TW200819233A - Bonding method of heating plate for increasing the temperature of substrate, and heating plate thereof - Google Patents

Bonding method of heating plate for increasing the temperature of substrate, and heating plate thereof Download PDF

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Publication number
TW200819233A
TW200819233A TW95138469A TW95138469A TW200819233A TW 200819233 A TW200819233 A TW 200819233A TW 95138469 A TW95138469 A TW 95138469A TW 95138469 A TW95138469 A TW 95138469A TW 200819233 A TW200819233 A TW 200819233A
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TW
Taiwan
Prior art keywords
heating
joint
plate
guide
substrate
Prior art date
Application number
TW95138469A
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English (en)
Chinese (zh)
Other versions
TWI301780B (enrdf_load_stackoverflow
Inventor
Kuan-Yu Chen
Lung-Tien Wu
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Metal Ind Res & Dev Ct
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Filing date
Publication date
Application filed by Metal Ind Res & Dev Ct filed Critical Metal Ind Res & Dev Ct
Priority to TW95138469A priority Critical patent/TW200819233A/zh
Publication of TW200819233A publication Critical patent/TW200819233A/zh
Application granted granted Critical
Publication of TWI301780B publication Critical patent/TWI301780B/zh

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  • Pressure Welding/Diffusion-Bonding (AREA)
TW95138469A 2006-10-18 2006-10-18 Bonding method of heating plate for increasing the temperature of substrate, and heating plate thereof TW200819233A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW95138469A TW200819233A (en) 2006-10-18 2006-10-18 Bonding method of heating plate for increasing the temperature of substrate, and heating plate thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW95138469A TW200819233A (en) 2006-10-18 2006-10-18 Bonding method of heating plate for increasing the temperature of substrate, and heating plate thereof

Publications (2)

Publication Number Publication Date
TW200819233A true TW200819233A (en) 2008-05-01
TWI301780B TWI301780B (enrdf_load_stackoverflow) 2008-10-11

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ID=44769711

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95138469A TW200819233A (en) 2006-10-18 2006-10-18 Bonding method of heating plate for increasing the temperature of substrate, and heating plate thereof

Country Status (1)

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TW (1) TW200819233A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103517574B (zh) * 2012-06-26 2016-08-10 富葵精密组件(深圳)有限公司 承载治具及软硬结合板的制作方法

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Publication number Publication date
TWI301780B (enrdf_load_stackoverflow) 2008-10-11

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