200842368 . 九、發明說明： 【發明所屬之技術領域】 本發明係與懸臂式探針卡有關，特別是指一種使探針 之間具有完全電性遮蔽效果之探針卡。 5【先前技術】 一般懸臂式探針卡之探針模組工程係設置為如第一圖 所示之探針裝置1，具有設於探針卡電路板上之一探針座 10以及多數個探針2〇，該探針座1〇為具良好絕緣及避震 特性的材質所製成，使該些探針20以包覆絕緣外層之結構 10自電路板上朝該探針座10拉設以固定於該探針座上， 然後繼績朝該探針座1〇中心延伸，最後裸露懸設有特定之 力臂長度及垂直之針尖部位，針尖部位為金屬裸針結構以 $觸待測電子元件，懸設之力臂部位可使針尖在正向點觸 電子兀件時提供各探針2〇獲得有彈性緩衝的縱向位移空 15 間0 …為因應電子電路中元件的高密集度，該些探針2〇亦設 計為以高密集度制，而於該探針座1(m為區分有上、中°、 20 :排探針21、22、23之多層分佈結構，該探針座10亦對 應區分有位於關之固定部u及自周邊㈣延伸之 12’各排探針21、22、23接設於該探針座1()時最先由= =定部11所固定，且該固定部π内朝向電路板之錯垂;: 向上依序設置該些下、中、上排探針23、22、21，以 =間上相互錯_免造成電健路，其中，下排探針^ 牙《又該固定部11後即直接裸_設特定長度之力臂，上、 4 200842368 =排探針2卜22 _沿該切部η延伸、， 设該支撐部I2後裸露_ X亚同樣穿 針21、22、23之針，丨、丈^,長度力#，使最終各排探 以同時接觸於積體電 _、 ^ 5 15 20 ^面上的對應分佈，可環繞 2〇c，分別對應於以1X3矩陳八优+ 7 2〇a、2〇b、 試接點，對第一（或第矩、陣:佈的二電子電路元件2之測 野弟C或弟二）測試窗口 20a (或2 右（或左）側有自該探針座1〇 )而δ， 排掇斜Μ ★ ΑΧ，+ (或左）方延伸接設之下 ㈠ 扣末端230 ’左（或右）側有 =i方延伸接設之中排探針22之針尖末端220 i: _ 口 20b而5，右側有自該探 設之上排探針21之針技 〇右方延伸接 产方;… 左側有自該探針座10 左方延伸接設之上排探針21之針尖末端2ω。 23 此㈣層分佈讀翁構可使各排_ 2卜22、 間於縱向空間上不致有電性短路的情形，但除了下 採針23於探針座10内設有最短的長度，其餘之上、 探針21、22皆繼續延伸穿設於探針座1〇之支 =整，=較之下排探針23更為增加，加上該些探針如 ^以兩讀度設置集中於探針座1〇内，因此往往在電性傳 遞的過程發生在探針座10中相鄰探針2〇之間的串音現 ^ ’即使1探針座10為以高絕緣特性之環氧樹脂材料所製 成’然在高速量測的過程中，自電測機台傳至電子元件的 測试條件訊號大多尚未完全結束，但自電子元件即已回傳 5 200842368 測試結果婦u，故當任—職條件訊軸任-賴結果气 號若為分別藉由相鄰二探針20傳遞，則容易以類似差動訊 號對的⑨氣特性形成串音現象而使雙向測試訊號皆嚴重失 个寻⑴么開弟Η09-304436所提供之『探針卡為 例，其中繼續朝中心延伸之上排探針之間雖然以空氣 電性隔絕’較之上述f用所提供之絕緣探針座有更加的嚷 緣效果’但由於空氣本身並無法作為紐屏蔽的效果，因 此在南速量測的過程中，同樣將面臨因探針過長而發 试條件訊號與測試結果訊號之間的串音現象。 縱使有如台灣專利公告第1274164所提供之『高頻 測試之探針卡』，藉錄佈導電㈣探針身部峡於金屬= 針座上’欲防止外界電磁干擾對探針傳遞訊號造成影塑， 15 20 =當探針卡在實際賴過財，自探針座上懸設之^針 a文到來自待測晶_正向作用力，純 a產生二斂的π動，因此造成探針與待測積體 間=位移誤差；且以金屬探針座作為固定探針之底座，不 供受力瞬間的避震效果，而容易使探針本身承受 1應力而損毁，更容易受到溫度變化影響而發生 ;=現7造成探針與待測積體電路元件之間的、 Π二導電膠本身材質之導電性有限，亦 厂曾又之一般做為電性傳導之金屬導體為大，若 板針周圍科電膠間接與金屬探針座之接地電位電性連 6 200842368 接，相鄰探針之間仍然存在 於高速量測的高雜件Τ … ·^ ―旦應用 輸的阻抗匹配特性有效維持高頻訊號傳 擾現象，目錢謂探料料有高頻電_可靠陡干 【發明内容】 因此，本發明之主要目的乃在於提供—種具電性遮 =之^臂式探針卡，可提供高穩定度及精密度的測試環 I亚有效避免相鄰各探針之間的電性干擾現象。 15 為達成前揭目的，本發明所提供—種懸臂式探針卡包 探針座、多數個第—及第二探針；探針座具有具絕 ，性之-龍及多數個支撐部，以及設於賤及支撐部之 曰 1具導電性之多數個導電部及金屬片，該金屬片電性連接 於接地電位；各該第—探針固定於周壁後延伸懸設其力臂 ^其針尖，各該第二探針於該探針座内係與相鄰之該第一 探針於船垂方向上相隔有特定之間距，並依序穿設該周 壁、導電部及該支撐部後延伸懸設其力臂及其針尖，且該 些第二探針於該導電部内佈設有該金屬片；該懸臂式探針 卡除了可應用於南猎集的電子電路量測，且在探針座中延 伸較長的各該第二探針之間更有對應填設之該導電部以及 電位接地之該金屬片，使用以傳遞訊號的各單一裸針結構 外具有可維持訊號完整性的絕緣材質及接地電位。 【實施方式】 7 20 200842368 明之示馨若干較佳實施例，用以對本發 下： 一放作砰細說明，其中所用圖示之簡要說明如 底視ί Γ㈣本發崎提供第"'較佳實施狀探針卡局部 f四圖係第三圖中‘4連線之剖視圖； 示意^五_本發明所提供第二較佳實施例之探針卡結構 示咅= ’·、_、本發明所提供第三較佳實闕之探針卡結構 大結述第三較佳實施例所提供探針卡之局部放 15 20 端於係上述第三較佳實施觸提供各探針之針尖末 寺测平面上對應各電子元件的分佈示意圖。 明荟閱如第三及第四圖所示本發明所提供第一較佳實 :列之-懸臂式探針卡3，包括有—電路板如、一探針座 刊及一探針組50，其中： 該電路板30係佈設有電子電路，並於下表面3〇1設有 们#墊Μ與電子電路電性連接，該些銲塾Μ供該探 =且邓相焊接’因此該電路板3〇可藉由電子電路傳遞測 式訊號於測試機台與該探針組5〇之間。 —該探針座40設於該電路板30之下表面3〇1，係區分有 —周壁41及錄個支撐部42，為具良好絕緣及避震特性之 8 200842368 材質一體成形製成，該周壁41位於該探針座4〇周圍，以 固定自電路板30上所延伸設置之該探針組5〇，該些支撐部 42係由該周壁41所環繞，為自該探針座4〇底部所凸^之 近似長方體結構，請配合第四圖參照，該周壁41以及各該 5支撐部42皆定義有一頂面411、421及一内側面412、422， 該周壁41之内側面412與各該支撐部42之内侧面422之 間形成一凹槽，並填設有如導電銀膠等具黏著性及 φ 之一導電部43。 私 該探針組50係為沿鉛垂方向上朝該電路板3〇依序疊 置之多數個下、中、上排探針51、52、53所組成，各該探 針51、52、53皆具有一針尖5〇卜一連接部5〇2及一燁接 部503’且自該針尖501向該連接部5〇2延伸形成有一力臂 504,自該連接部5〇2向該焊接部5〇3延伸形成有一身部 505，自該連接部5〇2至焊接部5〇3周圍並包覆有一絕緣層 506，各該探針5卜52、53之焊接部5〇3焊接於該電路^ • 3〇之銲墊31後則朝該探針座40延伸拉設，並固定於該探 針座40之周壁41中，請配合第五圖參照，各該下排探針 51以連接部502穿設該周壁41後直接裸露懸設其力臂 504使其針尖沿錯垂方向延伸凸設於該周壁々I之頂 面411 ’各該上、中排楝針53、52之身部505延伸穿設該 周壁41及導電部43並固定其連接部5〇2於該支撐部似上 後，直接裸露懸設其力臂504使其針尖5〇1沿鉛垂方向延 伸凸设於該支撐部42之頂面421，然後各該導電部43中以 如銅落等具極佳導電性之一金屬片Μ貼附於各該上、中排 9 200842368 探針53、52之絕緣層506上，再將各該金屬片44延伸佈 設至該電路板30上使電性連接於該電路板3〇之接地電 位，最後於該些絕緣層506周圍填設該探針座4〇之導電 43。 。 5 目此上述㈣臂式探針卡3具有乡層結構之該探針組 50，除了可應用於高密集的電子電路量測，且在探針座仞 中長度較長的中、上排探針52、53之間更有對應填設之該 • 導電部43，有效避免了該些探針52、53之間的串音問題， 且該絕緣層506上直接設置有電位接地之該金屬片私，如 1〇同傳輸線之阻抗匹配原理，使用以傳遞訊號的各單一裸針 結構外具有可維持訊號完整性的絕緣材質及接地電位。 當然利用該些金屬片44電性連接於接地電位的結構， 亦可如第五圖所示本發明第二較佳實施例所提供之一懸臂 式探針卡4，將上述實施例所提供之探針組5〇取代為g軸 15探針結構之一探針組55,該探針組55同樣具有以多層結構 φ 分佈之多數個下、中、上排探針56、57、58,所差異^在 於該絕緣層506之外圍更同軸包覆有一金屬片5〇7，該金屬 片507電性連接於該電路板3〇之接地電位，因此用以作為 各，探針56、57、58之同軸接地金屬，更能有效用以做高 20頻量測之應用，使訊號於各該探針56、57、58中傳輸時皆 能具有良好的阻抗匹配特性。 本發明更可如第六圖所示第三較佳實施例所提供之一 懸臂式探針卡5，為更高密度的探針結構，係具有一電路板 6〇、一探針座70及一探針組80，與上述實施例所提供者之 200842368 差異在於： 該探針座70除了有類似之一周壁71、一第一支撐部 72及一第一導電部73外，更自該支撐部72朝該探針座7〇 中心多設一第二支撐部74及一第二導電部75。 5 5亥探針組除了有原本之各下、中、上排探針51、52、 53外’更於靠近電路板60之方向上多設一層之多數個上層 探針54,各該上層探針54同樣於裸針結構上包覆有該絕緣 層506 ’並自該電路板6〇上依序延伸穿設該周壁71、第一 導電部73、第一支撐部72、第二導電部75及第二支撐部 1〇 74,然後裸露懸設其力臂及針尖，對應於各該第一及第二 導電部73、75處同樣以如銅等具極佳導電性之—金屬片 45貼附於各該上層探針54、上排探針兄及中排探針之 絕緣層506上，再將各該金屬片45延伸佈設至該電路板6〇 上使電性連接於該電路板6G之接地電位，最後於該些絕緣 層506周圍填設該探針座7〇之第一及第二導乃一、· 如此各探針51、52 ϋ之針尖末端於同一水平面上的 對應分佈可如第七圖所示環繞形成四測試窗口他、通、 5〇c、50d，分別對應於以1Χ4矩陣 2之測試接點。 _四冤子屯路讀 因此本實施例所提供之該懸臂式探針卡$為 用二大量的電子電路量測，只要該探針座 7〇有對應之縱向^足以供各探針51、52、m 且該探針組8〇在探針座70中長度較長的中、 53及上層探針54之間有對應包覆之該些絕緣㈣^金屬 20 200842368 =及導電部73、75’則如此高密度的探針分佈 於各早1針結構外具有可轉訊號完整㈣絕緣材質及 接地電位，有效避免相鄰各探針之間的電 唯，以上所述者，僅為本發明之較佳:實擾施現^而已， 故舉凡應用本發明說明書及申請專利範圍所為之等效結構 變化，理應包含在本發明之專利範圍内。 ❿ 12 200842368 【圖式簡單說明】 第一圖係習用探針裝置之結構示咅圖· 第二圖係上述習用探針裝置之針I末端於待 對應各電子元件的分佈示意圖； 上 底視圖 第三圖係本發明所提供第一較佳實施例之探針卡局部 第四圖係第三圖中4-4連線之剖視圖；200842368. IX. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD The present invention relates to a cantilever type probe card, and more particularly to a probe card having a fully electrical shielding effect between probes. 5 [Prior Art] The probe module engineering of the general cantilever probe card is set as the probe device 1 as shown in the first figure, and has one probe holder 10 and a plurality of probe pins on the circuit board of the probe card. The probe 2 is made of a material having good insulation and shock absorbing characteristics, so that the probes 20 are pulled from the circuit board toward the probe holder 10 by a structure 10 covering the insulating outer layer. It is fixed on the probe base, and then the successor extends toward the center of the probe holder 1 ,, and finally the naked end is hung with a specific force arm length and a vertical needle tip portion, and the needle tip portion is a metal bare needle structure to treat The electronic component is mounted, and the force arm portion of the suspension can provide the probe 2 when the tip is touched to the electronic component in the forward direction, and obtain the elastic displacement of the longitudinal displacement of the probe 15 ... 0 is the high concentration of the components in the electronic circuit The probes 2〇 are also designed to be made in a high density, and the probe holder 1 (m is a multi-layer distribution structure in which the upper, middle, and 20-row probes 21, 22, and 23 are distinguished, The needle holder 10 also has a 12' row of probes 21, 22, 23 extending between the fixed portion u and the periphery (four). When it is connected to the probe holder 1 (), it is first fixed by the == fixed portion 11, and the fixed portion π is slanted toward the circuit board; the lower, middle and upper rows of probes are arranged in order 23, 22, 21, to each other in the wrong = _ to cause the electric road, in which the lower row of probes ^ teeth "the fixed part 11 is directly naked _ set the arm of a certain length, on, 4 200842368 = The row of probes 2b22_ extends along the cut portion η, and after the support portion I2 is set, the needles of the needles 21, 22, and 23 are similarly exposed, and the needles of the needles 21, 22, and 23 are used to make the final probes. By simultaneously contacting the corresponding distribution on the integrated body _, ^ 5 15 20 ^ surface, it can surround 2〇c, corresponding to the 1X3 moment Chen Bayou + 7 2〇a, 2〇b, test junction, The first (or the second moment, the array: the two electronic circuit components 2 of the measurement of the younger brother C or the second brother) test window 20a (or 2 right (or left) side from the probe holder 1 〇) δ, row掇 Μ ΑΧ ΑΧ + + + + + + + + + + ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' And 5, the right side has the needle technique of the probe 21 from the top of the probe. 〇Right side extension of the delivery side;... On the left side, there is a tip end 2ω extending from the left side of the probe holder 10 to the upper row of the probe 21. 23 (4) layer distribution reading structure can make each row _ 2 Bu 22, There is no electrical short circuit in the longitudinal space, but except that the lower needle 23 is provided with the shortest length in the probe base 10, the probes 21 and 22 continue to extend through the probe base 1 . 〇 支 = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = The crosstalk between adjacent probes 2 in the probe holder 10 is now [even if the probe holder 10 is made of epoxy resin material with high insulating properties], in the process of high speed measurement, self-powering Most of the test condition signals transmitted from the measuring machine to the electronic components have not been completely completed, but the electronic components have been returned 5 200842368 test results, so the incumbent-service conditional axis--the result of the gas number is separately borrowed Passed by the adjacent two probes 20, it is easy to form a crosstalk phenomenon with a 9-gas characteristic similar to the differential signal pair to make the bidirectional test signal Severely lost (1) 开 Η Η - 09-304436 provided by the "probe card as an example, which continues to extend toward the center of the upper row of probes although the air is electrically isolated" compared to the above-mentioned f used to provide insulation The needle seat has a more sturdy edge effect. However, since the air itself cannot be used as a shield effect, in the process of the south speed measurement, there will also be a problem between the test condition signal and the test result signal due to the probe being too long. The phenomenon of crosstalk. Even if there is a "high-frequency test probe card" provided by Taiwan Patent Publication No. 1274164, the tape is electrically conductive (four) probe body is on the metal = needle seat to prevent external electromagnetic interference from causing the probe to transmit signals. , 15 20 = When the probe card is actually relied on the money, the needle from the probe holder is suspended to the positive force from the crystal to be measured, pure a produces a divergent π motion, thus causing the probe Between the product to be tested and the displacement error; and the base of the metal probe holder as the fixed probe does not provide the shock absorber effect of the moment, and the probe itself is easily damaged by 1 stress and is more susceptible to temperature changes. The influence occurs; = 7 now causes the conductivity of the material of the second conductive adhesive between the probe and the circuit component to be tested to be limited, and the metal conductor which is generally used as the electrical conduction is large. The electroacupuncture around the plate needle is indirectly connected to the ground potential of the metal probe base. The connection between the adjacent probes still exists in the high-speed measurement of the high-frequency components... The power-impedance characteristics of the application are transmitted. Effectively maintain the phenomenon of high-frequency signal transmission, Therefore, the main purpose of the present invention is to provide a test probe with high stability and precision. Sub-effectively avoids electrical interference between adjacent probes. In order to achieve the foregoing, the present invention provides a cantilever probe card package probe holder, a plurality of first and second probes, and a probe holder having a permanent, a dragon and a plurality of support portions. And a plurality of conductive portions and metal sheets disposed on the 贱 and the support portion, the metal sheets are electrically connected to the ground potential; and each of the first probes is fixed to the peripheral wall and then extends and extends the arm thereof. a needle tip, each of the second probes is spaced apart from the adjacent first probe in a predetermined distance between the adjacent probes, and sequentially passes through the peripheral wall, the conductive portion and the support portion. Extending and suspending the force arm and the tip thereof, and the second probes are disposed in the conductive portion; the cantilever probe card is applicable to the electronic circuit measurement of the south hunting set, and is in the probe The metal strips corresponding to the conductive portion and the potential ground are further arranged between the second probes which are extended in the socket, and have insulation for maintaining signal integrity outside the single bare needle structure for transmitting signals. Material and ground potential. [Embodiment] 7 20 200842368 A number of preferred embodiments of the present invention are provided for the following: a brief description of the illustrations, wherein the brief description of the illustrations used is as follows: (4) This is provided by the Japanese version. A preferred embodiment of the probe card portion f is a cross-sectional view of the '4 line in the third figure; FIG. 5 is a probe card structure of the second preferred embodiment provided by the present invention. 咅 = '·, _, and The invention provides a probe card structure of a third preferred embodiment. The third embodiment of the probe card provided by the third preferred embodiment is provided at the tip end of the probe provided by the third preferred embodiment. A schematic diagram of the distribution of corresponding electronic components on the measurement plane. The first preferred embodiment of the present invention, as shown in the third and fourth figures, is a cantilever probe card 3 comprising a circuit board, a probe holder and a probe set 50. , wherein: the circuit board 30 is provided with an electronic circuit, and is electrically connected to the electronic circuit on the lower surface 3〇1, and the soldering pads are used for the soldering and the Deng phase soldering. The board 3 can transmit a test signal between the test machine and the probe set 5〇 through an electronic circuit. The probe base 40 is disposed on the lower surface 3〇1 of the circuit board 30, and has a peripheral wall 41 and a recording support portion 42 formed integrally with a material having good insulation and shock absorption characteristics. The peripheral wall 41 is located around the probe holder 4 to fix the probe set 5 延伸 extending from the circuit board 30. The support portions 42 are surrounded by the peripheral wall 41 from the probe holder 4 The approximate rectangular parallelepiped structure of the bottom portion is referred to the fourth figure. The peripheral wall 41 and each of the 5 support portions 42 define a top surface 411, 421 and an inner side surface 412, 422. The inner side surface 412 of the peripheral wall 41 is A groove is formed between the inner side surfaces 422 of each of the support portions 42, and a conductive portion 43 having adhesiveness and φ such as conductive silver glue is filled. The probe set 50 is composed of a plurality of lower, middle and upper rows of probes 51, 52, 53 which are sequentially stacked in the vertical direction toward the circuit board 3, each of the probes 51, 52, Each of the 53 has a tip 5 〇 a connecting portion 5 〇 2 and a nip 503 ′ and extends from the tip 501 to the connecting portion 5 〇 2 to form a force arm 504 from the connecting portion 5 〇 2 to the welding The portion 5〇3 extends to form a body 505, and is surrounded by the connecting portion 5〇2 to the welded portion 5〇3 and covered with an insulating layer 506, and the welding portions 5〇3 of the probes 5 and 52 are welded to each other. The pad 31 of the circuit is extended toward the probe holder 40 and fixed to the peripheral wall 41 of the probe holder 40. Referring to the fifth figure, each of the lower rows of probes 51 is After the connecting portion 502 is inserted through the peripheral wall 41, the force arm 504 is directly exposed and suspended, and the needle tip extends in the wrong direction and protrudes from the top surface 411 of the peripheral wall 'I. The portion 505 extends through the peripheral wall 41 and the conductive portion 43 and fixes the connecting portion 5〇2 to the support portion. The force arm 504 is directly exposed and suspended so that the needle tip 5〇1 extends in the vertical direction. The The top surface 421 of the support portion 42 is then attached to the insulating layer 506 of each of the upper and middle rows 9 200842368 probes 53, 52 in each of the conductive portions 43 with a good electrical conductivity such as copper drop. Then, the metal piece 44 is extended to the circuit board 30 to be electrically connected to the ground potential of the circuit board 3, and finally the conductive layer 43 of the probe holder 4 is filled around the insulating layer 506. . . 5 The above-mentioned (four) arm type probe card 3 has the cluster structure 50 of the probe layer, except that it can be applied to high-density electronic circuit measurement, and the middle and upper lengths of the probe holder are long. The conductive portion 43 is evenly disposed between the pins 52 and 53 to effectively avoid the crosstalk problem between the probes 52 and 53, and the metal layer of the potential layer is directly disposed on the insulating layer 506. Private, such as the impedance matching principle of the same transmission line, uses an insulating material and ground potential that can maintain signal integrity outside the single bare needle structure for transmitting signals. Of course, the structure of the metal piece 44 is electrically connected to the ground potential, and the cantilever type probe card 4 provided by the second preferred embodiment of the present invention as shown in FIG. 5 is provided by the above embodiment. The probe set 5〇 is replaced by a probe set 55 which is one of the g-axis 15 probe structures, and the probe set 55 also has a plurality of lower, middle and upper rows of probes 56, 57, 58 distributed in a multi-layer structure φ. The difference is that the periphery of the insulating layer 506 is more coaxially coated with a metal piece 5〇7, and the metal piece 507 is electrically connected to the ground potential of the circuit board 3, so that the probes 56, 57, 58 are used as the respective ones. The coaxial grounding metal can be effectively used for high-frequency measurement, so that the signal can have good impedance matching characteristics when transmitted in each of the probes 56, 57, and 58. The present invention can further provide a cantilever probe card 5 according to the third preferred embodiment shown in FIG. 6 , which is a higher density probe structure, and has a circuit board 6 , a probe holder 70 and A probe set 80 differs from the 200842368 provided by the above embodiment in that: the probe holder 70 has a similar peripheral wall 71, a first support portion 72 and a first conductive portion 73, and further supports the probe holder 70. The portion 72 is provided with a second support portion 74 and a second conductive portion 75 toward the center of the probe holder 7. 5 5 Hai probe set, in addition to the original lower, middle and upper rows of probes 51, 52, 53, a plurality of upper probes 54 are disposed in a direction closer to the circuit board 60, each of which is a top probe The pin 54 is also coated with the insulating layer 506 ′ on the bare pin structure, and the peripheral wall 71 , the first conductive portion 73 , the first supporting portion 72 , and the second conductive portion 75 are sequentially extended from the circuit board 6 . And the second supporting portion 1〇74, and then the hanging force arm and the needle tip are exposed, corresponding to each of the first and second conductive portions 73, 75, which is also excellent in conductivity such as copper-metal sheet 45 Attached to the insulating layer 506 of each of the upper probes 54, the upper row of probes, and the middle row of probes, and then the metal sheets 45 are extended to the circuit board 6 使 to be electrically connected to the circuit board 6G. The ground potential is finally filled around the insulating layer 506, and the first and second guides of the probe holder 7 are respectively arranged, and the corresponding distribution of the tip end of each of the probes 51 and 52 is on the same horizontal surface. As shown in the seventh figure, four test windows are formed to surround, pass, 5〇c, 50d, respectively corresponding to the test contacts of the matrix 2 of 1Χ4. Therefore, the cantilever probe card $ provided by the embodiment is measured by two large electronic circuits, as long as the probe holder 7 has a corresponding longitudinal length enough for each probe 51, 52, m and the probe set 8 〇 in the probe holder 70 between the longer length of the middle, 53 and the upper probe 54 corresponding to the insulation (four) ^ metal 20 200842368 = and conductive parts 73, 75 'The high-density probes are distributed around each of the early 1-pin structures and have a complete (4) insulating material and a ground potential. This effectively avoids the power between adjacent probes. The above is only the present invention. It is preferable that the actual structural variation of the present invention and the scope of the patent application are included in the patent scope of the present invention. ❿ 12 200842368 [Simple description of the drawings] The first diagram is a schematic diagram of the structure of the conventional probe device. The second diagram is a schematic diagram of the distribution of the needle I end of the conventional probe device to the respective electronic components to be corresponding; 3 is a cross-sectional view of a fourth portion of the probe card of the first preferred embodiment of the present invention, taken along line 4-4 of the third figure;
第五圖係本發騎提供第二較佳實_讀針卡結構 一第八圖係本發明所提供第三較佳實施例之探針卡結構 示意圖； 第七圖係上述第三較佳實施例所提供探針卡之局部放 大結構示意圖； 1 ^第八圖係上述第三較佳實施例所提供各探針之針尖末 ^於待測平面上對應各電子元件的分佈示意圖。 13 200842368 【主要元件符號說明】 2電子電路元件 3、4、5懸臂式探針卡 30、60電路板 301下表面 5The fifth figure is a second preferred embodiment of the present invention. The eighth embodiment is a schematic view of the probe card of the third preferred embodiment of the present invention. The seventh figure is the third preferred embodiment. The schematic diagram of the partial enlarged structure of the probe card provided by the example; 1 ^ The eighth figure is a schematic diagram of the distribution of the corresponding electronic components of the probe tip of the probe provided in the third preferred embodiment. 13 200842368 [Description of main component symbols] 2 electronic circuit components 3, 4, 5 cantilever probe card 30, 60 circuit board 301 lower surface 5
10 31銲墊 40、70探針座 411、421 頂面 42、72、74支撐部 44、45、507金屬片 50、55、80探針組 502連接部 504力臂 41、71周壁 412、422内側面 43、73、75導電部 501針尖 503焊接部 505身部 506絕緣層 50a、50b、50c、50d 測試窗口 1510 31 pads 40, 70 probe holders 411, 421 top surfaces 42, 72, 74 support portions 44, 45, 507 metal sheets 50, 55, 80 probe set 502 connection portion 504 arms 41, 71 peripheral walls 412, 422 Inner side surface 43, 73, 75 conductive portion 501 needle tip 503 welded portion 505 body portion 506 insulating layer 50a, 50b, 50c, 50d test window 15
51、56下排探針 52、57中排探針 53、58上排探針 54上層探針 1451, 56 lower row of probes 52, 57 of middle row of probes 53, 58 upper row of probes 54 upper layer of probes 14