TW200811237A - Composition, associated method and article - Google Patents

Abstract

A composition is provided that includes a filler, a first curable material, and a second curable material. The first curable material may include an alcohol and an anhydride. At a first temperature (T1) the first curable material may cure and the second curable material may have a degree of conversion that is less than 50 percent. Associated article and method are provided also.

Description

200811237 IX. Description of the Invention [Technical Field to Which the Invention Is Alonged] The present invention includes a system relating to a composition. The invention includes systems relating to the manufacture and use of the compositions. [Prior Art] The capillary phenomenon primer resin can fill the gap between the wafer and the substrate to improve the fatigue life of the solder bumps in the assembly. Although the capillary resin can improve reliability, it requires additional processing steps when using them, thereby reducing manufacturing productivity. Some primers may be applied without flow (η 〇 - f 10-W ) primer (N F U ) and wafer level primer (WLU). The NFU needs to have a viscosity suitable for the flow phase. The WLU is required to have a solid resin system (B-stage silicone) after application to the wafer without interfering with wafer dicing into individual wafer operations. To achieve the solid resin system required for WLU, a solvent based resin system or a partially advanced polymerizable resin system can be used. Solvent-based resin systems can cause void formation due to incomplete solvent removal. Partially advanced polymerizable resins may cause premature curing of the resin and reduce reflow characteristics. A solid resin system that can be used as a WLU with different properties and/or characteristics from currently available resin systems is desirable. It is also desirable to form a solid resin system that can be used as a WLU with different properties and/or characteristics from currently available resin systems. 200811237 SUMMARY OF THE INVENTION Brief Description > In one system, the present invention provides a composition. The composition includes a dip material, a first curable substance, and a second curable substance. The first curable materials include alcohols and anhydrides. At the first temperature (T i ), the first curable material will solidify and the second curable material will have a conversion of less than 50%. In one system, the invention provides an article. The article includes a wafer, a substrate, and a primer material disposed between the wafer and the substrate. The primer material comprises a composition. The composition includes a dip material, a first curable substance, and a second curable substance. The first curable material includes alcohol 'and anhydride. At the first temperature (Ti), the first curable material will solidify and the second curable material will not cure. In one system, the present invention provides a method. The method comprises: preparing a B-stageable composition. The B-staged composition includes a dip material, a first curable material, and a second curable material. The first curable materials include alcohols and anhydrides. At the first temperature (T i ), the first curable material will solidify and the second curable material will have a conversion of less than 50%. The method further includes contacting the substrate with a B-staged composition, contacting the circuit device with the B-stageable composition, and curing the B-stageable composition. DETAILED DESCRIPTION The present invention includes systems associated with compositions. The present invention includes systems related to the manufacture of -6 - 200811237 and the use of the composition. In the following description and claims, reference will be made to several specific terms having the following definitions. The singular terms "a", "the", "the" and "the" are meant to refer to the plural referents, unless the context clearly indicates otherwise. The wording of the phrase used herein and throughout the specification and claims is intended to be a Therefore, the number modified by the term "about" is not limited to the exact number specified. In some cases, the graceful wording may correspond to the accuracy of the instrument for measurement. Similarly, "not contained" can be used in several languages and can include insubstantial numbers, or minor amounts, yet can still be considered as containing no modified terms. For example, no solvent, and similar terms and phrases may refer to the case where a significant portion, some, or all of the solvent has been removed from the solvate. The terms "may" and "may" as used herein mean the possibility of occurrence in a group of circumstances; the possibility of possessing the nature, characteristics or function of the property; and/or the ability to express another verb, potential Ability, or possibility, to characterize the other verb. Therefore, the use of "may" and "may" means that the modified term is clearly appropriate, possible or suitable for the indicated ability, function or usage, however, it is considered that in some cases, the Modified terms may sometimes be inappropriate, incapable or unsuitable. For example, in some cases, an event or ability can be expected, but in other cases, the event or ability does not occur. This difference is captured by the terms "may" and "possible". . B-stage refers to a curing stage of a curable substance, wherein 200811237, for example, the substance may be rubbery, solid, or dry to the touch, or may be both solid and dry to the touch, and It may have partial solubility in the solvent. The B-stage of the curable substance, or related terms and phrases, may include: at least partially curing a substance by curing the first of the plurality of curable substances in the mixture of substances having different curing properties , come on. Finger touch drying refers to a surface that does not have a pressure-sensitive adhesive at room temperature. For one of the evaluation criteria, the dry surface of the fingertip does not adhere or adhere to the finger that is in light contact with it at 25 °C, or the Dahlquist criterion shows the storage modulus (G). The ') system is greater than about 3 x 1 05 Pascals (measured at room temperature at 10 sec/sec). Solid state is a property in which a substance does not have a visible flow under moderate stress, or a property that is resistant to one or more forces (eg, compression or stretching) that may tend to deform it. . In one aspect, the determined size and shape can be maintained under normal conditions. The stability used in the specification and the scope of the patent application refers to the viscosity measured after mixing of the mixture of solid and curable substance and after mixing for a period of time (for example, after weeks, two weeks, etc.) The ratio of the viscosity. The composition of one of the systems according to the invention comprises a first curable substance and a second curable substance. The first curable substance will solidify in response to the first stimulus, and the second. curable substance will not respond to the first stimulus. In a system, the first stimulus can include exposure to energy selected from the group consisting of: thermal energy or electromagnetic radiation. Thermal energy can include: applying heat to the first curable material to cause an increase in the temperature of the first curable material. Electromagnetic radiation includes: ultraviolet light, electron beam, or microwave radiation. In a system, the second curable substance will solidify in response to a second stimulus, wherein the second stimulus is different from the first stimulus. In a system, the two stimuli may be completely different, for example, the first curable substance may be heated to a specific temperature at which the second curable substance does not cure. Curing; then curing the second curable substance by ultraviolet radiation. In a system, the two stimuli may comprise the same type of energy (thermal or electromagnetic), however, the extent or amount of energy applied is different. For example, the first curable material can be cured by heating to the first temperature, while the second curable material can only be cured at a higher temperature (not T). A curable substance can refer to a substance having one or more reactive groups that may participate in a chemical reaction upon exposure to one or more of thermal energy, electromagnetic radiation, or chemicals. The curable substance may include: a monomer species, an oligomer species, a mixture of monomer species, a mixture of oligomer species, a polymer species, a mixture of polymer species, a partially crosslinked species, a mixture of partially crosslinked species, Or a mixture of two or more of the former. The curing system may refer to a reaction which causes polymerization, crosslinking, or simultaneous polymerization and crosslinking of a curable substance having one or more reactive groups. Cured may refer to a curable substance with a reactive group in which more than 50% of the reactive groups have solidified or the conversion of the curable material is in the range of greater than about 50%. Conversion rate refers to the percentage of the total number of reactive groups in the total number of reactive groups. In a system, after a period of about one hour or more, the conversion of the first curable-9-200811237 material is greater than about 50% at the first temperature and at the first temperature, second The conversion rate of the curable material is less than about 1%. In a system, after a period of about one hour or more, at a first temperature, the conversion of the first curable substance is greater than about 50% 'and at the first temperature, the second curable substance The conversion rate is less than about 20%. In a system, after a period of about one hour or more, the conversion rate of the first curable substance is greater than about 60% at the first temperature, and the second curable substance is at the first temperature. The conversion rate is less than about 1%. In a system, after a period of about one hour or more, at a first temperature, the conversion of the first curable substance is greater than about 60%, and at the first temperature, the second curable The conversion rate of the substance is less than about 20%. In a system, after a period of about one hour or more, the conversion rate of the first curable substance is greater than about 75% at the first temperature, and the second curable substance is at the first temperature. The conversion rate is less than about 1%. In a system, after a period of about one hour or more, at a first temperature, the conversion of the first curable substance is greater than about 75 %, and at the first temperature, the second curable The conversion rate of the substance is less than about 20%. In a system, after a period of about 2 hours or more, the conversion rate of the first curable substance is greater than about 50% at the first temperature, and at the first temperature, the second curable substance The conversion rate is less than about 10%. In a system, after a period of about 5 hours or more, the conversion rate of the first curable substance is greater than about 50% at the first temperature, and at the first temperature, the second curable substance The conversion rate is less than about 10%. The scope limitations are to be combined and/or interchangeable herein and throughout the specification and claims. The specific scope includes all sub-ranges contained in -10- 200811237, unless otherwise indicated in the sentence. The curing temperature may depend on one or more of the following: the reactive group, for example, the reactivity of the alcohol and anhydride in the first curable substance, or the presence or absence of a curing agent (eg, a catalyst), The first curable material can be cured at a first temperature (Ti) below about 50 °C. In a system, the first material may be in the range of from about 50 ° C to about 75 ° C, in the range of about 75 ° C ° C, or in the range of from about 10 ° C to about 150 ° C. Cured under (T!). In a system, the first curable layer is cured at a temperature below the first temperature (Τ χ ) in the range of about 150 ° C. The first curable material is especially about 50. Curing at °C to the first temperature (Ti) in the range. In the first system, the first curable substance can be cured under the (τ 2 ) temperature, which is higher than the first temperature (T i ) system, the second temperature and the first temperature The difference between the two can be in the range of 100 °c. In a system, the difference between the second temperature and the first may be in the range of greater than about 75 °C. The difference between the two temperatures and the first temperature can be greater than approximately. In a 'system', the first * temperature and the other one's temperature may be in the range of greater than about 25 °C. In a system, the second curable material can be cured at a second temperature (T 2 ) in the range of small T:. In a system, two kinds of curable substances can be cured at a temperature of about 150 ° C to about 175 ° C. Within the scope of one, one can hold up to about 100 temperature substances. In one unit of about 150 ° C, the two temperatures are integrated in more than about one temperature system, and the difference between the 50 ° C degrees is about 150, within the range, about -11 - 200811237 1 7 5 . (: to a range of about 200 ° C, about 200 ° C to about 250 ° C, about 250 ° C to about 275 ° C, or about 275 ° C to about 300 Curing at a second temperature (T2) in the range of °C. In a system, the second curable material can be cured at a second temperature (Τ2) above about 30 TC. In a system, the second curable material will cure, in particular, at a second temperature (Τ2) in the range of from about 150 ° C to about 300 ° C. The first curable material includes Alcohols and anhydrides. In one system, the alcohol may comprise a compound having one or more hydroxyl functional groups. In one system, the anhydride may comprise a compound having one or more cyclic anhydride functional groups. The anhydride functional group may comprise a closed ring structure having an anhydride group and having a ring number of 4 or more carbons. The conversion of the first curable substance may depend on one or more of the following: hydroxyl group number relative to ring The ratio of the number of anhydride groups, the reactivity of the alcohol, or the reactivity of the anhydride. In a system, the ratio of the number of hydroxyl groups to the cyclic anhydride group is less than 1/3. In a system, the ratio of the number of hydroxyl groups to cyclic anhydride groups is in the range of about 1/3 to about 1/2, in the range of about 1/2 to about 2/3, and about 2/3 to Within the range of about 1/1, about 1/1 to about 3/2, about 372 to about 2/1, about 2/1 to about 8/3, or about 8/3 to about 3 / In the range of 1. In a system, the ratio of the number of hydroxyl groups to cyclic anhydride groups is in the range of greater than about 3/ 1. Suitable alcohols may include one or more of the following: hydroxyl functionalized lipids Group, cycloaliphatic, or aromatic materials. Aliphatic radicals, aromatic radicals, and cycloaliphatic radicals can be defined as follows: aliphatic radicals having at least one carbon atom, at least one valence, having -12-200811237 organic radicals And may be a linear or a chain of atoms. The aliphatic atom may include a hetero atom such as nitrogen, sulfur, helium, selenium, and oxygen, or may be composed only of carbon and hydrogen. The aliphatic atom group may include a wide range. Functional group, such as alkyl, cantyl, fast-radical, halogen-based, conjugated di-candiyl, alcohol-based, acid-based, aldehyde-based, keto-based, carboxylic acid-based, thiol-based (eg, carboxy Derivatives such as esters and guanamines, amines, nitro groups, etc. For example, a 4-methylpent-1-yl radical is a C6 aliphatic radical containing a methyl group, the methyl functional group, It is a monoalkyl group. Similarly, a 4-nitrobut-1-yl group contains a C4 aliphatic atomic group of a nitro group, and the nitro group functional group may have one or more identical or different A haloalkyl group of a halogen atom. The halogen atom includes, for example, fluorine, chlorine, bromine, and iodine. The aliphatic atom group having one or more halogen atoms includes an alkyl halide: a trifluoromethyl group, a bromodifluoromethyl group. , chlorodifluoromethyl, hexafluoroisopropylidene, chloromethyl, difluorovinylidene, trichloromethyl, bromodichloromethyl, bromoethyl, 2-bromotrimethylene (for example, -CH2CHBrCH2-) and so on. Other examples of aliphatic radicals include: allyl, aminecarbonyl (-CONH2), carbonyl, dicyanoisopropylidene (-CH2C(CN)2CH2-), methyl (-CH3), methylene (- 〇112-), ethyl, ethyl, methyl ketone (-CHO), hexyl, hexamethylene, hydroxymethyl (-CH2OH), mercaptomethyl (-CH2SH), methylthio (-SCH3) , methylthiomethyl (-ch2sch3), methoxy, methoxycarbonyl (CH3OCO-), nitromethyl (-CH2N02), thiocarbonyl, trimethyldecyl ((CH3)3Si-), third Butyl dimethyl decyl, trimethoxy decyl propyl ((CH 3 ) 3 SiCH 2 CH 2 CH 2 -), vinyl, vinylidene, and the like. In a further example, the "C1-C3G aliphatic atomic group" contains one but not more than 30 carbon atoms to -13-200811237. The methyl group (CH3-) is an example of a Cl aliphatic group. A mercapto group (CH3(CH2)9-) is an example of a C1G aliphatic group. The aromatic atomic group is an atomic arrangement having at least one valence and having at least one aromatic group. It may contain heteroatoms such as nitrogen, sulfur, selenium, sand and oxygen, or may consist solely of carbon and hydrogen. Suitable aromatic radicals may include: phenyl, pyridyl, furyl, thienyl, naphthyl, phenylene, and biphenyl radicals. The aromatic group may be a cyclic structure having 4n + 2 "delocalized electrons", wherein "η" is an integer of 1 or more, such as phenyl (n = 1), thienyl (n=l), furyl (n=l), naphthyl (n = 2), moji (n = 2), sulfhydryl (n = 3), etc. are exemplified. The aromatic radical can also include non-aromatic moieties. For example, the benzyl group can be an aromatic atom group including a benzene ring (aromatic group) and a methylene group (non-aromatic moiety). Similarly, a tetrahydronaphthyl group is an aromatic atom group containing an aromatic group (C6H3) fused to a non-aromatic moiety -(CH2)4-. The aromatic atom group may include one or more functional groups such as an alkyl group, an alkenyl group, an alkynyl group, a haloalkyl group, a halogenated aromatic group, a conjugated diene group, an alcohol group, an ether group, an aldehyde group. A ketone group, a carboxylic acid group, a thiol group (for example, a carboxylic acid derivative such as an ester and a guanamine), an amine group, a nitro group or the like. For example, a 4-methylphenyl atom group is a C7 aromatic atom group containing a methyl group, and the methyl group functional group is an alkyl group. Similarly, the 2-nitrophenyl group is a C6 aromatic atom group containing a nitro group which is a functional group. The aromatic atom group includes: a halogenated aromatic atom group such as trifluoromethylphenyl group, hexafluoroisopropylidene bis(4-phenyl-1-yloxy) (-〇PhC(CF3)2PhO〇, chlorine Methylphenyl-14- 200811237, 3-trifluorovinyl-2-thienyl, 3-trichloromethylphenyl-1-yl (3-CCl3Ph-), 4-(3-bromopropan-1- Benzyl-1-yl (BrCH2CH2CH2Ph-), etc. Other examples of aromatic radicals include: 4-allylbenzene-1-oxy, 4-aminophenyl-1-yl (H2NPh-), 3- Aminocarbonylbenzene-1-yl (NH2COPh-), 4-benzylmercaptophenyl-1-yl, dicyanoisopropylidene bis(4-phenyl-1-yloxy)(-OPhC(CN)2PhO -), 3-methylphenyl-1-yl, methylenebis(phenyl-4-yloxy)(-OPhCH2PhO-), 2-ethylphenyl-1-yl, phenylvinyl, 3-methyl Mercapto-2-thienyl, 2-hexyl-5-furanyl, hexamethylene-1,6-bis(phenyl-4-yloxy)(-OPh(CH2)6PhO-), 4-hydroxyl Phenyl-1-yl (4-HOCH2Ph-), 4-mercaptomethylphenyl-1-yl (4-HS-CH2Ph-), 4-methylthiophenyl-1-yl (4-CH3SPh-) , 3-methoxybenzene-byl, 2-methoxycarbonylphenyl-1-yloxy (eg, methyl o-hydroxybenzyl), 2- Methylphenyl-1-yl (-PhCH2N02), 3-trimethyldecylphenyl-1-yl, 4-tert-butyldimethylammoniophenyl-1-yl, 4-vinylbenzene-1 - a vinylidene bis(phenyl) group, etc. The term "C3-C3.aromatic radical" includes an aromatic radical containing at least 3 but not more than 30 carbon atoms. Aromatic radical 1-imidazole The group (C3H2N2-) represents a C3 aromatic atom group. The benzyl group (C7H7-) represents a C7 aromatic atom group. The cycloaliphatic atom group has an atomic group having at least one valence and having a cyclic but non-aromatic atom arrangement. The radical may comprise one or more acyclic moieties. For example, a cyclohexylmethyl (C6HMCH2-) is a cycloaliphatic radical comprising a cyclohexyl ring (a cyclic but non-aromatic atomic arrangement) and a methylene group (non- Cycloaliphatic radicals may contain heteroatoms such as nitrogen, sulfur, selenium, tellurium, and oxygen, or may be composed solely of carbon and hydrogen. Cyclo-15-200811237 aliphatic radicals may include one or more Functional groups, such as, for example, a hospital base, a stilbene group, an alkynyl group, a halogen-based group, a conjugated di-storage group, an alcohol group, an ether group, a ketone group, a ketone group a base, a decanoic acid group, a fluorenyl group (for example, a carboxylic acid derivative such as an ester and an amine), an amine group, a nitro group, etc. For example, a '4-methylcyclopentane-:ι-based group is included a C 6 cycloaliphatic atomic group of a methyl group, which is a member of the alkyl group. Similarly, the 2-nitrocyclobutane-yl radical is a C4 cycloaliphatic radical containing a nitro group, which is a nitro functional group. The cycloaliphatic radical may comprise one or more identical or mutually different halogen atoms. The halogen atom includes, for example, fluorine, chlorine, bromine, and iodine. A cycloaliphatic radical having one or more halogen atoms includes: 2-trifluoromethylcyclohex-1-yl, 4-bromodifluoromethylcyclooct-1-yl, 2-chlorodifluoromethyl Cyclohex-1-yl, hexafluoroisopropylidene 2,2-bis(cyclohex-4-yl)(-C^HwCCCFshCsHio-), 2-chloromethylcyclohex-1-yl; 3- - Fluoromethylenecyclohex-1-yl, 4-trichloromethylcyclohex-1-yloxy, 4-bromodichloromethylcyclohex-1-ylthio, 2-bromoethyl Cyclopent-1-yl, 2-bromopropylcyclohex-1-yloxy (for example, CH3CHBrCH2C6Hi.-) and the like. Other examples of cycloaliphatic radicals include: 4-allyl cyclohex-1-yl, 4-aminocyclohex-1-yl (H2NC6H1Q-), 4-aminocarbonylcyclopent-1-yl (NH2COC5H8- , 4·Ethyloxycyclohex-1-yl, 2,2-dicyanoisopropylidene bis(cyclohex-4-yloxy)(-OCsHioCCCNhC^HioO-), 3-methyl Cyclohex-1-yl, methylene bis(cyclohex-4-yloxy)(-0C6H1GCH2C6H1()0-), 1-ethylcyclobutan-1-yl, cyclopropylvinyl, 3-methyl Mercapto-2-tetrahydrofuranyl, 2-hexyl-5-tetrahydrofuranyl, hexamethylene-1,6-bis(cyclohex-4-yloxy)(-OCsHiiKCKbhC^HioO-), 4- Hydroxymethylcyclohex-1-yl (4-HOCH2C6Hi() - ), 4-mercaptomethyl-16- 200811237 cyclohex-1-yl (4-HSCH2C6H1()-), 4-methylthio ring Benzyl-(4-CH3SC6H1()-), 4-methoxycyclohex-1-yl, 2-methoxycarbonylcyclohexyl-buyloxy (2-CH3OCOC6H1()0-), 4-nitrate Methylcyclohexyl-buyl (N02CH2C6H1()-), 3-trimethyldecylcyclohex-1-yl, 2-tert-butyldimethylamylcyclopentan-1-yl, 4-trimethyl Oxidylalkylethylcyclohexyl-1-yl (eg, (CH30)3SiCH2CH2C6H1()-), 4- Alkenyl cyclohexene-1-yl, ethenylene bis (cyclohexyl) and the like. The term "C3-C3G cycloaliphatic radical" includes radicals containing at least 3 but no more than 10 carbon atoms. The cycloaliphatic radical 2-tetrahydrofuranyl (C4H70-) is a representative example of one of the C4 cycloaliphatic atoms. A cyclohexylmethyl group (C^HnCHb-) is a representative example of one of the C7 cycloaliphatic radicals. In a system, the average number of hydroxyl groups relative to each alcohol molecule can be in the range of about one. In a system, the average number of hydroxyl groups relative to each alcohol molecule can be in the range of about 2. In a system, the average number of hydroxyl groups relative to each alcohol molecule can be in the range of about 3. In a system, the average number of hydroxyl groups relative to each alcohol molecule can be in the range of greater than about 3. In a system, the alcohol can include an aliphatic material. The aliphatic material may be a linear, branched or cycloaliphatic group. Suitable aliphatic alcohols may include one or more of the following: ethylene glycol; propylene glycol; 1,4-butanediol; 2,2-dimethyl-1,3-propanediol; 2-ethyl, 2-methyl Base, 1,3-propanediol; 1,3- and 1,5-pentanediol; dipropylene glycol; 2-methyl-1,5-pentanediol; 1,6-hexanediol; dimethanol decalin Dimethanol dicyclooctane; 1,4-cyclohexanedimethanol; triethylene glycol; 1,1 decyl-octanediol; dihydroxybiphenyl; bisphenol; glycerol; trimethylolpropane; Methyl ethane; pentaerythritol; sorbitol; polyether diol; and derivatives of -17-200811237. In a system, the alcohol can include a hydroxy-functional aromatic species. Suitable hydroxy-functional aromatic materials may include structural units of formula (I):

(I) HO-G-OH wherein G may be a divalent aromatic atomic group. In a system, at least about 50% of the total number of G groups can be an aromatic organic atomic group, and the remainder can be an aliphatic, cycloaliphatic, or aromatic organic atomic group. In a system, G may comprise a structural unit represented by the formula (II):

(R2)m I (R!)P I (R3)m I I V ! 1 ϊ t lit S Y (II)

Wherein Y represents an aromatic atom group such as a phenyl group, a phenyl group, or a naphthyl group. E can be a bond or an aliphatic radical. In a system, E is a bond, and the alcohol is dihydroxybiphenyl. In a system, E can be an aliphatic radical such as an alkyl or alkylene radical. Suitable alkylene or alkylene radicals may include: methylene, ethyl, ethylene, propyl, propylene, isopropylidene, butyl, butylene, isobutylene, Pentyl, pentylene, and isopentylene. When E is an alkyl or alkylene group, it may also consist of two or more alkyl or alkylene groups bonded together by molecular moieties different from alkyl or alkylene groups. For example, an aromatic linkage; a tertiary amine linkage; an ether linkage; a carbonyl linkage; a ruthenium containing linkage (such as a decane or a decyloxy group); or a sulfur-containing linkage (such as a sulfide, a sub砺 or 飒); or a phosphorus-containing linkage (such as phosphonium or phosphine -18-200811237 base). In a system, E can be a cycloaliphatic radical. Suitable cycloaliphatic radicals may include: cyclopentylene, cyclohexylene, 3,3,5-dimethylcyclohexylene, methylcyclohexylene, 2-{2·2·1}-bicyclic Heptyl, neopentylene, cyclopentadecyl, cyclododedodecyl, and adamantyl. R1 independently represents hydrogen, a monovalent aliphatic atom group, a monovalent cycloaliphatic atomic group, or a monovalent aromatic atom group, such as an alkyl group, an aryl group, an arylalkyl group, an alkylaryl group, a cycloalkyl group, or two, in each case. Cycloalkyl. R2 and R3 are independently shown in each case: halogen, such as fluorine, bromine, chlorine and iodine; tertiary nitrogen group, such as dimethylamino; a group such as R1 as described above; or alkoxy For example, OR4, wherein R4. may be an aliphatic, cycloaliphatic or aromatic atomic group. The letter "m" is any integer between 0 (including 0) and the number of positions that can be replaced by Y; "P" indicates an integer between 〇 (including 0) and the number of positions that can be replaced on E; "t" An integer at least equal to 1; "s" can be 0 or 1; and "u" is any integer including 〇. In the structure of formula (II), when more than one of the 2 or 3 substituents are present, the substituents may be the same or different. For example, the R1 substituent can be a combination of different halogens. Where more than one R1 substituent is present, the R1 substituents may be the same or different. When "s" can be 〇 and "u" is not 〇, the aromatic ring can be directly bonded without intervening alkylene or other bridge linkages. The position of the hydroxyl group, R2 or R3 on the aromatic core residue Y may have an ortho, meta and para position, and the combination may be in a contiguous, asymmetric or symmetrical relationship, wherein two or more hydrocarbon residues are present. The ring carbon atoms may be substituted by a hydroxyl group, an R2 or R3 atom group. Suitable hydroxy-functionalized aromatic compounds may include one or more of the following: -19-200811237: 1,1-bis(4-hydroxyphenyl)cyclopentane; 2,2-bis(3-allyl- 4-hydroxyphenyl)propane; 2,2-bis(2-tert-butyl-4-hydroxy-5-methylphenyl)propane; 2,2-bis(3-tert-butyl-4-hydroxyl) -6-methylphenyl)propane; 2,2-bis(3_t-butyl-4-hydroxy-6-methylphenyl)butane; 1,3-bis[4-hydroxyphenyl-1 - (1-methylethylidene)]benzene; 1,4-bis[4-hydroxyphenyl-1-(1-methylmethylene)]benzene; 1,3_bis[3-third 4-hydroxy-6-methylphenyl-1-(1-methylethylidene)]benzene, 1,4-bis[3-dibutyl-4-transyl-6-methylphenyl -1-(1-methylethylidene)]benzene; 4,45-dihydroxybiphenyl; 2,2',6,8-tetramethyl-3,3 ',5,5'-tetrabromo -4,4'-dihydroxybiphenyl; 2,2',6,6'-tetramethyl-3,3',5-tribromo-4,4'-dihydroxybiphenyl; 1,1- Bis(4-hydroxyphenyl)-2,2,2-trichloroethane; 2,2-bis(4-hydroxyphenyl-1,1,1,3,3,3-hexafluoropropane); , 1-bis(4-hydroxyphenyl)-1-cyanoethane; 1,1-bis(4-hydroxyphenyl)dicyanomethane; 1-bis(4-hydroxyphenyl)-1-oxy-1-phenyl-methyl; 2,2-bis(3-methyl-4-phenyl)propyl; 1,1_double (4 -hydroxyphenyl)-n-decene; 9,9-bis(4-hydroxyphenyl)anthracene; 3,3-bis(4-hydroxyphenyl)phenylhydrazine; 1,2-bis(4-hydroxyphenyl)B Alkenes; 1,3-bis(4-hydroxyphenyl)propenone; bis(4-hydroxyphenyl) sulfide; 4,4'-oxydiphenol; 4,4-bis(4-hydroxyphenyl) Valeric acid; 4,4-bis(3,5-dimethyl-4-hydroxyphenyl)pentanoic acid; 2,2-bis(4-hydroxyphenyl)acetic acid; 2,4'-dihydroxyphenylmethane ; 2-bis(2-hydroxyphenyl)methane; bis(4-hydroxyphenyl)methane; bis(4-hydroxy-5-nitrophenyl)methane; bis(4-hydroxy-2,6-dimethyl 3-methoxyphenyl)methane; 1,1-bis(4-hydroxyphenyl)ethane; 1,1-bis(4-hydroxy-2-chlorophenyl)ethane; 2,2- Bis(4-hydroxyphenyl)propane (bisphenol-indole); 1,1-bis(4-hydroxyphenyl)propane; 2,2-bis(3-chloro-4-hydroxy-20- 200811237 phenyl Propane; 2,2-bis(3-bromo-4-hydroxyphenyl)propane; 2,2-bis(4-hydroxy-3-tolyl)propane; 2,2-bis(4-hydroxy-3) -isopropylphenyl)propane; 2,2-double (3-third 2-hydroxyphenyl)propane; 2,2-bis(3-phenyl-4-hydroxyphenyl)propane; 2,2-bis(3,5-dichloro-4-hydroxyphenyl)propane 2,2-bis(3,5-dibromo-4-hydroxyphenyl)propane; 2,2-bis(3,5-dimethyl-4-hydroxyphenyl)propane; 2,2-double (3-Chloro-4-hydroxy-5-methylphenyl)propane; 2,2-bis(3-bromo-4-hydroxy-5-methylphenyl)propane; 2,2-dual (3 -Chloro-4-hydroxy-5-isopropylphenyl)propane; 2,2-bis(3-bromo-4-hydroxy-5-isopropylphenyl)propane; 2,2-dual (3 - tert-butyl-5-chloro-4 -benzinyl); 2,2-bis(3-indolyl-5-t-butyl-4-hydroxyphenyl)propane; 2,2-double (3-Chloro-5-phenyl-4-hydroxyphenyl)propane; 2,2-bis(3-bromo-5-phenyl-4-hydroxyphenyl)propane; 2,2-double (3 ,5-diisopropyl-4-hydroxyphenyl)propane; 2,2-bis(3,5-di-t-butyl-4-hydroxyphenyl)propane; 2,2-bis(3,5- Diphenyl-4-hydroxyphenyl)propane; 2,2-bis(4-hydroxy-2,3,5,6-tetrachlorophenyl)propane; 2,2-bis(4-hydroxy-2,3 ,5,6-tetrabromophenyl)propane; 2,2-bis(4-hydroxy-2,3,5,6-tetramethylphenyl)propane; 2,2-bis(2,6-di Chloro-3,5-di Methyl-4-hydroxyphenyl)propane; 2,2-bis(2,6-dibromo-3,5-dimethyl-4-hydroxyphenyl)propane; 2,2-bis(4-hydroxyl) 3-ethylphenyl)propane; 2,2-bis(4-hydroxy-3,5-dimethylphenyl)propane; 2,2-bis(3,5,3',5'-tetrachloro 4-,4'-dihydroxyphenyl)propane; 1,1-bis(4-hydroxyphenyl)cyclohexylmethane; 2,2-bis(4-hydroxyphenyl)-1-phenylpropane; ,1-bis(4-hydroxyphenyl)cyclohexane; 1,1-bis(3-chloro-4-hydroxyphenyl)cyclohexane; 1,1-bis(3-bromo-4-hydroxyl) Phenyl)cyclohexane; 1,1-bis(4-hydroxy-3-methylphenyl)cyclohexane; -21 - 200811237 1,1-bis(4-hydroxy-3-isopropylphenyl) Cyclohexane; 1,1-bis(3-tert-butyl-4-hydroxyphenyl)cyclohexane; 1,1-bis(3-phenyl-4-hydroxyphenyl)cyclohexane; 1J- Bis(3,5-dichloro-4-hydroxyphenyl)cyclohexane; 1,1-bis(3,5-dibromo-4-hydroxyphenyl)cyclohexane; 1, Bu (3) ,5-dimethyl-4-hydroxyphenyl)cyclohexane; 4,4'-[1-methyl-4-(1-methylethyl)-1,3-cyclohexanediyl] Phenol (1,3 BHPM) ; 4-[1_[3-(4-hydroxyphenyl)-4-methylcyclohexyl]-1_methyl-ethyl]- Phenol (2,8 BHPM); 3,8-dihydroxy-5 a,1 0 b -diphenyl oxalate base-2 ',3 ',2,3 - 薰草院(c 〇um ar an e (DCBP); 2-phenyl-3,3-bis(4-hydroxyphenyl)benzamide; 1,1-bis(3-chloro-4-hydroxy-5-methylphenyl) Cyclohexane; 1,1-bis(3-bromo-4-hydroxy-5-methylphenyl)cyclohexane; 1,1-bis(3-chloro-4-hydroxy-yl-5-iso Propyl phenyl)cyclohexane; 1,1-bis(3-bromo-4-hydroxy-5-isopropylphenyl)cyclohexane; 1,1_bis(3-tert-butyl-5 -Chloro-4-hydroxyphenyl)cyclohexane; 1,1-bis(3-bromo-5-t-butyl-4-hydroxyphenyl)cyclohexane; 1,1_bis(3- Chloro-5-phenyl-4-hydroxyphenyl)cyclohexane; 1,1-bis(3-bromo-5-phenyl-4-hydroxyphenyl)cyclohexane; 1,1-double ( 3,5-diisopropyl-4-hydroxyphenyl)cyclohexane; 1,1-bis(3,5-di-t-butyl-4-hydroxyphenyl)cyclohexane; 1,1_double (3,5-diphenyl-4-hydroxyphenyl)cyclohexane; 1,1-bis(4-hydroxy-2,3,5,6-cis-chlorophenyl)cyclohexane; 1,1- Bis(4-hydroxy-2,3,5,6-tetrabromophenyl)cyclohexane; 1,1-bis(4-hydroxy-2,3,5,6-tetramethylphenyl)cyclohexane 1,1-bis(2,6-dichloro-3,5-dimethyl-4-hydroxyphenyl)cyclohexane; 1,1-bis(2,6-dibromo-3,5 -dimethyl-4-hydroxyphenyl)cyclohexane; 1,1-bis(4-hydroxyphenyl)-3,3,5-trimethylcyclohexane; 1,1-bis(3-chloro 4-hydroxyphenyl)-3,3,5-trimethylcyclohexane; 1,1-bis(3--22- 200811237 bromo-4-hydroxyphenyl)-3,3,5- Trimethylcyclohexane; 1,1-bis(4-hydroxy-3-methylphenyl)-3,3,5-trimethylcyclohexane; 1,1-bis(4-hydroxy-3- Isopropylphenyl)-3,3,5-trimethylcyclohexane; 1,1-bis(3-tert-butyl-4-hydroxyphenyl)-3,3,5-trimethylcyclo Hexane; 1,1-bis(3-phenyl-4-hydroxyphenyl)-3,3,5-trimethylcyclohexane; 1,1-bis(3,5-dichloro-4- Hydroxyphenyl)- 3.3.5-trimethylcyclohexane; 1,1-bis(3,5-dibromo-4-hydroxyphenyl)- 3.3.5-trimethylcyclohexane; 1-bis(3,5-dimethyl-4-hydroxyphenyl)-3.3.5-trimethylcyclohexane; 1,1-bis(3-chloro-4-hydroxy-5-methylbenzene -3,3,5-trimethylcyclohexane; 1,1-bis(3-bromo-4-hydroxy-5-methylphenyl)-3,3,5-trimethylcyclohexane Alkane; 1,1-bis(3-chloro-4-hydroxy-5-iso Propyl phenyl)-3,3,5-trimethylcyclohexane; 1,1-bis(3-bromo-4-hydroxy-5-isopropylphenyl)-3,3,5-three Methylcyclohexane; 1,1-bis(3-tert-butyl-5-chloro-4-hydroxyphenyl)-3,3,5-trimethylcyclohexane; 1,1-double ( 3-bromo-5-t-butyl-4-hydroxyphenyl)-3,3,5-trimethylcyclohexane; bis(3-chlorophenyl-5-phenyl-4-hydroxyphenyl) 3,3,5-trimethylcyclohexane; U-bis(3-bromo-5-phenyl-4-hydroxyphenyl)-3,3,5-trimethylcyclohexane; 1,1 -bis(3,5-diisopropyl-4-hydroxyphenyl)-3,3,5-trimethylcyclohexane; 1,1-bis(3,5-di-t-butyl-4- Hydroxyphenyl)-3,3,5-trimethylcyclohexane; 1,1-bis(3.5-diphenyl-4-hydroxyphenyl)-3,3,5-trimethylcyclohexane; 1,1-bis.(4-hydroxy-2,3,5,6-tetrachlorophenyl)-3,3,5-trimethylcyclohexane; 1,1-bis(4-hydroxy-2, 3,5,6-tetrabromophenyl)-3,3,5-trimethylcyclohexane; 1,1-bis(4-hydroxy-2,3,5,6-tetramethylphenyl)- 3,3,5-trimethylcyclohexane; 1, bis(2,6-dichloro-3,5-dimethyl-4-hydroxyphenyl)-3,3,5-trimethyl Cyclohexane; 1,1-bis(2,6-dibromo-3,5-dimethyl-4-hydroxyphenyl)--23- 200811237 3,3,5-trimethylcyclohexane; 4,4-bis(4-hydroxyphenyl)heptane; I1·bis(4-hydroxyphenyl)decane; 1,1-bis(4-hydroxyl Phenyl)cyclododecane; 1,1 -bis(3,5-dimethyl-4-hydroxyphenyl)cyclododecane; 4,4,-dihydroxy-1, buphenyl; 4,4 ,-Dihydroxy-3,3,-dimethyl-1,b-biphenyl; 4,4'-di-based-3,3,-dioctyl-15; 1-biphenyl; 4,4,- (3,3,5-trimethylcyclohexylidene)-phenol; 4,4,-bis(3,5-dimethyl).diphenol; 4,4,-dihydroxydiphenyl ether; 4,-dihydroxydiphenyl sulfide; 1,3-bis(2-(4-hydroxyphenyl)_2-propylφ)benzene; 1,3-bis(2-(4-hydroxy-3-) Phenyl phenyl)-2-propyl)benzene; 1,4-bis(2-(4-hydroxyphenyl)-2-propyl)benzene; 1,4-bis(2-(4-complexyl-3) -methylphenyl)-2-propyl)benzene; 2,4,-dihydroxyphenylhydrazine; 4,4'. dihydroxydiphenylphosphonium (BPS); bis(4-hydroxyphenyl)methane; 2,6_-hydroxynaphthalene; benzenediol; resorcinol; resorcinol substituted by C1 alkyl; 3 - (4-hydroxyphenyl)-1,1,3-trimethylhydroquinone-5 - alcohol; Bu (4 - via the base) -1,3,3-trimethylhydrogen -5-alcohol; 4,4-dihydroxydiphenyl ether; 4,4-dihydroxy-3,3-dichlorodiphenyl ether; 4,4-dihydroxy-2,5-di-diphenyl • ether; 4,4-thiodiphenol; 2,2,2,,2,-tetrahydro-3,3,3,,3'-tetramethyl-1,1,-spiro[1H-茚]-6,6,-diol; and mixtures thereof. In one system, the amount of alcohol present may range from about 5% by weight to about 10% by weight of the composition, from about 1% by weight to about 20% by weight of the composition, about 20%. It is in the range of from about 3% by weight to about 30% by weight, or from about 30% by weight to about 40% by weight of the composition. In one system, the amount of alcohol present may range from about 40% by weight to about 50% by weight of the composition, from about 50% by weight to about 60% by weight of the composition, and about 6% of the composition. 0 weight ° /. It is in the range of about 70% by weight, or about 70% by weight to about 80% by weight of the composition -24 - 200811237. Within a system, the amount of alcohol present may be greater than about 8% by weight of the composition. Suitable anhydrides may include one or more cyclic anhydride functionalized compounds or inorganic materials. Suitable organic anhydrides may include one or more of the following: phthalic anhydride; phthalic acid dianhydride; hexahydrophthalic anhydride; hexahydrophthalic dianhydride; 4-nitroorthobenzene Dicarboxylic anhydride; 4-nitrophthalic acid dianhydride; methyl-hexahydrophthalic anhydride; methyl-hexahydrophthalic acid dianhydride; naphthalene tetracarboxylic acid dianhydride; naphthalene anhydride; tetrahydrogen Phthalic anhydride; tetrahydrophthalic dianhydride; pyrogallite; cyclohexane dicarboxylic anhydride; 2-cyclohexyl diresin; bicyclo (2·2·1) heptane-2, 3-dicarboxylic anhydride·, bicyclo(m)hept-5-ene-2,3-dicarboxylic anhydride; methyl bicyclo(2.2.1)hept-5-ene-2,3-dicarboxylic anhydride; Butic anhydride; glutaric anhydride; 2-methylglutaric anhydride; 2,2-dimethylglutaric anhydride; hexafluoroglutaric anhydride; 2-phenylglutaric anhydride; 3,3-tetramethylene Glutaric anhydride; isocanic anhydride; tetrapropenyl succinic anhydride; octadecyl succinic anhydride; 2- or n-octenyl succinic anhydride; dodecenyl succinic anhydride; dodecenyl succinic anhydride; Is a derivative of them. Suitable inorganic anhydrides may include those represented by formula (III). Structural unit

, Si-X

(III) wherein "η" represents an integer ranging from about 0 to about 50, and X includes a cyclic anhydride -25-

200811237 structural unit, and R5, R6, R7, RS, r9 and R1G each independently represent an aliphatic atom group, a cycloaliphatic atom group, or an aromatic atom. In one system, "η" indicates an integer ranging from about 1 to about 1 Torr, from about 10 to about 25, from 25 to about 40, from about 40 to about 50, or an integer greater than about. In one system, R5, R6, r7, r8, R9 and R1G may comprise a halogen group such as a fluorine or chlorine group. In one system, one or more of R5, R6, R8, R9 and R1G may include methyl, ethyl, propyl, 3,3,3-trifluoropropyl, isopropyl, or phenyl. Atomic group. In a system, X in formula (III) may include a group of formula (IV), including R7.

Wherein RH-R17 may be hydrogen, halogen, an aliphatic atomic group, a cycloaliphatic group or an aromatic atomic group. R18 may be oxygen or C-R19, wherein R19 is any one of hydrogen, halogen, aliphatic radical, cycloaliphatic radical or aromatic radical. In one system, the amount of anhydride present may range from about 5% by weight to about 10% by weight of the composition, from about 10% by weight to about 20% by weight of the composition, and about 20% by weight of the composition. It is in the range of about 30% by weight, or about 30% to about 40% by weight of the composition. In one system, the amount of anhydride present may range from about 40% by weight to about 50% by weight of the composition in the range of from -26 to 200811237%, from about 50% to about 60% by weight. Within the range of from about 60% by weight to about 70% by weight, or from about 70% by weight to about 80% by weight. In one system, the amount of anhydride present may be in the range of greater than about 80% by weight of the composition. In a system, the first curable material can be cured to the B-stage at the first temperature. B-stage refers to a curing stage in which a partially cured material may be rubbery, solid, dry to the touch or may have partial solubility in a solvent. In a system, the first curable material can be cured to the B-stage by one or more of the following: increasing the number average molecular weight of the composition (eg, during polymerization), forming an interpenetrating polymer network, or borrowing By chemical crosslinking method. In some systems, the first curable material may be cured by a combination of two or more of the foregoing methods. For example, the curing reaction may include an increase in the number average molecular weight and formation of crosslinks. In the unitary system, the first curable substance can be cured to the B-stage by increasing the number average molecular weight of the composition. In a system, the anhydride can be reacted with an alcohol at the first temperature to increase the number average molecular weight of the composition. The second curable substance may comprise a polymeric precursor having one or more functional groups which are curable at a second temperature but which do not cure at the first temperature. The polymer precursor may include: a monomer species, an oligomer species, a mixture of monomer species, a mixture of oligomer species, a polymer species, a mixture of polymer species, a partially crosslinked species, a mixture of partially crosslinked species, or It is a mixture of two or more of the former. In a system, the second curable substance may include functional groups, which may be via free radical polymerization, atom transfer radical polymerization, open polymerization, ring opening shift polymerization, -27 - 200811237 anion The polymerization method or the cationic polymerization method 'forms a solidified substance. In one system, the second curable material can include one or more of the following: acrylates, urethanes, ureas, melamines, phenols, isocyanates, cyanates, or other suitable curable functional groups. In a system, the second curable material can include a heterocyclic functional group. The heterocyclic functional group can be ring opened in response to a second temperature but not the first temperature. Suitable heterocyclic materials can include one or more of the following: guanamine, ethylene oxide (such as an epoxy group), or a propylene oxide functional group. In a system, the second curable substance substantially comprises an oxirane functional group. In a system, the second curable material substantially comprises a propylene oxide functional group. Suitable propylene oxide functional groups can be derived from one or more of the following: 3-bromomethyl-3-hydroxymethyl ring Oxypropane; 3,3-bis-(ethoxymethyl) propylene oxide: 3,3_bis-(chloromethyl) propylene oxide; 3,3-bis-(.methoxymethyl) epoxy Propane; 3,3-bis-(fluoromethyl) propylene oxide; 3-hydroxymethyl-3-methyl propylene oxide; 3,3-bis-(ethyl methoxymethyl) propylene oxide; 3-bis-(hydroxymethyl) propylene oxide; 3-octyloxymethyl-3-methyl propylene oxide; 3-chloromethyl-3-methyl propylene oxide; 3-azidomethyl 3-methyl propylene oxide; 3,3-bis-(iodomethyl) propylene oxide; 3-iodomethyl-3-methyl propylene oxide; 3-propylmethyl-3-methyl ring Oxypropane; 3-nitromethyl-3-methyl propylene oxide; 3-difluoroaminomethyl-3-methyl propylene oxide; 3,3-bis-(difluoroaminomethyl) ) propylene oxide; 3,3-bis-(methylnitrylmethyl) propylene oxide; 3-methylnitromethyl-3-methyl propylene oxide; 3,3-bis-(azido) Methyl) propylene oxide; or 3-ethyl-3-((2-ethyl-28-) 200811237 Hexyloxy)methyl) propylene oxide. The second curable substance can be monofunctional or polyfunctional. If functional, the second curable material can include a plurality of chemical functional groups, such as acrylate and propylene oxide functional groups. In the system, the second curable substance substantially comprises four or more energy groups. In a system, the second curable substance substantially comprises one or more functional groups. In a system, the second curable comprises substantially eight or more functional groups. The second curable substance may comprise an organic or inorganic polymer. Suitable organic materials in the backbone may comprise substantially only carbon-linked (e.g., olefinic hydrocarbons) or carbon-heteroatom-carbon linkages (e.g., classes, esters, etc.). Examples of the organic substance which can be used as the polymer precursor include one or more of the following: a polymer precursor derived from an olefinic hydrocarbon such as ethylene, propylene, and a mixture thereof; a polymer precursor of methyl propane, For example, butadiene, isopropylene, and the like; polymers of unsaturated carboxylic acids and functional derivatives thereof, for example, acrylic compounds such as alkyl acrylates, alkyl acrylates, propylene Amidoxime, acrylonitrile, and acrylic-based aromatic polymer precursors, for example, styrene, α-methyl styrene vinyl toluene, and rubber-modified styrenes; guanamines, nylon- 6, nylon-6,6, nylon-1,1, and nylon-1,2; esters such as alkyl dicarboxylate, especially ethylene terephthalate, 1,4-benzoic acid Butylene glycol ester, propylene terephthalate, butylene glycol ethylene naphthalate, butane phthalate, cyclohexane, and cyclohexane are multi-individually integrated Bond, ether suitable, derivatized mixed precursor methyl; enene, For example; dimethyl ester, dimethyl -29-200811237 alcohol-ethylene terephthalate copolymer, and 1,4-cyclomethane dimethyl-1,4-cyclohexane dicarboxylate and aromatic hydrocarbons Alkyl diol diesters; carbonates; estercarbonates; maples; quinones; cyclic aryl sulfides: thioethers; and ethers, such as aryl ethers, phenyl ethers, ethers Maple, ether quinone imines, ethers, ether ether ketones; or blends, homopolymers or copolymers thereof. Suitable inorganic polymeric precursors may substantially comprise a primary linkage other than a carbon-carbon linkage or a carbon-heteroatom-carbon linkage, for example, a ruthenium-oxygen-oxime in a oxane or sesquioxane. Bonding. In a system, the second curable substance substantially comprises an inorganic polymeric precursor. In a system, the second curable material substantially comprises an inorganic polymeric precursor having one or more epoxy functional groups. In a system, the second curable material substantially comprises a pyrithionic high molecular precursor having one or more epoxy functional groups. In a system, the second curable material substantially comprises an inorganic polymeric precursor having one or more propylene oxide functional groups. In a system, the second curable material substantially comprises a pyrithion polymer precursor having one or more propylene oxide functional groups. Examples of propylene oxide-functionalized materials suitable as the second curable substance may include structural units represented by the formulae (V) to (X): -30- 200811237

(VII) ‘

(VIII)

In a system, the second curable substance may comprise a structural unit represented by the formula (XI): (XI) MaMb, DcDd, TeTf, Qg, wherein the subscripts "a", "b", "c" , "d", "e", "1" and "8" are independent or positive integers; and the sum of the integers "1>", "d" and "f" is greater than or equal to 1; and, -31 - 200811237 Μ has the following formula: (XII) Μ ' has the following formula: (XIII) D has the following formula: (XIV) D ' has the following formula: (XV) Τ has the following formula: (XVI) Τ, with the following formula: (XVII) R20R21R22SiO1/2, (Z)R23R24Si01/2, R25R26Si02/2,

(Z) R27Si02/2, R28Si03/2, (Z)Si03/2, and Q has the formula: (XVIII) Si04/2, wherein r2G to R28 in each case are aliphatic groups, aromatics An atomic group, or a cycloaliphatic radical, and z contains a propylene oxide functional group. Suitable examples of structural units of formula (XI) include: propylene oxide functionalized cyclic polyoxanes, propylene oxide functionalized linear polyoxyalkylenes, or propylene oxide functionalized Sesquiterpenoids. Suitable examples of sesquiterpoxyalkylene functionalized by propylene oxide include one or more structures of the formula (XIX) to (XXI): -32- 200811237

(XIX)

(XXI)

R29

Wherein R29 comprises a propylene oxide molecular fragment of formula (XXII):

(XXII) In a system, the amount of the second curable material present may range from about 1% by weight to about 20% by weight of the composition, from about 20% by weight to about 25% of the composition. Within the range of wt%, from about 25 wt% to about 30 wt% of the composition, or from about 30 wt% to about 4 wt% of the composition. The amount of the second curable substance - 33 - 200811237 present in a system may range from about 40% by weight to about 45% by weight of the composition, from about 45% by weight to about 50% by weight of the composition. Within the range of from about 50% by weight to about 5% by weight of the composition, or from about 5% by weight to about 60% by weight of the composition. In a system, the amount of the second curable material present is in a range greater than about 60% by weight of the composition. In a system, the second curable material can include a catalyst. The catalyst catalyzes (accelerates) the curing reaction of the second curable material in response to a second temperature (not responding to the first temperature). The catalyst can be catalyzed by a free radical transfer, an atom transfer machine, an open loop machine, an open loop shifter, an anion machine, or a cation machine. In a system, the catalyst comprises a cationic initiator which catalyzes the curing reaction of the second curable material. Suitable cationic initiators may include one or more of the following: iron salts, Lewis acids or alkylating agents. Suitable Lewis acid catalysts may include copper boron acetoacetate, cobalt boron acetoacetate, or both copper acetate boron and acetoacetate cobalt boron. Suitable alkylating agents may include: aryl sulfonates such as methyl p-toluenesulfonate or methyl trifluoromethanesulfonate. Suitable onium salts may include one or more of the following: an iodine salt, an oxonium salt, a pyrithione salt, a sulfonium salt, a scale salt, a metal boroacetate acetate, ruthenium (pentafluorophenyl) boron, or It is an aryl sulfonate. In a system, suitable cationic starters may include: a diaryl iodide salt, a triaryl sulfide salt, or a tetraaryl scale salt. Suitable diaryliodonium salts may include one or more of the following: hexafluorodecanoic acid bis(dodecylphenyl) iodine; hexafluorodecanoic acid (-34-200811237 octyloxyphenyl, Phenyl) iodine salt; or bis(pentafluorophenyl)borate diaryl iodine salt. Suitable tetraaryl iron salts can include tetraphenyl bromide scales. In a system, the catalyst can include a free radical initiator that catalyzes the curing reaction of the second curable material. Suitable free radical generating compounds may include one or more of the following: aromatic tetramethyl glycols, benzoin alkyl ethers, organic peroxides, and combinations of two or more thereof. In a system, the catalyst can include an iron salt along with a free radical generator. The free radical-generating compound accelerates the degradation of the key salt at relatively low temperatures. Other suitable curing catalysts may include one or more of the following: amines, alkyl substituted imidazoles, imidazolium salts, phosphines, metal salts (such as aluminum acetoacetate (A1 ( acac ) 3 ) Or a salt of a nitrogen-containing compound and an acidic compound, and a combination thereof. The nitrogen-containing compound may include, for example, an amine compound, a diaza compound, a triaza compound, a polyamine compound, and combinations thereof. The acidic compound may include: phenols, organic-substituted phenols, carboxylic acids, sulfonic acids, and combinations thereof. Suitable catalysts may be salts of nitrogen-containing compounds. Salts of nitrogen-containing compounds may include For example, 1,8-diazabicyclo(5,4,0)-7-undecane. Suitable catalysts may include one or more of the following: triphenylphosphine (TPP), N-A Imidazole (NMI), and dibutyltin dilaurate (DiBSn). The catalyst may be present in an amount from about 10 ppm to about 10% by weight of the total composition. As mentioned above, the curing catalyst is only Catalyzable second curable at a second temperature (higher than the first temperature) Curing reaction. In a system, the second curable substance is stable in the temperature range below the second temperature, in the presence of a catalyst, and for a certain period of time, or -35-200811237 In a system, the second curable substance may be stable at a temperature in the range of from about 2 ° C to about 75 t in the presence of a catalyst for a period of longer than about 1 minute. In one system, the second curable material may be stable in the presence of a catalyst at a temperature in the range of from about 751 to about 150 art, for a period of longer than about 10 minutes. In one system, the second The curable substance can be stabilized in the presence of a catalyst at a temperature ranging from about 150 ° C to about 200 ° C for a period of longer than about 10 minutes. In one system, the second curable substance is It may be stable for a period of time longer than about 1 minute in the presence of a catalyst at a temperature in the range of from about 200 ° C to about 300 ° C. A hardener may be employed. Suitable hard north agents may include one or the following Many: amine hardeners, phenolic resins, hydroxyaromatics, carboxylic anhydrides, A phenolic type hardener. Suitable amine hardeners may include: aromatic amines, aliphatic amines, or a combination thereof. The aromatic amines may include, for example, m-phenylenediamine, 4,4'-A a blend of diphenylamine, diaminodiphenyl milling, diaminodiphenyl ether, toluenediamine, diandenamide, and amines. The aliphatic amines may include, for example, ethylenediamines. A hydrogenated version of cyclohexanediamines, alkyl substituted diamines, methane diamines, isophorone diamines, and aromatic diamines. A combination of amine hardeners can be used. The hardener may include a phenol-aldehyde condensation product, commonly known as a phenolic type or a cresol resin. These resins may be condensation products of different phenols and various molar ratios of formaldehyde. For example, the phenolic type hardener may be commercially available. Commercially available substances, such as those available from Arakawa Chemical -36 - 200811237

Industries and Schenectady International's 758 and HRJ 1 5 83. Suitable hydroxyaromatic compounds may include one or more of the following, resorcinol, catechol, methyl benzene phenol, methyl m-methyl catechol. Suitable anhydride hardeners may include the following monohexahydrophthalic anhydride; methyltetrahydrophthalic anhydride alkyldicarboxylic anhydride; bicyclic (2. 2. 1) Gh-5-ene-2,3-dicarboxyl j bicyclic (2. 2. 1) hept-5-ene-2,3-dicarboxylic anhydride; phthalic acid dianhydride; hexahydrophthalic anhydride; dodecenyl dichloromaleic anhydride; tetrachloroortho Dicarboxylic anhydride and the like. A combination of at least two acid anhydride hardeners. The anhydrides can be hydrogenated for fluxing. In some systems, a separate phthalic anhydride may be used as the hardener or in combination with at least one of them. Further, the curing catalyst or the hydroxyl group-containing molecular fragment may be added together with the anhydride hardener. The composition of the present invention may include an additive. Choose the appropriate performance requirements for specific uses. For example, an optional flame retardant additive is required; a flow regulator can be used to influence the effect; when thermal conductivity is required, a thermally conductive substance can be added to a system to add a reactive organic diluent. Suitable examples of the reactive organic diluent include a monofunctional compound (having a functional group), and may be added to the composition to increase its viscosity diluent include: 3-ethyl-3-hydroxymethyl epoxyalkyl glycidol Ether; 4-vinyl-1-cyclohexane diepoxide TAMANOL I: benzenediol phenol and more or more: methyl, 1,2-cyclohexanal anhydride; methyl anhydride; pyro-succinic anhydride; When a carboxylic acid is used and a difunctional other hardener organic compound additive is used, the flame resistance may be referred to, rheological or rocking. To the composition a degree of reactivity. Reactive propane; dodecene; di(-37-200811237 cold-(3,4-epoxycyclohexyl)ethyl)tetramethyldioxane, and the like. The reactive organic diluent can include a monofunctional epoxide and/or a compound containing at least one epoxy functional. Representative examples of the diluent may include alkyl derivatives of phenol glycidyl ether, such as 3-(2-mercaptophenoxy)-1,2-epoxypropane or 3-(4-mercaptophenoxyl). Base)-1,2-epoxypropane. Other diluents which may be employed may include: glycidyl ethers of phenol itself and substituted phenols such as 2-methylphenol, 4-methylphenol, 3-methylphenol, 2-butylphenol, 4-butyl Phenolic, 3-octylphenol, 4-octylphenol, 4-tert-butylphenol, 4-phenylphenol, and 4-(phenylisopropylidene)phenol. A non-reactive diluent can also be added to the composition to increase the viscosity of the formulation. Examples of non-reactive diluents include: toluene, ethyl acetate, butyl acetate, 1-methoxypropyl acetate, ethylene glycol, dimethyl ether, and combinations thereof. In a system, the composition can include a tackifier. Suitable tackifiers may include one or more of the following: trialkoxyorganodecanes (eg, r-aminopropyltrimethoxydecane, 3-glycidylpropylpropyltrimethoxydecane, and Trimethoxydecylpropyl) fumarate). If present, the tackifier can be added in an effective amount. An effective amount may range from about 1% to about 2% by weight of the total final composition. In a system, the composition can include a flame retardant. Suitable examples of the grouping agent may include one or more of the following: phosphonium amine v triphenyl phosphate (τρρ ), resorcinol diphosphate (RDP), bisphenol quinone diphosphate (ΒΡΑ-Dp) , an organic phosphorus oxide, a halogenated epoxy resin (tetrabromobismuth bismuth hydride), a metal oxide, a metal hydroxide, and combinations thereof. When present, the flame retardant can be in about 〇. From 5 wt% to about 20 wt% (relative to the total weight -38 to 200811237). In a system, the composition can include a dip to form a warp. The dip material can be incorporated to control the following quality of the tethered composition: electrical, thermal, or mechanical. In a system, the coating is based on the electrical, thermal, or electrical properties of the layer formed by the composition. The dip can include a plurality of particles. The plurality of particles may be characterized by one or more of: average particle size, particle size distribution, flat surface area, particle shape, or particle cross-sectional geometry. In a system, the average particle size of the dip can be in the range of less than about (nm). In a system, the average particle size of the dip in the range of from about 1 nanometer to about 1 nanometer, in the range of about 10 nanometers to about meters, in the range of about 25 nanometers to about 50 nanometers, From about 5 meters to about 75 nanometers, or from about 7 5 nanometers to about 100 squares. In a system, the average particle size of the dip can range from about metre to about 〇.  In the range of 5 microns, in the range of about 5 micrometers to about 1 micrometer, in the range of about 1 micrometer to about 5 micrometers, in the range of about 5 micrometers to meters, in the range of about 1 micrometer to about 25 micrometers, 2 5 microns to about 50 microns. In a system, the average particle size can range from about 50 microns to about 1000 microns in the range of from about 10 microns to about 200 microns, in the range of from about 200 microns to about meters. It is in the range of from about 40 Å micrometers to about 6,000 micrometers, in the range of micrometers to about 800 micrometers, or in the range of about 800 micrometers to one micrometer. In a system, the average particle size of the dip is greater than about 1 000 microns. In another system, the selectivity and heat of the group can be varied. The following average particle size: 1 nanometer size can be 25 nanometer 50 nanometer 〇·1 micro range J 10 micro or approximate flat , about 400 micro about 600 ^ 100 0 small can enter the composition in the dip particle with two -39-200811237 different size ranges (bimodal distribution): the first range is from about 1 nm to about 250 nm, while the second range is 0. 5 micrometers (or 500 nanometers) to about 10 micrometers (here, the pigment particles in the second size range can be referred to as "micron-sized dips"). The table may range from about 5 microns to about 2 microns, or from about 2 microns to about 5 microns. The mash particles can have a wide variety of shapes and cross-sectional geometries, and φ depends in part on the process used to create their particles. In a system, the tanning particles may have a spherical, rod-shaped, tubular, sheet-like, fibrous, flat-like or whisker-like shape. The dip may include particles having two or more of the foregoing shapes. In a system, the cross-sectional geometry of the particles can be one or more of the following: a ring, an ellipse, a triangle, a rectangle, or a polygon. In a unitary system, the dip can consist essentially of spherical particles. In a system, the particles may include one or more active termination sites on the surface, such as a warp group. φ may be aggregates or agglomerates before breaking into the composition or even after breaking into the composition. The agglomerates may comprise more than one dip particle in physical contact with one another, and the agglomerate may comprise more than one agglomerate in physical contact with each other. In a system, the pigment particles may be non-aggregating and/or agglomerating, so that the particles are relatively easily dispersed in the polymer matrix. The mash particles can be mechanically or chemically treated to improve the dispersion of the mash in the polymer matrix. In a system, the material can be mechanically treated, for example, with high shear mixing, prior to dispersion in the curable material. In a system, -40- 200811237, the dip can be chemically treated before being dispersed in the curable substance. Chemical treatment can include the removal of polar groups (e.g., 'trans-bases'' from one or more surfaces of the pigment particles to reduce the formation of aggregates and/or aggregates. The chemical treatment may also include: functionalizing one or more surfaces of the pigment particles with a functional group that improves the compatibility between the tantalum and the polymeric matrix to reduce aggregates and/or aggregates. The formation, or both, improves the compatibility between the tantalum and the curable material and reduces the formation of aggregates and/or aggregates. In a system, the dip can include electrically insulating or electrically conductive particles. Suitable conductive particles may include one or more of the following: a metal, a semiconducting substance, a carbonaceous material (such as carbon black or a carbon nanotube), or a conductive polymer. Suitable electrically insulating particles can include one or more of the following: cerium materials, metal hydrates, metal oxides, metal borides, or metal nitrides. In a system, the dip can include a plurality of thermal conductive particles. Suitable thermally conductive particles may include one or more of the following: cerium materials (such as fumed cerium oxide, molten cerium oxide or colloidal cerium oxide), carbon materials, metal hydrates, metal oxides, metals Boride, or metal nitride. In a system, the tantalum may include cerium oxide and the cerium oxide may be colloidal cerium oxide. The colloidal cerium oxide can be a dispersion of submicron sized cerium oxide (SiO 2 ) particles in an aqueous or other solvent medium. The colloidal cerium oxide may contain up to about 85% by weight of cerium oxide (SiO 2 ), and up to about 80% by weight of cerium oxide. The total content of cerium oxide can be about 0% of the total composition weight. 00 from 1% by weight to about 1% by weight, from about 1% by weight to about 1% by weight, from about 10% by weight to about 20-41 - 200811237% by weight, from about 20% by weight to about 50% by weight Within the range, or in the range of from about 50% by weight to about 90% by weight. In a system, the colloidal ceria may comprise compatibilized and passivated colloidal silica. The compatibilized and passivated ceria can be used to reduce the coefficient of thermal expansion (CTE) of the composition, can be used as interstitial spacers to control the interface thickness, or both. In a system, the plurality of particles (i.e., cerium oxide) can be compatibilized and passivated by treatment with at least one organo alkoxy decane and at least one organic decane. The treatment of the two components can be carried out sequentially or simultaneously. In sequential treatment, the organoalkoxydecane can be used or reacted on at least a portion of the active cutoff position on the surface of the dip, and the organoazane can be used or reacted in at least a portion of the active cutoff position (in organic The remaining after the alkoxydecane reaction). After reaction with the organoalkoxydecane, other phase incompatible feedstocks may be relatively more compatible or dispersible in the organic or non-polar liquid phase. The compatibility or dispersibility of the dip in the organic matrix is increased and can be referred to herein as "compatibilized." The organoalkoxydecane used to functionalize the colloidal cerium oxide can be included in the range of the following formula (XXIII): (XXIII) (R30) kSi (OR31) 4. k wherein, in each case, an aliphatic atomic group, an aromatic atomic group, or a cycloaliphatic atomic group may be independently represented, optionally further functionalized with an alkyl acrylate, an alkyl methacrylate, an ethylene oxide, or an epoxy group. R31 may be a hydrogen atom, an aliphatic atomic group, an aromatic atomic group, or a cycloaliphatic atomic group; -42- 200811237 and "k" may be an integer of 1 to 3 (including 3). The organoalkoxydecane may include one or more of the following: phenyltrimethoxydecane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxydecane, 3-glycidyl ether propyltrimethyl Oxydecane or methacryloxypropyltrimethoxydecane. Even if the tantalum is phase compatible with the pendant organic groups by reaction with the organoalkoxydecane, the remaining active cut-off position on the surface of the tantalum can initiate premature chemical reactions. Increased water absorption, can affect the transparency of certain wavelengths, or have other undesirable side effects. In a system, the phase compatible material can be passivated by means of a passivating agent (e.g., organic decazane) that blocks the active cutoff position. Examples of the organoquinone azane may include one or more of the following: hexamethyldioxane ("HMDZ"), tetramethyldiazepine, divinyltetramethyldiazepine, or two Phenyltetramethyldiazepine. The phase compatible, passivated material can be blended with the composition and form a stable tonic composition. The organoalkoxydecane and the organic decazane are examples of phase compatibilizers and passivating agents, respectively. The supplemental composition comprising the compatibilized and passivated particles exhibits relatively good room temperature stability compared to the unpassivated formulation of the colloidal ceria. In some cases, the increase in room temperature stability of the resin formulation may allow higher loading rates of curing agents, hardeners and catalysts, otherwise they may be more than beneficial based on shelf life limitations. of. A higher degree of cure, a lower cure temperature, or a more well defined cure temperature profile can be achieved by increasing their mounting ratio. The amount of dip can be determined by reference to the performance requirements of the particular application, the size of the pellets -43-200811237, or the shape of the pellets. The amount of the stock present in a system may be less than about 1% by weight of the composition. In one system, the amount of the dip in the range may range from about 10% to about 15% by weight of the composition, from about 15% to about 25% by weight, from about 25% to about 30%. Within the range of % by weight, or in the range of from about 30% by weight to about 40% by weight. In a system, the colloidal and functionalized ceria can further include a micron-sized melt. Yttrium oxide. When present, the molten cerium oxide can be added in an effective amount to provide a further reduction in CTE; as interstitial particles to control interface thickness, and the like. Defoamer, dye. Pigments and the like can also be incorporated into the composition. The amount of the additive can be determined by the end use. The melt viscosity of the filled composition may depend on one or more of the following: the dressing rate of the dressing, the shape of the seed particles, the size of the seed particles, the molecular weight of the first curable substance, and the second curable substance. Molecular weight, temperature or conversion. In a system, the filled composition has flow properties (e.g., viscosity) at a particular temperature such that the filled composition can flow between the two surfaces, e.g., between the wafer and the substrate. The filled composition according to the system of the present invention may be solvent free. The solvent-free composition of the solvent according to the present invention may have a sufficiently low viscosity that the composition can flow into the space defined by the opposite side of the wafer and the substrate in a system. When the amount is greater than about 1% by weight of the by-charged composition, the filled composition may have a room temperature viscosity in the range of less than about -44 to 2008112372000 centipoise. In a system, when the amount of the dip is greater than about 10% by weight of the composition of the crucible, the composition of the crucible has a room temperature viscosity of from about 1 to about 1 000. Within the range of about 1 000 centipoise to about 2000 centipoise, about 2000 centipoise to about 5000 centipoise, about 5,000 centipoise to about 1 000 centipoise, about 1 000 centipoise to about 1 Within 5000 centipoise, or approximately 15,000 centipoise to approximately 2,000 centipoise. The stability of the composition may also depend on one or more of the following: the dressing rate, temperature, ambient conditions, or conversion rate. In a system, the filled composition can be in a stable state for a period of time greater than about one day at temperatures greater than about 20 °C. In a system, the composition may be from about 20 ° C to about 50 ° C, from about 50 ° C to about 75 ° C, from about 75 ° C to about 100 ° C, At a temperature ranging from about 10 ° C to about 150 ° C, or from about 150 ° C to about 175 ° C, it is in a stable state for a period longer than one day. In a unitary system, the filled composition can be in a stable state for a period of time greater than about one day at temperatures greater than about 1 75 °C. In a system, the entangled composition can be in a stable state for a period of time greater than about 1 75 ° C for longer than about 1 day. In a system, the filled composition can be in a stable state for a period of time greater than about 175 ° C for longer than about 30 days. In a system, the filled composition can be stored for less than about one day under unrefrigerated conditions. The filled composition can be used as one or more of the following: electrical contacts, thermal interface materials, conductive adhesives (eg, adhesives for adhesive bonding), or primers in electronic packaging devices. Materials (-45- 200811237 underfill materials). For a particular use, the suitability of the entangled composition will depend on one or more of the electrical, thermal, mechanical or flow properties of the entangled composition. Thus, for example, an electrical contact may require a conductive composition, whereas a primer material requires a conductive composition that is electrically insulating and has thermal properties such as thermal expansion coefficient, thermal fatigue, and the like. . In a system, the primer material can include a filled composition. The primer material is dispensable and can be used on devices such as solid state devices and/or electronic devices (such as computers or semiconductors), or devices that require primer, dual material molding, or a combination thereof. . The primer material can be used as an adhesive, for example, to strengthen the physical, mechanical, and electrical properties of the electrical interconnects connecting the wafer to the substrate. In some systems, the primer material can have a self-fluxing capability. In a system, the primer material can be cured at the first temperature to form a B-stage layer. In a system, the primer material can be cured to form a cured primer layer. The cured primer layer can be formed by directly heating the primer to a second temperature, or sequentially heating to a first temperature (forming a B-stage layer) and then heating to a second temperature. . The layers of the B-stage can be cooled to room temperature during the sequential continuous heating, exposed to other processing steps, and then heated to form a cured make layer. In a system, the primer material comprises a first curable material that cures at a temperature in the range of less than about 150 ° C, and is cured at a temperature in the range of from about 150 ° C to about 300 ° C. The second curable substance. Curing the first curable material can result in a B-stage layer of the shape -46-200811237, and subsequent curing of the second curable material can result in the formation of a cured make layer. In a system, the conversion of the first and second curable materials can be greater than about 50% of the cured make layer. In one system, the conversion of the first and second curable materials can be greater than about 60% of the cured make layer. In one system, the conversion of the first and second curable materials can be greater than about 75% of the cured make layer. In one system, the conversion of the first and second curable materials can be greater than about 90% of the cured make layer. In a system, the conversion rate of the first curable substance may be greater than about 75% of the cured make layer and the conversion rate of the second curable substance may be greater than about 50% of the cured make layer. The cured primer layer secures the wafer to the substrate. In one system, the cured primer can functionally support one or more electrical contacts between the wafer and the substrate. The cured make layer can provide functional support in one or more of the following ways: strengthening the interconnect, absorbing stress, reducing thermal fatigue, or being electrically insulated. Thermal fatigue occurs between the wafer and the substrate due to a mismatch in the thermal expansion coefficients of the wafer and the substrate. In a system, the cured primer layer can be thermally fatigued by having a thermal expansion coefficient that reduces the matching error. The coefficient of thermal expansion of the cured make layer can be selected to be less than about 50 p p m / ° C, less than about 40 p p m / ° C, or less than about 30 ppm / ° C due to a variety of factors, such as the amount of dip. In a system, the coefficient of thermal expansion can range from about 1 〇ppm / °C to about 20 ppm / °c, from about 20 p P m / -47 to 200811237 °C to about 30 ppm / °C Internal, from about 30 ppm / °C to about 40 ppm / °C, or greater than about 40 ppm / °C. The mechanical properties (e.g., modulus) and thermal properties of the cured make layer may also depend on the glass phase transition temperature of the composition. In a system, the glassy phase transition temperature of the cured make layer can be greater than about 150 ° C, greater than about 200 ° C, greater than about 250 ° C, greater than about 30 (TC, or greater than about 350 ° C. In the system, the modulus of the cured make layer can be in the range of greater than about 2000 MPa (million bars), greater than about 3000 MPa, greater than about 5000 MPa, greater than about 7000 MPa, or greater than about 1 Within 0000 MPa The electrical insulating properties of the primer material can depend on several factors, such as the type and concentration of the coating. In a system, the cured primer layer can have a resistivity in the range of about 10 _3 ohms • cm. , greater than about 1 CT4 ohm•cm, 1〇_5 ohm•cm, or 1(Τ6 ohm•cm. In addition to being electrically insulated, the cured primer can also be thermally conductive, as needed, Thermal interface material. When used as a heat dissipation interface material, the primer layer accelerates the heat transfer from the wafer to the substrate. The substrate can be sequentially connected to a heat dissipation unit such as a heat sink, a heat exchanger, or a heat spreader. Similarly, curing the thermal conductivity of the make layer (or The resistivity number can also depend on several factors, such as the type and concentration of the dip. In a system, the thermal conductivity of the cured make layer can be in the range of greater than about 1 W/mK (100 ° c). Within the range of greater than approximately 2 W / mK (under l〇〇°C), greater than approximately 5 W / mK (at 100 °C), greater than approximately 10 W / mK (at 1 0 〇 °C) Internal, or greater than about 20 W / mK (at 100 ° C). -48- 200811237 The cured primer layer also needs to be stable at the operating temperature. In a system, the cured primer material can be At a humidity greater than about 10% and at a temperature above about 20 ° C, at a humidity greater than about 50% and at a temperature above about 20 ° C, at a humidity greater than about 80% And at a temperature above about 20 ° C, at a temperature greater than about 10% and at a temperature above about 40 ° C, at a temperature greater than about 10% and at a temperature above 80 ° C It is stabilized or stabilized at a temperature greater than about 80% and at a temperature above about 8 ° C. In a system, the cured make layer can have the desired transparency of the wafer level primer. Appropriate transparency is defined as the ability to transmit sufficient light without obscuring the guide marks for wafer dicing. In one system, the transparency of the cured make layer is in the range of greater than about 50% visible light transmission. Within, in the range of from about 50% to about 75% visible light transmission, in the range of from about 75% to about 85% visible light transmission, from about 85% to about 90% visible light transmission, or greater than about 90 % visible light transmission. In a system, this transparency can be measured with reference to light at wavelengths outside the visible spectrum. In such a system, the transmission of light is sufficient to enable the detector or sensor to identify the alignment mark of the wafer. In a system, the primer material (before or after curing) may be free of solvents or other volatiles. The volatiles can be formed during the course of one or more processing steps, e.g., the step of solidifying the first curable material to form a layer B, resulting in the formation of voids. Cavities can cause undesirable defects to form. In a system, the amount of gas produced by the first curable material before, during, or after curing is insufficient to form a void that is visible to the naked eye. As previously indicated, the cured primer layer can be securely attached to the substrate. The effectiveness of the cured make layer to secure the wafer to the substrate can depend on several factors, such as inter-face adhesion between the make-up layer and the wafer or substrate, or cure of the make-up layer. After the contraction (if any). The interfacial properties between the primer material and the wafer or substrate can be improved by selecting a second curable material having the desired interfacial properties (e.g., adhesive properties). In a system, the second curable material can form a continuous interface contact with the substrate prior to curing. In a system, the second curable material can form a continuous interface contact with the wafer prior to curing. In a system, the cured primer layer, after curing, forms a continuous interface contact with the substrate and the wafer. An article can include a primer material disposed between the wafer and the substrate. An item may include a solid state device and/or an electronic device (such as a computer or board conductor), or a device that requires a primer, a dual material, or a combination thereof. The primer material is curable to form a cured make layer as previously described. In a system, the cured make layer can be firmly secured to the substrate within the device. In one system, an article can also include electrical contacts and the cured primer layer can be used to functionally support electrical contacts between the wafer and the substrate to prevent thermal fatigue. In a system, the electrical contacts can include solder bumps, and the cured make layer has the function of an adhesive, such as 'to enhance the physical, mechanical, and electrical properties of the solder bumps. Electrical interconnects may include lead or lead. The lead-free interconnect may include conductive particles -50 - 200811237 or conductive particles dispersed in a polymer matrix. In a system, the second curable material can be cured at a temperature of approximately interconnected solder (lead-containing) or cross-linked (lead-free). The present invention provides a method of making a composition (either entrenched or unfilled) in accordance with one of the systems of the present invention. The method includes contacting a first curable material with a second curable material to form an uncured composition (unfilled). The first curable material and the second curable material can also be contacted with a dip to form a filled composition. The contacting step can include mixing/blending in a solid state, molten state, or solution mixing. Solid or molten state blending of the curable material can involve the use of one or more shear forces, compressive forces, ultrasonic energy, electromagnetic energy, or thermal energy. Blending can be carried out in a processing apparatus wherein the aforementioned force can be exercised by one or more of the following: single screw, multi-screw, meshing co-rotating or counter-rotating screw, non-intermeshing co-rotating or counter-rotating A rotating screw, a reciprocating screw, a screw equipped with a pin, a barrel equipped with a pin, a roller, a ram, or a spiral rotor. These materials can be mixed by hand, but can also be mixed using mixing equipment such as: dough mixers, chain can mixers, planetary mixers, twin screw extruders, Two or three roller honing machine, B uss K neader, Hensehe 1 , He ico ir es, Rouse mixer R 〇ssmixers ), Banbury, roller honing machines, forming machines (such as injection molding machines, vacuum forming machines, blow molding machines) and the like. Blending can be carried out in batches -51 - 200811237 times, continuous or semi-continuous mode. For example, in the case of a batch mode reaction, all of the reactant components can be combined and reacted until most of the reactants have been consumed. In order for the reaction to continue, the reaction must be stopped once and additional reactants are added. In the case of continuous conditions, the reaction does not have to be stopped to add more reactants. Solution blending may also use additional energy, such as shear, compression, ultrasonic vibration, or the like, to promote compositional components (such as the two curable materials or materials (if present) and Homogenization of the solidified material). The filled or unfilled composition may also be contacted with the curing catalyst prior to or after blending. In a system, the filled composition can be prepared by blending a first curable substance, a second curable substance, and a tanning solution. In a system, the curable materials can be suspended in a liquid and then introduced into the ultrasonic oscillator together with the dip to form a mixture. The mixture solution can be blended by ultrasonically oscillating the mixture for a period of time effective to disperse the dip particles in their curable materials. In a system, the liquid expands the curable material during operation of the ultrasonic oscillation. The expansion of the curable material improves the ability of the dip to be filled with the curable material during solution blending, thereby improving dispersibility. In a system, the dip and optional additives can be ultrasonically oscillated with the polymeric precursor during solution blending. The polymeric precursor may comprise one or more monomers, dimers, trimers or the like which are reactive to form the desired polymeric matrix. Liquids such as solvents can be introduced into the ultrasonic oscillator along with the dip and high molecular precursors. The period of ultrasonic oscillation is sufficient to promote the coating of the binder composition by the polymer precursor. After coating, the polymer precursor can be subsequently polymerized to form a curable material having dispersed tantalum. The solvent can be used for solution blending of the composition. The solvent can be used as a viscosity modifier or to promote dispersion and/or suspension of the coating composition. A liquid aprotic solvent may be employed, such as one or more of the following: propylene carbonate, ethylene carbonate, butyrolactone, propionitrile, benzonitrile, nitromethane, nitrobenzene, cyclobutyl hydrazine, dimethylformamidine Amine, N-methylpyrrolidone or the like. Polar protic solvents may also be used, such as one or more of the following: water, methanol, acetonitrile, nitromethane, ethanol, propanol, isopropanol, butanol, or the like. Other non-polar solvents may also be used, such as one or more of the following: benzene, toluene, dichlorocarb, carbon tetrachloride, hexanyl, diethyl ether, tetrahydrofurazan, or the like. It is also possible to use an eo-solvent comprising at least one aprotic polar solvent and at least one non-polar solvent. The solvent can be evaporated before, during, and/or after blending of the composition. After blending, the solvent can be removed by heating or applying a vacuum or both. The removal of solvent from the membrane can be measured and characterized by analytical techniques such as infrared spectroscopy, nuclear magnetic resonance spectroscopy, thermogravimetric analysis, differential scanning calorimetry, and the like. In one system, the dip can include colloidal ceria and the colloidal ceria can be compatibilized and passivated prior to blending (solid, melt or solution blending). The compatibilizing agent is added to an aqueous dispersion of colloidal cerium oxide (in which an aliphatic hydroxy compound has been added) to make the colloidal cerium oxide compatible. As a result, the obtained composition (including the % compatibilized ceria particles and the compatibilizing agent in the aliphatic hydroxy compound) can be defined herein as a pre-split -53-200811237 dispersion. The aliphatic hydroxy compound may be selected from the group consisting of: isopropanol, tert-butanol, 2-butanol, and combinations thereof. The amount of the aliphatic hydroxy compound may range from about 1 time to about 1 Torr (by weight) based on the amount of cerium oxide present in the aqueous colloidal cerium oxide predispersion. The pH of the organically compatibilized ceria particles obtained by neutralization can be neutralized with an acid or a base. The compatibilization process can be aided by the use of an acid or a base together with other catalysts which promote the condensation of the sterol with the alkoxyalkylene group. If the catalyst is available, it can include organic tannins. Salts and organotin compounds such as tetrabutyl stannate, isopropoxy bis(acetonitrile) tin, dibutyltin dilaurate, or combinations thereof. In some cases, a stabilizer such as 4-hydroxy-2,2,6,6-tetramethylpiperidinyloxy (i.e., 4-hydroxy TEMPO) may be added to the predispersion. As a result, the resulting predispersion can be heated in the range of from about 50 Torr to about 100 ° C for a period of from about 1 hour to about 12 hours. The curing time range from about 1 hour to about 5 hours is sufficient. The cooled transparent predispersion can be further treated with a passivating agent as disclosed herein to form a final dispersion. Optionally, a curable polymeric precursor and an aliphatic solvent may be added during this processing step. Suitable additional solvents may be selected from the group consisting of: isopropanol, 1-methoxy-2-propanol, 1-methoxy-2-propyl acetate, toluene, and combinations of two or more thereof. The final dispersion of compatibilized and passivated particles can be treated with an acid or base or with an ion exchange resin to remove acidic or basic impurities. The final dispersion of the compatibilized and passivated particles (compatibilized and passivated as disclosed herein) can be artificially mixed or mixed by one or more of the following depending on factors affected by the application:搓揉 Mixer -54- 200811237, chain mixer, or planetary mixer. Factors such as viscosity, reactivity, particle size, batch size, and processing parameters (such as temperature). The blending of the dispersion components can be carried out in batch, continuous or semi-continuous mode. The final dispersion of the compatibilized and passivated particles can be at about 0. Concentration in a vacuum ranging from 5 Torr to about 250 Torr to a temperature in the range of from about 20 ° C to about 140 ° C to remove any low boiling components such as solvents, residual water, and These combinations result in a clear dispersion of compatibilized and passivated cerium oxide particles, optionally containing a curable monomer, referred to herein as the final concentrated dispersion. Here, the removal of the low-boiling component can be defined as: removing the low-boiling component to obtain a dispersion containing about 15% by weight to about 80% by weight of concentrated cerium oxide. In some cases, a pre-dispersion or final dispersion of the compatibilized and passivated ceria particles may be further treated with a compatibilizer and/or a passivating agent. The low boiling component can be at least partially removed. Next, a second blocking or passivating agent can be added which is compatible with the remaining functional groups in the compatibilized and passivated particles (which are left after the first compatibilization and passivation process). The amount is in the range of from about 5 times to about 10 times the amount of cerium oxide in the pre-dispersion or final dispersion. Partial removal of the low-boiling component removes at least about 10% by weight of the total low-boiling component, from about 10% by weight to about 50% by weight of the total low-boiling component or greater than the total amount of the low-boiling component. 50% by weight of the low boiling component. At least for the second pass through the process of compatibility and passivation, an effective amount of blocking agent can react with the surface functional groups of the compatibilized and passivated particles. In a system, after processing at final -55-200811237, the compatibilized and passivated particles have at least 10 weight less free hydroxyl groups than the corresponding groups of unpassivated particles. %, at least 20% by weight, or at least 35 % by weight. The filled or unfilled composition prepared according to one of the systems of the present invention can be heated to a first temperature to cure the first curable material. Curing of the first curable material can result in the formation of a B-stage composition which is dry, or solid, or both dry and solid. Thereafter, the B-stage composition can be heated to a second temperature (which is higher than the first temperature) to cure the second curable substance. In a system, before or after the B-stage, the filled or unfilled composition (primer) can be disposed on the surface of the wafer, the surface of the crystal, the surface of the substrate, or between the wafer and the substrate. . The method of arranging the primer composition can be referred to as "primer filling". The underfill can include: capillary underfilling, no-flow underfilling, transfer mold underfilling, wafer-level underfilling. (wafer level underfilling) and similar methods. Capillary primers include: a primer material in the form of a fillet or bead, extending along one or a multilateral edge of the wafer, dispensing, and allowing the primer material to flow through the capillary action of the wafer And fill all the gaps between the wafer and the substrate. The needle can be dispensed at the center of the component footprint area, in a dot pattern, using a needle. Other suitable dispensing methods may include: a nozzle method (point of flying or linear mode), and DJT-9 000 Dispense Jet - 56-200811237, which is commercially available from Asymtek ( Carlsbad, California). The method of transferring the molding primer comprises: placing the wafer and the substrate in a cavity and pushing the primer into the cavity. Pushing the primer material causes the primer material to fill the space between the wafer and the substrate. The method for filling the non-flowing primer includes: first, dispensing the primer material onto the substrate or the plate conductor device, secondly, placing the flip chip on the top of the primer, and third, electrically connecting The dots (solder bumps) are reflowed to form electrical contacts (solder joints) while curing the primer. The wafer level underfill method includes dispensing the underlay onto the wafer before the wafer is diced into individual wafers, and the wafers can then be bonded to the final structure by flip chip type operation. The flip chip can be placed on top of the substrate using an automated pick-and-place device. The placement force and head time of the placement head are controlled to optimize the cycle time and yield of the process. The construction can be heated to melt or reflow the electrical contacts (e.g., solder) to form an electrical interconnect and finally cure the primer. This heating operation can usually be carried out on a conveyor in a reflow furnace. The curing kinetics of the primer (based on a second curable material of a system) can be adjusted to meet the temperature profile of the reflow cycle. The no-flow or wafer-level primer allows the interconnect (solder joint) to form before the primer reaches the gel point and forms a solid make layer at the end of the heating cycle. No flow or wafer level primers can be cured using two different reflow profiles. The first temperature profile can be referred to as the "high prototype" temperature curve, which includes the soak zone below the melting point of the solder - 57-200811237. This second temperature profile can be referred to as a "volcano-type" temperature profile, with a constant heating rate, increasing the temperature until the maximum temperature is reached. The maximum temperature during reflow depends on the solder composition and can be about 1 〇 ° C to about 40 ° C higher than the melting point of the solder ball or the solder reflow temperature of the solder ball (in the absence of lead). The heating cycle can be between about 3 minutes and about 5 minutes, or between about 5 minutes and about 10 minutes. In a system, the cured make layer can be at a temperature in the range of from about 150 ° C to about 180 ° C, at a temperature in the range of from about 180 ° C to about 200 ° C, from about 200 ° C to about 250 Post-curing is carried out at a temperature in the range of °C or at a temperature ranging from about 250 ° C to about 300 ° C over a period of from about 1 hour to about 4 hours. In a system, the filled or unfilled composition is dispensed onto the substrate to form a no-flow primer. The first curable material is cured at the first temperature to form a B-stage no-flow primer. The flip chip is mounted on top of the B-stage primer to form an electrical component. The electrical component can then be heated to reflow the electrical interconnect (solder) to form an electrical contact (solder joint). During the reflow process, the second curable material can be cured simultaneously to form a cured make layer. The curing temperature (second curing temperature) and reflow temperature of the second curable substance can be adjusted so that curing and reflow occur simultaneously. In a system, the filled or unfilled composition can be dispensed onto the wafer to form a wafer level primer. The first curable material can be cured at the first temperature to form a B-stage wafer level primer. The wafer is diced into individual wafers and individual wafers are mounted on top of the substrate to form an electrical -58-200811237 component. The electrical component is then heated to reflow the electrical interconnect (solder) and form electrical contacts (solder joints). During the reflow process, the second curable material can be cured simultaneously to form a cured make layer. The curing temperature (second curing temperature) of the second curable material and the reflow temperature can be adjusted so that curing and reflow occur simultaneously. In a system, the primer material is particularly useful as a wafer level primer. The wafer can be packaged to form an electronic component by employing one of the foregoing methods of filling the underfill. Wafers that can be encapsulated with a primer composition include semiconductor wafers and LED wafers. Suitable wafers may include semiconductor materials such as germanium, gallium, germanium or indium, or a combination of two or more thereof. Electronic components can be used in electronic devices, integrated circuits, semiconductor devices, and the like. Integral circuits and other electronic devices using primer materials can be used in a wide range of applications, including personal computers, control systems, telephone networks, and a host of other consumer and industrial products. [Embodiment] The following examples are merely illustrative of the methods and systems according to the present invention and therefore should not be construed as limiting the scope of the claims. Unless otherwise stated, all ingredients are available from general chemical suppliers such as Alpha Aesar, Inc. (Ward Hill, Massachusetts), Sigma Aldrich, and Spectrum Chemical Mf g.  C o rp.  (Gardena, California), etc. ° -59- 200811237 Example 1 A monofunctional alcohol, 3-ethyl-3-hydroxymethyl-1-epoxypropane (available under the trade name UVR600 0 from Dow Chemicals) ) mixed with methylhexahydrophthalic anhydride (NHHPA). The mixing was carried out at room temperature using a magnetic stirrer and in the absence of solvent. The resulting mixture was applied to a glass slide prior to heating and analysis. Two different samples were prepared by varying the ratio of hydroxyl groups to anhydride groups. Sample 1 is a 1: 1 molar ratio. UVR6000: MHHPA, prepared. Sample 2 was prepared using a 1:3 molar ratio of UVR6000: MHHPA. The samples i and 2 were heated to a temperature of 10 (rc) for a period of 1 hour, and the properties of the composition obtained by visual observation, viscosity/adhesion were visually observed. Table 1 shows the sample composition and the The final properties of the two samples after heating. Table 1: The B-order properties of the sample. The ratio of the hydroxyl group to the anhydride group. The initial state of the composition. The final state of the composition after heating. 1 1:1 Liquid highly viscous liquid 2 1:3 Liquid highly viscous liquid Example 2 A polyfunctional alcohol, 1,2-propanediol, was mixed with methylhexahydrophthalic anhydride (MHHPA) at room temperature using a magnetic stirrer. And in the absence of solvent. The resulting mixture was applied to a glass slide before heating and analysis. Two differentities were prepared by changing the ratio of hydroxyl groups to anhydride groups -60 - 200811237 Sample 3. Sample 3 was prepared using 1:1 molar ratio, 2-propanediol: MHHPA, and sample 4 was 1:3 molar ratio of 1,2-propanediol:MHHPA. Prepared. Samples 3 and 4 were heated to a temperature of 100 ° C for a period of 1 hour. The properties of the composition obtained by visual observation, viscosity/adhesiveness were visually observed. Table 2 shows the sample composition and the final properties of the two samples after heating. Table 2: Sample B-order properties of the sample The ratio of the hydroxyl group to the anhydride group is the initial state of the composition. The final state after heating. 3 1:1 Liquid slightly adhered to the solid 4 1:3 Liquid-adhered liquid Example 3 A polyfunctional alcohol, glycerol and methyl Hexahydrophthalic anhydride (MHHPA) was mixed at room temperature using a magnetic stirrer and stored in the absence of solvent. The resulting mixture was applied to the glass before heating and analysis. On the sheet, three different samples were prepared by changing the ratio of the hydroxyl group to the anhydride group. Sample 5 was prepared by using a hydroxyl group of 1:3 molar ratio: anhydride group. 6 was prepared using a 1: 1 molar ratio of a radical group: an anhydride group. Sample 7 was prepared using a 3:1 molar ratio hydroxyl group·wild group'. Samples 5, 6 and 7 were heated to a temperature of 100 ° C for a period of 1 hour and The properties, viscosity/adhesiveness of the composition obtained by visual inspection were examined visually. Table 3 shows the sample composition and the final properties of the three samples after heating. -61 - 200811237 Table 3: B-order properties of the sample The ratio of the hydroxyl group to the anhydride group of the sample is the initial state of the composition. The final state after heating. 5 1:3 Liquid slightly adhered to the solid 6 1:1 Liquid refers to the dry solid 7 3:1 Liquid refers to the dry solid Example 4 A certain amount of 3-bromomethyl-3-methyl propylene oxide (82. 5 g,0. 5 mol ) was added to a round bottom bottle equipped with a mechanical stirrer and condenser. In the same order, methylphenol (31. 04 g,0. 25 mol) and 25 g of water were added to the flask. Will be tetrabutylammonium bromide (8. 0 g,0. 025 mol) was slowly added to the resulting mixture. Next, the mixture was heated to 75 ° C and potassium hydroxide was added dropwise (35. 5 g in 50 g of water). The resulting mixture was heated at 80 ° C for 18 hours. The mixture was cooled to room temperature and filtered, then diluted with water and extracted with dichloromethane. After evaporating the dichloromethane, it can produce 42.  Lg crude product, and then the crude product is recrystallized from hot hexane to give 3 1. 7 g pale yellow solid, methyl benzene phenol propylene oxide (MeHQ 〇 x). Example 5 A master batch containing no catalyst was prepared according to the following procedure. Compatibilized and passivated cerium oxide, MeHQOx (prepared in Example 4), MHHPA and glycerin were added to a round bottom flask, and a mixture was added to form a homogeneous solution. Then, the solvent was removed by a rotary evaporation method -62 - 200811237 (which included: heating at 90 ° C and full vacuum for 30 minutes after the time when the removal of the solvent was observed by the naked eye was observed). Table 4 illustrates formulations that can be used to prepare stock solutions. Table 4: stock solution formulation composition weight (g) solid % compatibilized and passivated cerium oxide (in methoxypropanol) 11. 36 26. 4 MeHQOx 5. 09 MHHPA 5. 84 continued glycerin 1. 07 - Final composition 15. 00 20. 0 Example 6 A catalyst (tetraphenylphosphonium bromide, TPPB) was blended into the stock solution prepared in Example 5. Table 5 shows the formulations used to prepare the final composition. Samples 8 and 9 were degassed and transferred to the injection needle and their B-stage and curing properties were measured. Table 5: Catalyst-containing formulation Final material composition Sample 8 Sample 9 Stock solution (g) 4 4 TPPB (g) 0. 17 0. 257 % by weight of catalyst 4. 3% 6. 4% by weight of the feed 20. 0% 20. 0% Example 7 The glass phase transition temperature (Tg), curing kinetics, and viscosity of liquid samples 8 and 9 were tested. The Tg and curing kinetics were determined by differential scanning calorimetry (-63-200811237 DSC) by heating at a heating rate of 30 ° C / min. The DSC curve shows two different exotherms centered around ll 〇 ° C and 240 ° C, as shown in Figure 1. The initial exotherm (DSC cure 1) is attributable to the B-stage reaction (alcoholization of the anhydride), while the second exotherm (DSC cure 2) represents the bulk resin cure (cure of the propylene oxide resin). Table 6: Viscosity, Tg and Curing Line Properties of Liquid Samples Sample 8 Sample 9 Room Temperature Viscosity (cPs) 2610 2680 Tg (DSC, .C) 71 74 DSC Curing 1 Start (°C) 77 74 DSC Curing 1 Peak (°C) 110 107 Heat of Reaction 1 (J/g) 48 43 DSC Curing 2 Start (°C) 187 181 DSC Curing 2 Peaks (°C) 243 236 Heat of Reaction 2 (J/g) 171 162 Dorsal Example 8 By heating the liquid samples 8 and 9 at 1 ° C for 2 hours, they were B-staged to produce a hard finger-dried dry film. The B-stage hardness of the two films was measured visually. The curing characteristics of the B-stage sample were tested by heating at a heating rate of 30 ° C / min using DSC. In the DSC analysis, only the solidification peak centered at 240 °C is left, as shown in Fig. 2. Further, the reaction enthalpy of this peak was equal to that measured from the liquid-solidified sample (Example 7). During the B-stage, no overall resin cure occurred. -64 - 200811237 Table 7: Curing properties of B-stage samples. Test] Implicit sample 8 Sample 9 B-stage nature of solid solid DSC curing after heating for 2 hours at loot: (it) One-by-one DSC curing 1 Peak (°C)-reaction heat 1 (J/g) _ DSC curing 2 start (°C) 182 176 DSC curing 2 peaks (°C) 239 229 Reaction heat 2 (J/g) 155 151 A substance, component or ingredient that is present prior to first contact with one or more other substances, components or ingredients in accordance with the present disclosure, formed, blended or mixed at the reaction site. A substance, component or component identified as a reaction product, resulting in a mixture or analog thereof, may be obtained by chemical reaction or conversion reaction during contact, reaction site formation, blending or mixing operations to obtain properties or The identification of the characteristics is carried out according to the disclosure of the present invention, the application of common sense, and the ordinary techniques of the art (for example, a chemist). The reaction of the chemical reactant or starting material into a chemical product or a reaction of the final material continues, regardless of its rate of occurrence. Therefore, since the conversion process is in progress, there will be a mixture of the starting material and the final material, as well as the intermediate species; depending on the kinetic lifetime, it is currently known by the art. Analytical techniques, detection of starting materials, final materials, and intermediate species can be easy or difficult. In the context of this specification or the patent application, the reactants or constituents referred to by the chemical name or chemical formula -65-200811237 (whether in singular or complex, are identified as being in the chemical or chemical species) The reactant, or solvent, prior to contacting, the chemical changes, transitions, or reactions (if any) that occur within the mixture, solution, or reaction medium that have occurred, intervening species, stock solutions, and the like, and Their utilization of the product or the utilization of the final product. Other subsequent variations may be made by bringing together the special components or components under the conditions required by the present disclosure. In such conversions or reactions, the reactants that are brought together are identified or expressed as reaction products or final materials. The foregoing embodiments are illustrative of certain features of the invention. The scope of the invention is intended to be construed as the invention. Accordingly, Applicant's intent is that the dependent application-selected embodiments are limited to the features of the invention as illustrated. As used herein, "contains" and its grammatical variants, including variations and different phrases, such as, for example, are "substantially composed of ------" and " By - where necessary, ranges have been provided, and their ranges have sub-ranges. Variations of such ranges are well known to those of ordinary skill, and in the case of the general public, Affiliated patent applications should cover that their technological advances can be made at the time of the inaccurate speech (eg, when they are mentioned. The initial or transitional results obtained can be considered neutral to be different from the reaction). The conversion, or reaction, of the reactants and subsequent changes, sub-compositions, or components may be included in the accompanying application, and the scope of the system selected in this document is not covered by the scope of the patent application, for example (but not in- -----Composed between the coverage of the coverage is not intended to be presented to the mutation. Scientific and unpredictable -66 - 200811237 Equals and substitutions; such variations should be covered by the scope of the attached application [Simplified BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a differential scanning calorimetry thermogram of a composition according to the system of the present invention. Fig. 2 is a differential scanning calorimetry thermogram of a composition according to the system of the present invention.

Claims (1)

200811237 X. Patent application scope 1. A compounded composition comprising: a dip; a first curable substance comprising an alcohol and an anhydride, and a second curable substance, and in the first Temperature (Td, the «th curable substance will solidify, while the second curable substance has a conversion of less than 50%. φ 2. The compounded composition of claim 1 The second repulsable material is solidified at a second temperature (τ2) above the first temperature (Ti). 3. The composition of the invention as claimed in claim 1 Wherein the alcohol comprises one or more hydroxyl functional groups, and the anhydride comprises one or more cyclic anhydride functional groups; wherein the anhydride reacts with the alcohol at the first temperature, and the number of constituents The average molecular weight is increased. φ 4. The filled composition of claim 1, wherein the pigment comprises a plurality of particles selected from one or more of the following: thermally conductive particles, electrically insulating particles, or electrically conductive particles. 5. For example, the supplemental composition of claim 4 Wherein the *thermal conductive particles comprise one or more of the following: germanium, carbon, metal hydrate, metal oxide, metal boride, or metal nitride. 6. as claimed in claim 4 a composition, wherein the electrically insulating particles comprise one or more of the following: a ruthenium material, a metal hydrate, a metal oxide, a metal boride, or a metal nitride. -68- 200811237 7 · as claimed in claim 4 The additive composition, wherein the conductive particles comprise one or more of the following: a metal, a semiconducting substance, a carbon substance, or a conductive polymer. 8 · The compounded composition of claim 1 of the patent scope, Wherein the dip consists of compatibilized and passivated cerium oxide. 9. The accommodating composition of claim 2, further comprising a catalyst, wherein the catalyst is capable of catalyzing The second curable substance responds to the second temperature but does not respond to the curing reaction occurring at the first temperature. 1〇·If the compound of claim 1 is filled, the material present therein The amount is greater than about 10% by weight of the compounded composition. 1 1 · The compounded composition of claim 1 wherein the amount of the material present is greater than the composition of the supplement The room temperature viscosity of the filled composition is less than about 2 000 centipoise at about 1% by weight of the article. 12. The compounded composition of claim 1 wherein the supplemented composition The composition is stable for a period of time greater than about 1 day at a temperature in the range of from about 20 ° C to about 175 ° C. 1 3. The compounded composition of claim 1 wherein the composition is uncured The filled composition has a sufficiently low viscosity to flow into the space defined by the opposite side of the wafer and substrate. I4. The filled composition of claim 1, wherein the supplemented composition comprises less than 1% by weight of a solvent. 1 5 · A primer material comprising the group of the patent application scope -69-200811237. 16) The primer material of claim 15 which further comprises a hardener, a reactive diluent, or a hardener and a reaction twin dilution. 如 17. The primer of claim 15 a material wherein the first curable substance is cured at a first temperature (T 1 ) (within a range of from about 75 Torr to about 〇 5 〇. ;); and the second curable substance is at the first The cure or crosslink at temperature (Tl) is less than 10%; and the second curable material is cured at a second temperature (Τ2) above 15 °C. 1 8 · A cured primer layer comprising the primer material of claim 17 of the patent application. 19. The cured primer layer of claim 18, wherein the cured make layer has a coefficient of thermal expansion of less than about 50 ppm/[deg.]C. 20. The cured primer layer of claim 18, wherein the cured make layer has a modulus greater than about 2000 MPa (million bars). 2 1. A cured make layer as claimed in claim 18, wherein the cured make layer has a resistivity greater than about 0.001 ohms. 22. The cured primer layer of claim 18, wherein the cured make layer is stable at a temperature greater than about 80% and at a temperature above about 8 °C. 23. The cured primer layer of claim 18, wherein the first curable material produces insufficient amount of gas before, during or after curing to form a visually detectable void. -70- 200811237 24. The two curable materials cured as in claim 18 of the patent application are in contact with the interface in contact with them prior to curing. 25. An article comprising: a wafer; a substrate; and a primer material disposed between the wafer and the substrate, wherein the primer material comprises a composition, a curable substance (including alcohol and anhydride), and Substance; and at the first temperature (T!), the first cure, while the second curable material does not cure. 2. 6. The article of claim 25 is cured to form a cured primer. Material, and the cured backsheet is fixed to the substrate. 27. The article of claim 26, the electrical interconnect to the substrate, which is supported by the cure to prevent thermal cycling fatigue. 2 8. If the object of claim 27 is not lead-free. 29. A method comprising: preparing a B-staged composition, the composition material; a first curable substance comprising an alcohol and an anhydride; a second curable substance; and at the first a warm subbing layer, wherein the first substrate is formed continuously: the dip material, the second curable curable material, wherein the undergrowth material layer is used to crystallize the wafer layer Wherein the interconnecting system comprises: and, under the degree (T i ), a curable substance is cured, and the second curable substance is less than 50% conversion; Contacting the B-stageable composition; contacting a circuit device with the B-stageable composition; and curing the B-stageable composition. The method of claim 29, wherein the method of arranging the B-staged composition to be in contact with a surface of the circuit device comprises: arranging the B-stageable composition on a wafer Surface; heating the B-staged composition to a first temperature to cure the first curable material to the B-stage; and dicing the wafer to form one or more circuit devices. -72-