^/yn 567·7). The number average molecular weight of the radical chain transfer agent can be measured, for example, by GPC, using polystyrene as a standard.曰 Its-human's description of chain transfer agents other than thiols. Ii) α-methylstyrene dimers. The α-mercaptostyrene dimer is a compound having a function of a %-carbon double bond in the molecule and functioning as an addition-fragmentation chain transfer agent. Examples of the above-mentioned mercaptostyrene dimers include: 2,4-dipyridylmethylpentene, 2,4-diphenylmethyl-2-pentene, and triterpene Printed (H^trimethyl-S-phenyl indane). The methylstyrene dimer of the present invention is not particularly limited, and those known to the public can be used. Iii) Terminal unsaturated methacrylic acid _ class The term terminal unsaturated methacrylate is a methacrylate compound having an unsaturated bond at the end and contributing to an addition reaction. Examples of such terminally unsaturated methyl propyl phthalates include: monomers, dimers, η polymers. Iv) Disulfide Examples of dioxins include diphenyl sulfide, polythioether modified epoxy resin, and diethoxydecane-polysulfide polymer. v) Examples of porphyrin cobalt complex porphyrin cobalt complexes include: tetra(2,4,6-trimethylphenyl) porphyrin (cobalt (n) tetramesitylporphyrin) complex, four Cobalt (HI) tetraphenyl porphyrin complex. Another 46 200900816 27285pif, the cobalt complex may also be c〇-ch2c(ch3)3, c〇_ch(co2ch3)ch3, c〇-ch(co2ch3)ch2ch(co2ch3)ch3. The free radical chain transfer agent can also be one having an initial transfer interminator. The term "terminating transfer termination" refers to the property of three functions of a radical polymerization initiator, a radical chain transfer agent, and a radical terminator. Such a radical chain transfer agent having an initial transfer termination property can generate a reverse reaction of the above formula (丨) by providing light energy or thermal energy, thereby allowing radicals to undergo chain transfer and improving the hardenability of the liquid crystal sealing agent. . Examples of the above radical chain transfer agent having an initial transfer terminator include a thiocarbamate compound such as tetraethylthiuram disulfide, and a triphenylsulfonium azo group. Benzene, tetraphenyl ethene derivative. The curable resin composition for liquid crystal sealing may further contain the above (5) epoxy curing agent and (6) epoxy in addition to the above (3), (4), (1), and (11). Resin, (7) photoradical polymerization initiator, (8) thermoplastic, polymer, (9) other additives. The details of the above-mentioned compounds and the like, and the Tanedo Valley have been described above, and thus the description thereof will be omitted. >士;树月曰,和成物;[[中, The amount of each component is not particularly limited, in terms of the hardening property or storage stability of the lipid composition ,, it is better The content of the (1)-radical polymerization initiator in the above (1Q) radical curable resin of 1 GG parts by weight is 4 0.01 parts by weight to 5.5% by weight. The residual material of the tree is excellent in the curability of the thermal radicals, and the cured product and the adhesion strength of the substrate are improved. In the case where the content of the (10) radical resin <(3) thermal radical polymerization initiator is more than 5 parts by weight, the viscosity stability of the resin composition 变 is deteriorated. On the other hand, when the content is less than 0.01 part by weight, the amount of the thermal radical polymerization initiator is too small, and the curability of the resin composition JI may be lowered. Further, with respect to the (10) radical curable resin, the (11) radical chain and the content of the shifting agent are preferably _ parts by weight to 5 parts. Parts by weight, more ς 2, are 0.05 parts by weight to 3.0 parts by weight. The resin composition has a stable viscosity and excellent properties. Even when the wiring on the substrate is reddish and fine, the curing reaction of the composition π can be sufficiently performed, so that it is not cured = two, thereby suppressing the liquid crystal (tetra) liquid crystal. Pollution. Among them, in the case of a phase-radical-curable resin, (11) the above-mentioned hydrazine is produced, and the hardening reaction such as the production of (10) radical-curable resin ί is excessively performed, and the softening reaction is not properly performed. Sometimes it gets worse. On the other hand, if (1) the content is less than GQ1 conversion ff, and the resin composition she = part ~ 25 Ha 3G weighs 1 part, it is better that the 5 weight is high and the flow "sometimes it will decrease. Another aspect: The hardening strength of the formed hardened material is lowered. As far as the right, the, and the machine filler are small, the moisture resistance is sometimes adjusted, and the content of the inorganic filler is adjusted to the upper 48 200900816 27285pif The adhesive strength of the cured product and the substrate may be characteristic of each radical hardening tree such as hardenability or storage stability; and it is more preferably 2 weights relative to the weight of the (10) 削) part by weight ^^ = " is 1 part by weight ~: The resin composition D in the exhaustion can maintain excellent concentricity and can be made into a highly reliable liquid crystal display surface; Further, in the composition of the eucalyptus wax, the tongue f曰U is not a double-walled curable resin, and (4) the epoxy tree is replaced by (10) free 40 parts by weight. The reading of the bribe is 1 part by weight ~ the resin composition Ε fabric is the amount of the resin composition π viscosity can be adjusted according to the composition of each component = i section. Use a Ε-type viscometer to coat the resin with H5-degree (initial viscosity) within the above range due to uneven coating of == ί. Where 'if the initial viscosity is 5 〇 or more, the seal after coating The retention is especially excellent. The so-called seal shape retention property is a property that the seal shape remains unchanged after a period of time.曰: Degree is greater than # 15〇 Pa_s ’ and the seal shape retention will become / more good. In addition, if the initial viscosity is less than or equal to the weight of the partner, the left side of the knife is sealed by a crystal, and even if the nozzle of the dispensing is a small diameter of O b 49 200900816 mm to 0.5 mm, the coating workability is also good. Further, the thixotropic index of the resin composition Π, i.e., the viscosity at 25 ° C and 0.5 rpm measured at e.g. 〇, 5 〇 print work viscosity 7? 2 ratio 7? 1/7? 2 is better 1.1 to 5.0, more preferably 1.2 to 2.5. The viscosity of the resin composition 是 is obtained by using an E-type rotary adhesive production (for example, a digital rheometer manufactured by BROOKFIELD Co., Ltd., model: DV-guar ULTRA), and has a radius of 12 mm and an angle of 3. Cp_52

型錐·板型感測器’於預定溫度下將液晶密封劑放置5分鐘 後所測定的值。 $ 上述觸變指數如上所述,是以較低的剪切速产 的黏度與以較高的剪切速度所測定的黏度之比值^因此疋 觸變,數高的流體於低剪切速度下會以高黏度進行流動, 而於高剪切速度下會以低黏度進行流動。因此,於以高剪 切速度來塗佈上述樹脂組成物时,上述樹脂組成物The cone-and-plate type sensor was used to place the liquid crystal sealant at a predetermined temperature for a value measured after 5 minutes. The above thixotropic index is as described above, which is the ratio of the viscosity at a lower shear rate to the viscosity measured at a higher shear rate. Therefore, the thixotropy is high, and the high number of fluids are at a low shear rate. It will flow at a high viscosity and will flow at a low viscosity at high shear rates. Therefore, when the above resin composition is applied at a high cutting speed, the above resin composition

Si :故而㈣基板的塗佈性良好。於由此種樹脂組成 物士所形成的密封部上’不易發生液㈣漏,另外,由於 此柄·月曰組成物jj的消泡性優異, 板的可靠性優異。 u向所^的液-顯不面 於:三液晶密封用硬化性樹脂組成物的特徵在 充料“,更(3)熱自由基聚合起始劑及(4)填 鍵、氫鍵官自1 i )具有可進行自由基聚合的碳-碳雙 包含選自由=叫氧基_餘成物;此麟組成物 以上的樹月旨;^定的樹脂所組成之族群中的兩種或兩種 玲,处(12)樹脂組成物中的氫鍵官能基量為 50 200900816 27285pif l_(b^4 m〇i/g〜6 0χ10-3 m〇1/g ;上述(12)樹脂組成物中 的環氧基量為l.OxlO4 mol/g〜2.6xKT3 mol/g。具有上述特 徵的本發明的液晶密封用硬化性樹脂組成物亦稱為「液晶 德封用硬化性樹脂組成物瓜」或「樹脂組成物皿」。 (12)具有可進行自由基聚合的碳_碳雙鍵、氫鍵官能 基、及環氧基的樹脂組成物 本發明的液晶密封用硬化性樹脂組成物皿包含選自特 定的樹脂族群中的兩種或兩種以上的樹脂,且含有具有可 進行自由基聚合的碳_碳雙鍵、氫鍵官能基、及環氧基的樹 脂組成物(亦簡稱為「硬化性樹脂」)。 所明可進行自由基聚合的碳_碳雙鍵,是指可藉由自由 基而進行聚合反應的官能基。可進行自由基聚合的碳-碳雙 鍵的較好的例子包括:乙烯基、稀丙基、丙稀醯基、甲基 丙稀醯基。其中,可進行自由基聚合的务碳雙鍵較好的是 (甲基)丙烯醯基。 .所明氫鍵官能基,是指具有氫鍵性的官能基或配位基 i (ligand )。具有氳鍵性的官能基的例子包括:基、 基、-NHR基(R表示脂肪族烴基、芳香族基)、_c〇nh2 基基、-基。具有氫鍵性的配位基的例子包 括:-NHCO-配位基、_CONHC〇·配位基、或_丽_祕配位 基。此等中,本發明的氫鍵官能基較好的是由_〇H所表示 的經基、由-NHC Ο -所表示的胺基甲酸乙酯配位基(亦簡稱 為「胺基曱酸乙醋基」)。 上述(12)硬化性樹脂具有如(甲基)丙烯醯基的可進 51Si: Therefore, (4) the coating property of the substrate is good. In the sealing portion formed of the resin composition, the liquid (4) leakage is less likely to occur, and the stalk composition is excellent in the defoaming property of the stalk composition, and the reliability of the sheet is excellent. u to the liquid - no difference: three liquid crystal sealing with a curable resin composition characterized by charging ", more (3) thermal radical polymerization initiator and (4) filling, hydrogen bonding official 1 i ) having a carbon-carbon double bond capable of undergoing radical polymerization, comprising two or two groups selected from the group consisting of = oxy group and the remainder; The amount of hydrogen bond functional group in the resin composition of (12) is 50 200900816 27285pif l_(b^4 m〇i/g~6 0χ10-3 m〇1/g; in the above (12) resin composition The amount of the epoxy group is 1.OxlO4 mol/g to 2.6 x KT3 mol/g. The curable resin composition for liquid crystal sealing of the present invention having the above characteristics is also referred to as "curable resin composition for liquid crystal sealing" or "Resin composition". (12) Resin composition having a carbon-carbon double bond, a hydrogen bond functional group, and an epoxy group capable of undergoing radical polymerization. The curable resin composition for liquid crystal sealing of the present invention comprises Two or more resins from a specific resin group, and having a carbon-carbon double bond capable of undergoing radical polymerization, a hydrogen bond functional group And a resin composition of an epoxy group (also referred to simply as "curable resin"). The carbon-carbon double bond which can be radically polymerized means a functional group which can be polymerized by a radical. Preferable examples of the radically polymerized carbon-carbon double bond include a vinyl group, a propyl group, an acrylonitrile group, and a methyl propyl group. Among them, a carbon-bonded double bond which can be subjected to radical polymerization is preferred. Is a (meth) acrylonitrile group. The hydrogen bond functional group is a functional group or a ligand i (ligand) having a hydrogen bond. Examples of the functional group having a hydrazone bond include: a group, a group, -NHR group (R represents an aliphatic hydrocarbon group, an aromatic group), a _c〇nh2 group, or a group. Examples of the ligand having a hydrogen bond include: -NHCO-coordination group, _CONHC〇-coordination group, Or a hydrazone ligand. In the above, the hydrogen bond functional group of the present invention is preferably a thiol ligand represented by _〇H and an urethane ligand represented by -NHC Ο (Also abbreviated as "amino acetate"). The above (12) curable resin has a (meth) acrylonitrile group.

200900816 ^ ' ·ώ〇^υΐ I 仃自由基聚合的碳-碳雙鍵。因此,(12)硬化性樹脂包括 在上述(10)自由基硬化性樹脂中。 、如上所述,要求液晶密封劑具有優異的耐洩漏性。由 於液晶洩漏容易在液晶密封劑的硬化緩慢時發生,故而以 光,行硬化時’若存在遮光部分,則液㈣漏會變的更加 ,,,因此液晶密封劑較好的是僅可藉由熱而進行硬化。 但是,通常於加熱硬化時,液晶密封劑的黏度會降低,因 此即使藉由加熱而進行硬化亦會發生液晶洩漏。因此,較 2有效的是減少液晶密封劑於加熱時的黏度降低。為了減 少液晶密封劑於加熱時的黏度降低,較好的是提高液晶密 封劑中所含的硬化性樹脂的硬化性。 根據上述情況,由於樹脂组成物m中 脂的氫鍵官能基量W-V〇1/g〜6.0xl0-3m〇1/g,故而 硬化速度快。其機制雖不明確,但可作出如下推測:若存 在某固定量的氫鍵官能基’則硬化性樹齡子之間會因氫 鍵^相互吸引’從而相互接近而躲,因此使硬化反應更 佳容易進行。齡之’由_互接近的可進行自由基聚合 的碳-碳雙鍵之間、及相互接近的環氧基之間會迅速反應, 故而本發明的硬化性樹脂的硬化速度快。 氣鍵官能基量是將上述氫鍵官能基數除以自由基反應 =樹脂的分子㈤求得’其單位為_/g。若硬化性樹脂 中的氫鍵官能基量大於上述上限值,則含有此硬化性樹脂 的液晶密封劑的耐水性有時會降低。另一方面,若硬化性 樹月曰中的氫鍵官能基4小於上述下限值,貞彳含有此硬化性 52 200900816 27285pif ,脂=液晶密封劑的硬化性會降低。根據上述情況,含有 氫,二能基量為〗.〇)<1〇-4 m〇1/g〜6 〇xl〇-3 m〇i/g之樹脂的 液晶枪封劑,其耐水性與硬化性的平衡性優異。 氫鍵官能基亦輿液晶污染有關。由於液晶通常為疏水 !·生,故而與具有極性基的化合物不易相溶(相容?)。根據上 述情況,由於若化合物中的氫鍵官能基的量增多,則上述 化合物的極性會提高,故而變得不易與液晶相容。因此, 含有氫鍵官能基的量為l_〇xl〇-4 mol/g〜6.0XHT3 mol/g之 硬化性樹脂的液晶密封劑不易污染液晶。 如上所述,本發明的硬化性樹脂於分子内具有環氧 基。所明%氧基,是指下述結構式所表示的基團。 本發3明的硬化性樹脂中的環氧基量為1〇xl〇_4 m〇i/g 2^6x12 m〇i/g ^環氧基量是將環氧基數除以硬化性樹脂 的=子里而求得’其單位為mQl/g。由於環氧基具有高加 成聚,故而具有環氧基的硬化性樹脂的硬化性高。此 外’環氧基可提高液晶㈣触玻璃基板的接著性。 士本發明的硬化性樹脂可藉由調配入選自由以下所示的 树月旨所組成的族群中的_或兩種以上的樹脂而獲得。 (1A)自由基反應性細旨,其於分子内具有氫鍵官能 基、及可進行自由基聚合的2個务碳雙鍵,且上述氫鍵官 此基量為 1·5χ1〇·3 m〇1/g〜6.〇xl(r3 m〇1/g。 53 200900816200900816 ^ ' ·ώ〇^υΐ I 碳 Free radical polymerization of carbon-carbon double bonds. Therefore, the (12) curable resin is included in the above (10) radical curable resin. As described above, the liquid crystal sealing agent is required to have excellent leak resistance. Since the liquid crystal leakage is likely to occur when the liquid crystal sealing agent hardens slowly, when the light is hardened, if the light shielding portion is present, the liquid (four) leakage becomes more. Therefore, the liquid crystal sealing agent is preferably only Hardened by heat. However, in general, when the heat is cured, the viscosity of the liquid crystal sealing agent is lowered, so that liquid crystal leakage occurs even if it is hardened by heating. Therefore, it is effective to reduce the viscosity reduction of the liquid crystal sealing agent upon heating. In order to reduce the viscosity of the liquid crystal sealing agent during heating, it is preferred to increase the hardenability of the curable resin contained in the liquid crystal sealing agent. According to the above, since the amount of the hydrogen bond functional group of the resin in the resin composition m is W-V〇1/g to 6.0xl0-3m〇1/g, the hardening speed is fast. Although the mechanism is not clear, it can be presumed that if a certain amount of hydrogen bond functional group is present, the hardened tree ages will be attracted to each other due to the mutual attraction of hydrogen bonds, thus making the hardening reaction better. Easy to carry out. The age of the resin is rapidly reacted between the carbon-carbon double bonds which are adjacent to each other and the epoxy groups which are close to each other, and the hardening resin of the present invention has a high curing rate. The amount of the gas bond functional group is obtained by dividing the number of the above hydrogen bond functional groups by the radical reaction = resin (5) and the unit is _ / g. When the amount of the hydrogen bond functional group in the curable resin is more than the above upper limit, the water resistance of the liquid crystal sealing agent containing the curable resin may be lowered. On the other hand, if the hydrogen bond functional group 4 in the sclerosing tree is less than the above lower limit, 贞彳 contains the sclerosing property 52 200900816 27285pif, and the hardness of the liquid crystal sealing agent is lowered. According to the above, a liquid crystal gun sealant containing hydrogen and a dienergy base amount of 树脂.〇) <1〇-4 m〇1/g~6 〇xl〇-3 m〇i/g, water resistance Excellent balance with hardenability. Hydrogen bond functional groups are also associated with liquid crystal contamination. Since the liquid crystal is usually hydrophobic, it is not easily compatible (compatible with the compound having a polar group). According to the above, when the amount of the hydrogen bond functional group in the compound is increased, the polarity of the above compound is increased, so that it is difficult to be compatible with the liquid crystal. Therefore, the liquid crystal sealing agent containing a hardening resin in an amount of 1 to 〇xl 〇 -4 mol / g to 6.0 X HT 3 mol / g containing a hydrogen bond functional group is less likely to contaminate the liquid crystal. As described above, the curable resin of the present invention has an epoxy group in the molecule. The % oxy group means a group represented by the following structural formula. The amount of the epoxy group in the curable resin of the present invention is 1〇xl〇_4 m〇i/g 2^6x12 m〇i/g. The amount of the epoxy group is the number of epoxy groups divided by the curable resin. = = and find 'the unit is mQl / g. Since the epoxy group has a high addition polymerization, the curable resin having an epoxy group has high hardenability. Further, the epoxy group can improve the adhesion of the liquid crystal (four) touch glass substrate. The curable resin of the present invention can be obtained by blending _ or two or more kinds of resins selected from the group consisting of the following. (1A) A radical reactive property, which has a hydrogen bond functional group in a molecule and two carbon double bonds capable of radical polymerization, and the hydrogen bond has a basis amount of 1. 5 χ 1 〇 3 m. 〇1/g~6.〇xl(r3 m〇1/g. 53 200900816

200900816 IB ^ 自由基反應性樹脂,其於分子内具有氣鍵官能 基丄環氧基、及可進行自由基聚合的碳-碳雙鍵,且上述氫 鍵吕月b基里為 1.0xl0_4 mol/g〜5.0xl0-3 m〇l/g。 / Uc)環氧樹脂,其於分子内具有環氧基但不具有可 進行自由基聚合的碳_碳雙鍵,並且其藉由環球法所測得的 軟化點大於等於40它,且重量平均分子量為500〜5〇〇〇。 本發明的硬化性樹脂可藉由適當選擇調配(1A)〜 ϋΐ脂,㈣氫鍵官能基®及環氧基量調節在上述範 化性樹;(1Α)〜(1C)的樹脂而形成的本發明之硬 化! 生樹知的虱鍵官能基量可以如下方式求得。 設定C1A)的氫鍵官能基數為;分子量為 Ma (g/mol)、調配比率為 a (wt%) ’、、 (⑻的氫鍵官能基㈣虮(個)、分子 (g/mol)、調配比率為b (wt%) 门 (1C)的氫鍵官能基數為n 八 (g/mol)、調配比率為(t%) 刀里為Me 能基量可根據下式H 時,物幽旨的氫鍵官 硬化性樹脂的氫鍵官能基量> (Na) / (Ma) xa/i〇〇+ (_ 、"… /(Mc)xc/100 ^(Mb)xb/100+(Nc) 氧基量亦可以相同方式求得。 S;: A)〜(1C)樹腸進行說明。 (1A)樹脂是分子内具錢㈣能基、及可進行自由 54 200900816 27285pif 基聚合的广個碳·碳雙鍵,且氫鍵官能基量為15祕3_% 6,0:1。mc)i/g的樹脂。於本發明中’可進行自由基聚合 稱為「雙鍵」,另外,㈤樹脂亦 w N冉:’、、 土一 g忐性樹脂」。此自由基二官能性樹脂 較好的是不含環氧基。200900816 IB ^ A radically reactive resin having a gas bond functional group 丄 epoxy group in the molecule and a carbon-carbon double bond capable of undergoing radical polymerization, and the above hydrogen bond Lu Yue b base is 1.0 x 10 4 mol / g~5.0xl0-3 m〇l/g. / Uc) an epoxy resin having an epoxy group in the molecule but having no carbon-carbon double bond capable of undergoing radical polymerization, and having a softening point of 40 or more as measured by the ring and ball method, and having a weight average The molecular weight is 500~5〇〇〇. The curable resin of the present invention can be prepared by appropriately selecting a resin of (1A) to blush, (4) a hydrogen bond functional group, and an epoxy group in the above-mentioned generalized tree; (1Α) to (1C). The hardening of the present invention! The amount of the hydrazone functional group of the raw tree can be determined in the following manner. The hydrogen bond functional group of C1A) is set; the molecular weight is Ma (g/mol), the compounding ratio is a (wt%) ', ((8) hydrogen bond functional group (tetra) 虮 (one), molecule (g/mol), The blending ratio is b (wt%). The hydrogen bond functional group of the gate (1C) is n 八 (g/mol), and the blending ratio is (t%). The amount of Me energy in the knives can be based on the following formula H. Hydrogen bond functional group amount of hydrogen bond-curable resin > (Na) / (Ma) xa/i〇〇+ (_ , "... /(Mc)xc/100 ^(Mb)xb/100+( Nc) The amount of oxygen can also be obtained in the same way. S;: A) ~ (1C) tree intestines are explained. (1A) Resin is a molecular (4) energy base, and can be freely 54 200900816 27285pif base polymerization A resin having a carbon-carbon double bond and a hydrogen bond functional group of 15% 3_% 6, 0: 1. mc) i / g. In the present invention, 'radical polymerization can be referred to as "double bond", and (5) resin is also W N冉: ', and earth-g-type resin. The radical difunctional resin preferably contains no epoxy group.

自由基二官能性樹脂的氫鍵官能基可以上述方式求 得 3。其值為 1.5xl〇-3m〇l/g〜6 0xl0-3m〇1/g,較好的是 1 5χ 1 (Τ3 mol/g〜3·4χ 10—3 m〇l/g。氫鍵官能基量的計算中所使用 的自由基一官能性樹脂的分子量較好的是藉由GPC,且以 聚笨乙烯進行換算而求得。於此情況下,可算出數量平均 分子量及重量平均分子量,而氫鍵官能基量較好的是根據 數量平均分子量而算出。 自由基一官能性樹脂例如可使「分子内具有雙鍵及羧 酸的化合物」與「分子内具有雙鍵及羥基的化合物」進行 酯化反應而獲得。 「分子内具有雙鍵及羧酸的化合物」的例子包括:(曱 基)丙烯酸、或使(曱基)丙烯酸與酸酐反應而獲得的(甲基) 丙烯酸衍生物。另外,「分子内具有雙鍵及羧酸的化合物」 亦可為:使於丙稀酸經烧基醋上加成6-己内酉旨 (6-hexanolide)而獲得的化合物,進而與酸針反應而獲得 的化合物。丙烯酸羥烷基酯的例子包括:丙烯酸羥基乙酯、 丙烯酸羥基丁酯。 「分子内具有雙鍵及羥基的化合物」的例子包括:丙 稀酸經烧基酷、4-季戊四醇三(甲基)丙烯酸醋、山梨播醇 55 200900816The hydrogen bond functional group of the radical difunctional resin can be obtained in the above manner. The value is 1.5 x l 〇 -3 m 〇 l / g 〜 6 0 x l 0 -3 m 〇 1 / g, preferably 1 5 χ 1 (Τ 3 mol / g ~ 3 · 4 χ 10 - 3 m 〇 l / g. Hydrogen bond function The molecular weight of the radical monofunctional resin used in the calculation of the basis amount is preferably determined by GPC and converted to polystyrene. In this case, the number average molecular weight and the weight average molecular weight can be calculated. The amount of the hydrogen bond functional group is preferably calculated based on the number average molecular weight. The radical monofunctional resin can be, for example, a "compound having a double bond and a carboxylic acid in a molecule" and a "compound having a double bond and a hydroxyl group in the molecule". The esterification reaction is carried out. Examples of the "compound having a double bond and a carboxylic acid in the molecule" include (fluorenyl)acrylic acid or a (meth)acrylic acid derivative obtained by reacting (mercapto)acrylic acid with an acid anhydride. Further, the "compound having a double bond and a carboxylic acid in the molecule" may be a compound obtained by adding a 6-hexanolide to an acrylic acid via a base vinegar, and further with an acid needle. A compound obtained by the reaction. Examples of the hydroxyalkyl acrylate include: Hydroxyethyl enoate, hydroxybutyl acrylate. Examples of "compounds having a double bond and a hydroxyl group in the molecule" include: acrylic acid by calcination, 4-pentaerythritol tris(meth)acrylic acid vinegar, sorbitol alcohol 55 200900816

/ ^.O^fUU '一(曱基)丙雄酸醋。 自由基二官能性樹脂亦可使「分子内具有雙 ^ 的化合物」的羧基與「芳香族二醇類的多元縮^甘 合物」的環氧基進行開環加成反應( ring-opening addition reaction)而獲得。 务香私一醇類的多元縮水甘油崎化合物」的例子包 括:雙酚A、雙酚S、雙酚F、雙酚AD、笨醚、間苯二酚 (resorcin)等多元縮水甘油醚化合物。 其中,自由基二官能性樹脂較好的是使多元縮水甘油 =物舆(甲基)丙稀酸反應而獲得_脂,更好的是下 ;L1^^ (⑷所表不的档ί脂、或此等的混合物。/ ^.O^fUU 'A (曱基) propyl male vinegar. The radical difunctional resin may also undergo a ring-opening addition reaction between an epoxy group of a "compound having a compound in a molecule" and an epoxy group of a "polycondensate of an aromatic diol" (ring-opening addition) Obtained by reaction). Examples of the polyglycidyl sulphate compound of the sulphuric alcohol include bisphenol A, bisphenol S, bisphenol F, bisphenol AD, stear ether, resorcin, and the like. Among them, the free radical difunctional resin is preferably obtained by reacting polyglycidyl = hydrazine (meth) acrylic acid to obtain _ lipid, more preferably; L1 ^ ^ ((4) , or a mixture of these.

通式(al )中, … ϊ R2 R3、H4分別獨立 —In the general formula (al ), ... ϊ R2 R3, H4 are independent —

Rm分別獨立地表示氫 ^表不氣原子或甲基’ 丙基、碳數為1〜4I子、碜數為1〜4的烷基、烯 η表示1〜4的整數至,元土或碳數為1〜4的烷氧基, 1表示1〜4的整數,Rm each independently represents a hydrogen atom or a methyl 'propyl group, a carbon number of 1 to 4 I, an alkyl group having a number of 1 to 4, and an ene group representing an integer of 1 to 4 to a terroir or carbon. The number is 1 to 4 alkoxy groups, and 1 represents an integer of 1 to 4,

ScV、或-〇-表示的有機基 團 Α 為以-CH2-、_C(CH3):The organic group represented by ScV or -〇- is --CH2-, _C(CH3):

200900816 27285pif200900816 27285pif

通式(a2)令, ·♦·...通式(a2) 5 K、&、尺8分別獨立 d分卿立地表示原子或^基 丙基、碟數為丨〜4 '、 每數為 4的烷基、烯 r表-/\ 的超貌基或破數為1 4 Γ表不ί〜4的#叙· 马1〜4的烷氧基 表示1〜4的整數 Ρ表示1〜4的整數General formula (a2), ♦·... General formula (a2) 5 K, & and ruler 8 are respectively independent and distinctly represent atomic or propyl group, and the number of discs is 丨~4 ', each number The alkyl group of 4, the olefinic table -/\ has a superficial basis or the number of breaks is 1 4 Γ 不 〜 〜4##·············· 4 integer

通式(a3)中,、尺2、Rm、η、 ......通式(a3) A與通式(al)所㈣的内容相同。In the general formula (a3), the rule 2, the Rm, the η, the formula (a3) A are the same as those of the formula (a).

il 4-' r λ\ ......通式(a4 ) 相同。式()中,R5、R6與通式㈤中所定義的内容 上述樹腊中’本發明的自由基二官能性樹脂尤其好的 57 200900816 是通式(a3)或(a4)所表示的樹脂。 (1B)樹脂 (叫樹脂是分子内具有氫鍵官能基、環氧基、及雙 1,且氫鍵官能基量為l.OxlO-4 mol/g〜5.0ΧΚΓ3 m〇l/g的樹 脂。(1B)樹脂可使環氧樹脂的環氧基與(曱基)丙烯酸或复 衍生物的羧基進行反應而獲得。 、Il 4-' r λ\ ...... The general formula (a4) is the same. In the formula (), R5, R6 and the content defined in the formula (5), in the above-mentioned tree wax, 'the radical difunctional resin of the invention is particularly good 57 200900816 is a resin represented by the formula (a3) or (a4) . (1B) Resin (the resin is a resin having a hydrogen bond functional group, an epoxy group, and a double 1 in the molecule, and the amount of the hydrogen bond functional group is 1.0 to 1.0 mol/g to 5.0 ΧΚΓ 3 m〇l/g. (1B) The resin can be obtained by reacting an epoxy group of an epoxy resin with a carboxyl group of (mercapto)acrylic acid or a complex derivative.

(1B)樹脂的氫鍵官能基量可以上述方式求得。此氣 鍵官能基量的值較好的是l.〇xl(T4m〇l/g〜5.0X10-3 m〇l/g^ =的是1.0xl0’4m〇1/g〜3 4xl(r3m〇1/g。計算氫鍵官能基 量時所使㈣分子量較好的是以與自由基二官能性樹脂相 同的方式,藉由GPC而求得的數量平均分子量。 (1B)樹脂的環氧基量並無特別限定,較好的是心 10 mol/g〜6.0x10-3 m〇1/g ’ 更好的是 ι 〇χΐ〇_4_The amount of the hydrogen bond functional group of the (1B) resin can be determined in the above manner. The value of the amount of the gas bond functional group is preferably l.〇xl (T4m〇l/g~5.0X10-3 m〇l/g^ = is 1.0xl0'4m〇1/g~3 4xl (r3m〇) 1/g. When calculating the amount of the hydrogen bond functional group, (4) the molecular weight is preferably a number average molecular weight determined by GPC in the same manner as the radical difunctional resin. (1B) Epoxy group of the resin The amount is not particularly limited, and it is preferably 10 mol/g to 6.0 x 10-3 m〇1/g '. More preferably ι 〇χΐ〇_4_

1(T3 mol/g。 S UB)樹脂的數量平均分子量較好岐·〜加⑻。 若此數量平均分子量在此範_,則硬化賴脂於液晶甲 散性會降低。因此,含有此樹脂的液 劑不易污染液晶。 +成為(1Β)樹腊之原料的環氧樹簡例子包括The number average molecular weight of 1 (T3 mol/g. S UB) resin is preferably 岐·~ plus (8). If the number average molecular weight is in this range, the hardening of the lyophilized liquid in the liquid crystal will be lowered. Therefore, the liquid containing this resin is less likely to contaminate the liquid crystal. + Examples of epoxy trees that become the raw material of (1Β) tree wax include

酚f清,環氧樹脂、苯酚酚醛清漆型環氧樹脂、雙酚A 型耗_、㈣F型環氧樹脂、三轉W型環氧樹月旨、 三苯齡乙細環氧樹脂、三苯_環氧触、二 型環氧翻、聯苯型環氧難。此等樹練好的是藉^分 子蒸餾法、清洗法等而高純度化。 曰 58 200900816 27285pif 包括成的(甲基)丙烯酸衍生物的例子 化合物。此齡If 的基團、及(甲基)丙稀醯基的 H此種化合物的具體例包括如下彳 θ / _,基_丙_§旨類的反應物 肝、均ΓΓΓ體例包括:鄰苯二甲酸酐、偏苯三甲酸 酐均本四甲酸酐、琥_酐、馬來酸軒 ^ acid)、己二酸酐、田刀夂、丄umaric 讀4 (甲基)丙_氧基乙基偏苯三曱酸野。Phenol f clear, epoxy resin, phenol novolak type epoxy resin, bisphenol A type consumption _, (four) F type epoxy resin, three-turn W-type epoxy tree, benzene, benzene, epoxy resin, triphenyl _Epoxy touch, type II epoxy turn, biphenyl type epoxy is difficult. These trees are well-picked by high-purification by means of a molecular distillation method, a washing method, and the like.曰 58 200900816 27285pif An example compound comprising a derivative of (meth)acrylic acid. Specific examples of such a group of If and a compound of (meth) propyl fluorenyl group H include the following reactants: 彳 θ / _, _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Dicarboxylic anhydride, trimellitic anhydride, tetracarboxylic anhydride, succinic anhydride, maleic acid, acid, adipic anhydride, turmeric, 丄 ricric read 4 (methyl) propyl oxyethyl benzene Three wild acid wild.

=基(甲基)丙烯_旨類的具體例包括:(甲基)丙稀酸 丁 (甲基)丙烤酸經基丙酉旨、(甲基)丙烯酸4_經基 氧二:烯酸的環氧乙院加成物、(甲基)丙烯酸的環 凡加成物、(曱基)丙烯酸的己内酯改質物。 由於(1B)樹脂於分子内兼具環氧基及雙鍵,故而盘 】由基二官能性樹脂及(lc)環氧樹脂的相容性優 =、因此,含有(m)樹脂、及(1A)自由基二官能性= 二或dc)環氧樹脂的液晶密封劑可提供均勻的硬化物: 在種液晶密封劑的玻璃轉移溫度(Tg)、接著強度提高。 (1C)樹脂Specific examples of the base group (meth) propylene include: (meth)acrylic acid butyl (meth) propane acid by the propyl group, (meth)acrylic acid 4 _ oxy oxadienoic acid The epoxy oxime adduct, the cyclomethicone of (meth)acrylic acid, and the caprolactone modification of (mercapto)acrylic acid. Since (1B) resin has both an epoxy group and a double bond in the molecule, the compatibility of the bis-functional resin and the (lc) epoxy resin is excellent, and therefore, (m) resin, and ( 1A) Free radical difunctional = di- or dc) The liquid crystal sealing agent of the epoxy resin can provide a uniform cured product: the glass transition temperature (Tg) of the liquid crystal sealing agent is increased, and the strength is increased. (1C) resin

Uc)樹脂是分子内不具有乙烯性不飽和雙鍵且具有 =或1個以上環氧基的樹脂。本發明的環氧樹脂,其藉 由每球法所測得的軟化點大於等於401,且重量平均分 置為500〜5〇〇〇。 (1 c)樹脂的軟化點及分子量可對製成液晶密封劑時 的黏度產生影響。含有軟化點及重量平均分子量在上述範 圍内之(ic)樹脂的液晶密封劑,尤其是未硬化時的液晶 59 20090081& 密封劑中的硬化性樹脂之黏度不會過低而處於適當的範圍 内,因此密封圖案變得不易變形,且耐洩漏性優異。若軟 化點大於等於40°c,則無特別限定,但為使製成液晶密封 劑時的的黏度處於適當的範圍内,軟化點較好的是小於 於 160°C。 ' ' 另外,含有軟化點及重量平均分子量在上述範圍内之 (ic)樹脂的液晶密封劑,由於(1C)樹脂於液晶中的溶 解性、擴散性降低,故而不易污染液晶。(1C)樹脂的重 1 量平均分子量例如可藉由GPC,且以聚苯乙烯作為標準而 進行測定。 上述(1C)樹脂的例子包括以下化合物,且其軟化點 及重量平均分子量在上述範圍内。 , 使由雙酚A、雙酚S、雙酚F、雙酚AD等所代表的芳 香族二醇類或遮將此等以乙二醇、丙二醇、烷二醇進行改 質而形成的二醇類,與表氯醇進行反應而獲得的芳香族多 元縮水甘油醚化合物。 ' ,笨酚或曱酚及曱醛衍生而形成的酚醛清漆樹脂、聚 '烯基苯紛或其共聚物等所代表的多盼類,與表氯醇進行反 應而獲得的酚醛清漆型多元縮水甘油醚化合物。 苯二甲基酚樹脂的縮水甘油醚化合物類。 酚醛清漆型多元縮水甘油醚化合物的具體例包括: =酚醛清漆型環氧樹脂、苯酚酚醛清漆型環氧樹脂。芳香 無多元縮水甘油醚化合物的具體例包括:雙酚A型環氣 月曰、雙酚F型環氧樹脂、三苯酚甲烧型環氧樹脂、三笨酚 60 200900816 27285pif 乙烷型環氧樹脂、三菜 將環氧基數除以^ G 相同的方式, 好的是使用由環氧u子量而求得。此分子量較 樹脂具有氣鍵官斤;:ΤίΓ。計算(】c) 樹脂相同。 W鍵吕此基!的方法亦與(1B) 環,量的倒數,故可藉由測定(1C) 出:將試量,如下方法而算 氧陸圜溶液並進行靜置土 xane中,加人鹽酸-二 耗的,而計算出:;:(一)娜 的液月旨及(1C)樹脂所構成的硬化性樹脂 里。另二人有*、广4漏性無㈣度的平衡性尤其優 性樹㈣/曰^ β)樹月旨及(1C)樹脂所構成的硬化 =月:的,:选封劑,其接著強度尤其優異。並且,含有 封、J 樹月旨所構成的硬化性樹脂的液晶密 封Μ ’其耐洩漏性尤其優異。 另外’於液晶密封倒含有(1Α)樹脂及(ic)樹脂作 ;’、、更化f生树月曰%,此等樹脂的調配比例以重量比計,較好 的是(1A)樹脂:(lc)樹脂=7〇〜97 : 3卜3。於液晶密 封W] 3有(1A)樹月旨及(1B)樹脂作為硬化性樹脂時,此 等樹月旨的概例以重量比計,較好的是㈤獅:(ib) 61 200900816 樹脂=10〜70 ·· 90〜30。於液晶密封劑含有(ιΒ)樹脂及 C1 c)樹脂作為硬化性樹脂時,此等樹脂的調配比例以重 量比計,較好的是(1B)樹脂:(1C)樹脂=7〇〜97 : 3〇 〜3。於液晶密封劑含有(1A)樹脂、(1B)樹脂、及(ic) 樹脂作為硬化性樹脂時,此等樹脂的調配比例以重量比 計,較好的是(1A)樹脂:(1B)樹脂:(lc)樹脂=1〇 〜87 : 1〇〜87 : 3〜30。The Uc) resin is a resin having no ethylenically unsaturated double bond in the molecule and having = or more than one epoxy group. The epoxy resin of the present invention has a softening point of 401 or more by a ball method and a weight average of 500 to 5 Å. (1 c) The softening point and molecular weight of the resin may affect the viscosity when the liquid crystal sealing agent is formed. The liquid crystal sealing agent containing the (ic) resin having a softening point and a weight average molecular weight within the above range, in particular, the liquid crystal of the unhardened liquid crystal 59 20090081 & the viscosity of the hardening resin in the sealant is not too low and is in an appropriate range Therefore, the seal pattern is less likely to be deformed and is excellent in leakage resistance. The softening point is not particularly limited as long as it is 40 ° C or more, but the softening point is preferably less than 160 ° C in order to make the viscosity when the liquid crystal sealing agent is formed in an appropriate range. In addition, the liquid crystal sealing agent containing the (ic) resin having a softening point and a weight average molecular weight within the above range is less likely to contaminate the liquid crystal because the solubility (1C) of the resin in the liquid crystal is lowered and the diffusibility is lowered. The weight average molecular weight of the (1C) resin can be measured, for example, by GPC and using polystyrene as a standard. Examples of the above (1C) resin include the following compounds, and the softening point and weight average molecular weight thereof are within the above ranges. An aromatic diol represented by bisphenol A, bisphenol S, bisphenol F, bisphenol AD or the like, or a diol formed by modifying ethylene glycol, propylene glycol or alkanediol An aromatic polyglycidyl ether compound obtained by reacting with epichlorohydrin. a polyphenol type varnish resin, a polyphenolic phenolic resin or a copolymer thereof, and a polyphenolic phenolic resin or a copolymer thereof, and a polyphenolic varnish-type multi-shrinkage obtained by reacting with epichlorohydrin Glycerol ether compound. A glycidyl ether compound of a benzene dimethylphenol resin. Specific examples of the novolac type polyglycidyl ether compound include: a novolac type epoxy resin and a phenol novolak type epoxy resin. Specific examples of the aromatic non-polyglycidyl ether compound include: bisphenol A type ring gas, bisphenol F type epoxy resin, trisphenol-based epoxy resin, trisphenol 60 200900816 27285pif ethane type epoxy resin In the same manner as the number of epoxy groups divided by ^ G, it is preferable to use the amount of the epoxy group. This molecular weight has a gas bond than the resin; ΤίΓ. Calculate () c) The resin is the same. W key Lu this base! The method is also related to the (1B) ring, the reciprocal of the amount, so it can be determined by measuring (1C): the test amount, the following method is used to calculate the oxygen lanthanum solution and the static soil xane, adding hydrochloric acid - two consumption And calculated:;: (a) Na's liquid month and (1C) resin composed of a curable resin. The other two have *, wide 4 leakage, no (four) degree of balance, especially excellent tree (four) / 曰 ^ β) tree month and (1C) resin composed of hardening = month:,: sealant, its strength Especially excellent. Further, the liquid crystal sealing material □ having a curable resin composed of a seal and a J-tree is particularly excellent in leakage resistance. In addition, 'the liquid crystal sealing contains (1 Α) resin and (ic) resin; ', and the ratio of the resin is 5%, and the ratio of the resin is preferably (1A) resin: (lc) Resin = 7〇~97: 3 Bu 3. In the liquid crystal sealing W] 3, when (1A) tree and (1B) resin are used as the curable resin, the outline of such a tree is in terms of weight ratio, preferably (5) lion: (ib) 61 200900816 resin =10~70 ·· 90~30. When the liquid crystal sealing agent contains (ι) resin and C1 c) resin as the curable resin, the ratio of the ratio of the resins is preferably (1B) resin: (1C) resin = 7 〇 to 97: 3〇~3. When the liquid crystal sealing agent contains (1A) resin, (1B) resin, and (ic) resin as a curable resin, the ratio of such resins is preferably (1A) resin: (1B) resin. :(lc) Resin = 1〇~87 : 1〇~87 : 3~30.

上述液晶密封用硬化性樹脂組成物冚,除了含有上述 (3)、^4)'(12)以外,亦可更含有上述(5)環氧硬化劑、 (6) %氧樹脂、(7)光自由基聚合起始劑、熱塑性聚 合物、(9)其他添加劑。關於此等化合物等的詳:内容以 上已進行了說明,故此處將說明省略。 2.液晶密封用硬化性樹脂組成物的製造方法 ^發明的液晶密封用硬化性樹脂組成物可在不損 二:的範圍内任意地製造,例如可將以 各 法並無特別限定,例如可使用雙葉二式 :^周知的混煉機械。為了不使混合物凝膜化 是=均勾,溫度較好的是設定在听〜坑:更好的 而丄:沉。此處’就提高組成物的錢穩定性的觀點 於^^備時触合物H度贿喊切祕饥且小 器進贿的齡财㈣料藉由過滤 璃瓶或塑ί容ΐΐ處理後將此混合物密封填充於玻 62 200900816 -I /Ζδ^ρΐΓ 3.液晶顯示面板的製造方法 本發明的液晶顯示面板可使用本發明的浪晶密封用硬 化性樹脂組成物而製造,以下,對較好的製造方法進行說 明。 此液晶顯示面板的製造方法,是經由液晶密封用硬化 性樹脂組成物’將㈣_2塊基板進行貼合而製成液晶 顯示面板的製造方法,其特徵在於包括如下步驟: 1)準備第1基板的步驟’上述第丨基板包含利用本發 明的液晶密封用硬化性樹脂組成物,以包圍像素陣列區域 的方式所形成的框狀顯示區域; 2 )於未硬化狀恶的上述顯示區域内、或另一塊基板上 滴入液晶的步驟; 3) 將上述第1基板、和與其相對向的第2基板重疊的 步驟; 4) 藉由加熱而使上述液晶密封用樹脂組成物硬化的步 驟。 1)步驟是將液晶密封劑塗佈於2塊基板中的任一塊 上,而準備配置有框狀顯示區域的基板。所謂框狀顯示區 域,意指以此樹脂組成物繪製出的密封形狀,亦稱為密封 圖案。基板疋成為顯示面板的基礎的部件,通常由2塊玻 璃等所構成。液晶顯示面板所使用的2塊基板的例子包 括·· TFT (thin film transistor,薄膜電晶體)形成為矩陣狀 的玻璃基板,形成有彩色濾光片(c〇br fllter)、黑色矩陣 (black matrix)的基板。基板的材質的例子包括了玻璃或 63 200900816 聚炭^ S曰、聚對笨二曱酸乙二酯、聚醚礙(polyether )PMMA ( polymethyl methacrylate,聚曱基丙稀 酸曱酯)等的塑膠。The curable resin composition for liquid crystal sealing may further contain the above (5) epoxy curing agent, (6)% oxygen resin, and (7) in addition to the above (3) and 4)' (12). Photoradical polymerization initiator, thermoplastic polymer, (9) other additives. The details of these compounds and the like have been described above, and thus the description thereof will be omitted. 2. Method for Producing Curable Resin Composition for Liquid Crystal Sealing The curable resin composition for liquid crystal sealing of the invention can be arbitrarily produced within the range of not less than two, and for example, various methods are not particularly limited, and for example, Use two-leaf two-type: ^ well-known mixing machine. In order not to make the mixture condensate, it is = even hook, the temperature is better set to listen ~ pit: better and 丄: sink. Here, the idea of improving the stability of the composition's money is to use the smear of the smear and the bribes of the bribes and the bribes of the bribes (4). The liquid crystal display panel of the present invention can be produced by using the curable resin composition for wave-sealing of the present invention, and the following is a case where the liquid crystal display panel of the present invention is produced by sealing and filling the mixture with a glass plate 62 200900816 - I / Ζ δ ΐΓ ΐΓ ΐΓ 3. A good manufacturing method is explained. The method for producing a liquid crystal display panel is a method for producing a liquid crystal display panel by bonding a (four)_2 substrate with a curable resin composition for liquid crystal sealing, and comprising the steps of: 1) preparing a first substrate Step 'The second substrate includes a frame-shaped display region formed by the curable resin composition for liquid crystal sealing of the present invention so as to surround the pixel array region; 2) in the display region which is not cured, or another a step of dropping a liquid crystal onto a substrate; 3) a step of superposing the first substrate and a second substrate facing the substrate; and 4) a step of curing the resin composition for liquid crystal sealing by heating. 1) The step is to apply a liquid crystal sealing agent to any one of the two substrates, and prepare a substrate in which the frame-shaped display region is disposed. The frame-shaped display area means a seal shape drawn by this resin composition, which is also called a seal pattern. The substrate 疋 is a component of the display panel, and is usually composed of two glasses or the like. Examples of the two substrates used in the liquid crystal display panel include a glass substrate in which a TFT (thin film transistor) is formed in a matrix, and a color filter (c〇br fllter) and a black matrix (black matrix) are formed. The substrate. Examples of the material of the substrate include glass or 63 200900816 polycarbonate, polyethylene terephthalate, polyether PMMA (polymethyl methacrylate), and the like. .

於各基板所對向的面上,亦可形成配向膜。配向膜並 無特別限定’例如可使用由眾所周知的有機配向劑或無機 配=劑所製成者。另外,於基板上亦可預先散布間隔物。 St物ί常使用圓球狀的二氧化矽粒子,其可有效地保持 :二的間隙(ceU gap)。通常可使用預先散布於基板 之狀L的面内間卩南物、或者包含於液晶密封劑中的間隔 士外’間㈣_類或^、並無制限定,可根據所 而的早兀間隙的大小,而使用眾所周知者。 基Ϊ上塗佈液晶密封_方法的例子包括:利用分 主盜進仃塗佈或藉由網版印刷進行 周知的技術。於製造小型液晶顯就 而言’較好的是藉由網版印刷進行塗佈。 區域内、或另 f組成物㈣化反應尚切行_膠化點 晶滴入通常可於大氣屋下進行。 , k液 上述液晶的滴下量,較杯的β ,、,、、A n 式’根據框的大小而進行調節。:二的方 會大於2塊基板之間所存在 於凌阳的容量不 (單元)的容量,故而不會對框劑所包園的空間 作框的密封劑亦不會破裂。另夕卜β 的屋力’因此製 (2)步驟中,於未形 64 200900816 27285pif =示區賴另—塊基板上滴人液晶時,於將基板彼此重 且W ’可將液晶滴入可成為顯示區域的區域内。 3),驟是將滴入有液晶的基板與另一塊基板相重疊。 於重®疋藉由氣壓差而使基板彼此貼合,故而較好的是 使用真空貼合裝置等,於減壓下進行重疊。 k a 卜於3)步驟之後,亦可包括將經重疊的2塊基 大氣壓的步驟。若將以上述方式於減壓An alignment film may be formed on the surface on which the respective substrates face. The alignment film is not particularly limited. For example, those produced by a well-known organic alignment agent or inorganic compounding agent can be used. Further, spacers may be scattered on the substrate in advance. St. ί often uses spherical cerium oxide particles, which can effectively maintain a ceU gap. Generally, it is possible to use an in-plane southerly material which is previously dispersed in the shape of the substrate L, or a spacer (external) in the liquid crystal sealing agent, which is not limited, and may be used according to the early gap. Size, while using well known people. Examples of the method of coating a liquid crystal seal on a substrate include: using a master pirate coating or a conventional technique by screen printing. In the case of manufacturing a small liquid crystal display, it is preferable to carry out coating by screen printing. In the region, or in another composition (4), the reaction is still cut. _ Gelation point Crystal drop can usually be carried out under the atmosphere. , k liquid The amount of dripping of the above liquid crystal is adjusted according to the size of the frame as compared with the β, ,, and A n of the cup. The ratio of the second is greater than the capacity of the capacity of the Sunplus (the unit) between the two substrates, so that the sealant that does not frame the space enclosed by the frame will not break. In addition, in the step of (2), in the step (2), when the liquid crystal is dropped on the substrate, the substrate is made heavy and W' can be dropped into the liquid crystal. Become the area of the display area. 3) The step is to overlap the substrate on which the liquid crystal is dropped with the other substrate. Since the substrate is bonded to each other by the difference in pressure, it is preferable to use a vacuum bonding apparatus or the like to overlap under reduced pressure. k a After the step 3), the step of superimposing 2 base atmospheric pressures may also be included. If it will be decompressed in the above way

:=之,生氣壓差,因此自2塊基二 對塊基板進付m使基板彼此相貼合。 太二 是ί存在於基板之間的液日日日密封舰行硬化。 本發月的液晶密封劑僅藉由加埶便可 時:,等=匕處理條件可根據液晶㈣劑的組成而適ί 驟n卜^亦可故照縣而使液㈣賴硬化的步 J ^情況下’可藉由光照射而使液晶密封劑暫時硬化 ΐ可光照射’是指‘ 錄、 、曰產生反應之施置的光(較好的是紫外 的是僅面板時的步驟的觀點而言,4)步驟較好 僅猎由加熱而使液晶密封劑硬化的步驟。 a力ίΓ/Λ巾,於賴由加熱而使液晶密_硬化時, ^加熱^条件較好的是設為贼〜聊及1〇分鐘〜24〇分 二古更好的是設為贿〜13叱且3〇分鐘〜12〇分鐘。另 於將光照射與加熱硬化合併制時,其加敎停件 較好的是設為贼〜听及1分鐘分鐘。料= 65 200900816 上述任-情況下,均可視需要而於 分鐘〜90分鐘的後硬化。 L WC下進灯30 而採用如下U的賊巾,為進—步提高生產性 框,缺後於久· ^板上利用液晶密封劑而形成多個 2塊基或朗的基板上滴人適量的液晶,再將 後,二fit目貼合。本方法是藉由將基板彼此相貼合 成物亦可_1=切取各個液晶顯示面板,本發明的組 速且晶光而僅藉由加熱便可迅 化部八B …、須考慮於遮光部分殘留有未硬 由%二、。ί,另外,對面板設計的限制亦非常少。此外, ;液晶密封劑的硬化時無須使用紫外線照射裝置等, =低製造成本。另外,如上述組成物1〜』, 或的液晶密封劑含有規定的熱自由基聚合起始劑 義莫吝^ ’故而若對此液晶密封舰行加熱,則從自由 二制ί生ΐ化起的短時間内,硬化便可充分地進行。因此, 、=造如安裝於行動電話上的小型面板m矩陣或配線 =的液晶顯示面板時,遮光部分不存在未硬化部分的問 此處,所謂黑色矩陣,是指由光阻劑(photoresist)所 B ^包圍構成彩色遽光片之光的3原色R(紅)G (綠) 埶藍)的方格狀邊框等。另外,用於紫外線照射、或加 裝置並無特別限制。可用於本發明中的加熱裝置的例 匕·洪箱(oven)、加熱板(hot plate)、熱壓機(hot 66 200900816 z/j,^pn press ) 〇 、根據上述方法,使用本發明的液晶密封用硬化性樹月旨 組成,而^造的液晶顯示面板,其_$漏性優異,且可抑 制液晶巧染,並且液晶密封劑的硬化物輿基板的接著 咼,因此顯示特性良好。 又 [實施例;|:=, the difference in raw gas pressure, so the m is fed from the two base two pairs of substrates to bond the substrates to each other. Too much is the liquid that exists between the substrates. The liquid crystal sealing agent of this month can only be obtained by twisting: etc., the processing conditions of the liquid crystal (4) can be adjusted according to the composition of the liquid crystal (four) agent, and the liquid can be cured according to the county. ^In the case of 'the liquid crystal sealant can be temporarily hardened by light irradiation, the light can be irradiated' means the light of the application of the recording, the 曰, and the reaction (preferably the ultraviolet is the step of the panel only) In the case, the step 4) is preferably a step of hardening the liquid crystal sealing agent by heating. a force Γ Γ / Λ , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , 13叱 and 3〇 minutes~12〇 minutes. In addition, when the light irradiation and the heat hardening are combined, the twisting stopper is preferably set to the thief to listen for 1 minute. Material = 65 200900816 In the above-mentioned case, it is possible to post-harden in minutes to 90 minutes as needed. L WC enters the lamp 30 and uses the following U thief towel to improve the production frame for the first step. After the lack of the liquid crystal sealant on the board, the liquid crystal sealant is used to form a plurality of bases or square substrates. The LCD will be post-fitted with two fit eyes. In the method, the liquid crystal display panels can be cut out by laminating the substrates to each other, and the liquid crystal display panel can be cut out. The group speed and the crystal light of the present invention can be accelerated only by heating. There is no hard by % two. ί, in addition, there are very few restrictions on panel design. In addition, the curing of the liquid crystal sealing agent does not require the use of an ultraviolet irradiation device or the like, and the manufacturing cost is low. Further, as the above-mentioned composition 1 to 』, or the liquid crystal sealing agent contains a predetermined thermal radical polymerization initiator, the liquid crystal sealing ship is heated from the free binary system. In a short time, hardening can be fully performed. Therefore, when the small panel m matrix or the wiring = liquid crystal display panel mounted on the mobile phone is used, there is no uncured portion in the light shielding portion. The so-called black matrix refers to the photoresist (photoresist). B ^ surrounds the checkered frame of the three primary colors R (red) G (green) indigo constituting the light of the color grading sheet. Further, the means for applying ultraviolet rays or the addition means is not particularly limited. An example of a heating device usable in the present invention, a hot pot, a hot plate, a hot press (hot 66 200900816 z/j, ^pn press ), according to the above method, using the present invention The liquid crystal display panel is composed of a curable resin for liquid crystal sealing, and the liquid crystal display panel is excellent in smear leakage, and can suppress ink crystal dyeing, and the cured material of the liquid crystal sealing agent is entangled with the substrate, so that the display characteristics are good. [Examples; |

/ >,以^,列舉本發明的實施例、比較例,來對本發明進 行=、:、·、兒月其中,本發明並不僅限於此處所示的形態。 另外’以下所揭示的「%」、「份」分別意指「= 量份」。 」$ 首先’就針對本發明的液晶密封用硬化性樹脂組成物 I而進行的實施例及比較例進行說明。 製備][員域1-1〜13、比較例卜1〜4所使用的材料等的 (1) 丙烯酸樹脂 、使用甲絲轉町的齡,_超純水進 重複上述步驟12次而進行高純度化處理。 彳 丙烯酸樹脂i :雙酚Α型環氧樹脂 (3〇〇2A:共榮社化學製造,分子量為_) 如夂酉曰 丙烤酸樹脂2 :雙驗a型環氧樹脂 _7〇〇 meYTEe n (2) 改質環氧樹脂 于里為485 ) 準備藉㈣下妓所合成較_氧龍(合成们 67 200900816 [合成例I -1] 於安裝有攪拌機、導氣管、溫度計、冷卻管的%〇工 的四口燒瓶中,裝入丨60 g雙酚F型環氧樹脂(E ^ YDF-8170C :東都化成公司製造)、36g丙稀酸、二 乙醇胺,於乾燥空氣流下,以1UTC加熱攪拌5小時 獲得丙烯酸改質環氧樹脂。利用超純水將所獲得的^脂产 洗12次。 ’曰 準備如下原料: (3) 熱自由基聚合起始劑 熱自由基聚合起始劑88 : 1,1-偶氮雙(2,4-環己烷小甲 腈)(V-40 :和光純藥製造,10小時半衰期溫度為 熱自由基聚合起始劑75 :過氧化2_乙基己酸第三戊酯 i^Lupasol 575 : API Corporation 製造,1〇 小時半衰期溫度 熱自由基聚合起始劑65 : 2,2’_偶氮雙(2_曱基丙酸酯) (V_601 ’和光純藥製造,1〇小時半衰期溫度為65°c ) 熱自由基聚合起始劑51: 2,2'-偶氮雙(2.4-二曱基戊腈) (V·65 ·和光純藥製造,1〇小時半衰期溫度為51。(:) (4) 填充料 填充料1 .球狀氧化石夕(Seahostar S-30 :曰本觸媒製 造’平均=次粒徑為G.3 ,比表面積為11 m2/g) 填充料2 .球狀氧化矽(SO-C2 : ADMATECHS公司 平均_人粒徑為〇·9 /zm,比表面積為4m2/g) (5 ) %氧硬化劑 68 200900816 27285ρΐί 潛伏性ί辰氧硬化劑1 :】 ^ HE , Λ . ^ 工,3-雙(肼基裁乙基)-5-異丙基乙 内 脲(Amicure VDH : 4 ^ 味之素公司製造,熔點為12〇。〇 與八1制i & 劑2.己二酸二醯肼(ADH:大塚化 學公司製造,熔點為181。匸) ’ (6)環氧樹脂 r2氧樹脂/ :鄰甲盼紛駿清漆型固體環氧樹脂 (EOCN-1020-75 :日本化筚公^制 % 士 ^ 4兀樂公司製造,赭由環球法所測得The present invention is exemplified by the following examples and comparative examples, and the present invention is not limited to the embodiments shown herein. In addition, "%" and "parts" as disclosed below mean "= parts". In the first embodiment, a comparative example and a comparative example of the curable resin composition for liquid crystal sealing of the present invention will be described. (1) Acrylic resin, the use of the material used in the comparison of the materials used in the 1-1 to 13 and the comparative examples 1 to 4, and the use of the age of the squid, _ ultrapure water, repeat the above steps 12 times and high. Purification treatment.彳Acrylic resin i: bisphenol oxime type epoxy resin (3〇〇2A: manufactured by Kyoeisha Chemical Co., Ltd., molecular weight _) 夂酉曰 夂酉曰 烤 烤 酸 2 2 2 2 2 2 2 2 2 2 2 2 2 2 n (2) modified epoxy resin in the 485) is prepared by borrowing (four) sputum synthesis _ oxygen dragon (synthesis 67 200900816 [synthesis example I -1] installed with a mixer, air duct, thermometer, cooling tube 〇 60 g of bisphenol F-type epoxy resin (E ^ YDF-8170C: manufactured by Tohto Kasei Co., Ltd.), 36 g of acrylic acid, diethanolamine, and heated at 1 UTC under a dry air flow. The acrylic modified epoxy resin was obtained by stirring for 5 hours. The obtained lipid was washed 12 times with ultrapure water. '曰 The following raw materials were prepared: (3) Thermal radical polymerization initiator Thermal radical polymerization initiator 88 : 1,1-azobis(2,4-cyclohexane small carbonitrile) (V-40: manufactured by Wako Pure Chemical Industries, 10 hour half-life temperature is thermal radical polymerization initiator 75: 2-ethyl peroxide Tripentyl hexanoate i^Lupasol 575 : manufactured by API Corporation, 1 hour half-life temperature thermal radical polymerization initiator 65 : 2,2'-azo (2_mercaptopropionate) (V_601 'made with Wako Pure Chemical Industries, 1 hr half-life temperature is 65 ° c) Thermal Radical Polymerization Starter 51: 2,2'-Azobis (2.4-didecyl) Valentonitrile) (V·65 · Wako Pure Chemical Manufacturing, 1 hour half-life temperature is 51. (:) (4) Filler Filler 1. Spherical Oxidized Oxide (Seahostar S-30: 曰本制制制' Average = secondary particle size is G.3, specific surface area is 11 m2 / g) Filler 2. Spherical yttrium oxide (SO-C2: ADMATECHS company average _ human particle size is 〇 · 9 / zm, specific surface area is 4m2 / g) (5) % oxygen hardener 68 200900816 27285ρΐί Latency ί 氧 oxygen hardener 1 :] ^ HE , Λ . ^, 3-bis(indenylethyl)-5-isopropylhydantoin ( Amicure VDH : 4 ^ Ajinomoto company, melting point of 12 〇. 〇 and 八一制i & agent 2. Diterpene adipate (ADH: manufactured by Otsuka Chemical Co., melting point 181. 匸) ' (6 Epoxy Resin r2 Oxygen Resin / : 邻甲盼 jun varnish type solid epoxy resin (EOCN-1020-75: Nippon Kasei Co., Ltd.% 士^ 4 兀 公司 company, 赭 measured by the method of the world

的权化點為75°C,環氧當量為215 g/eq) 環氧樹脂2 :雙驗A型環氧樹 製造,環氧當量為190g/eq) (7)光自由基聚合起始劑 光自由基聚合起始劑1:1-經基環己基苯基嗣(Irgacure 184 . Ciba Speciality Chemicals 公司製造) 光自由基聚合起始劑2: 2,2-二曱氧基-2-苯基苯乙酮 (Irgacure 651: Ciba Speciality Chemicais 製造) (8)熱塑性聚合物 甲基丙烯酸烷基酯共聚物微粒子(F_325 :日本Ze〇n 公司製造’平均一次粒徑為0.5 vm)。 [評價方法] 對實施例I-1〜13及比較例工_丨〜4所進行的評價方 法進行說明。此處測定:i)黏度、u)液晶密封劑的耐洩 漏丨生、iii)液aa岔封劑的塗佈性、)接著強度,對液晶 密封劑的特性進行評價。各測定評價方法的詳細内容如下。 i)黏度測定 69 200900816 使用E型旋轉型黏度計(數位流變計, ULTRA,BROOKFIELD 公司製造)、及半D H _ m 度為3。的CP-52型錐_板型感測器,於以下^ |咖、角 rpm的旋轉速度進行測定。 、牛下以1.0 於坑下的黏度:將本發明的液晶密 置5分鐘後進行測定。 、25C下放 於8〇C下的黏度:將本發明的液晶密封The weighting point is 75 ° C, epoxy equivalent is 215 g / eq) Epoxy resin 2: double-test A-type epoxy tree, epoxy equivalent of 190g / eq) (7) photoradical polymerization initiator Photoradical polymerization initiator: 1:1-cyclohexylphenyl fluorene (Irgacure 184. manufactured by Ciba Speciality Chemicals) Photoradical polymerization initiator 2: 2,2-dimethoxy-2-phenylbenzene Ethyl ketone (Irgacure 651: manufactured by Ciba Speciality Chemicais) (8) Thermoplastic polymer alkyl methacrylate copolymer microparticles (F_325: manufactured by Zemun Corporation, Japan, having an average primary particle diameter of 0.5 vm). [Evaluation method] The evaluation methods performed in Examples I-1 to 13 and Comparative Example _丨~4 will be described. Here, i) the viscosity, u) the leakage resistance of the liquid crystal sealing agent, iii) the coating property of the liquid aa sealant, and the subsequent strength were evaluated for the properties of the liquid crystal sealing agent. The details of each measurement evaluation method are as follows. i) Viscosity measurement 69 200900816 An E-type rotary viscometer (digital rheometer, ULTRA, manufactured by BROOKFIELD) and a half D H _ m degree of 3 were used. The CP-52 type cone-plate type sensor is measured at the following rotation speed of the coffee and the angle rpm. The viscosity of the cattle under 1.0 pit was measured by placing the liquid crystal of the present invention for 5 minutes. , 25C, the viscosity at 8 ° C: the liquid crystal sealing of the present invention

旋轉黏度計的杯中,以5t/分的升溫速度升&至阶,= 於80°c下放置5分鐘後進行測定。 ,並 於上述測定方法中,由於液晶密封劑於_ 超過測定界限而無法進行測定時,使用、黏度 (RheoSt麵RS150 : HAAKE製造)進行測定行= 板法的測定是依據上述機種的標準法,以 度升溫至80°C後,立即進行測定。 k ii)液晶雄'封劑的耐茂漏性 利用分注器(sh〇tmaster ••武藏工程(M職hi Engi順ing)公司製造),將添加有i份5 _之 維(glass fiber)的液晶密封劑,以〇 5mm的線寬、%、-m的厚度,於附有透明電極及配向膜的4〇聰⑷麵^ 璃基板(RT-DM88PIN : EHC公司製造)上,繪製成% mm x40 mm的框形。 其人利用分注器,將與貼合後的面板内容量相等的 液晶材料(MLC-11900-000 : Merck公司製造)精密滴入。 接著,使相對向的玻璃基板於9〇 Pa的減壓下進行重疊, 70 200900816 27285pif 恢復至大氣壓後,於120°C下加熱硬 進行=㈣液痛不面板的密封直線性是依據以下標準 [,封的最大寬度與最小寬度的比率]% ^讀的最錢度膽㈣最大寬度]X100 述比率大於等於95%者:〇(優異)In the cup of the rotary viscometer, the temperature was raised at a heating rate of 5 t/min to the order, and the measurement was carried out after standing at 80 ° C for 5 minutes. In the above-mentioned measurement method, when the liquid crystal sealing agent cannot be measured when the _ exceeds the measurement limit, the measurement is performed using the viscosity (RheoSt surface RS150: manufactured by HAAKE). The measurement of the plate method is based on the standard method of the above-mentioned model. Immediately after the temperature was raised to 80 ° C, the measurement was carried out. k ii) Leakage resistance of liquid crystal male sealant using a dispenser (sh〇tmaster • Musashi Engineering (M job hi Engi sing) company), will add i parts of 5 _ (glass fiber) The liquid crystal sealing agent was drawn in % on a 4 〇 (4) surface glass substrate (RT-DM88PIN: EHC) with a transparent electrode and an alignment film at a line width of 〇5 mm, a thickness of %, and a m. Frame shape of mm x 40 mm. The liquid crystal material (MLC-11900-000: manufactured by Merck Co., Ltd.) having the same amount of panel content as the bonded panel was precisely dropped by a dispenser. Next, the opposing glass substrates were superposed under a reduced pressure of 9 〇Pa, and 70 200900816 27285pif was returned to atmospheric pressure, and then heated at 120 ° C. Hardness was performed. (4) Liquid tightness The sealing linearity of the panel was based on the following criteria [ , the ratio of the maximum width to the minimum width of the seal]% ^ The most expensive biliary (four) maximum width read] X100 The ratio is greater than or equal to 95%: 〇 (excellent)

上述比率大於等於50%且小於95%者 上述比率小於50%者:>< (差) 出)液晶密封劑的塗佈性 將添加有1%的5 //m之玻璃纖維的液晶密封劑,於 真工下填充至針頭口控為〇.4mm的注射器(syringe)中。 接著’利用分注器(Shotmaster :武藏工程公司製造),於 喷出壓力為0.3 MPa、塗佈厚度為20 /zm、塗佈速度為10〇 mm/sec的條件下,於3〇〇 _x4〇〇 mm的液晶顯示面板用The above ratio is 50% or more and less than 95%, and the above ratio is less than 50%: >< (Poor) The coating property of the liquid crystal sealing agent is added with a liquid crystal sealing of 1% of 5 //m glass fiber The agent is filled into a syringe (syringe) with a needle of 4 mm in the needle. Then, using a dispenser (Shotmaster: manufactured by Musashi Engineering Co., Ltd.), at a discharge pressure of 0.3 MPa, a coating thickness of 20 /zm, and a coating speed of 10 〇mm/sec, at 3〇〇_x4 〇〇mm LCD panel

施加負重將其固定 化60分鐘。 玻璃基板(曰本電氣硝子公司製造)上,繪製5〇個35mm x40 mm的框形。 所繪製的密封圖案的密封形狀是根據以下標準進行評 價。 完全未發生密封斷開、密封瑕疵的框形為48個〜50 個:〇(優異) 上述框形少於45個〜48個:△(稍優異) 上述框形少於44個:X (差) iv)接著強度 71 200900816 於25 mmx45 mmx厚度5 mm的無鹼玻璃(n〇_alkali glass)上,將添加有1%的5 之玻璃纖維的液晶密封 劑網版印刷成直徑為1 mm的圓形,貼合與其成對的相同 玻,,一面進行固定,一面於12(rc下加熱i小時而製作 接著試驗片。使用拉伸試驗機(m〇del21〇 : Intesc〇公司製 造),以2 mm/分的速度將所獲得的試驗片沿平行方向= 去,測定平面拉伸強度。 接著強度是根據以下標準進行評價。 (] 拉伸強度大於等於10 MPa :〇(優異) 拉伸強度大於等於7 MPa且小於10 MPa : △(稍優 異) 拉伸強度小於7MPa : X (差) [實施例I -1] 以混合态,將30份丙烯酸樹脂〗、70份合成例工q 中所獲得的甲基丙烯酸改質環氧樹脂、丨份1〇小時半衰期 溫度為75°C的熱自由基聚合起始劑乃、2〇份填充料i預 I: 備混合,其次,以三輥對固體原料進行混煉,直至達到小 於等於5 //m。接著,以網眼孔徑為1〇从瓜的過濾器 (MSP-10-E10S : ADVANTEC公司製造),對此組成物& 行過濾,然後進行真空消泡處理,而獲得液晶密封用 組成物。 所獲得的液晶密封用樹脂組成物於25t下的黏度,於 〇·5 rpm下為260 Pa.s ’於i 〇印爪下為18〇 Pa.s,於5叻 下為 120 Pa’s。 72 200900816 27285pif 於在80 C下以E型旋轉型黏度計所測得的黏度大於The load was applied to fix it for 60 minutes. On the glass substrate (manufactured by Sakamoto Electric Glass Co., Ltd.), five frame shapes of 35 mm x 40 mm were drawn. The seal shape of the drawn seal pattern was evaluated according to the following criteria. The frame shape of the seal is not broken at all, and the sealing frame is 48 to 50: 〇 (excellent) The above frame shape is less than 45 to 48: △ (slightly superior) The above frame shape is less than 44: X (poor ) iv) Next strength 71 200900816 On a 25 mm x 45 mm x 5 mm thick alkali-free glass (n〇_alkali glass), a liquid crystal sealant with 1% of 5 glass fibers is screen-printed to a diameter of 1 mm. Round, attached to the same glass, and fixed on one side, and then heated at 12 (rc for 1 hour to make a test piece. Using a tensile tester (m〇del21〇: manufactured by Intesc〇)) The tensile strength of the test piece was measured in a parallel direction = 2 at a speed of 2 mm/min. The strength was evaluated according to the following criteria. () Tensile strength: 10 MPa or more: 〇 (excellent) Tensile strength 7 MPa or more and less than 10 MPa : △ (slightly excellent) Tensile strength less than 7 MPa : X (poor) [Example I -1] In a mixed state, 30 parts of acrylic resin, 70 parts of synthetic work q Obtained methacrylic acid modified epoxy resin, 〇1 hour half-life temperature The thermal radical polymerization initiator having a degree of 75 ° C, 2 parts of filler i pre-I: ready to mix, and secondly, the solid raw material is kneaded by three rolls until it reaches 5 // m or less. This composition was filtered with a mesh aperture of 1 〇 from a melon filter (MSP-10-E10S: manufactured by ADVANTEC Co., Ltd.), and then subjected to vacuum defoaming treatment to obtain a liquid crystal sealing composition. The viscosity of the resin composition for liquid crystal sealing at 25t is 260 Pa.s at 〇·5 rpm '18 〇Pa.s under i 〇, 120 Pa's at 5 。. 72 200900816 27285pif The viscosity measured by the E-type rotary viscometer at 80 C is greater than

’故而以平行板法(Rhe〇Stress RS150 : HAAKE 製l進行測疋’結果為9.00E + 05 Pa.s。另外,觸變指 數為2.2。 ,且’藉由上述評價方法,對液晶密封用樹脂組成物 進行t種败,對其特性進行評價。 [貫施例〜13]'The result of the parallel plate method (Rhe〇Stress RS150: HAAKE system 1) is 9.00E + 05 Pa.s. In addition, the thixotropy index is 2.2, and 'by the above evaluation method, for liquid crystal sealing The resin composition was subjected to t-type failure, and its characteristics were evaluated. [Comprehensive Example ~ 13]

二與貝施例1 -1相同的方式,獲得表卜表2所示之 、'且、、液印岔封用樹脂組成物。並且,進行與實施例I -1 相同的評價。 [比較例;[-1〜2] 曰^ίΓ施例1相同的方式,獲得表3所示之組成的液 曰曰毯’ m組成物。並且’進行與實施例}相同的評價。 [比較例I -3] 以行生式授拌裝置,將60份丙稀輯脂2、4〇份環氧 樹脂2混合授拌。 9 二於此樹脂中進而添加2份光自由基聚合起始劑 八、-π制、麵聚合物、1份傾偶合劑(s5ig :chiss〇 y =i、10份填充料2、1G份潛伏性環氧硬化劑2,以 裝置混合授拌。接著,以陶匕輕研磨機將此 進行混合,而獲得液晶密封用樹脂組成物。對 所獲付的魏組成魏行與實施例2相_評價。 [比較例I -4] 、 以灯星式授拌裝置,將60份两稀酸樹月旨2、4〇份環氧 73 200900816 樹脂2混合攪拌。 其次,於此樹脂中進而調配入10份熱塑性聚合物、1 份矽烷偶合劑(S510 : Chisso公司製造)、10份填充料2、 10份潛伏性環氧硬化劑2,以行星式攪拌裝置進行混合攪 拌。接著,以陶瓷三輥研磨機將混合物進一步混合,而獲 得液晶密封用樹脂組成物。對所獲得的樹脂組成物進行與 實施例1相同的評價。 將實施例I-1〜13、比較例I-1〜4中所製備的液晶滴 Γ 入技術用密封劑的洩漏性、塗佈性、接著強度的結果示於 表1〜表3。 200900816 27285pif [表l]In the same manner as in the case of Example 1-1, the resin composition for the seal of the liquid crystal seal shown in Table 2 was obtained. Further, the same evaluation as in Example 1-1 was carried out. [Comparative Example; [-1 to 2] 曰^ίΓ In the same manner as in Example 1, a liquid crepe blanket m composition of the composition shown in Table 3 was obtained. And the same evaluation as in the example was carried out. [Comparative Example I-3] 60 parts of propylene grease 2, 4 parts of epoxy resin 2 were mixed and mixed by a line-type mixing device. 9 Second, add 2 parts of photoradical polymerization initiator in this resin, VIII, -π, face polymer, 1 part of pour coupling agent (s5ig: chiss〇y = i, 10 parts of filler 2, 1G part of latent The epoxy curing agent 2 was mixed by means of a device, and then mixed with a ceramic grinder to obtain a resin composition for liquid crystal sealing. The obtained Wei composition was compared with Example 2 [Comparative Example I-4] In a lamp star-type mixing device, 60 parts of two dilute acid trees, 2, 4 parts of epoxy 73, 200900816 resin 2 were mixed and stirred. Next, the resin was further blended into the resin. 10 parts of a thermoplastic polymer, 1 part of a decane coupling agent (S510: manufactured by Chisso Co., Ltd.), 10 parts of a filler 2, and 10 parts of a latent epoxy curing agent 2, which were mixed and stirred by a planetary stirring device. The mixture was further mixed with a grinder to obtain a resin composition for liquid crystal sealing. The obtained resin composition was evaluated in the same manner as in Example 1. The examples I-1 to 13 and Comparative Examples I-1 to 4 were used. The prepared liquid crystal drip is leaky, coatable, and connected to the technical sealant. The results of the strength are shown in Table 1 to Table 3. 200900816 27285pif [Table l]

—— 實施例 1-1 實施例 1-2 實施例 1-3 實施例 1-4 實施例 1-5 實施例 1-6 組 成 丙烯酸樹脂 1 30 30 25 25 25 25 2 — — — — — — 合成例]中所獲得的改質環氧 樹脂 70 70 70 70 70 70 熱自由基聚合起始劑 88 — — — 1 — — 75 1 0.02 2 — 1 — 65 — — 一 — — 1 51 — — — — 一 — 填充料 1 20 20 20 20 20 20 2 — — — — — — 環氧硬化劑 1 — — — 5 5 5 2 — — — — — — 環氧樹脂 1 — — 5 5 5 5 2 — — — — — — 光自由基聚合起始劑 1 — — — — — — 2 一 — — — — — 熱塑性聚合物 — — — — 一 — 黏 度 25〇C/〇.5 rpm (Pa-s) 260 260 320 450 450 450 25〇C/1.〇rpm (Pa-s) 180 180 250 275 275 275 25〇C/5.0rpm (Pa-s) 120 120 150 180 180 180 80°C/l.〇rpm (Pa-s) 測定界 限 650 測定界 限 760 測定界 限 測定界 限 藉由平行板法所測得的於80°C 下的黏度(Pa‘s) 9.00E + 05 3.5E+ 03 9.00E + 05 3.5E+ 03 9.00E + 05 9.00E + 05 觸變指數 2.2 2.2 2.1 2.5 2.5 2.5 評 價 (0耐洩漏性 〇 Δ 〇 Δ 〇 〇 (ii)塗佈性 〇 〇 〇 〇 〇 〇 (m)接著強度 〇 〇 〇 〇 〇 〇 75 200900816 [表2]- Example 1-1 Example 1-2 Example 1-3 Example 1-4 Example 1-5 Example 1-6 Composition of acrylic resin 1 30 30 25 25 25 25 2 — — — — — — Synthesis Modified epoxy resin 70 70 70 70 70 70 Thermal radical polymerization initiator 88 — — — 1 — — 75 1 0.02 2 — 1 — 65 — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — A — Filling material 1 20 20 20 20 20 20 2 — — — — — — epoxy hardener 1 — — — 5 5 5 2 — — — — — — Epoxy resin 1 — — 5 5 5 5 2 — — — — — — Photoradical polymerization initiator 1 — — — — — — 2 — — — — — Thermoplastic polymer — — — — — viscosity — 25〇C/〇.5 rpm (Pa-s) 260 260 320 450 450 450 25〇C/1.〇rpm (Pa-s) 180 180 250 275 275 275 25〇C/5.0rpm (Pa-s) 120 120 150 180 180 180 80°C/l.〇rpm (Pa- s) Measurement limit 650 Determination limit 760 Measurement limit Measurement limit Viscosity at 80 ° C measured by the parallel plate method (Pa's) 9.00E + 05 3.5E+ 03 9.00E + 05 3.5 E+ 03 9.00E + 05 9.00E + 05 Thixotropic index 2.2 2.2 2.1 2.5 2.5 2.5 Evaluation (0 leakage resistance 〇Δ 〇Δ 〇〇(ii) coatability 〇〇〇〇〇〇(m) followed by strength〇〇 〇〇〇〇75 200900816 [Table 2]

實施 例I -7 實施 例I -8 實施 例I -9 實施 例I -10 實施 例I -11 實施 例I -12 實施 例I -13 組 成 丙烯酸樹脂 1 25 30 30 25 100 — 25 2 — — — — — — — 合成例〗中所獲得的改質 環氧樹脂 70 70 70 70 — 100 70 熱自由基聚合起始 劑 88 — — — — — — 75 — — — — 1 1 — 65 — — — — — — — 51 1 1 1 1 — — 1 填充料 1 20 5 45 20 20 20 10 2 — — — — — — — 環氧硬化劑 1 5 — — 5 — — 5 2 — — — — — — — 壤氧樹脂 1 5 — — 5 — — 5 2 — — — — — — — 光自由基聚合起始 劑 1 一 — — 1 — — — 2 — — — — — — — 熱塑性聚合物 — — — — — — 10 黏 度 25〇C/0.5 rpm (Pa-s) 450 80 1050 450 500 100 480 25〇C/1.〇 rpm (Pa-s) 275 70 480 275 400 60 290 25〇C/5.0rpm (Pa*s) 180 65 250 180 300 40 240 80°C/1.0 rpm (Pa-s) 測定 界限 測定 界限 測定 界限 測定 界限 測定 界限 測定 界限 測定 界限 藉由平行板法所測得的於 80°C下的黏度(Pa-s) 9.00E + 05 5.00E + 05 9.00E + 05 9.00E + 05 9.00E + 05 5.00E + 05 9.00E +05 觸變指數 2.5 1.2 4.2 2.5 1.7 2.5 2.0 評 價 (ί)耐洩漏性 〇 〇 〇 〇 〇 〇 〇 (ii)塗佈性 〇 〇 △ 〇 〇 〇 〇 (iii)接著強度 〇 〇 〇 〇 〇 Δ 〇 76 200900816 27285pii [表3]EXAMPLES I-7 Examples I-8 Examples I-9 Examples I-10 Examples I-11 Examples I-12 Examples I-13 Composition Acrylic Resin 1 25 30 30 25 100 — 25 2 — — — — — — — Modified epoxy resin 70 70 70 70 — 100 70 Thermal radical polymerization initiator 88 — — — — — — 75 — — — — 1 1 — 65 — — — — — — — 51 1 1 1 1 — — 1 Filling material 1 20 5 45 20 20 20 10 2 — — — — — — — Epoxy hardener 1 5 — — 5 — — 5 2 — — — — — — — Oxygen Resin 1 5 — — 5 — — 5 2 — — — — — — — Photo-radical polymerization initiator 1 — — 1 — — — 2 — — — — — — — Thermoplastic polymer — — — — — — 10 Viscosity 25〇C/0.5 rpm (Pa-s) 450 80 1050 450 500 100 480 25〇C/1.〇rpm (Pa-s) 275 70 480 275 400 60 290 25〇C/5.0rpm (Pa*s 180 65 250 180 300 40 240 80°C/1.0 rpm (Pa-s) Measurement limit measurement limit measurement limit measurement limit measurement limit measurement Limit of measurement limit Viscosity at 80 ° C measured by the parallel plate method (Pa-s) 9.00E + 05 5.00E + 05 9.00E + 05 9.00E + 05 9.00E + 05 5.00E + 05 9.00E +05 Thixotropic index 2.5 1.2 4.2 2.5 1.7 2.5 2.0 Evaluation (ί) Leak resistance 〇〇〇〇〇〇〇 (ii) Coating properties 〇〇 〇〇〇〇 iii (iii) Then strength 〇〇〇〇〇 Δ 〇76 200900816 27285pii [Table 3]

^ 比較例 1—1 比較例 1—2 比較例 I 一3 比較例 1—4 組 成 丙烯酸樹脂 1 25 30 — — 2 — — 60 60 合成例1中所獲得的改質環氧樹脂 70 70 — — 熱自由基聚合起始劑 88 — — — — 75 — — — 65 — — 一 — 51 — — — — 填充料 1 20 55 — — 2 — — 10 10 環氧硬化劑 1 5 — — — 〇 — — 10 10 壤氧树月曰 1 5 — - — 2 — — 40 40 光自由基聚合起始劑 1 1 — — — 2 — — 2 — 熱塑性聚合物 — — 10 10 黏 度 25〇C/〇.5 rpm (Pa*s) 450 1390 243 310 25〇C/1.〇 rpm (Pa-s) 275 530 250 370 25〇C/5.0rpm (Pa*s) 180 275 255 400 80°C/l.〇rpm (Pa-s) 380 測定界限 270 350 藉由平行板法所測得的於80°C下的黏 度(Pa.s) 2.9E+03 9.00E+05 6.0E + 02 8.0E+02 觸變指數 2.5 5.1 1 1.3 評 價 (i)财泡漏性 X 〇 X X (ii)塗佈性 〇 X 〇 〇 (iii)接著強度 〇 〇 X X 實施例I-1〜13所示的液晶密封劑,其耐洩漏性、塗 佈性、接著強度優異。若將此等實施例與比較例I -1、3 及4的結果進行比較,則可明瞭:液晶密封劑於80°C下的 黏度小於等於500 Pa‘s時,會於耐洩漏性方面產生問題。 另外,若將實施例與比較例I -2進行比較,則可明暸:若 於25°C、1.0 rpm下的黏度大於500 Pa·s,且觸變指數大 於5,則會於塗佈性方面產生問題。並且,由實施例I -1 77 200900816 〜13及比較例I -3、4的結果可明暸:若填充料的含量少, 則會於接著強度方面產生問題。 其次,就對本發明的液晶密封用硬化性樹脂組成物n 所進行的實施例及比較例進行說明。 [實施例Π -1〜6、比較例η _ι、2] 各實施例等所使用的材料如下所述。 (3) 熱自由基聚合起始劑^ Comparative Example 1-1 Comparative Example 1-2 Comparative Example I-3 Comparative Example 1-4 Composition Acrylic Resin 1 25 30 — 2 — — 60 60 Modified Epoxy Resin 70 70 obtained in Synthesis Example 1 — Thermal Radical Polymerization Starter 88 — — — 75 — — — 65 — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — 10 10 氧氧树月曰1 5 — — — 2 — — 40 40 Photoradical polymerization initiator 1 1 — — — 2 — — 2 — Thermoplastic polymer — 10 10 Viscosity 25〇C/〇.5 rpm (Pa*s) 450 1390 243 310 25〇C/1.〇rpm (Pa-s) 275 530 250 370 25〇C/5.0rpm (Pa*s) 180 275 255 400 80°C/l.〇rpm ( Pa-s) 380 Determination limit 270 350 Viscosity at 80 ° C measured by the parallel plate method (Pa.s) 2.9E+03 9.00E+05 6.0E + 02 8.0E+02 Thixotropic index 2.5 5.1 1 1.3 Evaluation (i) Bubble leakage X 〇 XX (ii) Coating property 〇 X 〇〇 (iii) Next strength 〇〇 XX The liquid crystal sealing agent shown in Examples I-1 to 13 has leakage resistance. Coating property, Then the strength is excellent. When these examples were compared with the results of Comparative Examples I-1, 3, and 4, it is clear that when the viscosity of the liquid crystal sealing agent at 80 ° C is 500 Pa's or less, the leakage resistance is produced. problem. Further, when the examples were compared with Comparative Example 1-2, it is understood that if the viscosity at 25 ° C and 1.0 rpm is more than 500 Pa·s and the thixotropic index is more than 5, the coating property is improved. cause problems. Further, from the results of Examples I -1 77 200900816 to 13 and Comparative Examples I -3 and 4, it is understood that if the content of the filler is small, there is a problem in the subsequent strength. Next, examples and comparative examples of the curable resin composition n for liquid crystal sealing of the present invention will be described. [Examples 1 -1 to 6, Comparative Examples η _ ι, 2] The materials used in the respective examples and the like are as follows. (3) Thermal radical polymerization initiator

熱自由基聚合起始劑:2,2,_偶氮雙(2_甲基丙酸酯Κ商 品名:V-601 ’和光純藥製造,1〇小時半衰期溫度 ° (4) 填充料 填充料.球狀氧化;ε夕(Seah〇starS-30 :日本觸媒公 製造,平均-次粒徑為0.3 ,比表面積為u (5) 環氧硬化劑 运 熱潛伏性環氧硬化劑:1,3·雙(肼基幾乙基)_5•異美 内醯脲(Amicure VDH :呋之去八制1 ^ ^ 土乙 禾之素公司製造,熔點為12〇γ ^ (6) 環氧樹脂 環氧樹脂 球法所測得 環氧樹脂.鄰甲驗酚醛清漆型固體 (EOCN-1020-75:日本化藥公司製造,藉由環 的軟化點為75°C,環氧當量為215g/eq) (9)其他添加劑 基三― (10)自由基硬化性樹脂 以甲苯稀_下麟的各樹職,㈣_水進行清 78 200900816 27285pif 洗,重複進行上述步驟㈣備高純度化的自由基硬化性樹 脂。此處’下述自由基硬化性_2是藉由下述合成例π •1的方法所合成的樹脂。 自由基硬化性樹脂1 ··雙齡Α型環氧樹脂改質二丙婦 酸酉旨(綱2A··共榮社化學製造,分子量為_)Thermal Radical Polymerization Starter: 2,2,_Azobis(2_methylpropionate Κ Trade Name: V-601' and Wako Pure Chemical Manufacturing, 1 〇 half-life temperature ° (4) Filler Filler Spherical oxidation; Sea 〇 ( (Seah〇starS-30: manufactured by Nippon Shokubai Co., with an average-order particle size of 0.3 and a specific surface area of u (5) Epoxy hardener: Thermal latent epoxy hardener: 1, 3·Bis(decyl-ethyl)_5•Imimethacin (Amicure VDH: Furuo Goto 8] 1 ^ ^ ethane acetoin, melting point 12〇γ ^ (6) epoxy ring Epoxy resin measured by the oxygen resin ball method. The adjacent acetal varnish type solid (EOCN-1020-75: manufactured by Nippon Kayaku Co., Ltd., with a softening point of the ring of 75 ° C and an epoxy equivalent of 215 g / eq) (9) Other additives base three - (10) Free radical curable resin with toluene _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Resin. Here, the radical scavenging property 2 described below is a resin synthesized by the following synthesis example π • 1. Free radical curable resin 1 · Double age Α epoxy Aliphatic acid modified dipropyl women unitary purpose (Class 2A ·· manufactured by Kyoeisha Chemical, molecular weight _)

自由基硬化性獅2 : 1分子㈣有環氧基及(甲基) 丙烯醯基的(甲基)丙烯酸改質環氧樹脂 [合成例Π-1] 於安裝有攪拌機、導氣管、溫度計、冷卻管的500ml 的四口燒瓶中,裝入160 g雙酚F型環氧樹脂(Ep〇t〇ht〇 YDF-8170C,東都化成公司製造)、36 g丙烯酸、〇 2邑三 乙醇胺,於乾燥空氣流下,以11(rc加熱攪拌5小時,: 獲得丙烯酸改質環氧樹脂。使用超純水將所獲得的樹脂产 洗12次。 曰β (11)自由基鍵轉移劑 自由基鏈轉移劑1:1,3,5-三(3-巯基丁氧基乙基)_135_ 三嗪-2,4,6(111,3氏511)三酮(〖&代1^1^0^尺-1:昭和電工公 司製造) (和光純藥 自由基鏈轉移劑2:二硫化四乙基秋蘭姆 工業製造) 自由基鍵轉移劑3 :二乙氧基曱烧聚碳鍵聚人物 (Thiokol LP-2 : Toray Fine Chemicals 公司製造) 自由基鏈轉移劑4 :第三-十二烷基硫醇 [評價方法] 79 200900816 對實施例Π-1〜6及比較例nq、2中所進行的評價方 法進行說明。此處,測定i)液晶顯示面板的顯示性、 液晶密封劑的密封性、iii)經硬化的液晶密封劑的接著強 度,對液晶密封劑的特性進行評價。各測定評價方法的詳 細内容如下。 0液晶顯示面板之顯示性 使用添加有1%的5,之玻璃纖維的液晶密封劑, 以0.5 mm的線寬、50 的厚度,於附有透明電極及配 向膜的40 mmx45 mm的玻璃基板(RT_DM88pm ^Hc公 司製造)上,繪製35 mmx40 mm的框形。繪製是使用分 注器(Shotmaster :武藏工程公司製造)而進行。 其次,利用分注器,將與貼合後的面板内容量相等的 液,材料(MLC-6848-000,Merck公司製造)精密滴入。 接,,於90 Pa的減壓下使2塊玻璃基板以相對向的方式 重疊後’施加負重將其固定,然後自減壓下恢復至大氣壓, :使基板彼此減合。並且,將此經貼合板投入至循 環式烘箱中,於70。〇下加熱30分鐘後,進而於12叱下加 熱60分鐘,藉此使液晶密封劑硬化。 ;、、’ΐ·貼δ的2塊基板的兩面上分別貼附偏向膜,而穿』 成液晶顯示面板。以直流電源裝置,對此液晶顯示面板施 V的電壓,藉此驅動液晶顯示面板。此時,目測觀察 2晶密封_形成的密封附近的液晶顯示功能自驅動初 =否,常發揮,且根據以下標準對液晶顯示面板的顯示 80 200900816 27285pii 至密封邊界附近為止表現出顯示功能的情況:〇(顯 示性良好) 自密封邊界附近至大於0.3 mm的距離為止未表現出 顯示功能的情況:X(顯示性明顯差) ii)液晶密封劑的密封性 以與上述液晶顯示面板的製造方法相同的方法,案』作 3塊液晶顯示面板,根據以下所示的標準,以4個等級對Free radical sclerosis lion 2 : 1 molecule (4) (meth)acrylic acid modified epoxy resin having epoxy group and (meth) acrylonitrile group [Synthesis Example Π-1] A mixer, an air pipe, a thermometer, and the like are attached. A 500 ml four-necked flask of a cooling tube was charged with 160 g of bisphenol F-type epoxy resin (Ep〇t〇ht〇YDF-8170C, manufactured by Tohto Kasei Co., Ltd.), 36 g of acrylic acid, and ruthenium diethanolamine. Under air flow, the mixture was heated and stirred at 11 (rc for 5 hours to obtain an acrylic modified epoxy resin. The obtained resin was washed 12 times using ultrapure water. 曰β (11) radical transfer agent radical chain transfer agent 1:1,3,5-tris(3-mercaptobutoxyethyl)_135_triazine-2,4,6(111,3's 511)trione (〖&代1^1^0^尺- 1: manufactured by Showa Denko Co., Ltd. (Wako Pure Chemicals Free radical chain transfer agent 2: tetraethyl thiuram disulfide industrial manufacturing) Free radical bond transfer agent 3: Diethoxy oxime polycarbon bond poly person (Thiokol LP -2 : manufactured by Toray Fine Chemicals Co., Ltd.) Free radical chain transfer agent 4: Third-dodecyl mercaptan [Evaluation method] 79 200900816 For the examples Π-1 to 6 and the comparative examples nq, 2 Evaluation methods will be described. Here, the measurement i) of the liquid crystal display panel, a liquid crystal sealing sealant, III) followed by the strength of the cured sealant liquid crystal, the characteristics of the liquid crystal sealant was evaluated. The details of each measurement evaluation method are as follows. 0 The display of the liquid crystal display panel uses a liquid crystal sealant to which 1% of 5, glass fiber is added, with a line width of 0.5 mm and a thickness of 50, on a 40 mm x 45 mm glass substrate with a transparent electrode and an alignment film ( On the RT_DM88pm ^Hc company, draw a frame of 35 mm x 40 mm. Drawing was performed using a dispenser (Shotmaster: manufactured by Musashi Engineering Co., Ltd.). Next, a liquid (MLC-6848-000, manufactured by Merck), which is equal in amount to the panel contents after the bonding, was precisely dropped by a dispenser. Then, after the two glass substrates were overlapped in a relative manner under a reduced pressure of 90 Pa, the load was fixed by applying a load, and then returned to atmospheric pressure from a reduced pressure: the substrates were subtracted from each other. Further, the laminated plate was placed in a circulating oven at 70. After heating under the arm for 30 minutes, the film was further heated at 12 Torr for 60 minutes to cure the liquid crystal sealing agent. The two films on the two substrates of ΐ, 贴 δ are attached with a deflecting film, respectively, and are formed into a liquid crystal display panel. The liquid crystal display panel is driven by applying a voltage of V to the liquid crystal display panel with a DC power supply device. At this time, visual observation of the liquid crystal display function in the vicinity of the sealed seal formed by the two crystal seals is often performed, and the display function of the display of the liquid crystal display panel 80 200900816 27285pii to the vicinity of the sealed boundary is exhibited according to the following criteria. : 〇 (good display property) The case where the display function is not exhibited from the vicinity of the sealing boundary to a distance of more than 0.3 mm: X (significantly poor display property) ii) Sealing property of the liquid crystal sealing agent and the manufacturing method of the above liquid crystal display panel The same method, the case" for three LCD panels, according to the criteria shown below, in four levels

各液晶顯示面板上成為顯示區域的框(密封)的密封性進 行評價。 ^ 無主密封(main seal)破損,且無自液晶向密封綠“ HnO侵入(以下稱為插入)的情況:◎ 雖可見插入,但無主密封破損的情況:〇 有1處主密封破損的情況:△ 有2處或2處以上主密封破損的情況:χ m)經硬化的液晶密封劑的接著強度 时、/兀u瓜·π mmx厚度5 mm的無鹼玻 成^的5 ^之破璃纖維的液晶密封劑網版印刷 其把P ⑮由又具dlp)夹住上述經貼合的2塊 7^^=重的狀態下將其投人至循環式供箱中後,於 ==^^下細分鐘二 作僅接由加熱而使液晶密封劑硬化所形成的Si片猎此製 81 200900816 ^藉由使用拉伸試驗機(model 210 :Intesco公司製造), t 2 mm/分的速度將所獲得的試驗片沿與玻璃底面相平行 的方向,去,而測定平面拉伸強度。 接著強度是根據以下標準進行評價。 拉伸強度大於等於10 MPa的情況:〇(接著強度良 好) &伸強度小於10 MPa的情況:X (接著強度差) iv)液晶密封劑的黏度穩定性 利用E型旋轉型黏度計(BROOKFIELD公司製造: 數位流變計,魏:DW ULTRA),糾下述方法所製 ,的液晶㈣劑的黏度穩定性進行測定。此時,液晶密封 劍的黏度疋敎剛製備後雜度 '及於坑下保存5天後 的黏度。測定是使用半徑為12rnm、角度為3。的cp_52型 錐-板型感測器,旋轉速度設為2·5 rpm。 、所測定的液晶密封劑的黏度中,將剛製備後的黏度設 為1,將於25 C下保存5天後的黏度設為π 2,根據以下 標準對液晶密封劑的黏度穩定性進行評價。 7?2/t? 1的值小於15的情況:〇 t/2/t? 1的值大於等於15且小於2 〇的情況·· △ 7/2/7? 1的值大於等於2 0的情況:χ [實施例Π-1] 將15份每氧樹脂、及45份自由基硬化性樹脂卜於 10(TC下加熱溶解1小時而製成均勻的溶液。其次,將此溶 液冷卻後’加入2〇份上述合成例^中所獲得的自由基 82 200900816 27285pif 硬化性樹脂2、0.5份自由基鏈轉移劑卜i5份填充料、3 份潛伏性環氧硬_、及丨份作為添加細雜偶合劑, 以混合器進行韻混合,接著,_三㈣行混煉,直至 固體原料達到小於等於5 //m。接著,利用網眼孔徑為1〇 /zm 的過;慮裔(MSP-10-E10S : ADVANTEC 公司製造), 對此混合物進行過濾,然後加入〇 5份熱自由基聚合起始 劑後,利用行星式攪拌機進行真空攪拌消泡處理,藉此製 備液晶密封劑。The sealing property of the frame (sealing) which becomes the display area on each liquid crystal display panel was evaluated. ^ There is no main seal (main seal) damage, and there is no case where the liquid crystal is sealed to the green "HnO (hereinafter referred to as insert): ◎ Although the insertion is visible, there is no damage to the main seal: one of the main seals is damaged: △ There are 2 or more places where the main seal is broken: χ m) The adhesion strength of the hardened liquid crystal sealant, /兀u melon·π mmx thickness 5 mm, the alkali-free glass is 5^ The liquid crystal sealant of the fiber is screen-printed, and P 15 is clamped to the above-mentioned two-folded 7^^======================================================================== ^The next minute is the Si piece formed by hardening the liquid crystal sealant only by heating. 81 200900816 ^ By using a tensile tester (model 210: manufactured by Intesco), the speed of t 2 mm/min The obtained test piece was taken in a direction parallel to the bottom surface of the glass to measure the plane tensile strength. Then the strength was evaluated according to the following criteria: When the tensile strength was 10 MPa or more: 〇 (following the strength) & When the tensile strength is less than 10 MPa: X (and subsequent strength difference) iv) The viscosity stability of the sealant was measured by an E-type rotary viscometer (manufactured by BROOKFIELD Co., Ltd.: digital rheometer, Wei: DW ULTRA), and the viscosity stability of the liquid crystal (four) agent prepared by the following method was measured. The viscosity of the liquid crystal sealing sword is just after the preparation of the 'muchness' and the viscosity after 5 days of storage under the pit. The measurement is a cp_52 cone-plate type sensor with a radius of 12rnm and an angle of 3. The rotation speed is set to 2·5 rpm. The viscosity of the liquid crystal sealing agent measured was set to 1 after the preparation, and the viscosity after storage for 5 days at 25 C was set to π 2 , and the liquid crystal sealing agent was used according to the following criteria. Evaluation of viscosity stability. Case where the value of 7?2/t?1 is less than 15: The value of 〇t/2/t? 1 is greater than or equal to 15 and less than 2 ··· △ 7/2/7? When the value is greater than or equal to 20: χ [Example Π-1] 15 parts of peroxy resin and 45 parts of radical curable resin were dissolved by heating at 10 (TC for 1 hour to prepare a uniform solution. Secondly, After cooling this solution, 'add 2 parts of the free radical 82 obtained in the above synthetic example ^ 200900816 27285pif hardening tree 2, 0.5 part of the free radical chain transfer agent, i5 parts of the filler, 3 parts of the latent epoxy hard _, and 丨 part as a fine intermixing agent, mixed with a mixer, and then _ three (four) line mixing, Until the solid raw material reaches 5 //m or less. Then, using a mesh pore size of 1〇/zm; the mixture is filtered (MSP-10-E10S: manufactured by ADVANTEC), and the mixture is filtered, and then 5 parts are added. After the thermal radical polymerization initiator, vacuum agitation and defoaming treatment was carried out using a planetary mixer to prepare a liquid crystal sealing agent.

[實施例Π -2] 除使用自由基鏈轉移劑2以外,其餘均以與實施例jj -1相同的方式製備液晶密封劑。 [實施例Π-3] 除使用自由基键轉移劑3以外,其餘均以與實施例π -1相同的方式製備液晶密封劑。 [實施例Π-4] 除將自由基硬化性樹脂1設為42.5份,將自由基硬化 性樹脂2設為15份,並且將自由基鏈轉移劑1設為2 5份, 將填充料設為20.5份以外,其餘均以與實施例π-ΐ相同的 方式製備液晶密封劑。 [實施例Π-5] 除將自由基硬化性樹脂1設為48份,將自由基硬化性 樹脂2設為15份,並且將填充料設為22份,將環氧樹脂 设為10份以外,其餘均以與實施例Π-1相同的方式製備 液晶密封劑。 83 200900816, [實施例Π-6] 除將自由基鏈轉移劑4設為0.5份以外,其餘均以與 實施例Π-1相同的方式製備液晶密封劑。 [比較例Π-1] 除完全不使用自由基鏈轉移劑,並且將自由基硬化性 樹脂1設為45.5份,將自由基硬化性樹脂2設為20份以 外,其餘均以與實施例Π-1相同的方式製備液晶密封劑。 [比較例Π-2] 除不使用熱自由基聚合起始劑,並且將自由基硬化性 樹脂1設為45.5份以外,其餘均以與實施例Π-1相同的方 式製備液晶密封劑。 將各實施例及比較例中所使用的液晶密封劑的各成分 的調配量,及關於所製備的液晶密封劑之密封性、接著強 度、及使用其之液晶顯示面板的顯示性的評價結果匯總示 於表4。 84 200900816 27285pif [表41[Example Π - 2] A liquid crystal sealing agent was prepared in the same manner as in Example jj-1 except that the radical chain transfer agent 2 was used. [Example Π-3] A liquid crystal sealing agent was prepared in the same manner as in Example π-1 except that the radical bond transfer agent 3 was used. [Example Π-4] The radical curable resin 1 was set to 42.5 parts, the radical curable resin 2 was set to 15 parts, and the radical chain transfer agent 1 was set to 25 parts, and the filler was set. A liquid crystal sealing agent was prepared in the same manner as in the example π-ΐ except for 20.5 parts. [Example Π-5] The radical curable resin 1 was set to 48 parts, the radical curable resin 2 was set to 15 parts, and the filler was set to 22 parts, and the epoxy resin was set to 10 parts. The liquid crystal sealant was prepared in the same manner as in Example Π-1. 83 200900816, [Example -6] A liquid crystal sealing agent was prepared in the same manner as in Example Π-1 except that the radical chain transfer agent 4 was set to 0.5 part. [Comparative Example Π-1] The radical curable resin 1 was used in an amount of 45.5 parts, and the radical curable resin 2 was set to 20 parts, except for the case where the radical chain transfer agent was not used at all. A liquid crystal sealant was prepared in the same manner as -1. [Comparative Example 2] A liquid crystal sealing agent was prepared in the same manner as in Example Π-1 except that the thermal radical polymerization initiator was not used and the radical curable resin 1 was changed to 45.5 parts. The amount of each component of the liquid crystal sealing agent used in each of the examples and the comparative examples, and the evaluation results of the sealing property, the bonding strength of the liquid crystal sealing agent to be prepared, and the display property of the liquid crystal display panel using the same are summarized. Shown in Table 4. 84 200900816 27285pif [Table 41

=表4可明4:應用本中請發明的實施例n]〜6的 液日日雄'封劑,並上述密封性、接英 異。 ”上玍接考強度、及顯示性非常優= Table 4 is clear: 4: The liquid Japanese-Japanese male sealant of the examples n] to 6 invented in the present invention is applied, and the above-mentioned sealing property and the above-mentioned sealing property are different. "The upper entrance strength and displayability are very good."

-1'的4,於不使用自由基鏈轉移劑時,由比較例Π 封性;;卿的顯 ι是。另外,於使用硫醇系# 劑時,可確^. mm 系熱硬化性劑作為熱硬化性 題 可提高二級简,賴使用—級硫醇相比, 自由4:=繼穩定性。另-方面,於不使用熱 Μ於密;=強;比 - 接者強度、顯禾性中的任-方面均存在問 [實施例m-i〜6、比較例心 以下,就對本發明的液晶密封用硬化性樹脂組成物皿 85 200900816 所進行的實施例及比較例進行具體說明 中所使用的材料等的 [實施例皿-1〜6、比較例冚_1〜4 製備] 各實施例等中所使用的材料如丁所示。 (3)熱自由基聚合起始劑 熱自由基聚合起始劑1 :2,2L偶氣雙(2本二 (V-65 :和光純藥製造,10小時半衰期溫度為H 開始溫度為51。〇4 of -1', when not using a radical chain transfer agent, is sealed by a comparative example; Further, when a thiol-based agent is used, it is possible to improve the secondary simplification as a thermosetting property of the thermophilic agent, and it is more stable than the use of the thiol. On the other hand, there is a problem in that the heat is not used in the dense; = strong; the ratio of the strength of the connector and the aspect of the invention are the same [Examples mi~6, below the core of the comparative example, the liquid crystal sealing of the present invention In the examples and comparative examples which were carried out with the curable resin composition, the materials and the like used in the detailed description are as follows: [Examples 1 to 6 and Comparative Examples 冚_1 to 4 are prepared] The materials used are shown as D. (3) Thermal Radical Polymerization Initiator Thermal Radical Polymerization Starter 1: 2, 2L Oxygen Double (2 copies of 2 (V-65: manufactured by Wako Pure Chemical Industries, 10 hours half-life temperature is H, starting temperature is 51). 〇

熱自由基聚合起始劑2 : 2,2,·偶氮雙(2_甲基丙酸 酉曰匕)(獨::和光純藥製造,1()小時半衰期溫度為66= 發熱開始溫度為60°C) 熱自由基聚合起始劑3 :過氧化2·乙基己酸第三戊酉旨 (Lupasol 575 : API Corporation 製造,10 小時半衰 ^ 為75。0:,發熱開始溫度為88。〇 度 熱自由基聚合起始劑4 : u_偶氮雙(2,4_環己燒小甲 腈)UerhexylO .日本油脂公司製造,1〇小時半衰期溫度 為70 C,發熱開始溫度為1〇5。匚) (4 )填充料 填充料1 :球狀二氧化矽(Seah〇star s_3〇 :日本觸媒 製造,平均—次粒徑為。.3 //m,比表面積為llm2/g)、 ,真充才斗2 .球狀二氧化石夕(SO-C2 : ADMATECHS公 司製造,,均1粒徑為G 9 ,比表面積為4m2/g) ,,充料3 .球狀二氧化石夕(s〇_ci : aDmatechs公 司製泣平均一次粒禋為0.25 〃m,比表面積A17_4m2/g) 86 200900816 272^pii 填充料4 :滑石粉(SG-2000 :曰本滑石粉公司製造, 平均一次粒徑為1.0 ym,比表面積為36.6 m2/g) (5)環氧硬化劑 潛伏性環氧硬化劑1 : 1,3-雙(肼基羰乙基)-5-異丙基乙 内醢脲(Amicure VDH :味之素Fine-Techno公司製造,熔 點為120°C ) 潛伏性環氧硬化劑2 :己二酸二醯肼(ADH :大塚化 學公司製造,熔點為181。(:) 潛伏性環氧硬化劑3 : Amicure PN-23J (味之素 Fine-Techno公司製造,熔點為l〇5°C ) (7) 光自由基聚合起始劑 光自由基聚合起始劑1· : 2,2-二曱氧基-2-本基求乙酉同 (Irgacure 651 : Ciba Speciality Chemicals 製造) (8) 熱塑性聚合物 甲基丙烯酸烷基酯共聚物微粒子(F-325 :日本Zeon 公司製造,平均一次粒徑為0.5 //m) (9) 其他添加劑 偶合劑1 :矽烷偶合劑(S-510 : Chisso公司製造) 偶合劑2 :矽烷偶合劑(KBM-403 :信越化學公司製 造) (12)硬化性樹脂 適當選擇使用下述(1A)樹脂、(1B)樹脂、(1C) 樹脂。 (1A)樹脂(自由基二官能性樹脂) 87 200900816 A· 1 一 W ii 樹脂(A-ι) ·卞述合成例m-1中所合成的樹脂 樹脂CA-2)‘:卞述合成例m-2中所合成的樹脂 樹脂(A-3):卞述合成例羾-3中所合成的樹脂 樹脂(A-4):卞述合成例111-4中所合成的樹脂 樹脂(A-5)’·卞述合成例羾-5中所合成的樹脂 樹脂(A-6)·:雙鹼A塑二丙稀酸環氧醋 樹脂(A-7):卞述合成例ffi_6中所合成的樹脂 (1B )樹月旨 (': 樹脂(B-1):卞述合成例皿·7中所合成的笨醚型部分 丙烯醯基化環氣樹脂 樹脂(B-2):下述合成例羾-8中所合成的雙酚F型部 分丙:fcfp酸基化環氧樹月曰 樹脂(B-3):下述合成例瓜-9中所合成的間苯二酚二 縮水甘油㈣部分两嫌醯基化環氧樹脂 樹脂(B-4):下述合成例羾-10中所合成的樹脂 樹脂(B-5):下述合成例羾-11中所合成的樹脂 () 樹脂(B_6):下述合成例皿~12中所合成的樹脂 (1C)樹脂 樹脂(C-1):鄰f酚酚醛清漆型固體環氧樹脂(市售 品) 樹脂(C-2):雙酚A型壤氧樹脂(市售品) 樹月旨(C-3 )(比車交用)雙紛A型環氧樹脂(市售品) [樹腊的分析方法] 另外,為了掌提备合成例中所合成的樹脂的品質等, 88 200900816 27285pif 而依據下述方法來適當進行a θ、a,—— υ環氧當量狀m測定及氧化測定 二 環氧當Π藉Γ下方法而算出:將樹脂溶解於鹽酸· 乳陸圜备射之後,較被環氧基所消耗Thermal Radical Polymerization Initiator 2 : 2,2,·Azobis(2-methylpropionate) (Individual: Made by Wako Pure Chemical Industries, 1 () hour half-life temperature is 66 = fever start temperature is 60 ° C) Thermal Radical Polymerization Initiator 3 : Peroxide 2 · Ethylhexanoic acid Third pentylene (Lupasol 575: manufactured by API Corporation, 10 hours half-fat ^ is 75.0:, the onset temperature of heat is 88 Thermal Thermal Radical Polymerization Starter 4 : u_Azobis(2,4_cyclohexane-small carbonitrile) UerhexylO. Made by Nippon Oil & Fat Co., Ltd., 1 hour half-life temperature is 70 C, and the onset temperature is 1 〇5.匚) (4) Filler filler 1: spherical cerium oxide (Seah〇star s_3〇: manufactured by Nippon Shokubai, average-secondary particle size is .3 //m, specific surface area is llm2/g ), 真充才斗2. Spherical dioxide dioxide (SO-C2: ADMATECHS company, 1 particle size G 9 , specific surface area 4m2 / g), filling 3. Spherical dioxide Shi Xi (s〇_ci : aDmatechs company wept average granules of 0.25 〃m, specific surface area A17_4m2 / g) 86 200900816 272^pii Filler 4: talcum powder (SG-2000: manufactured by Sakamoto Talc The average primary particle size is 1.0 ym and the specific surface area is 36.6 m2/g. (5) Epoxy hardener latent epoxy hardener 1: 1,3-bis(decylcarbonylethyl)-5-isopropyl Amidourin (Amicure VDH: Ajinomoto Fine-Techno, melting point: 120 ° C) Latent epoxy hardener 2: Diterpene adipate (ADH: manufactured by Otsuka Chemical Co., Ltd., melting point 181. (: ) Latent epoxy hardener 3 : Amicure PN-23J (Ajinomoto Fine-Techno, melting point l〇5 ° C) (7) Photoradical polymerization initiator photoradical polymerization initiator 1· : 2,2-dimethoxy-2-benzyl acetamidine (Irgacure 651: manufactured by Ciba Speciality Chemicals) (8) Thermoplastic polymer alkyl methacrylate copolymer microparticles (F-325: manufactured by Zeon Corporation, Japan) , average primary particle size is 0.5 //m) (9) Other additive coupling agent 1: decane coupling agent (S-510: manufactured by Chisso Co., Ltd.) Coupling agent 2: decane coupling agent (KBM-403: manufactured by Shin-Etsu Chemical Co., Ltd.) 12) The curable resin is appropriately selected from the following (1A) resin, (1B) resin, and (1C) resin. (1A) Resin (radical difunctional resin) 8 7 200900816 A· 1 A ii resin (A- ι) The resin resin CA-2) synthesized in Synthesis Example m-1 is described as follows: The resin resin synthesized in Synthesis Example m-2 is described (A- 3): The resin resin (A-4) synthesized in Synthesis Example 羾-3 is described as follows: The resin resin (A-5) synthesized in Synthesis Example 111-4 is described in detail. Resin resin (A-6):: Di-alkali A plastic diacetic acid epoxy vinegar resin (A-7): Resin synthesized in Synthesis Example ffi_6 (1B) Shuyue (': Resin (B-1): A description of the pheno-ether-type partially acrylylated cycloolefin resin (B-2) synthesized in the synthesis example, the bisphenol F type synthesized in the following Synthesis Example 羾-8 Part C: fcfp acid-based epoxy resin ruthenium resin (B-3): resorcinol diglycidyl (4) partially synthesized in the following synthesis example melon-9 -4): Resin resin (B-5) synthesized in the following Synthesis Example 羾-10: Resin () resin synthesized in the following Synthesis Example 羾-11 (B_6): The following synthesis example dish ~12 Synthetic resin (1C) resin resin (C-1): o-fphenol novolac type solid epoxy resin (commercial product) Lipid (C-2): Bisphenol A type of earth-alkali resin (commercial product) Shuyue (C-3) (compared to car) A-type epoxy resin (commercial product) [analysis of tree wax In addition, in order to provide the quality of the resin synthesized in the synthesis example, etc., 88 200900816 27285pif, a θ, a, υ epoxide equivalent m measurement and oxidation measurement epoxide are appropriately performed according to the following method. It is calculated by the method of sputum: after the resin is dissolved in hydrochloric acid and milk sputum, it is consumed by the epoxy group.

2)酸值測定 I 行測定。首先,將樹脂溶解於乙 =備樹脂溶液。於此樹脂溶液中添加盼 酞乙醇(ph__alem ethanol)溶液。接著,於此樹脂 溶液中滴入乙醇性0.1當量的Krw a w " 消耗的廳量而算出;: 谷液變為無色前所 [合成例Π -1] 自由基'一 S能性樹脂(Α-1 )的合成 準備安裝有溫度計、冷卻管、授拌裝置的燒瓶。於此 燒瓶中裝入170 g雙酶F二縮水甘_ (大日本油墨化學 工業公司製造,Epiclon 830S,環氧當量為17 於9(TC下對上述溶液擾拌2小時後,進而一面 ^-面攪拌3M、時而使其反應。其後,以軌水清洗反 應洛液後,除去曱苯而獲得樹脂。所獲得的樹 所測定的數量平均分子量為457,其波峰 分子内具有2健基,故而氫_能基量算 。由本合成例所獲得的樹㈣結構如 89 2009008162) Determination of acid value I line measurement. First, the resin is dissolved in a resin solution. A solution of ph__alem ethanol was added to the resin solution. Then, the resin solution was dropped into an amount of 0.1 equivalent of Krw aw " consumed by the ethanol solution; and the solution was changed to colorless before [synthesis example Π -1] radical 'one S-energy resin (Α -1) Synthesis of a flask equipped with a thermometer, a cooling tube, and a mixing device. The flask was charged with 170 g of double enzyme F digoxime _ (manufactured by Dainippon Ink Chemical Industry Co., Ltd., Epiclon 830S, epoxy equivalent of 17 at 9 (after TC was scrambled for 2 hours, then one side ^- The mixture was stirred for 3 M and occasionally reacted. Thereafter, the reaction solution was washed with a rail of water, and then the toluene was removed to obtain a resin. The obtained tree had a number average molecular weight of 457 and a peak of 2 in the molecule. Therefore, the hydrogen-energy basis is calculated. The tree (four) structure obtained by this synthesis example is 89 200900816

[合成例ΙΠ-2] 自由基二官能性樹脂(A-2)的合成[Synthesis Example ΙΠ-2] Synthesis of a radical difunctional resin (A-2)

、準備安裝有溫度計、冷卻管、攪拌裝置的燒瓶。 燒瓶中裝入200g的Epiclon850CRP(雙酚a型環& ; ^ 大曰本油墨化學工#製造)、丨〇 〇 g甲基Μ酸、^樹脂: 苯、0.4 g三乙胺、0.4 g對曱氧基苯酚,進行混人§曱 混合物於贼下游M、時而使其反應。心^播將此 超^清洗反應混合物,並以f柱進行精製,藉^二 氧基的100%經甲基丙烯醯基化樹 均裱 513所复獲得的樹脂藉由GPC所測t數量平均分子量為 個峰為/峰。由於所獲得的樹月旨於分子内具有2 風鍵官能基量算出為3.9祕3 ->他。由本 斤獲侍的樹脂的結構如下。Prepare a flask equipped with a thermometer, a cooling tube, and a stirring device. The flask was charged with 200 g of Epiclon 850 CRP (bisphenol a-ring &; ^ manufactured by Otsuka Ink Chemical Co., Ltd.), 丨〇〇g methyl decanoic acid, resin: benzene, 0.4 g of triethylamine, 0.4 g of The methoxy phenol is mixed with a § 曱 mixture and then reacted downstream of the thief M. The mixture was cleaned and washed with a f-column, and the resin obtained by 100% of the methacrylic acid thiolated tree homogenate 513 was averaged by GPC. The molecular weight is a peak/peak. Since the obtained tree month is intended to have 2 wind bond functional groups in the molecule, the amount is calculated as 3.9 secret 3 -> he. The structure of the resin to be served by the jin is as follows.

(A-2) [合成例m-3] 自由基二官能性樹脂 200900816 27285pif 準備安裝有溫度計、冷卻管、攪拌裝置的燒瓶。於此 燒瓶中裝入117 g間本一酴一縮水甘油鱗(Nagase ChemteX 公司製造’ Denacol EX-201 ’環氧當量為117 eq/g)、79 g 丙烯酸、500 g曱苯、1 g第三丁基溴化銨,進行攪拌而製 成均勻的溶液。將此溶液於9〇。〇下攪拌2小時後,進而一 面進行回6lL,一面授摔6小時而使其反應。 其後,以超純水清洗反應溶液後,除去曱苯而獲得樹 脂。所獲得的樹脂藉自GPC和則定的數量平均分子量為 366 ’其波峰為單峰。由於所獲得的樹脂於分子内具有2 個經基,故而氫鍵官能基量算出為5 46χ妒mQi/g。由本 合成例所獲得的樹脂的結構如下。(A-2) [Synthesis Example m-3] Radical difunctional resin 200900816 27285pif A flask equipped with a thermometer, a cooling tube, and a stirring device was prepared. The flask was charged with 117 g of a mono-glycidol scale (Denacol EX-201 'epoxide equivalent 117 eq/g manufactured by Nagase ChemteX Co., Ltd.), 79 g of acrylic acid, 500 g of benzene, and 1 g of the third The butyl ammonium bromide was stirred to form a homogeneous solution. This solution was taken at 9 Torr. After stirring for 2 hours, the mixture was further returned to 6 lL, and allowed to react for 6 hours. Thereafter, after washing the reaction solution with ultrapure water, the benzene was removed to obtain a resin. The obtained resin was obtained from GPC and had a number average molecular weight of 366 Å whose peak was a single peak. Since the obtained resin had two radicals in the molecule, the amount of the hydrogen bond functional group was calculated to be 5 46 χ妒mQi/g. The structure of the resin obtained in the present synthesis example is as follows.

[合成例m-4] ......^ '5) 自由基二官能性樹脂(A-4)的合成 準備安裝有溫度計、冷卻管、 燒瓶中裝人⑽g苯_環氧樹脂燒瓶。於此 氧美h w 1 §作為聚合抑制劑的對曱 乳基本盼、G.2g作為反應觸媒的丨㈣的對甲 g甲苯’進行攪拌而製成均勻的溶液g :稀:500 入空氣’-面將此溶液於8Q。 面°燒瓶 面進行回流,-面授拌36小時而使下其 =㈠、時,進而一 200900816 其後’以超純水清洗反應混合物後,除, 被丙職基化的樹脂。所獲得^旨^ GPC所〜的數量平均分子量為459,其波 曰 的樹脂於分子内具有2個經基’故而氫鍵官能基 J如:為4.36χ1〜/g。由本合成例所獲得的樹脂‘[Synthesis Example m-4] ......^ '5) Synthesis of a radical difunctional resin (A-4) A thermometer (10) g of a benzene-epoxy resin flask was placed in a thermometer, a cooling tube, and a flask. In this case, Oxygen hw 1 § as a polymerization inhibitor, the antimony milk of G.2g as a reaction catalyst is stirred, and a uniform solution is prepared to form a uniform solution g: Rare: 500 into the air' - This solution was applied to 8Q. The surface of the flask was refluxed, and the surface was mixed for 36 hours to make it = (1), hour, and further 200900816. Thereafter, after washing the reaction mixture with ultrapure water, the resin which was propylated was removed. The number average molecular weight of the obtained GPC is 459, and the resin of the ruthenium has two radicals in the molecule, and the hydrogen bond functional group J is, for example, 4.36 χ 1 〜g. Resin obtained by this synthesis example ‘

[合成例m-5] 自由基二官能性樹脂(A-5)的合成 準備安裝有溫度計、冷卻管、攪拌裝置的燒瓶。於此 燒瓶中裝入296.2 g (2莫耳)鄰苯二甲酸酐、917 〇 g (2[Synthesis Example m-5] Synthesis of Radical Bifunctional Resin (A-5) A flask equipped with a thermometer, a cooling tube, and a stirring device was prepared. The flask was charged with 296.2 g (2 moles) of phthalic anhydride and 917 〇 g (2

莫耳)丙燦酸2-輕基乙醋的6-己内g旨加成物(piaccei fa3, 分子量:459 g/mo卜Daicel化學公司製造)、化三乙胺、 0.9 g對苯二酚,進行混合。然後將此反應混合物於11〇r 下進行攪拌而使其反應。反應是一面監控反應混合物的酸 值一面進行的,反應混合物的酸值達到48 mgKOH/g時, 反應溫度為90°C。接著,於此反應混合物中添加680.82 g (2莫耳)雙紛A二縮水甘油鱗、1.6 g四丁基溴化鏔,於 90°C下進行反應,直至反應混合物的酸值達到2mgKOH/g 為止。 其後,於反應混合物中進而加入144.1 g (2莫耳)丙 92 200900816 27285pif 烯酸、1.8 g對笨二酚,一面向燒瓶内送入空氣,一面於 8〇°C下使其反應2小時’進而將溫度升高至贼,繼續進 行反應。反應進行至反應混合物的酸值達到2 為止。 以超純水清洗反應完畢後的混合物,並以管柱進行精 製而獲得樹脂。此樹脂是使雙酚A二縮水甘油醚的一個縮 ^甘油基與「使丙烯酸2·録乙g旨的6_己内g旨加成物與鄰Moer) 6-caprolactyl adduct of 2-acrylic acid 2-pilycolic acid (piaccei fa3, molecular weight: 459 g/mo, manufactured by Daicel Chemical Co., Ltd.), triethylamine, 0.9 g of hydroquinone , to mix. The reaction mixture was then stirred at 11 Torr to react. The reaction was carried out while monitoring the acid value of the reaction mixture. When the acid value of the reaction mixture reached 48 mgKOH/g, the reaction temperature was 90 °C. Next, 680.82 g (2 mol) of bis-A diglycidyl scale and 1.6 g of tetrabutylphosphonium bromide were added to the reaction mixture, and the reaction was carried out at 90 ° C until the acid value of the reaction mixture reached 2 mg KOH / g. until. Thereafter, 144.1 g (2 mol) of propyl 92 200900816 27285 pif enoic acid and 1.8 g of p-diphenol were further added to the reaction mixture, and air was supplied to the flask, and the reaction was carried out for 2 hours at 8 ° C. 'And then raise the temperature to the thief and continue the reaction. The reaction is carried out until the acid value of the reaction mixture reaches 2. The mixture after completion of the reaction was washed with ultrapure water and refined by a column to obtain a resin. This resin is a glycerol group of bisphenol A diglycidyl ether and a 6-heximide adduct of the acrylonitrile 2

苯二曱酸酐反應而形成的化合物」的鲮基進行反應且使 雙酚A一縮水甘油醚的另一個縮水甘油基與「丙烯酸」的 羧基反應而獲得的樹脂。藉由GPC而測定本合成 ^ 的樹脂,結果波峰為單峰,且分子量為1〇〇5。由於所^得 的樹脂於分子内具有2個羥基,故而氫鍵官能基量算^ 1.99xl0-3 mol/g。 自由基二官能性樹脂(A-6) 使用雙酚A型二丙烯酸環氧酯(EB37〇〇 : DAICEL-CYTEC公司製造)。氫鍵官能基量為4.12·3 mol/g。 [合成例m-6] 自由基二官能性樹脂(A-7)的合成 ,準備安裝有溫度計、冷卻管、攪拌裝置的燒瓶。於此 燒瓶中裝人172 §二異紐1,6·己二i旨(關東化學公司製 這)、148 g縮水甘油(和光純藥公司製造),於⑽七下攪 摔1小時而將其混合。其後,於此反應混合物中添加〇.〇5 g —月桂酸二丁基錫,於8〇〇c下攪拌2小時而使其反應。 200900816 ^ / yjii 接著’於反應混合物中加入144 g丙烯酸,於% 、, 12小時而使其反應。對反應混合物進行紅外分光分^攪掉 認基於異氰酸酯的吸收峰消失。 斤確 其後,以超純水清洗反應混合物,並以管柱 _、I』 藉此獲得二異氰酸1,6_己二酯二縮水甘油醚的 烯酸基化的化合物。藉由GPC败本合成 °,兩 脂,結果料為科,且分子量為彻。由於=樹 月旨於分子内具有2個誠、2個胺基曱酸乙g旨=、樹 而氫鍵官能基量算出為8.7〇xl〇-3m〇1/g。 土’故 (1B)的樹脂 [合成例m-7] = 苯醚型部分丙_基化環氧樹脂的合成 準備女裝有溫度計、冷卻管、授拌裝置的燒瓶。 k瓶中裝人IGGg苯_環氧樹脂(新日鐵 ^. mv柳E,熔點為84t)、Q2g作為 ^甲 =笨祕、…峨、甲㈣g、G2二= 的二乙胺,進行攪料製成均句的溶液一面向燒= =入空耽’-面將此溶液於8(rc下勝2小時,進而一面 進仃回流,-面_ 24小時而使其反應。 纯水Ϊ應3後隹以,來精製反應混合物,然後使用超 =進^洗’進而除去甲笨而獲得 醯基化的部分丙烯醯基化瑗备如此 _ 散内肺 GPC所測定的數量平均分子?:月曰。所獲得的樹脂藉由 於所㈣其波峰為單峰。由 丁Μ具有1個羥基,故而氫鍵官能基 200900816 27285ριί ί^ϋ·59χ](Γ3 m°1/gn ™匕樹腊於分子内 %、氧基,故而環氧基量算出為2 59χ1 3 [合成例m-8] I/g。 成樹脂⑽)··雙驗F型部分丙烯酿基化環氧樹脂的合 準備安裝有溫度計、冷卻管、攪拌裝 ==6〇g雙酴·F型環氧樹脂 、-東都化成么司製造)、36§丙烯酸、0.2§三 —’進行赫。接著,-㈣燒仙吹人乾燥空 一面於llGt下娜5小時,使此混合物進行心_ :烯酸改質環氧樹脂。將所獲得的樹脂以管柱二^製 後,將其溶解於與樹脂等量的甲苯中。 超Γ清洗此概料苯溶液後,進樣去甲苯 榭;=%被丙烯醯基化的部分丙烯醯基化環氧 =曰。=侍的樹脂藉由Gpc所測定的數f平均分子量為 〜、波料|峰。由於所獲得的樹脂於分子内 丄 ,基’故而氫鍵官能基量算出為2·6〇χ1(Γ3 m〇i/g /另外, 為?日3於分子内具有1個環氧基’故而環氧基量算出 為 2.60x10 J m〇l/g。 [合成例nr-9] ^月曰(B 3).間苯二酚二縮水甘油鱗型部分丙烯醯基 化裱氧樹脂的合成 =備安裝有溫度計、冷卻f、授拌裝置的燒瓶 。於此A resin obtained by reacting a mercapto group of a compound formed by the reaction of phthalic anhydride into a reaction between the other glycidyl group of bisphenol A monoglycidyl ether and a carboxyl group of "acrylic acid". The resin of the present synthesis was determined by GPC, and as a result, the peak was a single peak and the molecular weight was 1〇〇5. Since the obtained resin has two hydroxyl groups in the molecule, the amount of the hydrogen bond functional group is calculated to be 1.99xl0-3 mol/g. The radical difunctional resin (A-6) bisphenol A type epoxy acrylate (EB37 〇〇: manufactured by DAICEL-CYTEC Co., Ltd.) was used. The amount of hydrogen bond functional groups was 4.12·3 mol/g. [Synthesis Example m-6] Synthesis of a radical difunctional resin (A-7) A flask equipped with a thermometer, a cooling tube, and a stirring device was prepared. In this flask, 172 § bis bis, 1, hexa hexa y (made by Kanto Chemical Co., Ltd.), 148 g of glycidol (manufactured by Wako Pure Chemical Industries, Ltd.), and it was stirred for one hour under (10) seven times. mixing. Thereafter, ruthenium ruthenium 5 g - dibutyltin laurate was added to the reaction mixture, and the mixture was stirred at 8 ° C for 2 hours to cause a reaction. 200900816 ^ / yjii Next, 144 g of acrylic acid was added to the reaction mixture, and the mixture was reacted at % for 12 hours. The reaction mixture was subjected to infrared spectroscopy to eliminate the disappearance of the isocyanate-based absorption peak. After that, the reaction mixture is washed with ultrapure water, and the olefinic compound of 1,6-hexanediester diglycidyl ether of diisocyanate is obtained by the column _, I". By GPC, the synthesis of °, two lipids, the result is a family, and the molecular weight is complete. Since the =tree is intended to have two succinct and two amino decanoic acids in the molecule, the amount of the hydrogen bond functional group is calculated to be 8.7 〇 xl 〇 -3 m 〇 1 /g. Resin of the soil (1B) [Synthesis Example m-7] = Synthesis of a phenyl ether type partially-based epoxy resin A flask equipped with a thermometer, a cooling tube, and a mixing device was prepared. k bottle contains IGGg benzene_epoxy resin (Nippon Steel ^. mv Liu E, melting point is 84t), Q2g as ^A = stupid, ... 峨, A (four) g, G2 two = diethylamine, stir The solution is made into a uniform sentence, and the solution is made to burn == into the empty 耽'-face. This solution is won at 8 (rc for 2 hours, and then it is refluxed for one side, and the surface is allowed to react for 24 hours). After 3, the reaction mixture is refined, and then the super-injection is used to remove the sputum to obtain a thiolated partial acryl-methylation preparation. The number average molecule determined by the intracellular lung GPC?:树脂. The obtained resin is due to (iv) its peak is a single peak. The butyl group has 1 hydroxyl group, so the hydrogen bond functional group 200900816 27285ριί ί^ϋ·59χ] (Γ3 m°1/gn TM eucalyptus wax in the molecule % and oxy group, the amount of epoxy group is calculated to be 2 59 χ 1 3 [synthesis example m-8] I/g. Resin (10))························· Thermometer, cooling tube, stirring equipment ==6〇g double 酴·F type epoxy resin, -made by Dongdu Huacheng,) 36§Acrylic acid, 0.2§3—“. Next, - (4) burned the scented man to dry the side of the llGt for 5 hours, and the mixture was subjected to a core _: olefinic acid modified epoxy resin. After the obtained resin was prepared in a column, it was dissolved in toluene equivalent to the resin. After the benzene solution is washed, the toluene is injected; =% of the acrylylated epoxidized oxime is 曰. = The average molecular weight of the resin of the resin determined by Gpc is ~, wave material|peak. Since the obtained resin is in the molecule, the amount of the hydrogen bond functional group is calculated to be 2·6〇χ1 (Γ3 m〇i/g / in addition, the day 3 has one epoxy group in the molecule) The amount of epoxy groups was calculated to be 2.60 x 10 J m〇l/g. [Synthetic Example nr-9] ^ Moon 曰 (B 3). Synthesis of resorcinol diglycidyl squaring partial propylene fluorenated oxime resin = A flask equipped with a thermometer, a cooling unit, and a mixing device is provided.

、瓶、入234 g間苯二酚二縮水甘油醚(Nagase ChemteX 95 200900816 公司製造,Denacol ΕΧ_2(Π,環氧當量為117 _)、7 丙烯l 5^Gg甲笨、i g第三丁基漠化錄’進行授掉而製 成均勻的溶液。將此溶液於9(rc下赫2小時,進而一面 進行回流,一面攪拌6小時而進行反應。 反應完畢後,以管柱來精製反應混合物,並以超純水 進行清洗’而獲得環氧基的5G%被丙_基化的部分丙稀 醯基化環氧樹脂。所獲得的樹脂藉由Gpc所測定的數量平 均分子置為294,其波峰為單峰。由於所獲得的樹脂於分 《 子内具有1個羥基,故而氫鍵官能基量算出為3.4〇xi〇_3 mol/g。由於所獲得的樹脂於分子内具有}個環氧基,故而 環氧基量算出為3.40x10-3 m〇i/g。 [合成例m-ίο] 樹脂(B-4 )的合成 準備安裝有溫度計、冷卻管、攪拌裝置的燒瓶。於此 燒瓶中裝入296.2 g (2莫耳)鄰苯二曱酸酐、1372 〇g (2 莫耳)丙烯酸2-羥基乙酯的6-己内酯加成物(;placcelFA5, Ο 分子量:686 g/mo1,Daicel化學公司製造)、4gi乙胺、 0.9 g對苯二酚。將此混合物於11(^c下進行攪拌而使其反 應。反應是一面監控酸值一面進行的,於酸值達到36 mgKOH/g時,反應溫度為90°C。 接著,添加680.82 g (2莫耳)雙酚A二縮水甘油醚、 1.6 g四丁基溴化銨,持續進行加熱攪拌,直至反應混合物 的酸值達到2 mgKOH/g為止。 反應完畢後’以超純水清洗反應混合物,並以管柱進 96 200900816 27285pif 订’可獲得:使两稀酸2-絲乙醋的6_己内醋加成物 與鄰笨二丨酸酐反應_成的化合物,與物*二縮水甘 油趟反應喊得的翻旨。藉由Gpc喊此樹脂進行分析, f果其波峰為單峰,且數量平均分子量為116G。由於所獲 得的树I日;^分子内具有〗彳睹基,故而氳鍵官能基量算出 ,8·6χ1〇 m〇l/g。由於所獲得的樹脂於分子内具有丄個環 氧基,故而環氧基量算出為8.6xl(T4 mol/g。 f, bottle, into 234 g resorcinol diglycidyl ether (Nagase ChemteX 95 200900816 company, Denacol ΕΧ_2 (Π, epoxy equivalent 117 _), 7 propylene l 5^Gg 甲笨, ig third butyl desert The chemical recording was carried out to obtain a uniform solution. The solution was stirred at 9 rc for 2 hours, and further refluxed while stirring for 6 hours. After the completion of the reaction, the reaction mixture was purified by a column. And washing with ultrapure water to obtain 5G% of the epoxy group-derived partially acrylylated epoxy resin. The obtained resin has a number average molecular weight of 294 as determined by Gpc. The peak is a single peak. Since the obtained resin has one hydroxyl group in the sub-group, the amount of the hydrogen bond functional group is calculated to be 3.4 〇 xi 〇 3 mol / g. Since the obtained resin has} ring in the molecule The amount of the epoxy group was calculated to be 3.40 x 10-3 m〇i/g. [Synthesis Example m-ίο] Synthesis of Resin (B-4) A flask equipped with a thermometer, a cooling tube, and a stirring device was prepared. The flask was charged with 296.2 g (2 moles) of phthalic anhydride and 1372 〇g (2 moles) of acrylic acid 2 -6-caprolactone adduct of hydroxyethyl ester (; placcelFA5, 分子量 molecular weight: 686 g/mo1, manufactured by Daicel Chemical Co., Ltd.), 4 g of ethylamine, 0.9 g of hydroquinone. This mixture is at 11 (^c) The reaction was carried out by stirring, and the reaction was carried out while monitoring the acid value. When the acid value reached 36 mgKOH/g, the reaction temperature was 90 ° C. Next, 680.82 g (2 mol) of bisphenol A condensate was added. Glycerol ether, 1.6 g of tetrabutylammonium bromide, heating and stirring until the acid value of the reaction mixture reached 2 mgKOH/g. After the reaction was completed, the reaction mixture was washed with ultrapure water and fed into the column 96 200900816 27285pif Order 'Available: a compound obtained by reacting a 6-hexane vinegar adduct of two dilute acid 2-silk vinegar with o-parabens, and reacting with the product * diglycidyl hydrazine. GPC called this resin for analysis, f its peak is a single peak, and the number average molecular weight is 116G. Since the obtained tree I day; ^ has a thiol group in the molecule, so the amount of the 氲 bond functional group is calculated, 8· 6χ1〇m〇l/g. Since the obtained resin has an epoxy group in the molecule, The amount of epoxy group was calculated to 8.6xl (T4 mol / g. F

[合成例m-ii] 樹脂(B-5)的合成 準備安裝有溫度計、冷卻管、麟裝置的燒瓶。於此 燒觀中裝人19Q g苯驗祕清漆型環氧樹脂N_77〇 (大日 本^墨製造)、500 mL甲苯,進行餅,進而加入〇1 三苯基膦而製綱㈣溶液。使此紐處於回流狀態下, -面攪拌,-面以2小時滴人35g丙烯酸。其後 狀態下攪拌ό小時而使其反應。 、14机 反應完畢後,以管柱精製反應混合物,並以 。清洗而獲得樹脂。藉* GPC而測定此樹脂,結果二進 單峰,且數量平均分子量為1177。測定所獲得 為 氧當量,結果可知環氧基的·被丙烯酸改f。二的壤 得的樹脂於分子内具有3個經基,故而氫鍵官能基=獲 55xl〇-3 m〇1/g。由於所獲得的樹脂於分子内戽出 環氧基,故而環氧基數算出為2.55χ1〇-3 m〇i/g。 3個 [合成例HM2;| 樹脂(B-6)的合成 97 200900816 ,準備安裝有溫度計、冷卻管、麟裝置顿瓶。於此 燒瓶中裝人172 g二異氣酸1,6_己二S旨(關東化學公司製 造)、148 g縮水甘油(和光純藥公司製造),於肋 摔1小時而使其反應。然後,於此反應混合物中添加〇.05 g二月桂酸二丁基錫,於8(rc下攪摔2小時。接著,於此 反應混合物中加入72g丙烯酸,於1〇〇t:下攪拌3 將其混合。 反應几畢後,對反應混合物進行紅外分光分析,可確 認:基於異氰酸_魏峰消失。接著,以超純水清洗反 應^合物,並以管柱進行精製,獲得二異氰酸1,卜己二酯 與縮水甘油醚的反應物的5〇%丙烯醯基化物。藉由 而測定此樹脂’結果其波料單峰,且數量平均分子量為 388°由於所獲得的樹脂於分子内具有2個胺基甲酸乙醋配 位土、及1個羥基,故而氫鍵官能基量算出為7 73xl0-3 於所獲得的樹脂於分子内具有1個環氧基,故而 壞乳基1鼻出為2.58xl〇-3mol/g。 (1C)樹月旨 脂(CM):經管柱分離的鄰甲_料漆型固體環 :^EOCN_102():日本化藥公司製造’藉由環球法所 測付的軟化點為75t,環氧當量為215 g/eq)[Synthesis Example m-ii] Synthesis of Resin (B-5) A flask equipped with a thermometer, a cooling tube, and a lining apparatus was prepared. In this case, the 19Q g benzene lacquer-type epoxy resin N_77〇 (made by Daisuke Mo), 500 mL of toluene, and the cake were added, and then the solution of 〇1 triphenylphosphine was added. When the nucleus was brought to a reflux state, the surface was stirred, and the surface was dropped with 35 g of acrylic acid in 2 hours. Thereafter, the mixture was stirred for a few hours to cause a reaction. After the reaction is completed, the reaction mixture is purified by a column and taken. The resin was obtained by washing. The resin was measured by *GPC, and the result was a single peak with a number average molecular weight of 1177. The oxygen equivalent was obtained by the measurement, and as a result, it was found that the epoxy group was changed to acrylic acid by f. The resin of the second soil has three radicals in the molecule, so the hydrogen bond functional group = 55xl 〇 -3 m〇1/g. Since the obtained resin exfoliated the epoxy group in the molecule, the number of epoxy groups was calculated to be 2.55 χ 1 〇 -3 m 〇 i / g. Three [Synthesis Example HM2; | Synthesis of Resin (B-6) 97 200900816, a thermometer, a cooling tube, and a lining device were prepared. In the flask, 172 g of diiso-hydrogen acid 1,6-hexane dihydrate (manufactured by Kanto Chemical Co., Ltd.) and 148 g of glycidol (manufactured by Wako Pure Chemical Industries, Ltd.) were placed, and the reaction was carried out by ribs for 1 hour. Then, 〇.05 g of dibutyltin dilaurate was added to the reaction mixture, and the mixture was stirred at 8 (rc for 2 hours). Next, 72 g of acrylic acid was added to the reaction mixture, and the mixture was stirred at 1 Torr: After several times of reaction, the reaction mixture was subjected to infrared spectroscopic analysis to confirm that the isocyanate-Wei peak disappeared. Then, the reaction mixture was washed with ultrapure water and purified by a column to obtain diisocyanate. 5 〇 醯 醯 醯 反应 反应 。 。 。 。 。 。 。 。 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此There are two urethane coordinating ligands and one hydroxyl group in the molecule, so the amount of the hydrogen bond functional group is calculated to be 7 73xl0-3. The obtained resin has one epoxy group in the molecule, so the bad emulsion group 1 nasal output is 2.58xl〇-3mol/g. (1C) Shuyuezhi (CM): Neighboring lacquer-type solid ring separated by column: ^EOCN_102(): manufactured by Nippon Kayaku Co., Ltd. The softening point measured by the method is 75t and the epoxy equivalent is 215 g/eq.

斤由於此樹脂的每氧當量為215 g/eq,故而此樹脂(C 基二分子量為215。因此,此樹脂㈣氧基 _1/g。由於此樹脂不含氫鍵官能基, 氧鍵官能基量為G。另外,藉由GPC而測定此樹脂的 98 200900816 272S5pif 重量,均分子量’結果為 1075 〇 ,树脂(C~2):雙酚a型環氧樹脂(Epikote 1003 : JER 製造’藉由環球法所測得的軟化點為 89°C,環氧當量為720 g/eq) 由於此樹脂於分子内具有2個環氧基 ,故而此樹脂的 分子1算出為1440。此樹脂的環氧基量算出為139χ1〇-3 mol/g。由於此樹脂幾乎不具有分子量分佈,故而重量平均 为子i亦為1440。另外,此樹脂如下述結構式所示,每個 重複單元(分子量為284.4)具有1個羥基。由於此樹脂 的分子量為1440,故而n算出為3.87。因此,每1分子平 均具有3.87個羥基,故而氳鍵官能基量算出為2 69χ1(Γ3 mol/g 〇Because the resin has an oxygen equivalent weight of 215 g/eq, the resin (C-based molecular weight is 215. Therefore, the resin (tetra)oxy_1/g. Since the resin does not contain a hydrogen bond functional group, the oxygen bond function The basis weight is G. In addition, the 98 200900816 272S5pif weight of the resin was measured by GPC, and the average molecular weight 'result was 1075 〇, and the resin (C~2): bisphenol a type epoxy resin (Epikote 1003: JER manufacturing 'borrowed' The softening point measured by the ring and ball method was 89 ° C, and the epoxy equivalent was 720 g / eq. Since the resin had two epoxy groups in the molecule, the molecule 1 of the resin was calculated to be 1440. The amount of the oxygen was calculated to be 139 χ 1 〇 -3 mol / g. Since the resin hardly has a molecular weight distribution, the weight average is also 1440. Further, the resin is represented by the following structural formula, and each repeating unit (molecular weight is 284.4) has one hydroxyl group. Since the molecular weight of this resin is 1440, n is calculated to be 3.87. Therefore, the average molecular weight per molecule is 3.87 hydroxyl groups, so the amount of the oxime bond functional group is calculated to be 2 69 χ 1 (Γ3 mol/g 〇

於上述結構式中,數字表示分子量。 環氧樹脂(C-3 )(比較用》雙酚A型環氧樹腊(Epik〇te 828EL : JER製造,環氧當量為i90g/eq) 由於此樹脂(C-3 )於分子内具有2個環氣基,故而此 樹脂的分子量算出為380。因此,此樹脂的壤氣基量管出 為5.26XHT3 m〇i/g。另外,此樹脂亦為式(2)所示二妙^ , η算出為0.14。因此,由於此樹脂(C-3)具有〇 14°個_ 基,故而氫鍵官能基量算出為3.7χ10·4 mol/g。由於此樹^ 99 200900816 二 / 二 於室溫下為液狀,故而軟化點小於4〇°C。 [評價方法] 、、’,對實施例⑹〜6及比較例HM〜4所進行的評價方 法進订說明。此處’測定〇〉夜晶密封劑的耐泡漏性、U) =密封劑的塗佈性、Ui)密封外觀及接著強度、iv)液 日日在封劑的黏度’對液晶密封劑的特性進行評價。各評價 測定方法的詳細内容如下。 f 〇液晶密封劑的耐洩漏性 於以下述方法所製備的液晶密封劑中 ,進而添加1份 4.8 //m的球狀間隔物,而製備添加有間隔物的液晶密封 劑。其次’準備附有透明電極及配向膜的4〇 mmx45 玻璃基板(RT-DM88PIN: EHC公司製造)。然後將上述組 成物填充入为庄器(Hitachi Plant Technologies公司製造) 中’於玻璃基板上緣製35 mmx40 mm的四方形的密封圖 案(剖面面積為3500 ym2)。 使用分注器(Hitachi Plant Technologies公司製造), ( 將與貼合後的面板内容量相等的液晶材料 (MLC-11900-000 : Merck公司製造)精密滴入此基板的 密封圖案内。 使用真空貼合裝置(信越工程公司製造),於10 Pa的 減壓下,將上述玻璃基板與相對向的玻璃基板重疊。其次, 以預先準備的2塊40 mmx45 mm玻璃基板,夾住上述所 重疊的玻璃基板,施加負重而使其固定。此玻璃基板是使 用其兩面經鉻濺鑛處理(Chromium Sputtering)者。接著, 100 200900816 27285pif 將經重疊的玻璃基板恢復至大氣壓下,於l2〇r下加熱6〇 分鐘而使其硬化(以下,稱為「耐洩漏性試驗中的硬化步 驟」)。 根據以下方法,對成為耐洩漏性之指標的液晶顯示面 板之密封圖案直線性,即密封直線性進行評價。 [密封的最大寬度與最小寬度的比率]% =[密封的最小寬度]/[密封的最大寬度]χ1〇〇 上述比率大於等於95%者:◎(優異) ( 上述比率大於等於80%且小於95%者:〇(稍優異) 上述比率小於80%者:X (差) ' ii)液晶密封劑的塗佈性 於真空下,將上述i)所使用的液晶密封劑填充至注 射器中。接著,將裝有口徑為0.4 mm之針頭的注射哭設 置於分注器(Hitachi Plant Technologies公司製造)上,然 後使用此注射器,於300 mmx400 mm的液晶顯示面板用 玻璃基板(日本電氣硝子公司製造)上繪製50個35 mmx Q 40 mm的密封圖案。此時,喷出壓力設為〇·3 MPa,剖面 面積設為3500 //m2 ’塗佈速度設為100 mm/秒。 根據以下標準,對所繪製的密封圖案的密封形狀進行 評價。 完全未發生密封斷開、密封瑕疵的框形為48〜5〇彳. ◎(優異) 上述框形為45個或45個以上且少於48個:〇(稍^憂 異) 101 200900816 上述框形少於44個:χ (差)In the above formula, the number indicates the molecular weight. Epoxy Resin (C-3) (Comparative) Bisphenol A type epoxy wax (Epik〇te 828EL: manufactured by JER, epoxy equivalent i90g/eq) Since this resin (C-3) has 2 in the molecule Since the molecular weight of the resin is calculated to be 380. Therefore, the cross-linking amount of the resin is 5.26XHT3 m〇i/g. In addition, the resin is also represented by the formula (2). η was calculated to be 0.14. Therefore, since the resin (C-3) had 〇14° _ groups, the amount of hydrogen bond functional groups was calculated to be 3.7 χ10·4 mol/g. Since this tree ^ 99 200900816 2 / 2 in the chamber The temperature is liquid, so the softening point is less than 4 〇 ° C. [Evaluation method], ', the evaluation methods of Examples (6) to 6 and Comparative Examples HM to 4 are explained. Here, 'Measurement 〇> The bubble resistance of the night crystal sealant, U) = coatability of the sealant, Ui) seal appearance and adhesion strength, and iv) the viscosity of the sealant on the day of the liquid were evaluated for the characteristics of the liquid crystal sealant. Each evaluation The details of the measurement method are as follows. f 耐 Liquid Crystal Sealant Leakage Resistance A liquid crystal sealing agent to which a spacer was added was prepared by adding 1 part of a 4.8 // m spherical spacer to the liquid crystal sealing agent prepared by the following method. Next, a 4 mm mmx45 glass substrate (RT-DM88PIN: manufactured by EHC Corporation) with a transparent electrode and an alignment film was prepared. Then, the above composition was filled into a square seal pattern of 35 mm x 40 mm (a cross-sectional area of 3,500 ym 2 ) on the upper edge of the glass substrate as a container (manufactured by Hitachi Plant Technologies). Using a dispenser (manufactured by Hitachi Plant Technologies Co., Ltd.), a liquid crystal material (MLC-11900-000: manufactured by Merck Co., Ltd.) having the same amount of panel content as the bonded panel was precisely dropped into the sealing pattern of the substrate. The glass device was laminated on the glass substrate and the opposite glass substrate under a reduced pressure of 10 Pa. Next, the above-mentioned overlapped glass was sandwiched between two 40 mm x 45 mm glass substrates prepared in advance. The substrate is fixed by applying a load. The glass substrate is subjected to Chromium Sputtering on both sides thereof. Next, 100 200900816 27285pif restores the overlapped glass substrate to atmospheric pressure and heats it under l2〇r It is hardened by a few minutes (hereinafter, it is called "hardening process in a leak-proof test"). The linearity of the sealing pattern of the liquid-crystal display panel which is an index of leak-proof property, and the sealing linearity is evaluated by the following method. [The ratio of the maximum width to the minimum width of the seal]% = [Minimum width of the seal] / [Maximum width of the seal] χ 1 〇〇 The above ratio is large 95% or more: ◎ (excellent) (The above ratio is 80% or more and less than 95%: 〇 (slightly superior) The above ratio is less than 80%: X (poor) ' ii) The coating property of the liquid crystal sealing agent is The liquid crystal sealing agent used in the above i) was filled into a syringe under vacuum. Next, the injection cryo-filled with a needle having a diameter of 0.4 mm was placed on a dispenser (manufactured by Hitachi Plant Technologies), and then a glass substrate for a liquid crystal display panel of 300 mm x 400 mm (manufactured by Nippon Electric Glass Co., Ltd.) was used. ) Draw 50 35 mm x Q 40 mm seal patterns. At this time, the discharge pressure was set to 〇·3 MPa, the cross-sectional area was set to 3500 //m2, and the coating speed was set to 100 mm/sec. The seal shape of the drawn seal pattern was evaluated according to the following criteria. The frame shape of the seal is not broken at all, and the shape of the seal is 48 to 5 〇彳. ◎ (excellent) The above frame shape is 45 or more and less than 48: 〇 (slightly sorrowful) 101 200900816 Less than 44 shapes: χ (poor)

Ul)密封外觀及接著強度 使用網版,於25 mmx45 mmx厚度4 mm的無驗玻璃 、 C 1 )中所製備的液晶密封劑塗佈成直徑為1 mm 的I开"在封圖案。接著,將此無鹼玻璃與成對的相同玻璃 重1為十子形而將其固定後,將此經固定的一對玻璃於 120 C下加熱60分鐘而使其貼合(以下稱為「接著試驗中 ( 的硬化步驟」)。將所獲得的2塊玻璃板(以下稱為「試驗 片於25。(:、濕度為5〇%的恆溫槽中保存24小時後,目 測嬈察雄、封外觀。密封外觀亦可作為液晶密封劑的液晶污 染性的標準。 密封外觀是根據以下標準進行評價。 目測未見到空隙、流出:◎(優異) 目測可見微小空隙或者流出:△(稍差) 目測可見流出及空隙:χ (差) 饵/ 料’使用拉伸試驗裝置(Intesc〇製造),以=神 I 7刀的拉伸速度,對自恆溫槽中取出的試驗片剩定肀 強度。 接著強度是根據以下標準進行評價。 接著強度大於等於10Mpa: ◎(優異) 接著強度大於等於7 Mpa且小於1〇 jyjpa .〇 異) ' 接著強度小於7MPa未满:χ(差) iv)液晶密封劑的黏度測定 102 200900816 27285pif 組成物的黏度是使用E型旋轉型黏声 (BROOKFIELD公司製造:數位流變計,型號:十 ULTRA)以及半徑為】2 mm、角度為3。的cp_52型錐311 型感測态,於以下條件下,以1,〇 jpm的旋轉速度進行= 於25°C下的黏度:將本發明的液晶密封劑於25它 置5分鐘後進行測定。 ^Ul) Seal appearance and adhesion strength Using a screen, a liquid crystal sealant prepared in a 25 mm x 45 mm x thickness 4 mm non-glass, C 1 ) was coated into an I open " sealing pattern with a diameter of 1 mm. Next, the alkali-free glass and the pair of the same glass were fixed in a ten-shape and fixed, and the fixed pair of glasses were heated at 120 C for 60 minutes to be bonded (hereinafter referred to as " Then, in the test (the hardening step), the obtained two glass plates (hereinafter referred to as "the test piece were stored in a thermostat at a humidity of 5〇% for 24 hours, and then visually observed. The appearance of the seal can also be used as a standard for liquid crystal contamination of liquid crystal sealants. The appearance of the seal is evaluated according to the following criteria. No gaps or outflows were observed by visual inspection: ◎ (excellent) Small voids or outflows were visually observed: △ (slightly poor Visually visible outflows and voids: χ (Poor) Bait/Material's use of a tensile tester (manufactured by Intesc〇) to determine the tensile strength of the test piece taken from the constant temperature bath using the tensile speed of the God I 7 knife. The strength is then evaluated according to the following criteria: Then the intensity is greater than or equal to 10Mpa: ◎ (excellent) Then the strength is greater than or equal to 7 Mpa and less than 1〇jyjpa. 〇)) Then the strength is less than 7MPa less than: χ (poor) iv) Sealant Degree measurement 102 200900816 27285pif The viscosity of the composition is E-type rotary viscose (manufactured by BROOKFIELD: digital rheometer, model: ten ULTRA) and cp_52 cone 311 type with a radius of 2 mm and an angle of 3. The measurement was carried out under the following conditions at a rotation speed of 1, 〇jpm = viscosity at 25 ° C: The liquid crystal sealing agent of the present invention was measured at 25 minutes after it was set for 5 minutes.

於80 C下的黏度:將本發明的液晶密封劑設置於巨4 旋轉黏度計的杯中,以5。(:/分的升溫速度升溫至8〇ΐ:垔 80°C下放置5分鐘後進行測定。 ’於 此處’於上述測定方法中,液晶密封劑於8 度會超出測定界限而無法進行測定時,以平行去 (RheoSt麵RS150 : HAAKE製造)進行測定。藉 板法的測定是依據上述機種的標準法,以5t/八^ = 度升溫至贼後,立即進行峡。料,觸變指數 是使用E型旋轉型黏料(數位流變計,魏.^ ULTRA,。腦0K服D公司製造)以及半徑^酿、 角度為3的CP-52型錐·板型感測器,於25艺下以〇5 及5.0rpm的旋轉速度進行測定,以[於25它、^ ·卬111 的黏度]/[於25°C、5.0φιη下的黏度]的值來表:。rpm下 [實施例m-i] ^ ° 準備作為硬化性樹脂的30份樹脂( (A-3)、30份樹脂(A-5)、10份環最 」以刀树月曰 料:!,1份熱自由基聚合起始劑i , 8 、曰:l,20份填充 ^ 18份環氧硬化劑1。以 103 200900816 混合器將此等預備混合。接著,以三輥對此混合物進行混 煉’直至固體原料達到小於等於4 # m。接著,以網眼孔 徑為 10 的過濾器(MSP-10-E10S : ADVANTEC 公司 製造)’對此混煉物進行過濾後,進行真空消泡處理而獲得 液晶密封劑。 此液晶密封劑中所含的硬化性樹脂中的氫鍵官能基量 為 3.55xl〇_3 mol/g ’ 環氧基量為 〇 47x1〇-3 m〇1/g。 如此而獲得的液晶密封劑於25它下的黏度,於〇.5rpm 下為440 Pa s於1 .〇 rpm下為mo pa. s,於5 rpm下為 280 Pa.s 0Viscosity at 80 C: The liquid crystal sealing agent of the present invention was placed in a cup of a giant 4 rotational viscometer to be 5. (The temperature rise rate of :/min is raised to 8 〇ΐ: 垔80° C. and left for 5 minutes, and then measured. 'In this case', the liquid crystal sealant exceeds the measurement limit at 8 degrees and cannot be measured. In the case of the parallel method (RheoSt surface RS150: manufactured by HAAKE), the measurement by the plate method is based on the standard method of the above-mentioned model, and the temperature is raised to the thief at 5t/eight^= degrees, and the gorge is immediately performed. It is a CP-52 type cone-and-plate type sensor with E-type rotary type material (digital flow rheometer, Wei.^ ULTRA, manufactured by Brain 0K Service D) and radius ^3, angle 3 The measurement was carried out at a rotation speed of 〇5 and 5.0 rpm, and the value of [viscosity at 25, ^·卬111] / [viscosity at 25 ° C, 5.0 φηη] was expressed as follows: rpm Example mi] ^ ° 30 parts of resin ((A-3), 30 parts of resin (A-5), 10 parts of ring most) prepared as a curable resin, with 1 part of hot radical polymerization Starting agent i, 8 , 曰: 1, 20 parts filled ^ 18 parts of epoxy hardener 1. These were premixed with a mixer of 2009 200900816. Next, a mixture of three rolls was used. The kneading was carried out until the solid raw material reached 4 # m. Then, the mixture was filtered with a mesh pore size of 10 (MSP-10-E10S: manufactured by ADVANTEC) to perform vacuum defoaming. The liquid crystal sealing agent is obtained by the treatment. The amount of the hydrogen bond functional group in the curable resin contained in the liquid crystal sealing agent is 3.55 x l 〇 3 mol / g ' The amount of the epoxy group is 〇 47 x 1 〇 -3 m 〇 1 / g The viscosity of the liquid crystal sealant thus obtained at 25 is 440 Pa s at 5 rpm and mo pa. s at 1 rpm, 280 Pa.s at 5 rpm.

由於在8 0 °C下以E型旋轉型黏度計所測定的黏度大於 780 Pa.s,故而以平行板法(灿⑶別廳RS15〇 : HAAKE 製造)進行測定。其結果為9 〇〇E + 〇5 pa.s。觸變指數為 1.6 ° 藉由各種試驗對液晶密封劑進行評價。 [實施例皿-2〜6] 準備下述表5中所示的各成分,以與實施例皿心相同 的方式製備液4封劑。對各液晶密封劑進行與實施例瓜 -1相同的評價。 [比較例瓜-1] 準備下达表^中所示的各成分,以與實施例皿·i相同 的方式製備;。對各液晶密封魏行與實施例瓜 _1相同的《平仞其中,「耐汽漏性評價中的硬化步驟」是 藉由在以120C加熱60分鐘之前,照射3撕^的紫外線 104 200900816 27285pif 而進行。另外,「接著試驗中的硬化步驟」亦藉由在以120 °C加熱60分鐘之前,照射3000 mJ的紫外線而進行。 [比較例ΠΙ-2、3] 準備下述表6中所示的各成分,以與實施例ΠΤ-1相同 的方式製備液晶密封劑。對各液晶密封劑進行與實施例ΠΙ -1相同的評價。 [比較例Μ -4] 準備下述表6中所示的各成分,以與比較例ΙΜ相同 的方式製備液晶密封劑。對各液晶密封劑進行與實施例ΠΤ -1相同的評價。 105 200900816 [表5]Since the viscosity measured by the E-type rotary viscometer at 80 ° C was more than 780 Pa·s, it was measured by the parallel plate method (Can (3) Hall RS15 〇: manufactured by HAAKE). The result is 9 〇〇E + 〇5 pa.s. The thixotropy index was 1.6 °. The liquid crystal sealant was evaluated by various tests. [Examples - 2 to 6] The respective components shown in the following Table 5 were prepared, and a liquid 4 sealant was prepared in the same manner as in the examples. Each liquid crystal sealing agent was evaluated in the same manner as in Example guan-1. [Comparative Example Melon-1] The components shown in Table 2 were prepared and prepared in the same manner as in the example. For each liquid crystal seal, the same method as the example melon_1 is the same. The "hardening step in the evaluation of the resistance to vapor leakage" is performed by irradiating 3 ultraviolet rays 104 before heating at 120 C for 60 minutes. 200900816 27285pif And proceed. Further, "the hardening step in the subsequent test" was also carried out by irradiating ultraviolet rays of 3,000 mJ before heating at 120 °C for 60 minutes. [Comparative Example 、-2, 3] Each component shown in the following Table 6 was prepared, and a liquid crystal sealing agent was prepared in the same manner as in Example ΠΤ-1. The same evaluation as in Example ΠΙ-1 was carried out for each liquid crystal sealing agent. [Comparative Example - 4] Each component shown in the following Table 6 was prepared, and a liquid crystal sealing agent was prepared in the same manner as in Comparative Example. The same evaluation as in Example ΠΤ-1 was carried out for each liquid crystal sealing agent. 105 200900816 [Table 5]

氫鍵官能基量 (xlO—3 mol/g ) 環+基量(X 10'J mol/g) 實施 例Μ -1 實施 例m -2 實施 例皿 -3 實施 例ΙΠ -4 實施 例ΙΠ -5 實施 例ΙΠ -6 組 成 (1A)樹脂 A-1 4.38 0.00 30 — — — — — A-2 3.90 0.00 - — — — 10 — A-3 5.46 0.00 30 20 - — 70 20 A-4 4.36 0.00 — 25 — - — 25 A-5 1.99 0.00 30 25 — 20 — 25 A-6 4.12 0.00 一 — — — 15 — (1B)樹脂 B-1 2.59 2.59 — 25 30 一 — 25 B-2 2.60 2.60 — — - - — — B-3 3.40 3.40 — — 25 40 — — B-4 0.86 0.86 - — 30 40 — — (1C)樹脂 C-1 0.00 4.65 10 5 15 — 5 — C-2 2.69 1.39 — - — — — 5 填充料 - — 20 25 10 15 10 25 4 - — — — 10 15 — — 熱自由基 聚合起始 劑 — — 1 1 1 2 1 1 環氧硬化 劑 — — 8 8 3 5 8 8 熱塑性聚合物 — — — 2 — — — 2 樹脂中的氫鍵官能基量(Xl〇_3mol/g) 3.55 2.24 1.89 2.10 4.83 3.33 樹脂中的環氧基量(xl〇_3inol/g) 0.47 0.23 2.58 1.70 0.23 0.65 黏 度 25°C/0.5 rpm (Pa*s) 440 480 320 180 190 450 25°C/l.〇rpm (Pa-s) 350 310 210 80 180 280 25〇C/5.0 rpm (Pa-s) 280 260 180 40 170 220 80°C/l.〇rpm (Pa-s) 測定 界限 測定 界限 測定 界限 測定 界限 測定 界限 測定 界限 籍由平行板法所測得的於80°C下的黏度(xlO^a· s) 9 9 9 9 9 9 觸變指數 1.6 1.8 1.8 4.5 1.1 2.0 評 價 (i)耐洩漏性 ◎ ◎ ◎ ◎ ◎ ◎ (ii)塗佈性 ◎ ◎ ◎ ◎ ◎ ◎ (iii)接著強度 ◎ ◎ ◎ ◎ ◎ ◎ (iv)黏度穩定性 ◎ ◎ ◎ ◎ ◎ ◎ 106 200900816 Ζ /Ζΰ^ρΐΙHydrogen bond functional group amount (xlO - 3 mol / g) Ring + base amount (X 10 'J mol / g) Example Μ -1 Example m - 2 Example dish - Example ΙΠ -4 Example ΙΠ - 5 EXAMPLES -6 COMPOSITION (1A) Resin A-1 4.38 0.00 30 — — — — — A-2 3.90 0.00 — — — 10 — A-3 5.46 0.00 30 20 — — 70 20 A-4 4.36 0.00 — 25 — — — 25 A-5 1.99 0.00 30 25 — 20 — 25 A-6 4.12 0.00 一 — — — 15 — (1B) Resin B-1 2.59 2.59 — 25 30 I— 25 B-2 2.60 2.60 — — - — — B-3 3.40 3.40 — — 25 40 — — B-4 0.86 0.86 - — 30 40 — — (1C) Resin C-1 0.00 4.65 10 5 15 — 5 — C-2 2.69 1.39 — — — — — 5 Filler - 20 25 10 15 10 25 4 - — — — 10 15 — — Thermal Radical Polymerization Starter — — 1 1 1 2 1 1 Epoxy Hardener — — 8 8 3 5 8 8 Thermoplastic Polymer — — — 2 — — — 2 The amount of hydrogen bond functional groups in the resin (Xl〇_3mol/g) 3.55 2.24 1.89 2.10 4.83 3.33 The amount of epoxy groups in the resin (xl〇_3inol/g) 0.47 0.23 2.58 1.70 0.23 0.65 viscosity 25 °C/0.5 rpm (Pa*s) 440 480 320 180 190 450 25°C/l.〇rpm (Pa-s) 350 310 210 80 180 280 25〇C/5.0 rpm (Pa-s) 280 260 180 40 170 220 80°C/l.〇rpm (Pa-s) Measurement limit measurement limit measurement limit measurement limit measurement limit The viscosity at 80 °C measured by the parallel plate method (xlO^a·s) 9 9 9 9 9 9 Thixotropic index 1.6 1.8 1.8 4.5 1.1 2.0 Evaluation (i) Leakage resistance ◎ ◎ ◎ ◎ ◎ ◎ (ii) Coating property ◎ ◎ ◎ ◎ ◎ ◎ (iii) Subsequent strength ◎ ◎ ◎ ◎ ◎ ◎ (iv) Viscosity stability ◎ ◎ ◎ ◎ ◎ ◎ 106 200900816 Ζ /Ζΰ^ρΐΙ

[表6][Table 6]

氫鍵官能基 量 (xlO'3 mol/g) 環氧基量 Cxicr3 mol/g) 比較例 ΙΠ-1 比較例 ffi-2 比較例 ΠΙ-3 比較例 ΙΠ-4 (1A)樹脂 A-6 4.12 0.00 — — 66.7 60 A-7 8.70 0.00 30 30 33.3 — (1B)樹脂 B-5 2.55 2.55 30 - — 一 B-6 7·73 2.58 40 70 — — (1C)樹脂 C-1 0.00 4.65 5 - — — C-3 0.37 5.26 - - - 40 1 — — 20 55 — — 填充料 2 — - — - - 10 組 成 3 — — — — 25 - 熱自由基聚合起 1 - — — 3.5 - — 始劑 4 — — — — 1,7 - 環氧硬化劑 2 — — - — 16.7 10 3 — - 25 一 — - 熱塑性聚合物 — - — - — 10 偶合劑 1 - — — — - 10 2 - — — 一 3.3 - 光自由基聚合起始劑 — — 1 — — 2 樹脂中的氫鍵官能基量(xl(Tmol/g) 6.16 8.02 11.29 2.62 樹脂中的環氧基量(x〗0_3mol/g) 1.93 1.81 0.00 2.10 25〇C/0.5 rpm (Pa*s) 260 1320 360 255 25°C/l.〇rpm (Pa’s) 250 510 340 250 25X75.0rpm (Pa.s) 240 260 320 243 黏 度 80°C/1.0rpm (Pa-s) 350 測定界 限 380 270 藉由平行板法所測得的於80°C下的黏度(Pa-s) 8.00Ε+ 02 9.00E+ 05 9.00E+ 02 6.00E+ 02 觸變指數 1.1 5.3 1.1 1.0 (i)耐洩漏性 X 〇 X X 評 (ii)塗佈性 〇 X 〇 〇 價 (iii)接著強度 Δ X Δ X (iv)黏度穩定性 Δ X X X 由實施例II-1〜6與比較例1Π -1〜4的比較可知:含有 氫鍵官能基量及環氧基量在特定範圍内的硬化性樹脂之本 發明的液晶密封劑,其耐洩漏性、接著性、塗佈性優異。 尤其是,由各實施例與比較例m-4的比較可知:含有軟化 】07 200900816、 ====;=之本發明的液晶_ 密封劑相比,耐二氧一晶 [產業上之可利用性] 力軌液晶密封用硬化性樹脂組成物,即使僅藉由 m ’亦可迅速且充分地進行硬化。因此,使Hydrogen bond functional group amount (xlO'3 mol/g) Epoxy group amount Cxicr3 mol/g) Comparative Example ΙΠ-1 Comparative Example ffi-2 Comparative Example ΠΙ-3 Comparative Example ΙΠ-4 (1A) Resin A-6 4.12 0.00 — — 66.7 60 A-7 8.70 0.00 30 30 33.3 — (1B) Resin B-5 2.55 2.55 30 - — A B-6 7·73 2.58 40 70 — — (1C) Resin C-1 0.00 4.65 5 — — — C-3 0.37 5.26 - - - 40 1 — — 20 55 — — Filler 2 — — — — — 10 Composition 3 — — — — 25 — Thermal radical polymerization from 1 — — — 3.5 — — initiator 4 — — — — 1,7 — Epoxy hardener 2 — — — — 16.7 10 3 — — 25 — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — Photoradical polymerization initiator - 1 - 2 The amount of hydrogen bond functional groups in the resin (xl (Tmol / g) 6.16 8.02 11.29 2.62 The amount of epoxy groups in the resin (x = 0_3mol / g) 1.93 1.81 0.00 2.10 25〇C/0.5 rpm (Pa*s) 260 1320 360 255 25°C/l.〇rpm (Pa's) 250 510 340 250 25X75.0rpm (Pa.s) 240 260 320 243 Viscosity 80°C/1.0rpm ( Pa-s) 350 Limit 380 270 Viscosity at 80 °C measured by the parallel plate method (Pa-s) 8.00Ε+ 02 9.00E+ 05 9.00E+ 02 6.00E+ 02 Thixotropic index 1.1 5.3 1.1 1.0 (i) Leakage resistance X 〇 XX evaluation (ii) coatability 〇 X 〇〇 price (iii) subsequent strength Δ X Δ X (iv) viscosity stability Δ XXX by Examples II-1 to 6 and Comparative Example 1 Π -1 to 4 In comparison, it is understood that the liquid crystal sealing agent of the present invention containing a curable resin having a hydrogen bond functional group amount and an epoxy group content within a specific range is excellent in leakage resistance, adhesion, and coating property. Comparing with Comparative Example m-4, it is known that the liquid crystal _ sealant of the present invention contains softening 07 07 200900816, ====== resistance to dioxygen crystal [industrial availability] force rail liquid crystal sealing The curable resin composition can be quickly and sufficiently cured by simply using m '. So make

用本么明的液晶密姻硬化性樹脂組成物而製造的液晶密 封劑,由於具有高硬化性,故而耐线漏性優異,另外,由 於可抑制液晶污染,故而可有效作為可提供顯示特性良好 之液晶顯示面板的液晶密封劑。 本申請案是基於1)2007年2月20曰提出申請的申請 編號JP2007-039938、2) 2007年6月27曰提出申請的申 請編號JP2007-169749、3) 2007年11月14日提出申請的 申請編?虎JP2007-295925而主張優先權。上述申請說明書 中所揭示的内容全部引用於本申請案說明書中。 θ 【圖式簡單說明】 無 【主要元件符號說明】 無The liquid crystal sealing agent produced by using the liquid crystal dense curable resin composition of the present invention has high curability and is excellent in line leakage resistance, and can suppress liquid crystal contamination, so that it can effectively provide display characteristics. Liquid crystal sealing agent for liquid crystal display panel. This application is based on 1) Application No. JP2007-039938, filed on February 20, 2007, 2) Application No. JP2007-169749, filed on June 27, 2007, 3) Application filed on November 14, 2007 Apply for the compilation of Tiger JP2007-295925 and claim priority. The contents disclosed in the above specification are all incorporated in the specification of the present application. θ [Simple description of the diagram] None [Description of main component symbols] None

Claims (1)

200900816 十、申請專利範圍: 其含有: 1 · -種液晶密封用硬化性樹脂組成物 丙稀酸樹脂;及/或 (甲基)丙_改質環氧樹脂,其於 個或Η固以上的環氧基及(甲基)丙稀酿基;-為 熱自由基聚合起始劑;以及 填充料,200900816 X. Patent application scope: It contains: 1 · a kind of curable resin composition for liquid crystal sealing, acrylic resin; and / or (meth) propyl _ modified epoxy resin, which is above or above tamping Epoxy and (meth) propylene-based; - a thermal radical polymerization initiator; and filler, 上达液晶密封用硬化性樹驗成物以Ε型黏度計所測 疋的於25 C、1.〇 rpm下的黏度為5〇 pa s〜5〇〇 pa s,且 於80 C、1.0 rpm下的黏度大於5〇〇 pa.s。 t 2·如申請專利範圍第1 2 3 4 5項所述之液晶密封用硬化性樹 脂組成物,其中上述填充料的平均一次粒徑小於等於工$ ㈣,比表面積為i m2/g〜· m2/g,且相對於上述丙稀酸 樹脂及(曱基)丙馳改質環氧樹闕合計⑽重量份,上 述填充料的含量為1重量份〜重量份, 由[以E型黏度計所測定的於25〇C、0.5 rpm下的黏 度]/[以E型黏度计所測定的於25〇c、5 〇 ri)ni下的黏度]所 定義的觸變指數為丨丨〜5.0。 109 1 ·如申請專利範圍第6 7項或第2項所述之液晶密封用 2 硬化性細旨組成物,其巾由在—定溫度下使上述熱自由基 3 聚f起始劑進行10小時熱分解反應時熱自由基聚合起始 4 Μ;辰度減少至一半的溫度所定義的上述熱自由基聚合起始 5 劑之10小時半衰期溫度為40。(:〜8(TC。 6 4.一種液晶密封用硬化性樹脂組成物,其含有: 7 1分子内具有可進行自由基聚合的碳_碳雙鍵的自由基 200900816 _ - j 硬化性樹脂; 熱自由基聚合起始劑; 自由基鏈轉移劑;以及 填充料。 5. 如申5青專利範圍第4項所述之液晶密封用硬化性樹 脂組成物’其中上述自由基鏈轉移劑為硫醇類。 ίThe viscosity of the sclerosing tree tester for liquid crystal sealing measured at 25 C, 1. rpm is 5 〇pa s~5 〇〇pa s, and at 80 C, 1.0 rpm. The viscosity below is greater than 5〇〇pa.s. The curable resin composition for liquid crystal sealing according to the above-mentioned patent application, wherein the average primary particle diameter of the filler is equal to or less than $4, and the specific surface area is i m2/g~· M2/g, and the content of the filler is 1 part by weight to 1 part by weight based on the total amount of the acrylic resin and the (meth)acrylic modified epoxy resin, and is [by type E viscosity meter] The measured thixotropic index defined by the viscosity at 25 ° C, 0.5 rpm] / [viscosity at 25 〇 c, 5 〇 ri) measured by an E-type viscosity meter was 丨丨 ~ 5.0. 109 1 . The sclerosing composition for liquid crystal sealing according to claim 7 or 2, wherein the towel is subjected to the thermal radical 3 polyf starting agent at a predetermined temperature. The thermal radical polymerization starts at 4 hours in the thermal decomposition reaction; the temperature at which the temperature is reduced to half is defined by the temperature of the first half of the thermal radical polymerization, and the 10-hour half-life temperature is 40. (: 〜8 (TC. 6) 4. A curable resin composition for liquid crystal sealing, comprising: a radical having a carbon-carbon double bond capable of radical polymerization in 171 molecules; 200900816 _ - j hardening resin; The heat-radical-polymerization initiator; the radical-chain-transfering agent; and the filler of the liquid crystal sealing agent according to the fourth aspect of the invention, wherein the radical chain transfer agent is sulfur Alcohol. ί 6. 如申請專利範圍第4項或第5項所述之液晶密封用 硬化性樹脂組成物,其中作為上述自由基鏈轉移劑之硫醇 類是數量平均分子量為400〜2000的二級硫醇類。 7·如申請專利範圍第4項所述之液晶密封用硬化性樹 脂組成物’其中上述液晶密封用硬化性樹脂組成物以Ε型 黏度計所測定的於25。〇 1.0 ipm下的黏度為50 Pa.s〜5〇〇 Pa.S ’且於80°C、l.Orpm下的黏度大於500Pa.s。 8·一種液晶密封用硬化性樹脂組成物,其含有: $ "具有可進行自由基聚合的碳碳雙鍵、氫鍵官能基、及 環氧基的樹脂組成物; 熱自由基聚合起始劑;以及 填充料, 上述樹脂組成物包含選自由如下樹脂所組成之族群中 的兩種或兩種以上的樹脂: (1A)自由紅紐伽,胁丨分子 進行自t基聚合的2個碳-碳雙鍵,且上述氣鍵 吕月b基!為 1.5ΧΚΓ3 m〇l/g〜6.〇χ1〇-3 m〇1/g ; 〇B)自由基反舰樹脂’其於丨分子内具有氮鍵官 110 200900816 27285pif 能基丄環氧基、及可進行自由基聚合的碳碳雙鍵,且上述 氫鍵官能基量為l.OxlG—Vol/g〜5.GxlG.3mol/g;以及 口、jic)環氧樹脂,其於丨分子内具有環氧基但不具有 可進行自由基聚合的碳·碳雙鍵,並且其藉由環球法測得的 軟化點大於等於40°C,且重量平均分子量為5〇〇〜5_ ; 上述樹脂組成物中的氫鍵官能基量為10xl0_4mol 〜6. Ox Hr3 mol/g ; 上述樹脂組成物中的環氧基量為1〇χ1〇·4 2 6χ l(T3mol/g。 B t 9·如申明專利範圍第8項所述之液晶密封用硬化性樹 月曰’、且成物,其中上述細旨組成物巾的氫鍵官能基為輕基。 10.如申請專利範圍第8項所述之液晶密封用硬化性 ,月旨組成物,射上述(1Α)的自由基反應性樹脂為下述 通式(al)或通式(a2)所表示的樹脂;6. The curable resin composition for liquid crystal sealing according to Item 4 or 5, wherein the thiol as the radical chain transfer agent is a secondary thiol having a number average molecular weight of 400 to 2,000. class. 7. The curable resin composition for liquid crystal sealing according to claim 4, wherein the curable resin composition for liquid crystal sealing is 25 measured by a Ε-type viscosity meter. The viscosity at 〇 1.0 ipm is 50 Pa.s~5〇〇 Pa.S ' and the viscosity at 80 ° C, 1.0 rpm is greater than 500 Pa.s. A curable resin composition for liquid crystal sealing comprising: $ " a resin composition having a carbon-carbon double bond capable of radical polymerization, a hydrogen bond functional group, and an epoxy group; And a filler, wherein the resin composition comprises two or more resins selected from the group consisting of: (1A) free red neon, and two carbons from the t-based polymerization of the ruthenium molecule - Carbon double bond, and the above gas key Lu Yue b base! 1.5ΧΚΓ3 m〇l/g~6.〇χ1〇-3 m〇1/g ; 〇B) free radical anti-ship resin' has a nitrogen bond in the ruthenium molecule 110 200900816 27285pif can be based on an epoxy group, And a carbon-carbon double bond capable of undergoing radical polymerization, and the above-mentioned hydrogen bond functional group amount is 1.00xG-Vol/g~5.GxlG.3mol/g; and a mouth, jic) epoxy resin, which is in the ruthenium molecule An epoxy group having no carbon-carbon double bond capable of undergoing radical polymerization, and having a softening point of 40 ° C or more as measured by a ring and ball method, and a weight average molecular weight of 5 〇〇 5 _ 5 _; The amount of the hydrogen bond functional group in the material is 10 x 10 -4 mol to 6. Ox Hr3 mol / g; the amount of the epoxy group in the above resin composition is 1 〇χ 1 〇 · 4 2 6 χ l (T3 mol / g. B t 9 · as stated The sclerosing resin for liquid crystal sealing according to the eighth aspect of the invention, wherein the hydrogen bond functional group of the composition towel is a light base. 10. According to the scope of claim 8 The curable resin for liquid crystal sealing, the composition of the above-mentioned (1 Α) radical reactive resin is a resin represented by the following formula (al) or formula (a2); [上述通式(al)中, 通式() R2、R3、R4分觸立地表示氫原子或甲基; J觸立地表示氫原子、魏為卜4的烧基、姊 ,數為1〜4 _絲或碳數為1〜4的燒氧基; η表示1〜4的整數; 1表示1〜4的整數; 111 200900816 A. I y li A為以-CH2-、_C(CH3)2-、-S02-、或-O-表示的有機基 團];[In the above formula (al), the formula (), R2, R3, and R4 represent a hydrogen atom or a methyl group in a touch; J is a hydrogen atom, a pyridyl group of Wei, and a number of 1 to 4; _ silk or alkoxy having a carbon number of 1 to 4; η represents an integer of 1 to 4; 1 represents an integer of 1 to 4; 111 200900816 A. I y li A is -CH2-, _C(CH3)2- , an organic group represented by -S02-, or -O-]; ......通式(a2 ) [上述通式(a2)中,(General formula (a2) [in the above formula (a2), R5、R6、R7、Rs分別獨立地表示氫原子或曱基; Rq分別獨立地表示氫原子、碳數為1〜4的烷基、烯 丙基、碳數為1〜4的羥烷基或碳數為1〜4的烷氧基; r表示1〜4的整數; p表示1〜4的整數]。 ί 1.如申請專利範圍第8項所述之液晶密封用硬化性樹 脂組成物,其中上述(1Α)的自由基反應性樹脂為下述通 式(a3)或通式(a4)所表示的樹脂;R5, R6, R7 and Rs each independently represent a hydrogen atom or a fluorenyl group; Rq independently represents a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, an allyl group, a hydroxyalkyl group having 1 to 4 carbon atoms or An alkoxy group having a carbon number of 1 to 4; r represents an integer of 1 to 4; and p represents an integer of 1 to 4]. The curable resin composition for liquid crystal sealing according to claim 8, wherein the (1Α) radical reactive resin is represented by the following formula (a3) or formula (a4). Resin 通式(a3) [上述通式(a3)中, R!、R2分別獨立地表示氳原子或甲基; Rm*別獨立地表示氳原子、碳數為1〜4的烷基、烯 112 200900816 27285pif 丙基、碳數為1〜4的經烧基或碳數為1〜4的烧氧基; η表示1〜4的整數,· Α為以CH2-、-C(CH3)2-、-S02-、或-0-表示的有機基 團];In the above formula (a3), R! and R2 each independently represent a ruthenium atom or a methyl group; and Rm* independently represents a ruthenium atom, an alkyl group having 1 to 4 carbon atoms, and an ene 112 200900816 27285pif propyl, a calcined group having a carbon number of 1 to 4 or an alkoxy group having a carbon number of 1 to 4; η represents an integer of 1 to 4, and Α is CH2-, -C(CH3)2-, - An organic group represented by S02-, or -0-]; ......通式(a4) [上述通式(a4)中, R5、R6分別獨立地表示氫原子或曱基]。 12. 如申請專利範圍第8項所述之液晶密封用硬化性 樹脂組成物,其中上述液晶密封用硬化性樹脂組成物以£ 型黏度计所測定的於25°C、1.0 i*pm下的黏度為50 Pa.s〜 500Pa.s,且於 80。(:、l.Orpm 下的黏度大於 500 Pa.s。 13. 如申請專利範圍第8項所述之液晶密封用硬化性 樹脂組成物,其中上述液晶密封用硬化性樹脂組成物更含 有自由基鏈轉移劑。 14. 如申請專利範圍第13項所述之液晶密封用硬化性 樹脂組成物,其中上述液晶密封用硬化性樹脂組成物以E 型黏度計所測定的於25°C、1.0 rpm下的黏度為50 Pa. s〜 500 Pa.s,且於 80°C、l.Orpm 下的黏度大於 500 Pa.s。 15· —種液晶顯示面板的製造方法,其是經由液晶密封 用硬化性樹脂組成物將相對向的2塊基板進行貼合而製成 液晶顯示面板的製造方法,包括: 113 200900816 準備第I基板的步驟,上述第!基板包含 域,該框狀顯示區域由如申請專利範圍第〗項、广肩不區 第8項所狀液晶密硬倾樹驗成 區域而形f ^哪素陣列 入液Si:狀態的上述顯示區域内、或另-餘板上滴 驟;=述第1基板、和與其相對向的第2基板重疊的步 驟。H由加熱而使上述液晶密封用樹脂組成物硬化的步 (J 114 200900816 27285pif 七、 指定代表圖: (一) 本案指定代表圖為:無。 (二) 本代表圖之元件符號簡單說明: 無。 八、 本案若有化學式時,請揭示最能顯示發明特徵 的化學式:General formula (a4) [In the above formula (a4), R5 and R6 each independently represent a hydrogen atom or a fluorenyl group]. 12. The curable resin composition for liquid crystal sealing according to claim 8, wherein the curable resin composition for liquid crystal sealing is measured at a temperature of 25 ° C and 1.0 i * pm as measured by a £-type viscosity meter. The viscosity is 50 Pa.s~500Pa.s and is 80. The viscosity of the liquid crystal sealing curable resin composition as described in claim 8, wherein the curable resin composition for liquid crystal sealing further contains a radical. The curable resin composition for liquid crystal sealing according to claim 13, wherein the curable resin composition for liquid crystal sealing is measured at 25 ° C and 1.0 rpm by an E-type viscosity meter. The viscosity is 50 Pa. s~ 500 Pa.s, and the viscosity at 80 ° C, 1.0 rpm is greater than 500 Pa.s. 15. A method for manufacturing a liquid crystal display panel, which is hardened by liquid crystal sealing. The resin composition is bonded to two substrates to form a liquid crystal display panel, and includes: 113 200900816 A step of preparing a first substrate, wherein the first substrate includes a domain, and the frame-shaped display region is as claimed In the above-mentioned display area of the patent range 〗 〖, the wide shoulder and the eighth item, the liquid crystal densely pours into the area, and the shape of the liquid is in the above-mentioned display area of the Si: state or on the other-side plate; = the first substrate, and the opposite Step of superposing the second substrate. H is a step of hardening the liquid crystal sealing resin composition by heating (J 114 200900816 27285pif VII. Designated representative drawing: (1) The representative drawing of the case is: None. (2) The representative A brief description of the symbol of the figure: None. 8. If there is a chemical formula in this case, please disclose the chemical formula that best shows the characteristics of the invention: 通式(al )General formula (al )
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CN101617267A (en) 2009-12-30
CN101617267B (en) 2012-08-15

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