TW200810670A - Manufacturing method of heat-conductive module and product thereof - Google Patents
Manufacturing method of heat-conductive module and product thereof Download PDFInfo
- Publication number
- TW200810670A TW200810670A TW95129071A TW95129071A TW200810670A TW 200810670 A TW200810670 A TW 200810670A TW 95129071 A TW95129071 A TW 95129071A TW 95129071 A TW95129071 A TW 95129071A TW 200810670 A TW200810670 A TW 200810670A
- Authority
- TW
- Taiwan
- Prior art keywords
- heat
- conducting
- hole
- seat
- conducting seat
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 238000005452 bending Methods 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 10
- GNFTZDOKVXKIBK-UHFFFAOYSA-N 3-(2-methoxyethoxy)benzohydrazide Chemical compound COCCOC1=CC=CC(C(=O)NN)=C1 GNFTZDOKVXKIBK-UHFFFAOYSA-N 0.000 claims description 2
- 238000005553 drilling Methods 0.000 claims description 2
- 239000000047 product Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- FGUUSXIOTUKUDN-IBGZPJMESA-N C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 Chemical compound C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 FGUUSXIOTUKUDN-IBGZPJMESA-N 0.000 description 1
- 206010016717 Fistula Diseases 0.000 description 1
- WPPDFTBPZNZZRP-UHFFFAOYSA-N aluminum copper Chemical compound [Al].[Cu] WPPDFTBPZNZZRP-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000916 dilatatory effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003890 fistula Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW95129071A TW200810670A (en) | 2006-08-08 | 2006-08-08 | Manufacturing method of heat-conductive module and product thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW95129071A TW200810670A (en) | 2006-08-08 | 2006-08-08 | Manufacturing method of heat-conductive module and product thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200810670A true TW200810670A (en) | 2008-02-16 |
| TWI312268B TWI312268B (enrdf_load_stackoverflow) | 2009-07-11 |
Family
ID=44767431
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW95129071A TW200810670A (en) | 2006-08-08 | 2006-08-08 | Manufacturing method of heat-conductive module and product thereof |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW200810670A (enrdf_load_stackoverflow) |
-
2006
- 2006-08-08 TW TW95129071A patent/TW200810670A/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TWI312268B (enrdf_load_stackoverflow) | 2009-07-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |