200818876 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種數位相機模組及其組裝方法，尤其 係關於一種應用於行動電話上之數位相機模組及其組裝方 法。 【先前技術】 目前，行動電話向著多功能之趨勢發展，具有數位相 機模組之行動電話一經推出便倍受消費者歡迎。應用於行 _ 動電話之數位相機模組不僅需具有較好之成像功能，且需 要其結構與行動電話外殼結構相配合以達到節省行動電話 内部空間之目的，以滿足消費者對行動電話薄形化發展之 需要。 請參閱圖1，一種習知數位相機模組300安裝於行動 電話100内，該數位相機模組300包括一鏡座301及一鏡 筒302，該鏡座301和鏡筒302藉由螺紋連接成一體，該 | 鏡座301及鏡筒302之外週緣與其各自自身之頂面相交處 呈直角。該行動電話100包括一機體1001，該機體1001 具有一曲面部分1004與一平面部分1005。 所述數位相機模組300缺點在於：將該數位相機模組 300安裝於行動電話100内時，若將該鏡筒302之外週緣 與頂面相交處抵持於該行動電話100機體1001之曲面部分 1004與平面部分1005之臨界點1002或臨界點1002向平 面部分1005 —侧，會使該行動電話100頂部空出很大之空 間1003，從而增加該影像感測模組300於行動電話中所占 6 200818876 之空間。若將該鏡座301及鏡筒302鋒利的直角邊緣直接 抵持於該行動電話100機體1001之曲面部分1004上，不 僅易使該行動電話100之機體1001内部受損，而且該直角 外邊緣會抵頂曲面部分1004,會使鏡筒302之頂面與平面 部分1005間産生一定之間隙，從而增大整個數位相機模組 300於行動電話100中佔用之空間，既相當於無形中增加 行動電話100之厚度，不利於行動電話向薄形化方向發 展，且亦由於鏡筒302之頂面與平面部分1005間有間隔， • 而使該數位相機模組300於行動電話100中之安裝穩定性 變差。 【發明内容】 有鑒於此，本發明提供一種可減小與行動電話内部配 合空間之數位相機模組。 另，本發明亦提供一種組裝該數位相機模組之方法。 一種數位相機模組，其包括一影像感測模組和與其相 φ連接之一鏡頭模組，該鏡頭模組頂面週緣爲曲面。 一種數位相機模組之組裝方法，其包括以下步驟： 提供一影像感測模組； 提供一頂面週緣爲曲面之鏡座； 提供一頂面週緣爲曲面之鏡筒； 將所述鏡座和鏡筒相連接組成一鏡頭模組； 將所述鏡頭模組和影像感測模組相連接。 相較習知技術，所述數位相機模組採用具有曲面外形 之鏡座和鏡筒，不僅可避免鋒利邊緣對與其配合殼體之損 7 200818876 傷，而且減少其所占之空間。 所述數位相機模組組裝方法簡單，加工容易，易於達 到減小行動電話體積之目的。 【實施方式】 請參閱圖2,本發明較佳實施方式數位相機模組200 包括一影像感測模組50和一鏡頭模組60。該影像感测模 組50包括一基板52、一影像感測晶片54、複數焊線56 和一透明蓋體58。該鏡頭模組60包括一鏡座62、一鏡筒 _ 64和一鏡片66。 該基板52大致呈平板狀，通常由陶瓷或玻璃等材料製 成，其具有一頂面520，於該頂面520上設有複數第一焊 墊 522。 該影像感測晶片54設置於該基板52之頂面520上， 該影像感測晶片54之頂面中部具有一感測區540，於該感 測區540週圍佈設有複數第二焊墊542,所述第二焊墊542 φ用於輸出該影像感測晶片54産生之影像訊號。 所述複數焊線56之一端分別連接第一焊墊522,另一 端分別連接至第二焊墊542,從而實現基板52與影像感測 晶片54之電連接。 該透明蓋體58設置於影像感測晶片54之上，其由透 光性好之玻璃或塑膠材質製成。 該鏡座62爲中空圓柱狀，其具有一本體621，該本體 621具有一第一開口端620、一第二開口端622和一外週壁 624。該第一開口端620以封抵該頂面520上之方式固定連 8 200818876 接於該基板52上，該第二開口端622和本體621之外週壁 624相交處大致呈曲面，該曲面具有一定弧度，該弧度可 依需要配合之殼體加以調整。此種設計不僅有助於減小數 位相機模組200於具有曲面或斜面外形之行動電話中所占 之空間，從而減小行動電話之體積，有利於行動電話向薄 形化方向發展。另，該曲面結構避免了鋒利邊緣對與其配 合殼體之損傷，且提高安裝之可靠性。於該本體621内週 壁中部向内延伸出一環狀凸台626，該凸台626内直徑之 ⑩尺寸大於影像感測晶片54之感測區540之長度。凸台626 將鏡座62之内部分成兩空間，於第一開口端620 —侧之空 間用以將影像感測晶片54容納於其中，於第二開口端622 一侧空間之内週壁上形成内螺紋628。該透明蓋體58藉由 粘膠80粘接於凸台626之下表面，其尺寸大於凸台626 内直徑之尺寸，使影像感測晶片54被封閉於由基板52、 鏡座62及其凸台626與透明蓋體58圍成之密閉容室90 φ 中，以避免灰塵等雜質之污染。 該鏡筒64呈一中空圓筒狀，其具有一頂端640、一底 端642和週壁644。該頂端640開有一透光孔646，以保證 外部光線進入鏡筒64内；於週壁644上，從其中部到底端 642之間形成外螺紋648，用以與鏡座62内螺紋628相配 合；該頂端640和週壁644相交處呈曲面，該曲面亦具有 一定之弧度並可依需要配合之殼體加以調整。 該鏡片66固設於鏡筒64内，其與影像感測晶片54 之感測區540相對正，同時與透光孔646之中心對齊。 200818876 本發明優選實施方式之數位相機模組200之組裝方 法，其包括以下步驟： 提供一基板52，其具有一頂面520，於該頂面520上 設有間隔排列之複數第一焊墊522。 於該基板52之頂面520上塗上粘膠，再將影像感測晶 片54放置於該粘膠上，以將影像感測晶片54與基板52 連接；該影像感測晶片54頂面中央具有一感測區540，於 該感測區540之週緣部佈設有複數第二焊墊542。 • 複數焊線56藉由打線機打出，將每一焊線56之一端 電連接於基板52頂面520上之第一焊墊522,另一端電連 接於影像感測晶片54上表面之第二焊墊542上，以使影像 感测晶片54之訊號得以傳輸至基板52上。該複數焊線56 之材料係由導電性較好之黃金等金屬製成。 利用射出成型技術製造一中空鏡座62,其方法係利用 注塑機將加熱軟化之熔融塑膠材料注入金屬模具之型腔 ^ 中，經冷卻後從而一次形成具有於第二開口端622和外週 壁624相交處呈曲面之鏡座62，並於内週壁上形成内螺紋 628 ° 將一由透光性較好之玻璃或塑膠製成之透明蓋體58 藉由粘膠80粘接於所述鏡座62凸台626之下表面。 利用射出成型技術製造一中空鏡筒64，其製造方法與 鏡座62製造方法相同，從而形成具有曲面之鏡筒64，並 於鏡筒64之週壁644上形成外螺紋648。 將鏡片66藉由粘膠固接於鏡筒64内。 200818876 將鏡座62之内螺紋628和鏡筒64之外螺紋648相連 接，經過調整焦距後，再用粘膠將鏡座62和鏡筒64固定。 最後，將連接有鏡筒64之鏡座62之第一開口端620 藉由粘膠封抵於基板52之頂面520上，使影像感測晶片 54被封閉於由基板52、鏡座62及其凸台626和透明蓋體 58圍成之密閉容室90中，以避免灰塵等雜質之污染，從 而完成數位相機模組200之組裝。 當該數位相機模組200安裝於行動電話400内時，請 _ 參閱圖3，其中行動電話400包括一具有曲面或斜面外形 之機體4001、一屏幕4002、一鍵盤4003和安裝於該行動 電話400中之數位相機模組200，該數位相機模組200包 含具有曲面外形之鏡座62和鏡筒64。將該數位相機模組 200安裝於具有曲面或斜面外形之行動電話400中，藉由 該鏡座62和鏡筒64之曲面與該行動電話400邊緣祖配 合，減小該數位相機模組200於行動電話400中所占之體 • 積。 可以理解，該鏡筒可以省略，可以於鏡座内藉由卡配 或粘合等方式固設至少一鏡片以滿足成像之需求。 可以理解，該鏡座和鏡筒分別包括一頂面和侧面，該 頂面與該側面相交，所述曲面位於其頂面和側面之相交處。 可以理解，於製造鏡座和鏡筒時，可以先成型頂面週 緣無曲面之鏡座和鏡筒，經切削加工後可獲得頂面週緣爲 曲面之鏡座和鏡筒。 綜上所述，本發明符合發明專利要件，爰依法提出專 11 200818876 利申請。惟，以上所述者僅為本發明之較佳實施方式，本 發明之範圍幷不以上述實施方式為限，舉凡熟習本案技藝 之人士援依本發明之精神所作之等效修飾或變化，皆應涵 蓋於以下申請專利範圍内。 【圖式簡單說明】 圖1係習知數位相機模組安裝於行動電話上之剖視 圖， 圖2係本發明數位相機模組封裝結構圖； • 圖3係本發明數位相機模組安裝於行動電話上之剖視 圖。 【主要元件符號說明】 (習知） 行動電話 100 機體 1001 臨界點 1002 空間 1003 曲面部分 1104 平面部分 1105 數位相機 300 鏡座 301 鏡筒 302 (本發明） 數位相機模組 200 行動電話 400 機體 4001 螢幕 4002 鍵盤 4003 影像感測模組 50 基板 52 頂面 520 第一焊墊 522 影像感測晶片 54 感測區 540 第二焊墊 542 12 200818876 焊線 56 k頭模組 60 第一開口端 620 第二開口端 622 凸台 626 hiL· ^ 鏡简 64 底端 642 透光孔 646 馨鏡片 66 容室 90 透明蓋體 58 鏡座 62 本體 621 外週壁 624 内螺紋 628 頂端 640 週壁 644 外螺紋 648 黏膠 80 13BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a digital camera module and an assembly method thereof, and more particularly to a digital camera module for use in a mobile phone and an assembly method thereof. [Prior Art] At present, mobile phones are moving toward a multi-functional trend, and mobile phones with digital camera modules are popular with consumers as soon as they are launched. The digital camera module applied to the mobile phone not only needs to have better imaging function, but also needs its structure to cooperate with the structure of the mobile phone casing to save the space of the mobile phone to meet the consumer's thin shape for the mobile phone. The need for development. Referring to FIG. 1 , a conventional digital camera module 300 is mounted in a mobile phone 100. The digital camera module 300 includes a lens holder 301 and a lens barrel 302. The lens holder 301 and the lens barrel 302 are connected by screws. Integral, the outer circumference of the mirror holder 301 and the lens barrel 302 are at right angles to the top surface of each of the mirror holders 302. The mobile phone 100 includes a body 1001 having a curved portion 1004 and a planar portion 1005. The digital camera module 300 has the disadvantage that when the digital camera module 300 is installed in the mobile phone 100, if the outer periphery of the lens barrel 302 intersects with the top surface, the surface of the mobile phone 100 is fixed to the surface of the mobile phone 100. The portion 1004 and the critical point 1002 of the plane portion 1005 or the critical point 1002 are on the side of the plane portion 1005, which will make a large space 1003 on the top of the mobile phone 100, thereby increasing the image sensing module 300 in the mobile phone. Accounted for 6 200818876 space. If the sharp right-angled edge of the lens holder 301 and the lens barrel 302 directly abut against the curved surface portion 1004 of the mobile phone 100 body 1001, not only the internal body 1001 of the mobile phone 100 is easily damaged, but also the outer edge of the right angle will be Abutting the curved surface portion 1004 causes a certain gap between the top surface of the lens barrel 302 and the planar portion 1005, thereby increasing the space occupied by the entire digital camera module 300 in the mobile phone 100, which is equivalent to adding an invisible mobile phone. The thickness of 100 is not conducive to the development of the mobile phone in the thinning direction, and also because the top surface of the lens barrel 302 is spaced from the plane portion 1005, and the mounting stability of the digital camera module 300 in the mobile phone 100 is stabilized. Getting worse. SUMMARY OF THE INVENTION In view of the above, the present invention provides a digital camera module that can reduce the space for intercommunication with a mobile phone. In addition, the present invention also provides a method of assembling the digital camera module. A digital camera module includes an image sensing module and a lens module connected to the lens φ. The periphery of the top surface of the lens module is a curved surface. A method for assembling a digital camera module, comprising the steps of: providing an image sensing module; providing a lens holder having a top surface as a curved surface; providing a lens barrel having a top surface as a curved surface; The lens barrels are connected to form a lens module; the lens module and the image sensing module are connected. Compared with the prior art, the digital camera module adopts a mirror base and a lens barrel with a curved outer shape, which not only avoids the damage of the sharp edge to the matching shell, but also reduces the space occupied by the camera. The digital camera module has a simple assembly method, is easy to process, and is easy to achieve the purpose of reducing the volume of the mobile phone. [Embodiment] Referring to FIG. 2, a digital camera module 200 of the preferred embodiment of the present invention includes an image sensing module 50 and a lens module 60. The image sensing module 50 includes a substrate 52, an image sensing wafer 54, a plurality of bonding wires 56, and a transparent cover 58. The lens module 60 includes a lens holder 62, a lens barrel 64 and a lens 66. The substrate 52 is generally flat and generally made of a material such as ceramic or glass and has a top surface 520 on which a plurality of first pads 522 are disposed. The image sensing chip 54 is disposed on the top surface 520 of the substrate 52. The top surface of the image sensing chip 54 has a sensing area 540. A plurality of second pads 542 are disposed around the sensing area 540. The second pad 542 φ is used to output an image signal generated by the image sensing chip 54. One end of the plurality of bonding wires 56 is connected to the first pad 522, and the other end is connected to the second pad 542, respectively, thereby electrically connecting the substrate 52 and the image sensing chip 54. The transparent cover 58 is disposed on the image sensing wafer 54 and is made of a transparent glass or plastic material. The lens holder 62 has a hollow cylindrical shape and has a body 621 having a first open end 620, a second open end 622 and an outer peripheral wall 624. The first open end 620 is fixed to the base surface 520, and is connected to the base plate 52. The second open end 622 and the outer peripheral wall 624 of the body 621 intersect at a substantially curved surface. A certain degree of curvature, which can be adjusted according to the housing to be fitted. This design not only helps to reduce the space occupied by the digital camera module 200 in a mobile phone having a curved or beveled shape, thereby reducing the size of the mobile phone and facilitating the development of the mobile phone in the thinning direction. In addition, the curved structure avoids the damage of the sharp edges to the mating housing and improves the reliability of the mounting. An annular boss 626 extends inwardly from the central portion of the inner wall of the body 621. The diameter of the inner diameter of the boss 626 is greater than the length of the sensing region 540 of the image sensing chip 54. The boss 626 divides the inside of the lens holder 62 into two spaces, and the space on the side of the first open end 620 is used to accommodate the image sensing wafer 54 therein, and is formed on the inner peripheral wall of the space on the side of the second open end 622. Internal thread 628. The transparent cover 58 is adhered to the lower surface of the boss 626 by the adhesive 80, and the size thereof is larger than the inner diameter of the boss 626, so that the image sensing wafer 54 is enclosed by the substrate 52, the mirror holder 62 and the convex portion thereof. The table 626 and the transparent cover 58 enclose a closed chamber 90 φ to prevent contamination of impurities such as dust. The lens barrel 64 has a hollow cylindrical shape with a top end 640, a bottom end 642 and a peripheral wall 644. The top end 640 defines a light transmission hole 646 to ensure that external light enters the lens barrel 64. On the peripheral wall 644, an external thread 648 is formed between the middle portion and the bottom end portion 642 for cooperating with the internal thread 628 of the lens holder 62. The top end 640 and the peripheral wall 644 intersect at a curved surface, and the curved surface also has a certain degree of curvature and can be adjusted according to the required housing. The lens 66 is fixed in the lens barrel 64 and is opposite to the sensing area 540 of the image sensing wafer 54 while being aligned with the center of the light transmission hole 646. The method for assembling the digital camera module 200 of the preferred embodiment of the present invention comprises the following steps: providing a substrate 52 having a top surface 520 on which a plurality of first pads 522 are spaced apart. . An adhesive is applied to the top surface 520 of the substrate 52, and the image sensing wafer 54 is placed on the adhesive to connect the image sensing wafer 54 to the substrate 52. The image sensing wafer 54 has a center in the top surface. The sensing region 540 is provided with a plurality of second pads 542 at a peripheral portion of the sensing region 540. • The plurality of bonding wires 56 are driven by a wire bonding machine, and one end of each bonding wire 56 is electrically connected to the first pad 522 on the top surface 520 of the substrate 52, and the other end is electrically connected to the second surface of the image sensing chip 54. The pad 542 is placed to transmit the signal of the image sensing chip 54 to the substrate 52. The material of the plurality of bonding wires 56 is made of a metal such as gold having good conductivity. A hollow mirror holder 62 is manufactured by injection molding technology by injecting a heated softened molten plastic material into a cavity of a metal mold by an injection molding machine, and cooling to form a second open end 622 and a peripheral wall at a time. The intersection of the 624 is a curved mirror base 62, and an internal thread 628 is formed on the inner peripheral wall. A transparent cover 58 made of glass or plastic having good light transmittance is bonded to the transparent cover 80 by the adhesive 80. The mirror mount 62 has a lower surface of the boss 626. A hollow lens barrel 64 is manufactured by injection molding technique in the same manner as the lens holder 62, thereby forming a lens barrel 64 having a curved surface, and forming an external thread 648 on the peripheral wall 644 of the lens barrel 64. The lens 66 is fixed in the lens barrel 64 by adhesive. 200818876 The internal thread 628 of the lens holder 62 is connected to the external thread 648 of the lens barrel 64. After the focal length is adjusted, the lens holder 62 and the lens barrel 64 are fixed by adhesive. Finally, the first open end 620 of the lens holder 62 to which the lens barrel 64 is attached is sealed against the top surface 520 of the substrate 52 by an adhesive, so that the image sensing wafer 54 is enclosed by the substrate 52, the mirror holder 62, and The boss 626 and the transparent cover 58 enclose the sealed chamber 90 to prevent contamination of impurities such as dust, thereby completing the assembly of the digital camera module 200. When the digital camera module 200 is installed in the mobile phone 400, please refer to FIG. 3, wherein the mobile phone 400 includes a body 4001 having a curved or beveled shape, a screen 4002, a keyboard 4003, and a mobile phone 400. In the digital camera module 200, the digital camera module 200 includes a mirror mount 62 having a curved outer shape and a lens barrel 64. The digital camera module 200 is mounted on a mobile phone 400 having a curved or beveled shape. The curved surface of the lens holder 62 and the lens barrel 64 cooperate with the edge ancestor of the mobile phone 400 to reduce the digital camera module 200. The volume occupied by the mobile phone 400. It can be understood that the lens barrel can be omitted, and at least one lens can be fixed in the lens holder by carding or bonding to meet the needs of imaging. It can be understood that the lens holder and the lens barrel respectively comprise a top surface and a side surface, the top surface intersecting the side surface, the curved surface being located at the intersection of the top surface and the side surface thereof. It can be understood that when manufacturing the mirror base and the lens barrel, the mirror base and the lens barrel with no curved surface on the top surface can be formed, and the mirror base and the lens barrel with the curved top surface can be obtained after cutting. In summary, the present invention complies with the requirements of the invention patent, and the application for the special application 2008 18876 is proposed according to law. However, the above description is only a preferred embodiment of the present invention, and the scope of the present invention is not limited to the above-described embodiments, and those skilled in the art will be able to make equivalent modifications or changes in accordance with the spirit of the present invention. It should be covered by the following patent application. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view showing a digital camera module mounted on a mobile phone, FIG. 2 is a package structure diagram of a digital camera module of the present invention; FIG. 3 is a digital camera module of the present invention installed on a mobile phone. A cross-sectional view of the above. [Main component symbol description] (General) Mobile phone 100 Body 1001 Critical point 1002 Space 1003 Curved part 1104 Plane part 1105 Digital camera 300 Mirror base 301 Lens barrel 302 (Invention) Digital camera module 200 Mobile phone 400 Body 4001 Screen 4002 Keyboard 4003 Image Sensing Module 50 Substrate 52 Top Surface 520 First Pad 522 Image Sensing Wafer 54 Sensing Area 540 Second Pad 542 12 200818876 Bonding Wire 56 k Head Module 60 First Open End 620 Second Open end 622 boss 626 hiL· ^ Mirror 64 bottom 642 light hole 646 镜片 lens 66 chamber 90 transparent cover 58 mirror base 62 body 621 outer peripheral wall 624 internal thread 628 top 640 peripheral wall 644 external thread 648 sticky Glue 80 13