TW200804021A - Scribing method, scribing apparatus, and scribed substrate scribed by the method or apparatus - Google Patents

Scribing method, scribing apparatus, and scribed substrate scribed by the method or apparatus Download PDF

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Publication number
TW200804021A
TW200804021A TW096113059A TW96113059A TW200804021A TW 200804021 A TW200804021 A TW 200804021A TW 096113059 A TW096113059 A TW 096113059A TW 96113059 A TW96113059 A TW 96113059A TW 200804021 A TW200804021 A TW 200804021A
Authority
TW
Taiwan
Prior art keywords
substrate
cut
cutting
laser light
line
Prior art date
Application number
TW096113059A
Other languages
English (en)
Chinese (zh)
Inventor
Yukihiro Uehara
Takanori Tahara
Chisa Inaka
Hiroyuki Murata
Tomoo Uchikata
Original Assignee
Toray Eng Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Eng Co Ltd filed Critical Toray Eng Co Ltd
Publication of TW200804021A publication Critical patent/TW200804021A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C03B33/093—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam using two or more focussed radiation beams
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
    • C03C23/0005—Other surface treatment of glass not in the form of fibres or filaments by irradiation
    • C03C23/0025—Other surface treatment of glass not in the form of fibres or filaments by irradiation by a laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Optics & Photonics (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Thermal Sciences (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Laser Beam Processing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
TW096113059A 2006-04-13 2007-04-13 Scribing method, scribing apparatus, and scribed substrate scribed by the method or apparatus TW200804021A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006110534 2006-04-13

Publications (1)

Publication Number Publication Date
TW200804021A true TW200804021A (en) 2008-01-16

Family

ID=38609500

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096113059A TW200804021A (en) 2006-04-13 2007-04-13 Scribing method, scribing apparatus, and scribed substrate scribed by the method or apparatus

Country Status (3)

Country Link
JP (1) JPWO2007119740A1 (fr)
TW (1) TW200804021A (fr)
WO (1) WO2007119740A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI417261B (zh) * 2008-10-23 2013-12-01 Corning Inc 非接觸性玻璃片剪切裝置及劃線或切割玻璃片之方法

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TWI414383B (zh) * 2008-06-25 2013-11-11 Mitsuboshi Diamond Ind Co Ltd Angle processing device
WO2011052584A1 (fr) * 2009-10-29 2011-05-05 住友化学株式会社 Procédé de fabrication de module de cellule solaire à film mince organique
JP2011156582A (ja) * 2010-02-03 2011-08-18 Disco Abrasive Syst Ltd Ｃｏ２レーザによる分割方法
JP5560096B2 (ja) * 2010-05-28 2014-07-23 三星ダイヤモンド工業株式会社 レーザ加工方法
JP5678816B2 (ja) * 2011-06-22 2015-03-04 株式会社レミ ガラス基板の割断方法および割断装置
EP2754524B1 (fr) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Procédé et dispositif destinés au traitement basé sur laser de substrats plats, galette ou élément en verre, utilisant un faisceau laser en ligne
EP2781296B1 (fr) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Dispositif et procédé de découpe de contours à partir de substrats plats au moyen d'un laser
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
US9850160B2 (en) * 2013-12-17 2017-12-26 Corning Incorporated Laser cutting of display glass compositions
US10293436B2 (en) 2013-12-17 2019-05-21 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
JP2017521259A (ja) 2014-07-08 2017-08-03 コーニング インコーポレイテッド 材料をレーザ加工するための方法および装置
LT3169477T (lt) 2014-07-14 2020-05-25 Corning Incorporated Skaidrių medžiagų apdorojimo sistema ir būdas, naudojant lazerio pluošto židinio linijas, kurių ilgis ir skersmuo yra reguliuojami
JP6483974B2 (ja) * 2014-07-31 2019-03-13 浜松ホトニクス株式会社 加工対象物切断方法
KR102546692B1 (ko) 2015-03-24 2023-06-22 코닝 인코포레이티드 디스플레이 유리 조성물의 레이저 절단 및 가공
CN106604898B (zh) * 2015-08-10 2021-06-04 法国圣戈班玻璃厂 用于切割薄玻璃层的方法
WO2018064409A1 (fr) 2016-09-30 2018-04-05 Corning Incorporated Appareils et procédés de traitement au laser de pièces transparentes au moyen de points de faisceau non axisymétriques
EP3529214B1 (fr) 2016-10-24 2020-12-23 Corning Incorporated Station de traitement de substrat pour usinage laser de substrats en verre de type à vitre
JP6726597B2 (ja) * 2016-10-28 2020-07-22 日本車輌製造株式会社 レーザ加工機
CN111039254A (zh) * 2018-10-15 2020-04-21 无锡华润上华科技有限公司 Mems样品纵向截面的制备方法及形貌观察方法
JP7364860B2 (ja) 2019-07-01 2023-10-19 日亜化学工業株式会社 発光素子の製造方法
CN112846536A (zh) * 2021-01-07 2021-05-28 卡门哈斯激光科技（苏州）有限公司 一种太阳能电池片激光低损切割装置及方法
CN112846537A (zh) * 2021-01-07 2021-05-28 卡门哈斯激光科技（苏州）有限公司 一种太阳能电池片的激光低损切割装置及方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003002677A (ja) * 2001-06-22 2003-01-08 Seiko Epson Corp レーザ割断用支持テーブル、レーザ割断装置、レーザ割断方法、及び、液晶パネルの製造方法
JP2004087663A (ja) * 2002-08-26 2004-03-18 Tokyo Seimitsu Co Ltd ダイシング装置及びチップ製造方法
JP2005109432A (ja) * 2003-09-09 2005-04-21 Toyoda Gosei Co Ltd Ｉｉｉ族窒化物系化合物半導体素子の製造方法
JP2005179154A (ja) * 2003-12-22 2005-07-07 Shibuya Kogyo Co Ltd 脆性材料の割断方法およびその装置
JP4086796B2 (ja) * 2004-02-19 2008-05-14 キヤノン株式会社 基板割断方法
JP2006007619A (ja) * 2004-06-25 2006-01-12 Aisin Seiki Co Ltd レーザ加工方法及びレーザ加工装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI417261B (zh) * 2008-10-23 2013-12-01 Corning Inc 非接觸性玻璃片剪切裝置及劃線或切割玻璃片之方法

Also Published As

Publication number Publication date
WO2007119740A1 (fr) 2007-10-25
JPWO2007119740A1 (ja) 2009-08-27

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