TW200843630A - Electronic device for low temperature environment - Google Patents

Electronic device for low temperature environment Download PDF

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Publication number
TW200843630A
TW200843630A TW96115414A TW96115414A TW200843630A TW 200843630 A TW200843630 A TW 200843630A TW 96115414 A TW96115414 A TW 96115414A TW 96115414 A TW96115414 A TW 96115414A TW 200843630 A TW200843630 A TW 200843630A
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TW
Taiwan
Prior art keywords
heat
electronic device
heat storage
storage medium
phase change
Prior art date
Application number
TW96115414A
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Chinese (zh)
Inventor
Ming-Yang Hsiao
Chao-Tsai Chung
Original Assignee
Asustek Comp Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Asustek Comp Inc filed Critical Asustek Comp Inc
Priority to TW96115414A priority Critical patent/TW200843630A/en
Publication of TW200843630A publication Critical patent/TW200843630A/en

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Abstract

An electronic device for low temperature environment includes an electrical component, a heat absorber, a heat storage and a heat pipe. The heat absorber is in contact with the electrical component. The heat pipe interconnects the heat absorber and the heat storage. The heat storage includes a phase change material. When the electrical component operates, the heat generated by the electrical component is transferred via the heat absorber and the heat pipe and stored in the phase change material. When the electrical component is out of power, the phase change material releases heat, which is transferred via the heat absorber and the heat pipe to the electrical component so as to maintain the electrical component in the working temperature range.

Description

200843630 九、發明說明: 【發明所屬之技術領域】 本發明是有關於一種雷早駐 + 裡也子裝置,特別是一種適用 外低溫環境的電子裝置。 、戶 Λ 【先前技術】 產品有許多是安裝在戶外,例如無線基地台 電線桿上。在寒帶國家,冬天時的溫度常會降低 =零度以下’有的電子零件操作溫度是在零度以上, 會&amp;成糸統無法開機運作。 持在=7問題的作法是利用電阻加熱,使系統維 irt熱能又會導致系統散熱能力減弱。 法:線基地台遇到停電時,系統溫度仍會因無 日士季=加熱而降低至零度以下,因此無線基地台復電 吟,糸統仍不能即時開機運作。 目此’上述問題仍然未獲得完全的解決方案,還 k 創新的解決方案以克服上述的問題。 /、 【發明内容】 的就是在提供-種適用於戶外低溫 環 因此本發明的 境的電子裝置。 根據本發明之上述目的, θ Μ + 4 $ 棱出種適用於戶外低溫環 兄的'子裝置。此電子裝置包含電子元件、吸敎元件、儲 熱元件與熱管。吸熱元件連接電子元件。儲執:二: 含《化㈣介質。熱管用以連接吸熱S件與儲 5 200843630 當電子元件處於卫作狀態時,電子元件所產生的熱藉吸熱 兀件與熱管傳導儲存至儲熱元件内的相變化儲熱介質。當 電子疋件無法獲得電源時’儲熱元件内的該相變化錯執介 質釋出熱㊣’並藉熱管與吸熱元件傳導至電子元件,進而 維持電子元件處於一工作溫度範圍内。 因此,應用本發明的電子裝置,利用相變化儲熱介質 於電子裝置工作狀態時,儲存電子裝置内產生的熱能,而 於電子裝置無法獲得電源時,釋出熱能以加溫電子元件至 一工作溫度範圍内。 【實施方式】 本發明提供一種適用於戶外低溫環境的電子裝置,以 下將藉實施例來說明本發明的細節。 明麥照圖1,其繪示依照本發明一較佳實施例的一種適 用於戶外低溫環境的電子裝置。電子裝置100可以是任何 適用於戶外低溫環境的電子裝置(例如無線通訊的基地 口)。電子I置100的機殼1〇2内包含電路板1〇4、吸熱元 件、儲熱7G件與熱管112。電路板1〇4具有多個電子元件, 其中主要發熱的電子元件1〇6上設置吸熱元件,於本實施 例為金屬塊110。儲熱元件包含容器η4與相變化儲熱介質 116。金屬塊110與電子元件1〇6可加入導熱貼片1〇8,藉 以增加導熱的效率,但導熱貼片i08並非一定必要。 根據本發明之較佳實施例,熱管112用以連接金屬塊 110與容Is 114(熱管112貫穿至容器U4)。相變化儲熱介 質116為相變化過程可逆與高相變潛熱的儲熱介質,同時 200843630 此儲熱介質的熔點還需在電子元件的工作溫度範圍内(例 如高於攝氏〇度的範圍)。相變化儲熱介質116可以是石蠟 (C^H48)或任何符合上述條件的儲熱介質。容器ιΐ4則以無 法與相變化儲熱介質1丨6產生化學變化的材質製成。 圖2繪示依照本發明之電子元件於工作狀態時的儲熱 介質相變化圖。請同時參照w !與圖2,當電子元件ι〇6 處於;Μ乍狀態時,電子元件1〇6所產生的熱藉金屬塊ιι〇 與熱官112傳導儲存至容器114内的相變化儲熱介質丨16。 相變化儲熱介質116利用固體溶化成液體時的相變化吸收 電子元件106所產生的熱。相變化的時間t(吸熱的量)會正 比於相變化儲熱介質116的量(或容器114的容量)。 圖3繪示依照本發明之電子元件無法獲得電源時的儲 熱介質相變化圖。請同時參照圖!與圖3,當電子元件康 無法獲得電源時,容器114内的相變化儲熱介f ιΐ6釋出 熱能,並藉熱管112與金屬塊11〇傳導至電子元件1〇6,進 而維持電子7L# 1G6處於-工作溫度範圍内。此時,相變 化儲熱介質116湘液體凝固成固體時的相變化以釋出敎 量。 … 由上述較佳實施例可知,應用本發明的電子裝置,利 用相變化儲熱介質於電子裝置H態時’儲存電子裝置 内產生的熱能,而於電子裝置無法獲得電源時,釋出熱能 以加溫電子元件至一工作溫度範圍内。 雖然本發明已以-較佳實施例揭露如上,然其並非用 以限,本發明,任何熟習此技藝者,在不脫離本發明之精 神和範圍内,當可作各種之更動與潤飾,因此本發明之保 200843630 護範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 為讓本發明之上述和其他目的、特徵、優點與實施例 能更明顯易懂,所附圖式之詳細說明如下: 圖1繪示依照本發明一較佳實施例的一種適用於戶外 低溢環境的電子裝置;以及 圖2與圖3繪示依照本發明一較佳實施例的一種儲熱 裝置於兩種不同運作狀況的相變化圖。 【主要元件符號說明】 100 :電子裝置 102 :機殼 104 β•電路板 10 6 ·電子元件 108 :導熱貼片 110 :金屬塊 112 :熱管 114 :容器 116 :相變化儲熱介質200843630 IX. Description of the Invention: [Technical Field to Which the Invention Is Along] The present invention relates to a device for ray-preserving + lining, and more particularly to an electronic device suitable for an external low-temperature environment.家用 先前 【Prior Art】 Many of the products are installed outdoors, such as wireless base station poles. In cold regions, the temperature in winter is often lowered = below zero. Some electronic parts operating temperatures are above zero, and they will not be able to start up. The problem with the =7 problem is to use resistance heating, so that the system's irt thermal energy will cause the system to reduce heat dissipation. Method: When the line base station encounters a power outage, the system temperature will still drop below zero due to no solar season = heating. Therefore, the wireless base station will not be able to start up immediately after the power is restored. Therefore, the above problems still do not have a complete solution, and innovative solutions to overcome the above problems. / SUMMARY OF THE INVENTION It is an electronic device that is suitable for use in an outdoor low temperature ring and thus in the present invention. According to the above object of the present invention, θ Μ + 4 $ ribs are suitable for the 'child device of the outdoor low temperature ring brother. The electronic device includes an electronic component, a suction component, a heat storage component, and a heat pipe. The heat absorbing element is connected to the electronic component. Storage: Two: Contains "Chemical (four) media. The heat pipe is used to connect the heat-absorbing S piece and the storage. 5 200843630 When the electronic component is in the state of protection, the heat generated by the electronic component is transferred to the phase change heat storage medium stored in the heat storage element by the heat-absorbing element and the heat pipe. When the electronic component is unable to obtain power, the phase change in the heat storage element misplaces the heat and conducts heat to the electronic component by the heat pipe and the heat absorbing element, thereby maintaining the electronic component within an operating temperature range. Therefore, when the electronic device of the present invention is used, the phase change heat storage medium is used to store the heat energy generated in the electronic device when the electronic device is in an operating state, and when the electronic device cannot obtain the power source, the heat energy is released to warm the electronic component to work. Within the temperature range. [Embodiment] The present invention provides an electronic device suitable for use in an outdoor low temperature environment, and the details of the present invention will be described below by way of embodiments. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a diagram showing an electronic device suitable for use in an outdoor low temperature environment in accordance with a preferred embodiment of the present invention. The electronic device 100 can be any electronic device suitable for use in an outdoor low temperature environment (e.g., a base station for wireless communication). The casing 1〇2 of the electronic I set 100 includes a circuit board 1〇4, a heat absorbing element, a heat storage 7G piece and a heat pipe 112. The circuit board 1〇4 has a plurality of electronic components, and the main heat-generating electronic component 1〇6 is provided with a heat absorbing element, which is a metal block 110 in this embodiment. The heat storage element includes a container η4 and a phase change heat storage medium 116. The metal block 110 and the electronic component 1〇6 can be added to the thermal conductive patch 1〇8 to increase the heat transfer efficiency, but the thermal conductive patch i08 is not necessarily necessary. In accordance with a preferred embodiment of the present invention, heat pipe 112 is used to connect metal block 110 to volume Is 114 (heat pipe 112 extends through container U4). The phase change heat storage medium 116 is a heat storage medium for the phase change process reversible and high phase change latent heat, and the melting point of the heat storage medium of 200843630 also needs to be within the operating temperature range of the electronic component (for example, a range higher than the Celsius temperature). The phase change heat storage medium 116 may be paraffin (C^H48) or any heat storage medium meeting the above conditions. The container ι 4 is made of a material which cannot be chemically changed with the phase change heat storage medium 1丨6. 2 is a diagram showing phase changes of a heat storage medium when an electronic component according to the present invention is in an operating state. Please refer to w! and FIG. 2 at the same time. When the electronic component ι〇6 is in the Μ乍 state, the heat generated by the electronic component 1〇6 is transferred to the phase change storage stored in the container 114 by the metal block ιι〇 and the thermal officer 112. Heat medium 丨16. The phase change heat storage medium 116 absorbs heat generated by the electronic component 106 by a phase change when the solid dissolves into a liquid. The time t of the phase change (the amount of endotherm) will be proportional to the amount of phase change heat storage medium 116 (or the capacity of vessel 114). Fig. 3 is a view showing a phase change of a heat storage medium when an electronic component according to the present invention cannot obtain a power source. Please refer to the map at the same time! As shown in FIG. 3, when the electronic component is unable to obtain power, the phase change heat storage medium ff6 in the container 114 releases heat energy, and is conducted to the electronic component 1〇6 by the heat pipe 112 and the metal block 11〇, thereby maintaining the electron 7L#. 1G6 is in the - operating temperature range. At this time, the phase change heat storage medium 116 changes the phase change when the liquid solidifies into a solid to release the amount of ruthenium. According to the above preferred embodiment, the electronic device of the present invention uses the phase change heat storage medium to store the heat energy generated in the electronic device when the electronic device is in the H state, and releases the heat energy when the electronic device cannot obtain the power source. Warm the electronic components to an operating temperature range. Although the present invention has been described above with reference to the preferred embodiments thereof, it is not intended to limit the scope of the invention, and the invention may be modified and modified without departing from the spirit and scope of the invention. The scope of the warranty of the present invention is defined in the scope of the patent application. BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features, advantages and embodiments of the present invention will become more <RTIgt; An electronic device suitable for an outdoor low-over environment; and Figures 2 and 3 illustrate phase changes of a heat storage device in two different operating conditions in accordance with a preferred embodiment of the present invention. [Main component symbol description] 100 : Electronic device 102 : Case 104 β • Circuit board 10 6 · Electronic component 108 : Thermally conductive patch 110 : Metal block 112 : Heat pipe 114 : Container 116 : Phase change heat storage medium

Claims (1)

200843630 十、申請專利範圍: 1 · 一種適用於戶外低溫環境的電子裝置,至少包含: 一電子元件; s 一吸熱元件,連接該電子元件; 一儲熱元件,包含一相變化儲熱介質;以及 一熱官,連接該吸熱元件與該儲熱元件, 0 #該電子元件處於卫作狀態時,該電子㈣所產生的 熱藉該吸熱元件與該熱管傳導儲存至該相變化儲熱介質, 田忒電子7L件無法獲得電源時,該相變化儲熱介質釋 出熱能,並藉該熱管與該吸熱元件傳導至該電子元件,進 而、准持5亥電子元件處於一工作溫度範圍内。 a 2·如中請專利範圍帛i項所述之電子裝置,其中該相 ^化儲熱介質為石蠟(C23h48)。 埶—3 ·如申明專利範圍帛1項所述之電子裝置,其中該儲 =、凡件更包含一容器,以盛裝該相變化儲熱介質,該殼體 無去與該相變化儲熱介質產生化學變化。 4·如申明專利範圍第1項所述之電子裝置,其中該吸 熱元件為一金屬塊。 5 ·如申请專利範圍第1項所述之電子裝置,其中該相 200843630 内 變化儲熱介質的溶點溫度在該電子元件工作溫度範圍 6·如申請專利範圍第 弟項所述之電子裝置,更包含一 ¥熱貼片位於該吸熱元件與該電子元件之間。 申明專利範圍第1項所述之電子裝置,更包含-機殼以包圍上述所有元件。 8·如中料利範圍帛1項所述之電子裝置,其中該工 作溫度範圍南於攝氏〇度。200843630 X. Patent application scope: 1 · An electronic device suitable for outdoor low temperature environment, comprising at least: an electronic component; s a heat absorbing component, connecting the electronic component; a heat storage component comprising a phase change heat storage medium; a heat officer connecting the heat absorbing element and the heat storage element, wherein the heat generated by the electron (four) is stored and stored by the heat absorbing element and the heat pipe to the phase change heat storage medium, When the power supply of the electronic 7L is unable to obtain power, the phase change heat storage medium releases heat energy, and the heat pipe and the heat absorbing element are transmitted to the electronic component, and the electronic component is in an operating temperature range. A2. The electronic device of claim 1, wherein the phased heat storage medium is paraffin (C23h48). The electronic device of claim 1, wherein the storage unit further comprises a container for containing the phase change heat storage medium, and the housing does not change the heat storage medium with the phase change. Produce chemical changes. 4. The electronic device of claim 1, wherein the heat absorbing element is a metal block. 5. The electronic device according to claim 1, wherein the melting point temperature of the heat storage medium in the phase 200843630 is in the operating temperature range of the electronic component. 6. The electronic device according to the second aspect of the patent application, A further hot patch is disposed between the heat absorbing element and the electronic component. The electronic device described in claim 1 further includes a casing to surround all of the above components. 8. The electronic device of claim 1, wherein the operating temperature range is south to Celsius.
TW96115414A 2007-04-30 2007-04-30 Electronic device for low temperature environment TW200843630A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI483099B (en) * 2012-06-08 2015-05-01 Foxconn Tech Co Ltd Phase change type heat dissipating device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI483099B (en) * 2012-06-08 2015-05-01 Foxconn Tech Co Ltd Phase change type heat dissipating device
US9046305B2 (en) 2012-06-08 2015-06-02 Foxconn Technology Co., Ltd. Phase change type heat dissipating device

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